TW202302425A - Substrate container system - Google Patents
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- TW202302425A TW202302425A TW110135309A TW110135309A TW202302425A TW 202302425 A TW202302425 A TW 202302425A TW 110135309 A TW110135309 A TW 110135309A TW 110135309 A TW110135309 A TW 110135309A TW 202302425 A TW202302425 A TW 202302425A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
本發明是有關於一種防止諸如晶圓(wafer)的易碎物品在儲存、運送和運輸期間受到環境污染的可運輸容器,且特別是有關於一種能夠在容器系統內分配淨化氣體(purging gas)的容器系統。The present invention relates to a transportable container for protecting fragile items such as wafers from environmental contamination during storage, shipping and transportation, and more particularly to a system capable of dispensing purging gas within the container system container system.
在現代半導體製程中,精密的工件(例如,晶圓(wafer),光罩(reticle)/遮罩(mask))在可以被製成集成電路之前,會在多個製程設備進行多個製程。晶圓通常會從製造晶圓的設施被運輸或輸送到另一地點,以在該地點對所述晶圓進一步處理。此類精密裝置的移動通常以專用的基板容器(例如,前開式基板傳送盒 ,front opening unified pod, FOUP)來完成。In modern semiconductor manufacturing, delicate workpieces (eg, wafers, reticles/masks) undergo multiple processes in multiple process tools before they can be made into integrated circuits. Wafers are typically transported or transported from the facility where the wafers are fabricated to another location where the wafers are further processed. The movement of such delicate devices is usually accomplished with dedicated substrate containers (e.g., front opening unified pod, FOUP).
FOUP通常在多個製程站之間用於容納300mm或450mm的晶圓。慣例上,FOUP具有一個外殼,該外殼限定了一個開放的內部空間,且該外殼中有多個架子,用於固定多個彼此相間隔的晶圓。而且,外殼限定了前開口,所述前開口可被前門構件覆蓋,該前門構件結合了密封構件和閂鎖機構,以在門和外殼之間建立氣密接合。FOUPs are typically used to accommodate 300mm or 450mm wafers between multiple process stations. Conventionally, a FOUP has an enclosure defining an open interior space, and within the enclosure are a plurality of racks for holding a plurality of spaced apart wafers. Also, the housing defines a front opening that may be covered by a front door member that incorporates a sealing member and a latch mechanism to establish an air-tight engagement between the door and the housing.
理想上,在載入或取出基板的期間(例如,當前門被移除並且內部被暴露時),需要控管侵入基板容器的環境污染物(例如,空氣/灰塵/濕氣)。即使周圍環境是無塵室,當環境污染物侵入到容器中時也會對設置其中的基板的產能產生不利影響。為此,將淨化設備結合到運載盒系統中,以在所述盒的裝載/卸載期間支援淨化工序(purging process)。Ideally, environmental contaminants (eg, air/dust/moisture) that intrude into the substrate container need to be managed during loading or unloading of substrates (eg, when the front door is removed and the interior is exposed). Even if the surrounding environment is a clean room, the intrusion of environmental contaminants into the container can adversely affect the throughput of the substrates disposed therein. To this end, purge equipment is incorporated into the carrier cassette system to support the purging process during loading/unloading of the cassettes.
有鑒於此,本發明提出一種基板容器系統,利用在容器主體的背板上形成高度小於背板的後開口,並於後開口處覆蓋過濾組件的方式,讓過濾組件以非整面方式提供淨化氣體。In view of this, the present invention proposes a substrate container system, which utilizes the method of forming a rear opening with a height smaller than the back plate on the back plate of the container body, and covering the filter assembly at the rear opening, so that the filter assembly can provide purification in a non-solid manner. gas.
依據本發明之一方面,提供一種基板容器系統,包括一容器主體、一過濾組件以及一後蓋。容器主體包括一頂面、與頂面相對之一底面,以及連接頂面與底面之一背板。容器主體具有一前開口及一後開口,前開口位於頂面與底面之間,用以供一基板通過,後開口位於背板,與前開口相對。其中,背板具有一第一高度,後開口具有小於第一高度之一第二高度。過濾組件覆蓋於後開口。後蓋用以與容器主體建立密封地接合,後蓋與容器主體間形成一導氣通道,沿第一高度的方向延伸。後蓋與過濾組件共同定義了一緩衝室,導氣通道具有一出口,連接於緩衝室。According to one aspect of the present invention, a substrate container system is provided, including a container body, a filter assembly, and a rear cover. The container body includes a top surface, a bottom surface opposite to the top surface, and a back plate connecting the top surface and the bottom surface. The container main body has a front opening and a rear opening. The front opening is located between the top surface and the bottom surface for a substrate to pass through. The rear opening is located on the back plate and is opposite to the front opening. Wherein, the back plate has a first height, and the rear opening has a second height smaller than the first height. The filter assembly covers the rear opening. The back cover is used to establish a sealing connection with the container main body, and an air guide channel is formed between the back cover and the container main body, extending along the direction of the first height. The rear cover and the filter assembly jointly define a buffer chamber, and the air guide channel has an outlet connected to the buffer chamber.
於一實施例中,第二高度為第一高度的約10%至約90%。In one embodiment, the second height is about 10% to about 90% of the first height.
於一進一步的實施例中,第二高度為第一高度的約10%至約50%,且後開口位於鄰近頂面處。In a further embodiment, the second height is about 10% to about 50% of the first height, and the rear opening is located adjacent to the top surface.
