JPWO2023032636A1 - - Google Patents
Info
- Publication number
- JPWO2023032636A1 JPWO2023032636A1 JP2023545409A JP2023545409A JPWO2023032636A1 JP WO2023032636 A1 JPWO2023032636 A1 JP WO2023032636A1 JP 2023545409 A JP2023545409 A JP 2023545409A JP 2023545409 A JP2023545409 A JP 2023545409A JP WO2023032636 A1 JPWO2023032636 A1 JP WO2023032636A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
- G06N20/20—Ensemble learning
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- Data Mining & Analysis (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Mathematical Physics (AREA)
- Artificial Intelligence (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021141749 | 2021-08-31 | ||
| PCT/JP2022/030707 WO2023032636A1 (ja) | 2021-08-31 | 2022-08-12 | 情報処理方法、情報処理装置、及び基板処理システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032636A1 true JPWO2023032636A1 (https=) | 2023-03-09 |
| JPWO2023032636A5 JPWO2023032636A5 (https=) | 2024-05-23 |
Family
ID=85412213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545409A Pending JPWO2023032636A1 (https=) | 2021-08-31 | 2022-08-12 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240202606A1 (https=) |
| JP (1) | JPWO2023032636A1 (https=) |
| KR (1) | KR20240049620A (https=) |
| CN (1) | CN117882170A (https=) |
| TW (1) | TW202329205A (https=) |
| WO (1) | WO2023032636A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024136166A (ja) * | 2023-03-23 | 2024-10-04 | 株式会社Ｓｃｒｅｅｎホールディングス | 情報処理装置、基板処理装置および処理条件決定方法 |
| JP2025101332A (ja) * | 2023-12-25 | 2025-07-07 | 株式会社Ｓｃｒｅｅｎホールディングス | スケジュール作成プログラム生成方法、スケジュール作成プログラム生成装置、スケジュール作成装置、記録媒体、生成プログラム、スケジュール作成プログラム、基板処理装置、及び基板処理システム |
| WO2025249225A1 (ja) * | 2024-05-29 | 2025-12-04 | 東京エレクトロン株式会社 | コンピュータプログラム、学習モデルの生成方法、情報処理方法及び情報処理装置 |
| CN118520835B (zh) * | 2024-07-22 | 2024-10-25 | 上海燧原智能科技有限公司 | 基板排气孔布局补充方法、模型训练方法、装置及设备 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014065269A1 (ja) * | 2012-10-24 | 2014-05-01 | 東京エレクトロン株式会社 | 補正値算出装置、補正値算出方法及びコンピュータプログラム |
| JP2020181959A (ja) * | 2019-04-26 | 2020-11-05 | 東京エレクトロン株式会社 | 学習方法、管理装置および管理プログラム |
| JP2021086572A (ja) * | 2019-11-29 | 2021-06-03 | 東京エレクトロン株式会社 | 予測装置、予測方法及び予測プログラム |
| JP2021092970A (ja) * | 2019-12-10 | 2021-06-17 | キヤノン株式会社 | 制御方法、制御装置、機械設備、制御プログラム、記録媒体 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6720402B2 (ja) | 2017-03-21 | 2020-07-08 | 株式会社Ｐｒｅｆｅｒｒｅｄ Ｎｅｔｗｏｒｋｓ | サーバ装置、学習済モデル提供プログラム、学習済モデル提供方法及び学習済モデル提供システム |
| JP6689507B2 (ja) | 2018-02-20 | 2020-04-28 | 株式会社Ａｂｅｊａ | 情報処理システム |
-
2022
- 2022-08-12 JP JP2023545409A patent/JPWO2023032636A1/ja active Pending
- 2022-08-12 KR KR1020247010655A patent/KR20240049620A/ko active Pending
- 2022-08-12 WO PCT/JP2022/030707 patent/WO2023032636A1/ja not_active Ceased
- 2022-08-12 CN CN202280058364.8A patent/CN117882170A/zh active Pending
- 2022-08-17 TW TW111130907A patent/TW202329205A/zh unknown
-
2024
- 2024-02-28 US US18/589,462 patent/US20240202606A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014065269A1 (ja) * | 2012-10-24 | 2014-05-01 | 東京エレクトロン株式会社 | 補正値算出装置、補正値算出方法及びコンピュータプログラム |
| JP2020181959A (ja) * | 2019-04-26 | 2020-11-05 | 東京エレクトロン株式会社 | 学習方法、管理装置および管理プログラム |
| JP2021086572A (ja) * | 2019-11-29 | 2021-06-03 | 東京エレクトロン株式会社 | 予測装置、予測方法及び予測プログラム |
| JP2021092970A (ja) * | 2019-12-10 | 2021-06-17 | キヤノン株式会社 | 制御方法、制御装置、機械設備、制御プログラム、記録媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202329205A (zh) | 2023-07-16 |
| CN117882170A (zh) | 2024-04-12 |
| KR20240049620A (ko) | 2024-04-16 |
| WO2023032636A1 (ja) | 2023-03-09 |
| US20240202606A1 (en) | 2024-06-20 |
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