TW202329264A - Package structure - Google Patents

Abstract

A package structure includes a leadframe, a semiconductor die and a plastic package material. The leadframe includes a die pad and a plurality of leads. The leads are disposed on four peripheral regions of the die pad, and each of the leads includes a main body, at least one extending portion and a plurality of plating surfaces. The extending portion is connected to the main body, and the main body and the extending portion are integrally formed. The plating surfaces are disposed on the main body and the extending portion. The semiconductor die is disposed on the die pad of the leadframe. The plastic package material is disposed on the leadframe. The main body and the extending portion of each of the leads protrude a peripheral region of the plastic package material. Therefore, the welding strength between the package structure and the circuit board can be enhanced.

Description

package structure

The present disclosure relates to a package structure, and in particular to a package structure with increased solderable area.

In today's semiconductor packaging industry, Quad Flat No Leads (QFN) packages usually have poor soldering strength with circuit boards due to the small solderable area on the sides of the leads.

In order to solve the aforementioned problems, a structure in which the pins of the quadrilateral planar leadless package are retracted relative to the bottom surface has been developed, so as to increase the solderable area of the side of the pins and strengthen the soldering strength with the circuit board. However, the reduced area of the bottom surface of the pins disposed on the circuit board tends to cause instability on the circuit board, resulting in a problem of reduced lifespan. Therefore, developing a packaging structure that can maintain the solderable area of the bottom surface of the pin, increase the solderable area of the side of the pin, and enable the pin to be stably arranged on the circuit board has become an important and urgent problem in the industry.

This disclosure provides a packaging structure, which maintains the solderable area of the bottom surface and increases the solderable area of the side surface through the plating surface of the body and extension of the lead of the packaging structure, so as to improve the stability of the packaging structure on the circuit board. resistance and thermal cycle life.

An embodiment according to the present disclosure provides a packaging structure, which includes a lead frame, a semiconductor chip and a plastic packaging material. The lead frame includes a chip seat and a plurality of pins. The pins are arranged around the chip seat, and each pin includes a body, at least one extension and a plurality of plating surfaces. The extension part is connected to the main body, and the main body and the extension part are integrally formed. The electroplating surface is disposed on the main body and the extension part. The semiconductor chip is arranged on the chip seat of the lead frame. The plastic encapsulation material is arranged on the lead frame. The body and extension of each pin protrude from the outer edge of the plastic packaging material.

According to the package structure of the above-mentioned embodiment, each pin may further include at least one electroless plating surface, and the electroless plating surface is disposed on the extension portion.

According to the packaging structure of the embodiment described in the preceding paragraph, wherein a length of the packaging structure is L, a width of the packaging structure is W, and a maximum protruding length of each pin is Lmax, which can satisfy the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L.

According to the packaging structure of the above-mentioned embodiment, wherein a width of the body is W1, a width of the extension part is W2, and a thickness of the pin is T, which can satisfy the following condition: 0.25T ≤ W2 < W1.

According to the package structure of the embodiment described in the preceding paragraph, the number of plated surfaces may be at least eight.

According to the packaging structure of the above-mentioned embodiment, each pin may further include a protruding part, the protruding part is connected to the main body, the main body, the extension part and the protruding part are integrally formed, and the electroplating surface is disposed on the protruding part.

According to the package structure of the embodiment described in the preceding paragraph, the main body and the extension part can be farther away from the lower surface of the package structure than the protruding part.

According to the packaging structure of the embodiment described in the previous paragraph, wherein an extension length of the body is L1, an extension length of the extension part is L2, the maximum protruding length of each pin is Lmax, and the length of the packaging structure is L, which can satisfy the following conditions : 0 < L2 ≤ 0.5L; and 0 < Lmax = L1+L2.

According to the packaging structure of the embodiment described in the preceding paragraph, wherein the length of the packaging structure is L, and an extension length of the protrusion is L3, which can satisfy the following condition: 0 < L3 ≤ 0.5L.

According to the package structure of the embodiment described in the preceding paragraph, the body and the extension part may be closer to the lower surface of the package structure than the protruding part.

According to the packaging structure of the above-mentioned embodiment, each pin may further include a plane portion, the plane portion is connected to the body, the body, the extension portion and the plane portion are integrally formed, and the plating surface is disposed on the plane portion.

According to the package structure of the embodiment described in the preceding paragraph, the body and the extension part can be farther away from the lower surface of the package structure than the planar part.

According to the packaging structure of the embodiment described in the preceding paragraph, wherein the extension length of the body is L1, the extension length of the extension part is L2, the maximum protruding length of each pin is Lmax, and the length of the packaging structure is L, which can meet the following conditions: 0 < L2 ≤ 0.5L; and 0 < Lmax = L1+L2.

According to the package structure of the embodiment described in the preceding paragraph, the main body and the extension part can be closer to the lower surface of the package structure than the planar part.

An embodiment according to the present disclosure provides a packaging structure, which includes a lead frame, a semiconductor chip and a plastic packaging material. The lead frame includes a chip seat and a plurality of pins. The pins are arranged around the chip seat, and each pin includes a body, at least one extension and a plurality of plating surfaces. The extension part is connected to the main body, and the main body and the extension part are integrally formed. The electroplating surface is disposed on the main body and the extension part. The semiconductor chip is arranged on the chip seat of the lead frame. The plastic encapsulation material is arranged on the lead frame. The body of each pin is aligned with the outer edge of the plastic packaging material, and the extension part of each pin protrudes from the outer edge of the plastic packaging material.

According to the packaging structure of the above-mentioned embodiment, each pin may further include a plane portion, the plane portion is connected to the body, the body, the extension portion and the plane portion are integrally formed, and the plating surface is disposed on the plane portion.

According to the packaging structure of the embodiment described in the preceding paragraph, wherein a length of the packaging structure is L, a width of the packaging structure is W, and a maximum protruding length of each pin is Lmax, which can satisfy the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L.

Please refer to FIG. 1 to FIG. 4, wherein FIG. 1 shows a schematic front view of the package structure 100 according to the first embodiment of the present invention, and FIG. 2 shows a schematic rear view of the package structure 100 in the first embodiment shown in FIG. 1 , FIG. 3 shows a partial schematic diagram of the package structure 100 in the first embodiment shown in FIG. 1 , and FIG. 4 shows a schematic side view of the package structure 100 in the first embodiment shown in FIG. 1 . It can be seen from FIG. 1 to FIG. 4 that the packaging structure 100 has an upper surface 101 and a lower surface 102, and includes a lead frame (not shown), a semiconductor chip (not shown) and a plastic packaging material 130, The lead frame is used to carry the semiconductor chip, and the plastic encapsulation material 130 is disposed on the lead frame and covers the semiconductor chip to form the package structure 100 .