於一實施例中,過濾組件具有一氣體釋放面,其面積大於後開口之面積,氣體釋放面具有平行於背板的一平面。In one embodiment, the filter element has a gas release surface whose area is larger than that of the rear opening, and the gas release surface has a plane parallel to the back plate.
於再一實施例中,過濾組件具有一氣體釋放面,其面積大於後開口之面積,氣體釋放面具有與背板夾有一銳角的一平面。In yet another embodiment, the filter element has a gas releasing surface, the area of which is larger than that of the rear opening, and the gas releasing surface has a plane with an acute angle with the back plate.
於另一實施例中,過濾組件具有一氣體釋放面,其面積大於後開口之面積,氣體釋放面具有一波浪面。In another embodiment, the filter element has a gas releasing surface, the area of which is larger than that of the rear opening, and the gas releasing surface has a corrugated surface.
於又一實施例中,過濾組件具有一氣體釋放面,其面積大於後開口之面積,氣體釋放面通過後開口朝向容器主體延伸,形成一彎曲輪廓。In yet another embodiment, the filter element has a gas release surface with an area larger than that of the rear opening, and the gas release surface extends through the rear opening toward the main body of the container to form a curved profile.
於再一實施例中,過濾組件具有一氣體釋放面,其面積大於後開口之面積,氣體釋放面通過後開口朝向後蓋延伸,形成一彎曲輪廓。In yet another embodiment, the filter element has a gas release surface whose area is larger than that of the rear opening, and the gas release surface extends toward the rear cover through the rear opening to form a curved profile.
於一實施例中,其中後蓋具有朝容器主體凸出的多個凸肋,用來抵接於過濾組件,凸肋為間隔配置以於其中形成多個凹槽,導氣通道的該出口至少包括凹槽。In one embodiment, the rear cover has a plurality of ribs protruding toward the main body of the container for abutting against the filter assembly, the ribs are arranged at intervals to form a plurality of grooves therein, and the outlet of the air guide channel is at least Includes grooves.
於一實施例中,後蓋包括一進氣結構,彎曲地延伸在容器主體的底面下方,進氣結構包括與底面相對並且面朝下的一進氣埠,藉以連接於一外部淨化設備。基板容器系統更包括一氣閥組件,用以供一淨化氣體通過。其中,進氣埠具有一連接結構,氣閥組件經由連接結構連接至進氣埠。氣閥組件包括一氣閥主體及一第一彈性材料,第一彈性材料設置於氣閥主體之一側,並且具有一翼片。當氣閥組件組裝在連接結構時,翼片發生形變,藉以與連接結構建立密封地接合。氣閥組件更包括一第二彈性材料,設置於氣閥主體之另一側,第二彈性材料具有一對接面,用以供外部淨化設備對接,藉以形成密封地接合。In one embodiment, the back cover includes an air intake structure curvedly extending below the bottom surface of the container body, and the air intake structure includes an air intake port opposite to the bottom surface and facing downwards, so as to be connected to an external purification device. The substrate container system further includes a gas valve assembly for passing a purge gas. Wherein, the air intake port has a connection structure, and the air valve assembly is connected to the air intake port through the connection structure. The air valve assembly includes an air valve main body and a first elastic material. The first elastic material is arranged on one side of the air valve main body and has a wing. When the air valve assembly is assembled in the connection structure, the tabs are deformed to establish a sealing engagement with the connection structure. The air valve assembly further includes a second elastic material disposed on the other side of the main body of the air valve. The second elastic material has an abutment surface for the external purification equipment to be abutted to form a sealed joint.
於一實施例中,基板容器系統更包括一密封構件,具有一第一密封環部及一第二密封環部,第一密封環部佈置在後蓋與容器主體之間,第二密封環佈置在過濾組件與容器主體之間。In one embodiment, the substrate container system further includes a sealing member having a first sealing ring part and a second sealing ring part, the first sealing ring part is arranged between the back cover and the container main body, and the second sealing ring is arranged Between the filter component and the container body.
本發明實施例之基板容器系統中,背板具有第一高度,後開口具有小於第一高度之第二高度,過濾組件設置於後開口,藉以讓過濾組件以非整面方式提供淨化氣體,讓容器主體的內部空間在高度方向上具有不同的淨化氣體流速,可以在載入或取出基板的期間,避免門外氣體帶著灰塵、微粒或濕氣等污染物進入容器主體內,維持潔淨度以及減緩濕度回升。In the substrate container system of the embodiment of the present invention, the back plate has a first height, and the rear opening has a second height smaller than the first height, and the filter assembly is arranged at the rear opening, so that the filter assembly can provide the purified gas in a non-uniform manner, so that The internal space of the container body has different purification gas flow rates in the height direction, which can prevent the air outside the door from entering the container body with pollutants such as dust, particles, or moisture during loading or unloading of the substrate, maintaining cleanliness and slowing down Humidity picks up.
本中華民國發明專利申請主張2021年06月30日提出申請之編號為17/363,328名稱「SUBSTRATE CONTAINER SYSTEM」之美國專利申請案的國際優先權,該案係為2020年05月12日提出申請之編號為16/872,392之美國申請案的部分延續案(Continuation-In-Part),前述案件的內容通過引用併入本文,並且成為說明書的一部分。This ROC invention patent application claims the international priority of the U.S. patent application No. 17/363,328 titled "SUBSTRATE CONTAINER SYSTEM" filed on June 30, 2021, which was filed on May 12, 2020 Continuation-In-Part of US Application Serial No. 16/872,392, the contents of which are incorporated herein by reference and made a part of this specification.
