TW202328368A - Bonding method - Google Patents

Bonding method Download PDF

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Publication number
TW202328368A
TW202328368A TW111129471A TW111129471A TW202328368A TW 202328368 A TW202328368 A TW 202328368A TW 111129471 A TW111129471 A TW 111129471A TW 111129471 A TW111129471 A TW 111129471A TW 202328368 A TW202328368 A TW 202328368A
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Taiwan
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induction heating
adhesive
spacer
frequency induction
adherend
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TW111129471A
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Chinese (zh)
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紀
天野泰之
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日商琳得科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/40—Applying molten plastics, e.g. hot melt
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spacer (210) are placed and a high-frequency electric-field application step in which a high-frequency electric field is applied to the adhesive (11) for high-frequency dielectric heating to bond the adherend (120). The adherend (120) has a first surface, which includes recessed and protrudent portions, and the adhesive (11) for high-frequency dielectric heating comprises a thermoplastic resin. In the placement step, after the adherend (120) and the spacer (210) have been placed, there are spaces (31) formed between the first surface of the adherend (120) and the surface of the spacer (210) which faces the first surface, and the spaces (31) are filled by a deformation of the spacer (210).

Description

接合方法Joining method

本發明係有關接合方法。The present invention relates to joining methods.

做為使用黏著劑，接合被附著體之方法，提案有經由高頻感應加熱處理等，接合被附著體之方法。例如，有在於被附著體之至少一方之面，將具備起伏面之被附著體，使用黏著劑，經由高頻感應加熱處理進行接合之情形。此時，有將具備起伏面之被附著體之起伏面側，配置於高頻感應加熱裝置之電極面側，在與電極面相反側之面，配置黏著劑進行接合之情形。 例如，文獻1(日本特開2004-0222990號公報)中，揭示有經由在一方之被附著體之被黏著部分之被黏著面，塗佈水性黏著劑，及重合一方之被附著體之被黏著面與另一方之被附著體之被黏著面，以及按壓重合之被黏著面，進行高頻感應加熱，接合一方之被附著體與另一方之被附著體之2個之被附著體的方法。 將具備起伏面之被附著體之起伏面側，配置於高頻感應加熱裝置之電極面側，在與該電極面側相反側之面，配置黏著劑進行接合之時，於高頻感應加熱裝置之電極面與該被附著體之起伏面間，會產生空間部。然後，對於該黏著劑，施加高頻電場時，對於配置於對應在該空間部之位置之接著劑而言，難以傳導高頻之能量，對於配置於對應於接觸被附著體之起伏面與高頻感應加熱裝置之電極之部分之位置的黏著劑而言，選擇性地易於傳導高頻之能量。為此，對於黏著劑之高頻電場之施加會變得不均勻，難以在短時間強固接合被附著體與黏著劑。 揭示於文獻1之接合技術中，為了埋入將具備起伏面之被附著體之起伏面，配置於高頻感應加熱裝置之電極面側時所產生之空間，預先，使用成形成為對應於具備被附著體之起伏面之形狀的壓接板，接合複數之被附著體。但是，揭示於文獻1之接合技術中，就每個起伏面之形狀準備成形之壓接板則變得麻煩。如此，將具備起伏面之被附著體，配置於高頻感應加熱裝置之電極面側，經由高頻感應加熱處理加以接合之技術則有更多改善之空間。 As a method of bonding the adherend using an adhesive, there is proposed a method of bonding the adherend through high-frequency induction heating treatment or the like. For example, there is a case where an adherend having an undulating surface is bonded to at least one surface of the adherend through high-frequency induction heating using an adhesive. At this time, the undulating surface side of the adherend having the undulating surface may be placed on the electrode surface side of the high-frequency induction heating device, and an adhesive may be placed on the surface opposite to the electrode surface for bonding. For example, in Document 1 (Japanese Unexamined Patent Publication No. 2004-0222990 ), it is disclosed that a water-based adhesive is applied to the adhered surface of the adhered part of one adherend, and the adhered surface of one adherend is overlapped. A method of joining the two adherends of one adherend and the other adherend by pressing the superimposed adherend surface and heating with high-frequency induction. Place the undulating surface side of the adherend with the undulating surface on the electrode surface side of the high-frequency induction heating device, and when disposing the adhesive on the surface opposite to the electrode surface side for bonding, place it on the high-frequency induction heating device There will be a space between the electrode surface and the undulating surface of the attached body. Then, when a high-frequency electric field is applied to the adhesive, it is difficult for the adhesive disposed at the position corresponding to the space to conduct high-frequency energy, and it is difficult for the adhesive disposed at the undulating surface corresponding to the contact with the attached body and the high For the adhesive at the position of the electrode part of the frequency induction heating device, it is easy to conduct high frequency energy selectively. For this reason, the application of the high-frequency electric field to the adhesive becomes uneven, and it is difficult to firmly bond the adherend and the adhesive in a short time. In the bonding technology disclosed in Document 1, in order to bury the space created when the undulating surface of the adherend having the undulating surface is placed on the electrode surface side of the high-frequency induction heating device, a material shaped corresponding to the adherend having the undulating surface is used in advance. The crimping plate in the shape of the undulating surface of the attachment is used to join a plurality of attachments. However, in the joining technique disclosed in Document 1, it is troublesome to prepare a pressure-bonding plate molded for each shape of the undulating surface. In this way, there is more room for improvement in the technique of arranging the adherend with the undulating surface on the electrode surface side of the high-frequency induction heating device and bonding it through high-frequency induction heating treatment.

本發明之目的係提供將具備起伏面之被附著體，配置於高頻感應加熱裝置之電極面側，經由高頻感應加熱處理加以接合之技術中，即使不預先準備對應起伏面之形狀而成形之壓接模具(壓接板)，亦可將該被附著體在短時間強固接合之接合方法。 [1]使用高頻感應加熱用黏著劑，接合被附著體之接合方法中，具有配置感應加熱裝置之電極、前述被附著體及間隔件之配置工程、和於前述高頻感應加熱用黏著劑，施加高頻電場，接合前述被附著體之高頻電場施加工程；前述被附著體係具備具有起伏面之第1面；前述高頻感應加熱用黏著劑係包含熱可塑性樹脂；前述配置工程中，配置前述被附著體及前述間隔件時，於前述被附著體之前述第1面、和對向於該第1面之前述間隔件之面之間，形成空間部，前述空間部係經由前述間隔件之變形加以埋沒的接合方法。 [2]前述空間部係對於前述被附著體及前述間隔件，以前述電極加壓之時，經由前述間隔件之變形加以埋沒之記載於[1]之接合方法。 [3]前述高頻電場施加工程中，將前述被附著體與前述高頻感應加熱用黏著劑，邊以前述電極加壓，邊施加高頻電場，接合前述被附著體之記載於[1]或[2]之接合方法。 [4]前述配置工程中，各別配置前述高頻感應加熱用黏著劑，和前述被附著體之記載於[1]至[3]之任一項之接合方法。 [5]前述配置工程中，前述被附著體之前述第1面則朝向與前述高頻感應加熱用黏著劑相反側加以配置之記載於[1]至[4]之任一項之接合方法。 [6]前述配置工程中，配置2個以上之被附著體，至少1個之被附著體係具備前述第1面之前述被附著體之記載於[1]至[5]之任一項之接合方法。 [7]前述被附著體之前述起伏面中，前述起伏面之起伏之最大高低差為1mm以上之記載於[1]至[6]之任一項之接合方法。 [8]前述被附著體之前述第1面之起伏則具備凹部與凸部，令前述被附著體之前述第1面以平面視之時，佔據於前述第1面之前述凹部之面積比例為20%以上，不足100%之記載於[1]至[7]之任一項之接合方法。 [9]前述間隔件之厚度係對於備於前述被附著體之前述第1面之前述起伏面之前述起伏之最大高低差而言。為50%以上之記載於[1]至[8]之任一項之接合方法。 [10]前述間隔件之介電特性(tanδ/ε’r)為0.003以下之記載於[1]至[9]之任一項之接合方法。 (tanδ係23℃且頻率40.68MHz之損耗正切、ε’r係23℃且頻率40.68MHz之相對電容率)。 [11]前述間隔件係絕緣體之記載於[1]至[10]之任一項之接合方法。 [12]使下述數式1表示之前述間隔件之空間部追隨性FP成為50%以上，進行接合之記載於[1]至[11]之任一項之接合方法。 S1：令前述被附著體之前述空間部以平面視之時，在令前述間隔件追隨於前述被附著體前之狀態下，對應於前述被附著體之前述空間部之開口形狀之面積 S2：於前述空間部之內部之表面，附著著色劑，經由前述間隔件之變形，埋沒前述空間部之內部時，於埋沒前述空間部之部分之前述間隔件之表面，令前述著色劑所附著之以平面視之面積。 [13]前述高頻感應加熱用黏著劑係更包含經由高頻電場之施加而發熱之介電材料之記載於[1]至[12]之任一項之接合方法。 [14]前述介電材料係介電填料(B)，前述介電填料(B)係至少1種選自氧化鋅、碳化矽、氧化鈦及鈦酸鋇所成群之記載於[13]之接合方法。 [15]前述高頻感應加熱用黏著劑之介電特性(tanδ/ε’r)為0.005以上之記載於[1]至[14]之任一項之接合方法。 (tanδ係23℃且頻率40.68MHz之損耗正切、ε’r係23℃且頻率40.68MHz之相對電容率)。 根據本發明之一形態時，可提供將具備起伏面之被附著體，配置於高頻感應加熱裝置之電極面側，經由高頻感應加熱處理加以接合之技術中，即使不預先準備對應起伏面之形狀而成形之壓接模具，亦可將該被附著體在短時間強固接合之接合方法。 The object of the present invention is to provide a technique in which an adherend having a relief surface is arranged on the electrode surface side of a high-frequency induction heating device, and bonded by high-frequency induction heating treatment, even if the shape of the relief surface is not prepared in advance. The crimping die (crimping plate) can also be a bonding method that can firmly bond the attached body in a short time. [1] In the bonding method of bonding an adherend using an adhesive for high-frequency induction heating, the electrodes for arranging the induction heating device, the arrangement process of the aforementioned adherend and the spacer, and the adhesive for high-frequency induction heating are included , applying a high-frequency electric field to join the above-mentioned adhered body with a high-frequency electric field application process; the aforementioned adhered system has a first surface with an undulating surface; the aforementioned high-frequency induction heating adhesive contains a thermoplastic resin; in the aforementioned configuration process, When arranging the aforementioned attached body and the aforementioned spacer, a space is formed between the aforementioned first surface of the aforementioned attached body and the surface of the aforementioned spacer facing the first side, and the aforementioned space is passed through the aforementioned spacer. A joining method to bury the deformation of the parts. [2] The space portion is the bonding method described in [1], in which the adherend and the spacer are buried by deformation of the spacer when the electrodes are pressurized. [3] In the aforementioned high-frequency electric field application process, the aforementioned adherend and the aforementioned adhesive for high-frequency induction heating are pressed by the aforementioned electrode while applying a high-frequency electric field, and the aforementioned adherend is bonded as described in [1]. Or the joining method of [2]. [4] In the above arrangement process, the above adhesive for high-frequency induction heating and the bonding method described in any one of [1] to [3] of the above adherend are respectively arranged. [5] The bonding method described in any one of [1] to [4] in which the first surface of the adherend is placed facing the side opposite to the adhesive for high-frequency induction heating in the placement process. [6] In the above arrangement process, two or more attached objects are arranged, and at least one of the attached objects has the attachment described in any one of [1] to [5] of the aforementioned first surface. method. [7] The bonding method described in any one of [1] to [6] in which the maximum difference in height of the undulations of the undulated surface of the adherend is 1 mm or more. [8] The ups and downs of the aforementioned first surface of the aforementioned object to be attached are provided with concave portions and convex portions, so that when the aforementioned first surface of the aforementioned object to be attached is viewed in a plan view, the area ratio of the aforementioned concave portions occupying the aforementioned first surface is: More than 20% but less than 100% of the bonding method described in any one of [1] to [7]. [9] The thickness of the spacer refers to the maximum height difference of the undulation of the undulation surface prepared on the first surface of the attachment. It is more than 50% of the bonding method described in any one of [1] to [8]. [10] The bonding method described in any one of [1] to [9] in which the dielectric properties (tanδ/ε'r) of the spacer is 0.003 or less. (tanδ is the loss tangent at 23°C and frequency 40.68MHz, ε'r is the relative permittivity at 23°C and frequency 40.68MHz). [11] The above-mentioned spacer-insulator bonding method described in any one of [1] to [10]. [12] The bonding method described in any one of [1] to [11], wherein the spacer followability FP of the spacer expressed by the following formula 1 is 50% or more. S1: When the aforementioned space portion of the aforementioned attached body is viewed in a plan view, the area S2 corresponding to the opening shape of the aforementioned space portion of the aforementioned attached body in the state where the aforementioned spacer follows the front of the aforementioned attached body: When the coloring agent is attached to the surface inside the space portion and the spacer is deformed to bury the inside of the space portion, the coloring agent is attached to the surface of the spacer part buried in the space portion. The area viewed from the plane. [13] The adhesive for high-frequency induction heating described in any one of [1] to [12] that further includes a dielectric material that generates heat by application of a high-frequency electric field. [14] The aforementioned dielectric material is a dielectric filler (B), and the aforementioned dielectric filler (B) is at least one kind selected from the group consisting of zinc oxide, silicon carbide, titanium oxide, and barium titanate, as described in [13] Joining method. [15] The bonding method described in any one of [1] to [14], wherein the dielectric property (tanδ/ε'r) of the adhesive for high-frequency induction heating is 0.005 or more. (tanδ is the loss tangent at 23°C and frequency 40.68MHz, ε'r is the relative permittivity at 23°C and frequency 40.68MHz). According to one aspect of the present invention, it is possible to provide a technique in which an adherend having an undulating surface is placed on the electrode surface side of a high-frequency induction heating device, and bonded by high-frequency induction heating treatment, even if the corresponding undulating surface is not prepared in advance. The crimping mold formed according to the shape can also be a bonding method that can firmly bond the attached body in a short time.

