TW202244965A - Electronic device and capacitor assembly package structure thereof - Google Patents

Abstract

An electronic device and a capacitor assembly package structure thereof are provided. The capacitor assembly package structure includes a capacitor assembly, an insulation package body and an electrode unit. The capacitor assembly includes a plurality of first capacitors. The electrode unit includes a first electrode structure and a second electrode structure. A side of a first positive portion of each of the first capacitors has a plurality of first protruding portions and a plurality of first concave portions. The first protruding portion has a first contact surface, and the first contact surface of the first protruding portion is exposed from a first side of the insulation package body and electrically connected to the first electrode structure. The first concave portion has a first concave surface, and the first concave surface of the first concave portion is covered by the insulation package body and does not contact the first electrode structure. Therefore, by virtue of using the first protruding portions and the first concave portions, a contact region and a path of water vapor of the first positive part and the first electrode structure can be decreased, so that water vapor proof effect of the capacitor assembly package structure and the electronic device can be improved.

Description

Packaging structure of electronic device and its capacitor assembly

The present invention relates to a packaging structure, in particular to a capacitor assembly packaging structure and an electronic device using the capacitor assembly packaging structure.

Capacitors have been widely used in basic components such as consumer appliances, computer motherboards and their peripherals, power supplies, communication products, and automobiles. Their main functions include filtering, bypassing, rectifying, coupling, decoupling, To become one of the indispensable components in electronic products. According to different materials and uses, capacitors include aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors, etc. In the prior art, solid electrolytic capacitors have the advantages of small size, large capacitance, and superior frequency characteristics, and can be applied to the decoupling function of the power supply circuit of the central processing unit. Generally speaking, a high-capacity solid electrolytic capacitor can be formed by stacking a plurality of capacitor units. A stacked solid electrolytic capacitor in the prior art includes a plurality of capacitor units and a lead frame. Each capacitor unit includes an anode portion, The cathode portion and the insulating portion, and the insulating portion electrically insulates the anode portion and the cathode portion from each other. In particular, the cathode parts of the capacitor units are stacked with each other, and a conductor layer is provided between two adjacent capacitor units, so that the plurality of capacitor units can be electrically connected to each other. However, the stacked capacitors in the prior art still have room for improvement.

The technical problem to be solved by the present invention is to provide an electronic device and a capacitor assembly packaging structure thereof in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a capacitor assembly packaging structure, which includes: a carrier substrate, a capacitor assembly, an insulating package, and an electrode unit. The carrier substrate includes an insulating body and a first conductive layer disposed on a surface of the insulating body. The capacitor assembly includes a plurality of first capacitors, the plurality of first capacitors are sequentially stacked on the insulating body and electrically connected to the first conductive layer, each first capacitor has a first positive portion and is electrically connected to the first conductive layer A first negative portion of the layer. The insulating package is disposed on the insulating body and covers the plurality of first capacitors. The electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating package and a first part of the insulating body, and the second electrode structure covers a second part of the insulating package part and a second part of the insulating body. Wherein, each first capacitor has a plurality of first protrusions and a plurality of first depressions on one end of the first positive portion. Wherein, each first protruding portion has a first contact surface, and the first contact surface of each first protruding portion is exposed from a first side surface of the insulating package and electrically contacts the first electrode structure. Wherein, each first recessed portion has a first recessed surface, and the first recessed surface of each first recessed portion is covered by an insulating package and does not contact the first electrode structure.

In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a capacitor assembly packaging structure, which includes: a capacitor assembly, an insulating packaging body, and an electrode unit. The capacitor assembly includes a plurality of first capacitors, and each first capacitor has a first positive portion and a first negative portion. The insulating package wraps the plurality of first capacitors. The electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating package, and the second electrode structure covers a second part of the insulating package. Wherein, each first capacitor has a plurality of first protrusions and a plurality of first depressions on one end of the first positive portion. Wherein, each first protruding portion has a first contact surface, and the first contact surface of each first protruding portion is exposed from a first side surface of the insulating package and electrically contacts the first electrode structure. Wherein, each first recessed portion has a first recessed surface, and the first recessed surface of each first recessed portion is covered by an insulating package and does not contact the first electrode structure.

