TW202311675A - Cooling and heating system - Google Patents
Cooling and heating system Download PDFInfo
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- TW202311675A TW202311675A TW111129716A TW111129716A TW202311675A TW 202311675 A TW202311675 A TW 202311675A TW 111129716 A TW111129716 A TW 111129716A TW 111129716 A TW111129716 A TW 111129716A TW 202311675 A TW202311675 A TW 202311675A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/04—Electric heating systems using electric heating of heat-transfer fluid in separate units of the system
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
Description
本說明書涉及散熱及供暖技術領域,特別涉及一種散熱及供暖系統。 相關申請案之交叉參考 This specification relates to the technical field of heat dissipation and heating, in particular to a heat dissipation and heating system. Cross References to Related Applications
本申請主張於2021年8月11日提交之申請號為CN202110918659.5的中國專利申請案的優先權,於2021年8月11日提交之申請號為CN202121869423.9的中國專利申請案的優先權、於2021年8月11日提交之申請號為CN202121877222.3的中國專利申請案的優先權和2022年7月20日提交之申請號為PCT/CN2022/106689的國際專利申請案的優先權,其全部內容通過引用的方式併入本文。This application claims the priority of the Chinese patent application with the application number CN202110918659.5 submitted on August 11, 2021, and the priority of the Chinese patent application with the application number CN202121869423.9 submitted on August 11, 2021 , the priority of the Chinese patent application with application number CN202121877222.3 filed on August 11, 2021 and the priority of the international patent application with application number PCT/CN2022/106689 filed on July 20, 2022, Its entire content is incorporated herein by reference.
散熱系統是一種用於對產熱量較大的裝置(如晶片、中央處理器、GPU、ASIC等)進行散熱的系統,以防止這些裝置在使用流程中溫度過高,保證裝置的正常運行。散熱系統的散熱方式通常使用風冷或者液冷。例如,散熱系統可以使用特定液體(例如,水)作為冷卻劑,冷卻劑可以在散熱系統的管路中流動並與待散熱裝置進行熱交換,降低待散熱裝置的溫度。The heat dissipation system is a system used to dissipate heat from devices that generate large amounts of heat (such as chips, central processing units, GPUs, ASICs, etc.), so as to prevent these devices from overheating during use and ensure the normal operation of the devices. The heat dissipation method of the heat dissipation system usually uses air cooling or liquid cooling. For example, the heat dissipation system may use a specific liquid (for example, water) as a coolant, and the coolant may flow in pipelines of the heat dissipation system and perform heat exchange with the device to be dissipated, reducing the temperature of the device to be dissipated.
本揭示內容的實施例之一提供一種散熱系統,該散熱系統包括:進液管、分流管、散熱單元、集流管與出液管;該進液管包括進液口,該進液管與該分流管連通;該散熱單元包括液體入口與液體出口,該分流管與該液體入口連通,該液體出口與該集流管連通;該集流管與該出液管連通,該出液管包括出液口;該進液口與該出液口的高度均高於該分流管、該散熱單元與該集流管中液體的液位。One of the embodiments of the present disclosure provides a heat dissipation system, the heat dissipation system includes: a liquid inlet pipe, a distribution pipe, a heat dissipation unit, a collecting pipe, and a liquid outlet pipe; the liquid inlet pipe includes a liquid inlet, and the liquid inlet pipe and The shunt pipe communicates; the cooling unit includes a liquid inlet and a liquid outlet, the shunt pipe communicates with the liquid inlet, and the liquid outlet communicates with the header; the header communicates with the liquid outlet pipe, and the liquid outlet pipe includes Liquid outlet; the heights of the liquid inlet and the liquid outlet are higher than the liquid levels in the shunt pipe, the cooling unit and the collecting pipe.
在一些實施例中,該散熱系統還包括分層式櫃體,該分層式櫃體的每一層用於設置一個或多個該散熱單元。In some embodiments, the heat dissipation system further includes a layered cabinet, and each layer of the layered cabinet is used for setting one or more heat dissipation units.
在一些實施例中,該進液口與該出液口設置在該分層式櫃體的側壁的同一高度處。In some embodiments, the liquid inlet and the liquid outlet are arranged at the same height of the side wall of the layered cabinet.
在一些實施例中,該分層式櫃體的每一層並列設置有兩排該散熱單元,該散熱系統還包括設置於該兩排該散熱單元之間的散熱風道,該散熱風道在該分層式櫃體的頂部與底部之間沿垂直方向延伸。In some embodiments, two rows of heat dissipation units are arranged side by side on each floor of the layered cabinet, and the heat dissipation system further includes a heat dissipation air duct arranged between the two rows of heat dissipation units. The top and bottom of the tiered cabinet extend vertically.
在一些實施例中,該分流管的一端與該進液管連通,該分流管的另一端封堵,該分流管呈U型環繞兩排該散熱單元設置;該集流管的一端與該出液管連通,該集流管的另一端封堵,該集流管呈U型環繞兩排該散熱單元設置。In some embodiments, one end of the shunt pipe communicates with the liquid inlet pipe, and the other end of the shunt pipe is blocked, and the shunt pipe is U-shaped and arranged around two rows of the cooling units; one end of the header pipe is connected to the outlet pipe. The liquid pipe is connected, and the other end of the collecting pipe is blocked, and the collecting pipe is U-shaped and arranged around two rows of the cooling units.
在一些實施例中,該分層式櫃體對應於兩排該散熱單元的第一側壁及第二側壁分別設置有第一進風口與第二進風口,該分層式櫃體的頂部對應於該散熱風道的位置設置有排風口。In some embodiments, the layered cabinet is provided with a first air inlet and a second air inlet corresponding to the first side wall and the second side wall of the two rows of heat dissipation units, and the top of the layered cabinet corresponds to The position of the cooling air duct is provided with an air outlet.
在一些實施例中,該排風口處設有排風裝置。In some embodiments, an exhaust device is provided at the air outlet.
在一些實施例中,該散熱系統還包括溫度調節裝置,該溫度調節裝置包括溫度感測器與控制器;該溫度感測器用於檢測該散熱系統的溫度並產生溫度檢測信號;該控制器用於根據該溫度檢測信號調節該排風裝置的排風效率。In some embodiments, the heat dissipation system further includes a temperature adjustment device, the temperature adjustment device includes a temperature sensor and a controller; the temperature sensor is used to detect the temperature of the heat dissipation system and generate a temperature detection signal; the controller is used to The exhaust efficiency of the exhaust device is adjusted according to the temperature detection signal.
在一些實施例中,該溫度感測器設置於該散熱風道的頂部,以用於檢測該散熱風道頂部的溫度。In some embodiments, the temperature sensor is disposed on the top of the cooling air duct for detecting the temperature at the top of the cooling air duct.
在一些實施例中,該第一進風口處及/或該第二進風口處設有進風裝置;該控制器還用於根據該溫度檢測信號調節該進風裝置的進風效率。In some embodiments, an air inlet device is provided at the first air inlet and/or the second air inlet; the controller is also used to adjust the air inlet efficiency of the air inlet device according to the temperature detection signal.
在一些實施例中,該進液口及/或該出液口上設有第一流量閥;該控制器還用於根據該溫度檢測信號調節通過該第一流量閥的液體流量。In some embodiments, the liquid inlet and/or the liquid outlet is provided with a first flow valve; the controller is also used to adjust the liquid flow through the first flow valve according to the temperature detection signal.
在一些實施例中,該分層式櫃體的每一層均設有該溫度感測器,且每一層均設有一個該分流管與一個該集流管;每一層的該分流管與該進液管的連接端,及/或每一層的該集流管與該出液管的連接端設有第二流量閥;該控制器還用於根據每一層的該溫度感測器的溫度檢測信號調節通過每一層的該第二流量閥的液體流量。In some embodiments, each layer of the layered cabinet is provided with the temperature sensor, and each layer is provided with a shunt pipe and a header; The connecting end of the liquid pipe, and/or the connecting end of the header and the liquid outlet pipe of each layer is provided with a second flow valve; the controller is also used for detecting the temperature signal according to the temperature sensor of each layer Liquid flow through this second flow valve for each layer is regulated.
