TW202317386A - Attaching device and attaching module - Google Patents
Attaching device and attaching module Download PDFInfo
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- TW202317386A TW202317386A TW111122106A TW111122106A TW202317386A TW 202317386 A TW202317386 A TW 202317386A TW 111122106 A TW111122106 A TW 111122106A TW 111122106 A TW111122106 A TW 111122106A TW 202317386 A TW202317386 A TW 202317386A
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Abstract
Description
本發明涉及一種貼合裝置,尤其涉及一種具備張力調整功能的貼合裝置及貼合模組。The invention relates to a bonding device, in particular to a bonding device and a bonding module with a tension adjustment function.
現有的貼合裝置包含有一承載平台以及一壓合機構,並且現有的貼合裝置是通過移動壓合機構而直接將一貼合物件壓抵於一被貼物件。然而,由於現今貼合需求越來越多樣化,所以現有貼合裝置的結構設計已逐漸無法符合現今的貼合需求。The existing bonding device includes a carrying platform and a pressing mechanism, and the existing bonding device directly presses a bonding object against a pasted object by moving the pressing mechanism. However, due to the increasingly diverse lamination requirements, the structural design of the existing lamination devices has gradually failed to meet the current lamination requirements.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believes that the above-mentioned defects can be improved, Naite devoted himself to research and combined with the application of scientific principles, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned defects.
本發明實施例在於提供一種貼合裝置及貼合模組,其能有效地改善現有貼合裝置所可能產生的缺陷。The embodiment of the present invention is to provide a bonding device and a bonding module, which can effectively improve the possible defects of the existing bonding device.
本發明實施例公開一種貼合裝置,其包括:一承載機構,包含有一承載面,用來供一被貼物件設置;一壓合機構,對應於所述承載機構設置;其中,所述壓合機構包含有一充填空間、連通於所述充填空間的一充填口、及定義至少局部所述充填空間的一壓合件;其中,所述壓合機構與所述承載機構能相對地移動,並且所述壓合機構能通過所述充填口來使所述充填空間進行流體充填,以使所述充填空間膨脹而迫使所述壓合件產生變形;以及一貼合治具,選擇性地設置於所述承載面與所述壓合件之間,並且所述貼合治具包含有:一框架;至少一個緩衝組件,可活動地安裝於所述框架;以及一撓性片體,包含有一貼合區域及位於所述貼合區域外側的一周圍區域;其中,所述貼合區域面向所述承載面且用來供一貼合物件黏附,所述周圍區域固定於至少一個所述緩衝組件;至少一個張力調整總成,包含有:一驅動機構與一傳動機構,安裝於所述承載機構與所述壓合機構的其中之一,並且所述傳動機構相連於所述驅動機構;及一連接機構,安裝於所述傳動機構與至少一個所述緩衝組件的至少其中之一;其中,當所述被貼物件設置於所述承載面,並且所述貼合物件黏附於所述撓性片體,以進行一貼合作業時,所述貼合治具通過所述連接機構而連接於所述傳動機構,以使所述傳動機構與至少一個所述緩衝組件能通過所述連接機構的帶動而彼此連動。The embodiment of the present invention discloses a bonding device, which includes: a bearing mechanism, including a bearing surface, used for setting an object to be stuck; a pressing mechanism, which is arranged corresponding to the bearing mechanism; wherein, the pressing The mechanism includes a filling space, a filling port communicating with the filling space, and a pressing part defining at least part of the filling space; wherein, the pressing mechanism and the carrying mechanism can move relatively, and the The pressing mechanism can fill the filling space with fluid through the filling port, so as to expand the filling space and force the pressing part to deform; and a fitting jig is selectively arranged on the between the bearing surface and the pressing part, and the bonding fixture includes: a frame; at least one buffer component, which can be movably installed on the frame; and a flexible sheet, which contains a bonding area and a peripheral area located outside the bonding area; wherein, the bonding area faces the load-bearing surface and is used for a bonding object to be adhered, and the surrounding area is fixed to at least one of the cushioning components; at least A tension adjustment assembly, including: a driving mechanism and a transmission mechanism, installed on one of the bearing mechanism and the pressing mechanism, and the transmission mechanism is connected to the driving mechanism; and a connecting mechanism , installed on at least one of the transmission mechanism and at least one of the buffer components; wherein, when the object to be attached is arranged on the bearing surface, and the object to be attached is adhered to the flexible sheet, When carrying out a lamination operation, the lamination jig is connected to the transmission mechanism through the connection mechanism, so that the transmission mechanism and at least one of the buffer components can be driven by the connection mechanism to communicate with each other. Gearing.