[接合方法] 關於本實施形態之接合方法係使用高頻感應加熱用黏著劑，接合被附著體之接合方法中，具有配置感應加熱裝置之電極、被附著體及間隔件之配置工程、和於高頻感應加熱用黏著劑，施加高頻電場，接合被附著體之高頻電場施加工程。被附著體係具備具有起伏面之第1面，高頻感應加熱用黏著劑係包含熱可塑性樹脂。於配置工程中，配置前述被附著體及前述間隔件時，於被附著體之第1面、和對向於該第1面之前述間隔件之面之間，形成空間部，空間部係經由間隔件之變形加以埋沒。然而，本說明書中，有將感應加熱裝置稱為高頻感應加熱裝置之情形。 使用於關於本實施形態之接合方法之被附著體係具備具有起伏面之第1面，和第1面之相反側之面之第2面。第2面係可不具有起伏面。被附著體之起伏面係具備隆起之部分和陷落之部分，陷落之部位係可存在1處，亦可存在複數處所。隆起之部分並同樣地，可存在1處，亦可存在複數處所。陷落之部位存在複數處所時，陷落之部位之深度可為幾乎一樣，亦可為不相同者。隆起之部位存在複數處所時，隆起之部位之高度可為幾乎一樣，亦可為不相同者。隆起之部分及陷落之部分各別存在複數處所之時，隆起之部位及陷落之部位係可各別分散，亦可為密集者。又，令起伏面以剖面視之時，陷落之部分係可存在1處凹陷成圓弧狀之形狀，亦可存在複數處所。隆起之部分係可存在1處凸出成圓弧狀之形狀，亦可存在複數處所。以下，令具備具有起伏面之第1面之被附著體，在方便上有稱為被附著體(X)之情形。 關於本實施形態之接合方法之一形態中，配置工程中，首先將被附著體(X)之第1面側，朝向感應加熱裝置之電極側，於電極與被附著體(X)之間，配置間隔件。於間隔件之配置中，於被附著體(X)之第1面、和對向於該第1面之間隔件之面之間，形成空間部。空間部之形狀係對應於被附著體(X)之起伏面與間隔件之間所形成之空間之形狀的形狀。然後，經由變形間隔件，對應於空間部之形狀，埋沒空間部之至少一部分。此時，高頻感應加熱用黏著劑係配置於被附著體(X)之第2面側。接著，於高頻電場施加工程中，在經由間隔件之變形埋沒空間部之狀態下，對於高頻感應加熱用黏著劑而言，施加高頻電場，接合高頻感應加熱用黏著劑與被附著體(X)。 關於本實施形態之接合方法中，經由間隔件之變形，埋沒空間部之故，省去預先準備對應於起伏面之形狀而成形之壓接模具的麻煩。然後，在關於本實施形態之接合方法中，在經由間隔件之變形埋沒空間部之狀態下，進行感應加熱處理之故，高頻感應加熱處理之能量則對於高頻感應加熱用黏著劑易於以接近均勻之狀態加以傳達。由此，可將被附著體(X)與高頻感應加熱用黏著劑，在短時間加以強固接合。 於關於本實施形態之接合方法中，可接合具備具有起伏面之第1面之至少1個之被附著體時，被附著體之數量則不特別加以限定，間隔件之數量亦不限定。此時，關於本實施形態之接合方法中，可將被附著體(X)與高頻感應加熱用黏著劑，在短時間加以強固接合之故，可隔著高頻感應加熱用黏著劑，將被附著體彼此在短時間加以強固接合。 關於本實施形態之一形態之接合方法係包含配置感應加熱裝置之電極、被附著體及間隔件之配置工程(工程P1)及於高頻感應加熱用黏著劑，施加高頻電場，接合被附著體之高頻電場施加工程(工程P2)。 以下，對於關於本實施形態之接合方法之各工程，加以說明。 ・工程P1 工程P1係配置感應加熱裝置之電極、和被附著體(X)、和間隔件之配置工程。工程P1中，對向被附著體(X)之第1面與間隔件而加以配置，於被附著體(X)之第1面與對向該第1面之間隔件之面之間，形成空間部。空間部係經由間隔件之變形加以埋沒。 工程P1中，配置電極、和被附著體(X)、和間隔件之順序則未特別加以限制。例如，配置電極之後，配置被附著體(X)及間隔件之亦可，配置被附著體(X)及間隔件之後，配置電極亦可。又，配置被附著體(X)及間隔件之順序不特別加以限定，先配置被附著體(X)及間隔件之任一方亦可，各別同時配置亦可。 工程P1中，形成於被附著體(X)之第1面、和對向於該第1面之間隔件之面之間之空間部，則經由間隔件之變形加以埋沒。空間部經由間隔件之變形物埋沒之順序則不特別加以限定，配置被附著體(X)及間隔件之後，埋入空間部亦可。例如，於感應加熱裝置之電極，配置間隔件及被附著體(X)之後，經由間隔件，被附著體(X)之空間部成為埋沒之狀態亦可。具體而言，空間部係對於被附著體(X)及間隔件，以感應加熱裝置之電極加壓之時，經由間隔件之變形加以埋沒亦可。 又，工程P1中，經由間隔件之變形埋空間部之後，配置被附著體(X)及間隔件亦可。例如，於感應加熱裝置之電極，配置間隔件及被附著體(X)之前，預先經由間隔件，被附著體(X)之空間部成為埋沒之狀態之後，將間隔件及被附著體(X)配置於感應加熱裝置之電極亦可。具體而言，做為間隔件，經由變形黏土，油灰等，埋入空間部之後，將被附著體(X)及間隔件，配置於感應加熱裝置之電極亦可。 然而，只要配置間隔件時，於被附著體(X)及間隔件之間，形成空間部，經由間隔件之變形，埋沒空間部之時，間隔件係對於被附著體(X)之起伏面之整面而言，不加以配置亦可。例如，配置於被附著體(X)之起伏面與電極之間之間隔件係配置於被附著體(X)之起伏面之陷落部分與電極之間，不配置於被附著體(X)之起伏面之隆起之部分與電極之間亦可。 工程P1中，被附著體之數量係未特別加以限定，可配置2個以上之被附著體。配置2個以上之被附著體時，至少1個之被附著體係被附著體(X)。例如將2個被附著體(X)，經由高頻感應加熱用黏著劑加以接合之時，於兩者之被附著體(X)之第2面之間，配置高頻感應加熱用黏著劑，於電極與兩者之被附著體(X)之第1面之間，配置間隔件加以接合亦可。又，例如將附著體(X)，和第1面及第2面皆不具有起伏面之被附著體，經由高頻感應加熱用黏著劑加以接合之時，於2個不具被附著體之起伏面之面間，配置高頻感應加熱用黏著劑，於電極與被附著體(X)之第1面之間，配置間隔件加以接合亦可。更且，接合包含至少1個之附著體(X)，3個以上之被附著體之時，於不具各被附著體之起伏面之面間，配置高頻感應加熱用黏著劑，交互配置被附著體和高頻感應加熱用黏著劑加以接合亦可。 工程P1中，各別配置高頻感應加熱用黏著劑，和被附著體(X)亦可。配置2個以上之被附著體之時，高頻感應加熱用黏著劑係可做為與不具有被附著體(X)之起伏面之第2面側一體化之高頻感應加熱用黏著劑加以配置。高頻感應加熱用黏著劑係可做為與於第1面及第2面之兩面不具有起伏面之被附著體一體化之高頻感應加熱用黏著劑加以配置。不論何者之時，被附著體(X)之第1面係朝向與高頻感應加熱用黏著劑相反側加以配置。即，於被附著體(X)之第1面之相反側之面，配置高頻感應加熱用黏著劑。 接合包含附著體(X)之2個以上之被附著體時，工程P1係可使接合被附著體彼此，將高頻感應加熱用黏著劑挾持在被附著體之不具有起伏面之面之間為佳。可使高頻感應加熱用黏著劑，於被附著體間之一部分加加以挾持，或於被附著體間之複數處所加以挾持，或於被附著體間之整面加以挾持即可。從提升被附著體彼此之黏著強度之觀點視之，在於被附著體彼此之接合面整體，挾持高頻感應加熱用黏著劑為佳。 又，做為在於被附著體間之一部分，挾持高頻感應加熱用黏著劑之一形態，可列舉沿著被附著體彼此之接合面之外周，將高頻感應加熱用黏著劑配置成框狀，在被附著體間之整面加以挾持之形態。如此，經由將高頻感應加熱用黏著劑配置成框狀，得被附著體彼此之接合強度的同時，相較在接合面整體，配置高頻感應加熱用黏著劑之時，構造體可被輕量化。 又，根據在於被附著體間之一部分，挾持高頻感應加熱用黏著劑之一形態時，可減少高頻感應加熱用黏著劑之量，使尺寸變小之故，相較在於接合面整體，配置高頻感應加熱用黏著劑，可縮短高頻感應加熱處理時間。 ・工程P2 工程P2係於工程P1中，配置各構件之後，於高頻感應加熱用黏著劑，施加高頻電場，接合被附著體(X)之工程。工程P2中，接合含被附著體(X)之2個以上之被附著體時，於工程P1中，在配置於被附著體間之高頻感應加熱用黏著劑，施加高頻電場，接合2個以上之被附著體之工程。施加之高頻電場之頻率係於一實施形態中，為3MHz以上、300MHz以下。例如經由使用感應加熱裝置，可將高頻電場施加於高頻感應加熱用黏著劑。前述工程P2中，將被附著體(X)與高頻感應加熱用黏著劑，邊在電極加壓，邊施加高頻電場，接合被附著體(X)亦可。 (高頻感應加熱條件) 高頻感應加熱條件係雖可適當變更，但以下之條件者為佳。 高頻電場之輸出為10W以上為佳，較佳為30W以上，更佳為50W以上，更甚者為80W以上。 高頻電場之輸出為50,000W以下為佳，較佳為20,000W以下，更佳為15,000W以下，更甚者為10,000W以下，更進一步1,000W以下為佳。 高頻電場之輸出為10W以上時，可防止於感應加熱處理時溫度難以上昇之不妥之故，易於得良好之接合強度。 高頻電場之輸出為50,000W以下時，可易於防止感應加熱處理之溫度控制困難之不妥。 高頻電場之施加時間係1秒以上為佳。 高頻電場之施加時間為300秒以下為佳，較佳為240秒以下，更佳為180秒以下，更甚者為120秒以下，更進一步90秒以下為佳，尤以50秒以下為佳。 高頻電場之施加時間為1秒以上之時，於感應加熱處理時，可防止溫度難以上昇之不妥之故，易於得良好之黏著力。 高頻電場之施加時間為300秒以下之時，可易於防止構造體之製造效率下降，製造成本變變高，更且被附著體(X)會熱劣化之不妥。 施加之高頻電場之頻率為1kHz以上為佳，較佳為1MHz以上，更佳為3MHz以上，更甚者為5MHz以上，更進一步為10MHz以上。 施加之高頻電場之頻率為300MHz以下為佳，較佳為100MHz以下，更佳為80MHz以下，更甚者為50MHz以下。具體而言，國際電信聯盟所分配之工業用頻率帶13.56MHz、27.12MHz、或40.68MHz係可利用於本實施形態之高頻感應加熱所成製造方法及接合方法。 又，邊加壓處理，邊施加高頻電場之時，施加高頻時之按壓壓力係做為負荷於高頻感應加熱用黏著劑之壓力之初期設定值，1kPa以上為佳，較佳為5kPa以上，更佳為10kPa以上，更甚者為30kPa以上，更進一步為50kPa以上為佳。 以下又，邊加壓處理，邊施加高頻電場之時，施加高頻時之按壓壓力係做為負荷於高頻感應加熱用黏著劑之壓力之初期設定值，10MPa以下為佳，較佳為5MPa以下，更佳為1MPa以下，更甚者為500kPa以下，更進一步為100kPa以下為佳。 在此，成為負荷於高頻感應加熱用黏著劑之壓力之初期設定值之基準之面積係令電極、被附著體、及間隔件以平面視之時之面積中，最小面積者。 對於關於本實施形態之接合方法，參照圖面加以說明。 圖1~圖3係說明關於本實施形態之接合方法之一例的概略圖。於圖1~圖3中，顯示使用感應加熱裝置50，將第1之被附著體110、和第2之被附著體120，經由高頻感應加熱用黏著劑11，加以接合之方法之一例。 圖1~圖3所示感應加熱裝置50係具備第1高頻電場施加電極51、和第2高頻電場施加電極52、和高頻電源53。 第1高頻電場施加電極51、和第2高頻電場施加電極52係相互對向配置。第1高頻電場施加電極51及第2高頻電場施加電極52係具有加壓機構。經由感應加熱裝置50之電極(第1高頻電場施加電極51及第2高頻電場施加電極52)之加壓機構，邊加壓配置於該電極之間之2個以上之被附著體與高頻感應加熱用黏著劑，邊施加高頻電場。 感應加熱裝置50係構成第1高頻電場施加電極51、和第2高頻電場施加電極52為相互平行之1對之平板電極之時，有令如此電極配置之形式稱之為平行平板型之情形。 於高頻電場之施加時，使用平行平板型之高頻感應加熱裝置為佳。平行平板型之高頻感應加熱裝置時，高頻電場貫通位於電極間之高頻感應加熱用黏著劑之故，可加熱高頻感應加熱用黏著劑整體，可使被附著體(X)與高頻感應加熱用黏著劑，在短時間加以接合。又，製造做為構造體之層積體時，使用平行平板型之高頻感應加熱裝置為佳。 於各別第1高頻電場施加電極51及第2高頻電場施加電極52，例如連接為施加頻率13.56MHz程度、頻率27.12MHz程度、或頻率40.68MHz程度之高頻電場之高頻電源53。 圖2係顯示配置感應加熱裝置50之電極(第1高頻電場施加電極51及第2高頻電場施加電極52)、第1之被附著體110、高頻感應加熱用黏著劑11、做為被附著體(X)之第2被附著體120，及間隔件210時之狀態。第1之被附著體110係於高頻感應加熱用黏著劑11側及第1高頻電場施加電極51側之兩面，不具有起伏面。第2之被附著體120係令起伏面備有在第1面125，與第1面125相反側之第2面127係不具有起伏面。如圖2所示，於第1高頻電場施加電極51及第2高頻電場施加電極52之一對之電極間，令間隔件210、第2之被附著體120、高頻感應加熱用黏著劑11、及第1被附著體110，從第2高頻電場施加電極52側，依順序加以配置。第2之被附著體120之第1面125係對向於間隔件210加以配置。 圖3係顯示配置感應加熱裝置50之電極、第1之被附著體110、高頻感應加熱用黏著劑11、第2被附著體120，及間隔件210後之狀態。於第2高頻電場施加電極52與第2之被附著體120之間，配置間隔件210時，於第2之被附著體120之起伏面與間隔件之間，形成空間部31。感應加熱裝置50係可從第1高頻電場施加電極51及第2高頻電場施加電極52之至少一方之方向加壓處理。圖3中，經由感應加熱裝置50，在第1高頻電場施加電極51及第2高頻電場施加電極52之間，對於第1之被附著體110、高頻感應加熱用黏著劑11、第2被附著體120，及間隔件210，向箭頭之方向加壓處理。 圖1係顯示配置感應加熱裝置50之電極、第1之被附著體110、高頻感應加熱用黏著劑11、第2被附著體120，及間隔件210後，經由感應加熱裝置50，伴隨加壓處理，進行感應加熱處理之狀態。經由感應加熱裝置50進行加壓處理時，間隔件210則變形，間隔件210則沿著空間部31之形狀而追隨。然後，空間部31係經由間隔件210加以埋沒。 感應加熱裝置50係如圖1~圖3所示，使用間隔件210，挾持於第1之被附著體110及第2被附著體120之間，隔著高頻感應加熱用黏著劑11，感應加熱處理。更且，感應加熱裝置50係除了感應加熱處理之外，經由第1高頻電場施加電極51及第2高頻電場施加電極52所成加壓處理，接合第1之被附著體110、第2被附著體120。第1之被附著體110，及第2之被附著體120之接合係經由感應加熱裝置50之電極，邊加壓邊施加高頻電場。又，第1之被附著體110，及第2之被附著體120之接合係經由感應加熱裝置50之電極，進行加壓，將空間部31經由間隔件210埋沒之後，施加高頻電場亦可。 在此，經由感應加熱裝置50之電極，邊進行加壓，邊施加高頻電場之狀態中，做為初期之狀態，成為經由加壓，與空間部31經由間隔件210埋沒之幾乎同時，施加高頻電場之狀態。加壓係例如指A.感應加熱裝置50之加壓機構所成加壓處理，或不進行B.感應加熱裝置50之加壓機構等所成加壓處理，僅經由感應加熱裝置50之電極之自重所成按壓加以加壓之加壓處理，或複合C.感應加熱裝置50之加壓機構等所成加壓處理、和感應加熱裝置50之電極之自重所成加壓處理之面者之加壓處理。對於第1之被附著體110，高頻感應加熱用黏著劑11、間隔件210及第2之被附著體120而言，做為經由感應加熱裝置50之電極，邊加壓邊施加高頻電場之狀態之一形態，例如可列舉以下之從(E1)至(E3)之形態。 (E1)：做為間隔件210，使用易於彈性變形之材質之間隔件，經由感應加熱裝置50之電極進行加壓，維持變形間隔件210之狀態下，施加高頻電場之形態。 (E2)：做為間隔件210，使用易於塑性變形之材質之間隔件，經由感應加熱裝置50之電極進行加壓，維持變形間隔件210之狀態下，施加高頻電場之形態。 (E3)：做為間隔件210，使用易於塑性變形之材質之間隔件，經由感應加熱裝置50之電極進行加壓，變形間隔件210之後，解除電極所成加壓狀態下，施加高頻電場之形態。 (E3)之形態中，解除加壓機構所成加壓處理，維持電極之自重所成按壓亦可。 從易於再利用間隔件之觀點視之，經由感應加熱裝置50之電極邊加壓，邊施加高頻電場之狀態之形態係上述之形態(E1)為佳。 經由如上述之接合方法，可得具備於第1面125具有起伏面之第2之被附著體120之構造體100。 然而，不進行感應加熱裝置50所成加壓處理，例如僅經由高頻感應加熱用黏著劑及被附著體之自重所成按壓，接合2個以上之被附著體亦可。此時，只要於感應加熱處理前，變形間隔件210，預先埋沒空間部31即可。例如，將可拆卸油灰等之材料做為間隔件210使用，變形間隔件210，預先埋沒空間部亦可。 於第1高頻電場施加電極51及第2高頻電場施加電極52，施加高頻電場時，高頻感應加熱用黏著劑11則吸收高頻能量。本實施形態中，即使將第2之被附著體120之第1面125配置於第2高頻電場施加電極52側，經由使用間隔件210，空間部31則經由間隔件210之變形而被埋沒。為此，高頻感應加熱用黏著劑11則在接近均勻之狀態下，吸收高頻能量。由此，高頻感應加熱用黏著劑11中之熱可塑性樹脂成分幾乎一樣地熔融，即使在短時間處理，亦可強固接合第1之被附著體110及第2之被附著體120。 然而，高頻感應加熱用黏著劑11含有介電材料(未圖示)之時，分散於做為黏著劑成分之熱可塑性樹脂成分中之介電材料則吸收高頻能量。然後，介電材料係做為發熱源而工作，經由介電材料之發熱，熔融熱可塑性樹脂成分，即使在短時間處理，最終而言，可強固接合第1之被附著體110及第2之被附著體120。 第1高頻電場施加電極51及第2高頻電場施加電極52係具有加壓機構之故，亦可做為加壓裝置工作。為此，經由對第1高頻電場施加電極51及第2高頻電場施加電極52所成壓縮方向之加壓，以及高頻感應加熱用黏著劑11之加熱熔融，可更強固接合第1之被附著體110、第2被附著體120。 以上，雖參照圖1~圖3，說明關於本實施形態之接合方法之一例，但關於本實施形態之實施形態係非限定於此例。做為其他之形態，只要使用至少1個被附著體(X)，被附著體之數量則不特別加以限定。例如，將2個被附著體，皆使用被附著體(X)亦可。圖1~圖3中，做為一方之被附著體，使用做為被附著體(X)之第2之被附著體120，做為另一方之被附著體，使用不具有起伏面之第1之被附著體110。 圖1~圖3所示例中，做為其他之形態，使用平行平板型之高頻感應加熱裝置，亦可2個被附著體，皆使用做為被附著體(X)之第2之被附著體120。此時，任一之第2之被附著體120，使第1面125，朝向感應加熱裝置50之各電極側(第1高頻電場施加電極51及第2高頻電場施加電極52)加以配置。然後，於感應加熱裝置之各電極與2個之第2之被附著體120間，各別配置間隔件210，將2個之第2之被附著體120以高頻感應加熱用黏著劑11加以接合。 高頻感應加熱處理係不限定於將上述所說明之電極對向配置之感應加熱裝置，使用格子電極型之高頻感應加熱裝置亦可。格子電極型之高頻感應加熱裝置係具有於每一定間隔，將第1極性之電極、和與第1極性之電極成為相反極性之第2極性之電極交互排列於同一平面上之格子電極。然而，於圖1~圖3中，為了簡略化，例示使用對向配置電極之感應加熱裝置之形態。使用格子電極型之感應加熱裝置時，亦可在短時間將被附著體(X)加以強固接合。 於高頻電場之施加時，使用格子電極型之高頻感應加熱裝置為佳。經由使用格子電極型之高頻感應加熱裝置，可不受被附著體(X)之厚度之影響加以接合。又，經由使用格子電極型之高頻感應加熱裝置，可實現接合時之省能源化。 經由格子電極型之感應加熱裝置加以接合時，於被附著體(X)之具有起伏面之第1面側、及與第1面相反側之第2面側之任一方，配置格子電極，施加高頻亦可。又，於被附著體(X)之第1面側、及第2面側之雙方，配置格子電極，施加高頻電場亦可。更且，配置於被附著體(X)之第1面側，施加高頻電場，之後，於第2面側，配置格子電極，施加高頻電場亦可。 以下，對於使用於關於本實施形態之接合方法之各構件，加以說明。 ＜被附著體＞ 使用於關於本實施形態之接合方法之被附著體(X)係於第1面，具有起伏面，起伏面係具有隆起部位之凸部、和陷落部位之凹部。本實施形態中，有將起伏面之相對性隆起之部位稱之為凸部，將經由起伏面之凸部，分割之相對性陷落之部位稱之為凹部之情形。 圖4A及圖4B係表示使用於關於本實施形態之接合方法之被附著體之一例的剖面圖。例如，圖4A所示被附著體120B係於第1面，具有起伏面，凸部121A、凸部121B、及凸部121C為起伏面之隆起部位，凹部123A、凹部123B、凹部123C及凹部123D為起伏面陷落之部位。凹部與凸部之剖面形狀係不限於圖4A及圖4B所示矩形，例如可從凸部之頂部T向凹部之底部L傾斜，亦可為彎曲，具有階差亦可。又，例如起伏面之隆起部位可為半圓狀之形狀。此時，半圓狀之部位成為凸部，該凸部之兩側之陷落部位成為凹部。更且，例如起伏面之陷落部位為半圓狀之時，半圓狀之部位成為凹部，陷落成半圓狀之兩側之隆起部位則成為凸部。 被附著體(X)中，起伏面之起伏之最大高低差係1mm以上為佳，較佳為2mm以上，更佳為3mm以上，更甚者為4mm以上。起伏面之起伏之最大高低差為1mm以上時，易於使用間隔件，提高被附著體(X)與高頻感應加熱用黏著劑，在短時間加以強固接合之效果。 被附著體之起伏面之起伏之高低差之上限值係只要使用間隔件，可將被附著體(X)與高頻感應加熱用黏著劑，在短時間加以強固接合，則不特別加以限定。被附著體之起伏面之起伏之最大高低差係例如40mm以下為佳，亦可為20mm以下，更甚者亦可為10mm以下。 起伏面之起伏之最大高低差係具有起伏面之凸部之數量為1個之時，表示從凸部之頂部至凹部之底部之高低差之最大值。凸部之頂部係凸部之最高部位，凹部之底部係凹部之最低部位。然而，例如起伏面之隆起之部位或陷落之部位為1個半圓狀之時，起伏之高低差係成為半圓狀之半徑。 起伏面之起伏之最大高低差係具有起伏面之凸部之數量為2個以上之時，表示凸部與凹部之高低差之最大值。例如，參照圖4A時，凹部123A、凹部123B、凹部123C、及凹部123D係各別從凸部121C之頂部T至凹部123D之底部L之距離為相同的。因此，圖4A所示起伏之最大高低差係例如以從鄰接之凸部121C之頂部T至凹部123D之底部L之最大高低差D加以表示。 另一方面，例如參照圖4B時，被附著體120D係凸部122A、凸部122B、凸部122C、及凸部122D之高度係各為不同，凸部122B則最為突出。又，被附著體120D係凹部124A、凹部124B、凹部124C、及凹部124D之深度係各為不同，凹部124D則最為陷落。因此，圖4B所示起伏之最大高低差係以最為突出之凸部122B之頂部T至最為陷落之凹部124D之底部L之最大高低差D加以表示。 於被附著體(X)中，令被附著體(X)之第1面以平面視之時，佔據在第1面之凹部之面積比例為20%以上為佳，較佳為30%以上，更佳為40%以上，更甚者為50%以上，更進一步為60%以上為佳。 佔據在第1面之凹部之面積比例之上限值係未特別加以限定，例如可為90%以下。 佔據在第1面之凹部之面積比例為20%以上時，易於提高使用間隔件所成之效果，可將被附著體(X)在短時間強固加以接合。 關於本實施形態之接合方法中，被附著體(X)之材質係未特別加以限定。被附著體之材質係可為有機材料、及無機材料(包含金屬材料等。)之任一之材料，亦可為有機材料與無機材料之複合材料。 被附著體(X)之材質係有機材料為佳。做為被附著體之材質之有機材料係例如可列舉塑膠材料，及橡膠材料等。做為塑膠材料，可列舉例如、聚丙烯樹脂、聚乙烯樹脂、乙烯-乙酸乙烯酯共聚物、環氧樹脂、聚胺甲酸酯樹脂、丙烯腈-丁二烯-苯乙烯共聚物樹脂(ABS樹脂)、未氫化苯乙烯-共軛二烯共聚物(苯乙烯-丁二烯-苯乙烯共聚物)(SBS)、苯乙烯-丁二烯/丁烯-苯乙烯共聚物、苯乙烯-異戊二烯共聚物、苯乙烯-異戊二烯-苯乙烯共聚物(SIS)、苯乙烯-乙烯/異戊二烯-苯乙烯共聚物等)、氫化苯乙烯-共軛二烯共聚物(苯乙烯-乙烯/丙烯-苯乙烯共聚物)(SEPS)、及苯乙烯-乙烯/丁烯-苯乙烯共聚物(SEBS)等)、聚碳酸酯樹脂(PC樹脂)、聚醯胺樹脂(耐龍6及耐龍66等)、聚酯(聚對苯二甲酸乙二醇酯樹脂(PET樹脂)及聚對苯二甲酸丁二酯樹脂(PBT樹脂)等)、聚甲醛樹脂(POM樹脂)、聚甲基丙烯酸甲酯樹脂、及聚苯乙烯樹脂等。做為橡膠材料，可列舉苯乙烯-丁二烯橡膠(SBR)、乙烯丙烯橡膠(EPR)、丁二烯橡膠(BR)、及聚矽氧橡膠等。又，被附著體(X)係有機材料之發泡材亦可。被附著體之材質為熱可塑性樹脂之時，從黏著性之觀點視之，含有被附著體(X)之熱可塑性樹脂之主要組成係與含有高頻感應加熱用黏著劑之熱可塑性樹脂(A)之主要組成相同為佳。 本說明書中，「熱可塑性樹脂之主要組成」係例如熱可塑性樹脂為聚合物之時，該聚合物所含重覆單位之內，該聚合物中含最多之重覆單位者。熱可塑性樹脂為來自單獨之單體之聚合物之時，該單體單位(重覆單位)為「熱可塑性樹脂之主要組成」。熱可塑性樹脂為共聚物之時，該聚合物中含最多之重覆單位為「熱可塑性樹脂之主要之組成」。熱可塑性樹脂為共聚物之時，該共聚合物中，「熱可塑性樹脂之主要組成」係含30質量%以上之重覆單位(單體單位)，於一形態中，含超過30質量%之重覆單位，另一形態中，含40質量%以上之重覆單位，更為其他之一形態中，含50質量%以上之重覆單位。又，熱可塑性樹脂為共聚物之時，含最多之重覆單位可為2種以上。 做為被附著體(X)之材質之無機材料係可列舉玻璃材料、水泥材料、陶瓷材料，及金屬材料等。又，被附著體(X)係可為纖維與上述之塑膠材料之複合材料之纖維強化樹脂(Fiber Reinforced Plastics,FRP)。此纖維強化樹脂之塑膠材料係選自至少一種例如、聚丙烯樹脂、聚乙烯樹脂、聚胺甲酸酯樹脂、丙烯腈-丁二烯-苯乙烯共聚物樹脂(ABS樹脂)、聚碳酸酯樹脂(PC樹脂)、聚醯胺樹脂(耐龍6及耐龍66等)、聚酯(聚對苯二甲酸乙二醇酯樹脂(PET樹脂)及聚對苯二甲酸丁二酯樹脂(PBT樹脂)等)、聚甲醛樹脂(POM樹脂)、聚甲基丙烯酸甲酯樹脂、環氧樹脂、及聚苯乙烯樹脂等所成群。纖維強化樹脂之纖維係例如可列舉玻璃纖維、克維拉纖維及碳纖維等。 被附著體(X)係導電性低為佳。 關於本實施形態之接合方法中，使用高頻感應加熱用黏著劑，接合2個以上之複數之被附著體彼此時，複數之被附著體中之至少1個之被附著體係使用被附著體(X)。複數之被附著體之材質係互為相同之材質，或互為不同之材質。 被附著體之形狀雖未特別加以限定，關於本實施形態之高頻感應加熱用黏著劑為黏著薄片時，被附著體係具有可貼合黏著薄片之面者為佳，薄片狀、板狀、或塊狀為佳。接合複數之被附著體彼此之時，此等被附著體之形狀及尺寸可為互為相同，亦可為不同者。 ＜間隔件＞ 使用於關於本實施形態之接合方法之間隔件之材質係可變形者，只要可埋入經由被附著體(X)之第1面與緩衝材所形成之空間部，則不特別加以限定。間隔件之材質係例如橡膠、黏土、油灰等。做為橡膠，未特別加以限定，例如可列舉各種之橡膠。間隔件之材質為橡膠之時，橡膠中，經由高頻電場之施加，難以產生發熱之故，從難以產生熱劣化，難以產生與被附著體之熔接之觀點視之，以聚矽氧橡膠為佳。做為黏土，只要是一般所知之黏土即可，例如可列舉含聚矽氧樹脂之聚矽氧黏土等。做為油灰，可列舉不活性化學合成樹脂等。 (厚度) 間隔件之厚度係對於被附著體(X)之第1面所備有之起伏面之起伏之最大高低差而言，50%以上為佳，較佳為75%以上，更佳為100%以上，更甚者為125%以上，更進一步為150%以上，尤以175%以上為佳。間隔件之厚度係被附著體所具有之起伏面之最大高低差之50%以上時，則易於埋入起伏面之凹部。 間隔件之厚度之上限值係只要可埋入空間部，可將具有起伏面之被附著體在短時間加以強固接合時，則不特別加以限定，例如對於被附著體(X)之第1面所備有之起伏面之起伏之最大高低差而言，可為500%以下，亦可為400%以下，更可為300%以下。 間隔件之厚度係表示間隔件之對向於電極側之面、及對向於被附著體(X)之面之間之距離。例如，參照圖2時，間隔件210之厚度Z係表示間隔件210之對向於第2高頻電場施加電極52之面與對向於間隔件210之被附著體(X)之第1面125之面之距離。 (介電特性) 間隔件之介電特性(tanδ/ε’r)係0.003以下為佳，較佳為0.002以下，更佳為0.0010以下。使用於關於本實施形態之接合方法之間隔件之介電特性係通常為0以上。 (tanδ係23℃且頻率40.68MHz之損耗正切、ε’r係23℃且頻率40.68MHz之相對電容率)。 間隔件之介電特性愈小(愈接近0)，在感應加熱處理時，間隔件更難以發熱之故，更可抑制間隔件之非刻意之變形(非為埋入空間部之變形)及熔融。為此，間隔件之介電特性為0.003以下時，在感應加熱處理時，間隔件難以產生發熱，可易於將具有起伏面之被附著體與黏著劑在短時間加以強固接合。 介電特性(tanδ/ε’r)係將使用阻抗材料裝置等測定之損耗正切(tanδ)，除上使用阻抗材料裝置測定之相對電容率(ε’r)之值者。 做為間隔件之介電特性之損耗正切(tanδ)、及相對電容率(ε’r)係使用阻抗材料分析儀，可簡便且正確加以測定。 然而，間隔件之測定方法之詳細係如下所述。首先，得間隔件之測定用試驗片。間隔件之厚度為厚之時，經由切削、研磨等，調整厚度亦可。測定用薄片之厚度係例如10μm以上，2mm以下。對於如此所得之薄片，使用RF阻抗材料分析儀E4991A(Agilent公司製)，在23℃之頻率40.68MHz之條件下，各別測定相對電容率(ε’r)、及損耗正切(tanδ)，算出介電特性(tanδ/ε’r)之值。 (絕緣特性) 間隔件係絕緣體為佳。間隔件為絕緣體時，在感應加熱處理之時，隔著間隔件不會有電之流動，在高頻感應加熱用黏著劑以接近均勻之狀態，施以感應加熱處理之故，易於將被附著體(X)與高頻感應加熱用黏著劑在短時間加以強固接合。 於本實施形態中，間隔件之絕緣性係依據JIS K 6911：1995，令測定電壓為500V，測定體積電阻率。測定開始1分後之體積電阻率超過10 8Ω・cm之時，間隔件係定義為絕緣體。 (空間部追隨性) 開於本實施形態之接合方法中，間隔件之空間部追隨性成為50%以上加以接合為佳、較佳成為60%以上加以接合，更佳為成為70%以上加以接合，更甚者為成為80%以上加以接合。尤其，間隔件之空間部追隨性愈大，對於空間部而言，間隔件則更易於埋沒。例如間隔件之空間部追隨性為50%以上時，高頻感應加熱用黏著劑可在接近均勻之狀態吸收高頻高頻之故，更易於將被附著體(X)與高頻感應加熱用黏著劑在短時間加以強固接合。 間隔件之空間部追隨性之上限則未特別加以限定。間隔件之空間部追隨性之上限可為100%以下。 間隔件之空間部追隨性FP係以下數式1加以表示。 S1：令空間部(經由被附著體(X)之第1面與間隔件所形成之空間部)以平面視之時，在令間隔件追隨於被附著體(X)前之狀態下，對應於被附著體(X)之空間部之開口形狀之面積。 S2：於空間部之內部之表面，附著著色劑，經由間隔件之變形，埋沒空間部之內部時，於埋沒空間部之部分之間隔件之表面，令著色劑所附著之以平面視之面積 在此，對於間隔件之空間部追隨性，參照圖面加以說明。圖5A~圖7B係說明空間部追隨性之測定方法的概念圖。圖5A~圖7B所示被附著體120C係做為被附著體(X)之被附著體。圖5A、圖6A、圖5B、及圖6B係表示將被附著體120C之具有起伏面側之第1面，朝向間隔件210A加以配置之狀態。圖5A及圖6A係加壓前之狀態，圖5A係表示從被附著體120C之第2面側所視平面圖，圖6A係表示圖5A之A-A剖面圖。圖5B及圖6B係加壓後之狀態，圖5B係表示從被附著體120C之第2面側所視平面圖，圖6B係表示圖5B之B-B剖面圖。然而，圖5A及圖5B所示虛線係表示備於將被附著體120C之第1面側之凹部之位置，和塗佈於凹部之內部之著色劑V與間隔件210A之位置。又，如圖6A及圖6B所示，於圖5A及圖5B中，於形成空間部31A之凹部之底部側(即，以虛線包圍之內側之部分)，附著有著色劑V。於圖5A及圖5B中，為表示被附著體120C之位置，和間隔件210A之位置之位置關係，在方便上，省略塗佈於凹部之底部側之著色劑V之圖示。 如圖5A~圖6B所示，被附著體120C係具有配置於間隔件210A側之第1面。被附著體120C之第1面係具備具有凹部與凸部之起伏面。被附著體120C之凹部係具有令被附著體120C之第1面以平面所視時之矩形之開口、和從被附著體120C之側面以剖面所視時之矩形之剖面。即，被附著體120C之第1面係具備在矩形之平面與矩形之剖面所包圍之凹部之形狀。如圖6A所示，重置配置被附著體120C之第1面、和間隔件210A時，在不加壓之狀態時，在被附著體120C之凹部與間隔件210A之間，形成空間部31A。空間部31A係以間隔件210A與被附著體120C之凹部加以分割。 空間部追隨性FP係如下加以測定。首先，於形成空間部31A之凹部之內部之整面，預先塗佈著色劑V加以附著。著色劑V之種類則不特別加以限定。著色劑V係在抑制被附著體120C、及對於間隔件210A之著色劑V之彈剝，提高著色劑V之附著性之觀點，例如使用印章用之紅色印泥墨水為佳。 接著，朝向被附著體120C之第1面，置配置間隔件210A。然後，對於間隔件210A，朝向被附著體120C施加壓力。對於間隔件210A，朝向被附著體120C施加壓力時，施加壓力之間隔件210A則變形，間隔件210A之一部分則埋入空間部31A之內部。對於間隔件210A施加之壓力係未特別加以限定，只要被附著體之空間部追隨性成為50%以上之壓力即可。做為該壓力之一例，可列舉將被附著體(X)與高頻感應加熱用黏著劑，邊在電極加壓，邊施加高頻電場時之壓力。間隔件210之一部分埋入空間部內之部分之表面中，附著附著於空間部之內部之表面之著色劑V。 圖7A係表示從被附著體120C之第1面(即空間部側)側所視平面圖。圖7A所示被附著體120C係將間隔件210A之一部分，追隨於被附著體120C之空間部之前之狀態，且於凹部之內部之整面，塗佈著色劑V前之狀態。圖7B係表示於凹部之內部之整面，塗佈著色劑V，將間隔件210A追隨於被附著體120C之後，由附著從空間部31A取出間隔件210A之著色劑V之面所視平面圖。 圖7A所示面積S1A及面積S1B係各別對應於被附著體120C之空間部31A之開口RO之形狀之面積之一部分。圖7B所示面積S2A及面積S2B係各別將附著於空間部31A之內部之表面之著色劑V，附著於間隔件210A之表面之面積之一部分。具體而言係如以下所述。首先，於空間部31A之內部之表面，附著著色劑V，經由間隔件210A之變形，埋沒空間部31A之內部時，於埋沒空間部31A之部分之間隔件210A之表面，附著著色劑V。接著，解除為變形間隔件210A之壓力，分離被附著體120C與間隔件210A。之後，於間隔件210A之表面，平面視附著著色劑V之部分。該平面所視時之面積之一部分為面積S2A及面積S2B。面積S2A及面積S2B係各別如圖7B所示，相當於附著著色劑V之略交錯狀形狀之部分。 然後，空間部追隨性FP係根據前述之數式1，以令面積S2A及面積S2B之合計之面積(S2)，除以面積S1A及面積S1B之合計之面積(S1)之百分率加以表示。 ＜高頻感應加熱用黏著劑＞ 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係包含熱可塑性樹脂(A)。高頻感應加熱用黏著劑係包含熱可塑性樹脂(A)之同時，可更包含介電材料，不包含介電材料亦可。從易於提高高頻感應加熱用黏著劑之發熱性之觀點視之，高頻感應加熱用黏著劑係包含介電材料為佳。介電材料係未特別加以限定，介電樹脂、及介電填料之任一者皆可。介電材料係從成形時所造成之劣化為少，得安定之發熱性之觀點視之，例如為介電填料(B)為佳。 本說明書中中，含有使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之熱可塑性樹脂係有標記為熱可塑性樹脂(A)，介電填料標記為介電填料(B)之情形。 (熱可塑性樹脂(A)) 熱可塑性樹脂(A)之種類則未特別加以限制。 熱可塑性樹脂(A)係例如從易於融解之同時，具有特定之耐熱性等之觀點視之，至少一種選自聚烯烴系樹脂、苯乙烯系樹脂、聚甲醛系樹脂、聚碳酸酯系樹脂、丙烯酸系樹脂、聚醯胺系樹脂、聚醯亞胺系樹脂、聚乙酸乙烯酯系樹脂、苯氧基系樹脂、及聚酯系樹脂所成群為佳。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑中，熱可塑性樹脂(A)係聚烯烴系樹脂或苯乙烯系樹脂為佳，較佳為聚烯烴系樹脂。熱可塑性樹脂(A)係聚烯烴系樹脂或苯乙烯系樹脂之時，於高頻電場之施加時，高頻感應加熱用黏著劑易於熔融，容易黏著使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑與被附著體(X)。 於本說明書中，聚烯烴系樹脂係包含具有極性部位之聚烯烴系樹脂及不具有極性部位之聚烯烴系樹脂，特定極性部合之有無時，記載成具有極性部分之聚烯烴系樹脂或不具有極性部位之聚烯烴系樹脂。 熱可塑性樹脂(A)係具有極性部位之聚烯烴系樹脂為佳。熱可塑性樹脂(A)係可為不具有極性部位之聚烯烴系樹脂。 [聚烯烴系樹脂] 做為熱可塑性樹脂(A)之聚烯烴系樹脂係例如可列舉聚乙烯、聚丙烯、聚丁烯、及聚甲基戊烯等之均聚體所成樹脂、以及選自乙烯、丙烯、丁烯、己烯、辛烯、及4-甲基戊烯等所成群之單體之共聚物所成α-烯烴樹脂。做為熱可塑性樹脂(A)之聚烯烴系樹脂係可為一種單獨之樹脂，亦可為二種以上之樹脂之組合。 [具有極性部位之聚烯烴系樹脂] 具有極性部位之聚烯烴系樹脂之極性部位係對於聚烯烴系樹脂而言，只要是可賦予極性之部位，則不特別加以限定。 又，高頻感應加熱用黏著劑係做為熱可塑性樹脂(A)含有具有極性部位之聚烯烴系樹脂，介電特性易於提高，對於被附著體(X)之黏著力亦提高之故為佳。 具有極性部位之聚烯烴系熱可塑性樹脂係可為烯烴系單體與具有極性部位之單體之共聚物。又，具有極性部位之聚烯烴系熱可塑性樹脂係可為於經由烯烴系單體之聚合所得烯烴系聚合物，經由附加反應等之改性極性部位，加以導入的樹脂。 對於構成具有極性部位之聚烯烴系樹脂之烯烴系單體之種類，未特別加以限制。做為烯烴系單體，可列舉例如乙烯、丙烯、丁烯、己烯、辛烯及4-甲基-1-戊烯等。烯烴系單體係可以此等之一種單獨加以使用，以二種類以上組合使用亦可。 烯烴系單體係從在機械性強度優異，得安定之黏著特性之觀點視之，乙烯或丙烯之至少任一者為佳。 具有極性部位之聚烯烴系樹脂之來自烯烴之烯烴單位係來自於乙烯或丙烯之構成單位為佳。 做為極性部位，例如列舉羥基、羧基、乙酸乙烯酯構造，及酸酐構造等。做為極性部位，可列舉經由酸改性，導入至聚烯烴系樹脂之酸改性構造等。 做為極性部位之酸改性構造，係經由酸改性熱可塑性樹脂(例如聚烯烴系樹脂)導入之部位。做為酸改性熱可塑性樹脂(例如、聚烯烴系樹脂)時所使用之化合物，係可列舉從不飽和羧酸、不飽和羧酸之酸酐、及不飽和羧酸之酯之任一者引導之不飽和羧酸衍生物成分。於本說明書中，有將具有酸改性構造之聚烯烴系樹脂，稱之為酸改性聚烯烴系樹脂之情形。 做為不飽和羧酸，例如列舉丙烯酸、甲基丙烯酸、馬來酸、富馬酸、衣康酸及檸康酸等。 做為不飽和羧酸之酸酐，例如列舉無水馬來酸、無水衣康酸及無水檸康酸等之不飽和檸康酸之酸酐等。 做為不飽和羧酸之酯係可列舉例如、丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丁酯、馬來酸二甲酯、馬來酸單甲酯、富馬酸二甲酯、富馬酸二乙酯、衣康酸二甲酯、衣康酸二乙酯、檸康酸二甲酯、檸康酸二乙酯、及甲基四氫鄰苯二甲酸酐二甲酯等之不飽和羧酸之酯等。 (介電填料(B)) 對於做為介電材料較佳之材料之介電填料(B)加以說明。 介電填料(B)係經由高頻電場之施加而發熱之填料。高頻電場係在高頻下方向反轉之電場。 介電填料(B)係於施加頻率域為3MHz以上、300MHz以下之高頻電場界時發熱之填料為佳。介電填料(B)係頻率域3MHz以上、300MHz以下中，例如經由頻率13.56MHz、27.12MHz或40.68MHz等之高頻電場之施加而發熱之填料為佳。 介電填料(B)係氧化鋅、碳化矽(SiC)、銳鈦礦模具氧化鈦、鈦酸鋇、鈦酸鋯酸鋇、鈦酸鉛、鈮酸鉀、金紅石型氧化鈦、水合矽酸鋁、具有鹼金屬之水合鋁矽酸鹽等之結晶水之無機材料或具有鹼土金屬之水合鋁矽酸鹽等之結晶水之無機材料等之一種單獨或二種以上之組合為適切者。 介電填料(B)係從得更高發熱性之觀點視之，含至少任一選自氧化鋅、碳化矽、鈦酸鋇及氧化鈦所成群者為佳，更佳為至少任一選自氧化鋅、鈦酸鋇及氧化鈦所成群。 例示之介電填料中，種類極為豐富，可自各種形狀及尺寸選擇，令高頻感應加熱用黏著劑之黏著特性及機械特性配合用途加以改良之故，介電填料(B)係更佳為氧化鋅。經由做為介電填料(B)使用氧化鋅，可得無色之高頻感應加熱用黏著劑。氧化鋅係在介電填料中，密度為小之故，做為介電填料(B)使用含有氧化鋅之高頻感應加熱用黏著劑，接合被附著體(X)之時，較使用含有其他之電填料之黏著劑之時，構造體之總重量則難以增大。氧化鋅係在陶瓷中，硬度不會過高之故，不易傷及高頻感應加熱用黏著劑之製造裝置。氧化鋅係不活性之氧化物之故，即使與熱可塑性樹脂配合，賦予熱可塑性樹脂之損傷亦少。 又，做為介電填料(B)之氧化鈦係銳鈦礦型氧化鈦及金紅石型氧化鈦之至少任一者為佳，從介電特性優異之觀點視之，更佳為銳鈦礦型氧化鈦。 高頻感應加熱用黏著劑中之介電填料(B)之體積含有率係5體積%以上為佳，較佳為8體積%以上，更佳為10體積%以上。 高頻感應加熱用黏著劑中之介電填料(B)之體積含有率係50體積%以下為佳，較佳為40體積%以下，更佳為35體積%以下，更甚者為25體積%以下。 高頻感應加熱用黏著劑中之介電填料(B)之體積含有率為5體積%以上時，易於提升發熱性，可使高頻感應加熱用黏著劑與被附著體(X)強固接合。 高頻感應加熱用黏著劑中之介電填料(B)之體積含有率為50體積%以下時，可防止接著劑之強度下降，其結果，經由使用該黏著劑，可防止接合強度之下降。又，使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑為黏著薄片時，接黏著薄片中之介電填料(B)之體積含有率為50體積%以下之時，易於得做為薄片之可撓性，易於防止韌性之下降低下之故，易於在之後工程中，可將高頻感應加熱用黏著薄片加工成所期望之形狀。 然而，使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑，含有熱可塑性樹脂(A)及介電填料(B)之時，對於熱可塑性樹脂(A)及介電填料(B)之合計體積而言，介電填料(B)之體積含有率係5體積%以上為佳，較佳為8體積%以上，更佳為10體積%以上。對於熱可塑性樹脂(A)及介電填料(B)之合計體積而言，介電填料(B)之體積含有率係50體積%以下為佳，較佳為40體積%以下，更佳為35體積%以下，更甚者為25體積%以下。 介電填料(B)之體積平均粒子徑係1μm以上為佳，較佳為2μm以上，更佳為3μm以上。 介電填料(B)之體積平均粒子徑係30μm以下為佳，較佳為25μm以下，更佳為20μm以下。 介電填料(B)之體積平均粒子徑為1μm以上時，高頻感應加熱用黏著劑係在高頻電場之施加時，發現高發熱性能，可與被附著體(X)在短時間強固黏著。 介電填料(B)之體積平均粒子徑為30μm以下時，高頻感應加熱用黏著劑係在高頻電場之施加時，發現高發熱性能，可與被附著體(X)在短時間強固黏著。又，使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑為黏著薄片時，介電填料(B)之體積平均粒子徑為30μm以下之時，可防止高頻感應加熱用黏著薄片之強度下降。 介電填料(B)之體積平均粒子徑係經由以下之方法加以測定。經由雷射繞射・散射法，進行介電填料(B)之粒度分布測定，從該粒度分布測定之結果，依據JIS Z 8819-2：2001，算出體積平均粒子徑。 ＜添加劑＞ 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係可包含添加劑，亦可不含添加劑。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑包含添加劑時，做為添加劑，例如可列舉黏著賦予劑、可塑劑、蠟、著色劑、氧化防止劑、紫外線吸收劑、抗菌劑、偶合劑、黏度調整劑、有機填充劑、及無機填充劑等。做為添加劑之有機填充劑及無機填充劑係與介電材料(介電填料)不同。 黏著賦予劑及可塑劑係可改良高頻感應加熱用黏著劑之熔融特性、及黏着特性。 做為黏著賦予劑，例如可列舉松脂衍生物、聚萜烯樹脂、芳香族改性萜烯樹脂、芳香族改性萜烯樹脂之氫化物、萜烯苯酚樹脂、苯并呋喃・茚樹脂、脂肪族石油樹脂、芳香族石油樹脂、及芳香族石油樹脂之氫化物。 做為可塑劑，例如可列舉石油系橡膠加工油、天然油、二氯基酸二烷基、及低分子量液狀聚合物。做為石油系橡膠加工油，例如可列舉烷烴系橡膠加工油、環烷系橡膠加工油、及芳香族系橡膠加工油等。做為天然油，例如可列舉蓖麻油，及妥爾油等。做為二氯基酸二烷基酯，例如可列舉鄰苯二甲酸二丁酯、鄰苯二甲酸二辛酯、及己二酸二丁酯等。做為低分子量液狀聚合物，例如可列舉液狀聚丁烯、及液狀聚異戊二烯等。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑，含有添加劑之時，高頻感應加熱用黏著劑中之添加劑之含有率係通常，以高頻感應加熱用黏著劑之整體量基準，為0.01質量%以上為佳，較佳為0.05質量%以上，更佳為0.1質量%以上。又，高頻感應加熱用黏著劑中之添加劑之含有率係20質量%以下為佳，較佳為15質量%以下，更佳為10質量%以下。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係不含有溶劑為佳。根據不含有溶劑之高頻感應加熱用黏著劑時，難以產生起因於使用於與被附著體(X)之黏著之黏著劑之VOC(揮發性有機物，Volatile Organic Compounds)之問題。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係不含有碳或碳為主成分之碳化合物(例如碳黑等)及金屬等之導電性物質為佳。使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係例如不含有碳鋼、α鐵、γ鐵、δ鐵、銅、氧化鐵、黃銅、鋁、鐵-鎳合金、鐵-鎳-鉻合金、碳纖維及碳黑為佳。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑，含有導電性物質之時，黏著劑中之導電性物質之含有率係各別獨立而言，以黏著劑之整體量基準，為7質量%以下為佳，較佳為6質量%以下，更佳為5質量%以下，更甚者為1質量%以下，更進一步為0.1質量%以下為佳。 黏著劑中之導電性物質之含有率係尤以0質量%為佳。 接著劑中之導電性物質之含有率為7質量%以下時，於感應加熱處理時，可易於防止電性絕緣破壞，黏著部及被附著體(X)之碳化之不妥。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑中，熱可塑性樹脂(A)及介電填料(B)之合計含有率係80質量%以上為佳，較佳為90質量%以上，更佳為93質量%以上，更甚者為95質量%以上，更進一步為99質量%以上為佳。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之形狀係未特別加以限定，為薄片狀為佳。即，使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑為黏著薄片(有稱高頻感應加熱用黏著薄片之情形)為佳。藉由高頻感應加熱用黏著劑成為黏著薄片，可更縮短構造體之製造工程之時間。薄片狀之高頻感應加熱用黏著劑係可為具備從相互對向之面之一方面，朝向另一方之面貫通之開口部之框狀薄片之形狀。該開口部係可具有1個。或具有2個以上亦可。薄片狀之高頻感應加熱用黏著劑係可不具有該開口部之薄片。 (介電特性) 對於使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之介電特性(tanδ/ε’r)加以說明。使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係高頻感應加熱用黏著劑之介電特性(tanδ/ε’r)為0.005以上。(tanδ係23℃且頻率40.68MHz之損耗正切、ε’r係23℃且頻率40.68MHz之相對電容率)。 高頻感應加熱用黏著劑之介電特性為0.005以上時，在感應加熱處理時，高頻感應加熱用黏著劑易於發熱，可易於將高頻感應加熱用黏著劑與被附著體(X)在短時間加以強固接合。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之介電特性係0.008以上為佳，更佳為0.010以上。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之介電特性為0.008以上時，在感應加熱處理時，高頻感應加熱用黏著劑更易於發熱，可易於將高頻感應加熱用黏著劑與被附著體(X)在短時間加以強固接合。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之介電特性之上限係不特別加以限定。使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之介電特性係例如可為0.1以下，亦可為0.08以下，亦可為0.05以下。高頻感應加熱用黏著劑之介電特性係例如可滿足0.005以上，0.1以下。 高頻感應加熱用黏著劑之介電特性為0.1以下時，易於抑制過熱，難以產生被附著體(X)與高頻感應加熱用黏著劑接觸部分之損傷。 高頻感應加熱用黏著劑之介電特性(tanδ/ε’r)之測定方法係與在前述之間隔件之介電特性(tanδ/ε’r)所說明之測定方法相同。 然而，高頻感應加熱用黏著劑之介電特性(tanδ/ε’r)之測定中，有將高頻感應加熱用黏著劑之測定用薄片從構造體獲得之需要時，經由從構造體切出、削出，得均勻厚度之測定用薄片。對於未薄片化，例如團塊狀之高頻感應加熱用黏著劑，經由以熱加壓機等薄片化，得測定用薄片即可。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之厚度係5μm以上為佳，較佳為10μm以上，更佳為30μm以上，尤以50μm以上為佳。 黏著薄片之厚度為5μm以上時，對於與被附著體(X)接觸之黏著薄片，可提升高頻施加時之發熱性之故，可易於將黏著薄片與被附著體(X)在短時間強固黏著。又，與被附著體(X)接合之時，黏著薄片易於追隨被附著體之第2面之形狀，易於發現黏著強度。 黏著薄片之厚度之上限則未特別加以限定。愈增加黏著薄片之厚度，亦增加黏著黏著薄片與被附著體(X)所得之構造體整體之重量。為此，黏著薄片係例如在加工性、使用性等之實際使用上沒有問題之範圍之厚度為佳。考量到高頻感應加熱用黏著薄片之實用性及成形性，使用於關於本實施形態之接合方法之黏著薄片之厚度係2000μm以下為佳，較佳為1000μm以下，更佳為600μm以下。 做為高頻感應加熱用黏著劑之黏著薄片係較使需要使用塗佈之液狀之黏著劑之情形，則易於處理，亦可提升與被附著體(X)之接合時之作業性。 又，做為高頻感應加熱用黏著劑之黏著薄片係可適切控制薄片厚度等。為此，可將黏著薄片適用於捲對捲方式，且可經由拔模加工等，配合與被附著體(X)之第2面之黏著面積、以及被附著體(X)之第2面之形狀，將黏著薄片加工成任意之面積及形狀。為此，做為高頻感應加熱用黏著劑之黏著薄片係從製造工程之觀點視之，優點極大。 (高頻感應加熱用黏著劑之形態) 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之形狀係未特別加以限定，為薄片狀為佳。即，使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑為黏著薄片(有稱高頻感應加熱用黏著薄片之情形)為佳。藉由高頻感應加熱用黏著劑成為黏著薄片，可更縮短構造體之製造工程之時間。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係在一形態中，僅以使用於關於本實施形態之接合方法之高頻感應加熱用黏著薄片所成黏著層一層加以構成。高頻感應加熱用黏著劑係僅黏著層之一層所成高頻感應加熱用黏著薄片之時，該黏著層相當於(該接合層本身)高頻感應加熱用黏著薄片之故，高頻感應加熱用黏著薄片之形態及特性係相當於接合層之形態及特性。高頻感應加熱用黏著薄片係僅由單一之黏著層所成為佳。即，使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑為僅單一黏著層所成之高頻感應加熱用黏著薄片為佳。由此，可使高頻感應加熱用黏著薄片之厚度變薄，且可簡單地成形高頻感應加熱用黏著薄片。 高頻感應加熱用黏著薄片係有僅以高頻感應加熱黏著性之黏著層之一層所成之故，本說明書中，「高頻感應加熱用黏著薄片」之用語，以及「黏著層」之用語係依情形，可互相替換。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係不限定於僅黏著層之一層所成之高頻感應加熱用黏著薄片之形態。高頻感應加熱用黏著之其他之形態中，於被附著體之至少一方之面，預先設置高頻感應加熱用黏著層亦可。 圖8A~圖8C係使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之概略圖，例示有複數之形態。 圖8A所示高頻感應加熱用黏著劑11A係僅由單一之黏著層所構成之黏著薄片12。 圖8B所示附有高頻感應加熱用黏著劑之被附著體14係具備做為黏著層之高頻感應加熱用黏著劑11A、和做為被附著體(X)之被附著體120A，高頻感應加熱用黏著劑11A則一體設於被附著體120A。被附著體120係具備第1面、和第2面，第1面係具有起伏面，第2面係不具有起伏面。高頻感應加熱用黏著劑11A係直接接觸設於被附著體120A之第2面。附有高頻感應加熱用黏著劑之被附著體14係可各別準備高頻感應加熱用黏著劑11A、和被附著體120A加以貼合而成為一體，於作成被附著體120A時，於被附著體120A之第2面，設置高頻感應加熱用黏著劑11A成為一體亦可。被附著體120係使用與在前述被附著體之材質所說明之材質相同之材質。 圖8C所示附有高頻感應加熱用黏著劑之被附著體16係具備做為黏著層之高頻感應加熱用黏著劑11A、和被附著體110A，高頻感應加熱用黏著劑11A則一體設於被附著體110A。被附著體110A係第1面及第2面皆不具有起伏面。高頻感應加熱用黏著劑11A係直接接觸設於被附著體110A之不具有起伏面之面。附有高頻感應加熱用黏著劑之被附著體16係可各別準備高頻感應加熱用黏著劑11A、和被附著體110A加以貼合而成為一體，於作成被附著體110A時，於被附著體110A之平坦面，設置高頻感應加熱用黏著劑11A成為一體亦可。被附著體110A係使用與在前述被附著體之材質所說明之材質相同之材質。 然而，於前述之配置工程中，高頻感應加熱用黏著劑11A係配置於被附著體120A，或與配置於被附著體110A之電極側之面相反側之面。又，高頻感應加熱用黏著劑係由僅單一之黏著層之高頻感應加熱用黏著劑11A構成之時、前述之配置工程中，各別配置高頻感應加熱用黏著劑11A，和被附著體(X)(例如被附著體120A)。另一方面，高頻感應加熱用黏著劑係一體設於被附著體之時，前述之配置工程中，配置附有高頻感應加熱用黏著劑之被附著體14即可。又，使用附有高頻感應加熱用黏著劑之被附著體16之時，前述之配置工程中，配置被附著體(X)(例如被附著體120A)、和附有高頻感應加熱用黏著劑之被附著體16即可。不論何者之時，被附著體(X)之第1面係朝向與高頻感應加熱用黏著劑11A相反側加以配置。 (厚度) 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係僅黏著層之一層所成之黏著薄片時，使用於關於本實施形態之接合方法之黏著薄片之厚度係5μm以上為佳，較佳為10μm以上，更佳為30μm以上，尤以50μm以上為佳。 黏著薄片之厚度為5μm以上時，對於與被附著體(X)接觸之黏著薄片，可提升高頻施加時之發熱性之故，可易於將黏著薄片與被附著體(X)在短時間強固黏著。又，與被附著體(X)接合之時，黏著薄片易於追隨被附著體(X)之第2面，易於發現黏著強度。 黏著薄片為附有高頻感應加熱用黏著劑之被附著體之黏著劑時，黏著層之厚度係5μm以上為佳，較佳為10μm以上，更佳為30μm以上，尤以50μm以上為佳。 附有高頻感應加熱用黏著劑之被附著體之黏著劑之時，黏著層之厚度為5μm以上之時，又，與被附著體接合之時，黏著層易於追隨設置被附著體之黏著層之面之表面，易於發現黏著強度。 黏著薄片之厚度之上限則未特別加以限定。愈增加黏著薄片之厚度，亦增加黏著黏著薄片與被附著體(X)所得之構造體整體之重量。為此，黏著薄片係例如在加工性、使用性等之實際使用上沒有問題之範圍之厚度為佳。考量到高頻感應加熱用黏著薄片之實用性及成形性，使用於關於本實施形態之接合方法之黏著薄片之厚度係2000μm以下為佳，較佳為1000μm以下，更佳為600μm以下。黏著薄片之厚度之上限係無關於僅黏著層之一層所成構成，包含黏著層之複數層所成多層構成之任一者，成為上述之值者為佳。 做為高頻感應加熱用黏著劑之黏著薄片係較使需要使用塗佈之液狀之黏著劑之情形，則易於處理，亦可提升與被附著體(X)之接合時之作業性。 又，做為高頻感應加熱用黏著劑之黏著薄片係可適切控制薄片厚度等。為此，可將黏著薄片適用於捲對捲方式，且可經由拔模加工等，配合與被附著體(X)之第2面之黏著面積、以及被附著體(X)之第2面之形狀，將黏著薄片加工成任意之面積及形狀。為此，做為高頻感應加熱用黏著劑之黏著薄片係從製造工程之觀點視之，優點極大。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係施加所謂短波至超短波之頻率帶(例如3MHz以上、300MHz以下)之高頻電場加以使用為佳。施加該頻率帶之高頻電場時，可加熱之深度為深之故，可提升高頻施加時之發熱性。為此，高頻感應加熱用黏著劑之厚度為厚之時，亦可易於將黏著薄片與被附著體(X)在短時間加以強固接合。 (高頻感應加熱用黏著劑之製造方法) 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係例如經由混合上述各成分而製造。使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係黏著薄片之時，例如預備混合上述各成分，使用押出機、及熱滾軸等之公知之混練裝置加以混練，經由壓出成形、壓延成形、注塑成形及鑄造成形等之公知之成形方法加以製造。 高頻感應加熱用黏著劑係較一般之黏著劑，在耐水性及耐濕性上則優異。 使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑係經由高頻電場之施加，局部性加熱。因此，根據使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之時，於與被附著體(X)之接合時，易於防止被附著體(X)整體之損傷之不妥。 [實施形態之變形] 本發明係非限定於前述實施形態。本發明係包含可達成本發明目的之範圍之變形及改良。 然而，關於本實施形態之接合方法中，將空間部經由間隔件之變形加以埋沒時之加壓方向係未特別加以限定。加壓方向係例如沿著被附著體(X)及間隔件之層積方向為佳，層積於被附著體(X)及間隔件之縱方向加以配置時，係沿著層積方向(縱方向)之方向，層積於被附著體(X)及間隔件之橫方向加以配置時，係沿著層積方向(橫方向)之方向。加壓處理係由配置被附著體(X)及間隔件之雙面側加以加壓亦可，固定任一方之面側，由另一方之面側加以加壓亦可。在此縱方向係例如指沿重力方向之方向，橫方向係指沿著與重力方向正交之方向的方向。 又，關於本實施形態之接合方法中，將空間部經由間隔件之變形加以埋沒時之加壓手段係雖舉例具有高頻感應加熱裝置之電極之加壓機構，但不限定於此加壓手段。加壓手段係例如可經由手之加壓，不具備加壓機構之僅高頻感應加熱裝置之電極之自重所成按壓亦可，具備高頻感應加熱裝置以外之加壓機構之裝置之加壓手段亦可。 實施例 以下，列舉實施例，更詳細說明本發明。本發明係非限定於此等實施例。 ＜高頻感應加熱用黏著劑之製作＞ 準備下述所示熱可塑性樹脂(A)、及介電填料(B)，使熱可塑性樹脂(A)成為80體積%、及介電填料(B)成為20體積%之比例，各別加以秤量。 接著，預備混合熱可塑性樹脂(A)與介電填料(B)。將預備混合熱可塑性樹脂(A)與介電填料(B)之材料，供給至30mmφ二軸押出機之漏斗、將缸設定溫度設定於180℃以上230℃以下、擠壓模溫度設定於230℃，熔融混練預備混合之材料。冷卻熔融混練之材料後，經由切斷該材料，製作粒狀之顆粒接著，將製作之粒狀顆粒，投入設置T模頭之單軸押出機之漏斗，成為缸溫度為200℃、擠壓模溫度為200℃之條件，從T模頭，押出薄膜狀熔融混練物，經由於冷卻滾軸加以冷卻，製作厚度0.4mm之薄片狀之高頻感應加熱用黏著劑(高頻感應加熱黏著薄片AS1)。 (熱可塑性樹脂(A)) 聚丙烯樹脂(日本聚丙烯股份有限公司製、NOVATEC PPMH4、聚丙烯均聚體、融點：165℃) (介電填料(B)) ZnO：氧化鋅(堺化學工業股份有限公司製、製品名「LP-ZINC11」) (介電填料之體積平均粒子徑) 經由雷射繞射・散射法，測定介電填料之粒度分布。由粒度分布測定之結果，依據JIS Z 8819-2：2001，算出體積平均粒子徑。算出之氧化鋅(ZnO)之體積平均粒子徑係11μm。 (介電特性) 將製作之高頻感應加熱黏著薄片，切斷成30mm×30mm之大小。對於切斷之高頻感應加熱黏著薄片，使用RF阻抗材料分析儀E4991A(Agilent公司製)，安裝介電材料測試・治具 16453A(Agilent公司製)，以平行板法，在23℃之頻率40.68MHz之條件下，各別測定相對電容率(ε’r)、及損耗正切(tanδ)。根據測定結果，算出介電特性(tanδ/ε’r)之值。高頻感應加熱黏著薄片之介電特性(tanδ/ε’r)係0.011。 ＜被附著體之準備＞ 做為被附著體，準備下述所示第1之被附著體WK1、和第2之被附著體WK2。 ＜第1之被附著體WK1＞ 做為第1之被附著體WK1，製作圖9A及圖9B所示聚丙烯樹脂製之塊狀之第1之被附著體WK1。第1之被附著體WK1係具備具有凹部及凸部之起伏面之第1面、與第1面相反側之第2面係不具有起伏面。圖9A及圖9B係表示實施例所使用之第1之被附著體WK1之概略圖。圖9A係表示從第1之被附著體WK1之第2面側所視平面圖，圖9B係表示從第1之被附著體WK1之長度方向側所視側面圖。第1之被附著體WK1之短邊方向之寬度尺寸W係20mm。第1之被附著體WK1之凸部之長度尺寸L2係15mm，第1之被附著體WK1之凹部之長度尺寸L1係10mm。因此，第1之被附著體WK1之長度方向之長度尺寸係60mm。第1之被附著體WK1之凸部與凹部之最大高低差D係5mm。 ＜第2之被附著體WK2＞ 做為第2之被附著體WK2，準備聚丙烯樹脂製薄片(寬度20mm、長度60mm、厚度0.4mm)。 ＜間隔件之準備＞ 做為間隔件，各別準備表1所示厚度之聚矽氧橡膠、油灰(不活性化學合成樹脂)、及聚四氟乙烯(PTFE)(表1中，標記為鐵氟龍(註冊商標)。 (介電特性) 將間隔件，切斷成長度30mm、寬度30mm之大小。對於切斷之間隔件，使用RF阻抗材料分析儀E4991A(Agilent公司製)，安裝介電材料測試・治具 16453A(Agilent公司製)，以平行板法，在23℃之頻率40.68MHz之條件下，各別測定相對電容率(ε’r)、及損耗正切(tanδ)。根據測定結果，算出介電特性(tanδ/ε’r)之值。然而，間隔件之厚度超過2mm之時，經由切削或研磨，調整成厚度2mm以下，進行測定。 (絕緣性) 依據JIS K 6911：1995，測定間隔件之體積電阻率。令測定電壓為500V，測定開始1分後之體積電阻率超過1×10 8Ω・cm之時，定義為絕緣體。 (空間部追隨性) 使用用於接合之間隔件與第1之被附著體WK1。於第1之被附著體WK1之凹部之內面之表面，塗佈印章用紅印泥墨水，使第1之被附著體WK1與間隔件對向加以配置。接著，在進行後述之高頻感應加熱時之壓力條件下，對於第1之被附著體WK1之凹部，按壓於間隔件表面。接著，從第1之被附著體WK1，取下間隔件。然而，壓力之條件係做為在實施例1及實施例2所使用之間隔件之空間部追隨性成為80%以上之壓力加以設定。 令經由第1被附著體WK1之凹部所形成之空間部以平面視之時，在令間隔件追隨於第1之被附著體WK1前之狀態下，令對應於第1之被附著體WK1之空間部之開口形狀之面積之合計為S1。經由間隔件之變形，埋沒空間部之內部時，令於埋沒空間部之部分之間隔件之表面，附著著色劑之部位以平面視之時之面積之合計為S2。根據前述之數式1，經由令S2，除以S1之百分率，求得空間部追隨性。 ・空間部追隨性之評估基準 A：80%以上。 B：50%以上、不足80%。 F：不足50%。 ＜實施例1~3及比較例1＞ 將高頻感應加熱黏著薄片AS1切出成寬度20mm、長度10mm之尺寸，於高頻感應加熱裝置(山本VINITA股份有限公司製、製品名「YRP-400T-A」)之第1電極與第2電極之電極間，配置切斷成寬度20mm、長度60mm之尺寸之間隔件，於間隔件上，依第1之被附著體WK1、和高頻感應加熱黏著薄片AS1、和第2之被附著體WK2順序加以層積配置。 接著，將如此配置之間隔件，第1之被附著體WK1、高頻感應加熱黏著薄片AS1、及第2之被附著體WK2，固定於高頻感應加熱裝置之2個電極。在固定之狀態下，以下述之高頻施加條件，施加高頻電場，黏著高頻感應加熱用黏著薄片與被附著體，製作接合性評估用之試驗片。高頻電場施加時之按壓壓力係施加於黏著薄片之壓力之初期設定值。 圖10係表示接合性評估用之試驗片之側面之概略圖。如圖10所示，高頻感應加熱黏著薄片AS1係配置於第1之被附著體WK1、和第2之被附著體WK2之間，高頻感應加熱黏著薄片AS1係配置於設有位於第1之被附著體WK1之最為第2端部E1B側之凹部之面之相反側之面、和對向於該面之第2之被附著體WK2之第2端部E2B側之面間。即，配置於第1之被附著體WK1、和第2之被附著體WK2間之高頻感應加熱黏著薄片AS1係配置於從第1之被附著體WK1之第2端部E1B側，至朝向第1端部E1A側之最初之凸部之範圍。 [高頻電場施加條件] 頻率　　　　：40.68MHz 輸出　　　　：150W 按壓壓力　　：62kPa (接合性評估) 接合強度之測定係依據JIS Z 0237：2000進行。接合強度之測定係具體而言使用拉伸試驗機，於圖10所示接合性評估用之試驗片中，固定第1之被附著體WK1之第1端部E1A側，經由將第2之被附著體WK2之第1端部E2A側向上方移動之180°剝離加以測定。 接合性評估住製作接合性評估用之試驗片時，測定直至得1N/20mm以上之接合強度所需之高頻感應加熱處理之時間。 [評估基準] A：直至得1N/20mm以上之接合強度之時間為不足30sec。 B：直至得1N/20mm以上之接合強度之時間為30sec以上，不足60sec。 F：即使進行60sec以上之高頻感應加熱處理時，接合強度乃不足1N/20mm。 各實施例係相較比較例1，接合性之評估皆為優異。由以上之結果，關於本實施形態之接合方法係可將具有起伏面之被附著體，在短時間強固接合。 [Joining method] The bonding method of this embodiment uses an adhesive for high-frequency induction heating to join the adherend. In the method of joining the adherend, there are arranging the electrodes of the induction heating device, the arrangement process of the adherend and the spacer, and the following steps: Adhesive for high-frequency induction heating, high-frequency electric field application, and high-frequency electric field application process for bonding objects to be attached. The adhered system has a first surface having an undulating surface, and the adhesive for high-frequency induction heating includes a thermoplastic resin. In the configuration process, when arranging the aforementioned attached body and the aforementioned spacer, a space is formed between the first surface of the attached body and the surface of the aforementioned spacer facing the first side, and the space is passed through The deformation of the spacer is buried. However, in this specification, an induction heating device may be referred to as a high-frequency induction heating device. The adhered system used in the bonding method according to this embodiment has a first surface having an undulating surface, and a second surface which is the opposite side of the first surface. The second surface system does not need to have an undulating surface. The undulating surface of the attached body has a raised part and a sunken part, and the sunken part may exist in one place or in multiple places. Likewise, the raised portion may exist in one place or in plural places. When there are multiple places in the sunken part, the depths of the sunken parts may be almost the same or different. When there are multiple locations of raised parts, the heights of the raised parts may be almost the same or different. When the raised part and the sunken part respectively exist in multiple places, the raised parts and the sunken parts may be separately scattered or densely packed. Also, when the undulating surface is viewed in cross-section, the sunken part may exist in one place in the form of an arcuate depression, or in plural places. The protruding part may have a shape protruding into a circular arc at one place, or there may be multiple places. Hereinafter, an adherend having a first surface having an undulating surface may be referred to as an adherend (X) for convenience. In one form of the bonding method of this embodiment, in the arrangement process, first, the first surface side of the adherend (X) faces the electrode side of the induction heating device, between the electrode and the adherend (X), Configure spacers. In the arrangement of the spacer, a space portion is formed between the first surface of the adherend (X) and the surface of the spacer facing the first surface. The shape of the space portion corresponds to the shape of the space formed between the undulating surface of the attached body (X) and the spacer. Then, at least a part of the space portion is buried corresponding to the shape of the space portion through the deformation spacer. At this time, the adhesive for high-frequency induction heating is arranged on the second surface side of the adherend (X). Next, in the process of applying a high-frequency electric field, a high-frequency electric field is applied to the adhesive for high-frequency induction heating in a state where the space portion is buried through deformation of the spacer, and the adhesive for high-frequency induction heating and the adhered Body (X). In the joining method of this embodiment, since the space portion is buried through the deformation of the spacer, the trouble of preparing a pressure-bonding die formed in advance according to the shape of the undulating surface is saved. Then, in the bonding method according to this embodiment, since the induction heating treatment is performed in a state where the space portion is buried by the deformation of the spacer, the energy of the high-frequency induction heating treatment is easily absorbed by the adhesive for high-frequency induction heating. It is conveyed in a state close to uniformity. Thereby, the adherend (X) and the adhesive for high-frequency induction heating can be strongly bonded in a short time. In the joining method of this embodiment, when at least one adherend having a first surface having an undulating surface can be joined, the number of adherends is not particularly limited, and the number of spacers is also not limited. At this time, in the bonding method of this embodiment, the adherend (X) and the adhesive for high-frequency induction heating can be firmly bonded in a short time, and the adhesive for high-frequency induction heating can be placed between The attached objects are firmly bonded to each other in a short time. The bonding method of one form of this embodiment includes the process of arranging the electrode of the induction heating device, the adherend and the spacer (process P1), applying a high-frequency electric field to the adhesive for high-frequency induction heating, and bonding the adhered Body high-frequency electric field application project (project P2). Hereinafter, each process related to the joining method of this embodiment is demonstrated.