The lead frame includes a chip seat 110 and a plurality of pins 120, wherein the semiconductor chip is arranged on the chip seat 110 of the lead frame, the pins 120 are arranged around the chip seat 110, and each lead 120 includes a body 121, at least one extension portion 122 , a plurality of electroplated surfaces 123 , at least one electroless plated surface 124 and a protruding portion 125 .

The extension part 122 is connected to the main body 121, and the protruding part 125 is connected to the main body 121, and the main body 121, the extension part 122 and the protruding part 125 are integrally formed. The plating surface 124 is disposed on the extension portion 122, wherein the body 121, the extension portion 122 and the protrusion 125 of each pin 120 protrude from the outer edge of the plastic packaging material 130, and the body 121 and the extension 122 are farther away from the package than the protrusion 125 The lower surface 102 of the structure 100 . Through the pins 120 protruding from the outer edge of the plastic packaging material 130 , the side solderable area of the packaging structure 100 can be increased. Furthermore, compared with the prior art packaging structure in which the pins do not protrude from the outer edge of the plastic packaging material, the packaging structure 100 can increase the thermal cycle life of the board level by more than 20%.

In the first embodiment, the number of extensions 122 of each pin 120 is two, the number of plated surfaces 123 of each pin 120 is nine, the number of electroless plated surfaces 124 of each pin 120 is two, and each pin 120 is a ladder pin. Furthermore, the material of the electroplating surface 123 can be tin alloy or nickel-gold alloy, wherein the nickel-gold alloy can be nickel-palladium-gold (NiPdAu), nickel-palladium-silver-gold (NiPdAgAu) or nickel-gold (NiAu), and the material of the lead frame can be Iron-nickel alloy or copper alloy, and the material of the plastic packaging material 130 can be epoxy resin, but not limited to the above materials.

Furthermore, the packaging structure 100 of the first embodiment can be obtained through etching steps, molding steps, laser steps, electroplating steps and cutting steps, but not limited thereto. In detail, the etching step is to etch the lower surface of the lead frame, the molding step is to place the plastic encapsulation material 130 on the lead frame and cover the semiconductor chip, and the laser step is to etch the upper surface and the lower surface of the lead frame respectively. The laser beam removes a part of the plastic packaging material 130. The electroplating step is to set the electroplating surface 123 on the surface of the lead frame that is not covered with the plastic packaging material 130 after the laser step, and then form the packaging structure 100 with a cutting step. The laser step can be two It depends on the energy and parameters of the laser beam, but is not limited to the above-mentioned process steps.

It can be seen from FIG. 2 that the length of the package structure 100 is L, the width of the package structure 100 is W, and the maximum protruding length of each pin 120 is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L. Specifically, the plastic packaging material 130 can be square or rectangular, and the maximum protruding length depends on the configuration of the circuit board, and is not limited to the above conditions. Furthermore, the maximum protruding lengths of the pins 120 may be the same. In this way, the solderable area of the pins 120 around the package structure 100 can be consistent, so that when the subsequent package structure 100 is welded to the circuit board (not shown in the figure), it is difficult to produce differences in the degree of welding, and it can be firmly arranged on the circuit board. plate.

From Figures 2 to 4, it can be seen that an extension length of the main body 121 is L1, an extension length of the extension portion 122 is L2, an extension length of the protruding portion 125 is L3, a width of the body 121 is W1, and an extension length of the extension portion 122 is L3. A width of 122 is W2, a thickness of the pin 120 is T, a length of the package structure 100 is L, and a maximum protruding length of each pin 120 is Lmax, which satisfies the following conditions: 0 < L2 ≤ 0.5L; 0 < L3 ≤ 0.5L; 0.25T ≤ W2 < W1; and 0 < Lmax = L1+L2. In this way, the structural stability of the pin 120 can be maintained, and it is not easy to cause side solder run-off, and the reliability can be improved.

Please refer to FIG. 5 to FIG. 9, wherein FIG. 5 shows a schematic front view of the package structure 100 in the first embodiment shown in FIG. 1 after soldering, and FIG. 6 shows the package structure 100 in the first embodiment shown in FIG. 1 The schematic diagram of the rear surface after soldering, FIG. 7 shows a partial side view of the package structure 100 after soldering in the first embodiment shown in FIG. 1 , and FIG. 8 shows the package structure 100 after soldering in the first embodiment shown in FIG. 1 FIG. 9 shows a partial side view of the package structure 100 in the first embodiment shown in FIG. 8 after soldering. It can be seen from FIG. 5 to FIG. 9 that the solder portion 140 can only be disposed on the electroplating surface 123 , wherein the solder portion 140 contacts the main body 121 , the extension portion 122 and the protruding portion 125 on which the electroplating surface 123 is disposed. In this way, in addition to maintaining the solderable area of the package structure 100 on the bottom surface, the solderable area of the package structure 100 on the side can be increased, so as to improve the welding strength between the package structure 100 and the circuit board.

As can be seen from FIG. 7 , after the soldering operation of the package structure 100 , inspectors can inspect the soldering condition in the viewing direction D through automated optical inspection (AOI, Automated optical inspection). Specifically, the inspection direction D is a direction from the upper surface 101 to the lower surface 102 of the package structure 100 , and inspectors can directly inspect from a top-down perspective. The efficiency of inspection can be improved by performing automatic optical inspection at a top-down angle.

It must be noted that the installation positions of the solder portion 140 in FIGS. 5 to 9 are only for illustration, mainly used to express that the solder portion 140 is only provided on the electroplated surface 123 and will not be provided on the electroless plated surface 124, but not The setting position of the solder part 140 in FIGS. 5 to 9 is limited.

Please refer to FIG. 10 to FIG. 13, wherein FIG. 10 shows a schematic front view of the package structure 200 according to the second embodiment of the present invention, and FIG. 11 shows a schematic rear view of the package structure 200 in the second embodiment of FIG. 10 , FIG. 12 shows a partial schematic diagram of the package structure 200 in the second embodiment shown in FIG. 10 , and FIG. 13 shows a schematic side view of the package structure 200 in the second embodiment shown in FIG. 10 . It can be seen from FIG. 10 to FIG. 13 that the packaging structure 200 has an upper surface 201 and a lower surface 202, and includes a lead frame (not shown), a semiconductor chip (not shown) and a plastic packaging material 230, The lead frame is used to carry the semiconductor chip, and the plastic encapsulation material 230 is disposed on the lead frame and covers the semiconductor chip to form the package structure 200 .