本發明實施例也公開一種貼合模組,其包括:一腔體;一貼合治具,可分離地設置於所述腔體並包含有:一框架;至少一個緩衝組件,可活動地安裝於所述框架;及一撓性片體,其周圍區域固定於至少一個所述緩衝組件;以及至少一個張力調整總成,包含有:一驅動機構與一傳動機構,安裝於所述腔體,並且所述傳動機構相連於所述驅動機構;及一連接機構,安裝於所述傳動機構與至少一個所述緩衝組件的至少其中之一; 其中,所述貼合治具通過所述連接機構而連接於所述傳動機構,以使所述傳動機構與至少一個所述緩衝組件能通過所述連接機構的帶動而彼此連動。The embodiment of the present invention also discloses a bonding module, which includes: a cavity; a bonding jig, which is detachably arranged in the cavity and includes: a frame; at least one buffer component, which is movably installed on the frame; and a flexible sheet, the surrounding area of which is fixed to at least one of the buffer components; and at least one tension adjustment assembly, including: a driving mechanism and a transmission mechanism, installed in the cavity, And the transmission mechanism is connected to the drive mechanism; and a connection mechanism is installed on at least one of the transmission mechanism and at least one of the buffer components; wherein, the bonding jig is connected by the connection mechanism It is connected to the transmission mechanism, so that the transmission mechanism and at least one of the buffer components can be driven by the connection mechanism to interlock with each other.
綜上所述,於本發明實施例所公開的貼合裝置及貼合模組之中,任一個所述張力調整總成能通過相對應所述緩衝組件來調整所述撓性片體的張力,據以有效地控制所述撓性片體的所述張力值,並提升其使用壽命。In summary, among the laminating devices and laminating modules disclosed in the embodiments of the present invention, any one of the tension adjustment assemblies can adjust the tension of the flexible sheet by corresponding to the buffer assembly , so as to effectively control the tension value of the flexible sheet and increase its service life.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than to make any statement on the scope of protection of the present invention. limit.
以下是通過特定的具體實施例來說明本發明所公開有關“貼合裝置及貼合模組”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is an illustration of the implementation of the "laminating device and laminating module" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.
[實施例一][Example 1]
請參閱圖1至圖8所示,其為本發明的實施例一。本實施例公開一種貼合裝置100,其是用來將一貼合物件200貼附於一被貼物件300,並且所述被貼物件300具有一曲面301,而所述曲面301的具體形貌可以依據設計需求而加以調整變化(如:凸面或凹面)。於本實施例中,所述被貼物件300可以是一曲面玻璃(如:C形曲面玻璃或U形曲面玻璃),而所述貼合物件200則可以是一個顯示器,但本發明不受限於此。Please refer to FIG. 1 to FIG. 8 , which are the first embodiment of the present invention. This embodiment discloses a
