JP2004222990A - Bonding method for footwear, and footwear - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding method for footwear capable of saving labor in a working process and improving appearance of the footwear by improving the conventional process where an adhesive is applied on both of faces to be bonded to carry out adhesion by at least one face coating, and the footwear prepared by using this method. <P>SOLUTION: The bonding method for the footwear is characterized by coating at least one face to be bonded of an object to be bonded with a water-based adhesive, laminating the faces to be bonded, and bonding the laminated faces by high frequency induction heating while the laminated faces are pressed. The footwear containing a stuck part bonded by using this method is provided. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【００３９】
表１において、「接着状態」は、ＪＩＳ Ｋ ６８５４「接着剤のはく離接着強さ試験方法」のＴ型はく離試験に準拠して行い確認した。試験機の引張速度（クロスヘッドの移動速度）は毎分５０ｍｍとした。なお、接着剤のはみ出しの有無は目視観察にて行った。
【００４０】
表１の実施例１，２，４，５に示すように、胛部には透湿性があるが、底部には透湿性が無い場合には接着剤の乾燥を行うことなく底部への接着剤塗布のみで良好に接着し、上記接着性能試験において材料破壊が得られた。また、表１の実施例３に示すように、胛部も透湿性が無い場合には、あらかじめ接着剤を乾燥して行えば良好な接着が得られた。 また、表１の実施例４に示すように、透湿性胛部を用いる場合も接着剤塗布後数分程度放置乾燥しても良好に接着することができ、また靴の種類による影響もなかった。いずれの場合も接着剤のはみ出しはなかった。
【００４１】
【発明の効果】
以上説明したように、請求項１記載の発明よれば、水性接着剤を履物の被接着面の少なくとも片面にのみに塗布しても、押圧下、重ね合わせた被接着面を高周波誘電加熱して接着することにより、被着物は十分な接着が得られることから、接着部分の接着剤のはみ出しを簡単に無くすことができ、また従来のように被接着面の重ね合わせのタイミングを計る必要もないので、従来の接着方法に比べ、作業工程を省力化でき、且つ履物の美観を向上させうる。
【００４２】
また、請求項３記載の発明によれば、水性接着剤を胛部と底部の被接着面の少なくとも片面にのみ塗布しても、押圧下、重ね合わせた被接着面を高周波誘電加熱して接着することにより、胛部と底部との十分な接着が得られる。したがって、この場合も、請求項１記載の発明と同様に、接着部分の接着剤のはみ出しを簡単に無くすことができ、また従来のように被接着面の重ね合わせのタイミングを計る必要もないので、従来の接着方法に比べ、作業工程を省力化でき、且つ履物の美観を向上させうる。
【００４３】
また、請求項２，４記載の発明によれば、少なくとも被接着面の一方の側において、その材料を透湿性にしており、水性接着剤を被接着面の少なくとも片面に塗布し、水性接着剤を予め乾燥することなくそのまま被接着面を重ね合わせ高周波誘電加熱を行えば、十分な接着が得られる。これは、重ね合わせ面を押圧しつつ、高周波誘電加熱を行う際、接着剤が他の面に浸透又は移行し、接着剤を両面に塗布した状態に近くなること、高周波誘電加熱による発熱量は物質固有の損失係数に比例するため、水のように非常に大きな損失係数を有するものは発熱量が大きくなり透湿性材料を通じて速やかに蒸発し、迅速に乾燥することが相俟って達成されると考えられる。なお、被接着面の水性接着剤を予め乾燥して用いてもよいのは勿論である。
【００４４】
更に、請求項１〜４記載の発明によれば、いずれも水性接着剤を使用しているので、有機溶剤を含有する接着剤を使用する場合に比べ、火気に対する危険性が極めて少なく、又人体や環境へ悪影響を与えない良好な作業環境が確保される。
【００４５】
請求項５記載の発明によれば、この履物の接着は、前記請求項１記載の発明の接着方法で行われており、作業工程を省力化でき、且つ履物の美観を向上させうるので、本発明の履物は、省力化に対応するコスト安が実現でき、見栄えがよく、かつ水性接着剤を用いているので、人体や環境に悪影響を与えないメリットを有する。
【図面の簡単な説明】
【図１】図１は本発明に係る接着方法の一実施の形態の概要を示す図であって、（Ａ１）は接着後靴型５を装着したまま電極６，６間から取り出した靴の側面図であり、（Ａ２）は接着後靴型５を装着したまま電極６，６間から取り出した靴の背面図であり、（Ｂ１）は電極６，６間に胛部１と底部２とを靴型５と圧着型３を介して挟持し押圧しながら高周波誘電加熱する際の状態を示す側面図であり、（Ｂ２）は電極６，６間に胛部１と底部２とを靴型５と圧着型３を介して挟持し高周波誘電加熱して接着する際の状態を示す背面図である。
【図２】図２は本発明に係る接着方法の他の実施の形態の概要を示す図であって、（Ａ１）は接着後靴型５を装着したまま電極６，６間から取り出した靴の側面図であり、（Ａ２）は接着後靴型５を装着したまま電極６，６間から取り出した靴の背面図であり、（Ｂ１）は電極６，６間に胛部１と底部２とを靴型５と圧着板４を介して挟持し押圧しながら高周波誘電加熱する際の状態を示す側面図であり、（Ｂ２）は電極６，６間に胛部１と底部２とを靴型５と圧着板４を介して挟持し高周波誘電加熱する際の状態を示す背面図である。
【符号の説明】
１；胛部、２；底部、３；ウレタン樹脂製圧着型、４；ウレタン樹脂製圧着板、５；アルミニュウム製靴型、６；高周波誘電加熱装置の電極。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a bonding method, and more particularly, to a method of bonding footwear having a large shape repulsion and being difficult to bond, and a footwear having a bonded portion bonded by using this method.