The lead frame includes a chip seat 210 and a plurality of pins 220, wherein the semiconductor chip is arranged on the chip seat 210 of the lead frame, the pins 220 are arranged around the chip seat 210, and each lead 220 includes a body 221, at least one extension portion 222 , a plurality of electroplated surfaces 223 , at least one electroless plated surface 224 and a planar portion 226 .

The extension part 222 is connected to the body 221, the plane part 226 is connected to the body 221, and the body 221, the extension part 222 and the plane part 226 are integrally formed, wherein the electroplating surface 223 is arranged on the body 221, the extension part 222 and the plane part 226, and the electroless plating surface 224 The body 221 and the extension 222 of each pin 220 protrude from the outer edge of the plastic packaging material 230 , and the body 221 and the extension 222 are farther away from the lower surface 202 of the package structure 200 than the planar portion 226 . Through the pins 220 protruding from the outer edge of the plastic packaging material 230 , the side solderable area of the packaging structure 200 can be increased. Furthermore, compared with the packaging structure in the prior art where the pins do not protrude from the outer edge of the plastic packaging material, the packaging structure 200 can increase the thermal cycle life of the board level by more than 20%.

In the second embodiment, the number of extensions 222 of each pin 220 is one, the number of plated surfaces 223 of each pin 220 is ten, the number of electroless plated surfaces 224 of each pin 220 is one, and each pin 220 is a ladder pin.

Furthermore, the packaging structure 200 of the second embodiment can be obtained through etching steps, molding steps, laser steps, electroplating steps and cutting steps, but not limited thereto. In detail, the etching step is to etch the lower surface of the lead frame, the molding step is to arrange the plastic packaging material 230 on the lead frame and cover the semiconductor chip, and the laser step is to respectively perform etching on the upper surface and the lower surface of the lead frame. The laser beam removes a part of the plastic packaging material 230, and the electroplating step is to set the electroplating surface 223 on the surface of the lead frame that is not covered with the plastic packaging material 230 after the laser step, and then form the packaging structure 200 with a cutting step, wherein the laser step can be two It depends on the energy and parameters of the laser beam, but is not limited to the above-mentioned process steps.

It can be seen from FIG. 11 that the length of the package structure 200 is L, the width of the package structure 200 is W, and the maximum protruding length of each pin 220 is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L. Specifically, the plastic encapsulation material 230 can be square or rectangular, and the maximum protruding length depends on the configuration of the circuit board, and is not limited to the above conditions. Furthermore, the maximum protruding lengths of the pins 220 may be the same. In this way, the solderable area of the pins 220 around the package structure 200 can be consistent, so that when the subsequent package structure 200 is welded to the circuit board (not shown in the figure), it is difficult to produce differences in the degree of welding, and it can be firmly arranged on the circuit board. plate.

It can be seen from Fig. 11 to Fig. 13 that an extension length of the body 221 is L1, an extension length of the extension part 222 is L2, a width of the body 221 is W1, a width of the extension part 222 is W2, and a width of the pin 220 is A thickness is T, the length of the package structure 200 is L, and the maximum protruding length of each pin 220 is Lmax, which satisfies the following conditions: 0 < L2 ≤ 0.5L; 0.25T ≤ W2 < W1; and 0 < Lmax = L1+ L2. In this way, the structural stability of the pin 220 can be maintained, and it is not easy to cause the defect of solder creeping on the side.

Furthermore, the portion of the pin 220 close to the lower surface 202 of the package structure 200 does not exceed the edge of the plastic package material 230 . Therefore, through the package structure 200 of the second embodiment, there is no need to change the style of the package outline drawing (Package Outline Drawing, POD), reducing the procedure of redrawing the package outline drawing.

Please refer to FIG. 14 to FIG. 18, wherein FIG. 14 shows the front view of the package structure 200 in the second embodiment shown in FIG. 10 after soldering, and FIG. 15 shows the package structure 200 in the second embodiment shown in FIG. 10 Figure 16 shows a partial side view of the package structure 200 after soldering in the second embodiment in Figure 10, and Figure 17 shows the package structure 200 in the second embodiment in Figure 10 after soldering FIG. 18 shows a partial side view of the package structure 200 in the second embodiment shown in FIG. 17 after soldering. It can be seen from FIG. 14 to FIG. 18 that the solder portion 240 can only be disposed on the electroplating surface 223 , wherein the solder portion 240 contacts the main body 221 , the extension portion 222 and the flat portion 226 on which the electroplating surface 223 is disposed. In this way, in addition to maintaining the solderable area of the package structure 200 on the bottom surface, the solderable area of the package structure 200 on the side can be increased, so as to improve the welding strength between the package structure 200 and the circuit board.

It can be seen from FIG. 16 that after the soldering operation of the package structure 200 is performed, inspectors can inspect the soldering condition by viewing the direction D through the automatic optical inspection. Specifically, the viewing direction D is a direction from the upper surface 201 to the lower surface 202 of the package structure 200 , and inspectors can directly inspect from a top-down perspective. The efficiency of inspection can be improved by performing automatic optical inspection at a top-down angle.

In addition, the second embodiment is the same as the first embodiment in terms of structure and arrangement of other elements, so it will not be repeated here.

Please refer to FIG. 19 to FIG. 22, wherein FIG. 19 shows a schematic front view of the package structure 300 according to the third embodiment of the present invention, and FIG. 20 shows a schematic rear view of the package structure 300 in the third embodiment shown in FIG. 19 , FIG. 21 shows a partial schematic diagram of the package structure 300 in the third embodiment shown in FIG. 19 , and FIG. 22 shows a schematic side view of the package structure 300 in the third embodiment shown in FIG. 19 . It can be seen from FIG. 19 to FIG. 22 that the packaging structure 300 has an upper surface 301 and a lower surface 302, and includes a lead frame (not shown), a semiconductor chip (not shown) and a plastic packaging material 330, The lead frame is used to carry the semiconductor chip, and the plastic encapsulation material 330 is disposed on the lead frame and covers the semiconductor chip to form the package structure 300 .

