CN216346514U

CN216346514U - Heat dissipation and heating system

Info

Publication number: CN216346514U
Application number: CN202121869423.9U
Authority: CN
Inventors: 李日升; 刘云锋; 汪烈东
Original assignee: Hangzhou Darehan Technology Co ltd
Current assignee: Hangzhou Darehan Technology Co ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2022-04-19
Anticipated expiration: 2031-08-11

Abstract

The embodiment of the specification discloses a heat dissipation system and a heating system. This cooling system includes: the heat dissipation device comprises a liquid inlet pipe, a flow dividing pipe, a heat dissipation unit, a flow collecting pipe and a liquid outlet pipe; the liquid inlet pipe comprises a liquid inlet and is communicated with the flow dividing pipe; the heat dissipation unit comprises a liquid inlet and a liquid outlet, the flow dividing pipe is communicated with the liquid inlet, and the liquid outlet is communicated with the flow collecting pipe; the collecting pipe is communicated with the liquid outlet pipe, and the liquid outlet pipe comprises a liquid outlet; the height of the liquid inlet and the height of the liquid outlet are higher than the liquid level of the liquid in the flow dividing pipe, the heat dissipation unit and the flow collecting pipe. Some embodiments of this specification can effectively avoid the empty water condition in the pipe of cooling system by setting up inlet and liquid outlet in cooling system's highest place to need not to increase extra exhaust apparatus and come the air in the pipe of cooling system of discharge.

Description

Heat dissipation and heating system

Technical Field

The present specification relates to the field of heat dissipation and heating technologies, and in particular, to a heat dissipation and heating system.

Background

The heat dissipation system is a system for dissipating heat of devices (such as chips, CPUs, GPUs, ASICs, etc.) with large heat generation capacity, so as to prevent the devices from having an excessively high temperature during use and ensure the normal operation of the devices. The heat dissipation system usually uses air cooling or liquid cooling. For example, the heat dissipation system may use a specific liquid (e.g., water) as a coolant, which may flow in a pipe of the heat dissipation system and exchange heat with the device to be dissipated, lowering the temperature of the device to be dissipated.

SUMMERY OF THE UTILITY MODEL

One of the embodiments of the present specification provides a heat dissipation system, including: the heat dissipation device comprises a liquid inlet pipe, a flow dividing pipe, a heat dissipation unit, a flow collecting pipe and a liquid outlet pipe; the liquid inlet pipe comprises a liquid inlet, and the liquid inlet pipe is communicated with the flow dividing pipe; the heat dissipation unit comprises a liquid inlet and a liquid outlet, the flow dividing pipe is communicated with the liquid inlet, and the liquid outlet is communicated with the collecting pipe; the collecting pipe is communicated with the liquid outlet pipe, and the liquid outlet pipe comprises a liquid outlet; the height of the liquid inlet and the height of the liquid outlet are higher than the liquid level of the liquid in the flow dividing pipe, the heat dissipation unit and the flow collecting pipe.

One of the embodiments of the present disclosure provides a heating system, which includes the heat dissipation system in the foregoing embodiments and a heating pipeline, where the heating pipeline is communicated with the liquid outlet of the heat dissipation system.

Drawings

The present application will be further explained by way of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not intended to be limiting, and in these embodiments like numerals are used to indicate like structures, wherein:

FIG. 1 is a schematic diagram of a heat dissipation system according to some embodiments herein;

FIG. 2 is a schematic diagram of an internal structure of a heat dissipation system according to some embodiments of the present disclosure;

FIG. 3 is a schematic diagram of an internal piping structure of a heat dissipation system in accordance with some embodiments of the present disclosure;

FIG. 4 is a schematic structural view of a heat dissipation unit according to some embodiments herein;

FIG. 5 is a schematic diagram of a heating system according to some embodiments herein.

Description of the drawings: a heat dissipation system 100; a liquid inlet pipe 110; a liquid inlet 111; a shunt tube 120; a first shunt tube end 121; a second shunt tube end 122; a first diversion port 123; a heat dissipating unit 130; a second connection pipe 131; a liquid inlet 133; a liquid outlet 135; a heat dissipation plate 137(137-1, 137-2, 137-3, 137-4); a board card 139; a header 140; the first collector pipe end 141; a second collector end 142; a first manifold port 143; a drain pipe 150; a liquid outlet 151; a tiered cabinet 160; a first side wall 161; a second side wall 162; a heat dissipation air duct 163; a first air intake 164; a second air intake 165; an air outlet 166; a support frame 167; a heating line 200; a heating system 1000.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only examples or embodiments of the application, from which the application can also be applied to other similar scenarios without inventive effort for a person skilled in the art. Unless otherwise apparent from the context, or otherwise indicated, like reference numbers in the figures refer to the same structure or operation.

It should be understood that "system", "apparatus", "unit" and/or "module" as used herein is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, other words may be substituted by other expressions if they accomplish the same purpose.

As used in this application and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

Some embodiments of the present description provide a heat dissipation system having a liquid inlet tube including a liquid inlet and a liquid outlet tube including a liquid outlet. The liquid inlet and the liquid outlet are both arranged at the high point of the heat dissipation system, that is, the heights of the liquid inlet and the liquid outlet are both higher than the liquid level of the liquid in other pipelines (such as a flow dividing pipe and a flow collecting pipe) of the heat dissipation system. The liquid inlet and the liquid outlet are arranged at the high point of the heat dissipation system, so that the pipeline of the heat dissipation system is filled with liquid in the use process; the flow rate of liquid input into the liquid inlet (i.e., liquid inlet amount) is the same as the flow rate of liquid discharged from the liquid outlet (i.e., liquid discharge amount). Compared with a high-inlet-low-outlet setting mode (namely, the liquid inlet is arranged at a high point of the heat dissipation system, the liquid outlet is arranged at a low point of the heat dissipation system, and the height of the liquid outlet is lower than the liquid level of liquid in other pipelines of the heat dissipation system), the heat dissipation system provided by the specification can effectively avoid the situation that the pipelines of the heat dissipation system are empty when the liquid inlet amount is unstable (if the liquid inlet amount is small). By empty water is meant that no liquid is present at some point in the tubing of the heat dissipation system.

