TWI811956B - Probe pin cleaning board - Google Patents

Abstract

A probe pin cleaning board, comprising a carrier board composed of a glass fiber resin board or a single-sided copper-clad fiberglass resin board, and a bonding layer containing a binding agent that is arranged on the upper surface of the carrier board and closely adheres to the carrier board, and a cleaning layer arranged on the upper surface of the bonding layer and closely adhering to the bonding layer and composed of silicone, magnesium oxide, silicon carbide, aluminum oxide, and zirconium oxide, wherein the melting temperature of the probe pin cleaning board is above 200°C.

Description

Probe cleaning plate

The present invention relates to a probe cleaning plate, and in particular to a probe cleaning plate that is resistant to high temperature treatment.

In the manufacturing process of semiconductor devices, the product testing performed after the wafer is packaged is called post-packaging test (Final Test). Probe pins are often used to apply electrical signals to multiple chips on the semiconductor wafer to detect The output signal of the wafer is used to confirm whether the function of the semiconductor wafer is normal. As the probe comes into contact with the electrode during the test, foreign matter such as particles from the electrode may be attached to the tip of the probe, causing noise during detection and reduced accuracy. Even when large foreign matter is attached, adjacent probes may be short-circuited. causing the wafer to be damaged. A cleaning step is therefore required to remove foreign matter from the probe.

A conventional method for cleaning a probe is to use a cleaning chip made of an elastic material such as silicone or polyurethane resin mixed with grinding stone particles such as silicon oxide, silicon carbide, aluminum oxide or diamond, and insert the tip of the probe into the cleaning sheet. Using the inside of the wafer, the pumice particles fixed on the elastic material grind the tip of the probe to remove foreign matter. Or use a cleaning sheet with an adhesive colloid layer formed on a grinding plate with minute unevenness on the surface, so that the probe penetrates into the interior from the surface of the colloid layer and moves on the uneven surface of the grinding plate to remove the tip of the probe. foreign body.

However, the cleaning sheets used in the conventional technology are not resistant to high temperatures. During the post-packaging test of the wafer, there are also steps that require testing at high temperatures. If the probe, wafer or usage environment are not properly cooled, , the cleaning sheet adhesive may overflow and even deform or fall off, resulting in inaccurate probe cleaning and even damage and wear of the probe.

Therefore, an object of the present invention is to provide a probe cleaning plate that can withstand repeated heating and cooling processes without deformation.

The technical means adopted by the present invention to solve the problems of the prior art is to provide a probe cleaning plate, which includes: a supporting plate, the material of which is selected from a fiberglass resin board or a single-sided copper-clad glass fiber resin. board; a bonding agent layer, which is disposed on the upper surface of the supporting plate and closely adheres to the supporting plate; the bonding agent layer contains a bonding agent; and a cleaning layer, which is disposed on the upper surface of the bonding agent layer and is in close contact with the supporting plate. The bonding agent layer is closely adhered to each other. The cleaning layer is made of silicone, magnesium oxide, silicon carbide, aluminum oxide and zirconium oxide. The melting temperature of the probe cleaning plate is above 200°C.

In one embodiment of the present invention, the probe cleaning plate as mentioned above is provided, wherein the Shore A hardness of the cleaning layer is 70 to 98.

In one embodiment of the present invention, the probe cleaning plate as mentioned above is provided, wherein the thickness of the cleaning layer is 0.2 to 0.5 mm.

In an embodiment of the present invention, the probe cleaning plate as mentioned above is provided, wherein the thickness of the joint layer is 0.01 to 0.025 mm.

In one embodiment of the present invention, the probe cleaning plate as mentioned above is provided, wherein the thickness of the supporting plate is 0.1 to 6 mm.

Through the technical means used in the probe cleaning plate of the present invention, a probe cleaning plate for a wafer testing probe can be provided, which can withstand repeated heating and cooling processes without deformation.

The embodiments of the present invention will be described below based on FIGS. 1 to 5 . This description is not intended to limit the implementation of the present invention, but is one example of the present invention.