以下將參考所附圖式輔以描述更為詳盡地描述本發明的公開內容。圖式中所示為本發明的示例性實施例,並非用來限制本發明;事實上,本發明可以依據許多不同的形式來實施,並且不應被解釋為僅限制於此處所闡述的示例性實施例。提供這些示例性實施例是為了使本發明的說明更為公開透徹和完整,並且將本發明的範圍充分地傳達給本領域相關的技術人員。Hereinafter, the disclosure of the present invention will be described in more detail with reference to the accompanying drawings and supplemented by description. The drawings show exemplary embodiments of the invention and are not intended to limit the invention; indeed, the invention may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Example. These exemplary embodiments are provided so that the description of the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.
在實施例的詳細說明中,相同的圖式標號表示相同或類似的元件。本說明書中使用的術語僅用於描述特定示例性實施例的目的,而不意圖限制本發明。如本文所使用的單數型式的「一」、「一個」及「所述」,除非上下文另外清楚地指出,否則旨在同時包括複數形式。此外,當在本文中使用時,「包括」、「包含」及「具有」所涵蓋的範圍並不排除存在或添加一個或多個其它特徵、區域、整數、步驟、操作、元件、組件和/或群組。In the detailed description of the embodiments, the same reference numerals in the drawings represent the same or similar elements. The terms used in the specification are for the purpose of describing specific exemplary embodiments only, and are not intended to limit the present invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. In addition, when used herein, the scope covered by "comprising", "including" and "having" does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and/or or groups.
本發明實施例之基板容器系統,容器主體的背板上具有後開口,後開口以非整面方式提供淨化氣體,讓容器主體的內部空間在高度方向上具有不同的淨化氣體流速,可以避免門外氣體帶著灰塵、微粒或濕氣等污染物進入容器主體內,從而維持潔淨度以及減緩濕度回升。以下將輔以圖1至圖25,詳細說明本發明實施例的基板容器系統。本發明實施例的圖式中,示例性的基板容器系統的部分元件或結構並未繪示在圖式中,以清楚顯示本發明之特徵。In the substrate container system of the embodiment of the present invention, there is a rear opening on the back plate of the container body, and the rear opening provides the purge gas in a non-full surface, so that the internal space of the container body has different flow rates of the purge gas in the height direction, which can avoid the outside of the door. Gas carries contaminants such as dust, particulates or moisture into the container body to maintain cleanliness and slow humidity rise. The substrate container system according to the embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 25 . In the drawings of the embodiments of the present invention, some elements or structures of the exemplary substrate container system are not shown in the drawings to clearly show the features of the present invention.
請同時參照圖1及圖2,圖1繪示依照本發明一實施例的基板容器系統的立體爆炸圖,圖2繪示圖1的容器主體的立體圖。本實施例的基板容器系統2000包括一容器主體2100、一過濾組件2300以及一後蓋2500。基板容器系統2000例如是一前開式基板傳送盒(front opening unified pod, FOUP)。本實施例的容器主體2100包括一頂面2110、與頂面2110相對之一底面2130,以及連接頂面2110與底面2130之一背板2150。容器主體2100具有一前開口2100a及一後開口2100b,前開口2100a位於頂面2110與底面2130之間,用以供一基板通過。基板容器系統2000更包括前門(圖式中未繪示),前門包括了閂鎖機構及氣密構件,當前門覆蓋於前開口2100a,並與容器主體2100相鎖固時,前門與容器主體2100形成一個氣密的內部空間,用來承載晶圓、光罩或其他具有高潔淨度要求的基板。Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 shows a three-dimensional exploded view of a substrate container system according to an embodiment of the present invention, and FIG. 2 shows a perspective view of the container body in FIG. 1 . The
本實施例中,容器主體2100係由塑料一體成形,並且更包括兩側壁2170,連接於頂面2110及底面2130之間,且兩側壁2170分別位於背板2150的相對兩側。整體而言,容器主體2100經由頂面2110、底面2130、兩側壁2170以及背板2150形成一個箱體,用來容置基板。前開口2100a由頂面2110、底面2130、兩側壁2170圍繞形成,且其寬度及高度均大於後開口2100b。In this embodiment, the
請同時參照圖3及圖4,圖3繪示圖2的容器主體2100的示意圖,圖4繪示容器主體2100沿圖3的剖面P1的剖面圖。後開口2100b位於背板2150,與前開口2100a相對,其中,背板2150具有一第一高度H1,後開口2100b具有小於第一高度H1之一第二高度H2。頂面2110及底面2130之間距由前開口2100a往後開口2100b的方向逐漸縮小,直至背板2150的位置。背板2150連接於頂面2110及底面2130,背板2150的第一高度H1大致上等於容器主體2100於此處的高度。後開口2100b的第二高度H2小於背板2150的第一高度H1,表示後開口2100b並非佔滿整個背板2150,後開口2100b是以非整面方式形成。Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a schematic diagram of the