In addition, the liquid inlet and the liquid outlet are arranged at the high point of the heat dissipation system, if gas occurs in the heat dissipation system, the gas can be discharged from the liquid inlet and/or the liquid outlet more easily, and compared with the arrangement mode of low inlet and high outlet (namely, the liquid inlet is arranged at the low point of the heat dissipation system, and the liquid outlet is arranged at the high point of the heat dissipation system), an additional exhaust device is not required to be added in a pipeline of the heat dissipation system to discharge the air in the pipeline, so that the structure of the heat dissipation system is simplified, and the manufacturing cost of the heat dissipation system is reduced.

FIG. 1 is a schematic diagram of a heat dissipation system according to some embodiments herein; fig. 2 is a schematic diagram of an internal structure of a heat dissipation system according to some embodiments of the present disclosure. As shown in fig. 1 and 2, in some embodiments, the heat dissipation system 100 may include a liquid inlet pipe 110, a flow dividing pipe 120, a heat dissipation unit 130, a header 140, a liquid outlet pipe 150, and a tiered cabinet 160.

The liquid inlet pipe 110 is a pipe through which liquid enters the heat dissipation system 100. The inlet pipe 110 may include an inlet 111 for inputting liquid. The liquid inlet pipe 110 is communicated with the shunt pipe 120, and the liquid in the liquid inlet pipe 110 can flow into the shunt pipe 120. Outlet pipe 150 is a conduit for liquid to exit heat dissipation system 100. Effluent channel 150 may include an effluent port 151 for effluent of liquid. The outlet pipe 150 is communicated with the header 140, and the liquid in the header 140 can flow into the outlet pipe 150. The layered cabinet 160 may include a plurality of supporting frames 167 disposed in layers, and each supporting frame 167 may be used for placing the heat dissipation unit 130. The heat radiating unit 130 may include a liquid inlet 133 and a liquid outlet 135. The liquid inlet 133 may communicate with the shunt tube 120, and the liquid in the shunt tube 120 may enter the inside of the heat dissipation unit 130 through the liquid inlet 133 to exchange heat with the device to be dissipated (e.g., a chip), thereby reducing the temperature of the device to be dissipated. The liquid outlet 135 may be in communication with the manifold 140, and the heat exchanged liquid may flow into the manifold 140 through the liquid outlet 135. The liquid inlet 111 and the liquid outlet 151 are higher than the liquid level of the liquid in the shunt tube 120, the collecting tube 140 and the heat dissipation unit 130. The height may be a vertical height or a vertical distance from the bottom of the tiered cabinet 160. For example, the height of the liquid inlet 111 and the liquid outlet 151 may refer to the vertical distance between the liquid inlet 111 and the liquid outlet 151 and the bottom of the tiered cabinet 160.

In the present embodiment, the liquid for exchanging heat with the device to be cooled may enter the liquid inlet pipe 110 through the liquid inlet 111, and then enter the inside of the heat dissipating unit 130 through the shunt pipe 120, and exchange heat with the device to be cooled installed in the heat dissipating unit 30. Finally, the heat-exchanged liquid may be discharged from the liquid outlet 151 via the header 140 and the liquid outlet 150 in sequence. In some cases, the heights of the liquid inlet 111 and the liquid outlet 151 are higher than the liquid levels of the liquid in the shunt tube 120, the collecting tube 140 and the heat dissipation unit 130, so that the situation of empty water in the pipes of the heat dissipation system 100 can be effectively avoided. And no additional exhaust device is needed to exhaust air in the pipe of the heat dissipation system 100, so that the structure of the heat dissipation system 100 is simplified, and the manufacturing cost of the heat dissipation system 100 is reduced.

Reference to a liquid in one or more embodiments of the present description is to be understood as a coolant for absorbing heat from a device to be cooled, the liquid being one or more of water, antifreeze, and the like. The device to be cooled according to the embodiments of the present disclosure may include, but is not limited to, one or more combinations of a chip, a printed circuit board, and the like. In some embodiments, a chip set, a Printed Circuit Board (PCB), or the like may be disposed on the Board, and the Board (e.g., the Board 139) is mounted in the heat dissipation unit 130, so as to dissipate heat through the heat dissipation system 100.

As shown in fig. 1 and 2, in some embodiments, the tiered cabinet 160 may include a housing that may form a receiving space for receiving components of the heat dissipation system 100 (e.g., the heat dissipation unit 130, the shunt tube 120, the header 140, etc.). In some embodiments, the liquid inlet 111 and the liquid outlet 151 may be disposed on a side wall of the layered cabinet 160 (i.e., a side wall of the housing) so that the liquid inlet 111 and the liquid outlet 151 are connected to an external pipe (e.g., the heating pipeline 200).

In some embodiments, the liquid inlet 111 and the liquid outlet 151 may be disposed on the same sidewall of the tiered cabinet 160. For example, in the embodiment shown in fig. 1 and 2, the liquid inlet pipe 110 and the liquid outlet pipe 150 are both disposed on the same side of the tiered cabinet 160 (near one of the side walls of the housing of the tiered cabinet 160). One end of the liquid inlet pipe 110 near the liquid inlet 111 is curved in an arc so that the liquid inlet 111 protrudes from the side wall. The end of the outlet tube 150 near the outlet port 151 is curved in an arc to extend the outlet port 151 out of the sidewall. By providing inlet port 111 and outlet port 151 in the same sidewall, heat dissipation system 100 may be easily installed and maintained.

In some alternative embodiments, the liquid inlet 111 and the liquid outlet 151 may be disposed on different sidewalls of the tiered cabinet 160. For example, the liquid inlet pipe 110 may be disposed near one of the side walls of the housing of the tiered cabinet 160, and an end of the liquid inlet pipe 110 near the liquid inlet 111 is curved in an arc so that the liquid inlet 111 protrudes from the side wall. Liquid outlet tube 150 may be disposed near another side wall opposite to the side wall, and one end of liquid outlet tube 150 near liquid outlet 151 is curved in an arc to extend liquid outlet 151 out of the another side wall. With this arrangement, the liquid outlet 151 and the liquid inlet 111 are respectively disposed on two opposite side walls of the housing.