[0002]
[Prior art]
There are various joining methods for footwear, depending on the site, shape, material, application, etc. Among them, the cement type is a very simple method of bonding with an adhesive without sewing with a thread, and mass production is possible It is still the mainstream as a revolutionary method that has greatly contributed to the spread of footwear such as shoes.
[0003]
According to this method, a contact adhesive is applied to both surfaces of a surface to be bonded of a portion to be bonded, and a solvent is dried. For example, in the case of bonding the upper and the bottom, which are the parts to be bonded of shoes, the bonded surface of the upper and the bottom may be used alone or in combination with physical treatment such as buffing, degreasing with an organic solvent, and primer treatment. After applying the adhesive uniformly on both sides of the treated surface using a brush, brush, etc., and drying the solvent at room temperature or by heating, the applied surfaces of the adhesive are overlapped. , Press and bond. At the time of superposition, depending on the working environment and the type of the adhesive, it is necessary to heat the surface of the adhesive to enhance the contact property, which is important in performing sufficient bonding.
[0004]
At this time, if the heating is performed too much, the cohesive force of the adhesive is reduced, so that it becomes impossible to withstand repulsion due to the shape of the adherend after bonding. Conversely, if the heating is insufficient, or if the surface temperature of the adhesive is lowered after being left after heating, it is said that any excess or deficiency in heating, such as insufficient contactability, will cause poor adhesion. There was a problem.
[0005]
In recent years, attention has been paid to water-based adhesives in consideration of the effects of organic solvents on the human body and the environment, and they have begun to be used.However, when this water-based adhesive is used, in addition to the above problems, it is difficult to dry water. , And you have to expend considerable time and energy. If the drying is insufficient, the cohesive force of the adhesive is not sufficiently exhibited, so that when an adherend having a shape repulsion such as footwear is bonded, the adhesive layer cannot withstand the repulsion. The thread becomes stringy or ruptures, resulting in an open mouth and insufficient adhesion.
[0006]
In addition, when the temperature is low or the humidity is high, no matter which solvent (organic solvent or water) is used, sufficient tackiness cannot be obtained due to insufficient tack or dew condensation. In this case, it is necessary to pay attention to the surface temperature of the adhesive and to determine the timing of the superposition. Furthermore, if the shape of the surface to be bonded becomes more complicated, for example, in the case of bonding shoes, a complex shaped shell is required. It is very difficult to overlap the adhesive surfaces applied to the bottom and the bottom without displacement, and if the adhesive applied to the limb is excessive (adhesive height) than the adhesive, the adhesive will be protruded, Conversely, when the amount is too small (low glue), a gap is formed between the shell and the bottom. In the former case, the appearance of the adhesive is impaired due to the protrusion of the adhesive, and in the latter case, the adhesion is insufficient.
[0007]
It should be noted that the present invention uses high-frequency dielectric heating as described later, and there are prior art documents related to this point (Patent Documents 1 and 2). However, these materials prevent leakage of water from the seam by injecting and filling hot-melt adhesive fluidized by high-frequency dielectric heating into the needle hole of the seam of the footwear manufactured by stitching, and special members and structures. In the moisture permeable shoe having the above, the high-frequency fusion welding of the ground part of the shoe and the waterproof and moisture permeable diaphragm is performed without using an adhesive, and the aqueous adhesive as in the present invention is not used.
