JP7312539B2 - High frequency dielectric heating adhesive sheet - Google Patents

Description

The present invention relates to a high frequency dielectric heating adhesive sheet.

2. Description of the Related Art Conventionally, in temporary structures for exhibitions, events, studio sets, and the like, a plurality of members are joined by metal joining members such as nails, adhesives, or the like.

Temporary structures that are joined by metal joining members such as nails have problems such as that it takes time to dismantle them and that the members are greatly damaged after dismantling. A member that is severely damaged after being dismantled is treated as a waste material because it is difficult to reuse.

Further, conventionally, a temporary structure that is assembled by bonding with an adhesive cannot be easily separated from each other, so it is pulverized and discarded.
Therefore, there was a problem that the members of the temporary structure could not be reused.

For example, U.S. Pat. No. 6,200,000 describes a method for dismantling adhesive assemblies. In the dismantling method described in Patent Document 1, joints of parts assembled by bonding with a thermoplastic resin composition containing a heating element that generates heat by high-frequency induction are separated by induction heating.

JP-A-2002-144341

The dismantling method described in Patent Document 1 employs a method of heating metal by high frequency induction (high frequency induction heating method). Therefore, when the members (adherends) of the temporary structure are made of metal and when there is metal in the vicinity of the joints, the dismantling method described in Patent Document 1 generates heat, is unsafe, and may damage the adherends.
In addition, the thermoplastic resin composition used in the dismantling method described in Patent Document 1 has the problem that it cannot sufficiently meet the requirements at the site where the temporary structure is used, such as the need to quickly and safely and easily dismantle the firmly bonded temporary structure such as adhesive assembly parts in a short time without damaging the parts.

An object of the present invention is to provide a high-frequency dielectric heating adhesive sheet which can be firmly joined in a short time and which enables a temporary structure in which members are strongly joined together to be safely and easily dismantled in a short time without damaging the members.

According to one aspect of the present invention, there is provided a high-frequency dielectric heating adhesive sheet including a high-frequency dielectric adhesive layer, wherein the high-frequency dielectric heating adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B), and is used for a temporary structure that is separated into a plurality of members at the adhesive surface after use.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, it is preferable that the plurality of members include a first member and a second member, the high-frequency dielectric heating adhesive sheet is sandwiched between the first member and the second member to join the first member and the second member in the temporary structure, and at least one of the first member and the second member is made of wood.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the dielectric filler (B) is preferably zinc oxide.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the high-frequency dielectric adhesive layer preferably contains the dielectric filler (B) in an amount of 3% by volume or more and 40% by volume or less.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the high-frequency dielectric adhesive layer preferably contains 5 parts by mass or more and 800 parts by mass or less of the dielectric filler (B) with respect to 100 parts by mass of the thermoplastic resin (A).

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the average particle size of the dielectric filler (B) measured according to JIS Z 8819-2:2001 is preferably 1 μm or more and 30 μm or less.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the Vicat softening point of the thermoplastic resin (A) measured according to JIS K 7206:2016 is preferably 40°C or higher and 200°C or lower.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the MFR of the high-frequency dielectric adhesive layer at 230° C. measured according to JIS K 7210:2014 is preferably 0.6 g/10 min or more and 85 g/10 min or less.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, it is preferable that the density of the high-frequency dielectric heating adhesive sheet is 3 g/cm ³ or less.

In the high-frequency dielectric heating adhesive sheet according to one aspect of the present invention, the 5% weight loss temperature of the high-frequency dielectric adhesive layer is preferably 300° C. or higher.

The high frequency dielectric heating adhesive sheet according to one aspect of the present invention is preferably used by applying a high frequency of 1 kHz or more and 300 MHz or less.

The high-frequency dielectric heating adhesive sheet according to one aspect of the present invention is preferably used with a high-frequency application time of 1 second or more and 60 seconds or less.

According to the present invention, it is possible to provide a high-frequency dielectric heating adhesive sheet that can be firmly joined in a short time and that can safely and easily dismantle a temporary structure in which members are firmly joined together in a short time without damaging the members.

It is a perspective view which shows the temporary structure which concerns on 1st Embodiment. FIG. 4 is a diagram for explaining dielectric heating treatment performed using the dielectric heating bonding apparatus in the first embodiment; It is a schematic diagram which shows the dismantling method of the temporary structure which concerns on 1st Embodiment. It is a perspective view which shows the temporary structure which concerns on 2nd Embodiment. FIG. 10 is a diagram for explaining dielectric heating treatment performed using a dielectric heating bonding apparatus in the second embodiment; It is a schematic diagram which shows the dismantling method of the temporary structure which concerns on 2nd Embodiment. It is a schematic diagram which shows the dismantling method of the temporary structure which concerns on 2nd Embodiment.

[First Embodiment]
[High frequency dielectric heating adhesive sheet]
The high-frequency dielectric heating adhesive sheet according to this embodiment includes a high-frequency dielectric adhesive layer. The high frequency dielectric adhesive layer contains thermoplastic resin (A) and dielectric filler (B). The high-frequency dielectric heating adhesive sheet according to this embodiment is used for a temporary structure that is separated into a plurality of members on the adhesive surface after use. In this specification, the thermoplastic resin (A) may be referred to as the A component. In this specification, the dielectric filler (B) may also be referred to as the B component.
The details of the high frequency dielectric heating adhesive sheet and the high frequency dielectric adhesive layer will be described later.

(1) How to use the high-frequency dielectric heating adhesive sheet By using the high-frequency dielectric heating adhesive sheet according to the present embodiment, for example, a temporary structure can be manufactured by joining a plurality of members, and the temporary structure can be dismantled by performing high-frequency dielectric heating treatment on the joints of the temporary structure.

(temporary structure)
FIG. 1 shows a perspective view showing a temporary structure 1 according to the first mode of this embodiment.
A temporary structure 1 according to a first aspect of the present embodiment has a plate member 20 as a first member, a prismatic member 31 as a second member, and a high frequency dielectric heating adhesive sheet 11 . In the temporary structure 1 , the plate member 20 and the prismatic member 31 are joined by the high-frequency dielectric heating adhesive sheet 11 .
The temporary structure 1 has a plurality of prismatic members 31, specifically, a prismatic member 31A, a prismatic member 31B, a prismatic member 31C, and a prismatic member 31D.
In the temporary structure 1 , the plate member 20 and each of the plurality of prismatic members 31 are joined by individual high-frequency dielectric heating adhesive sheets 11 . Specifically, the prismatic member 31A and the plate material 20 are bonded with the high frequency dielectric heating adhesive sheet 11A, the prismatic member 31B and the plate material 20 are bonded with the high frequency dielectric heating adhesive sheet 11B, the prismatic member 31C and the plate material 20 are bonded with the high frequency dielectric heating adhesive sheet 11C, and the prismatic member 31D and the plate material 20 are bonded with the high frequency dielectric heating adhesive sheet 11D.
Details of the high-frequency dielectric heating adhesive sheet 11 will be described later.

(First member and second member)
In this embodiment, the first member is the plate member 20, but the first member in the present invention is not limited to the plate member, and may be a prismatic member or other shape like the second member.
In the present embodiment, the second member is the prismatic member 31, but the second member in the present invention is not limited to the prismatic member, and may be a plate like the first member, or may have another shape.

In this embodiment, the materials of the first member and the second member are not particularly limited as long as they are materials used for temporary structures. Preferably, at least one of the first member and the second member is wood.
In the present embodiment, one of the first member and the second member is wood, and the other of the first member and the second member is preferably a member made of a material selected from the group consisting of wood, glass, resin, and metal, from the viewpoint of weight reduction and strength enhancement.
In the temporary structure 1 according to the present embodiment, the plate member 20 as the first member and the prismatic member 31 as the second member are both made of wood.

The board 20 is preferably a wooden board. Wood boards include wood veneer, plywood, laminated lumber, laminated veneer lumber (LVL), oriented strand board (OSB), particle board, medium density fiberboard (MDF) and high density fiberboard (HDF). Fiberboard) and the like.

The thickness of the plate member 20 is preferably 1 mm or more, more preferably 3 mm or more, and even more preferably 5 mm or more.
The thickness of the plate member 20 is preferably 50 mm or less, more preferably 40 mm or less, and even more preferably 30 mm or less.
If the plate member 20 has a thickness of 1 mm or more, the strength of the temporary structure can be easily obtained.
If the thickness of the plate member 20 is 50 mm or less, the weight of the temporary structure can be easily reduced.

The prismatic member 31 is preferably a wooden square timber. Examples of wooden square timbers include square timbers obtained by processing solid wood into a prism shape and square timbers obtained by processing wood fiber boards into a prism shape. Examples of wood fiberboards for rectangular lumber include laminated lumber, plywood, LVL (laminated veneer lumber), particleboard, and MDF (medium density fiberboard).

The prismatic member 31 is not particularly limited. The length of the longest side of the polygon in a cross-sectional view perpendicular to the length direction of the prismatic member 31 is preferably 10 mm or longer, more preferably 15 mm or longer, and even more preferably 20 mm or longer. The length of the polygonal side in a cross-sectional view perpendicular to the length direction of the prismatic member 31 is preferably 400 mm or less, more preferably 300 mm or less, even more preferably 200 mm or less, and even more preferably 100 mm or less.

The temporary structure 1 can be used as a structure to be dismantled after use. The temporary structure 1 can be used as a temporary structure in exhibitions, events, outdoor advertisements, studio sets and the like.

The dimensions of the temporary structure 1 are not particularly limited. The longest dimension of the temporary structure 1 is preferably 300 mm or more, more preferably 400 mm or more, and even more preferably 500 mm or more. The longest dimension of the temporary structure 1 is preferably 10000 mm or less, more preferably 5000 mm or less, and even more preferably 2500 mm or less.

