TW202237761A - Resin composition, film, optical filter, solid-state imaging element and image display device - Google Patents
Resin composition, film, optical filter, solid-state imaging element and image display device Download PDFInfo
- Publication number
- TW202237761A TW202237761A TW111104022A TW111104022A TW202237761A TW 202237761 A TW202237761 A TW 202237761A TW 111104022 A TW111104022 A TW 111104022A TW 111104022 A TW111104022 A TW 111104022A TW 202237761 A TW202237761 A TW 202237761A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- resin
- repeating unit
- resin composition
- compounds
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 196
- 238000003384 imaging method Methods 0.000 title claims abstract description 23
- 230000003287 optical effect Effects 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 287
- 239000011347 resin Substances 0.000 claims abstract description 287
- 239000000463 material Substances 0.000 claims abstract description 220
- 239000000049 pigment Substances 0.000 claims abstract description 216
- 239000002253 acid Substances 0.000 claims abstract description 88
- 125000003118 aryl group Chemical group 0.000 claims abstract description 35
- 125000000524 functional group Chemical group 0.000 claims abstract description 35
- 239000007787 solid Substances 0.000 claims abstract description 27
- 125000000623 heterocyclic group Chemical group 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims description 331
- -1 carboline structure Chemical group 0.000 claims description 194
- 229920000642 polymer Polymers 0.000 claims description 64
- 239000003999 initiator Substances 0.000 claims description 41
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 25
- 230000002378 acidificating effect Effects 0.000 claims description 21
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical group C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims description 14
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 13
- 229920001400 block copolymer Polymers 0.000 claims description 13
- 229920000570 polyether Polymers 0.000 claims description 13
- XJHABGPPCLHLLV-UHFFFAOYSA-N benzo[de]isoquinoline-1,3-dione Chemical group C1=CC(C(=O)NC2=O)=C3C2=CC=CC3=C1 XJHABGPPCLHLLV-UHFFFAOYSA-N 0.000 claims description 12
- 229920000728 polyester Polymers 0.000 claims description 12
- FZEYVTFCMJSGMP-UHFFFAOYSA-N acridone Chemical group C1=CC=C2C(=O)C3=CC=CC=C3NC2=C1 FZEYVTFCMJSGMP-UHFFFAOYSA-N 0.000 claims description 11
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical group C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 claims description 11
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 10
- 150000002576 ketones Chemical group 0.000 claims description 10
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 10
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical group C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 claims description 10
- FNQJDLTXOVEEFB-UHFFFAOYSA-N 1,2,3-benzothiadiazole Chemical group C1=CC=C2SN=NC2=C1 FNQJDLTXOVEEFB-UHFFFAOYSA-N 0.000 claims description 9
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 claims description 9
- GWVMLCQWXVFZCN-UHFFFAOYSA-N isoindoline Chemical group C1=CC=C2CNCC2=C1 GWVMLCQWXVFZCN-UHFFFAOYSA-N 0.000 claims description 9
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 claims description 8
- 229920000578 graft copolymer Polymers 0.000 claims description 7
- 125000005543 phthalimide group Chemical group 0.000 claims description 7
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 claims description 6
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical group C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 claims description 6
- ASSKVPFEZFQQNQ-UHFFFAOYSA-N 2-benzoxazolinone Chemical group C1=CC=C2OC(O)=NC2=C1 ASSKVPFEZFQQNQ-UHFFFAOYSA-N 0.000 claims description 6
- QAODFZKBZDXSOJ-UHFFFAOYSA-N acridine-1,2-diol Chemical group C1=CC=CC2=CC3=C(O)C(O)=CC=C3N=C21 QAODFZKBZDXSOJ-UHFFFAOYSA-N 0.000 claims description 6
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 claims description 6
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical group C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 claims description 6
- UVEWQKMPXAHFST-UHFFFAOYSA-N n,1-diphenylmethanimine Chemical group C=1C=CC=CC=1C=NC1=CC=CC=C1 UVEWQKMPXAHFST-UHFFFAOYSA-N 0.000 claims description 6
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 claims description 6
- 125000000714 pyrimidinyl group Chemical group 0.000 claims description 6
- BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical group C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 claims description 5
- KYNSBQPICQTCGU-UHFFFAOYSA-N Benzopyrane Chemical group C1=CC=C2C=CCOC2=C1 KYNSBQPICQTCGU-UHFFFAOYSA-N 0.000 claims description 5
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 claims description 5
- DMLAVOWQYNRWNQ-UHFFFAOYSA-N azobenzene Chemical group C1=CC=CC=C1N=NC1=CC=CC=C1 DMLAVOWQYNRWNQ-UHFFFAOYSA-N 0.000 claims description 5
- HNYOPLTXPVRDBG-UHFFFAOYSA-N barbituric acid Chemical group O=C1CC(=O)NC(=O)N1 HNYOPLTXPVRDBG-UHFFFAOYSA-N 0.000 claims description 5
- MYONAGGJKCJOBT-UHFFFAOYSA-N benzimidazol-2-one Chemical group C1=CC=CC2=NC(=O)N=C21 MYONAGGJKCJOBT-UHFFFAOYSA-N 0.000 claims description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 5
- 239000004305 biphenyl Chemical group 0.000 claims description 5
- 235000010290 biphenyl Nutrition 0.000 claims description 5
- IYYZUPMFVPLQIF-ALWQSETLSA-N dibenzothiophene Chemical group C1=CC=CC=2[34S]C3=C(C=21)C=CC=C3 IYYZUPMFVPLQIF-ALWQSETLSA-N 0.000 claims description 5
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical group O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 5
- 125000002294 quinazolinyl group Chemical group N1=C(N=CC2=CC=CC=C12)* 0.000 claims description 5
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical group C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 5
- 125000005259 triarylamine group Chemical group 0.000 claims description 5
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical group C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 claims description 4
- HRYILSDLIGTCOP-UHFFFAOYSA-N N-benzoylurea Chemical group NC(=O)NC(=O)C1=CC=CC=C1 HRYILSDLIGTCOP-UHFFFAOYSA-N 0.000 claims description 4
- TXCDCPKCNAJMEE-UHFFFAOYSA-N dibenzofuran Chemical group C1=CC=C2C3=CC=CC=C3OC2=C1 TXCDCPKCNAJMEE-UHFFFAOYSA-N 0.000 claims description 4
- 125000002883 imidazolyl group Chemical group 0.000 claims description 4
- 125000001041 indolyl group Chemical group 0.000 claims description 4
- BJEYNNFDAPPGST-UHFFFAOYSA-N oxirene Chemical group O1C=C1 BJEYNNFDAPPGST-UHFFFAOYSA-N 0.000 claims description 4
- 125000003226 pyrazolyl group Chemical group 0.000 claims description 4
- LISFMEBWQUVKPJ-UHFFFAOYSA-N quinolin-2-ol Chemical group C1=CC=C2NC(=O)C=CC2=C1 LISFMEBWQUVKPJ-UHFFFAOYSA-N 0.000 claims description 4
- VUWCWMOCWKCZTA-UHFFFAOYSA-N 1,2-thiazol-4-one Chemical group O=C1CSN=C1 VUWCWMOCWKCZTA-UHFFFAOYSA-N 0.000 claims description 3
- 241000234282 Allium Species 0.000 claims description 3
- SLLFVLKNXABYGI-UHFFFAOYSA-N 1,2,3-benzoxadiazole Chemical group C1=CC=C2ON=NC2=C1 SLLFVLKNXABYGI-UHFFFAOYSA-N 0.000 claims description 2
- 235000002732 Allium cepa var. cepa Nutrition 0.000 claims description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003072 pyrazolidinyl group Chemical group 0.000 claims description 2
- 125000003831 tetrazolyl group Chemical group 0.000 claims 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical group C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 claims 1
- 238000004040 coloring Methods 0.000 abstract description 25
- 239000002904 solvent Substances 0.000 description 104
- 239000000126 substance Substances 0.000 description 80
- 239000010408 film Substances 0.000 description 77
- 238000000034 method Methods 0.000 description 57
- 239000004094 surface-active agent Substances 0.000 description 54
- 239000006185 dispersion Substances 0.000 description 52
- 239000010410 layer Substances 0.000 description 48
- 102100031476 Cytochrome P450 1A1 Human genes 0.000 description 47
- 101000941690 Homo sapiens Cytochrome P450 1A1 Proteins 0.000 description 47
- 239000002245 particle Substances 0.000 description 47
- 125000001424 substituent group Chemical group 0.000 description 42
- 125000000217 alkyl group Chemical group 0.000 description 34
- 239000000975 dye Substances 0.000 description 33
- 239000002585 base Substances 0.000 description 32
- 229910052731 fluorine Inorganic materials 0.000 description 32
- 239000000203 mixture Substances 0.000 description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 29
- 239000000243 solution Substances 0.000 description 29
- 125000003700 epoxy group Chemical group 0.000 description 28
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 27
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 23
- 239000011362 coarse particle Substances 0.000 description 23
- 239000011737 fluorine Substances 0.000 description 23
- 150000003839 salts Chemical class 0.000 description 23
- 239000003795 chemical substances by application Substances 0.000 description 21
- 125000005647 linker group Chemical group 0.000 description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 20
- 125000004432 carbon atom Chemical group C* 0.000 description 20
- 239000000047 product Substances 0.000 description 19
- 239000003963 antioxidant agent Substances 0.000 description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 18
- 239000000758 substrate Substances 0.000 description 18
- 229910052796 boron Inorganic materials 0.000 description 17
- 239000002270 dispersing agent Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 17
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 16
- 238000010521 absorption reaction Methods 0.000 description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 16
- 230000000704 physical effect Effects 0.000 description 16
- 239000011241 protective layer Substances 0.000 description 16
- 229920001187 thermosetting polymer Polymers 0.000 description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 15
- 125000002947 alkylene group Chemical group 0.000 description 15
- 229910052799 carbon Inorganic materials 0.000 description 15
- 150000002430 hydrocarbons Chemical group 0.000 description 15
- 239000011164 primary particle Substances 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 125000003545 alkoxy group Chemical group 0.000 description 14
- 230000018109 developmental process Effects 0.000 description 14
- 239000007788 liquid Substances 0.000 description 14
- 238000005192 partition Methods 0.000 description 14
- 239000010936 titanium Substances 0.000 description 14
- 238000002834 transmittance Methods 0.000 description 14
- 125000001931 aliphatic group Chemical group 0.000 description 13
- 230000003078 antioxidant effect Effects 0.000 description 13
- 150000004292 cyclic ethers Chemical group 0.000 description 13
- 125000004122 cyclic group Chemical group 0.000 description 13
- 238000011161 development Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 238000002156 mixing Methods 0.000 description 13
- 239000003960 organic solvent Substances 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 229910052719 titanium Inorganic materials 0.000 description 13
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 125000005843 halogen group Chemical group 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 125000003277 amino group Chemical group 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 11
- 229940125782 compound 2 Drugs 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 10
- 125000002252 acyl group Chemical group 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 230000007613 environmental effect Effects 0.000 description 10
- 238000001914 filtration Methods 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000002835 absorbance Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 125000001153 fluoro group Chemical group F* 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 229910044991 metal oxide Inorganic materials 0.000 description 9
- 150000004706 metal oxides Chemical class 0.000 description 9
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 230000002123 temporal effect Effects 0.000 description 9
- 238000011282 treatment Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 8
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 8
- FYNROBRQIVCIQF-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole-5,6-dione Chemical compound C1=CN=C2C(=O)C(=O)N=C21 FYNROBRQIVCIQF-UHFFFAOYSA-N 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 238000004528 spin coating Methods 0.000 description 8
- 150000003536 tetrazoles Chemical group 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 7
- 239000004793 Polystyrene Substances 0.000 description 7
- 239000006096 absorbing agent Substances 0.000 description 7
- 125000004414 alkyl thio group Chemical group 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000010954 inorganic particle Substances 0.000 description 7
- 239000012860 organic pigment Substances 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 7
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 6
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 125000004644 alkyl sulfinyl group Chemical group 0.000 description 6
- 125000005135 aryl sulfinyl group Chemical group 0.000 description 6
- 125000004391 aryl sulfonyl group Chemical group 0.000 description 6
- 125000004104 aryloxy group Chemical group 0.000 description 6
- 125000004093 cyano group Chemical group *C#N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 150000002466 imines Chemical class 0.000 description 6
- 239000003112 inhibitor Substances 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 229920005672 polyolefin resin Polymers 0.000 description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 6
- RQGPLDBZHMVWCH-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole Chemical compound C1=NC2=CC=NC2=C1 RQGPLDBZHMVWCH-UHFFFAOYSA-N 0.000 description 6
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 6
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- 102100026533 Cytochrome P450 1A2 Human genes 0.000 description 5
- 101000855342 Homo sapiens Cytochrome P450 1A2 Proteins 0.000 description 5
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 125000004423 acyloxy group Chemical group 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 125000006575 electron-withdrawing group Chemical group 0.000 description 5
- 125000005842 heteroatom Chemical group 0.000 description 5
- 238000003801 milling Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000001054 red pigment Substances 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 239000012463 white pigment Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 4
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical group NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000004056 anthraquinones Chemical class 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000001055 blue pigment Substances 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 125000003566 oxetanyl group Chemical group 0.000 description 4
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- 229940051201 quinoline yellow Drugs 0.000 description 4
- 239000004172 quinoline yellow Substances 0.000 description 4
- 235000012752 quinoline yellow Nutrition 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- KQBSGRWMSNFIPG-UHFFFAOYSA-N trioxane Chemical group C1COOOC1 KQBSGRWMSNFIPG-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 3
- KEQTWHPMSVAFDA-UHFFFAOYSA-N 2,3-dihydro-1h-pyrazole Chemical group C1NNC=C1 KEQTWHPMSVAFDA-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 241000212314 Foeniculum Species 0.000 description 3
- 235000004204 Foeniculum vulgare Nutrition 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 229920002873 Polyethylenimine Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical group C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 3
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000005163 aryl sulfanyl group Chemical group 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 3
- 239000007771 core particle Substances 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001056 green pigment Substances 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000001023 inorganic pigment Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- OQGRFQCUGLKSAV-JTQLQIEISA-N n-[(3s)-2,6-dioxopiperidin-3-yl]-2-phenylacetamide Chemical compound N([C@@H]1C(NC(=O)CC1)=O)C(=O)CC1=CC=CC=C1 OQGRFQCUGLKSAV-JTQLQIEISA-N 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 150000003141 primary amines Chemical group 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000000168 pyrrolyl group Chemical group 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 229930195734 saturated hydrocarbon Natural products 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 3
- OVTCUIZCVUGJHS-VQHVLOKHSA-N trans-dipyrrin Chemical compound C=1C=CNC=1/C=C1\C=CC=N1 OVTCUIZCVUGJHS-VQHVLOKHSA-N 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical group O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 3
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- SPKCDZSHUZJCGE-UHFFFAOYSA-N 1h-indazole;1h-pyrrole Chemical group C=1C=CNC=1.C1=CC=C2C=NNC2=C1 SPKCDZSHUZJCGE-UHFFFAOYSA-N 0.000 description 2
- OZDGMOYKSFPLSE-UHFFFAOYSA-N 2-Methylaziridine Chemical compound CC1CN1 OZDGMOYKSFPLSE-UHFFFAOYSA-N 0.000 description 2
- JQMFQLVAJGZSQS-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JQMFQLVAJGZSQS-UHFFFAOYSA-N 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 2
- DQYSALLXMHVJAV-UHFFFAOYSA-M 3-heptyl-2-[(3-heptyl-4-methyl-1,3-thiazol-3-ium-2-yl)methylidene]-4-methyl-1,3-thiazole;iodide Chemical compound [I-].CCCCCCCN1C(C)=CS\C1=C\C1=[N+](CCCCCCC)C(C)=CS1 DQYSALLXMHVJAV-UHFFFAOYSA-M 0.000 description 2
- IHXWECHPYNPJRR-UHFFFAOYSA-N 3-hydroxycyclobut-2-en-1-one Chemical class OC1=CC(=O)C1 IHXWECHPYNPJRR-UHFFFAOYSA-N 0.000 description 2
- UJBOOUHRTQVGRU-UHFFFAOYSA-N 3-methylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1 UJBOOUHRTQVGRU-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical group C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 101100135116 Oryza sativa subsp. japonica RR12 gene Proteins 0.000 description 2
- 101100135117 Oryza sativa subsp. japonica RR13 gene Proteins 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical group C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 2
- 101150080148 RR10 gene Proteins 0.000 description 2
- 101150016011 RR11 gene Proteins 0.000 description 2
- 101150048609 RR21 gene Proteins 0.000 description 2
- 101150110620 RR22 gene Proteins 0.000 description 2
- 101150048251 RR23 gene Proteins 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 206010047571 Visual impairment Diseases 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 2
- 125000004656 alkyl sulfonylamino group Chemical group 0.000 description 2
- 125000005529 alkyleneoxy group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 125000005161 aryl oxy carbonyl group Chemical group 0.000 description 2
- 125000004657 aryl sulfonyl amino group Chemical group 0.000 description 2
- 125000005110 aryl thio group Chemical group 0.000 description 2
- 238000010296 bead milling Methods 0.000 description 2
- 150000008366 benzophenones Chemical class 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000011246 composite particle Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- 150000003997 cyclic ketones Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- BQJCRHHNABKAKU-KBQPJGBKSA-N morphine Chemical group O([C@H]1[C@H](C=C[C@H]23)O)C4=C5[C@@]12CCN(C)[C@@H]3CC5=CC=C4O BQJCRHHNABKAKU-KBQPJGBKSA-N 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical class N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 150000004010 onium ions Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical compound C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical group C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 2
- 229920000090 poly(aryl ether) Polymers 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 125000006239 protecting group Chemical group 0.000 description 2
- 239000001057 purple pigment Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 150000003335 secondary amines Chemical group 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 125000005504 styryl group Chemical group 0.000 description 2
- 125000000475 sulfinyl group Chemical group [*:2]S([*:1])=O 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- 150000003512 tertiary amines Chemical group 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- 125000004149 thio group Chemical group *S* 0.000 description 2
- 150000003568 thioethers Chemical group 0.000 description 2
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical class S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 239000001052 yellow pigment Substances 0.000 description 2
- VCGRFBXVSFAGGA-UHFFFAOYSA-N (1,1-dioxo-1,4-thiazinan-4-yl)-[6-[[3-(4-fluorophenyl)-5-methyl-1,2-oxazol-4-yl]methoxy]pyridin-3-yl]methanone Chemical compound CC=1ON=C(C=2C=CC(F)=CC=2)C=1COC(N=C1)=CC=C1C(=O)N1CCS(=O)(=O)CC1 VCGRFBXVSFAGGA-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- DOMQFIFVDIAOOT-ROUUACIJSA-N (2S,3R)-N-[4-(2,6-dimethoxyphenyl)-5-(5-methylpyridin-3-yl)-1,2,4-triazol-3-yl]-3-(5-methylpyrimidin-2-yl)butane-2-sulfonamide Chemical compound COC1=C(C(=CC=C1)OC)N1C(=NN=C1C=1C=NC=C(C=1)C)NS(=O)(=O)[C@@H](C)[C@H](C)C1=NC=C(C=N1)C DOMQFIFVDIAOOT-ROUUACIJSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MRUDPRFGMHTPFJ-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) acetate Chemical compound CC(=O)ON=C(C)C(C)=O MRUDPRFGMHTPFJ-UHFFFAOYSA-N 0.000 description 1
- SKCKRZWCOYHBEC-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) benzoate Chemical compound CC(=O)C(C)=NOC(=O)C1=CC=CC=C1 SKCKRZWCOYHBEC-UHFFFAOYSA-N 0.000 description 1
- HQLZSJJJXHJANW-UHFFFAOYSA-N (3-oxopentan-2-ylideneamino) acetate Chemical compound CCC(=O)C(C)=NOC(C)=O HQLZSJJJXHJANW-UHFFFAOYSA-N 0.000 description 1
- MAYZWDRUFKUGGP-VIFPVBQESA-N (3s)-1-[5-tert-butyl-3-[(1-methyltetrazol-5-yl)methyl]triazolo[4,5-d]pyrimidin-7-yl]pyrrolidin-3-ol Chemical compound CN1N=NN=C1CN1C2=NC(C(C)(C)C)=NC(N3C[C@@H](O)CC3)=C2N=N1 MAYZWDRUFKUGGP-VIFPVBQESA-N 0.000 description 1
- HPQOZLRGTMSOBA-UHFFFAOYSA-N (4-imino-3-oxobutan-2-yl) propanoate Chemical compound CCC(=O)OC(C)C(=O)C=N HPQOZLRGTMSOBA-UHFFFAOYSA-N 0.000 description 1
- UKGJZDSUJSPAJL-YPUOHESYSA-N (e)-n-[(1r)-1-[3,5-difluoro-4-(methanesulfonamido)phenyl]ethyl]-3-[2-propyl-6-(trifluoromethyl)pyridin-3-yl]prop-2-enamide Chemical compound CCCC1=NC(C(F)(F)F)=CC=C1\C=C\C(=O)N[C@H](C)C1=CC(F)=C(NS(C)(=O)=O)C(F)=C1 UKGJZDSUJSPAJL-YPUOHESYSA-N 0.000 description 1
- ZGYIXVSQHOKQRZ-COIATFDQSA-N (e)-n-[4-[3-chloro-4-(pyridin-2-ylmethoxy)anilino]-3-cyano-7-[(3s)-oxolan-3-yl]oxyquinolin-6-yl]-4-(dimethylamino)but-2-enamide Chemical compound N#CC1=CN=C2C=C(O[C@@H]3COCC3)C(NC(=O)/C=C/CN(C)C)=CC2=C1NC(C=C1Cl)=CC=C1OCC1=CC=CC=N1 ZGYIXVSQHOKQRZ-COIATFDQSA-N 0.000 description 1
- MOWXJLUYGFNTAL-DEOSSOPVSA-N (s)-[2-chloro-4-fluoro-5-(7-morpholin-4-ylquinazolin-4-yl)phenyl]-(6-methoxypyridazin-3-yl)methanol Chemical compound N1=NC(OC)=CC=C1[C@@H](O)C1=CC(C=2C3=CC=C(C=C3N=CN=2)N2CCOCC2)=C(F)C=C1Cl MOWXJLUYGFNTAL-DEOSSOPVSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical group C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- KCOPAESEGCGTKM-UHFFFAOYSA-N 1,3-oxazol-4-one Chemical group O=C1COC=N1 KCOPAESEGCGTKM-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical group O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- XUKSWKGOQKREON-UHFFFAOYSA-N 1,4-diacetoxybutane Chemical compound CC(=O)OCCCCOC(C)=O XUKSWKGOQKREON-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- APWRZPQBPCAXFP-UHFFFAOYSA-N 1-(1-oxo-2H-isoquinolin-5-yl)-5-(trifluoromethyl)-N-[2-(trifluoromethyl)pyridin-4-yl]pyrazole-4-carboxamide Chemical compound O=C1NC=CC2=C(C=CC=C12)N1N=CC(=C1C(F)(F)F)C(=O)NC1=CC(=NC=C1)C(F)(F)F APWRZPQBPCAXFP-UHFFFAOYSA-N 0.000 description 1
- MJUVRTYWUMPBTR-MRXNPFEDSA-N 1-(2,2-difluoro-1,3-benzodioxol-5-yl)-n-[1-[(2r)-2,3-dihydroxypropyl]-6-fluoro-2-(1-hydroxy-2-methylpropan-2-yl)indol-5-yl]cyclopropane-1-carboxamide Chemical compound FC=1C=C2N(C[C@@H](O)CO)C(C(C)(CO)C)=CC2=CC=1NC(=O)C1(C=2C=C3OC(F)(F)OC3=CC=2)CC1 MJUVRTYWUMPBTR-MRXNPFEDSA-N 0.000 description 1
- KZEVSDGEBAJOTK-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[5-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CC=1OC(=NN=1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O KZEVSDGEBAJOTK-UHFFFAOYSA-N 0.000 description 1
- ABDDQTDRAHXHOC-QMMMGPOBSA-N 1-[(7s)-5,7-dihydro-4h-thieno[2,3-c]pyran-7-yl]-n-methylmethanamine Chemical compound CNC[C@@H]1OCCC2=C1SC=C2 ABDDQTDRAHXHOC-QMMMGPOBSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical group C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- NDVAMUMVOJRAJV-UHFFFAOYSA-N 10h-phenanthren-9-one Chemical group C1=CC=C2C(=O)CC3=CC=CC=C3C2=C1 NDVAMUMVOJRAJV-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical group C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical group CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- XQFYGXFPKONEPY-UHFFFAOYSA-N 2,3-diphenylfuran Chemical group O1C=CC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 XQFYGXFPKONEPY-UHFFFAOYSA-N 0.000 description 1
- QWQNFXDYOCUEER-UHFFFAOYSA-N 2,3-ditert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1C(C)(C)C QWQNFXDYOCUEER-UHFFFAOYSA-N 0.000 description 1
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- AGDJBQFTSSGBSY-UHFFFAOYSA-N 2,4-bis(2-chlorophenyl)-1-[2-(2-chlorophenyl)imidazol-1-yl]-5-(3,4-dimethoxyphenyl)-4,5-diphenylimidazole Chemical compound ClC1=C(C=CC=C1)C=1N(C(C(N=1)(C1=CC=CC=C1)C1=C(C=CC=C1)Cl)(C1=CC=CC=C1)C1=CC(=C(C=C1)OC)OC)N1C(=NC=C1)C1=C(C=CC=C1)Cl AGDJBQFTSSGBSY-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical class C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical class C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- VWVRASTUFJRTHW-UHFFFAOYSA-N 2-[3-(azetidin-3-yloxy)-4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound O=C(CN1C=C(C(OC2CNC2)=N1)C1=CN=C(NC2CC3=C(C2)C=CC=C3)N=C1)N1CCC2=C(C1)N=NN2 VWVRASTUFJRTHW-UHFFFAOYSA-N 0.000 description 1
- LPZOCVVDSHQFST-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-ethylpyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)CC LPZOCVVDSHQFST-UHFFFAOYSA-N 0.000 description 1
- JVKRKMWZYMKVTQ-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C=NN(C=1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JVKRKMWZYMKVTQ-UHFFFAOYSA-N 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical compound NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 2-dodecanoyloxyethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCC ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 0.000 description 1
- SNZYOYGFWBZAQY-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-methyloxirane Chemical compound CC1CO1.CCC(CO)(CO)CO SNZYOYGFWBZAQY-UHFFFAOYSA-N 0.000 description 1
- RSROEZYGRKHVMN-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;oxirane Chemical compound C1CO1.CCC(CO)(CO)CO RSROEZYGRKHVMN-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 description 1
- BTZVKSVLFLRBRE-UHFFFAOYSA-N 2-methoxypropyl acetate Chemical compound COC(C)COC(C)=O BTZVKSVLFLRBRE-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- LFSAPCRASZRSKS-UHFFFAOYSA-N 2-methylcyclohexan-1-one Chemical compound CC1CCCCC1=O LFSAPCRASZRSKS-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical group CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- WLXYHLHNIRJAIG-UHFFFAOYSA-N 2h-benzo[e]isoindole Chemical compound C1=CC=C2C3=CNC=C3C=CC2=C1 WLXYHLHNIRJAIG-UHFFFAOYSA-N 0.000 description 1
- HCDMJFOHIXMBOV-UHFFFAOYSA-N 3-(2,6-difluoro-3,5-dimethoxyphenyl)-1-ethyl-8-(morpholin-4-ylmethyl)-4,7-dihydropyrrolo[4,5]pyrido[1,2-d]pyrimidin-2-one Chemical compound C=1C2=C3N(CC)C(=O)N(C=4C(=C(OC)C=C(OC)C=4F)F)CC3=CN=C2NC=1CN1CCOCC1 HCDMJFOHIXMBOV-UHFFFAOYSA-N 0.000 description 1
- BYHQTRFJOGIQAO-GOSISDBHSA-N 3-(4-bromophenyl)-8-[(2R)-2-hydroxypropyl]-1-[(3-methoxyphenyl)methyl]-1,3,8-triazaspiro[4.5]decan-2-one Chemical compound C[C@H](CN1CCC2(CC1)CN(C(=O)N2CC3=CC(=CC=C3)OC)C4=CC=C(C=C4)Br)O BYHQTRFJOGIQAO-GOSISDBHSA-N 0.000 description 1
- YGYGASJNJTYNOL-CQSZACIVSA-N 3-[(4r)-2,2-dimethyl-1,1-dioxothian-4-yl]-5-(4-fluorophenyl)-1h-indole-7-carboxamide Chemical compound C1CS(=O)(=O)C(C)(C)C[C@@H]1C1=CNC2=C(C(N)=O)C=C(C=3C=CC(F)=CC=3)C=C12 YGYGASJNJTYNOL-CQSZACIVSA-N 0.000 description 1
- WNEODWDFDXWOLU-QHCPKHFHSA-N 3-[3-(hydroxymethyl)-4-[1-methyl-5-[[5-[(2s)-2-methyl-4-(oxetan-3-yl)piperazin-1-yl]pyridin-2-yl]amino]-6-oxopyridin-3-yl]pyridin-2-yl]-7,7-dimethyl-1,2,6,8-tetrahydrocyclopenta[3,4]pyrrolo[3,5-b]pyrazin-4-one Chemical compound C([C@@H](N(CC1)C=2C=NC(NC=3C(N(C)C=C(C=3)C=3C(=C(N4C(C5=CC=6CC(C)(C)CC=6N5CC4)=O)N=CC=3)CO)=O)=CC=2)C)N1C1COC1 WNEODWDFDXWOLU-QHCPKHFHSA-N 0.000 description 1
- SRVXSISGYBMIHR-UHFFFAOYSA-N 3-[3-[3-(2-amino-2-oxoethyl)phenyl]-5-chlorophenyl]-3-(5-methyl-1,3-thiazol-2-yl)propanoic acid Chemical compound S1C(C)=CN=C1C(CC(O)=O)C1=CC(Cl)=CC(C=2C=C(CC(N)=O)C=CC=2)=C1 SRVXSISGYBMIHR-UHFFFAOYSA-N 0.000 description 1
- MPAGVACEWQNVQO-UHFFFAOYSA-N 3-acetyloxybutyl acetate Chemical compound CC(=O)OC(C)CCOC(C)=O MPAGVACEWQNVQO-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- MLADSFHWSYJDAK-UHFFFAOYSA-N 3-methoxy-N,N-dimethylprop-2-enamide Chemical compound COC=CC(=O)N(C)C MLADSFHWSYJDAK-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VJPPLCNBDLZIFG-ZDUSSCGKSA-N 4-[(3S)-3-(but-2-ynoylamino)piperidin-1-yl]-5-fluoro-2,3-dimethyl-1H-indole-7-carboxamide Chemical compound C(C#CC)(=O)N[C@@H]1CN(CCC1)C1=C2C(=C(NC2=C(C=C1F)C(=O)N)C)C VJPPLCNBDLZIFG-ZDUSSCGKSA-N 0.000 description 1
- UATILMFCGOVFLI-UHFFFAOYSA-N 4-[1,1-dimethoxyethoxy-methoxy-[3-(2-methylprop-2-enoyloxy)propyl]silyl]oxybutyl 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OCCCCO[Si](OC(OC)(OC)C)(OC)CCCOC(C(=C)C)=O UATILMFCGOVFLI-UHFFFAOYSA-N 0.000 description 1
- YFCIFWOJYYFDQP-PTWZRHHISA-N 4-[3-amino-6-[(1S,3S,4S)-3-fluoro-4-hydroxycyclohexyl]pyrazin-2-yl]-N-[(1S)-1-(3-bromo-5-fluorophenyl)-2-(methylamino)ethyl]-2-fluorobenzamide Chemical compound CNC[C@@H](NC(=O)c1ccc(cc1F)-c1nc(cnc1N)[C@H]1CC[C@H](O)[C@@H](F)C1)c1cc(F)cc(Br)c1 YFCIFWOJYYFDQP-PTWZRHHISA-N 0.000 description 1
- XYWIPYBIIRTJMM-IBGZPJMESA-N 4-[[(2S)-2-[4-[5-chloro-2-[4-(trifluoromethyl)triazol-1-yl]phenyl]-5-methoxy-2-oxopyridin-1-yl]butanoyl]amino]-2-fluorobenzamide Chemical compound CC[C@H](N1C=C(OC)C(=CC1=O)C1=C(C=CC(Cl)=C1)N1C=C(N=N1)C(F)(F)F)C(=O)NC1=CC(F)=C(C=C1)C(N)=O XYWIPYBIIRTJMM-IBGZPJMESA-N 0.000 description 1
- KVCQTKNUUQOELD-UHFFFAOYSA-N 4-amino-n-[1-(3-chloro-2-fluoroanilino)-6-methylisoquinolin-5-yl]thieno[3,2-d]pyrimidine-7-carboxamide Chemical compound N=1C=CC2=C(NC(=O)C=3C4=NC=NC(N)=C4SC=3)C(C)=CC=C2C=1NC1=CC=CC(Cl)=C1F KVCQTKNUUQOELD-UHFFFAOYSA-N 0.000 description 1
- WTNFILZMBZUFDX-UHFFFAOYSA-N 4-phenyl-1,2-dihydrotriazol-5-one Chemical class N1N=NC(C=2C=CC=CC=2)=C1O WTNFILZMBZUFDX-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- IRPVABHDSJVBNZ-RTHVDDQRSA-N 5-[1-(cyclopropylmethyl)-5-[(1R,5S)-3-(oxetan-3-yl)-3-azabicyclo[3.1.0]hexan-6-yl]pyrazol-3-yl]-3-(trifluoromethyl)pyridin-2-amine Chemical compound C1=C(C(F)(F)F)C(N)=NC=C1C1=NN(CC2CC2)C(C2[C@@H]3CN(C[C@@H]32)C2COC2)=C1 IRPVABHDSJVBNZ-RTHVDDQRSA-N 0.000 description 1
- UPULOMQHYQDNNT-UHFFFAOYSA-N 5h-1,3-oxazol-2-one Chemical group O=C1OCC=N1 UPULOMQHYQDNNT-UHFFFAOYSA-N 0.000 description 1
- KCBWAFJCKVKYHO-UHFFFAOYSA-N 6-(4-cyclopropyl-6-methoxypyrimidin-5-yl)-1-[[4-[1-propan-2-yl-4-(trifluoromethyl)imidazol-2-yl]phenyl]methyl]pyrazolo[3,4-d]pyrimidine Chemical compound C1(CC1)C1=NC=NC(=C1C1=NC=C2C(=N1)N(N=C2)CC1=CC=C(C=C1)C=1N(C=C(N=1)C(F)(F)F)C(C)C)OC KCBWAFJCKVKYHO-UHFFFAOYSA-N 0.000 description 1
- UNQYAAAWKOOBFQ-UHFFFAOYSA-N 7-[(4-chlorophenyl)methyl]-8-[4-chloro-3-(trifluoromethoxy)phenoxy]-1-(3-hydroxypropyl)-3-methylpurine-2,6-dione Chemical compound C=1C=C(Cl)C=CC=1CN1C=2C(=O)N(CCCO)C(=O)N(C)C=2N=C1OC1=CC=C(Cl)C(OC(F)(F)F)=C1 UNQYAAAWKOOBFQ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- CYJRNFFLTBEQSQ-UHFFFAOYSA-N 8-(3-methyl-1-benzothiophen-5-yl)-N-(4-methylsulfonylpyridin-3-yl)quinoxalin-6-amine Chemical compound CS(=O)(=O)C1=C(C=NC=C1)NC=1C=C2N=CC=NC2=C(C=1)C=1C=CC2=C(C(=CS2)C)C=1 CYJRNFFLTBEQSQ-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- ZRPZPNYZFSJUPA-UHFFFAOYSA-N ARS-1620 Chemical compound Oc1cccc(F)c1-c1c(Cl)cc2c(ncnc2c1F)N1CCN(CC1)C(=O)C=C ZRPZPNYZFSJUPA-UHFFFAOYSA-N 0.000 description 1
- 239000005964 Acibenzolar-S-methyl Substances 0.000 description 1
- GDALETGZDYOOGB-UHFFFAOYSA-N Acridone Natural products C1=C(O)C=C2N(C)C3=CC=CC=C3C(=O)C2=C1O GDALETGZDYOOGB-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XLCJBNJIJFJMFX-UHFFFAOYSA-N CC1C(C)=C(CCC2)C=CC12C(OCC(CO)O)=O Chemical compound CC1C(C)=C(CCC2)C=CC12C(OCC(CO)O)=O XLCJBNJIJFJMFX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- 239000013523 DOWSIL™ Substances 0.000 description 1
- 229920013731 Dowsil Polymers 0.000 description 1
- 239000004129 EU approved improving agent Substances 0.000 description 1
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- FMRHJJZUHUTGKE-UHFFFAOYSA-N Ethylhexyl salicylate Chemical class CCCCC(CC)COC(=O)C1=CC=CC=C1O FMRHJJZUHUTGKE-UHFFFAOYSA-N 0.000 description 1
- GISRWBROCYNDME-PELMWDNLSA-N F[C@H]1[C@H]([C@H](NC1=O)COC1=NC=CC2=CC(=C(C=C12)OC)C(=O)N)C Chemical compound F[C@H]1[C@H]([C@H](NC1=O)COC1=NC=CC2=CC(=C(C=C12)OC)C(=O)N)C GISRWBROCYNDME-PELMWDNLSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- AYCPARAPKDAOEN-LJQANCHMSA-N N-[(1S)-2-(dimethylamino)-1-phenylethyl]-6,6-dimethyl-3-[(2-methyl-4-thieno[3,2-d]pyrimidinyl)amino]-1,4-dihydropyrrolo[3,4-c]pyrazole-5-carboxamide Chemical compound C1([C@H](NC(=O)N2C(C=3NN=C(NC=4C=5SC=CC=5N=C(C)N=4)C=3C2)(C)C)CN(C)C)=CC=CC=C1 AYCPARAPKDAOEN-LJQANCHMSA-N 0.000 description 1
- FEYNFHSRETUBEM-UHFFFAOYSA-N N-[3-(1,1-difluoroethyl)phenyl]-1-(4-methoxyphenyl)-3-methyl-5-oxo-4H-pyrazole-4-carboxamide Chemical compound COc1ccc(cc1)N1N=C(C)C(C(=O)Nc2cccc(c2)C(C)(F)F)C1=O FEYNFHSRETUBEM-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- IDRGFNPZDVBSSE-UHFFFAOYSA-N OCCN1CCN(CC1)c1ccc(Nc2ncc3cccc(-c4cccc(NC(=O)C=C)c4)c3n2)c(F)c1F Chemical compound OCCN1CCN(CC1)c1ccc(Nc2ncc3cccc(-c4cccc(NC(=O)C=C)c4)c3n2)c(F)c1F IDRGFNPZDVBSSE-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229920002035 Pluronic® L 10 Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 238000001237 Raman spectrum Methods 0.000 description 1
- 101100079340 Rattus norvegicus Nalcn gene Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 229920002359 Tetronic® Polymers 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- DPQRMIPRAHPPNE-UHFFFAOYSA-N [(1-oxo-1-phenylpropan-2-ylidene)amino] acetate Chemical compound CC(=O)ON=C(C)C(=O)C1=CC=CC=C1 DPQRMIPRAHPPNE-UHFFFAOYSA-N 0.000 description 1
- LXRZVMYMQHNYJB-UNXOBOICSA-N [(1R,2S,4R)-4-[[5-[4-[(1R)-7-chloro-1,2,3,4-tetrahydroisoquinolin-1-yl]-5-methylthiophene-2-carbonyl]pyrimidin-4-yl]amino]-2-hydroxycyclopentyl]methyl sulfamate Chemical compound CC1=C(C=C(S1)C(=O)C1=C(N[C@H]2C[C@H](O)[C@@H](COS(N)(=O)=O)C2)N=CN=C1)[C@@H]1NCCC2=C1C=C(Cl)C=C2 LXRZVMYMQHNYJB-UNXOBOICSA-N 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- YPCHGLDQZXOZFW-UHFFFAOYSA-N [2-[[4-methyl-3-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]carbonylamino]phenyl]carbamoyloxymethyl]-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound CC1=CC=C(NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C)C=C1NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C YPCHGLDQZXOZFW-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- HIVQCJOGAHNXBO-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] propanoate Chemical compound CCC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C HIVQCJOGAHNXBO-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- ZXXUPZWDQJEEQW-UHFFFAOYSA-N [[3-cyclohexyl-1-oxo-1-(4-phenylsulfanylphenyl)propan-2-ylidene]amino] acetate Chemical compound C(C)(=O)ON=C(C(=O)C1=CC=C(C=C1)SC1=CC=CC=C1)CC1CCCCC1 ZXXUPZWDQJEEQW-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical group 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- HUVXQFBFIFIDDU-UHFFFAOYSA-N aluminum phthalocyanine Chemical class [Al+3].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 HUVXQFBFIFIDDU-UHFFFAOYSA-N 0.000 description 1
- 125000006598 aminocarbonylamino group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 150000008641 benzimidazolones Chemical class 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical group C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 125000000649 benzylidene group Chemical group [H]C(=[*])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- SVNCDHBIQPXHHA-UHFFFAOYSA-N bis(2,4-ditert-butyl-6-methylphenyl) ethyl phosphate Chemical compound CC=1C=C(C(C)(C)C)C=C(C(C)(C)C)C=1OP(=O)(OCC)OC1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C SVNCDHBIQPXHHA-UHFFFAOYSA-N 0.000 description 1
- RKTGAWJWCNLSFX-UHFFFAOYSA-M bis(2-hydroxyethyl)-dimethylazanium;hydroxide Chemical compound [OH-].OCC[N+](C)(C)CCO RKTGAWJWCNLSFX-UHFFFAOYSA-M 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 125000005620 boronic acid group Chemical group 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- DGLFSNZWRYADFC-UHFFFAOYSA-N chembl2334586 Chemical compound C1CCC2=CN=C(N)N=C2C2=C1NC1=CC=C(C#CC(C)(O)C)C=C12 DGLFSNZWRYADFC-UHFFFAOYSA-N 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000599 controlled substance Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- LBJNMUFDOHXDFG-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu].[Cu] LBJNMUFDOHXDFG-UHFFFAOYSA-N 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical compound O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 description 1
- IIRFCWANHMSDCG-UHFFFAOYSA-N cyclooctanone Chemical compound O=C1CCCCCCC1 IIRFCWANHMSDCG-UHFFFAOYSA-N 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- YDMWUMUNUXUYKT-UHFFFAOYSA-N ethyl [(1-oxo-1-phenylpropan-2-ylidene)amino] carbonate Chemical compound CCOC(=O)ON=C(C)C(=O)C1=CC=CC=C1 YDMWUMUNUXUYKT-UHFFFAOYSA-N 0.000 description 1
- PBJZAYSKNIIHMZ-UHFFFAOYSA-N ethyl carbamate;oxirane Chemical class C1CO1.CCOC(N)=O PBJZAYSKNIIHMZ-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical class CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- IPENDKRRWFURRE-UHFFFAOYSA-N fluoroimide Chemical compound C1=CC(F)=CC=C1N1C(=O)C(Cl)=C(Cl)C1=O IPENDKRRWFURRE-UHFFFAOYSA-N 0.000 description 1
- LWDCPOMFNRJKLX-UHFFFAOYSA-N formic acid;prop-2-enoic acid Chemical class OC=O.OC(=O)C=C LWDCPOMFNRJKLX-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229940100608 glycol distearate Drugs 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000005844 heterocyclyloxy group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine group Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- LOCAIGRSOJUCTB-UHFFFAOYSA-N indazol-3-one Chemical group C1=CC=C2C(=O)N=NC2=C1 LOCAIGRSOJUCTB-UHFFFAOYSA-N 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- MGIYRDNGCNKGJU-UHFFFAOYSA-N isothiazolinone Chemical group O=C1C=CSN1 MGIYRDNGCNKGJU-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical class [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N methyl cyclohexan-4-ol Natural products CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011325 microbead Substances 0.000 description 1
- 238000000199 molecular distillation Methods 0.000 description 1
- 229960005181 morphine Drugs 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- FMASTMURQSHELY-UHFFFAOYSA-N n-(4-fluoro-2-methylphenyl)-3-methyl-n-[(2-methyl-1h-indol-4-yl)methyl]pyridine-4-carboxamide Chemical compound C1=CC=C2NC(C)=CC2=C1CN(C=1C(=CC(F)=CC=1)C)C(=O)C1=CC=NC=C1C FMASTMURQSHELY-UHFFFAOYSA-N 0.000 description 1
- VFBILHPIHUPBPZ-UHFFFAOYSA-N n-[[2-[4-(difluoromethoxy)-3-propan-2-yloxyphenyl]-1,3-oxazol-4-yl]methyl]-2-ethoxybenzamide Chemical compound CCOC1=CC=CC=C1C(=O)NCC1=COC(C=2C=C(OC(C)C)C(OC(F)F)=CC=2)=N1 VFBILHPIHUPBPZ-UHFFFAOYSA-N 0.000 description 1
- DOWVMJFBDGWVML-UHFFFAOYSA-N n-cyclohexyl-n-methyl-4-(1-oxidopyridin-1-ium-3-yl)imidazole-1-carboxamide Chemical compound C1=NC(C=2C=[N+]([O-])C=CC=2)=CN1C(=O)N(C)C1CCCCC1 DOWVMJFBDGWVML-UHFFFAOYSA-N 0.000 description 1
- NNKPHNTWNILINE-UHFFFAOYSA-N n-cyclopropyl-3-fluoro-4-methyl-5-[3-[[1-[2-[2-(methylamino)ethoxy]phenyl]cyclopropyl]amino]-2-oxopyrazin-1-yl]benzamide Chemical compound CNCCOC1=CC=CC=C1C1(NC=2C(N(C=3C(=C(F)C=C(C=3)C(=O)NC3CC3)C)C=CN=2)=O)CC1 NNKPHNTWNILINE-UHFFFAOYSA-N 0.000 description 1
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical group O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 description 1
- CUGIGWZZILPRCH-UHFFFAOYSA-N naphtho[2,3-f]quinoline-1,2-dione Chemical class C1(C(C=NC2=C1C1=CC3=CC=CC=C3C=C1C=C2)=O)=O CUGIGWZZILPRCH-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 239000001053 orange pigment Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical group C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 125000000160 oxazolidinyl group Chemical group 0.000 description 1
- GSWAOPJLTADLTN-UHFFFAOYSA-N oxidanimine Chemical compound [O-][NH3+] GSWAOPJLTADLTN-UHFFFAOYSA-N 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- 238000010951 particle size reduction Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 125000005328 phosphinyl group Chemical group [PH2](=O)* 0.000 description 1
- 125000005499 phosphonyl group Chemical group 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 125000000612 phthaloyl group Chemical group C(C=1C(C(=O)*)=CC=CC1)(=O)* 0.000 description 1
- 229940110337 pigment blue 1 Drugs 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- LZMJNVRJMFMYQS-UHFFFAOYSA-N poseltinib Chemical compound C1CN(C)CCN1C(C=C1)=CC=C1NC1=NC(OC=2C=C(NC(=O)C=C)C=CC=2)=C(OC=C2)C2=N1 LZMJNVRJMFMYQS-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- GZTPJDLYPMPRDF-UHFFFAOYSA-N pyrrolo[3,2-c]pyrazole Chemical compound N1=NC2=CC=NC2=C1 GZTPJDLYPMPRDF-UHFFFAOYSA-N 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- GGVMPKQSTZIOIU-UHFFFAOYSA-N quaterrylene Chemical group C12=C3C4=CC=C2C(C2=C56)=CC=C5C(C=57)=CC=CC7=CC=CC=5C6=CC=C2C1=CC=C3C1=CC=CC2=CC=CC4=C21 GGVMPKQSTZIOIU-UHFFFAOYSA-N 0.000 description 1
- JWVCLYRUEFBMGU-UHFFFAOYSA-N quinazoline Chemical group N1=CN=CC2=CC=CC=C21 JWVCLYRUEFBMGU-UHFFFAOYSA-N 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XIIOFHFUYBLOLW-UHFFFAOYSA-N selpercatinib Chemical compound OC(COC=1C=C(C=2N(C=1)N=CC=2C#N)C=1C=NC(=CC=1)N1CC2N(C(C1)C2)CC=1C=NC(=CC=1)OC)(C)C XIIOFHFUYBLOLW-UHFFFAOYSA-N 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- XGVXKJKTISMIOW-ZDUSSCGKSA-N simurosertib Chemical compound N1N=CC(C=2SC=3C(=O)NC(=NC=3C=2)[C@H]2N3CCC(CC3)C2)=C1C XGVXKJKTISMIOW-ZDUSSCGKSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical group C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 125000000565 sulfonamide group Chemical group 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 125000006296 sulfonyl amino group Chemical group [H]N(*)S(*)(=O)=O 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000005000 thioaryl group Chemical group 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- HTSABYAWKQAHBT-UHFFFAOYSA-N trans 3-methylcyclohexanol Natural products CC1CCCC(O)C1 HTSABYAWKQAHBT-UHFFFAOYSA-N 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 239000001003 triarylmethane dye Substances 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/32—Monomers containing only one unsaturated aliphatic radical containing two or more rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
- C08K5/3417—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
- C09B67/0033—Blends of pigments; Mixtured crystals; Solid solutions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
- C09B67/006—Preparation of organic pigments
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Theoretical Computer Science (AREA)
- Structural Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Architecture (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Filters (AREA)
Abstract
Description
本發明係關於一種含有色材之樹脂組成物。又,本發明係關於一種使用樹脂組成物之膜、濾光器、固體攝像元件及圖像顯示裝置。The invention relates to a resin composition containing color material. Also, the present invention relates to a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition.