[0008]
[Patent Document 1]
Japanese Patent No. 3253305 (page 1)
[Patent Document 2]
Japanese Unexamined Patent Publication No. 11-513852 (page 4, FIG. 7)
[0009]
[Problems to be solved by the invention]
Therefore, the present invention solves the above various problems, and (1) the conventional method of applying and bonding an adhesive to both surfaces to be bonded can be performed by applying only at least one of the surfaces to be bonded. (2) An object of the present invention is to provide a method for bonding footwear that enables bonding without paying special attention to the timing of superposition, and to provide a footwear using this method for at least a part thereof. .
[0010]
[Means for Solving the Problems]
In order to achieve this object, as a result of intensive studies, a new bonding method using an aqueous adhesive and high-frequency dielectric heating has been conceived, and using this bonding method, at least one side of the bonded surface of footwear such as shoes is used. It has been found that the adhesive can be sufficiently adhered by applying a water-based adhesive to the resin and that the adhesive can be adhered without giving special consideration to the timing of superposition, and the present invention has been completed.
[0011]
That is, the invention according to claim 1 of the present invention is characterized in that an aqueous adhesive is applied to at least one of the adhered surfaces of the adhered portion, the adhered surfaces are overlapped, and the high-frequency dielectric is pressed while pressing the overlapped surface. This is a method for bonding footwear, wherein the bonding is performed by heating.
[0012]
Here, the part to be bonded is not particularly limited as long as it is a part of the footwear that requires bonding. For example, the upper part and the bottom part of the footwear, the lamination of the bottom part, the string part and the bottom part of the sandals, and the like are exemplified. "To at least one of the surfaces to be bonded" means that an adhesive may be applied to one of the two surfaces to be bonded (hereinafter, referred to as one surface), but is not limited thereto. Instead, it may be applied to both of the two surfaces to be bonded. The superposed surface may be pressed by applying a pressure higher than that which prevents poor adhesion due to a difference in the shape of the two adherends to be bonded during high-frequency dielectric heating. Preferably 1.5 kgf / cm ² -10kgf / cm ² It is about. Pressing may be in a state where pressure is applied, and is a concept including pressurizing, pressing, compressing, and the like.
[0013]
The aqueous adhesive used in the present invention refers to an adhesive using water as a medium, and refers to an adhesive which is an emulsion or an aqueous solution. Further, the present invention is not limited to the contact type adhesives conventionally used. Examples of such adhesives include aqueous solutions such as urea-based, phenol-based, and polyvinyl alcohol, and aqueous emulsions such as vinyl acetate, ethylene vinyl acetate, acrylic, urethane, styrene-butadiene rubber, chloroprene rubber, and nitrile rubber. It is preferable to use an aqueous emulsion-type adhesive containing urethane, chloroprene rubber, acrylic, or the like as a main component. The form to be used is not particularly limited, and may be a one-pack type, two-pack type or other type of adhesive.
[0014]
With the above configuration, at least one side of the portion to be bonded is made to have a moisture-permeable property as in the invention according to claim 2 to secure moisture permeability from the bonding surface to the outside, or by some other method. Even if the water-based adhesive is applied only to at least one of the surfaces to be bonded of the footwear, if the water-permeable adhesive is applied to at least one of the surfaces to be bonded, the water-based adhesive is not dried in advance and the surfaces to be bonded are overlapped and pressed. If high frequency dielectric heating is performed, sufficient adhesion can be obtained. Since the water-based adhesive is bonded by applying high-frequency dielectric heating under pressure by superimposing the surfaces to be bonded after application, it does not need to be dried in advance, and even when the temperature is low or the humidity is high, the temperature of the adhesive surface and There is no need to measure the timing of superposition in consideration of dew condensation or the like. Furthermore, since it is sufficient to apply the coating to at least one surface, it is possible to easily prevent the adhesive from protruding from the bonding portion. Therefore, as compared with the conventional bonding method, the work process can be saved and the aesthetic appearance of the footwear can be improved.
[0015]
Sufficient adhesive strength can be obtained by applying the adhesive only on one side because (1) the adhesive permeates or migrates to the other surface when high-frequency dielectric heating is performed while pressing the overlapping surface. (2) Since the amount of heat generated by high-frequency dielectric heating is proportional to the loss coefficient inherent to the substance, those having a very large loss coefficient, such as water, generate a large amount of heat. It is believed that both can be quickly evaporated through the moisture permeable portion, and that the adhesive is dried quickly.
