TW202328064A - 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法 - Google Patents

感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法 Download PDF

Info

Publication number
TW202328064A
TW202328064A TW111146849A TW111146849A TW202328064A TW 202328064 A TW202328064 A TW 202328064A TW 111146849 A TW111146849 A TW 111146849A TW 111146849 A TW111146849 A TW 111146849A TW 202328064 A TW202328064 A TW 202328064A
Authority
TW
Taiwan
Prior art keywords
group
represented
formula
acid
radiation
Prior art date
Application number
TW111146849A
Other languages
English (en)
Chinese (zh)
Inventor
渋谷愛菜
上村稔
金子明弘
小島雅史
後藤研由
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202328064A publication Critical patent/TW202328064A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW111146849A 2021-12-10 2022-12-07 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法 TW202328064A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-201239 2021-12-10
JP2021201239 2021-12-10

Publications (1)

Publication Number Publication Date
TW202328064A true TW202328064A (zh) 2023-07-16

Family

ID=86730227

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111146849A TW202328064A (zh) 2021-12-10 2022-12-07 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法及電子器件之製造方法

Country Status (7)

Country Link
US (1) US20240329524A1 (https=)
EP (1) EP4446811A4 (https=)
JP (1) JPWO2023106171A1 (https=)
KR (1) KR102937068B1 (https=)
CN (1) CN118451368A (https=)
TW (1) TW202328064A (https=)
WO (1) WO2023106171A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202513539A (zh) * 2023-09-26 2025-04-01 日商Jsr股份有限公司 感放射線性組成物及圖案形成方法
WO2025115477A1 (ja) * 2023-11-28 2025-06-05 サンアプロ株式会社 スルホニウム塩及び酸発生剤

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007293250A (ja) * 2006-03-27 2007-11-08 Fujifilm Corp ポジ型レジスト組成物およびそれを用いたパターン形成方法
JP2013061648A (ja) 2011-09-09 2013-04-04 Rohm & Haas Electronic Materials Llc フォトレジスト上塗り組成物および電子デバイスを形成する方法
KR102075960B1 (ko) 2012-03-14 2020-02-11 제이에스알 가부시끼가이샤 포토레지스트 조성물, 레지스트 패턴 형성 방법, 산 확산 제어제 및 화합물
JP5850873B2 (ja) 2012-07-27 2016-02-03 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法
JP5836299B2 (ja) 2012-08-20 2015-12-24 富士フイルム株式会社 パターン形成方法、感電子線性又は感極紫外線性樹脂組成物、及びレジスト膜、並びに、これらを用いた電子デバイスの製造方法
JP6002705B2 (ja) 2013-03-01 2016-10-05 富士フイルム株式会社 パターン形成方法、感活性光線性又は感放射線性樹脂組成物、レジスト膜、及び、電子デバイスの製造方法
JP5676021B2 (ja) 2014-01-06 2015-02-25 富士フイルム株式会社 感活性光線性または感放射線性樹脂組成物及びそれを用いたパターン形成方法
US9644056B2 (en) 2015-02-18 2017-05-09 Sumitomo Chemical Company, Limited Compound, resin and photoresist composition
JP6518475B2 (ja) 2015-03-20 2019-05-22 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、酸発生剤及び化合物
JP6442370B2 (ja) * 2015-06-26 2018-12-19 サンアプロ株式会社 スルホニウム塩および光酸発生剤
KR102395705B1 (ko) 2017-04-21 2022-05-09 후지필름 가부시키가이샤 Euv광용 감광성 조성물, 패턴 형성 방법, 전자 디바이스의 제조 방법
US11820735B2 (en) 2018-04-12 2023-11-21 Sumitomo Chemical Company, Limited Salt, acid generator, resist composition and method for producing resist pattern
US11378883B2 (en) 2018-04-12 2022-07-05 Sumitomo Chemical Company, Limited Salt, acid generator, resist composition and method for producing resist pattern
KR102537251B1 (ko) 2018-06-28 2023-05-26 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물, 패턴 형성 방법, 전자 디바이스의 제조 방법, 수지
JP7076570B2 (ja) 2018-09-25 2022-05-27 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
EP4198019A1 (en) * 2018-10-09 2023-06-21 Changzhou Tronly Advanced Electronic Materials Co., Ltd. Triphenylphosphonium salt compound, and uses thereof
JP7186592B2 (ja) 2018-12-04 2022-12-09 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、及び化合物
JP7218162B2 (ja) 2018-12-04 2023-02-06 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、及び化合物
WO2020158337A1 (ja) 2019-01-28 2020-08-06 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
JP7507000B2 (ja) 2019-04-25 2024-06-27 住友化学株式会社 カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法
JP7579066B2 (ja) 2019-04-25 2024-11-07 住友化学株式会社 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法
JP7489818B2 (ja) * 2019-04-25 2024-05-24 住友化学株式会社 カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法
JP7560956B2 (ja) * 2019-04-25 2024-10-03 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP2021071720A (ja) 2019-10-28 2021-05-06 Jsr株式会社 感放射線性樹脂組成物及びレジストパターン形成方法
WO2021095356A1 (ja) * 2019-11-12 2021-05-20 東洋合成工業株式会社 スルホニウム塩、酸発生剤、レジスト組成物、及びデバイスの製造方法
KR102894013B1 (ko) * 2020-09-28 2025-12-03 제이에스알 가부시키가이샤 감방사선성 수지 조성물 및 패턴 형성 방법
KR102863079B1 (ko) * 2020-11-27 2025-09-19 삼성전자주식회사 광산발생제, 이를 포함하는 포토레지스트 조성물, 및 상기 광산발생제의 제조방법