The lead frame includes a chip seat 310 and a plurality of pins 320, wherein the semiconductor chip is arranged on the chip seat 310 of the lead frame, the pins 320 are arranged around the chip seat 310, and each lead 320 includes a body 321, at least one extension part 322 , a plurality of electroplated surfaces 323 and at least one electroless plated surface 324 .

The extension part 322 is connected to the main body 321, and the main body 321 and the extension part 322 are integrally formed, wherein the electroplating surface 323 is arranged on the main body 321 and the extension part 322, and the electroless plating surface 324 is arranged on the extension part 322, wherein the main body 321 and the extension part 322 of each pin 320 The extension portion 322 protrudes from the outer edge of the plastic packaging material 330 . The side solderable area of the package structure 300 can be increased through the pins 320 protruding from the outer edge of the plastic package material 330 . Furthermore, compared with the packaging structure in the prior art where the pins do not protrude from the outer edge of the plastic packaging material, the packaging structure 300 can increase the thermal cycle life of the board level by more than 20%.

In the third embodiment, the number of extensions 322 of each pin 320 is one, the number of plated surfaces 323 of each pin 320 is eight, the number of electroless plated surfaces 324 of each pin 320 is one, and each pin 320 is a protruding pin.

Furthermore, the packaging structure 300 of the third embodiment can be obtained through etching steps, molding steps, laser steps, electroplating steps and cutting steps, but not limited thereto. In detail, the etching step is to etch the lower surface of the lead frame, the molding step is to place the plastic packaging material 330 on the lead frame and cover the semiconductor chip, and the laser step is to remove the upper surface of the lead frame with a laser beam. For a part of the plastic packaging material 330, the electroplating step is to set the electroplating surface 323 on the surface of the lead frame that is not covered with the plastic packaging material 330 after the laser step, and then form the packaging structure 300 with a cutting step, wherein the laser step can be more than two. It depends on the energy and parameters of the laser beam, but is not limited to the above-mentioned process steps.

It can be seen from FIG. 20 that the length of the package structure 300 is L, the width of the package structure 300 is W, and the maximum protruding length of each pin 320 is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L. Specifically, the plastic encapsulation material 330 can be square or rectangular, and the maximum protruding length depends on the configuration of the circuit board, and is not limited to the above conditions. Furthermore, the maximum protruding lengths of the pins 320 may be the same. In this way, the solderable area of the pins 320 around the package structure 300 can be consistent, so that when the subsequent package structure 300 is welded to the circuit board (not shown in the figure), it is difficult to produce differences in the degree of welding, and it can be firmly arranged on the circuit board. plate.

It can be seen from FIG. 21 and FIG. 22 that the body 321 has a width W1, the extension portion 322 has a width W2, and the pin 320 has a thickness T, which satisfies the following condition: 0.25T ≤ W2 < W1. In this way, the structural stability of the pin 320 can be maintained, and it is not easy to cause the defect of solder creeping on the side.

Please refer to FIG. 23 to FIG. 27, wherein FIG. 23 shows the front view of the package structure 300 in the third embodiment shown in FIG. 19 after soldering, and FIG. 24 shows the package structure 300 in the third embodiment shown in FIG. 19 The schematic diagram of the rear surface after soldering, FIG. 25 shows a partial side view of the package structure 300 in the third embodiment in FIG. 19 after soldering, and FIG. 26 shows the package structure 300 in the third embodiment in FIG. 19 after soldering FIG. 27 shows a partial side view of the package structure 300 in the third embodiment shown in FIG. 26 after soldering. It can be seen from FIG. 23 to FIG. 27 that the solder portion 340 can only be disposed on the electroplating surface 323 , wherein the solder portion 340 is in contact with the main body 321 and the extension portion 322 on which the electroplating surface 323 is disposed. In this way, in addition to maintaining the solderable area of the package structure 300 on the bottom surface, the solderable area of the package structure 300 on the side can be increased, so as to improve the welding strength between the package structure 300 and the circuit board.

It can be seen from FIG. 25 that after the soldering operation is performed on the package structure 300 , inspectors can inspect the soldering condition by viewing the direction D through the automatic optical inspection. Specifically, the viewing direction D is a direction from the upper surface 301 to the lower surface 302 of the package structure 300 , and inspectors can directly inspect from a top-down perspective. The efficiency of inspection can be improved by performing automatic optical inspection at a top-down angle.

In addition, the third embodiment is the same as the first embodiment in terms of structure and disposition relationship of other components, which will not be repeated here.

Please refer to FIG. 28 to FIG. 31, wherein FIG. 28 shows a schematic front view of the package structure 400 according to the fourth embodiment of the present invention, and FIG. 29 shows a schematic rear view of the package structure 400 in the fourth embodiment shown in FIG. 28 , FIG. 30 shows a partial schematic view of the package structure 400 in the fourth embodiment shown in FIG. 28 , and FIG. 31 shows a schematic side view of the package structure 400 in the fourth embodiment shown in FIG. 28 . It can be seen from FIG. 28 to FIG. 31 that the packaging structure 400 has an upper surface 401 and a lower surface 402, and includes a lead frame (not shown), a semiconductor chip (not shown) and a plastic packaging material 430, The lead frame is used to carry the semiconductor chip, and the plastic encapsulation material 430 is disposed on the lead frame and covers the semiconductor chip to form the package structure 400 .

The lead frame includes a chip seat 410 and a plurality of pins 420, wherein the semiconductor chip is arranged on the chip seat 410 of the lead frame, the pins 420 are arranged around the chip seat 410, and each lead 420 includes a body 421, at least one extension portion 422 , a plurality of electroplated surfaces 423 , at least one electroless plated surface 424 and a protruding portion 425 .

The extension part 422 is connected to the body 421, and the protruding part 425 is connected to the body 421, and the body 421, the extension part 422 and the protruding part 425 are integrally formed, wherein the electroplating surface 423 is arranged on the body 421, the extension part 422 and the protruding part 425, without The plating surface 424 is disposed on the extension portion 422, wherein the body 421, the extension portion 422, and the protrusion 425 of each pin 420 protrude from the outer edge of the plastic packaging material 430, and the body 421 and the extension portion 422 are closer to the package than the protrusion 425 The lower surface 402 of the structure 400 . The side solderable area of the package structure 400 can be increased through the pins 420 protruding from the outer edge of the plastic package material 430 . Furthermore, compared with the packaging structure in the prior art where the pins do not protrude from the outer edge of the plastic packaging material, the packaging structure 400 can increase the thermal cycle life of the board by more than 20%.

