TW202327811A - Probe pin cleaning board - Google Patents

Abstract

A probe pin cleaning board, comprising a carrier board composed of a glass fiber resin board or a single-sided copper-clad fiberglass resin board, and a bonding layer containing a binding agent that is arranged on the upper surface of the carrier board and closely adheres to the carrier board, and a cleaning layer arranged on the upper surface of the bonding layer and closely adhering to the bonding layer and composed of silicone, magnesium oxide, silicon carbide, aluminum oxide, and zirconium oxide, wherein the melting temperature of the probe pin cleaning board is above 200 DEG C.

Description

Probe Cleaning Plate

The present invention relates to a probe cleaning board, in particular to a high temperature resistant probe cleaning board.

In the manufacturing process of semiconductor devices, the product test after the wafer is packaged is called final test (Final Test), in which probe pins are often used to apply electrical signals to multiple chips on the semiconductor wafer to detect The output signal of the wafer is used to confirm whether the function of the semiconductor wafer is normal. During the test, as the probe comes into contact with the electrode, foreign matter such as particles of the electrode may adhere to the tip of the probe, which will cause noise during detection and reduce the accuracy. Even when a large foreign matter is attached, the adjacent probe may be short-circuited. cause the wafer to be destroyed. A cleaning step is therefore required to remove foreign matter from the probe.

The method of cleaning the probe is known to use a cleaning sheet mixed with grinding stone particles such as silicon oxide, silicon carbide, aluminum oxide or diamond in elastic materials such as silicone or polyurethane resin, and insert the tip of the probe into the clean Using the inside of the wafer, the grinding stone particles fixed to the elastic material abrade the tip of the probe to remove foreign matter. Or use a cleaning sheet with an adhesive colloidal layer formed on the grinding plate with tiny unevenness on the surface, so that the probe penetrates from the surface of the colloidal layer to the inside and moves on the uneven surface of the grinding plate to remove the dirt on the tip of the probe. foreign body.

However, the cleaning sheet used in the conventional technology has the problem of not being able to withstand high temperatures. In the post-package testing of wafers, there are also steps that need to be tested at high temperatures. If the probes, wafers or the use environment are not properly cooled , it may cause the cleaning sheet adhesive to overflow or even deform or fall off, resulting in inaccurate cleaning of the probe, and even damage and wear of the probe.

Therefore, the object of the present invention is to provide a probe cleaning plate that can withstand repeated heating and cooling without deformation.

The technical means adopted by the present invention to solve the problems of the prior art is to provide a probe cleaning board, which includes: a carrier board, the material of which is selected from glass fiber resin board or single-sided copper-clad glass fiber resin plate; a bonding agent layer, arranged on the upper surface of the carrier plate and closely attached to the carrier plate, the bonding agent layer comprising a bonding agent; and a cleaning layer, arranged on the upper surface of the bonding agent layer and in contact with the carrier plate The adhesive layer is closely bonded, and the cleaning layer is composed of silica gel, magnesium oxide, silicon carbide, aluminum oxide and zirconium oxide, and the melting temperature of the probe cleaning plate is above 200°C.

In one embodiment of the present invention, the aforementioned probe cleaning plate is provided, wherein the Shore A hardness of the cleaning layer is 70-98.

In one embodiment of the present invention, the aforementioned probe cleaning plate is provided, wherein the thickness of the cleaning layer is 0.2 to 0.5 mm.

In one embodiment of the present invention, the aforementioned probe cleaning plate is provided, wherein the bonding layer has a thickness of 0.01 to 0.025 mm.

In one embodiment of the present invention, the aforementioned probe cleaning plate is provided, wherein the thickness of the support plate is 0.1 to 6 mm.

Through the technical means adopted by the probe cleaning board of the present invention, a probe cleaning board for wafer test probes can be provided, which can withstand repeated heating and cooling without deformation.