[0016]
Even in the case where the material to be bonded is not moisture permeable and the surface to be bonded has little moisture permeability, apply the water-based adhesive to at least one side of the surface to be bonded of the footwear and stick the water-based adhesive in advance. If it is dried to an extent that it is not excessive, the surfaces to be bonded are overlapped, and high-frequency dielectric heating is performed, sufficient bonding can be obtained. In this case as well, after applying and drying the water-based adhesive, the surfaces to be bonded are superimposed and bonded by applying high-frequency dielectric heating under pressure, so even when the temperature is low or the humidity is high, the temperature and dew condensation on the surface of the adhesive must be considered. There is no need to measure the timing of superposition. In addition, since the adhesive is applied only on at least one side and the adhesive is also dried, the adhesive does not protrude from the adhesive portion during heating. Therefore, as compared with the conventional bonding method, the work process can be saved and the aesthetic appearance of the footwear can be improved.
[0017]
Even if the water-based adhesive applied only on one side is dried to the extent that it is not tacky in advance, sufficient adhesion is obtained because the adhesive component and remaining water are heated by high-frequency dielectric heating while pressing the overlapping surface. However, it is considered that the adhesive is sufficiently softened, and the adhesive applied on one side functions sufficiently as an adhesive on the other side.
[0018]
In addition, in the case where the moisture permeability is secured or not secured in the part to be adhered, even if the adhesive is applied to both surfaces, the amount of application can be reduced as compared with the conventional method, so that the amount can be easily adjusted and sufficient adhesive force can be obtained. It is a matter of course that the protrusion of the adhesive portion can be easily eliminated while ensuring the above.
[0019]
The invention according to claim 3 of the present invention is characterized in that a water-based adhesive is applied to at least one of the bonded surface of the shoe upper and the bottom, the bonded surfaces are overlapped, and the high frequency is applied while pressing the bonded surface. A shoe bonding method characterized by bonding by performing dielectric heating.
[0020]
Here, the adhesive may be applied to at least one of the upper part and the bottom surface to be bonded, and the adhesive may be applied to one surface of the lower part and the lower surface to be bonded, but not limited to this. It means that it may be applied to both sides of the bottom surface to be bonded. The pressing of the superposed surfaces may be performed by applying a pressure higher than that which prevents poor adhesion due to a difference in shape between the two adherends to be bonded at the time of high-frequency dielectric heating. Preferably 1.5 kgf / cm ² -10kgf / cm ² It is about. Pressing may be in a state where pressure is applied, and is a concept including pressurizing, pressing, compressing, and the like.
[0021]
The aqueous adhesive used in the present invention refers to an adhesive using water as a medium, and refers to an adhesive which is an emulsion or an aqueous solution. Further, the present invention is not limited to the contact type adhesives conventionally used. Examples of such adhesives include aqueous solutions such as urea-based, phenol-based, and polyvinyl alcohol, and aqueous emulsions such as vinyl acetate, ethylene vinyl acetate, acrylic, urethane, styrene-butadiene rubber, chloroprene rubber, and nitrile rubber. It is preferable to use an aqueous emulsion-type adhesive containing urethane, chloroprene rubber, acrylic, or the like as a main component. The form to be used is not particularly limited, and may be a one-pack type, two-pack type or other type of adhesive.
[0022]
According to the above construction, the water-based adhesive can be applied to at least one side only if the cross section is made to be moisture-permeable as in the invention of claim 4 or if the moisture permeability from the bonding surface to the outside is secured by some method. Even if the water-based adhesive is not dried in advance and the high-frequency dielectric heating is performed by superimposing the upper and lower surfaces to be bonded as they are, sufficient bonding can be obtained. Since the water-based adhesive is bonded by applying high-frequency dielectric heating under pressure after superimposing the surfaces to be bonded after application, it does not need to be dried in advance, and even when the temperature is low or the humidity is high, the temperature or condensation on the surface of the adhesive There is no need to measure the timing of superposition in consideration of the above. Furthermore, since it is sufficient to apply the coating to at least one surface, it is possible to easily prevent the adhesive from protruding from the bonding portion. Therefore, as compared with the conventional bonding method, the work process can be saved and the aesthetic appearance of the footwear can be improved.
