TW202300267A - 多軸工具機、其控制方法和相關配置 - Google Patents

多軸工具機、其控制方法和相關配置 Download PDF

Info

Publication number
TW202300267A
TW202300267A TW111134786A TW111134786A TW202300267A TW 202300267 A TW202300267 A TW 202300267A TW 111134786 A TW111134786 A TW 111134786A TW 111134786 A TW111134786 A TW 111134786A TW 202300267 A TW202300267 A TW 202300267A
Authority
TW
Taiwan
Prior art keywords
actuator
axis
workpiece
actuators
axis actuator
Prior art date
Application number
TW111134786A
Other languages
English (en)
Chinese (zh)
Inventor
廣 陸
Original Assignee
美商伊雷克托科學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商伊雷克托科學工業股份有限公司 filed Critical 美商伊雷克托科學工業股份有限公司
Publication of TW202300267A publication Critical patent/TW202300267A/zh

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/127Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/127Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
    • B23K26/128Laser beam path enclosures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/706Protective screens

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Numerical Control (AREA)
  • Laser Beam Processing (AREA)
  • Valve Device For Special Equipments (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
TW111134786A 2017-05-05 2018-05-04 多軸工具機、其控制方法和相關配置 TW202300267A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762502311P 2017-05-05 2017-05-05
US62/502,311 2017-05-05
US201762511072P 2017-05-25 2017-05-25
US62/511,072 2017-05-25

Publications (1)

Publication Number Publication Date
TW202300267A true TW202300267A (zh) 2023-01-01

Family

ID=64016684

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111134786A TW202300267A (zh) 2017-05-05 2018-05-04 多軸工具機、其控制方法和相關配置
TW107115277A TW201902605A (zh) 2017-05-05 2018-05-04 多軸工具、其控制方法和相關配置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107115277A TW201902605A (zh) 2017-05-05 2018-05-04 多軸工具、其控制方法和相關配置

Country Status (8)

Country Link
US (2) US20210276125A1 (https=)
EP (1) EP3618997A4 (https=)
JP (2) JP2020519446A (https=)
KR (2) KR20220116355A (https=)
CN (1) CN110573292A (https=)
SG (1) SG11201909363WA (https=)
TW (2) TW202300267A (https=)
WO (1) WO2018204241A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018213294A1 (en) * 2017-05-15 2018-11-22 The Trustees Of The University Of Pennsylvania Systems and methods for laser cleaving diamonds
EP3843942A4 (en) * 2018-10-16 2022-06-08 Electro Scientific Industries, Inc. FRAME AND OUTER COVER BAND FOR A LASER PROCESSING SYSTEM
JP7181790B2 (ja) * 2018-12-28 2022-12-01 株式会社キーエンス レーザ加工装置
JP6898366B2 (ja) * 2019-01-22 2021-07-07 ファナック株式会社 ロボット装置及び熱変位量推定装置
US12103110B2 (en) * 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
RU194549U1 (ru) * 2019-06-04 2019-12-13 Илья Андреевич Богданов Многофункциональный станок с числовым программным управлением
CN110883486B (zh) * 2019-12-24 2025-07-18 东莞市科泰汽车检夹具有限公司 一种用于工件焊接的定位装置
TWI718945B (zh) * 2020-05-12 2021-02-11 國立彰化師範大學 主動式恆定施力感測控制系統
US20230211437A1 (en) * 2020-07-15 2023-07-06 Fanuc Corporation Laser machining system
TWI738601B (zh) * 2020-07-28 2021-09-01 盟立自動化股份有限公司 工具的移動路徑的生成方法
TWI769915B (zh) 2021-08-26 2022-07-01 財團法人工業技術研究院 投射系統及應用其之投射校準方法
KR102570759B1 (ko) * 2022-06-30 2023-08-25 최병찬 레이저 절삭 가공장치 및 이의 가공방법
TWI843251B (zh) 2022-10-25 2024-05-21 財團法人工業技術研究院 目標追蹤系統及應用其之目標追蹤方法
TWI900227B (zh) * 2024-09-11 2025-10-01 中華精測科技股份有限公司 用於雷射加工的定位調整系統及其操作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833489B2 (ja) * 1993-09-27 1998-12-09 三菱電機株式会社 レーザ加工機
CN2216443Y (zh) * 1994-07-18 1996-01-03 王佛性 激光加工机的变焦距光学聚焦系统
JPH09122944A (ja) * 1995-10-26 1997-05-13 Amada Co Ltd レーザ加工機
US6528762B2 (en) * 2001-02-12 2003-03-04 W. A. Whitney Co. Laser beam position control apparatus for a CNC laser equipped machine tool
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
DE202004021725U1 (de) 2004-06-05 2010-07-15 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserbearbeitungsmaschine mit Strahldiagnosevorrichtung zur Bestimmung wenigstens eines Strahlkenndatums eines Laserstrahls an einer Laserbearbeitungsmaschine
JP5266647B2 (ja) * 2006-03-23 2013-08-21 日産自動車株式会社 レーザ溶接装置およびその調整方法
JP5201975B2 (ja) * 2007-12-14 2013-06-05 株式会社キーエンス レーザ加工装置、レーザ加工方法
US8392002B2 (en) 2010-10-14 2013-03-05 Delta Tau Data Systems, Inc. Hybrid machine control incorporating fast-tool servos
CN103212854B (zh) * 2012-01-19 2016-04-27 昆山思拓机器有限公司 激光切割加工方法
JP5994168B2 (ja) * 2012-03-26 2016-09-21 邦男 荒井 X、y独立駆動方式のレーザー加工装置
CN102773612B (zh) * 2012-06-07 2015-06-10 江阴德力激光设备有限公司 一种振镜式紫外激光切割晶圆芯片装置及其方法
US9718146B2 (en) * 2013-06-03 2017-08-01 Mitsubishi Electric Research Laboratories, Inc. System and method for calibrating laser processing machines
CN203719627U (zh) * 2014-01-20 2014-07-16 东莞市亿辉光电科技有限公司 全自动大平面三维影像测量仪
CN106794564B (zh) * 2015-06-22 2019-02-19 伊雷克托科学工业股份有限公司 多轴工具机及其控制方法
CN106392330B (zh) * 2016-06-13 2017-12-05 济南新天科技有限公司 大幅面分割拼接激光打标机

Also Published As

Publication number Publication date
KR102490377B1 (ko) 2023-01-19
US20210276125A1 (en) 2021-09-09
CN110573292A (zh) 2019-12-13
US20220410315A1 (en) 2022-12-29
KR20220116355A (ko) 2022-08-22
EP3618997A1 (en) 2020-03-11
SG11201909363WA (en) 2019-11-28
TW201902605A (zh) 2019-01-16
KR20190138876A (ko) 2019-12-16
JP2022169542A (ja) 2022-11-09
WO2018204241A1 (en) 2018-11-08
EP3618997A4 (en) 2021-06-02
JP2020519446A (ja) 2020-07-02

Similar Documents

Publication Publication Date Title
US20220410315A1 (en) Multi-axis machine tool, methods of controlling the same and related arrangements
JP7717128B2 (ja) 多軸工作機械
CA2924823C (en) Laser processing systems capable of dithering
JP5985834B2 (ja) 切替え可能なレーザシステムを有するレーザ加工装置及びレーザ加工方法
US20170320164A1 (en) Laser-assisted micromachining systems and methods