・Project P1 Project P1 is a project for disposing the electrode of the induction heating device, the attached body (X), and the spacer. In process P1, the first surface of the object to be attached (X) and the spacer are arranged, and between the first surface of the object to be attached (X) and the surface of the spacer facing the first surface, a Department of Space. The space is filled by deformation of the spacer. In Process P1, the order of disposing the electrodes, the adherend (X), and the spacer is not particularly limited. For example, after disposing the electrode, the object to be attached (X) and the spacer may be arranged, and after the object to be attached (X) and the spacer are arranged, the electrode may be arranged. In addition, the order of disposing the to-be-attached body (X) and the spacer is not particularly limited, either one of the to-be-attached body (X) and the spacer may be disposed first, or may be respectively disposed simultaneously. In process P1, the space formed between the first surface of the object to be attached (X) and the surface of the spacer facing the first surface is buried by deformation of the spacer. The order in which the space portion is buried through the deformation of the spacer is not particularly limited, and the space portion may be buried after the attachment (X) and the spacer are arranged. For example, after disposing the spacer and the adherend (X) on the electrodes of the induction heating device, the space of the adherend (X) may be filled through the spacer. Specifically, the space portion may be filled by deformation of the spacer when the electrode of the induction heating device is used to pressurize the adherend (X) and the spacer. Also, in process P1, after the space portion is buried by deformation of the spacer, the adherend (X) and the spacer may be arranged. For example, before the electrode of the induction heating device, the spacer and the attached body (X) are arranged, the spacer of the attached body (X) becomes buried through the spacer in advance, and then the spacer and the attached body (X) are placed ) can also be arranged on the electrodes of the induction heating device. Specifically, as a spacer, the attached body (X) and the spacer may be placed on the electrodes of the induction heating device after being embedded in the space through deformed clay, putty, etc. However, as long as a space is formed between the object to be attached (X) and the spacer when the spacer is arranged, when the space is buried by deformation of the spacer, the spacer is the undulating surface of the object to be attached (X). As a whole, no configuration is required. For example, the spacer arranged between the undulating surface of the attached body (X) and the electrode is arranged between the depressed part of the undulated surface of the attached body (X) and the electrode, and is not arranged on the surface of the attached body (X). Between the raised portion of the undulating surface and the electrode is also acceptable. In project P1, the number of attached objects is not particularly limited, and more than two attached objects can be arranged. When two or more attachments are arranged, at least one attachment system is the attachment (X). For example, when two adherends (X) are bonded through the adhesive for high-frequency induction heating, the adhesive for high-frequency induction heating is arranged between the second surfaces of the two adherends (X), Between the electrode and the first surface of the adherend (X) of the two, a spacer may be arranged and bonded. Also, for example, when the attached body (X) and the attached body without undulations on the first surface and the second surface are bonded with an adhesive through high-frequency induction heating, the undulations of the two adhered bodies will be reduced. Adhesives for high-frequency induction heating may be arranged between the surfaces, and spacers may be arranged between the electrodes and the first surface of the adherend (X) for bonding. Furthermore, when bonding at least one attachment (X) and three or more attachments, an adhesive for high-frequency induction heating is arranged between the surfaces without the undulations of each attachment, and the attachments are arranged alternately. The attachment and the high-frequency induction heating can also be bonded with an adhesive. In process P1, the adhesive for high-frequency induction heating and the attached body (X) may be arranged separately. When arranging two or more adherends, the adhesive for high-frequency induction heating can be used as an adhesive for high-frequency induction heating that is integrated with the second side of the undulating surface of the adherend (X) configuration. The adhesive for high-frequency induction heating can be arranged as an adhesive for high-frequency induction heating that is integrated with an adherend that does not have undulating surfaces on both surfaces of the first surface and the second surface. In any case, the first surface of the adherend (X) is disposed facing the side opposite to the adhesive for high-frequency induction heating. That is, the adhesive for high-frequency induction heating is disposed on the surface of the adherend (X) opposite to the first surface. When joining two or more attached objects including the attached body (X), process P1 can make the attached objects be joined together, and the adhesive for high-frequency induction heating is sandwiched between the surfaces of the attached objects that do not have undulating surfaces better. The adhesive for high-frequency induction heating can be clamped on a part of the attachments, or at multiple places between the attachments, or can be clamped on the entire surface of the attachments. From the viewpoint of improving the adhesive strength between the adherends, it is preferable to sandwich the adhesive for high-frequency induction heating on the entire bonding surface of the adherends. In addition, as a mode in which the adhesive for high-frequency induction heating is sandwiched between a part of the adherends, it is possible to arrange the adhesive for high-frequency induction heating in a frame shape along the outer periphery of the joint surface between the adherends. , the form in which the entire surface of the attached body is held hostage. In this way, by arranging the adhesive for high-frequency induction heating in a frame shape, the bonding strength between the adherends can be obtained, and at the same time, the structure can be lightened compared to when the adhesive for high-frequency induction heating is arranged on the entire joint surface. Quantify. In addition, when the adhesive for high-frequency induction heating is clamped between a part of the adherend, the amount of the adhesive for high-frequency induction heating can be reduced and the size can be reduced. Compared with the entire bonding surface, Equipped with an adhesive for high-frequency induction heating, the time for high-frequency induction heating can be shortened.・Project P2 Process P2 is the process of bonding the adherend (X) by applying a high-frequency electric field to the adhesive for high-frequency induction heating after arranging the components in the process P1. In process P2, when joining two or more adherends including the adherend (X), in process P1, apply a high-frequency electric field to the adhesive for high-frequency induction heating arranged between the adherends, and join 2 Projects involving more than one attached object. In one embodiment, the frequency of the high-frequency electric field to be applied is not less than 3 MHz and not more than 300 MHz. For example, by using an induction heating device, a high-frequency electric field can be applied to the adhesive for high-frequency induction heating. In the aforementioned process P2, the object to be attached (X) and the adhesive for high-frequency induction heating may be bonded to the object to be attached (X) by applying a high-frequency electric field while applying pressure to the electrodes. (High-frequency induction heating conditions) Although the high-frequency induction heating conditions can be changed appropriately, the following conditions are preferable. The output of the high-frequency electric field is preferably above 10W, more preferably above 30W, more preferably above 50W, even more preferably above 80W. The output of the high-frequency electric field is preferably 50,000W or less, more preferably 20,000W or less, more preferably 15,000W or less, still more preferably 10,000W or less, and even more preferably 1,000W or less. When the output of the high-frequency electric field is 10W or more, it is possible to prevent the temperature from rising during the induction heating process, and it is easy to obtain good joint strength. When the output of the high-frequency electric field is below 50,000W, it is easy to prevent the difficulty of temperature control in induction heating treatment. The application time of the high-frequency electric field is preferably more than 1 second. The application time of the high-frequency electric field is preferably less than 300 seconds, more preferably less than 240 seconds, more preferably less than 180 seconds, still more preferably less than 120 seconds, further preferably less than 90 seconds, especially preferably less than 50 seconds . When the application time of the high-frequency electric field is more than 1 second, it is easy to obtain a good adhesive force because it can prevent the temperature from being difficult to rise during the induction heating treatment. When the application time of the high-frequency electric field is 300 seconds or less, it is easy to prevent the reduction of the manufacturing efficiency of the structure, the increase of the manufacturing cost, and the inconvenience of the adherend (X) being thermally degraded. The frequency of the applied high-frequency electric field is preferably 1 kHz or higher, more preferably 1 MHz or higher, more preferably 3 MHz or higher, still more preferably 5 MHz or higher, and still more preferably 10 MHz or higher. The frequency of the applied high-frequency electric field is preferably 300 MHz or less, more preferably 100 MHz or less, more preferably 80 MHz or less, still more preferably 50 MHz or less. Specifically, the industrial frequency bands 13.56MHz, 27.12MHz, or 40.68MHz allocated by the International Telecommunication Union can be used in the high-frequency induction heating manufacturing method and bonding method of this embodiment. In addition, when applying high-frequency electric field while applying pressure, the pressing pressure when applying high-frequency is used as the initial setting value of the pressure of the adhesive for high-frequency induction heating, preferably 1kPa or more, more preferably 5kPa Above, more preferably above 10kPa, more preferably above 30kPa, still more preferably above 50kPa. In the following, when applying a high-frequency electric field while applying pressure, the pressing pressure when applying high-frequency is used as the initial setting value of the pressure to load the adhesive for high-frequency induction heating, preferably 10 MPa or less, more preferably 5 MPa or less, more preferably 1 MPa or less, still more preferably 500 kPa or less, further preferably 100 kPa or less. Here, the area serving as the reference for the initial setting value of the pressure applied to the adhesive for high-frequency induction heating is the smallest area among the areas of the electrodes, adherends, and spacers when viewed in plan. The bonding method of this embodiment will be described with reference to the drawings. 1 to 3 are schematic diagrams illustrating an example of a bonding method related to this embodiment. 1 to 3 show an example of a method of bonding a first adherend 110 and a second adherend 120 with an adhesive 11 for high-frequency induction heating using an induction heating device 50 . The induction heating device 50 shown in FIGS. 1 to 3 includes a first high-frequency electric field application electrode 51 , a second high-frequency electric field application electrode 52 , and a high-frequency power source 53 . The first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 are arranged to face each other. The first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 have a pressurizing mechanism. Through the pressurizing mechanism of the electrodes (the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52) of the induction heating device 50, two or more adherends and high-level objects arranged between the electrodes are pressurized. Adhesive for frequency induction heating while applying a high frequency electric field. When the induction heating device 50 constitutes the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 as a pair of flat plate electrodes parallel to each other, the form of such electrode arrangement is called a parallel plate type. situation. When applying a high-frequency electric field, it is better to use a parallel-plate high-frequency induction heating device. In the parallel plate type high-frequency induction heating device, since the high-frequency electric field penetrates the high-frequency induction heating adhesive located between the electrodes, the entire high-frequency induction heating adhesive can be heated, and the adherend (X) can be connected to the high-frequency induction heating device. Adhesive for frequency induction heating to join in a short time. Also, when manufacturing a laminated body as a structure, it is preferable to use a parallel plate type high-frequency induction heating device. Each of the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 is connected to a high-frequency power supply 53 for applying a high-frequency electric field with a frequency of about 13.56 MHz, a frequency of about 27.12 MHz, or a frequency of about 40.68 MHz. Fig. 2 shows the electrodes (the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52) of the induction heating device 50, the first adherend 110, the adhesive 11 for high-frequency induction heating, as The state of the second attached body 120 of the attached body (X) and the spacer 210. The first adherend 110 has no undulations on both surfaces of the high-frequency induction heating adhesive 11 side and the first high-frequency electric field application electrode 51 side. The second attached body 120 has a first surface 125 with undulations, and a second surface 127 opposite to the first surface 125 has no undulations. As shown in Figure 2, between the electrodes of a pair of the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52, the spacer 210, the second adherend 120, and the adhesive for high-frequency induction heating The agent 11 and the first adherend 110 are arranged sequentially from the second high-frequency electric field application electrode 52 side. The first surface 125 of the second adherend 120 is disposed facing the spacer 210 . FIG. 3 shows the state after the electrodes of the induction heating device 50 , the first adherend 110 , the adhesive 11 for high-frequency induction heating, the second adherend 120 , and the spacer 210 are arranged. When the spacer 210 is disposed between the second high-frequency electric field application electrode 52 and the second adherend 120 , a space 31 is formed between the undulated surface of the second adherend 120 and the spacer. The induction heating device 50 can apply pressure from at least one direction of the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 . In Fig. 3, through the induction heating device 50, between the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52, for the first adherend 110, the adhesive 11 for high-frequency induction heating, the first 2 Attached body 120 and spacer 210 are subjected to pressure treatment in the direction of the arrow. Fig. 1 shows that after the electrode of the induction heating device 50, the first adherend 110, the adhesive 11 for high-frequency induction heating, the second adherend 120, and the spacer 210 are arranged, the induction heating device 50 is accompanied by heating. Pressure treatment, the state of induction heating treatment. When the pressure treatment is performed by the induction heating device 50 , the spacer 210 is deformed, and the spacer 210 follows the shape of the space portion 31 . Then, the space portion 31 is buried via the spacer 210 . The induction heating device 50 is shown in Figures 1 to 3, using a spacer 210, sandwiched between the first attached body 110 and the second attached body 120, through the adhesive 11 for high-frequency induction heating, and induction heating. heat treatment. Furthermore, the induction heating device 50 joins the first adherend 110 and the second adherend 110 through the pressure treatment of the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 in addition to the induction heating treatment. Attached body 120 . The first adherend 110 and the second adherend 120 are bonded by applying a high-frequency electric field while applying pressure through the electrodes of the induction heating device 50 . In addition, the bonding of the first adherend 110 and the second adherend 120 may be performed by applying a high-frequency electric field after the electrodes of the induction heating device 50 are used to bury the space 31 through the spacer 210. . Here, in the state where the high-frequency electric field is applied while pressurizing via the electrodes of the induction heating device 50, as an initial state, the application of the high-frequency electric field becomes almost simultaneously with the filling of the space portion 31 via the spacer 210 by pressurization. The state of the high-frequency electric field. Pressurization refers to, for example, A. The pressurization process of the pressurization mechanism of the induction heating device 50, or the pressure treatment of the pressure mechanism of the B. Induction heating device 50, etc., only through the electrode of the induction heating device 50 Pressurized by self-weight and pressurized, or compounded C. Pressurized by the pressurized mechanism of the induction heating device 50, and the surface of the pressurized surface formed by the self-weight of the electrode of the induction heating device 50 pressure treatment. For the first adherend 110, the adhesive 11 for high-frequency induction heating, the spacer 210, and the second adherend 120, as electrodes via the induction heating device 50, a high-frequency electric field is applied while pressing As one form of the state, for example, the following forms from (E1) to (E3) can be mentioned. (E1): As the spacer 210, use a spacer made of a material that is easily deformed elastically, apply pressure through the electrodes of the induction heating device 50, and apply a high-frequency electric field while maintaining the state of the deformed spacer 210. (E2): As the spacer 210, use a spacer made of a material that is easily deformed plastically, apply pressure through the electrodes of the induction heating device 50, and apply a high-frequency electric field while maintaining the state of the deformed spacer 210. (E3): As the spacer 210, use a spacer made of a material that is easily deformed plastically, apply pressure through the electrodes of the induction heating device 50, and after the spacer 210 is deformed, release the electrode from the pressurized state, and apply a high-frequency electric field form. In the form of (E3), it is also possible to cancel the pressurization process by the pressurization mechanism and maintain the self-weight of the electrode. From the standpoint of easy reuse of the spacer, the form in which a high-frequency electric field is applied while applying pressure to the electrodes of the induction heating device 50 is preferably the above-mentioned form (E1). Through the bonding method as described above, the structure 100 including the second adherend 120 having an undulating surface on the first surface 125 can be obtained. However, without performing the pressure treatment by the induction heating device 50, for example, two or more adherends may be bonded by only pressing by the adhesive for high-frequency induction heating and the weight of the adherend. In this case, the spacer 210 may be deformed to bury the space portion 31 before the induction heating treatment. For example, a material such as detachable putty may be used as the spacer 210, the spacer 210 may be deformed, and the space portion may be buried in advance. When a high-frequency electric field is applied to the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 , the high-frequency induction heating adhesive 11 absorbs high-frequency energy. In this embodiment, even if the first surface 125 of the second adherend 120 is arranged on the side of the second high-frequency electric field application electrode 52, the space part 31 is buried by the deformation of the spacer 210 by using the spacer 210. . Therefore, the adhesive 11 for high-frequency induction heating absorbs high-frequency energy in a nearly uniform state. As a result, the thermoplastic resin component in the high-frequency induction heating adhesive 11 is melted almost uniformly, and the first adherend 110 and the second adherend 120 can be firmly bonded even in a short time. However, when the adhesive 11 for high-frequency induction heating contains a dielectric material (not shown), the dielectric material dispersed in the thermoplastic resin component as the adhesive component absorbs high-frequency energy. Then, the dielectric material works as a heat source. Through the heat generated by the dielectric material, the thermoplastic resin component is melted. Even if it is processed in a short time, finally, the first adherend 110 and the second adherend can be strongly bonded. Attached body 120 . Since the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 have a pressurizing mechanism, they can also work as a pressurizing device. Therefore, by applying pressure in the direction of compression of the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52, and heating and melting the adhesive 11 for high-frequency induction heating, the first bonding can be strengthened. The attached body 110 and the second attached body 120 . As mentioned above, although an example of the joining method concerning this embodiment was demonstrated with reference to FIGS. 1-3, the embodiment concerning this embodiment is not limited to this example. In other forms, as long as at least one object to be attached (X) is used, the number of objects to be attached is not particularly limited. For example, the attachment body (X) may be used as both of the two attachment bodies. In Figures 1 to 3, as one of the attached bodies, the second attached body 120 as the attached body (X) is used, and as the other side's attached body, the first attached body without undulating surface is used. The attached body 110 . In the examples shown in Figures 1 to 3, as another form, a parallel flat plate type high-frequency induction heating device can be used, and two attached objects can also be used, and the second attached object as the attached object (X) can be used. Body 120. At this time, any of the second adherends 120 is arranged so that the first surface 125 faces each electrode side of the induction heating device 50 (the first high-frequency electric field application electrode 51 and the second high-frequency electric field application electrode 52 ). . Then, spacers 210 are arranged between the electrodes of the induction heating device and the two second adherends 120, and the two second adherends 120 are bonded with the adhesive 11 for high-frequency induction heating. join. The high-frequency induction heating treatment is not limited to the induction heating device in which the electrodes described above are opposed to each other, and a grid electrode type high-frequency induction heating device may also be used. The grid electrode type high-frequency induction heating device has a grid electrode in which electrodes of the first polarity and electrodes of the second polarity opposite to the electrodes of the first polarity are alternately arranged on the same plane at regular intervals. However, in FIGS. 1 to 3 , for the sake of simplification, an example of an induction heating device using opposingly arranged electrodes is illustrated. When the grid electrode type induction heating device is used, the attached body (X) can also be strongly bonded in a short time. When applying a high-frequency electric field, it is better to use a grid electrode type high-frequency induction heating device. By using a grid electrode type high-frequency induction heating device, it is possible to join without being affected by the thickness of the adherend (X). In addition, by using a grid electrode type high-frequency induction heating device, energy saving at the time of bonding can be realized. When bonding via a grid electrode type induction heating device, a grid electrode is placed on either one of the first surface side with the undulating surface of the adherend (X) and the second surface side opposite to the first surface, and applied High frequency is also available. In addition, grid electrodes may be arranged on both the first surface side and the second surface side of the adherend (X), and a high-frequency electric field may be applied. Furthermore, it may be arranged on the first surface side of the adherend (X) to apply a high-frequency electric field, and thereafter, a grid electrode may be arranged on the second surface side to apply a high-frequency electric field. Hereinafter, each member used for the joining method concerning this embodiment is demonstrated. <Adhering body> The to-be-adhered body (X) used in the joining method concerning this embodiment is a 1st surface, and has an undulating surface, and an undulating surface is a convex part which has a raised part, and a concave part which has a depressed part. In this embodiment, the relatively raised portion of the undulating surface may be called a convex portion, and the relatively depressed portion divided by the raised portion of the undulating surface may be called a concave portion. 