在一些實施例中,該散熱單元包括多個並列設置的散熱板,每相鄰兩個該等散熱板之間安裝有板卡,該等散熱板用於對該板卡上的晶片進行散熱;在該散熱單元中,每個該散熱板均包括該液體入口及該液體出口,一端的該散熱板的該液體入口與該分流管連通,另一端的該散熱板的該液體出口與該集流管連通,相鄰該等散熱板之間的該液體入口與該液體出口相互連通。In some embodiments, the heat dissipation unit includes a plurality of heat dissipation plates arranged side by side, and a board is installed between every two adjacent heat dissipation plates, and the heat dissipation plates are used to dissipate heat from the chip on the board; In the heat dissipation unit, each heat dissipation plate includes the liquid inlet and the liquid outlet, the liquid inlet of the heat dissipation plate at one end communicates with the branch pipe, and the liquid outlet of the heat dissipation plate at the other end communicates with the collector The tubes communicate with each other, and the liquid inlet and the liquid outlet between the adjacent heat dissipation plates communicate with each other.
本揭示內容的實施例之一提供一種供暖系統,包括前述實施例中的散熱系統以及供暖管路,該供暖管路與該散熱系統的該出液口連通。One embodiment of the present disclosure provides a heating system, comprising the heat dissipation system in the foregoing embodiments and a heating pipeline, where the heating pipeline communicates with the liquid outlet of the heat dissipation system.
本揭示內容的實施例之一提供一種散熱系統,該散熱系統包括:分層式櫃體,該分層式櫃體的每一層並列設置有兩排散熱單元;設置於該兩排散熱單元之間的散熱風道,該散熱風道在該分層式櫃體的頂部與底部之間沿垂直方向延伸;該分層式櫃體對應於該兩排散熱單元的第一側壁及第二側壁分別設置有第一進風口與第二進風口,該分層式櫃體的頂部對應於該散熱風道的位置設置有排風口。One of the embodiments of the disclosure provides a heat dissipation system, the heat dissipation system includes: a layered cabinet, each layer of the layered cabinet is provided with two rows of heat dissipation units in parallel; arranged between the two rows of heat dissipation units The heat dissipation air duct extends vertically between the top and the bottom of the layered cabinet; the layered cabinet corresponds to the first side wall and the second side wall of the two rows of cooling units. There are a first air inlet and a second air inlet, and the top of the layered cabinet body is provided with an air outlet corresponding to the position of the cooling air duct.
在一些實施例中,該排風口處設有排風裝置。In some embodiments, an exhaust device is provided at the air outlet.
在一些實施例中,該散熱系統還包括溫度調節裝置,該溫度調節裝置包括溫度感測器與控制器;該溫度感測器用於檢測該散熱系統的溫度並產生溫度檢測信號;該控制器用於根據該溫度檢測信號調節該排風裝置的排風效率。In some embodiments, the heat dissipation system further includes a temperature adjustment device, the temperature adjustment device includes a temperature sensor and a controller; the temperature sensor is used to detect the temperature of the heat dissipation system and generate a temperature detection signal; the controller is used to The exhaust efficiency of the exhaust device is adjusted according to the temperature detection signal.
在一些實施例中,該溫度感測器設置於該散熱風道的頂部,以用於檢測該散熱風道頂部的溫度。In some embodiments, the temperature sensor is disposed on the top of the cooling air duct for detecting the temperature at the top of the cooling air duct.
在一些實施例中,該第一進風口處及/或該第二進風口處設有進風裝置;該控制器還用於根據該溫度檢測信號調節該進風裝置的進風效率。In some embodiments, an air inlet device is provided at the first air inlet and/or the second air inlet; the controller is also used to adjust the air inlet efficiency of the air inlet device according to the temperature detection signal.
在一些實施例中,該散熱單元包括液體入口及液體出口,該散熱系統還包括:進液管、分流管、集流管及出液管;該進液管包括進液口,該進液管與該分流管連通;該分流管與該液體入口連通,該液體出口與該集流管連通;該集流管與該出液管連通,該出液管包括出液口。In some embodiments, the heat dissipation unit includes a liquid inlet and a liquid outlet, and the heat dissipation system further includes: a liquid inlet pipe, a shunt pipe, a collector pipe, and a liquid outlet pipe; the liquid inlet pipe includes a liquid inlet, and the liquid inlet pipe It communicates with the shunt pipe; the shunt pipe communicates with the liquid inlet, and the liquid outlet communicates with the collecting pipe; the collecting pipe communicates with the liquid outlet pipe, and the liquid outlet pipe includes a liquid outlet.
在一些實施例中,該分流管的一端與該進液管連通,該分流管的另一端封堵,該分流管呈U型環繞該兩排散熱單元設置;該集流管的一端與該出液管連通,該集流管的另一端封堵,該集流管呈U型環繞該兩排散熱單元設置。In some embodiments, one end of the shunt pipe communicates with the liquid inlet pipe, the other end of the shunt pipe is blocked, and the shunt pipe is arranged in a U shape around the two rows of cooling units; one end of the header pipe is connected to the outlet pipe. The liquid pipe is connected, and the other end of the collecting pipe is blocked, and the collecting pipe is U-shaped and arranged around the two rows of cooling units.
在一些實施例中,該散熱系統還包括溫度調節裝置,該溫度調節裝置包括溫度感測器與控制器;該進液口及/或該出液口上設有第一流量閥;該溫度感測器用於檢測該散熱系統的溫度並產生溫度檢測信號;該控制器用於根據該溫度檢測信號調節通過該第一流量閥的液體流量。In some embodiments, the cooling system further includes a temperature adjustment device, the temperature adjustment device includes a temperature sensor and a controller; the liquid inlet and/or the liquid outlet are provided with a first flow valve; the temperature sensor The controller is used to detect the temperature of the cooling system and generate a temperature detection signal; the controller is used to adjust the liquid flow through the first flow valve according to the temperature detection signal.
在一些實施例中,該分層式櫃體的每一層均設有該溫度感測器,且每一層均設有一個該分流管與一個該集流管;每一層的該分流管與該進液管的連接端,及/或每一層的該集流管與該出液管的連接端設有第二流量閥;該控制器還用於根據每一層的該溫度感測器的溫度檢測信號調節通過每一層的該第二流量閥的液體流量。In some embodiments, each layer of the layered cabinet is provided with the temperature sensor, and each layer is provided with a shunt pipe and a header; The connecting end of the liquid pipe, and/or the connecting end of the header and the liquid outlet pipe of each layer is provided with a second flow valve; the controller is also used for detecting the temperature signal according to the temperature sensor of each layer Liquid flow through this second flow valve for each layer is regulated.
在一些實施例中,該散熱單元包括多個並列設置的散熱板,每相鄰兩個該等散熱板之間安裝有板卡,該等散熱板用於對該板卡上的晶片進行散熱;在該散熱單元中,每個該散熱板均包括液體入口及液體出口,一端的該散熱板的該液體入口與該分流管連通,另一端的該散熱板的該液體出口與該集流管連通,相鄰該等散熱板之間的該液體入口與該液體出口相互連通。In some embodiments, the heat dissipation unit includes a plurality of heat dissipation plates arranged side by side, and a board is installed between every two adjacent heat dissipation plates, and the heat dissipation plates are used to dissipate heat from the chip on the board; In the heat dissipation unit, each heat dissipation plate includes a liquid inlet and a liquid outlet, the liquid inlet of the heat dissipation plate at one end communicates with the branch pipe, and the liquid outlet of the heat dissipation plate at the other end communicates with the header , the liquid inlet and the liquid outlet between the adjacent heat dissipation plates communicate with each other.
為了更清楚地說明本申請實施例的技術方案,下面將對實施例描述中所需要使用的圖式作簡單的介紹。顯而易見地,下面描述中的圖式僅僅是本申請的一些示例或實施例,對於本領域具有通常知識者來講,在不付出創造性勞動的前提下,還可以根據這些圖式將本申請應用於其它類似情景。除非從語言環境中顯而易見或另做說明,圖中相同標號代表相同結構或操作。In order to illustrate the technical solutions of the embodiments of the present application more clearly, the diagrams that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some examples or embodiments of the present application, and those skilled in the art can also apply the present application to other similar scenarios. Unless otherwise apparent from context or otherwise indicated, like reference numerals in the figures represent like structures or operations.