In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide an electronic device, which includes: a circuit substrate structure, a capacitor assembly packaging structure, and two soldering materials. The circuit substrate structure has a positive pad and a negative pad. The capacitor assembly packaging structure is arranged on the circuit substrate structure. The two welding materials are disposed on the circuit substrate structure and electrically connected between the circuit substrate structure and the capacitor component package structure. The packaging structure of the capacitor assembly includes: a capacitor assembly, an insulating packaging body and an electrode unit. The capacitor assembly includes a plurality of first capacitors, and each first capacitor has a first positive portion and a first negative portion. The insulating package wraps the plurality of first capacitors. The electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating package, and the second electrode structure covers a second part of the insulating package. Wherein, each first capacitor has a plurality of first protrusions and a plurality of first depressions on one end of the first positive portion. Wherein, each first protruding portion has a first contact surface, and the first contact surface of each first protruding portion is exposed from a first side surface of the insulating package and electrically contacts the first electrode structure. Wherein, each first recessed portion has a first recessed surface, and the first recessed surface of each first recessed portion is covered by an insulating package and does not contact the first electrode structure.

One of the beneficial effects of the present invention is that an electronic device and its capacitor assembly packaging structure provided by the present invention can pass through "a plurality of first protrusions on one end of the first positive part of each first capacitor part and a plurality of first depressions (or each second capacitor has a plurality of second protrusions and a plurality of second depressions on one side of the second positive part of each second capacitor)", "each first protrusion The portion has a first contact surface, and the first contact surface of each first protruding portion is exposed from a first side of the insulating package and electrically contacts the first electrode structure (or each second protruding portion has a The second contact surface, and the second contact surface of each second protruding part is exposed from a first side surface of the insulating package and electrically contacts the first electrode structure)" and "each first concave part has a first a recessed surface, and the first recessed surface of each first recessed portion is covered by an insulating package without contacting the first electrode structure (or each second recessed portion has a second recessed surface, and each second recessed portion has a second recessed surface, and each second recessed portion The second concave surface of the concave part is covered by the insulating package and will not touch the first electrode structure)" to reduce the contact between the first positive electrode part of each first capacitor and the first electrode structure of the electrode unit area and water vapor path (or reduce the contact area and water vapor path between the second positive portion of each second capacitor and the first electrode structure of the electrode unit), thereby improving the water vapor effect of the packaging structure of the capacitor assembly and the electronic device.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following is an illustration of the implementation of the "electronic device and its capacitor assembly packaging structure" disclosed by the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

Referring to FIGS. 1 to 13 , the present invention provides a packaging structure of a capacitor assembly, which includes: a capacitor assembly 2 , an insulating packaging body 3 and an electrode unit 4 . The capacitor assembly 2 includes a plurality of first capacitors 21 , and each first capacitor 21 has a first positive portion 21P and a first negative portion 21N. The insulating package 3 is used to cover the plurality of first capacitors 21 . The electrode unit 4 includes a first electrode structure 41 and a second electrode structure 42 . The first electrode structure 41 is used to cover a first portion 301 of the insulating package 3 , and the second electrode structure 42 is used to cover a second portion 302 of the insulating package 3 . Furthermore, each first capacitor 21 has a plurality of first protrusions 2111 and a plurality of first depressions 2112 on one end of the first positive portion 21P. Each first protrusion 2111 has a first contact surface 21110, and the first contact surface 21110 of each first protrusion 2111 is exposed from a first side 3001 of the insulating package 3 and electrically contacts the first electrode Structure 41. Each first recessed portion 2112 has a first recessed surface 21120 , and the first recessed surface 21120 of each first recessed portion 2112 is covered by the insulating package 3 and does not contact the first electrode structure 41 .

[first embodiment]

Referring to FIGS. 1 to 6 , the first embodiment of the present invention provides a capacitor assembly packaging structure S, which includes: a carrier substrate 1 , a capacitor assembly 2 , an insulating package 3 and an electrode unit 4 .

Furthermore, as shown in FIG. 6 , the carrier substrate 1 includes an insulating body 10 and a first conductive layer 11 disposed on a surface of the insulating body 10 . For example, the insulating body 10 can be made of any insulating material (such as epoxy or silicon), and the first conductive layer 11 can be made of any conductive material. However, the above-mentioned example is only one possible embodiment, and it is not intended to limit the present invention.