使用含有色材之樹脂組成物來進行濾色器等濾光器的製造。Manufacturing of optical filters such as color filters using resin compositions containing coloring materials.
例如,在專利文獻1中記載有使用樹脂組成物來製造濾色器之方法,前述樹脂組成物含有:有機顏料奈米粒子,其為一次粒子的數平均粒徑為50nm以下且數平均粒徑與體積平均粒徑之比([體積平均粒徑]/[數平均粒徑])為1.0~2.0;接枝聚合物,在主鏈至少包含有機色素殘基之重複單元;聚合性化合物及光聚合起始劑。For example, Patent Document 1 describes a method of producing a color filter using a resin composition containing organic pigment nanoparticles having a number average particle diameter of primary particles of 50 nm or less and a number average particle diameter of 50 nm or less. The ratio to the volume average particle size ([volume average particle size]/[number average particle size]) is 1.0 to 2.0; the graft polymer contains at least repeating units of organic pigment residues in the main chain; polymerizable compounds and optical Polymerization initiator.
[專利文獻1]日本特開2009-084418號公報[Patent Document 1] Japanese Patent Laid-Open No. 2009-084418
近年來,固體攝像元件中對小型化或薄膜化的要求強烈。因此,近年來,在固體攝像元件中所使用之包含濾色器等色材之膜,亦希望更薄膜化。為了維持所期望的分光性能的同時實現薄膜化,需要提高用於膜形成之樹脂組成物的色材濃度。In recent years, there has been a strong demand for miniaturization and thinning of solid-state imaging devices. Therefore, in recent years, films including color materials such as color filters used in solid-state imaging devices are also required to be thinner. In order to achieve thinning while maintaining the desired spectral performance, it is necessary to increase the concentration of the coloring material in the resin composition used for film formation.
然而,在作為色材使用含有顏料者之情況下,若樹脂組成物的色材濃度高,則能夠吸附於樹脂等顏料之材料的比例相對減少,因此存在保管樹脂組成物時或塗佈樹脂組成物時顏料容易凝聚之傾向,從而在使用樹脂組成物獲得之膜中有可能產生顏料的凝聚物。若在膜中生成這種顏料的凝聚物,則局部存在大的粒徑的顏料等、膜中存在之顏料的粒徑的偏差變大,因此容易產生顏色不均勻。However, in the case of using a pigment-containing material as the color material, if the color material concentration of the resin composition is high, the ratio of the material that can be adsorbed to the pigment such as resin is relatively reduced, so when storing the resin composition or coating the resin composition Pigment tends to aggregate easily when used as a resin composition, so pigment aggregates may occur in the film obtained by using the resin composition. When such aggregates of pigments are formed in the film, pigments with large particle diameters are locally present, and the particle diameters of the pigments present in the film vary greatly, so color unevenness tends to occur.
從而,本發明的目的為提供一種能夠形成抑制顏色不均勻之膜之樹脂組成物。又,本發明提供一種膜、濾光器、固體攝像元件及圖像顯示裝置。Therefore, an object of the present invention is to provide a resin composition capable of forming a film in which color unevenness is suppressed. Also, the present invention provides a film, an optical filter, a solid-state imaging device, and an image display device.
依據本發明人的研究,發現了藉由後述之樹脂組成物能夠實現上述目的,從而完成了本發明。藉此,本發明提供以下內容。According to the studies of the present inventors, it was found that the above objects can be achieved by a resin composition described later, and the present invention has been accomplished. Accordingly, the present invention provides the following.
一種樹脂組成物,其含有色材A及樹脂B,其中, 上述色材A含有顏料, 上述樹脂B含有樹脂b1,前述樹脂b1包含具有酸基之重複單元b1-1、具有選自包含2個以上的芳香族環之基團、包含雜環基之基團及包含縮合環之基團中之官能基b之重複單元b1-2及除了上述重複單元b1-1及上述重複單元b1-2以外的重複單元b1-3, 上述樹脂組成物的總固體成分中的上述色材A的含量為55質量%以上。 <2>如<1>所述之樹脂組成物,其中 上述色材A含有酞青顏料。 <3>如<1>或<2>所述之樹脂組成物,其中 上述色材A還含有染料。 <4>如<1>至<3>之任一項所述之樹脂組成物,其中 上述官能基b為含有萘二甲醯亞胺結構、吖啶酮結構、9-氧硫口山口星結構、氧雜蒽酮結構、蔥酮結構、苯并咪唑結構、苯并噻唑結構、苯并㗁唑結構、苯并三唑結構、苯并㗁二唑結構、苯并噻二唑結構、苯并噻𠯤結構、苯并㗁𠯤結構、苯甲醯脲結構、異噻唑啉酮結構、啡㗁𠯤結構、啡噻𠯤結構、二羥基吖啶結構、啡㗁噻結構、二苯并哌喃結構、茀結構、咔唑結構、咔啉結構、二苯并噻吩結構、二苯并呋喃結構、嘧啶結構、吡𠯤結構、喹唑啉結構、喹㗁啉結構、喹啉結構、咪唑結構、噻唑結構、吲哚結構、苯并噻吩結構、苯并哌喃結構、喹啉酮結構、硫口克唍酮結構、口克唍結構、苯并咪唑酮結構、鄰苯二甲醯亞胺結構、萘-2,3-二羧基醯亞胺結構、吡唑結構、吡唑琳桐結構、異吲哚啉結構、異吲哚啉酮結構、蒽醌結構、四唑結構、二苯甲酮結構、三𠯤結構、偶氮苯結構、亞苄苯胺結構、啡𠯤結構、巴比妥酸結構、苝結構、紫環酮結構、喹啉黃結構、己內醯胺結構、糖精結構、聯苯結構、三芳基苯結構、三芳基胺結構、苯并二氫噻唑酮結構或苯并㗁唑啉酮結構之基團。 <5>如<1>至<3>之任一項所述之樹脂組成物,其中 上述官能基b為含有萘二甲醯亞胺結構、吖啶酮結構、氧雜蒽酮結構、苯并咪唑結構、苯并噻唑結構、苯并㗁唑結構、苯并三唑結構、苯并㗁二唑結構、苯并噻二唑結構、啡㗁𠯤結構、啡噻𠯤結構、啡㗁噻結構、鄰苯二甲醯亞胺結構、吡唑琳桐結構、四唑結構、苯并二氫噻唑酮結構或苯并㗁唑啉酮結構之基團。 <6>如<1>至<5>之任一項所述之樹脂組成物,其中 上述樹脂b1中的上述單元b1-2的含量為10~35質量%。 <7>如<1>至<6>之任一項所述之樹脂組成物,其中 上述重複單元b1-3包含具有聚酯結構或聚醚結構的接枝鏈之重複單元。 <8>如<1>至<7>之任一項所述之樹脂組成物,其中 上述樹脂B還包含與上述樹脂b1不同之樹脂b2。 <9>如<8>所述之樹脂組成物,其中 上述樹脂b2包含具有與上述樹脂b1不同之酸基之樹脂。 <10>如<9>所述之樹脂組成物,其中 上述樹脂b2具有比上述樹脂b1所具有之酸基更小之pKa的酸基。 <11>如<8>至<10>之任一項所述之樹脂組成物,其中 上述樹脂b2包含選自接枝聚合物、星形聚合物、嵌段共聚物及聚合物鏈中的至少一個末端被酸基密封之樹脂中之至少1種。 <12>如<1>至<11>之任一項所述之樹脂組成物,其還含有聚合性化合物及光聚合起始劑。 <13>一種膜,其係由<1>至<12>之任一項所述之樹脂組成物獲得。 <14>一種濾光器,其具有<13>所述之膜。 <15>一種固體攝像元件,其具有<13>所述之膜。 <16>一種圖像顯示裝置,其具有<13>所述之膜。 [發明效果] A resin composition, which contains color material A and resin B, wherein, The above-mentioned color material A contains a pigment, The above-mentioned resin B contains a resin b1, and the above-mentioned resin b1 includes a repeating unit b1-1 having an acid group, a group having two or more aromatic rings, a group including a heterocyclic group, and a group including a condensed ring The repeating unit b1-2 of the functional group b and the repeating unit b1-3 other than the above repeating unit b1-1 and the above repeating unit b1-2, Content of the said color material A in the total solid content of the said resin composition is 55 mass % or more. <2> The resin composition as described in <1>, wherein Said color material A contains a phthalocyanine pigment. <3> The resin composition as described in <1> or <2>, wherein The above-mentioned color material A further contains a dye. <4> The resin composition according to any one of <1> to <3>, wherein The above-mentioned functional group b contains a naphthalimide structure, an acridone structure, a 9-oxosulfur star structure, an xanthone structure, an onion structure, a benzimidazole structure, a benzothiazole structure, a benzo㗁azole structure, benzotriazole structure, benzodiazole structure, benzothiadiazole structure, benzothia𠯤 structure, benzo㗁𠯤 structure, benzoyl urea structure, isothiazolinone structure, phenanthene 𠯤 structure, thiophene 𠯤 structure, dihydroxyacridine structure, phenothiophene structure, dibenzopyran structure, oxene structure, carbazole structure, carboline structure, dibenzothiophene structure, dibenzofuran structure, pyrimidine Structure, pyryrone structure, quinazoline structure, quinoline structure, quinoline structure, imidazole structure, thiazole structure, indole structure, benzothiophene structure, benzopyran structure, quinolinone structure, thiocarbazone Ketone structure, ketone structure, benzimidazolone structure, phthalimide structure, naphthalene-2,3-dicarboxyimide structure, pyrazole structure, pyrazolene structure, isoindoline Structure, isoindolinone structure, anthraquinone structure, tetrazole structure, benzophenone structure, trioxane structure, azobenzene structure, benzylidene aniline structure, phenanthrene structure, barbituric acid structure, perylene structure, The base of perionone structure, quinoline yellow structure, caprolactam structure, saccharin structure, biphenyl structure, triarylbenzene structure, triarylamine structure, benzodihydrothiazolone structure or benzoxazolone structure group. <5> The resin composition according to any one of <1> to <3>, wherein The above functional group b contains naphthalimide structure, acridone structure, xanthone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, benzotriazole structure, benzo Oxadiazole structure, benzothiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, phthalimide structure, pyrazolidine structure, tetrazole structure, benzodihydrothiazole A group with a ketone structure or a benzoxazolone structure. <6> The resin composition according to any one of <1> to <5>, wherein Content of the said unit b1-2 in the said resin b1 is 10-35 mass %. <7> The resin composition according to any one of <1> to <6>, wherein The above-mentioned repeating unit b1-3 includes a repeating unit having a grafted chain of a polyester structure or a polyether structure. <8> The resin composition according to any one of <1> to <7>, wherein The above-mentioned resin B further includes a resin b2 different from the above-mentioned resin b1. <9> The resin composition as described in <8>, wherein The above-mentioned resin b2 contains a resin having an acid group different from that of the above-mentioned resin b1. <10> The resin composition as described in <9>, wherein The said resin b2 has the acid group of pKa smaller than the acid group which the said resin b1 has. <11> The resin composition according to any one of <8> to <10>, wherein The resin b2 includes at least one selected from the group consisting of graft polymers, star polymers, block copolymers, and resins in which at least one terminal of the polymer chain is sealed with an acid group. <12> The resin composition according to any one of <1> to <11>, further comprising a polymerizable compound and a photopolymerization initiator. <13> A film obtained from the resin composition according to any one of <1> to <12>. <14> An optical filter comprising the film described in <13>. <15> A solid-state imaging device having the film according to <13>. <16> An image display device comprising the film according to <13>. [Invention effect]
依據本發明,能夠提供一種能夠形成抑制顏色不均勻之膜之樹脂組成物。又,能夠提供一種膜、濾光器、固體攝像元件及圖像顯示裝置。According to the present invention, it is possible to provide a resin composition capable of forming a film in which color unevenness is suppressed. In addition, it is possible to provide a film, an optical filter, a solid-state imaging device, and an image display device.
以下,對本發明的內容進行詳細說明。 在本說明書中,“~”係以將記載於其前後之數值作為下限值及上限值而包含之含義來使用。 本說明書中之基團(原子團)的標記中,未標有經取代及未經取代之標記包含不具有取代基之基團(原子團),並且亦包含具有取代基之基團(原子團)。例如,“烷基”不僅包含不具有取代基之烷基(未經取代之烷基),而且還包含具有取代基之烷基(經取代之烷基)。 在本說明書中,“曝光”只要沒有特別指定,不僅包含使用光之曝光,而且使用電子束、離子束等粒子束之描畫亦包含於曝光中。又,作為曝光中所使用之光,可舉出水銀燈的明線光譜、以準分子雷射為代表之遠紫外線、極紫外線(EUV光)、X射線、電子束等光化射線或放射線。 在本說明書中,“(甲基)丙烯酸酯”表示丙烯酸酯及甲基丙烯酸酯兩者或任一者,“(甲基)丙烯酸”表示丙烯酸及甲基丙烯酸兩者或任一者,“(甲基)丙烯醯基”表示丙烯醯基及甲基丙烯醯基兩者或任一者。 在本說明書中,結構式中的Me表示甲基,Et表示乙基,Bu表示丁基,Ph表示苯基。 在本說明書中,重量平均分子量及數量平均分子量為藉由GPC(凝膠滲透層析)法測量出的聚苯乙烯換算值。 在本說明書中,總固體成分係指從組成物的所有成分中去除溶劑之成分的總質量。 在本說明書中,顏料係指不易溶解於溶劑中的色材。 在本說明書中,“步驟”這一用語,不僅包含獨立之步驟,而且即使在無法與其他步驟明確地進行區分之情況下,只要發揮該步驟的所期待的作用,則亦包含於本用語中。 Hereinafter, the content of the present invention will be described in detail. In this specification, "-" is used in the meaning which includes the numerical value described before and after it as a lower limit and an upper limit. In the notation of a group (atomic group) in this specification, the notation indicating substituted and unsubstituted includes a group (atomic group) without a substituent, and also includes a group (atomic group) having a substituent. For example, "alkyl" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. In addition, examples of light used for exposure include the bright line spectrum of a mercury lamp, extreme ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, electron beams, and other actinic rays or radiation. In this specification, "(meth)acrylate" means both or either of acrylate and methacrylate, "(meth)acrylic" means both or either of acrylic and methacrylic, "( "Meth)acryl" means both or either of acryl and methacryl. In this specification, Me in the structural formulas represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. In this specification, the weight average molecular weight and number average molecular weight are polystyrene conversion values measured by the GPC (gel permeation chromatography) method. In this specification, the total solid content refers to the total mass of components excluding solvents from all the components of the composition. In this specification, a pigment refers to a color material that is not easily soluble in a solvent. In this specification, the term "step" not only includes independent steps, but also includes in this term as long as the expected function of the step is exerted even if it cannot be clearly distinguished from other steps. .
<樹脂組成物> 本發明的樹脂組成物,其含有色材A及樹脂B,其特徵為, 上述色材A含有顏料, 上述樹脂B含有樹脂b1,前述樹脂b1包含具有酸基之重複單元b1-1、具有選自包含2個以上的芳香族環之基團、包含雜環基之基團及包含縮合環之基團中之官能基b之重複單元b1-2及除了重複單元b1-1及重複單元b1-2以外的重複單元b1-3, 樹脂組成物的總固體成分中的色材A的含量為55質量%以上。 <Resin composition> The resin composition of the present invention, which contains colorant A and resin B, is characterized by: The above-mentioned color material A contains a pigment, The above-mentioned resin B contains a resin b1, and the above-mentioned resin b1 includes a repeating unit b1-1 having an acid group, a group having two or more aromatic rings, a group including a heterocyclic group, and a group including a condensed ring The repeating unit b1-2 of the functional group b and the repeating unit b1-3 other than the repeating unit b1-1 and the repeating unit b1-2, Content of the color material A in the total solid content of a resin composition is 55 mass % or more.
依據本發明的樹脂組成物,藉由含有上述之樹脂b1,儘管樹脂組成物的總固體成分中的色材A的含量為55質量%以上,亦能夠形成可抑制顏色不均勻之膜。According to the resin composition of the present invention, by containing the above-mentioned resin b1, even if the content of the color material A in the total solid content of the resin composition is 55% by mass or more, a film in which color unevenness can be suppressed can be formed.
本發明的樹脂組成物可較佳地用作濾光器用樹脂組成物。作為濾光器,可舉出濾色器、近紅外線透過濾波器、近紅外線截止濾波器等,濾色器為較佳。又,本發明的樹脂組成物可較佳地用作固體攝像元件。更具體而言,可較佳地用作固體攝像元件中所使用之濾光器用樹脂組成物,可更佳地用作固體攝像元件中所使用之濾色器的著色像素形成用樹脂組成物。The resin composition of the present invention can be preferably used as a resin composition for optical filters. As an optical filter, a color filter, a near-infrared ray transmission filter, a near-infrared ray cut filter, etc. are mentioned, A color filter is preferable. In addition, the resin composition of the present invention can be preferably used as a solid-state imaging device. More specifically, it can be preferably used as a resin composition for an optical filter used in a solid-state imaging device, and can be more preferably used as a resin composition for forming colored pixels of a color filter used in a solid-state imaging device.
作為濾色器,可舉出具有使特定的波長的光透過之著色像素之濾波器。作為著色像素,可舉出紅色像素、綠色像素、藍色像素、品紅色像素、青色像素、黃色像素等,綠色像素、藍色像素或青色像素為較佳,綠色像素為更佳。濾色器的著色像素能夠使用含有彩色色材之樹脂組成物來形成。As a color filter, the filter which has the colored pixel which transmits the light of a specific wavelength is mentioned. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels. Green pixels, blue pixels, or cyan pixels are preferred, and green pixels are more preferred. Colored pixels of the color filter can be formed using a resin composition containing a color material.
近紅外線截止濾波器的極大吸收波長存在於波長700~1800nm的範圍為較佳,存在於波長700~1300nm的範圍為更佳,存在於波長700~1000nm的範圍為進一步較佳。又,近紅外線截止濾波器的在波長400~650nm的所有範圍內的透過率為70%以上為較佳,80%以上為更佳,90%以上為進一步較佳。又,波長700~1800nm的範圍內的至少1點上的透過率為20%以下為較佳。又,近紅外線截止濾波器的極大吸收波長下的吸光度Amax與波長550nm下的吸光度A550之比(吸光度Amax/吸光度A550)為20~500為較佳,50~500為更佳,70~450為進一步較佳,100~400為特佳。近紅外線截止濾波器能夠使用包含近紅外線吸收色材之樹脂組成物來形成。The maximum absorption wavelength of the near-infrared cut filter is preferably in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm, and still more preferably in the wavelength range of 700 to 1000 nm. In addition, the transmittance of the near-infrared cut filter is preferably 70% or higher in the entire wavelength range of 400 to 650 nm, more preferably 80% or higher, and still more preferably 90% or higher. Also, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. In addition, the ratio of the absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter to the absorbance A550 at a wavelength of 550 nm (absorbance Amax/absorbance A550) is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. More preferably, 100-400 is especially preferable. The near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing color material.
近紅外線透過濾波器為透過近紅外線中的至少一部分之濾波器。近紅外線透射濾波器為遮蔽可見光中的至少一部分並且使近紅外線中的至少一部分透過之濾波器為較佳。作為近紅外線透過濾波器,可較佳地舉出滿足波長400~640nm的範圍內的透過率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且波長1100~1300nm的範圍內的透過率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之分光特性之濾波器等。近紅外線透過濾波器為滿足以下(1)~(5)之任一個分光特性之濾波器為較佳。 (1):波長400~640nm的範圍內的透過率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且波長800~1500nm的範圍內的透過率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (2):波長400~750nm的範圍內的透過率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且波長900~1500nm的範圍內的透過率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (3):波長400~830nm的範圍內的透過率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且波長1000~1500nm的範圍內的透過率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (4):波長400~950nm的範圍內的透過率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且波長1100~1500nm的範圍內的透過率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (5):波長400~1050nm的範圍內的透過率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且波長1200~1500nm的範圍內的透過率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 The near-infrared pass filter is a filter that passes at least part of near-infrared rays. The near-infrared transmission filter is preferably a filter that blocks at least a part of visible light and transmits at least a part of near-infrared rays. As a near-infrared ray transmission filter, it is preferable to mention that the maximum transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the wavelength is 1100 to 640 nm. Filters and the like having spectral characteristics whose minimum transmittance in the range of 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more). The near-infrared ray transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5). (1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (3): The maximum value of the transmittance in the wavelength range of 400-830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1000-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (4): The maximum value of the transmittance in the wavelength range of 400-950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1100-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (5): The maximum value of the transmittance in the wavelength range of 400-1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1200-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%).
本發明的樹脂組成物亦能夠用於遮光膜等。The resin composition of the present invention can also be used for light-shielding films and the like.
本發明的樹脂組成物的固體成分濃度為5~30質量%為較佳。下限為7.5質量%以上為較佳,10質量%以上為更佳。上限為25質量%以下為較佳,20質量%以下為更佳,15質量%以下為進一步較佳。It is preferable that the solid content concentration of the resin composition of this invention is 5-30 mass %. The lower limit is preferably at least 7.5% by mass, more preferably at least 10% by mass. The upper limit is preferably at most 25% by mass, more preferably at most 20% by mass, and still more preferably at most 15% by mass.
以下,對本發明的樹脂組成物中所使用之各成分進行說明。Hereinafter, each component used for the resin composition of this invention is demonstrated.
<<色材A>> 本發明的樹脂組成物含有色材A(以下,記載為色材)。作為色材,可舉出白色色材、黑色色材、彩色色材及近紅外線吸收色材。又,色材中亦能夠使用顏料衍生物。再者,本發明中,白色色材不僅包括純白色,而且還包括接近白色之淺灰色(例如灰白色、薄灰色等)的色材。 <<Color material A>> The resin composition of the present invention contains the color material A (hereinafter referred to as color material). Examples of the color material include a white color material, a black color material, a colored color material, and a near-infrared absorption color material. Moreover, a pigment derivative can also be used for a color material. Furthermore, in the present invention, the white color material includes not only pure white, but also light gray color materials close to white (such as off-white, thin gray, etc.).
本發明的樹脂組成物中所含有之色材可使用含有顏料者。顏料可以為無機顏料、有機顏料中的任一種,從顏色變化的多少、分散的容易性、安全性等觀點考慮,有機顏料為較佳。又,顏料包含選自彩色顏料及近紅外線吸收顏料中之至少1種為較佳,包含彩色顏料為更佳。As the coloring material contained in the resin composition of the present invention, those containing pigments can be used. The pigment may be any of inorganic pigments and organic pigments, and organic pigments are preferred from the viewpoints of color change, ease of dispersion, and safety. Also, the pigment preferably contains at least one selected from color pigments and near-infrared absorbing pigments, and more preferably contains color pigments.
又,色材包含選自酞青顏料、二㗁𠯤顏料、喹吖酮顏料、蒽醌顏料、苝顏料、偶氮顏料、甲亞胺顏料、二酮吡咯并吡咯顏料、吡咯并吡咯顏料、異吲哚啉顏料及喹啉黃顏料中之至少1種者為較佳,包含選自酞青顏料、二酮吡咯并吡咯顏料及吡咯并吡咯顏料中之至少1種者為更佳,從更顯著發揮本發明的效果之理由考慮,包含酞青顏料者為進一步較佳。又,酞青顏料為不持有中心金屬之酞青顏料或作為中心金屬具有銅或鋅之酞青顏料為較佳,作為中心金屬具有銅或鋅之酞青顏料為更佳。又,酞青顏料為鹵化酞青顏料為較佳。In addition, the color material includes a pigment selected from phthalocyanine pigments, dimethicone pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, azo pigments, azomethine pigments, diketopyrrolopyrrole pigments, pyrrolopyrrole pigments, iso Preferably at least one of indoline pigments and quinoline yellow pigments, more preferably at least one selected from phthalocyanine pigments, diketopyrrolopyrrole pigments, and pyrrolopyrrole pigments. From the viewpoint of exhibiting the effects of the present invention, it is more preferable to include a phthalocyanine pigment. Also, the phthalocyanine pigment is preferably a phthalocyanine pigment that does not have a central metal or a phthalocyanine pigment that has copper or zinc as a central metal, and is more preferably a phthalocyanine pigment that has copper or zinc as a central metal. Also, the phthalocyanine pigment is preferably a halogenated phthalocyanine pigment.
顏料的平均一次粒徑為1~200nm為較佳。下限為5nm以上為較佳,10nm以上為更佳。上限為180nm以下為較佳,150nm以下為更佳,100nm以下為進一步較佳。若顏料的平均一次粒徑在上述範圍內,則樹脂組成物中的顏料的分散穩定性良好。再者,在本發明中,顏料的一次粒徑能夠藉由透過型電子顯微鏡觀察顏料的一次粒子,並依據所獲得之照片來求出。具體而言,求出顏料的一次粒子的投影面積,並計算與其相對應之等效圓直徑作為顏料的一次粒徑。又,將本發明中的平均一次粒徑設為關於400個顏料的一次粒子的一次粒徑的算數平均值。又,顏料的一次粒子係指未凝聚的獨立粒子。The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably at most 180 nm, more preferably at most 150 nm, and still more preferably at most 100 nm. When the average primary particle diameter of the pigment is within the above-mentioned range, the dispersion stability of the pigment in the resin composition will be good. Furthermore, in the present invention, the primary particle size of the pigment can be obtained by observing the primary particle of the pigment with a transmission electron microscope and obtaining the obtained photograph. Specifically, the projected area of the primary particle of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle diameter of the pigment. Moreover, the average primary particle diameter in this invention is made into the arithmetic mean value about the primary particle diameter of the primary particle of 400 pigments. In addition, the primary particle of the pigment refers to unaggregated independent particles.
有機顏料及顏料衍生物的微晶尺寸為0.1~50nm為較佳,0.5~30nm為更佳,1~15nm為進一步較佳。微晶尺寸能夠使用X射線繞射裝置並且由繞射角的峰值的半值寬來求出,可使用謝樂公式來算出。有機顏料及顏料衍生物的微晶尺寸能夠藉由製造條件的調整、製造之後粉碎等公知的方法來調整。The crystallite size of organic pigments and pigment derivatives is preferably from 0.1 to 50 nm, more preferably from 0.5 to 30 nm, and still more preferably from 1 to 15 nm. The crystallite size can be obtained from the half-value width of the peak value of the diffraction angle using an X-ray diffraction device, and can be calculated using the Scherrer formula. The crystallite size of organic pigments and pigment derivatives can be adjusted by known methods such as adjustment of production conditions and pulverization after production.
本發明的樹脂組成物中所含有之色材係含有顏料及顏料衍生物者為較佳。作為顏料衍生物,可舉出具有在色素骨架上鍵結有酸基或鹼基而成之結構之化合物。關於顏料衍生物的詳細內容,待留後述。顏料衍生物的含量相對於顏料100質量份係1~30質量份為較佳,3~20質量份為進一步較佳。顏料衍生物可以僅使用1種,亦可以併用2種以上。It is preferable that the coloring material contained in the resin composition of the present invention contains pigments and pigment derivatives. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton. The details of the pigment derivatives will be described later. The content of the pigment derivative is preferably 1 to 30 parts by mass with respect to 100 parts by mass of the pigment, more preferably 3 to 20 parts by mass. Pigment derivatives may be used alone or in combination of two or more.
本發明的樹脂組成物中所含有之色材還可以為含有染料者。在含有染料之情況下,染料的含量相對於顏料100質量份為10~100質量份為較佳。上限為80質量份以下為較佳,70質量份以下為更佳。下限為20質量份以上為較佳,30質量份以上為更佳,40質量份以上為進一步較佳。染料可以僅使用1種,亦可以併用2種以上。 又,本發明的樹脂組成物中所含有之色材係實質上不含有染料者亦較佳。依據該態樣,能夠形成耐光性或耐熱性優異之膜。實質上不含有染料係指色材中的染料的含量為0.1質量%以下,0.01質量%以下為較佳,不含有為進一步較佳。 The coloring material contained in the resin composition of the present invention may also contain a dye. When a dye is contained, the content of the dye is preferably 10 to 100 parts by mass relative to 100 parts by mass of the pigment. The upper limit is preferably at most 80 parts by mass, more preferably at most 70 parts by mass. The lower limit is preferably at least 20 parts by mass, more preferably at least 30 parts by mass, and still more preferably at least 40 parts by mass. One type of dye may be used alone, or two or more types may be used in combination. Moreover, it is also preferable that the coloring material contained in the resin composition of this invention does not contain a dye substantially. According to this aspect, a film excellent in light resistance or heat resistance can be formed. Not containing a dye substantially means that the content of the dye in the color material is 0.1% by mass or less, preferably 0.01% by mass or less, and is more preferably not contained.
(彩色色材) 作為彩色色材,可舉出在波長400~700nm的範圍內具有極大吸收波長之色材。例如可舉出黃色色材、橙色色材、紅色色材、綠色色材、紫色色材、藍色色材等。從耐熱性的觀點考慮,彩色色材為顏料(彩色顏料)為較佳,紅色顏料、黃色顏料及藍色顏料為更佳,紅色顏料及藍色顏料為進一步較佳。作為彩色顏料的具體例,例如可舉出以下所示者。 (color material) As a color material, the color material which has a maximum absorption wavelength in the wavelength range of 400-700 nm is mentioned. For example, a yellow color material, an orange color material, a red color material, a green color material, a purple color material, a blue color material, etc. are mentioned. From the viewpoint of heat resistance, the color material is preferably a pigment (color pigment), more preferably a red pigment, a yellow pigment, and a blue pigment, and even more preferably a red pigment and a blue pigment. As a specific example of a color pigment, what is shown below is mentioned, for example.
作為紅色色材,可舉出二酮吡咯并吡咯化合物、蒽醌化合物、偶氮化合物、萘酚化合物、甲亞胺化合物、口山口星化合物、喹吖酮化合物、苝化合物、硫靛化合物等,二酮吡咯并吡咯化合物、蒽醌化合物、偶氮化合物為較佳,二酮吡咯并吡咯化合物為更佳。又,紅色色材為顏料為較佳。Examples of red coloring materials include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, methimine compounds, Kouyama compounds, quinacridone compounds, perylene compounds, and thioindigo compounds. A diketopyrrolopyrrole compound, an anthraquinone compound, and an azo compound are preferable, and a diketopyrrolopyrrole compound is more preferable. Also, it is preferable that the red color material is a pigment.