[0023]
Sufficient adhesive strength can be obtained by applying adhesive only on one side because the adhesive permeates or migrates to the other side when high-frequency dielectric heating is performed while pressing the overlapping surface, and the adhesive is applied to both sides. Since it becomes close to the applied state and the calorific value due to high-frequency dielectric heating is proportional to the loss coefficient inherent to the substance, those with a very large loss coefficient, such as water, have a large calorific value and quickly pass through the moisture-permeable portion. It is believed that evaporation and rapid drying are achieved in combination.
[0024]
Even when the material of the shell and the bottom is non-moisture permeable and the moisture permeability is hardly secured on the surface to be bonded, even if the water-based adhesive is applied to at least one side only, dry the water-based adhesive beforehand so that it is not sticky. If the surfaces to be bonded are overlapped with each other and high-frequency dielectric heating is performed, a sufficient bonding force can be obtained. In this case as well, after applying and drying the water-based adhesive, the surfaces to be bonded are superimposed and bonded by applying high-frequency dielectric heating under pressure, so even when the temperature is low or the humidity is high, the temperature and dew condensation on the surface of the adhesive must be considered. There is no need to measure the timing of superposition. In addition, since the adhesive is applied only on at least one side and the adhesive is also dried, the adhesive does not protrude from the adhesive portion during heating. Therefore, as compared with the conventional bonding method, the work process can be saved and the aesthetic appearance of the footwear can be improved.
[0025]
Even when the water-based adhesive is dried in advance, sufficient adhesive strength is obtained by applying the adhesive only on one side because the adhesive component and the remaining water are obtained by high-frequency dielectric heating while pressing the overlapping surface. This is considered to be achieved because heat is generated, the adhesive is sufficiently softened, and the adhesive applied on one side functions sufficiently as an adhesive on the other side.
[0026]
In addition, in the case where the moisture permeability is secured or not secured in the part to be adhered, even if the adhesive is applied to both surfaces, the amount of application can be reduced as compared with the conventional method, so that the amount can be easily adjusted and sufficient adhesive force can be obtained. It is a matter of course that the protrusion of the adhesive portion can be easily eliminated while ensuring the above.
[0027]
In the invention according to claim 5 of the present invention, the high-frequency dielectric heating is performed by applying an aqueous adhesive to at least one of the surfaces to be bonded of the bonded portions, overlapping the surfaces to be bonded, and pressing the surface to be bonded. It is a footwear including an adhesive part which is adhered by performing.
[0028]
Here, the meanings of "the part to be bonded", "at least one of the surfaces to be bonded", "pressing of the superposed surface", and "water-based adhesive" are as described in the description of the first aspect of the present invention. The bonding in this case can save the work process as compared with the conventional bonding method, for example, it is possible to easily eliminate the protrusion of the adhesive at the bonding portion for the reason described in the description of the invention according to claim 1. In addition, since the footwear of the present invention can be improved in appearance, the footwear of the present invention is low in cost and has a good appearance, and has an advantage of not adversely affecting the human body and the environment since the water-based adhesive is used.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiment.
FIG. 1 is a diagram showing an outline of an embodiment of a method for bonding footwear according to the present invention. (A1) is a side view of the shoe taken out from between the electrodes 6 and 6 with the last 5 attached, and (A2) is a shoe taken out from between the electrodes 6 and 6 with the last 5 attached. FIG.
(B1) is a side view showing a state in which high-frequency dielectric heating and bonding are performed while holding and pressing the shell 1 and the bottom 2 between the electrodes 6 and 6 via the shoe last 5 and the crimping die 3, (B2) is a rear view showing a state where the shell 1 and the bottom 2 are sandwiched between the electrodes 6 and 6 via the shoe last 5 and the crimping mold 3 to perform high-frequency dielectric heating.
FIG. 2 is a diagram showing an outline of another embodiment of the method for bonding footwear according to the present invention. (A1) is a side view of the shoe taken out from between the electrodes 6 and 6 with the last 5 attached, and (A2) is a shoe taken out from between the electrodes 6 and 6 with the last 5 attached. FIG.
(B1) is a side view showing a state in which high-frequency dielectric heating and bonding are performed while sandwiching and pressing the shell 1 and the bottom 2 between the electrodes 6 and 6 via the shoe last 5 and the pressing plate 4, (B2) is a rear view showing a state in which the shell 1 and the bottom 2 are sandwiched between the electrodes 6 and 6 via the shoe last 5 and the crimping plate 4 to perform high-frequency dielectric heating.
[0030]
{Circle around (1)} In the above embodiment, the high-frequency dielectric heating device (Yamamoto Vinita Co., Ltd.) used for high-frequency dielectric heating has a press function between the electrodes 6 and 6, and the distance between the electrodes and the pressure are reduced. Use one that can be adjusted freely.