應當理解,本文使用的「系統」、「裝置」、「單元」及/或「模組」是用於區分不同級別的不同元件、組件、部件、部分或裝配的一種方法。然而,如果其他詞語可實現相同的目的,則可通過其他表達來替換所述詞語。It should be understood that "system", "device", "unit" and/or "module" as used herein is a method used to distinguish different elements, components, components, parts or assemblies of different levels. However, the words may be replaced by other expressions if other words can achieve the same purpose.
如本申請與申請專利範圍中所示,除非上下文明確提示例外情形,「一」、「一個」、「一種」及/或「該」等詞並非特指單數,也可包括複數。一般說來,術語「包括」與「包含」僅提示包括已明確標識的步驟與元素,而這些步驟與元素不構成一個排它性的羅列,方法或者裝置也可能包含其它的步驟或元素。As indicated in this application and claims, terms such as "a", "an", "an" and/or "the" do not refer to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements.
本揭示內容的一些實施例提供一種散熱系統,該散熱系統的進液管包括進液口,出液管包括出液口。進液口及出液口均設置在散熱系統的高點,即進液口與出液口的高度均高於散熱系統的其他管道(例如,分流管、集流管)內的液體的液位。通過將進液口及出液口均設置在散熱系統的高點,散熱系統在使用流程中其管道內將充滿液體;不論進液口的液體流量(即進液量)大小,輸入進液口的流量與出液口排出的液體流量(即排液量)均相同。相較於高進低出(即進液口設置在散熱系統的高點,出液口設置在散熱系統的低點,出液口的高度低於散熱系統的其他管道中的液體的液位)的設置方式而言,本說明書提供的散熱系統可以有效避免進液量不穩定(如進液量較小)時散熱系統管道出現空水的情況。這裡所說的空水是指散熱系統的管道中某些位置沒有液體存在。Some embodiments of the present disclosure provide a heat dissipation system, the liquid inlet pipe of the heat dissipation system includes a liquid inlet, and the liquid outlet pipe includes a liquid outlet. Both the liquid inlet and the liquid outlet are set at the high point of the heat dissipation system, that is, the height of the liquid inlet and the liquid outlet is higher than the liquid level of the liquid in other pipes (such as shunt pipes and headers) of the heat dissipation system . By setting both the liquid inlet and the liquid outlet at the high point of the heat dissipation system, the pipes of the heat dissipation system will be filled with liquid during the use process; The flow rate is the same as the liquid flow rate (that is, the discharge volume) discharged from the liquid outlet. Compared with high inlet and low outlet (that is, the liquid inlet is set at the high point of the heat dissipation system, the liquid outlet is set at the low point of the heat dissipation system, and the height of the liquid outlet is lower than the liquid level of the liquid in other pipes of the heat dissipation system) As far as the setting method is concerned, the heat dissipation system provided in this manual can effectively avoid the situation of empty water in the pipes of the heat dissipation system when the liquid intake is unstable (for example, the liquid intake is small). The empty water mentioned here means that there is no liquid in some places in the pipeline of the cooling system.
此外,通過將進液口與出液口均設置在散熱系統的高點,散熱系統中如果出現氣體的話,能夠更容易地從進液口及/或出液口排出,相較於低進高出(即進液口設置在散熱系統的低點,出液口設置在散熱系統的高點)的設置方式而言,無需在散熱系統管道增加額外的排氣裝置以將管道中的空氣排出,不僅精簡了散熱系統的結構,還減小了散熱系統的製造成本。In addition, by arranging both the liquid inlet and the liquid outlet at the high point of the heat dissipation system, if gas occurs in the heat dissipation system, it can be more easily discharged from the liquid inlet and/or liquid outlet, compared with the low-inlet high In terms of the setting method (that is, the liquid inlet is set at the low point of the heat dissipation system, and the liquid outlet is set at the high point of the heat dissipation system), there is no need to add an additional exhaust device to the heat dissipation system pipe to discharge the air in the pipe. Not only the structure of the heat dissipation system is simplified, but also the manufacturing cost of the heat dissipation system is reduced.
圖1係根據本揭示內容的一些實施例所示的散熱系統的結構示意圖;圖2係根據本揭示內容的一些實施例所示的散熱系統的內部結構示意圖。如圖1及圖2所示,在一些實施例中,散熱系統100可以包括進液管110、分流管120、散熱單元130、集流管140、出液管150及分層式櫃體160。Fig. 1 is a schematic structural diagram of a heat dissipation system according to some embodiments of the present disclosure; Fig. 2 is a schematic diagram of the internal structure of a heat dissipation system according to some embodiments of the present disclosure. As shown in FIGS. 1 and 2 , in some embodiments, the
其中,進液管110是指液體進入散熱系統100的管道。進液管110可以包括用於輸入液體的進液口111。進液管110與分流管120連通,進液管110的液體可以流入到分流管120中。出液管150是指液體排出散熱系統100的管道。出液管150可以包括用於液體排出的出液口151。出液管150與集流管140連通,集流管140的液體可以流入到出液管150中。分層式櫃體160可以包括分層設置的多個支撐架167,每個支撐架167均可用於放置散熱單元130。散熱單元130可以包括液體入口133及液體出口135。液體入口133可以與分流管120連通,分流管120中的液體可以通過液體入口133進入散熱單元130的內部以與待散熱裝置(例如,晶片)進行熱交換,從而降低待散熱裝置的溫度。液體出口135可以與集流管140連通,經過熱交換的液體可以通過液體出口135流到集流管140中。進液口111與出液口151的高度均高於分流管120、集流管140以及散熱單元130內的液體的液位。這裡所說的高度可以是指垂直方向的高度,或者相對於分層式櫃體160底部的垂直距離。例如,進液口111與出液口151的高度可以是指進液口111及出液口151與分層式櫃體160的底部之間的垂直距離。Wherein, the