Furthermore, as shown in FIG. 3 , FIG. 4 and FIG. 6 , the capacitor assembly 2 includes a plurality of first capacitors 21 . A plurality of first capacitors 21 are sequentially stacked on the insulating body 10 and electrically connected to the first conductive layer 11 , and each first capacitor 21 has a first positive portion 21P and is electrically connected to the first conductive layer 11 A first negative pole portion 21N. Furthermore, each first capacitor 21 has a plurality of first protrusions 2111 and a plurality of first depressions 2112 on one end of the first positive portion 21P. In addition, each first protruding portion 2111 has a first contact surface 21110, and the first contact surface 21110 of each first protruding portion 2111 is exposed from a first side 3001 of the insulating package 3 and is in electrical contact. The first electrode structure 41 . In addition, each first recessed portion 2112 has a first recessed surface 21120 , and the first recessed surface 21120 of each first recessed portion 2112 is covered by the insulating package 3 and does not contact the first electrode structure 41 . For example, a plurality of first protrusions 2111 and a plurality of first depressions 2112 can be alternately arranged on the side end of the first positive electrode portion 21P of the first capacitor 21, and the shape of the first protrusions 2111 is similar to a volcano. shape, and the first concave portion 2112 may be a semicircular perforation. However, the above-mentioned example is only one possible embodiment, and it is not intended to limit the present invention.

For example, as shown in FIG. 4 , each first capacitor 21 includes a metal foil 211 , an insulating surrounding layer 212 , a conductive polymer layer 213 , a carbon glue layer 214 and a silver glue layer 215 . Furthermore, the insulating surrounding layer 212 is disposed around a first portion 211A of the metal foil 211 , and the conductive polymer layer 213 covers the first portion 211A of the metal foil 211 and contacts the insulating surrounding layer 212 . In addition, the carbon glue layer 214 completely covers the conductive polymer layer 213 and contacts the insulating surrounding layer 212 , and the silver glue layer 215 completely covers the carbon glue layer 214 and contacts the insulating surrounding layer 212 . In addition, a second portion 211B of the metal foil 211 is not surrounded by the insulating surrounding layer 212 and is not covered by the conductive polymer layer 213, and the thickness T2 of the second portion 211B of the metal foil 211 can be equal to that of the metal foil The thickness T1 of the first portion 211A of 211 . It is worth noting that, as shown in FIG. 1 and FIG. 2 , a plurality of first protrusions 2111 (including a plurality of first contact surfaces 21110 ) and a plurality of first concave portions 2112 (including a plurality of first concave surfaces 21120 ) Both are pre-formed on the metal foil 211, and the outer surface of the metal foil 211 has an oxidized porous corrosion layer (not shown). However, the above-mentioned example is only one possible embodiment, and it is not intended to limit the present invention.

Furthermore, as shown in FIG. 5 and FIG. 6 , the insulating package 3 is disposed on the insulating body 10 and covers a plurality of first capacitors 21 , and the electrode unit 4 includes a first electrode structure 41 and a second electrode. structure42. Moreover, the first electrode structure 41 covers a first portion 301 of the insulating package 3 and a first portion 101 of the insulating body 10, and the second electrode structure 42 covers a second portion 302 of the insulating package 3 and the insulating body. A second part 102 of 10 . It is worth noting that the first side 3001 of the insulating package 3 , the first contact surface 21110 of each first protruding portion 2111 and a first side 1001 of the insulating body 10 are flush with each other, and one side of the insulating package 3 The second side 3002 , a conductive side 1100 of the first conductive layer 11 and a second side 1002 of the insulating body 10 are flush with each other.

For example, as shown in FIG. 5 and FIG. 6 , the first electrode structure 41 includes a first inner conductive layer electrically contacting a plurality of first protruding portions 2111 of the first anode portion 21P of each first capacitor 21 411, a first intermediate conductive layer 412 covering the first inner conductive layer 411 and a first outer conductive layer 413 covering the first intermediate conductive layer 412, and the first inner conductive layer 411 covers the insulating package 3 The first part 301 is connected to the first part 101 of the insulating body 10 . Moreover, the second electrode structure 42 includes a second inner conductive layer 421 electrically contacting the first conductive layer 11, a second intermediate conductive layer 422 covering the second inner conductive layer 421, and a second intermediate conductive layer covering the second intermediate conductive layer. 422 and a second outer conductive layer 423 , and the second inner conductive layer 421 covers the second portion 302 of the insulating package 3 and the second portion 102 of the insulating body 10 . It is worth mentioning that both the first internal conductive layer 411 and the second internal conductive layer 421 can be at least one of an Ag layer and a Cu layer (such as an Ag layer, a Cu layer, or a layer including an Ag layer and a Cu layer). Composite material layer) or other conductive materials, both the first intermediate conductive layer 412 and the second intermediate conductive layer 422 can be Ni layer or other conductive materials, and the first outer conductive layer 413 and the second outer conductive layer 423 Both can be Sn layers or other conductive materials. However, the above-mentioned example is only one possible embodiment, and it is not intended to limit the present invention.