In some embodiments, the liquid inlet 111 and the liquid outlet 151 may be disposed at the top of the housing of the tiered cabinet 160. For example, inlet 111 of inlet tube 110 and outlet 151 of outlet tube 150 each extend from the top of the housing. In some embodiments, the specific positions of the inlet 111 and the outlet 151 may be configured relatively according to the position of the external pipe.

In some embodiments, the height of the inlet port 111 and the height of the outlet port 151 may be the same. For example, the liquid inlet 111 and the liquid outlet 151 may be disposed at the top of the layered cabinet 160, and the heights of the liquid inlet 111 and the liquid outlet 151 are the same. For example, the liquid inlet pipe 110 and the liquid outlet pipe 150 protrude from the top of the housing and the open end surfaces of the liquid inlet 111 and the liquid outlet 151 are flush with the top of the housing so that the heights of the liquid inlet 111 and the liquid outlet 151 are the same. As shown in fig. 2, in some embodiments, the liquid inlet 111 and the liquid outlet 151 may be disposed at the same height of the side wall of the tiered cabinet 160, such that the height of the liquid inlet 111 and the height of the liquid outlet 151 are the same. The liquid inlet 111 and the liquid outlet 151 are arranged at the same height, so that the empty water condition of the pipeline can be effectively avoided; moreover, the liquid inlet 111 and the liquid outlet 151 can be used interchangeably, the installation is simple and convenient, and the fault tolerance rate is high.

Fig. 3 is a schematic diagram of an internal piping structure of a heat dissipation system according to some embodiments of the present disclosure. The bypass pipe 120 may be used to deliver the liquid (liquid without heat exchange) in the liquid inlet pipe 110 to the heat dissipation unit 130 placed in the tiered cabinet 160 to exchange heat with the equipment to be dissipated installed in the heat dissipation unit 130. In some embodiments, the tube wall of the shunt tube 120 is provided with a first shunt opening 123, the first shunt opening 123 can communicate with the liquid inlet 133 of the heat dissipation unit 130, and the liquid can flow into the heat dissipation unit 130 through the first shunt opening 123 and the liquid inlet 133. In some embodiments, as shown in fig. 3, a plurality of first shunt ports 123 can be spaced apart on the wall of the shunt tube 120.

Header 140 may be used to deliver the relatively hot liquid (heat exchanged liquid) from heat dissipation unit 130 to drain 150. In some embodiments, a first collecting port 143 is disposed on a tube wall of the collecting pipe 140, the first collecting port 143 may communicate with the liquid outlet 135 of the heat dissipation module 130, and the heat-exchanged liquid discharged from the heat dissipation module 130 may flow into the collecting pipe 140 through the liquid outlet 135 and the first collecting port 143.

In some embodiments, heat dissipation system 100 may include a first connection tube (not shown). The first diverging port 123 and the liquid inlet 133 of the heat radiating unit 130 and the first collecting port 143 and the liquid outlet 135 of the heat radiating unit 130 may be connected by a first connection pipe. Exemplary first connecting tubes may include stainless steel tubes, metal tubes, corrugated tubes, rubber tubes, plastic tubes, and the like. In some embodiments, the first connection tube may be a hose (e.g., a rubber tube) to facilitate installation and removal.

In some embodiments, as shown in fig. 3, the shunt tubes 120 and the collector tubes 140 can each be U-shaped around the heat dissipating unit 130. One end of the shunt tube 120 (i.e., the first shunt tube end 121 shown in fig. 2 and 3) can be in communication with the inlet tube 110 and the other end (i.e., the second shunt tube end 122 shown in fig. 2 and 3) can be plugged. One end of the manifold 140 (i.e., the first manifold end 141 shown in fig. 2 and 3) may be in communication with the outlet pipe 150 and the other end (i.e., the second manifold end 142 shown in fig. 2 and 3) may be plugged.

In some embodiments, the second shunt tube end 122 and the second manifold end 142 may be plugged in a variety of ways. In some embodiments, the second shunt tube end 122 and the second collector end 142 may each be plugged by a plugging member that is threadably connected to the second shunt tube end 122 and the second collector end 142. In some embodiments, the occluding member may comprise a screw. The screw can be screwed with the second shunt pipe end 122 and the second collecting pipe end 142 to ensure the plugging effect, effectively prevent the liquid from leaking, and the screw connection structure is convenient to install and disassemble. In some alternative embodiments, the blocking member may be attached to the second shunt tube end 122 and the second collector end 142 by bonding, welding, or snapping, etc. For example, the blocking member that blocks the second shunt tube end 122 and the second collector tube end 142 may be blocking plates that are connected by welding. In some embodiments, leak-proof gaskets may be provided between the blocking member and the second shunt tube end 122 and the second manifold end 142 to further prevent liquid from leaking out of the blocking member. The leakage-proof gasket can be made of rubber, latex or resin. In some embodiments, the shunt tube 120 and/or the header 140 can be formed as a single piece with the one end plugged.

In some embodiments, the cross-sectional shape of one or more of the conduits (e.g., inlet conduit 110, outlet conduit 150, shunt conduit 120, and header 140, etc.) in embodiments herein may include a polygon (e.g., a quadrilateral, a hexagon, an octagon, etc.), a circle, an ellipse, or the like. Illustratively, in the embodiment shown in FIG. 3, the cross-sectional shapes of the inlet tube 110, the outlet tube 150, the shunt tube 120, and the manifold 140 are all circular. The impurities in the pipeline with the circular or oval cross section are not easy to accumulate, and the pipeline can be effectively prevented from being blocked. In addition, the pipeline with the circular cross-sectional shape is more convenient to produce and manufacture.

In some cases, in order to improve the working efficiency of the heat dissipation system 100, the heat dissipation unit 130 may be disposed on the supporting frame 167 of each layer of the layered cabinet 160, and the heat dissipation units 130 on the supporting frames 167 may be dissipated simultaneously. To achieve this, the heat dissipation system 100 in some embodiments of the present disclosure may divide the liquid delivered to the liquid inlet pipe 110 to simultaneously dissipate the heat of the heat dissipation units 130 on the plurality of support frames 167.

