TW202329205A - 資訊處理方法、資訊處理裝置及基板處理系統 - Google Patents

資訊處理方法、資訊處理裝置及基板處理系統 Download PDF

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Publication number
TW202329205A
TW202329205A TW111130907A TW111130907A TW202329205A TW 202329205 A TW202329205 A TW 202329205A TW 111130907 A TW111130907 A TW 111130907A TW 111130907 A TW111130907 A TW 111130907A TW 202329205 A TW202329205 A TW 202329205A
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TW
Taiwan
Prior art keywords
learning model
learning
model
substrate processing
control
Prior art date
Application number
TW111130907A
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English (en)
Chinese (zh)
Inventor
斉藤友貴哉
片岡勇樹
Original Assignee
日商東京威力科創股份有限公司
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Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202329205A publication Critical patent/TW202329205A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
TW111130907A 2021-08-31 2022-08-17 資訊處理方法、資訊處理裝置及基板處理系統 TW202329205A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-141749 2021-08-31
JP2021141749 2021-08-31

Publications (1)

Publication Number Publication Date
TW202329205A true TW202329205A (zh) 2023-07-16

Family

ID=85412213

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111130907A TW202329205A (zh) 2021-08-31 2022-08-17 資訊處理方法、資訊處理裝置及基板處理系統

Country Status (6)

Country Link
US (1) US20240202606A1 (https=)
JP (1) JPWO2023032636A1 (https=)
KR (1) KR20240049620A (https=)
CN (1) CN117882170A (https=)
TW (1) TW202329205A (https=)
WO (1) WO2023032636A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024136166A (ja) * 2023-03-23 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 情報処理装置、基板処理装置および処理条件決定方法
JP2025101332A (ja) * 2023-12-25 2025-07-07 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成プログラム生成方法、スケジュール作成プログラム生成装置、スケジュール作成装置、記録媒体、生成プログラム、スケジュール作成プログラム、基板処理装置、及び基板処理システム
WO2025249225A1 (ja) * 2024-05-29 2025-12-04 東京エレクトロン株式会社 コンピュータプログラム、学習モデルの生成方法、情報処理方法及び情報処理装置
CN118520835B (zh) * 2024-07-22 2024-10-25 上海燧原智能科技有限公司 基板排气孔布局补充方法、模型训练方法、装置及设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014065269A1 (ja) * 2012-10-24 2014-05-01 東京エレクトロン株式会社 補正値算出装置、補正値算出方法及びコンピュータプログラム
JP6720402B2 (ja) 2017-03-21 2020-07-08 株式会社Ｐｒｅｆｅｒｒｅｄ Ｎｅｔｗｏｒｋｓ サーバ装置、学習済モデル提供プログラム、学習済モデル提供方法及び学習済モデル提供システム
JP6689507B2 (ja) 2018-02-20 2020-04-28 株式会社Ａｂｅｊａ 情報処理システム
JP2020181959A (ja) * 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
JP7412150B2 (ja) * 2019-11-29 2024-01-12 東京エレクトロン株式会社 予測装置、予測方法及び予測プログラム
JP7493930B2 (ja) * 2019-12-10 2024-06-03 キヤノン株式会社 情報処理方法、情報処理装置、生産システム、プログラム、記録媒体

Also Published As

Publication number Publication date
JPWO2023032636A1 (https=) 2023-03-09
CN117882170A (zh) 2024-04-12
KR20240049620A (ko) 2024-04-16
WO2023032636A1 (ja) 2023-03-09
US20240202606A1 (en) 2024-06-20

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