(2) Method for Joining First Member and Second Member The first member (the plate member 20) and the second member (the prismatic member 31) are preferably joined by dielectric heating treatment, and more preferably by a joining method including the following steps (1) and (2).

Step (1): A step of sandwiching the high-frequency dielectric heating adhesive sheet between the first member and the second member. Step (2): A step of subjecting the high-frequency dielectric heating adhesive sheet sandwiched between the first member and the second member to a dielectric heating treatment using a dielectric heating bonding device.

Step (1) is a step of disposing a high-frequency dielectric heating adhesive sheet at a predetermined location. Specifically, step (1) is a step of sandwiching the high-frequency dielectric heating adhesive sheet 11 between the plate member 20 as the first member and the prismatic member 31 as the second member. At that time, it is preferable to cut the high-frequency dielectric heating adhesive sheet 11 into a predetermined shape and sandwich it between the plate member 20 and the prismatic member 31 . For example, in the temporary structure 1 shown in FIG. 1, where four prismatic members 31 (31A, 31B, 31C and 31D) are joined to a plate 20, it is preferable to use the high-frequency dielectric heating adhesive sheets 11 (11A, 11B, 11C and 11D) having a shape corresponding to the joint area between each prismatic member 31 and the plate.

Step (2) is a step of subjecting the high-frequency dielectric heating adhesive sheet 11 sandwiched between the plate member 20 as the first member and the square columnar member 31 as the second member to a dielectric heating treatment using a dielectric heating adhesive device.

Next, the dielectric heating bonding apparatus used in step (2) and the conditions of the dielectric heating treatment will be described. Here, an example of manufacturing the temporary structure 1 will be described.

(3) Dielectric Heating Bonding Apparatus FIG. 2 shows a schematic diagram of the dielectric heating bonding apparatus 100 .
The dielectric heating bonding apparatus 100 includes a first high frequency applying electrode 160 , a second high frequency applying electrode 180 and a high frequency power source 200 .
The first high frequency applying electrode 160 and the second high frequency applying electrode 180 are arranged to face each other. The first high frequency applying electrode 160 and the second high frequency applying electrode 180 have a press mechanism. With this press mechanism, the plate material 20 , the high-frequency dielectric heating adhesive sheet 11 and the prismatic member 31 can be pressurized between the first high-frequency applying electrode 160 and the second high-frequency applying electrode 180 .
Although FIG. 2 shows an example of joints between the plate material 20 and the prismatic member 31A, joints between the other prismatic members 31B, 31C, and 31D and the plate material 20 can be performed in the same manner as the joining between the plate material 20 and the prismatic member 31A.

A high frequency power source 200 for applying a high frequency of about 28 MHz or about 40 MHz is connected to each of the first high frequency applying electrode 160 and the second high frequency applying electrode 180 .
As shown in FIG. 2, the dielectric heating bonding apparatus 100 performs dielectric heating via a high frequency dielectric heating bonding sheet 11A sandwiched between a plate member 20 and a prismatic member 31A. Furthermore, the dielectric heating bonding apparatus 100 bonds the plate member 20 and the prismatic member 31A by pressure processing using the first high frequency applying electrode 160 and the second high frequency applying electrode 180 in addition to the dielectric heating treatment.

When a high-frequency electric field is applied between the first high-frequency applying electrode 160 and the second high-frequency applying electrode 180, the dielectric filler (not shown) dispersed in the adhesive component of the high-frequency dielectric heating adhesive sheet 11A absorbs the high-frequency energy in the overlapped portion of the plate member 20 and the prismatic member 31A.
The dielectric filler as the B component functions as a heat source, and the heat generated melts the thermoplastic resin component as the A component of the high-frequency dielectric heating adhesive sheet 11A, so that the plate material 20 and the prismatic member 31 can finally be strongly bonded even if the treatment is performed for a short period of time.

Since the first high frequency applying electrode 160 and the second high frequency applying electrode 180 have a press mechanism, they also function as a press device. Therefore, the plate member 20 and the prismatic member 31 can be bonded more firmly by applying pressure in the compression direction by the first high-frequency applying electrode 160 and the second high-frequency applying electrode 180 and heating and melting the high-frequency dielectric heating adhesive sheet 11A.

In the temporary structure 1, the high-frequency dielectric heating adhesive sheet 11 may be sandwiched between the prismatic members 31 to bond the prismatic members 31 together.

(4) Dismantling Method of Temporary Structure A method of dismantling the temporary structure 1 will be described.
The first member (plate member 20) and the second member (prism member 31) are preferably separated by dielectric heating treatment to dismantle the temporary structure 1, and more preferably dismantling by a dismantling method including the following steps (3) and (4).

Step (3): A step of performing a dielectric heating treatment on the high-frequency dielectric heating adhesive sheet that joins the first member and the second member, using a dielectric heating bonding apparatus. Step (4): A step of applying an external force to at least one of the first member and the second member to separate the first member and the second member.

FIG. 3 shows a dismantling method of the temporary structure 1 according to the first embodiment.
FIG. 3A is a schematic diagram showing step (3).
FIG. 3B is a schematic diagram showing step (4).
The dielectric heating bonding apparatus 100 can also be used in the dismantling method of the temporary structure 1 .
FIG. 3 shows an example of a dismantling method of the temporary structure 1 at the joining point between the prismatic member 31A and the plate member 20 (separation of the prismatic member 31A and the plate member 20 at the bonding surface), but the joining portions between the other prismatic members 31B, 31C and 31D and the plate member 20 can be dismantled in the same manner as the dismantling method for the plate member 20 and the prismatic member 31A.

Step (3) is a step of subjecting the high-frequency dielectric heating adhesive sheet 11 sandwiched between the plate member 20 as the first member and the prismatic member 31 as the second member to dielectric heating using the dielectric heating adhesive device 100.
The same method and conditions as in step (2) can be applied to the method and conditions of the high-frequency dielectric heat treatment in step (3).

Step (4) is a step of applying an external force to at least one of the plate member 20 as the first member and the prismatic member 31 as the second member after the high-frequency dielectric heating adhesive sheet 11 is heated in step (3), thereby separating the plate member 20 and the prismatic member 31.
As an external force, it is also preferable to separate the plate member 20 and the prismatic member 31 by applying a manual force of the demolition worker.
In step (4), after the high-frequency dielectric heating adhesive sheet 11 is heated in step (3), it is also preferable to apply an external force to at least one of the first member and the second member by bringing a pressing member into contact. When dismantling using a pressing member, as shown in FIG. 3B, it is preferable to bring the pressing member 190 into contact with the prismatic member 31 as the second member along the adhesive surface of the temporary structure 1 to separate the plate member 20 and the prismatic member 31. The pressing member 190 is not limited to the shape shown in FIG. 3(B).
Step (4) is preferably performed while the high-frequency dielectric heating adhesive sheet 11 is in a heated state, and more preferably, step (4) is performed during the application of the high-frequency wave after the start of application of the high-frequency wave. The first high frequency applying electrode 160 and the second high frequency applying electrode 180 have a press mechanism. With this press mechanism, the first high-frequency applying electrode 160 and the second high-frequency applying electrode 180 can be brought close to each other or separated from each other. Therefore, in order to prevent the pressing member 190 from coming into contact with the first high frequency applying electrode 160 when the pressing member 190 is brought into contact with the prismatic member 31A, it is also preferable to bring the pressing member 190 into contact with the prismatic member 31A after the first high frequency applying electrode 160 is separated from the prismatic member 31A after the application of the high frequency. After the high frequency application is completed, the first high frequency applying electrode 160 is separated from the prismatic member 31A, and then the pressing member 190 is preferably brought into contact with the prismatic member 31A until the high frequency dielectric heating adhesive sheet 11 is cooled.
By pressing the prismatic member 31A with the pressing member 190 at the timing when the high-frequency dielectric heating adhesive sheet 11 is heated, a shearing force along the adhesive surface acts on the temporary structure 1 . Due to this shearing force, the prismatic member 31A is separated from the high-frequency dielectric heating adhesive sheet 11, as shown in FIG. 3(B). By separating the prismatic member 31A from the plate member 20, the temporary structure 1 is dismantled.
When pressing the prismatic member 31A with the pressing member 190, it is preferable to fix the plate member 20 by fixing means (not shown). By fixing the plate member 20 by the fixing means, the shear force along the bonding surface between the prismatic member 31A and the plate member 20 can be applied more reliably. Examples of fixing means include a suction table capable of sucking and fixing the surface (opposite surface) opposite to the surface (bonding surface) of the plate 20 to which the prismatic member 31A is bonded, and a gripping device that grips and fixes the outer periphery of the plate 20. The pressing by the pressing member 190 in the description of the dismantling method according to the present embodiment may be changed to pressing by the hand force of the demolition worker. Further, the fixing means may be the manual power of the demolition worker.

(5) High-Frequency Dielectric Heating Conditions High-frequency dielectric heating conditions during the manufacture and dismantling of the temporary structure can be changed as appropriate, but the following conditions are preferred.

The high-frequency output is preferably 0.01 kW or more, more preferably 0.05 kW or more, and even more preferably 0.1 kW or more.
The high-frequency output is preferably 50 kW or less, preferably 20 kW or less, more preferably 15 kW or less, and even more preferably 10 kW or less.
If the high-frequency output is 0.01 kW or more, it is easy to prevent the problem that the temperature does not easily rise due to the dielectric heating treatment and good adhesion cannot be obtained. If the high-frequency output is 0.01 kW or more, it is possible to prevent deterioration in dismantling workability due to a longer time for the high-frequency dielectric heating adhesive sheet to melt.
If the high-frequency output is 50 kW or less, it is easy to prevent the problem of difficulty in temperature control due to dielectric heating treatment.