As shown in fig. 2 and 3, in some embodiments, a plurality of second branch ports may be disposed on a wall of the liquid inlet pipe 110, and the plurality of second branch ports are arranged along a length direction of the liquid inlet pipe 110. In some embodiments, the shunt tubes 120 can include multiple (e.g., the embodiment shown in fig. 3 includes 4 shunt tubes 120), with each shunt tube 120 in communication with one of the secondary shunt ports. The position of each shunt tube 120 may correspond to the position of the heat dissipation unit 130 placed on each layer of the supporting frame 167 of the layered cabinet 160, and the fluid is delivered to the heat dissipation unit 130 at the corresponding position through the shunt tube 120 for heat exchange. The position of the shunt tube 120 corresponding to the position of the heat dissipation unit 130 can mean that the shunt tube 120 and the heat dissipation unit 130 are in a positional relationship that facilitates the communication between the first shunt opening 123 and the liquid inlet 133.

In some cases, the heat dissipating units 130 disposed on each layer of the supporting frame 167 need to discharge the heat exchanged liquid, and the heat dissipating system 100 can collect and uniformly deliver the heat exchanged liquid to the liquid outlet pipe 150 through a plurality of collecting pipes 140 to facilitate the concentrated discharge of the heat exchanged liquid. In some embodiments, a plurality of second collecting ports may be disposed on a wall of the outlet pipe 150, and the plurality of second collecting ports are arranged along a length direction of the outlet pipe 150. In some embodiments, the manifold 140 may include a plurality (e.g., the embodiment shown in fig. 3 includes 4 manifolds 140), with each manifold 140 communicating with a second manifold port. The position of each header 140 may correspond to the position of the heat dissipation unit 130 disposed on each layer of the support frame 167 of the layered cabinet 160, and the heat-exchanged liquid discharged from the heat dissipation unit 130 at the corresponding position is collected by the header 140, so that the liquid collected by the plurality of headers 140 is uniformly delivered to the liquid outlet pipe 150 for concentrated discharge. The position of the header 140 corresponding to the position of the heat dissipation unit 130 may be referred to herein as the positional relationship between the header 140 and the heat dissipation unit 130, which facilitates the communication between the first collecting port 143 and the liquid outlet 135.

In some embodiments, the fluid inlet 133 and the first fluid dividing port 123, the fluid outlet 135 and the first fluid collecting port 143, the fluid dividing pipe 120 and the second fluid dividing port, and the fluid collecting pipe 140 and the second fluid collecting port may be connected by a screw connection, a flange connection, a welding connection, a pipe bonding connection, a connector connection, etc. For example, taking the communication between the flow dividing pipe 120 and the liquid inlet pipe 110 as an example, the first flow dividing pipe end 121 of the flow dividing pipe 120 is a threaded pipe opening with external threads, the second flow dividing opening of the liquid inlet pipe 110 is provided with a threaded hole, and the communication between the flow dividing pipe 120 and the liquid inlet pipe 110 can be realized by the threaded connection between the threaded pipe opening and the threaded hole.

Fig. 4 is a schematic structural view of a heat dissipating unit according to some embodiments of the present disclosure. In some embodiments, the heat dissipating unit 130 may include a plurality of heat dissipating plates 137 disposed in parallel. A board 139 may be installed between every two adjacent heat dissipation plates 137. The heat dissipation plate 137 may be used to dissipate heat from a device to be dissipated (e.g., a chip set, a PCB, etc.) on the board 139. The parallel arrangement may mean that the plurality of heat dissipation plates 137 are arranged at intervals in the thickness direction. Each of the heat dissipation plates 137 in the heat dissipation unit 130 may include a liquid inlet 133 and a liquid outlet 135. Among the plurality of heat dissipation plates 137 arranged in parallel, the liquid inlet 133 of the heat dissipation plate 137 (e.g., the heat dissipation plate 137-1 located at the rightmost side in fig. 4) located at one end of the heat dissipation unit 130 communicates with the bypass pipe 120, the liquid outlet 135 of the heat dissipation plate 137 (e.g., the heat dissipation plate 137-4 located at the leftmost side in fig. 4) located at the other end of the heat dissipation unit 130 communicates with the manifold 140, and the liquid inlet 133 and the liquid outlet 135 between adjacent heat dissipation plates 137 communicate with each other. Illustratively, in the embodiment shown in fig. 4, the heat dissipating unit is composed of four heat dissipating plates 137(137-1, 137-2, 137-3, 137-4, respectively) arranged in parallel, and a liquid inlet 133 and a liquid outlet 135 are provided on an end surface of each heat dissipating plate 137. The liquid inlets 133 and the liquid outlets 135 of the adjacent two heat dissipation plates 137 are disposed to intersect so that the liquid inlets 133 and the liquid outlets 135 of the adjacent two heat dissipation plates 137 communicate. For example, the liquid inlet 133 of the heat dissipation plate 137-1 is located on the upper side of the end face, and the liquid outlet 135 is located on the lower side of the end face; the liquid inlet 133 of the heat dissipation plate 137-2 is located on the lower side of the end surface, and the liquid outlet 135 is located on the upper side of the end surface.

In this embodiment, the liquid may enter the heat dissipation unit 130 through the liquid inlet 133 of the heat dissipation plate 137-1, sequentially pass through the heat dissipation plate 137-2 and the heat dissipation plate 137-3, and perform heat exchange on the chip disposed on the board card 139 between two adjacent heat dissipation plates 137, so as to finally cool the chip. And finally discharged from the liquid outlet 135 of the heat dissipation plate 137-4 to the manifold 140. It should be noted that the above is only an example, and is not intended to limit the number of the heat dissipation plates 137 included in the heat dissipation unit 130. In some embodiments, in addition to the 4-piece heat dissipation plate 137 solution in the above embodiments, the heat dissipation unit 130 may further include 2, 3, 5, 6, or more heat dissipation plates 137. The number of the heat dissipation plates 137 of the heat dissipation unit 130 may be determined by those skilled in the art according to the specific structure, size, number, etc. of the devices to be heat dissipated.

