TWI762034B - Probe cleaning device - Google Patents

Abstract

A probe cleaning device includes a cleaning layer. The cleaning layer includes a first layer body in the middle, and two second layer bodies integrally connected to two opposite sides of the first layer body respectively. The abrasive particles are disposed on at least one of the first layer and the second layer and are suitable for cleaning a probe. Wherein, based on the total weight of the cleaning layer and the abrasive particles as 100wt%, the cleaning layer is 20wt%-80wt%, and the abrasive particles are 20wt%-80wt%. The present invention provides a solution suitable for cleaning oxides or contamination on probes.

Description

Probe cleaning device

The present invention relates to a peripheral device of a measuring instrument with a probe, in particular to a probe cleaning device suitable for removing the attachments on the probe.

Instruments containing probes, such as a four-point probe for measuring thin-film resistance, may form oxides or contamination on the surface of the probes after being used for a long time. However, the probes are usually quite delicate and cannot be handled with items commonly used for cleaning and polishing, such as vegetable cloth or sandpaper, so there is indeed a need to provide a solution specifically suitable for cleaning probes.

One of the objects of the present invention is to provide a probe cleaning device that overcomes at least one of the disadvantages of the prior art.

The probe cleaning device is suitable for cleaning a probe, and includes a cleaning layer and several abrasive particles. The cleaning layer includes a first layer body in the middle, and two second layer bodies integrally connected to two opposite sides of the first layer body respectively. The abrasive particles are disposed on at least one of the first layer and the second layer and are suitable for cleaning the probe. Wherein, based on the total weight of the cleaning layer and the abrasive particles as 100wt%, the cleaning layer is 20wt%-80wt%, and the abrasive particles are 20wt%-80wt%.

The effect of the present invention is that the probes can be inserted repeatedly, and the oxides formed on the probes or the attached dirt can be removed by the abrasive particles.

Another object of the present invention is to provide a probe cleaning device that overcomes at least one of the disadvantages of the prior art.

The probe cleaning device is suitable for cleaning a probe and includes a cleaning block and several abrasive particles. The cleaning block includes an inner block located in the middle, and an outer body covering the inner block and integrally connecting the inner block. The abrasive particles are disposed on at least one of the inner block and the outer body and are suitable for cleaning the probe. Wherein, based on the total weight of the cleaning block and the abrasive particles as 100 wt %, the cleaning block is 20 wt % to 80 wt %, and the abrasive particles are 20 wt % to 80 wt %.

The effect of the present invention is that the probes can be inserted repeatedly, and the oxides formed on the probes or the attached dirt can be removed by the abrasive particles.

"Example 1"

1 and 2, an embodiment 1 of the probe cleaning device of the present invention is suitable for cleaning a probe 2 of a measuring instrument. The measuring instrument can be, for example, a four-point probe instrument for measuring sheet resistance, but not limited thereto.

The embodiment 1 includes a cleaning layer 3 and several abrasive particles 4 disposed in the cleaning layer 3 . Wherein, the example 1 only includes the layered structure of the cleaning layer 3, and does not include other layered structures.

The cleaning layer 3 is made of nitrile butadiene rubber (NBR), and based on the total weight of the cleaning layer 3 and the abrasive particles 4 as 100 wt %, the cleaning layer 3 accounts for 20 wt %.

In other embodiments of the present invention, based on the total weight of the cleaning layer 3 and the abrasive particles 4 being 100 wt %, the cleaning layer 3 can also account for α wt %, where α is an integer between 20 and 80.

In other embodiments of the present invention, the cleaning layer 3 can also be selected from silicone materials, polyethylene (PE), polypropylene (PP), polystyrene (PS), styrene-ethylene-butylene- Made of at least one selected from the group consisting of styrene copolymer (SEBS), ethylene propylene rubber (EPDM), butadiene rubber, neoprene rubber (CR) and nitrile rubber (NBR), as long as A The type of Shore hardness can be i . Wherein, i is an integer between 0 and 90.

The overall thickness T0 of the cleaning layer 3 is 280 µm, and includes a first layer body 31 in the middle, and two second layer bodies 32 integrally connected to opposite sides of the first layer body 31 respectively. In other embodiments of the present invention, the overall thickness T0 of the cleaning layer 3 can also be x μm, where x is an integer between 100 and 1600.

