TW202300236A - Bearing device and equipment for silicon wafer cleaning and silicon wafer - Google Patents

Abstract

The embodiment of the invention discloses a bearing device and equipment for silicon wafer cleaning and a silicon wafer. The bearing device comprises a bearing frame which is composed of a plurality of supporting rods and used for bearing silicon wafers. Each supporting rod comprises a plurality of slots for inserting silicon wafers; a plurality of grooves are evenly distributed in the opposite sides of the inserting groove in the circumferential direction, and cleaning liquid is allowed to flow in the grooves.

Description

Carrying device, equipment and silicon wafer used for silicon wafer cleaning

Embodiments of the present invention belong to the technical field of semiconductors, and in particular relate to a carrying device, equipment and silicon wafers for cleaning silicon wafers.

Usually, silicon wafers used in the manufacture of semiconductor devices are produced after a series of production steps such as cutting, grinding, polishing, and epitaxial growth of single crystal silicon rods. During the above-mentioned production steps, due to reasons such as the silicon wafer itself or the external environment, it is easy to produce various foreign matter such as particle pollutants and metal ion impurities. These particle pollutants and metal ion impurities will pollute the silicon wafer, thereby causing semiconductor device production The yield rate is reduced. Therefore, in order to completely remove these foreign substances, it is necessary to use a cleaning device to clean and rinse the silicon wafer. In the silicon wafer cleaning process, the silicon wafer carrying device is one of the main tools of the cleaning device. The structure of the carrying device directly affects the cleaning quality of the silicon wafer. After the cleaning is completed, the above-mentioned foreign matter still exists on the surface of the silicon wafer.

In view of this, the embodiment of the present invention expects to provide a carrier device, equipment, and silicon wafer for cleaning silicon wafers; it can remove the residual pollutants on the support rods in the carrier device, and at the same time reduce the support of particle pollutants in the carrier device The accumulation rate on the rod increases the service life of the carrier and reduces the frequency of preventive maintenance (PM) for silicon wafer cleaning equipment.

The technical scheme of the embodiment of the present invention is realized like this: In a first aspect, an embodiment of the present invention provides a carrying device for cleaning silicon wafers, the carrying device includes a support frame for carrying silicon wafers composed of a plurality of support rods; each support rod includes: Multiple slots for inserting silicon chips; A plurality of grooves evenly distributed in the circumferential direction on opposite sides of the socket, the grooves allow the flow of cleaning fluid.

In a second aspect, an embodiment of the present invention provides a device for cleaning silicon wafers, which includes the carrying device according to the first aspect.

In a third aspect, an embodiment of the present invention provides a silicon wafer, which is obtained by cleaning the equipment according to the second aspect.

Embodiments of the present invention provide a carrying device, equipment, and silicon wafers for cleaning silicon wafers; the carrying device includes a support frame for carrying silicon wafers composed of a plurality of support rods; at the same time, for each support rod, By forming a plurality of grooves evenly distributed along the circumferential direction of the carrying device on the opposite side of each slot, in the process of cleaning the silicon wafer, the fluidity of the cleaning liquid can be improved and the residual pollutants on the surface of the support rod can be reduced , thereby improving the cleaning quality of silicon wafers.

In order for Ligui examiners to understand the technical characteristics, content and advantages of the present invention and the effects it can achieve, the present invention is hereby combined with the accompanying drawings and appendices, and is described in detail in the form of embodiments as follows, and the drawings used therein , the purpose of which is only for illustration and auxiliary instructions, and not necessarily the true proportion and precise configuration of the present invention after implementation, so it should not be interpreted based on the proportion and configuration relationship of the attached drawings, and limit the application of the present invention in actual implementation The scope is described first.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical" , "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description , rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the embodiments of the present invention, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense unless otherwise clearly specified and limited. Disassembled connection, or integration; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the art can understand the specific meanings of the above terms in the embodiments of the present invention according to specific situations.