根據前述,後開口2100b的第二高度H2小於背板2150的第一高度H1,在一實施例中,第二高度H2為第一高度H1的約10%至約90%;在更進一步的實施例中,第二高度H2為第一高度H1的約10%至約50%,且後開口2100b位於鄰近頂面2110處。According to the foregoing, the second height H2 of the
請參照圖5,其繪示圖3的容器主體的後視圖。在圖5的實施例中,第二高度H2約為第一高度H1的40%,且後開口2100b位於鄰近頂面2110處,亦即後開口2100b在高度上為靠近頂面2110的上方位置。Please refer to FIG. 5 , which shows a rear view of the container body in FIG. 3 . In the embodiment shown in FIG. 5 , the second height H2 is about 40% of the first height H1, and the
請參照圖6,其繪示依照本發明另一實施例的容器主體的後視圖。在圖6的實施例中,第二高度H2(i)約為第一高度H1(i)的90%,且後開口2100b(i)位於鄰近頂面2110(i)處。Please refer to FIG. 6 , which shows a rear view of a container body according to another embodiment of the present invention. In the embodiment of FIG. 6 , the second height H2(i) is about 90% of the first height H1(i), and the
請參照圖7,其繪示依照本發明又一實施例的容器主體的後視圖。在圖7的實施例中,第二高度H2(ii)約為第一高度H1(ii)的10%,且後開口2100b(ii)位於鄰近頂面2110(ii)處。Please refer to FIG. 7 , which shows a rear view of a container body according to another embodiment of the present invention. In the embodiment of FIG. 7 , the second height H2(ii) is about 10% of the first height H1(ii), and the
請參照圖8,其繪示依照本發明再一實施例的容器主體的後視圖。在圖8的實施例中,第二高度H2(iii)約為第一高度H1(iii)的50%,且後開口2100b(iii)位於鄰近頂面2110(iii)處。Please refer to FIG. 8 , which shows a rear view of a container body according to another embodiment of the present invention. In the embodiment of FIG. 8 , the second height H2(iii) is about 50% of the first height H1(iii), and the
請參照圖9,其繪示依照本發明另一實施例的容器主體的後視圖。在圖9的實施例中,第二高度H2(iv)約為第一高度H1(iv)的20%,且後開口2100b(iv)與頂面2110(iv)具有一段距離。Please refer to FIG. 9 , which shows a rear view of a container body according to another embodiment of the present invention. In the embodiment of FIG. 9 , the second height H2(iv) is about 20% of the first height H1(iv), and the
前述多種第一高度H1(i)~H1(iv)及第二高度H2(i)~H2(iv)之實施例,並非用以限制本發明,只要是第二高度H2為第一高度H1的約10%至約90%者,均屬於本發明的範圍。另外,後開口2100b較佳地在高度方向位於上方鄰近頂面2110之處,使得提供淨化氣體時,淨化氣體在不同高度具有不同的流速,此點將在後續進行說明。The foregoing embodiments of various first heights H1(i)~H1(iv) and second heights H2(i)~H2(iv) are not intended to limit the present invention, as long as the second height H2 is equal to the first height H1 About 10% to about 90% all belong to the scope of the present invention. In addition, the
請同時參照圖10至圖12,圖10繪示圖1的基板容器系統組裝前的示意圖,圖11繪示圖1的容器主體、密封構件以及過濾組件組裝後的示意圖,圖12繪示圖1的基板容器系統組裝後的示意圖。本實施例的基板容器系統2000中,過濾組件2300覆蓋於後開口2100b。後蓋2500用以與容器主體2100建立密封地接合,後蓋2500與容器主體2100間形成一導氣通道2140,沿第一高度H1的方向延伸。後蓋2500與過濾組件2300共同定義了一緩衝室2340,導氣通道2140具有一出口2140a,連接於緩衝室2340。Please refer to FIG. 10 to FIG. 12 at the same time. FIG. 10 shows a schematic diagram of the substrate container system in FIG. 1 before assembly, and FIG. Schematic of the assembled substrate container system. In the
基板容器系統2000通以淨化氣體後,淨化氣體由底部進入導氣通道2140,接著沿著第一高度H1的方向朝上擴散移動,並經由出口2140a進入緩衝室2340。過濾組件2300為多孔性材料,例如是由多孔燒結材料一體成形,其材料可以例如包括並不限於陶瓷材料和基於聚合物的材料。當淨化氣體進入緩衝室2340累積達到設計的壓力閥值時(或稱之為飽壓),淨化氣體會經由過濾組件2300均勻透出,並且在淨化操作的期間保持壓力的穩定。After the
過濾組件2300較佳地大致上呈一平板狀結構,其具有面朝容器主體2100內部空間的一氣體釋放面2310。藉由平板狀結構的過濾組件2300設計,相較於其他習知型式的過濾組件(例如柱狀的氣體擴散塔),在相同氣體釋放面積的條件下,平板狀結構的過濾組件2300內部具有較大的通氣空間(相對來說,柱狀的氣體擴散塔其內部的通氣空間較小),且平板狀結構的過濾組件2300其氣體釋放面2310,是全面朝向容器主體2100的內部空間擴散淨化氣體(相對來說,柱狀的氣體擴散塔其氣體釋放面,有部分是朝向容器後方透出淨化氣體),有助於淨化效率的提升。The