A first layer thickness T1 of the first layer body 31 is 100 μm, and since the first layer body 31 and each second layer body 32 are part of the cleaning layer 3 , the first layer body 31 and each layer body 32 are part of the cleaning layer 3 . The material of a second layer body 32 is the same as the aforementioned composition of the cleaning layer 3 . Each second layer body 32 has a second layer thickness T2 of 90 μm and includes an outer surface 321 opposite to the first layer body 31 .

In other embodiments of the present invention, the first layer thickness T1 of the first layer body 31 can also be y mm, and y is an integer between 80 and 1400. In other embodiments of the present invention, the second layer thickness T2 of the second layer body 32 can also be z mm, and z is an integer between 10 and 100.

The abrasive particles 4 are made of alumina with an average particle size of about 1 µm, are disposed in the first layer body 31 and the second layer body 32 , and are suitable for cleaning the probe 2 . Based on the total weight of the cleaning layer 3 and the abrasive particles 4 as 100 wt %, the abrasive particles 4 account for 80 wt %. Furthermore, based on the total weight of the cleaning layer 3 and the abrasive particles 4 being 100 wt %, the abrasive particles 4 in the first layer 31 are 20 wt %, and the abrasive particles 4 in the second layer 32 are 20 wt %. The abrasive particle 4 is 60 wt%.

Since in Example 1, the weight percent of the abrasive particles 4 is much larger than that of the cleaning layer 3, or the weight percent of the cleaning layer 3 is much smaller than the weight percent of the abrasive particles 4, in Example 1, the The cleaning layer 3 is used as a binder for bonding the abrasive particles 4 .

In other embodiments of the present invention, based on the total weight of the cleaning layer 3 and the abrasive particles 4 being 100 wt %, the abrasive particles 4 can also account for β wt %, where β is an integer between 20 and 80. Based on the total weight of the cleaning layer 3 and the abrasive particles 4 being 100 wt %, the abrasive particles 4 in the first layer body 31 can also be θ wt %, and θ is an integer between 5 and 75, which is located in the The abrasive particles 4 in the second layer body 32 can also be δ wt %, where δ is an integer between 5 and 75. In other embodiments of the present invention, the particle size and/or the average particle size of the abrasive particles 4 can also be 0.1-10 µm.

When the present embodiment 1 is used, the probe 2 is inserted therein as shown in FIG. 2 . During the process of inserting the probe 2 into the present embodiment 1, the attachments or dirt attached to the probe 2 can be scraped off by the abrasive particles 4, so that the probe 2 can be cleaned by the present embodiment 1 .

The feature of the present embodiment 1 is that oxides or dirt on the probe 2 can be cleaned through the abrasive particles 4 . In addition, because the present embodiment 1 only includes a single layer of the cleaning layer 3 and does not include other layered structures, the present embodiment 1 also has the advantage of being light and thin in that the overall thickness T0 is relatively thin.

"Examples 2 to 5"

Examples 2 to 5 are similar to Example 1, except that the proportion of the cleaning layer 3 in Example 2 is increased to 80 wt%, and Example 3 uses styrene-ethylene-butylene-styrene copolymer (SEBS) Instead of nitrile rubber (NBR), in Example 4, in addition to replacing nitrile rubber (NBR) with styrene-ethylene-butylene-styrene copolymer (SEBS), the proportion of cleaning layer 3 was also increased to 80wt%. The proportion of the cleaning layer in Example 5 is 60%, of which 30% is SEBS and the other 30% is NBR. The types and amounts of materials actually used in Examples 2 to 5 are recorded in Table 1.

"Cleaning Effect Test"

<Preparation of samples>

Get a metal pad made of tin, and several new probes. Each new probe was repeatedly inserted into the metal pad 1000 times under the condition of acupuncture pressure of 500 UM, so that the new probe became a sample probe after use. Wherein, the resistance value of each sample probe will increase from about 50 milliohms to about 100 milliohms due to the influence of attachments or dirt, compared with the new probe corresponding to the beginning.

<Cleaning the probe>

The sample probes were also repeatedly inserted into Examples 1 to 5 under the condition of acupuncture pressure of 500 UM. After each insertion and extraction, the resistance value of the sample probe was measured once until the resistance value of the sample probe decreased. Return to about 50 milliohms and record the number of cleanings (mating cycles) required to get back to about 50 milliohms.

