TW202243811A - Dressing board and cutting blade trimming method enabling proper trimming of a cutting blade - Google Patents
Dressing board and cutting blade trimming method enabling proper trimming of a cutting blade Download PDFInfo
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- TW202243811A TW202243811A TW111115264A TW111115264A TW202243811A TW 202243811 A TW202243811 A TW 202243811A TW 111115264 A TW111115264 A TW 111115264A TW 111115264 A TW111115264 A TW 111115264A TW 202243811 A TW202243811 A TW 202243811A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
- B24B3/463—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades of slicing machine disc blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Abstract
Description
本發明是有關於一種可在切削被加工物之切削刀片的形狀之修正上使用之磨刀板、及使用了該磨刀板之切削刀片之修整方法。The present invention relates to a sharpening board that can be used for correcting the shape of a cutting blade for cutting a workpiece, and a method for dressing a cutting blade using the sharpening board.
可藉由將形成有複數個器件之晶圓分割並個體化,而製造各自具備器件之複數個器件晶片。又,可藉由將複數個器件晶片組裝在預定的基板上,並以由樹脂所構成之密封材(塑模樹脂)來被覆已組裝之器件晶片,而得到封裝基板。可藉由將此封裝基板分割並個體化,來製造經封裝化之各自具備複數個器件晶片之複數個封裝器件。器件晶片或封裝器件可組入行動電話、個人電腦等的各種電子機器上。A plurality of device wafers each having a device can be produced by dividing and individualizing a wafer formed with a plurality of devices. Also, a package substrate can be obtained by assembling a plurality of device chips on a predetermined substrate and covering the assembled device chips with a sealing material (molding resin) made of resin. A plurality of packaged devices each having a plurality of device chips can be manufactured by dividing and individualizing the package substrate. Device chips or packaged devices can be incorporated into various electronic machines such as mobile phones and personal computers.
在上述之晶圓、封裝基板等的被加工物之分割上,會使用切削裝置。切削裝置具備有保持被加工物之工作夾台、及對被加工物施行切削加工之切削單元,且可在切削單元裝設環狀的切削刀片。可藉由使切削刀片旋轉並切入已被工作夾台所保持之被加工物,而切削、分割被加工物。Cutting devices are used for the division of workpieces such as wafers and package substrates mentioned above. The cutting device is equipped with a chuck for holding the workpiece, and a cutting unit for cutting the workpiece, and the cutting unit can be equipped with a ring-shaped cutting blade. The workpiece can be cut and divided by rotating the cutting blade and cutting into the workpiece held by the chuck.
若繼續進行藉由切削刀片所進行之被加工物的切削,切削刀片的前端部會逐漸地磨耗,且切削刀片的前端面會變化成帶有圓角之形狀(R形狀)。並且,若以已磨耗之切削刀片將被加工物切削並分割成複數個晶片時,會有因切削刀片的R形狀反映於晶片而使晶片的形狀崩壞,且晶片的品質降低之疑慮。If the cutting of the workpiece by the cutting insert is continued, the front end of the cutting insert is gradually worn away, and the front end surface of the cutting insert changes into a rounded shape (R shape). In addition, if the workpiece is cut and divided into a plurality of wafers with worn cutting blades, the shape of the wafers may be broken due to the R-shape of the cutting blades being reflected on the wafers, and the quality of the wafers may be lowered.
因此,在藉由切削刀片切削被加工物之前,會實施刻意地磨耗切削刀片的前端部來修正切削刀片的形狀之修整。可藉由以下的作法來實施修整:藉由切削裝置的工作夾台來保持用於修整切削刀片之構件(磨刀板),並使切削刀片切入磨刀板。在例如專利文獻1中揭示有以下之手法:藉由使切削刀片切入已形成在磨刀板之凸部,來將切削刀片的前端面整形為平直。 先前技術文獻 專利文獻 Therefore, before the workpiece is cut by the cutting blade, dressing is performed to correct the shape of the cutting blade by deliberately abrading the tip portion of the cutting blade. Dressing can be carried out by holding a member (sharpening plate) for dressing the cutting blade by the work chuck of the cutting device, and cutting the cutting blade into the grinding plate. For example, Patent Document 1 discloses a method of shaping the front end surface of a cutting insert to be straight by cutting the cutting insert into a convex portion formed on a sharpening plate. prior art literature patent documents
專利文獻1:日本特開2019-18254號公報Patent Document 1: Japanese Patent Laid-Open No. 2019-18254
發明欲解決之課題The problem to be solved by the invention
如上述,在要將切削刀片的前端面整形為平直的情況下,可使用例如具有凸部之磨刀板。具有凸部之磨刀板是藉由以切削刀片切削平板狀之磨刀板,並在磨刀板的正面側形成複數條線狀之溝(凹部)而製造。此溝形成為比修整的實施時之切削刀片對磨刀板的切入深度更深。As described above, when the front end surface of the cutting insert is to be straightened, for example, a sharpening plate having a convex portion can be used. The sharpening plate having the convex portion is produced by cutting a flat sharpening plate with a cutting blade, and forming a plurality of linear grooves (recesses) on the front side of the sharpening plate. This groove is formed to be deeper than the cutting depth of the cutting blade into the sharpening plate at the time of dressing.