請同時參照圖1、圖13a及圖13b,圖13a及圖13b分別繪示圖1中過濾組件的立體圖及側視圖。過濾組件2300的氣體釋放面2310面積大於後開口2100b之面積。淨化氣體經由氣體釋放面2310均勻穩定地透出,從而進入容器主體2100的內部空間,以對於基板進行淨化操作。本實施例中,氣體釋放面2310具有一波浪面,及氣體釋放面為凹凸起伏狀態。在組裝時,所述氣體釋放面2310通過後開口2100b延伸進入容器主體2100內部(如沿著圖1及圖10所示的延伸方向D延伸進入容器主體2100內部),可以增加氣體釋放面2310的面積,有助於淨化效率的提升。Please refer to FIG. 1 , FIG. 13 a and FIG. 13 b at the same time. FIG. 13 a and FIG. 13 b are respectively a perspective view and a side view of the filter assembly in FIG. 1 . The area of the
請同時參照圖14a至圖14c,圖14a及圖14b分別繪示另一實施例的過濾組件的立體圖及側視圖,圖14c繪示圖14b之過濾組件與背板的示意圖。過濾組件2300(i)的氣體釋放面2310(i)面積大於後開口2100b之面積。淨化氣體經由氣體釋放面2310(i)均勻穩定地透出,從而進入容器主體2100的內部空間,以對於基板進行淨化操作。本實施例中,氣體釋放面2310(i)具有平行於背板2150的一平面,有助於淨化氣體透出的均勻度。在組裝時,所述氣體釋放面2310(i)通過後開口2100b延伸進入容器主體2100內部(如沿著圖1及圖10所示的延伸方向D延伸進入容器主體2100內部),有助於淨化效率的提升。Please refer to FIG. 14a to FIG. 14c at the same time. FIG. 14a and FIG. 14b respectively show a perspective view and a side view of another embodiment of the filter assembly, and FIG. 14c shows a schematic diagram of the filter assembly and the back plate of FIG. 14b. The area of the gas release surface 2310(i) of the filter element 2300(i) is larger than the area of the
請參照圖14d,繪示圖14c之過濾組件與背板於另一實施方式的示意圖。在不同的實施方式中,過濾組件2300(i)’的氣體釋放面2310(i)’具有與背板2150夾有一銳角的一平面。在這樣的實施例中,平面並非與背板2150平行,可以選擇性地朝向容器主體2100的頂面2110或底面2130傾斜,以調整氣體釋放面2310(i)’逸出氣體的角度。此處所述平面與背板2150之角度,可以視產品的需求或規格進行調整設計。Please refer to FIG. 14d , which shows a schematic view of another embodiment of the filter element and the back plate of FIG. 14c. In various embodiments, the gas release surface 2310(i)' of the filter assembly 2300(i)' has a plane forming an acute angle with the
請同時參照圖15a及圖15b,分別繪示又一實施例的過濾組件的立體圖及側視圖。過濾組件2300(ii)的氣體釋放面2310(ii)面積大於後開口2100b之面積。淨化氣體經由氣體釋放面2310(ii)均勻穩定地透出,從而進入容器主體2100的內部空間,以對於基板進行淨化操作。本實施例中,氣體釋放面2310(ii)通過後開口2100b朝向後蓋2500延伸(如沿著圖1及圖10所示的延伸方向D的相反方向),形成一彎曲輪廓,從而形成凹狀態,可以增加氣體釋放面2310(ii)的面積,有助於淨化效率的提升。Please refer to FIG. 15a and FIG. 15b at the same time, which respectively show a perspective view and a side view of a filter assembly in another embodiment. The area of the gas release surface 2310(ii) of the filter element 2300(ii) is larger than the area of the
請同時參照圖16a及圖16b,分別繪示再一實施例的過濾組件的立體圖及側視圖。過濾組件2300(iii)的氣體釋放面2310(iii)面積大於後開口2100b之面積。淨化氣體經由氣體釋放面2310(iii)均勻穩定地透出,從而進入容器主體2100的內部空間,以對於基板進行淨化操作。本實施例中,氣體釋放面2310(iii)通過後開口2100b朝向容器主體2100延伸(如沿著圖1及圖10所示的延伸方向D延伸),形成一彎曲輪廓,從而形成凸狀態,可以增加氣體釋放面2310(iii)的面積,有助於淨化效率的提升。Please refer to FIG. 16a and FIG. 16b at the same time, which respectively show a perspective view and a side view of a filter assembly according to another embodiment. The area of the gas release surface 2310(iii) of the filter element 2300(iii) is larger than the area of the
接著請同時參照圖17至圖19,圖17繪示圖1的後蓋、過濾組件及密封構件組裝前的示意圖,圖18繪示圖1的後蓋、過濾組件及密封構件組裝後的示意圖,圖19繪示沿圖18中剖面P2的立體剖面圖。本實施例中,後蓋2500具有朝容器主體2100凸出(如沿著圖1及圖10所示的延伸方向D凸出)的多個凸肋2510,用來抵接於過濾組件2300,多個凸肋2510為間隔配置以於其中形成多個凹槽2510a,導氣通道2140的出口2140a至少包括這些凹槽2150a。Then please refer to Fig. 17 to Fig. 19 at the same time, Fig. 17 depicts the schematic diagram of the rear cover, filter assembly and sealing member of Fig. 1 before assembly, Fig. 18 depicts the schematic diagram of the rear cover, filter assembly and sealing member of Fig. 1 after assembly, FIG. 19 is a perspective sectional view along the section P2 in FIG. 18 . In this embodiment, the
請參照圖1、圖10以及圖17至圖19。基板容器系統2000更包括一密封構件2700,具有一第一密封環部2710及一第二密封環部2720,第一密封環部2710佈置在後蓋2500與容器主體2100之間,第二密封環部2720佈置在過濾組件2300與容器主體2100之間。後蓋2500經由第一密封環部2710與容器主體2100建立密封地接合,過濾組件2300經由第二密封環部2720與容器主體2100對應後開口2100b之周圍部分建立密封地接合。藉由密封構件2700提供於容器主體2100與後蓋2500之間,讓兩者之間的導氣通道2140可以達成氣密,避免漏氣的情況發生,確保淨化氣體僅會透過過濾組件2300進入容器主體2100的內部空間。Please refer to FIG. 1 , FIG. 10 and FIG. 17 to FIG. 19 . The