如圖1和圖2所示,所述貼合裝置100於本實施例中包含有一承載機構1、對應於所述承載機構1設置且能彼此相對移動的一壓合機構2、連接於所述壓合機構2的一充填機構3、位於所述壓合機構2與所述承載機構1外側的一傳送機構4、連接於所述承載機構1及/或所述壓合機構2的一抽氣機構5、用來選擇性地設置於所述承載機構1與所述壓合機構2之間的一貼合治具6、及連接所述貼合治具6的兩個張力調整總成7。As shown in Figures 1 and 2, the
需說明的是,所述貼合裝置100於本實施例中所包含多個構件,其可以依據設計需求而加以增減;舉例來說,在本發明未繪示的其他實施例中,所述抽氣機構5、所述充填機構3、及所述傳送機構4的至少其中一個可以被省略;或者,所述承載機構1與所述壓合機構2的位置可以相互顛倒。以下將先對所述貼合裝置100的各個構件作一說明,而後再適時介紹構件之間的連接關係。It should be noted that the
如圖1所示,所述承載機構1包含有一第一腔體11及設置於所述第一腔體11內的一承載台12。其中,所述承載台12包含有一承載面123,用來供所述被貼物件300設置(如:所述被貼物件300可以是通過真空方式、黏貼方式、或扣合方式設置於所述承載面123)。所述承載面123可以鍍有一潤滑層,據以避免刮傷所述被貼物件300,並且所述承載面123於本實施例中為對應於上述被貼物件300的一彎曲表面。更詳細地說,所述承載台12可以包含有一平台121及可拆卸地安裝於所述平台121的一模具122,並且所述模具122形成有所述承載面123。據此,所述模具122可以依據不同的被貼物件300而加以更換。As shown in FIG. 1 , the
如圖1所示,所述壓合機構2於本實施例中包含有一第二腔體21、設置於所述第二腔體21內的一壓合件22、及安裝於所述第二腔體21且連接於所述壓合件22的一升降組件25。其中,所述壓合機構2在所述第二腔體21內設有一充填空間23及連通所述充填空間23的一充填口24,並且所述壓合機構2於本實施例中是以所述壓合件22來形成所述充填空間23,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述充填空間23也可以是由所述壓合件22與其他構件共同定義(也就是,所述壓合件22定義至少局部所述充填空間23)。As shown in Figure 1, the
更詳細地說,所述壓合件22於本實施例中包含有固定於所述升降組件25的一基座221、位在所述基座221上的一囊體222、及固定所述囊體222至所述基座221的一固定框223。其中,所述囊體222的內部定義為所述充填空間23,並且所述基座221形成有所述充填口24,而所述固定框223則是將所述囊體222的周緣壓迫固定於所述基座221,據以使所述囊體222能夠依循預設形態膨脹。然而,在本發明未繪示的其他實施例中,所述壓合件22的構造可以依據設計需求而加以調整變化。In more detail, the
再者,所述充填機構3設置於所述承載機構1與所述壓合機構2之外,並且所述充填機構3連接於所述壓合機構2的所述充填口24。據此,所述充填機構3能通過所述充填口24而選擇性地對所述充填空間23進行流體(如:氣體或液體)填充,以使所述充填空間23(或所述壓合件22)逐漸地膨脹。也就是說,所述壓合機構2能通過所述充填口24來使所述充填空間23(經由所述充填機構3)進行流體充填,以使所述充填空間23膨脹而迫使所述壓合件22產生變形。Furthermore, the
進一步地說,所述壓合機構2與所述承載機構1能於一開啟位置(如:圖1)與一密合位置(如:圖2)之間相對地移動;也就是說,所述貼合裝置100可以依據實際需求而使所述壓合機構2與所述承載機構1的至少其中一個進行移動。Furthermore, the
如圖1所示,當所述壓合機構2與所述承載機構1處於所述開啟位置時,所述第一腔體11與第二腔體21彼此間隔設置,據以使所述貼合治具6能構選擇性地設置於所述承載面123與所述壓合件22之間。於本實施例中,所述貼合裝置100是採用所述傳送機構4(如:機械手臂、吸盤、或磁吸器)來固持所述貼合治具6,並將所述貼合治具6對應於所述承載面123與所述壓合件22之間進行置入或移出。As shown in Figure 1, when the
如圖2所示,當所述壓合機構2與所述承載機構1處於所述密合位置時,其(所述第一腔體11與所述第二腔體21)共同包圍構成一作業空間P,並且所述貼合治具6位於所述作業空間P內,而所述壓合件22能夠通過所述升降組件25而相對於所述承載台12靠近或遠離。As shown in Figure 2, when the press-
其中,所述抽氣機構5於本實施例中連接於所述承載機構1的所述第一腔體11,並且當所述壓合機構2與所述承載機構1處於所述密合位置時,所述抽氣機構5用來對所述作業空間P進行抽氣,以使所述作業空間P呈真空狀,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述抽氣機構5也可以是連接於所述壓合機構2的所述第二腔體21。也就是說,本實施例的所述抽氣機構5可以是連接於所述壓合機構2與所述承載機構1的至少其中之一。Wherein, the
如圖3和圖4所示,所述貼合治具6包含有一框架61、分別可活動地安裝於所述框架61的兩個緩衝組件63、及安裝於兩個所述緩衝組件63的一撓性片體62。其中,所述框架61於本實施例中呈矩形且包含有分別位於相反兩側的兩個端部611(如:所述矩形的短邊部位)及位於相反另兩側的兩個長側部612(如:所述矩形的長邊部位)。其中,為便於後續說明,所述長側部612的長度方向定義為一第一方向D1,而每個所述端部611則大致呈U形,其兩端分別連接於兩個所述長側部612。As shown in Fig. 3 and Fig. 4, the