Embodiments of the present invention will be described below based on FIGS. 1 to 5 . This description is not intended to limit the implementation of the present invention, but is one of the examples of the present invention.

As shown in FIG. 1 and FIG. 2 , the probe cleaning plate 100 according to the embodiment of the present invention includes a carrier plate 1 , a bonding agent layer 2 and a cleaning layer 3 .

According to the probe cleaning board 100 of the embodiment of the present invention, the material of the supporting board 1 is selected from a glass fiber resin board or a single-sided copper-clad glass fiber resin board.

According to the probe cleaning plate 100 of the embodiment of the present invention, the bonding agent layer 2 includes a bonding agent, is disposed on the upper surface of the carrier plate 1 and closely adheres to the carrier plate 1 .

According to the probe cleaning plate 100 of the embodiment of the present invention, the constituent materials of the cleaning layer 3 include silica gel, magnesium oxide, silicon carbide, aluminum oxide, and zirconium oxide, which are arranged on the upper surface of the bonding agent layer 2 and bonded to the bonding agent layer 2 Close fit with magnesia as dehumidification material and zirconia as primary probe cleaning material.

As shown in FIG. 3 , in the probe cleaning plate 100 according to the embodiment of the present invention, the area of the cleaning layer 3 and the bonding agent layer 2 is slightly smaller than that of the carrier plate 1 .

As shown in Figure 4, according to the probe cleaning plate 100 according to the embodiment of the present invention, the Shore A hardness of the cleaning layer 3 is 70 to 98. SA-257, but the present invention is not limited thereto, and a suitable one can be selected from commercially available binders according to actual needs.

As shown in FIG. 5, according to the probe cleaning plate 100 of the embodiment of the present invention, the thicknesses of the cleaning layer 3, the bonding layer 2 and the carrier plate 1 are respectively formed as T3, T2 and T1, wherein the thickness of the cleaning layer 3 is T3 The range is 0.2 to 0.5 mm, the thickness T2 of the bonding layer 2 is in the range of 0.01 to 0.025 mm, and the thickness T1 of the carrier plate 1 is in the range of 0.1 to 6 mm.

[Heat resistance test] A plurality of probe cleaning boards 100 according to the embodiment of the present invention, a commercially available probe cleaning board made in Japan, and a control group used to show the state of glue overflow after heating were prepared, and heat resistance tests were performed at different temperatures.

The heat resistance test consists of the following steps:

Step 1: Send the prepared three groups of test objects into the incubator with the specified test temperature at the same time;

Step 2: Heat the test object, and take out the test object when the temperature reaches the specified test temperature;

Step 3: Observe under the microscope whether the three groups of test objects have melting, glue overflow and deformation;

Step 4: Prepare three new groups of test objects and specify a new test temperature to repeat the previous steps 1 to 3.

The melting, glue overflow and deformation of each group of test objects observed in step 3 are recorded and shown in Table 1, where the processing temperature of 200°C is the destruction temperature, which is currently known in the industry as the probe cleaning board Structural damage such as deformation or even melting will occur at this temperature.

【Table 1】 Sample temperature (°C) control group Probe cleaning plate made in Japan Probe Cleaning Plate 100 35 Glue overflow No abnormality No abnormality 80 Glue overflow No abnormality No abnormality 90 Glue overflow No abnormality No abnormality 100 Glue overflow No abnormality No abnormality 110 Glue overflow No abnormality No abnormality 130 Glue overflow No abnormality No abnormality 140 Glue overflow No abnormality No abnormality 150 Glue overflow No abnormality No abnormality 160 Glue overflow No abnormality No abnormality 170 Glue overflow No abnormality No abnormality 180 Glue overflow No abnormality No abnormality 190 Glue overflow No abnormality No abnormality 200 Glue overflow surface wrinkle No abnormality

As shown in Table 1, the heat-treated probe cleaning plate made in Japan and the probe cleaning plate 100 according to the embodiment of the present invention are observed and compared with the control group with a microscope. If there is obvious colloid overflow as shown in the control group If the situation is judged to be overflowing glue, observe whether each surface of the cleaning plate is heated to melt or deform. If deformation is observed, record the deformation situation.