4A and 4B are cross-sectional views showing an example of an adherend used in the bonding method according to this embodiment. For example, the attached body 120B shown in FIG. 4A is on the first surface and has an undulating surface, and the convex portion 121A, the convex portion 121B, and the convex portion 121C are raised parts of the undulating surface, and the concave portion 123A, the concave portion 123B, the concave portion 123C, and the concave portion 123D It is the part where the undulating surface sinks. The cross-sectional shape of the concave portion and the convex portion is not limited to the rectangle shown in FIG. 4A and FIG. 4B , for example, it can be inclined from the top T of the convex portion to the bottom L of the concave portion, or curved, or have a step difference. Also, for example, the raised portion of the undulating surface may be in the shape of a semicircle. At this time, the semicircular portion becomes a convex portion, and the depressed portions on both sides of the convex portion become a concave portion. Furthermore, for example, when the sunken portion of the undulating surface is semicircular, the semicircular portion becomes a concave portion, and the raised portions on both sides of the semicircular shape become convex portions. In the object to be attached (X), the maximum height difference of the undulating surface is preferably 1 mm or more, more preferably 2 mm or more, more preferably 3 mm or more, and even more preferably 4 mm or more. When the maximum height difference of the undulating surface is more than 1mm, it is easy to use the spacer, and the attachment (X) and the adhesive for high-frequency induction heating can be strengthened in a short time to strengthen the bonding effect. The upper limit of the height difference of the undulating surface of the object to be attached is not particularly limited as long as the object to be attached (X) and the adhesive for high-frequency induction heating can be firmly bonded in a short time by using a spacer . The maximum height difference of the undulation surface of the attached object is, for example, preferably less than 40 mm, may be less than 20 mm, and even less than 10 mm. The maximum height difference of the undulation of the undulation surface means the maximum value of the elevation difference from the top of the convex part to the bottom of the concave part when the number of the convex part having the undulating surface is one. The top of the convex part is the highest part of the convex part, and the bottom of the concave part is the lowest part of the concave part. However, for example, when the raised portion or the sunken portion of the undulating surface is a semicircle, the height difference of the undulation becomes the radius of the semicircle. The maximum level difference of the undulation of the undulating surface means the maximum value of the height difference between the convex part and the concave part when the number of the convex parts having the undulating surface is two or more. For example, referring to FIG. 4A , the distances from the top T of the convex portion 121C to the bottom L of the concave portion 123D are the same for the concave portion 123A, the concave portion 123B, the concave portion 123C, and the concave portion 123D. Therefore, the maximum height difference shown in FIG. 4A is represented by, for example, the maximum height difference D from the top T of the adjacent convex portion 121C to the bottom L of the concave portion 123D. On the other hand, referring to FIG. 4B for example, the heights of the protrusions 122A, 122B, 122C, and 122D of the attached body 120D are different, and the protrusion 122B is the most prominent. Moreover, the depths of the recessed part 124A, the recessed part 124B, the recessed part 124C, and the recessed part 124D of the attached body 120D are different, and the recessed part 124D is the most depressed. Therefore, the maximum height difference shown in FIG. 4B is represented by the maximum height difference D from the top T of the most prominent convex portion 122B to the bottom L of the most depressed concave portion 124D. In the object to be attached (X), when the first surface of the object to be attached (X) is viewed in a plan view, the area ratio of the concave portion occupying the first surface is preferably 20% or more, more preferably 30% or more, More preferably at least 40%, more preferably at least 50%, and still more preferably at least 60%. The upper limit of the area ratio of the concave portion occupying the first surface is not particularly limited, and may be, for example, 90% or less. When the area ratio of the concave portion occupying the first surface is 20% or more, it is easy to enhance the effect of using the spacer, and the adherend (X) can be strongly bonded in a short time. In the bonding method of this embodiment, the material of the adherend (X) is not particularly limited. The material of the attached body can be any one of organic material and inorganic material (including metal material, etc.), and can also be a composite material of organic material and inorganic material. The material of the attachment (X) is preferably an organic material. Examples of organic materials used as the material of the attached body include plastic materials and rubber materials. As the plastic material, for example, polypropylene resin, polyethylene resin, ethylene-vinyl acetate copolymer, epoxy resin, polyurethane resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), unhydrogenated styrene-conjugated diene copolymer (styrene-butadiene-styrene copolymer) (SBS), styrene-butadiene/butylene-styrene copolymer, styrene-iso Pentadiene copolymer, styrene-isoprene-styrene copolymer (SIS), styrene-ethylene/isoprene-styrene copolymer, etc.), hydrogenated styrene-conjugated diene copolymer ( Styrene-ethylene/propylene-styrene copolymer) (SEPS), and styrene-ethylene/butylene-styrene copolymer (SEBS), etc.), polycarbonate resin (PC resin), polyamide resin (resistant Dragon 6 and Nylon 66, etc.), polyester (polyethylene terephthalate resin (PET resin) and polybutylene terephthalate resin (PBT resin), etc.), polyoxymethylene resin (POM resin) , polymethyl methacrylate resin, and polystyrene resin. Examples of the rubber material include styrene-butadiene rubber (SBR), ethylene propylene rubber (EPR), butadiene rubber (BR), and silicone rubber. In addition, the adherend (X) may be a foamed material of an organic material. When the material of the object to be attached is a thermoplastic resin, from the viewpoint of adhesiveness, the main composition of the thermoplastic resin containing the object to be attached (X) is the same as that of the thermoplastic resin (A) containing an adhesive for high-frequency induction heating. ) have the same main composition. In the present specification, the "main composition of the thermoplastic resin" means, for example, when the thermoplastic resin is a polymer, among the repeating units contained in the polymer, the polymer contains the most repeating units. When the thermoplastic resin is a polymer derived from a single monomer, the monomer unit (repeating unit) is "the main component of the thermoplastic resin". When the thermoplastic resin is a copolymer, the polymer containing the most repeating units is "the main composition of the thermoplastic resin". When the thermoplastic resin is a copolymer, the "main component of the thermoplastic resin" in the copolymer contains more than 30% by mass of repeating units (monomer units), and in one form, contains more than 30% by mass of Repeated units, in another form, containing 40% by mass or more of repeated units, and in another form, containing 50% by mass or more of repeated units. Also, when the thermoplastic resin is a copolymer, it may contain two or more types of repeating units at most. Inorganic materials used as the material of the adherend (X) include glass materials, cement materials, ceramic materials, and metal materials. In addition, the attached body (X) can be a fiber reinforced resin (Fiber Reinforced Plastics, FRP) which is a composite material of fiber and the above-mentioned plastic material. The plastic material of this fiber-reinforced resin is selected from at least one such as polypropylene resin, polyethylene resin, polyurethane resin, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), polycarbonate resin (PC resin), polyamide resin (Nylon 6 and Nylon 66, etc.), polyester (polyethylene terephthalate resin (PET resin) and polybutylene terephthalate resin (PBT resin) ), etc.), polyoxymethylene resin (POM resin), polymethyl methacrylate resin, epoxy resin, and polystyrene resin are grouped together. The fiber system of the fiber-reinforced resin includes, for example, glass fiber, Kevlar fiber, carbon fiber, and the like. It is better that the attached body (X) has low electrical conductivity. Regarding the joining method of this embodiment, when using an adhesive for high-frequency induction heating to join two or more plural adherends, the adherend system of at least one of the plural adherends uses the adherend ( X). The materials of the plural objects to be attached are the same material or different materials. Although the shape of the object to be attached is not particularly limited, when the adhesive for high-frequency induction heating in this embodiment is an adhesive sheet, it is preferable that the adhered system has a surface that can be attached to the adhesive sheet, such as a sheet, a plate, or Chunks are better. When bonding a plurality of attached objects, the shape and size of these attached objects may be the same as or different from each other. <Spacer> The material of the spacer used in the bonding method of this embodiment is deformable, as long as it can be embedded in the space formed by the first surface of the attached body (X) and the cushioning material, there is no particularity. Be limited. The material of the spacer is rubber, clay, putty, etc., for example. It does not specifically limit as a rubber, For example, various rubbers are mentioned. When the material of the spacer is rubber, it is difficult to generate heat through the application of a high-frequency electric field in the rubber. From the viewpoint of difficulty in generating thermal deterioration and fusion with the attached body, polysiloxane rubber is used as the good. As the clay, any commonly known clay may be used, and examples thereof include silicone clay containing a silicone resin. Examples of the putty include inactive chemical synthetic resins and the like. (Thickness) The thickness of the spacer is preferably 50% or more, preferably 75% or more, and more preferably More than 100%, more preferably more than 125%, further more than 150%, especially more than 175%. When the thickness of the spacer is more than 50% of the maximum height difference of the undulating surface of the attached body, it is easy to be buried in the concave portion of the undulating surface. The upper limit of the thickness of the spacer is not particularly limited as long as it can be embedded in the space, and the adherend with the undulating surface can be firmly bonded in a short time. For example, the first part of the adherend (X) The maximum height difference of the undulating surface provided on the surface may be 500% or less, 400% or less, or 300% or less. The thickness of the spacer means the distance between the surface of the spacer facing the electrode side and the surface facing the adherend (X). For example, when referring to FIG. 2, the thickness Z of the spacer 210 represents the surface of the spacer 210 facing the second high-frequency electric field application electrode 52 and the first surface of the spacer 210 facing the attached body (X). A distance of 125 faces. (Dielectric properties) The dielectric properties (tanδ/ε'r) of the spacer are preferably 0.003 or less, more preferably 0.002 or less, more preferably 0.0010 or less. The dielectric properties of the spacer used in the bonding method of this embodiment are usually 0 or more. (tanδ is the loss tangent at 23°C and frequency 40.68MHz, ε'r is the relative permittivity at 23°C and frequency 40.68MHz). The smaller the dielectric properties of the spacer (closer to 0), the more difficult it is for the spacer to heat up during induction heating, and the unintentional deformation (not the deformation of the embedded space) and melting of the spacer can be suppressed. . Therefore, when the dielectric property of the spacer is 0.003 or less, the spacer is less likely to generate heat during induction heating, and the adherend with the undulating surface and the adhesive can be easily bonded firmly in a short time. The dielectric property (tanδ/ε'r) is the value obtained by dividing the loss tangent (tanδ) measured with an impedance material device, etc. by the relative permittivity (ε'r) measured with an impedance material device. The loss tangent (tanδ) and relative permittivity (ε'r) of the dielectric properties of the spacer can be measured simply and accurately by using an impedance material analyzer. However, the details of the measuring method of the spacer are as follows. First, a test piece for measuring a spacer is obtained. When the thickness of the spacer is thick, the thickness can be adjusted by cutting, grinding, etc. The thickness of the sheet for measurement is, for example, not less than 10 μm and not more than 2 mm. For the sheet obtained in this way, the relative permittivity (ε'r) and the loss tangent (tanδ) were measured respectively under the condition of 23° C. and a frequency of 40.68 MHz using an RF impedance material analyzer E4991A (manufactured by Agilent Corporation), and calculated The value of dielectric properties (tanδ/ε'r). (Insulation properties) The spacer is preferably an insulator. When the spacer is an insulator, there will be no electricity flowing through the spacer during the induction heating treatment, and the adhesive for high-frequency induction heating is in a nearly uniform state, and it is easy to be adhered due to the induction heating treatment. The body (X) is strongly bonded with the high-frequency induction heating adhesive in a short time. In this embodiment, the insulation of the spacer was based on JIS K 6911:1995, and the volume resistivity was measured with a measurement voltage of 500V. When the volume resistivity exceeds 10 8 Ω·cm one minute after the start of the measurement, the spacer is defined as an insulator. (Space portion followability) In the bonding method of this embodiment, the space portion followability of the spacer is preferably bonded at 50% or more, more preferably 60% or more, and more preferably 70% or more. , What's more, to become more than 80% to join. In particular, the greater the followability of the space part of the spacer, the easier it is for the space part to be buried. For example, when the followability of the space part of the spacer is more than 50%, the adhesive for high-frequency induction heating can absorb high-frequency high-frequency in a nearly uniform state, and it is easier to connect the attached body (X) and the high-frequency induction heating Adhesives provide a strong bond in a short time. The upper limit of the followability of the space portion of the spacer is not particularly limited. The upper limit of the followability of the space part of the spacer may be 100% or less. The followability FP of the space portion of the spacer is represented by the following formula 1. S1: When the space part (the space formed by the first surface of the attached body (X) and the spacer) is viewed in a plane, and the spacer is made to follow the front of the attached body (X), corresponding The area of the opening shape in the space of the attached body (X). S2: When the coloring agent is attached to the inner surface of the space and the spacer is deformed to bury the inside of the space, the surface of the spacer between the buried space is the area in plan view where the coloring agent is attached Here, the followability of the space portion of the spacer will be described with reference to the drawings. 5A to 7B are conceptual diagrams illustrating the measurement method of the followability of the space part. The attached body 120C shown in FIGS. 5A to 7B is the attached body as the attached body (X). 5A, 6A, 5B, and 6B show a state in which the first surface of the adherend 120C having the undulating surface faces the spacer 210A and is arranged. 5A and 6A are states before pressurization, FIG. 5A is a plan view viewed from the second surface side of the adherend 120C, and FIG. 6A is a cross-sectional view along AA of FIG. 5A. 5B and 6B are pressurized states, FIG. 5B is a plan view viewed from the second surface side of the adherend 120C, and FIG. 6B is a BB sectional view of FIG. 5B. However, the dotted lines shown in FIGS. 5A and 5B indicate the position of the recess prepared on the first surface side of the adherend 120C, and the positions of the colorant V and the spacer 210A applied inside the recess. Also, as shown in FIGS. 6A and 6B , in FIGS. 5A and 5B , the colorant V adheres to the bottom side of the concave portion forming the space portion 31A (that is, the inner portion surrounded by a dotted line). In FIG. 5A and FIG. 5B , in order to show the positional relationship between the position of the adherend 120C and the position of the spacer 210A, illustration of the colorant V coated on the bottom side of the concave portion is omitted for convenience. As shown in FIGS. 5A to 6B , the adherend 120C has a first surface disposed on the side of the spacer 210A. The first surface of the adherend 120C has an undulating surface having concave portions and convex portions. The concave portion of the attached body 120C has a rectangular opening when the first surface of the attached body 120C is viewed in plan, and a rectangular cross section when viewed in cross-section from the side of the attached body 120C. That is, the first surface of the adherend 120C has a shape of a concave portion surrounded by a rectangular plane and a rectangular cross section. As shown in FIG. 6A , when the first surface of the attached body 120C and the spacer 210A are reset and arranged, a space portion 31A is formed between the concave portion of the attached body 120C and the spacer 210A in a non-pressurized state. . The space portion 31A is divided by the spacer 210A and the concave portion of the attached body 120C. The spatial part followability FP was measured as follows. First, the coloring agent V is previously applied and attached to the entire surface of the inside of the concave portion forming the space portion 31A. The kind of the colorant V is not particularly limited. The coloring agent V is used to suppress the attachment object 120C and the peeling of the coloring agent V to the spacer 210A and improve the adhesion of the coloring agent V. For example, it is preferable to use red ink pad ink for stamps. Next, the spacer 210A is placed toward the first surface of the adherend 120C. Then, for the spacer 210A, pressure is applied toward the attached body 120C. With regard to the spacer 210A, when pressure is applied toward the adherend 120C, the spacer 210A deforms when the pressure is applied, and a part of the spacer 210A is buried in the space portion 31A. The pressure applied to the spacer 210A is not particularly limited, as long as the followability of the space portion of the attached body is 50% or more. An example of the pressure is the pressure when a high-frequency electric field is applied while the adherend (X) and the adhesive for high-frequency induction heating are pressed against the electrodes. Part of the spacer 210 is embedded in the surface of the part inside the space, and the colorant V adhered to the surface inside the space. FIG. 7A is a plan view viewed from the first surface (that is, the side of the space portion) of the adherend 120C. The attached body 120C shown in FIG. 7A is a state before a part of the spacer 210A is followed before the space portion of the attached body 120C, and the state before the coloring agent V is applied to the entire surface inside the concave portion. 7B is a plan view showing the colorant V applied to the entire surface inside the concave portion, followed by the spacer 210A after the adherend 120C, and the surface of the colorant V attached to the spacer 210A taken out from the space portion 31A. The area S1A and the area S1B shown in FIG. 7A are part of the area respectively corresponding to the shape of the opening RO of the space portion 31A of the adherend 120C. The area S2A and the area S2B shown in FIG. 7B are part of the area where the colorant V attached to the surface inside the space portion 31A is attached to the surface of the spacer 210A, respectively. Specifically, it is as follows. First, the colorant V adheres to the inner surface of the space portion 31A, and when the space portion 31A is buried through deformation of the spacer 210A, the colorant V adheres to the surface of the spacer 210A in the portion where the space portion 31A is buried. Next, the pressure to deform the spacer 210A is released, and the attached body 120C and the spacer 210A are separated. After that, the portion of the colorant V adheres to the surface of the spacer 210A in a planar view. Part of the area viewed from the plane is area S2A and area S2B. The area S2A and the area S2B are respectively shown in FIG. 7B, and correspond to the part of the substantially zigzag shape to which the coloring agent V adheres. Then, the followability FP of the space portion is represented by the percentage of the total area (S2) of the area S2A and the area S2B divided by the total area (S1) of the area S1A and the area S1B according to the aforementioned formula 1. <Adhesive for high-frequency induction heating> The adhesive for high-frequency induction heating used in the bonding method related to this embodiment contains a thermoplastic resin (A). The adhesive for high-frequency induction heating may contain a dielectric material in addition to the thermoplastic resin (A), or may not contain a dielectric material. It is preferable that the adhesive for high-frequency induction heating contains a dielectric material from the viewpoint of easily improving the heat generation property of the adhesive for high-frequency induction heating. The dielectric material is not particularly limited, any of dielectric resin and dielectric filler may be used. The dielectric material is from the viewpoint of less deterioration during molding and stable heat generation, for example, dielectric filler (B) is preferable. In this specification, the thermoplastic resin containing the adhesive for high-frequency induction heating used in the bonding method of this embodiment is denoted as thermoplastic resin (A), and the dielectric filler is denoted as dielectric filler (B). situation. (Thermoplastic resin (A)) The kind of the thermoplastic resin (A) is not particularly limited. The thermoplastic resin (A) is, for example, from the viewpoint of being easy to melt and having specific heat resistance, and at least one selected from polyolefin resins, styrene resins, polyoxymethylene resins, polycarbonate resins, Acrylic resins, polyamide resins, polyimide resins, polyvinyl acetate resins, phenoxy resins, and polyester resins are preferably used in groups. Among the high-frequency induction heating adhesives used in the bonding method of this embodiment, the thermoplastic resin (A) is preferably a polyolefin resin or a styrene resin, more preferably a polyolefin resin. When the thermoplastic resin (A) is polyolefin-based resin or styrene-based resin, the adhesive for high-frequency induction heating is easy to melt when a high-frequency electric field is applied, and it is easy to adhere to the bonding method used in this embodiment. Adhesive and attached body (X) for frequency induction heating. In this specification, polyolefin-based resins include polyolefin-based resins having polar moieties and polyolefin-based resins not having polar moieties. When the presence or absence of polar moieties is specified, it is described as polyolefin-based resins having polar moieties or not. Polyolefin-based resins with polar moieties. The thermoplastic resin (A) is preferably a polyolefin-based resin having a polar portion. The thermoplastic resin (A) may be a polyolefin-based resin that does not have a polar portion. [Polyolefin Resin] Examples of the polyolefin resin of the thermoplastic resin (A) include resins obtained from homopolymers of polyethylene, polypropylene, polybutene, and polymethylpentene, and selected α-olefin resin formed from copolymers of monomers such as ethylene, propylene, butene, hexene, octene, and 4-methylpentene. The polyolefin-based resin as the thermoplastic resin (A) may be a single resin or a combination of two or more resins. [Polyolefin-Based Resin Having a Polar Site] The polar site of the polyolefin-based resin having a polar site is not particularly limited as long as it is a site that can impart polarity to the polyolefin-based resin. In addition, it is preferable that the adhesive for high-frequency induction heating contains a polyolefin-based resin having a polar part as the thermoplastic resin (A), and the dielectric properties are easily improved, and the adhesive force to the adherend (X) is also improved. . The polyolefin-based thermoplastic resin having a polar portion may be a copolymer of an olefin-based monomer and a monomer having a polar portion. In addition, the polyolefin-based thermoplastic resin having a polar part may be a resin introduced into an olefin-based polymer obtained by polymerization of an olefin-based monomer through an additional reaction or the like to modify the polar part. The kind of olefin-based monomer constituting the polyolefin-based resin having a polar portion is not particularly limited. Examples of the olefin-based monomer include ethylene, propylene, butene, hexene, octene, and 4-methyl-1-pentene. The olefin-based monomer system may be used alone or in combination of two or more types. The olefin-based monomer is preferably at least either ethylene or propylene from the viewpoint of excellent mechanical strength and stable adhesive properties. The olefin-derived olefin unit of the polyolefin-based resin having a polar portion is preferably a constituent unit derived from ethylene or propylene. Examples of the polar site include a hydroxyl group, a carboxyl group, a vinyl acetate structure, and an acid anhydride structure. Examples of the polar portion include acid-modified structures introduced into polyolefin-based resins through acid-modification, and the like. As the acid-modified structure of the polar part, it is a part introduced through an acid-modified thermoplastic resin (such as polyolefin resin). As the compound used when acid-modified thermoplastic resin (for example, polyolefin-based resin), it can be listed from any one of unsaturated carboxylic acid, anhydride of unsaturated carboxylic acid, and ester of unsaturated carboxylic acid unsaturated carboxylic acid derivatives. In this specification, a polyolefin-based resin having an acid-modified structure may be referred to as an acid-modified polyolefin-based resin. Examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, and citraconic acid. Examples of the anhydride of unsaturated carboxylic acid include anhydrides of unsaturated citraconic acid such as anhydrous maleic acid, anhydrous itaconic acid, and anhydrous citraconic acid. Examples of esters of unsaturated carboxylic acids include methyl acrylate, ethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, dimethyl maleate, mono Methyl ester, dimethyl fumarate, diethyl fumarate, dimethyl itaconate, diethyl itaconate, dimethyl citraconate, diethyl citraconate, and methyltetrahydro Esters of unsaturated carboxylic acids such as dimethyl phthalic anhydride, etc. (Dielectric Filler (B)) The dielectric filler (B), which is a preferable material for the dielectric material, will be described. The dielectric filler (B) is a filler that generates heat by application of a high-frequency electric field. A high-frequency electric field is an electric field whose direction is reversed at high frequencies. The dielectric filler (B) is preferably a filler that generates heat when a high-frequency electric field with a frequency range above 3 MHz and below 300 MHz is applied. The dielectric filler (B) is preferably a filler that generates heat through the application of a high-frequency electric field with a frequency of 13.56MHz, 27.12MHz, or 40.68MHz in the frequency range of 3MHz to 300MHz. Dielectric filler (B) zinc oxide, silicon carbide (SiC), anatase mold titanium oxide, barium titanate, barium zirconate titanate, lead titanate, potassium niobate, rutile type titanium oxide, hydrated silicic acid Aluminum, an inorganic material having crystal water such as hydrated aluminosilicate of alkali metal, or an inorganic material having crystal water such as hydrated aluminosilicate of alkaline earth metal, etc., alone or in combination of two or more are suitable. The dielectric filler (B) is viewed from the viewpoint of higher exothermic properties, preferably containing at least any one selected from the group consisting of zinc oxide, silicon carbide, barium titanate and titanium oxide, more preferably at least any one selected from Grouped from zinc oxide, barium titanate and titanium oxide. Among the exemplified dielectric fillers, there are extremely rich types, which can be selected from various shapes and sizes, so that the adhesive properties and mechanical properties of the adhesive for high-frequency induction heating can be improved according to the application. The dielectric filler (B) is more preferably Zinc oxide. By using zinc oxide as the dielectric filler (B), a colorless adhesive for high-frequency induction heating can be obtained. Zinc oxide is part of the dielectric filler, and its density is low, so when using a high-frequency induction heating adhesive containing zinc oxide as the dielectric filler (B), it is easier to bond the attached body (X) than to use other adhesives containing zinc oxide. When using the adhesive of the electric filler, the total weight of the structure is difficult to increase. Zinc oxide is contained in ceramics, so the hardness is not too high, so it is not easy to damage the manufacturing device of the adhesive for high-frequency induction heating. Since zinc oxide is an inactive oxide, even if it is blended with a thermoplastic resin, there is little damage to the thermoplastic resin. Also, at least any one of titanium oxide-based anatase-type titanium oxide and rutile-type titanium oxide is preferable as the dielectric filler (B), and anatase is more preferable from the viewpoint of excellent dielectric properties. type titanium oxide. The volume content of the dielectric filler (B) in the adhesive for high frequency induction heating is preferably at least 5 vol %, more preferably at least 8 vol %, more preferably at least 10 vol %. The volume content of the dielectric filler (B) in the adhesive for high-frequency induction heating is preferably not more than 50% by volume, more preferably not more than 40% by volume, more preferably not more than 35% by volume, and even more preferably not more than 25% by volume the following. When the volume content of the dielectric filler (B) in the adhesive for high-frequency induction heating is 5% by volume or more, it is easy to improve heat generation, and the adhesive for high-frequency induction heating can be strongly bonded to the adherend (X). When the volume content of the dielectric filler (B) in the adhesive for high-frequency induction heating is 50% by volume or less, the strength of the adhesive can be prevented from decreasing. As a result, the use of the adhesive can prevent the decrease in joint strength. In addition, when the adhesive for high-frequency induction heating used in the bonding method of this embodiment is an adhesive sheet, the volume content of the dielectric filler (B) in the adhesive sheet is 50% by volume or less. Because of the flexibility of the sheet, it is easy to prevent the toughness from decreasing, and it is easy to process the adhesive sheet for high-frequency induction heating into the desired shape in the subsequent process. However, when the adhesive for high-frequency induction heating used in the bonding method of this embodiment contains thermoplastic resin (A) and dielectric filler (B), the thermoplastic resin (A) and dielectric filler (B) ), the volume content of the dielectric filler (B) is preferably at least 5% by volume, more preferably at least 8% by volume, and more preferably at least 10% by volume. With respect to the total volume of the thermoplastic resin (A) and the dielectric filler (B), the volume content of the dielectric filler (B) is preferably 50% by volume or less, preferably 40% by volume or less, and more preferably 35% by volume. Volume % or less, even less than 25 volume %. The volume average particle diameter of the dielectric filler (B) is preferably 1 μm or more, more preferably 2 μm or more, more preferably 3 μm or more. The volume average particle diameter of the dielectric filler (B) is preferably 30 μm or less, more preferably 25 μm or less, more preferably 20 μm or less. When the volume average particle diameter of the dielectric filler (B) is 1 μm or more, the adhesive for high-frequency induction heating exhibits high heat generation performance when a high-frequency electric field is applied, and can be strongly adhered to the adherend (X) in a short time . When the volume-average particle diameter of the dielectric filler (B) is 30 μm or less, the adhesive for high-frequency induction heating exhibits high heat generation performance when a high-frequency electric field is applied, and can be firmly adhered to the adherend (X) in a short time . Also, when the adhesive for high-frequency induction heating used in the bonding method of this embodiment is an adhesive sheet, when the volume average particle diameter of the dielectric filler (B) is 30 μm or less, the adhesive sheet for high-frequency induction heating can be prevented The intensity decreases. The volume average particle diameter of the dielectric filler (B) is measured by the following method. The particle size distribution of the dielectric filler (B) was measured by the laser diffraction/scattering method, and the volume average particle diameter was calculated from the result of the particle size distribution measurement in accordance with JIS Z 8819-2:2001. <Additives> The adhesive for high-frequency induction heating used in the bonding method according to this embodiment may or may not contain additives. When the high-frequency induction heating adhesive used in the bonding method of this embodiment contains additives, examples of additives include tackifiers, plasticizers, waxes, colorants, oxidation inhibitors, ultraviolet absorbers, and antibacterial agents. , coupling agent, viscosity modifier, organic filler, and inorganic filler, etc. Organic fillers and inorganic fillers used as additives are different from dielectric materials (dielectric fillers). The tack-imparting agent and plasticizer can improve the melting properties and adhesive properties of the adhesive for high-frequency induction heating. Examples of tackifiers include rosin derivatives, polyterpene resins, aromatic-modified terpene resins, hydrogenated aromatic-modified terpene resins, terpene-phenol resins, coumarone-indene resins, fatty Petroleum resins, aromatic petroleum resins, and hydrogenated aromatic petroleum resins. Examples of plasticizers include petroleum-based rubber processing oils, natural oils, dialkyl dichloro acids, and low-molecular-weight liquid polymers. Examples of petroleum-based rubber processing oils