更詳細地說,所述框架61形成有多個導引軌6111,並且多個所述導引軌6111的數量於本實施例中是以四個來說明,而四個所述導引軌6111是分別形成於所述框架61的四個角落;也就是說,每個所述端部611形成有兩個所述導引軌6111,其分別鄰近於兩個所述長側部612,並且任一個所述導引軌6111的長度方向是平行於所述第一方向D1,但本發明不以此為限。More specifically, the
再者,所述框架61於每個所述端部611上設有一移取區域6112,並且所述框架61的所述移取區域6112構造是對應於所述傳送機構4,據以利於所述傳送機構4通過配合於所述移取區域6112而移動所述貼合治具6。舉例來說,如果所述傳送機構4是一機械手臂,則每個所述移取區域6112則是適於所述機械手臂夾持的一缺口;或者,所述傳送機構4是一磁吸器,則每個所述移取區域6112則設有適於所述磁吸器吸取的一磁吸體。Furthermore, the
所述撓性片體62可以是金屬薄片、網布橡膠、具伸縮功能薄膜、或高分子材料,但不受限於此。所述撓性片體62包含有一貼合區域621及分別位於所述貼合區域621外側的一周圍區域622;其中,所述撓性片體62於本實施例中也是呈矩形,並且所述周圍區域622的兩個短邊部位沿所述第一方向D1彼此間隔且分別對應於所述撓性片體62的兩個短邊部位,而所述貼合區域621則是位於所述撓性片體62的中央處,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述貼合區域621也可以是偏離所述撓性片體62的中央處。The
再者,所述撓性片體62的所述周圍區域622的兩個所述短邊部位分別固定於兩個所述緩衝組件63,並且所述貼合區域621是與兩個所述緩衝組件63相隔有同等的距離,而所述撓性片體62較佳是與所述框架61的兩個所述長側部612呈間隔設置。其中,如圖1所示,所述貼合區域621用來供所述貼合物件200黏附,並且當所述貼合治具6置入所述作業空間P時,所述貼合區域621面向所述承載面123,以使所述貼合物件200可以面向所述承載面123(或其所承載的所述被貼物件300)。Furthermore, the two short sides of the surrounding
更詳細地說,如圖3和圖4所示,所述撓性片體62於本實施例中是以雙膜式構造來說,其包含一底膜62a與一貼合膜62b。其中,所述周圍區域622位於所述底膜62a,所述貼合區域621位於所述貼合膜62b,並且所述貼合膜62b的彈性係數小於所述底膜62a。於本實施例中,所述貼合膜62b是堆疊於所述底膜62a的中央處,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述撓性片體62也可以是單膜式構造。More specifically, as shown in FIG. 3 and FIG. 4 , the
需先說明的是,兩個所述緩衝組件63於本實施例中是採用相同的構造,並且兩個所述緩衝組件63相對於所述框架61呈鏡像對稱設置,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,兩個所述緩衝組件63的構造也可以略有差異。It should be noted that the two
任一個所述緩衝組件63包含有一彈性件631與可活動地設置於所述框架61的一定位件632;於本實施例中,所述彈性件631是以能通過彈性變形來儲存機械勢能的金屬(如:彈簧)來說明,而所述定位件632則是桿體來說明,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述彈性件631也可以是具備材料彈性的構件(如:橡膠);或者,所述彈性件631與所述定位件632整合為單件式的構造。Any one of the
更詳細地說,如圖3至圖6所示,兩個所述彈性件631的一端固定於所述框架61(如:兩個所述端部611),兩個所述彈性件631的另一端分別固定於兩個所述定位件632,並且兩個所述定位件632分別可活動地設置於多個所述導引軌6111,而所述周圍區域622的兩個所述短邊部位分別固定於兩個所述緩衝組件63的所述定位件632,據以使所述定位件632能通過所述彈性件631而(沿著相對應所述導引軌6111)相對於所述框架61彈性地移動,但本發明不以上述為限。舉例來說,在本發明未繪示的其他實施例中,所述框架61可以省略多個所述導引軌6111,每個所述緩衝組件63也可以省略所述定位件632,並以所述彈性件631直接固定於其中一個所述周圍區域622。In more detail, as shown in FIG. 3 to FIG. 6 , one end of the two
此外,所述貼合治具6可以通過所述框架61定位於所述壓合機構2與所述承載機構1的至少其中之一,但所述貼合治具6定位於所述壓合機構2與所述承載機構1之間的方式可以依據設計需求而加以調整變化,本發明在此不加以限制。In addition, the
兩個所述張力調整總成7分別對應於兩個所述緩衝組件63設置,並且兩個所述張力調整總成7能在不同方位上通過兩個所述緩衝組件63來調整所述撓性片體62的張力,據以使所述撓性片體62於形變時的張力值能被保持在一預設範圍之內。也就是說,所述貼合治具6能與任一個所述張力調整總成7相互搭配,而實現主動張力調整的功能。於本實施例中,任一個所述張力調整總成7可以不受限於所述作業空間P內的壓力值影響,而對於所述撓性片體62進行張力調整。The two