Furthermore, as shown in FIG. 6 and FIG. 7, the first embodiment of the present invention provides an electronic device Z, which includes: a circuit substrate structure P, a capacitor assembly packaging structure S, and two solder materials M (such as tin balls, solder paste, or any conductive material). Furthermore, the circuit substrate structure P has a positive pad P1 and a negative pad P2, the capacitor assembly packaging structure S is disposed on the circuit substrate structure P, and the capacitor assembly packaging structure S includes a carrier substrate 1, a capacitor assembly 2. An insulating package 3 and an electrode unit 4 . Furthermore, two solder materials M are disposed on the circuit substrate structure P and electrically connected between the circuit substrate structure P and the capacitor assembly packaging structure S. As shown in FIG. One of the solder materials M can be used as an underfill to electrically connect between the positive electrode pad P1 and the first electrode structure 41, and the other solder material M can be used as another underfill to electrically connect the electrode structure 41. It is connected between the negative pad P2 and the second electrode structure 42 .

Thus, since the first contact surface 21110 of each first protruding portion 2111 will be exposed from a first side surface 3001 of the insulating package 3 and electrically contact the first electrode structure 41, and the first contact surface 2111 of each first concave portion 2112 The first concave surface 21120 will be covered by the insulating package 3 and will not contact the first electrode structure 41, so the distance between the first positive electrode portion 21P of each first capacitor 21 and the first electrode structure 41 of the electrode unit 4 The contact area can be reduced, thereby effectively reducing the moisture path between the first positive electrode portion 21P of each first capacitor 21 and the first electrode structure 41, so as to improve the waterproof effect of the capacitor assembly packaging structure S and the electronic device Z .

It should be noted that at least one first resistor can be further formed between the plurality of first protruding portions 2111 of the first positive electrode portion 21P of each first capacitor 21 and the first inner conductive layer 411 of the first electrode structure 41. Gas conductive layer. For example, the first gas barrier conductive layer may be Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn, or may also be an alloy (such as NiCr, TiW, TiN, TiC). However, the above-mentioned example is only one possible embodiment, and it is not intended to limit the present invention.

[Second embodiment]

Referring to FIG. 8 and FIG. 9 , the second embodiment of the present invention provides a capacitor assembly packaging structure S, which includes a carrier substrate 1 , a capacitor assembly 2 , an insulating package 3 and an electrode unit 4 . From the comparison of Fig. 8 with Fig. 3, and the comparison of Fig. 9 with Fig. 5, it can be seen that the biggest difference between the second embodiment of the present invention and the first embodiment lies in: in the second embodiment, the shape of the first protrusion 2111 It is a bump similar to a square or a rectangle, and the shape of the first concave portion 2112 is a groove similar to a square or a rectangle. However, the above-mentioned example is only one possible embodiment, and it is not intended to limit the present invention. For example, the shape of the first protruding portion 2111 can be a bump of any shape, and the shape of the first concave portion 2112 can be a groove of any shape.

[Third embodiment]

Referring to FIG. 10 and FIG. 11 , the third embodiment of the present invention provides a capacitor assembly packaging structure S, which includes a carrier substrate 1 , a capacitor assembly 2 , an insulating package 3 and an electrode unit 4 . From the comparison between Fig. 10 and Fig. 4, and the comparison between Fig. 11 and Fig. 6, it can be seen that the biggest difference between the third embodiment of the present invention and the first embodiment lies in: in the third embodiment, the second part of the metal foil 211 The thickness T2 of the metal foil 211B is smaller than the thickness T1 of the first portion 211A of the metal foil 211 .

Thereby, since the thickness T2 of the second portion 211B of the metal foil 211 is smaller than the thickness T1 of the first portion 211A of the metal foil 211, the first positive portion 21P of each first capacitor 21 is connected to the first electrode unit 4. The contact area between the electrode structures 41 can be reduced, thereby effectively reducing the water vapor path between the first positive electrode portion 21P of each first capacitor 21 and the first electrode structure 41, so as to improve the contact between the packaging structure S of the capacitor assembly and the electronics. Waterproof effect of device Z.

