WO2023016206A1

WO2023016206A1 - Heat dissipation system and heating system

Info

Publication number: WO2023016206A1
Application number: PCT/CN2022/106689
Authority: WO
Inventors: 李日升; 刘云锋; 汪烈东
Original assignee: 杭州大热若寒科技有限责任公司
Priority date: 2021-08-11
Filing date: 2022-07-20
Publication date: 2023-02-16
Also published as: TW202311675A

Abstract

A heat dissipation system and a heating system. The heating system comprises a liquid input pipe (110), flow distribution pipes (120), heat dissipation units (130), collecting pipes (140) and a liquid output pipe (150), wherein the liquid input pipe (110) comprises a liquid input port (111), and the liquid input pipe (110) is in communication with the flow distribution pipes (120); the heat dissipation unit (130) comprises liquid inlets (133) and liquid outlets (135), the flow distribution pipes (120) being in communication with the liquid inlets (133), and the liquid outlets (135) being in communication with the collecting pipes (140); and the collecting pipes (140) are in communication with the liquid output pipe (150), and the liquid output pipe (150) comprises a liquid output port (151), wherein the liquid input port (111) and the liquid output port (151) are both higher than the liquid level of the liquid in the flow distribution pipes (120), the heat dissipation units (130) and the collecting pipes (140). Since the liquid input port (111) and the liquid output port (151) are arranged at the highest position of the heat dissipation system, the situation of no water in the pipeline of the heat dissipation system can be effectively prevented, and there is no need to provide an additional exhaust device to remove air from the pipeline of the heat dissipation system.

Description

Cooling and heating system

cross reference

This application claims priority to Chinese patent application CN202110918659.5 filed on August 11, 2021, the entire contents of which are incorporated herein by reference, and this application claims priority to Chinese patent application CN202121869423.9 filed on August 11, 2021 , the entire content of which is incorporated herein by reference. This application claims the priority of Chinese patent application CN202121877222.3 filed on August 11, 2021, the entire content of which is incorporated herein by reference.

technical field

This specification relates to the technical field of heat dissipation and heating, in particular to a heat dissipation and heating system.

Background technique

The heat dissipation system is a system used to dissipate heat from devices that generate large amounts of heat (such as chips, CPUs, GPUs, ASICs, etc.), so as to prevent these devices from overheating during use and ensure the normal operation of the devices. The heat dissipation method of the heat dissipation system usually uses air cooling or liquid cooling. For example, the heat dissipation system may use a specific liquid (for example, water) as a coolant, and the coolant may flow in pipelines of the heat dissipation system and perform heat exchange with the equipment to be dissipated to reduce the temperature of the equipment to be dissipated.

Contents of the invention

One of the embodiments of this specification provides a heat dissipation system, the heat dissipation system includes: a liquid inlet pipe, a shunt pipe, a heat dissipation unit, a collecting pipe, and a liquid outlet pipe; the liquid inlet pipe includes a liquid inlet, and the liquid inlet The tube communicates with the distribution pipe; the heat dissipation unit includes a liquid inlet and a liquid outlet, the distribution pipe communicates with the liquid inlet, and the liquid outlet communicates with the collector; the collector communicates with the The liquid outlet pipe is connected, and the liquid outlet pipe includes a liquid outlet; the height of the liquid inlet and the liquid outlet is higher than the liquid level of the liquid in the shunt pipe, the heat dissipation unit and the collecting pipe. bit.

In some embodiments, the heat dissipation system further includes a layered cabinet, and each layer of the layered cabinet is used for setting one or more heat dissipation units.

In some embodiments, the liquid inlet and the liquid outlet are arranged at the same height of the side wall of the layered cabinet.

In some embodiments, two rows of heat dissipation units are arranged side by side on each floor of the layered cabinet, and the heat dissipation system further includes a heat dissipation air duct disposed between the two rows of heat dissipation units, The cooling air duct extends vertically between the top and the bottom of the layered cabinet.

In some embodiments, one end of the shunt pipe communicates with the liquid inlet pipe, the other end of the shunt pipe is blocked, and the shunt pipe is U-shaped and arranged around two rows of heat dissipation units; One end of the pipe communicates with the liquid outlet pipe, the other end of the collecting pipe is blocked, and the collecting pipe is U-shaped and arranged around two rows of the cooling units.

In some embodiments, the layered cabinet is provided with a first air inlet and a second air inlet corresponding to the first side wall and the second side wall of the two rows of heat dissipation units respectively, and the layered cabinet An air outlet is provided on the top of the body corresponding to the position of the heat dissipation air duct.

In some embodiments, an exhaust device is provided at the air outlet.

In some embodiments, the heat dissipation system further includes a temperature adjustment device, and the temperature adjustment device includes a temperature sensor and a controller; the temperature sensor is used to detect the temperature of the heat dissipation system and generate a temperature detection signal; the control The device is used to adjust the exhaust efficiency of the exhaust device according to the temperature detection signal.

In some embodiments, the temperature sensor is disposed on the top of the cooling air duct for detecting the temperature at the top of the cooling air duct.

In some embodiments, an air inlet device is provided at the first air inlet and/or at the second air inlet; the controller is also used to adjust the air intake of the air inlet device according to the temperature detection signal wind efficiency.

In some embodiments, a first flow valve is provided on the liquid inlet and/or the liquid outlet; the controller is also used to adjust the liquid flow through the first flow valve according to the temperature detection signal .

In some embodiments, each layer of the layered cabinet is provided with the temperature sensor, and each layer is provided with one of the shunt pipes and one of the headers; The connecting end of the branch pipe and the liquid inlet pipe, and/or the connecting end of the collecting pipe of each layer and the liquid outlet pipe is provided with a second flow valve; the controller is also used for each The temperature detection signal of the temperature sensor of one layer regulates the liquid flow through the second flow valve of each layer.

In some embodiments, the heat dissipation unit includes a plurality of heat dissipation plates arranged side by side, and board cards are installed between every two adjacent heat dissipation plates, and the heat dissipation plates are used to perform heat dissipation on the chips on the board cards. Heat dissipation; in the heat dissipation unit, each of the heat dissipation plates includes the liquid inlet and the liquid outlet, the liquid inlet of the heat dissipation plate at one end communicates with the distribution pipe, and the liquid inlet of the heat dissipation plate at the other end The liquid outlet of the cooling plate communicates with the header, and the liquid inlet and the liquid outlet between adjacent cooling plates communicate with each other.

One of the embodiments of the present specification provides a heating system, including the heat dissipation system in the foregoing embodiments and a heating pipeline, where the heating pipeline communicates with the liquid outlet of the heat dissipation system.

One of the embodiments of this specification provides a heat dissipation system. The heat dissipation system includes: a layered cabinet, and each layer of the layered cabinet is provided with two rows of heat dissipation units in parallel; The heat dissipation air passage between the units, the heat dissipation air passage extends vertically between the top and the bottom of the layered cabinet; the layered cabinet corresponds to the first row of heat dissipation units of the two rows The side wall and the second side wall are respectively provided with a first air inlet and a second air inlet, and the top of the layered cabinet is provided with an air outlet at a position corresponding to the heat dissipation air duct.

In some embodiments, an exhaust device is provided at the air outlet.