然而,若在磨刀板形成較深之溝,會有以下情形:磨刀板的剛性降低並且在磨刀板的正面側與背面側產生應力差,而在磨刀板產生翹曲。特別是,在為了材料的削減等而使用較薄的磨刀板的情況下,會變得更易於在形成溝時產生翹曲。其結果,會有以下情形:在無法藉由工作夾台來將磨刀板保持為平坦的情形下,使切削刀片正確地切入磨刀板的凸部會變得較困難。However, if deep grooves are formed in the sharpening plate, the rigidity of the sharpening plate decreases, and a stress difference occurs between the front side and the back side of the sharpening plate, causing the sharpening plate to warp. In particular, when a thin sharpening plate is used for material reduction or the like, warping becomes more likely to occur when grooves are formed. As a result, there may be a situation in which it becomes difficult to accurately cut the cutting blade into the convex portion of the sharpening plate when the sharpening plate cannot be held flat by the work chuck.
本發明是有鑒於所述之問題而作成之發明,目的在於提供一種可進行切削刀片的適當的修整之磨刀板、及使用了該磨刀板之切削刀片之修整方法。 用以解決課題之手段 The present invention was made in view of the aforementioned problems, and an object of the present invention is to provide a sharpening plate capable of proper dressing of a cutting blade, and a dressing method of a cutting blade using the sharpening blade. means to solve problems
根據本發明的一個態樣,可提供一種磨刀板,使用於切削刀片的形狀之修正,前述磨刀板包含:第1層,包含第1磨粒、與固定該第1磨粒之第1結合材;及複數個第2層,以夾著該第1層的方式積層於該第1層, 該第1層的厚度比該切削刀片的寬度更小,該第2層包含平均粒徑比該第1磨粒更小之第2磨粒、與固定該第2磨粒之第2結合材。 According to one aspect of the present invention, there is provided a sharpening plate for modifying the shape of a cutting blade, the aforementioned sharpening plate comprises: a first layer including first abrasive grains, and a first layer for fixing the first abrasive grains. a binder; and a plurality of second layers laminated on the first layer sandwiching the first layer, The thickness of the first layer is smaller than the width of the cutting insert, and the second layer includes second abrasive grains with an average particle diameter smaller than that of the first abrasive grains and a second bonding material that fixes the second abrasive grains.
再者,較佳的是,該第1磨粒以及該第2磨粒是綠碳化矽(green carborundum)或白剛鋁石(white alundum),該第1結合材以及該第2結合材是樹脂結合劑。又,較佳的是,該第1磨粒的平均粒徑是1μm以上且200μm以下,該第2磨粒的平均粒徑是0.1μm以上且20μm以下。Furthermore, preferably, the first abrasive grain and the second abrasive grain are green silicon carbide (green carborundum) or white alundum (white alundum), and the first bonding material and the second bonding material are resin Binding agent. Also, it is preferable that the average particle diameter of the first abrasive grains is not less than 1 μm and not more than 200 μm, and that the average particle diameter of the second abrasive grains be not less than 0.1 μm and not more than 20 μm.
又,根據本發明的其他的一個態樣,可提供一種磨刀板,使用於切削刀片的形狀之修正,前述磨刀板包含:第1層,包含磨粒、與固定該磨粒之結合材;及複數個第2層,以夾著該第1層的方式積層於該第1層, 該第1層的厚度比該切削刀片的寬度更小,該第2層不包含磨粒。 In addition, according to another aspect of the present invention, there is provided a sharpening plate for modifying the shape of a cutting blade, the aforementioned sharpening plate includes: a first layer containing abrasive grains, and a bonding material for fixing the abrasive grains ; and a plurality of second layers stacked on the first layer sandwiching the first layer, The thickness of the first layer is smaller than the width of the cutting insert, and the second layer does not contain abrasive grains.