include alkane-based rubber processing oils, naphthenic-based rubber processing oils, and aromatic-based rubber processing oils. Examples of natural oils include castor oil, tall oil, and the like. Examples of dialkyl dichloro-acids include dibutyl phthalate, dioctyl phthalate, and dibutyl adipate. As a low molecular weight liquid polymer, liquid polybutene, liquid polyisoprene, etc. are mentioned, for example. When the adhesive for high-frequency induction heating used in the bonding method of this embodiment contains additives, the content of the additive in the adhesive for high-frequency induction heating is generally based on the total amount of the adhesive for high-frequency induction heating The base is preferably at least 0.01% by mass, more preferably at least 0.05% by mass, more preferably at least 0.1% by mass. In addition, the content of the additive in the adhesive for high-frequency induction heating is preferably 20% by mass or less, more preferably 15% by mass or less, more preferably 10% by mass or less. It is preferable that the high-frequency induction heating adhesive used in the bonding method of this embodiment does not contain a solvent. In the case of an adhesive for high-frequency induction heating that does not contain a solvent, it is difficult to cause problems of VOC (Volatile Organic Compounds) in the adhesive used for adhesion to the adherend (X). It is preferable that the adhesive for high-frequency induction heating used in the bonding method of this embodiment does not contain carbon or a carbon compound (for example, carbon black, etc.) as a main component of carbon, and a conductive substance such as metal. The high-frequency induction heating adhesive used in the bonding method of this embodiment does not contain, for example, carbon steel, α iron, γ iron, δ iron, copper, iron oxide, brass, aluminum, iron-nickel alloy, iron- Nickel-chromium alloy, carbon fiber and carbon black are preferred. When the adhesive for high-frequency induction heating used in the bonding method of this embodiment contains a conductive substance, the content of the conductive substance in the adhesive is each independently based on the total amount of the adhesive. It is preferably at most 7% by mass, more preferably at most 6% by mass, more preferably at most 5% by mass, still more preferably at most 1% by mass, still more preferably at most 0.1% by mass. The content of the conductive substance in the adhesive is preferably 0% by mass. When the content of the conductive substance in the adhesive is 7% by mass or less, it is easy to prevent electrical insulation damage and carbonization of the adhesive part and the adherend (X) during induction heating. In the high-frequency induction heating adhesive used in the bonding method of this embodiment, the total content of the thermoplastic resin (A) and the dielectric filler (B) is preferably 80% by mass or more, more preferably 90% by mass Above, more preferably at least 93% by mass, still more preferably at least 95% by mass, still more preferably at least 99% by mass. The shape of the adhesive for high-frequency induction heating used in the bonding method of this embodiment is not particularly limited, but it is preferably in the form of a sheet. That is, it is preferable to use the adhesive for high-frequency induction heating used in the bonding method of this embodiment as an adhesive sheet (sometimes called an adhesive sheet for high-frequency induction heating). The time for the manufacturing process of the structure can be further shortened by using the adhesive for high-frequency induction heating as an adhesive sheet. The sheet-like adhesive for high-frequency induction heating may be in the shape of a frame-shaped sheet having an opening penetrating from one of the opposing surfaces toward the other. There may be one opening. Or there may be two or more. The sheet-like adhesive for high-frequency induction heating may not have the opening. (Dielectric Characteristics) The dielectric characteristics (tanδ/ε'r) of the adhesive for high-frequency induction heating used in the bonding method of this embodiment will be described. The dielectric property (tanδ/ε'r) of the adhesive for high-frequency induction heating used in the joining method related to this embodiment is 0.005 or more. (tanδ is the loss tangent at 23°C and frequency 40.68MHz, ε'r is the relative permittivity at 23°C and frequency 40.68MHz). When the dielectric property of the adhesive for high-frequency induction heating is 0.005 or more, the adhesive for high-frequency induction heating tends to generate heat during induction heating, and the adhesive for high-frequency induction heating and the adherend (X) can be easily bonded together. To strengthen the joint in a short time. The dielectric property of the high-frequency induction heating adhesive used in the bonding method of this embodiment is preferably 0.008 or higher, more preferably 0.010 or higher. When the dielectric property of the adhesive for high-frequency induction heating used in the bonding method of this embodiment is 0.008 or more, the adhesive for high-frequency induction heating is more likely to generate heat during induction heating, and high-frequency induction heating can be easily performed. Use an adhesive to bond strongly with the attached body (X) in a short time. The upper limit of the dielectric properties of the high-frequency induction heating adhesive used in the bonding method of this embodiment is not particularly limited. The dielectric property of the high-frequency induction heating adhesive used in the bonding method of this embodiment may be, for example, 0.1 or less, 0.08 or less, or 0.05 or less. The dielectric properties of the adhesive for high-frequency induction heating can satisfy, for example, not less than 0.005 and not more than 0.1. When the dielectric property of the adhesive for high-frequency induction heating is 0.1 or less, it is easy to suppress overheating, and it is difficult to cause damage to the contact portion of the adherend (X) and the adhesive for high-frequency induction heating. The method for measuring the dielectric properties (tanδ/ε'r) of the adhesive for high-frequency induction heating is the same as that described above for the dielectric properties (tanδ/ε'r) of the spacer. However, in the measurement of the dielectric properties (tanδ/ε'r) of the adhesive for high-frequency induction heating, when there is a need to obtain a thin piece of the adhesive for high-frequency induction heating from the structure, by cutting from the structure Cut out and cut out to obtain thin slices for measuring uniform thickness. For non-flaked adhesives such as agglomerated high-frequency induction heating adhesives, it is sufficient to thin them with a hot press to obtain thin sheets for measurement. The thickness of the high-frequency induction heating adhesive used in the bonding method of this embodiment is preferably 5 μm or more, more preferably 10 μm or more, more preferably 30 μm or more, especially 50 μm or more. When the thickness of the adhesive sheet is 5 μm or more, the heat generation of the adhesive sheet in contact with the adherend (X) can be improved when high-frequency application is applied, and the adhesive sheet and the adherend (X) can be easily strengthened in a short time clinging. Also, when bonding with the adherend (X), the adhesive sheet can easily follow the shape of the second surface of the adherend, and the adhesive strength can be easily found. The upper limit of the thickness of the adhesive sheet is not particularly limited. The more the thickness of the adhesive sheet is increased, the weight of the whole structure obtained by adhering the adhesive sheet and the attached body (X) will also increase. For this reason, the thickness of the adhesive sheet is preferably within a range in which there is no problem in practical use such as processability and usability. Considering the practicability and formability of the adhesive sheet for high-frequency induction heating, the thickness of the adhesive sheet used in the bonding method of this embodiment is preferably 2000 μm or less, more preferably 1000 μm or less, more preferably 600 μm or less. The adhesive sheet used as an adhesive for high-frequency induction heating is easier to handle than a liquid adhesive that needs to be applied, and the workability of bonding with the adherend (X) can also be improved. In addition, the adhesive sheet used as an adhesive for high-frequency induction heating can properly control the thickness of the sheet. For this reason, the adhesive sheet can be applied to the roll-to-roll method, and can be matched with the adhesive area of the second surface of the attached body (X) and the area of the second side of the attached body (X) through draft processing, etc. Shape, process the adhesive sheet into any area and shape. For this reason, an adhesive sheet as an adhesive for high-frequency induction heating has great advantages from the viewpoint of manufacturing engineering. (Form of Adhesive for High-frequency Induction Heating) The shape of the adhesive for high-frequency induction heating used in the joining method related to this embodiment is not particularly limited, but it is preferably in the form of a sheet. That is, it is preferable to use the adhesive for high-frequency induction heating used in the bonding method of this embodiment as an adhesive sheet (sometimes called an adhesive sheet for high-frequency induction heating). The time for the manufacturing process of the structure can be further shortened by using the adhesive for high-frequency induction heating as an adhesive sheet. The adhesive for high-frequency induction heating used in the bonding method of this embodiment is constituted by only one adhesive layer of the adhesive sheet for high-frequency induction heating used in the bonding method of this embodiment. When the adhesive for high-frequency induction heating is an adhesive sheet for high-frequency induction heating made of only one layer of the adhesive layer, the adhesive layer is equivalent to (the bonding layer itself) the adhesive sheet for high-frequency induction heating, and the high-frequency induction heating The shape and characteristics of the adhesive sheet are equivalent to those of the bonding layer. Adhesive sheets for high-frequency induction heating are preferably made of only a single adhesive layer. That is, it is preferable to use an adhesive sheet for high-frequency induction heating in which the adhesive for high-frequency induction heating used in the joining method according to this embodiment is only a single adhesive layer. Accordingly, the thickness of the adhesive sheet for high-frequency induction heating can be reduced, and the adhesive sheet for high-frequency induction heating can be easily formed. The adhesive sheet for high-frequency induction heating is made of only one layer of the adhesive layer that is adhesive for high-frequency induction heating. In this specification, the term "adhesive sheet for high-frequency induction heating" and the term "adhesive layer" Depending on the situation, they can be substituted for each other. The adhesive for high-frequency induction heating used in the bonding method of this embodiment is not limited to the form of an adhesive sheet for high-frequency induction heating consisting of only one adhesive layer. In other forms of the adhesive for high-frequency induction heating, an adhesive layer for high-frequency induction heating may be provided in advance on at least one surface of the adherend. 8A to 8C are schematic diagrams of adhesives for high-frequency induction heating used in the bonding method related to this embodiment, and illustrate plural forms. The adhesive 11A for high-frequency induction heating shown in FIG. 8A is an adhesive sheet 12 composed of only a single adhesive layer. Attached body 14 with high-frequency induction heating adhesive shown in FIG. The adhesive 11A for frequency induction heating is integrally provided on the attached body 120A. The attached body 120 includes a first surface and a second surface, the first surface has an undulating surface, and the second surface does not have an undulating surface. The adhesive 11A for high-frequency induction heating is provided in direct contact with the second surface of the adherend 120A. Attached body 14 with adhesive for high-frequency induction heating can be separately prepared adhesive 11A for high-frequency induction heating and bonded with attached body 120A to form a whole. The second surface of the attached body 120A may be integrally provided with an adhesive 11A for high-frequency induction heating. The attached body 120 is made of the same material as that described above in the material of the attached body. The adherend 16 with the adhesive for high-frequency induction heating shown in FIG. 8C is equipped with the adhesive 11A for high-frequency induction heating as an adhesive layer, and the adherend 110A, and the adhesive 11A for high-frequency induction heating is integrated. Provided on the attached body 110A. 110 A of to-be-attached bodies do not have an undulating surface on both a 1st surface and a 2nd surface. The adhesive 11A for high-frequency induction heating is provided in direct contact with the surface of the adhered body 110A that does not have the undulating surface. Attached body 16 with adhesive for high-frequency induction heating can be separately prepared adhesive 11A for high-frequency induction heating, and attached to body 110A to be bonded together. The flat surface of the attached body 110A may be integrally provided with an adhesive 11A for high-frequency induction heating. The attached body 110A is made of the same material as that described above in the material of the attached body. However, in the above-mentioned disposition process, the adhesive 11A for high-frequency induction heating is disposed on the adherend 120A, or on the surface opposite to the electrode side disposed on the adherend 110A. In addition, when the high-frequency induction heating adhesive is composed of only a single adhesive layer of the high-frequency induction heating adhesive 11A, in the above-mentioned arrangement process, the high-frequency induction heating adhesive 11A is separately arranged, and the attached body (X) (for example, the attached body 120A). On the other hand, when the adhesive for high-frequency induction heating is integrally provided on the adherend, in the above-mentioned disposition process, it is sufficient to arrange the adherend 14 with the adhesive for high-frequency induction heating. Also, when using the attached body 16 with an adhesive for high-frequency induction heating, in the aforementioned disposition process, dispose the attached body (X) (for example, the attached body 120A) and the adhesive with high-frequency induction heating. The attached body 16 of the agent can be used. In any case, the first surface of the adherend (X) is arranged facing the side opposite to the high-frequency induction heating adhesive 11A. (Thickness) When the high-frequency induction heating adhesive used in the bonding method of this embodiment is an adhesive sheet made of only one layer of the adhesive layer, the thickness of the adhesive sheet used in the bonding method of this embodiment is 5 μm or more Preferably, it is more than 10 μm, more preferably more than 30 μm, especially more than 50 μm. When the thickness of the adhesive sheet is 5 μm or more, the heat generation of the adhesive sheet in contact with the adherend (X) can be improved when high-frequency application is applied, and the adhesive sheet and the adherend (X) can be easily strengthened in a short time clinging. In addition, when bonding with the adherend (X), the adhesive sheet is easy to follow the second surface of the adherend (X), and the adhesive strength is easily found. When the adhesive sheet is an adhesive of an attached body with an adhesive for high-frequency induction heating, the thickness of the adhesive layer is preferably 5 μm or more, more preferably 10 μm or more, more preferably 30 μm or more, especially 50 μm or more. In the case of the adhesive of the attached body with the adhesive for high-frequency induction heating, when the thickness of the adhesive layer is 5 μm or more, and when bonding with the attached body, the adhesive layer is easy to follow the adhesive layer on which the attached body is installed The surface of the surface is easy to find the adhesive strength. The upper limit of the thickness of the adhesive sheet is not particularly limited. The more the thickness of the adhesive sheet is increased, the weight of the whole structure obtained by adhering the adhesive sheet and the attached body (X) will also increase. For this reason, the thickness of the adhesive sheet is preferably within a range in which there is no problem in practical use such as processability and usability. Considering the practicability and formability of the adhesive sheet for high-frequency induction heating, the thickness of the adhesive sheet used in the bonding method of this embodiment is preferably 2000 μm or less, more preferably 1000 μm or less, more preferably 600 μm or less. The upper limit of the thickness of the adhesive sheet is not related to the composition of only one layer of the adhesive layer, but to any of the multi-layer constructions of a plurality of layers including the adhesive layer, preferably the above-mentioned value. The adhesive sheet used as an adhesive for high-frequency induction heating is easier to handle than a liquid adhesive that needs to be applied, and the workability of bonding with the adherend (X) can also be improved. In addition, the adhesive sheet used as an adhesive for high-frequency induction heating can properly control the thickness of the sheet. For this reason, the adhesive sheet can be applied to the roll-to-roll method, and can be matched with the adhesive area of the second surface of the attached body (X) and the area of the second side of the attached body (X) through draft processing, etc. Shape, process the adhesive sheet into any area and shape. For this reason, an adhesive sheet as an adhesive for high-frequency induction heating has great advantages from the viewpoint of manufacturing engineering. The adhesive for high-frequency induction heating used in the bonding method of this embodiment is preferably used by applying a high-frequency electric field in a so-called short-wave to ultra-short-wave frequency band (for example, 3 MHz or more and 300 MHz or less). When a high-frequency electric field in this frequency band is applied, the depth of heat that can be heated is deep, and heat generation when high-frequency application is applied can be improved. Therefore, even when the thickness of the adhesive for high-frequency induction heating is thick, the adhesive sheet and the adherend (X) can be easily bonded firmly in a short time. (Manufacturing method of adhesive for high-frequency induction heating) The adhesive for high-frequency induction heating used in the joining method related to this embodiment is manufactured by mixing the above-mentioned components, for example. When using the adhesive sheet for high-frequency induction heating in the bonding method of this embodiment, for example, the above-mentioned components are preliminarily mixed, kneaded using a known kneading device such as an extruder and a hot roller, and then extruded. It is produced by known forming methods such as forming, calender forming, injection forming and casting forming. Adhesives for high-frequency induction heating are superior in water resistance and moisture resistance compared to ordinary adhesives. The high-frequency induction heating adhesive used in the bonding method of this embodiment is locally heated by application of a high-frequency electric field. Therefore, when the adhesive for high-frequency induction heating is used in the bonding method of this embodiment, it is easy to prevent damage to the entire attachment (X) during bonding with the attachment (X). [Modification of Embodiment] The present invention is not limited to the foregoing embodiment. The present invention includes modifications and improvements within the scope of attaining the purpose of the present invention. However, in the bonding method of this embodiment, the direction of pressurization when the space portion is buried through the deformation of the spacer is not particularly limited. The direction of pressurization is preferably along the lamination direction of the adherend (X) and the spacer, and when the lamination is arranged in the longitudinal direction of the adherend (X) and the spacer, it is along the lamination direction (longitudinal direction). direction) is a direction along the stacking direction (lateral direction) when it is laminated in the lateral direction of the adherend (X) and the spacer. The pressure treatment may be performed by applying pressure from both sides where the adherend (X) and the spacer are placed, or by fixing one side and applying pressure from the other side. Here, the vertical direction means, for example, a direction along the direction of gravity, and the horizontal direction means a direction along a direction perpendicular to the direction of gravity. In addition, in the bonding method of this embodiment, the pressurizing means when the space is buried through the deformation of the spacer is an example of a pressurizing mechanism having an electrode of a high-frequency induction heating device, but it is not limited to this pressurizing means. . The pressurization means can be pressurized by hand, for example, press by the self-weight of the electrode of the high-frequency induction heating device without a pressurization mechanism, and pressurization of a device with a pressurization mechanism other than a high-frequency induction heating device The means are also available. EXAMPLES Hereafter, an Example is given and this invention is demonstrated in more detail. The present invention is not limited to these examples. <Preparation of adhesive for high-frequency induction heating> Prepare the thermoplastic resin (A) and dielectric filler (B) shown below so that the thermoplastic resin (A) becomes 80% by volume and the dielectric filler (B) It becomes the ratio of 20% by volume and weighed separately. Next, prepare to mix the thermoplastic resin (A) and the dielectric filler (B). Supply the pre-mixed thermoplastic resin (A) and dielectric filler (B) to the hopper of a 30mmφ two-axis extruder, set the temperature of the cylinder at 180°C to 230°C, and the temperature of the extrusion die at 230°C , Melting and kneading ready-to-mix materials. After cooling the melted and kneaded material, cut the material to make granular granules. Then, put the granulated granules into the hopper of a single-axis extruder with a T-die head to form an extrusion die with a cylinder temperature of 200°C. At a temperature of 200°C, extrude a film-shaped molten kneaded product from a T-die, cool it through a cooling roller, and produce a sheet-shaped adhesive for high-frequency induction heating with a thickness of 0.4mm (high-frequency induction heating adhesive sheet AS1 ). (Thermoplastic resin (A)) Polypropylene resin (Nippon Polypropylene Co., Ltd., NOVATEC PPMH4, polypropylene homopolymer, melting point: 165°C) (Dielectric filler (B)) ZnO: Zinc oxide (Sakai Chemical Co., Ltd. Industrial Co., Ltd., product name "LP-ZINC11") (Volume Average Particle Size of Dielectric Filler) The particle size distribution of the dielectric filler was measured by the laser diffraction and scattering method. From the results of the particle size distribution measurement, the volume average particle diameter was calculated in accordance with JIS Z 8819-2:2001. The calculated volume average particle diameter of zinc oxide (ZnO) was 11 μm. (Dielectric properties) The produced high-frequency induction heating adhesive sheet was cut into a size of 30mm×30mm. For cutting the high-frequency induction heating adhesive sheet, use the RF impedance material analyzer E4991A (manufactured by Agilent), install the dielectric material test fixture 16453A (manufactured by Agilent), and use the parallel plate method at 23 ℃ The frequency is 40.68 Under the condition of MHz, the relative permittivity (ε'r) and loss tangent (tanδ) were measured respectively. Based on the measurement results, the value of the dielectric property (tanδ/ε'r) was calculated. The dielectric property (tanδ/ε'r) of the high-frequency induction heating adhesive sheet is 0.011. <Preparation of Attached Object> As attached objects, a first attached object WK1 and a second attached object WK2 shown below were prepared. <First to-be-attached body WK1> As the first to-be-attached body WK1, a block-shaped first to-be-attached body WK1 made of polypropylene resin as shown in FIGS. 9A and 9B was produced. The first adherend WK1 has a first surface having an undulating surface having concave portions and convex portions, and a second surface opposite to the first surface does not have an undulating surface. 9A and 9B are schematic diagrams showing the first attached body WK1 used in the example. FIG. 9A is a plan view viewed from the second surface side of the first attached body WK1, and FIG. 9B is a side view viewed from the longitudinal direction side of the first attached body WK1. The width dimension W of the first attached body WK1 in the short side direction is 20 mm. The length dimension L2 of the convex portion of the first attached body WK1 is 15 mm, and the length dimension L1 of the concave portion of the first attached body WK1 is 10 mm. Therefore, the length dimension in the longitudinal direction of the first attached body WK1 is 60 mm. The maximum height difference D between the convex part and the concave part of the first attached body WK1 is 5mm. <Second to-be-attached body WK2> As the second to-be-attached body WK2, a polypropylene resin sheet (20 mm in width, 60 mm in length, and 0.4 mm in thickness) was prepared. <Preparation of spacer> As a spacer, prepare silicone rubber, putty (inactive chemical synthetic resin), and polytetrafluoroethylene (PTFE) (marked as iron in Table 1) with the thickness shown in Table 1. Fluorolon (registered trademark). (Dielectric properties) Cut the spacer into a size of 30mm in length and 30mm in width. For the cut-off spacer, use RF Impedance Material Analyzer E4991A (manufactured by Agilent) to install dielectric Material testing fixture 16453A (manufactured by Agilent Corporation), using the parallel plate method, under the condition of 23°C and frequency 40.68MHz, respectively measure the relative permittivity (ε'r) and loss tangent (tanδ). According to the measurement results , Calculate the value of the dielectric properties (tanδ/ε'r). However, when the thickness of the spacer exceeds 2mm, adjust it to a thickness of 2mm or less through cutting or grinding, and then measure it. (Insulation) According to JIS K 6911: 1995 , to measure the volume resistivity of the spacer. Let the measurement voltage be 500V, and when the volume resistivity exceeds 1×10 8 Ω·cm one minute after the start of the measurement, it is defined as an insulator. (Space part followability) Used for bonding The spacer and the first attached body WK1. On the surface of the inner surface of the concave part of the first attached body WK1, apply red ink pad ink for stamps, and place the first attached body WK1 and the spacer facing each other. Then, under the pressure condition of the high-frequency induction heating described later, the concave portion of the first adherend WK1 is pressed against the surface of the spacer. Next, the spacer is removed from the first adherend WK1. However, the condition of the pressure is set as a pressure at which the followability of the space part of the spacer used in Example 1 and Example 2 becomes 80% or more. Let the space part formed by the concave part of the first adherend WK1 When viewed in plan, let the total area of the opening shape of the space corresponding to the first attached body WK1 be S1 in a state where the spacer follows the front of the first attached body WK1. The deformation, when the interior of the space is buried, let the surface of the spacer between the parts of the buried space and the area where the coloring agent is adhered to when viewed in a plane be the total of S2. According to the aforementioned formula 1, by ordering S2 , divided by the percentage of S1, to obtain the followability of the space part. ・Evaluation criteria for the followability of the space part A: 80% or more. B: 50% or more and less than 80%. F: Less than 50%. <Example 1~3 and Comparative Example 1> Cut out the high-frequency induction heating adhesive sheet AS1 into a size of 20 mm in width and 10 mm in length, and place it on the No. Between the electrodes of the 1st electrode and the 2nd electrode, a spacer cut into a size of 20 mm in width and 60 mm in length is arranged. On the spacer, the first adhered body WK1, the high-frequency induction heating adhesive sheet AS1, and the second 2. The attached body WK2 is sequentially stacked and arranged. Then, the spacers thus arranged, the first attached body WK1, the high-frequency induction heating adhesive sheet AS1, and the second attached body WK2 are fixed on a high-frequency 2 electrodes of induction heating device. In a fixed state, a high-frequency electric field is applied under the following high-frequency application conditions, and the adhesive sheet for high-frequency induction heating and the adherend are adhered to prepare a test piece for bondability evaluation. The pressing pressure when the high-frequency electric field is applied is the initial setting value of the pressure applied to the adhesive sheet. Fig. 10 is a schematic side view showing a test piece for bondability evaluation. As shown in Figure 10, the high-frequency induction heating adhesive sheet AS1 is disposed between the first attached body WK1 and the second attached body WK2, and the high-frequency induction heated adhesive sheet AS1 is disposed between the first attached body WK1 and the second attached body WK2. Between the surface of the attached body WK1 opposite to the surface of the most second end E1B side of the concave portion, and the surface of the second attached body WK2 facing the second end E2B side. That is, the high-frequency induction heating adhesive sheet AS1 disposed between the first adherend WK1 and the second adherend WK2 is disposed from the second end E1B side of the first adherend WK1 toward the The range of the initial convex portion on the side of the first end portion E1A. [Conditions for applying high-frequency electric field] Frequency: 40.68MHz Output: 150W Pressing pressure: 62kPa (jointness evaluation) The measurement of joint strength is based on JIS Z 0237:2000. The measurement of joint strength is specifically to use a tensile testing machine. In the test piece for joint evaluation shown in FIG. 10, fix the first end E1A side of the first attachment WK1, The 180° peeling of the first end E2A side of the attachment WK2 moving upward was measured. Bondability Evaluation When producing test pieces for bondability evaluation, measure the time required for high-frequency induction heating until a bond strength of 1N/20mm or more is obtained. [Evaluation Criteria] A: The time until the bonding strength of 1N/20mm or more is obtained is less than 30 sec. B: The time until the joint strength of 1N/20mm or more is obtained is 30 sec or more and less than 60 sec. F: Even when high-frequency induction heating is performed for 60 sec or more, the joint strength is less than 1N/20mm. Each example is compared with comparative example 1, and the evaluation of joint property is all excellent. From the above results, the bonding method of the present embodiment can firmly bond the adherend having the undulating surface in a short time.