[Fourth embodiment]

Referring to FIG. 12 and FIG. 13 , the fourth embodiment of the present invention provides a capacitor assembly packaging structure S, which includes a carrier substrate 1 , a capacitor assembly 2 , an insulating package 3 and an electrode unit 4 . From the comparison of FIG. 12 with FIG. 4, and the comparison of FIG. 13 with FIG. 6, it can be seen that the biggest difference between the fourth embodiment of the present invention and the first embodiment is that in the fourth embodiment, the carrier substrate 1 includes A second conductive layer 12 is formed on the other surface of the housing 10 , the capacitor assembly 2 includes a plurality of second capacitors 22 , and the insulating package 3 is disposed on the insulating body 10 and covers the plurality of second capacitors 22 .

Furthermore, as shown in FIG. 12 and FIG. 13 , a plurality of second capacitors 22 are sequentially stacked on the insulating body 10 and electrically connected to the first conductive layer 12, and each second capacitor 22 has a first Two positive pole portions 22P and a second negative pole portion 22N electrically connected to the first conductive layer 12 . Furthermore, each second capacitor 22 has a plurality of second protrusions 2211 and a plurality of second depressions 2212 on one end of the second positive portion 22P. Each second protrusion 2211 has a second contact surface 22110, and the second contact surface 22110 of each second protrusion 2211 is exposed from the first side 3001 of the insulating package 3 and electrically contacts the first electrode Structure 41. In addition, each second recessed portion 2212 has a second recessed surface 22120 , and the second recessed surface 22120 of each second recessed portion 2212 is covered by the insulating package 3 and does not contact the first electrode structure 41 . It should be noted that the plurality of second protrusions 2211 (including the plurality of second contact surfaces 22110 ) and the plurality of second recesses 2212 (including the plurality of second recessed surfaces 22120 ) can be alternately arranged on the second capacitor 22 . On the side end of the second positive electrode portion 22P.

Thus, since the second contact surface 22110 of each second protruding portion 2211 is exposed from the first side surface 3001 of the insulating package 3 and electrically contacts the first electrode structure 41 , and the second contact surface 22110 of each second concave portion 2212 The two recessed surfaces 22120 will be covered by the insulating package 3 and will not contact the first electrode structure 41, so the contact between the second positive electrode portion 22P of each second capacitor 22 and the first electrode structure 41 of the electrode unit 4 The area can be reduced, thereby effectively reducing the moisture path between the second positive portion 22P of each second capacitor 22 and the first electrode structure 41 , so as to improve the waterproof effect of the capacitor assembly packaging structure S and the electronic device Z.

It should be noted that at least one second resistor can be further formed between the plurality of second protruding portions 2211 of the second positive electrode portion 22P of each second capacitor 22 and the first inner conductive layer 411 of the first electrode structure 41. Gas conductive layer. For example, the second gas barrier conductive layer can be Zn, Au, Pt, Pd, Ti, Ni, Ag, Cu, Cr or Sn, or can also be an alloy (such as NiCr, TiW, TiN, TiC). However, the above-mentioned example is only one possible embodiment, and it is not intended to limit the present invention.

[Advantageous Effects of Embodiment]

One of the beneficial effects of the present invention is that an electronic device Z and its capacitor assembly packaging structure S provided by the present invention can pass through "one side end of the first positive part 21P of each first capacitor 21 has a plurality of The first protrusion 2111 and the plurality of first depressions 2112 (or each second capacitor 22 has a plurality of second protrusions 2211 and a plurality of second depressions 2212 on one end of the second positive pole portion 22P )", "Each first protruding portion 2111 has a first contact surface 21110, and the first contact surface 21110 of each first protruding portion 2111 is exposed from a first side 3001 of the insulating package 3 and electrically Contact the first electrode structure 41 (or each second protruding portion 2211 has a second contact surface 22110, and the second contact surface 22110 of each second protruding portion 2211 is connected from a first side surface 3001 of the insulating package 3 exposed and electrically contacting the first electrode structure 41)" and "each first recessed portion 2112 has a first recessed surface 21120, and the first recessed surface 21120 of each first recessed portion 2112 is covered by the insulating package 3 without contacting the first electrode structure 41 (or each second recessed portion 2212 has a second recessed surface 22120, and the second recessed surface 22120 of each second recessed portion 2212 is covered by the insulating package 3 without will contact the first electrode structure 41)” to reduce the contact area and water vapor path between the first positive electrode portion 21P of each first capacitor 21 and the first electrode structure 41 of the electrode unit 4 (or reduce the water vapor path of each The contact area between the second positive portion 22P of the second capacitor 22 and the first electrode structure 41 of the electrode unit 4 and the moisture path), thereby improving the waterproof effect of the capacitor assembly packaging structure S and the electronic device Z.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