此外,根據本發明的其他的一個態樣,可提供一種切削刀片之修整方法,使用磨刀板來修正切削刀片的形狀,前述切削刀片之修整方法包含以下步驟: 保持之步驟,藉由工作夾台來保持該磨刀板,該磨刀板包含第1層與複數個第2層,前述第1層包含第1磨粒與固定該第1磨粒之第1結合材,前述複數個第2層以夾著該第1層的方式積層於該第1層,該第1層的厚度比該切削刀片的寬度更小,該第2層包含平均粒徑比該第1磨粒更小之第2磨粒、與固定該第2磨粒之第2結合材,且是以該第1層以及該第2層露出之面成為上表面之方式來藉由該工作夾台保持該磨刀板;及 修正之步驟,使該切削刀片與該磨刀板相對地移動而使該切削刀片的前端部沿著該第1層朝該磨刀板的上表面側切入,藉此使該切削刀片的下表面接觸於該第1層,並且使該切削刀片的前端部的兩側面接觸於該第2層,來修正該切削刀片的前端部的形狀。 In addition, according to another aspect of the present invention, a method for trimming a cutting blade can be provided, using a sharpening plate to modify the shape of the cutting blade, the method for trimming the cutting blade includes the following steps: In the step of holding, the sharpening plate is held by a work clamp, and the sharpening plate includes a first layer and a plurality of second layers. The first layer includes the first abrasive grains and the first abrasive grains that fix the first abrasive grains. In the binder, the plurality of second layers are laminated on the first layer with the first layer sandwiched therebetween, the thickness of the first layer is smaller than the width of the cutting insert, and the second layer contains The second abrasive grains, which are smaller than the first abrasive grains, and the second bonding material that fixes the second abrasive grains, and the exposed surface of the first layer and the second layer become the upper surface through the work. a clamping table holds the sharpening plate; and The correction step is to move the cutting blade relative to the sharpening plate so that the front end portion of the cutting blade cuts into the upper surface side of the sharpening plate along the first layer, thereby making the lower surface of the cutting blade The shape of the front end of the cutting insert is corrected by contacting the first layer and bringing both side surfaces of the front end of the cutting insert into contact with the second layer.
此外,根據本發明的其他的一個態樣,可提供一種切削刀片之修整方法,使用磨刀板來修正切削刀片的形狀,前述切削刀片之修整方法包含以下步驟: 保持之步驟,藉由工作夾台來保持該磨刀板,該磨刀板包含第1層與複數個第2層,前述第1層包含磨粒與固定該磨粒之結合材,前述複數個第2層以夾著該第1層的方式積層於該第1層,該第1層的厚度比該切削刀片的寬度更小,該第2層不包含磨粒,且是以該第1層以及該第2層露出之面成為上表面之方式來藉由該工作夾台保持該磨刀板;及 修正之步驟,使該切削刀片與該磨刀板相對地移動而使該切削刀片的前端部沿著該第1層朝該磨刀板的上表面側切入,藉此使該切削刀片的下表面接觸於該第1層,並且使該切削刀片的前端部的兩側面接觸於該第2層,而修正該切削刀片的前端部的形狀。 發明效果 In addition, according to another aspect of the present invention, a method for trimming a cutting blade can be provided, using a sharpening plate to modify the shape of the cutting blade, the method for trimming the cutting blade includes the following steps: In the step of holding, the sharpening plate is held by the working clamping platform, and the sharpening plate includes a first layer and a plurality of second layers, the first layer includes abrasive grains and a binding material for fixing the abrasive grains, and the aforementioned plurality of layers The second layer is laminated on the first layer so as to sandwich the first layer, the thickness of the first layer is smaller than the width of the cutting insert, the second layer does not contain abrasive grains, and is based on the first layer and the way that the exposed surface of the second layer becomes the upper surface to hold the sharpening plate by the work holder; and The correction step is to move the cutting blade relative to the sharpening plate so that the front end portion of the cutting blade cuts into the upper surface side of the sharpening plate along the first layer, thereby making the lower surface of the cutting blade contacting the first layer, and bringing both side surfaces of the tip end of the cutting insert into contact with the second layer, thereby correcting the shape of the tip end of the cutting insert. Invention effect
本發明的一個態樣之磨刀板包含第1層與複數個第2層而構成,前述第1層包含磨粒,前述複數個第2層以夾著第1層的方式積層於第1層。藉此,變得可在不用事先在磨刀板形成較深之溝的情形下實施切削刀片之修整,而可抑制磨刀板之翹曲的產生。其結果,可以藉由工作夾台適當地保持磨刀板,而適當地實施切削刀片的形狀之修正。A sharpening plate according to one aspect of the present invention includes a first layer and a plurality of second layers, the first layer contains abrasive grains, and the plurality of second layers are laminated on the first layer so as to sandwich the first layer . This makes it possible to perform dressing of the cutting insert without forming deep grooves on the sharpening plate in advance, thereby suppressing occurrence of warping of the sharpening plate. As a result, the shape of the cutting insert can be properly corrected by properly holding the sharpening plate by the chuck.
用以實施發明之形態form for carrying out the invention
以下,參照附加圖式來說明本發明的實施形態。首先,針對本實施形態之磨刀板的構成例作說明。本實施形態之磨刀板是使用於切削刀片之整形(修整)。切削刀片是切入被加工物來切削被加工物之環狀的加工工具。Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. First, a configuration example of the sharpening plate of this embodiment will be described. The sharpening plate of this embodiment is used for shaping (dressing) of cutting blades. The cutting insert is a ring-shaped machining tool that penetrates into a workpiece to cut the workpiece.