In some embodiments, the heat dissipation unit includes a liquid inlet and a liquid outlet, and the heat dissipation system further includes: a liquid inlet pipe, a shunt pipe, a collecting pipe, and a liquid outlet pipe; the liquid inlet pipe includes a liquid inlet, so The liquid inlet pipe is connected with the shunt pipe; the shunt pipe is connected with the liquid inlet, and the liquid outlet is connected with the collecting pipe; the collecting pipe is connected with the liquid outlet pipe, and the outlet pipe is connected with the liquid outlet pipe. The liquid pipe includes a liquid outlet.

In some embodiments, one end of the shunt pipe communicates with the liquid inlet pipe, the other end of the shunt pipe is blocked, and the shunt pipe is U-shaped and arranged around the two rows of cooling units; One end of the pipe communicates with the liquid outlet pipe, the other end of the collecting pipe is blocked, and the collecting pipe is U-shaped and arranged around the two rows of cooling units.

In some embodiments, the heat dissipation system further includes a temperature adjustment device, and the temperature adjustment device includes a temperature sensor and a controller; the liquid inlet and/or the liquid outlet are provided with a first flow valve; the The temperature sensor is used to detect the temperature of the cooling system and generate a temperature detection signal; the controller is used to adjust the liquid flow through the first flow valve according to the temperature detection signal.

In some embodiments, the heat dissipation unit includes a plurality of heat dissipation plates arranged side by side, and board cards are installed between every two adjacent heat dissipation plates, and the heat dissipation plates are used to perform heat dissipation on the chips on the board cards. Heat dissipation; in the heat dissipation unit, each of the heat dissipation plates includes a liquid inlet and a liquid outlet, the liquid inlet of the heat dissipation plate at one end communicates with the distribution pipe, and the heat dissipation plate at the other end communicates with the distribution pipe. The liquid outlet communicates with the header, and the liquid inlet and the liquid outlet between adjacent heat dissipation plates communicate with each other.

Description of drawings

The present application will be further illustrated by means of exemplary embodiments, which will be described in detail by means of the accompanying drawings. These examples are non-limiting, and in these examples, the same number indicates the same structure, wherein:

FIG. 1 is a schematic structural diagram of a heat dissipation system according to some embodiments of the present specification;

Fig. 2 is a schematic diagram of the internal structure of a heat dissipation system according to some embodiments of the present specification;

Fig. 3 is a schematic diagram of the internal pipeline structure of the heat dissipation system according to some embodiments of the present specification;

Fig. 4 is a schematic structural diagram of a heat dissipation unit according to some embodiments of the present specification;

Fig. 5 is a schematic structural diagram of a heating system according to some embodiments of the present specification.

Description of drawings: heat dissipation system 100; liquid inlet pipe 110; liquid inlet port 111; shunt pipe 120; first shunt pipe end 121; second shunt pipe end 122; first shunt mouth 123; 131; liquid inlet 133; liquid outlet 135; cooling plate 137 (137-1, 137-2, 137-3, 137-4); plate card 139; header 140; first header end 141; second Collecting pipe end 142; first collecting port 143; liquid outlet pipe 150; liquid outlet 151; layered cabinet body 160; first side wall 161; second side wall 162; cooling air duct 163; first inlet Air outlet 164; second air inlet 165; air outlet 166; support frame 167; heating pipeline 200; heating system 1000.

Detailed ways

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings that need to be used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application, and those skilled in the art can also apply the present application to other similar scenarios. Unless otherwise apparent from context or otherwise indicated, like reference numerals in the figures represent like structures or operations.

It should be understood that "system", "device", "unit" and/or "module" as used herein is a method for distinguishing different components, elements, parts, parts or assemblies of different levels. However, the words may be replaced by other expressions if other words can achieve the same purpose.

As indicated in this application and claims, the terms "a", "an", "an" and/or "the" do not refer to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also contain other steps or elements.

Some embodiments of this specification provide a heat dissipation system, the liquid inlet pipe of the heat dissipation system includes a liquid inlet, and the liquid outlet pipe includes a liquid outlet. Both the liquid inlet and the liquid outlet are set at the high point of the cooling system, that is, the height of the liquid inlet and the liquid outlet are both higher than the liquid level of the liquid in other pipes (such as shunt pipes and headers) of the cooling system . By setting both the liquid inlet and the liquid outlet at the high point of the heat dissipation system, the pipes of the heat dissipation system will be filled with liquid during use; The flow rate is the same as the liquid flow rate (that is, the liquid discharge volume) discharged from the liquid outlet. Compared with high inlet and low outlet (that is, the liquid inlet is set at the high point of the cooling system, the liquid outlet is set at the low point of the cooling system, and the height of the liquid outlet is lower than the liquid level in other pipes of the cooling system) As far as the setting method is concerned, the heat dissipation system provided in this manual can effectively avoid the situation of empty water in the pipes of the heat dissipation system when the liquid intake is unstable (for example, the liquid intake is small). The empty water mentioned here means that there is no liquid in some places in the pipeline of the cooling system.

In addition, by arranging both the liquid inlet and the liquid outlet at the high point of the heat dissipation system, if gas occurs in the heat dissipation system, it can be more easily discharged from the liquid inlet and/or liquid outlet, compared with the low-inlet height In terms of the setting method (that is, the liquid inlet is set at the low point of the heat dissipation system, and the liquid outlet is set at the high point of the heat dissipation system), there is no need to add an additional exhaust device to the heat dissipation system pipe to discharge the air in the pipe. Not only the structure of the heat dissipation system is simplified, but also the manufacturing cost of the heat dissipation system is reduced.

Fig. 1 is a schematic structural diagram of a heat dissipation system according to some embodiments of this specification; Fig. 2 is a schematic diagram of an internal structure of a heat dissipation system according to some embodiments of this specification. As shown in FIG. 1 and FIG. 2 , in some embodiments, the heat dissipation system 100 may include a liquid inlet pipe 110 , a distribution pipe 120 , a heat dissipation unit 130 , a header 140 , a liquid outlet pipe 150 and a layered cabinet 160 .

Wherein, the liquid inlet pipe 110 refers to a pipe through which liquid enters the cooling system 100 . The liquid inlet pipe 110 may include a liquid inlet 111 for inputting liquid. The liquid inlet pipe 110 communicates with the shunt pipe 120 , and the liquid in the liquid inlet pipe 110 can flow into the shunt pipe 120 . The liquid outlet pipe 150 refers to a pipe through which the liquid is discharged from the cooling system 100 . The liquid outlet pipe 150 may include a liquid outlet 151 for liquid discharge. The liquid outlet pipe 150 communicates with the collecting pipe 140 , and the liquid in the collecting pipe 140 can flow into the liquid outlet pipe 150 . The layered cabinet body 160 may include a plurality of support frames 167 arranged in layers, and each support frame 167 may be used to place the cooling unit 130 . The heat dissipation unit 130 may include a liquid inlet 133 and a liquid outlet 135 . The liquid inlet 133 can communicate with the shunt pipe 120, and the liquid in the shunt pipe 120 can enter the inside of the cooling unit 130 through the liquid inlet 133 to exchange heat with the device to be dissipated (for example, a chip), thereby reducing the temperature of the device to be dissipated. The liquid outlet 135 may communicate with the header 140 , and the heat-exchanged liquid may flow into the header 140 through the liquid outlet 135 . The heights of the liquid inlet 111 and the liquid outlet 151 are higher than the liquid levels of the liquid in the distribution pipe 120 , the header pipe 140 and the cooling unit 130 . The height mentioned here may refer to the height in the vertical direction, or the vertical distance relative to the bottom of the layered cabinet body 160 . For example, the height of the liquid inlet 111 and the liquid outlet 151 may refer to the vertical distance between the liquid inlet 111 and the liquid outlet 151 and the bottom of the layered cabinet 160 .

