TW202237784A - 保護膜形成膜、保護膜形成用片、保護膜形成用複合片及裝置的製造方法 - Google Patents
保護膜形成膜、保護膜形成用片、保護膜形成用複合片及裝置的製造方法 Download PDFInfo
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- TW202237784A TW202237784A TW111109569A TW111109569A TW202237784A TW 202237784 A TW202237784 A TW 202237784A TW 111109569 A TW111109569 A TW 111109569A TW 111109569 A TW111109569 A TW 111109569A TW 202237784 A TW202237784 A TW 202237784A
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- protective film
- film
- forming
- wafer
- aminoethanol
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Physical Vapour Deposition (AREA)
- Magnetic Heads (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-049006 | 2021-03-23 | ||
JP2021049006A JP2022147663A (ja) | 2021-03-23 | 2021-03-23 | 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202237784A true TW202237784A (zh) | 2022-10-01 |
Family
ID=83451651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111109569A TW202237784A (zh) | 2021-03-23 | 2022-03-16 | 保護膜形成膜、保護膜形成用片、保護膜形成用複合片及裝置的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2022147663A (ja) |
KR (1) | KR20220132426A (ja) |
CN (1) | CN115181309A (ja) |
TW (1) | TW202237784A (ja) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014148496A1 (ja) | 2013-03-19 | 2014-09-25 | リンテック株式会社 | 保護膜形成用フィルム |
-
2021
- 2021-03-23 JP JP2021049006A patent/JP2022147663A/ja active Pending
-
2022
- 2022-01-30 CN CN202210114400.XA patent/CN115181309A/zh active Pending
- 2022-03-07 KR KR1020220028708A patent/KR20220132426A/ko unknown
- 2022-03-16 TW TW111109569A patent/TW202237784A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2022147663A (ja) | 2022-10-06 |
CN115181309A (zh) | 2022-10-14 |
KR20220132426A (ko) | 2022-09-30 |
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