需先說明的是,如圖1至圖3所示,基於兩個所述張力調整總成7於本實施例中是採用相同構造且呈鏡像對稱設置,所以為便於理解本實施例,以下將先介紹單個所述張力調整總成7的構造及其所對應的所述緩衝組件63之間的連接關係但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,兩個所述張力調整總成7的構造也可以略有差異。What needs to be explained first is that, as shown in Figures 1 to 3, the two
於本實施例中,所述張力調整總成7包含有一驅動機構71(如:馬達)、相連於所述驅動機構71的一傳動機構72、及連接所述貼合治具6與所述傳動機構72的一連接機構73。其中,所述驅動機構71與所述傳動機構72安裝於所述承載機構1與所述壓合機構2的其中之一,並且所述連接機構73安裝於所述傳動機構72與相對應所述緩衝組件63的至少其中之一。In this embodiment, the
進一步地說,所述驅動機構71與所述傳動機構72於本實施例中是安裝於所述壓合機構2(如:所述第二腔體21),並且所述驅動機構71位於所述承載機構1與所述壓合機構2的外側,而所述傳動機構72位於所述壓合機構2之內,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述驅動機構71也可以採用真空馬達,以利於設置在所述壓合機構2(如:所述第二腔體21)之內。Furthermore, the
更詳細地說,所述驅動機構71於本實施例中被配置為具有驅動功能與張力監控功能。所述傳動機構72包含有多個滾輪721及設置在多個所述滾輪721上的一傳送帶722,並且所述連接機構73包含有一對接件731與於幾何上對應所述對接件的一配合件732;其中,所述對接件731安裝於相對應所述緩衝組件63的所述定位件632,並且所述配合件732安裝於所述傳動機構(如:所述傳送帶722),但本發明不以上述為限。More specifically, the
舉例來說,在本發明未繪示的其他實施例中,所述連接機構73也可以是安裝於所述緩衝組件63(如:所述定位件632)與所述傳動機構(如:所述傳送帶722)其中一個的單件式構造,並用以可拆卸地固定在所述緩衝組件63(如:所述定位件632)與所述傳動機構(如:所述傳送帶722)其中另一個。For example, in other embodiments not shown in the present invention, the connecting
再者,如圖2與圖7A(或圖7B)所示,所述驅動機構71相連於其中一個所述滾輪721,據以能夠驅使所述傳送帶722沿著多個所述滾輪721移動,進而驅使所述配合件732能與所述傳送帶722同步地移動,以實現上述驅動功能。此外,所述驅動機構71也可以通過其所受到所述傳送帶722的拉扯力道,而偵測或判斷出所述傳送帶722得即時張力值,以實現上述張力監控功能,但本發明不受限於此。Moreover, as shown in FIG. 2 and FIG. 7A (or FIG. 7B), the
如圖2、及圖7A至圖8所示,當所述被貼物件300設置於所述承載面123,並且所述貼合物件200黏附於所述撓性片體62,以進行一貼合作業時,所述貼合治具6通過任一個所述張力調整總成7的所述連接機構73而連接於所述傳動機構72(如:所述對接件731可分離地組接於所述配合件732),以使其所述傳動機構72與相對應所述緩衝組件63能通過所述連接機構73的帶動而彼此連動。As shown in Fig. 2 and Fig. 7A to Fig. 8, when the object to be pasted 300 is set on the carrying
再者,於所述貼合作業之中,所述被貼物件300的所述曲面301及受膨脹的所述充填空間23壓迫而變形的所述壓合件22能夠夾持且壓迫所述撓性片體62與所述貼合物件200,進而使所述貼合物件200變形且貼附於所述被貼物件300的所述曲面301。需額外說明的是,所述貼合作業於本實施例中可以依據實際需求,而選擇性地以下述兩種具體實施方式來進行:Furthermore, during the pasting operation, the
如圖2、圖7A、及圖8所示,於所述貼合作業的第一種實施方式中,所述壓合機構2能使所述充填空間23朝向所述撓性片體62逐漸地膨脹以迫使所述壓合件22逐漸地壓迫於所述撓性片體62,進而令所述撓性片體62朝向所述承載面123逐漸地變形而使所述貼合物件200變形且貼附於所述被貼物件300的所述曲面301。As shown in FIG. 2, FIG. 7A, and FIG. 8, in the first embodiment of the bonding operation, the
如圖2、圖7B、及圖8所示,於所述貼合作業的第二種實施方式中,所述承載機構1(通過設有可驅使所述承載台12升降的構件而)能使位於所述承載面123上的所述被貼物件300朝向所述撓性片體62移動並抵接,以迫使所述貼合物件200及所述撓性片體62逐漸地壓抵於受膨脹的所述充填空間23壓迫而變形的所述壓合件22,進而使所述貼合物件200變形且貼附於所述被貼物件300的所述曲面301。As shown in Fig. 2, Fig. 7B, and Fig. 8, in the second embodiment of the bonding operation, the carrying mechanism 1 (by providing a member that can drive the carrying