接下來對於淨化氣體進入基板容器系統2000的入口端進行說明。請同時參照圖17至圖21,圖20繪示圖1的基板容器系統和剖面P3的示意圖,圖21繪示圖20沿剖面P3的剖面圖。基板容器系統2000的後蓋2500包括一進氣結構2540,彎曲地延伸在容器主體2100的底面2130下方,進氣結構2540包括與底面2130相對並且面朝下的一進氣埠2541,藉以連接於一外部淨化設備(圖式中未顯示此周邊元件)。進氣結構2540連通於導氣通道2140,且本實施例中進氣結構2540與導氣通道2140為成對配置,分別位在後開口2100b的相對兩側邊(如圖1及圖17所示)。Next, the inlet port where the purge gas enters the
基板容器系統2000更包括一氣閥組件2900,用以供淨化氣體通過,其中,進氣埠2541具有一連接結構2542,氣閥組件2900經由連接結構2542連接至進氣埠2541。The
請繼續參照圖21,淨化氣體經由氣閥組件2900進入進氣結構2540,接著沿著導氣通道2140朝上擴散(如圖中粗黑箭頭所示),接著通過導氣通道的出口2140a(圖21中未標示)進入緩衝室2340。淨化氣體在緩衝室2340中達到飽壓後,經由氣體釋放面2310均勻地朝向容器主體2100的內部空間透出。在容器主體2100的高度上,對應過濾組件2300位置所吹拂的淨化氣體流速,會高於其他部分的淨化氣體流速;亦即淨化氣體在不同高度具有不同的流速。以圖21的實施例為例,過濾組件2300位於容器主體2100的上半部分,因此淨化氣體於容器主體2100上半部分的流速高於下半部分的流速,如圖中容器主體2100內所繪示的上下兩個空心箭頭所示。在相同淨化氣體流量的條件下,相較於整面均勻地吹拂,本發明實施例以非整面吹拂使得上半部的流速高於下半部的流速,可以更有利地避免前門打開時,由上而下吹拂的門外氣體帶著灰塵、微粒或濕氣等污染物進入容器主體2100內,從而維持潔淨度以及減緩濕度回升。Please continue to refer to FIG. 21, the purified gas enters the
接下來對於氣閥組件2900進行說明。請同時參照圖22至圖24,圖22繪示依照本發明一實施例的氣閥組件的立體圖,圖23繪示氣閥組件沿圖22的剖面P4的剖面圖,圖24繪示氣閥組件組裝於進氣埠時的示意圖。氣閥組件2900包括一氣閥主體2930及一第一彈性材料2910。第一彈性材料2910設置於氣閥主體2930的一側,並且具有一翼片2911。當氣閥組件2900組裝在進氣埠2541的連接結構2542時,翼片2911發生形變,藉以與連接結構2542建立密封地接合。Next, the
於一實施例中,連接結構2542是一個套筒,用來供氣閥組件2900套接。翼片2911凸出於第一彈性材料2910外表面,並往外延伸一段距離,當組裝氣閥組件2900於連接結構2542時,翼片2911與連接結構2542發生干涉而彎折(如圖24所示),藉以讓翼片2911可以與連接結構2542建立密封地接合。In one embodiment, the
請參照圖23至圖25,圖25繪示圖22的氣閥組件的另一視角的立體圖。氣閥組件2900更包括一第二彈性材料2920,設置於氣閥主體2930之另一側,具有一對接面2921,用以供外部淨化設備對接,藉以形成密封地接合。本實施例中,第一彈性材料2910及第二彈性材料2920位於氣閥主體2930的相對兩側,利用第二彈性材料2920讓外部淨化設備與對接面2921密封接合,可以避免漏氣,有助於淨化操作的效率。Please refer to FIG. 23 to FIG. 25 , FIG. 25 is a perspective view showing another perspective of the air valve assembly in FIG. 22 . The
前述詳細說明所揭露的多個實施例,提供一種基板容器系統,包括:一容器主體,包括一頂面、與頂面相對之一底面,以及連接頂面與底面之一背板,容器主體具有一前開口及一後開口,前開口位於頂面與底面之間,用以供一基板通過,後開口位於背板,與前開口相對,其中,背板具有一第一高度,後開口具有小於第一高度之一第二高度;一過濾組件,覆蓋於後開口;以及,一後蓋,用以與容器主體建立密封地接合,後蓋與容器主體間形成一導氣通道,沿第一高度的方向延伸,後蓋與過濾組件共同定義了一緩衝室,導氣通道具有一出口,連接於緩衝室。容器主體的背板上具有後開口,後開口以非整面方式提供淨化氣體,讓容器主體的內部空間在高度方向上具有不同的淨化氣體流速,可以避免門外氣體帶著灰塵、微粒或濕氣等污染物進入容器主體內,維持潔淨度以及減緩濕度回升。The multiple embodiments disclosed in the foregoing detailed description provide a substrate container system, including: a container body including a top surface, a bottom surface opposite to the top surface, and a back plate connecting the top surface and the bottom surface, the container body has A front opening and a rear opening, the front opening is located between the top surface and the bottom surface for a substrate to pass through, the rear opening is located on the back plate, opposite to the front opening, wherein the back plate has a first height, and the rear opening has a height less than A second height of the first height; a filter assembly covering the rear opening; and a rear cover for establishing a sealing connection with the container body, an air guide channel is formed between the rear cover and the container body along the first height Extending in the direction, the rear cover and the filter assembly jointly define a buffer chamber, and the air guide channel has an outlet connected to the buffer chamber. There is a rear opening on the back plate of the main body of the container, and the rear opening provides the purified gas in a non-integral manner, so that the internal space of the main body of the container has different flow rates of the purified gas in the height direction, which can prevent the air outside the door from carrying dust, particles or moisture Such pollutants enter the main body of the container, maintain cleanliness and slow down the rise of humidity.
