TW202310033A - 預測方法、預測程式、預測裝置、學習方法、學習程式及學習裝置 - Google Patents

預測方法、預測程式、預測裝置、學習方法、學習程式及學習裝置 Download PDF

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Publication number
TW202310033A
TW202310033A TW111127519A TW111127519A TW202310033A TW 202310033 A TW202310033 A TW 202310033A TW 111127519 A TW111127519 A TW 111127519A TW 111127519 A TW111127519 A TW 111127519A TW 202310033 A TW202310033 A TW 202310033A
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Taiwan
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etching rate
model
etching
film
prediction
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TW111127519A
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Chinese (zh)
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樋口倫太郎
中森光則
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日商東京威力科創股份有限公司
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Publication of TW202310033A publication Critical patent/TW202310033A/zh

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Theoretical Computer Science (AREA)
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  • General Business, Economics & Management (AREA)
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  • Development Economics (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
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  • Game Theory and Decision Science (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Primary Health Care (AREA)
  • Drying Of Semiconductors (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
TW111127519A 2021-08-05 2022-07-22 預測方法、預測程式、預測裝置、學習方法、學習程式及學習裝置 TW202310033A (zh)

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JP2021-129221 2021-08-05
JP2021129221 2021-08-05

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TW202310033A true TW202310033A (zh) 2023-03-01

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TW111127519A TW202310033A (zh) 2021-08-05 2022-07-22 預測方法、預測程式、預測裝置、學習方法、學習程式及學習裝置

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JP (1) JPWO2023013436A1 (https=)
TW (1) TW202310033A (https=)
WO (1) WO2023013436A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263366A1 (ja) * 2024-06-21 2025-12-26 東京エレクトロン株式会社 基板処理方法、基板処理システム及びパラメータの補正方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5052033B2 (ja) * 2005-04-28 2012-10-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2009177007A (ja) * 2008-01-25 2009-08-06 Panasonic Corp 絶縁膜のエッチング方法
JP2011029443A (ja) * 2009-07-27 2011-02-10 Panasonic Corp ウェット処理方法及びウェット処理システム
JP6106519B2 (ja) * 2013-05-09 2017-04-05 東京エレクトロン株式会社 基板処理方法、プログラム、制御装置、成膜装置及び基板処理システム
JP6668257B2 (ja) * 2014-12-26 2020-03-18 倉敷紡績株式会社 珪素濃度又はエッチング選択比の測定方法及び測定装置
JP2018032781A (ja) * 2016-08-25 2018-03-01 東京応化工業株式会社 エッチング液、及びエッチング方法
JP6525044B1 (ja) * 2017-12-13 2019-06-05 オムロン株式会社 監視システム、学習装置、学習方法、監視装置及び監視方法
JP7296300B2 (ja) * 2019-10-29 2023-06-22 倉敷紡績株式会社 基板のエッチング方法

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