進一步地說,如圖5和圖6所示,當所述撓性片體62受壓迫而使其張力值達到一預設啟動值時,任一個所述張力調整總成7的所述驅動機構71能驅使所述傳動機構72,以通過所述連接機構73帶動相對應所述緩衝組件63,進而使所述撓性片體62的所述張力值維持在不大於所述預設啟動值的5%~10%。據此,所述貼合治具6能與任一個所述張力調整總成7相互搭配而實現主動張力調整的功能,以有效地維持所述撓性片體62的所述張力值的穩定度,並提升其使用壽命。Further, as shown in Fig. 5 and Fig. 6, when the tension value of the
此外,所述周圍區域622的兩個所述短邊部位也能通過兩個所述緩衝組件63而朝向所述貼合區域621產生相同的位移量(如:圖6)。其中,所述預設啟動值是小於所述撓性片體62(如:所述底膜62a)產生破裂或彈性疲乏的一張力臨界值。於本實施例中,在所述撓性片體62受壓迫而使所述張力值達到所述預設啟動值時,每個所述定位件632能沿著相對應所述導引軌6111而相對於所述框架61移動所述位移量。In addition, the two short sides of the surrounding
據此,所述撓性片體62可以通過所述周圍區域622的任一個所述短邊部位產生所述位移量,以避免所述撓性片體62被拉伸至超出其張力臨界值,而導致損毀。再者,所述撓性片體62通過所述周圍區域622的兩個所述短邊部位所產生的所述位移量皆相同,據以避免位於所述貼合區域621上的所述貼合物件200相對於所述被貼物件300產生偏移,進而時現精準貼合的效果。Accordingly, the
再者,所述貼合治具6的所述撓性片體62通過所述貼合膜62b的彈性係數小於所述底膜62a,以使得所述底膜62a在被拉伸變形時,貼附於所述貼合膜62b上的所述貼合物件200能夠比較不受到所述底膜62a拉伸的影響,進而有效地提升貼合的穩定性與精準度。Furthermore, the elastic coefficient of the
需額外說明的是,所述貼合裝置100於本實施例中是以包含有兩個所述張力調整總成7來說明,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述貼合裝置100所包含的所述張力調整總成7數量可以是至少一個,並且所述貼合治具6則是包含有搭配於至少一個所述張力調整總成7的至少一個所述緩衝組件63。It should be noted that, in this embodiment, the
再者,所述第二腔體21(或稱為腔體)、所述貼合治具6、及至少一個所述張力調整總成7於本實施例中也可合併稱為一貼合模組,並且所述貼合模組可以單獨地應用(如:販賣)或搭配其他構件使用,本發明在此不加以限制。Moreover, the second cavity 21 (or called the cavity), the
[實施例二][Example 2]
請參閱圖9和圖10所示,其為本發明的實施例二。由於本實施例類似於上述實施例一,所以兩個實施例的相同特徵不再加以贅述,而本實施例相較於上述實施例一的差異大致說明如下:Please refer to FIG. 9 and FIG. 10 , which is the second embodiment of the present invention. Since this embodiment is similar to the first embodiment above, the same features of the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:
於本實施例中,所述周圍區域622包含有分別位於所述貼合區域621相反兩側的兩個長邊部位,其沿垂直所述第一方向D1的一第二方向D2而彼此間隔。再者,所述貼合治具6進一步包含有安裝於所述框架61(如:兩個所述長側部612)的兩個輔助緩衝組件64,並且所述周圍區域622的兩個所述長邊部位分別固定於兩個所述輔助緩衝組件64。其中,任一個所述輔助緩衝組件64的構造與運作機制類似於所述緩衝組件63,所以本實施例不再加以贅述。In this embodiment, the surrounding
再者,所述貼合裝置100於本實施例中包含有四個所述張力調整總成7,並且四個所述張力調整總成7分別對應於兩個所述緩衝組件63與兩個所述輔助緩衝組件64設置,據以使所述撓性片體62能在四個方位進行張力調整。Furthermore, the
此外,當所述撓性片體62受壓迫而使所述張力值達到所述預設啟動值時所述周圍區域622能通過兩個所述緩衝組件63而朝向所述貼合區域621產生相同的位移量,並且所述輔助周圍區域622也能通過兩個所述輔助緩衝組件64而朝向所述貼合區域621產生相同的位移量。In addition, when the
[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]