雖然本發明已以多個實施例揭露如上,然其並非用以限定本發明。任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種更動與潤飾,因此本發明之保護範圍當視後附申請專利範圍所界定者為準。Although the present invention has been disclosed above with a number of embodiments, it is not intended to limit the present invention. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.
2000:基板容器系統
2100:容器主體
2100a:前開口
2100b:後開口
2100b(i):後開口
2100b(ii):後開口
2100b(iii):後開口
2100b(iv):後開口
2110:頂面
2110(i):頂面
2110(ii):頂面
2110(iii):頂面
2110(iv):頂面
2130:底面
2140:導氣通道
2140a:出口
2150:背板
2170:側壁
2300:過濾組件
2300(i):過濾組件
2300(i)’:過濾組件
2300(ii):過濾組件
2300(iii):過濾組件
2310:氣體釋放面
2310(i):氣體釋放面
2310(i)’:氣體釋放面
2310(ii):氣體釋放面
2310(iii):氣體釋放面
2340:緩衝室
2500:後蓋
2510:凸肋
2510a:凹槽
2540:進氣結構
2541:進氣埠
2542:連接結構
2700:密封構件
2710:第一密封環部
2720:第二密封環部
2900:氣閥組件
2910:第一彈性材料
2911:翼片
2920:第二彈性材料
2921:對接面
2930:氣閥主體
D:延伸方向
H1:第一高度
H1(i):第一高度
H1(ii):第一高度
H1(iii):第一高度
H1(iv):第一高度
H2:第二高度
H2(i):第二高度
H2(ii):第二高度
H2(iii):第二高度
H2(iv):第二高度
P1:剖面
P2:剖面
P3:剖面
P4:剖面
2000: Substrate Container System
2100:
為讓本發明之上述以及其他特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 圖1繪示依照本發明一實施例的基板容器系統的立體爆炸圖; 圖2繪示圖1的容器主體的立體圖; 圖3繪示圖2的容器主體的示意圖; 圖4繪示容器主體沿圖3的剖面P1的剖面圖; 圖5繪示圖3的容器主體的後視圖; 圖6繪示依照本發明另一實施例的容器主體的後視圖; 圖7繪示依照本發明又一實施例的容器主體的後視圖; 圖8繪示依照本發明再一實施例的容器主體的後視圖; 圖9繪示依照本發明另一實施例的容器主體的後視圖; 圖10繪示圖1的基板容器系統組裝前的示意圖; 圖11繪示圖1的容器主體、密封構件以及過濾組件組裝後的示意圖; 圖12繪示圖1的基板容器系統組裝後的示意圖; 圖13a繪示圖1中過濾組件的立體圖; 圖13b繪示圖1中過濾組件的側視圖; 圖14a繪示另一實施例的過濾組件的立體圖; 圖14b繪示另一實施例的過濾組件的側視圖; 圖14c繪示圖14b之過濾組件與背板的示意圖; 圖14d繪示圖14c之過濾組件與背板於另一實施方式的示意圖; 圖15a繪示又一實施例的過濾組件的立體圖; 圖15b繪示又一實施例的過濾組件的側視圖; 圖16a繪示再一實施例的過濾組件的立體圖; 圖16b繪示再一實施例的過濾組件的側視圖; 圖17繪示圖1的後蓋、過濾組件及密封構件組裝前的示意圖; 圖18繪示圖1的後蓋、過濾組件及密封構件組裝後的示意圖; 圖19繪示沿圖18中剖面P2的立體剖面圖; 圖20繪示圖1的基板容器系統的示意圖; 圖21繪示圖20中沿剖面P3的剖面圖; 圖22繪示依照本發明一實施例的氣閥組件的立體圖; 圖23繪示氣閥組件沿圖22的剖面P4的剖面圖; 圖24繪示氣閥組件組裝於進氣埠時的示意圖;以及 圖25繪示圖22的氣閥組件的另一視角的立體圖。 In order to make the above and other features, advantages and embodiments of the present invention more comprehensible, the accompanying drawings are described as follows: FIG. 1 shows a three-dimensional exploded view of a substrate container system according to an embodiment of the present invention; Fig. 2 depicts a perspective view of the container body of Fig. 1; Fig. 3 depicts a schematic diagram of the container body of Fig. 2; Fig. 4 shows a sectional view of the container body along the section P1 in Fig. 3; Figure 5 depicts a rear view of the container body of Figure 3; Fig. 6 shows a rear view of a container body according to another embodiment of the present invention; Fig. 7 illustrates a rear view of a container body according to yet another embodiment of the present invention; Fig. 8 shows a rear view of a container body according to yet another embodiment of the present invention; Fig. 9 illustrates a rear view of a container body according to another embodiment of the present invention; FIG. 10 is a schematic diagram of the substrate container system shown in FIG. 1 before assembly; FIG. 11 is a schematic diagram of the assembled container body, sealing member and filter assembly of FIG. 1; FIG. 12 is a schematic diagram of the assembled substrate container system of FIG. 1; Figure 13a depicts a perspective view of the filter assembly in Figure 1; Figure 13b shows a side view of the filter assembly in Figure 1; Fig. 14a shows a perspective view of a filter assembly of another embodiment; Figure 14b shows a side view of another embodiment of the filter assembly; Fig. 14c shows a schematic diagram of the filter element and the back plate of Fig. 14b; Figure 14d shows a schematic view of another embodiment of the filter element and the back plate of Figure 14c; Fig. 15a shows a perspective view of a filter assembly according to another embodiment; Fig. 15b shows a side view of a filter assembly according to another embodiment; Fig. 16a shows a perspective view of a filter assembly according to