CN117597830A - 采用集成槽形天线的封装基板及相关集成电路（ic）封装和制造方法 - Google Patents

采用集成槽形天线的封装基板及相关集成电路（ic）封装和制造方法 Download PDF

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Publication number
CN117597830A
CN117597830A CN202280047564.3A CN202280047564A CN117597830A CN 117597830 A CN117597830 A CN 117597830A CN 202280047564 A CN202280047564 A CN 202280047564A CN 117597830 A CN117597830 A CN 117597830A
Authority
CN
China
Prior art keywords
substrate
antenna
slot
metallization
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280047564.3A
Other languages
English (en)
Chinese (zh)
Inventor
J·杨
方堃
S·黄
H·赵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN117597830A publication Critical patent/CN117597830A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/062—Two dimensional planar arrays using dipole aerials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
CN202280047564.3A 2021-07-14 2022-06-14 采用集成槽形天线的封装基板及相关集成电路（ic）封装和制造方法 Pending CN117597830A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/375,289 2021-07-14
US17/375,289 US20230014567A1 (en) 2021-07-14 2021-07-14 Package substrate employing integrated slot-shaped antenna(s), and related integrated circuit (ic) packages and fabrication methods
PCT/US2022/072928 WO2023288163A1 (en) 2021-07-14 2022-06-14 Package substrate employing integrated slot-shaped antenna(s), and related integrated circuit (ic) packages and fabrication methods

Publications (1)

Publication Number Publication Date
CN117597830A true CN117597830A (zh) 2024-02-23

Family

ID=82547514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280047564.3A Pending CN117597830A (zh) 2021-07-14 2022-06-14 采用集成槽形天线的封装基板及相关集成电路（ic）封装和制造方法

Country Status (7)

Country Link
US (1) US20230014567A1 (enExample)
EP (1) EP4371186A1 (enExample)
JP (1) JP2024527308A (enExample)
KR (1) KR20240031309A (enExample)
CN (1) CN117597830A (enExample)
TW (1) TW202324833A (enExample)
WO (1) WO2023288163A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217691636U (zh) * 2019-09-27 2022-10-28 株式会社村田制作所 天线模块
CN117121373A (zh) * 2021-03-31 2023-11-24 株式会社村田制作所 高频模块和通信装置
US11978697B2 (en) * 2021-07-16 2024-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure
US11894314B2 (en) * 2021-09-10 2024-02-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation
US12074360B2 (en) * 2021-10-22 2024-08-27 Sensorview Co., Ltd. RFIC assembled antenna
US12347929B2 (en) * 2022-08-12 2025-07-01 Apple Inc. Antenna feed structure
WO2025115920A1 (ja) * 2023-11-27 2025-06-05 株式会社村田製作所 アンテナモジュール及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9806422B2 (en) * 2013-09-11 2017-10-31 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
WO2016120254A1 (en) * 2015-01-27 2016-08-04 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna structure
EP3449532B1 (en) * 2016-04-28 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method
KR102423296B1 (ko) * 2017-09-14 2022-07-21 삼성전자주식회사 Pcb를 포함하는 전자 장치
KR102019354B1 (ko) * 2017-11-03 2019-09-09 삼성전자주식회사 안테나 모듈
KR102022353B1 (ko) * 2018-01-18 2019-09-18 삼성전기주식회사 안테나 모듈
US10862211B2 (en) * 2018-08-21 2020-12-08 Htc Corporation Integrated antenna structure
KR102733019B1 (ko) * 2019-07-17 2024-11-21 삼성전자주식회사 안테나 모듈 및 그것을 포함하는 전자 장치
JP7382776B2 (ja) * 2019-09-30 2023-11-17 日本特殊陶業株式会社 偏波共用アンテナ
US11670836B2 (en) * 2020-10-29 2023-06-06 Advanced Semiconductor Engineering, Inc. Semiconductor device package

Also Published As

Publication number Publication date
US20230014567A1 (en) 2023-01-19
TW202324833A (zh) 2023-06-16
JP2024527308A (ja) 2024-07-24
EP4371186A1 (en) 2024-05-22
WO2023288163A1 (en) 2023-01-19
KR20240031309A (ko) 2024-03-07

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