綜上所述,於本發明實施例所公開的貼合裝置及貼合治具中,任一個所述張力調整總成能通過相對應所述緩衝組件來調整所述撓性片體的張力,據以有效地控制所述撓性片體的所述張力值,並提升其使用壽命。To sum up, in the laminating device and laminating jig disclosed in the embodiments of the present invention, any one of the tension adjustment assemblies can adjust the tension of the flexible sheet by corresponding to the buffer assembly, According to this, the tension value of the flexible sheet can be effectively controlled, and its service life can be improved.
再者,所述貼合治具於本實施例中還能與任一個所述張力調整總成相互搭配而實現主動張力調整的功能,以進一步維持所述撓性片體的所述張力值的穩定度,並提升其使用壽命。此外,任一個所述張力調整總成於本實施例中可以不受限於所述作業空間內的壓力值影響,而對於所述撓性片體進行張力調整。Furthermore, in this embodiment, the laminating jig can also cooperate with any one of the tension adjustment assemblies to realize the function of active tension adjustment, so as to further maintain the tension value of the flexible sheet. stability and increase its service life. In addition, in this embodiment, any one of the tension adjustment assemblies can adjust the tension of the flexible sheet without being limited by the pressure value in the working space.
進一步地說,於本發明實施例所公開的貼合裝置及貼合治具中,所述撓性片體可以通過任一個所述周圍區域產生所述位移量,以避免所述撓性片體被拉伸至超出其張力臨界值,而導致損毀。再者,所述撓性片體通過兩個所述周圍區域所產生的所述位移量皆相同,據以避免位於所述貼合區域上的所述貼合物件相對於所述被貼物件產生偏移,進而時現精準貼合的效果。Furthermore, in the laminating device and laminating jig disclosed in the embodiments of the present invention, the flexible sheet can generate the displacement through any one of the surrounding areas, so as to avoid the flexible sheet Stretched beyond its tension threshold, resulting in failure. Furthermore, the amount of displacement generated by the flexible sheet passing through the two surrounding areas is the same, so as to prevent the sticking object located on the sticking area from being stuck relative to the sticking object. Offset for a precise fit.
再者,於本發明實施例所公開的貼合裝置及貼合治具中,所述撓性片體通過所述貼合膜的彈性係數小於所述底膜,以使得所述底膜在被拉伸變形時,貼附於所述貼合膜上的所述貼合物件能夠比較不受到所述底膜拉伸的影響,進而有效地提升貼合的穩定性與精準度。Furthermore, in the laminating device and laminating jig disclosed in the embodiments of the present invention, the elastic coefficient of the flexible sheet passed through the laminating film is smaller than that of the base film, so that the base film is When being stretched and deformed, the attached object attached to the laminating film can be less affected by the stretching of the base film, thereby effectively improving the stability and accuracy of laminating.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。The content disclosed above is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention, so all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention Inside.
