TW202241984A - 新穎化合物、及含有該化合物之硬化性樹脂組合物 - Google Patents

新穎化合物、及含有該化合物之硬化性樹脂組合物 Download PDF

Info

Publication number
TW202241984A
TW202241984A TW111103640A TW111103640A TW202241984A TW 202241984 A TW202241984 A TW 202241984A TW 111103640 A TW111103640 A TW 111103640A TW 111103640 A TW111103640 A TW 111103640A TW 202241984 A TW202241984 A TW 202241984A
Authority
TW
Taiwan
Prior art keywords
acid
resin composition
curable resin
compound
bis
Prior art date
Application number
TW111103640A
Other languages
English (en)
Chinese (zh)
Inventor
玉祖健一
Original Assignee
日商艾迪科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商艾迪科股份有限公司 filed Critical 日商艾迪科股份有限公司
Publication of TW202241984A publication Critical patent/TW202241984A/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/02—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
    • C07D405/12—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a chain containing hetero atoms as chain links
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145—Compounds containing one epoxy group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111103640A 2021-02-03 2022-01-27 新穎化合物、及含有該化合物之硬化性樹脂組合物 TW202241984A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021016043 2021-02-03
JP2021-016043 2021-02-03

Publications (1)

Publication Number Publication Date
TW202241984A true TW202241984A (zh) 2022-11-01

Family

ID=82741749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111103640A TW202241984A (zh) 2021-02-03 2022-01-27 新穎化合物、及含有該化合物之硬化性樹脂組合物

Country Status (7)

Country Link
US (1) US20240084065A1 (https=)
EP (1) EP4289837A4 (https=)
JP (1) JP7731382B2 (https=)
KR (1) KR20230142703A (https=)
CN (1) CN116848105A (https=)
TW (1) TW202241984A (https=)
WO (1) WO2022168665A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026041464A1 (en) * 2024-08-19 2026-02-26 Huntsman Advanced Materials (Switzerland) Gmbh Storage-stable epoxy methacrylate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066625A (en) 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US3651012A (en) * 1969-04-25 1972-03-21 Gen Electric Novel bis-imide compositions and polymers therefrom
JPS56103162A (en) * 1980-01-21 1981-08-18 Hitachi Ltd Ether-imide and its preparation
JPH10195050A (ja) * 1997-01-07 1998-07-28 Nippon Kayaku Co Ltd イミド骨格を有するヒドロキシ化合物、エポキシ化合物及びこれらを含有する熱硬化性組成物
WO2001004170A1 (en) * 1999-07-08 2001-01-18 Mitsui Chemicals, Inc. Thermoplastic polymer having polar group, use thereof, and unsaturated compounds having polar group
JP2005053856A (ja) * 2003-08-06 2005-03-03 Chung Yuan Christian Univ エポキシド基及びマレイミド基を有する化合物ならびに当該化合物から調製される硬化樹脂
JP4906071B2 (ja) 2006-04-28 2012-03-28 株式会社Ａｄｅｋａ エポキシ樹脂用硬化剤組成物およびそれを含有してなる硬化性エポキシ樹脂組成物
JP5729023B2 (ja) * 2010-03-23 2015-06-03 東レ株式会社 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
JP2011213683A (ja) * 2010-04-01 2011-10-27 Toray Fine Chemicals Co Ltd フタルイミド構造含有グリシジルエーテル化合物およびその製造方法

Also Published As

Publication number Publication date
JPWO2022168665A1 (https=) 2022-08-11
EP4289837A4 (en) 2025-01-08
EP4289837A1 (en) 2023-12-13
US20240084065A1 (en) 2024-03-14
JP7731382B2 (ja) 2025-08-29
WO2022168665A1 (ja) 2022-08-11
CN116848105A (zh) 2023-10-03
KR20230142703A (ko) 2023-10-11

Similar Documents

Publication Publication Date Title
JP5517326B2 (ja) 一液型シアネート−エポキシ複合樹脂組成物
JP7012012B2 (ja) 新規ホスホニウム化合物
JP4938567B2 (ja) 一液型シアネート−エポキシ複合樹脂組成物
TW202241984A (zh) 新穎化合物、及含有該化合物之硬化性樹脂組合物
JP7261580B2 (ja) 樹脂組成物
JP7801260B2 (ja) 電荷移動錯体
TWI901843B (zh) 硬化性樹脂組合物
TW202128813A (zh) 樹脂組合物
JP7699104B2 (ja) 硬化性樹脂組成物、及び硬化性樹脂組成物の硬化収縮を抑制する方法
EP4491653A1 (en) One-pack type epoxy resin composition
TW202346406A (zh) 化合物、硬化性樹脂組合物及硬化物
EP4424673A1 (en) Clathrate compound, epoxy resin curing agent, and curable resin composition
WO2022004596A1 (ja) ベンゾオキサジン化合物含有混合物、これを含む硬化性組成物および該硬化性組成物を硬化させてなる硬化物
WO2025062839A1 (ja) 化合物、エポキシ樹脂、硬化性組成物、リサイクル用材料、硬化物、硬化物の製造方法、分解物の製造方法及び分解方法
TW202208476A (zh) 含有苯并㗁𠯤化合物之混合物之製造方法
JP2025132266A (ja) 化合物、化合物の製造方法、エポキシ樹脂組成物及び硬化性組成物
JP2023131013A (ja) 硬化剤組成物、エポキシ樹脂組成物及び硬化物
JP2022013418A (ja) ベンゾオキサジン化合物含有混合物、これを含む硬化性組成物および該硬化性組成物を硬化させてなる硬化物