在本實施例中,用於與待散熱裝置進行熱交換的液體可以經由進液口111進入進液管110,然後通過分流管120進入散熱單元130內部,並與散熱單元30內安裝的待散熱裝置進行熱交換。最後,經過熱交換的液體可以依次經由集流管140、出液管150從出液口151排出。在一些情況下,由於進液口111與出液口151的高度均高於分流管120、集流管140以及散熱單元130內的液體的液位,因此可以有效避免散熱系統100的管道出現空水的情況。並且無需增加額外的排氣裝置來排出散熱系統100的管道中的空氣,一態樣精簡散熱系統100的結構,同時還減小了散熱系統100的製造成本。In this embodiment, the liquid used for heat exchange with the device to be dissipated can enter the
本說明書一個或多個實施例中所指的液體可以理解為用於吸收待散熱裝置的熱量的冷卻劑,液體可以是水、防凍液等中的一種或多種液體。本揭示內容的實施例的待散熱裝置可以包括但不限於晶片、印製電路板等一種或多種的組合。在一些實施例中,可以將晶片集合、印製電路板(Printed Circuit Board,PCB)等設置在板卡上,並將板卡(例如,板卡139)安裝在散熱單元130中,進而通過上述散熱系統100對其進行散熱。The liquid referred to in one or more embodiments of this specification can be understood as a coolant for absorbing heat of the device to be dissipated, and the liquid can be one or more of water, antifreeze, and the like. The device to be dissipated in the embodiments of the present disclosure may include, but not limited to, one or a combination of chips, printed circuit boards, and the like. In some embodiments, a chip assembly, a printed circuit board (Printed Circuit Board, PCB), etc. may be arranged on a board, and the board (for example, the board 139 ) is installed in the
結合圖1與圖2所示,在一些實施例中,分層式櫃體160可以包括殼體,殼體可以形成容納空間用於容納散熱系統100的部件(例如,散熱單元130、分流管120、集流管140等)。在一些實施例中,進液口111與出液口151可以均設置在分層式櫃體160的側壁(也即殼體的側壁),以便於進液口111及出液口151與外部管道(例如,供暖管路200)進行連接。As shown in FIG. 1 and FIG. 2 , in some embodiments, the
在一些實施例中,進液口111及出液口151可以均設置在分層式櫃體160的同一側壁。例如,在圖1與圖2所示的實施例中,進液管110及出液管150均設置在分層式櫃體160的同一側(靠近分層式櫃體160的殼體的其中一個側壁)。進液管110靠近進液口111的一端呈弧線彎曲以使進液口111伸出該側壁。出液管150靠近出液口151的一端呈弧線彎曲以使出液口151伸出該側壁。通過將進液口111與出液口151設置在同一側壁,可以使得散熱系統100便於安裝與維護。In some embodiments, the
在一些替代性實施例中,進液口111及出液口151可以設置在分層式櫃體160的不同側壁。例如,進液管110可以設置在靠近分層式櫃體160的殼體的其中一個側壁的位置,進液管110靠近進液口111的一端呈弧線彎曲以使進液口111伸出該側壁。而出液管150可以設置在靠近與該側壁相對的另一側壁的位置,出液管150靠近出液口151的一端呈弧線彎曲以使出液口151伸出該另一側壁。通過這樣設置之後,出液口151及進液口111就分別設置在殼體的兩個相對的側壁上。In some alternative embodiments, the
在一些實施例中,進液口111與出液口151可以均設置在分層式櫃體160的殼體的頂部。例如,進液管110的進液口111與出液管150的出液口151均從殼體的頂部伸出。在一些實施例中,進液口111及出液口151的具體設置位置可以根據外部管道的位置進行相對配置。In some embodiments, both the
在一些實施例中,進液口111的高度與出液口151的高度可以相同。示例性的,進液口111及出液口151可以均設置在分層式櫃體160的頂部,並且進液口111與出液口151的高度相同。例如,進液管110與出液管150伸出殼體的頂部並且進液口111與出液口151的開口端面與殼體的頂部齊平以使得進液口111與出液口151的高度相同。如圖2所示,在一些實施例中,進液口111及出液口151可以均設置在分層式櫃體160的側壁的同一高度處,以使得進液口111的高度與出液口151的高度相同。通過將進液口111與出液口151設置在同一高度,可以更有效避免管道出現空水情況;而且可以使得進液口111與出液口151能夠互換使用,安裝簡便,容錯率高。In some embodiments, the height of the
圖3係根據本揭示內容的一些實施例所示的散熱系統的內部管路結構示意圖。分流管120可以用於將進液管110中的液體(未經過熱交換的液體)輸送至放置在分層式櫃體160上中的散熱單元130中,以與散熱單元130中安裝的待散熱裝置進行熱交換。在一些實施例中,分流管120的管壁上設置有第一分流口123,第一分流口123可以與散熱單元130的液體入口133連通,液體可以經由第一分流口123與液體入口133流入到散熱單元130中。在一些實施例中,如圖3所示,分流管120的管壁上可以間隔設置多個第一分流口123。Fig. 3 is a schematic diagram of the internal pipeline structure of the cooling system according to some embodiments of the present disclosure. The
集流管140可以用於將散熱單元130排出的溫度較高的液體(經過熱交換的液體)輸送至出液管150中。在一些實施例中,集流管140的管壁上設置有第一集流口143,第一集流口143可以與散熱單元130的液體出口135連通,由散熱單元130排出的經過熱交換的液體可以經由液體出口135與第一集流口143流入到集流管140中。The collecting
在一些實施例中,散熱系統100可以包括第一連接管(圖中未示出)。第一分流口123與散熱單元130的液體入口133以及第一集流口143與散熱單元130的液體出口135可以通過第一連接管進行連接。示例性的第一連接管可以包括不銹鋼管、金屬管、波紋管、橡膠管、塑膠管等。在一些實施例中,第一連接管可以為軟管(如橡膠管),以方便安裝及拆卸。In some embodiments, the
如圖3所示,在一些實施例中,分流管120與集流管140可以分別呈U型環繞散熱單元130設置。分流管120的一端(即圖2及圖3所示的第一分流管端121)可以與進液管110連通,另一端(即圖2及圖3所示第二分流管端122)封堵。集流管140的一端(即圖2及圖3所示的第一集流管端141)可以與出液管150連通,另一端(即圖2及圖3所示的第二集流管端142)封堵。As shown in FIG. 3 , in some embodiments, the
在一些實施例中,第二分流管端122以及第二集流管端142可以通過多種方式進行封堵。在一些實施例中,第二分流管端122以及第二集流管端142可以均通過封堵構件封堵,封堵構件與第二分流管端122以及第二集流管端142螺紋連接。在一些實施例中,封堵構件可以包括螺釘。螺釘可以與第二分流管端122以及第二集流管端142螺紋連接以保證封堵效果,有效防止液體漏出,而且螺紋連接結構便於安裝及拆卸。在一些替代性實施例中,封堵構件可以通過粘接、焊接或卡接等方式與第二分流管端122以及第二集流管端142連接。例如,將第二分流管端122以及第二集流管端142封堵起來的封堵構件可以是通過焊接方式連接的封堵板。在一些實施例,封堵構件與第二分流管端122以及第二集流管端142之間可以設置防漏墊片,以進一步防止液體從封堵構件處漏出。防漏墊片可以為橡膠、乳膠或樹脂等材質。在一些實施例中,分流管120及/或集流管140可以通過一體成型製成上述一端封堵的結構。In some embodiments, the second
在一些實施例中,本揭示內容的實施例中的一個或多個管道(例如,進液管110、出液管150、分流管120以及集流管140等)的截面形狀可以包括多邊形(如四邊形、六邊形、八邊形等)、圓形或橢圓形等。示例性的,在圖3所示的實施例中,進液管110、出液管150、分流管120以及集流管140的截面形狀均為圓形。截面形狀為圓形或橢圓形的管路內雜質不易堆積,可以有效防止管路被堵塞。此外,截面形狀為圓形的管路更便於生產製造。In some embodiments, the cross-sectional shape of one or more pipes (for example, the