作為可藉由切削刀片來切削之被加工物的例子,可列舉圓盤狀的矽晶圓。例如矽晶圓可被以相互交叉的方式配置排列成格子狀之複數條切割道(分割預定線)區劃成複數個矩形狀的區域。又,於藉由切割道所區劃出之區域各自形成有IC(積體電路,Integrated Circuit)、LSI(大型積體電路,Large Scale Integration)、LED(發光二極體,Light Emitting Diode)、MEMS(微機電系統,Micro Electro Mechanical Systems)器件等的器件。可藉由將此矽晶圓以切削刀片來切削並沿著切割道分割,而製造各自具備器件之複數個器件晶片。An example of a workpiece that can be cut by a cutting blade is a disk-shaped silicon wafer. For example, a silicon wafer can be divided into a plurality of rectangular regions by a plurality of dicing lines (planned dividing lines) arranged in a grid-like manner in an intersecting manner. In addition, IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), MEMS are respectively formed in the area demarcated by the dicing line. (Micro Electro Mechanical Systems, Micro Electro Mechanical Systems) devices and other devices. A plurality of device wafers each having a device can be produced by cutting the silicon wafer with a cutting blade and dividing it along dicing lines.
但是,對被加工物的材質、形狀、構造、大小等並無限制。例如被加工物亦可為以矽以外之半導體(砷化鎵(GaAs)、磷化銦(InP)、氮化鎵(GaN)、碳化矽(SiC)等)、玻璃、陶瓷、樹脂、金屬等所構成之晶圓。又,對形成於被加工物之器件的種類、數量、形狀、構造、大小、配置等也無限制,在被加工物上亦可未形成有器件。此外,被加工物亦可為CSP(晶片尺寸封裝,Chip Size Package)基板、QFN(方形扁平無引線封裝,Quad Flat Non-leaded package)基板等之封裝基板。However, there are no limitations on the material, shape, structure, size, etc. of the workpiece. For example, the workpiece can also be semiconductors other than silicon (gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), etc.), glass, ceramics, resin, metal, etc. composed of wafers. Also, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of the devices formed on the workpiece, and no devices may be formed on the workpiece. In addition, the processed object can also be a package substrate such as a CSP (Chip Size Package) substrate, a QFN (Quad Flat Non-leaded package) substrate, or the like.
在以切削刀片加工被加工物之時,首先會實施切削刀片的修整。修整是藉由以下作法來進行:使切削刀片旋轉,並使切削刀片的前端部切入磨刀板。藉此,切削刀片的前端部會和磨刀板接觸而磨耗,而可修正切削刀片之前端面的形狀。When machining a workpiece with a cutting insert, dressing of the cutting insert is performed first. Dressing is performed by rotating the cutting blade and cutting the front end of the cutting blade into the sharpening plate. Accordingly, the front end portion of the cutting insert is worn by contact with the sharpening plate, and the shape of the front end surface of the cutting insert can be corrected.
圖1是顯示磨刀板11的立體圖。磨刀板11是使用於切削刀片之修整的長方體形的構件,且包含複數個第1層13與複數個第2層15。第1層13以及第2層15是形成為矩形狀之板狀的構件,且在磨刀板11的厚度方向(第1層13及第2層15的厚度方向)上交互地積層。FIG. 1 is a perspective view showing a sharpening
第1層13包含磨粒(第1磨粒)與固定磨粒之結合材(第1結合材)。又,第2層15包含磨粒(第2磨粒)與固定磨粒之結合材(第2結合材)。作為第1磨粒及第2磨粒,可以使用綠碳化矽(GC)、白剛鋁石(WA)等。The