11:高頻感應加熱用黏著劑 11A:高頻感應加熱用黏著劑 12:黏著薄片 14:被附著體 16:被附著體 31:空間部 31A:空間部 50:感應加熱裝置 51:第1高頻電場施加電極、 52:第2高頻電場施加電極 53:高頻電源 100:構造體 110:第1被附著體 120:第2被附著體 120B:被附著體 120C:被附著體 120D:被附著體 121A:凸部 121B:凸部 121C:凸部 122A:凸部 122B:凸部 122C:凸部 122D:凸部 123A:凹部 123B:凹部 123C:凹部 124A:凹部 124B:凹部 124C:凹部 124D:凹部 125:第1面 127:第2面 210:間隔件 210A:間隔件 AS1:高頻感應加熱黏著薄片 S1A:面積 S1B:面積 S2A:面積 S2B:面積 WK1:第1之被附著體 WK2:第2之被附著體 L1:長度尺寸 L2:長度尺寸 E1A:第1端部 E1B:第2端部 E2A:第1端部 E2B:第2端部 D:最大高低差 T:頂部T 11: Adhesive for high frequency induction heating 11A: Adhesive for high frequency induction heating 12: Adhesive flakes 14: Attached body 16: Attached body 31: Department of Space 31A: Department of Space 50: Induction heating device 51: the first high-frequency electric field application electrode, 52: The second high-frequency electric field application electrode 53: High frequency power supply 100: Construct 110: The first attached body 120: The second attached body 120B: attached body 120C: attached body 120D: Attached body 121A: convex part 121B: convex part 121C: convex part 122A: convex part 122B: convex part 122C: convex part 122D: convex part 123A: concave part 123B: concave part 123C: concave part 124A: concave part 124B: concave part 124C: concave part 124D: concave part 125: side 1 127: Side 2 210: spacer 210A: spacer AS1: High frequency induction heating adhesive sheet S1A: Area S1B: Area S2A: Area S2B: Area WK1: the first attached body WK2: The second attached body L1: length dimension L2: length dimension E1A: 1st end E1B: 2nd end E2A: 1st end E2B: 2nd end D: Maximum height difference T: top T