In some embodiments, the outline shape of the heat dissipation plate 137 in the thickness direction thereof may include a rectangle, a circle, a triangle, a polygon, or the like. For example, in the embodiment shown in fig. 4, the outline shape of the heat dissipation plate 137 in the thickness direction thereof may be regarded approximately as a rectangle. In some embodiments, the outline shape of the heat dissipation plate 137 in the thickness direction thereof may preferably be the same as or similar to the shape of the device to be heat dissipated, so as to enable the heat dissipation plate 137 to have a better heat dissipation effect while saving the cost of the heat dissipation plate 137. In some embodiments, the heat dissipation plate 137 may be made of a material that is easily heat conductive, such as copper or aluminum. In some embodiments, the heat dissipation system 100 may further include a second connection pipe 131. The liquid inlets 133 and the liquid outlets 135 of the adjacent heat dissipation plates 137 may be connected by a second connection pipe 131. The second connection pipe 131 and the first connection pipe may be made of the same or different materials. In some embodiments, the pipes provided inside the heat dissipation plate 137 may include a ring pipe, a side-by-side pipe, or the like to communicate the liquid inlet 133 and the liquid outlet 135 of the heat dissipation plate 137.

In some embodiments, for one heat dissipation unit 130, the liquid inlet 133 communicated with the shunt tube 120 and the liquid outlet 135 communicated with the collecting tube 140 may be both located on the upper side of the end face of the heat dissipation plate 137, so that the phenomenon of empty water in the heat dissipation plate 137 can be effectively avoided, and the heat dissipation effect of the heat dissipation unit 130 is improved.

Referring to fig. 1 and 2, in some embodiments, two rows of heat dissipation units 130 may be arranged side by side on each layer of the supporting frame 167 of the layered cabinet 160. In some embodiments, the two rows of heat dissipation units 130 on each layer of the support frame 167 can share the same shunt tubes 120 and collector tubes 140. Illustratively, the liquid inlets 133 of the two rows of heat dissipation units 130 placed on each layer of the supporting frame 167 are communicated with different first shunt openings 123 of the same shunt tube 120. The liquid outlets 135 of the two rows of heat dissipation units 130 disposed on each layer of the supporting frame 167 can communicate with different first collecting ports 143 of the same collecting pipe 140.

Referring to fig. 2 and 3, in some embodiments, one shunt tube 120 and one collector tube 140 corresponding to two rows of heat dissipating units on each level of the tiered cabinet 160 may be disposed in a U-shape around two rows of heat dissipating units 130 on that level. In some embodiments, after the liquid enters the liquid inlet pipe 110 through the liquid inlet 111, the liquid can enter the dividing pipes 120 of each layer of the layered cabinet 160. Since the liquid inlets 133 of the two rows of heat dissipation units 130 disposed on each layer are all communicated with the same shunt tube 120, the liquid in the shunt tube 120 can enter the corresponding heat dissipation unit 130 through the liquid inlet 133 communicated with the shunt tube 120, so as to reduce the temperature of the chip located between the heat dissipation plates 137.

In this embodiment, after heat is transferred to the liquid, the temperature of the liquid rises, the liquid with the raised temperature can enter the collecting pipe 140 communicated with the liquid outlets 135 of the two rows of heat dissipating units 130 through the liquid outlets 135 of the two rows of heat dissipating units 130, and the liquid with the raised temperature is collected in the collecting pipe 140, and then enters the liquid outlet pipe 150 and is discharged out of the heat dissipating system 100 through the liquid outlet 151 or to a corresponding device.

In some cases, the dividing tubes 120 and the collecting tubes 140 in each layer of the layered cabinet 160 are arranged to be U-shaped and arranged around the two rows of heat dissipation units 130 located in the corresponding layer, so that all the liquid inlets 133 and the liquid outlets 135 of the two rows of heat dissipation units 130 can be conveniently communicated with the same dividing tube 120 and the same collecting tube 140, the pipeline design in the heat dissipation system 100 is optimized, the space occupied by the dividing tubes 120 and the collecting tubes 140 is reduced, and the space utilization rate of the layered cabinet 160 is improved.

In some embodiments, the heat dissipation system 100 may dissipate heat in a manner that includes liquid-cooled heat dissipation and/or air-cooled heat dissipation. As shown in fig. 2, in some embodiments, the heat dissipation system 100 may include a heat dissipation air duct 163 disposed between two rows of heat dissipation units 130, and the heat dissipation air duct 163 may be used to implement air-cooled heat dissipation of the heat dissipation system 100. In some embodiments, the heat dissipation duct 163 extends in a vertical direction between the top and bottom of the tiered cabinet 160. The vertical direction may be understood as a height direction (i.e., the second direction in fig. 1) of the tiered cabinet 160. In some embodiments, the heat dissipation duct 163 may be formed by a gap between two rows of heat dissipation units 130 on each layer of the layered cabinet 160, that is, the space between two rows of heat dissipation units 130 on each layer may communicate to form the heat dissipation duct 163. The bottom of the tiered cabinet 160 may be the side of the tiered cabinet 160 near the mounting floor, while the top of the tiered cabinet 160 is the side of the tiered cabinet 160 away from the mounting floor.

In some cases, by providing the heat dissipation duct 163 between the two rows of heat dissipation units 130 on each level of the tiered cabinet 160, the hot air in the tiered cabinet 160 is collected into the heat dissipation duct 163 from both sides (i.e., both sides where the heat dissipation units 130 are provided), and is exhausted from the top of the tiered cabinet 160.

Referring to fig. 1 and 2, in some embodiments, in order to realize air-cooled heat dissipation of the heat dissipation system 100, the first side wall 161 and the second side wall 162 of the tiered cabinet 160 corresponding to the two rows of heat dissipation units 130 on each tier of the supporting frame 167 may be respectively provided with a first air inlet 164 and a second air inlet 165. And an air outlet 166 may be provided at the top of the tiered cabinet 160 corresponding to the heat dissipation air duct 163. In the present embodiment, a natural wind channel is formed by providing the air inlets (i.e., the first air inlet 164 and the second air inlet 165) on the first side wall 161 and the second side wall 162, respectively, and providing the air outlet 166 on the top of the laminated cabinet 160. After the external air enters the laminated cabinet 160, the external air may be collected from the first side wall 161 and the second side wall 162 to the heat dissipation duct 163, and the hot air around the heat dissipation unit 130 and the collecting main 140 may be taken away during the collection process, so as to reduce the temperature inside the laminated cabinet 160. In some embodiments, the first and

second air intakes

164, 165 may be one or more through holes disposed on the first and

second sidewalls

161, 162. The air outlet 166 may be a through hole provided at the top of the housing of the tiered cabinet 160.