再者,包含於第2層15之磨粒(第2磨粒)的平均粒徑會比包含於第1層13之磨粒(第1磨粒)的平均粒徑更小。例如,第1磨粒的平均粒徑是1μm以上且200μm以下,第2磨粒的平均粒徑是0.1μm以上且20μm以下。Furthermore, the average particle diameter of the abrasive grains (second abrasive grains) contained in the
可以使用以樹脂構成之樹脂結合劑、或以陶瓷構成之陶瓷結合劑來作為第1結合材及第2結合材。特別是,若使用樹脂結合劑來作為第1結合材及第2結合材,因為可抑制使切削刀片切入磨刀板11時的切削刀片之損壞,因而較佳。A resin bond made of resin or a vitrified bond made of ceramics can be used as the first bonding material and the second bonding material. In particular, it is preferable to use a resin bond as the first bonding material and the second bonding material because damage to the cutting blade when the cutting blade is cut into the sharpening
例如,可藉由使磨粒含浸於酚樹脂、環氧樹脂等的樹脂後,將樹脂成形為板狀並以預定的溫度(例如150℃以上且約200℃以下)進行燒成,而形成板狀之第1層13及第2層15。再者,若在第1層13及第2層15已包含有磨粒,樹脂結合劑的流動性會降低,而變得容易維持第1層13及第2層15的形狀。For example, a plate can be formed by impregnating abrasive grains with a resin such as phenol resin or epoxy resin, then molding the resin into a plate shape and firing at a predetermined temperature (for example, 150°C or higher and about 200°C or lower). The
圖2(A)是顯示第1層13及第2層15的立體圖。例如磨刀板11可藉由將大型的第1層13以及第2層15交互地積層後,將第1層13及第2層15同時切斷來製造。FIG. 2(A) is a perspective view showing the
第1層13包含相互大致平行之矩形狀的第1面(正面)13a以及第2面(背面)13b。同樣地,第2層15包含相互大致平行之矩形狀的第1面(正面)15a以及第2面(背面)15b。並且,第2層15以夾著第1層13的方式積層於第1層13。具體而言,是在第1層13的第1面13a側固定第2層15的第2面15b側,且在第1層13的第2面13b側固定第2層15的第1面15a側。例如,可將第1層13與第2層15透過接著劑來貼合。The
圖2(B)是顯示已交互地積層之第1層13以及第2層15的立體圖。可藉由以切削刀片等將已積層之第1層13以及第2層15同時切斷,而獲得所期望的形狀及尺寸之磨刀板11。FIG. 2(B) is a perspective view showing the
此外,積層之第1層13以及第2層15之層數沒有限制。不過,磨刀板11的最上層與最下層是設為第2層15。藉此,成為所有的第1層13均被第2層15夾住之構造。又,如後述,第1層13被利用在切削刀片的前端面的整形。因此,第1層13之層數宜為2以上。藉此,變得可使用1片磨刀板11來實施複數次切削刀片的前端面的整形。In addition, the number of layers of the
如圖1所示,磨刀板11包含相互大致平行之第1面(正面)11a與第2面(背面)11b。第1面11a相當於最上層的第2層15的第1面15a,第2面11b相當於最下層的第2層15的第2面15b。As shown in FIG. 1 , the sharpening
又,磨刀板11包含連接於第1面11a以及第2面11b的長邊之一對第3面(側面)11c、與連接於第1面11a以及第2面11b的短邊之一對第4面(側面)11d。一對第3面11c是和磨刀板11的長度方向(第1層13以及第2層15的長度方向)以及磨刀板11的厚度方向大致平行之矩形狀的平坦面。又,一對第4面是和磨刀板11的寬度方向(第1層13以及第2層15的寬度方向)以及磨刀板11的厚度方向大致平行之矩形狀的平坦面。Moreover, the sharpening
在第3面11c以及第4面11d中,露出有第1層13的側面以及第2層15的側面。因此,於第3面11c以及第4面11d顯現有藉由將第1層13的側面以及第2層15的側面交互地配置排列而形成之週期性的條紋圖樣(橫條紋圖樣)。The side surfaces of the
可利用上述之磨刀板11來進行切削刀片的修整。在進行切削刀片之修整時,首先是藉由環狀的框架來支撐磨刀板11。圖3是顯示被環狀的框架17所支撐之磨刀板11的立體圖。The above-mentioned sharpening
框架17是以例如SUS(不鏽鋼)等的金屬所構成。在框架17的中央部設有在厚度方向上貫通框架17之圓形的開口17a。再者,開口17a的直徑比磨刀板11的各邊的長度更大。並且,可將磨刀板11配置在開口17a的內側。The
可在磨刀板11以及框架17貼附膠帶19。具體而言,是將膠帶19的中央部貼附於磨刀板11,且將膠帶19的外周部貼附於框架17。其結果,磨刀板11透過膠帶19而受到框架17所支撐。An
膠帶19包含形成為圓形之薄膜狀的基材、與設置在基材上之黏著層(糊層)。例如,基材是以聚烯烴、聚氯乙烯、聚對苯二甲酸乙二酯等之樹脂所構成,黏著層是以環氧系、丙烯酸系、或橡膠系之接著劑等所構成。又,黏著層亦可是會因紫外線的照射而硬化之紫外線硬化型的樹脂。The