At present, the related steps of silicon wafer cleaning in the conventional technical scheme include a cleaning step and a rinsing step, wherein the cleaning step mainly uses a cleaning solution to perform wet cleaning on the silicon wafer. In cleaning tank 1, spray standard cleaning solution 1 (standard cleaning-1, SC-1) and standard cleaning solution 2 (standard cleaning-2, SC-2) into cleaning tank 1 in order to clean silicon wafer W; Among them, SC-1 is usually a mixed solution of ammonia water and hydrogen peroxide, and SC-2 is usually a mixed solution of hydrochloric acid and hydrogen peroxide. The rinsing step is a production step set after the cleaning step. Specifically, as shown in FIG. The surface of the sheet was rinsed. It should be noted that in the cleaning step and the rinsing step, an ultrasonic cleaning method is used to remove particle pollutants and metal ion impurities remaining on the surface of the silicon wafer W to the greatest extent.

It should be noted that in the cleaning step and the rinsing step, the cleaning solution or rinsing solution used for a certain number of times will be discharged to the outside through the drain pipe (not shown) below the cleaning tank 1 or rinsing tank 2 respectively, and at the same time, the operator will Fill the inside of the cleaning tank 1 and the rinsing tank 2 with pollution-free new cleaning solution and new rinsing solution again to clean the next batch of silicon wafers W.

However, referring to Fig. 2 and Fig. 3, it shows a front view and a schematic diagram of a top view of the cleaning tank 1, wherein as shown in Fig. 2 and Fig. On the other hand, the tank body 21 is also provided with a carrying device 22A, wherein the carrying device 22A includes a carrying frame 31A composed of three support rods 311A, and the structure of each support rod 311A is specifically referred to in Figure 4 and Figure 5 , with reference to FIG. 4 and FIG. 5, it can be seen that each support rod 311A is provided with a plurality of slots 3111 so that each silicon wafer W can be inserted into the support rod 311A through the slots 3111 to be fixed, and for a support As far as the rod 311A is concerned, the distances between two adjacent slots 3111 are equal, and the slots 3111 on the three support rods 311A are all in one-to-one correspondence, and the slots of the three slots 3111 of the same silicon chip are inserted. The bottom is on the same arc surface, and the radius of the arc surface is equal to the radius of the inserted silicon wafer W. However, it can be understood that in the conventional technical solution, when the cleaning liquid is discharged through the discharge pipe (not shown) at the bottom of the cleaning tank 1, the pollutants in the cleaning liquid will remain on the surface of the support rod 311A, which is mainly due to the During the cleaning liquid discharge process, the support rod 311A provided in the tank body 21 slows down the flow of the cleaning liquid, causing the pollutants in the cleaning liquid to remain on the surface of the support rod 311A; it should be noted that even if the cleaning tank 1 is filled with For a new cleaning solution, the above pollutants will still remain in the new cleaning solution to contaminate the silicon wafer W during the subsequent cleaning process. Secondly, when the silicon wafer W is inserted into the support rod 311A through the slot 3111, under the impact of the cleaning liquid, particles are generated at the contact position between the silicon wafer W and the support rod 311A due to the influence of friction, as shown in Figure 6 7 and 7, which respectively show partial enlarged views of the contact positions. It can be understood that these contact positions are difficult to clean because the cleaning fluid cannot reach them, and thus a large amount of particulate matter is accumulated at these contact positions. During the cleaning process of the silicon wafer W, the particles accumulated at the contact position will not only affect the cleaning quality of the silicon wafer W, but also affect the service life of the support rod 311A, and further affect the service life of the supporting device 22A.

Based on the above description, the embodiment of the present invention expects to improve the carrying device 22A, so that the improved carrying device can speed up the flow of cleaning liquid to reduce the residual pollutants on the surface of the support rods, and at the same time reduce the gap between the silicon wafer W and the support rods. The particulate matter content and accumulation rate at the contact position. Specifically, as shown in FIG. 8 , it shows a carrying device 22 for cleaning a silicon wafer W provided by an embodiment of the present invention. The carrying device 22 includes a plurality of supporting rods 311 for carrying a silicon wafer The carrier frame 31 of W; each support rod 311 comprises: A plurality of slots 3111 for inserting silicon chips W; A plurality of grooves 3112 are evenly distributed along the circumferential direction on opposite sides of the slot 3111, and the cleaning liquid is allowed to flow in the grooves 3112.