作為紅色色材的具體例,可舉出C.I.(比色指數)顏料紅1、2、3、4、5、6、7、9、10、14、17、22、23、31、38、41、48:1、48:2、48:3、48:4、49、49:1、49:2、52:1、52:2、53:1、57:1、60:1、63:1、66、67、81:1、81:2、81:3、83、88、90、105、112、119、122、123、144、146、149、150、155、166、168、169、170、171、172、175、176、177、178、179、184、185、187、188、190、200、202、206、207、208、209、210、216、220、224、226、242、246、254、255、264、269、270、272、279、291、294、295、296、297等紅色顏料。又,作為紅色色材,亦能夠使用日本特開2017-201384號公報中所記載之在結構中取代至少1個溴原子之二酮吡咯并吡咯化合物、日本專利第6248838號的0016~0022段中所記載之二酮吡咯并吡咯化合物、國際公開第2012/102399號中所記載之二酮吡咯并吡咯化合物、國際公開第2012/117965號中所記載之二酮吡咯并吡咯化合物、日本特開2020-085947號公報中所記載之溴化二酮吡咯并吡咯化合物、日本特開2012-229344號公報中所記載之萘酚偶氮化合物、日本專利第6516119號公報中所記載之紅色色材、日本專利第6525101號公報中所記載之紅色色材、日本特開2020-090632號公報的0229段中所記載之溴化二酮吡咯并吡咯化合物、韓國公開專利第10-2019-0140741號公報中所記載之蒽醌化合物、韓國公開專利第10-2019-0140744號公報中所記載之蒽醌化合物、日本特開2020-079396號公報中所記載之苝化合物、日本特開2020-066702號公報的0025~0041段中所記載之二酮吡咯并吡咯化合物等。又,作為紅色色材,還能夠使用具有導入有氧原子、硫原子或氮原子鍵結於芳香族環而得之基團之芳香族環基鍵結於二酮吡咯并吡咯骨架而成之結構之化合物。Specific examples of red color materials include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41 , 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1 , 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170 ,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246 , 254, 255, 264, 269, 270, 272, 279, 291, 294, 295, 296, 297 and other red pigments. In addition, as a red coloring material, diketopyrrolopyrrole compounds in which at least one bromine atom is substituted in the structure described in JP-A-2017-201384 and in paragraphs 0016 to 0022 of JP-A-6248838 can also be used. The diketopyrrolopyrrole compound described, the diketopyrrolopyrrole compound described in International Publication No. 2012/102399, the diketopyrrolopyrrole compound described in International Publication No. 2012/117965, JP 2020 - Brominated diketopyrrolopyrrole compounds described in Gazette No. 085947, naphthol azo compounds described in JP 2012-229344 Gazette, red coloring materials described in JP 6516119 Gazette, Japan The red coloring material described in Patent No. 6525101, the brominated diketopyrrolopyrrole compound described in paragraph 0229 of Japanese Patent Application Laid-Open No. 2020-090632, the Korean patent publication No. 10-2019-0140741 Anthraquinone compounds described in Korean Laid-Open Patent No. 10-2019-0140744, perylene compounds described in Japanese Patent Laid-Open No. 2020-079396, 0025 in Japanese Patent Laid-Open No. 2020-066702 Diketopyrrolopyrrole compounds described in paragraph 0041, etc. Also, as a red coloring material, a structure in which an aromatic ring group having a group in which an oxygen atom, a sulfur atom, or a nitrogen atom is introduced and bonded to an aromatic ring is bonded to a diketopyrrolopyrrole skeleton can also be used. compound.
作為紅色色材,C.I.顏料紅122、177、254、255、264、269、272為較佳,C.I.顏料紅254、264、272為更佳,C.I.顏料紅254、264為進一步較佳。As a red color material, C.I. Pigment Red 122, 177, 254, 255, 264, 269, 272 are more preferable, C.I. Pigment Red 254, 264, 272 are more preferable, and C.I. Pigment Red 254, 264 are further preferable.
作為綠色色材,可舉出酞菁化合物、方酸菁化合物等,酞菁化合物為較佳,酞菁顏料為更佳。又,綠色色材為顏料為較佳。Examples of the green color material include phthalocyanine compounds and squarylium compounds, among which phthalocyanine compounds are preferred, and phthalocyanine pigments are more preferred. Also, it is preferable that the green color material is a pigment.
作為綠色色材的具體例,可舉出C.I.顏料綠7、10、36、37、58、59、62、63、64、65、66等綠色顏料。又,作為綠色色材,還能夠使用一分子中的鹵素原子數平均為10~14個、溴原子數平均為8~12個、氯原子數平均為2~5個之鹵化鋅酞菁顏料。作為具體例,可舉出國際公開第2015/118720號中所記載之化合物。又,作為綠色色材,亦能夠使用中國專利申請第106909027號說明書中所記載之化合物、國際公開第2012/102395號中所記載之作為配位體具有磷酸酯之酞菁化合物、日本特開2019-008014號公報中所記載之酞菁化合物、日本特開2018-180023號公報中所記載之酞菁化合物、日本特開2019-038958號公報中所記載之化合物、日本特開2020-070426號公報中所記載之鋁酞菁化合物、日本特開2020-076995號公報中所記載之核殼型色素等。Specific examples of green color materials include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Also, as a green coloring material, a zinc halide phthalocyanine pigment having an average number of halogen atoms of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 in one molecule can also be used. Specific examples include compounds described in International Publication No. 2015/118720. In addition, as a green color material, the compound described in the specification of Chinese Patent Application No. 106909027, the phthalocyanine compound having a phosphoric acid ester as a ligand described in International Publication No. 2012/102395, Japanese Patent Laid-Open 2019 - Phthalocyanine compounds described in JP-A No. 008014, phthalocyanine compounds described in JP-A No. 2018-180023, compounds described in JP-A No. 2019-038958, JP-A No. 2020-070426 Aluminum phthalocyanine compounds described in , core-shell pigments described in Japanese Patent Application Laid-Open No. 2020-076995, etc.
作為綠色色材,C.I.顏料綠7、36、58、62、63為較佳,C.I.顏料綠36、58為更佳。As green color material, C.I. Pigment Green 7, 36, 58, 62, 63 are better, and C.I. Pigment Green 36, 58 are more preferable.
作為橙色色材的具體例,可舉出C.I.顏料橙2、5、13、16、17:1、31、34、36、38、43、46、48、49、51、52、55、59、60、61、62、64、71、73等橙色顏料。Specific examples of orange color materials include C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73 and other orange pigments.
作為黃色色材,可舉出偶氮化合物、甲亞胺化合物、異吲哚啉化合物、蝶啶化合物、喹啉黃化合物及苝化合物。作為黃色色材的具體例,可舉出C.I.顏料黃1、2、3、4、5、6、10、11、12、13、14、15、16、17、18、20、24、31、32、34、35、35:1、36、36:1、37、37:1、40、42、43、53、55、60、61、62、63、65、73、74、77、81、83、86、93、94、95、97、98、100、101、104、106、108、109、110、113、114、115、116、117、118、119、120、123、125、126、127、128、129、137、138、139、147、148、150、151、152、153、154、155、156、161、162、164、166、167、168、169、170、171、172、173、174、175、176、177、179、180、181、182、185、187、188、193、194、199、213、214、215、228、231、232、233、234、235、236等黃色顏料。As a yellow coloring material, an azo compound, an imine compound, an isoindoline compound, a pteridine compound, a quinoline yellow compound, and a perylene compound are mentioned. Specific examples of yellow color materials include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc. yellow paint.
又,作為黃色色材,亦能夠使用下述結構的偶氮巴比妥酸鎳錯合物。 [化學式1] Moreover, the nickel azobarbiturate complex compound of the following structure can also be used as a yellow color material. [chemical formula 1]
又,作為黃色色材,亦能夠使用日本特開2017-201003號公報中所記載之化合物、日本特開2017-197719號公報中所記載之化合物、日本特開2017-171912號公報的0011~0062段、0137~0276段中所記載之化合物、日本特開2017-171913號公報的0010~0062段、0138~0295段中所記載之化合物、日本特開2017-171914號公報的0011~0062段、0139~0190段中所記載之化合物、日本特開2017-171915號公報的0010~0065段、0142~0222段中所記載之化合物、日本特開2013-054339號公報的0011~0034段中所記載之喹啉黃化合物、日本特開2014-026228號公報的0013~0058段中所記載之喹啉黃化合物、日本特開2018-062644號公報中所記載之異吲哚啉化合物、日本特開2018-203798號公報中所記載之喹啉黃化合物、日本特開2018-062578號公報中所記載之喹啉黃化合物、日本專利第6432076號公報中所記載之喹啉黃化合物、日本特開2018-155881號公報中所記載之喹啉黃化合物、日本特開2018-111757號公報中所記載之喹啉黃化合物、日本特開2018-040835號公報中所記載之喹啉黃化合物、日本特開2017-197640號公報中所記載之喹啉黃化合物、日本特開2016-145282號公報中所記載之喹啉黃化合物、日本特開2014-085565號公報中所記載之喹啉黃化合物、日本特開2014-021139號公報中所記載之喹啉黃化合物、日本特開2013-209614號公報中所記載之喹啉黃化合物、日本特開2013-209435號公報中所記載之喹啉黃化合物、日本特開2013-181015號公報中所記載之喹啉黃化合物、日本特開2013-061622號公報中所記載之喹啉黃化合物、日本特開2013-032486號公報中所記載之喹啉黃化合物、日本特開2012-226110號公報中所記載之喹啉黃化合物、日本特開2008-074987號公報中所記載之喹啉黃化合物、日本特開2008-081565號公報中所記載之喹啉黃化合物、日本特開2008-074986號公報中所記載之喹啉黃化合物、日本特開2008-074985號公報中所記載之喹啉黃化合物、日本特開2008-050420號公報中所記載之喹啉黃化合物、日本特開2008-031281號公報中所記載之喹啉黃化合物、日本特公昭48-032765號公報中所記載之喹啉黃化合物、日本特開2019-008014號公報中所記載之喹啉黃化合物、日本專利第6607427號公報中所記載之喹啉黃化合物、日本特開2019-073695號公報中所記載之次甲基染料、日本特開2019-073696號公報中所記載之次甲基染料、日本特開2019-073697號公報中所記載之次甲基染料、日本特開2019-073698號公報中所記載之次甲基染料、韓國公開專利第10-2014-0034963號公報中所記載之化合物、日本特開2017-095706號公報中所記載之化合物、台灣專利申請公開第201920495號公報中所記載之化合物、日本專利第6607427號公報中所記載之化合物、日本特開2020-033525號公報中所記載之化合物、日本特開2020-033524號公報中所記載之化合物、日本特開2020-033523號公報中所記載之化合物、日本特開2020-033522號公報中所記載之化合物、日本特開2020-033521號公報中所記載之化合物、國際公開第2020/045200號中所記載之化合物、國際公開第2020/045199號中所記載之化合物、國際公開第2020/045197號中所記載之化合物、日本特開2020-093994號公報中所記載之偶氮化合物、日本特開2020-083982號公報中所記載之苝化合物、國際公開第2020/105346號中所記載之苝化合物、日本特表2020-517791號公報中所記載之喹啉黃化合物、由下述式(QP1)表示之化合物、由下述式(QP2)表示之化合物。又,從提高色價的觀點考慮,亦可較佳地使用對該等化合物進行多聚體化者。 [化學式2] In addition, as a yellow coloring material, compounds described in JP-A-2017-201003, compounds described in JP-A-2017-197719, compounds 0011-0062 in JP-A-2017-171912 can also be used. Paragraphs, compounds described in paragraphs 0137-0276, compounds described in paragraphs 0010-0062, 0138-0295 of JP-A-2017-171913, paragraphs 0011-0062 of JP-A-2017-171914, Compounds described in paragraphs 0139 to 0190, compounds described in paragraphs 0010 to 0065, 0142 to 0222 of JP-A-2017-171915, and paragraphs 0011-0034 of JP-A-2013-054339 The quinophthalone compound, the quinophthalone compound described in paragraphs 0013 to 0058 of JP-A-2014-026228, the isoindoline compound described in JP-A-2018-062644, JP-A-2018 -The quinophthalone compound described in Gazette No. 203798, the quinophthalone compound described in JP-A-2018-062578, the quinophthalone compound described in JP-A-6432076, JP-A-2018- The quinophthalone compound described in Gazette No. 155881, the quinophthalone compound described in JP-A No. 2018-111757, the quinophthalone compound described in JP-A No. 2018-040835, JP-A-2017 - The quinophthalone compound described in Gazette No. 197640, the quinophthalone compound described in JP-A-2016-145282, the quinophthalone compound described in JP-A-2014-085565, JP-A The quinophthalone compound described in the 2014-021139 communique, the quinophthalone compound described in the Japanese Patent Application Publication No. 2013-209614, the quinophthalone compound described in the Japanese Patent Application Publication No. The quinophthalone compound described in the publication No. 2013-181015, the quinophthalone compound described in the Japanese Patent Application Publication No. 2013-061622, the quinophthalone compound described in the Japanese Patent Application Publication No. The quinophthalone compound described in Japanese Patent Application Laid-Open No. 2012-226110, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-074987, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-081565, The quinophthalone compound described in JP-A-2008-074986, the quinophthalone compound described in JP-A-2008-074985, and the quinophthalone described in JP-A-2008-050420 Compounds, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2008-031281, quinophthalone compounds described in Japanese Patent Application Publication No. 48-032765, and quinoline compounds described in Japanese Patent Application Publication No. 2019-008014 Yellow compound, quinoline yellow compound described in Japanese Patent No. 6607427, methine dye described in Japanese Patent Application Laid-Open No. 2019-073695, methine described in Japanese Patent Application Laid-Open No. 2019-073696 Dyes, methine dyes described in JP-A-2019-073697, methine dyes described in JP-A-2019-073698, Korean Laid-Open Patent No. 10-2014-0034963 Compounds described in Japanese Patent Laid-Open No. 2017-095706, Compounds described in Taiwan Patent Application Publication No. 201920495, Compounds described in Japanese Patent No. 6607427, Japanese Patent Laid-Open No. 2020-033525 The compound described in the gazette, the compound described in the Japanese Patent Laid-Open No. 2020-033524, the compound described in the Japanese Patent Laid-Open No. 2020-033523, the compound described in the Japanese Patent Laid-Open No. 2020-033522, Japan Compounds described in JP-A-2020-033521, compounds described in International Publication No. 2020/045200, compounds described in International Publication No. 2020/045199, compounds described in International Publication No. 2020/045197 Compounds, azo compounds described in JP-A No. 2020-093994, perylene compounds described in JP-A No. 2020-083982, perylene compounds described in International Publication No. 2020/105346, JP The quinophthalone compound described in Publication No. 2020-517791, the compound represented by the following formula (QP1), and the compound represented by the following formula (QP2). Moreover, from the viewpoint of improving the color value, those obtained by multimerizing these compounds can also be preferably used. [chemical formula 2]
式(QP1)中,X 1~X 16分別獨立地表示氫原子或鹵素原子,Z 1表示碳數1~3的伸烷基。作為由式(QP1)表示之化合物的具體例,可舉出日本專利第6443711號公報的0016段中所記載之化合物。 [化學式3] In formula (QP1), X 1 to X 16 each independently represent a hydrogen atom or a halogen atom, and Z 1 represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by the formula (QP1) include compounds described in paragraph 0016 of Japanese Patent No. 6443711. [chemical formula 3]
式(QP2)中,Y 1~Y 3分別獨立地表示鹵素原子。n、m表示0~6的整數,p表示0~5的整數。(n+m)為1以上。作為由式(QP2)表示之化合物的具體例,可舉出日本專利6432077號公報的0047~0048段中所記載之化合物。 In formula (QP2), Y 1 to Y 3 each independently represent a halogen atom. n and m represent the integer of 0-6, and p represents the integer of 0-5. (n+m) is 1 or more. Specific examples of the compound represented by the formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.
作為紫色色材的具體例,可舉出C.I.顏料紫1、19、23、27、32、37、42、60、61等紫色顏料。Specific examples of purple color materials include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.
作為藍色色材的具體例,可舉出C.I.顏料藍1、2、15、15:1、15:2、15:3、15:4、15:6、16、22、29、60、64、66、79、80、87、88等藍色顏料。又,作為藍色色材,還能夠使用具有磷原子之鋁酞菁化合物。作為具體例,可舉出日本特開2012-247591號公報的0022~0030段、日本特開2011-157478號公報的0047段中所記載之化合物。Specific examples of blue color materials include C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88 and other blue pigments. In addition, an aluminum phthalocyanine compound having a phosphorus atom can also be used as a blue color material. Specific examples include compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraphs 0047 of JP-A-2011-157478.
又,綠色色材或藍色色材亦能夠使用日本特表2020-504758號公報中所記載之二芳基甲烷化合物。Moreover, the diarylmethane compound described in JP 2020-504758 A can also be used as a green coloring material or a blue coloring material.
關於各種顏料所具有之較佳的繞射角,能夠參閱日本專利第6561862號公報、日本專利第6413872號公報、日本專利第6281345號公報、日本特開2020-026503號公報、日本特開2020-033526號公報的記載,該等內容被編入本說明書中。又,作為吡咯并吡咯顏料,使用在晶格面中(±1±1±1)的8個面中對應於X射線繞射圖案中的最大峰值之面方向的微晶尺寸為140Å以下者亦較佳。又,關於吡咯并吡咯顏料的物性,如日本特開2020-097744號公報的0028~0073段中所記載那樣設定亦較佳。For the preferred diffraction angles of various pigments, refer to Japanese Patent No. 6561862, Japanese Patent No. 6413872, Japanese Patent No. 6281345, Japanese Patent Application Publication No. 2020-026503, Japanese Patent Application Publication No. 2020- No. 033526 bulletin, these contents are incorporated into this specification. In addition, as the pyrrolopyrrole pigment, one having a crystallite size of 140 Å or less in the plane direction corresponding to the largest peak in the X-ray diffraction pattern among the eight planes of the crystal lattice (±1±1±1) is also used. better. Furthermore, it is also preferable to set the physical properties of the pyrrolopyrrole pigment as described in paragraphs 0028 to 0073 of JP-A-2020-097744.
又,從提高分光特性之觀點考慮,作為顏料使用日本專利6744002號公報中所記載之具有拉曼光譜之鹵化鋅酞菁顏料亦較佳。又,從黏度調節的觀點考慮,作為顏料使用國際公開第2019/107166號中所記載之控制接觸角之二㗁𠯤顏料亦較佳。In addition, from the viewpoint of improving spectral characteristics, it is also preferable to use a zinc halide phthalocyanine pigment having a Raman spectrum described in Japanese Patent No. 6744002 as a pigment. Also, from the viewpoint of viscosity adjustment, it is also preferable to use the second 㗁𠯤 pigment for controlling the contact angle described in International Publication No. 2019/107166 as a pigment.
彩色色材中亦能夠使用染料。作為染料,並無特別限制,能夠使用公知的染料。例如能夠舉出吡唑偶氮系、苯胺基偶氮系、三芳基甲烷系、蒽醌系、蒽吡啶醌系、苯亞甲基系、氧雜菁系、吡唑并三唑偶氮系、吡啶酮偶氮系、花青系、啡噻系、吡咯并吡唑次甲基偶氮系、呫噸系、酞菁系、苯并吡喃系、靛藍系、吡咯亞甲基系等染料。Dyes can also be used as coloring materials. The dye is not particularly limited, and known dyes can be used. For example, pyrazole azo series, anilino azo series, triarylmethane series, anthraquinone series, anthrapyridine quinone series, benzylidene series, oxonol series, pyrazolotriazole azo series, Pyridone azo-based, cyanine-based, pyrrolopyrazole-based azo-based, xanthene-based, phthalocyanine-based, benzopyran-based, indigo-based, pyrromethene-based and other dyes.
彩色色材中亦能夠使用色素多聚體。色素多聚體為溶解於溶劑中而使用之染料為較佳。又,色素多聚體可以形成粒子。在色素多聚體為粒子之情況下,通常在分散於溶劑之狀態下使用。粒子狀態的色素多聚體例如能夠藉由乳化聚合來得到,作為具體例可舉出日本特開2015-214682號公報中所記載之化合物及製造方法。色素多聚體在一分子中具有2以上色素結構,具有3以上色素結構為較佳。上限並無特別限定,但是亦能夠設為100以下。在一分子中所具有之複數個色素結構可以為相同的色素結構,亦可以為不同之色素結構。色素多聚體的重量平均分子量(Mw)為2000~50000為較佳。下限為3000以上為更佳,6000以上為進一步較佳。上限為30000以下為更佳,20000以下為進一步較佳。色素多聚體亦能夠使用日本特開2011-213925號公報、日本特開2013-041097號公報、日本特開2015-028144號公報、日本特開2015-030742號公報、國際公開第2016/031442號等中所記載之化合物。A pigment multimer can also be used for a color material. It is preferable that a dye multimer is used as a dye dissolved in a solvent. Also, pigment multimers may form particles. When the pigment multimer is a particle, it is usually used in a dispersed state in a solvent. The pigment multimer in a particulate state can be obtained, for example, by emulsion polymerization, and specific examples thereof include compounds and production methods described in JP-A-2015-214682. The pigment multimer has two or more pigment structures in one molecule, preferably three or more pigment structures. The upper limit is not particularly limited, but can also be set to 100 or less. The plural pigment structures contained in one molecule may be the same pigment structure or different pigment structures. The weight average molecular weight (Mw) of the pigment multimer is preferably 2,000 to 50,000. The lower limit is more preferably 3000 or more, and more preferably 6000 or more. The upper limit is more preferably 30,000 or less, and further preferably 20,000 or less. As the pigment polymer, JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, and International Publication No. 2016/031442 can also be used. Compounds described in et al.
又,作為彩色色材,能夠使用韓國公開專利第10-2020-0028160號公報中所記載之三芳基甲烷染料聚合物、日本特開2020-117638號公報中所記載之口山口星化合物、國際公開第2020/174991號中所記載之酞青化合物、日本特開2020-160279號公報中所記載之異吲哚啉化合物或該等的鹽、韓國公開專利第10-2020-0069442號公報中所記載之由式1表示之化合物、韓國公開專利第10-2020-0069730號公報中所記載之由式1表示之化合物、韓國公開專利第10-2020-0069070號公報中所記載之由式1表示之化合物、韓國公開專利第10-2020-0069067號公報中所記載之由式1表示之化合物、韓國公開專利第10-2020-0069062號公報中所記載之由式1表示之化合物、專利第6809649號中所記載之鹵化鋅酞青顏料、日本特開2020-180176號公報中所記載之異吲哚啉化合物。彩色色材可以為輪烷,色素骨架可用於輪烷的環狀結構,亦可用於棒狀結構,亦可用於這兩者的結構。In addition, as a color material, the triarylmethane dye polymer described in Korean Laid-Open Patent No. 10-2020-0028160, the Kusama compound described in Japanese Patent Application Laid-Open No. 2020-117638, the International Publication No. Phthalocyanine compounds described in No. 2020/174991, isoindoline compounds described in Japanese Patent Laid-Open No. 2020-160279 or their salts, Korean Laid-Open Patent No. 10-2020-0069442 The compound represented by Formula 1, the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069730, the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069070 Compound, compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069067, compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069062, Patent No. 6809649 Zinc halide phthalocyanine pigments described in , and isoindoline compounds described in Japanese Patent Application Laid-Open No. 2020-180176. The color material can be a rotaxane, and the pigment skeleton can be used in a cyclic structure of a rotaxane, a rod structure, or both structures.
彩色色材亦可以組合使用2種以上。又,在彩色色材組合使用2種以上之情況下,亦可以以2種以上的彩色色材的組合形成黑色。作為該等組合,例如可舉出以下(1)~(7)的態樣。在樹脂組成物中包含2種以上彩色色材並且以2種以上的彩色色材的組合呈現黑色之情況下,本發明的樹脂組成物能夠較佳地用作近紅外線透射濾波器形成用樹脂組成物。 (1)含有紅色色材及藍色色材之態樣。 (2)含有紅色色材、藍色色材及黃色色材之態樣。 (3)含有紅色色材、藍色色材、黃色色材及紫色色材之態樣。 (4)含有紅色色材、藍色色材、黃色色材、紫色色材及綠色色材之態樣。 (5)含有紅色色材、藍色色材、黃色色材及綠色色材之態樣。 (6)含有紅色色材、藍色色材及綠色色材之態樣。 (7)含有黃色色材及紫色色材之態樣。 Two or more kinds of color materials may be used in combination. Also, when two or more color materials are used in combination, black may be formed by combining two or more color materials. Examples of such combinations include the following aspects (1) to (7). In the case where two or more color materials are contained in the resin composition and black is represented by a combination of two or more color materials, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. things. (1) The form that contains red color material and blue color material. (2) Forms containing red color material, blue color material and yellow color material. (3) Forms containing red color material, blue color material, yellow color material and purple color material. (4) Forms containing red color material, blue color material, yellow color material, purple color material and green color material. (5) Forms containing red color material, blue color material, yellow color material and green color material. (6) Forms containing red color material, blue color material and green color material. (7) Forms containing yellow and purple color materials.
(白色色材) 作為白色色材,可舉出氧化鈦、鈦酸鍶、鈦酸鋇、氧化鋅、氧化鎂、氧化鋯、氧化鋁、硫酸鋇、二氧化矽、滑石、雲母、氫氧化鋁、矽酸鈣、矽酸鋁、中空樹脂粒子、硫化鋅等無機顏料(白色顏料)。白色顏料係具有鈦原子之粒子為較佳,氧化鈦為更佳。又,白色顏料係相對於波長589nm的光之折射率係2.10以上的粒子為較佳。前述折射率為2.10~3.00為較佳,2.50~2.75為更佳。 (white color material) Examples of white color materials include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silicon dioxide, talc, mica, aluminum hydroxide, calcium silicate, Aluminum silicate, hollow resin particles, zinc sulfide and other inorganic pigments (white pigments). The white pigment is preferably particles having titanium atoms, more preferably titanium oxide. Also, the white pigment is preferably particles having a refractive index of 2.10 or higher with respect to light having a wavelength of 589 nm. The aforementioned refractive index is preferably from 2.10 to 3.00, more preferably from 2.50 to 2.75.
又,白色顏料亦能夠使用“氧化鈦 物性與應用技術 清野學著 13~45頁 1991年6月25日發行、技報堂出版發行”中所記載之氧化鈦。In addition, as the white pigment, titanium oxide described in "Titanium Oxide Physical Properties and Applied Technology, Kiyono Gakushu, pp. 13-45, June 25, 1991, Gihodo Publishing" can also be used.
白色顏料不限於包括單一無機物者,亦可以使用與其他原材料複合而成之粒子。例如使用在內部具有空孔或其他原材料之粒子、在芯粒子中附著多個無機粒子之粒子、由包括聚合物粒子之芯粒子及包括無機奈米粒子之殼體層構成之芯及核複合粒子為較佳。作為由包括上述聚合物粒子之芯粒子及包括無機奈米粒子之殼質層構成之芯及核複合粒子,例如能夠參閱日本特開2015-047520號公報的0012~0042段的記載,該內容被編入本說明書中。The white pigment is not limited to a single inorganic substance, and particles compounded with other raw materials can also be used. For example, particles with pores or other raw materials inside, particles with a plurality of inorganic particles attached to the core particle, core and core composite particles composed of a core particle including polymer particles and a shell layer including inorganic nanoparticles are used as better. As the core-core composite particle composed of the core particle including the above-mentioned polymer particle and the shell layer including inorganic nanoparticles, for example, the description in paragraphs 0012 to 0042 of Japanese Patent Laid-Open No. 2015-047520 can be referred to. incorporated into this manual.
白色顏料亦能夠使用中空無機粒子。中空無機粒子係指在內部具有空腔之結構的無機粒子,並且係指具有被外殼包圍之空腔之無機粒子。作為中空無機粒子,可舉出日本特開2011-075786號公報、國際公開第2013/061621號、日本特開2015-164881號公報等中所記載之中空無機粒子,該等內容被編入本說明書中。Hollow inorganic particles can also be used as a white pigment. The hollow inorganic particle refers to an inorganic particle having a structure of a cavity inside, and refers to an inorganic particle having a cavity surrounded by an outer shell. Examples of the hollow inorganic particles include hollow inorganic particles described in JP-A-2011-075786, International Publication No. 2013/061621, JP-A-2015-164881, etc., and these contents are incorporated in this specification. .
(黑色色材) 作為黑色色材,並無特別限定,能夠使用公知者。例如,作為無機黑色色材,可舉出碳黑、鈦黑、石墨等無機顏料(黑色顏料),碳黑、鈦黑為較佳,鈦黑為更佳。鈦黑係指含有鈦原子之黑色粒子,低價氧化鈦或氮氧化鈦為較佳。以提高分散性、抑制凝聚性等為目的,能夠依據需要對鈦黑的表面進行修飾。例如能夠藉由氧化矽、氧化鈦、氧化鍺、氧化鋁、氧化鎂或氧化鋯來被覆鈦黑的表面。又,亦能夠藉由如日本特開2007-302836號公報中所示的撥水性物質進行處理。作為黑色顏料,可舉出C.I.顏料黑1、7等。鈦黑係每個粒子的一次粒徑及平均一次粒徑中的任一個較小為較佳。具體而言,平均一次粒徑為10~45nm為較佳。鈦黑亦能夠用作分散物。例如可舉出含有鈦黑粒子及二氧化矽粒子並且分散物中的Si原子與Ti原子的含有比調節在0.20~0.50的範圍內之分散物等。關於上述分散物,亦能夠參閱日本特開2012-169556號公報的0020~0105段的記載,該內容被編入本說明書中。作為鈦黑的市售品的例,可舉出鈦黑10S、12S、13R、13M、13M-C、13R-N、13M-T(產品名:Mitsubishi Materials Corporation製)、Tilack D(產品名:Ako Kasei Co.,Ltd.製)等。 (black color material) It does not specifically limit as a black color material, A well-known thing can be used. For example, examples of inorganic black color materials include inorganic pigments (black pigments) such as carbon black, titanium black, and graphite. Carbon black and titanium black are preferred, and titanium black is more preferred. Titanium black refers to black particles containing titanium atoms, preferably subvalent titanium oxide or titanium oxynitride. The surface of titanium black can be modified as needed for the purpose of improving dispersibility, suppressing cohesion, and the like. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide or zirconium oxide. In addition, it can also be treated with a water-repellent substance as disclosed in JP-A-2007-302836. C.I. Pigment Black 1, 7 etc. are mentioned as a black pigment. It is preferable that either one of the primary particle diameter and the average primary particle diameter of each particle of the titanium black system is small. Specifically, the average primary particle diameter is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles and adjusting the content ratio of Si atoms to Ti atoms in the dispersion to be in the range of 0.20 to 0.50, etc. may be mentioned. Regarding the above-mentioned dispersion, the description in paragraphs 0020 to 0105 of JP-A-2012-169556 can also be referred to, and the content is incorporated in this specification. Examples of commercially available titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (product name: manufactured by Mitsubishi Materials Corporation), Tilack D (product name: Ako Kasei Co., Ltd.), etc.
又,作為有機黑色色材,可舉出雙苯并呋喃酮化合物、甲亞胺化合物、苝化合物、偶氮化合物等。作為雙苯并呋喃酮化合物,可舉出日本特表2010-534726號公報、日本特表2012-515233號公報、日本特表2012-515234號公報等中所記載之化合物,例如能夠作為BASF公司製的“Irgaphor Black”而獲得。作為苝化合物,可舉出日本特開2017-226821號公報的0016~0020段中所記載之化合物、C.I.顏料黑31、32等。作為甲亞胺化合物,可舉出日本特開平01-170601號公報、日本特開平02-034664號公報等中所記載之化合物,例如,能夠作為Dainichiseika Color & Chemicals Mfg.Co.,Ltd.製的“CHROMO FINE BLACK A1103”而獲得。Moreover, as an organic black coloring material, a bisbenzofuranone compound, an imine compound, a perylene compound, an azo compound, etc. are mentioned. Examples of the bisbenzofuranone compound include compounds described in JP 2010-534726, JP 2012-515233, JP 2012-515234, etc. Obtained from "Irgaphor Black". Examples of the perylene compound include compounds described in paragraphs 0016 to 0020 of JP-A-2017-226821, C.I. Pigment Black 31, 32, and the like. Examples of the formimine compound include compounds described in JP-A-01-170601, JP-A-02-034664, etc., for example, the product manufactured by Dainichiseika Color & Chemicals Mfg.Co., Ltd. Obtained from "CHROMO FINE BLACK A1103".
本發明的樹脂組成物中所使用之色材可以僅為上述之黑色色材,亦可以為還包含彩色色材者。依據該態樣,容易獲得能夠形成可見區域內的遮光性優異之膜之樹脂組成物。作為色材,在併用黑色色材及彩色色材之情況下,兩者的質量比為黑色色材:彩色色材=100:10~300為較佳,100:20~200為更佳。The color material used in the resin composition of the present invention may be only the above-mentioned black color material, or may also include color color material. According to this aspect, it is easy to obtain a resin composition capable of forming a film excellent in light-shielding properties in the visible region. As a color material, when a black color material and a color material are used together, the mass ratio of both is black color material:color color material=100:10-300 is preferable, and 100:20-200 is more preferable.
作為黑色色材與彩色色材的較佳的組合,例如可舉出以下。 (A-1)含有有機黑色色材及藍色色材之態樣。 (A-2)含有有機黑色色材、藍色色材及黃色色材之態樣。 (A-3)含有有機黑色色材、藍色色材、黃色色材及紅色色材之態樣。 (A-4)含有有機黑色色材、藍色色材、黃色色材及紫色色材之態樣。 As a preferable combination of a black color material and a color color material, the following are mentioned, for example. (A-1) Forms containing organic black and blue color materials. (A-2) Forms containing organic black color materials, blue color materials and yellow color materials. (A-3) Forms containing organic black color materials, blue color materials, yellow color materials and red color materials. (A-4) Forms containing organic black color materials, blue color materials, yellow color materials and purple color materials.
上述(A-1)的態樣中,有機黑色色材與藍色色材的質量比為有機黑色色材:藍色色材=100:1~70為較佳,100:5~60為更佳,100:10~50為進一步較佳。 上述(A-2)的態樣中,有機黑色色材、藍色色材與黃色色材的質量比為有機黑色色材:藍色色材:黃色色材=100:10~90:10~90為較佳,100:15~85:15~80為更佳,100:20~80:20~70為進一步較佳。 上述(A-3)的態樣中,有機黑色色材、藍色色材、黃色色材與紅色色材的質量比為有機黑色色材:藍色色材:黃色色材:紅色色材=100:20~150:1~60:10~100為較佳,100:30~130:5~50:20~90為更佳,100:40~120:10~40:30~80為進一步較佳。 上述(A-4)的態樣中,有機黑色色材、藍色色材、黃色色材與紫色色材的質量比為有機黑色色材:藍色色材:黃色色材:紫色色材=100:20~150:1~60:10~100為較佳,100:30~130:5~50:20~90為更佳,100:40~120:10~40:30~80為進一步較佳。 In the aspect of (A-1) above, the mass ratio of organic black color material to blue color material is organic black color material:blue color material=100:1~70 is better, 100:5~60 is more preferable, 100:10-50 is more preferable. In the form of (A-2) above, the mass ratio of organic black color material, blue color material and yellow color material is organic black color material:blue color material:yellow color material=100:10~90:10~90 More preferably, 100:15-85:15-80 is more preferable, and 100:20-80:20-70 is still more preferable. In the above (A-3) form, the mass ratio of organic black color material, blue color material, yellow color material and red color material is organic black color material:blue color material:yellow color material:red color material=100: 20-150:1-60:10-100 is preferable, 100:30-130:5-50:20-90 is more preferable, and 100:40-120:10-40:30-80 is still more preferable. In the above (A-4), the mass ratio of organic black color material, blue color material, yellow color material and purple color material is organic black color material:blue color material:yellow color material:purple color material=100: 20-150:1-60:10-100 is preferable, 100:30-130:5-50:20-90 is more preferable, and 100:40-120:10-40:30-80 is still more preferable.
(近紅外線吸收色材) 近紅外線吸收色材為在比波長700nm更長波長側具有極大吸收波長之化合物為較佳。紅外線吸收劑為在超過波長700nm且1800nm以下的範圍內具有極大吸收波長之化合物為較佳,在超過波長700nm且1400nm以下的範圍內具有極大吸收波長之化合物為更佳,在超過波長700nm且1200nm以下的範圍內具有極大吸收波長之化合物為進一步較佳,在超過波長700nm且1000nm以下的範圍內具有極大吸收波長之化合物為特佳。又,近紅外線吸收色材的波長500nm中的吸光度A 1與極大吸收波長中的吸光度A 2的比例A 1/A 2為0.08以下為較佳,0.04以下為更佳。又,近紅外線吸收色材為顏料為較佳,有機顏料為更佳。 (Near-infrared Absorbing Color Material) The near-infrared absorbing color material is preferably a compound having a maximum absorption wavelength on the side longer than the wavelength of 700 nm. The infrared absorber is preferably a compound with a maximum absorption wavelength in the range of more than 700nm to 1800nm, more preferably a compound with a maximum absorption wavelength in the range of more than 700nm to 1400nm, and a compound with a wavelength of more than 700nm to 1200nm The compound which has a maximum absorption wavelength in the following range is more preferable, and the compound which has a maximum absorption wavelength in the range which exceeds wavelength 700nm and 1000nm or less is especially preferable. Also, the ratio A 1 /A 2 of the absorbance A 1 at the wavelength of 500 nm of the near-infrared absorbing color material to the absorbance A 2 at the maximum absorption wavelength is preferably 0.08 or less, more preferably 0.04 or less. Also, the near-infrared absorbing color material is preferably a pigment, more preferably an organic pigment.
作為近紅外線吸收色材,可舉出吡咯并吡咯化合物、花青化合物、方酸菁化合物、酞菁化合物、萘酞菁化合物、夸特銳烯(quaterrylene)化合物、部花青素化合物、克酮鎓化合物、氧雜菁化合物、亞銨化合物、二硫醇化合物、三芳基甲烷化合物、吡咯亞甲基化合物、甲亞胺化合物、蒽醌化合物、雙苯并呋喃酮化合物、金屬氧化物、金屬硼化物等。作為吡咯并吡咯化合物,可舉出日本特開2009-263614號公報的0016~0058段中所記載之化合物、日本特開2011-068731號公報的0037~0052段中所記載之化合物、國際公開第2015/166873號的0010~0033段中所記載之化合物等。作為方酸菁化合物,可舉出日本特開2011-208101號公報的0044~0049段中所記載之化合物、日本專利第6065169號公報的0060~0061段中所記載之化合物、國際公開第2016/181987號的0040段中所記載之化合物、日本特開2015-176046號公報中所記載之化合物、國際公開第2016/190162號的0072段中所記載之化合物、日本特開2016-074649號公報的0196~0228段中所記載之化合物、日本特開2017-067963號公報的0124段中所記載之化合物、國際公開第2017/135359號中所記載之化合物、日本特開2017-114956號公報中所記載之化合物、日本專利6197940號公報中所記載之化合物、國際公開第2016/120166號中所記載之化合物等。作為花青化合物,可舉出日本特開2009-108267號公報的0044~0045段中所記載之化合物、日本特開2002-194040號公報的0026~0030段中所記載之化合物、日本特開2015-172004號公報中所記載之化合物、日本特開2015-172102號公報中所記載之化合物、日本特開2008-088426號公報中所記載之化合物、國際公開第2016/190162號的0090段中所記載之化合物、日本特開2017-031394號公報中所記載之化合物等。作為克酮鎓化合物,可舉出日本特開2017-082029號公報中所記載之化合物。作為亞銨化合物,例如,可舉出日本特表2008-528706號公報中所記載之化合物、日本特開2012-012399號公報中所記載之化合物、日本特開2007-092060號公報中所記載之化合物、國際公開第2018/043564號的0048~0063段中所記載之化合物。作為酞青化合物,可舉出日本特開2012-077153號公報的0093段中所記載之化合物、日本特開2006-343631號公報中所記載之酞青氧鈦、日本特開2013-195480號公報的0013~0029段中所記載之化合物、專利第6081771號公報中所記載之釩酞青化合物、國際公開第2020/071486號中所記載之釩酞青化合物、國際公開第2020/071470號中所記載之酞青化合物。作為萘酞菁化合物,可舉出日本特開2012-077153號公報的0093段中所記載之化合物。作為二硫代烯金屬錯合物,可舉出日本專利第5733804號公報中所記載之化合物。作為金屬氧化物,例如可舉出氧化銦錫、氧化銻錫、氧化鋅、Al摻雜氧化鋅、氟摻雜二氧化錫、鈮摻雜二氧化鈦、氧化鎢等。關於氧化鎢的詳細內容,能夠參閱日本特開2016-006476號公報的0080段,該內容被編入本說明書中。作為金屬硼化物,可舉出硼化鑭等。作為硼化鑭的市售品,可舉出LaB 6-F(JAPAN NEW METALS CO.,LTD製)等。又,作為金屬硼化物,亦能夠使用國際公開第2017/119394號中所記載之化合物。作為氧化銦錫的市售品,可舉出F-ITO(DOWA HOLDINGS CO.,LTD製)等。 Examples of near-infrared absorbing color materials include pyrrolopyrrole compounds, cyanine compounds, squaraine compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, and ketones. Onium compounds, oxonol compounds, imonium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, imine compounds, anthraquinone compounds, bisbenzofuranone compounds, metal oxides, metal boron compounds etc. Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614 , compounds described in paragraphs 0037-0052 of JP-A-2011-068731 , International Publication No. Compounds described in paragraphs 0010 to 0033 of No. 2015/166873, etc. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Laid-Open No. 2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169, International Publication No. 2016/ Compounds described in Paragraph 0040 of No. 181987, compounds described in JP-A No. 2015-176046, compounds described in Paragraph 0072 of International Publication No. 2016/190162, compounds described in JP-A No. 2016-074649 Compounds described in paragraphs 0196 to 0228, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in International Publication No. 2017/135359, JP-A-2017-114956 Compounds described, compounds described in Japanese Patent No. 6197940, compounds described in International Publication No. 2016/120166, etc. Examples of cyanine compounds include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, JP 2015 - Compounds described in Publication No. 172004, Compounds described in Japanese Patent Application Laid-Open No. 2015-172102, Compounds described in Japanese Patent Application Publication No. 2008-088426, Paragraph 0090 of International Publication No. 2016/190162 Compounds described, compounds described in JP-A-2017-031394, etc. Examples of the crotonium compound include compounds described in JP-A-2017-082029. Examples of iminium compounds include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, and compounds described in JP-A-2007-092060. Compounds, compounds described in paragraphs 0048 to 0063 of International Publication No. 2018/043564. Examples of the phthalocyanine compound include compounds described in paragraph 0093 of JP-A-2012-077153, phthalocyanine-titanium compounds described in JP-A-2006-343631, JP-A-2013-195480 Compounds described in paragraphs 0013 to 0029, vanadium phthalocyanine compounds described in Patent No. 6081771, vanadium phthalocyanine compounds described in International Publication No. 2020/071486, and vanadium phthalocyanine compounds described in International Publication No. 2020/071470 The recorded phthalocyanine compounds. As a naphthalocyanine compound, the compound described in paragraph 0093 of Unexamined-Japanese-Patent No. 2012-077153 is mentioned. Examples of the dithioalkene metal complexes include compounds described in Japanese Patent No. 5733804 . Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details of tungsten oxide, paragraph 0080 of JP-A-2016-006476 can be referred to, and this content is incorporated in this specification. Lanthanum boride etc. are mentioned as a metal boride. Commercially available lanthanum borides include LaB 6 -F (manufactured by JAPAN NEW METALS CO., LTD.) and the like. In addition, as metal borides, compounds described in International Publication No. 2017/119394 can also be used. F-ITO (manufactured by DOWA HOLDINGS CO., LTD.) etc. are mentioned as a commercial item of indium tin oxide.