在一些情況下,為了提高散熱系統100的工作效率,可以在分層式櫃體160每一層的支撐架167上均放置散熱單元130,並同時對多個支撐架167上的散熱單元130進行散熱。為了達到這一目的,本揭示內容的一些實施例中的散熱系統100可以對輸送至進液管110的液體進行分流,以同時對多個支撐架167上的散熱單元130進行散熱。In some cases, in order to improve the working efficiency of the
結合圖2及圖3所示,在一些實施例中,進液管110的管壁上可以設置有多個第二分流口,多個第二分流口沿進液管110的長度方向進行佈置。在一些實施例中,分流管120可以包括多個(例如,圖3所示的實施例包括4個分流管120),每個分流管120與一個第二分流口連通。每個分流管120的位置可以與分層式櫃體160的每一層支撐架167上放置的散熱單元130的位置相對應,通過分流管120將液體輸送至對應位置的散熱單元130中進行熱交換。這裡所說的分流管120的位置與散熱單元130的位置相對應可以是指分流管120與散熱單元130位置關係能夠方便將第一分流口123與液體入口133進行連通。As shown in FIG. 2 and FIG. 3 , in some embodiments, a plurality of second flow openings may be provided on the pipe wall of the
在一些情況下,每一層支撐架167上放置的散熱單元130都需要將經過熱交換的液體排出,散熱系統100可以通過多個集流管140對這些液體進行收集並統一輸送至出液管150以方便對這些液體進行集中排出。在一些實施例中,出液管150的管壁上可以設置多個第二集流口,多個第二集流口沿出液管150的長度方向進行佈置。在一些實施例中,集流管140可以包括多個(例如,圖3所示的實施例包括4個集流管140),每個集流管140與一個第二集流口連通。每個集流管140的位置可以與分層式櫃體160的每一層支撐架167上放置的散熱單元130的位置相對應,通過集流管140收集對應位置的散熱單元130排出的經過熱交換的液體,多個集流管140收集的液體將統一輸送至出液管150中進行集中排出。這裡所說的集流管140的位置與散熱單元130的位置相對應可以是指集流管140與散熱單元130位置關係能夠方便將第一集流口143與液體出口135進行連通。In some cases, the
在一些實施例中,液體入口133與第一分流口123、液體出口135與第一集流口143、分流管120與第二分流口以及集流管140與第二集流口可以通過螺紋連接、法蘭連接、焊接、管道黏合連接、連接頭連接等方式進行連通。示例性的,以分流管120與進液管110的連通為例,分流管120的第一分流管端121為具有外螺紋的螺紋管口,進液管110的第二分流口設置有螺紋孔,通過螺紋管口與螺紋孔的螺紋連接,可以實現分流管120與進液管110的連通。In some embodiments, the
圖4係根據本揭示內容的一些實施例所示的散熱單元的結構示意圖。在一些實施例中,散熱單元130可以包括多個並列設置的散熱板137。每相鄰兩個散熱板137之間可以安裝有板卡139。散熱板137可以用於對板卡139上的待散熱裝置(例如,晶片、晶片集合、PCB板等)進行散熱。其中,並列設置可以是指多個散熱板137沿其厚度方向進行間隔排列。散熱單元130中的每個散熱板137均可以包括液體入口133與液體出口135。並列設置的多個散熱板137中,位於散熱單元130其中一端的散熱板137(例如,圖4中位於最右側的散熱板137-1)的液體入口133與分流管120連通,位於散熱單元130另一端的散熱板137(例如,圖4中位於最左側的散熱板137-4)的液體出口135與集流管140連通,相鄰散熱板137之間的液體入口133與液體出口135相互連通。示例性的,在圖4所示的實施例中,散熱單元由四個散熱板137(分別為137-1、137-2、137-3、137-4)並列設置組成,在每個散熱板137的端面設置有一個液體入口133與液體出口135。相鄰兩個散熱板137的液體入口133與液體出口135交叉設置以便於相鄰兩個散熱板137的液體入口133與液體出口135連通。例如,散熱板137-1的液體入口133位於端面上側,液體出口135位於端面下側;散熱板137-2的液體入口133位於端面下側,液體出口135位於端面上側。Fig. 4 is a schematic structural diagram of a heat dissipation unit according to some embodiments of the present disclosure. In some embodiments, the
在本實施例中,液體可以經由散熱板137-1的液體入口133進入散熱單元130,依次經過散熱板137-2與散熱板137-3並對設置在相鄰兩個散熱板137之間的板卡139上的晶片進行熱交換,最終實現對晶片的降溫。最後從散熱板137-4的液體出口135排出至集流管140中。需要說明的是,上述內容僅作為示例,並不旨在限制散熱單元130包含的散熱板137的數量。在一些實施例中,除了上述實施例中的4片散熱板137的方案之外,散熱單元130還可以包括2片、3片、5片、6片或更多數量的散熱板137。本領域具有通常知識者可以根據待散熱裝置的具體結構、尺寸、數量等確定散熱單元130的散熱板137的數量。In this embodiment, the liquid can enter the
在一些實施例中,散熱板137在其厚度方向上的輪廓形狀可以包括長方形、圓形、三角形或多邊形等。示例性的,在圖4所示的實施例中,散熱板137在其厚度方向上的輪廓形狀可以近似看作長方形。在一些實施例中,散熱板137在其厚度方向上的輪廓形狀可以優選為與待散熱裝置的形狀相同或相似,以在節約散熱板137的成本的同時使得散熱板137能夠起到更佳的散熱效果。在一些實施例中,散熱板137的材質可以包括銅或鋁等易於導熱的材料。在一些實施例中,散熱系統100還可以包括第二連接管131。相鄰散熱板137的液體入口133與液體出口135可以通過第二連接管131進行連接。第二連接管131與第一連接管可以採用相同或不同的材料製作。在一些實施例中,散熱板137內部所設置的管道可以包括環形管道、並列式管道等,以連通散熱板137的液體入口133與液體出口135。In some embodiments, the outline shape of the
在一些實施例中,對於一個散熱單元130而言,其與分流管120連通的液體入口133以及與集流管140連通的液體出口135可以均位於散熱板137的端面上側,從而可以有效避免散熱板137內出現空水現象,提高散熱單元130的散熱效果。In some embodiments, for a
參見圖1及圖2所示,在一些實施例中,分層式櫃體160的每一層支撐架167上可以並列設置有兩排散熱單元130。在一些實施例中,每一層支撐架167上的兩排散熱單元130可以共用同一個分流管120與集流管140。示例性的,每一層支撐架167上放置的兩排散熱單元130的液體入口133與同一個分流管120的不同第一分流口123連通。每一層支撐架167上放置的兩排散熱單元130的液體出口135可以與同一個集流管140的不同第一集流口143連通。Referring to FIG. 1 and FIG. 2 , in some embodiments, two rows of cooling
參見圖2及圖3所示,在一些實施例中,對應於分層式櫃體160的每一層上的兩排散熱單元的一個分流管120與集流管140可以呈U型環繞該層上的兩排散熱單元130設置。在一些實施例中,當液體通過進液口111進入到進液管110後,可以分別進入分層式櫃體160各層的分流管120中。由於每一層上所放置的兩排散熱單元130的液體入口133均與同一個分流管120連通,因此分流管120中的液體可以通過與分流管120連通的液體入口133進入到對應的各個散熱單元130中,以此來降低位於散熱板137之間的晶片的溫度。2 and 3, in some embodiments, a
在本實施例中,當熱量傳遞給液體後,液體的溫度升高,溫度升高後的液體則可以通過兩排散熱單元130的各個液體出口135進入到與該兩排散熱單元130的各個液體出口135連通的集流管140中,溫度升高後的液體彙集在集流管140中後,再進入到出液管150並通過出液口151排出散熱系統100或排到相應的裝置中。In this embodiment, when the heat is transferred to the liquid, the temperature of the liquid rises, and the liquid after the temperature rise can enter the respective liquids connected to the two rows of
在一些情況下,通過將分層式櫃體160每一層中的分流管120以及集流管140設置成呈U型環繞位於對應層的兩排散熱單元130設置,可以方便兩排散熱單元130的所有液體入口133以及液體出口135分別與同一個分流管120及同一個集流管140連通,優化了散熱系統100中的管路設計,縮減了分流管120以及集流管140佔用的空間,提高了分層式櫃體160的空間利用率。In some cases, by arranging the