Z: electronic device P: circuit substrate structure P1: Positive pad P2: Negative pad M: welding material S: Capacitor assembly package structure 1: Carrier substrate 10: Insulation body 101: Part 1 102: Part Two 1001: first side 1002: second side 11: The first conductive layer 1100: conductive side 12: Second conductive layer 2: Capacitor components 21: First capacitor 21P: the first positive part 21N: the first negative part 2111: first protrusion 21110: first contact surface 2112: the first depression 21120: first recessed surface 211: metal foil 211A: Part I 211B: Part II 212: insulation surrounding layer 213: Conductive polymer layer 214: carbon glue layer 215: silver adhesive layer 22: Second capacitor 22P: the second positive part 22N: the second negative part 2211: second protrusion 22110: Second contact surface 2212: the second depression 22120: Second concave surface 3: Insulated package 301: Part 1 302: Part Two 3001: first side 3002: second side 4: Electrode unit 41: First electrode structure 411: the first internal conductive layer 412: the first intermediate conductive layer 413: the first outer conductive layer 42: Second electrode structure 421: Second inner conductive layer 422: the second intermediate conductive layer 423: second outer conductive layer T1: Thickness T2: Thickness

FIG. 1 is a schematic top view of a metal foil according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the metal foil according to the first embodiment of the present invention.

FIG. 3 is a schematic top view of a first capacitor according to the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a first capacitor according to the first embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of the packaging structure of the capacitor assembly according to the first embodiment of the present invention.

FIG. 6 is another schematic cross-sectional view of the packaging structure of the capacitor assembly according to the first embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view of the electronic device according to the first embodiment of the present invention.

FIG. 8 is a schematic top view of a first capacitor according to a second embodiment of the present invention.

9 is a schematic cross-sectional view of a packaging structure of a capacitor assembly according to a second embodiment of the present invention.

FIG. 10 is a schematic cross-sectional view of a first capacitor according to a third embodiment of the present invention.

FIG. 11 is a schematic cross-sectional view of a packaging structure of a capacitor assembly according to a third embodiment of the present invention.

12 is a schematic cross-sectional view of a first capacitor according to a fourth embodiment of the present invention.

FIG. 13 is a schematic cross-sectional view of a packaging structure of a capacitor assembly according to a fourth embodiment of the present invention.

S: Capacitor assembly package structure

1: Carrier substrate

10: Insulation body

101: Part 1

102: Part Two

1001: first side

1002: second side

11: The first conductive layer

1100: conductive side

2: Capacitor components

21: First capacitor

21P: the first positive part

21N: the first negative part

2111: first protrusion

21110: first contact surface

2112: the first depression

21120: first recessed surface

3: Insulated package

301: Part 1

302: Part Two

3001: first side

3002: second side

4: Electrode unit

41: First electrode structure

411: the first internal conductive layer

412: the first intermediate conductive layer

413: the first outer conductive layer

42: Second electrode structure

421: Second inner conductive layer

422: the second intermediate conductive layer

423: second outer conductive layer

Claims (10)