The application time of the high frequency is preferably 1 second or longer.
The high-frequency application time is preferably 60 seconds or less, more preferably 45 seconds or less, even more preferably 35 seconds or less, and even more preferably 25 seconds or less.
If the high-frequency application time is 1 second or longer, it is easy to prevent the problem that the dielectric heating treatment is difficult to raise the temperature and that good adhesive strength cannot be obtained. If the high-frequency application time is 1 second or more, it is possible to prevent the melting time of the high-frequency dielectric heating adhesive sheet from becoming longer and the dismantling workability from deteriorating.
If the high-frequency application time is 60 seconds or less, the joining time or dismantling time between the first member and the second member becomes excessively long, the manufacturing efficiency or dismantling efficiency of the temporary structure decreases, the manufacturing cost increases, and further, it is easy to prevent problems such as thermal deterioration of the first member and the second member (for example, the plate material 20 and the prismatic member 31 that are wooden materials).

The frequency of the high frequency is preferably 1 kHz or higher, more preferably 1 MHz or higher, even more preferably 5 MHz or higher, and even more preferably 10 MHz or higher.
The frequency of the high frequency is preferably 300 MHz or less, more preferably 100 MHz or less, even more preferably 80 MHz or less, and even more preferably 50 MHz or less. Specifically, the industrial frequency band of 13.56 MHz, 27.12 MHz or 40.68 MHz allocated by the International Telecommunication Union is also used for the high-frequency dielectric heating bonding method of this embodiment.

(6) High-Frequency Dielectric Heating Adhesive Sheet and High-Frequency Dielectric Adhesive Layer The high-frequency dielectric heating adhesive sheet according to the present embodiment, as one aspect, consists of only one high-frequency dielectric adhesive layer. In addition, the high-frequency dielectric heating adhesive sheet according to the present invention is not limited to a mode consisting of only one high-frequency dielectric adhesive layer, and a modified example of the high-frequency dielectric heating adhesive sheet includes a mode in which layers other than the high-frequency dielectric adhesive layer are laminated.
As described above, since the high-frequency dielectric heating adhesive sheet may consist of only one high-frequency dielectric adhesive layer, the terms "high-frequency dielectric heating adhesive sheet" and "high-frequency dielectric adhesive layer" may be interchanged with each other in some cases.

(6.1) Thermoplastic resin (A)
The type of thermoplastic resin (A) is not particularly limited.
The thermoplastic resin (A) is preferably at least one selected from the group consisting of polyolefin resins, polyolefin resins having a polar site, styrene resins, polyacetal resins, polycarbonate resins, polyacrylic resins, polyamide resins, polyimide resins, polyvinyl acetate resins, phenoxy resins, and polyester resins, from the viewpoint of, for example, being easily melted and having a predetermined heat resistance.

The thermoplastic resin (A) is preferably a polyolefin resin or a polyolefin resin having a polar site.

The polyolefin-based resin as the thermoplastic resin (A) may be a polyolefin-based resin having no polar sites.

(polyolefin resin)
Examples of the polyolefin resin as the thermoplastic resin (A) include resins composed of homopolymers such as polyethylene, polypropylene, polybutene and polymethylpentene, and α-olefin resins composed of copolymers of monomers selected from the group consisting of ethylene, propylene, butene, hexene, octene, 4-methylpentene, and the like. The polyolefin-based resin as the thermoplastic resin (A) may be a single resin or a combination of two or more resins.

(Polyolefin resin having polar sites)
The polar site in the polyolefin resin having a polar site is not particularly limited as long as it can impart polarity to the polyolefin resin.
The thermoplastic resin (A) may be a copolymer of an olefinic monomer and a monomer having a polar site. The thermoplastic resin (A) may also be a resin obtained by introducing a polar site into an olefinic polymer obtained by polymerization of an olefinic monomer through modification such as an addition reaction.

The type of olefin-based monomer that constitutes the polyolefin-based resin having a polar site as the thermoplastic resin (A) is not particularly limited. Examples of olefinic monomers include ethylene, propylene, butene, hexene, octene and 4-methyl-1-pentene. These olefinic monomers may be used singly or in combination of two or more.
Ethylene and polypropylene are preferable as the olefin-based monomer from the viewpoint of excellent mechanical strength and stable adhesive properties.
The olefin-derived structural unit in the polyolefin-based resin having a polar site is preferably a structural unit derived from ethylene or propylene.

Examples of polar sites include hydroxyl groups, carboxyl groups, vinyl acetate structures, acid anhydride structures, and acid-modified structures introduced into polyolefin resins by acid modification.

The acid-modified structure as a polar site is a site introduced by acid-modifying the polyolefin resin. Compounds used for graft modification of polyolefin resins include unsaturated carboxylic acid derivative components derived from any of unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, and unsaturated carboxylic acid esters.

Unsaturated carboxylic acids include, for example, acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid and citraconic acid.

Acid anhydrides of unsaturated carboxylic acids include, for example, acid anhydrides of unsaturated carboxylic acids such as maleic anhydride, itaconic anhydride and citraconic anhydride.

Examples of unsaturated carboxylic acid esters include esters of unsaturated carboxylic acids such as methyl acrylate, ethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, dimethyl maleate, monomethyl maleate, dimethyl fumarate, diethyl fumarate, dimethyl itaconate, diethyl itaconate, dimethyl citraconate, diethyl citraconate, and dimethyl tetrahydrophthalic anhydride.

When the thermoplastic resin (A) is a copolymer of an olefin-based monomer and a monomer having a polar site, the copolymer preferably contains 2% by mass or more, more preferably 4% by mass or more, more preferably 5% by mass or more, and even more preferably 6% by mass or more of a structural unit derived from a monomer having a polar site. In addition, the copolymer preferably contains 30% by mass or less of a structural unit derived from a monomer having a polar site, more preferably 25% by mass or less, even more preferably 20% by mass or less, and 15% by mass or less.
When the copolymer contains 2% by mass or more of structural units derived from a monomer having a polar site, the adhesive strength of the high-frequency dielectric heating adhesive sheet is improved. In addition, when the copolymer contains 30% by mass or less of structural units derived from a monomer having a polar site, it is possible to prevent the thermoplastic resin (A) from becoming too tacky. As a result, it is possible to prevent difficulty in molding the high-frequency dielectric heating adhesive sheet.

When the polyolefin resin as the thermoplastic resin (A) has an acid-modified structure, the acid modification rate is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 0.2% by mass or more.
When the polyolefin resin as the thermoplastic resin (A) has an acid-modified structure, the acid modification rate is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 10% by mass or less.
When the thermoplastic resin (A) has an acid-modified structure, the rate of acid modification is 0.01% by mass or more, thereby improving the adhesive strength of the high-frequency dielectric heating adhesive sheet. In addition, when the acid modification rate is 30% by mass or less, it is possible to prevent the thermoplastic resin (A) from becoming too tacky. As a result, it is possible to prevent difficulty in molding the high-frequency dielectric heating adhesive sheet.
As used herein, modification rate is the percentage of the mass of the acid-derived moieties relative to the total mass of the acid-modified polyolefin.

(Maleic anhydride-modified polyolefin)
The polyolefin resin as the thermoplastic resin (A) more preferably has an acid anhydride structure as the acid-modified structure. The acid anhydride structure is preferably a structure introduced when the polyolefin resin is modified with maleic anhydride.
In the maleic anhydride-modified polyolefin as component A, the modification rate with maleic anhydride is preferably in the same range as the modification rate when the polyolefin resin as the thermoplastic resin (A) has an acid-modified structure.

The olefin-derived structural units in the maleic anhydride-modified polyolefin are preferably ethylene- or propylene-derived structural units.

(Olefin-vinyl acetate copolymer resin)
The thermoplastic resin (A) according to the present embodiment is also preferably a copolymer (olefin-vinyl acetate copolymer resin) containing an olefin-derived structural unit and a vinyl acetate-derived structural unit.
The olefin-vinyl acetate copolymer resin as the thermoplastic resin (A) preferably has vinyl acetate-derived structural units in the same range as the structural units derived from the monomer having a polar site in the copolymer of the olefin-based monomer and the monomer having a polar site.

The olefin-derived structural unit in the olefin-vinyl acetate copolymer resin is preferably a structural unit derived from ethylene or propylene from the viewpoint of excellent mechanical strength and stable adhesion.
Therefore, the thermoplastic resin (A) is preferably at least one of ethylene-vinyl acetate copolymer resin and propylene-vinyl acetate copolymer resin, more preferably ethylene-vinyl acetate copolymer resin. The vinyl acetate-derived structural unit in the ethylene-vinyl acetate copolymer resin and the propylene-vinyl acetate copolymer resin is also preferably within the same percentage (mass %) range as described for the olefin-vinyl acetate copolymer resin.

(Vicat softening point)
The Vicat softening point of the thermoplastic resin (A) measured according to JIS K 7206:2016 is preferably 40°C or higher, more preferably 50°C or higher, and even more preferably 60°C or higher.
The Vicat softening point of the thermoplastic resin (A) measured according to JIS K 7206:2016 is preferably 200°C or lower, preferably 150°C or lower, more preferably 130°C or lower, and even more preferably 100°C or lower.
If the thermoplastic resin (A) has a Vicat softening point of 40° C. or higher, the heat resistance of the high-frequency dielectric adhesive layer can be improved.
When the Vicat softening point of the thermoplastic resin (A) is 200° C. or lower, stable bonding strength can be easily obtained in a short time.