[圖1]係說明關於本實施形態之接合方法之一例的概略圖。 [圖2]係說明關於本實施形態之接合方法之一例的概略圖。 [圖3]係說明關於本實施形態之接合方法之一例的概略圖。 [圖4A]係表示使用於關於本實施形態之接合方法之被附著體之一例的剖面圖。 [圖4B]係表示使用於關於本實施形態之接合方法之被附著體之一例的剖面圖。 [圖5A]係說明空間部追隨性之測定方法的概念圖。 [圖5B]係說明空間部追隨性之測定方法的概念圖。 [圖6A]係說明空間部追隨性之測定方法的概念圖。 [圖6B]係說明空間部追隨性之測定方法的概念圖。 [圖7A]係說明空間部追隨性之測定方法的概念圖。 [圖7B]係說明空間部追隨性之測定方法的概念圖。 [圖8A]係使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之概略圖。 [圖8B]係使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之概略圖。 [圖8C]係使用於關於本實施形態之接合方法之高頻感應加熱用黏著劑之概略圖。 [圖9A]係實施例所使用之第1之被附著體WK1之概略圖。 [圖9B]係實施例所使用之第1之被附著體WK1之概略圖。 [圖10]係表示接合性評估用之試驗片之側面之概略圖。 [ Fig. 1 ] is a schematic diagram illustrating an example of a joining method related to this embodiment. [ Fig. 2 ] is a schematic diagram illustrating an example of a joining method related to this embodiment. [ Fig. 3 ] is a schematic diagram illustrating an example of a joining method related to this embodiment. [ Fig. 4A ] is a cross-sectional view showing an example of an adherend used in the bonding method according to this embodiment. [ Fig. 4B ] is a cross-sectional view showing an example of an adherend used in the bonding method according to this embodiment. [FIG. 5A] is a conceptual diagram for explaining the measurement method of the tracking property of the space part. [FIG. 5B] is a conceptual diagram for explaining the measurement method of the tracking property of the space part. [FIG. 6A] is a conceptual diagram illustrating a method of measuring the followability of the space part. [FIG. 6B] is a conceptual diagram illustrating a method of measuring the followability of the space part. [FIG. 7A] is a conceptual diagram illustrating a method of measuring the followability of the space part. [ Fig. 7B ] is a conceptual diagram illustrating a method of measuring the followability of the space part. [ Fig. 8A ] is a schematic diagram of an adhesive for high-frequency induction heating used in the bonding method of this embodiment. [ Fig. 8B ] is a schematic diagram of an adhesive for high-frequency induction heating used in the bonding method of this embodiment. [ Fig. 8C ] is a schematic diagram of an adhesive for high-frequency induction heating used in the bonding method of this embodiment. [ Fig. 9A ] is a schematic diagram of the first attached body WK1 used in the embodiment. [ Fig. 9B ] is a schematic diagram of the first attached body WK1 used in the embodiment. [ Fig. 10 ] is a schematic side view showing a test piece for bondability evaluation.