A capacitor assembly packaging structure, comprising: A carrier substrate, the carrier substrate includes an insulating body and a first conductive layer disposed on a surface of the insulating body; A capacitor assembly, the capacitor assembly includes a plurality of first capacitors, the plurality of first capacitors are sequentially stacked on the insulating body and electrically connected to the first conductive layer, each of the first capacitors having a first positive pole portion and a first negative pole portion electrically connected to the first conductive layer; an insulating package, the insulating package is disposed on the insulating body and covers a plurality of the first capacitors; and An electrode unit, the electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating package and a first part of the insulating body, and the The second electrode structure covers a second portion of the insulating package and a second portion of the insulating body; Wherein, each of the first capacitors has a plurality of first protrusions and a plurality of first depressions on one side of the first positive portion; Wherein, each of the first protrusions has a first contact surface, and the first contact surface of each of the first protrusions is exposed from a first side of the insulating package and is electrically conductive. contacting the first electrode structure; Wherein, each of the first recesses has a first recessed surface, and the first recessed surface of each of the first recesses is covered by the insulating package and will not touch the first electrode structure. The packaging structure of the capacitor assembly according to claim 1, wherein each of the first capacitors includes a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, the The insulating surrounding layer is disposed on a first part of the metal foil in a surrounding manner, the conductive polymer layer covers the first part of the metal foil and contacts the insulating surrounding layer, and the carbon glue layer is completely Covering the conductive polymer layer and contacting the insulating surrounding layer, and the silver adhesive layer completely covering the carbon adhesive layer and contacting the insulating surrounding layer; wherein, a second part of the metal foil Not surrounded by the insulating surrounding layer and not covered by the conductive polymer layer, and the thickness of the second part of the metal foil is equal to or smaller than that of the first part of the metal foil thickness; wherein, the first side of the insulating package, the first contact surface of each of the first protrusions and a first side of the insulating body are flush with each other, and the insulating A second side surface of the package body, a conductive side surface of the first conductive layer, and a second side surface of the insulating body are flush with each other. The capacitor assembly packaging structure according to claim 1, wherein the first electrode structure includes one of the plurality of first protrusions electrically contacting the first positive pole portion of each of the first capacitors A first inner conductive layer, a first middle conductive layer covering the first inner conductive layer, and a first outer conductive layer covering the first middle conductive layer, and the first inner conductive layer covers The first part of the insulating package and the first part of the insulating body; wherein, the second electrode structure includes a second inner conductive layer electrically contacting the first conductive layer, covering the A second middle conductive layer of the second inner conductive layer and a second outer conductive layer covering the second middle conductive layer, and the second inner conductive layer covers the first insulating package Two parts and the second part of the insulating body; wherein, both the first internal conductive layer and the second internal conductive layer are at least one of an Ag layer and a Cu layer, and the first Both the middle conductive layer and the second middle conductive layer are Ni layers, and both the first outer conductive layer and the second outer conductive layer are Sn layers. The capacitor assembly packaging structure according to claim 1, wherein the carrier substrate includes a second conductive layer disposed on the other surface of the insulating body; wherein the capacitor assembly includes a plurality of second capacitors, A plurality of the second capacitors are sequentially stacked on the insulating body and electrically connected to the second conductive layer, and each of the second capacitors has a second positive portion and is electrically connected to the first A second negative portion of two conductive layers; wherein, the insulating package is disposed on the insulating body and covers a plurality of second capacitors, and the second positive portion of each second capacitor There are a plurality of second protrusions and a plurality of second depressions on one side end; wherein, each of the second protrusions has a second contact surface, and each of the second protrusions The second contact surface is exposed from the first side of the insulating package and electrically contacts the first electrode structure; wherein each of the second recesses has a second recessed surface, and each The second concave surface of the second concave part is covered by the insulating package and will not contact the first electrode structure; wherein, the plurality of first protrusions and the plurality of first A concave part is alternately arranged on the side end of the first positive electrode part of the first capacitor, and a plurality of the second protrusions and a plurality of the second concave parts are alternately arranged on the first positive electrode part. On the side end of the second positive pole part of the second capacitor. A capacitor assembly packaging structure, comprising: a capacitor assembly comprising a plurality of first capacitors each having a first positive portion and a first negative portion; an insulating package enclosing a plurality of the first capacitors; and An electrode unit, the electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating package, and the second electrode structure covers the a second part of the insulating package; Wherein, each of the first capacitors has a plurality of first protrusions and a plurality of first depressions on one side of the first positive portion; Wherein, each of the first protrusions has a first contact surface, and the first contact surface of each of the first protrusions is exposed from a first side of the insulating package and is electrically conductive. contacting the first electrode