又,作為近紅外線吸收色材,亦能夠使用日本特開2017-197437號公報中所記載之方酸菁化合物、日本特開2017-025311號公報中所記載之方酸菁化合物、國際公開第2016/154782號中所記載之方酸菁化合物、日本專利第5884953號公報中所記載之方酸菁化合物、日本專利第6036689號公報中所記載之方酸菁化合物、日本專利第5810604號公報中所記載之方酸菁化合物、國際公開第2017/213047號的0090~0107段中所記載之方酸菁化合物、日本特開2018-054760號公報的0019~0075段中所記載之含吡咯環之化合物、日本特開2018-040955號公報的0078~0082段中所記載之含吡咯環之化合物、日本特開2018-002773號公報的0043~0069段中所記載之含吡咯環之化合物、日本特開2018-041047號公報的0024~0086段中所記載之在醯胺α位具有芳香環之方酸菁化合物、日本特開2017-179131號公報中所記載之醯胺連接型方酸菁化合物、日本特開2017-141215號公報中所記載之具有吡咯雙型方酸菁骨架或克酮鎓骨架之化合物、日本特開2017-082029號公報中所記載之二羥基咔唑雙型方酸菁化合物、日本特開2017-068120號公報的0027~0114段中所記載之非對稱型化合物、日本特開2017-067963號公報中所記載之含吡咯環之化合物(咔唑型)、日本專利第6251530號公報中所記載之酞菁化合物、日本特開2020-075959號公報中所記載之方酸菁化合物、韓國公開專利第10-2019-0135217號公報中所記載之銅錯合物等。In addition, as a near-infrared absorbing coloring material, squarylium compounds described in JP-A-2017-197437, squarylium compounds described in JP-A-2017-025311, International Publication No. 2016 The squaraine compound described in /154782, the squaraine compound described in Japanese Patent No. 5884953, the squaraine compound described in Japanese Patent No. 6036689, the squaraine compound described in Japanese Patent No. 5810604 The squaraine compound described, the squaraine compound described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the compound containing a pyrrole ring described in paragraphs 0019 to 0075 of JP-A-2018-054760 , Compounds containing a pyrrole ring described in paragraphs 0078 to 0082 of JP-A-2018-040955, compounds containing a pyrrole ring described in paragraphs 0043-0069 of JP-A-2018-002773, JP-A A squarylium compound having an aromatic ring at the amide α-position described in paragraphs 0024 to 0086 of Publication No. 2018-041047, an amide-linked squarylium compound described in Japanese Patent Laid-Open Publication No. 2017-179131, Japan A compound having a pyrrole double-type squaraine skeleton or a crotonium skeleton described in JP-A-2017-141215, a dihydroxycarbazole-type squaraine compound described in JP-A-2017-082029, Asymmetric compounds described in paragraphs 0027 to 0114 of JP-A-2017-068120, pyrrole-ring-containing compounds (carbazole-type) described in JP-A-2017-067963, Japanese Patent No. 6251530 Phthalocyanine compounds described in the gazette, squarylium compounds described in Japanese Patent Laid-Open No. 2020-075959, copper complexes described in Korean Laid-Open Patent No. 10-2019-0135217, etc.
(顏料衍生物) 本發明中,色材中亦能夠使用顏料衍生物。在本發明中,併用顏料及顏料衍生物為較佳。作為顏料衍生物,可舉出具有在色素骨架上鍵結有酸基或鹼基而成之結構之化合物。 (pigment derivatives) In the present invention, pigment derivatives can also be used for the color material. In the present invention, it is preferable to use a pigment and a pigment derivative in combination. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton.
作為構成顏料衍生物之色素骨架,可舉出喹啉色素骨架、苯并咪唑酮色素骨架、苯并異吲哚色素骨架、苯并噻唑色素骨架、亞銨(iminium)色素骨架、方酸菁色素骨架、克酮鎓色素骨架、氧雜菁色素骨架、吡咯并吡咯色素骨架、二酮吡咯并吡咯色素骨架、偶氮色素骨架、甲亞胺色素骨架、酞菁色素骨架、萘酞菁色素骨架、蒽醌色素骨架、喹吖酮色素骨架、二㗁𠯤色素骨架、紫環酮(perinone)色素骨架、苝色素骨架、硫靛色素骨架、異吲哚啉色素骨架、異吲哚啉酮色素骨架、喹啉黃色素骨架、亞銨(iminium)色素骨架、二硫醇色素骨架、三芳基甲烷色素骨架、吡咯亞甲基色素骨架等。Examples of the dye skeleton constituting the pigment derivative include quinoline dye skeleton, benzimidazolone dye skeleton, benzisoindole dye skeleton, benzothiazole dye skeleton, iminium dye skeleton, squarylium dye Skeleton, crotonium dye skeleton, oxonol dye skeleton, pyrrolopyrrole dye skeleton, diketopyrrolopyrrole dye skeleton, azo dye skeleton, formimine dye skeleton, phthalocyanine dye skeleton, naphthalocyanine dye skeleton, Anthraquinone pigment skeleton, quinacridone pigment skeleton, di㗁𠯤 pigment skeleton, perinone (perinone) pigment skeleton, perylene pigment skeleton, thioindigo pigment skeleton, isoindoline pigment skeleton, isoindolinone pigment skeleton, Quinoline yellow pigment skeleton, iminium pigment skeleton, dithiol pigment skeleton, triarylmethane pigment skeleton, pyrromethene pigment skeleton, etc.
作為酸基,可舉出羧基、磺酸基、磷酸基、硼酸基、羧酸醯胺基、磺酸胺基、醯亞胺酸基及該等鹽等。作為構成鹽之原子或原子團,可舉出鹼金屬離子(Li +、Na +、K +等)、鹼土類金屬離子(Ca 2+、Mg 2+等)、銨離子、咪唑鎓離子、吡啶鎓離子、鏻離子等。作為羧酸醯胺基,由-NHCOR X1表示之基團為較佳。作為磺酸醯胺基,由-NHSO 2R X2表示之基團為較佳。作為醯亞胺酸基,由-SO 2NHSO 2R X3、-CONHSO 2R X4、-CONHCOR X5或-SO 2NHCOR X6表示之基團為較佳,-SO 2NHSO 2R X3為更佳。R X1~R X6分別獨立地表示烷基或芳基。R X1~R X6所表示之烷基及芳基可以具有取代基。作為取代基,鹵素原子為較佳,氟原子為更佳。 Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amine group, an imidic acid group, and salts thereof. The atoms or atomic groups constituting the salt include alkali metal ions (Li + , Na + , K + , etc.), alkaline earth metal ions (Ca 2+ , Mg 2+ , etc.), ammonium ions, imidazolium ions, pyridinium ions, etc. ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR X1 is preferable. As the sulfonamide group, a group represented by -NHSO 2 R X2 is preferable. As the imidic acid group, a group represented by -SO 2 NHSO 2 R X3 , -CONHSO 2 R X4 , -CONHCOR X5 or -SO 2 NHCOR X6 is preferable, and -SO 2 NHSO 2 R X3 is more preferable. R X1 to R X6 each independently represent an alkyl group or an aryl group. The alkyl and aryl groups represented by R X1 to R X6 may have a substituent. As the substituent, a halogen atom is preferable, and a fluorine atom is more preferable.
作為鹼基,可舉出胺基、吡啶基及其鹽、銨基的鹽以及酞醯亞胺甲基。作為構成鹽之原子或原子團,可舉出氫氧根離子、鹵素離子、羧酸根離子、磺酸根離子、苯氧離子等。Examples of the base include an amino group, a pyridyl group and salts thereof, ammonium group salts, and phthalimidomethyl group. Examples of the atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.
作為顏料衍生物的具體例,可舉出後述實施例中所記載之化合物、日本特開昭56-118462號公報中所記載之化合物、日本特開昭63-264674號公報中所記載之化合物、日本特開平01-217077號公報中所記載之化合物、日本特開平03-009961號公報中所記載之化合物、日本特開平03-026767號公報中所記載之化合物、日本特開平03-153780號公報中所記載之化合物、日本特開平03-045662號公報中所記載之化合物、日本特開平04-285669號公報中所記載之化合物、日本特開平06-145546號公報中所記載之化合物、日本特開平06-212088號公報中所記載之化合物、日本特開平06-240158號公報中所記載之化合物、日本特開平10-030063號公報中所記載之化合物、日本特開平10-195326號公報中所記載之化合物、國際公開第2011/024896號的0086~0098段中所記載之化合物、國際公開第2012/102399號的0063~0094段中所記載之化合物、國際公開第2017/038252號的0082段中所記載之化合物、日本特開2015-151530號公報的0171段中所記載之化合物、日本特開2011-252065號公報的0162~0183段中所記載之化合物、日本特開2003-081972號公報中所記載之化合物、日本專利第5299151號公報中所記載之化合物、日本特開2015-172732號公報中所記載之化合物、日本特開2014-199308號公報中所記載之化合物、日本特開2014-085562號公報中所記載之化合物、日本特開2014-035351號公報中所記載之化合物、日本特開2008-081565號公報中所記載之化合物、日本特開2019-109512號公報中所記載之化合物、日本特開2019-133154號公報中所記載之化合物、國際公開第2020/002106號中所記載之具有硫醇連接基之二酮吡咯并吡咯化合物、日本特開2018-168244號公報中所記載之苯并咪唑酮化合物或該等的鹽等。Specific examples of pigment derivatives include compounds described in Examples described later, compounds described in JP-A-56-118462, compounds described in JP-A-63-264674, Compounds described in JP-A-01-217077, compounds described in JP-A-03-009961, compounds described in JP-A-03-026767, JP-A-03-153780 Compounds described in JP 03-045662, JP 04-285669, JP 06-145546, JP Compounds described in KOKAI Publication No. 06-212088, compounds described in Japanese Patent Application Publication No. 06-240158, compounds described in Japanese Patent Application Publication No. 10-030063, compounds disclosed in Japanese Patent Application Publication No. 10-195326 Compounds described, compounds described in paragraphs 0086 to 0098 of International Publication No. 2011/024896, compounds described in paragraphs 0063 to 0094 of International Publication No. 2012/102399, paragraph 0082 of International Publication No. 2017/038252 Compounds described in , compounds described in paragraph 0171 of JP-A-2015-151530, compounds described in paragraphs 0162-0183 of JP-A-2011-252065, JP-A-2003-081972 Compounds described in Japanese Patent No. 5299151, Compounds described in Japanese Patent Laid-Open No. 2015-172732, Compounds described in Japanese Patent Laid-Open No. 2014-199308, Japanese Patent Laid-Open No. 2014 - Compounds described in JP-A No. 085562, compounds described in JP-A No. 2014-035351, compounds described in JP-A No. 2008-081565, compounds described in JP-A No. 2019-109512 Compounds, compounds described in JP-A-2019-133154, diketopyrrolopyrrole compounds having a thiol linker described in International Publication No. 2020/002106, JP-A-2018-168244 The described benzimidazolone compounds or their salts, etc.
樹脂組成物的總固體成分中的色材的含量為55質量%以上,57.5質量%以上為較佳,60質量%以上為更佳,62.5質量%以上為進一步較佳。上限為80質量%以下為較佳,77.5質量%以下為更佳,75質量%以下為進一步較佳。The content of the color material in the total solids of the resin composition is 55% by mass or more, preferably 57.5% by mass or more, more preferably 60% by mass or more, and more preferably 62.5% by mass or more. The upper limit is preferably at most 80% by mass, more preferably at most 77.5% by mass, and still more preferably at most 75% by mass.
樹脂組成物的總固體成分中的顏料的含量為30質量%以上為較佳,45質量%以上為更佳,55質量%以上為進一步較佳。上限為80質量%以下為較佳,77.5質量%以下為更佳,75質量%以下為進一步較佳。依據本發明的樹脂組成物,即使在顏料的含量高之情況下,亦能夠形成抑制顏色不均勻之膜,因此在顏料的含量高之情況下,本發明的效果更顯著。The content of the pigment in the total solid content of the resin composition is preferably at least 30% by mass, more preferably at least 45% by mass, and still more preferably at least 55% by mass. The upper limit is preferably at most 80% by mass, more preferably at most 77.5% by mass, and still more preferably at most 75% by mass. According to the resin composition of the present invention, even when the content of the pigment is high, it is possible to form a film that suppresses color unevenness. Therefore, the effect of the present invention is more prominent when the content of the pigment is high.
色材中的顏料的含量為20~100質量%為較佳,50~100質量%為更佳,70~100質量%為進一步較佳。又,色材中的顏料與顏料衍生物的合計的含量為25~100質量%為較佳,55~100質量%為更佳,75~100質量%為進一步較佳。The content of the pigment in the color material is preferably from 20 to 100% by mass, more preferably from 50 to 100% by mass, and still more preferably from 70 to 100% by mass. Moreover, the total content of the pigment and the pigment derivative in the color material is preferably 25 to 100 mass %, more preferably 55 to 100 mass %, and still more preferably 75 to 100 mass %.
<<樹脂B>> 本發明的樹脂組成物含有樹脂(以下,記載為樹脂)。樹脂例如以將顏料等分散於樹脂組成物中之用途或黏合劑的用途進行摻合。再者,將主要為了將顏料等分散於樹脂組成物中而使用之樹脂稱為分散劑。但是,樹脂的該等用途為一例,亦能夠以該等用途以外的目的使用樹脂。 <<Resin B>> The resin composition of the present invention contains a resin (hereinafter, referred to as resin). The resin is blended, for example, for dispersing a pigment or the like in a resin composition or for a binder. In addition, the resin mainly used for dispersing a pigment etc. in a resin composition is called a dispersing agent. However, these uses of the resin are examples, and the resin can also be used for purposes other than these uses.
(特定樹脂) 本發明的樹脂組成物中所含有之樹脂含有樹脂b1(以下,亦稱為特定樹脂),前述樹脂b1包含具有酸基之重複單元b1-1、具有選自包含2個以上的芳香族環之基團、包含雜環基之基團及包含縮合環之基團中之官能基b之重複單元b1-2及除了重複單元b1-1及重複單元b1-2以外的重複單元b1-3。 (specific resin) The resin contained in the resin composition of the present invention contains resin b1 (hereinafter, also referred to as specific resin), and the above-mentioned resin b1 includes a repeating unit b1-1 having an acid group, and has a compound selected from the group consisting of two or more aromatic rings. Repeating unit b1-2 and repeating unit b1-3 other than repeating unit b1-1 and repeating unit b1-2 of the functional group b in the group, the group containing a heterocyclic group, and the group containing a condensed ring.
[重複單元b1-1] 特定樹脂含有具有酸基之重複單元b1-1(以下,亦稱為重複單元b1-1)。作為酸基,可舉出羧基、磷酸基、磺基及酚性羥基,羧基為較佳。 [repeating unit b1-1] The specific resin contains repeating unit b1-1 (hereinafter also referred to as repeating unit b1-1) having an acidic group. Examples of the acid group include a carboxyl group, a phosphoric acid group, a sulfo group, and a phenolic hydroxyl group, and a carboxyl group is preferred.
重複單元b1-1中所包含之酸基的個數可以為1個,亦可以為2個以上。重複單元b1-1中所包含之酸基的個數為1~4個為較佳,1個或2個為更佳。The number of acid groups included in the repeating unit b1-1 may be one, or two or more. The number of acid groups included in the repeating unit b1-1 is preferably 1 to 4, more preferably 1 or 2.
作為重複單元b1-1,可舉出由下述式(bb-1)表示之重複單元。 [化學式4] As repeating unit b1-1, the repeating unit represented by following formula (bb-1) is mentioned. [chemical formula 4]
式(bb-1)的R b1~R b3分別獨立地表示氫原子或烷基。R b1~R b3所表示之烷基的碳數為1~10為較佳,1~3為更佳,1為進一步較佳。 R b1 to R b3 of the formula (bb-1) each independently represent a hydrogen atom or an alkyl group. The alkyl group represented by R b1 to R b3 has preferably 1 to 10 carbon atoms, more preferably 1 to 3 carbon atoms, and more preferably 1 carbon atoms.
式(bb-1)的L b1表示單鍵或n1+1價的連接基。其中,在n1為2以上之情況下,L b1為n1+1價的連接基。 作為L b1所表示之n1+1價的連接基,可舉出脂肪族烴基、芳香族烴基、-NH-、-SO-、-SO 2-、-CO-、-O-、-COO-、OCO-、-S-及組合該等中的2個以上而成之基團。脂肪族烴基、芳香族烴基亦可以具有取代基。作為取代基,可舉出羥基、鹵素原子等。 L b1 in formula (bb-1) represents a single bond or a linking group with a valence of n1+1. However, when n1 is 2 or more, L b1 is a linking group having a valency of n1+1. Examples of the n1+1-valent linking group represented by L b1 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, OCO-, -S-, and a group formed by combining two or more of them. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.
式(bb-1)的A b1表示酸基。作為A b1所表示之酸基,可舉出羧基、磷酸基、磺基及酚性羥基,羧基為較佳。 A b1 of the formula (bb-1) represents an acid group. Examples of the acid group represented by A b1 include a carboxyl group, a phosphoric acid group, a sulfo group, and a phenolic hydroxyl group, and a carboxyl group is preferred.
式(bb-1)的n1表示1以上的整數,1~4的整數為較佳,1或2為更佳。n1 in the formula (bb-1) represents an integer of 1 or more, preferably an integer of 1 to 4, more preferably 1 or 2.
作為重複單元b1-1的具體例,可舉出以下所示之結構的重複單元。 [化學式5] Specific examples of the repeating unit b1-1 include repeating units having the structures shown below. [chemical formula 5]
特定樹脂中的重複單元b1-1的含量為5~50質量%為較佳,5~40質量%為更佳,10~35質量%為進一步較佳。下限為12質量%以上為較佳,14質量%以上為更佳。The content of the repeating unit b1-1 in the specific resin is preferably from 5 to 50% by mass, more preferably from 5 to 40% by mass, and still more preferably from 10 to 35% by mass. The lower limit is preferably at least 12% by mass, more preferably at least 14% by mass.
[重複單元b1-2] 特定樹脂包含具有選自包含2個以上的芳香族環之基團、包含雜環基之基團及包含縮合環之基團中之官能基b之重複單元b1-2(以下,亦稱為重複單元b1-2)。 [repeating unit b1-2] The specific resin comprises repeating units b1-2 (hereinafter, also referred to as repeating unit b1-2).
重複單元b1-2所具有之上述官能基b為含有酮結構之基團為較佳。若官能基b為含有酮結構之基團,則在作為色材使用酞青顏料之情況下,能夠形成更抑制顏色不均勻之膜。It is preferable that the said functional group b which the repeating unit b1-2 has is a group containing a ketone structure. When the functional group b is a group containing a ketone structure, when a phthalocyanine pigment is used as a color material, it is possible to form a film with more suppressed color unevenness.
又,官能基b為具有2~4個環結構之基團亦較佳。在該態樣中,在該態樣中,官能基b中所包含之環結構的數量為2~3個為較佳。Moreover, it is also preferable that the functional group b is a group having 2 to 4 ring structures. In this aspect, in this aspect, the number of ring structures contained in the functional group b is preferably 2 to 3.
又,官能基b為包含2~5個雜原子之基團亦較佳。在該態樣中,官能基b中所包含之雜原子的數量為2~4個為較佳。Moreover, it is also preferable that the functional group b is a group containing 2 to 5 heteroatoms. In this aspect, the number of heteroatoms included in the functional group b is preferably 2 to 4.
其中,官能基b為具有2~4個環結構並且包含2~5個雜原子之基團為較佳,具有2~3個環結構並且包含2~4個雜原子之基團為更佳。尤其,官能基b為含有酮結構之基團,具有2~4個環結構(較佳為2~3個環結構)並且包含2~5個(較佳為2~4個)雜原子之基團為較佳。藉由作為官能基b使用這種結構的基團,在作為色材使用酞青顏料之情況下,能夠形成更抑制顏色不均勻之膜。Among them, the functional group b is preferably a group having 2-4 ring structures and containing 2-5 heteroatoms, more preferably a group having 2-3 ring structures and containing 2-4 heteroatoms. In particular, the functional group b is a group containing a ketone structure, having 2 to 4 ring structures (preferably 2 to 3 ring structures) and containing 2 to 5 (preferably 2 to 4) heteroatoms Group is better. By using a group having such a structure as the functional group b, when a phthalocyanine pigment is used as a color material, it is possible to form a film with more suppressed color unevenness.
官能基b為含有萘二甲醯亞胺結構、吖啶酮結構、9-氧硫口山口星結構、氧雜蒽酮結構、蔥酮結構、苯并咪唑結構、苯并噻唑結構、苯并㗁唑結構、苯并三唑結構、苯并㗁二唑結構、苯并噻二唑結構、苯并噻𠯤結構、苯并㗁𠯤結構、苯甲醯脲結構、異噻唑啉酮結構、啡㗁𠯤結構、啡噻𠯤結構、二羥基吖啶結構、啡㗁噻結構、二苯并哌喃結構、茀結構、咔唑結構、咔啉結構、二苯并噻吩結構、二苯并呋喃結構、嘧啶結構、吡𠯤結構、喹唑啉結構、喹㗁啉結構、喹啉結構、咪唑結構、噻唑結構、吲哚結構、苯并噻吩結構、苯并哌喃結構、喹啉酮結構、硫口克唍酮結構、口克唍結構、苯并咪唑酮結構、鄰苯二甲醯亞胺結構、萘-2,3-二羧基醯亞胺結構、吡唑結構、吡唑琳桐結構、異吲哚啉結構、異吲哚啉酮結構、蒽醌結構、四唑結構、二苯甲酮結構、三𠯤結構、偶氮苯結構、亞苄苯胺結構、啡𠯤結構、巴比妥酸結構、苝結構、紫環酮結構、喹啉黃結構、己內醯胺結構、糖精結構、聯苯結構、三芳基苯結構、三芳基胺結構、苯并二氫噻唑酮結構或苯并㗁唑啉酮結構之基團為較佳, 含有萘二甲醯亞胺結構、吖啶酮結構、氧雜蒽酮結構、蔥酮結構、苯并咪唑結構、苯并噻唑結構、苯并㗁唑結構、苯并三唑結構、苯并㗁二唑結構、苯并噻二唑結構、啡㗁𠯤結構、啡噻𠯤結構、二羥基吖啶結構、啡㗁噻結構、二苯并哌喃結構、咔唑結構、咔啉結構、二苯并噻吩結構、二苯并呋喃結構、嘧啶結構、吡𠯤結構、喹唑啉結構、喹㗁啉結構、咪唑結構、噻唑結構、吲哚結構、苯并噻吩結構、苯并哌喃結構、喹啉酮結構、硫口克唍酮結構、口克唍結構、鄰苯二甲醯亞胺結構、萘-2,3-二羧基醯亞胺結構、吡唑結構、吡唑琳桐結構、異吲哚啉結構、異吲哚啉酮結構、蒽醌結構、四唑結構、二苯甲酮結構、三𠯤結構、偶氮苯結構、亞苄苯胺結構、啡𠯤結構、巴比妥酸結構、苝結構、紫環酮結構、糖精結構、聯苯結構、三芳基苯結構、三芳基胺結構、苯并二氫噻唑酮結構或苯并㗁唑啉酮結構之基團為更佳, 含有萘二甲醯亞胺結構、吖啶酮結構、氧雜蒽酮結構、蔥酮結構、苯并咪唑結構、苯并噻唑結構、苯并㗁唑結構、苯并三唑結構、苯并㗁二唑結構、苯并噻二唑結構、啡㗁𠯤結構、啡噻𠯤結構、二羥基吖啶結構、啡㗁噻結構、二苯并哌喃結構、咔啉結構、二苯并噻吩結構、二苯并呋喃結構、嘧啶結構、吡𠯤結構、喹唑啉結構、喹㗁啉結構、硫口克唍酮結構、口克唍結構、鄰苯二甲醯亞胺結構、吡唑琳桐結構、異吲哚啉酮結構、四唑結構、亞苄苯胺結構、苯并二氫噻唑酮結構或苯并㗁唑啉酮結構之基團為更佳, 含有萘二甲醯亞胺結構、吖啶酮結構、氧雜蒽酮結構、苯并咪唑結構、苯并噻唑結構、苯并㗁唑結構、苯并三唑結構、苯并㗁二唑結構、苯并噻二唑結構、啡㗁𠯤結構、啡噻𠯤結構、啡㗁噻結構、鄰苯二甲醯亞胺結構、吡唑琳桐結構、四唑結構、苯并二氫噻唑酮結構或苯并㗁唑啉酮結構之基團為進一步較佳, 含有萘二甲醯亞胺結構、吖啶酮結構、苯并咪唑結構、苯并噻唑結構、苯并㗁唑結構、啡㗁𠯤結構、啡噻𠯤結構、啡㗁噻結構、鄰苯二甲醯亞胺結構、吡唑琳桐結構或四唑結構之基團為更進一步較佳, 從容易形成更抑制顏色不均勻之膜之理由考慮,含有萘二甲醯亞胺結構或吖啶酮結構之基團為特佳。 The functional group b contains naphthalimide structure, acridone structure, 9-oxosulfuric star structure, xanthone structure, allium ketone structure, benzimidazole structure, benzothiazole structure, benzo Azole structure, benzotriazole structure, benzodiazole structure, benzothiadiazole structure, benzothia𠯤 structure, benzo㗁𠯤 structure, benzoylurea structure, isothiazolinone structure, phenanthiazolinone structure, phenanthiadiazole structure Structure, phenanthrene structure, dihydroxyacridine structure, phenanthrene structure, dibenzopyran structure, oxene structure, carbazole structure, carboline structure, dibenzothiophene structure, dibenzofuran structure, pyrimidine structure , pyryrone structure, quinazoline structure, quinoline structure, quinoline structure, imidazole structure, thiazole structure, indole structure, benzothiophene structure, benzopyran structure, quinolinone structure, thiocrotone Structure, Kremne structure, Benzimidazolone structure, Phthalimide structure, Naphthalene-2,3-dicarboxyimide structure, Pyrazole structure, Pyrazolin structure, Isoindoline structure , isoindolinone structure, anthraquinone structure, tetrazole structure, benzophenone structure, trioxane structure, azobenzene structure, benzylidene aniline structure, phenanthrene structure, barbituric acid structure, perylene structure, purple Groups with cyclic ketone structure, quinoline yellow structure, caprolactam structure, saccharin structure, biphenyl structure, triarylbenzene structure, triarylamine structure, benzodihydrothiazolone structure or benzodiazolinone structure For better, Contains naphthalimide structure, acridone structure, xanthone structure, onionone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, benzotriazole structure, benzodiazole Azole structure, benzothiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, dihydroxyacridine structure, phenanthiadiazole structure, dibenzopyran structure, carbazole structure, carboline structure, dibenzothiophene Structure, Dibenzofuran structure, Pyrimidine structure, Pyramide structure, Quinazoline structure, Quinoline structure, Imidazole structure, Thiazole structure, Indole structure, Benzothiophene structure, Benzopyran structure, Quinolinone structure , Thiocrotine structure, Crotium structure, Phthalimide structure, Naphthalene-2,3-dicarboxyimide structure, Pyrazole structure, Pyrazolin structure, Isoindoline structure , isoindolinone structure, anthraquinone structure, tetrazole structure, benzophenone structure, trioxane structure, azobenzene structure, benzylidene aniline structure, phenanthrene structure, barbituric acid structure, perylene structure, purple Groups with cyclic ketone structure, saccharin structure, biphenyl structure, triarylbenzene structure, triarylamine structure, benzodihydrothiazolone structure or benzoxazolone structure are more preferred, Contains naphthalimide structure, acridone structure, xanthone structure, onionone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, benzotriazole structure, benzodiazole Azole structure, benzothiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, dihydroxyacridine structure, phenanthiadiazole structure, dibenzopyran structure, carboline structure, dibenzothiophene structure, diphenyl Furan structure, pyrimidine structure, pyrimidine structure, quinazoline structure, quinoline structure, thiocrotin structure, pyrimide structure, phthalimide structure, pyrazolene structure, isoindoline Groups with dorinone structure, tetrazole structure, benzylidene aniline structure, benzodihydrothiazolone structure or benzooxazolone structure are more preferred, Contains naphthalimide structure, acridone structure, xanthone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, benzotriazole structure, benzodiazole structure, benzo Thiadiazole structure, phenanthiazolone structure, phenanthiazolone structure, phenanthiazolium structure, phthalimine structure, pyrazolinium structure, tetrazole structure, benzodihydrothiazolone structure or benzo The group of the oxazolinone structure is further preferred, Contains naphthalimide structure, acridone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, phenanthiazole structure, phenanthiazolinium structure, morphothiazolinium structure, phthaloyl The group of imine structure, pyrazolium structure or tetrazole structure is further preferred, A group containing a naphthalimide structure or an acridone structure is particularly preferable because it is easier to form a film with more suppressed color unevenness.
作為官能基b的具體例,可舉出以下所示之結構的基團及該等基團與取代基鍵結之結構的基團。作為取代基,可舉出以後述之取代基T例舉之基團。以下式中,*表示連接鍵,R表示氫原子或取代基。作為取代基,可舉出以後述之取代基T例舉之基團。 [化學式6] [化學式7] [化學式8] [化學式9] Specific examples of the functional group b include a group having the structure shown below and a group having a structure in which these groups are bonded to a substituent. Examples of the substituent include groups exemplified for the substituent T described later. In the following formulae, * represents a linking bond, and R represents a hydrogen atom or a substituent. Examples of the substituent include groups exemplified for the substituent T described later. [chemical formula 6] [chemical formula 7] [chemical formula 8] [chemical formula 9]
作為上述之取代基T,可舉出以下基團。鹵素原子(例如為氟原子、氯原子、溴原子、碘原子)、烷基(較佳為碳數1~30的烷基)、烯基(較佳為碳數2~30的烯基)、炔基(較佳為碳數2~30的炔基)、芳基(較佳為碳數6~30的芳基)、雜環基(較佳為碳數1~30的雜環基)、胺基(較佳為碳數0~30的胺基)、烷氧基(較佳為碳數1~30的烷氧基)、芳氧基(較佳為碳數6~30的芳氧基)、雜環氧基(較佳為碳數1~30的雜環氧基)、醯基(較佳為碳數2~30的醯基)、烷氧羰基(較佳為碳數2~30的烷氧羰基)、芳氧羰基(較佳為碳數7~30的芳氧羰基)、雜環氧羰基(較佳為碳數2~30的雜環氧羰基)、醯氧基(較佳為碳數2~30的醯氧基)、醯胺基(較佳為碳數2~30的醯胺基)、胺基羰基胺基(較佳為碳數2~30的胺基羰基胺基)、烷氧基羰基胺基(較佳為碳數2~30的烷氧基羰基胺基)、芳氧基羰基胺基(較佳為碳數7~30的芳氧基羰基胺基)、胺磺醯基(較佳為碳數0~30的胺磺醯基)、胺磺醯基胺基(較佳為碳數0~30的胺磺醯基胺基)、胺甲醯基(較佳為碳數1~30的胺甲醯基)、烷硫基(較佳為碳數1~30的烷硫基)、芳硫基(較佳為碳數6~30的芳硫基)、雜環硫基(較佳為碳數1~30的雜環硫基)、烷基磺醯基(較佳為碳數1~30的烷基磺醯基)、烷基磺醯基胺基(較佳為碳數1~30的烷基磺醯基胺基)、芳基磺醯基(較佳為碳數6~30的芳基磺醯基)、芳基磺醯基胺基(較佳為碳數6~30的芳基磺醯基胺基)、雜環磺醯基(較佳為碳數1~30的雜環磺醯基)、雜環磺醯基胺基(較佳為碳數1~30的雜環磺醯基胺基)、烷基亞磺醯基(較佳為碳數1~30的烷基亞磺醯基)、芳基亞磺醯基(較佳為碳數6~30的芳基亞磺醯基)、雜環亞磺醯基(較佳為碳數1~30的雜環亞磺醯基)、脲基(較佳為碳數1~30的脲基)、羥基、硝基、羧酸醯胺基、磺酸醯胺基、醯亞胺基、膦基、巰基、氰基、烷基亞磺酸基、芳基亞磺酸基、芳基偶氮基、雜環偶氮基、氧膦基、氧膦基氧基、氧膦基胺基、甲矽烷基、肼基、亞胺基。在該等基團為還能夠取代之基團之情況下,還可以具有取代基。Examples of the above-mentioned substituent T include the following groups. Halogen atom (such as fluorine atom, chlorine atom, bromine atom, iodine atom), alkyl group (preferably an alkyl group with 1 to 30 carbon atoms), alkenyl group (preferably an alkenyl group with 2 to 30 carbon atoms), Alkynyl (preferably an alkynyl group with 2 to 30 carbons), aryl (preferably an aryl group with 6 to 30 carbons), heterocyclic group (preferably a heterocyclic group with 1 to 30 carbons), Amino group (preferably an amino group with 0 to 30 carbons), alkoxy group (preferably an alkoxy group with 1 to 30 carbons), aryloxy group (preferably an aryloxy group with 6 to 30 carbons) ), heterocyclic epoxy group (preferably a heterocyclic epoxy group with 1 to 30 carbons), acyl group (preferably an acyl group with 2 to 30 carbons), alkoxycarbonyl group (preferably a carbon number with 2 to 30 alkoxycarbonyl), aryloxycarbonyl (preferably aryloxycarbonyl with 7 to 30 carbons), heteroepoxycarbonyl (preferably heteroepoxycarbonyl with 2 to 30 carbons), acyloxy (preferably an acyloxy group with 2 to 30 carbons), an amido group (preferably an amide group with 2 to 30 carbons), an aminocarbonylamine group (preferably an aminocarbonylamino group with 2 to 30 carbons ), an alkoxycarbonylamine group (preferably an alkoxycarbonylamine group with 2 to 30 carbons), an aryloxycarbonylamine group (preferably an aryloxycarbonylamine group with 7 to 30 carbons), Aminosulfonyl group (preferably sulfamoylamino group with 0-30 carbon atoms), sulfamoylamino group (preferably sulfamoylamino group with 0-30 carbon atoms), carbamoyl group (more preferably carbamoyl with 1 to 30 carbons), alkylthio (preferably alkylthio with 1 to 30 carbons), arylthio (preferably arylthio with 6 to 30 carbons), Heterocyclic thio group (preferably a heterocyclic thio group with 1 to 30 carbons), alkylsulfonyl group (preferably an alkylsulfonyl group with 1 to 30 carbons), alkylsulfonylamino group ( preferably an alkylsulfonylamino group with 1 to 30 carbons), an arylsulfonyl group (preferably an arylsulfonyl group with 6 to 30 carbons), an arylsulfonylamino group (preferably is an arylsulfonylamino group with 6 to 30 carbons), a heterocyclic sulfonyl group (preferably a heterocyclic sulfonyl group with 1 to 30 carbons), a heterocyclic sulfonylamino group (preferably a carbon Heterocyclic sulfinylamino group with a number of 1 to 30), alkylsulfinyl group (preferably an alkylsulfinyl group with a carbon number of 1 to 30), arylsulfinyl group (preferably a carbon number 6-30 arylsulfinyl group), heterocyclic sulfinyl group (preferably heterocyclic sulfinyl group with 1-30 carbon numbers), ureido group (preferably urea group with 1-30 carbon number ), hydroxyl, nitro, carboxylic acid amido, sulfonamide, imide, phosphino, mercapto, cyano, alkylsulfinate, arylsulfinate, arylazo group, heterocyclic azo group, phosphinyl group, phosphinyloxy group, phosphinylamino group, silyl group, hydrazine group, imino group. When these groups are groups that can further be substituted, they may further have a substituent.
作為重複單元b1-2,可舉出由下述式(bb-2)表示之重複單元。 [化學式10] As repeating unit b1-2, the repeating unit represented by following formula (bb-2) is mentioned. [chemical formula 10]
式(bb-2)的R b11~R b13分別獨立地表示氫原子或烷基。R b11~R b13所表示之烷基的碳數為1~10為較佳,1~3為更佳,1為進一步較佳。 R b11 to R b13 of the formula (bb-2) each independently represent a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by R b11 -R b13 is preferably 1-10, more preferably 1-3, and still more preferably 1.
式(bb-2)的L b11表示單鍵或2價的連接基。作為L b11所表示之2價的連接基,可舉出脂肪族烴基、芳香族烴基、-NH-、-SO-、-SO 2-、-CO-、-O-、-COO-、OCO-、-S-及組合該等中的2個以上而成之基團。脂肪族烴基、芳香族烴基亦可以具有取代基。作為取代基,可舉出羥基、鹵素原子等。 L b11 in formula (bb-2) represents a single bond or a divalent linking group. Examples of the divalent linking group represented by L b11 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, OCO- , -S- and a group formed by combining two or more of these. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.
式(bb-2)的A b11表示上述官能基b。 A b11 of formula (bb-2) represents the above-mentioned functional group b.
作為重複單元b1-2的具體例,可舉出後述之實施例中所記載之重複單元A-1~A-57。Specific examples of the repeating unit b1-2 include repeating units A-1 to A-57 described in Examples described later.
特定樹脂中的重複單元b1-2的含量為5~50質量%為較佳,5~40質量%為更佳,10~35質量%為進一步較佳。下限為12質量%以上為較佳,14質量%以上為更佳。The content of the repeating unit b1-2 in the specific resin is preferably from 5 to 50% by mass, more preferably from 5 to 40% by mass, and still more preferably from 10 to 35% by mass. The lower limit is preferably at least 12% by mass, more preferably at least 14% by mass.