再者,磨刀板11是配置成可在一對第3面11c的其中一面貼附膠帶19。因此,磨刀板11是以呈現條紋圖樣之一對第3面11c的另一面露出於上方,且第1面11a、第2面11b以及呈現條紋圖樣之一對第4面11d露出於側邊的狀態受到框架17支撐。In addition, the sharpening
可藉由使切削刀片切入已受到框架17支撐之磨刀板11,來進行切削刀片之修整。在切削刀片的修整上,可使用切削裝置。圖4是顯示切削裝置2的立體圖。再者,在圖4中,X軸方向(加工進給方向、第1水平方向)與Y軸方向(分度進給方向、第2水平方向)是相互垂直之方向。又,Z軸方向(鉛直方向、上下方向、高度方向)是和X軸方向以及Y軸方向垂直之方向。Dressing of the cutting blade can be performed by cutting the cutting blade into the sharpening
切削裝置2具備可保持被加工物以及磨刀板11之工作夾台(保持工作台)4。工作夾台4的上表面是和水平方向(XY平面方向)大致平行的平坦面,並構成保持被加工物或磨刀板11之保持面4a(參照圖5)。保持面4a已透過形成於工作夾台4的內部之流路(未圖示)、閥(未圖示)等而連接到噴射器等之吸引源(未圖示)。The
工作夾台4已和移動機構(未圖示)與旋轉驅動源(未圖示)連接,前述移動機構是使工作夾台4沿著X軸方向移動之滾珠螺桿式的機構,前述旋轉驅動源是使工作夾台4以繞著和Z軸方向大致平行之旋轉軸的方式旋轉之馬達等的驅動源。又,在工作夾台4的周圍設置有可保持並固定框架17之複數個夾具6(參照圖5)。The working clamp table 4 has been connected with a moving mechanism (not shown) and a rotary drive source (not shown). The aforementioned moving mechanism is a ball screw type mechanism that moves the working clamping table 4 along the X-axis direction. The aforementioned rotating drive source It is a drive source such as a motor that rotates the
在工作夾台4的上方,設置有可切削被加工物以及磨刀板11之切削單元8。切削單元8具備圓柱狀的殼體10,在殼體10容置有沿著Y軸方向配置之圓柱狀的主軸12(參照圖5)。主軸12的前端部(一端部)已露出於殼體10的外部,且在主軸12的基端部(另一端部)連接有馬達等的旋轉驅動源。Above the work clamping table 4, a
在主軸12的前端部可裝設切削被加工物之環狀的切削刀片14。切削刀片14藉由從旋轉驅動源透過主軸12所傳達之動力,而繞著和Y軸方向大致平行之旋轉軸旋轉。A ring-shaped
可使用例如輪轂型的切削刀片(輪轂型刀片)來作為切削刀片14。輪轂型刀片是使以金屬等所構成之環狀的基台、與沿著基台的外周緣所形成之環狀的切刃一體化而成之切削刀片。輪轂型刀片的切刃可以藉由電鑄磨石來構成,前述電鑄磨石包含以鑽石、立方氮化硼(cBN:cubic Boron Nitride)等所構成之磨粒、與固定磨粒之鎳鍍敷層等的結合材。As the cutting
不過,也可以使用墊圈型的切削刀片(墊圈型刀片)來作為切削刀片14。墊圈型刀片是僅藉由環狀的切刃來構成,前述環狀的切刃包含磨粒、固定磨粒之結合材(金屬結合劑、樹脂結合劑、陶瓷結合劑(vitrified bond)等)。However, a washer-type cutting insert (washer-type insert) may also be used as the cutting
當將切削刀片14裝設於切削單元8時,切削刀片14會被固定於殼體10之刀片蓋16所覆蓋。刀片蓋16具備已連接於可供給純水等的切削液之管件(未圖示)之一對連接部18、及連接於一對連接部18之一對噴嘴20。一對噴嘴20是以夾著切削刀片14的下端部的方式,配置在切削刀片14的兩側面側(正面側、背面側)。又,於一對噴嘴20分別設置有朝向切削刀片14開口之供給口(未圖示)。When the
當對一對連接部18供給切削液時,切削液即流入一對噴嘴20,且從一對噴嘴20的噴射口朝向切削刀片14的兩側面(正面、背面)供給切削液。藉由此切削液,可將切削刀片14、與被工作夾台4所保持之被加工物或磨刀板11冷卻,並且將因切削加工所產生之屑(切削屑)沖洗掉。When the cutting fluid is supplied to the pair of
在切削單元8連接有使切削單元8移動之滾珠螺桿式的移動機構(未圖示)。此移動機構使切削單元8沿著Y軸方向移動,並且使其沿著Z軸方向升降。藉由移動機構,可調節切削刀片14的分度進給方向上的位置、或切削刀片14對被加工物或磨刀板11之切入深度。A ball screw type moving mechanism (not shown) for moving the
可藉由上述之切削裝置2來切削矽晶圓等的被加工物。例如切削刀片14將矽晶圓沿著切割道來切削並分割成複數個器件晶片。A workpiece such as a silicon wafer can be cut by the
再者,若繼續進行由切削刀片14進行之被加工物的切削,切削刀片14的前端部會磨耗,且切削刀片14的前端面會變化成帶有圓角之形狀(R形狀)(參照圖5)。並且,若以已磨耗的切削刀片14來將被加工物切削並分割成複數個晶片,會有因切削刀片14的R形狀反映於晶片而使晶片的形狀崩壞,且晶片的品質降低之疑慮。Furthermore, if the cutting of the workpiece by the cutting
於是,在藉由切削刀片14加工被加工物之前,會實施刻意地磨耗切削刀片14的前端部來修正切削刀片14的形狀之修整。修整是藉由使切削刀片14切入磨刀板11來進行。以下,針對使用磨刀板11來修正切削刀片14的形狀之切削刀片之修整方法的具體例進行說明。Therefore, before the workpiece is machined with the cutting
