JPWO2023013436A1 - - Google Patents

Info

Publication number
JPWO2023013436A1
JPWO2023013436A1 JP2023540254A JP2023540254A JPWO2023013436A1 JP WO2023013436 A1 JPWO2023013436 A1 JP WO2023013436A1 JP 2023540254 A JP2023540254 A JP 2023540254A JP 2023540254 A JP2023540254 A JP 2023540254A JP WO2023013436 A1 JPWO2023013436 A1 JP WO2023013436A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540254A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013436A1 publication Critical patent/JPWO2023013436A1/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Theoretical Computer Science (AREA)
  • Strategic Management (AREA)
  • Human Resources & Organizations (AREA)
  • Physics & Mathematics (AREA)
  • Economics (AREA)
  • General Physics & Mathematics (AREA)
  • General Business, Economics & Management (AREA)
  • Tourism & Hospitality (AREA)
  • Marketing (AREA)
  • Software Systems (AREA)
  • Development Economics (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
  • Computing Systems (AREA)
  • Game Theory and Decision Science (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Artificial Intelligence (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Primary Health Care (AREA)
  • Drying Of Semiconductors (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
JP2023540254A 2021-08-05 2022-07-22 Pending JPWO2023013436A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021129221 2021-08-05
PCT/JP2022/028438 WO2023013436A1 (ja) 2021-08-05 2022-07-22 予測方法、予測プログラム、予測装置、学習方法、学習プログラム及び学習装置

Publications (1)

Publication Number Publication Date
JPWO2023013436A1 true JPWO2023013436A1 (https=) 2023-02-09

Family

ID=85155598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540254A Pending JPWO2023013436A1 (https=) 2021-08-05 2022-07-22

Country Status (3)

Country Link
JP (1) JPWO2023013436A1 (https=)
TW (1) TW202310033A (https=)
WO (1) WO2023013436A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263366A1 (ja) * 2024-06-21 2025-12-26 東京エレクトロン株式会社 基板処理方法、基板処理システム及びパラメータの補正方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332619A (ja) * 2005-04-28 2006-12-07 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2009177007A (ja) * 2008-01-25 2009-08-06 Panasonic Corp 絶縁膜のエッチング方法
JP2011029443A (ja) * 2009-07-27 2011-02-10 Panasonic Corp ウェット処理方法及びウェット処理システム
JP2014220430A (ja) * 2013-05-09 2014-11-20 東京エレクトロン株式会社 基板処理方法、プログラム、制御装置、成膜装置及び基板処理システム
WO2016104433A1 (ja) * 2014-12-26 2016-06-30 倉敷紡績株式会社 珪素濃度又はエッチング選択比の測定方法及び測定装置
JP2018032781A (ja) * 2016-08-25 2018-03-01 東京応化工業株式会社 エッチング液、及びエッチング方法
JP2019106476A (ja) * 2017-12-13 2019-06-27 オムロン株式会社 監視システム、学習装置、学習方法、監視装置及び監視方法
JP2021072294A (ja) * 2019-10-29 2021-05-06 倉敷紡績株式会社 基板のエッチング方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332619A (ja) * 2005-04-28 2006-12-07 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2009177007A (ja) * 2008-01-25 2009-08-06 Panasonic Corp 絶縁膜のエッチング方法
JP2011029443A (ja) * 2009-07-27 2011-02-10 Panasonic Corp ウェット処理方法及びウェット処理システム
JP2014220430A (ja) * 2013-05-09 2014-11-20 東京エレクトロン株式会社 基板処理方法、プログラム、制御装置、成膜装置及び基板処理システム
WO2016104433A1 (ja) * 2014-12-26 2016-06-30 倉敷紡績株式会社 珪素濃度又はエッチング選択比の測定方法及び測定装置
JP2018032781A (ja) * 2016-08-25 2018-03-01 東京応化工業株式会社 エッチング液、及びエッチング方法
JP2019106476A (ja) * 2017-12-13 2019-06-27 オムロン株式会社 監視システム、学習装置、学習方法、監視装置及び監視方法
JP2021072294A (ja) * 2019-10-29 2021-05-06 倉敷紡績株式会社 基板のエッチング方法

Also Published As

Publication number Publication date
TW202310033A (zh) 2023-03-01
WO2023013436A1 (ja) 2023-02-09

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