在一些實施例中,散熱系統100實現散熱的方式可以包括液冷散熱及/或風冷散熱。如圖2所示,在一些實施例中,散熱系統100可以包括設置在兩排散熱單元130之間的散熱風道163,散熱風道163可以用於實現散熱系統100的風冷散熱。在一些實施例中,散熱風道163在分層式櫃體160的頂部與底部之間沿垂直方向延伸。垂直方向可以理解為分層式櫃體160的高度方向(即圖1中的第二方向)。在一些實施例中,散熱風道163可以由分層式櫃體160各層上的兩排散熱單元130之間的空隙形成,即各層上的兩排散熱單元130之間的空間可以連通形成散熱風道163。分層式櫃體160的底部可以是分層式櫃體160靠近安裝地面的一側,而分層式櫃體160的頂部則是分層式櫃體160遠離安裝地面的一側。In some embodiments, the heat dissipation method of the
在一些情況下,通過在分層式櫃體160每層的兩排散熱單元130之間設置散熱風道163,分層式櫃體160內的熱空氣會從兩側(即設置有散熱單元130的兩側)彙集到散熱風道163中,並從分層式櫃體160的頂部排出。In some cases, by setting the heat
參見圖1及圖2所示,在一些實施例中,為了實現散熱系統100的風冷散熱,分層式櫃體160對應於每層支撐架167上的兩排散熱單元130的第一側壁161及第二側壁162可以分別設置有第一進風口164與第二進風口165。而在分層式櫃體160的頂部對應於散熱風道163的位置可以設置有排風口166。在本實施例中,通過分別在第一側壁161與第二側壁162設置進風口(即第一進風口164與第二進風口165),以及在分層式櫃體160的頂部設置排風口166,可以使進入分層式櫃體160的空氣形成自然風道。當外部空氣進入分層式櫃體160後,可以分別從第一側壁161及第二側壁162向散熱風道163彙集,在彙集流程中可以帶走散熱單元130以及集流管140周圍的熱空氣,從而降低分層式櫃體160內的溫度。在一些實施例中,第一進風口164與第二進風口165可以為設置在第一側壁161及第二側壁162上的一個或多個通孔。排風口166可以為設置在分層式櫃體160的殼體的頂部的通孔。Referring to Fig. 1 and Fig. 2, in some embodiments, in order to realize the air-cooled heat dissipation of the
在一些情況下,進入散熱單元130經過熱交換的液體溫度通常較高,從散熱單元130排出並經由集流管140、出液管150排出散熱系統100的流程中,集流管140與出液管150中的液體也會散發熱量。這些熱量會傳遞到管體外使分層式櫃體160內的溫度上升。從第一進風口164進入的外部空氣可以經過第一側壁161對應的集流管140與散熱單元130,將該處的熱空氣帶到散熱風道163內。而從第二進風口165進入的外部空氣可以經過第二側壁162對應的集流管140與散熱單元130,將該處的熱空氣帶到散熱風道163內。散熱風道163的氣體溫度因此升高,散熱風道163內的熱空氣可以通過分層式櫃體160頂部的排風口166被排出,從而實現了散熱系統100的風冷散熱。在一些實施例中,散熱風道163內的熱空氣可以由於其自身密度特性自動從頂部的排風口166排出。In some cases, the temperature of the liquid entering the
在一些實施例中,為了增大散熱系統100在風冷散熱的效率,排風口166可以設有排風裝置(圖中未示出)。在一些實施例中,排風裝置可以包括一個或多個排氣扇,排氣扇由電機驅動,能夠較好地將散熱風道163內的熱空氣排出分層式櫃體160。In some embodiments, in order to increase the efficiency of the
在一些實施例中,可以在第一進風口164及/或第二進風口165設置進風裝置(圖中未示出),提高散熱系統100的進氣效率。在一些實施例中,進風裝置可以包括一個或多個進氣扇,進氣扇由電機驅動,能夠較好地將外部空氣吸入分層式櫃體160。In some embodiments, an air intake device (not shown in the figure) may be provided at the
本揭示內容的實施例中的散熱系統100可以同時通過液冷散熱與風冷散熱的兩種散熱方式來實現散熱,能夠在很大程度上降低分層式櫃體160內各個散熱單元130內晶片的溫度,使得散熱系統100具有更佳地散熱性能。此外,散熱系統100中的分層式櫃體160可以包括分層設置的多個支撐架167,且每層支撐架167上均可以放置有兩排散熱單元130,每排散熱單元130中可以包括多個待散熱裝置(例如,晶片)。通過設置兩排散熱單元130,能夠有效增加分層式櫃體160單位體積的晶片放置量,從而提高分層式櫃體160的空間利用率。在一些實施例中,散熱系統100可以僅包括液冷散熱或風冷散熱。The
在一些實施例中,本揭示內容的實施例中的散熱系統100還可以根據散熱系統100(也即分層式櫃體160)內的溫度調節風冷及/或液冷的散熱效率,以此來調節散熱系統100內的溫度。在一些實施例中,散熱系統100還可以包括溫度調節裝置(圖中未示出),溫度調節裝置可以對散熱系統100內的溫度進行監控以及調節。In some embodiments, the
在一些實施例中,溫度調節裝置可以包括溫度感測器及控制器。其中,溫度感測器可以用於檢測散熱系統100的溫度並產生溫度檢測信號,控制器可以用於根據溫度檢測信號調節排風裝置及/或進風裝置的排放效率。在一些實施例中,可以通過調節排風裝置中的一個或多個排氣扇及/或進風裝置中的一個或多個進氣扇的轉速來調節排風裝置的排風效率及/或進風效率。排氣扇及/或進氣扇的轉速越高,排風裝置的排風效率及/或進風裝置的進風效率就越高,散熱系統的溫度就降低得越快。在一些實施例中,控制器可以包括單片機、可程式設計邏輯控制器(Programmable Logic Controller,PLC)等控制系統。In some embodiments, the temperature regulating device may include a temperature sensor and a controller. Wherein, the temperature sensor can be used to detect the temperature of the
在一些實施例中,溫度感測器可以設置在散熱風道163內,例如,溫度感測器可以設置在散熱風道163的頂部,以用於檢測散熱風道163頂部的溫度。在一些實施例中,溫度感測器可以設置在分層式櫃體160的任意位置以檢測該位置的溫度。在一些情況下,當散熱系統100內設置有前述一個或多個實施例中的散熱風道163時,由於分層式櫃體160內的空氣會彙集到散熱風道163中並通過散熱風道163的頂部排出分層式櫃體160,因此散熱風道163頂部的溫度相對較高。在一些實施例中,當溫度感測器檢測到散熱風道163頂部的超過溫度臨界值(例如,65度、70度、80度等)時,可以產生溫度過高的溫度檢測信號,控制器可以基於相應的溫度檢測信號提高排風裝置中的一個或多個排氣扇的轉速,以此來增大排風裝置的排風效率,提高散熱效率。In some embodiments, the temperature sensor may be disposed in the heat
在一些實施例中,當溫度感測器檢測到散熱風道163頂部的溫度處於溫度臨界值以內時,可以產生溫度正常的溫度檢測信號,控制器可以在不影響散熱系統100的散熱效果的情況下,基於溫度正常的溫度檢測信號將排風裝置中的一個或多個排氣扇的轉速調低。這樣既可以保證排風裝置的轉速能夠滿足散熱系統100的散熱需求,又降低了排風裝置(例如,排氣扇)的功耗,並且降低了排氣扇運轉時所產生的噪音。在一些實施例中,當溫度正常時,控制器可以不對排風裝置進行調節。In some embodiments, when the temperature sensor detects that the temperature at the top of the cooling
在一些實施例中,控制器可以用於根據溫度檢測信號調節進風裝置的進風效率。在一些實施例中,控制器可以用於根據溫度檢測信號同時調節進風裝置的進風效率與排風裝置的排風效率。控制器根據溫度檢測信號調節進風裝置的進風效率的流程與根據溫度檢測信號調節排風裝置的排風效率相同或者相似,在此不再贅述。In some embodiments, the controller can be used to adjust the air intake efficiency of the air intake device according to the temperature detection signal. In some embodiments, the controller can be used to simultaneously adjust the air intake efficiency of the air intake device and the exhaust efficiency of the air exhaust device according to the temperature detection signal. The flow of the controller adjusting the air intake efficiency of the air intake device according to the temperature detection signal is the same or similar to that of adjusting the exhaust air efficiency of the air exhaust device according to the temperature detection signal, and will not be repeated here.