[重複單元b1-3] 特定樹脂包含除了重複單元b1-1及重複單元b1-2以外的重複單元b1-3。 [repeat unit b1-3] The specific resin contains repeating unit b1-3 other than repeating unit b1-1 and repeating unit b1-2.
作為重複單元b1-3,可舉出具有交聯性基之重複單元(以下,亦稱為重複單元b1-3a)、具有接枝鏈之重複單元(以下,亦稱為重複單元b1-3b)、酸基、具有除了交聯性基及上述之官能基b以外的官能基(以下,亦稱為其他官能基)之重複單元(以下,亦稱為重複單元b1-3c)等。重複單元b1-3為具有脲結構之重複單元亦較佳。Examples of the repeating unit b1-3 include a repeating unit having a crosslinkable group (hereinafter also referred to as repeating unit b1-3a), and a repeating unit having a graft chain (hereinafter also referred to as repeating unit b1-3b) , acid groups, repeating units (hereinafter also referred to as repeating units b1-3c) having functional groups (hereinafter also referred to as other functional groups) other than the crosslinkable group and the above-mentioned functional group b, etc. It is also preferable that the repeating unit b1-3 is a repeating unit having a urea structure.
作為重複單元b1-3a所具有之交聯性基,可舉出含乙烯性不飽和鍵之基團及環狀醚基。作為含乙烯性不飽和鍵之基團,可舉出乙烯基、苯乙烯基、(甲基)烯丙基、(甲基)丙烯醯基等。作為環狀醚基,可舉出環氧基、氧雜環丁基等,環氧基為較佳。環氧基可以為脂環式環氧基。再者,脂環式環氧基係指具有環氧環與飽和烴環縮合而成之環狀結構之1價的官能基。Examples of the crosslinkable group that the repeating unit b1-3a has include an ethylenically unsaturated bond-containing group and a cyclic ether group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a styryl group, a (meth)allyl group, and a (meth)acryl group. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned, and an epoxy group is preferable. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed.
作為重複單元b1-3a,可舉出由下述式(bb-3a)表示之重複單元。 [化學式11] As repeating unit b1-3a, the repeating unit represented by following formula (bb-3a) is mentioned. [chemical formula 11]
式(bb-3a)的R b21~R b23分別獨立地表示氫原子或烷基。R b21~R b23所表示之烷基的碳數為1~10為較佳,1~3為更佳,1為進一步較佳。 R b21 to R b23 of the formula (bb-3a) each independently represent a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by Rb21 - Rb23 is preferably 1-10, more preferably 1-3, and is still more preferably 1.
式(bb-3a)的L b21表示單鍵或2價的連接基。作為L b21所表示之2價的連接基,可舉出脂肪族烴基、芳香族烴基、-NH-、-SO-、-SO 2-、-CO-、-O-、-COO-、OCO-、-S-及組合該等中的2個以上而成之基團。脂肪族烴基、芳香族烴基亦可以具有取代基。作為取代基,可舉出羥基、鹵素原子等。 L b21 of the formula (bb-3a) represents a single bond or a divalent linking group. Examples of the divalent linking group represented by L b21 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, OCO- , -S- and a group formed by combining two or more of these. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.
式(bb-3a)的A b21表示交聯性基。 A b21 of formula (bb-3a) represents a crosslinkable group.
作為重複單元b1-3a的具體例,可舉出以下所示之結構的重複單元。 [化學式12] Specific examples of the repeating unit b1-3a include repeating units having the structures shown below. [chemical formula 12]
作為重複單元b1-3b所具有之接枝鏈,可舉出包含選自聚酯結構、聚醚結構、聚苯乙烯結構及聚(甲基)丙烯酸結構中之至少1種結構之接枝鏈,從能夠形成更抑制顏色不均勻之膜、進而能夠更有效地抑制粗大粒子的產生之理由考慮,聚酯結構或聚醚結構的接枝鏈為較佳,聚酯結構的接枝鏈為更佳。Examples of the graft chain included in the repeating unit b1-3b include a graft chain comprising at least one structure selected from the group consisting of a polyester structure, a polyether structure, a polystyrene structure, and a poly(meth)acrylic acid structure, From the viewpoint of being able to form a film with more suppressed color unevenness and further effectively suppressing the generation of coarse particles, grafted chains with a polyester structure or a polyether structure are preferred, and grafted chains with a polyester structure are more preferred. .
作為接枝鏈的末端結構,並無特別限定。可以為氫原子,亦可以為取代基。作為取代基,可舉出烷基、烷氧基、烷基硫醚基等。其中,從提高顏料的分散性的觀點考慮,具有立體排斥效果之基團為較佳,碳數5~30的烷基或烷氧基為較佳。烷基及烷氧基可以為直鏈狀、支鏈狀及環狀中的任一種,直鏈狀或支鏈狀為較佳。The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. As a substituent, an alkyl group, an alkoxy group, an alkylsulfide group etc. are mentioned. Among them, from the viewpoint of improving the dispersibility of the pigment, a group having a steric repulsion effect is preferred, and an alkyl group or alkoxy group having 5 to 30 carbon atoms is preferred. The alkyl and alkoxy groups may be linear, branched, or cyclic, and linear or branched are preferred.
再者,接枝鏈係指從主鏈枝化之分子鏈。又,主鏈係指支鏈點最多的分子鏈。Furthermore, the grafted chain refers to a molecular chain branched from the main chain. Also, the main chain refers to a molecular chain having the most branch points.
接枝鏈的重量平均分子量為500~30000為較佳,1000~20000為更佳,2000~10000為進一步較佳。The weight average molecular weight of the graft chain is preferably from 500 to 30,000, more preferably from 1,000 to 20,000, and still more preferably from 2,000 to 10,000.
作為重複單元b1-3b,可舉出由下述式(bb-3b)表示之重複單元。 [化學式13] As repeating unit b1-3b, the repeating unit represented by following formula (bb-3b) is mentioned. [chemical formula 13]
式(bb-3b)的R b31~R b33分別獨立地表示氫原子或烷基。R b31~R b33所表示之烷基的碳數為1~10為較佳,1~3為更佳,1為進一步較佳。 R b31 to R b33 of the formula (bb-3b) each independently represent a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by Rb31 - Rb33 is preferably 1-10, more preferably 1-3, and still more preferably 1.
式(bb-3b)的L b31表示單鍵或2價的連接基。作為L b31所表示之2價的連接基,可舉出脂肪族烴基、芳香族烴基、-NH-、-SO-、-SO 2-、-CO-、-O-、-COO-、OCO-、-S-及組合該等中的2個以上而成之基團。脂肪族烴基、芳香族烴基亦可以具有取代基。作為取代基,可舉出羥基、鹵素原子等。 L b31 of the formula (bb-3b) represents a single bond or a divalent linking group. Examples of the divalent linking group represented by L b31 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, OCO- , -S- and a group formed by combining two or more of these. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.
式(bb-3b)的A b31表示接枝鏈。A b31所表示之接枝鏈為包含選自聚酯結構、聚醚結構、聚苯乙烯結構及聚(甲基)丙烯酸結構中之至少1種結構之接枝鏈為較佳,聚酯結構或聚醚結構的接枝鏈為更佳。接枝鏈的較佳的範圍與上述之內容相同。 A b31 of the formula (bb-3b) represents a grafted chain. The graft chain represented by A b31 is preferably a graft chain comprising at least one structure selected from polyester structure, polyether structure, polystyrene structure and poly(meth)acrylic acid structure, polyester structure or The graft chain of polyether structure is more preferable. The preferable range of the grafted chain is the same as the content mentioned above.
作為重複單元b1-3b的具體例,可舉出以下所示之結構的重複單元。 [化學式14] Specific examples of the repeating unit b1-3b include repeating units having the structures shown below. [chemical formula 14]
作為重複單元b1-3c所具有之其他官能基,可舉出烷基、苯基、胺基、羥基、氰基等。As another functional group which the repeating unit b1-3c has, an alkyl group, a phenyl group, an amino group, a hydroxyl group, a cyano group etc. are mentioned.
作為重複單元b1-3c,可舉出由下述式(bb-3c)表示之重複單元。 [化學式15] As repeating unit b1-3c, the repeating unit represented by following formula (bb-3c) is mentioned. [chemical formula 15]
式(bb-3c)的R b41~R b43分別獨立地表示氫原子或烷基。R b41~R b43所表示之烷基的碳數為1~10為較佳,1~3為更佳,1為進一步較佳。 R b41 to R b43 of the formula (bb-3c) each independently represent a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by Rb41 - Rb43 is preferably 1-10, more preferably 1-3, and still more preferably 1.
式(bb-3c)的L b41表示單鍵或2價的連接基。作為L b41所表示之2價的連接基,可舉出脂肪族烴基、芳香族烴基、-NH-、-SO-、-SO 2-、-CO-、-O-、-COO-、OCO-、-S-及組合該等中的2個以上而成之基團。脂肪族烴基、芳香族烴基亦可以具有取代基。作為取代基,可舉出羥基、鹵素原子等。 L b41 of the formula (bb-3c) represents a single bond or a divalent linking group. Examples of the divalent linking group represented by L b41 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, OCO- , -S- and a group formed by combining two or more of these. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.
式(bb-3c)的A b41表示其他官能基。作為其他官能基,可舉出烷基、苯基、胺基、羥基、氰基等。 A b41 of formula (bb-3c) represents another functional group. As another functional group, an alkyl group, a phenyl group, an amino group, a hydroxyl group, a cyano group, etc. are mentioned.
作為重複單元b1-3c的具體例,可舉出以下所示之結構的重複單元。 [化學式16] Specific examples of the repeating unit b1-3c include repeating units having the structures shown below. [chemical formula 16]
作為重複單元b1-3的具體例,亦可舉出後述之實施例中所記載之重複單元F-1~F-7等。Specific examples of the repeating unit b1-3 include repeating units F-1 to F-7 described in Examples described later, and the like.
特定樹脂可以僅包含一種重複單元b1-3,亦可以包含2種以上。The specific resin may contain only one kind of repeating unit b1-3, or may contain two or more kinds.
作為特定樹脂的較佳的態樣之一,可舉出作為重複單元b1-3包含具有接枝鏈之重複單元(重複單元b1-3b)之態樣。依據該態樣,能夠形成更抑制顏色不均勻之膜。進而,抑制粗大粒子的產生或亦能夠更提高樹脂組成物的經時穩定性。在該態樣中,作為重複單元b1-3b,具有聚酯結構或聚醚結構的接枝鏈之重複單元為較佳,聚酯結構的具有接枝鏈之重複單元為更佳。As one of preferable aspects of the specific resin, an aspect including a repeating unit (repeating unit b1-3b) having a graft chain as the repeating unit b1-3 is mentioned. According to this aspect, it is possible to form a film in which color unevenness is further suppressed. Furthermore, generation|occurrence|production of coarse particles can be suppressed, and the temporal stability of a resin composition can also be improved further. In this aspect, as the repeating unit b1-3b, a repeating unit having a graft chain of a polyester structure or a polyether structure is preferable, and a repeating unit having a graft chain of a polyester structure is more preferable.
作為特定樹脂的另一較佳的態樣,可舉出作為重複單元b1-3不含有具有接枝鏈之重複單元(重複單元b1-3b)之態樣。在該態樣中,進一步使用能夠除了特定樹脂以外的樹脂(後述之其他樹脂)為較佳,使用選自接枝聚合物、星形聚合物、嵌段共聚物及聚合物鏈中的至少一個末端被酸基密封之樹脂中之至少1種為更佳。依據該態樣,亦能夠形成更抑制顏色不均勻之膜。進而,抑制粗大粒子的產生或亦能夠更提高樹脂組成物的經時穩定性。As another preferable aspect of the specific resin, an aspect in which a repeating unit having a graft chain (repeating unit b1-3b) is not included as the repeating unit b1-3 is mentioned. In this aspect, it is preferable to further use a resin other than the specific resin (other resins described later), and use at least one selected from the group consisting of graft polymers, star polymers, block copolymers, and polymer chains. At least one kind of resin whose terminal is sealed with an acid group is more preferable. According to this aspect as well, it is possible to form a film in which color unevenness is further suppressed. Furthermore, generation|occurrence|production of coarse particles can be suppressed, and the temporal stability of a resin composition can also be improved further.
特定樹脂中的重複單元b1-3的含量為10~85質量%為較佳。上限為80質量%以下為較佳,75質量%以下為更佳,70質量%以下為進一步較佳。下限為15質量%以上為較佳,20質量%以上為更佳。It is preferable that content of the repeating unit b1-3 in a specific resin is 10-85 mass %. The upper limit is preferably at most 80% by mass, more preferably at most 75% by mass, and still more preferably at most 70% by mass. The lower limit is preferably at least 15% by mass, more preferably at least 20% by mass.
特定樹脂在作為重複單元b1-3含有具有交聯性基之重複單元(重複單元b1-3a)之情況下,特定樹脂中的重複單元b1-3a的含量為1~30質量%為較佳。上限為25質量%以下為較佳,15質量%以下為更佳。下限為3質量%以上為較佳,5質量%以上為更佳。When the specific resin contains a repeating unit (repeating unit b1-3a) having a crosslinkable group as the repeating unit b1-3, the content of the repeating unit b1-3a in the specific resin is preferably 1 to 30% by mass. The upper limit is preferably at most 25% by mass, more preferably at most 15% by mass. The lower limit is preferably at least 3% by mass, more preferably at least 5% by mass.
特定樹脂在作為重複單元b1-3含有具有接枝鏈之重複單元(重複單元b1-3b)之情況下,特定樹脂中的重複單元b1-3b的含量為1~80質量%為較佳。上限為70質量%以下為較佳,60質量%以下為更佳。下限為3質量%以上為較佳,5質量%以上為更佳。When the specific resin contains a repeating unit having a graft chain (repeating unit b1-3b) as the repeating unit b1-3, the content of the repeating unit b1-3b in the specific resin is preferably 1 to 80% by mass. The upper limit is preferably at most 70% by mass, more preferably at most 60% by mass. The lower limit is preferably at least 3% by mass, more preferably at least 5% by mass.
特定樹脂在作為重複單元b1-3含有具有其他官能基之重複單元(重複單元b1-3c)之情況下,特定樹脂中的重複單元b1-3c的含量為1~80質量%為較佳。上限為70質量%以下為較佳,60質量%以下為更佳。下限為3質量%以上為較佳,5質量%以上為更佳。When the specific resin contains a repeating unit (repeating unit b1-3c) having another functional group as the repeating unit b1-3, the content of the repeating unit b1-3c in the specific resin is preferably 1 to 80% by mass. The upper limit is preferably at most 70% by mass, more preferably at most 60% by mass. The lower limit is preferably at least 3% by mass, more preferably at least 5% by mass.
[特定樹脂的具體例] 作為特定樹脂的具體例,可舉出後述之實施例顯示之樹脂P1~P188、PP1、PP2、PP101~PP136。 [Concrete example of specific resin] Specific examples of the specific resin include resins P1 to P188, PP1, PP2, and PP101 to PP136 shown in Examples described later.
[特定樹脂的物性] 特定樹脂的酸值為10~250mgKOH/g為較佳。上限為220mgKOH/g以下為較佳,200mgKOH/g以下為更佳。下限為30mgKOH/g以上為較佳,50mgKOH/g以上為更佳。若特定樹脂的酸值在上述範圍內,則能夠形成樹脂組成物中的顏料的分散性良好並且更抑制顏色不均勻之膜。此外,亦能夠更有效地抑制樹脂組成物中的粗大粒子的產生等。此外,藉由光微影法形成圖案時,亦能夠更有效地抑制顯影殘渣的產生。 [Physical properties of specific resins] The acid value of the specific resin is preferably 10 to 250 mgKOH/g. The upper limit is preferably 220 mgKOH/g or less, more preferably 200 mgKOH/g or less. The lower limit is preferably 30 mgKOH/g or more, more preferably 50 mgKOH/g or more. When the acid value of the specific resin is within the above-mentioned range, the dispersibility of the pigment in the resin composition is good, and a film in which color unevenness is further suppressed can be formed. In addition, it is also possible to more effectively suppress the generation of coarse particles in the resin composition and the like. In addition, when the pattern is formed by the photolithography method, the generation of development residue can be more effectively suppressed.
特定樹脂的重量平均分子量為1000~100000為較佳。下限為2000以上為較佳,4000以上為更佳。上限為60000以下為較佳,40000以下為更佳。若特定樹脂的重量平均分子量在上述範圍內,則能夠形成更抑制顏色不均勻之膜。此外,能夠更提高樹脂組成物的經時穩定性。此外,藉由光微影法形成圖案時,亦能夠更有效地抑制顯影殘渣的產生。It is preferable that the weight average molecular weight of a specific resin is 1,000-100,000. The lower limit is preferably 2000 or more, more preferably 4000 or more. The upper limit is preferably 60,000 or less, more preferably 40,000 or less. When the weight average molecular weight of a specific resin exists in the said range, the film which suppressed color unevenness more can be formed. In addition, the temporal stability of the resin composition can be further improved. In addition, when the pattern is formed by the photolithography method, the generation of development residue can be more effectively suppressed.
特定樹脂的由下述式(A λ)表示之比吸光度為3以下為較佳,2以下為更佳,1以下為進一步較佳。 E=A/(c×l)……(A λ) 式(A λ)中,E表示波長400~800nm下的最大吸收波長下的特定樹脂的比吸光度, A表示波長400~800nm下的最大吸收波長下的特定樹脂的吸光度, l表示位由cm表示之槽長度, c表示單位由mg/ml表示之溶液中的特定樹脂的濃度。 The specific resin has a specific absorbance represented by the following formula (A λ ) of preferably 3 or less, more preferably 2 or less, and still more preferably 1 or less. E=A/(c×l)...(A λ ) In the formula (A λ ), E represents the specific absorbance of a specific resin at the maximum absorption wavelength at a wavelength of 400-800nm, and A represents the maximum absorption at a wavelength of 400-800nm. The absorbance of the specific resin at the absorption wavelength, l represents the groove length expressed in cm, and c represents the concentration of the specific resin in the solution expressed in mg/ml.
在特定樹脂具有交聯性基之情況下,特定樹脂的交聯性基量為0.01~2.5mmol/g為較佳。下限為0.2mmol/g以上為較佳,0.5mmol/g以上為更佳。上限為2mmol/g以下為較佳,1.5mmol/g以下為更佳。若特定樹脂的交聯性基量在上述範圍內,則樹脂組成物中的顏料的分散性及樹脂組成物的硬化性良好。再者,特定樹脂的交聯性基量為表示每1g特定樹脂的固體成分的交聯性基的莫耳量之數值。When the specific resin has a crosslinkable group, the amount of the crosslinkable group in the specific resin is preferably 0.01 to 2.5 mmol/g. The lower limit is preferably at least 0.2 mmol/g, more preferably at least 0.5 mmol/g. The upper limit is preferably at most 2 mmol/g, more preferably at most 1.5 mmol/g. When the crosslinkable group amount of the specific resin is within the above range, the dispersibility of the pigment in the resin composition and the curability of the resin composition are favorable. In addition, the crosslinkable group amount of a specific resin is a numerical value which shows the molar amount of the crosslinkable group per 1g of solid content of a specific resin.
(其他樹脂) 本發明的樹脂組成物能夠含有與上述之特定樹脂不同之樹脂(以下,亦稱為其他樹脂)。 (other resins) The resin composition of the present invention may contain resins (hereinafter, also referred to as other resins) different from the above-mentioned specific resins.
作為其他樹脂,例如可舉出(甲基)丙烯酸樹脂、環氧樹脂、(甲基)丙烯醯胺樹脂、烯-硫醇樹脂、聚碳酸酯樹脂、聚醚樹脂、聚芳酯樹脂、聚碸樹脂、聚醚碸樹脂、聚苯樹脂、聚伸芳基醚氧化膦樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚烯烴樹脂、環狀烯烴樹脂、聚酯樹脂、苯乙烯樹脂、矽氧烷樹脂等。又,作為樹脂,亦能夠使用國際公開第2016/088645號的實施例中所記載之樹脂、日本特開2017-057265公報中所記載之樹脂、日本特開2017-032685公報中所記載之樹脂、日本特開2017-075248公報中所記載之樹脂、日本特開2017-066240公報中所記載之樹脂、日本特開2017-167513公報中所記載之樹脂、日本特開2017-173787公報中所記載之樹脂、日本特開2017-206689號公報的0041~0060段中所記載之樹脂、日本特開2018-010856號公報的0022~0071段中所記載之樹脂、日本特開2016-222891公報中所記載之嵌段聚異氰酸酯樹脂(cyanate resin)、日本特開2020-122052公報中所記載之樹脂、日本特開2020-111656公報中所記載之樹脂、日本特開2020-139021公報中所記載之樹脂、日本特開2017-138503號公報中所記載之包含在主鏈上具有環結構之構成單元及在側鏈上具有聯苯基之構成單元之樹脂、日本特開2020-186373號公報的0199~0233段中所記載之樹脂、日本特開2020-186325號公報中所記載之鹼可溶性樹脂、韓國公開專利第10-2020-0078339號公報中所記載之由式1表示之樹脂。Examples of other resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, Resin, polyether resin, polyphenylene resin, polyarylether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin , silicone resin, etc. In addition, as the resin, resins described in the examples of International Publication No. 2016/088645, resins described in JP-A 2017-057265, resins described in JP-A 2017-032685, Resins described in JP-A 2017-075248, resins described in JP-A 2017-066240, resins described in JP-A 2017-167513, and resins described in JP-A 2017-173787 Resins, the resins described in paragraphs 0041 to 0060 of JP-A-2017-206689, the resins described in paragraphs 0022-0071 of JP-A-2018-010856, and the resins described in JP-A-2016-222891 The blocked polyisocyanate resin (cyanate resin), the resin described in JP-A-2020-122052, the resin described in JP-A-2020-111656, the resin described in JP-A-2020-139021, Resin containing a constituent unit having a ring structure on the main chain and a constituent unit having a biphenyl group on the side chain described in JP-A-2017-138503, 0199-0233 of JP-A-2020-186373 The resin described in the paragraph, the alkali-soluble resin described in Japanese Patent Laid-Open No. 2020-186325, and the resin represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0078339.
其他樹脂的重量平均分子量(Mw)為3000~2000000為較佳。上限為1000000以下為較佳,500000以下為更佳。下限為4000以上為較佳,5000以上為更佳。The weight average molecular weight (Mw) of other resins is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4000 or more, more preferably 5000 or more.
作為其他樹脂,使用具有酸基之樹脂為較佳。作為酸基,例如可舉出羧基、磷酸基、磺酸基、苯酚性羥基等。其他樹脂所具有之酸基的種類可以與上述之特定樹脂所具有之酸基相同,亦可以為與之不同者。從能夠更提高樹脂組成物的經時穩定性之理由考慮,其他樹脂包含具有比特定樹脂所具有之酸基更小之pKa的酸基之樹脂(以下,亦稱為樹脂X)為較佳。又,特定樹脂所具有之酸基的pKa與樹脂X所具有之酸基的pka之差(特定樹脂的酸基的pKa-樹脂X的pKa)為1.0以上為較佳,1.5以上為更佳,2.0以上為進一步較佳。作為特定樹脂所具有之酸基與樹脂X所具有之酸基的較佳的組合,可舉出特定樹脂所具有之酸基為羧基並且樹脂X所具有之酸基為磺基或磷酸基(較佳為磷酸基)之組合。As other resins, it is preferable to use a resin having an acid group. As an acidic group, a carboxyl group, a phosphoric acid group, a sulfonic acid group, a phenolic hydroxyl group etc. are mentioned, for example. The kind of the acid group which other resin has may be the same as the acid group which the above-mentioned specific resin has, and may be different. Another resin containing an acid group having a pKa smaller than that of the specific resin (hereinafter, also referred to as resin X) is preferable for the reason that the temporal stability of the resin composition can be further improved. Also, the difference between the pKa of the acid groups of the specific resin and the pKa of the acid groups of the resin X (the pKa of the acid groups of the specific resin - the pKa of the resin X) is preferably 1.0 or more, more preferably 1.5 or more, 2.0 or more is more preferable. As a preferable combination of the acid group that the specific resin has and the acid group that the resin X has, the acid group that the specific resin has is a carboxyl group and the acid group that the resin X has is a sulfo group or a phosphoric acid group (compared to preferably a combination of phosphate groups).
具有酸基之樹脂的酸值為30~500mgKOH/g為較佳。下限為40mgKOH/g以上為更佳,50mgKOH/g以上為特佳。上限為400mgKOH/g以下為更佳,300mgKOH/g以下為進一步較佳,200mgKOH/g以下特佳。具有酸基之樹脂的重量平均分子量(Mw)為5000~100000為較佳,5000~50000為更佳。又,具有酸基之樹脂的數平均分子量(Mn)為1000~20000為較佳。The acid value of the resin with acid groups is preferably 30-500 mgKOH/g. The lower limit is more preferably 40 mgKOH/g or more, and particularly preferably 50 mgKOH/g or more. The upper limit is more preferably 400 mgKOH/g or less, further preferably 300 mgKOH/g or less, and particularly preferably 200 mgKOH/g or less. The weight average molecular weight (Mw) of the resin having an acid group is preferably from 5,000 to 100,000, more preferably from 5,000 to 50,000. Moreover, it is preferable that the number average molecular weight (Mn) of the resin which has an acid group is 1000-20000.
具有酸基之樹脂含有在側鏈上具有酸基之重複單元為較佳,在樹脂的所有重複單元中含有5~70莫耳%的在側鏈上具有酸基之重複單元為更佳。在側鏈上具有酸基之重複單元的含量的上限為50莫耳%以下為較佳,30莫耳%以下為更佳。在側鏈上具有酸基之重複單元的含量的下限為10莫耳%以上為較佳,20莫耳%以上為更佳。The resin having an acidic group preferably contains repeating units having an acidic group on the side chain, and more preferably contains 5 to 70 mol % of repeating units having an acidic group on the side chain in all the repeating units of the resin. The upper limit of the content of the repeating unit having an acid group on the side chain is preferably 50 mol % or less, more preferably 30 mol % or less. The lower limit of the content of the repeating unit having an acid group in the side chain is preferably 10 mol % or more, more preferably 20 mol % or more.
關於具有酸基之樹脂,能夠參閱日本特開2012-208494號公報的0558~0571段(對應之美國專利申請公開第2012/0235099號說明書的0685~0700段)的記載、日本特開2012-198408號公報的0076~0099段的記載,該等內容被編入本說明書中。又,具有酸基之樹脂亦能夠使用市售品。又,作為將酸基導入到樹脂之方法,並無特別限制,例如可舉出日本專利第6349629號公報中所記載之方法。另外,作為將酸基導入到樹脂之方法,亦可舉出使酸酐與在環氧基的開環反應中生成之羥基進行反應來導入酸基之方法。Regarding resins having acid groups, reference can be made to the descriptions in paragraphs 0558 to 0571 of JP-A-2012-208494 (corresponding to paragraphs 0685-0700 of US Patent Application Publication No. 2012/0235099), JP-A-2012-198408 No. 0076 to 0099 of the Publication No. 0076 to 0099, these contents are incorporated into this specification. Moreover, the resin which has an acid group can also use a commercial item. Moreover, there are no particular limitations on the method for introducing an acid group into the resin, and examples thereof include the method described in Japanese Patent No. 6349629 . Moreover, as a method of introducing an acid group into a resin, the method of introducing an acid group by reacting an acid anhydride with the hydroxyl group produced|generated in the ring-opening reaction of an epoxy group is also mentioned.
作為其他樹脂,亦能夠使用具有鹼基之樹脂。具有鹼基之樹脂為含有在側鏈上具有鹼基之重複單元之樹脂為較佳,具有在側鏈上具有鹼基之重複單元及不含有鹼基之重複單元之共聚物為更佳,具有在側鏈上具有鹼基之重複單元及不含有鹼基之重複單元之嵌段共聚物為進一步較佳。具有鹼基之樹脂亦能夠用作分散劑。具有鹼基之樹脂的胺值為5~300mgKOH/g為較佳。下限為10mgKOH/g以上為較佳,20mgKOH/g以上為更佳。上限為200mgKOH/g以下為較佳,100mgKOH/g以下為更佳。As another resin, the resin which has a base can also be used. The resin with base is preferably the resin containing the repeating unit with base on the side chain, and the copolymer with the repeating unit with base on the side chain and the repeating unit without base is more preferred, with A block copolymer having a repeating unit of a base on a side chain and a repeating unit not containing a base is further preferred. Resins with bases can also be used as dispersants. The amine value of the resin having a base is preferably 5-300 mgKOH/g. The lower limit is preferably at least 10 mgKOH/g, more preferably at least 20 mgKOH/g. The upper limit is preferably 200 mgKOH/g or less, more preferably 100 mgKOH/g or less.
作為具有鹼基之樹脂的市售品,可舉出DISPERBYK-161、162、163、164、166、167、168、174、182、183、184、185、2000、2001、2050、2150、2163、2164、BYK-LPN6919(以上為BYK Chemie公司製)、SOLSPERSE11200、13240、13650、13940、24000、26000、28000、32000、32500、32550、32600、33000、34750、35100、35200、37500、38500、39000、53095、56000、7100(以上為Lubrizol Japan Limited.製)、Efka PX 4300、4330、4046、4060、4080(以上為BASF公司製)等。又,具有鹼基之樹脂亦能夠使用日本特開2014-219665號公報的0063~0112段中所記載之嵌段共聚物(B)、日本特開2018-156021號公報的0046~0076段中所記載之嵌段共聚物A1、日本特開2019-184763號公報的0150~0153段中所記載之具有鹼基之乙烯基樹脂,該等內容被編入本說明書中。Commercially available resins having bases include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, BYK-LPN6919 (manufactured by BYK Chemie), SOLSPERSE11200, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 35000, 395 53095, 56000, 7100 (the above are manufactured by Lubrizol Japan Limited.), Efka PX 4300, 4330, 4046, 4060, 4080 (the above are manufactured by BASF Corporation), etc. In addition, as the resin having a base, the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665 and the block copolymer (B) described in paragraphs 0046-0076 of JP-A-2018-156021 can also be used. The block copolymer A1 described, and the vinyl resin having a base described in paragraphs 0150 to 0153 of JP-A-2019-184763 are incorporated in this specification.
其他樹脂使用具有酸基之樹脂及具有鹼基之樹脂亦較佳。依據該態樣,能夠更提高樹脂組成物的經時穩定性。在併用具有酸基之樹脂及具有鹼基之樹脂之情況下,具有鹼基之樹脂的含量相對於具有酸基之樹脂的100質量份為20~500質量份為較佳,30~300質量份為更佳,50~200質量份為進一步較佳。As other resins, it is also preferable to use a resin with an acid group and a resin with a base. According to this aspect, the temporal stability of the resin composition can be further improved. In the case of using a resin with an acid group and a resin with a base in combination, the content of the resin with a base is preferably 20 to 500 parts by mass, 30 to 300 parts by mass relative to 100 parts by mass of the resin with an acid group More preferably, 50-200 mass parts is still more preferable.
作為其他樹脂使用包含源自含有由下述式(ED1)表示之化合物和/或由下述式(ED2)表示之化合物(以下,有時將該等化合物亦稱為“醚二聚物”。)之單體成分之重複單元之樹脂亦較佳。As another resin, a compound derived from a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) is used (hereinafter, these compounds may also be referred to as "ether dimer". ) The resin of the repeating unit of the monomer component is also preferred.
[化學式17] [chemical formula 17]
式(ED1)中,R 1及R 2分別獨立地表示氫原子或可以具有取代基之碳數1~25的烴基。 [化學式18] 式(ED2)中,R表示氫原子或碳數1~30的有機基。關於式(ED2)的詳細內容,能夠參閱日本特開2010-168539號公報的記載,該內容被編入本說明書中。 In formula (ED1), R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [chemical formula 18] In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of the formula (ED2), the description in JP 2010-168539 A can be referred to, and the content is incorporated in this specification.
作為醚二聚物的具體例,例如能夠參閱日本特開2013-029760號公報的0317段的記載,該內容被編入本說明書中。As a specific example of the ether dimer, for example, the description in paragraph 0317 of JP-A-2013-029760 can be referred to, and the content is incorporated in this specification.
作為其他樹脂,使用包含源自由式(X)表示之化合物之重複單元之樹脂亦較佳。 [化學式19] 式中,R 1表示氫原子或甲基,R 21及R 22分別獨立地表示伸烷基,n表示0~15的整數。R 21及R 22所表示之伸烷基的碳數為1~10為較佳,1~5為更佳,1~3為進一步較佳,2或3為特佳。n表示0~15的整數,0~5的整數為較佳,0~4的整數為更佳,0~3的整數為進一步較佳。 As other resins, it is also preferable to use a resin comprising a repeating unit derived from the compound represented by formula (X). [chemical formula 19] In the formula, R 1 represents a hydrogen atom or a methyl group, R 21 and R 22 each independently represent an alkylene group, and n represents an integer of 0-15. The carbon number of the alkylene group represented by R 21 and R 22 is preferably 1-10, more preferably 1-5, still more preferably 1-3, and particularly preferably 2 or 3. n represents an integer of 0-15, preferably an integer of 0-5, more preferably an integer of 0-4, and further preferably an integer of 0-3.
作為由式(X)表示之化合物,可舉出對枯基苯酚的環氧乙烷或環氧丙烷改質(甲基)丙烯酸酯等。作為市售品,可舉出ARONIX M-110(TOAGOSEI CO.,LTD.製)等。Examples of the compound represented by the formula (X) include ethylene oxide or propylene oxide modified (meth)acrylate of p-cumylphenol, and the like. As a commercial item, ARONIX M-110 (made by TOAGOSEI CO., LTD.) etc. are mentioned.
作為其他樹脂,使用具有交聯性基團之樹脂亦較佳。作為交聯性基團,可舉出含乙烯性不飽和鍵之基團及環狀醚基。作為含乙烯性不飽和鍵之基團,可舉出乙烯基、苯乙烯基、(甲基)烯丙基、(甲基)丙烯醯基等。作為環狀醚基,可舉出環氧基、氧雜環丁基等,環氧基為較佳。環氧基可以為脂環式環氧基。再者,脂環式環氧基係指具有環氧環與飽和烴環縮合而成之環狀結構之1價的官能基。As another resin, it is also preferable to use a resin having a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups and cyclic ether groups. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a styryl group, a (meth)allyl group, and a (meth)acryl group. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned, and an epoxy group is preferable. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed.
作為其他樹脂,使用具有芳香族羧基之樹脂(以下,亦稱為樹脂Ac)亦較佳。樹脂Ac中,芳香族羧基可以包含在重複單元的主鏈上,亦可以包含在重複單元的側鏈上。芳香族羧基包含於重複單元的主鏈上為較佳。再者,本說明書中,芳香族羧基係指在芳香族環鍵結1個以上羧基之結構的基團。芳香族羧基中,與芳香族環鍵結而成之羧基的數量為1~4個為較佳,1~2個為更佳。It is also preferable to use a resin having an aromatic carboxyl group (hereinafter also referred to as resin Ac) as another resin. In resin Ac, the aromatic carboxyl group may be included in the main chain of the repeating unit, or may be included in the side chain of the repeating unit. The aromatic carboxyl group is preferably contained in the main chain of the repeating unit. In addition, in this specification, an aromatic carboxyl group means the group of the structure which bonded one or more carboxyl groups to an aromatic ring. Among the aromatic carboxyl groups, the number of carboxyl groups bonded to the aromatic ring is preferably 1 to 4, more preferably 1 to 2.
樹脂Ac為包含選自由式(Ac-1)表示之重複單元及由式(Ac-2)表示之重複單元中之至少1種重複單元之樹脂為較佳。 [化學式20] 式(Ac-1)中,Ar 1表示包含芳香族羧基之基團,L 1表示-COO-或-CONH-,L 2表示2價的連接基。 式(Ac-2)中,Ar 10表示含有芳香族羧基之基團,L 11表示-COO-或-CONH-,L 12表示3價的連接基,P 10表示聚合物鏈。 Resin Ac is preferably a resin containing at least one repeating unit selected from repeating units represented by formula (Ac-1) and repeating units represented by formula (Ac-2). [chemical formula 20] In the formula (Ac-1), Ar 1 represents a group including an aromatic carboxyl group, L 1 represents -COO- or -CONH-, and L 2 represents a divalent linking group. In formula (Ac-2), Ar 10 represents a group containing an aromatic carboxyl group, L 11 represents -COO- or -CONH-, L 12 represents a trivalent linking group, and P 10 represents a polymer chain.
作為式(Ac-1)中Ar 1所表示之含有芳香族羧基之基團,可舉出源自芳香族三羧酸酐之結構、源自芳香族四羧酸酐之結構等。作為芳香族三羧酸酐及芳香族四羧酸酐,可舉出下述結構的化合物。 [化學式21] Examples of the aromatic carboxyl group-containing group represented by Ar 1 in the formula (Ac-1) include a structure derived from an aromatic tricarboxylic anhydride, a structure derived from an aromatic tetracarboxylic anhydride, and the like. Examples of the aromatic tricarboxylic acid anhydride and the aromatic tetracarboxylic acid anhydride include compounds of the following structures. [chemical formula 21]
上述式中,Q 1表示單鍵、-O-、-CO-、-COOCH 2CH 2OCO-、-SO 2-、-C(CF 3) 2-、由下述式(Q-1)表示之基團或由下述式(Q-2)表示之基團。 [化學式22] In the above formula, Q 1 represents a single bond, -O-, -CO-, -COOCH 2 CH 2 OCO-, -SO 2 -, -C(CF 3 ) 2 -, represented by the following formula (Q-1) or a group represented by the following formula (Q-2). [chemical formula 22]
Ar 1所表示之包含芳香族羧基之基團可以具有交聯性基團。交聯性基團為含乙烯性不飽和鍵之基團及環狀醚基為較佳,含乙烯性不飽和鍵之基團為更佳。作為Ar 1所表示之含有芳香族羧基之基團的具體例,可舉出由式(Ar-11)表示之基團、由式(Ar-12)表示之基團、由式(Ar-13)表示之基團等。 [化學式23] The group containing an aromatic carboxyl group represented by Ar 1 may have a crosslinkable group. The cross-linkable group is preferably an ethylenically unsaturated bond-containing group and a cyclic ether group, more preferably an ethylenically unsaturated bond-containing group. Specific examples of the group containing an aromatic carboxyl group represented by Ar 1 include groups represented by formula (Ar-11), groups represented by formula (Ar-12), groups represented by formula (Ar-13 ) represents the group, etc. [chemical formula 23]
式(Ar-11)中,n1表示1~4的整數,1或2為較佳,2為更佳。 式(Ar-12)中,n2表示1~8的整數,1~4的整數為較佳,1或2為更佳,2為進一步較佳。 式(Ar-13)中,n3及n4分別獨立地表示0~4的整數,0~2的整數為較佳,1或2為更佳,1為進一步較佳。其中,n3及n4的至少一個為1以上的整數。 式(Ar-13)中,Q 1表示單鍵、-O-、-CO-、-COOCH 2CH 2OCO-、-SO 2-、-C(CF 3) 2-、由上述式(Q-1)表示之基團或由上述式(Q-2)表示之基團。 式(Ar-11)~(Ar-13)中,*1表示與L 1的鍵結位置。 In formula (Ar-11), n1 represents an integer of 1 to 4, 1 or 2 is preferable, and 2 is more preferable. In formula (Ar-12), n2 represents an integer of 1 to 8, preferably an integer of 1 to 4, more preferably 1 or 2, and still more preferably 2. In formula (Ar-13), n3 and n4 each independently represent an integer of 0 to 4, an integer of 0 to 2 is preferable, 1 or 2 is more preferable, and 1 is still more preferable. However, at least one of n3 and n4 is an integer of 1 or more. In the formula (Ar-13), Q 1 represents a single bond, -O-, -CO-, -COOCH 2 CH 2 OCO-, -SO 2 -, -C(CF 3 ) 2 -, from the above formula (Q- 1) The group represented by or the group represented by the above-mentioned formula (Q-2). In formulas (Ar-11) to (Ar-13), *1 represents a bonding position with L 1 .