(average molecular weight)
The average molecular weight (weight average molecular weight) of the thermoplastic resin (A) is generally preferably 5,000 or more, more preferably 10,000 or more, and even more preferably 20,000 or more.
The average molecular weight (weight average molecular weight) of the thermoplastic resin (A) is preferably 300,000 or less, more preferably 200,000 or less, and even more preferably 100,000 or less.
When the weight-average molecular weight of the thermoplastic resin (A) is 5000 or more, it is possible to prevent the heat resistance and adhesive strength from significantly deteriorating.
If the weight average molecular weight of the thermoplastic resin (A) is 300,000 or less, it is possible to prevent the weldability and the like from significantly deteriorating when the dielectric heat treatment is performed.
The weight average molecular weight of the thermoplastic resin (A) can be measured, for example, by the intrinsic viscosity method according to JIS K 7367-3:1999.

(melt flow rate)
The melt flow rate (MFR) of the thermoplastic resin (A) is usually preferably within the following range when measured according to JIS K 7210-1:2014.
The MFR of the thermoplastic resin (A) is preferably 0.5 g/10 minutes or more, more preferably 0.8 g/10 minutes or more, and even more preferably 1 g/10 minutes or more under the conditions described later.
The MFR of the thermoplastic resin (A) is preferably 30 g/10 min or less, more preferably 20 g/10 min or less, and even more preferably 15 g/10 min or less under the conditions described later.
If the MFR of the thermoplastic resin (A) is 0.5 g/10 minutes or more, the fluidity can be maintained and the film thickness accuracy can be easily obtained. Further, if the MFR of the thermoplastic resin (A) is 0.5 g/10 minutes or more, and if the first member and the second member have uneven surfaces, the followability of the high-frequency dielectric heating adhesive sheet to the surfaces of the first member and the second member is improved.
If the MFR of the thermoplastic resin (A) is 30 g/10 minutes or less, it is easy to obtain film-forming properties.
The MFR value of the thermoplastic resin (A) can be measured according to JIS K 7210-1:2014 under conditions of a predetermined test temperature and a load of 2.16 kg.
The test temperature complies with JIS K 7210-1:2014. For example, when the olefin-derived structural unit in the thermoplastic resin (A) is polyethylene, the test temperature is 190°C. When the olefin-derived structural unit in the thermoplastic resin (A) is polypropylene, the test temperature is 230°C.

(6.2) Dielectric filler (B)
(kinds)
It is preferable that the dielectric filler (B) generate heat by application of a high frequency of 1 kHz or more and 300 MHz or less. Further, the dielectric filler (B) is preferably a high frequency absorbing filler having a high dielectric loss factor capable of generating heat by application of a high frequency such as a frequency of 28 MHz or 40 MHz.

As the dielectric filler (B), zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, barium titanate, barium zirconate titanate, lead titanate, potassium niobate, rutile-type titanium oxide, hydrated aluminum silicate, inorganic materials having water of crystallization such as hydrated aluminosilicate of alkali metals, or inorganic materials having water of crystallization such as hydrated aluminosilicates of alkaline earth metals are preferably used alone or in combination of two or more.

The dielectric filler (B) is preferably a metal oxide, more preferably zinc oxide. Zinc oxide as the dielectric filler (B) is abundant in variety and can be selected from various shapes and sizes. Furthermore, if the dielectric filler (B) is zinc oxide, the adhesive properties and mechanical properties of the high-frequency dielectric heating adhesive sheet can be improved according to the application.
Zinc oxide as the dielectric filler (B) is easily blended uniformly into the thermoplastic resin (A), which is the adhesive component. Therefore, even if the amount of zinc oxide compounded in the high-frequency dielectric adhesive layer is relatively small, in a predetermined dielectric heating treatment, an excellent heat generation effect can be exhibited compared to a high-frequency dielectric heating adhesive sheet containing other dielectric fillers.
Therefore, since the high-frequency dielectric adhesive layer contains zinc oxide as the dielectric filler (B), excellent weldability can be obtained in the dielectric heating treatment for joining the first member and the second member.

The high-frequency dielectric adhesive layer according to this embodiment preferably does not contain a conductive substance. Examples of conductive substances include carbon, carbon compounds containing carbon as a main component (for example, carbon black, etc.), metals, and the like. The content of the conductive substance is preferably 5% by mass or less, more preferably 1% by mass or less, further preferably 0.1% by mass or less, and even more preferably 0% by mass, based on the total amount of the high-frequency dielectric adhesive layer. If the content of the conductive substance in the high-frequency dielectric adhesive layer is 5% by mass or less, it is possible to prevent the problem of carbonization of the adhesive portion and the adherend due to electrical breakdown during dielectric heat treatment.

(Average particle size)
The average particle diameter (median diameter, D50) of the dielectric filler (B) measured according to JIS Z 8819-2:2001 is preferably 1 μm or more, more preferably 2 μm or more, and even more preferably 3 μm or more.
The average particle diameter (median diameter, D50) of the dielectric filler (B) measured according to JIS Z 8819-2:2001 is preferably 30 μm or less, more preferably 25 μm or less, and even more preferably 20 μm or less.
If the average particle size of the dielectric filler (B) is too small, the reversal motion is reduced when a high frequency is applied, so the dielectric heating adhesiveness is excessively lowered, and strong adhesion between adherends may be difficult.
On the other hand, as the average particle size of the dielectric filler (B) increases, the distance that can be polarized inside the filler increases. As a result, the degree of polarization is increased, the reversal motion becomes more intense when a high frequency is applied, and the dielectric heating adhesiveness is improved.
Therefore, if the average particle size of the dielectric filler (B) is 1 μm or more, the distance that can be polarized inside the filler does not become too small, and the degree of polarization can be prevented from becoming small, depending on the type of filler.
If the average particle size of the dielectric filler (B) is too large, the distance from the surrounding dielectric filler is short, and the reversal motion when a high frequency is applied is reduced due to the influence of the charge, and the dielectric heating adhesiveness may be excessively reduced, or strong adhesion between adherends may be difficult.
Therefore, if the average particle size of the dielectric filler (B) is 30 μm or less, it is possible to prevent the dielectric heating adhesiveness from excessively deteriorating and the strong adhesion between adherends from becoming difficult.
When the dielectric filler (B) is zinc oxide, it preferably has an average particle size of 10 μm or more and 20 μm or less.
The average particle size of the dielectric filler (B) is preferably smaller than the thickness of the high-frequency dielectric adhesive layer.

(Volume content)
The high-frequency dielectric heating adhesive sheet according to the present embodiment preferably contains 3% by volume or more, more preferably 5% by volume or more, and more preferably 13% by volume or more of the dielectric filler (B) in the high-frequency dielectric adhesive layer.
The high-frequency dielectric heating adhesive sheet according to the present embodiment preferably contains 40% by volume or less, more preferably 35% by volume or less, and even more preferably 25% by volume or less of the dielectric filler (B) in the high-frequency dielectric adhesive layer.
If the volume content of the dielectric filler (B) is 3% by volume or more, it is possible to prevent poor heat build-up during the dielectric heating treatment. As a result, it is possible to prevent the problem that the meltability of the thermoplastic resin (A) is excessively lowered and strong adhesion cannot be obtained.
If the volume content of the dielectric filler (B) is 40% by volume or less, the fluidity of the high-frequency dielectric heating adhesive sheet is reduced during the dielectric heating process, and the current between the electrodes when high-frequency waves are applied can be prevented. Further, when the volume content of the dielectric filler (B) is 40% by volume or less, it is possible to prevent deterioration of the film formability, flexibility and toughness of the high-frequency dielectric heating adhesive sheet.

In addition, since the high-frequency dielectric adhesive layer according to the present embodiment contains the thermoplastic resin (A) and the dielectric filler (B), the dielectric filler (B) preferably contains 3% by volume or more, more preferably 5% by volume or more, and even more preferably 13% by volume or more, relative to the total volume of the thermoplastic resin (A) and the dielectric filler (B).
The high-frequency dielectric adhesive layer according to the present embodiment preferably contains 40% by volume or less, more preferably 35% by volume or less, and even more preferably 25% by volume or less of the dielectric filler (B) with respect to the total volume of the thermoplastic resin (A) and the dielectric filler (B).

(Parts by mass)
The high-frequency dielectric adhesive layer according to the present embodiment preferably contains 5 parts by mass or more, preferably 20 parts by mass or more, more preferably 30 parts by mass or more, more preferably 50 parts by mass or more, and even more preferably 100 parts by mass or more of the dielectric filler (B) with respect to 100 parts by mass of the thermoplastic resin (A).
The high-frequency dielectric adhesive layer according to the present embodiment preferably contains 800 parts by mass or less, preferably 400 parts by mass or less, more preferably 300 parts by mass or less, and even more preferably 200 parts by mass or less of the dielectric filler (B) with respect to 100 parts by mass of the thermoplastic resin (A).
When the number of parts by mass of the dielectric filler (B) is 5 parts by mass or more, it is possible to prevent poor heat build-up during the dielectric heating treatment. As a result, it is possible to prevent the problem that the meltability of the thermoplastic resin (A) is excessively lowered and strong adhesion cannot be obtained.
If the number of parts by mass of the dielectric filler (B) is 800 parts by mass or less, the fluidity of the high-frequency dielectric heating adhesive sheet is reduced during the dielectric heating treatment, and the current between the electrodes when the high frequency is applied can be prevented. Further, when the number of parts by mass of the dielectric filler (B) is 800 parts by mass or less, it is possible to prevent deterioration of film formability, flexibility and toughness of the high-frequency dielectric heating adhesive sheet.

