JPWO2023013651A1 - - Google Patents
Info
- Publication number
- JPWO2023013651A1 JPWO2023013651A1 JP2023540370A JP2023540370A JPWO2023013651A1 JP WO2023013651 A1 JPWO2023013651 A1 JP WO2023013651A1 JP 2023540370 A JP2023540370 A JP 2023540370A JP 2023540370 A JP2023540370 A JP 2023540370A JP WO2023013651 A1 JPWO2023013651 A1 JP WO2023013651A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/40—Applying molten plastics, e.g. hot melt
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021129845 | 2021-08-06 | ||
PCT/JP2022/029692 WO2023013651A1 (en) | 2021-08-06 | 2022-08-02 | Bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023013651A1 true JPWO2023013651A1 (en) | 2023-02-09 |
Family
ID=85155643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023540370A Pending JPWO2023013651A1 (en) | 2021-08-06 | 2022-08-02 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2023013651A1 (en) |
CN (1) | CN117677483A (en) |
TW (1) | TW202328368A (en) |
WO (1) | WO2023013651A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57148619A (en) * | 1981-03-09 | 1982-09-14 | Honshu Paper Co Ltd | Method and apparatus for bonding of container or the like by high frequency induction heating |
JP3673901B2 (en) * | 1995-03-31 | 2005-07-20 | タキロン株式会社 | High frequency welding method of polypropylene sheet and insulating material used in this method |
JP2004222990A (en) * | 2003-01-23 | 2004-08-12 | Nooteepu Kogyo Kk | Bonding method for footwear, and footwear |
JP6097914B2 (en) * | 2012-08-17 | 2017-03-22 | 埼玉県 | Adhesive and resin bonding method |
US11542415B2 (en) * | 2017-04-03 | 2023-01-03 | Lintec Corporation | High-frequency dielectric heating adhesive sheet, and adhesion method in which same is used |
-
2022
- 2022-08-02 CN CN202280051134.9A patent/CN117677483A/en active Pending
- 2022-08-02 JP JP2023540370A patent/JPWO2023013651A1/ja active Pending
- 2022-08-02 WO PCT/JP2022/029692 patent/WO2023013651A1/en active Application Filing
- 2022-08-05 TW TW111129471A patent/TW202328368A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN117677483A (en) | 2024-03-08 |
WO2023013651A1 (en) | 2023-02-09 |
TW202328368A (en) | 2023-07-16 |