式(Ac-1)中,L 1表示-COO-或-CONH-,表示-COO-為較佳。 In the formula (Ac-1), L 1 represents -COO- or -CONH-, preferably -COO-.
作為式(Ac-1)中L 2所表示之2價的連接基,可舉出伸烷基、伸芳基、-O-、-CO-、-COO-、-OCO-、-NH-、-S-及組合該等2種以上而成之基團。伸烷基的碳數為1~30為較佳,1~20為更佳,1~15為進一步較佳。伸烷基可以為直鏈、支鏈、環狀中的任一種。伸芳基的碳數為6~30為較佳,6~20為更佳,6~10為進一步較佳。伸烷基及伸芳基可以具有取代基。作為取代基,可舉出羥基等。L 2所表示之2價的連接基為由-L 2a-O-表示之基團為較佳。L 2a可舉出伸烷基;伸芳基;伸烷基與伸芳基組合而成之基團;選自伸烷基及伸芳基中之至少1種與選自-O-、-CO-、-COO-、-OCO-、-NH-及-S-中之至少1種組合而成之基團,伸烷基為較佳。伸烷基的碳數為1~30為較佳,1~20為更佳,1~15為進一步較佳。伸烷基可以為直鏈、支鏈、環狀中的任一種。伸烷基及伸芳基可以具有取代基。作為取代基,可舉出羥基等。 Examples of the divalent linking group represented by L2 in formula (Ac-1) include alkylene, arylylene, -O-, -CO-, -COO-, -OCO-, -NH-, -S- and a group formed by combining two or more of these. The number of carbon atoms in the alkylene group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The alkylene group may be any of linear, branched and cyclic. The carbon number of the arylylene group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. An alkylene group and an arylylene group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. The divalent linking group represented by L 2 is preferably a group represented by -L 2a -O-. L 2a can include an alkylene group; an arylylene group; a group formed by a combination of an alkylene group and an arylylene group; at least one selected from the group consisting of an alkylene group and an arylylene group and a group selected from -O-, -CO A combination of at least one of -, -COO-, -OCO-, -NH-, and -S-, preferably an alkylene group. The number of carbon atoms in the alkylene group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The alkylene group may be any of linear, branched and cyclic. An alkylene group and an arylylene group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned.
作為式(Ac-2)中Ar 10所表示之包含芳香族羧基之基團,與式(Ac-1)的Ar 1的含義相同,較佳之範圍亦相同。 The group containing an aromatic carboxyl group represented by Ar 10 in formula (Ac-2) has the same meaning as Ar 1 in formula (Ac-1), and the preferred range is also the same.
式(Ac-2)中,L 11表示-COO-或-CONH-,表示-COO-為較佳。 In the formula (Ac-2), L 11 represents -COO- or -CONH-, preferably -COO-.
作為式(Ac-2)中L 12所表示之3價的連接基,可舉出烴基、-O-、-CO-、-COO-、-OCO-、-NH-、-S-及組合該等2種以上而成之基團。烴基可舉出脂肪族烴基、芳香族烴基。脂肪族烴基的碳數為1~30為較佳,1~20為更佳,1~15為進一步較佳。脂肪族烴基可以為直鏈、支鏈、環狀中的任一種。芳香族烴基的碳數為6~30為較佳,6~20為更佳,6~10為進一步較佳。烴基可以具有取代基。作為取代基,可舉出羥基等。L 12所表示之3價的連接基為由式(L12-1)表示之基團為較佳,由式(L12-2)表示之基團為更佳。 [化學式24] Examples of the trivalent linking group represented by L12 in the formula (Ac- 2 ) include hydrocarbon groups, -O-, -CO-, -COO-, -OCO-, -NH-, -S-, and combinations thereof. Groups formed by more than two types. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The hydrocarbon group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. The trivalent linking group represented by L 12 is preferably a group represented by formula (L12-1), more preferably a group represented by formula (L12-2). [chemical formula 24]
式(L12-1)中,L 12b表示3價的連接基,X 1表示S,*1表示與式(Ac-2)的L 11的鍵結位置,*2表示與式(Ac-2)的P 10的鍵結位置。作為L 12b所表示之3價的連接基,可舉出烴基;烴基與選自-O-、-CO-、-COO-、-OCO-、-NH-及-S-中之至少1種組合而成之基團等,烴基或烴基與-O-組合而成之基團為較佳。 In formula (L12-1), L 12b represents a trivalent linking group, X 1 represents S, *1 represents the bonding position with L 11 of formula (Ac-2), and *2 represents the bonding position with formula (Ac-2) The bonding position of P 10 . Examples of the trivalent linking group represented by L12b include a hydrocarbon group; a combination of a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH-, and -S- As the resulting group, etc., a hydrocarbon group or a combination of a hydrocarbon group and -O- is preferable.
式(L12-2)中,L 12c表示3價的連接基,X 1表示S,*1表示與式(Ac-2)的L 11的鍵結位置,*2表示與式(Ac-2)的P 10的鍵結位置。作為L 12c所表示之3價的連接基,可舉出烴基;烴基與選自-O-、-CO-、-COO-、-OCO-、-NH-及-S-中之至少1種組合而成之基團等,烴基為較佳。 In formula (L12-2), L 12c represents a trivalent linking group, X 1 represents S, *1 represents the bonding position with L 11 of formula (Ac-2), and *2 represents the bonding position with formula (Ac-2) The bonding position of P 10 . Examples of the trivalent linking group represented by L12c include a hydrocarbon group; a combination of a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH-, and -S- The resulting groups, etc., are preferably hydrocarbon groups.
式(Ac-2)中,P 10表示聚合物鏈。P 10所表示之聚合物鏈具有選自聚酯結構、聚醚結構、聚苯乙烯結構及聚(甲基)丙烯酸結構中之至少1種結構為較佳。聚合物鏈P 10的重量平均分子量為500~20000為較佳。下限為1000以上為較佳。上限為10000以下為較佳,5000以下為更佳,3000以下為進一步較佳。若P 10的重量平均分子量在上述範圍內,則組成物中的顏料的分散性良好。具有芳香族羧基之樹脂為具有由式(Ac-2)表示之重複單元之樹脂之情況下,該樹脂可較佳地用作分散劑。 In the formula (Ac-2), P 10 represents a polymer chain. The polymer chain represented by P10 preferably has at least one structure selected from the group consisting of polyester structure, polyether structure, polystyrene structure and poly(meth)acrylic acid structure. The weight average molecular weight of the polymer chain P10 is preferably 500-20000. The lower limit is preferably 1000 or more. The upper limit is preferably 10,000 or less, more preferably 5,000 or less, and still more preferably 3,000 or less. When the weight average molecular weight of P10 is within the above-mentioned range, the dispersibility of the pigment in the composition will be good. When the resin having an aromatic carboxyl group is a resin having a repeating unit represented by formula (Ac-2), the resin can be preferably used as a dispersant.
P 10所表示之聚合物鏈可以包含交聯性基。作為交聯性基團,可舉出含乙烯性不飽和鍵之基團及環狀醚基。 The polymer chain represented by P10 may contain a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups and cyclic ether groups.
作為其他樹脂,使用選自接枝聚合物、星形聚合物、嵌段共聚物及聚合物鏈中的至少一個末端被酸基密封之樹脂中之至少1種為較佳。該種樹脂可較佳地用作分散劑。As another resin, it is preferable to use at least one selected from the group consisting of graft polymers, star polymers, block copolymers, and resins in which at least one terminal of the polymer chain is sealed with an acid group. Such a resin can be preferably used as a dispersant.
作為接枝聚合物,可舉出包含具有接枝鏈之重複單元之樹脂及具有由上述之式(Ac-2)表示之重複單元之樹脂等。作為接枝鏈,可舉出包含選自聚酯結構、聚醚結構、聚苯乙烯結構及聚(甲基)丙烯酸結構中之至少1種結構之接枝鏈。作為接枝鏈的末端結構,並無特別限定。可以為氫原子,亦可以為取代基。作為取代基,可舉出烷基、烷氧基、烷基硫醚基等。其中,從提高顏料的分散性的觀點考慮,具有立體排斥效果之基團為較佳,碳數5~30的烷基或烷氧基為較佳。烷基及烷氧基可以為直鏈狀、支鏈狀及環狀中的任一種,直鏈狀或支鏈狀為較佳。Examples of the graft polymer include a resin containing a repeating unit having a graft chain, a resin having a repeating unit represented by the above formula (Ac-2), and the like. Examples of the graft chain include a graft chain containing at least one structure selected from a polyester structure, a polyether structure, a polystyrene structure, and a poly(meth)acrylic acid structure. The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. As a substituent, an alkyl group, an alkoxy group, an alkylsulfide group etc. are mentioned. Among them, from the viewpoint of improving the dispersibility of the pigment, a group having a steric repulsion effect is preferred, and an alkyl group or alkoxy group having 5 to 30 carbon atoms is preferred. The alkyl and alkoxy groups may be linear, branched, or cyclic, and linear or branched are preferred.
作為接枝聚合物的具體例,可舉出日本特開2012-255128號公報的0025~0094段、日本特開2009-203462號公報的0022~0097段、日本特開2012-255128號公報的0102~0166段中所記載之樹脂。Specific examples of the graft polymer include paragraphs 0025 to 0094 of JP-A-2012-255128 , paragraphs 0022-0097 of JP-A-2009-203462 , and paragraphs 0102 and 2012 of JP-A-2012-255128 . ~ Resins described in paragraph 0166.
作為星形聚合物,可舉出在核部鍵結有複數個聚合物鏈之結構的樹脂。作為星型聚合物的具體例,可舉出日本特開2013-043962號公報的0196~0209段中所記載之高分子化合物C-1~C-31等。Examples of the star polymer include resins having a structure in which a plurality of polymer chains are bonded to the core. Specific examples of the star polymer include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP 2013-043962 A .
作為嵌段共聚物,具有含有酸基或鹼基之重複單元之聚合物的嵌段(以下,亦稱為嵌段A)與具有不含有酸基及鹼基之重複單元之聚合物的嵌段(以下,亦稱為嵌段B)的嵌段共聚物為較佳。嵌段共聚物亦能夠使用日本特開2014-219665號公報的0063~0112段中所記載之嵌段共聚物(B)、日本特開2018-156021號公報的0046~0076段中所記載之嵌段共聚物A1,該等內容被編入本說明書中。As a block copolymer, a block of a polymer having a repeating unit containing an acid group or a base (hereinafter also referred to as block A) and a block of a polymer having a repeating unit not containing an acid group or a base (hereinafter also referred to as block B) block copolymers are preferred. As the block copolymer, block copolymers (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665 and block copolymers described in paragraphs 0046-0076 of JP-A-2018-156021 can also be used. Segment copolymer A1, these contents are incorporated into this specification.
作為聚合物鏈中的至少一個末端被酸基密封之樹脂,可舉出包含選自聚酯結構、聚醚結構及聚(甲基)丙烯酸結構中之至少1種結構之聚合物鏈中的至少一個末端被酸基密封之結構的樹脂。作為密封聚合物鏈的末端之酸基,可舉出羧基、磺基、磷酸基。Examples of resins in which at least one end of the polymer chain is sealed with an acid group include at least one of polymer chains containing at least one structure selected from the group consisting of polyester structures, polyether structures, and poly(meth)acrylic acid structures. A resin whose ends are sealed with acid groups. Examples of the acid group sealing the terminal of the polymer chain include a carboxyl group, a sulfo group, and a phosphoric acid group.
其他樹脂亦能夠使用作為分散劑的樹脂。作為分散劑,可舉出酸性分散劑(酸性樹脂)、鹼性分散劑(鹼性樹脂)。在此,酸性分散劑(酸性樹脂)表示酸基的量多於鹼基的量的樹脂。作為酸性分散劑(酸性樹脂),將酸基的量與鹼性基的量的總計量設為100莫耳%時,酸基的量為70莫耳%以上之樹脂為較佳。酸性分散劑(酸性樹脂)所具有之酸基係羧基為較佳。酸性分散劑(酸性樹脂)的酸值為10~105mgKOH/g為較佳。又,鹼性分散劑(鹼性樹脂)表示鹼基的量多於酸基的量的樹脂。作為鹼性分散劑(鹼性樹脂),將酸基的量與鹼性基的量的總量設為100莫耳%時鹼性基的量超過50莫耳%之樹脂為較佳。鹼性分散劑所具有之鹼性基為胺基為較佳。Other resins can also be used as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the acidic dispersant (acidic resin) means a resin having more acidic groups than basic groups. As the acidic dispersant (acidic resin), when the total amount of the amount of acid groups and the amount of basic groups is 100 mol %, a resin with an amount of acid groups of 70 mol % or more is preferable. The acidic group contained in the acidic dispersant (acidic resin) is preferably a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10-105 mgKOH/g. In addition, the basic dispersant (basic resin) means a resin having more basic groups than acid groups. As the basic dispersant (basic resin), a resin having a basic group exceeding 50 mol% when the total amount of acid groups and basic groups is 100 mol% is preferable. It is preferable that the basic group which the basic dispersant has is an amine group.
分散劑還能夠作為市售品而獲得,作為該等具體例,可舉出BYK Chemie公司製的Disperbyk系列(例如Disperbyk-111、161、2001等)、Lubrizol Japan Limited.製的SOLSPERSE系列(例如SOLSPERSE 20000、76500等)、Ajinomoto Fine-Techno Co.,Inc.製的AJISPER系列、A208F(DKS Co.Ltd.製)、H-3606(DKS Co.Ltd.製)、SANDET ET(Sanyo Chemical Industries, Ltd.製)等。又,亦能夠將日本特開2012-137564號公報的0129段中所記載之產品、日本特開2017-194662號公報的0235段中所記載之產品用作分散劑。The dispersant can also be obtained as a commercial product, and as such specific examples, the Disperbyk series manufactured by BYK Chemie (such as Disperbyk-111, 161, 2001, etc.), the SOLSPERSE series manufactured by Lubrizol Japan Limited (such as SOLSPERSE 20000, 76500, etc.), AJISPER series manufactured by Ajinomoto Fine-Techno Co., Inc., A208F (manufactured by DKS Co. Ltd.), H-3606 (manufactured by DKS Co. Ltd.), SANDET ET (manufactured by Sanyo Chemical Industries, Ltd. . System), etc. Moreover, the product described in paragraph 0129 of JP-A-2012-137564 and the product described in paragraph 0235 of JP-A-2017-194662 can also be used as a dispersant.
樹脂組成物的總固體成分中的樹脂的含量為1~50質量%為較佳。上限為40質量%以下為較佳,30質量%以下為更佳。下限為5質量%以上為較佳,10質量%以上為更佳。It is preferable that content of the resin in the total solid content of a resin composition is 1-50 mass %. The upper limit is preferably at most 40% by mass, more preferably at most 30% by mass. The lower limit is preferably at least 5% by mass, more preferably at least 10% by mass.
樹脂組成物的總固體成分中的特定樹脂的含量為1~50質量%為較佳。上限為40質量%以下為較佳,30質量%以下為更佳。下限為5質量%以上為較佳,10質量%以上為更佳。It is preferable that content of the specific resin in the total solid content of a resin composition is 1-50 mass %. The upper limit is preferably at most 40% by mass, more preferably at most 30% by mass. The lower limit is preferably at least 5% by mass, more preferably at least 10% by mass.
樹脂組成物中所含有之樹脂中的特定樹脂的含量為10~100質量%為較佳,25~100質量%為更佳,45~100質量%為進一步較佳。The content of the specific resin in the resin contained in the resin composition is preferably from 10 to 100% by mass, more preferably from 25 to 100% by mass, and still more preferably from 45 to 100% by mass.
本發明的樹脂組成物可以僅包含1種樹脂,亦可以包含2種以上。包含2種以上樹脂之情況下,該等的合計在上述範圍內為較佳。The resin composition of this invention may contain only 1 type of resin, and may contain 2 or more types. When including two or more types of resins, the total of these is preferably within the above range.
<<聚合性化合物>> 本發明的樹脂組成物具有聚合性化合物為較佳。作為聚合性化合物,可舉出具有含乙烯性不飽和鍵之基團之化合物等。作為含乙烯性不飽和鍵之基團,可舉出乙烯基、(甲基)烯丙基、(甲基)丙烯醯基等。本發明中所使用之聚合性化合物為自由基聚合性化合物為較佳。 <<Polymer compound>> It is preferable that the resin composition of this invention has a polymeric compound. Examples of the polymerizable compound include compounds having an ethylenically unsaturated bond-containing group, and the like. Examples of the ethylenically unsaturated bond-containing group include vinyl, (meth)allyl, (meth)acryl, and the like. The polymerizable compound used in the present invention is preferably a radically polymerizable compound.
作為聚合性化合物,可以為單體、預聚物、低聚物等化學形態的任一種,但單體為較佳。聚合性化合物的分子量為100~2500為較佳。上限為2000以下為較佳,1500以下為更佳。下限為150以上為較佳,250以上為更佳。The polymerizable compound may be in any chemical form such as a monomer, a prepolymer, or an oligomer, but a monomer is preferred. It is preferable that the molecular weight of a polymeric compound is 100-2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.
從樹脂組成物的經時穩定性的觀點考慮,聚合性化合物的含乙烯性不飽和鍵之基團值(以下稱為C=C值)為2~14mmol/g為較佳。下限為3mmol/g以上為較佳,4mmol/g以上為更佳,5mmol/g以上為進一步較佳。上限為12mmol/g以下為較佳,10mmol/g以下為更佳,8mmol/g以下為進一步較佳。聚合性化合物的C=C值為將在聚合性化合物的1分子中所包含之含乙烯性不飽和鍵之基團的數除以聚合性化合物的分子量來算出之值。From the viewpoint of temporal stability of the resin composition, it is preferable that the ethylenically unsaturated bond-containing group value (hereinafter referred to as C=C value) of the polymerizable compound is 2 to 14 mmol/g. The lower limit is preferably at least 3 mmol/g, more preferably at least 4 mmol/g, and still more preferably at least 5 mmol/g. The upper limit is preferably at most 12 mmol/g, more preferably at most 10 mmol/g, and still more preferably at most 8 mmol/g. The C=C value of the polymerizable compound is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in 1 molecule of the polymerizable compound by the molecular weight of the polymerizable compound.
聚合性化合物含有3個以上的含乙烯性不飽和鍵之基團之化合物為較佳,含有4個以上的含乙烯性不飽和鍵之基團之化合物為更佳。從樹脂組成物的經時穩定性的觀點考慮,含乙烯性不飽和鍵之基團的上限為15個以下為較佳,10個以下為更佳,6個以下為進一步較佳。又,聚合性化合物為3官能以上的(甲基)丙烯酸酯化合物為較佳,3~15官能的(甲基)丙烯酸酯化合物為更佳,3~10官能的(甲基)丙烯酸酯化合物為進一步較佳,3~6官能的(甲基)丙烯酸酯化合物為特佳。作為聚合性化合物的具體例,可舉出日本特開2009-288705號公報的0095~0108段、日本特開2013-029760號公報的0227段、日本特開2008-292970號公報的0254~0257段、日本特開2013-253224號公報的0034~0038段、日本特開2012-208494號公報的0477段、日本特開2017-048367號公報、日本專利第6057891號公報、日本專利第6031807號公報中所記載之化合物,且該等內容被編入本說明書中。The polymerizable compound is preferably a compound containing 3 or more ethylenically unsaturated bond-containing groups, and more preferably a compound containing 4 or more ethylenically unsaturated bond-containing groups. From the viewpoint of temporal stability of the resin composition, the upper limit of the ethylenically unsaturated bond-containing groups is preferably 15 or less, more preferably 10 or less, and still more preferably 6 or less. Furthermore, the polymerizable compound is preferably a trifunctional or higher (meth)acrylate compound, more preferably a 3-15 functional (meth)acrylate compound, and a 3-10 functional (meth)acrylate compound is More preferably, a 3-6 functional (meth)acrylate compound is especially preferable. Specific examples of polymerizable compounds include paragraphs 0095 to 0108 of JP-A-2009-288705, paragraphs 0227 of JP-A-2013-029760, and paragraphs 0254-0257 of JP-A-2008-292970. , Paragraph 0034-0038 of JP-A-2013-253224, paragraph 0477 of JP-A-2012-208494, JP-A-2017-048367, JP-A-6057891, JP-A-6031807 The compounds described, and these contents are incorporated into this specification.
作為聚合性化合物,可舉出二新戊四醇三(甲基)丙烯酸酯、二新戊四醇四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯及該等化合物的改質體等。作為改質體,可舉出乙氧基化二新戊四醇六(甲基)丙烯酸酯等、上述化合物的(甲基)丙烯醯基經由伸烷氧基鍵結之結構的化合物等。作為具體例,可舉出由式(Z-4)表示之化合物、由式(Z-5)表示之化合物等。Examples of the polymerizable compound include diperythritol tri(meth)acrylate, diperythritol tetra(meth)acrylate, dippentyl penta(meth)acrylate, dipentyl Tetrol hexa(meth)acrylate and modified products of these compounds, etc. Examples of modifiers include ethoxylated dipenteoerythritol hexa(meth)acrylate, compounds having a structure in which (meth)acryloyl groups of the above-mentioned compounds are bonded via alkyleneoxy groups, and the like. Specific examples include compounds represented by formula (Z-4), compounds represented by formula (Z-5), and the like.
[化學式25] [chemical formula 25]
式(Z-4)及(Z-5)中,E分別獨立地表示-((CH 2) yCH 2O)-或-((CH 2) yCH(CH 3)O)-,y分別獨立地表示0~10的整數,X分別獨立地表示(甲基)丙烯醯基、氫原子或羧基。式(Z-4)中,(甲基)丙烯醯基的合計為3個或4個,m分別獨立地表示0~10的整數,各m的合計為0~40的整數。式(Z-5)中,(甲基)丙烯醯基的合計為5個或6個,n分別獨立地表示0~10的整數,各n的合計為0~60的整數。 In formulas (Z-4) and (Z-5), E independently represent -((CH 2 ) y CH 2 O)- or -((CH 2 ) y CH(CH 3 )O)-, y respectively independently represent an integer of 0 to 10, and X each independently represent a (meth)acryl group, a hydrogen atom, or a carboxyl group. In formula (Z-4), the total number of (meth)acryloyl groups is 3 or 4, m each independently represents an integer of 0-10, and the total number of each m is an integer of 0-40. In formula (Z-5), the total number of (meth)acryloyl groups is 5 or 6, n each independently represents an integer of 0-10, and the total number of each n is an integer of 0-60.
式(Z-4)中,m為0~6的整數為較佳,0~4的整數為更佳。又,各m的合計為2~40的整數為較佳,2~16的整數為更佳,4~8的整數為特佳。 式(Z-5)中,n為0~6的整數為較佳,0~4的整數為更佳。又,各n的合計為3~60的整數為較佳,3~24的整數為更佳,6~12的整數為特佳。 又,式(Z-4)或式(Z-5)中的E、亦即-((CH 2) yCH 2O)-或-((CH 2) yCH(CH 3)O)-為氧原子側的末端與X鍵結之形態為較佳。 In formula (Z-4), m is preferably an integer of 0-6, more preferably an integer of 0-4. Moreover, it is preferable that the total of each m is an integer of 2-40, the integer of 2-16 is more preferable, and the integer of 4-8 is especially preferable. In formula (Z-5), n is preferably an integer of 0-6, more preferably an integer of 0-4. Moreover, it is preferable that the total of each n is an integer of 3-60, the integer of 3-24 is more preferable, and the integer of 6-12 is especially preferable. Also, E in formula (Z-4) or formula (Z-5), namely -((CH 2 ) y CH 2 O)- or -((CH 2 ) y CH(CH 3 )O)- is The form in which the terminal on the oxygen atom side is bonded to X is preferable.
又,作為聚合性化合物,亦能夠使用下述式(Z-6)所示之聚新戊四醇聚(甲基)丙烯酸酯。 [化學式26] 式(Z-6)中,X 1~X 6分別獨立地表示氫原子或(甲基)丙烯醯基,n表示1~10的整數。在此,X 1~X 6中的至少一個為(甲基)丙烯醯基。 Moreover, as a polymeric compound, the polyneopentaerythritol poly(meth)acrylate represented by following formula (Z-6) can also be used. [chemical formula 26] In formula (Z-6), X 1 to X 6 each independently represent a hydrogen atom or a (meth)acryl group, and n represents an integer of 1-10. Here, at least one of X 1 to X 6 is a (meth)acryl group.
本發明中所使用之聚合性化合物為選自包括二新戊四醇六(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、聚新戊四醇聚(甲基)丙烯酸酯及該等的改質體之群組中之至少1種為較佳。作為市售品,可舉出KAYARAD D-310、DPHA、DPEA-12(以上為Nippon Kayaku Co.,Ltd.製)、NK ESTER A-DPH-12E、TPOA-50(Shin-Nakamura Chemical Co.,Ltd.製)等。The polymeric compound used in the present invention is selected from the group consisting of diperythritol hexa(meth)acrylate, dipenteoerythritol penta(meth)acrylate, polyneopentaerythritol poly(meth)acrylic acid At least one of the group of esters and modified products of these is preferred. Commercially available products include KAYARAD D-310, DPHA, DPEA-12 (manufactured by Nippon Kayaku Co., Ltd.), NK ESTER A-DPH-12E, TPOA-50 (by Shin-Nakamura Chemical Co., Ltd.), etc.
又,作為聚合性化合物,亦能夠使用二甘油EO(環氧乙烷)改質(甲基)丙烯酸酯(作為市售品,M-460;TOAGOSEI CO.,LTD.製)、新戊四醇四(甲基)丙烯酸酯(Shin-Nakamura Chemical Co.,Ltd.製、NK ESTER A-TMMT)、1,6-己二醇二丙烯酸酯(Nippon Kayaku Co.,Ltd.製、KAYARAD HDDA)、RP-1040(Nippon Kayaku Co.,Ltd.製)、ARONIX TO-2349(TOAGOSEI CO.,LTD.製)、NK OLIGO UA-7200(Shin-Nakamura Chemical Co.,Ltd.製)、8UH-1006、8UH-1012(TAISEI FINE CHEMICAL CO,.LTD.製)、LIGHT ACRYLATE POB-A0(KYOEISHA CHEMICAL CO.,LTD.製)、EBECRYL80(DAICEL-ALLNEX LTD.製、含胺之4官能丙烯酸酯)等。Also, as the polymerizable compound, diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available, M-460; manufactured by TOAGOSEI CO., LTD.), neopentylitol Tetra(meth)acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), NK OLIGO UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by TAISEI FINE CHEMICAL CO,. LTD.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL CO., LTD.), EBECRYL80 (manufactured by DAICEL-ALLNEX LTD., amine-containing tetrafunctional acrylate), etc.
又,作為聚合性化合物,使用三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷環氧丙烷改質三(甲基)丙烯酸酯、三羥甲基丙烷環氧乙烷改質三(甲基)丙烯酸酯、異氰脲酸環氧乙烷改質三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯等3官能的(甲基)丙烯酸酯化合物亦較佳。作為3官能的(甲基)丙烯酸酯化合物的市售品,可舉出ARONIX M-309、M-310、M-321、M-350、M-360、M-313、M-315、M-306、M-305、M-303、M-452、M-450(TOAGOSEI CO.,LTD.製)、NK ESTER A9300、A-GLY-9E、A-GLY-20E、A-TMM-3、A-TMM-3L、A-TMM-3LM-N、A-TMPT、TMPT(Shin-Nakamura Chemical Co.,Ltd.製)、KAYARAD GPO-303、TMPTA、THE-330、TPA-330、PET-30(Nippon Kayaku Co.,Ltd.製)等。Also, as polymerizable compounds, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane ethylene oxide modified Trifunctional (meth)acrylate compounds such as tri(meth)acrylate, oxirane-isocyanurate-modified tri(meth)acrylate, and pentaerythritol tri(meth)acrylate are also preferable. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 ( Nippon Kayaku Co., Ltd.), etc.
又,作為聚合性化合物,亦能夠使用羧基、磺基、磷酸基等具有酸基之化合物。作為該等化合物的市售品,可舉出ARONIX M-305、M-510、M-520、ARONIX TO-2349(TOAGOSEI CO.,LTD.製)等。Moreover, as a polymeric compound, the compound which has an acid group, such as a carboxyl group, a sulfo group, and a phosphoric acid group, can also be used. As a commercial item of these compounds, ARONIX M-305, M-510, M-520, ARONIX TO-2349 (made by TOAGOSEI CO., LTD.) etc. are mentioned.
又,作為聚合性化合物亦能夠使用具有己內酯結構之化合物。關於具有己內酯結構之化合物,亦能夠參閱日本特開2013-253224號公報的0042~0045段的記載,該內容被編入本說明書中。關於具有己內酯結構之化合物,例如可舉出由Nippon Kayaku Co.,Ltd.作為KAYARAD DPCA系列而市售之DPCA-20、DPCA-30、DPCA-60、DPCA-120等。Moreover, the compound which has a caprolactone structure can also be used as a polymeric compound. Regarding the compound having the caprolactone structure, the description in paragraphs 0042 to 0045 of JP-A-2013-253224 can also be referred to, and the content is incorporated in this specification. As for the compound which has a caprolactone structure, DPCA-20, DPCA-30, DPCA-60, DPCA-120 etc. marketed by Nippon Kayaku Co., Ltd. as KAYARAD DPCA series are mentioned, for example.
又,作為聚合性化合物亦能夠使用具有茀骨架之聚合性化合物。作為市售品,可舉出OGSOL EA-0200、EA-0300(Osaka Gas Chemicals Co., Ltd.製、具有茀骨架之(甲基)丙烯酸酯單體)等。In addition, as the polymerizable compound, a polymerizable compound having a fennel skeleton can also be used. As a commercial item, OGSOL EA-0200, EA-0300 (Osaka Gas Chemicals Co., Ltd. make, the (meth)acrylate monomer which has a fennel skeleton) etc. are mentioned.
又,作為聚合性化合物,亦能夠使用實質上不含有甲苯等環境管制物質之化合物亦較佳。作為該種化合物的市售品,可舉出KAYARAD DPHA LT、KAYARAD DPEA-12 LT(Nippon Kayaku Co.,Ltd.製)等。Moreover, it is also preferable to use a compound which does not substantially contain environmental control substances, such as toluene, as a polymeric compound. Commercially available products of such compounds include KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.), and the like.
又,作為聚合性化合物,如日本特公昭48-041708號公報、日本特開昭51-037193號公報、日本特公平02-032293號公報、日本特公平02-016765號公報中所記載之胺基甲酸酯丙烯酸酯類或日本特公昭58-049860號公報、日本特公昭56-017654號公報、日本特公昭62-039417號公報、日本特公昭62-039418號公報中所記載之具有環氧乙烷系骨架之胺基甲酸酯化合物亦較佳。又,使用日本特開昭63-277653號公報、日本特開昭63-260909號公報、日本特開平01-105238號公報中所記載之在分子內具有胺基結構或硫醚結構之聚合性化合物亦較佳。又,聚合性化合物亦能夠使用UA-7200(Shin-Nakamura Chemical Co.,Ltd.製)、DPHA-40H(Nippon Kayaku Co.,Ltd.製)、UA-306H、UA-306T、UA-306I、AH-600、T-600、AI-600、LINC-202UA(KYOEISHA CHEMICAL CO.,LTD.製)等的市售品。In addition, as polymerizable compounds, such as the amine groups described in JP-A-48-041708, JP-A-51-037193, JP-A-02-032293, JP-A-02-016765 Formate acrylates or Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 have ethylene oxide Urethane compounds with an alkane skeleton are also preferred. In addition, polymerizable compounds having an amino structure or a thioether structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238 are used. Also better. In addition, as the polymerizable compound, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, Commercial items such as AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO., LTD.).
樹脂組成物的總固體成分中的聚合性化合物的含量為1~35質量%為較佳。上限為30質量%以下為較佳,25質量%以下為更佳。下限為2質量%以上為較佳,5質量%以上為更佳。本發明的樹脂組成物可以僅含有1種聚合性化合物,亦可以含有2種以上。在含有2種以上的聚合性化合物之情況下,該等總量在上述範圍內為較佳。The content of the polymerizable compound in the total solid content of the resin composition is preferably 1 to 35% by mass. The upper limit is preferably at most 30% by mass, more preferably at most 25% by mass. The lower limit is preferably at least 2% by mass, more preferably at least 5% by mass. The resin composition of this invention may contain only 1 type of polymeric compound, and may contain 2 or more types. When containing 2 or more types of polymeric compounds, it is preferable that these total amounts are in the said range.
<<光聚合起始劑>> 本發明的樹脂組成物能夠含有光聚合起始劑。在本發明的樹脂組成物含有聚合性化合物之情況下,本發明的樹脂組成物進一步含有光聚合起始劑為較佳。作為光聚合起始劑,並無特別限制,能夠從公知的光聚合起始劑中適當地進行選擇。例如,對紫外線區域至可見區域的光線具有感光性之化合物為較佳。光聚合起始劑係光自由基聚合起始劑為較佳。 <<Photopolymerization Initiator>> The resin composition of the present invention can contain a photopolymerization initiator. When the resin composition of this invention contains a polymerizable compound, it is preferable that the resin composition of this invention further contains a photoinitiator. It does not specifically limit as a photoinitiator, It can select suitably from well-known photoinitiator. For example, a compound having photosensitivity to rays from the ultraviolet range to the visible range is preferable. The photopolymerization initiator is preferably a photoradical polymerization initiator.
作為光聚合起始劑,可舉出鹵化烴衍生物(例如,具有三𠯤骨架之化合物、具有㗁二唑骨架之化合物等)、醯基膦化合物、六芳基聯咪唑化合物、肟化合物、有機過氧化物、硫化合物、酮化合物、芳香族鎓鹽、α-羥基酮化合物、α-胺基酮化合物等。就曝光靈敏度的觀點而言,光聚合起始劑係三鹵甲基三𠯤(trihalo methyl triazine)化合物、苄基二甲基縮酮化合物、α-羥基酮化合物、α-胺基酮化合物、醯基膦化合物、氧化膦化合物、茂金屬化合物、肟化合物、六芳基雙咪唑化合物、鎓化合物、苯并噻唑化合物、二苯甲酮化合物、苯乙酮化合物、環戊二烯-苯-鐵錯合物、鹵甲基㗁二唑化合物及3-芳基取代香豆素化合物為較佳,選自肟化合物、α-羥基酮化合物、α-胺基酮化合物及醯基膦化合物中之化合物為更佳,肟化合物為進一步較佳。又,作為光聚合起始劑,可舉出日本特開2014-130173號公報的0065~0111段中所記載之化合物、日本專利第6301489號公報中所記載之化合物、MATERIAL STAGE 37~60p,vol.19,No.3,2019中所記載之過氧化物系光聚合起始劑、國際公開第2018/221177號中所記載之光聚合起始劑、國際公開第2018/110179號中所記載之光聚合起始劑、日本特開2019-043864號公報中所記載之光聚合起始劑、日本特開2019-044030號公報中所記載之光聚合起始劑、日本特開2019-167313號公報中所記載之過氧化物系起始劑、日本特開2020-055992號公報中所記載之具有㗁唑烷基之胺基苯乙酮系起始劑、日本特開2013-190459號公報中所記載之肟系光聚合起始劑、日本特開2020-172619號公報中所記載之聚合物、國際公開第2020/152120號中所記載之由式1表示之化合物等,該等內容被編入本說明書中。Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (for example, compounds having a trioxane skeleton, compounds having a oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic Peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, and the like. From the viewpoint of exposure sensitivity, photopolymerization initiators are trihalomethyl triazine compounds, benzyl dimethyl ketal compounds, α-hydroxy ketone compounds, α-amino ketone compounds, acyl Phosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, hexaaryl bis-imidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron zirconium Compounds, halomethyl oxadiazole compounds and 3-aryl substituted coumarin compounds are preferred, and the compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and acyl phosphine compounds are More preferably, an oxime compound is further more preferable. Also, examples of photopolymerization initiators include compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in JP-A-6301489, MATERIAL STAGE 37-60p, vol. .19, No.3, 2019, the peroxide-based photopolymerization initiator, the photopolymerization initiator described in International Publication No. 2018/221177, and the photopolymerization initiator described in International Publication No. 2018/110179 Photopolymerization initiator, photopolymerization initiator described in JP 2019-043864 A, photopolymerization initiator described in JP 2019-044030 A, JP 2019-167313 A The peroxide-based initiator described in JP-A-2020-055992, the aminoacetophenone-based initiator with oxazolidinyl group described in JP-A No. 2013-190459 The oxime-based photopolymerization initiators described, the polymers described in Japanese Patent Application Laid-Open No. 2020-172619, the compound represented by formula 1 described in International Publication No. 2020/152120, etc., are incorporated herein. in the manual.
作為六芳基雙咪唑化合物的具體例,可舉出2,2’,4-三(2-氯苯基)-5-(3,4-二甲氧基苯基)-4,5-二苯基-1,1’-雙咪唑等。Specific examples of hexaarylbisimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-bis Phenyl-1,1'-biimidazole, etc.
作為α-羥基酮化合物的市售品,可舉出Omnirad 184、Omnirad 1173、Omnirad 2959、Omnirad 127(以上為IGM Resins B.V.公司製)、Irgacure 184、Irgacure 1173、Irgacure 2959、Irgacure 127(以上為BASF公司製)等。作為α-胺基酮化合物的市售品,Omnirad 907、Omnirad 369、Omnirad 369E、Omnirad 379EG(以上為IGM Resins B.V.公司製)、Irgacure 907、Irgacure 369、Irgacure 369E、Irgacure 379EG(以上為BASF公司製)等。作為醯基膦化合物的市售品,可舉出Omnirad 819、Omnirad TPO(以上為IGM Resins B.V.公司製)、Irgacure 819、Irgacure TPO(以上為BASF公司製)等。Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (the above are manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, Irgacure 127 (the above are manufactured by BASF company), etc. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (the above are manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (the above are manufactured by BASF Corporation) )Wait. Examples of commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (the above are manufactured by IGM Resins B.V.), Irgacure 819, and Irgacure TPO (the above are manufactured by BASF Corporation) and the like.
作為肟化合物,可舉出日本特開2001-233842號公報中所記載之化合物、日本特開2000-080068號公報中所記載之化合物、日本特開2006-342166號公報中所記載之化合物、J.C.S.Perkin II(1979年、pp.1653-1660)中所記載之化合物、J.C.S.Perkin II(1979年、pp.156-162)中所記載之化合物、Journal of Photopolymer Science and Technology(1995年、pp.202-232)中所記載之化合物、日本特開2000-066385號公報中所記載之化合物、日本特表2004-534797號公報中所記載之化合物、日本特開-2006-342166號公報中所記載之化合物、日本特開2017-019766號公報中所記載之化合物、日本專利第6065596號公報中所記載之化合物、國際公開第2015/152153號中所記載之化合物、國際公開第2017/051680號中所記載之化合物、日本特開2017-198865號公報中所記載之化合物、國際公開第2017/164127號的0025~0038段中所記載之化合物、國際公開第2013/167515號中所記載之化合物等。作為肟化合物的具體例,可舉出3-苯甲醯氧基亞胺基丁烷-2-酮、3-乙醯氧基亞胺基丁烷-2-酮、3-丙醯基氧基亞胺基丁烷-2-酮、2-乙醯氧基亞胺基戊烷-3-酮、2-乙醯氧基亞胺基-1-苯基丙烷-1-酮、2-苯甲醯氧基亞胺基-1-苯基丙烷-1-酮、3-(4-甲苯磺醯氧基)亞胺基丁烷-2-酮、2-乙氧基羰基氧基亞胺基-1-苯基丙烷-1-酮、1-[4-(苯硫基)苯基]-3-環己基-丙烷-1,2-二酮-2-(O-乙醯基肟)等。作為市售品,可舉出Irgacure OXE01、Irgacure OXE02、Irgacure OXE03、Irgacure OXE04(以上為BASF公司製)、TR-PBG-304、TR-PBG-327(TRONLY公司製)、ADEKA OPTOMER N-1919(ADEKA Corporation製、日本特開2012-014052號公報中所記載之光聚合起始劑2)。又,作為肟化合物,使用無著色性之化合物或透明性高且不易變色之化合物亦較佳。作為市售品,可舉出ADEKA ARKLS NCI-730、NCI-831、NCI-930(以上為ADEKA CORPORATION製)等。Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J.C.S. Compounds described in Perkin II (1979, pp.1653-1660), compounds described in J.C.S. Perkin II (1979, pp.156-162), Journal of Photopolymer Science and Technology (1995, pp.202) -232), the compound described in JP-A-2000-066385, the compound described in JP-A-2004-534797, the compound described in JP-2006-342166 Compounds, compounds described in Japanese Patent Laid-Open No. 2017-019766, compounds described in Japanese Patent No. 6065596, compounds described in International Publication No. 2015/152153, compounds described in International Publication No. 2017/051680 Compounds described, compounds described in JP-A-2017-198865, compounds described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. Specific examples of oxime compounds include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, 3-propionyloxy Iminobutan-2-one, 2-Acetyloxyiminopentan-3-one, 2-Acetyloxyimino-1-phenylpropan-1-one, 2-Benzene Acyloxyimino-1-phenylpropan-1-one, 3-(4-tosyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino- 1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (the above are manufactured by BASF Corporation), TR-PBG-304, TR-PBG-327 (manufactured by TRONLY Corporation), ADEKA OPTOMER N-1919 ( ADEKA Corporation make, and the photoinitiator 2) described in Unexamined-Japanese-Patent No. 2012-014052. In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and low discoloration. As a commercial item, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (the above are made by ADEKA CORPORATION) etc. are mentioned.
