CN117882170A - 信息处理方法、信息处理装置、以及基板处理系统 - Google Patents

信息处理方法、信息处理装置、以及基板处理系统 Download PDF

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Publication number
CN117882170A
CN117882170A CN202280058364.8A CN202280058364A CN117882170A CN 117882170 A CN117882170 A CN 117882170A CN 202280058364 A CN202280058364 A CN 202280058364A CN 117882170 A CN117882170 A CN 117882170A
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CN
China
Prior art keywords
model
learning model
learning
substrate processing
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280058364.8A
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English (en)
Chinese (zh)
Inventor
齐藤友贵哉
片冈勇树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN117882170A publication Critical patent/CN117882170A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
CN202280058364.8A 2021-08-31 2022-08-12 信息处理方法、信息处理装置、以及基板处理系统 Pending CN117882170A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-141749 2021-08-31
JP2021141749 2021-08-31
PCT/JP2022/030707 WO2023032636A1 (ja) 2021-08-31 2022-08-12 情報処理方法、情報処理装置、及び基板処理システム

Publications (1)

Publication Number Publication Date
CN117882170A true CN117882170A (zh) 2024-04-12

Family

ID=85412213

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280058364.8A Pending CN117882170A (zh) 2021-08-31 2022-08-12 信息处理方法、信息处理装置、以及基板处理系统

Country Status (6)

Country Link
US (1) US20240202606A1 (https=)
JP (1) JPWO2023032636A1 (https=)
KR (1) KR20240049620A (https=)
CN (1) CN117882170A (https=)
TW (1) TW202329205A (https=)
WO (1) WO2023032636A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024136166A (ja) * 2023-03-23 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 情報処理装置、基板処理装置および処理条件決定方法
JP2025101332A (ja) * 2023-12-25 2025-07-07 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成プログラム生成方法、スケジュール作成プログラム生成装置、スケジュール作成装置、記録媒体、生成プログラム、スケジュール作成プログラム、基板処理装置、及び基板処理システム
WO2025249225A1 (ja) * 2024-05-29 2025-12-04 東京エレクトロン株式会社 コンピュータプログラム、学習モデルの生成方法、情報処理方法及び情報処理装置
CN118520835B (zh) * 2024-07-22 2024-10-25 上海燧原智能科技有限公司 基板排气孔布局补充方法、模型训练方法、装置及设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014065269A1 (ja) * 2012-10-24 2014-05-01 東京エレクトロン株式会社 補正値算出装置、補正値算出方法及びコンピュータプログラム
JP6720402B2 (ja) 2017-03-21 2020-07-08 株式会社Ｐｒｅｆｅｒｒｅｄ Ｎｅｔｗｏｒｋｓ サーバ装置、学習済モデル提供プログラム、学習済モデル提供方法及び学習済モデル提供システム
JP6689507B2 (ja) 2018-02-20 2020-04-28 株式会社Ａｂｅｊａ 情報処理システム
JP2020181959A (ja) * 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
JP7412150B2 (ja) * 2019-11-29 2024-01-12 東京エレクトロン株式会社 予測装置、予測方法及び予測プログラム
JP7493930B2 (ja) * 2019-12-10 2024-06-03 キヤノン株式会社 情報処理方法、情報処理装置、生産システム、プログラム、記録媒体

Also Published As

Publication number Publication date
TW202329205A (zh) 2023-07-16
JPWO2023032636A1 (https=) 2023-03-09
KR20240049620A (ko) 2024-04-16
WO2023032636A1 (ja) 2023-03-09
US20240202606A1 (en) 2024-06-20

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