{Circle around (2)} The shoe last 5 (last) of the shell 1 which has electrical conductivity and serves as a pressing jig for bonding to the bottom 2 is attached to the one electrode 6. The other electrode 6 does not cause adhesion failure due to deformation of the bottom portion or bias of pressure generated at the time of pressing, further fills the space and gap between the bottom portion 2 and the electrode, and efficiently performs high-frequency dielectric heating. A urethane resin crimping die 3 having a shape that can be fitted without a gap or a urethane resin crimping plate 4 when the bottom 2 has a shape close to a flat plate is attached.
{Circle around (3)} As the adhesive, it is preferable to use a one-part or two-part type adhesive which is a non-flammable aqueous adhesive as a main component and which has been adjusted to an appropriate viscosity which is easy to apply and hardly sags. Among them, urethane-based aqueous emulsion-type adhesives (for example, No. 4960 manufactured by Nortape Kogyo Co., Ltd.), acrylic-based aqueous emulsion-type adhesives (for example, No. 4680 manufactured by Nortape Kogyo Co., Ltd.), chloroprene rubber-based aqueous emulsion A mold adhesive (for example, No. 4040 manufactured by Notape Industry Co., Ltd.) or the like is preferably used.
{Circle around (4)} The upper 2 attached to the last 5 by hanging or sewing is attached to one of the electrodes 6, and an aqueous adhesive is applied to the bottom 2 with a brush or the like. Is attached to the urethane resin crimping die 3 or the urethane resin crimping plate 4 which is the electrode of (1).
(5) Then, the upper part 1 and the bottom part 2 are 2 kgf / cm. ² ~ 5kgf / cm ² Adhesion is performed by high-frequency dielectric heating while pressing with a moderate pressure.
[0031]
By bonding as described above, in the high-frequency dielectric heating bonding between the shell and the bottom, when a material having moisture permeability only for the shell is used, the adhesive is only applied to the bottom without drying the adhesive. , Good adhesion was obtained in which a material breakage at the blade or the bottom occurred without peeling off from the adherend in a performance test described later. In the case where a material having no moisture permeability was used for the cross section, the same adhesion was obtained by drying the adhesive applied to the bottom in advance. In the case where the shell had moisture permeability, even when left for several minutes after the application of the adhesive, the adhesion was similarly good. In each case, the adhesive did not protrude and the appearance was not impaired.
[0032]
In the case of a permeable porcelain, sufficient adhesive strength can be obtained even if the pre-applied adhesive is pressed and heated without drying, because the adhesive applied to the bottom surface to be adhered is It is considered that this is due to the fact that the state is close to a state where the adhesive penetrates into the surface to be bonded and the adhesive is applied to both surfaces, and that the moisture is quickly evaporated by high frequency dielectric heating.
If the shell is not moisture-permeable and the bottom is not moisture-permeable, the moisture will not be sufficiently evaporated. Therefore, the adhesive is in a sticky state, but if the adhesive is dried and bonded in advance, the adhesive is not applied because the adhesive component and remaining moisture generate heat due to high-frequency dielectric heating and the adhesive is softened. We think that we adhere to surface.
[0033]
【Example】
Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited to these Examples.
(Example 1)
After the buffing treatment, an aqueous urethane-based adhesive (Notape Kogyo Co., Ltd. (Notape Kogyo Co., Ltd.) No. 4960 / curing agent U-41 = 100 parts by weight / 5 parts by weight, non-volatile content: about 50%) with a brush at about 200 g / m. ² Apply. (1) Immediately after the application of the adhesive, the bottom 2 is fitted into a urethane resin crimping die 3 molded so that the bottom 2 fits without gaps. The surface to be bonded of the natural leather blade 1 from which the skin layer has been scraped off by buffing is superimposed on the adhesive applied surface at the bottom. This was placed between the poles 6 and 6 of the high-frequency dielectric heating and bonding apparatus, and the oscillation frequency was 13.56 MHz, the high-frequency output was 2.94 KW, the anode current was 0.5 A, and the pressing pressure was 3.0 kgf / cm. ² The bonding was performed with an application time of 20 seconds and a cooling time of 20 seconds. The bonded shoes were men's shoes with heels.
[0034]
(Example 2)
In Example 1, except that instead of using the SBR-based vulcanized rubber bottom, a primer-treated (urethane primer SK-5 manufactured by Nortape Kogyo Co., Ltd.) non-breathable urethane foam bottom was used. Bonding was performed under the same conditions.