作為光聚合起始劑,亦能夠使用具有茀環之肟化合物。作為具有茀環之肟化合物的具體例,可舉出日本特開2014-137466號公報中所記載之化合物、日本專利第6636081號公報中所記載之化合物、韓國公開專利第10-2016-0109444號公報中所記載之化合物。As a photopolymerization initiator, an oxime compound having an oxene ring can also be used. Specific examples of oxime compounds having a stilbene ring include compounds described in JP-A-2014-137466, compounds described in JP-A-6636081, Korean Laid-Open Patent No. 10-2016-0109444 Compounds listed in the gazette.
作為光聚合起始劑,亦能夠使用具有咔唑環中的至少一個苯環成為萘環之骨架之肟化合物。作為該種肟化合物的具體例,可舉出國際公開第2013/083505號中所記載之化合物。As a photoinitiator, the oxime compound which has a skeleton in which at least one benzene ring in a carbazole ring becomes a naphthalene ring can also be used. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.
作為光聚合起始劑,亦能夠使用具有氟原子之肟化合物。作為具有氟原子之肟化合物的具體例,可舉出日本特開2010-262028號公報中所記載之化合物、日本特表2014-500852號公報中所記載之化合物24、36~40、日本特開2013-164471號公報中所記載之化合物(C-3)等。An oxime compound having a fluorine atom can also be used as a photopolymerization initiator. Specific examples of oxime compounds having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36-40 described in JP-A-2014-500852, JP-A Compound (C-3) described in Publication No. 2013-164471, etc.
作為光聚合起始劑,能夠使用具有硝基之肟化合物。將具有硝基之肟化合物設為二聚體亦較佳。作為具有硝基之肟化合物的具體例,可舉出日本特開2013-114249號公報的0031~0047段、日本特開2014-137466號公報的0008~0012、0070~0079段中所記載之化合物、日本專利4223071號公報的0007~0025段中所記載之化合物、ADEKA ARKLS NCI-831(ADEKA CORPORATION製)。As a photopolymerization initiator, an oxime compound having a nitro group can be used. It is also preferable to form an oxime compound having a nitro group as a dimer. Specific examples of oxime compounds having a nitro group include compounds described in paragraphs 0031 to 0047 of JP-A-2013-114249 and in paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466 , Compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).
作為光聚合起始劑,亦能夠使用具有苯并呋喃骨架之肟化合物。作為具體例,可舉出國際公開第2015/036910號中所記載之OE-01~OE-75。An oxime compound having a benzofuran skeleton can also be used as a photopolymerization initiator. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.
作為光聚合起始劑,亦能夠使用在咔唑骨架鍵結有具有羥基之取代基之肟化合物。作為該等光聚合起始劑,可舉出國際公開第2019/088055號中所記載之化合物等。An oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used as a photopolymerization initiator. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.
作為光聚合起始劑,亦能夠使用具有在芳香族環導入拉電子基團而成之芳香族環基Ar OX1之肟化合物(以下,亦稱為肟化合物OX)。作為上述芳香族環基Ar OX1所具有之拉電子基團,可舉出醯基、硝基、三氟甲基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、氰基,醯基及硝基為較佳,醯基為更佳,苯甲醯基為進一步較佳。苯甲醯基可以具有取代基。作為取代基,鹵素原子、氰基、硝基、羥基、烷基、烷氧基、芳基、芳氧基、雜環基、雜環氧基、烯基、烷基硫烷基、芳基硫烷基、醯基或胺基為較佳,烷基、烷氧基、芳基、芳氧基、雜環氧基、烷基硫烷基、芳基硫烷基或胺基為更佳,烷氧基、烷基硫烷基或胺基為進一步較佳。 As the photopolymerization initiator, an oxime compound (hereinafter also referred to as an oxime compound OX) having an aromatic ring group Ar OX1 in which an electron-withdrawing group is introduced into an aromatic ring can also be used. Examples of the electron-withdrawing group included in the aromatic ring group Ar OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, Arylsulfonyl, cyano, acyl and nitro are preferred, acyl is more preferred, and benzoyl is still more preferred. The benzoyl group may have a substituent. As a substituent, a halogen atom, a cyano group, a nitro group, a hydroxyl group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic epoxy group, an alkenyl group, an alkylsulfanyl group, an arylthio group Alkyl, acyl or amine are preferred, alkyl, alkoxy, aryl, aryloxy, heteroepoxy, alkylsulfanyl, arylsulfanyl or amine are more preferred, alkyl An oxy group, an alkylsulfanyl group or an amino group is further preferred.
肟化合物OX為選自由式(OX1)表示之化合物及由式(OX2)表示之化合物中之至少1種為較佳,由式(OX2)表示之化合物為更佳。 [化學式27] 式中,R X1表示烷基、烯基、烷氧基、芳基、芳氧基、雜環基、雜環氧基、烷基硫烷基、芳基硫烷基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、醯基、醯氧基、胺基、膦醯基、胺甲醯基或胺磺醯基, R X2表示烷基、烯基、烷氧基、芳基、芳氧基、雜環基、雜環氧基、烷基硫烷基、芳基硫烷基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、醯氧基或胺基, R X3~R X14分別獨立地表示氫原子或取代基; 其中,R X10~R X14中的至少一個為拉電子基團。 The oxime compound OX is preferably at least one selected from the compound represented by the formula (OX1) and the compound represented by the formula (OX2), more preferably the compound represented by the formula (OX2). [chemical formula 27] In the formula, R X1 represents an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic epoxy group, an alkylsulfanyl group, an arylsulfanyl group, an alkylsulfinyl group , arylsulfinyl, alkylsulfonyl, arylsulfonyl, acyl, acyloxy, amino, phosphonyl, carbamoyl or sulfamoyl, R X2 represents alkyl, Alkenyl, alkoxy, aryl, aryloxy, heterocyclyl, heterocyclyloxy, alkylsulfanyl, arylsulfanyl, alkylsulfinyl, arylsulfinyl, alkyl A sulfonyl group, an arylsulfonyl group, an acyloxy group or an amino group, and R X3 to R X14 each independently represent a hydrogen atom or a substituent; wherein, at least one of R X10 to R X14 is an electron-withdrawing group.
作為拉電子基團,可舉出醯基、硝基、三氟甲基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、氰基,醯基及硝基為較佳,醯基為更佳,苯甲醯基為進一步較佳。Examples of the electron-withdrawing group include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, a cyano group, and an acyl group. A group and a nitro group are preferred, an acyl group is more preferred, and a benzoyl group is further preferred.
上述式中,R X12為拉電子基團,R X10、R X11、R X13、R X14為氫原子為較佳。 In the above formula, R X12 is an electron-withdrawing group, and R X10 , R X11 , R X13 , and R X14 are preferably hydrogen atoms.
作為肟化合物OX的具體例,可舉出日本專利第4600600號公報的0083~0105段中所記載之化合物。Specific examples of the oxime compound OX include compounds described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600.
以下示出在本發明中較佳地使用之肟化合物的具體例,但本發明並不限定於該等。Specific examples of oxime compounds preferably used in the present invention are shown below, but the present invention is not limited thereto.
[化學式28] [化學式29] [化學式30] [chemical formula 28] [chemical formula 29] [chemical formula 30]
肟化合物係在波長350~500nm的範圍內具有極大吸收波長之化合物為較佳,在波長360~480nm的範圍內具有極大吸收波長之化合物為更佳。又,從靈敏度的觀點考慮,肟化合物在波長365nm或波長405nm下的莫耳吸光係數高為較佳,1000~300000為更佳,2000~300000為進一步較佳,5000~200000為特佳。化合物的莫耳吸光係數能夠使用公知的方法進行測量。例如,藉由分光光度計(Varian公司製的Cary-5分光光度計(spectrophotometer)),使用乙酸乙酯溶劑以0.01g/L的濃度測量為較佳。The oxime compound is preferably a compound having a maximum absorption wavelength within a wavelength range of 350-500 nm, and more preferably a compound having a maximum absorption wavelength within a wavelength range of 360-480 nm. Also, from the viewpoint of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or 405 nm, more preferably 1,000 to 300,000, still more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorptivity of a compound can be measured using a known method. For example, it is preferable to measure at a concentration of 0.01 g/L using an ethyl acetate solvent with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).
作為光聚合起始劑,組合使用Irgacure OXE01(BASF公司製)和/或Irgacure OXE02(BASF公司製)和Omnirad 2959(IGM Resins B.V.公司製)亦較佳。It is also preferable to use Irgacure OXE01 (manufactured by BASF) and/or Irgacure OXE02 (manufactured by BASF) in combination with Omnirad 2959 (manufactured by IGM Resins B.V.) as a photopolymerization initiator.
作為光聚合起始劑,可以使用2官能或3官能以上的光自由基聚合起始劑。藉由使用該等光自由基聚合起始劑,由光自由基聚合起始劑的一分子產生2個以上的自由基,因此可獲得良好的靈敏度。又,在使用非對稱結構的化合物之情況下,結晶性下降而在溶劑等中的溶解性得到提高,隨時間而變得難以析出,從而能夠提高樹脂組成物的經時穩定性。作為2官能或3官能以上的光自由基聚合起始劑的具體例,可舉出日本特表2010-527339號公報、日本特表2011-524436號公報、國際公開第2015/004565號、日本特表2016-532675號公報的0407~0412段、國際公開第2017/033680號的0039~0055段中所記載之肟化合物的二聚體、日本特表2013-522445號公報中所記載之化合物(E)及化合物(G)、國際公開第2016/034963號中所記載之Cmpd1~7、日本特表2017-523465號公報的0007段中所記載之肟酯類光起始劑、日本特開2017-167399號公報的0020~0033段中所記載之光起始劑、日本特開2017-151342號公報的0017~0026段中所記載之光聚合起始劑(A)、日本專利第6469669號公報中所記載之肟酯光起始劑等。As the photopolymerization initiator, a bifunctional or trifunctional or higher photoradical polymerization initiator can be used. By using such radical photopolymerization initiators, two or more radicals are generated from one molecule of the radical photopolymerization initiators, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity is lowered, the solubility in a solvent or the like is improved, and precipitation becomes difficult over time, thereby improving the temporal stability of the resin composition. Specific examples of difunctional or trifunctional or more photoradical polymerization initiators include JP 2010-527339, JP 2011-524436, International Publication No. 2015/004565, JP Dimers of oxime compounds described in paragraphs 0407 to 0412 of Table No. 2016-532675, paragraphs 0039 to 0055 of International Publication No. 2017/033680, compounds described in Japanese Patent Publication No. 2013-522445 (E ) and compound (G), Cmpd 1-7 described in International Publication No. 2016/034963, the oxime ester photoinitiator described in paragraph 0007 of JP 2017-523465, JP 2017- Photoinitiators described in paragraphs 0020 to 0033 of Japanese Patent Application Publication No. 167399, photopolymerization initiators (A) described in paragraphs 0017 to 0026 of Japanese Patent Application Laid-Open No. 2017-151342, and Japanese Patent Publication No. 6469669 The oxime ester photoinitiator etc. described.
樹脂組成物的總固體成分中的光聚合起始劑的含量為0.1~30質量%為較佳。下限為0.5質量%以上為較佳,1質量%以上為更佳。上限為20質量%以下為較佳,15質量%以下為更佳。本發明的樹脂組成物中,光聚合起始劑可以僅使用1種,亦可以使用2種以上。在使用2種以上之情況下,該等的合計在上述範圍內為較佳。It is preferable that content of the photoinitiator in the total solid content of a resin composition is 0.1-30 mass %. The lower limit is preferably at least 0.5% by mass, more preferably at least 1% by mass. The upper limit is preferably at most 20% by mass, more preferably at most 15% by mass. In the resin composition of the present invention, only one type of photopolymerization initiator may be used, or two or more types may be used. When using 2 or more types, it is preferable that the sum total of these is in the said range.
<<溶劑>> 本發明的樹脂組成物含有溶劑為較佳。作為溶劑,可舉出有機溶劑。溶劑的種類只要滿足各成分的溶解性或組成物的塗佈性,則基本上並無特別限制。作為有機溶劑,可舉出酯系溶劑、酮系溶劑、醇系溶劑、醯胺系溶劑、醚系溶劑、烴系溶劑等。關於該等的詳細內容,能夠參閱國際公開第2015/166779號的0223段,且該內容被編入本說明書中。又,亦能夠較佳地使用環狀烷基經取代之酯系溶劑、環狀烷基經取代之酮系溶劑。作為有機溶劑的具體例,可舉出聚乙二醇單甲醚、二氯甲烷、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙基賽路蘇乙酸酯、乳酸乙酯、二乙二醇二甲醚、乙酸丁酯、3-甲氧基丙酸甲酯、2-庚酮、2-戊酮、3-戊酮、4-庚酮、環己酮、2-甲基環己酮、3-甲基環己酮、4-甲基環己酮、環庚酮、環辛酮、乙酸環己基、環戊酮、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯、丙二醇單甲醚、丙二醇單甲醚乙酸酯、3-甲氧基-N,N-二甲基丙醯胺、3-丁氧基-N,N-二甲基丙醯胺、丙二醇二乙酸酯、3-甲氧基丁醇、甲基乙基酮、γ-丁內酯、環丁碸、苯甲醚、1,4-二乙醯氧基丁烷、二乙二醇單乙基醚乙酸鹽、二乙酸丁烷-1,3-二基、二丙二醇甲醚乙酸鹽、二丙酮醇(作為別稱為雙丙酮醇、4-羥基-4-甲基-2-戊酮)、2-甲氧基丙基乙酸酯、2-甲氧基-1-丙醇、異丙醇等。但是,有時出於環境方面等原因,減少作為有機溶劑之芳香族烴類(苯、甲苯、二甲苯、乙苯等)為較佳(例如,相對於有機溶劑總量,能夠設為50質量ppm(百萬分率(parts per million))以下,亦能夠設為10質量ppm以下,亦能夠設為1質量ppm以下)。 <<Solvent>> It is preferable that the resin composition of this invention contains a solvent. An organic solvent is mentioned as a solvent. The type of solvent is basically not particularly limited as long as it satisfies the solubility of each component and the applicability of the composition. Examples of the organic solvent include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. Regarding such details, paragraph 0223 of International Publication No. 2015/166779 can be referred to, and this content is incorporated in this specification. Also, a cyclic alkyl-substituted ester solvent and a cyclic alkyl-substituted ketone solvent can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celuxoacetate , ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone , 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, Butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylacrylamide, 3-butoxy-N,N-di Methacrylamide, Propylene Glycol Diacetate, 3-Methoxybutanol, Methyl Ethyl Ketone, γ-Butyrolactone, Cyclobutane, Anisole, 1,4-Diacetyloxybutanol alkane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl yl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, sometimes for reasons such as the environment, it is better to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) ppm (parts per million) or less, may be 10 mass ppm or less, may also be 1 mass ppm or less).
本發明中,使用金屬含量少的有機溶劑為較佳。有機溶劑的金屬含量例如為10質量ppb(parts per billion,十億分之一)以下為較佳。依據需要,可以使用質量ppt(parts per trillion:兆分率)級別的有機溶劑,該種有機溶劑例如由Toyo Gosei Co.,Ltd提供(化學工業日報,2015年11月13日)。In the present invention, it is preferable to use an organic solvent with a low metal content. The metal content of the organic solvent is preferably, for example, 10 mass ppb (parts per billion, one part per billion) or less. According to needs, organic solvents of ppt (parts per trillion) level can be used, such organic solvents are provided by Toyo Gosei Co., Ltd, for example (Chemical Industry Daily, November 13, 2015).
作為自有機溶劑中去除金屬等雜質之方法,例如能夠舉出蒸餾(分子蒸餾或薄膜蒸餾等)或使用了過濾器之過濾。作為過濾中所使用之過濾器的過濾器孔徑,10μm以下為較佳,5μm以下為更佳,3μm以下為進一步較佳。過濾器的材質係聚四氟乙烯、聚乙烯或尼龍為較佳。Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and still more preferably 3 μm or less. The filter is preferably made of polytetrafluoroethylene, polyethylene or nylon.
有機溶劑可以包含異構體(雖然原子數相同,但是結構不同之化合物)。又,異構體可以僅包含1種,亦可以包含複數種。Organic solvents may contain isomers (compounds with the same number of atoms but different structures). In addition, isomers may contain only 1 type, and may contain plural types.
有機溶劑中的過氧化物的含有率為0.8mmol/L以下為較佳,實質上不含有過氧化物為更佳。The content of the peroxide in the organic solvent is preferably at most 0.8 mmol/L, and it is more preferably not substantially containing the peroxide.
樹脂組成物中的溶劑的含量係10~95質量%為較佳,20~90質量%為更佳,30~90質量%為進一步較佳。The content of the solvent in the resin composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and still more preferably from 30 to 90% by mass.
又,從環境管制的觀點考慮,本發明的樹脂組成物實質上不含有環境管制物質為較佳。再者,本發明中,實質上不含有環境管制物質係指樹脂組成物中之環境管制物質的含量為50質量ppm以下,30質量ppm以下為較佳,10質量ppm以下為進一步較佳,1質量ppm以下為特佳。環境管制物質例如可舉出苯;甲苯、二甲苯等烷基苯類;氯苯等鹵化苯類等。該等在REACH(Registration Evaluation Authorization and Restriction of CHemicals)管制、PRTR(Pollutant Release and Transfer Register)法、VOC(Volatile Organic Compounds)管制等下註冊為環境管制物質,使用量和處理方法受到嚴格管制。該等化合物有時在製造用於樹脂組成物之各成分等時用作溶劑,有時會作為殘留溶劑混入樹脂組成物中。從對人的安全性、對環境的考慮的觀點而言,盡可能地減少該等物質為較佳。作為減少環境管制物質之方法,可舉出將系統內部進行加熱和減壓而設為環境管制物質的沸點以上,並從系統內部中蒸餾去除環境管制物質並將其減少之方法。又,在蒸餾去除少量的環境管制物質之情況下,為了提高效率而與具有與該溶劑相同的沸點之溶劑共沸亦為有用。又,在含有具有自由基聚合性之化合物之情況下,可以在添加聚合抑制劑之後減壓蒸餾去除,以便抑制在減壓蒸餾去除中進行自由基聚合反應導致在分子間進行交聯。該等蒸餾去除方法能夠在原料階段、使原料進行反應之產物(例如聚合後的樹脂溶液和多官能單體溶液)的階段或藉由混合該等化合物而製作之樹脂組成物的階段等中的任一階段中進行。Moreover, it is preferable that the resin composition of this invention does not contain an environmental control substance substantially from a viewpoint of environmental control. Furthermore, in the present invention, substantially not containing environmental control substances means that the content of environmental control substances in the resin composition is 50 mass ppm or less, preferably 30 mass ppm or less, more preferably 10 mass ppm or less, 1 The quality below ppm is especially good. Examples of environmental control substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzenes such as chlorobenzene. These are registered as environmental control substances under REACH (Registration Evaluation Authorization and Restriction of Chemicals) control, PRTR (Pollutant Release and Transfer Register) law, VOC (Volatile Organic Compounds) control, etc., and their usage and disposal methods are strictly regulated. These compounds may be used as solvents in the production of components used in resin compositions, etc., and may be mixed into resin compositions as residual solvents. From the standpoint of human safety and environmental considerations, it is preferable to reduce these substances as much as possible. As a method of reducing the environmentally regulated substances, there may be mentioned a method of heating and decompressing the inside of the system to a temperature equal to or higher than the boiling point of the environmentally regulated substances, and distilling and removing the environmentally regulated substances from the inside of the system to reduce them. In addition, when distilling off a small amount of environmentally controlled substances, it is also useful to azeotrope with a solvent having the same boiling point as the solvent in order to improve efficiency. Also, when a compound having radical polymerizability is contained, it may be removed by distillation under reduced pressure after adding a polymerization inhibitor in order to suppress crosslinking between molecules due to progress of radical polymerization during removal under reduced pressure. These distillation removal methods can be used at the stage of raw materials, at the stage of products made by reacting raw materials (such as polymerized resin solutions and polyfunctional monomer solutions), or at the stage of resin compositions prepared by mixing these compounds, etc. at any stage.
<<熱硬化劑>> 本發明的樹脂組成物能夠作為除了上述之樹脂及聚合性化合物以外的成分含有熱硬化劑。作為熱硬化劑,可舉出具有環狀醚基之化合物。作為環狀醚基,可舉出環氧基、氧雜環丁基等。環氧基可以為脂環式環氧基。再者,脂環式環氧基係指具有環氧環與飽和烴環縮合而成之環狀結構之1價的官能基。具有環狀醚基之化合物為具有環氧基之化合物(以下,亦稱為環氧化合物)為較佳。作為環氧化合物,可舉出1個分子內具有1個以上的環氧基之化合物,具有2個以上的環氧基之化合物為較佳。環氧化合物為在1分子內具有1~100個環氧基之化合物為較佳。環氧化合物中所包含之環氧基的上限例如能夠設為10個以下,亦能夠設為5個以下。環氧化合物中所包含之環氧基的下限為2個以上為較佳。作為環氧化合物,亦能夠使用日本特開2013-011869號公報的0034~0036段、日本特開2014-043556號公報的0147~0156段、日本特開2014-089408號公報的0085~0092段中所記載之化合物、日本特開2017-179172號公報中所記載之化合物。該等內容被編入本說明書中。 <<Thermohardener>> The resin composition of the present invention may contain a thermosetting agent as a component other than the aforementioned resin and polymerizable compound. As a thermosetting agent, the compound which has a cyclic ether group is mentioned. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed. It is preferable that the compound which has a cyclic ether group is a compound which has an epoxy group (it is also called an epoxy compound hereafter). As an epoxy compound, the compound which has 1 or more epoxy groups in 1 molecule is mentioned, The compound which has 2 or more epoxy groups is preferable. The epoxy compound is preferably a compound having 1 to 100 epoxy groups in 1 molecule. The upper limit of the epoxy group contained in an epoxy compound can be 10 or less, for example, and can also be 5 or less. It is preferable that the lower limit of the epoxy group contained in an epoxy compound is 2 or more. As the epoxy compound, it is also possible to use paragraphs 0034-0036 of JP-A-2013-011869, paragraphs 0147-0156 of JP-A-2014-043556, and paragraphs 0085-0092 of JP-A-2014-089408. The compounds described are the compounds described in JP-A-2017-179172. These contents are incorporated into this manual.
具有環狀醚基之化合物可以為低分子化合物(例如,分子量小於2000,進而分子量小於1000),亦可以為高分子化合物(macromolecule)(例如,分子量為1000以上,在聚合物之情況下,重量平均分子量為1000以上)。具有環狀醚基之化合物的重量平均分子量為200~100000為較佳,500~50000為更佳。重量平均分子量的上限為10000以下為進一步較佳,5000以下為特佳,3000以下為進一步較佳。Compounds with cyclic ether groups can be low-molecular compounds (for example, molecular weight less than 2000, and further molecular weight is less than 1000), or macromolecular compounds (macromolecule) (for example, molecular weight is more than 1000, in the case of polymers, weight The average molecular weight is above 1000). The weight average molecular weight of the compound having a cyclic ether group is preferably from 200 to 100,000, more preferably from 500 to 50,000. The upper limit of the weight average molecular weight is more preferably 10,000 or less, particularly preferably 5,000 or less, and still more preferably 3,000 or less.
作為具有環狀醚基之化合物的市售品,例如可舉出EHPE3150(Daicel Corporation製)、EPICLON N-695(DIC CORPORATION製)、Marproof G-0150M、G-0105SA、G-0130SP、G-0250SP、G-1005S、G-1005SA、G-1010S、G-2050M、G-01100、G-01758(以上為NOF CORPORATION製,含有環氧基之聚合物)等。又,作為具有環狀醚基之化合物,亦能夠使用後述之實施例中所記載之化合物。Examples of commercially available compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC CORPORATION), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP . Moreover, the compound described in the Example mentioned later can also be used as a compound which has a cyclic ether group.
樹脂組成物的總固體成分中的熱硬化劑的含量為0.1~20質量%為較佳。下限例如為0.5質量%以上為更佳,1質量%以上為進一步較佳。上限例如為15質量%以下為更佳,10質量%以下為進一步較佳。熱硬化劑可以僅使用1種,亦可以使用2種以上。在使用2種以上之情況下,該等的合計在上述範圍內為較佳。It is preferable that content of the thermosetting agent in the total solid content of a resin composition is 0.1-20 mass %. The lower limit is, for example, more preferably 0.5 mass % or more, and still more preferably 1 mass % or more. The upper limit is, for example, more preferably 15 mass % or less, and further preferably 10 mass % or less. A thermosetting agent may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that the sum total of these is in the said range.
<<聚伸烷基亞胺>> 本發明的樹脂組成物亦能夠含有聚伸烷基亞胺。聚伸烷基亞胺例如用作顏料的分散助劑。分散助劑係指用於提高在樹脂組成物中顏料等的色材的分散性之材料。聚伸烷基亞胺係指開環聚合伸烷基亞胺而成之聚合物。聚伸烷基亞胺為具有分別含有1級胺基、2級胺基及3級胺基之支鏈結構之聚合物為較佳。伸烷基亞胺的碳數為2~6為較佳,2~4為更佳,2或3為進一步較佳,2為特佳。 <<Polyalkyleneimine>> The resin composition of the present invention can also contain polyalkyleneimine. Polyalkyleneimines are used, for example, as dispersing aids for pigments. The dispersing aid refers to a material for improving the dispersibility of color materials such as pigments in the resin composition. Polyalkyleneimine refers to a polymer formed by ring-opening polymerization of alkyleneimine. It is preferable that the polyalkyleneimine is a polymer having a branched chain structure respectively containing a primary amine group, a secondary amine group, and a tertiary amine group. The carbon number of the alkyleneimine is preferably 2-6, more preferably 2-4, further preferably 2 or 3, and particularly preferably 2.
聚伸烷基亞胺的分子量為200以上為較佳,250以上為更佳。上限為100000以下為較佳,50000以下為更佳,10000以下為進一步較佳,2000以下為特佳。再者,關於聚伸烷基亞胺的分子量的值,在能夠從結構式計算分子量之情況下,聚伸烷基亞胺的分子量為由結構式計算之值。另一方面,在特定胺化合物的分子量無法由結構式計算或者難以計算之情況下,使用藉由沸點上升法測量之數量平均分子量的值。又,在無法藉由沸點上升法測量或者難以測量之情況下,使用藉由黏度法測量之數量平均分子量的值。又,在無法藉由黏度法測量或者難以藉由黏度法測量之情況下,使用藉由GPC(凝膠滲透層析法)法測量之以聚苯乙烯換算值計的數量平均分子量的值。The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, still more preferably 10,000 or less, and particularly preferably 2,000 or less. In addition, about the value of the molecular weight of a polyalkylene imine, when molecular weight can be calculated from a structural formula, the molecular weight of a polyalkylene imine is the value calculated from a structural formula. On the other hand, in the case where the molecular weight of the specific amine compound cannot be calculated from the structural formula or is difficult to calculate, the value of the number average molecular weight measured by the boiling point increase method is used. Also, when it is impossible or difficult to measure by the boiling point elevation method, the value of the number average molecular weight measured by the viscosity method is used. Moreover, when it cannot measure by a viscosity method or it is difficult to measure by a viscosity method, the value of the number average molecular weight in terms of polystyrene conversion value measured by the GPC (gel permeation chromatography) method is used.
聚伸烷基亞胺的胺值為5mmol/g以上為較佳,10mmol/g以上為更佳,15mmol/g以上為進一步較佳。The amine value of the polyalkyleneimine is preferably at least 5 mmol/g, more preferably at least 10 mmol/g, and still more preferably at least 15 mmol/g.
作為伸烷基亞胺的具體例,可舉出乙烯亞胺、丙烯亞胺、1,2-丁烯亞胺、2,3-丁烯亞胺等,乙烯亞胺或丙烯亞胺為較佳,乙烯亞胺為更佳。聚伸烷基亞胺為聚乙烯亞胺為特佳。又,相對於一級胺基、二級胺基與三級胺基的合計,聚乙烯亞胺含有10莫耳%以上的一級胺基為較佳,含有20莫耳%以上為更佳,含有30莫耳%以上為進一步較佳。作為聚乙烯亞胺的市售品,可舉出Epomin SP-003、SP-006、SP-012、SP-018、SP-200、P-1000(以上為NIPPON SHOKUBAI CO.,LTD.製)等。Specific examples of alkyleneimine include ethyleneimine, propyleneimine, 1,2-buteneimine, 2,3-buteneimine, etc., and ethyleneimine or propyleneimine is preferable. , ethyleneimine is more preferred. The polyalkyleneimine is particularly preferably polyethyleneimine. Furthermore, relative to the total of the primary amine groups, secondary amine groups, and tertiary amine groups, polyethyleneimine preferably contains 10 mol% or more of primary amine groups, more preferably 20 mol% or more, and contains 30 mol% or more. Mole % or more is further preferred. Examples of commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (manufactured by NIPPON SHOKUBAI CO., LTD.). .
樹脂組成物的總固體成分中的聚伸烷基亞胺的含量為0.1~5質量%為較佳。下限為0.2質量%以上為較佳,0.5質量%以上為更佳,1質量%以上為進一步較佳。上限為4.5質量%以下為較佳,4質量%以下為更佳,3質量%以下為進一步較佳。又,聚伸烷基亞胺的含量相對於顏料100質量份為0.5~20質量份為較佳。下限為0.6質量份以上為較佳,1質量份以上為更佳,2質量份以上為進一步較佳。上限為10質量份以下為較佳,8質量份以下為更佳。聚伸烷基亞胺可以僅使用1種,亦可以使用2種以上。在使用2種以上之情況下,該等合計量在上述範圍內為較佳。The content of the polyalkyleneimine in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The lower limit is preferably at least 0.2% by mass, more preferably at least 0.5% by mass, and still more preferably at least 1% by mass. The upper limit is preferably at most 4.5% by mass, more preferably at most 4% by mass, and still more preferably at most 3% by mass. Moreover, it is preferable that content of polyalkyleneimine is 0.5-20 mass parts with respect to 100 mass parts of pigments. The lower limit is preferably at least 0.6 parts by mass, more preferably at least 1 part by mass, and still more preferably at least 2 parts by mass. The upper limit is preferably at most 10 parts by mass, more preferably at most 8 parts by mass. The polyalkyleneimine may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.
<<硬化促進劑>> 本發明的樹脂組成物可以包含硬化促進劑。作為硬化促進劑,可舉出硫醇化合物、羥甲基化合物、胺化合物、鏻鹽化合物、脒氯化合物、醯胺化合物、鹼產生劑、異氰酸酯化合物、烷氧基矽烷化合物、鎓鹽化合物等。作為硬化促進劑的具體例,可舉出國際公開第2018/056189號的0094~0097段中所記載之化合物、日本特開2015-034963號公報的0246~0253段中所記載之化合物、日本特開2013-041165號公報的0186~0251段中所記載之化合物、日本特開2014-055114號公報中所記載之離子性化合物、日本特開2012-150180號公報的0071~0080段中所記載之化合物、日本特開2011-253054號公報中所記載之具有環氧基之烷氧基矽烷化合物、日本專利第5765059號公報的0085~0092段中所記載之化合物、日本特開2017-036379號公報中所記載之含羧基之環氧硬化劑等。樹脂組成物的總固體成分中的硬化促進劑的含量為0.3~8.9質量%為較佳,0.8~6.4質量%為更佳。 <<Hardening Accelerator>> The resin composition of the present invention may contain a curing accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine chloride compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, onium salt compounds, and the like. Specific examples of the hardening accelerator include compounds described in paragraphs 0094 to 0097 of International Publication No. 2018/056189, compounds described in paragraphs 0246 to 0253 of Japanese Patent Application Laid-Open No. 2015-034963, Japanese Patent Application Laid-Open No. Compounds described in paragraphs 0186 to 0251 of JP-A-2013-041165, ionic compounds described in JP-A-2014-055114, and paragraphs 0071-0080 of JP-A-2012-150180 Compound, an alkoxysilane compound having an epoxy group described in JP-A-2011-253054, a compound described in paragraphs 0085-0092 of JP-A No. 5765059, JP-A-2017-036379 Carboxyl-containing epoxy hardeners as described in The content of the hardening accelerator in the total solid content of the resin composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass.
<<紫外線吸收劑>> 本發明的樹脂組成物能夠包含紫外線吸收劑。作為紫外線吸收劑能夠使用共軛二烯化合物、胺基二烯化合物、水楊酸酯化合物、二苯甲酮化合物、苯并三唑化合物、丙烯腈化合物、羥苯基三𠯤化合物、吲哚化合物、三𠯤化合物等。作為該等化合物的具體例,可舉出日本特開2009-217221號公報的0038~0052段、日本特開2012-208374號公報的0052~0072段、日本特開2013-068814號公報的0317~0334段、日本特開2016-162946號公報的0061~0080段中所記載之化合物,該等內容被編入本說明書中。作為紫外線吸收劑的具體例,可舉出下述結構的化合物等。作為紫外線吸收劑的市售品,例如可舉出UV-503(DAITO CHEMICAL CO.,LTD.製)、BASF公司製的Tinuvin系列、Uvinul系列、Sumika Chemtex Company, Limited製的Sumisorb系列等。又,作為苯并三唑化合物,可舉出MIYOSHI OIL & FAT CO.,LTD.製的MYUA系列(化學工業日報、2016年2月1日)。又,紫外線吸收劑亦能夠使用日本專利第6268967號公報的0049~0059段中所記載之化合物、國際公開第2016/181987號的0059~0076段中所記載之化合物、國際公開第2020/137819號中所記載之硫代芳基取代苯并三唑型紫外線吸收劑。 [化學式31] <<ultraviolet absorber>> The resin composition of the present invention can contain an ultraviolet absorber. Conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyl triazole compounds, and indole compounds can be used as ultraviolet absorbers , Three 𠯤 compounds, etc. Specific examples of such compounds include paragraphs 0038 to 0052 of JP-A-2009-217221, paragraphs 0052-0072 of JP-A-2012-208374, and paragraphs 0317-0072 of JP-A-2013-068814. The compounds described in Paragraph 0334 and Paragraphs 0061 to 0080 of JP-A-2016-162946 are incorporated in this specification. As a specific example of an ultraviolet absorber, the compound etc. of the following structures are mentioned. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by DAITO CHEMICAL CO., LTD.), Tinuvin series and Uvinul series produced by BASF Corporation, Sumika Chemtex Company, Limited Sumisorb series, and the like. Moreover, as a benzotriazole compound, MYUA series by MIYOSHI OIL & FAT CO., LTD. is mentioned (Chemical Industry Daily, February 1, 2016). In addition, as the ultraviolet absorber, compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059 to 0076 of International Publication No. 2016/181987, and compounds described in International Publication No. 2020/137819 can also be used. Thioaryl substituted benzotriazole UV absorbers described in [chemical formula 31]
在樹脂組成物的總固體成分中,紫外線吸收劑的含量為0.01~10質量%為較佳,0.01~5質量%為更佳。本發明中,紫外線吸收劑可以僅使用1種,亦可以使用2種以上。在使用2種以上之情況下,總量成為上述範圍為較佳。In the total solid content of the resin composition, the content of the ultraviolet absorber is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. In the present invention, only one type of ultraviolet absorber may be used, or two or more types may be used. When using 2 or more types, it is preferable that the total amount becomes the said range.
<<聚合抑制劑>> 本發明的樹脂組成物能夠含有聚合抑制劑。作為聚合抑制劑,可舉出對苯二酚、對甲氧基苯酚、二-三級丁基-對甲酚、鄰苯三酚、三級丁基兒茶酚、苯醌、4,4’-硫代雙(3-甲基-6-三級丁基苯酚)、2,2’-亞甲基雙(4-甲基-6-三級丁基苯酚)、N-亞硝基苯基羥胺鹽(銨鹽、初級鈰鹽等)。其中,對甲氧基苯酚為較佳。在樹脂組成物的總固體成分中,聚合抑制劑的含量為0.0001~5質量%為較佳。聚合抑制劑可以僅為1種,亦可以為2種以上。在2種以上之情況下,總量在上述範圍內為較佳。 <<Polymerization inhibitor>> The resin composition of the present invention can contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, pyrogallol, tertiary butylcatechol, benzoquinone, 4,4' -Thiobis(3-methyl-6-tertiary butylphenol), 2,2'-methylenebis(4-methyl-6-tertiary butylphenol), N-nitrosophenyl Hydroxylamine salts (ammonium salts, primary cerium salts, etc.). Among them, p-methoxyphenol is preferred. The content of the polymerization inhibitor is preferably 0.0001 to 5% by mass in the total solid content of the resin composition. A polymerization inhibitor may be only 1 type, and may be 2 or more types. In the case of two or more, the total amount is preferably within the above range.
<<矽烷偶合劑>> 本發明的樹脂組成物能夠含有矽烷偶合劑。本發明中,矽烷偶合劑係指具有水解性基團和除其以外的官能基之矽烷化合物。又,水解性基團係指與矽原子直接鍵結,並藉由水解反應及縮合反應中的至少一種而可產生矽氧烷鍵之取代基。作為水解性基團,例如可舉出鹵素原子、烷氧基、醯氧基等,烷氧基為較佳。亦即,矽烷偶合劑係具有烷氧基矽基之化合物為較佳。又,作為除了水解性基團以外的官能基,例如,可舉出乙烯基、(甲基)烯丙基、(甲基)丙烯醯基、巰基、環氧基、氧雜環丁基、胺基、脲基、硫醚基、異氰酸酯基、苯基等,胺基、(甲基)丙烯醯基及環氧基為較佳。作為矽烷偶合劑的具體例,有N-β-胺基乙基-γ-胺基丙基甲基二甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製、產品名 KBM-602)、N-β-胺基乙基-γ-胺基丙基三甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製、產品名 KBM-603)、N-β-胺基乙基-γ-胺基丙基三乙氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製、產品名 KBE-602)、γ-胺基丙基三甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製、產品名 KBM-903)、γ-胺基丙基三乙氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製、產品名 KBE-903)、3-甲基丙烯醯氧丙基甲基二甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製、產品名 KBM-502)、3-甲基丙烯醯氧丙基三甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製、產品名 KBM-503)等。又,關於矽烷偶合劑的具體例,可舉出日本特開2009-288703號公報的0018~0036段中所記載之化合物、日本特開2009-242604號公報的0056~0066段中所記載之化合物,且該等內容被編入本說明書中。樹脂組成物的總固體成分中的矽烷偶合劑的含量為0.01~15.0質量%為較佳,0.05~10.0質量%為更佳。矽烷偶合劑可以僅為1種,亦可以為2種以上。在2種以上之情況下,總量在上述範圍內為較佳。 <<Silane coupling agent>> The resin composition of the present invention can contain a silane coupling agent. In the present invention, the silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. Also, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As a hydrolyzable group, a halogen atom, an alkoxy group, an acyloxy group etc. are mentioned, for example, An alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)allyl groups, (meth)acryl groups, mercapto groups, epoxy groups, oxetanyl groups, amine groups, etc. group, urea group, thioether group, isocyanate group, phenyl group, etc., amino group, (meth)acryl group and epoxy group are preferred. Specific examples of the silane coupling agent include N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-602), N-β-aminoethyl-γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-603), N-β-aminoethyl-γ-amine propyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-602), γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-903), γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-903), 3-methacryloxypropylmethyldimethoxy 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502), 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502) 503) etc. Further, specific examples of the silane coupling agent include compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraphs 0056-0066 of JP-A-2009-242604 , and these contents are incorporated into this specification. The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.01 to 15.0% by mass, more preferably 0.05 to 10.0% by mass. Only 1 type may be sufficient as a silane coupling agent, and 2 or more types may be sufficient as it. In the case of two or more, the total amount is preferably within the above range.