It can be seen from Table 1 that although the cleaning board made in Japan did not melt, overflow glue or deform when it was processed at a temperature of 35°C to 190°C, when the processing temperature was increased to 200°C, the cleaning board's There are wrinkles on the surface, which means that the internal structure of the probe cleaning plate has been damaged by high temperature, and it cannot maintain a smooth surface, which may cause cleaning inaccurately during use, or even damage the probes. This means that the cleaning plate made in Japan When used in a test process that requires high-temperature treatment at 200°C, if the temperature of the cleaning plate is raised to 200°C during cleaning, it may cause deformation of the cleaning plate, making cleaning inaccurate and even probe damage, which will further affect subsequent crystal processing. Round test, and if it is intended to be used in a test process that requires high temperature treatment at 200°C, an additional cooling step is required, which increases time and equipment costs.

Compared with this, the probe cleaning plate 100 according to the embodiment of the present invention not only does not melt, overflow and deform when the temperature is 35° C. to 190° C., even when the processing temperature is increased to 200° C. , and no abnormalities such as deformation were observed under the microscope, that is to say, the probe cleaning plate 100 according to the embodiment of the present invention can withstand the high temperature treatment of 200 ° C, even if the probe according to the embodiment of the present invention is cleaned during cleaning When the temperature of the board 100 rises to 200°C, the probe cleaning board 100 will not be affected by glue overflow or deformation, and the probes can be cleaned normally. Therefore, even if the probe cleaning board 100 according to the embodiment of the present invention is applied to In the test process of 200°C high temperature treatment, the probes are directly cleaned without additional cooling steps, which can reduce the required time and equipment cost compared with the conventional probe cleaning board.

The above descriptions and descriptions are only descriptions of the preferred embodiments of the present invention. Those who have common knowledge of this technology may make other modifications according to the scope of the patent application defined below and the above descriptions, but these modifications should still be It is for the inventive spirit of the present invention and within the scope of rights of the present invention.

100 probe cleaning plate 1 bearing plate 2 Binder layer 3 Cleaning layer

FIG. 1 is a perspective view showing a probe cleaning plate according to an embodiment of the present invention. FIG. 2 is a side view showing a probe cleaning plate according to an embodiment of the present invention. FIG. 3 is a top view showing a probe cleaning plate according to an embodiment of the present invention. FIG. 4 is a cross-sectional view showing a probe cleaning plate according to an embodiment of the present invention. FIG. 5 is a partially enlarged view showing a cross-sectional view of a probe cleaning plate according to an embodiment of the present invention.

100: Probe cleaning plate

1: bearing plate

3: Clean layer

Claims (5)

A probe cleaning plate comprising: A carrier board, the constituent material of the carrier board is selected from glass fiber resin board or single-sided copper-clad glass fiber resin board; A bonding agent layer is arranged on the upper surface of the carrier plate and closely adheres to the carrier plate, the bonding agent layer includes a bonding agent; and A cleaning layer, which is arranged on the upper surface of the bonding agent layer and closely adheres to the bonding agent layer, and the constituent materials of the cleaning layer include silica gel, magnesia, silicon carbide, alumina, diamond powder and zirconia, Wherein the melting temperature of the probe cleaning plate is above 200°C. The probe cleaning plate as claimed in claim 1, wherein the Shore A hardness of the cleaning layer is 70 to 98. The probe cleaning plate as claimed in item 1, wherein the cleaning layer has a thickness of 0.2 to 0.5 mm. The probe cleaning board as claimed in claim 1, wherein the bonding layer has a thickness of 0.01 to 0.025mm. The probe cleaning plate as claimed in item 1, wherein the thickness of the carrier plate is 0.1 to 6 mm.

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