In this embodiment, the liquid used for heat exchange with the equipment to be dissipated can enter the liquid inlet pipe 110 through the liquid inlet 111, and then enter the inside of the heat dissipation unit 130 through the shunt pipe 120, and communicate with the heat dissipation unit 30 installed in the heat dissipation unit 30. The device performs heat exchange. Finally, the heat-exchanged liquid can be discharged from the liquid outlet 151 via the header 140 and the liquid outlet pipe 150 in sequence. In some cases, since the heights of the liquid inlet 111 and the liquid outlet 151 are higher than the liquid levels of the liquid in the manifold 120, the header 140, and the heat dissipation unit 130, it is possible to effectively avoid voids in the pipes of the heat dissipation system 100. water condition. And there is no need to add an additional exhaust device to exhaust the air in the pipes of the heat dissipation system 100 . On the one hand, the structure of the heat dissipation system 100 is simplified, and at the same time, the manufacturing cost of the heat dissipation system 100 is reduced.

The liquid referred to in one or more embodiments of this specification can be understood as a coolant used to absorb heat from the equipment to be dissipated, and the liquid can be one or more of water, antifreeze, and the like. The device to be dissipated in the embodiment of this specification may include, but not limited to, a chip, a printed circuit board, and a combination of one or more of them. In some embodiments, a chip assembly, a printed circuit board (Printed Circuit Board, PCB), etc. can be arranged on a board, and the board (for example, board 139) is installed in the heat dissipation unit 130, and then through the above-mentioned The heat dissipation system 100 dissipates heat.

1 and 2, in some embodiments, the layered cabinet 160 may include a casing, and the casing may form an accommodation space for accommodating the components of the heat dissipation system 100 (for example, the heat dissipation unit 130, the distribution pipe 120 , header 140, etc.). In some embodiments, the liquid inlet 111 and the liquid outlet 151 can both be arranged on the side wall of the layered cabinet 160 (that is, the side wall of the housing), so that the liquid inlet 111 and the liquid outlet 151 can be connected with each other. External pipes (for example, heating pipe 200) are connected.

In some embodiments, both the liquid inlet 111 and the liquid outlet 151 may be disposed on the same side wall of the layered cabinet 160 . For example, in the embodiment shown in FIG. 1 and FIG. 2, the liquid inlet pipe 110 and the liquid outlet pipe 150 are all arranged on the same side of the layered cabinet body 160 (one of the shells close to the layered cabinet body 160 side wall). One end of the liquid inlet pipe 110 close to the liquid inlet 111 is bent in an arc so that the liquid inlet 111 protrudes from the side wall. One end of the liquid outlet pipe 150 close to the liquid outlet 151 is bent in an arc so that the liquid outlet 151 protrudes from the side wall. By arranging the liquid inlet 111 and the liquid outlet 151 on the same side wall, the cooling system 100 can be easily installed and maintained.

In some alternative embodiments, the liquid inlet 111 and the liquid outlet 151 may be disposed on different side walls of the layered cabinet 160 . For example, the liquid inlet pipe 110 can be arranged at a position close to one of the side walls of the shell of the layered cabinet body 160, and the end of the liquid inlet pipe 110 near the liquid inlet 111 is bent in an arc to make the liquid inlet 111 protrude. the sidewall. And the liquid outlet pipe 150 can be arranged at the position close to the other side wall opposite to the side wall, and the end of the liquid outlet pipe 150 near the liquid outlet 151 is curved in an arc so that the liquid outlet 151 protrudes from the other side wall . After such arrangement, the liquid outlet 151 and the liquid inlet 111 are respectively arranged on two opposite side walls of the casing.

In some embodiments, both the liquid inlet 111 and the liquid outlet 151 may be disposed on the top of the shell of the layered cabinet 160. For example, the liquid inlet 111 of the liquid inlet pipe 110 and the liquid outlet 151 of the liquid outlet pipe 150 both protrude from the top of the casing. In some embodiments, the specific positions of the liquid inlet 111 and the liquid outlet 151 can be relatively arranged according to the positions of the external pipes.

In some embodiments, the height of the liquid inlet 111 and the height of the liquid outlet 151 may be the same. Exemplarily, both the liquid inlet 111 and the liquid outlet 151 may be disposed on the top of the layered cabinet 160 , and the heights of the liquid inlet 111 and the liquid outlet 151 are the same. For example, the liquid inlet pipe 110 and the liquid outlet pipe 150 protrude from the top of the housing and the opening end faces of the liquid inlet 111 and the liquid outlet 151 are flush with the top of the housing so that the height of the liquid inlet 111 and the liquid outlet 151 same. As shown in FIG. 2 , in some embodiments, the liquid inlet 111 and the liquid outlet 151 can both be set at the same height of the side wall of the layered cabinet body 160, so that the height of the liquid inlet 111 and the liquid outlet Ports 151 have the same height. By arranging the liquid inlet 111 and the liquid outlet 151 at the same height, it is possible to more effectively avoid the occurrence of empty water in the pipeline; moreover, the liquid inlet 111 and the liquid outlet 151 can be used interchangeably, which is easy to install and has a high fault tolerance rate.

Fig. 3 is a schematic diagram of the internal piping structure of the cooling system according to some embodiments of the present specification. The shunt pipe 120 can be used to deliver the liquid in the liquid inlet pipe 110 (liquid that has not been heat-exchanged) to the heat dissipation unit 130 placed on the layered cabinet body 160, so as to be installed in the heat dissipation unit 130 to be heat-dissipated. The device performs heat exchange. In some embodiments, the pipe wall of the distribution pipe 120 is provided with a first distribution port 123, the first distribution port 123 can communicate with the liquid inlet 133 of the cooling unit 130, and the liquid can flow in through the first distribution port 123 and the liquid inlet 133. into the cooling unit 130. In some embodiments, as shown in FIG. 3 , a plurality of first flow openings 123 may be arranged at intervals on the pipe wall of the flow distribution pipe 120 .

The collecting pipe 140 can be used to deliver the higher temperature liquid (liquid after heat exchange) discharged from the cooling unit 130 to the liquid outlet pipe 150 . In some embodiments, a first collecting port 143 is provided on the pipe wall of the collecting pipe 140, and the first collecting port 143 can communicate with the liquid outlet 135 of the cooling unit 130, and the heat-exchanged fluid discharged from the cooling unit 130 Liquid may flow into the header 140 via the liquid outlet 135 and the first header 143 .

In some embodiments, the cooling system 100 may include a first connecting pipe (not shown in the figure). The first distribution port 123 and the liquid inlet 133 of the cooling unit 130 and the first collecting port 143 and the liquid outlet 135 of the cooling unit 130 may be connected through a first connecting pipe. Exemplary first connecting pipes may include stainless steel pipes, metal pipes, corrugated pipes, rubber pipes, plastic pipes, and the like. In some embodiments, the first connecting pipe may be a hose (such as a rubber hose) to facilitate installation and disassembly.