As shown in Figures 1 and 2, a probe cleaning plate 100 according to an embodiment of the present invention includes a supporting plate 1, a bonding agent layer 2 and a cleaning layer 3.

According to the probe cleaning plate 100 of the embodiment of the present invention, the material of the supporting plate 1 is selected from a fiberglass resin board or a single-sided copper-clad fiberglass resin board.

According to the probe cleaning plate 100 of the embodiment of the present invention, the bonding agent layer 2 includes a bonding agent and is disposed on the upper surface of the supporting plate 1 and closely adheres to the supporting plate 1 .

According to the probe cleaning plate 100 of the embodiment of the present invention, the cleaning layer 3 is composed of silicone, magnesium oxide, silicon carbide, aluminum oxide and zirconium oxide, and is disposed on the upper surface of the bonding agent layer 2 and connected with the bonding agent layer 2 Tight fit, with magnesium oxide as the dehumidifying material and zirconium oxide as the primary probe cleaning material.

As shown in FIG. 3 , according to the probe cleaning plate 100 according to the embodiment of the present invention, the areas of the cleaning layer 3 and the bonding agent layer 2 are slightly smaller than the supporting plate 1 .

As shown in Figure 4, according to the probe cleaning plate 100 according to the embodiment of the present invention, the Shore hardness A of the cleaning layer 3 is 70 to 98. In this embodiment, although the bonding agent is manufactured by Jiedi Co., Ltd. SA-257, but the present invention is not limited thereto, and a suitable one can be selected from commercially available binding agents according to actual needs.

As shown in FIG. 5 , according to the probe cleaning plate 100 according to the embodiment of the present invention, the thicknesses of the cleaning layer 3 , the joint layer 2 and the supporting plate 1 are respectively formed as T3 , T2 and T1 , in which the thickness T3 of the cleaning layer 3 is The thickness T2 of the joint layer 2 ranges from 0.2 to 0.5mm, the thickness T2 of the joint layer 2 ranges from 0.01 to 0.025mm, and the thickness T1 of the bearing plate 1 ranges from 0.1 to 6mm.

[Heat resistance test] A plurality of probe cleaning plates 100 according to embodiments of the present invention, a commercially available probe cleaning plate made in Japan, and a control group used to show the state of glue overflow after heating were prepared, and heat resistance tests were performed at different temperatures.

The heat resistance test includes the following steps:

Step 1: Send the three prepared groups of test objects into the heating box set with the specified test temperature at the same time;

Step 2: Heat the object under test, and take out the object under test when the temperature reaches the specified test temperature;

Step 3: Observe the three groups of test objects under a microscope to see if there is any melting, glue overflow and deformation;

Step 4: Prepare three new groups of tested objects and specify new test temperatures. Repeat the above steps 1 to 3.

The melting, glue overflow and deformation conditions of each group of tested objects observed in step 3 are recorded and shown in Table 1. The processing temperature of 200°C is the destruction temperature, which is the probe cleaning plate currently known in the industry. At this temperature, structural damage such as deformation or even melting will occur.

【Table 1】 Sample temperature(℃) control group Japanese probe cleaning plate Probe Cleaning Plate 100 35 Glue overflow No abnormality No abnormality 80 Glue overflow No abnormality No abnormality 90 Glue overflow No abnormality No abnormality 100 Glue overflow No abnormality No abnormality 110 Glue overflow No abnormality No abnormality 130 Glue overflow No abnormality No abnormality 140 Glue overflow No abnormality No abnormality 150 Glue overflow No abnormality No abnormality 160 Glue overflow No abnormality No abnormality 170 Glue overflow No abnormality No abnormality 180 Glue overflow No abnormality No abnormality 190 Glue overflow No abnormality No abnormality 200 Glue overflow surface wrinkles No abnormality

As shown in Table 1, the heated probe cleaning plate made in Japan and the probe cleaning plate 100 according to the embodiment of the present invention are observed and compared with the control group under a microscope. If there is obvious overflow of colloid as shown in the control group, The situation is judged as glue overflow. At the same time, observe whether each surface of the cleaning plate is heated and melted or deformed. If deformation is observed, record the deformation situation.

