TW202332532A - 附黏著劑層之光學積層體之製造方法 - Google Patents
附黏著劑層之光學積層體之製造方法 Download PDFInfo
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- TW202332532A TW202332532A TW111127795A TW111127795A TW202332532A TW 202332532 A TW202332532 A TW 202332532A TW 111127795 A TW111127795 A TW 111127795A TW 111127795 A TW111127795 A TW 111127795A TW 202332532 A TW202332532 A TW 202332532A
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- adhesive layer
- cutting
- release liner
- manufacturing
- end mill
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/13—Surface milling of plates, sheets or strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23C5/00—Milling-cutters
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- B23C5/10—Shank-type cutters, i.e. with an integral shaft
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/02—Milling-cutters characterised by the shape of the cutter
- B23C5/10—Shank-type cutters, i.e. with an integral shaft
- B23C5/1009—Ball nose end mills
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/30—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding plastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/047—Perforating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Milling Processes (AREA)
- Polarising Elements (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021153158A JP7312221B2 (ja) | 2021-09-21 | 2021-09-21 | 粘着剤層付光学積層体の製造方法 |
JP2021-153158 | 2021-09-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202332532A true TW202332532A (zh) | 2023-08-16 |
Family
ID=85720444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111127795A TW202332532A (zh) | 2021-09-21 | 2022-07-25 | 附黏著劑層之光學積層體之製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7312221B2 (ko) |
KR (1) | KR20240072120A (ko) |
CN (1) | CN117980099A (ko) |
TW (1) | TW202332532A (ko) |
WO (1) | WO2023047731A1 (ko) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3483505B2 (ja) | 1999-08-11 | 2004-01-06 | 住友化学工業株式会社 | 積層フィルムの周縁の仕上げ方法 |
JP2002273614A (ja) * | 2002-03-13 | 2002-09-25 | Allied Material Corp | ダイヤモンドコーティングエンドミル |
JP2004001115A (ja) * | 2002-05-31 | 2004-01-08 | Nachi Fujikoshi Corp | ダイヤモンド被覆エンドミル |
JP4992460B2 (ja) | 2007-02-21 | 2012-08-08 | 三菱マテリアル株式会社 | エンドミル |
BR112017011855A2 (pt) * | 2014-12-12 | 2018-02-27 | Mitsubishi Heavy Industries Machine Tool Co., Ltd. | ferramenta de esmerilhamento e método de fabricação da mesma |
WO2019070033A1 (ja) | 2017-10-05 | 2019-04-11 | 住友化学株式会社 | 光学部材の製造方法及び製造装置 |
JP7257809B2 (ja) | 2019-02-20 | 2023-04-14 | 日東電工株式会社 | 切削加工された粘着剤層付光学積層体の製造方法 |
JP6997844B2 (ja) * | 2019-11-14 | 2022-01-18 | 住友化学株式会社 | 積層体を加工する方法、加工フィルムの製造方法、および、積層体加工装置 |
-
2021
- 2021-09-21 JP JP2021153158A patent/JP7312221B2/ja active Active
-
2022
- 2022-06-23 CN CN202280063709.9A patent/CN117980099A/zh active Pending
- 2022-06-23 WO PCT/JP2022/025075 patent/WO2023047731A1/ja active Application Filing
- 2022-06-23 KR KR1020247001389A patent/KR20240072120A/ko unknown
- 2022-07-25 TW TW111127795A patent/TW202332532A/zh unknown
-
2023
- 2023-04-04 JP JP2023060508A patent/JP2023090712A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2023044997A (ja) | 2023-04-03 |
JP7312221B2 (ja) | 2023-07-20 |
WO2023047731A1 (ja) | 2023-03-30 |
KR20240072120A (ko) | 2024-05-23 |
CN117980099A (zh) | 2024-05-03 |
JP2023090712A (ja) | 2023-06-29 |
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