As shown in FIG. 3 , in some embodiments, the branch pipe 120 and the collector pipe 140 may be arranged in a U shape around the heat dissipation unit 130 . One end of the shunt pipe 120 (i.e. the first shunt pipe end 121 shown in FIGS. 2 and 3 ) can communicate with the liquid inlet pipe 110, and the other end (i.e. the second shunt pipe end 122 shown in FIGS. 2 and 3 ) is blocked. . One end of the header 140 (i.e. the first header end 141 shown in FIGS. 2 and 3 ) can communicate with the outlet pipe 150, and the other end (ie the second header end shown in FIGS. 2 and 3 ) 142) Blockage.

In some embodiments, the second manifold end 122 and the second header end 142 can be blocked in various ways. In some embodiments, both the second branching pipe end 122 and the second collecting pipe end 142 can be blocked by a blocking member, and the blocking member is screwed to the second branching pipe end 122 and the second collecting pipe end 142 . In some embodiments, the occlusion member may comprise a screw. The screw can be threadedly connected with the second branching pipe end 122 and the second collecting pipe end 142 to ensure the sealing effect and effectively prevent the liquid from leaking out, and the threaded connection structure is convenient for installation and disassembly. In some alternative embodiments, the blocking member may be connected to the second branch pipe end 122 and the second collector pipe end 142 by means of bonding, welding or clamping. For example, the blocking member that blocks the second branch pipe end 122 and the second collecting pipe end 142 may be a blocking plate connected by welding. In some embodiments, an anti-leakage gasket may be provided between the blocking member and the second branch pipe end 122 and the second collecting pipe end 142 to further prevent liquid from leaking from the blocking member. The leak-proof gasket can be made of materials such as rubber, latex or resin. In some embodiments, the branch pipe 120 and/or the collector pipe 140 can be integrally formed into the above-mentioned structure with one end blocked.

In some embodiments, the cross-sectional shape of one or more pipes (for example, the liquid inlet pipe 110, the liquid outlet pipe 150, the branch pipe 120, and the header 140) in the embodiments of the present specification may include a polygon (such as a quadrangle, hexagon, octagon, etc.), circle or ellipse, etc. Exemplarily, in the embodiment shown in FIG. 3 , the cross-sectional shapes of the liquid inlet pipe 110 , the liquid outlet pipe 150 , the distribution pipe 120 and the collecting pipe 140 are all circular. Impurities are not easy to accumulate in pipelines with circular or oval cross-sections, which can effectively prevent pipelines from being blocked. In addition, pipelines with circular cross-sections are easier to manufacture.

In some cases, in order to improve the working efficiency of the heat dissipation system 100, the heat dissipation unit 130 can be placed on the support frame 167 of each layer of the layered cabinet body 160, and the heat dissipation units 130 on multiple support frames 167 can be simultaneously Heat dissipation. In order to achieve this purpose, the heat dissipation system 100 in some embodiments of the present specification can divide the liquid delivered to the liquid inlet pipe 110 to simultaneously dissipate heat to the heat dissipation units 130 on multiple support frames 167 .

As shown in FIG. 2 and FIG. 3 , in some embodiments, a plurality of second flow openings may be provided on the pipe wall of the liquid inlet pipe 110 , and the plurality of second flow openings are arranged along the length direction of the liquid inlet pipe 110 . In some embodiments, the distribution tube 120 may include multiple (for example, the embodiment shown in FIG. 3 includes 4 distribution tubes 120 ), and each distribution tube 120 communicates with a second distribution port. The position of each branch pipe 120 can correspond to the position of the heat dissipation unit 130 placed on each layer of the support frame 167 of the layered cabinet body 160, and the liquid is transported to the heat dissipation unit 130 at the corresponding position through the branch pipe 120 for heat dissipation. exchange. Here, the position of the distribution pipe 120 corresponding to the position of the cooling unit 130 may mean that the positional relationship between the distribution pipe 120 and the cooling unit 130 can facilitate the communication between the first distribution port 123 and the liquid inlet 133 .

In some cases, the heat dissipation units 130 placed on each support frame 167 need to discharge the heat-exchanged liquid, and the heat dissipation system 100 can collect these liquids through multiple headers 140 and uniformly transport them to the liquid outlet pipe 150 to facilitate the centralized discharge of these liquids. In some embodiments, multiple second collecting ports may be provided on the pipe wall of the liquid outlet pipe 150 , and the multiple second collecting ports are arranged along the length direction of the liquid outlet pipe 150 . In some embodiments, multiple headers 140 may be included (eg, the embodiment shown in FIG. 3 includes four headers 140 ), and each header 140 communicates with a second header. The position of each header 140 may correspond to the position of the heat dissipation unit 130 placed on each layer of the support frame 167 of the layered cabinet body 160, and the heat dissipation unit 130 at the corresponding position is collected through the header 140. The exchanged liquid and the liquid collected by the plurality of collecting pipes 140 will be uniformly delivered to the liquid outlet pipe 150 for centralized discharge. Here, the position of the header 140 corresponding to the position of the cooling unit 130 may mean that the positional relationship between the header 140 and the cooling unit 130 can facilitate the communication between the first header 143 and the liquid outlet 135 .

In some embodiments, the liquid inlet 133 and the first manifold 123, the liquid outlet 135 and the first manifold 143, the manifold 120 and the second manifold, and the manifold 140 and the second manifold may be threaded. , flange connection, welding, pipe bonding connection, joint head connection and other ways to communicate. Exemplarily, taking the connection between the shunt pipe 120 and the liquid inlet pipe 110 as an example, the first shunt pipe end 121 of the shunt pipe 120 is a threaded nozzle with an external thread, and the second shunt port of the liquid inlet pipe 110 is provided with a threaded hole , the communication between the shunt pipe 120 and the liquid inlet pipe 110 can be realized through the threaded connection between the threaded nozzle and the threaded hole.

Fig. 4 is a schematic structural diagram of a heat dissipation unit according to some embodiments of the present specification. In some embodiments, the heat dissipation unit 130 may include a plurality of heat dissipation plates 137 arranged side by side. A board card 139 may be installed between every two adjacent cooling plates 137 . The heat dissipation plate 137 can be used to dissipate heat on the device to be dissipated (for example, chip, chip assembly, PCB board, etc.) on the board card 139 . Wherein, arranging in parallel may mean that a plurality of cooling plates 137 are arranged at intervals along the thickness direction thereof. Each heat dissipation plate 137 in the heat dissipation unit 130 may include a liquid inlet 133 and a liquid outlet 135 . Among the plurality of cooling plates 137 arranged side by side, the liquid inlet 133 of the cooling plate 137 located at one end of the cooling unit 130 (for example, the cooling plate 137-1 on the far right in FIG. The liquid outlet 135 of the cooling plate 137 at the other end of 130 (for example, the cooling plate 137-4 on the leftmost side in FIG. interconnected. Exemplarily, in the embodiment shown in FIG. 4 , the heat dissipation unit is composed of four heat dissipation plates 137 (respectively 137-1, 137-2, 137-3, 137-4) arranged side by side, and each heat dissipation plate The end face of 137 is provided with a liquid inlet 133 and a liquid outlet 135 . The liquid inlets 133 and the liquid outlets 135 of two adjacent cooling plates 137 are intersected so that the liquid inlets 133 and the liquid outlets 135 of the adjacent two cooling plates 137 communicate. For example, the liquid inlet 133 of the cooling plate 137-1 is located on the upper side of the end surface, and the liquid outlet 135 is located on the lower side of the end surface; the liquid inlet 133 of the cooling plate 137-2 is located on the lower side of the end surface, and the liquid outlet 135 is located on the upper side of the end surface.