In some cases, the temperature of the liquid entering the heat dissipation unit 130 through heat exchange is generally high, and the liquid in the header 140 and the liquid outlet 150 also dissipates heat during the process of being discharged from the heat dissipation unit 130 and being discharged out of the heat dissipation system 100 through the header 140 and the liquid outlet 150. This heat is transferred to the outside of the tubes causing the temperature within the tiered cabinet 160 to rise. The external air entering from the first air inlet 164 may pass through the corresponding header 140 and the heat dissipation unit 130 of the first sidewall 161, and bring the hot air therein into the heat dissipation duct 163. And the external air entering from the second air inlet 165 may pass through the corresponding header 140 and the heat dissipation unit 130 of the second sidewall 162, and bring the hot air therein into the heat dissipation duct 163. The air temperature in the heat dissipation air duct 163 is increased, and the hot air in the heat dissipation air duct 163 can be exhausted through the air outlet 166 at the top of the layered cabinet 160, so as to realize air-cooling heat dissipation of the heat dissipation system 100. In some embodiments, the hot air in the heat dissipation duct 163 can be automatically exhausted from the top exhaust outlet 166 due to its own density characteristics.

In some embodiments, to increase the efficiency of the heat dissipation system 100 in air-cooling heat dissipation, the air outlet 166 may be provided with an air exhaust device (not shown). In some embodiments, the exhaust device may include one or more exhaust fans driven by a motor to better exhaust the hot air in the cooling air duct 163 out of the tiered cabinet 160.

In some embodiments, an air intake device (not shown) may be disposed at the first air intake 164 and/or the second air intake 165 to improve the air intake efficiency of the heat dissipation system 100. In some embodiments, the air intake device may include one or more air intake fans driven by a motor to better draw outside air into the tiered cabinet 160.

The heat dissipation system 100 in the embodiment of the present disclosure can achieve heat dissipation through two heat dissipation methods, namely liquid-cooled heat dissipation and air-cooled heat dissipation, and can reduce the temperature of the chip in each heat dissipation unit 130 in the layered cabinet 160 to a great extent, so that the heat dissipation system 100 has better heat dissipation performance. In addition, the layered cabinet 160 in the heat dissipation system 100 may include a plurality of supporting frames 167 disposed in layers, two rows of heat dissipation units 130 may be placed on each supporting frame 167, and each row of heat dissipation units 130 may include a plurality of devices (e.g., chips) to be dissipated. By arranging the two rows of heat dissipation units 130, the chip placement amount per unit volume of the layered cabinet 160 can be effectively increased, thereby improving the space utilization rate of the layered cabinet 160. In some embodiments, the heat dissipation system 100 may include only liquid-cooled heat dissipation or air-cooled heat dissipation.

In some embodiments, the heat dissipation system 100 of the present disclosure may also adjust the heat dissipation efficiency of the air-cooling and/or liquid-cooling according to the temperature inside the heat dissipation system 100 (i.e., the tiered cabinet 160), so as to adjust the temperature inside the heat dissipation system 100. In some embodiments, heat dissipation system 100 may further include a temperature regulation device (not shown), which may monitor and regulate the temperature within heat dissipation system 100.

In some embodiments, the temperature adjustment device may include a temperature sensor and a controller. Wherein, the temperature sensor can be used for detecting the temperature of the heat dissipation system 100 and generating a temperature detection signal, and the controller can be used for adjusting the discharge efficiency of the air exhaust device and/or the air intake device according to the temperature detection signal. In some embodiments, the exhaust efficiency and/or intake efficiency of the exhaust device may be adjusted by adjusting the rotational speed of one or more exhaust fans in the exhaust device and/or one or more intake fans in the intake device. The higher the rotation speed of the exhaust fan and/or the intake fan is, the higher the exhaust efficiency of the exhaust device and/or the intake efficiency of the intake device is, and the faster the temperature of the heat dissipation system is reduced. In some embodiments, the Controller may include a single chip, a Programmable Logic Controller (PLC), and other control systems.

In some embodiments, a temperature sensor may be disposed within the heat dissipation air duct 163, for example, a temperature sensor may be disposed at the top of the heat dissipation air duct 163 for detecting the temperature at the top of the heat dissipation air duct 163. In some embodiments, a temperature sensor may be disposed at any location of the tiered cabinet 160 to detect a temperature at that location. In some cases, when the heat dissipation air duct 163 of one or more of the above embodiments is disposed in the heat dissipation system 100, the temperature at the top of the heat dissipation air duct 163 is relatively high because the air in the laminated cabinet 160 is collected into the heat dissipation air duct 163 and exhausted out of the laminated cabinet 160 through the top of the heat dissipation air duct 163. In some embodiments, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 exceeds a temperature threshold (e.g., 65 degrees, 70 degrees, 80 degrees, etc.), a temperature detection signal with an excessive temperature may be generated, and the controller may increase the rotation speed of one or more exhaust fans in the exhaust device based on the corresponding temperature detection signal, so as to increase the exhaust efficiency of the exhaust device and improve the heat dissipation efficiency.

In some embodiments, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 is within the temperature threshold, a normal temperature detection signal may be generated, and the controller may turn down the rotation speed of one or more exhaust fans in the exhaust device based on the normal temperature detection signal without affecting the heat dissipation effect of the heat dissipation system 100. This ensures that the rotational speed of the exhaust device can meet the heat dissipation requirements of the heat dissipation system 100, reduces the power consumption of the exhaust device (e.g., exhaust fan), and reduces the noise generated during operation of the exhaust fan. In some embodiments, the controller may not adjust the exhaust when the temperature is normal.