yet another embodiment; Fig. 16b shows a side view of a filter assembly according to another embodiment; Fig. 17 is a schematic diagram showing the rear cover, filter assembly and sealing member of Fig. 1 before assembly; FIG. 18 is a schematic diagram of the assembled rear cover, filter assembly and sealing member of FIG. 1; Fig. 19 illustrates a perspective sectional view along section P2 in Fig. 18; FIG. 20 shows a schematic diagram of the substrate container system of FIG. 1; Fig. 21 depicts a sectional view along section P3 in Fig. 20; 22 is a perspective view of an air valve assembly according to an embodiment of the present invention; Fig. 23 shows a sectional view of the air valve assembly along the section P4 in Fig. 22; FIG. 24 shows a schematic view of the air valve assembly assembled in the air inlet port; and FIG. 25 is a perspective view of another viewing angle of the air valve assembly of FIG. 22 .
2000:基板容器系統 2000: Substrate Container System
2100:容器主體 2100: container body
2100a:前開口 2100a: front opening
2100b:後開口 2100b: Rear opening
2110:頂面 2110: top surface
2130:底面 2130: Bottom
2140:導氣通道 2140: Air channel
2150:背板 2150: Backplane
2170:側壁 2170: side wall
2300:過濾組件 2300: filter components
2500:後蓋 2500: back cover
2700:密封構件 2700: sealing member
2710:第一密封環部 2710: the first sealing ring part
2720:第二密封環部 2720:Second sealing ring part
D:延伸方向 D: Extension direction
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US17/363,328 US12017841B2 (en) | 2019-07-13 | 2021-06-30 | Substrate container system |
US17/363,328 | 2021-06-30 |
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TWI773536B TWI773536B (en) | 2022-08-01 |
TW202302425A true TW202302425A (en) | 2023-01-16 |
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TW110135309A TWI773536B (en) | 2021-06-30 | 2021-09-23 | Substrate container system |
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JP (1) | JP7458442B2 (en) |
KR (1) | KR20230005055A (en) |
CN (1) | CN113937041A (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2002122382A (en) | 2000-01-28 | 2002-04-26 | Ebara Corp | Substrate container |
JP2002170874A (en) | 2000-12-04 | 2002-06-14 | Ebara Corp | Substrate transport container |
JP2002176097A (en) | 2000-12-05 | 2002-06-21 | Ebara Corp | Substrate conveyance container and its usage |
TWI431712B (en) | 2011-09-20 | 2014-03-21 | Gudeng Prec Ind Co Ltd | Large-sized front opening unified wafer pod |
TWM489155U (en) | 2014-06-09 | 2014-11-01 | Gudeng Precision Industrial Co Ltd | Gas diffusion device of wafer pod |
US10312122B2 (en) | 2014-07-25 | 2019-06-04 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
JP6450156B2 (en) | 2014-11-12 | 2019-01-09 | ミライアル株式会社 | Gas purge filter |
JP6367153B2 (en) | 2015-06-09 | 2018-08-01 | 信越ポリマー株式会社 | Substrate storage container |
WO2018179964A1 (en) * | 2017-03-27 | 2018-10-04 | 信越ポリマー株式会社 | Substrate storage container |
WO2019012926A1 (en) * | 2017-07-14 | 2019-01-17 | 信越ポリマー株式会社 | Substrate-holding container |
JP6695945B2 (en) | 2018-09-05 | 2020-05-20 | 信越ポリマー株式会社 | Substrate storage container |
WO2020065968A1 (en) * | 2018-09-28 | 2020-04-02 | ミライアル株式会社 | Substrate accommodation container |
CN112289718A (en) | 2019-07-13 | 2021-01-29 | 家登精密工业股份有限公司 | Substrate carrier and gas diffusion module thereof |
US11104496B2 (en) | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
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2021
- 2021-09-17 CN CN202111096102.4A patent/CN113937041A/en active Pending
- 2021-09-23 TW TW110135309A patent/TWI773536B/en active
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CN113937041A (en) | 2022-01-14 |
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TWI773536B (en) | 2022-08-01 |
JP7458442B2 (en) | 2024-03-29 |
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