首先,藉由工作夾台4保持磨刀板11(保持步驟)。圖5是顯示被工作夾台4所保持之磨刀板11的局部剖面正面圖。First, the sharpening
在保持步驟中,是將已被框架17所支撐之磨刀板11隔著膠帶19配置於工作夾台4的保持面4a上。又,框架17會被複數個夾具6固定。若在此狀態下使吸引源的吸引力(負壓)作用於保持面4a,即可讓磨刀板11隔著膠帶19被工作夾台4吸引保持。藉此,磨刀板11會以第1層13以及第2層15的側面露出而呈現條紋圖樣之第3面11c(參照圖1等)成為上表面之方式被工作夾台4保持。In the holding step, the sharpening
其次,藉由使切削刀片14切入磨刀板11的上表面側,來修正切削刀片14的前端部的形狀(修整步驟)。圖6(A)是顯示修整步驟中的磨刀板11與切削刀片14的局部剖面正面圖。Next, the shape of the tip portion of the cutting
在修整步驟中,首先,是使工作夾台4旋轉,並將磨刀板11的長度方向(第3面11c的長邊方向)對齊於X軸方向。藉此,將磨刀板11配置成:長度方向沿著X軸方向,厚度方向沿著Y軸方向,寬度方向沿著Z軸方向。In the dressing step, first, the
又,使切削單元8(參照圖4及圖5)沿著Y軸方向移動,並使磨刀板11的第1層13與切削刀片14的Y軸方向上的位置對齊。例如可將切削刀片14定位成:第1層13的厚度方向(圖6(A)中的紙面左右方向)上的中心與切削刀片14的寬度方向(圖6(A)中的紙面左右方向)的中心之Y軸方向上的位置一致。此外,使切削單元8(參照圖4及圖5)沿著Z軸方向移動,並將切削刀片14的下端定位到比磨刀板11的上表面(第3面11c)更下方。Furthermore, the cutting unit 8 (see FIGS. 4 and 5 ) is moved in the Y-axis direction, and the
之後,一面旋轉切削刀片14,一面使工作夾台4沿著X軸方向移動。藉此,磨刀板11與切削刀片14會沿著加工進給方向相對地移動,且切削刀片14的前端部會沿著第1層13朝磨刀板11的上表面側切入。其結果,磨刀板11的上表面側會受到切削刀片14切削,而在磨刀板11的上表面側沿著第1層13形成直線狀之溝。又,切削刀片14的前端部會因為和磨刀板11之接觸而磨耗,而可修正切削刀片14的下表面(前端面)14a的形狀。Thereafter, while rotating the cutting
在此,第1層13的厚度d
1比切削刀片14的厚度(寬度)D更小。因此,切削刀片14的下表面14a會接觸於包含粒徑較大的磨粒(第1磨粒)之第1層13,且切削刀片14的前端部的兩側面會接觸於包含粒徑較小的磨粒(第2磨粒)之第2層15。因此,在切削刀片14的下表面14a會讓磨耗易於進行,在切削刀片14的前端部的兩側面則磨耗難以進行。
Here, the thickness d1 of the first
再者,第1層13以及第2層15的厚度可以因應於切削刀片14的厚度D而合宜設定。又,亦可為:第2層15的厚度d
2與夾著該第2層15之2片第1層的厚度d
1之總和(d
2+2d
1)比切削刀片14的厚度D更小。在此情況下,當使切削刀片14切入磨刀板11時,切削刀片14的下表面14a會接觸到2層以上的第1層13。
Furthermore, the thicknesses of the
圖6(B)是顯示修整步驟後之切削刀片14的正面圖。如上述,當使切削刀片14沿著第1層13切入磨刀板11時,切削刀片14的前端部當中接觸於第1層13之區域會優先地磨耗,而逐漸地消除切削刀片14的下表面14a的圓角。並且,當切削刀片14的下表面14a成為平直的形狀時,切削刀片14的修整即完成。FIG. 6(B) is a front view showing the cutting
再者,使切削刀片14切入磨刀板11之次數,可因應於切削刀片14的形狀、材質、尺寸等來合宜設定。在使切削刀片14切入磨刀板11複數次的情況下,可在使切削刀片14沿著第1個第1層13來切入磨刀板11後,使切削刀片14在Y軸方向上移動,並沿著第2個第1層13來切入磨刀板11。可以藉由重複此作業,而使切削刀片14對磨刀板11切入所期望的次數。並且,若沿著全部的第1層13形成溝後,會將使用完畢之磨刀板11更換成新品的磨刀板11(未使用之磨刀板11)。Furthermore, the number of times the
如以上,本實施形態之磨刀板11是包含第1層13與複數個第2層15而構成,前述第1層13包含磨粒,前述複數個第2層15以夾著第1層13的方式積層於第1層13。藉此,變得可在不用事先在磨刀板11形成較深之溝的情形下實施切削刀片14之修整,而可抑制磨刀板11的翹曲之產生。其結果,可以藉由工作夾台4適當地保持磨刀板11,而適當地實施切削刀片14的形狀之修正。As above, the sharpening
再者,在上述的實施形態中,已針對第2層15相較於第1層13包含有平均粒徑較小的磨粒(第2磨粒)之情況作了說明。但是,作為第2層15,也可以使用不包含磨粒之層。在此情況下,變得難以在接觸於第2層15的切削刀片14的前端部的兩側面產生磨耗,且變得易於將切削刀片14的下表面14a修正為平直的形狀。In addition, in the said embodiment, the case where the
另外,上述實施形態之構成、方法等,只要在不脫離本發明的目的之範圍下,均可合宜變更來實施。In addition, the structure, method, etc. of the above-mentioned embodiment can be changed suitably and implemented as long as it does not deviate from the objective of this invention.