It can be seen from Table 1 that although the Japanese-made cleaning plates did not melt, overflow or deform when processed at temperatures from 35°C to 190°C, when the processing temperature was increased to 200°C, the cleaning plate's surface deteriorated. If there are wrinkles on the surface, it means that the internal structure of the probe cleaning plate has been damaged by high temperature and cannot maintain a smooth surface, which may cause inaccurate cleaning during use or even damage to the probe. This means that the cleaning plate made in Japan has been damaged. When used in test processes that require high-temperature treatment at 200°C, if the temperature of the cleaning plate is excessively raised to 200°C during cleaning, it may cause deformation of the cleaning plate, causing inaccurate cleaning and even damage to the probe, further affecting subsequent crystallization. If it is to be used in a test process that requires high temperature treatment at 200°C, additional cooling steps will be required, which will increase time and equipment costs.

In contrast, the probe cleaning plate 100 according to the embodiment of the present invention not only does not melt, overflow or deform when it is processed at a temperature of 35°C to 190°C, even when the processing temperature is increased to 200°C. , and no abnormality such as deformation was observed under a microscope. In other words, the probe cleaning plate 100 according to the embodiment of the present invention can withstand a high temperature treatment of 200°C, even if the probe according to the embodiment of the present invention is cleaned during cleaning. When the temperature of the plate 100 rises to 200°C, the probe cleaning plate 100 will still not be affected by glue overflow or deformation, and can clean the probe normally. Therefore, even if the probe cleaning plate 100 according to the embodiment of the present invention is used for needs In the test process of high temperature treatment at 200°C, the probe is directly cleaned without additional cooling steps. Compared with the conventional probe cleaning plate, the required time and equipment cost can be reduced.

The above descriptions and explanations are only descriptions of the preferred embodiments of the present invention. Those with ordinary knowledge of this technology may make other modifications based on the patent scope defined below and the above explanations, but these modifications should still be made. It is for the spirit of the present invention and within the scope of rights of the present invention.

100 Probe Cleaning Plate 1. Bearing plate 2. Binder layer 3. Clean layer

Figure 1 is a perspective view showing a probe cleaning plate according to an embodiment of the present invention. Figure 2 is a side view showing a probe cleaning plate according to an embodiment of the present invention. Figure 3 is a top view showing a probe cleaning plate according to an embodiment of the present invention. Figure 4 is a cross-sectional view showing a probe cleaning plate according to an embodiment of the present invention. FIG. 5 is a partially enlarged view showing a cross-sectional view of a probe cleaning plate according to an embodiment of the present invention.

100 Probe Cleaning Plate 1. Bearing plate 3. Clean layer

Claims (5)

A probe cleaning plate containing: A supporting board, the material of which is selected from fiberglass resin board or single-sided copper-clad fiberglass resin board; A bonding agent layer is disposed on the upper surface of the bearing plate and closely adheres to the bearing plate, the bonding agent layer includes a bonding agent; and A cleaning layer is provided on the upper surface of the bonding agent layer and closely adheres to the bonding agent layer. The composition materials of the cleaning layer include silicone gel, magnesium oxide, silicon carbide, aluminum oxide, diamond powder and zirconium oxide, The melting temperature of the probe cleaning plate is above 200°C. The probe cleaning plate according to claim 1, wherein the Shore hardness A of the cleaning layer is 70 to 98. The probe cleaning plate according to claim 1, wherein the thickness of the cleaning layer is 0.2 to 0.5 mm. The probe cleaning plate according to claim 1, wherein the thickness of the joint layer is 0.01 to 0.025mm. The probe cleaning plate as claimed in claim 1, wherein the thickness of the supporting plate is 0.1 to 6 mm.