In the high-frequency dielectric heating adhesive sheet according to the present embodiment, the total mass of the thermoplastic resin (A) and the dielectric filler (B) is preferably 80% by mass or more, more preferably 90% by mass or more, and even more preferably 99% by mass or more, relative to the total mass of the high-frequency dielectric heating adhesive layer.

(6.3) Additives The high-frequency dielectric adhesive layer according to this embodiment may or may not contain additives.

When the high-frequency dielectric adhesive layer according to the present embodiment contains additives, examples of the additives include tackifiers, plasticizers, waxes, colorants, antioxidants, ultraviolet absorbers, antibacterial agents, coupling agents, viscosity modifiers, organic fillers, inorganic fillers, and the like. Organic fillers and inorganic fillers as additives are different from dielectric fillers as the B component.

Tackifiers and plasticizers can improve the fusing and adhesion properties of high frequency dielectric adhesive layers.
Examples of tackifiers include rosin derivatives, polyterpene resins, aromatic modified terpene resins, hydrides of aromatic modified terpene resins, terpene phenol resins, coumarone-indene resins, aliphatic petroleum resins, aromatic petroleum resins, and hydrides of aromatic petroleum resins.
Plasticizers include, for example, petroleum-based process oils, natural oils, dialkyl dibasic acids, and low molecular weight liquid polymers. Petroleum-based process oils include, for example, paraffinic process oils, naphthenic process oils, and aromatic process oils. Natural oils include, for example, castor oil and tall oil. Dialkyl dibasic acids include, for example, dibutyl phthalate, dioctyl phthalate and dibutyl adipate. Examples of low molecular weight liquid polymers include liquid polybutene and liquid polyisoprene.

When the high-frequency dielectric adhesive layer according to the present embodiment contains an additive, the high-frequency dielectric adhesive layer normally contains the additive in an amount of preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more, based on the total amount of the high-frequency dielectric adhesive layer. In addition, when the high-frequency dielectric adhesive layer according to the present embodiment contains an additive, the high-frequency dielectric adhesive layer preferably contains 20% by mass or less of the additive, more preferably 15% by mass or less, and even more preferably 10% by mass or less, based on the total amount of the high-frequency dielectric adhesive layer.

The high-frequency dielectric adhesive layer according to the present embodiment can be produced by pre-mixing the above-described components (thermoplastic resin (A) and dielectric filler (B); further additives as necessary), kneading using a known kneading apparatus, and using a known molding method. Examples of kneading devices include extruders and hot rolls. Examples of molding methods include extrusion molding, calendar molding, injection molding and casting molding.

(7) Form and properties of high-frequency dielectric heating adhesive sheet When the high-frequency dielectric heating adhesive sheet according to the present embodiment consists of only one high-frequency dielectric adhesive layer, the form and properties of the high-frequency dielectric heating adhesive sheet correspond to the forms and properties of the high-frequency dielectric adhesive layer.

(thickness)
The thickness of the high-frequency dielectric adhesive layer according to this embodiment is usually preferably 10 μm or more, more preferably 50 μm or more, and even more preferably 100 μm or more.
The thickness of the high-frequency dielectric adhesive layer according to this embodiment is preferably 2,000 μm or less, more preferably 1,000 μm or less, and even more preferably 600 μm or less.
If the thickness of the high-frequency dielectric adhesive layer is 10 μm or more, it is possible to prevent the adhesive force between the adherends from suddenly decreasing. Further, if the thickness of the high-frequency dielectric adhesive layer is 10 μm or more, the high-frequency dielectric adhesive layer can follow the unevenness when the bonding surface of the adherend has unevenness, and the adhesive strength can be easily developed.
If the thickness of the high-frequency dielectric adhesive layer is 2,000 μm or less, it can be wound into a roll as a long product or applied to a roll-to-roll system. In addition, handling of the high-frequency dielectric heating adhesive sheet is facilitated in subsequent processes such as punching. Moreover, since the weight of the entire adhesive structure (temporary structure) increases as the thickness of the high-frequency dielectric adhesive layer increases, the thickness is preferably within a range that does not cause problems in use.

(Dielectric properties (tan δ/ε'))
The dielectric loss tangent (tan δ) and dielectric constant (ε′) as dielectric properties of the high-frequency dielectric heating adhesive sheet according to the present embodiment can be measured in accordance with JIS C 2138:2007, but can be easily and accurately measured in accordance with the impedance material method.
The dielectric property (tan δ/ε') of the high-frequency dielectric heating adhesive sheet according to this embodiment is preferably 0.005 or more, more preferably 0.008 or more, and even more preferably 0.01 or more.
The dielectric property (tan δ/ε′) of the high-frequency dielectric heating adhesive sheet according to this embodiment is preferably 0.05 or less, more preferably 0.03 or less. The dielectric property (tan δ/ε') is a value obtained by dividing the dielectric loss tangent (tan δ) measured using an impedance material device or the like by the dielectric constant (ε') measured using an impedance material device or the like.
If the dielectric property of the high-frequency dielectric heating adhesive sheet is 0.005 or more, it is possible to prevent the problem that it becomes difficult to firmly bond the first member and the second member without generating a predetermined amount of heat when the dielectric heating treatment is performed.
However, if the dielectric properties of the high-frequency dielectric heating adhesive sheet become excessively large, the first member and the second member are likely to be damaged.
The details of the method for measuring the dielectric properties of the high-frequency dielectric heating adhesive sheet are as follows. Using an impedance material analyzer E4991 (manufactured by Agilent), the dielectric constant (ε') and dielectric loss tangent (tan δ) of the high-frequency dielectric heating adhesive sheet cut into a predetermined size are measured at 23° C. and a frequency of 40 MHz, respectively, and the value of the dielectric property (tan δ/ε') is calculated.

(melt flow rate)
The melt flow rate (MFR) of the high-frequency dielectric adhesive layer according to the present embodiment measured according to JIS K 7210-1:2014 is preferably 0.6 g/10 minutes or more, more preferably 1.0 g/10 minutes or more, more preferably 1.2 g/10 minutes or more, and particularly preferably 2.0 g/10 minutes or more.
The melt flow rate of the high-frequency dielectric adhesive layer according to the present embodiment, measured according to JIS K 7210-1:2014, is preferably 85 g/10 minutes or less, more preferably 55 g/10 minutes or less, more preferably 40 g/10 minutes or less, even more preferably 20 g/10 minutes or less, and particularly preferably 10 g/10 minutes or less.
In this specification, the test temperature is 230° C. and the load is 2.16 kg when measuring the MFR of the high-frequency dielectric adhesive layer.
If the MFR of the high-frequency dielectric adhesive layer is 0.6 g/10 minutes or more, the fluidity can be maintained and the film thickness accuracy can be easily obtained.
If the MFR of the high-frequency dielectric adhesive layer is 85 g/10 minutes or less, it is easy to obtain film formability.

(Vicat softening point)
The Vicat softening point of the high-frequency dielectric heating adhesive sheet measured according to JIS K 7206:2016 is preferably 50°C or higher, more preferably 60°C or higher, and even more preferably 70°C or higher.
The Vicat softening point of the high-frequency dielectric heating adhesive sheet measured according to JIS K 7206:2016 is preferably 210°C or lower, preferably 160°C or lower, more preferably 140°C or lower, and even more preferably 110°C or lower.
If the Vicat softening point of the high frequency dielectric heating adhesive sheet is 50° C. or higher, the heat resistance of the high frequency dielectric adhesive layer can be improved.
If the Vicat softening point of the high-frequency dielectric heating adhesive sheet is 210° C. or less, stable bonding strength can be easily obtained in a short time.

(density)
The density of the high-frequency dielectric heating adhesive sheet according to this embodiment is preferably 3 g/cm ³ or less, more preferably 2.5 g/cm ³ or less, and even more preferably 2 g/cm ³ or less.
The density of the high-frequency dielectric heating adhesive sheet according to this embodiment is preferably 0.85 g/cm ³ or more, more preferably 0.87 g/cm ³ or more, and even more preferably 0.89 g/cm ³ or more.
If the density of the high-frequency dielectric heating adhesive sheet is 3 g/cm ³ or less, it is possible to prevent the high-frequency dielectric heating adhesive sheet from sagging due to its own weight, and to prevent the separation from occurring at the bonding portion between the first member and the second member.
If the density of the high-frequency dielectric heating adhesive sheet is 3 g/cm ³ or less, an increase in the weight of the temporary structure can be suppressed, so workability during construction using the temporary structure and dismantling of the temporary structure can be improved.
Further, if the density of the high-frequency dielectric heating adhesive sheet is 0.85 g/cm ³ or more, fluttering can be easily suppressed when the sheet is formed by the roll-to-roll method.
The density of the high-frequency dielectric heating adhesive sheet can be measured according to JIS K 7112:1999 A method (submersion method in water).

(Tensile shear bond strength)
As for the tensile shear adhesive strength of the high-frequency dielectric heating adhesive sheet, it is preferable that the adhesive strength is 1 MPa or more, or the adhesive strength is such that the adherend is destroyed in the measurement of the tensile shear force.
Measurement of tensile shear force is carried out by the following method. A high-frequency dielectric heating adhesive sheet is cut into a size of 25 mm×12.5 mm×0.4 mm (thickness). After sandwiching the cut high-frequency dielectric heating adhesive sheet between a pair of plywoods (25 mm × 100 mm × 1.5 mm) as adherends, a parallel plate type high-frequency dielectric heating apparatus is used to produce a test piece for adhesion evaluation by applying high frequency for 20 seconds under the conditions of a frequency of 40 MHz and an output of 200 W. After standing for 24 hours in a standard environment (23° C., 50% RH), the tensile shear strength of the adhesive force evaluation test piece is measured using a universal tensile tester at a tensile speed of 100 mm/min. Measurement of tensile shear force conforms to JIS K 6850:1999.