<Inspect the needle shape>

The cleaned sample probe was placed under a microscope with the needle tip facing upwards to observe the condition of the needle tip, and the shape of the cleaned needle was recorded in Table 1. [Table 1] Example 1 Example 2 type Usage amount (wt%) type Usage amount (wt%) cleaning layer 3 NBR 20 NBR 80 Abrasive particles 4 Alumina 80 Alumina 20 total 100 100 Number of times required to drop to 50 milliohms 6 10 pin test not deformed not deformed Example 3 Example 4 type Usage amount (wt%) type Usage amount (wt%) cleaning layer 3 SEBS 20 SEBS 80 Abrasive particles 4 Alumina 80 Alumina 20 total 100 100 Number of times required to drop to 50 milliohms 6 9 pin test smooth smooth Example 5 type Usage amount (wt%) cleaning layer 3 SEBS 30 NBR 30 Abrasive particles 4 Alumina 40 total 100 Number of times required to drop to 50 milliohms 8 pin test not deformed

From the experimental results in Table 1, it can be seen that compared with using SEBS, the use of NBR further has the characteristics that it is not easy to make the probe smooth. When the weight percentage of the abrasive particles 4 is high, the number of cleanings required to restore the resistance value of the sample probe to about 50 milliohms is less, that is, the higher the weight percentage of the abrasive particles 4, the higher the cleaning power. it is good.

"Example 6"

Referring to FIG. 3 , Embodiment 6 of the probe cleaning device of the present invention is similar to Embodiment 1, except that Embodiment 6 further includes an adhesive layer attached to the outer surface 321 of one of the second layers 32 51 , and a release layer 52 attached to the side of the adhesive layer 51 opposite to the outer surface 321 . In addition to the advantages of the first embodiment, the sixth embodiment can also be adhered to or beside the measuring instrument after the release layer 52 is removed, so as to facilitate the cleaning of the probe 2 .

"Example 7"

Referring to FIGS. 4 and 5 , an embodiment 7 of the probe cleaning device of the present invention is also suitable for cleaning the probe 2 (see FIG. 2 ), and includes a cleaning block 6 and several The abrasive particles 4. Based on the total weight of the cleaning block 6 and the abrasive particles 4 as 100 wt %, the cleaning block 6 is 80 wt %, and the abrasive particles are 20 wt %.

In other embodiments of the present invention, based on the total weight of the cleaning block 6 and the abrasive particles 4 being 100 wt %, the cleaning block 6 can also account for χ wt %, where χ is an integer between 20 and 80, with When the total weight of the cleaning block 6 and the abrasive particles 4 is 100 wt %, the abrasive particles 4 can also account for ψ wt %, where ψ is an integer between 20 and 80.

The cleaning block 6 includes an inner block 61 in the middle of a cube, and an outer body 62 integrally connected to the inner block 61 and covering the inner block 61 and having a cube shape. The side length S1 of the inner block 61 is 1000 µm. A third layer thickness T3 of the outer body 62 is 200 µm.

The abrasive particles 4 are arranged in the inner block body 61 and the outer layer body 62 . Wherein, based on the total weight of the cleaning block 6 and the abrasive particles 4 as 100 wt %, the abrasive particles 4 in the cleaning block 6 are 15 wt %, and the abrasive particles 4 in the outer body 62 are 5 wt %.

In other embodiments of the present invention, the side length S1 can also be p µm, p is an integer between 500 and 3000, the third layer thickness T3 can also be q µm, and q is an integer between 100 and 250. Based on the total weight of the cleaning block 6 and the abrasive particles 4 being 100 wt %, the weight percentage of the abrasive particles 4 in the inner block 61 can also be ε wt %, where ε is an integer between 5 and 75, located in The weight percentage of the abrasive particles 4 in the outer layer body 62 can also be ζ wt %, where ζ is an integer between 5 and 75.

To sum up, the effect of the probe cleaning device of the present invention is that the probe 2 can be inserted repeatedly, and the oxides formed on the probe 2 or the attached dirt can be removed by grinding through the abrasive particles 4 .

The above descriptions are merely examples of the present invention, which cannot limit the scope of the patent application of the present invention, and the simple equivalent changes and modifications according to the patent application scope of the present invention and the patent specification should also be regarded as the present invention. Covered by the scope of the patent application.