structure; Wherein, each of the first recesses has a first recessed surface, and the first recessed surface of each of the first recesses is covered by the insulating package and will not touch the first electrode structure. The packaging structure of the capacitor assembly according to claim 5, wherein each of the first capacitors includes a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, the The insulating surrounding layer is disposed on a first part of the metal foil in a surrounding manner, the conductive polymer layer covers the first part of the metal foil and contacts the insulating surrounding layer, and the carbon glue layer is completely Covering the conductive polymer layer and contacting the insulating surrounding layer, and the silver adhesive layer completely covering the carbon adhesive layer and contacting the insulating surrounding layer; wherein, a second part of the metal foil Not surrounded by the insulating surrounding layer and not covered by the conductive polymer layer, and the thickness of the second part of the metal foil is equal to or smaller than that of the first part of the metal foil Thickness; wherein, the first side surface of the insulating package and the first contact surface of each of the first protrusions are flush with each other. The capacitor assembly packaging structure according to claim 5, wherein the first electrode structure includes one of the plurality of first protrusions electrically contacting the first positive pole portion of each of the first capacitors A first inner conductive layer, a first middle conductive layer covering the first inner conductive layer, and a first outer conductive layer covering the first middle conductive layer, and the first inner conductive layer covers The first part of the insulating package; wherein the second electrode structure includes a second inner conductive layer, a second intermediate conductive layer covering the second inner conductive layer, and a second intermediate conductive layer covering the second inner conductive layer. A second outer conductive layer of the middle conductive layer, and the second inner conductive layer covers the second part of the insulating package; wherein the first inner conductive layer and the second inner conductive layer Both are at least one of the Ag layer and the Cu layer, the first intermediate conductive layer and the second intermediate conductive layer are both Ni layers, and the first outer conductive layer and the second outer conductive layer The layers are all Sn layers. The capacitor assembly packaging structure according to claim 5, wherein the capacitor assembly includes a plurality of second capacitors, and each of the second capacitors has a second positive portion and a second negative portion; wherein, the The insulating package covers a plurality of the second capacitors, and each of the second capacitors has a plurality of second protrusions and a plurality of second depressions on one end of the second positive part; wherein , each of the second protrusions has a second contact surface, and the second contact surface of each of the second protrusions is exposed from the first side of the insulating package and electrically Contacting the first electrode structure; wherein, each of the second recesses has a second recessed surface, and the second recessed surface of each of the second recesses is covered by the insulating package will not contact the first electrode structure; wherein, a plurality of the first protrusions and a plurality of the first depressions are alternately arranged on the side of the first positive electrode portion of the first capacitor end, and a plurality of second protrusions and a plurality of second depressions are alternately arranged on the side end of the second positive pole portion of the second capacitor. An electronic device comprising: A circuit substrate structure, the circuit substrate structure has a positive pad and a negative pad; a capacitor assembly packaging structure disposed on the circuit substrate structure; and Two soldering materials, the two soldering materials are disposed on the circuit substrate structure and electrically connected between the circuit substrate structure and the capacitor assembly packaging structure; Wherein, the capacitor assembly packaging structure includes: a capacitor assembly comprising a plurality of first capacitors each having a first positive portion and a first negative portion; an insulating package enclosing a plurality of the first capacitors; and An electrode unit, the electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure covers a first part of the insulating package, and the second electrode structure covers the a second part of the insulating package; Wherein, each of the first capacitors has a plurality of first protrusions and a plurality of first depressions on one side of the first positive portion; Wherein, each of the first protrusions has a first contact surface, and the first contact surface of each of the first protrusions is exposed from a first side of the insulating package and is electrically conductive. contacting the first electrode structure; Wherein, each of the first recesses has a first recessed surface, and the first recessed surface of each of the first recesses is covered by the insulating package without contacting the first electrode structure. The electronic device according to claim 9, wherein the capacitor assembly includes a plurality of second capacitors, and each of the second capacitors has a second positive portion and a second negative portion; wherein the insulating package The body covers a plurality of the second capacitors, and each of the second capacitors has a plurality of second protrusions and a plurality of second depressions on one end of the second positive part; wherein, each One of the second protrusions has a second contact surface, and the second contact surface of each of the second protrusions is exposed from the first side of the insulating package and electrically contacts the The first electrode structure; wherein, each of the second recesses has a second recessed surface, and the second recessed surface of each of the second recesses is covered by the insulating package without contacting the first electrode structure; wherein, a plurality of the first protrusions and a plurality of the first depressions are alternately arranged on the side end of the first positive electrode portion of the first capacitor , and a plurality of the second protrusions and a plurality of the second depressions are alternately arranged on the side end of the second positive pole portion of the second capacitor.

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