[0035]
(Example 3)
After the buffing treatment, an aqueous urethane-based adhesive (Notape Kogyo Co., Ltd. (Notape Kogyo Co., Ltd.) No. 4960 / curing agent U-41 = 100 parts by weight / 5 parts by weight, non-volatile content: about 50%) with a brush at about 200 g / m. ² Apply. {Circle around (1)} The urethane resin is molded into a shape in which the bottom 2 coated with the aqueous urethane adhesive is dried for about 10 minutes with a hot air dryer set at 60 ° C. to evaporate the water, and the bottom 2 fits without gaps. (2) Subsequently, after being suspended in an aluminum shoe last, the adhesive portion was subjected to a primer treatment (a primer for urethane SK-5 manufactured by Nortape Kogyo Co., Ltd. SK-5) to provide a non-moisture permeable cap 1 ( The surface to be adhered of the artificial leather Clarino manufactured by Kuraray Co., Ltd. is superposed on the dried adhesive-coated surface of the bottom 2. This was placed between the poles 6 and 6 of the high-frequency dielectric heating and bonding apparatus, and the oscillation frequency was 13.56 MHz, the high-frequency output was 2.94 KW, the anode current was 0.5 A, and the pressing pressure was 3.0 kgf / cm. ² The bonding was performed with an application time of 20 seconds and a cooling time of 20 seconds. The bonded footwear was a heeled men's shoe.
[0036]
(Example 4)
In Example 1, bonding was carried out under the same conditions except that the adhesive was left at room temperature for 5 minutes after application.
[0037]
(Example 5)
After the buffing treatment, an aqueous urethane-based adhesive (Notape Kogyo Co., Ltd. (Notape Kogyo Co., Ltd.) No. 4960 / curing agent U-41 = 100 parts by weight / 5 parts by weight, non-volatile content: about 50%) with a brush at about 200 g / m. ² Apply. (1) Immediately after the application of the adhesive, the bottom 2 is placed on a urethane resin crimping plate 4 having a thickness larger than the size of the bottom 2 and having a thickness of about 10 mm. The skin surface layer of the natural leather blade portion 1 obtained by buffing the skin layer is superimposed on the adhesive applied surfaces 6 and 6 of the bottom portion 2. This was placed between both poles of a high-frequency dielectric heating and bonding apparatus, and the oscillation frequency was 13.56 MHz, the high-frequency output was 2.94 KW, the anode current was 0.5 A, and the pressing pressure was 3.0 kgf / cm. ² The bonding was performed with an application time of 20 seconds and a cooling time of 20 seconds. The bonded shoes were casual shoes having no heel and a flat bottom surface.
[0038]
(Adhesion performance evaluation)
Table 1 shows the results of the performance evaluation of the shoes bonded by the methods of Examples 1 to 5.
[Table 1]

[0039]
In Table 1, the "adhesion state" was confirmed based on the T-peel test of JIS K 6854 "Testing method for adhesive peel strength". The tensile speed (moving speed of the crosshead) of the testing machine was 50 mm per minute. In addition, the presence or absence of the protrusion of the adhesive was visually observed.
[0040]
As shown in Examples 1, 2, 4, and 5 in Table 1, when the upper part has moisture permeability, but the bottom part has no moisture permeability, the adhesive to the bottom is not dried without drying the adhesive. Good adhesion was obtained only by application, and material destruction was obtained in the above adhesion performance test. In addition, as shown in Example 3 of Table 1, when the cross section was not moisture-permeable, good adhesion was obtained by drying the adhesive in advance. In addition, as shown in Example 4 in Table 1, even when a moisture-permeable cap was used, it was possible to adhere well even if left to dry for several minutes after the application of the adhesive, and was not affected by the type of shoes. . In all cases, the adhesive did not protrude.
[0041]
【The invention's effect】
As described above, according to the first aspect of the present invention, even if the aqueous adhesive is applied only to at least one of the surfaces to be bonded of the footwear, under pressure, the superposed surfaces to be bonded are subjected to high-frequency dielectric heating. By adhering, the adherend can be sufficiently adhered, so that the protrusion of the adhesive at the adhered portion can be easily eliminated, and it is not necessary to time the overlapping of the adhered surfaces as in the conventional case. Therefore, as compared with the conventional bonding method, the work process can be saved and the aesthetic appearance of footwear can be improved.