(5% weight loss temperature)
The 5% weight loss temperature of the high-frequency dielectric adhesive layer according to this embodiment is preferably 300° C. or higher, more preferably 325° C. or higher, and even more preferably 350° C. or higher.
The 5% weight loss temperature of the high-frequency dielectric adhesive layer according to this embodiment is preferably 500° C. or lower, more preferably 475° C. or lower, and even more preferably 450° C. or lower.
If the 5% weight loss temperature of the high-frequency dielectric adhesive layer is 300° C. or higher, stable physical properties can be easily obtained even after molding.
If the 5% weight loss temperature of the high-frequency dielectric adhesive layer is 500° C. or lower, moldability can be easily obtained.

The high frequency dielectric heating adhesive sheet according to the present embodiment is preferably used under conditions of high frequency output of 0.01 kW or more, more preferably under conditions of high frequency output of 0.05 kW or more, and further preferably under conditions of high frequency output of 0.1 kW or more.
The high frequency dielectric heating adhesive sheet according to the present embodiment is preferably used under conditions of high frequency output of 50 kW or less, more preferably under conditions of high frequency output of 20 kW or less, further preferably under conditions of high frequency output of 15 kW or less, further preferably under conditions of high frequency output of 10 kW or less.
In this specification, the use of the high-frequency dielectric heating adhesive sheet means at least use in joining (bonding) a first member and a second member, and use in separating (dismantling) the temporary structure into the first member and the second member.

The high-frequency dielectric heating adhesive sheet according to the present embodiment is preferably used by applying a high frequency of 1 kHz or higher, more preferably by applying a high frequency of 1 MHz or higher, more preferably by applying a high frequency of 5 MHz or higher, and further preferably by applying a high frequency of 10 MHz or higher.
The high-frequency dielectric heating adhesive sheet according to the present embodiment is preferably used by applying a high frequency of 300 MHz or less, more preferably by applying a high frequency of 100 MHz or less, more preferably by applying a high frequency of 80 MHz or less, and even more preferably by applying a high frequency of 50 MHz or less.
More specifically, the high-frequency dielectric heating adhesive sheet according to this embodiment is preferably used by applying a high-frequency industrial frequency band of 13.56 MHz, 27.12 MHz or 40.68 MHz allocated by the International Telecommunications Union.

The high-frequency dielectric heating adhesive sheet according to this embodiment is preferably used with a high-frequency application time of 1 second or longer.
The high-frequency dielectric heating adhesive sheet according to the present embodiment is preferably used with a high-frequency application time of 60 seconds or less, more preferably with a high-frequency application time of 45 seconds or less, more preferably with a high-frequency application time of 35 seconds or less, and even more preferably with a high-frequency application time of 25 seconds or less.

(Effect of the first embodiment)
By using the high-frequency dielectric heating adhesive sheet according to the present embodiment for joining members together, the first member (the plate member 20) and the second member (the prismatic member 31) can be firmly joined in a short time, and the strongly joined first member (the plate member 20) and the second member (the prismatic member 31) can be safely and easily dismantled in a short time without damaging them.

Furthermore, since the adhesive used for bonding the first member (plate member 20) and the second member (prism member 31) is in the form of a sheet, it is easy to handle and workability at the time of bonding is improved.

According to the dismantling method using the high-frequency dielectric heating adhesive sheet according to the present embodiment, the dielectric heating adhesive device can locally heat only a predetermined portion from the outside. Therefore, even if the temporary structure is a large and complicated three-dimensional structure or a thick and complicated three-dimensional structure, the dismantling method of the temporary structure 1 using the high-frequency dielectric heating adhesive sheet according to the present embodiment is effective.

Since the high-frequency dielectric heating adhesive sheet according to this embodiment does not contain a solvent, the problem of VOCs (volatile organic compounds) due to the adhesive used for bonding the first member and the second member is less likely to occur. Therefore, by using the high-frequency dielectric heating adhesive sheet according to this embodiment for joining members together, it is possible to provide a temporary structure 1 suitable for applications where VOCs are a concern. Furthermore, since the problem of VOC is less likely to occur when the temporary structure 1 is dismantled, it is possible to prevent deterioration of the work environment due to VOC during dismantling.

Further, according to the high-frequency dielectric heating adhesive sheet according to this embodiment, the thickness of the high-frequency dielectric heating adhesive sheet can be appropriately controlled. Therefore, the high-frequency dielectric heating adhesive sheet according to the present embodiment can also be applied to a roll-to-roll system, and the high-frequency dielectric heating adhesive sheet can be processed into an arbitrary area and shape according to the bonding area between members and the shape of the member by punching or the like. Therefore, the high-frequency dielectric heating adhesive sheet according to this embodiment has a great advantage also from the viewpoint of the manufacturing process.

[Second embodiment]
Next, a second embodiment of the invention will be described.
In the second embodiment, the structure of the temporary structure as a mode of use of the high-frequency dielectric heating adhesive sheet is different from the temporary structure 1 of the first embodiment.
In the following description, the differences from the first embodiment will be mainly described, and duplicate descriptions will be omitted or simplified. The same reference numerals are assigned to the same configurations as in the first embodiment, and the description thereof is omitted or simplified.

(temporary structure)
FIG. 4 shows a perspective view (exploded perspective view) of a temporary structure 1A according to the second embodiment.
The temporary structure 1A is a multi-connected structure formed by joining two temporary structures 1 and 2 with a high-frequency dielectric heating adhesive sheet 11E.

A temporary structure 1 and a temporary structure 2 are the same as the temporary structure according to the first embodiment. The temporary structure 2 has a plate member 22 as a first member, a prismatic member 32 as a second member, and a high-frequency dielectric heating adhesive sheet 12 . In the temporary structure 2 , the plate member 22 and the prismatic member 32 are joined by the high frequency dielectric heating adhesive sheet 12 .
The temporary structure 2 has a plurality of prismatic members 32, specifically, a prismatic member 32A, a prismatic member 32B, a prismatic member 32C, and a prismatic member 32D.
In the temporary structure 2 , the plate member 22 and each of the plurality of prismatic members 32 are joined by individual high-frequency dielectric heating adhesive sheets 12 . Specifically, the prismatic member 32A and the plate material 22 are bonded by the high frequency dielectric heating adhesive sheet 12A, the prismatic member 32B and the plate material 22 are bonded by the high frequency dielectric heating adhesive sheet 12B, the prismatic member 32C and the plate material 22 are bonded by the high frequency dielectric heating adhesive sheet 12C, and the prismatic member 32D and the plate material 22 are bonded by the high frequency dielectric heating adhesive sheet 12D.
The plate material 22, prismatic member 32, and high-frequency dielectric heating adhesive sheet 12 in the temporary structure 2 are not particularly limited. For example, the plate material 22, the prismatic member 32, and the high-frequency dielectric heating adhesive sheet 12 in the temporary structure 2 are preferably the same members as the plate material 20, the prismatic member 31, and the high-frequency dielectric heating adhesive sheet 11 in the temporary structure 1, respectively. Also in the temporary structure 2, the plate members 22 and the prismatic members 32 are preferably made of wood.
Temporary structure 2 can also be manufactured in the same manner as temporary structure 1 .
Also in the temporary structure 2, the high-frequency dielectric heating adhesive sheet 11 may be sandwiched between the prismatic members 32 to bond the prismatic members 32 together.

The temporary structure 1A is joined by a high-frequency dielectric heating adhesive sheet 11E between a side surface 1E of the temporary structure 1 to which the prismatic member 31C is joined and a side surface 2E of the temporary structure 2 to which the prismatic member 32A is joined.

The high-frequency dielectric heating adhesive sheet 11E is preferably the same as the high-frequency dielectric heating adhesive sheet 11 according to the first embodiment, and various types of high-frequency dielectric heating adhesive sheets described in the first embodiment can be used. The shape of the high-frequency dielectric heating adhesive sheet 11E is preferably a shape corresponding to the joint surface between the side surface 1E and the side surface 2E.

(Manufacturing method of temporary structure)
The temporary structure 1A and the temporary structure 2 are preferably joined by a dielectric heat treatment, more preferably by a joining method including the following steps (1A) and (2A). For convenience of explanation, temporary structure 1 may be referred to as a first temporary structure, and temporary structure 2 may be referred to as a second temporary structure.

Step (1A): A step of sandwiching a high-frequency dielectric heating adhesive sheet between the first temporary structure and the second temporary structure. Step (2A): A step of subjecting the high-frequency dielectric heating adhesive sheet sandwiched between the first temporary structure and the second temporary structure to a dielectric heating treatment using a dielectric heating bonding device.

Step (1A) is a step of disposing a high-frequency dielectric heating adhesive sheet at a predetermined location. Specifically, the step (1A) is a step of sandwiching the high-frequency dielectric heating adhesive sheet 11E between a first temporary structure (temporary structure 1) as a first member and a second temporary structure (temporary structure 2) as a second member. In this embodiment, the high-frequency dielectric heating adhesive sheet 11E is sandwiched between the side surface 1E of the temporary structure 1 and the side surface 2E of the temporary structure 2. As shown in FIG.

Step (2A) is a step of subjecting the high-frequency dielectric heating adhesive sheet 11E sandwiched between a first temporary structure (temporary structure 1) and a second temporary structure (temporary structure 2) as a second member to a dielectric heating treatment using a dielectric heating bonding apparatus.