In some embodiments, the controller may be configured to adjust an intake efficiency of the intake device based on the temperature detection signal. In some embodiments, the controller may be configured to simultaneously adjust an intake efficiency of the intake device and an exhaust efficiency of the exhaust device based on the temperature detection signal. The process that the controller adjusts the air inlet efficiency of the air inlet device according to the temperature detection signal is the same as or similar to the process that the controller adjusts the air exhaust efficiency of the air exhaust device according to the temperature detection signal, and the process is not repeated herein.

In some embodiments, a first flow valve (not shown) may be disposed at the inlet 111 and/or the outlet 151, and the controller may control the first flow valve (e.g., in a PLC controlled manner) to adjust the flow rate of the liquid delivered to the heat dissipation system 100 and/or the liquid discharged from the heat dissipation system 100 through the first flow valve, so as to adjust the temperature of the heat dissipation system 100. For example, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 exceeds the temperature threshold, a temperature detection signal corresponding to an excessive temperature may be generated, and the controller may control the first flow valve based on the temperature detection signal corresponding to the excessive temperature, so as to increase the flow rate of the liquid passing through the first flow valve, thereby increasing the cooling effect of the cooling system 100. In some embodiments, when the temperature sensor detects that the temperature at the top of the cooling air duct 163 is within the temperature threshold, a normal temperature detection signal may be generated, and the controller may adjust the first flow valve based on the normal temperature detection signal to reduce the flow rate of the liquid through the first flow valve and reduce the power consumption caused by cooling (e.g., the power consumption of a water pump connected to the liquid outlet and/or the liquid inlet of the cooling system 100). In some embodiments, the controller may not adjust the first flow valve when the temperature is normal.

In some embodiments, a temperature sensor may be provided at each level of the tiered cabinet 160. Illustratively, a temperature sensor is provided on each support bracket 167. The connection end of each layer of shunt tubes 120 to the inlet tubes 140 (e.g., the first shunt tube end 121 shown in fig. 2 and 3) and/or the connection end of each layer of manifold 140 to the outlet tubes 150 (e.g., the first manifold end 141 shown in fig. 2 and 3) is provided with a second flow valve (not shown). The controller may be configured to adjust the flow rate of the liquid through each of the second flow valves based on a temperature detection signal generated by the temperature sensor of each of the layers.

For example only, when a temperature sensor of a layer detects that the temperature of the layer exceeds or is within a temperature threshold, the controller may adjust a second flow valve on the layer shunt tube 120 and/or the layer header 140 according to the over-temperature or normal-temperature detection signal, so as to adjust the flow rate of the liquid passing through the second flow valve (e.g., the flow rate of the liquid entering the layer shunt tube 120 and/or the flow rate of the liquid exiting the layer header 140) to increase or decrease, and accordingly decrease the temperature of the layer space or decrease the power consumption of the heat dissipation system 100.

In some embodiments, the controller may also adjust the plurality of second flow valves simultaneously according to temperature detection signals of the temperature sensors disposed at each layer of the layered cabinet, so as to adjust the liquid flow rate passing through the plurality of second flow valves, achieve the purpose of adjusting the temperature in the multi-layer space of the layered cabinet 160, and finally ensure that the temperature distribution in the multi-layer space of the layered cabinet 160 is uniform. In some embodiments, the number of heat dissipating units 130 disposed in each layer of the tiered cabinet 160 and the number and/or type of boards 139 in each heat dissipating unit 130 may be different, such that the amount of heat generated in each layer may be different. Through set up temperature sensor respectively and correspond the liquid flow who adjusts every layer at each layer, can realize the control that becomes more meticulous to cooling system 100, can enough guarantee the required radiating effect of each layer, can practice thrift cooling system 100's use cost again.

The heat dissipation system disclosed in the embodiments of the present application may have beneficial effects including, but not limited to: (1) the liquid inlet and the liquid outlet are arranged to be higher than the liquid level of the liquid in the flow dividing pipe, the flow collecting pipe and the heat dissipation unit, so that the condition that a pipeline of a heat dissipation system is empty of water can be effectively avoided; air in a pipeline of the heat dissipation system is discharged without adding an additional exhaust device, so that the structure of the heat dissipation system can be simplified, and meanwhile, the manufacturing cost of the heat dissipation system is reduced; (2) by arranging two rows of heat dissipation units on each layer of support frame simultaneously, the space utilization rate of the layered cabinet body can be improved; (3) a natural air duct can be formed inside the layered cabinet body by arranging a heat dissipation air duct between the two rows of heat dissipation units and arranging a first air inlet and a second air inlet on a first side wall and a second side wall of the layered cabinet body; air can enter the interior of the layered cabinet body through the first air inlet and the second air inlet and is collected towards the heat dissipation air duct, and hot air around the heat dissipation unit and the collecting pipe can be taken away in the collecting process, so that the temperature in the layered cabinet body is reduced. It is to be noted that different embodiments may produce different advantages, and in different embodiments, any one or combination of the above advantages may be produced, or any other advantages may be obtained.

Some embodiments of the present disclosure also provide a heating system. The heating system may include the heat dissipation system 100 in any of the above technical solutions and a heating pipeline, and the heating pipeline is communicated with the liquid outlet 111 of the heat dissipation system 100. The heat exchange liquid discharged from the liquid outlet 111 of the heat dissipation system 100 is received by the heating pipe. The heating system can directly use the liquid for heating, and the heat in the liquid is released through the secondary heat exchange for heating other places. In addition, because the heat radiation system 100 has low requirements on the water quality of the liquid, a water purifying device is not required to be arranged in the heating system, and the cost of the heating system is reduced.