In the fourth embodiment, the number of extensions 422 of each pin 420 is two, the number of plated surfaces 423 of each pin 420 is nine, the number of electroless plated surfaces 424 of each pin 420 is two, and each pin 420 is a ladder pin.

Furthermore, the packaging structure 400 of the fourth embodiment can be obtained through etching steps, molding steps, laser steps, electroplating steps and cutting steps, but not limited thereto. In detail, the etching step is to etch the upper surface of the lead frame, the molding step is to arrange the plastic packaging material 430 on the lead frame and cover the semiconductor chip, and the laser step is to remove the upper surface of the lead frame with a laser beam. For a part of the plastic packaging material 430, the electroplating step is to set the electroplating surface 423 on the surface of the lead frame that does not cover the plastic packaging material 430 after the laser step, and then form the packaging structure 400 with a cutting step, wherein the laser step can be more than two. It depends on the energy and parameters of the laser beam, but is not limited to the above-mentioned process steps.

It can be seen from FIG. 29 that the length of the package structure 400 is L, the width of the package structure 400 is W, and the maximum protruding length of each pin 420 is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L. Specifically, the plastic packaging material 430 can be square or rectangular, and the maximum protruding length depends on the configuration of the circuit board, and is not limited to the above conditions. Furthermore, the maximum protruding lengths of the pins 420 may be the same. In this way, the solderable area of the pins 420 around the package structure 400 can be consistent, so that when the subsequent package structure 400 is welded to the circuit board (not shown in the figure), it is difficult to produce differences in the degree of welding, and it can be firmly arranged on the circuit board. plate.

It can be seen from FIG. 29 to FIG. 31 that the length of the package structure 400 is L, the extension length of the protrusion 425 is L3, the width of the body 421 is W1, the width of the extension 422 is W2, and the length of the pin 420 is A thickness T, which satisfies the following conditions: 0 < L3 ≤ 0.5L; and 0.25T ≤ W2 < W1. In this way, the structural stability of the pin 420 can be maintained, and it is not easy to cause side solder run-off, and the reliability can be improved.

Please refer to FIG. 32 to FIG. 36, wherein FIG. 32 shows the front view of the package structure 400 in the fourth embodiment shown in FIG. 28 after soldering, and FIG. 33 shows the package structure 400 in the fourth embodiment shown in FIG. 28 The schematic diagram of the rear surface after soldering, FIG. 34 shows a partial side view of the package structure 400 in the fourth embodiment shown in FIG. 28 after soldering, and FIG. 35 shows the package structure 400 in the fourth embodiment shown in FIG. 28 after soldering FIG. 36 shows a partial side view of the package structure 400 in the fourth embodiment shown in FIG. 35 after soldering. It can be seen from FIG. 32 to FIG. 36 that the solder portion 440 can only be disposed on the electroplating surface 423 , wherein the solder portion 440 contacts the main body 421 , the extension portion 422 and the protruding portion 425 on which the electroplating surface 423 is disposed. In this way, in addition to maintaining the solderable area of the package structure 400 on the bottom surface, the solderable area of the package structure 400 on the side can be increased, so as to improve the welding strength between the package structure 400 and the circuit board.

It can be seen from FIG. 34 that after the soldering operation is performed on the package structure 400 , inspectors can check the soldering condition by viewing the direction D through the automatic optical inspection. Specifically, the viewing direction D is a direction from the upper surface 401 to the lower surface 402 of the package structure 400 , and inspectors can directly inspect from a top-down perspective. The efficiency of inspection can be improved by performing automatic optical inspection at a top-down angle.

In addition, the fourth embodiment is the same as the first embodiment in the structure and configuration relationship of the rest of the components, which will not be repeated here.

Please refer to FIG. 37 to FIG. 40, wherein FIG. 37 shows a schematic front view of the package structure 500 according to the fifth embodiment of the present invention, and FIG. 38 shows a schematic rear view of the package structure 500 in the fifth embodiment shown in FIG. 37 , FIG. 39 shows a partial schematic view of the package structure 500 in the fifth embodiment shown in FIG. 37 , and FIG. 40 shows a schematic side view of the package structure 500 in the fifth embodiment shown in FIG. 37 . It can be seen from FIG. 37 to FIG. 40 that the packaging structure 500 has an upper surface 501 and a lower surface 502, and includes a lead frame (not shown), a semiconductor chip (not shown) and a plastic packaging material 530, The lead frame is used to carry the semiconductor chip, and the plastic encapsulation material 530 is disposed on the lead frame and covers the semiconductor chip to form the package structure 500 .

The lead frame includes a chip seat 510 and a plurality of pins 520, wherein the semiconductor chip is arranged on the chip seat 510 of the lead frame, the pins 520 are arranged around the chip seat 510, and each lead 520 includes a body 521, at least one extension part 522 , a plurality of electroplated surfaces 523 , at least one electroless plated surface 524 and a planar part 526 .

The extension part 522 is connected to the main body 521, the flat part 526 is connected to the main body 521, and the main body 521, the extension part 522 and the flat part 526 are integrally formed, wherein the electroplating surface 523 is arranged on the main body 521, the extension part 522 and the flat part 526, and the electroless plating surface 524 The body 521 and the extension 522 of each pin 520 protrude from the outer edge of the plastic packaging material 530 , and the body 521 and the extension 522 are closer to the lower surface 502 of the package structure 500 than the planar portion 526 . The side solderable area of the package structure 500 can be increased through the pins 520 protruding from the outer edge of the plastic package material 530 . Furthermore, compared with the packaging structure in the prior art where the pins do not protrude from the outer edge of the plastic packaging material, the packaging structure 500 can increase the thermal cycle life of the board level by more than 20%.

In the fifth embodiment, the number of extensions 522 of each pin 520 is one, the number of plated surfaces 523 of each pin 520 is nine, the number of electroless plated surfaces 524 of each pin 520 is one, and each pin 520 is a ladder pin.

