KR20240049620A - 정보 처리 방법, 정보 처리 장치, 및 기판 처리 시스템 - Google Patents

정보 처리 방법, 정보 처리 장치, 및 기판 처리 시스템 Download PDF

Info

Publication number
KR20240049620A
KR20240049620A KR1020247010655A KR20247010655A KR20240049620A KR 20240049620 A KR20240049620 A KR 20240049620A KR 1020247010655 A KR1020247010655 A KR 1020247010655A KR 20247010655 A KR20247010655 A KR 20247010655A KR 20240049620 A KR20240049620 A KR 20240049620A
Authority
KR
South Korea
Prior art keywords
learning model
model
learning
substrate processing
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247010655A
Other languages
English (en)
Korean (ko)
Inventor
유키야 사이토
유키 가타오카
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20240049620A publication Critical patent/KR20240049620A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H01L21/67253—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • H01L21/67098—
    • H01L21/67201—
    • H01L21/67248—
    • H01L21/6773—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
KR1020247010655A 2021-08-31 2022-08-12 정보 처리 방법, 정보 처리 장치, 및 기판 처리 시스템 Pending KR20240049620A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-141749 2021-08-31
JP2021141749 2021-08-31
PCT/JP2022/030707 WO2023032636A1 (ja) 2021-08-31 2022-08-12 情報処理方法、情報処理装置、及び基板処理システム

Publications (1)

Publication Number Publication Date
KR20240049620A true KR20240049620A (ko) 2024-04-16

Family

ID=85412213

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247010655A Pending KR20240049620A (ko) 2021-08-31 2022-08-12 정보 처리 방법, 정보 처리 장치, 및 기판 처리 시스템

Country Status (6)

Country Link
US (1) US20240202606A1 (https=)
JP (1) JPWO2023032636A1 (https=)
KR (1) KR20240049620A (https=)
CN (1) CN117882170A (https=)
TW (1) TW202329205A (https=)
WO (1) WO2023032636A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024136166A (ja) * 2023-03-23 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 情報処理装置、基板処理装置および処理条件決定方法
JP2025101332A (ja) * 2023-12-25 2025-07-07 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成プログラム生成方法、スケジュール作成プログラム生成装置、スケジュール作成装置、記録媒体、生成プログラム、スケジュール作成プログラム、基板処理装置、及び基板処理システム
WO2025249225A1 (ja) * 2024-05-29 2025-12-04 東京エレクトロン株式会社 コンピュータプログラム、学習モデルの生成方法、情報処理方法及び情報処理装置
CN118520835B (zh) * 2024-07-22 2024-10-25 上海燧原智能科技有限公司 基板排气孔布局补充方法、模型训练方法、装置及设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018173121A1 (ja) 2017-03-21 2018-09-27 株式会社Ｐｒｅｆｅｒｒｅｄ Ｎｅｔｗｏｒｋｓ サーバ装置、学習済モデル提供プログラム、学習済モデル提供方法及び学習済モデル提供システム
WO2019163823A1 (ja) 2018-02-20 2019-08-29 株式会社Ａｂｅｊａ 情報処理システム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014065269A1 (ja) * 2012-10-24 2014-05-01 東京エレクトロン株式会社 補正値算出装置、補正値算出方法及びコンピュータプログラム
JP2020181959A (ja) * 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
JP7412150B2 (ja) * 2019-11-29 2024-01-12 東京エレクトロン株式会社 予測装置、予測方法及び予測プログラム
JP7493930B2 (ja) * 2019-12-10 2024-06-03 キヤノン株式会社 情報処理方法、情報処理装置、生産システム、プログラム、記録媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018173121A1 (ja) 2017-03-21 2018-09-27 株式会社Ｐｒｅｆｅｒｒｅｄ Ｎｅｔｗｏｒｋｓ サーバ装置、学習済モデル提供プログラム、学習済モデル提供方法及び学習済モデル提供システム
WO2019163823A1 (ja) 2018-02-20 2019-08-29 株式会社Ａｂｅｊａ 情報処理システム

Also Published As

Publication number Publication date
TW202329205A (zh) 2023-07-16
JPWO2023032636A1 (https=) 2023-03-09
CN117882170A (zh) 2024-04-12
WO2023032636A1 (ja) 2023-03-09
US20240202606A1 (en) 2024-06-20

Similar Documents

Publication Publication Date Title
KR20240049620A (ko) 정보 처리 방법, 정보 처리 장치, 및 기판 처리 시스템
US12242237B2 (en) Methods and mechanisms for generating a data collection plan for a semiconductor manufacturing system
US12235624B2 (en) Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing
KR20230150368A (ko) 가상 모델을 사용한 프로세스 챔버 건강 모니터링 및 진단을 위한 시스템들 및 방법들
US12191126B2 (en) Process control knob estimation
CN118435137A (zh) 用于使用基于物理的模型的基板制造腔室的诊断方法
KR20240058131A (ko) 정보 처리 방법, 정보 처리 장치, 및 정보 처리 시스템
US12506024B2 (en) Method and mechanism for contact-free process chamber characterization
CN116805582A (zh) 用于在基板制造期间测量图案化基板特性的方法和机制
JP2026000953A (ja) センサを移送チャンバロボットに結合するための方法および機構
TW202509692A (zh) 修改用於新半導體處理設備的機器學習模型的方法和機制
KR20230164607A (ko) 머신 러닝 모델 성능의 변동을 방지하기 위한 방법들 및 메커니즘들
CN117916871A (zh) 用于将传感器耦合至传输腔室机器人的方法和机构

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000