In this embodiment, the liquid can enter the heat dissipation unit 130 through the liquid inlet 133 of the heat dissipation plate 137-1, pass through the heat dissipation plate 137-2 and the heat dissipation plate 137-3 in turn, and pass through the heat dissipation plate 137-2 and the heat dissipation plate 137-3 to the heat sink disposed between two adjacent heat dissipation plates 137. The chips on the board 139 perform heat exchange, and finally realize the cooling of the chips. Finally, the liquid is discharged from the liquid outlet 135 of the cooling plate 137 - 4 into the header 140 . It should be noted that the above content is only an example, and is not intended to limit the number of heat dissipation plates 137 included in the heat dissipation unit 130 . In some embodiments, in addition to the solution of 4 cooling plates 137 in the above embodiments, the cooling unit 130 may further include 2, 3, 5, 6 or more cooling plates 137 . Those skilled in the art can determine the number of heat dissipation plates 137 of the heat dissipation unit 130 according to the specific structure, size, quantity, etc. of the equipment to be dissipated.

In some embodiments, the outline shape of the heat dissipation plate 137 in its thickness direction may include a rectangle, a circle, a triangle, a polygon, and the like. Exemplarily, in the embodiment shown in FIG. 4 , the outline shape of the heat dissipation plate 137 in its thickness direction can be approximately regarded as a rectangle. In some embodiments, the contour shape of the heat dissipation plate 137 in its thickness direction may preferably be the same or similar to the shape of the device to be dissipated, so that the heat dissipation plate 137 can play a better role while saving the cost of the heat dissipation plate 137. heat radiation. In some embodiments, the heat dissipation plate 137 may be made of copper or aluminum, which is easy to conduct heat. In some embodiments, the cooling system 100 may further include a second connecting pipe 131 . The liquid inlet 133 and the liquid outlet 135 of adjacent cooling plates 137 may be connected through a second connecting pipe 131 . The second connecting pipe 131 and the first connecting pipe can be made of the same or different materials. In some embodiments, the pipes provided inside the heat dissipation plate 137 may include annular pipes, parallel pipes, etc., so as to communicate with the liquid inlet 133 and the liquid outlet 135 of the heat dissipation plate 137 .

In some embodiments, for a heat dissipation unit 130, the liquid inlet 133 communicated with the branch pipe 120 and the liquid outlet 135 communicated with the header 140 can both be located above the end surface of the heat dissipation plate 137, thereby effectively avoiding An empty water phenomenon occurs in the heat dissipation plate 137 to improve the heat dissipation effect of the heat dissipation unit 130 .

Referring to FIG. 1 and FIG. 2 , in some embodiments, two rows of cooling units 130 may be arranged side by side on each support frame 167 of the layered cabinet body 160 . In some embodiments, the two rows of cooling units 130 on each support frame 167 may share the same branch pipe 120 and header pipe 140 . Exemplarily, the liquid inlets 133 of the two rows of cooling units 130 placed on each support frame 167 are in communication with different first distribution ports 123 of the same distribution pipe 120 . The liquid outlets 135 of the two rows of cooling units 130 placed on each support frame 167 may communicate with different first headers 143 of the same header 140 .

Referring to FIGS. 2 and 3 , in some embodiments, a branch pipe 120 and a collector pipe 140 corresponding to two rows of cooling units on each floor of the layered cabinet body 160 may surround the floor in a U shape. Two rows of cooling units 130 are provided on the top. In some embodiments, after the liquid enters the liquid inlet pipe 110 through the liquid inlet 111 , it can respectively enter into the distribution pipes 120 of each layer of the layered cabinet body 160 . Since the liquid inlets 133 of the two rows of cooling units 130 placed on each layer are in communication with the same splitter tube 120, the liquid in the splitter tube 120 can enter the corresponding cooling units through the liquid inlets 133 in communication with the splitter tube 120. In the unit 130 , the temperature of the chips located between the heat sinks 137 is reduced.

In this embodiment, when the heat is transferred to the liquid, the temperature of the liquid rises, and the liquid after the temperature rise can enter the respective liquids connected to the two rows of heat dissipation units 130 through the liquid outlets 135 of the two rows of heat dissipation units 130. In the header 140 connected to the outlet 135 , the temperature-increased liquid is collected in the header 140 , then enters the liquid outlet pipe 150 and is discharged out of the heat dissipation system 100 through the liquid outlet 151 or into a corresponding device.

In some cases, by arranging the distribution pipes 120 and the header pipes 140 in each layer of the layered cabinet body 160 in a U-shape to surround the two rows of heat dissipation units 130 on the corresponding floor, it is convenient for the two rows of heat dissipation units 130 All the liquid inlets 133 and the liquid outlets 135 are respectively communicated with the same manifold 120 and the same header 140, which optimizes the pipeline design in the cooling system 100 and reduces the space occupied by the manifold 120 and the header 140. The space utilization rate of the layered cabinet body 160 is improved.

In some embodiments, the heat dissipation manner of the heat dissipation system 100 may include liquid cooling and/or air cooling. As shown in FIG. 2 , in some embodiments, the heat dissipation system 100 may include a heat dissipation air duct 163 disposed between two rows of heat dissipation units 130 , and the heat dissipation air duct 163 may be used to realize air cooling and heat dissipation of the heat dissipation system 100 . In some embodiments, the cooling air duct 163 extends vertically between the top and the bottom of the layered cabinet 160 . The vertical direction can be understood as the height direction of the layered cabinet 160 (ie, the second direction in FIG. 1 ). In some embodiments, the cooling air channel 163 can be formed by the gap between the two rows of cooling units 130 on each layer of the layered cabinet body 160, that is, the space between the two rows of cooling units 130 on each layer can be formed through communication. Heat dissipation air duct 163. The bottom of the layered cabinet 160 may be the side of the layered cabinet 160 close to the installation ground, and the top of the layered cabinet 160 is the side of the layered cabinet 160 away from the installation ground.

In some cases, by setting the heat dissipation air duct 163 between the two rows of heat dissipation units 130 on each floor of the layered cabinet body 160, the hot air in the layered type cabinet body 160 will flow from both sides (that is, the heat dissipation unit 130 is provided Both sides) are collected into the cooling air channel 163 and discharged from the top of the layered cabinet 160.

1 and 2, in some embodiments, in order to realize the air-cooled heat dissipation of the heat dissipation system 100, the layered cabinet 160 corresponds to the first side walls of the two rows of heat dissipation units 130 on each support frame 167 161 and the second side wall 162 may be respectively provided with a first air inlet 164 and a second air inlet 165 . On the top of the layered cabinet body 160 , an air outlet 166 may be provided at a position corresponding to the cooling air duct 163 . In this embodiment, by setting the air inlets (namely the first air inlet 164 and the second air inlet 165) on the first side wall 161 and the second side wall 162 respectively, and setting the row The tuyere 166 can make the air entering the layered cabinet body 160 form a natural air duct. When the outside air enters the layered cabinet body 160, it can collect from the first side wall 161 and the second side wall 162 to the heat dissipation air duct 163 respectively, and the air around the heat dissipation unit 130 and the collector pipe 140 can be taken away during the collection process. hot air, thereby reducing the temperature inside the tiered cabinet 160. In some embodiments, the first air inlet 164 and the second air inlet 165 may be one or more through holes provided on the first side wall 161 and the second side wall 162 . The air outlet 166 may be a through hole provided on the top of the shell of the layered cabinet 160 .