2:切削裝置
4:工作夾台(保持工作台)
4a:保持面
6:夾具
8:切削單元
10:殼體
11:磨刀板
11a:第1面(正面)
11b:第2面(背面)
11c:第3面(側面)
11d:第4面(側面)
12:主軸
13:第1層
13a,15a:第1面(正面)
13b,15b:第2面(背面)
14:切削刀片
14a:下表面(前端面)
15:第2層
16:刀片蓋
17:框架
17a:開口
18:連接部
19:膠帶
20:噴嘴
d
1:第1層的厚度
d
2:第2層的厚度
D:切削刀片的厚度
X,Y,Z:方向
2: Cutting device 4: Work chuck (holding table) 4a: Holding surface 6: Fixture 8: Cutting unit 10: Housing 11: Grinding
圖1是顯示磨刀板的立體圖。 圖2(A)是顯示第1層及第2層的立體圖,圖2(B)是顯示交互地積層之第1層以及第2層的立體圖。 圖3是顯示被環狀的框架所支撐之磨刀板的立體圖。 圖4是顯示切削裝置的立體圖。 圖5是顯示被工作夾台所保持之磨刀板的局部剖面正面圖。 圖6(A)是顯示修整步驟中的磨刀板與切削刀片的局部剖面正面圖,圖6(B)是顯示修整步驟後之切削刀片的正面圖。 Fig. 1 is a perspective view showing a sharpening board. FIG. 2(A) is a perspective view showing the first layer and the second layer, and FIG. 2(B) is a perspective view showing the first layer and the second layer of the alternate strata. Fig. 3 is a perspective view showing a sharpening board supported by a ring-shaped frame. Fig. 4 is a perspective view showing a cutting device. Fig. 5 is a partial sectional front view showing the sharpening plate held by the work chuck. FIG. 6(A) is a partial sectional front view showing the sharpening plate and the cutting insert in the dressing step, and FIG. 6(B) is a front view showing the cutting insert after the dressing step.
11:磨刀板 11: Sharpening board
11a:第1面(正面) 11a: Side 1 (Front)
11b:第2面(背面) 11b: Side 2 (Back)
11c:第3面(側面) 11c: Surface 3 (side)
11d:第4面(側面) 11d: 4th side (side)
13:第1層 13: Layer 1
15:第2層
15:
15a:第1面(正面) 15a: Side 1 (Front)
15b:第2面(背面) 15b: Side 2 (Back)
Claims (6)
Applications Claiming Priority (2)
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JP2021080389A JP2022174532A (en) | 2021-05-11 | 2021-05-11 | Dresser board and cutting blade dressing method |
JP2021-080389 | 2021-05-11 |
Publications (1)
Publication Number | Publication Date |
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TW202243811A true TW202243811A (en) | 2022-11-16 |
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Application Number | Title | Priority Date | Filing Date |
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TW111115264A TW202243811A (en) | 2021-05-11 | 2022-04-21 | Dressing board and cutting blade trimming method enabling proper trimming of a cutting blade |
Country Status (4)
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JP (1) | JP2022174532A (en) |
KR (1) | KR20220153492A (en) |
CN (1) | CN115319543A (en) |
TW (1) | TW202243811A (en) |
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JP6967386B2 (en) | 2017-07-12 | 2021-11-17 | 株式会社ディスコ | Dressing method |
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2022
- 2022-04-21 TW TW111115264A patent/TW202243811A/en unknown
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CN115319543A (en) | 2022-11-11 |
KR20220153492A (en) | 2022-11-18 |
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