Furthermore, the packaging structure 500 of the fifth embodiment can be obtained through etching steps, molding steps, laser steps, electroplating steps and cutting steps, but not limited thereto. In detail, the etching step is to etch the upper surface of the lead frame, the molding step is to place the plastic packaging material 530 on the lead frame and cover the semiconductor chip, and the laser step is to remove the upper surface of the lead frame with a laser beam. For a part of the plastic packaging material 530, the electroplating step is to set the electroplating surface 523 on the surface of the lead frame that is not covered with the plastic packaging material 530 after the laser step, and then form the packaging structure 500 with a cutting step, wherein the laser step can be more than two. It depends on the energy and parameters of the laser beam, but is not limited to the above-mentioned process steps.

It can be seen from FIG. 38 that the length of the package structure 500 is L, the width of the package structure 500 is W, and the maximum protruding length of each pin 520 is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L. Specifically, the plastic packaging material 530 can be square or rectangular, and the maximum protruding length depends on the configuration of the circuit board, and is not limited to the above conditions. Furthermore, the maximum protruding lengths of the pins 520 may be the same. In this way, the solderable area of the pins 520 around the package structure 500 can be consistent, so that when the subsequent package structure 500 is welded to the circuit board (not shown in the figure), it is difficult to produce differences in the degree of welding, and it can be firmly arranged on the circuit board. plate.

It can be known from FIG. 39 and FIG. 40 that the width of the main body 521 is W1, the width of the extension 522 is W2, and the thickness of the pin 520 is T, which satisfy the following condition: 0.25T ≤ W2 < W1. In this way, the structural stability of the pin 520 can be maintained, and it is not easy to cause the defect of solder creeping on the side.

Please refer to FIG. 41 to FIG. 45, wherein FIG. 41 shows the front view of the package structure 500 in the fifth embodiment shown in FIG. 37 after soldering, and FIG. 42 shows the package structure 500 in the fifth embodiment shown in FIG. 37 The schematic diagram of the rear surface after soldering, FIG. 43 shows a partial side view of the package structure 500 in the fifth embodiment in FIG. 37 after soldering, and FIG. 44 shows the package structure 500 in the fifth embodiment in FIG. 37 after soldering FIG. 45 shows a partial side view of the package structure 500 in the fifth embodiment shown in FIG. 44 after soldering. It can be seen from FIG. 41 to FIG. 45 that the solder portion 540 can only be disposed on the electroplating surface 523 , wherein the solder portion 540 contacts the main body 521 , the extension portion 522 and the flat portion 526 on which the electroplating surface 523 is disposed. In this way, in addition to maintaining the solderable area of the package structure 500 on the bottom surface, the solderable area of the package structure 500 on the side can be increased, so as to improve the welding strength between the package structure 500 and the circuit board.

It can be seen from FIG. 43 that after the soldering operation is performed on the package structure 500 , inspectors can detect the soldering condition by viewing the direction D through the automatic optical inspection. Specifically, the inspection direction D is a direction from the upper surface 501 to the lower surface 502 of the package structure 500 , and inspectors can directly inspect from a top-down perspective. The efficiency of inspection can be improved by performing automatic optical inspection at a top-down angle.

In addition, the fifth embodiment is the same as the first embodiment in terms of the structure and arrangement of other elements, so it will not be repeated here.

Please refer to FIG. 46 to FIG. 49, wherein FIG. 46 shows a schematic front view of the package structure 600 according to the sixth embodiment of the present invention, and FIG. 47 shows a schematic rear view of the package structure 600 in the sixth embodiment shown in FIG. 46 , FIG. 48 shows a partial schematic diagram of the package structure 600 in the sixth embodiment shown in FIG. 46 , and FIG. 49 shows a schematic side view of the package structure 600 in the sixth embodiment shown in FIG. 46 . It can be seen from FIG. 46 to FIG. 49 that the packaging structure 600 has an upper surface 601 and a lower surface 602, and includes a lead frame (not shown), a semiconductor chip (not shown) and a plastic packaging material 630, The lead frame is used to carry the semiconductor chip, and the plastic encapsulation material 630 is disposed on the lead frame and covers the semiconductor chip to form the package structure 600 .

The lead frame includes a chip seat 610 and a plurality of pins 620, wherein the semiconductor chip is arranged on the chip seat 610 of the lead frame, the pins 620 are arranged around the chip seat 610, and each lead 620 includes a body 621, at least one extension portion 622 , a plurality of electroplated surfaces 623 , at least one electroless plated surface 624 and a planar portion 626 .

The extension part 622 is connected to the body 621, and the plane part 626 is connected to the body 621, and the body 621, the extension part 622 and the plane part 626 are integrally formed, wherein the electroplating surface 623 is arranged on the body 621, the extension part 622 and the plane part 626, and the electroless plating surface 624 Set on the extension part 622, wherein the body 621 of each pin 620 is close to the outer edge of the plastic packaging material 630, and the extension part 622 of each pin 620 protrudes from the outer edge of the plastic packaging material 630, and the body 621 is closer to the extension part 622. The planar portion 626 is away from the lower surface 602 of the package structure 600 . The side solderable area of the package structure 600 can be increased through the pins 620 protruding from the outer edge of the plastic package material 630 . Furthermore, compared with the packaging structure in the prior art in which pins do not protrude from the outer edge of the plastic packaging material, the packaging structure 600 can increase the board-level thermal cycle life by more than 20%. It must be noted that the body 621 is aligned with the outer edge of the plastic packaging material 630 means that the main body 621 does not protrude from the outer edge of the plastic packaging material 630 .

In the sixth embodiment, the number of extensions 622 of each pin 620 is two, the number of plated surfaces 623 of each pin 620 is ten, the number of electroless plated surfaces 624 of each pin 620 is two, and each pin 620 is a protruding pin.

Furthermore, the packaging structure 600 of the sixth embodiment can be obtained through etching steps, molding steps, laser steps, electroplating steps and cutting steps, but not limited thereto. In detail, the etching step is to etch the lower surface of the lead frame, the molding step is to arrange the plastic packaging material 630 on the lead frame and cover the semiconductor chip, and the laser step is to respectively etch the upper surface and the lower surface of the lead frame. The laser beam removes a part of the plastic packaging material 630, and the electroplating step is to set the electroplating surface 623 on the surface of the lead frame that is not covered with the plastic packaging material 630 after the laser step, and then form the packaging structure 600 by a cutting step, wherein the laser step can be two It depends on the energy and parameters of the laser beam, but is not limited to the above-mentioned process steps.

