TW202300608A - 表面保護片材及處理方法 - Google Patents

表面保護片材及處理方法 Download PDF

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Publication number
TW202300608A
TW202300608A TW111105241A TW111105241A TW202300608A TW 202300608 A TW202300608 A TW 202300608A TW 111105241 A TW111105241 A TW 111105241A TW 111105241 A TW111105241 A TW 111105241A TW 202300608 A TW202300608 A TW 202300608A
Authority
TW
Taiwan
Prior art keywords
water
less
protection sheet
weight
surface protection
Prior art date
Application number
TW111105241A
Other languages
English (en)
Chinese (zh)
Inventor
熊倉健太
小坂尚史
清水陽介
島﨑雄太
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202300608A publication Critical patent/TW202300608A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111105241A 2021-03-25 2022-02-14 表面保護片材及處理方法 TW202300608A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021052064 2021-03-25
JP2021-052064 2021-03-25
JP2021151207 2021-09-16
JP2021-151207 2021-09-16
WOPCT/JP2022/003425 2022-01-28
PCT/JP2022/003425 WO2022201857A1 (ja) 2021-03-25 2022-01-28 表面保護シートおよび処理方法

Publications (1)

Publication Number Publication Date
TW202300608A true TW202300608A (zh) 2023-01-01

Family

ID=83396767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105241A TW202300608A (zh) 2021-03-25 2022-02-14 表面保護片材及處理方法

Country Status (3)

Country Link
JP (1) JPWO2022201857A1 (enrdf_load_stackoverflow)
TW (1) TW202300608A (enrdf_load_stackoverflow)
WO (1) WO2022201857A1 (enrdf_load_stackoverflow)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX169921B (es) * 1988-10-26 1993-07-30 Kimberly Clark Co Mejoras a material de hoja con adhesivo sensible ala presion y desprendible con agua
US5284690A (en) * 1992-11-03 1994-02-08 Rohm And Haas Company Aqueous release coating composition for pressure sensitive adhesives
JP2006241264A (ja) * 2005-03-02 2006-09-14 Kuramoto Sangyo:Kk 粘着組成物及びそれを用いた温水剥離型粘着シート
EP2379659A1 (en) * 2008-12-31 2011-10-26 3M Innovative Properties Company Stretch releasable adhesive tape
CN112920738B (zh) * 2018-02-05 2022-08-16 日东电工株式会社 粘合片及粘合片剥离方法
JP7441012B2 (ja) * 2019-08-02 2024-02-29 日東電工株式会社 粘着シート
JP7638618B2 (ja) * 2019-08-02 2025-03-04 日東電工株式会社 積層体および剥離方法

Also Published As

Publication number Publication date
JPWO2022201857A1 (enrdf_load_stackoverflow) 2022-09-29
WO2022201857A1 (ja) 2022-09-29

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