For the carrying device 22 shown in FIG. 8 , a plurality of grooves 3112 are uniformly opened along the circumferential direction of the carrying device 22 on the opposite side of the slot 3111 to improve the flow of cleaning liquid during the cleaning of the silicon wafer W. performance, reducing the residual pollutants on the surface of the support rod 311. Of course, it can also be understood that the plurality of grooves 3112 provided in the support rod 311 can also speed up the flow of the cleaning liquid during the cleaning liquid discharge process, so as to reduce the pollutants attached to the surface of the support rod 311 .

For the carrying device 22 shown in FIG. 8, in some possible implementations, preferably, the width of the groove 3112 is not greater than the width of the slot 3111, and the depth of the groove 3112 is not greater than that of the slot 3111. depth.

For the carrying device 22 shown in FIG. 8 , in some possible implementations, preferably, the groove 3112 opens into the slot 3111 on the opposite side along the circumferential direction, so as to be connected to the slot 3111 on the opposite side Pass. As shown in Figure 9, in the embodiment of the present invention, in the specific implementation process, a corresponding groove 3112 can be provided on the opposite side of each slot 3111, and at the same time, in order to facilitate the processing of the groove 3112, it can be along the support The slot 3111 and the groove 3112 are simultaneously processed in the circumferential direction of the rod 311, so that the groove 3112 communicates with the slot 3111 and forms a circular distribution, so that on the basis of ensuring the stability of the silicon wafer W, the cleaning liquid can also be improved to the greatest extent. Fluidity, so that the cleaning solution at the position of each silicon wafer W can flow at the maximum flow rate, so that the cleaning quality of each silicon wafer W is improved.

On the other hand, for the carrying device 22 shown in FIG. 8, in some possible implementations, as shown in FIG. flow groove 3113, and the cleaning liquid is allowed to flow in the flow guide groove 3113. Specifically, as shown in FIG. 11 , diversion grooves 3113 are respectively opened at the contact positions of each silicon wafer W and each support rod 311, so as to maximize the improvement of the contact position of the silicon wafer W and the support rods 311. The fluidity of the cleaning liquid can clean the contact position of the silicon wafer W and the support rod 311 , thereby reducing the aggregation and accumulation rate of particles at the contact position of the silicon wafer W and the support rod 311 .

Preferably, for the above possible implementation manners, in some examples, as shown in FIG. 12 , each flow guide groove 3113 includes a straight flow groove 31131 and a multi-section branch flow groove 31132, so that the cleaning liquid passes through the straight flow groove After 31131, it flows through each section of the multi-section branched flow groove 31132. It can be understood that in order to improve the fluidity of the cleaning liquid, in the embodiment of the present invention, the number of multi-section branched flow grooves 31132 is not specifically limited. , the number of multi-section branched flow channels 31132 can be 3 as shown in Figure 12, or as shown in Figure 13, the number of multi-section branched flow channels 31132 is 5, and the specific number depends on the support rod The specific size of 311 is determined.

Preferably, for the above-mentioned possible implementations, in some examples, as shown in FIG. 14 , the diversion groove 3113 includes a straight flow groove 31131, a multi-section branch flow groove 31132 and a split flow groove 31133, so that the cleaning liquid passes through The straight flow groove 31131 reaches the split flow groove 31133 and flows through the multi-section branch flow grooves 31132. Understandably, in order to improve the cleaning fluidity at the contact position between the silicon wafer W and the support rod 311, It is also ensured that the silicon wafer W does not shake during the cleaning process, so a split flow tank 31133 can be added after the direct flow tank 31131 to ensure a stable flow rate of the cleaning solution flowing through the above contact position; similarly, in the above embodiment, The number of multi-node branched flow channels 31132 is not specifically limited, and the number of multi-node branched flow channels 31132 can be three as shown in Figure 14, or as shown in Figure 15, the number of multi-node branched flow channels 31132 The number of grooves 31132 is five, and the specific number is determined according to the specific size of the carrying device.

It should be noted that, in the embodiment of the present invention, only the carrying device 22A in the cleaning tank 1 is improved, but the improved carrying device 22 is also suitable for use in the rinsing tank 2 to fix the silicon wafer W and raise the silicon wafer W at the same time. Rinse quality of W.

Secondly, the embodiment of the invention also provides a device for cleaning silicon wafers, which includes the carrying device according to the aforementioned technical solution.