It can be seen from FIG. 47 that the length of the package structure 600 is L, the width of the package structure 600 is W, and the maximum protruding length of each pin 620 is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L. Specifically, the plastic encapsulation material 630 can be square or rectangular, and the maximum protruding length depends on the configuration of the circuit board, and is not limited to the above conditions. Furthermore, the maximum protruding lengths of the pins 620 may be the same. In this way, the solderable area of the pins 620 around the package structure 600 can be consistent, so that when the subsequent package structure 600 is welded to the circuit board (not shown in the figure), it is difficult to produce differences in the degree of welding, and it can be firmly arranged on the circuit board. plate.

Furthermore, the part of the lead 620 close to the lower surface 602 of the packaging structure 600 does not exceed the edge of the plastic packaging material 630 . Therefore, the package structure 600 of the sixth embodiment does not need to change the style of the package outline drawing, reducing the procedure of redrawing the package outline drawing.

Please refer to FIG. 50 to FIG. 54, wherein FIG. 50 shows the front view of the package structure 600 in the sixth embodiment shown in FIG. 46 after soldering, and FIG. 51 shows the package structure 600 in the sixth embodiment shown in FIG. 46 The schematic diagram of the rear surface after soldering, FIG. 52 shows a partial side view of the package structure 600 in the sixth embodiment shown in FIG. 46 after soldering, and FIG. 53 shows the package structure 600 in the sixth embodiment shown in FIG. 46 after soldering FIG. 54 shows a partial side view of the packaging structure 600 in the sixth embodiment shown in FIG. 53 after soldering. It can be seen from FIG. 50 to FIG. 54 that the solder portion 640 can only be disposed on the electroplating surface 623 , wherein the solder portion 640 contacts the main body 621 , the extension portion 622 and the flat portion 626 on which the electroplating surface 623 is disposed. In this way, in addition to maintaining the solderable area of the package structure 600 on the bottom surface, the solderable area of the package structure 600 on the side can be increased, so as to improve the welding strength between the package structure 600 and the circuit board.

As can be seen from FIG. 52 , after the soldering operation of the package structure 600 , inspectors can check the soldering condition by viewing the direction D through the automatic optical inspection. Specifically, the inspection direction D is a direction from the upper surface 601 to the lower surface 602 of the package structure 600 , and inspectors can directly inspect from a top-down perspective. The efficiency of inspection can be improved by performing automatic optical inspection at a top-down angle.

In addition, the structure and arrangement relationship of the rest of the components in the sixth embodiment are the same as those in the first embodiment, which will not be repeated here.

To sum up, the packaging structure of the present invention can maintain the soldering area of the bottom surface, and simultaneously increase the solderable area of the side of the packaging structure, thereby improving the soldering strength between the packaging structure and the circuit board. Moreover, the packaging structure can be stably arranged on the circuit board after soldering, so as to increase the thermal cycle life of the board level. Furthermore, the detection efficiency can be improved in the detection operation after the soldering operation.

Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

100,200,300,400,500,600: package structure 101, 201, 301, 401, 501, 601: upper surface 102,202,302,402,502,602: lower surface 110,210,310,410,510,610: wafer holder 120,220,320,420,520,620: pins 121,221,321,421,521,621: Ontology 122,222,322,422,522,622: extension 123,223,323,423,523,623: Plating surface 124,224,324,424,524,624: electroless plated surface 125,425: protruding part 130,230,330,430,530,630: plastic packaging materials 140,240,340,440,540,640: soldering department 226,526,626: plane department D: viewing direction L1, L2, L3: extension length W1, W2, W: width L: Length Lmax: Maximum protrusion length T: Thickness

FIG. 1 shows a schematic front view of a packaging structure according to a first embodiment of the present invention; FIG. 2 shows a schematic view of the rear of the packaging structure in the first embodiment of FIG. 1; FIG. 3 shows a partial schematic diagram of the package structure in the first embodiment of FIG. 1; FIG. 4 shows a schematic side view of the package structure in the first embodiment of FIG. 1; FIG. 5 shows a schematic front view of the package structure after soldering in the first embodiment of FIG. 1; FIG. 6 shows a schematic view of the back side of the package structure after soldering in the first embodiment of FIG. 1; FIG. 7 shows a partial side view of the package structure after soldering in the first embodiment of FIG. 1; FIG. 8 shows a schematic side view of the package structure after soldering in the first embodiment of FIG. 1; FIG. 9 shows a partial side view of the package structure after soldering in the first embodiment of FIG. 8; FIG. 10 shows a schematic front view of the packaging structure according to the second embodiment of the present invention; FIG. 11 shows a schematic diagram of the rear of the package structure in the second embodiment of FIG. 10; FIG. 12 shows a partial schematic diagram of the package structure in the second embodiment of FIG. 10; FIG. 13 shows a schematic side view of the package structure in the second embodiment of FIG. 10; FIG. 14 shows a schematic front view of the package structure after soldering in the second embodiment of FIG. 10; FIG. 15 shows a schematic view of the back side of the package structure after soldering in the second embodiment of FIG. 10; FIG. 16 shows a partial side view of the package structure after soldering in the second embodiment of FIG. 10; FIG. 17 shows a schematic side view of the package structure after soldering in the second embodiment of FIG. 10; FIG. 18 shows a partial side view of the package structure after soldering in the second embodiment of FIG. 17; FIG. 19 shows a schematic front view of the packaging structure according to the third embodiment of the present invention; FIG. 20 shows a schematic view of the rear of the package structure in the third embodiment shown in FIG. 19; FIG. 21 is a partial schematic diagram of the package structure in the third embodiment shown in FIG. 19; FIG. 22 shows a schematic side view of the package structure in the third embodiment shown in FIG. 19; FIG. 23 shows a schematic front view of the package structure after soldering in the third embodiment shown in FIG. 19; FIG. 24 is a schematic diagram of the rear surface of the package structure after soldering in the third embodiment shown in FIG. 19; FIG. 25 shows a partial side view of the package structure after soldering in the third embodiment of FIG. 19; FIG. 26 shows a schematic side view of the package structure after soldering in the third embodiment of FIG. 19; FIG. 27 shows a partial side view of the package structure after soldering in the third embodiment of FIG. 26; FIG. 28 shows a schematic front view of the packaging structure according to the fourth embodiment of the present invention; FIG. 29 shows a schematic diagram of the rear of the package structure in the fourth embodiment shown in FIG. 28; FIG. 30 is a partial schematic diagram of the package structure in the fourth embodiment shown in FIG. 28; FIG. 31 is a schematic side view of the package structure in the fourth embodiment shown in FIG. 28; FIG. 32 shows a schematic front view of the package structure after soldering in the fourth embodiment shown in FIG. 28; FIG. 33 is a schematic diagram of the rear surface of the package structure after soldering in the fourth embodiment shown in FIG. 28; FIG. 34 shows a partial side view of the package structure after soldering in the fourth embodiment shown in FIG. 28; FIG. 35 shows a schematic side view of the package structure after soldering in the fourth embodiment shown in FIG. 28; FIG. 36 shows a partial side view of the package structure after soldering in the fourth embodiment shown in FIG. 35; FIG. 37 shows a schematic front view of the packaging structure according to the fifth embodiment of the present invention; FIG. 38 shows a schematic view of the rear of the packaging structure in the fifth embodiment shown in FIG. 37; FIG. 39 shows a partial schematic diagram of the package structure in the fifth embodiment shown in FIG. 37; FIG. 40 shows a schematic side view of the package structure in the fifth embodiment shown in FIG. 37; FIG. 41 shows a schematic front view of the package structure after soldering in the fifth embodiment shown in FIG. 37; FIG. 42 is a schematic diagram of the rear surface of the package structure in the fifth embodiment shown in FIG. 37 after soldering; FIG. 43 shows a partial side view of the package structure after soldering in the fifth embodiment of FIG. 37; FIG. 44 shows a schematic side view of the package structure after soldering in the fifth embodiment shown in FIG. 37; FIG. 45 shows a partial side view of the package structure after soldering in the fifth embodiment of FIG. 44; FIG. 46 shows a schematic front view of the packaging structure according to the sixth embodiment of the present invention; FIG. 47 shows a schematic view of the rear of the packaging structure in the sixth embodiment shown in FIG. 46; FIG. 48 shows a partial schematic diagram of the packaging structure in the sixth embodiment of FIG. 46; FIG. 49 shows a schematic side view of the package structure in the sixth embodiment shown in FIG. 46; FIG. 50 shows a schematic front view of the packaging structure after soldering in the sixth embodiment shown in FIG. 46; FIG. 51 is a schematic diagram of the rear surface of the packaging structure after soldering in the sixth embodiment shown in FIG. 46; FIG. 52 shows a partial side view of the packaging structure in the sixth embodiment shown in FIG. 46 after soldering; FIG. 53 shows a schematic side view of the packaging structure in the sixth embodiment of FIG. 46 after soldering; and FIG. 54 is a partial side view of the packaging structure in FIG. 53 in the sixth embodiment after soldering.