100:貼合裝置
1:承載機構
11:第一腔體
12:承載台
121:平台
122:模具
123:承載面
2:壓合機構
21:第二腔體
22:壓合件
221:基座
222:囊體
223:固定框
23:充填空間
24:充填口
25:升降組件
3:充填機構
4:傳送機構
5:抽氣機構
6:貼合治具
61:框架
611:端部
6111:導引軌
6112:移取區域
612:長側部
62:撓性片體
62a:底膜
62b:貼合膜
621:貼合區域
622:周圍區域
63:緩衝組件
631:彈性件
632:定位件
64:輔助緩衝組件
7:張力調整總成
71:驅動機構
72:傳動機構
721:滾輪
722:傳送帶
73:連接機構
731:對接件
732:配合件
P:作業空間
D1:第一方向
D2:第二方向
200:貼合物件
300:被貼物件
301:曲面
100: Fitting device
1: Carrying mechanism
11: The first cavity
12: Carrying platform
121: platform
122: Mold
123: bearing surface
2: Pressing mechanism
21: Second cavity
22: Pressed parts
221: base
222: Capsule
223: fixed frame
23: Fill the space
24: filling port
25: Lifting components
3: Filling mechanism
4: Transmission mechanism
5: Air extraction mechanism
6:Fitting fixture
61: frame
611: end
6111: guide rail
6112:Remove area
612: long side
62:
圖1為本發明實施例一的貼合裝置位於開啟位置的平面示意圖。Fig. 1 is a schematic plan view of the laminating device in the open position according to the first embodiment of the present invention.
圖2為本發明實施例一的貼合裝置位於密合位置的平面示意圖。Fig. 2 is a schematic plan view of the bonding device in the bonding position according to the first embodiment of the present invention.
圖3為本發明實施例一的貼合治具的俯視示意圖。FIG. 3 is a schematic top view of the bonding jig according to
圖4為圖3的側視示意圖。FIG. 4 is a schematic side view of FIG. 3 .
圖5為圖3的貼合治具的動作示意圖。FIG. 5 is a schematic diagram of the action of the bonding jig in FIG. 3 .
圖6為圖5的側視示意圖。FIG. 6 is a schematic side view of FIG. 5 .
圖7A為圖2的所述貼合裝置進行貼合作業的第一種實施方式的示意圖。Fig. 7A is a schematic diagram of a first embodiment of the laminating operation performed by the laminating device in Fig. 2 .
圖7B為圖2的所述貼合裝置進行貼合作業的第二種實施方式的示意圖。Fig. 7B is a schematic diagram of a second embodiment of the bonding operation performed by the bonding device in Fig. 2 .
圖8為本發明實施例一的貼合裝置將貼合物件貼附於被貼物件的示意圖。FIG. 8 is a schematic diagram of the sticking device according to
圖9為本發明實施例二的貼合治具的俯視示意圖。FIG. 9 is a schematic top view of a laminating jig according to
圖10為圖9的貼合治具的動作示意圖。FIG. 10 is a schematic diagram of the action of the bonding jig shown in FIG. 9 .
100:貼合裝置 100: Fitting device
1:承載機構 1: Carrying mechanism
11:第一腔體 11: The first cavity
12:承載台 12: Carrying platform
121:平台 121: platform
122:模具 122: Mold
123:承載面 123: bearing surface
2:壓合機構 2: Pressing mechanism
21:第二腔體 21: Second cavity
22:壓合件 22: Pressed parts
221:基座 221: base
222:囊體 222: Capsule
223:固定框 223: fixed frame
23:充填空間 23: Fill the space
24:充填口 24: filling port
25:升降組件 25: Lifting components
3:充填機構 3: Filling mechanism
4:傳送機構 4: Transmission mechanism
5:抽氣機構 5: Air extraction mechanism
6:貼合治具 6:Fitting fixture
61:框架 61: frame
62:撓性片體 62: flexible sheet
621:貼合區域 621:Fitting area
63:緩衝組件 63: Buffer component
7:張力調整總成 7: Tension adjustment assembly
71:驅動機構 71: Driving mechanism
72:傳動機構 72: Transmission mechanism
721:滾輪 721:Roller
722:傳送帶 722: Conveyor belt
73:連接機構 73: Connection mechanism
731:對接件 731: Docking piece
732:配合件 732: Fittings
200:貼合物件 200: Fitting objects
300:被貼物件 300: pasted object
301:曲面 301: Surface
Claims (15)
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US202163273112P | 2021-10-28 | 2021-10-28 | |
US63/273112 | 2021-10-28 |
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