Also Published As

Publication number Publication date
KR102937068B1 (ko) 2026-03-11
EP4446811A4 (en) 2025-04-30
EP4446811A1 (en) 2024-10-16
US20240329524A1 (en) 2024-10-03
WO2023106171A1 (ja) 2023-06-15
KR20240096807A (ko) 2024-06-26
JPWO2023106171A1 (https=) 2023-06-15
CN118451368A (zh) 2024-08-06

Similar Documents

Publication Publication Date Title
JP7579861B2 (ja) 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
KR102772041B1 (ko) 패턴 형성 방법, 및 전자 디바이스의 제조 방법
KR102878549B1 (ko) 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성 수지 조성물의 제조 방법, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 전자 디바이스의 제조 방법, 수지, 및 수지의 제조 방법
KR102937062B1 (ko) 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 전자 디바이스의 제조 방법, 및 화합물
TW202323231A (zh) 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、及電子器件的製造方法
JP7646693B2 (ja) 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
TW202340163A (zh) 感光化射線性或感放射線性樹脂組成物、抗蝕劑膜、圖案形成方法和電子元件的製造方法
TW202306947A (zh) 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子元件之製造方法及化合物
KR102818947B1 (ko) 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법
TW202323335A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法
KR102937068B1 (ko) 감활성광선성 또는 감방사선성 수지 조성물, 레지스트막, 패턴 형성 방법 및 전자 디바이스의 제조 방법
TW202311215A (zh) 感光化射線性或感放射線性樹脂組成物的製造方法、圖案形成方法、電子元件的製造方法、及鎓鹽的製造方法
JP7853983B2 (ja) 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法、及び電子デバイスの製造方法
TW202432528A (zh) 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法、及鎓鹽
TW202402725A (zh) 樹脂組成物、膜、圖案形成方法、電子器件之製造方法、及化合物
KR20240123376A (ko) 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법
TWI913494B (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物之製造方法、感光化射線性或感放射線性膜、圖案形成方法、電子器件之製造方法、樹脂、及樹脂之製造方法
TW202311211A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、電子元件的製造方法及化合物
TW202340141A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、電子元件的製造方法及化合物
TW202440679A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法
TW202424012A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法
TW202540057A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、電子器件之製造方法及鎓鹽化合物
TW202411275A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法
TW202323327A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件的製造方法
TW202424091A (zh) 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法