100: Package structure

121: Ontology

122: Extension

123: Plating surface

124: Electroless plating surface

125: protruding part

130: plastic packaging material

L1, L2: extension length

W1, W2: width

Claims (17)

A packaging structure comprising: A lead frame, comprising: a wafer holder; and A plurality of pins are arranged around the chip holder, and each pin includes: a body; At least one extension part is connected to the body, and the body and the at least one extension part are integrally formed; and A plurality of electroplating surfaces are disposed on the body and the at least one extension; a semiconductor chip disposed on the die pad of the lead frame; and a plastic packaging material arranged on the lead frame; Wherein, the main body and the at least one extension portion of each pin protrude from the outer edge of the plastic packaging material. The package structure according to claim 1, wherein each of the leads further includes at least one electroless plating surface, and the at least one electroless plating surface is disposed on the at least one extension portion. The packaging structure as described in claim 1, wherein a length of the packaging structure is L, a width of the packaging structure is W, and a maximum protruding length of each pin is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L. The package structure according to claim 1, wherein the body has a width of W1, the at least one extension has a width of W2, and the lead has a thickness of T, which satisfies the following conditions: 0.25T ≤ W2 < W1. The package structure according to claim 1, wherein the number of the plated surfaces is at least eight. The package structure as claimed in item 1, wherein each of the pins further includes a protruding portion, the protruding portion is connected to the body, the body, the at least one extension portion and the protruding portion are integrally formed, and these The electroplating surface is disposed on the protrusion. The packaging structure as claimed in claim 6, wherein the body and the at least one extending portion are farther away from a lower surface of the packaging structure than the protruding portion. The package structure as described in claim 7, wherein an extension length of the body is L1, an extension length of the at least one extension part is L2, a maximum protruding length of each pin is Lmax, and a length of the package structure is L, which satisfies the following conditions: 0 < L2 ≤ 0.5L; and 0 < Lmax = L1+L2. The package structure as claimed in item 6, wherein a length of the package structure is L, an extension length of the protrusion is L3, and it satisfies the following conditions: 0 < L3 ≤ 0.5L. The packaging structure as claimed in claim 6, wherein the body and the at least one extending portion are closer to a lower surface of the packaging structure than the protruding portion. The package structure as described in claim 1, wherein each of the pins further includes a plane portion, the plane portion is connected to the body, the body, the at least one extension portion and the plane portion are integrally formed, and the plating surfaces are provided on the plane. The package structure according to claim 11, wherein the body and the at least one extension part are farther away from the lower surface of the package structure than the planar part. The package structure as described in claim 12, wherein an extension length of the body is L1, an extension length of the at least one extension part is L2, a maximum protruding length of each pin is Lmax, and a length of the package structure is L, which satisfies the following conditions: 0 < L2 ≤ 0.5L; and 0 < Lmax = L1+L2. The package structure according to claim 11, wherein the body and the at least one extension portion are closer to a lower surface of the package structure than the planar portion. A packaging structure comprising: A lead frame, comprising: a wafer holder; and A plurality of pins are arranged around the chip holder, and each pin includes: a body; At least one extension part is connected to the body, and the body and the at least one extension part are integrally formed; and A plurality of electroplating surfaces are disposed on the body and the at least one extension; a semiconductor chip disposed on the die pad of the lead frame; and a plastic packaging material arranged on the lead frame; Wherein, the body of each lead is aligned with the outer edge of the plastic packaging material, and the at least one extension portion of each lead protrudes from the outer edge of the plastic packaging material. The package structure according to claim 15, wherein each of the pins further includes a plane portion, the plane portion is connected to the body, the body, the at least one extension portion and the plane portion are integrally formed, and the plating surfaces are provided on the plane. The packaging structure as described in claim 15, wherein a length of the packaging structure is L, a width of the packaging structure is W, and a maximum protruding length of each pin is Lmax, which satisfies the following conditions: W ≤ L; 0.01W ≤ Lmax; and Lmax ≤ 0.5L.

Images