在一些實施例中,進液口111及/或出液口151處可以設有第一流量閥(圖中未示出),控制器可以控制第一流量閥(例如,採用PLC控制的方式)以此調節通過第一流量閥輸送到散熱系統100中的液體及/或從散熱系統100中排出的液體的流量,從而實現散熱系統100的溫度調節。示例性的,當溫度感測器檢測到散熱風道163頂部的溫度超過溫度臨界值時,可以產生與溫度過高的溫度檢測信號,控制器可以基於溫度過高的溫度檢測信號控制第一流量閥,提高通過第一流量閥的液體流量,從而提高散熱系統100的散熱效果。在一些實施例中,當溫度感測器檢測到散熱風道163頂部的溫度在溫度臨界值內時,可以產生溫度正常的溫度檢測信號,控制器可以基於溫度正常的溫度檢測信號調節第一流量閥,以減小通過第一流量閥的液體的流量,減小散熱所引起的功耗(例如,與散熱系統100的出液口及/或進液口連接的水泵的功耗)。在一些實施例中,當溫度正常時,控制器可以不對第一流量閥進行調節。In some embodiments, a first flow valve (not shown in the figure) may be provided at the
在一些實施例中,可以在分層式櫃體160的每一層均設置溫度感測器。示例性的,在每個支撐架167上都設置溫度感測器。每一層的分流管120與進液管140的連接端(例如,圖2及圖3所示的第一分流管端121)及/或每一層集流管140與出液管150的連接端(例如,圖2及圖3所示的第一集流管端141)設有第二流量閥(圖中未示出)。控制器可以用於根據每一層的溫度感測器產生的溫度檢測信號調節通過每個第二流量閥的液體流量。In some embodiments, a temperature sensor can be provided on each floor of the
僅作為示例,當某一層的溫度感測器檢測到該層的溫度超過溫度臨界值或處於溫度臨界值內時,控制器可以根據溫度過高或溫度正常的溫度檢測信號調節該層分流管120及/或集流管140上的第二流量閥,從而調節通過該第二流量閥的液體流量(例如,進入到該層分流管120的液體的流量及/或從該層集流管140排出的液體流量)增大或變小,相應地降低該層空間的溫度或減少散熱系統100的功耗。As an example only, when the temperature sensor of a certain layer detects that the temperature of this layer exceeds the temperature critical value or is within the temperature critical value, the controller can adjust the
在一些實施例中,控制器也可以根據設置在分層式櫃體的每一層的溫度感測器的溫度檢測信號同時對多個第二流量閥進行調節,從而調節通過多個第二流量閥的液體流量,實現對分層式櫃體160的多層空間內的溫度調節的目的,最終保證分層式櫃體160多層空間內的溫度分佈均勻。在一些實施例中,分層式櫃體160各層所設置的散熱單元130的數量以及各散熱單元130內的板卡139的數量及/或類型可能有所不同,從而導致每層所產生的熱量可能不同。通過在各層分別設置溫度感測器並對應調節每層的液體流量,能夠實現對散熱系統100的精細化控制,既能夠保證各層所需的散熱效果,又能夠節約散熱系統100的使用成本。In some embodiments, the controller can also simultaneously adjust multiple second flow valves according to the temperature detection signals of the temperature sensors installed on each layer of the layered cabinet, thereby adjusting the flow through the multiple second flow valves. The liquid flow rate can realize the purpose of temperature regulation in the multi-layer space of the
本申請實施例所揭露的散熱系統可能帶來的有益效果包括但不限於:(1)通過將進液口的高度與出液口的高度設置為均高於分流管、集流管以及散熱單元內的液體的液位,可以有效避免散熱系統的管道出現空水的情況;並且無需增加額外的排氣裝置來排出散熱系統的管道中的空氣,能夠精簡散熱系統的結構,同時還減小了散熱系統的製造成本;(2)通過在每層支撐架上同時設置兩排散熱單元,能夠提高分層式櫃體的空間利用率;(3)通過在兩排散熱單元之間設置散熱風道以及在分層式櫃體的第一側壁及第二側壁上設置第一進風口與第二進風口,可以在分層式櫃體內部形成自然風道;空氣可以通過第一進風口與第二進風口進入分層式櫃體內部並向散熱風道彙集,在彙集流程中可以帶走散熱單元以及集流管周圍的熱空氣,從而降低分層式櫃體內的溫度。需要說明的是,不同實施例可能產生的有益效果不同,在不同的實施例裡,可能產生的有益效果可以是以上任意一種或幾種的組合,也可以是其他任何可能獲得的有益效果。The possible beneficial effects of the heat dissipation system disclosed in the embodiments of this application include but are not limited to: (1) By setting the height of the liquid inlet and the height of the liquid outlet to be higher than the distribution pipe, the header pipe and the heat dissipation unit The liquid level of the liquid inside can effectively avoid the situation of empty water in the pipeline of the cooling system; and there is no need to add an additional exhaust device to discharge the air in the pipeline of the cooling system, which can simplify the structure of the cooling system and reduce the The manufacturing cost of the cooling system; (2) By setting two rows of cooling units on each support frame at the same time, the space utilization rate of the layered cabinet can be improved; (3) By setting the cooling air duct between the two rows of cooling units And the first air inlet and the second air inlet are set on the first side wall and the second side wall of the layered cabinet body, which can form a natural air duct inside the layered cabinet body; air can pass through the first air inlet and the second air inlet. The air inlet enters the interior of the layered cabinet and collects into the cooling air duct. During the collection process, the hot air around the cooling unit and the collector can be taken away, thereby reducing the temperature in the layered cabinet. It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.
本揭示內容的一些實施例還提供一種供暖系統。供暖系統可以包括上述任一技術方案中的散熱系統100以及供暖管路,供暖管路與散熱系統100的出液口111連通。利用供暖管路接收由散熱系統100的出液口111排出的經過熱交換的液體。供暖系統可以將該液體直接用於供暖,通過再次的熱交換把液體中的熱量釋放,用於其他場地的取暖。另外,由於散熱系統100對液體的水質要求不高,供暖系統中無需設置淨水裝置,降低了供暖系統的成本。Some embodiments of the present disclosure also provide a heating system. The heating system may include the
圖5係根據本申請一些實施例所示的供暖系統的結構示意圖。在一些實施例中,供暖系統1000可以包括散熱系統100與供暖管路200,供暖管路200與散熱系統100的出液口111連通。供暖系統1000可以理解為使人們生活或進行生產的空間保持在適宜的熱狀態而設置的供熱設施(如暖氣片、地暖等)。液體在供暖管路200中的流動方向如圖5中的箭頭所示。溫度較高的液體可以通入供暖系統1000的供暖管路200中,液體可以在供暖管路200中放熱,以提高供暖系統1000需要供暖的區域的溫度。將供暖系統1000與散熱系統200配合使用時,可以將散熱系統100中的出液口111流出的進行熱交換後的液體用於供暖系統1000進行供暖,實現液體的迴圈利用,也實現了對待散熱裝置所散發的熱能的回收利用。在一些實施例中,流入到供暖系統1000中進行再次熱交換(例如,在供暖管路200中放熱)後的液體可以直接流入到散熱系統100中用於對待散熱裝置進行散熱。示例性的,當液體在供暖管路200中進行熱交換放熱後,液體的溫度會降低,因此可以再次作為散熱系統100的冷卻液體。將散熱系統100的進液口111與供暖管路200的出口相連,可以將該液體輸入至散熱系統100的散熱單元130與晶片進行熱交換,實現液體的迴圈利用。Fig. 5 is a schematic structural diagram of a heating system according to some embodiments of the present application. In some embodiments, the
需要說明的是,不同實施例可能產生的有益效果不同,在不同的實施例裡,可能產生的有益效果可以是以上任意一種或幾種的組合,也可以是其他任何可能獲得的有益效果。It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.
上文已對基本概念做了描述,顯然,對於本領域具有通常知識者來說,上述詳細揭露僅僅作為示例,而並不構成對本申請的限定。雖然此處並沒有明確說明,本領域具有通常知識者可能會對本申請進行各種修改、改進與修正。該類修改、改進與修正在本申請中被建議,所以該類修改、改進、修正仍屬於本申請示範實施例的精神與範圍。The basic concept has been described above, obviously, for those skilled in the art, the above detailed disclosure is only an example, and does not constitute a limitation to the present application. Although not explicitly stated herein, various modifications, improvements, and amendments to this application may be made by those skilled in the art. Such modifications, improvements and amendments are suggested in this application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of this application.
同時,本申請使用了特定詞語來描述本申請的實施例。如「一個實施例」、「一實施例」、及/或「一些實施例」意指與本申請至少一個實施例相關的某一特徵、結構或特點。因此,應強調並注意的是,本說明書中在不同位置兩次或多次提及的「一實施例」或「一個實施例」或「一個替代性實施例」並不一定是指同一實施例。此外,本申請的一個或多個實施例中的某些特徵、結構或特點可以進行適當的組合。Meanwhile, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and/or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that two or more references to "an embodiment" or "an embodiment" or "an alternative embodiment" in this specification in different places do not necessarily refer to the same embodiment . In addition, certain features, structures or characteristics of one or more embodiments of the present application may be properly combined.
此外,除非申請專利範圍中明確說明,本申請所述處理元素與序列的順序、數字字母的使用、或其他名稱的使用,並非用於限定本申請流程與方法的順序。儘管上述揭露中通過各種示例討論了一些目前認為有用的申請實施例,但應當理解的是,該類細節僅起到說明的目的,附加的申請專利範圍並不僅限於揭露的實施例,相反,申請專利範圍旨在覆蓋所有符合本申請實施例實質與範圍的修正及等價組合。例如,雖然以上所描述的系統元件可以通過硬體裝置實現,但是也可以只通過軟體的解決方案得以實現,如在現有的伺服器或行動裝置上安裝所描述的系統。In addition, unless clearly stated in the patent scope of the application, the order of processing elements and sequences, the use of numbers and letters, or the use of other names in this application are not used to limit the order of the process and methods of this application. Although the above disclosure discusses some presently believed useful embodiments of the application by way of various examples, it should be understood that such details are for illustrative purposes only and that the scope of the appended claims is not limited to the disclosed embodiments. Rather, the application The scope of the patent is intended to cover all modifications and equivalent combinations that conform to the spirit and scope of the embodiments of the present application. For example, although the above-described system components can be implemented by hardware devices, they can also be implemented by only software solutions, such as installing the described system on an existing server or mobile device.