Finally, the embodiment of the invention also provides a silicon wafer, which is obtained by cleaning the equipment according to the aforementioned technical solution.

It should be noted that: the technical solutions described in the embodiments of the present invention can be combined arbitrarily if there is no conflict.

It should be noted that: the technical solutions described in the embodiments of the present invention can be combined arbitrarily if there is no conflict. The above are only preferred embodiments of the present invention, and are not used to limit the implementation scope of the present invention. If the present invention is modified or equivalently replaced without departing from the spirit and scope of the present invention, it shall be covered by the protection of the patent scope of the present invention. in the range.

1: cleaning tank 2: rinse tank 21: tank body 22: Carrying device 22A: Carrying device 31A: Carrier 311: support rod 311A: support rod 3111: slot 3112: Groove 3113: diversion groove 31131: DC tank 31132: branch launder W: Wafer

FIG. 1 is a schematic flow diagram of a production step process for cleaning silicon wafers provided by an embodiment of the present invention; Fig. 2 is a schematic top view schematic diagram of the structure of the cleaning tank in the conventional technical solution provided by the embodiment of the present invention; Fig. 3 is a schematic side view of the structure of the cleaning tank in the conventional technical solution provided by the embodiment of the present invention; Fig. 4 is a schematic front view of a support rod in a conventional technical solution provided by an embodiment of the present invention; Fig. 5 is a schematic top view of a support rod in a conventional technical solution provided by an embodiment of the present invention; Fig. 6 is a schematic diagram of a partial enlarged side view of the contact position between the silicon chip and the support rod in the conventional technical solution provided by the embodiment of the present invention; Fig. 7 is a schematic diagram of a partial enlarged top view of the contact position between the silicon chip and the support rod in the conventional technical solution provided by the embodiment of the present invention; Fig. 8 is a schematic structural diagram of a carrying device for silicon wafer cleaning provided by an embodiment of the present invention; Fig. 9 is a schematic diagram of the groove structure provided on the support rod provided by the embodiment of the present invention; Fig. 10 is a schematic structural diagram of a diversion groove opened in a support rod provided by an embodiment of the present invention; FIG. 11 is a schematic diagram of the positional relationship between the silicon chip and the diversion groove provided by the embodiment of the present invention; Fig. 12 is a schematic structural diagram of a diversion tank provided by an embodiment of the present invention; Fig. 13 is a schematic structural diagram of another diversion groove provided by an embodiment of the present invention; Fig. 14 is a schematic structural diagram of another diversion groove provided by an embodiment of the present invention; Fig. 15 is a schematic diagram of another diversion groove provided by an embodiment of the present invention.

1: cleaning tank

2: rinse tank

W: Wafer

Claims (8)

A carrying device for silicon wafer cleaning, the carrying device includes a support frame for carrying silicon wafers composed of a plurality of support rods; each support rod includes: Multiple slots for inserting silicon chips; A plurality of grooves evenly distributed in the circumferential direction on opposite sides of the socket, the grooves allow the flow of cleaning fluid. The carrying device for cleaning silicon wafers according to claim 1, wherein the width of the groove is not greater than the width of the slot, and the depth of the groove is not greater than the depth of the slot. The carrying device for silicon wafer cleaning as claimed in claim 1, wherein the groove opens into the slot on the opposite side along the circumferential direction, so as to communicate with the slot on the opposite side. The carrying device for cleaning silicon wafers as described in claim 1, wherein, at the contact position between each silicon wafer and the support rod, a diversion groove is respectively opened in the radial direction, and the diversion groove allows the Cleaning fluid flows. The carrying device for cleaning silicon wafers as described in claim 4, wherein each flow diversion groove includes a straight flow groove and a plurality of branch flow grooves, so that the cleaning liquid flows through the straight flow groove to each section The branched launder. The supporting device for silicon wafer cleaning as described in claim 4, wherein the diversion tank includes a straight-flow tank, a multi-section branched flow tank and a split-flow tank, so that the cleaning liquid reaches the split flow after passing through the straight-flow tank trough and flow through to each section of the branched flow trough. An equipment for cleaning silicon wafers, the equipment comprises the carrying device for cleaning silicon wafers according to any one of Claims 1 to 6. A silicon wafer, which is obtained by cleaning the silicon wafer cleaning equipment described in Claim 7.

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