Next, the dielectric heating bonding apparatus used in step (2A) and the conditions of the dielectric heating treatment will be described. Here, an example of manufacturing the temporary structure 1A will be described.

A schematic diagram of the dielectric heat bonding apparatus 110 is shown in FIG.
The dielectric heating bonding apparatus 110 includes a first high frequency applying electrode 161 , a second high frequency applying electrode 181 and a high frequency power source 200 .
The first high frequency applying electrode 161 and the second high frequency applying electrode 181 are arranged to face each other. The first high-frequency applying electrode 161 and the second high-frequency applying electrode 181 may be the same electrodes as the first high-frequency applying electrode 160 and the second high-frequency applying electrode 180 of the first embodiment, respectively. In addition, in the second embodiment, the high-frequency dielectric heating adhesive sheet 11E sandwiched between the side surface 1E of the temporary structure 1 and the side surface 2E of the temporary structure 2 is selectively subjected to the dielectric heating treatment, so the shapes of the first high-frequency applying electrode 161 and the second high-frequency applying electrode 181 may be different from those in the first embodiment.

As shown in FIG. 5, by subjecting the high-frequency dielectric heating adhesive sheet 11E to the high-frequency dielectric heating treatment, the temporary structures 1 and 2 can be firmly bonded. The same method and conditions as in the first embodiment can be applied to the method and conditions of the high-frequency dielectric heat treatment in this embodiment. It is preferable to perform high-frequency dielectric heating while applying an external force in a direction in which the temporary structures 1 and 2 are brought into contact with each other. For example, in the case of the joining shown in FIG. 5, it is preferable to apply an external force directed from the left to the right to the temporary structure 1 and to apply an external force directed from the right to the left to the temporary structure 2, and perform high-frequency dielectric heating while the temporary structures 1 and 2 are in contact with each other.

(Method for Dismantling Temporary Structures)
A method for dismantling the temporary structure 1A will be described.
Preferably, the first temporary structure (temporary structure 1) and the second temporary structure (temporary structure 2) are separated by dielectric heating treatment and the temporary structure 1A is dismantled, more preferably by a dismantling method including the following steps (3A) and (4A).

Step (3A): A step of performing a dielectric heating treatment on the high-frequency dielectric heating adhesive sheet that joins the first temporary structure and the second temporary structure using a dielectric heating adhesive device. Step (4A): A step of applying an external force in a direction to separate the first temporary structure and the second temporary structure, thereby separating the first member and the second member.

6 and 7 show a dismantling method for the temporary structure 1A according to the second embodiment.
FIG. 6 is a schematic diagram showing step (3A).
FIG. 7 is a schematic diagram showing step (4A).
The dielectric heating bonding device 110 can also be used in the dismantling method of the temporary structure 1A.

Step (3A) is a step of performing a dielectric heating treatment on the high-frequency dielectric heating adhesive sheet 11E sandwiched between the temporary structures 1 and 2 using the dielectric heating adhesive device 110. FIG.
The same method and conditions as in step (2A) can be applied to the method and conditions of the high-frequency dielectric heat treatment in step (3A).

Step (4A) is a step of separating the temporary structures 1 and 2 by applying an external force in the direction of separating the temporary structures 1 and 2 after the high-frequency dielectric heating adhesive sheet 11 is heated in the step (3A).
It is also preferable to separate the temporary structure 1 and the temporary structure 2 by applying the force of the demolition worker's hand as an external force.
In the dismantling method of the temporary structure 1A according to the present embodiment, it is also preferable to use separating means having a grasping means 191 for grasping the temporary structure 1, a grasping means 192 for grasping the temporary structure 2, and a driving means (not shown) for moving the grasping means 191 and the grasping means 192 in a direction separating them. The means for separating the temporary structure 1 and the temporary structure 2 is not limited to the mode of pulling and separating the temporary structures 1 and 2 along the surface direction like this separating means, but means for separating by applying a shearing force along the side surface 1E of the temporary structure 1 and the side surface 2E of the temporary structure 2 (along the bonding surface) may be used.

Step (4A) is preferably performed while the high-frequency dielectric heating adhesive sheet 11E is in a heated state, and more preferably, step (4A) is performed during the application of the high-frequency wave after starting the application of the high-frequency wave. The first high frequency applying electrode 161 and the second high frequency applying electrode 181 have a press mechanism. With this press mechanism, the first high-frequency applying electrode 161 and the second high-frequency applying electrode 181 can be brought close to each other or separated from each other. When the temporary structure 1 and the temporary structure 2 are separated by the separating means, it is preferable to release the pressurization between the first high frequency applying electrode 161 and the second high frequency applying electrode 181 . It is preferable to separate the temporary structure 1 and the temporary structure 2 before the high frequency dielectric heating adhesive sheet 11E is cooled after the first high frequency applying electrode 161 is separated from the temporary structure 1 and the temporary structure 2 after the application of the high frequency is completed.
After separating the temporary structure 1A into the temporary structure 1 and the temporary structure 2, the temporary structure 1 and the temporary structure 2 can be separated into the plate material 20, the plate material 22, the prismatic member 31 and the prismatic member 32 by the dismantling method described in the first embodiment.

(Effect of Second Embodiment)
According to this embodiment, in addition to the effects of the first embodiment, the following effects are obtained.

By using the high-frequency dielectric heating adhesive sheet according to the present embodiment for joining members together, the temporary structure 1 and the temporary structure 2 can be firmly joined in a short time, and a larger temporary structure 1A having excellent strength can be manufactured in a short time.
Furthermore, by using the high-frequency dielectric heating adhesive sheet according to this embodiment, the large temporary structure 1A can be dismantled safely and easily in a short time. Specifically, without damaging the firmly joined temporary structures 1 and 2, and the plates 20, 22, prismatic members 31, and prismatic members 32 that constitute them, it can be dismantled safely and easily in a short time.

[Modification of Embodiment]
The invention is not limited to the embodiments described above. The present invention can include modifications, improvements, and the like within the scope of achieving the object of the present invention.

In the first embodiment, the method of joining and separating the plate member 20 and the prismatic member 31A has been described as an example, but the present invention is not limited to such an aspect. As a method for joining and separating the plate member 20 and the prismatic member 31A, the plurality of prismatic members 31 may be joined to the plate member 20 at the same time, or the high frequency dielectric heating adhesive sheet 11 at the portion where the plurality of prismatic members 31 are joined may be subjected to high frequency dielectric heating treatment at the same time to separate the plurality of prismatic members 31 from the plate member 20 at the same time.

The high-frequency dielectric heating adhesive sheet may have an adhesive portion. By having the adhesive portion, when the high-frequency dielectric heating adhesive sheet is sandwiched between members, positional deviation can be prevented and the sheet can be arranged at an accurate position. The adhesive portion may be provided on one side of the high-frequency dielectric adhesive layer, or may be provided on both sides. Also, the adhesive portion may be provided on the entire surface of the high-frequency dielectric adhesive layer, or may be provided partially.

Further, the high-frequency dielectric heating adhesive sheet may be partially provided with holes and projections for temporary fixation. By having holes and projections for temporary fixing, when the high-frequency dielectric heating adhesive sheet is sandwiched between members, it is possible to prevent misalignment and place it in an accurate position.

The number of members as adherends used in the bonding method using the high-frequency dielectric heating adhesive sheet is not particularly limited.

Also, the high-frequency dielectric heating adhesive sheet may be sandwiched over the entire area between the first member and the second member, or one or two or more high-frequency dielectric heating adhesive sheets may be sandwiched between the first member and the second member. An example of a mode in which the high-frequency dielectric heating adhesive sheet is partially arranged between members includes a mode in which the high-frequency dielectric heating adhesive sheet is arranged in a frame shape along the outer peripheral portion of the bonding surface between the first member and the second member. By arranging the high-frequency dielectric heating adhesive sheet in a frame shape, the size of the high-frequency dielectric heating adhesive sheet to be used can be reduced, so that the time for high-frequency dielectric heating treatment can be shortened and the weight of the temporary structure can be reduced.

Further, the high-frequency dielectric heating treatment is not limited to the dielectric heating bonding device in which the electrodes are arranged opposite to each other as described in the above embodiment, and for example, a lattice electrode type high-frequency dielectric heating device may be used. A lattice electrode type high-frequency dielectric heating device has a lattice electrode in which first electrodes and second electrodes having a polarity opposite to that of the first electrodes are alternately arranged on the same plane at regular intervals. For example, when manufacturing or dismantling the temporary structure 1, a grid electrode is arranged on the side of the plate member 20 or the side of the prismatic member 31 to apply a high frequency.

When a temporary structure is manufactured or dismantled using a lattice electrode type high-frequency dielectric heating apparatus, lattice electrodes (first lattice electrode and second lattice electrode) may be placed on both the plate material side and the prismatic member side of the temporary structure, and high frequencies may be applied simultaneously from both sides.
For example, when manufacturing or dismantling the temporary structure 1, a first grid electrode may be placed on the plate member 20 side, a second grid electrode may be placed on the prismatic member 31 side, and a high frequency may be applied simultaneously.

When a temporary structure is manufactured or dismantled using a grid electrode type high-frequency dielectric heating apparatus, a grid electrode may be placed on one side of the temporary structure to apply a high frequency, and then a grid electrode may be placed on the other side of the temporary structure to apply a high frequency.
For example, when manufacturing or disassembling the temporary structure 1, a grid electrode may be placed on the plate member 20 side to apply a high frequency, and then a grid electrode may be placed on the prismatic member 31 side to apply a high frequency.