同理,應當注意的是,為了簡化本申請揭露的表述,從而幫助對一個或多個申請實施例的理解,前文對本申請實施例的描述中,有時會將多種特徵歸併至一個實施例、圖式或對其的描述中。但是,這種揭露方法並不意味著本申請物件所需要的特徵比申請專利範圍中提及的特徵多。實際上,實施例的特徵要少於上述揭露的單個實施例的全部特徵。In the same way, it should be noted that in order to simplify the expression disclosed in this application and thus help the understanding of one or more application embodiments, in the foregoing descriptions of the embodiments of the application, sometimes multiple features are combined into one embodiment, schema or description thereof. However, this method of disclosure does not imply that the object of the present application requires more features than those mentioned in the claims. Indeed, embodiment features are less than all features of a single foregoing disclosed embodiment.
最後,應當理解的是,本申請中所述實施例僅用以說明本申請實施例的原則。其他的變形也可能屬於本申請的範圍。因此,作為示例而非限制,本申請實施例的替代配置可視為與本申請的教導一致。相應地,本申請的實施例不僅限於本申請明確介紹及描述的實施例。Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other modifications are also possible within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of the present application may be considered consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.
100:散熱系統 110:進液管 111:進液口 120:分流管 121:第一分流管端 122:第二分流管端 123:第一分流口 130:散熱單元 131:第二連接管 133:液體入口 135:液體出口 137:散熱板 137-1:散熱板 137-2:散熱板 137-3:散熱板 137-4:散熱板 139:板卡 140:集流管 141:第一集流管端 142:第二集流管端 143:第一集流口 150:出液管 151:出液口 160:分層式櫃體 161:第一側壁 162:第二側壁 163:散熱風道 164:第一進風口 165:第二進風口 166:排風口 167:支撐架 200:供暖管路 1000:供暖系統 100: cooling system 110: liquid inlet pipe 111: liquid inlet 120: shunt tube 121: the first shunt pipe end 122: the second shunt pipe end 123: The first split port 130: cooling unit 131: the second connecting pipe 133: Liquid inlet 135: liquid outlet 137: cooling plate 137-1: cooling plate 137-2: cooling plate 137-3: cooling plate 137-4: cooling plate 139: board 140: Manifold 141: The first collecting pipe end 142: Second header end 143: The first outlet 150: Outlet pipe 151: liquid outlet 160: layered cabinet 161: first side wall 162: second side wall 163: cooling air duct 164: The first air inlet 165: Second air inlet 166: exhaust vent 167: support frame 200: heating pipeline 1000: heating system
本申請將以示例性實施例的方式進一步說明,這些示例性實施例將通過圖式進行詳細描述。這些實施例並非限制性的,在這些實施例中,相同的編號表示相同的結構,其中:The present application will be further illustrated by way of exemplary embodiments, which will be described in detail by means of drawings. These examples are non-limiting, and in these examples, the same number indicates the same structure, wherein:
[圖1]係根據本揭示內容的一些實施例所示的散熱系統的結構示意圖;[FIG. 1] is a schematic structural diagram of a cooling system according to some embodiments of the present disclosure;
[圖2]係根據本揭示內容的一些實施例所示的散熱系統的內部結構示意圖;[ FIG. 2 ] is a schematic diagram of the internal structure of a cooling system according to some embodiments of the present disclosure;
[圖3]係根據本揭示內容的一些實施例所示的散熱系統的內部管路結構示意圖;[ FIG. 3 ] is a schematic diagram of the internal pipeline structure of the heat dissipation system according to some embodiments of the present disclosure;
[圖4]係根據本揭示內容的一些實施例所示的散熱單元的結構示意圖;[ FIG. 4 ] is a schematic structural diagram of a heat dissipation unit according to some embodiments of the present disclosure;
[圖5]係根據本揭示內容的一些實施例所示的供暖系統的結構示意圖。[ Fig. 5 ] is a schematic structural diagram of a heating system according to some embodiments of the present disclosure.
圖式說明:散熱系統100;進液管110;進液口111;分流管120;第一分流管端121;第二分流管端122;第一分流口123;散熱單元130;第二連接管131;液體入口133;液體出口135;散熱板137(137-1、137-2、137-3、137-4);板卡139;集流管140;第一集流管端141;第二集流管端142;第一集流口143;出液管150;出液口151;分層式櫃體160;第一側壁161;第二側壁162;散熱風道163;第一進風口164;第二進風口165;排風口166;支撐架167;供暖管路200;供暖系統1000。Explanation of drawings: cooling
100:散熱系統 100: cooling system
110:進液管 110: liquid inlet pipe
111:進液口 111: liquid inlet
120:分流管 120: shunt tube
121:第一分流管端 121: the first shunt pipe end
122:第二分流管端 122: the second shunt pipe end
130:散熱單元 130: cooling unit
140:集流管 140: Manifold
141:第一集流管端 141: The first collecting pipe end
142:第二集流管端 142: Second header end
150:出液管 150: Outlet pipe
151:出液口 151: liquid outlet
160:分層式櫃體 160: layered cabinet
161:第一側壁 161: first side wall
162:第二側壁 162: second side wall
163:散熱風道 163: cooling air duct
164:第一進風口 164: The first air inlet
165:第二進風口 165: Second air inlet
166:排風口 166: exhaust vent
167:支撐架 167: support frame
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CN202110918659.5A CN113587196A (en) | 2021-08-11 | 2021-08-11 | Heat dissipation and heating system |
CN202121877222.3 | 2021-08-11 | ||
CN202121869423.9 | 2021-08-11 | ||
CN202121877222.3U CN215340997U (en) | 2021-08-11 | 2021-08-11 | Heat dissipation system |
CN202110918659.5 | 2021-08-11 | ||
CN202121869423.9U CN216346514U (en) | 2021-08-11 | 2021-08-11 | Heat dissipation and heating system |
PCT/CN2022/106689 WO2023016206A1 (en) | 2021-08-11 | 2022-07-20 | Heat dissipation system and heating system |
WOPCT/CN2022/106689 | 2022-07-20 |
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CN116437648B (en) * | 2023-06-12 | 2023-08-25 | 天津膜术工场环保科技有限公司 | Rail transit system modularization application management cabinet |
CN117526140B (en) * | 2024-01-03 | 2024-03-29 | 伊诺德电力集团有限公司 | Low-voltage switch cabinet based on Internet of things |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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US20150160702A1 (en) * | 2013-12-10 | 2015-06-11 | Silicon Graphics International Corp. | Hot Swappable Computer Cooling System |
CN108738281B (en) * | 2018-05-31 | 2020-12-22 | 台州智奥通信设备有限公司 | Enhanced heat dissipation device and control method |
CN109634391B (en) * | 2018-12-20 | 2022-08-16 | 威创集团股份有限公司 | Heat dissipation device |
US11137175B2 (en) * | 2019-07-16 | 2021-10-05 | Asia Vital Components Co., Ltd. | Composite water-cooling radiator structure |
CN210742434U (en) * | 2019-08-30 | 2020-06-12 | 武汉鄂电电力试验设备有限公司 | Frequency conversion series resonance withstand voltage test device |
CN212677617U (en) * | 2020-09-03 | 2021-03-09 | 北京百度网讯科技有限公司 | Liquid cooling distribution device and liquid cooling distribution system |
CN113587196A (en) * | 2021-08-11 | 2021-11-02 | 杭州大热若寒科技有限责任公司 | Heat dissipation and heating system |
CN216346514U (en) * | 2021-08-11 | 2022-04-19 | 杭州大热若寒科技有限责任公司 | Heat dissipation and heating system |
CN215340997U (en) * | 2021-08-11 | 2021-12-28 | 杭州大热若寒科技有限责任公司 | Heat dissipation system |
-
2022
- 2022-07-20 WO PCT/CN2022/106689 patent/WO2023016206A1/en unknown
- 2022-08-08 TW TW111129716A patent/TW202311675A/en unknown
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WO2023016206A1 (en) | 2023-02-16 |
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