2: Probe

3: cleaning layer

31: first layer body

32: Second layer body

321: outer surface

4: Abrasive particles

51: Adhesive layer

52: release layer

6: Cleaning Blocks

61: Inner block

62: Outer body

S1: side length

T0: Overall thickness

T1: Thickness of the first layer

T2: Second layer thickness

T3: The third layer is thick

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: 1 is a cross-sectional view illustrating an embodiment 1 of the probe cleaning device of the present invention. The imaginary line in the figure is used to illustrate the boundary between a first layer body and two second layer bodies rather than an actual layer, and the figure The abrasive particles in are for illustration only, not the actual distribution; Fig. 2 is a sectional view, similar to Fig. 1, illustrating the use of this embodiment 1; Figure 3 is a cross-sectional view illustrating an embodiment 6 of the probe cleaning device of the present invention; Figure 4 is a perspective view illustrating an embodiment 7 of the probe cleaning apparatus of the present invention; and FIG. 5 is a cross-sectional view illustrating Embodiment 7. The imaginary line in the figure is used to illustrate the boundary between an inner block and an outer layer rather than an actual layer, and the abrasive particles in the figure are for illustration only, not actual distribution situation.

3: cleaning layer

31: first layer body

32: Second layer body

321: outer surface

4: Abrasive particles

51: Adhesive layer

52: release layer

T0: Overall thickness

T1: Thickness of the first layer

T2: Second layer thickness

Claims (9)

A probe cleaning device, suitable for cleaning a probe, and comprising: a cleaning layer, including a first layer body in the middle, and two second layers integrally connected to two opposite sides of the first layer body respectively. body; and a number of abrasive particles, arranged in at least one of the first layer body and the second layer body and suitable for cleaning the probe; wherein, the total weight of the cleaning layer and the abrasive particles is 100wt% In total, the cleaning layer is 20wt%~80wt%, and the abrasive particles are 20wt%~80wt%; wherein, the cleaning layer is selected from silicone materials, polyethylene, polypropylene, polystyrene, styrene-ethylene- It is made of at least one selected from the group consisting of butene-styrene copolymer, ethylene propylene rubber, butadiene rubber, neoprene rubber and nitrile rubber, and can be penetrated by the probe. The probe cleaning device according to claim 1, wherein the abrasive particles are arranged in the first layer body and the second layer body, and the total weight of the cleaning layer and the abrasive particles is 100wt% , the weight percentage of the abrasive particles in the first layer body is 20-80 wt %. The probe cleaning device according to claim 1, wherein a first layer thickness of the first layer body is 80-1400 μm, and a second layer thickness of each second layer body is 10-100 μm. The probe cleaning device according to claim 1, wherein the A-type Shaw hardness of the cleaning layer is 0-90, and the abrasive particles are made of alumina. The probe cleaning device as claimed in claim 1, comprising only the cleaning layer and no other layered structures. The probe cleaning device according to claim 1, wherein the abrasive particles have a particle size of 0.1-10 μm. A probe cleaning device is suitable for cleaning a probe, and comprises: a cleaning block, including an inner block body located in the middle, and an outer layer body covering the inner block body and integrally connecting the inner block body; Particles, disposed on at least one of the inner block and the outer body and suitable for cleaning the probe; wherein, based on the total weight of the cleaning block and the abrasive particles as 100 wt %, the cleaning block is 20 wt % ~80wt%, the abrasive particles are 20wt%~80wt%; wherein, the cleaning block is selected from silicone material, polyethylene, polypropylene, polystyrene, styrene-ethylene-butylene-styrene copolymer, It is made of at least one selected from the group consisting of ethylene propylene rubber, butadiene rubber, neoprene rubber and nitrile rubber, and can be penetrated by the probe. The probe cleaning device according to claim 7, wherein the inner block is hexahedral, the side length of the inner block is 500-3000 μm, and a third layer thickness of the outer body is 100-250 μm . The probe cleaning device as claimed in claim 7, wherein the abrasive particles are arranged in the inner block and the outer layer, and based on the total weight of the cleaning block and the abrasive particles as 100 wt%, the The weight percentage of the abrasive particles in the inner block is 20-80 wt %.

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