TW202324833A - 採用（諸）整合槽形天線的封裝基板，以及相關的積體電路（ｉｃ）封裝和製造方法 - Google Patents

採用（諸）整合槽形天線的封裝基板，以及相關的積體電路（ｉｃ）封裝和製造方法 Download PDF

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Publication number
TW202324833A
TW202324833A TW111121639A TW111121639A TW202324833A TW 202324833 A TW202324833 A TW 202324833A TW 111121639 A TW111121639 A TW 111121639A TW 111121639 A TW111121639 A TW 111121639A TW 202324833 A TW202324833 A TW 202324833A
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TW
Taiwan
Prior art keywords
substrate
antenna
slot
package
conductive
Prior art date
Application number
TW111121639A
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English (en)
Chinese (zh)
Inventor
延宰賢
方崑
黃秀亨
曹賢哲
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美商高通公司
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Application filed by 美商高通公司 filed Critical 美商高通公司
Publication of TW202324833A publication Critical patent/TW202324833A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/062—Two dimensional planar arrays using dipole aerials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
TW111121639A 2021-07-14 2022-06-10 採用（諸）整合槽形天線的封裝基板，以及相關的積體電路（ｉｃ）封裝和製造方法 TW202324833A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/375,289 2021-07-14
US17/375,289 US20230014567A1 (en) 2021-07-14 2021-07-14 Package substrate employing integrated slot-shaped antenna(s), and related integrated circuit (ic) packages and fabrication methods

Publications (1)

Publication Number Publication Date
TW202324833A true TW202324833A (zh) 2023-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW111121639A TW202324833A (zh) 2021-07-14 2022-06-10 採用（諸）整合槽形天線的封裝基板，以及相關的積體電路（ｉｃ）封裝和製造方法

Country Status (7)

Country Link
US (1) US20230014567A1 (enExample)
EP (1) EP4371186A1 (enExample)
JP (1) JP2024527308A (enExample)
KR (1) KR20240031309A (enExample)
CN (1) CN117597830A (enExample)
TW (1) TW202324833A (enExample)
WO (1) WO2023288163A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217691636U (zh) * 2019-09-27 2022-10-28 株式会社村田制作所 天线模块
CN117121373A (zh) * 2021-03-31 2023-11-24 株式会社村田制作所 高频模块和通信装置
US11978697B2 (en) * 2021-07-16 2024-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure
US11894314B2 (en) * 2021-09-10 2024-02-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation
US12074360B2 (en) * 2021-10-22 2024-08-27 Sensorview Co., Ltd. RFIC assembled antenna
US12347929B2 (en) * 2022-08-12 2025-07-01 Apple Inc. Antenna feed structure
WO2025115920A1 (ja) * 2023-11-27 2025-06-05 株式会社村田製作所 アンテナモジュール及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9806422B2 (en) * 2013-09-11 2017-10-31 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
WO2016120254A1 (en) * 2015-01-27 2016-08-04 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna structure
EP3449532B1 (en) * 2016-04-28 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method
KR102423296B1 (ko) * 2017-09-14 2022-07-21 삼성전자주식회사 Pcb를 포함하는 전자 장치
KR102019354B1 (ko) * 2017-11-03 2019-09-09 삼성전자주식회사 안테나 모듈
KR102022353B1 (ko) * 2018-01-18 2019-09-18 삼성전기주식회사 안테나 모듈
US10862211B2 (en) * 2018-08-21 2020-12-08 Htc Corporation Integrated antenna structure
KR102733019B1 (ko) * 2019-07-17 2024-11-21 삼성전자주식회사 안테나 모듈 및 그것을 포함하는 전자 장치
JP7382776B2 (ja) * 2019-09-30 2023-11-17 日本特殊陶業株式会社 偏波共用アンテナ
US11670836B2 (en) * 2020-10-29 2023-06-06 Advanced Semiconductor Engineering, Inc. Semiconductor device package

Also Published As

Publication number Publication date
US20230014567A1 (en) 2023-01-19
JP2024527308A (ja) 2024-07-24
EP4371186A1 (en) 2024-05-22
WO2023288163A1 (en) 2023-01-19
KR20240031309A (ko) 2024-03-07
CN117597830A (zh) 2024-02-23

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