[0042]
According to the third aspect of the present invention, even if the aqueous adhesive is applied only to at least one of the surfaces to be bonded of the cross section and the bottom, the superposed surfaces to be bonded are pressed and pressed by high-frequency dielectric heating. By doing so, sufficient adhesion between the fin and the bottom can be obtained. Therefore, in this case as well, similar to the first aspect of the present invention, it is possible to easily eliminate the protrusion of the adhesive at the bonding portion, and it is not necessary to measure the timing of overlapping the surfaces to be bonded as in the related art. As compared with the conventional bonding method, the work process can be saved, and the aesthetic appearance of footwear can be improved.
[0043]
According to the invention of claims 2 and 4, the material is made permeable to moisture at least on one side of the surface to be bonded, and the aqueous adhesive is applied to at least one surface of the surface to be bonded. If the surfaces to be bonded are superimposed on each other without drying in advance and high-frequency dielectric heating is performed, sufficient bonding can be obtained. This is because when performing high-frequency dielectric heating while pressing the superposed surfaces, the adhesive penetrates or migrates to the other surface and approaches the state where the adhesive is applied to both surfaces, and the amount of heat generated by high-frequency dielectric heating is A substance having a very large loss coefficient, such as water, is proportional to the substance-specific loss coefficient, so that the heat generation becomes large, and the substance is quickly evaporated through the moisture-permeable material and quickly dried, which is achieved together. it is conceivable that. The water-based adhesive on the surface to be bonded may be dried and used in advance.
[0044]
Furthermore, according to the first to fourth aspects of the present invention, since the aqueous adhesive is used, the danger to fire is extremely small as compared with the case where an adhesive containing an organic solvent is used. And a favorable working environment that does not adversely affect the environment.
[0045]
According to the fifth aspect of the present invention, the bonding of the footwear is performed by the bonding method of the first aspect of the present invention, and the work process can be saved and the aesthetic appearance of the footwear can be improved. The footwear of the present invention can realize cost reduction corresponding to labor saving, has good appearance, and has an advantage that it does not adversely affect the human body and the environment since it uses an aqueous adhesive.
[Brief description of the drawings]
FIG. 1 is a diagram showing an outline of an embodiment of a bonding method according to the present invention. FIG. 1 (A1) shows a shoe taken out from between electrodes 6 and 6 with a last 5 attached after bonding. It is a side view, (A2) is a rear view of the shoe taken out from between the electrodes 6 and 6 with the shoe 5 attached after bonding, and (B1) is a back portion 1 and a bottom portion 2 between the electrodes 6 and 6. (B2) is a side view showing a state in which high-frequency dielectric heating is performed while nipping and pressing the shoe via the shoe last 5 and the crimping mold 3; FIG. 5 is a rear view showing a state in which a high-frequency dielectric heating and bonding are carried out while being sandwiched via a crimping die 5 and a crimping die 3;
FIG. 2 is a view showing an outline of another embodiment of the bonding method according to the present invention, wherein (A1) shows a shoe taken out from between the electrodes 6 and 6 with the shoe last attached after bonding. (A2) is a rear view of the shoe taken out from between the electrodes 6 and 6 with the last 5 attached after bonding, and (B1) is a back 1 and a bottom 2 between the electrodes 6 and 6. (B2) is a side view showing a state in which high-frequency dielectric heating is performed while sandwiching and pressing the upper and lower members via a shoe last 5 and a crimping plate 4; It is a rear view which shows the state at the time of holding | gripping via the type | mold 5 and the crimping plate 4, and performing high frequency dielectric heating.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1; Shell part, 2; Bottom part, 3; Urethane resin crimping type, 4; Urethane resin crimping plate, 5; Aluminum shoe type, 6; Electrode of high frequency dielectric heating device.

Claims (5)

A footwear characterized in that an aqueous adhesive is applied to at least one of the adhered surfaces of the adhered portion, the adhered surfaces are overlapped, and the laminated surface is pressed while performing high-frequency dielectric heating to adhere. Bonding method. The method for bonding footwear according to claim 1, wherein one or both of the bonded parts is permeable to moisture. A shoe characterized in that an aqueous adhesive is applied to at least one of the upper and lower surfaces to be bonded, the surfaces to be bonded are superimposed, and high-frequency dielectric heating is performed while pressing the superposed surfaces to bond the shoes. Bonding method. 4. The method for bonding shoes according to claim 3, wherein the upper is permeable. Footwear including an adhesive portion formed by applying an aqueous adhesive to at least one of the surfaces to be adhered of the adhered portion, overlapping the adhered surfaces, and applying high-frequency dielectric heating while pressing the overlapped surface .

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