It is preferable to use a grid electrode type high frequency dielectric heating device for applying high frequency. By using a lattice electrode type high-frequency dielectric heating device, the surface layer of the temporary structure, for example, the surface layer closer to the high-frequency dielectric heating adhesive sheet, can be bonded by dielectric heating without being affected by the thickness of the temporary structure. In addition, by using a lattice electrode type high-frequency dielectric heating device, it is possible to save energy in manufacturing a temporary structure.

For the sake of simplification, the drawing illustrates an embodiment using a dielectric heating bonding device in which electrodes are arranged opposite to each other.

Further, in the above-described embodiment, the apparatus including the first high-frequency applying electrode and the second high-frequency applying electrode having the press mechanism has been described as an example, but the present invention is not limited to the case of using such an apparatus. The method of pressurizing the plate material, the high-frequency dielectric heating adhesive sheet, and the prismatic member is not limited to a mechanical press mechanism.

The present invention will be described in more detail below with reference to examples. The present invention is by no means limited to these examples.

[Preparation of high-frequency dielectric heating adhesive sheet]
[Example 1]
Ethylene-vinyl acetate copolymer (manufactured by Tosoh Corporation, product name "Ultrathen 626", softening point: 65°C, melt flow rate: 3 g/10 min, density: 0.936 g/cm ³ ; vinyl acetate content: 15% by mass) as component A is 80.0% by volume, and zinc oxide (manufactured by Sakai Chemical Industry Co., Ltd., product name: "LPZINC11", average particle size: 11 µm, indicated as ZnO in Table 1) as component B. 20.0% by volume and , were each weighed into a container. Table 1 shows the blending ratio of each component. The blending ratio of each component in Table 1 is a value expressed in volume %. Table 1 also shows values converted into parts by mass as the compounding ratio of the B component. In Example 1, 142 parts by mass of component B was added to 100 parts by mass of component A.
The weighed A and B components were premixed in a container. After pre-mixing each component, it is supplied to a hopper of a 30mmΦ twin-screw extruder, the cylinder setting temperature is set to 180 ° C. or higher and 200 ° C. or lower, and the die temperature is set to 200 ° C., melted and kneaded, and then processed into pellets with a pelletizer.
Next, the obtained pellets are put into a hopper of a single-screw extruder equipped with a T-die, and a sheet-shaped melt-kneaded product is extruded from the T-die under the conditions of a cylinder temperature of 200 ° C. and a die temperature of 200 ° C., and cooled with a cooling roll to prepare a high-frequency dielectric heating adhesive sheet with a thickness of 400 μm. Using the obtained high-frequency dielectric heating adhesive sheet, the plywood as the first member and the plywood as the second member were bonded under the following high-frequency application conditions to obtain the temporary structure of Example 1.

<High frequency application conditions>
The plywood as the first member, the obtained high-frequency dielectric heating adhesive sheet, and the members listed in Table 1 as the second member were superimposed, and a high-frequency dielectric heating apparatus of grid electrode type (manufactured by Yamamoto Vinita Co., Ltd.) was used to apply high-frequency waves for 20 seconds under the conditions of a frequency of 40 MHz and an output of 1,000 W.

[Examples 2 to 4]
Temporary structures of Examples 2 to 4 were obtained in the same manner as in Example 1 except that the combination of the first member and the second member and the A component were changed as shown in Table 1 below, and the temperature during kneading and film formation was appropriately adjusted.
As component A in Example 4, maleic anhydride-modified polyethylene (manufactured by Mitsubishi Chemical Corporation, product name “Modic L553”, softening point: 84°C, melt flow rate (190°C): 1.4 g/10 minutes, density: 0.920 g/cm ³ ) was used.

[Evaluation of high-frequency dielectric heating adhesive sheet]
(tensile shear force)
The produced high-frequency dielectric heating adhesive sheet was cut into a size of 25 mm×12.5 mm×0.4 mm (thickness). After sandwiching the cut high-frequency dielectric heating adhesive sheet between a pair of plywood (25 mm × 100 mm × 1.5 mm) as an adherend, a parallel plate type high-frequency dielectric heating device (manufactured by Yamamoto Vinita Co., Ltd.) was used to apply a high frequency for 20 seconds under the conditions of a frequency of 40 MHz and an output of 200 W to prepare a test piece for adhesive strength evaluation. After standing for 24 hours in a standard environment (23° C., 50% RH), a universal tensile tester (Instron 5581, manufactured by Instron) was used to measure the tensile shear strength of the adhesive force evaluation test piece at a tensile speed of 100 mm/min. A case where the adhesive strength was 1 MPa or more, or a case where the plywood as an adherend was destroyed was regarded as acceptable. The tensile shear force was measured according to JIS K 6850:1999.

(dielectric properties)
The produced high-frequency dielectric heating adhesive sheet was cut into a size of 30 mm×30 mm. Using an impedance material analyzer E4991 (manufactured by Agilent), the dielectric constant (ε′) and dielectric loss tangent (tan δ) of the cut high-frequency dielectric heating adhesive sheet were measured at 23° C. and a frequency of 40 MHz. Based on the measurement results, the values of the dielectric properties (tan δ/ε') were calculated.

(softening point)
The Vicat softening point of the high-frequency dielectric heating adhesive sheet was measured according to JIS K7206:2016.

(5% weight loss temperature)
The 5% weight loss temperature (the temperature at which the weight loss is measured while raising the temperature of the measurement sample and the weight loss reaches 5% by weight) was measured using a differential thermal analyzer (manufactured by Shimadzu Corporation, TG/DTA analyzer DTG-60). A sample to be measured was heated from 40° C. to 500° C. at a heating rate of 10° C./min in a dry nitrogen atmosphere, and the 5% weight loss temperature of the sample to be measured was measured.

(dismantling)
A grid electrode type high-frequency dielectric heating apparatus (manufactured by Yamamoto Vinita Co., Ltd.) was used to apply high-frequency power to the prepared test piece for adhesion evaluation under conditions of a frequency of 40 MHz and an output of 1000 W for 20 seconds. By pulling the plywood as an adherend by hand, the case where the plywood could be separated from each other was regarded as passing.

(softening point)
The Vicat softening point of the high-frequency dielectric heating adhesive sheet was measured according to JIS K 7206:2016.

(density)
The density (g/cm ³ ) of the high-frequency dielectric heating adhesive sheet was measured according to JIS K 7112:1999 A method (submersion method in water).

(Melt flow rate at 230°C)
The melt flow rate (MFR) of the high-frequency dielectric heating adhesive sheet was measured at a test temperature of 230° C. and a load of 2.16 kg according to JIS K 7210-1:2014.

According to the high-frequency dielectric heating adhesive sheets according to Examples 1 to 4, the first member and the second member could be strongly bonded in a short time. Moreover, it was found that the temporary structures produced using the high-frequency dielectric heating adhesive sheets according to Examples 1 to 4 could be dismantled safely and easily.

1, 1A, 2 Temporary structure 11, 11A, 11B, 11C, 11D, 11E, 12, 12A, 12B, 12C, 12D High-frequency dielectric heating adhesive sheet 20, 22 Plate (first member) 31, 31A, 31B, 31C, 31D, 32, 32A, 32B, 32C, 32D Prismatic member (second member).

Claims (11)

A high frequency dielectric heating adhesive sheet comprising a high frequency dielectric adhesive layer,
The high-frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B),
The dielectric filler (B) is zinc oxide,
The high-frequency dielectric adhesive layer has a thickness of 10 μm or more and 600 μm or less,
The high-frequency dielectric heating adhesive sheet is used for a temporary structure that is separated into a plurality of members on the adhesive surface after use ,
The plurality of members includes a first member and a second member;
The high-frequency dielectric heating adhesive sheet is sandwiched between the first member and the second member in the temporary structure to join the first member and the second member,
One of the first member and the second member is wood, and the other of the first member and the second member is a member made of a material selected from the group consisting of wood, glass, resin and metal .
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to claim 1 ,
The dielectric property (tan δ/ε′) calculated from the dielectric loss tangent tan δ and the dielectric constant ε′ measured under the condition of a frequency of 40 MHz at 23° C. is 0.005 or more.
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to claim 1 or claim 2 ,
The high-frequency dielectric adhesive layer contains 3% by volume or more and 40% by volume or less of the dielectric filler (B).
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 3 ,
The high frequency dielectric adhesive layer contains 5 parts by mass or more and 800 parts by mass or less of the dielectric filler (B) with respect to 100 parts by mass of the thermoplastic resin (A).
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 4 ,
The average particle size of the dielectric filler (B) measured according to JIS Z 8819-2:2001 is 1 μm or more and 30 μm or less.
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 5 ,
The Vicat softening point of the thermoplastic resin (A) measured according to JIS K 7206:2016 is 40° C. or higher and 200° C. or lower.
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 6 ,
The high-frequency dielectric adhesive layer has an MFR of 0.6 g/10 minutes or more and 85 g/10 minutes or less at 230° C. measured in accordance with JIS K 7210:2014.
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 7 ,
The density of the high-frequency dielectric heating adhesive sheet is 3 g/cm ³ or less,
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 8 ,
The high-frequency dielectric adhesive layer has a 5% weight loss temperature of 300° C. or higher.
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 9 ,
The high-frequency dielectric heating adhesive sheet is used by applying a high frequency of 1 kHz or more and 300 MHz or less,
High frequency dielectric heating adhesive sheet. In the high-frequency dielectric heating adhesive sheet according to any one of claims 1 to 10 ,
The high-frequency dielectric heating adhesive sheet is used with a high-frequency application time of 1 second or more and 60 seconds or less.
High frequency dielectric heating adhesive sheet.

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