In some cases, the temperature of the liquid entering the heat dissipation unit 130 after heat exchange is usually relatively high. The liquid in tube 150 also dissipates heat. The heat will be transferred to the outside of the pipe to increase the temperature inside the layered cabinet 160 . The external air entering from the first air inlet 164 can pass through the header 140 and the heat dissipation unit 130 corresponding to the first side wall 161 , and bring the hot air there into the heat dissipation air duct 163 . The external air entering from the second air inlet 165 can pass through the collector 140 and the heat dissipation unit 130 corresponding to the second side wall 162 , and bring the hot air there into the heat dissipation air duct 163 . As a result, the temperature of the gas in the heat dissipation air duct 163 rises, and the hot air in the heat dissipation air duct 163 can be discharged through the air outlet 166 on the top of the layered cabinet 160 , thereby realizing the air cooling and heat dissipation of the heat dissipation system 100 . In some embodiments, the hot air in the cooling air channel 163 can be automatically discharged from the air outlet 166 at the top due to its own density characteristics.

In some embodiments, in order to increase the efficiency of the heat dissipation system 100 in air cooling and heat dissipation, the air outlet 166 may be provided with an exhaust device (not shown in the figure). In some embodiments, the air exhaust device may include one or more exhaust fans, which are driven by motors and can better exhaust the hot air in the cooling air duct 163 out of the layered cabinet 160 .

In some embodiments, an air intake device (not shown in the figure) may be provided at the first air inlet 164 and/or the second air inlet 165 to improve the air intake efficiency of the cooling system 100 . In some embodiments, the air intake device may include one or more intake fans, which are driven by motors and can better draw external air into the layered cabinet 160 .

The heat dissipation system 100 in the embodiment of this specification can realize heat dissipation through two heat dissipation methods of liquid cooling and air cooling at the same time, which can greatly reduce the temperature of chips in each heat dissipation unit 130 in the layered cabinet 160 , so that the heat dissipation system 100 has better heat dissipation performance. In addition, the layered cabinet 160 in the heat dissipation system 100 may include a plurality of support frames 167 arranged in layers, and two rows of heat dissipation units 130 may be placed on each layer of support frames 167, and each row of heat dissipation units 130 may include Multiple devices (eg, chips) to be cooled. By arranging two rows of cooling units 130, the amount of chips placed per unit volume of the layered cabinet 160 can be effectively increased, thereby improving the space utilization rate of the layered cabinet 160. In some embodiments, the cooling system 100 may only include liquid cooling or air cooling.

In some embodiments, the heat dissipation system 100 in the embodiment of this specification can also adjust the heat dissipation efficiency of air cooling and/or liquid cooling according to the temperature in the heat dissipation system 100 (that is, the layered cabinet 160), so as to adjust The temperature inside the cooling system 100. In some embodiments, the heat dissipation system 100 may further include a temperature adjustment device (not shown in the figure), and the temperature adjustment device may monitor and adjust the temperature in the heat dissipation system 100 .

In some embodiments, a temperature regulating device may include a temperature sensor and a controller. Wherein, the temperature sensor can be used to detect the temperature of the cooling system 100 and generate a temperature detection signal, and the controller can be used to adjust the discharge efficiency of the exhaust device and/or the air intake device according to the temperature detection signal. In some embodiments, the exhaust efficiency and/or Air intake efficiency. The higher the rotation speed of the exhaust fan and/or the intake fan, the higher the exhaust efficiency of the exhaust device and/or the higher the air intake efficiency of the air intake device, and the faster the temperature of the cooling system is reduced. In some embodiments, the controller may include a single chip microcomputer, a programmable logic controller (Programmable Logic Controller, PLC) and other control systems.

In some embodiments, the temperature sensor may be disposed in the heat dissipation air duct 163 , for example, the temperature sensor may be disposed at the top of the heat dissipation air duct 163 for detecting the temperature at the top of the heat dissipation air duct 163 . In some embodiments, the temperature sensor can be arranged at any position of the tiered cabinet 160 to detect the temperature at the position. In some cases, when the heat dissipation system 100 is provided with the heat dissipation air passage 163 in one or more of the foregoing embodiments, since the air in the layered cabinet body 160 will gather into the heat dissipation air passage 163 and pass through the heat dissipation air passage The top of 163 discharges the layered cabinet body 160, so the temperature at the top of the cooling air duct 163 is relatively high. In some embodiments, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 exceeds a temperature threshold (for example, 65 degrees, 70 degrees, 80 degrees, etc.), a temperature detection signal that the temperature is too high may be generated, and the controller may be based on the corresponding The temperature detection signal increases the speed of one or more exhaust fans in the exhaust device, so as to increase the exhaust efficiency of the exhaust device and improve the heat dissipation efficiency.

In some embodiments, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 is within the temperature threshold, a normal temperature detection signal may be generated, and the controller may, without affecting the cooling effect of the cooling system 100, based on A temperature detection signal that the temperature is normal reduces the speed of one or more exhaust fans in the exhaust device. This can not only ensure that the speed of the exhaust device can meet the heat dissipation requirements of the heat dissipation system 100, but also reduce the power consumption of the exhaust device (eg, exhaust fan), and reduce the noise generated when the exhaust fan is running. In some embodiments, when the temperature is normal, the controller may not adjust the exhaust device.

In some embodiments, the controller can be used to adjust the air intake efficiency of the air intake device according to the temperature detection signal. In some embodiments, the controller can be used to simultaneously adjust the air intake efficiency of the air intake device and the exhaust efficiency of the air exhaust device according to the temperature detection signal. The process of the controller adjusting the air intake efficiency of the air intake device according to the temperature detection signal is the same or similar to adjusting the exhaust air efficiency of the air exhaust device according to the temperature detection signal, and will not be repeated here.

In some embodiments, a first flow valve (not shown) may be provided at the liquid inlet 111 and/or the liquid outlet 151, and the controller may control the first flow valve (for example, by means of PLC control) In this way, the flow rate of the liquid delivered into the heat dissipation system 100 and/or the liquid discharged from the heat dissipation system 100 through the first flow valve is adjusted, so as to realize temperature regulation of the heat dissipation system 100 . Exemplarily, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 exceeds the temperature threshold, it can generate a temperature detection signal that is too high, and the controller can control the first flow valve based on the temperature detection signal that the temperature is too high to increase the temperature. The liquid flow through the first flow valve improves the heat dissipation effect of the heat dissipation system 100 . In some embodiments, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 is within the temperature threshold, a normal temperature detection signal can be generated, and the controller can adjust the first flow valve based on the normal temperature temperature detection signal to The flow of the liquid passing through the first flow valve is reduced to reduce the power consumption caused by heat dissipation (for example, the power consumption of the water pump connected to the liquid outlet and/or the liquid inlet of the heat dissipation system 100 ). In some embodiments, when the temperature is normal, the controller may not adjust the first flow valve.