FIG. 5 is a schematic diagram of a heating system according to some embodiments of the present application. In some embodiments, the heating system 1000 may include a heat dissipation system 100 and a heating pipe 200, and the heating pipe 200 is in communication with the liquid outlet 111 of the heat dissipation system 100. The heating system 1000 may be understood as a heating facility (e.g., a radiator, a floor heater, etc.) provided to maintain a space where people live or produce in a suitable thermal state. The direction of liquid flow in the heating line 200 is shown by the arrows in fig. 5. The liquid with a higher temperature can be introduced into the heating pipe 200 of the heating system 1000, and the liquid can release heat in the heating pipe 200 to increase the temperature of the area to be heated by the heating system 1000. When the heating system 1000 is used in cooperation with the heat dissipation system 200, the liquid flowing out of the liquid outlet 111 of the heat dissipation system 100 and subjected to heat exchange can be used for heating the heating system 1000, so that the liquid can be recycled, and the heat energy dissipated by the equipment to be cooled can be recycled. In some embodiments, the liquid flowing into the heating system 1000 for heat exchange again (e.g., releasing heat in the heating pipeline 200) can directly flow into the heat dissipation system 100 for heat dissipation of the device to be dissipated. For example, after the liquid performs heat exchange in the heating pipe 200 to release heat, the temperature of the liquid may decrease, and thus the liquid may be used as the cooling liquid of the heat dissipation system 100 again. The liquid inlet 111 of the heat dissipation system 100 is connected to the outlet of the heating pipeline 200, and the liquid can be input into the heat dissipation unit 130 of the heat dissipation system 100 to exchange heat with the chip, so as to realize the recycling of the liquid.

It is to be noted that different embodiments may produce different advantages, and in different embodiments, any one or combination of the above advantages may be produced, or any other advantages may be obtained.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered merely illustrative and not restrictive of the broad application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, this application uses specific language to describe embodiments of the application. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the present application is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

Additionally, the order in which elements and sequences of the processes described herein are processed, the use of alphanumeric characters, or the use of other designations, is not intended to limit the order of the processes and methods described herein, unless explicitly claimed. While various presently contemplated embodiments have been discussed in the foregoing disclosure by way of example, it should be understood that such detail is solely for that purpose and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements that are within the spirit and scope of the embodiments herein. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of the present application. Thus, by way of example, and not limitation, alternative configurations of the embodiments of the present application can be viewed as being consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to only those embodiments explicitly described and depicted herein.

Claims

1. A heat dissipation system, comprising: the heat dissipation device comprises a liquid inlet pipe, a flow dividing pipe, a heat dissipation unit, a flow collecting pipe and a liquid outlet pipe;

the liquid inlet pipe comprises a liquid inlet, and the liquid inlet pipe is communicated with the flow dividing pipe;

the heat dissipation unit comprises a liquid inlet and a liquid outlet, the flow dividing pipe is communicated with the liquid inlet, and the liquid outlet is communicated with the collecting pipe;

the collecting pipe is communicated with the liquid outlet pipe, and the liquid outlet pipe comprises a liquid outlet;

the height of the liquid inlet and the height of the liquid outlet are higher than the liquid level of the liquid in the flow dividing pipe, the heat dissipation unit and the flow collecting pipe.

2. The heat dissipation system of claim 1, further comprising a tiered cabinet, each tier of the tiered cabinet being configured to house one or more of the heat dissipation units.

3. The heat dissipation system of claim 2, wherein the liquid inlet and the liquid outlet are disposed at a same height of a sidewall of the tiered cabinet.

4. The heat dissipation system of claim 2, wherein two rows of the heat dissipation units are disposed in parallel on each layer of the tiered cabinet body, the heat dissipation system further comprising a heat dissipation air duct disposed between the two rows of the heat dissipation units, the heat dissipation air duct extending in a vertical direction between a top and a bottom of the tiered cabinet body.

5. The heat dissipation system of claim 4, wherein one end of the shunt tube is connected to the liquid inlet tube, and the other end of the shunt tube is blocked, and the shunt tube is disposed around two rows of the heat dissipation units in a U-shaped manner;

one end of the collecting pipe is communicated with the liquid outlet pipe, the other end of the collecting pipe is plugged, and the collecting pipe is U-shaped and surrounds the two rows of radiating units.

6. The heat dissipation system of claim 4, wherein the first side wall and the second side wall of the tiered cabinet body corresponding to the two rows of heat dissipation units are respectively provided with a first air inlet and a second air inlet, and an air outlet is arranged at the top of the tiered cabinet body corresponding to the position of the heat dissipation air duct.

7. The heat dissipating system of claim 6, wherein an air exhaust is provided at the air exhaust.

8. The heat dissipating system of claim 7, further comprising a temperature regulating device comprising a temperature sensor and a controller;

the temperature sensor is used for detecting the temperature of the heat dissipation system and generating a temperature detection signal;

the controller is used for adjusting the air exhaust efficiency of the air exhaust device according to the temperature detection signal.

9. The heat dissipation system of claim 8, wherein the temperature sensor is disposed at the top of the heat dissipation air duct for detecting the temperature at the top of the heat dissipation air duct.

10. The heat dissipation system of claim 8, wherein an air intake device is provided at the first air intake and/or the second air intake;

the controller is also used for adjusting the air inlet efficiency of the air inlet device according to the temperature detection signal.

11. The heat dissipation system of claim 8, wherein a first flow valve is disposed on the liquid inlet and/or the liquid outlet;

the controller is also used for adjusting the liquid flow passing through the first flow valve according to the detection signal.

12. The heat dissipation system as claimed in claim 8, wherein each layer of the layered cabinet is provided with the temperature sensor, and each layer is provided with one of the shunt tubes and one of the header tubes;

a second flow valve is arranged at the connecting end of the flow dividing pipe and the liquid inlet pipe of each layer and/or at the connecting end of the flow collecting pipe and the liquid outlet pipe of each layer;

the controller is also used for adjusting the liquid flow rate passing through the second flow valve of each layer according to the temperature detection signal of the temperature sensor of each layer.

13. The heat dissipation system according to any one of claims 1 to 12, wherein the heat dissipation unit includes a plurality of heat dissipation plates arranged in parallel, a board is installed between every two adjacent heat dissipation plates, and the heat dissipation plates are used for dissipating heat of chips on the board;

in the heat dissipation unit, each heat dissipation plate includes the liquid inlet and the liquid outlet, the liquid inlet of the heat dissipation plate at one end is communicated with the flow dividing pipe, the liquid outlet of the heat dissipation plate at the other end is communicated with the flow collecting pipe, and the liquid inlet and the liquid outlet between adjacent heat dissipation plates are communicated with each other.

14. A heating system, characterized in that the heating system comprises: the heat dissipating system of any of claims 1-13; and

and the heating pipeline is communicated with the liquid outlet of the heat dissipation system.