11:高頻感應加熱用黏著劑 11: Adhesive for high frequency induction heating

31:空間部 31: Department of Space

50:感應加熱裝置 50: Induction heating device

51:第1高頻電場施加電極 51: The first high-frequency electric field application electrode

52:第2高頻電場施加電極 52: The second high-frequency electric field application electrode

53:高頻電源 53: High frequency power supply

110:第1被附著體 110: The first attached body

120:第2被附著體 120: The second attached body

210:間隔件 210: spacer

Claims (15)

一種接合方法，使用高頻感應加熱用黏著劑，接合被附著體之接合方法中，具有配置感應加熱裝置之電極、前述被附著體及間隔件之配置工程、 和於前述高頻感應加熱用黏著劑，施加高頻電場，接合前述被附著體之高頻電場施加工程； 前述被附著體係具備具有起伏面之第1面； 前述高頻感應加熱用黏著劑係包含熱可塑性樹脂； 於前述配置工程中， 配置前述被附著體及前述間隔件時，於前述被附著體之前述第1面、和對向於該第1面之前述間隔件之面之間，形成空間部， 前述空間部係經由前述間隔件之變形加以埋沒。 A bonding method that uses an adhesive for high-frequency induction heating to bond an adherend, comprising the steps of arranging the electrodes of the induction heating device, the aforementioned adherend and the spacer, And the above-mentioned high-frequency induction heating adhesive, applying a high-frequency electric field, and bonding the above-mentioned high-frequency electric field application process of the attached body; The aforementioned adhered system has a first surface with undulating surfaces; The aforementioned high-frequency induction heating adhesive system includes a thermoplastic resin; In the aforementioned configuration project, When arranging the aforementioned attached body and the aforementioned spacer, a space portion is formed between the aforementioned first surface of the aforementioned attached body and the surface of the aforementioned spacer facing the first surface, The aforementioned space portion is buried by deformation of the aforementioned spacer. 如請求項1記載之接合方法，其中，前述空間部係對於前述被附著體及前述間隔件，以前述電極加壓之時，經由前述間隔件之變形加以埋沒。The bonding method according to claim 1, wherein the space portion is buried by deformation of the spacer when the adherend and the spacer are pressurized by the electrode. 如請求項1或2記載之接合方法，其中，前述高頻電場施加工程中， 將前述被附著體與前述高頻感應加熱用黏著劑，邊以前述電極加壓，邊施加高頻電場，接合前述被附著體。 The bonding method according to claim 1 or 2, wherein, in the aforementioned high-frequency electric field application process, The adherend and the adhesive for high-frequency induction heating are bonded together by applying a high-frequency electric field while applying pressure with the electrodes. 如請求項1或2記載之接合方法，其中，於前述配置工程中， 各別配置前述高頻感應加熱用黏著劑，和被附著體。 The bonding method described in claim 1 or 2, wherein, in the aforementioned configuration process, The above-mentioned adhesive for high-frequency induction heating and the attached body are respectively arranged. 如請求項1或2記載之接合方法，其中，於前述配置工程中， 前述被附著體之前述第1面則朝向與前述高頻感應加熱用黏著劑相反側加以配置。 The bonding method described in claim 1 or 2, wherein, in the aforementioned configuration process, The said 1st surface of the said to-be-adhered body is arrange|positioned facing the side opposite to the said adhesive agent for high-frequency induction heating. 如請求項1或2記載之接合方法，其中，於前述配置工程中， 配置2個以上之被附著體，至少1個之被附著體係具備前述第1面之前述被附著體。 The bonding method described in claim 1 or 2, wherein, in the aforementioned configuration process, Two or more adherends are arranged, and at least one adherend system has the aforementioned adherend on the first surface. 如請求項1或2記載之接合方法，其中，前述被附著體之前述起伏面中，前述起伏面之起伏之最大高低差為1mm以上。The bonding method according to claim 1 or 2, wherein, in the undulating surface of the adherend, the maximum height difference of the undulation of the undulating surface is 1 mm or more. 如請求項1或2記載之接合方法，其中，前述被附著體之前述第1面之起伏則具備凹部與凸部，令前述被附著體之前述第1面以平面視之時，佔據於前述第1面之前述凹部之面積比例為20%以上，不足100%。The bonding method as described in claim 1 or 2, wherein the undulation of the first surface of the aforementioned object to be attached is provided with a concave portion and a convex portion, so that when the first surface of the aforementioned object to be attached is viewed in a plane, it occupies the The ratio of the area of the aforementioned concave portion on the first surface is 20% or more and less than 100%. 如請求項1或2記載之接合方法，其中，前述間隔件之厚度係對於備於前述被附著體之前述第1面之前述起伏面之前述起伏之最大高低差，為50%以上。The joining method according to claim 1 or 2, wherein the thickness of the spacer is 50% or more of the maximum height difference of the undulation of the undulation surface provided on the first surface of the adherend. 如請求項1或2記載之接合方法，其中，前述間隔件之介電特性(tanδ/ε’r)為0.003以下； (tanδ係23℃且頻率40.68MHz之損耗正切、ε’r係23℃且頻率40.68MHz之相對電容率)。 The joining method according to claim 1 or 2, wherein the dielectric properties (tanδ/ε’r) of the spacer are 0.003 or less; (tanδ is the loss tangent at 23°C and frequency 40.68MHz, ε'r is the relative permittivity at 23°C and frequency 40.68MHz). 如請求項1或2記載之接合方法，其中，前述間隔件係絕緣體。The bonding method according to claim 1 or 2, wherein the spacer is an insulator. 如請求項1或2記載之接合方法，其中，使下述數式1表示之前述間隔件之空間部追隨性FP成為50%以上，進行接合； S1：令前述被附著體之前述空間部以平面視之時，在令前述間隔件追隨於前述被附著體前之狀態下，對應於前述被附著體之前述空間部之開口形狀之面積 S2：於前述空間部之內部之表面，附著著色劑，經由前述間隔件之變形，埋沒前述空間部之內部時，於埋沒前述空間部之部分之前述間隔件之表面，令前述著色劑所附著之以平面視之面積。 The bonding method according to claim 1 or 2, wherein the bonding is performed so that the space part followability FP of the spacer represented by the following formula 1 becomes 50% or more; S1: When the aforementioned space portion of the aforementioned attached body is viewed in a plan view, the area S2 corresponding to the opening shape of the aforementioned space portion of the aforementioned attached body in the state where the aforementioned spacer follows the front of the aforementioned attached body: When the coloring agent is attached to the surface inside the space portion and the spacer is deformed to bury the inside of the space portion, the coloring agent is attached to the surface of the spacer part buried in the space portion. The area viewed from the plane. 如請求項1或2記載之接合方法，其中，前述高頻感應加熱用黏著劑係更包含經由高頻電場之施加而發熱之介電材料。The bonding method according to claim 1 or 2, wherein the adhesive for high-frequency induction heating further includes a dielectric material that generates heat through application of a high-frequency electric field. 如請求項13記載之接合方法，其中，前述介電材料係介電填料(B)， 前述介電填料(B)係至少1種選自由氧化鋅、碳化矽、氧化鈦及鈦酸鋇所成群。 The bonding method according to claim 13, wherein the dielectric material is a dielectric filler (B), The aforementioned dielectric filler (B) is at least one kind selected from the group consisting of zinc oxide, silicon carbide, titanium oxide and barium titanate. 如請求項1或2記載之接合方法，其中，前述高頻感應加熱用黏著劑之介電特性(tanδ/ε’r)為0.005以上， (tanδ係23℃且頻率40.68MHz之損耗正切、ε’r係23℃且頻率40.68MHz之相對電容率)。 The bonding method according to Claim 1 or 2, wherein the dielectric property (tanδ/ε'r) of the adhesive for high-frequency induction heating is 0.005 or more, (tanδ is the loss tangent at 23°C and frequency 40.68MHz, ε'r is the relative permittivity at 23°C and frequency 40.68MHz).
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