In some embodiments, a temperature sensor may be provided on each floor of the layered cabinet 160 . Exemplarily, a temperature sensor is provided on each supporting frame 167 . The connecting end of the branch pipe 120 of each layer and the liquid inlet pipe 140 (for example, the first branch pipe end 121 shown in FIGS. 2 and 3 ) and/or the connection between the header pipe 140 of each layer and the liquid outlet pipe 150 end (for example, the first header end 141 shown in FIGS. 2 and 3 ) is provided with a second flow valve (not shown). The controller can be used to adjust the liquid flow through each second flow valve according to the temperature detection signal generated by the temperature sensor of each layer.

As an example only, when the temperature sensor of a certain layer detects that the temperature of the layer exceeds the temperature threshold or is within the temperature threshold, the controller can adjust the layer shunt pipe 120 and/or The second flow valve on the header 140, thereby regulating the flow of liquid through the second flow valve (for example, the flow of liquid entering the layer manifold 120 and/or the liquid flow discharged from the layer header 140 ) increases or decreases, correspondingly lowering the temperature of the layer space or reducing the power consumption of the cooling system 100 .

In some embodiments, the controller can also simultaneously adjust the multiple second flow valves according to the temperature detection signals of the temperature sensors on each layer of the layered cabinet, thereby adjusting the flow through the multiple second flow valves. The liquid flow can realize the purpose of regulating the temperature in the multi-layer space of the layered cabinet body 160, and finally ensure that the temperature distribution in the multi-layer space of the layered cabinet body 160 is uniform. In some embodiments, the number of heat dissipation units 130 arranged on each floor of the layered cabinet body 160 and the number and/or type of boards 139 in each heat dissipation unit 130 may be different, resulting in Calories may vary. By installing temperature sensors on each layer and adjusting the liquid flow of each layer accordingly, fine control of the heat dissipation system 100 can be achieved, which can not only ensure the heat dissipation effect required by each layer, but also save the use cost of the heat dissipation system 100 .

The possible beneficial effects of the heat dissipation system disclosed in the embodiments of the present application include but are not limited to: (1) by setting the height of the liquid inlet and the height of the liquid outlet to be higher than the distribution pipe, the header and the heat dissipation unit The liquid level of the liquid inside can effectively avoid the situation of empty water in the pipeline of the cooling system; and there is no need to add an additional exhaust device to discharge the air in the pipeline of the cooling system, which can simplify the structure of the cooling system and reduce the The manufacturing cost of the heat dissipation system; (2) by setting two rows of heat dissipation units on each support frame at the same time, the space utilization rate of the layered cabinet can be improved; (3) by setting the heat dissipation air duct between the two rows of heat dissipation units And the first air inlet and the second air inlet are set on the first side wall and the second side wall of the layered cabinet body, and a natural air duct can be formed inside the layered cabinet body; air can pass through the first air inlet and the second air inlet. The second air inlet enters the interior of the layered cabinet and collects into the cooling air duct. During the collection process, the hot air around the heat dissipation unit and the collector can be taken away, thereby reducing the temperature in the layered cabinet. It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

Some embodiments of this specification also provide a heating system. The heating system may include the heat dissipation system 100 in any of the above technical solutions and a heating pipeline, and the heating pipeline communicates with the liquid inlet 111 of the heat dissipation system 100 . The heat exchanged liquid discharged from the liquid inlet 111 of the cooling system 100 is received by the heating pipeline. The heating system can directly use the liquid for heating, and release the heat in the liquid through another heat exchange for heating in other places. In addition, since the cooling system 100 does not have high requirements on the water quality of the liquid, no water purification equipment needs to be installed in the heating system, which reduces the cost of the heating system.

Fig. 5 is a schematic structural diagram of a heating system according to some embodiments of the present application. In some embodiments, the heating system 1000 may include a cooling system 100 and a heating pipeline 200 , and the heating pipeline 200 communicates with the liquid inlet 111 of the cooling system 100 . The heating system 1000 can be understood as a heating facility (such as radiators, floor heating, etc.) set up to keep the space where people live or carry out production in a suitable thermal state. The flow direction of the liquid in the heating pipeline 200 is shown by the arrows in FIG. 5 . The liquid with higher temperature can be passed into the heating pipeline 200 of the heating system 1000 , and the liquid can release heat in the heating pipeline 200 to increase the temperature of the heating system 1000 in the area to be heated. When the heating system 1000 is used in conjunction with the heat dissipation system 200, the heat-exchanged liquid flowing out of the liquid inlet 111 in the heat dissipation system 100 can be used in the heating system 1000 for heating, so as to realize the recycling of the liquid and realize the heat dissipation Recycling of heat energy emitted by equipment. In some embodiments, the liquid that flows into the heating system 1000 for another heat exchange (for example, releasing heat in the heating pipeline 200 ) can directly flow into the heat dissipation system 100 to dissipate heat from the equipment to be radiated. Exemplarily, when the liquid undergoes heat exchange and heat release in the heating pipeline 200 , the temperature of the liquid will decrease, so it can be used as the cooling liquid of the heat dissipation system 100 again. Connecting the liquid inlet 111 of the heat dissipation system 100 to the outlet of the heating pipeline 200, the liquid can be input to the heat dissipation unit 130 of the heat dissipation system 100 to exchange heat with the chips, thereby realizing the recycling of the liquid.

It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

The basic concept has been described above, obviously, for those skilled in the art, the above detailed disclosure is only an example, and does not constitute a limitation to the present application. Although not expressly stated here, various modifications, improvements and amendments to this application may be made by those skilled in the art. Such modifications, improvements, and amendments are suggested in this application, so such modifications, improvements, and amendments still belong to the spirit and scope of the exemplary embodiments of this application.

Meanwhile, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and/or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that two or more references to "an embodiment" or "an embodiment" or "an alternative embodiment" in different places in this specification do not necessarily refer to the same embodiment . In addition, certain features, structures or characteristics of one or more embodiments of the present application may be properly combined.

In addition, unless explicitly stated in the claims, the order of processing elements and sequences described in the application, the use of numbers and letters, or the use of other designations are not used to limit the order of the flow and methods of the application. While the foregoing disclosure has discussed by way of various examples some embodiments of the invention that are presently believed to be useful, it should be understood that such detail is for illustrative purposes only and that the appended claims are not limited to the disclosed embodiments, but rather, the claims The claims are intended to cover all modifications and equivalent combinations that fall within the spirit and scope of the embodiments of the application. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by a software-only solution, such as installing the described system on an existing server or mobile device.

In the same way, it should be noted that in order to simplify the expression disclosed in the present application and help the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of the present application, sometimes multiple features are combined into one embodiment, drawings or descriptions thereof. This method of disclosure does not, however, imply that the subject matter of the application requires more features than are recited in the claims. Indeed, embodiment features are less than all features of a single foregoing disclosed embodiment.

Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other modifications are also possible within the scope of this application. Therefore, as an example rather than a limitation, alternative configurations of the embodiments of the present application may be considered consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

A heat dissipation system, the heat dissipation system comprising: a liquid inlet pipe, a shunt pipe, a heat dissipation unit, a collecting pipe and a liquid outlet pipe;

The liquid inlet pipe includes a liquid inlet, and the liquid inlet pipe communicates with the shunt pipe;

The cooling unit includes a liquid inlet and a liquid outlet, the shunt pipe communicates with the liquid inlet, and the liquid outlet communicates with the header;

The collecting pipe is in communication with the liquid outlet pipe, and the liquid outlet pipe includes a liquid outlet;

The heights of the liquid inlet and the liquid outlet are higher than the liquid levels of the liquid in the distribution pipe, the heat dissipation unit and the collecting pipe.
The heat dissipation system according to claim 1, further comprising a layered cabinet, and each layer of the layered cabinet is used for setting one or more of the heat dissipation units.
According to the cooling system according to claim 2, the liquid inlet and the liquid outlet are arranged at the same height of the side wall of the layered cabinet.
According to the heat dissipation system according to claim 2, two rows of heat dissipation units are arranged side by side on each floor of the layered cabinet, and the heat dissipation system further includes a heat dissipation system arranged between the two rows of heat dissipation units. The heat dissipation air duct extends vertically between the top and the bottom of the layered cabinet.
According to the cooling system according to claim 4, one end of the shunt pipe communicates with the liquid inlet pipe, the other end of the shunt pipe is blocked, and the shunt pipe is U-shaped and arranged around two rows of the heat dissipation units;

One end of the collecting pipe communicates with the liquid outlet pipe, and the other end of the collecting pipe is blocked, and the collecting pipe is U-shaped and arranged around two rows of heat dissipation units.
According to the heat dissipation system according to claim 4, the layered cabinet is respectively provided with a first air inlet and a second air inlet corresponding to the first side wall and the second side wall of the two rows of the heat dissipation units, the An air outlet is provided on the top of the layered cabinet corresponding to the position of the heat dissipation air duct.
According to the heat dissipation system of claim 6, an exhaust device is provided at the air outlet.
The heat dissipation system according to claim 7, further comprising a temperature adjustment device, the temperature adjustment device comprising a temperature sensor and a controller;

The temperature sensor is used to detect the temperature of the cooling system and generate a temperature detection signal;

The controller is used for adjusting the exhaust efficiency of the exhaust device according to the temperature detection signal.
According to the heat dissipation system according to claim 8, the temperature sensor is arranged at the top of the heat dissipation air duct for detecting the temperature at the top of the heat dissipation air duct.
According to the heat dissipation system according to claim 8, an air inlet device is provided at the first air inlet and/or the second air inlet;

The controller is also used for adjusting the air intake efficiency of the air intake device according to the temperature detection signal.
According to the heat dissipation system according to claim 8, a first flow valve is provided on the liquid inlet and/or the liquid outlet;

The controller is also used for adjusting the liquid flow through the first flow valve according to the temperature detection signal.
According to the heat dissipation system according to claim 8, each layer of the layered cabinet is provided with the temperature sensor, and each layer is provided with one of the shunt pipes and one of the collector pipes;

A second flow valve is provided at the connecting end of the branch pipe and the liquid inlet pipe of each layer, and/or at the connecting end of the collecting pipe and the liquid outlet pipe of each layer;

The controller is also used for adjusting the liquid flow through the second flow valve of each layer according to the temperature detection signal of the temperature sensor of each layer.
According to the heat dissipation system according to any one of claims 1-12, the heat dissipation unit comprises a plurality of heat dissipation plates arranged side by side, and board cards are installed between every two adjacent heat dissipation plates, and the heat dissipation plates use for dissipating heat from the chip on the board;

In the heat dissipation unit, each heat dissipation plate includes the liquid inlet and the liquid outlet, the liquid inlet of the heat dissipation plate at one end communicates with the distribution pipe, and the heat dissipation plate at the other end The liquid outlet communicates with the header, and the liquid inlet and the liquid outlet between adjacent heat dissipation plates communicate with each other.
A heating system, comprising the heat dissipation system according to any one of claims 1-13 and a heating pipeline, wherein the heating pipeline communicates with the liquid outlet of the heat dissipation system.
A heat dissipation system, the heat dissipation system comprising:

A layered cabinet, each layer of the layered cabinet is provided with two rows of cooling units in parallel;

A heat dissipation air duct arranged between the two rows of heat dissipation units, the heat dissipation air duct extends vertically between the top and the bottom of the layered cabinet;

The layered cabinet is respectively provided with a first air inlet and a second air inlet corresponding to the first side wall and the second side wall of the two rows of cooling units, and the top of the layered cabinet corresponds to the The position of the heat dissipation air duct is provided with an air outlet.
According to the heat dissipation system of claim 15, an exhaust device is provided at the air outlet.
The heat dissipation system according to claim 16, further comprising a temperature adjustment device, the temperature adjustment device comprising a temperature sensor and a controller;

The temperature sensor is used to detect the temperature of the cooling system and generate a temperature detection signal;

The controller is used for adjusting the exhaust efficiency of the exhaust device according to the temperature detection signal.
According to the heat dissipation system of claim 17, the temperature sensor is arranged at the top of the heat dissipation air duct for detecting the temperature at the top of the heat dissipation air duct.
According to the heat dissipation system according to claim 17, an air inlet device is provided at the first air inlet and/or the second air inlet;

The controller is also used for adjusting the air intake efficiency of the air intake device according to the temperature detection signal.
The heat dissipation system according to claim 15, wherein the heat dissipation unit comprises a liquid inlet and a liquid outlet, and the heat dissipation system further comprises: a liquid inlet pipe, a branch pipe, a collecting pipe, and a liquid outlet pipe;

The liquid inlet pipe includes a liquid inlet, and the liquid inlet pipe communicates with the shunt pipe;

The distribution pipe is in communication with the liquid inlet, and the liquid outlet is in communication with the header;

The collecting pipe communicates with the liquid outlet pipe, and the liquid outlet pipe includes a liquid outlet.
According to the heat dissipation system of claim 20, one end of the shunt pipe communicates with the liquid inlet pipe, the other end of the shunt pipe is blocked, and the shunt pipe is U-shaped and arranged around the two rows of cooling units;

One end of the collecting pipe communicates with the outlet pipe, the other end of the collecting pipe is blocked, and the collecting pipe is U-shaped and arranged around the two rows of cooling units.
The heat dissipation system according to claim 20, further comprising a temperature regulating device, the temperature regulating device comprising a temperature sensor and a controller; the liquid inlet and/or the liquid outlet are provided with a first flow rate valve;

The temperature sensor is used to detect the temperature of the cooling system and generate a temperature detection signal;

The controller is used for adjusting the liquid flow through the first flow valve according to the temperature detection signal.
According to the heat dissipation system of claim 22, each layer of the layered cabinet is provided with the temperature sensor, and each layer is provided with one of the shunt pipes and one of the collector pipes;

A second flow valve is provided at the connecting end of the branch pipe and the liquid inlet pipe of each layer, and/or at the connecting end of the collecting pipe and the liquid outlet pipe of each layer;

The controller is also used for adjusting the liquid flow through the second flow valve of each layer according to the temperature detection signal of the temperature sensor of each layer.
According to the heat dissipation system according to any one of claims 20-23, the heat dissipation unit comprises a plurality of heat dissipation plates arranged side by side, and board cards are installed between every two adjacent heat dissipation plates, and the heat dissipation plates use for dissipating heat from the chip on the board;

In the heat dissipation unit, each of the heat dissipation plates includes a liquid inlet and a liquid outlet, the liquid inlet of the heat dissipation plate at one end communicates with the distribution pipe, and the liquid of the heat dissipation plate at the other end The outlet communicates with the header, and the liquid inlet and the liquid outlet between adjacent heat dissipation plates communicate with each other.