<<界面活性劑>> 本發明的樹脂組成物能夠含有界面活性劑。作為界面活性劑,能夠使用氟系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、陰離子系界面活性劑、聚矽氧系界面活性劑等各種界面活性劑。界面活性劑為矽酮系界面活性劑或氟系界面活性劑為較佳。關於界面活性劑,能夠參閱國際公開第2015/166779號的0238~0245段中所記載之界面活性劑,該內容被編入本說明書中。 <<Surfactant>> The resin composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and polysiloxane-based surfactants can be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant. Regarding the surfactant, the surfactant described in paragraphs 0238 to 0245 of International Publication No. 2015/166779 can be referred to, and the content is incorporated in this specification.
氟系界面活性劑中的含氟率為3~40質量%為較佳,更佳為5~30質量%,特佳為7~25質量%。在塗佈膜的厚度的均勻性或省液性的方面而言,氟含有率在該範圍內的氟系界面活性劑係有效的,在樹脂組成物中之溶解性亦良好。The fluorine content in the fluorine-based surfactant is preferably from 3 to 40% by mass, more preferably from 5 to 30% by mass, and particularly preferably from 7 to 25% by mass. A fluorine-based surfactant having a fluorine content within this range is effective in terms of the uniformity of the thickness of the coating film and the liquid-saving property, and its solubility in the resin composition is also good.
作為氟系界面活性劑,可舉出日本特開2014-041318號公報的0060~0064(對應之國際公開第2014/017669號的0060~0064段)段等中所記載之界面活性劑、日本特開2011-132503號公報的0117~0132段中所記載之界面活性劑、日本特開2020-008634號公報中所記載之界面活性劑,該等內容被編入本說明書中。作為氟系界面活性劑的市售品,例如可舉出MEGAFACE F-171、F-172、F-173、F-176、F-177、F-141、F-142、F-143、F-144、F-437、F-475、F-477、F-479、F-482、F-554、F-555-A、F-556、F-557、F-558、F-559、F-560、F-561、F-565、F-563、F-568、F-575、F-780、EXP、MFS-330、R-01、R-40、R-40-LM、R-41、R-41-LM、RS-43、R-43、TF-1956、RS-90、R-94、RS-72-K、DS-21(以上為DIC CORPORATION製)、FLUORAD FC430、FC431、FC171(以上為Sumitomo 3M Limited製)、SURFLON S-382、SC-101、SC-103、SC-104、SC-105、SC-1068、SC-381、SC-383、S-393、KH-40(以上為AGC INC.製)、PolyFox PF636、PF656、PF6320、PF6520、PF7002(以上為OMNOVA SOLUTIONS INC.製)、Futurgent 208G、215M、245F、601AD、601ADH2、602A、610FM、710FL、710FM、710FS、FTX-218(以上為NEOS製)等。Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP-A-2014-041318 (corresponding to paragraphs 0060-0064 of International Publication No. 2014/017669), etc. The surfactants described in paragraphs 0117 to 0132 of KOKAI Publication No. 2011-132503 and the surfactants described in JP-A-2020-008634 are incorporated in this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F- 144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F- 560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (manufactured by DIC CORPORATION), FLUORAD FC430, FC431, FC171 ( The above are manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (above manufactured by AGC INC.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (the above are manufactured by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FTX- 218 (the above are made by NEOS), etc.
氟系界面活性劑亦能夠較佳地使用丙烯酸系化合物,該丙烯酸系化合物具備具有含有氟原子之官能基之分子結構,且施加熱時含有氟原子之官能基部分被切斷而氟原子揮發。作為該種氟系界面活性劑,可舉出DIC Corporation製的MEGAFACE DS系列(化學工業日報(2016年2月22日)、日經產業新聞(2016年2月23日)),例如可舉出MEGAFACE DS-21。As the fluorine-based surfactant, an acrylic compound having a molecular structure having a functional group containing a fluorine atom is preferably used, and when heat is applied, the functional group containing a fluorine atom is partially cut off and the fluorine atom is volatilized. Examples of such fluorine-based surfactants include MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, MEGAFACE DS-21.
關於氟系界面活性劑,使用具有氟化烷基或氟化伸烷基醚基之含氟原子的乙烯基醚化合物與親水性乙烯基醚化合物的聚合物亦較佳。該等氟系界面活性劑可舉出日本特開2016-216602號公報中所記載之氟系界面活性劑,該內容被編入本說明書中。As for the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. Examples of such fluorine-based surfactants include fluorine-based surfactants described in JP-A-2016-216602, and the content is incorporated in this specification.
氟系界面活性劑亦能夠使用嵌段聚合物。氟系界面活性劑亦能夠較佳地使用含氟高分子化合物,該含氟高分子化合物包含:源自具有氟原子之(甲基)丙烯酸酯化合物之重複單元;及源自具有2個以上(較佳為5個以上)的伸烷氧基(較佳為伸乙氧基、伸丙氧基)之(甲基)丙烯酸酯化合物之重複單元。又,日本特開2010-032698號公報的0016~0037段中所記載之含氟界面活性劑、下述化合物亦例示為本發明中所使用之氟系界面活性劑。 [化學式32] 上述化合物的重量平均分子量較佳為3000~50000,例如為14000。上述化合物中,表示重複單元的比率之%為莫耳%。 A block polymer can also be used as a fluorine-type surfactant. The fluorine-based surfactant can also preferably use a fluorine-containing polymer compound, which contains: a repeating unit derived from a (meth)acrylate compound having a fluorine atom; Repeating unit of (meth)acrylate compound of preferably 5 or more) alkyleneoxy groups (preferably ethoxyl groups, propoxyl groups). In addition, the fluorine-containing surfactant described in paragraphs 0016 to 0037 of JP-A-2010-032698 and the following compounds are also exemplified as the fluorine-based surfactant used in the present invention. [chemical formula 32] The weight average molecular weight of the above compound is preferably 3000-50000, for example 14000. In the above-mentioned compounds, % representing the ratio of repeating units is mole %.
又,氟系界面活性劑亦能夠使用在側鏈上具有含乙烯性不飽和鍵之基團之含氟聚合物。作為具體例,可舉出日本特開2010-164965號公報的0050~0090段及0289~0295段中所記載之化合物、DIC Corporation製的MEGAFACE RS-101、RS-102、RS-718K、RS-72-K等。又,氟系界面活性劑亦能夠使用日本特開2015-117327號公報的0015~0158段中所記載之化合物。In addition, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group on a side chain can also be used. Specific examples include the compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102, RS-718K, RS- 72-K et al. Moreover, the compound described in paragraph 0015-0158 of Unexamined-Japanese-Patent No. 2015-117327 can also be used as a fluorine-type surfactant.
又,從環境管制的觀點考慮,將國際公開第2020/084854號中所記載之界面活性劑用作具有碳數6以上的全氟烷基之界面活性劑的代替亦較佳。Also, from the viewpoint of environmental control, it is also preferable to use the surfactant described in International Publication No. 2020/084854 as a substitute for the surfactant having a perfluoroalkyl group having 6 or more carbon atoms.
又,將由式(fi-1)表示之含氟醯亞胺氯化合物用作界面活性劑亦較佳。 [化學式33] 式(fi-1)中,m表示1或2,n表示1~4的整數,a表示1或2,X a+表示a價的金屬離子、一級銨離子、二級銨離子、三級銨離子、四級銨離子或NH 4 +。 Furthermore, it is also preferable to use a fluoroimide chlorine-containing compound represented by the formula (fi-1) as a surfactant. [chemical formula 33] In the formula (fi-1), m represents 1 or 2, n represents an integer from 1 to 4, a represents 1 or 2, X a+ represents a-valent metal ions, primary ammonium ions, secondary ammonium ions, and tertiary ammonium ions , quaternary ammonium ion or NH 4 + .
作為非離子系界面活性劑,可舉出丙三醇(glycerol)、三羥甲基丙烷、三羥甲基乙烷及該等的乙氧基化物及丙氧基化物(例如,丙三醇丙氧基化物、丙三醇乙氧基化物等)、聚氧乙烯月桂基醚、聚氧乙烯硬脂基醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、脫水山梨糖醇脂肪酸酯、Pluronic L10、L31、L61、L62、10R5、17R2、25R2(BASF公司製)、Tetronic 304、701、704、901、904、150R1(BASF公司製)、Solsperse 20000(Japan Lubrizol Corporation製)、NCW-101、NCW-1001、NCW-1002(FUJIFILM Wako Pure Chemical Corporation製)、PIONIN D-6112、D-6112-W、D-6315(Takemoto Oil & Fat Co.,Ltd.製)、OLFIN E1010、Surfynol 104、400、440(Nissin Chemical Co.,Ltd.製)等。Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propane Oxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonyl ether Phenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF Corporation) , Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF Corporation), Solsperse 20000 (manufactured by Japan Lubrizol Corporation), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D -6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.
作為矽酮系界面活性劑,可舉出DOWSIL SH8400、SH 8400 FLUID、FZ-2122、67 Additive、74 Additive、M Additive、SF 8419 OIL(以上為Dow Toray Co.,Ltd.製)、TSF-4300、TSF-4445、TSF-4460、TSF-4452(以上為Momentive Performance Materials Inc.製)、KP-341、KF-6000、KF-6001、KF-6002、KF-6003(以上為Shin-Etsu Chemical Co.,Ltd.製)、BYK-307、BYK-322、BYK-323、BYK-330、BYK-333、BYK-3760、BYK-UV3510(以上為BYK Chemie公司製)等。Examples of silicone-based surfactants include DOWSIL SH8400, SH 8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (manufactured by Dow Toray Co., Ltd.), TSF-4300 , TSF-4445, TSF-4460, TSF-4452 (the above are manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (the above are made by Shin-Etsu Chemical Co. ., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (the above are manufactured by BYK Chemie), etc.
又,矽酮系界面活性劑中,亦能夠使用下述結構的化合物。 [化學式34] Moreover, the compound of the following structure can also be used among silicone type surfactants. [chemical formula 34]
在樹脂組成物的總固體成分中,界面活性劑的含量為0.001質量%~5.0質量%為較佳,0.005~3.0質量%為更佳。界面活性劑可以僅為1種,亦可以為2種以上。在2種以上之情況下,總量在上述範圍內為較佳。In the total solid content of the resin composition, the content of the surfactant is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% to 3.0% by mass. Surfactant may be only 1 type, and may be 2 or more types. In the case of two or more, the total amount is preferably within the above range.
<<抗氧化劑>> 本發明的樹脂組成物能夠含有抗氧化劑。作為抗氧化劑,可舉出酚化合物、亞磷酸酯化合物、硫醚化合物等。作為酚化合物,能夠使用被稱作酚系抗氧化劑之任意的酚化合物。作為較佳的酚化合物,可舉出受阻酚化合物。在與酚性羥基相鄰之部位(鄰位)具有取代基之化合物為較佳。作為前述取代基,碳數1~22的經取代或未經取代的烷基為較佳。又,抗氧化劑係在同一分子內具有酚基和亞磷酸酯基之化合物亦較佳。又,抗氧化劑亦能夠較佳地使用磷系抗氧化劑。作為磷系抗氧化劑,可舉出三[2-[[2,4,8,10-四(1,1-二甲基乙基)二苯并[d,f][1,3,2]二氧雜膦雜環庚二烯-6-基]氧基]乙基]胺、三[2-[(4,6,9,11-四-三級丁基二苯并[d,f][1,3,2]二氧雜膦雜環庚二烯-2-基)氧基]乙基]胺、雙(2,4-二-三級丁基-6-甲基苯基)亞磷酸乙酯等。作為抗氧化劑的市售品,例如可舉出ADK STAB AO-20、ADK STAB AO-30、ADK STAB AO-40、ADK STAB AO-50、ADK STAB AO-50F、ADK STAB AO-60、ADK STAB AO-60G、ADK STAB AO-80、ADK STAB AO-330(以上為ADEKA Corporation製)等。又,抗氧化劑亦能夠使用專利第6268967號公報的0023~0048段中所記載之化合物、國際公開第2017/006600號中所記載之化合物、國際公開第2017/164024號中所記載之化合物、韓國公開專利第10-2019-0059371號公報中所記載之化合物。樹脂組成物的總固體成分中的抗氧化劑的含量為0.01~20質量%為較佳,0.3~15質量%為更佳。抗氧化劑可以僅使用1種,亦可以使用2種以上。在使用2種以上之情況下,總量成為上述範圍為較佳。 <<Antioxidant>> The resin composition of the present invention can contain an antioxidant. As an antioxidant, a phenolic compound, a phosphite compound, a thioether compound, etc. are mentioned. As the phenolic compound, any phenolic compound called a phenolic antioxidant can be used. A hindered phenol compound is mentioned as a preferable phenol compound. A compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. Furthermore, it is also preferable that the antioxidant is a compound having a phenolic group and a phosphite group in the same molecule. Moreover, phosphorus antioxidant can also be used preferably as an antioxidant. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2] Dioxaphosphine-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tertiary butyldibenzo[d,f] [1,3,2]dioxaphosphine-2-yl)oxy]ethyl]amine, bis(2,4-di-tertiary butyl-6-methylphenyl) Ethyl phosphate etc. Examples of commercially available antioxidants include ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (the above are manufactured by ADEKA Corporation), etc. In addition, as an antioxidant, compounds described in paragraphs 0023 to 0048 of Patent No. 6268967, compounds described in International Publication No. 2017/006600, compounds described in International Publication No. 2017/164024, Korean A compound described in Publication Patent No. 10-2019-0059371. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Antioxidant may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that the total amount becomes the said range.
<<其他成分>> 本發明的樹脂組成物依據需要可以含有增感劑、硬化促進劑、填料、熱硬化促進劑、塑化劑及其他助劑類(例如導電性粒子、消泡劑、阻燃劑、調平劑、剝離促進劑、香料、表面張力調節劑、鏈轉移劑等)。能夠藉由適當地含有該等成分來調節膜物理性質等性質。關於該等成分,例如,能夠參閱日本特開2012-003225號公報的0183段以後(所對應之美國專利申請公開第2013/0034812號說明書的0237段)的記載、日本特開2008-250074號公報的0101~0104、0107~0109段等的記載,且該等內容被編入本說明書中。又,本發明的樹脂組成物依據需要可以含有潛在的抗氧化劑。作為潛在抗氧化劑,可舉出作為抗氧化劑發揮作用之部位被保護基保護之化合物,且保護基藉由在100~250℃下進行加熱或在酸/鹼觸媒存在下在80~200℃下進行加熱而脫離並作為抗氧化劑發揮作用之化合物。作為潛在抗氧化劑,可舉出國際公開第2014/021023號、國際公開第2017/030005號、日本特開2017-008219號公報中所記載之化合物。作為潛在抗氧化劑的市售品,可舉出ADEKA ARKLS GPA-5001(ADEKA CORPORATION製)等。 <<Other ingredients>> The resin composition of the present invention may contain sensitizers, hardening accelerators, fillers, thermosetting accelerators, plasticizers and other additives (such as conductive particles, defoamers, flame retardants, leveling agents, etc.) , peeling accelerators, fragrances, surface tension regulators, chain transfer agents, etc.). Properties such as film physical properties can be adjusted by appropriately containing these components. Regarding these components, for example, the descriptions in JP-A-2012-003225 and after paragraph 0183 (paragraph 0237 of the corresponding U.S. Patent Application Publication No. 2013/0034812 specification), JP-A-2008-250074 0101-0104, 0107-0109, etc., and these contents are incorporated into this specification. Moreover, the resin composition of this invention may contain a latent antioxidant as needed. As potential antioxidants, there can be mentioned compounds in which the part that acts as an antioxidant is protected by a protecting group, and the protecting group is heated at 100 to 250°C or heated at 80 to 200°C in the presence of an acid/alkali catalyst. A compound that decomposes upon heating and acts as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219. As a commercial item of a latent antioxidant, ADEKA ARKLS GPA-5001 (made by ADEKA CORPORATION) etc. are mentioned.
為了調節所獲得的膜的折射率,本發明的樹脂組成物可以含有金屬氧化物。作為金屬氧化物,可舉出TiO 2、ZrO 2、Al 2O 3、SiO 2等。金屬氧化物的一次粒徑係1~100nm為較佳,3~70nm為更佳,5~50nm為進一步較佳。金屬氧化物可以具有核殼結構。又,在該情況下,核部可以為中空狀。 The resin composition of the present invention may contain a metal oxide in order to adjust the refractive index of the obtained film. Examples of metal oxides include TiO 2 , ZrO 2 , Al 2 O 3 , SiO 2 and the like. The primary particle size of the metal oxide is preferably from 1 to 100 nm, more preferably from 3 to 70 nm, and still more preferably from 5 to 50 nm. Metal oxides may have a core-shell structure. Also, in this case, the core portion may be hollow.
本發明的樹脂組成物可以包含耐光性改良劑。作為耐光性改善劑,可舉出日本特開2017-198787號公報的0036~0037段中所記載之化合物、日本特開2017-146350號公報的0029~0034段中所記載之化合物、日本特開2017-129774號公報的0036~0037、0049~0052段中所記載之化合物、日本特開2017-129674號公報的0031~0034、0058~0059段中所記載之化合物、日本特開2017-122803號公報的0036~0037、0051~0054段中所記載之化合物、國際公開第2017/164127號的0025~0039段中所記載之化合物、日本特開2017-186546號公報的0034~0047段中所記載之化合物、日本特開2015-025116號公報的0019~0041段中所記載之化合物、日本特開2012-145604號公報的0101~0125段中所記載之化合物、日本特開2012-103475號公報的0018~0021段中所記載之化合物、日本特開2011-257591號公報的0015~0018段中所記載之化合物、日本特開2011-191483號公報的0017~0021段中所記載之化合物、日本特開2011-145668號公報的0108~0116段中所記載之化合物、日本特開2011-253174號公報的0103~0153段中所記載之化合物等。The resin composition of the present invention may contain a light resistance improver. Examples of light resistance improving agents include compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, compounds described in paragraphs 0029-0034 of JP-A-2017-146350, compounds described in JP-A-2017-146350, JP-A Compounds described in paragraphs 0036-0037, 0049-0052 of No. 2017-129774, compounds described in paragraphs 0031-0034, 0058-0059 of JP-A No. 2017-129674, JP-A No. 2017-122803 Compounds described in paragraphs 0036 to 0037 and 0051 to 0054 of the publication, compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, and paragraphs 0034 to 0047 of Japanese Patent Application Laid-Open No. 2017-186546 The compounds described in paragraphs 0019 to 0041 of JP-A-2015-025116, the compounds described in paragraphs 0101-0125 of JP-A-2012-145604, and the compounds described in JP-A-2012-103475 Compounds described in paragraphs 0018 to 0021, compounds described in paragraphs 0015 to 0018 of JP-A-2011-257591, compounds described in paragraphs 0017-0021 of JP-A-2011-191483, JP-A-2011-257591 Compounds described in paragraphs 0108 to 0116 of Unexamined Publication No. 2011-145668, compounds described in paragraphs 0103 to 0153 of Japanese Patent Application Laid-Open No. 2011-253174, and the like.
本發明的樹脂組成物實質上不含有對苯二甲酸酯亦較佳。其中,“實質上不含有”係指在樹脂組成物的總量中對苯二甲酸酯的含量為1000質量ppb以下,100質量ppb以下為更佳,零為特佳。It is also preferable that the resin composition of the present invention does not substantially contain terephthalate. Here, "substantially not containing" means that the content of terephthalate in the total amount of the resin composition is 1000 mass ppb or less, more preferably 100 mass ppb or less, and particularly preferably zero.
從環境管制的觀點考慮,有時全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽的使用會受到管制。本發明的樹脂組成物中,在降低上述之化合物的含有率之情況下,全氟烷基磺酸(尤其,全氟烷基的碳數為6~8的全氟烷基磺酸)及其鹽以及全氟烷基羧酸(尤其,全氟烷基的碳數為6~8的全氟烷基羧酸)及其鹽的含有率相對於樹脂組成物的總固體成分為0.01ppb~1,000ppb的範圍為較佳,0.05ppb~500ppb的範圍為更佳,0.1ppb~300ppb的範圍為進一步較佳。本發明的樹脂組成物亦可以實質上不含有全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽。例如,藉由使用能夠代替全氟烷基磺酸及其鹽之化合物以及能夠代替全氟烷基羧酸及其鹽之化合物,亦可以選擇實質上不含有全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽之樹脂組成物。作為能夠成為管制化合物的代替之化合物,例如可舉出藉由全氟烷基的碳數的差異從管制對象去除之化合物。但是,上述之內容並不妨礙全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽的使用。本發明的樹脂組成物在可允許之最大的範圍內亦可以含有全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽。From the viewpoint of environmental regulation, the use of perfluoroalkanesulfonic acids and their salts and perfluoroalkylcarboxylic acids and their salts are sometimes regulated. In the resin composition of the present invention, in the case of reducing the content rate of the above-mentioned compounds, perfluoroalkylsulfonic acid (especially, perfluoroalkylsulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and its The content of salts and perfluoroalkylcarboxylic acids (especially perfluoroalkylcarboxylic acids with 6 to 8 carbon atoms in the perfluoroalkyl group) and their salts is 0.01ppb to 1,000 with respect to the total solid content of the resin composition The range of ppb is preferable, the range of 0.05ppb-500ppb is more preferable, and the range of 0.1ppb-300ppb is still more preferable. The resin composition of the present invention may not substantially contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. For example, by using a compound that can replace perfluoroalkylsulfonic acid and its salt and a compound that can replace perfluoroalkylcarboxylic acid and its salt, it is also possible to select a compound that does not substantially contain perfluoroalkylsulfonic acid and its salt and Resin composition of perfluoroalkyl carboxylic acid and its salt. Examples of compounds that can be substituted for regulated compounds include compounds that are excluded from regulated objects due to differences in the carbon number of perfluoroalkyl groups. However, the above-mentioned content does not prevent the use of perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. The resin composition of the present invention may also contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt within the maximum allowable range.
本發明的樹脂組成物的含水率通常為3質量%以下,0.01~1.5質量%為較佳,0.1~1.0質量%的範圍為更佳。含水率能夠藉由Karl Fischer法進行測量。The water content of the resin composition of the present invention is usually 3% by mass or less, preferably 0.01 to 1.5% by mass, more preferably 0.1 to 1.0% by mass. Moisture content can be measured by the Karl Fischer method.
為了膜面狀(平坦性等)的調節、膜厚的調節等,本發明的樹脂組成物能夠調節黏度來使用。黏度的值能夠依據需要適當地選擇,但是例如在25℃條件下係0.3mPa・s~50mPa・s為較佳,0.5mPa・s~20mPa・s為更佳。作為黏度的測量方法,例如能夠使用錐板類型黏度計在將溫度調節成25℃之狀態下進行測量。The resin composition of the present invention can be used by adjusting the viscosity for the purpose of adjusting the film surface shape (flatness, etc.), adjusting the film thickness, and the like. The value of the viscosity can be appropriately selected according to needs, but for example, it is preferably 0.3 mPa・s to 50 mPa・s at 25°C, more preferably 0.5 mPa・s to 20 mPa・s. As a method of measuring the viscosity, for example, it can be measured using a cone-plate type viscometer in a state where the temperature is adjusted to 25°C.
<<收容容器>> 作為樹脂組成物的收容容器,並無特別限制,能夠使用公知的收容容器。又,作為收容容器,以抑制雜質混入原材料或樹脂組成物中為目的,使用由6種6層的樹脂構成容器內壁之多層瓶或將6種樹脂設為7層結構之瓶亦較佳。作為該種容器,例如可舉出日本特開2015-123351號公報中所記載的容器。又,以防止金屬從容器內壁溶出、提高樹脂組成物的經時穩定性或抑制成分變質等目的,容器內壁製成玻璃製或不銹鋼製等亦較佳。 <<Containment container>> The container for the resin composition is not particularly limited, and known containers can be used. In addition, as a storage container, for the purpose of preventing impurities from mixing into the raw material or resin composition, it is also preferable to use a multi-layer bottle whose inner wall is composed of 6 types of 6-layer resins or a bottle with 6 types of resins in a 7-layer structure. As such a container, the container described in Unexamined-Japanese-Patent No. 2015-123351 is mentioned, for example. In addition, it is also preferable that the inner wall of the container is made of glass or stainless steel for the purpose of preventing metal elution from the inner wall of the container, improving the stability of the resin composition over time, or suppressing deterioration of the components.
<樹脂組成物的製備方法> 本發明的樹脂組成物能夠藉由混合前述成分而製備。製備樹脂組成物時,可以將所有成分同時溶解和/或分散於溶劑中而製備樹脂組成物,亦可以依據需要,將各成分適當地作為2個以上的溶液或分散液,並在使用時(塗佈時)將該等進行混合而製備樹脂組成物。 <Preparation method of resin composition> The resin composition of the present invention can be prepared by mixing the aforementioned components. When preparing the resin composition, all the components can be dissolved and/or dispersed in the solvent at the same time to prepare the resin composition, and each component can also be suitably used as two or more solutions or dispersions as needed, and when used ( At the time of coating) these are mixed to prepare a resin composition.
又,製備樹脂組成物時,包含使顏料分散之步驟為較佳。作為在使顏料分散之步驟中用於顏料的分散之機械力,可舉出壓縮、擠壓、衝擊、剪切、氣蝕等。作為該等步驟的具體例,可舉出珠磨、砂磨、輥磨、球磨、塗料攪拌、微射流、高速葉輪、混砂、噴射流混合、高壓濕式微粒化、超聲波分散等。又,在砂磨(珠磨)下的顏料的粉碎中,以如下條件進行處理為較佳,該條件為藉由使用直徑小的微珠,且提高微珠的填充率等而提高粉碎效率。又,在粉碎處理後藉由過濾、離心分離等而去除粗粒子為較佳。又,關於使顏料分散之步驟及分散機,能夠較佳地使用“分散技術大全集、JOHOKIKO CO.,LTD.發行,2005年7月15日”或“以懸浮液(固體/液體分散體系)為中心之分散技術與工業上的實際應用綜合資料集,經營開發中心出版部發行,1978年10月10日”、日本特開2015-157893號公報的0022段中所記載的步驟及分散機。又,在使顏料分散之步驟中,可以藉由鹽磨步驟進行粒子的微細化處理。在鹽磨步驟中所使用之原材料、設備、處理條件等例如能夠參閱日本特開2015-194521號公報、日本特開2012-046629號公報的記載。Moreover, when preparing a resin composition, it is preferable to include the step of dispersing a pigment. Compression, extrusion, impact, shearing, cavitation, etc. are mentioned as a mechanical force used for dispersion|distribution of a pigment in the process of dispersing a pigment. Specific examples of these steps include bead milling, sand milling, roller milling, ball milling, paint stirring, micro jets, high-speed impellers, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, and the like. In addition, in pulverization of pigments under sand milling (bead milling), it is preferable to perform treatment under the conditions that the pulverization efficiency can be improved by using small-diameter beads and increasing the filling rate of the microbeads. Moreover, it is preferable to remove coarse particles by filtration, centrifugation, etc. after pulverization. Also, regarding the procedure and dispersing machine for dispersing the pigment, it is preferable to use "Compendium of Dispersion Technology, JOHOKIKO CO., LTD. Issued, July 15, 2005" or "Using Suspension (Solid/Liquid Dispersion System) Centered Dispersion Technology and Industrial Practical Application Comprehensive Data Collection, Issued by the Publishing Department of the Management Development Center, October 10, 1978", the steps and dispersion machines recorded in paragraph 0022 of Japanese Patent Application Laid-Open No. 2015-157893. In addition, in the step of dispersing the pigment, particle size reduction treatment may be performed by a salt milling step. For raw materials, equipment, processing conditions and the like used in the salt milling step, for example, reference can be made to the descriptions in JP-A-2015-194521 and JP-A-2012-046629.
製備樹脂組成物時,為了去除雜質或降低缺陷等,用過濾器過濾樹脂組成物為較佳。作為過濾器,只要係一直以來用於過濾用途等之過濾器,則能夠無特別限制地進行使用。例如可舉出使用聚四氟乙烯(PTFE)、聚偏二氟乙烯(PVDF)等氟樹脂、尼龍(例如尼龍-6、尼龍-6,6)等聚醯胺系樹脂、聚乙烯、聚丙烯(PP)等聚烯烴樹脂(包括高密度、超高分子量的聚烯烴樹脂)等材料之過濾器。在該等材料之中,聚丙烯(包括高密度聚丙烯)及尼龍為較佳。When preparing a resin composition, it is preferable to filter the resin composition with a filter in order to remove impurities or reduce defects. As the filter, any filter can be used without particular limitation as long as it is conventionally used for filtration purposes and the like. For example, fluorine resins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide-based resins such as nylon (such as nylon-6, nylon-6,6), polyethylene, polypropylene, etc. (PP) and other polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins) and other materials. Among these materials, polypropylene (including high density polypropylene) and nylon are preferred.
過濾器的孔徑為0.01~7.0μm為較佳,0.01~3.0μm為更佳,0.05~0.5μm為進一步較佳。只要過濾器的孔徑在上述範圍,則能夠更可靠地去除微細的雜質。關於過濾器的孔徑值,能夠參閱過濾器廠商的標稱值。關於過濾器,能夠使用由NIHON PALL Corporation(DFA4201NXEY、DFA4201NAEY、DFA4201J006P等)、Advantec Toyo Kaisha, Ltd.、Nihon Entegris K.K.(Formerly Nippon Mykrolis Corporation)及KITZ MICROFILTER Corporation等提供之各種過濾器。The pore size of the filter is preferably from 0.01 to 7.0 μm, more preferably from 0.01 to 3.0 μm, and still more preferably from 0.05 to 0.5 μm. As long as the pore diameter of the filter is within the above-mentioned range, fine impurities can be removed more reliably. For the pore diameter value of the filter, you can refer to the nominal value of the filter manufacturer. As for the filter, various filters provided by NIHON PALL Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, etc. can be used.
又,作為過濾器,使用纖維狀的過濾材料亦較佳。作為纖維狀的濾材,例如可舉出聚丙烯纖維、尼龍纖維、玻璃纖維等。作為市售品,可舉出ROKI TECHNO CO.,LTD.製的SBP類型系列(SBP008等)、TPR類型系列(TPR002、TPR005等)、SHPX類型系列(SHPX003等)。Moreover, it is also preferable to use a fibrous filter material as a filter. As a fibrous filter medium, a polypropylene fiber, a nylon fiber, a glass fiber etc. are mentioned, for example. Examples of commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.
在使用過濾器時,可以組合不同之過濾器(例如,第1過濾器和第2過濾器等)。此時,用各過濾器之過濾可以僅進行1次,亦可以進行2次以上。又,可以在上述範圍內組合不同孔徑的過濾器。又,亦可以用第1過濾器之過濾僅對分散液進行,在混合其他成分之後,用第2過濾器進行過濾。又,能夠依據組成物的親疏水性適當地選擇過濾器。When using filters, it is possible to combine different filters (for example, 1st filter and 2nd filter, etc.). In this case, the filtration by each filter may be performed only once, or may be performed two or more times. Also, filters with different pore diameters may be combined within the above range. Moreover, it is also possible to perform filtration with the 1st filter only for a dispersion liquid, and to filter with a 2nd filter after mixing other components. In addition, the filter can be appropriately selected according to the hydrophilicity and hydrophobicity of the composition.
<膜> 本發明的膜為由上述本發明的樹脂組成物獲得之膜。本發明的膜能夠用於濾色器、近紅外線透射濾波器及近紅外線截止濾波器等濾光器。 <Film> The film of the present invention is a film obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be used for filters such as color filters, near-infrared transmission filters, and near-infrared cut filters.
本發明的膜的膜厚能夠依據目的而適當地進行調節。例如,膜厚為20μm以下為較佳,10μm以下為更佳,5μm以下為進一步較佳。膜厚的下限為0.1μm以上為較佳,0.2μm以上為更佳,0.3μm以上為進一步較佳。The film thickness of the film of the present invention can be appropriately adjusted depending on the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and still more preferably 5 μm or less. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.3 μm.
在將本發明的膜用作濾色器之情況下,本發明的膜具有綠色、紅色、藍色、青色、品紅色或黃色色相為較佳,具有綠色、藍色或青色色相為更佳,具有綠色色相為進一步較佳。又,本發明的膜能夠較佳地用作濾色器的著色像素。作為著色像素,可舉出紅色像素、綠色像素、藍色像素、品紅色像素、青色像素、黃色像素等,綠色像素、藍色像素或青色像素為較佳,綠色像素為更佳。In the case of using the film of the present invention as a color filter, the film of the present invention preferably has a green, red, blue, cyan, magenta or yellow hue, more preferably has a green, blue or cyan hue, It is further preferred to have a green hue. Also, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels. Green pixels, blue pixels, or cyan pixels are preferred, and green pixels are more preferred.
<膜的製造方法> 接著,對本發明的膜的製造方法進行說明。本發明的膜能夠經由塗佈本發明的樹脂組成物之步驟來製造。膜的製造方法中,還包括形成圖案(像素)之步驟為較佳。作為圖案(像素)的形成方法,可舉出光微影法、乾式蝕刻法,光微影法為較佳。 <Membrane manufacturing method> Next, the method for producing the film of the present invention will be described. The film of the present invention can be produced through the step of applying the resin composition of the present invention. In the film manufacturing method, it is preferable to further include a step of forming a pattern (pixel). As a pattern (pixel) forming method, photolithography and dry etching are mentioned, and photolithography is preferred.
基於光微影法之圖案形成包括如下步驟為較佳:使用本發明的樹脂組成物在支撐體上形成樹脂組成物層之步驟;將樹脂組成物層曝光成圖案狀之步驟;及將樹脂組成物層的未曝光部進行顯影去除而形成圖案(像素)之步驟。依據需要,還可以設置對樹脂組成物層進行烘烤之步驟(預烘烤步驟)及對經顯影之圖案(像素)進行烘烤之步驟(後烘烤步驟)。It is preferable that the pattern formation based on photolithography includes the following steps: a step of using the resin composition of the present invention to form a resin composition layer on a support; a step of exposing the resin composition layer into a pattern; and exposing the resin composition The step of developing and removing the unexposed part of the object layer to form a pattern (pixel). If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixel) (post-baking step) may also be provided.
形成本發明的樹脂組成物層之步驟中,使用樹脂組成物在支撐體上形成樹脂組成物層。作為支撐體,並無特別限制,能夠根據用途而適當地選擇。例如,可舉出玻璃基板、矽基板等,矽基板為較佳。又,在矽基板上可以形成有電荷耦合元件(CCD)、互補金屬氧化物半導體(CMOS)、透明導電膜等。又,有時在矽基板上形成有將各像素隔離之黑矩陣(black matrix)。又,為了改善與上部層的黏附性、防止物質的擴散或者基板表面的平坦化,可以在矽基板上設置基底層。基底層亦可以使用從本說明書中所記載之樹脂組成物去除著色劑之組成物或含有本說明書中所記載之樹脂、聚合性化合物、界面活性劑等之組成物等來形成。用二碘甲烷測量時基底層的表面接觸角為20~70°為較佳。又,用水測量時30~80°為較佳。In the step of forming the resin composition layer of the present invention, the resin composition layer is formed on the support using the resin composition. The support is not particularly limited, and can be appropriately selected according to the application. For example, a glass substrate, a silicon substrate, etc. are mentioned, and a silicon substrate is preferable. In addition, a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, and the like may be formed on the silicon substrate. In addition, a black matrix is sometimes formed on a silicon substrate to isolate each pixel. In addition, in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or planarize the surface of the substrate, a base layer may be provided on the silicon substrate. The base layer can also be formed using a composition in which a colorant is removed from a resin composition described in this specification, or a composition containing a resin, a polymerizable compound, a surfactant, and the like described in this specification. When measured with diiodomethane, the surface contact angle of the base layer is preferably 20-70°. Also, 30° to 80° is preferable when measured with water.
作為樹脂組成物的塗佈方法,能夠使用公知的方法。例如,可舉出滴加法(滴鑄);狹縫塗佈法;噴霧法;輥塗法;旋轉塗佈法(旋塗);流延塗佈法;狹縫旋塗法;預濕法(例如,日本特開2009-145395號公報中所記載之方法);噴墨(例如按需方式、壓電方式、熱方式)、噴嘴噴射等噴出系印刷、柔版印刷、網版印刷、凹版印刷、逆轉偏移印刷、金屬遮罩印刷等各種印刷法;使用模具等之轉印法;奈米壓印法等。作為噴墨中之應用方法並沒有特別限定,例如可舉出“可推廣、使用之噴墨-專利中出現之無限可能性-,2005年2月發行,Sumitbe Techon Research Co.,Ltd.”所示之方法(尤其第115頁~第133頁)或日本特開2003-262716號公報、日本特開2003-185831號公報、日本特開2003-261827號公報、日本特開2012-126830號公報、日本特開2006-169325號公報等中所記載之方法。又,關於樹脂組成物的塗佈方法,能夠參閱國際公開第2017/030174號、國際公開第2017/018419號的記載,該等內容被編入本說明書中。As a coating method of the resin composition, a known method can be used. For example, there can be mentioned dropping method (drip casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); For example, the method described in Japanese Patent Laid-Open No. 2009-145395); inkjet (such as drop-on-demand method, piezoelectric method, thermal method), jet printing such as nozzle jetting, flexographic printing, screen printing, gravure printing , reverse offset printing, metal mask printing and other printing methods; transfer printing using molds, etc.; nanoimprinting, etc. The application method in inkjet is not particularly limited, for example, "Inkjet that can be promoted and used - infinite possibilities in the patent -, issued in February 2005, Sumitbe Techon Research Co., Ltd." The method shown (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830, The method described in Japanese Unexamined Patent Application Publication No. 2006-169325 and the like. In addition, regarding the coating method of the resin composition, the descriptions in International Publication No. 2017/030174 and International Publication No. 2017/018419 can be referred to, and these contents are incorporated in this specification.
形成於支撐體上之樹脂組成物層可以進行乾燥(預烘烤)。在藉由低溫製程製造膜之情況下,可以不進行預烘烤。在進行預烘烤之情況下,預烘烤溫度為150℃以下為較佳,120℃以下為更佳,110℃以下為進一步較佳。下限例如能夠設為50℃以上,亦能夠設為80℃以上。預烘烤時間為10~300秒鐘為較佳,40~250秒鐘為更佳,80~220秒鐘為進一步較佳。預烘烤能夠用加熱板、烘箱等來進行。The resin composition layer formed on the support may be dried (prebaked). In the case of producing a film by a low-temperature process, pre-baking may not be performed. In the case of prebaking, the prebaking temperature is preferably 150° C. or lower, more preferably 120° C. or lower, and still more preferably 110° C. or lower. The lower limit may be, for example, 50° C. or higher, or may be 80° C. or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and still more preferably 80 to 220 seconds. Prebaking can be performed with a hot plate, an oven, or the like.
接著,將樹脂組成物層曝光成圖案狀(曝光步驟)。例如,使用步進曝光機、掃描曝光機等,隔著具有規定的遮罩圖案之遮罩,對樹脂組成物層進行曝光,藉此能夠曝光成圖案狀。藉此,能夠使曝光部分硬化。Next, the resin composition layer is exposed in a pattern (exposure step). For example, the resin composition layer can be exposed in a patterned form by exposing the resin composition layer through a mask having a predetermined mask pattern using a stepper, a scanning exposure machine, or the like. Thereby, the exposed part can be cured.
作為能夠在曝光時使用之放射線(光),可舉出g射線、i射線等。又,亦能夠使用波長300nm以下的光(較佳為波長180~300nm的光)。作為波長300nm以下的光,可舉出KrF射線(波長248nm)、ArF射線(波長193nm)等,KrF射線(波長248nm)為較佳。又,亦能夠利用300nm以上的長波長的光源。Examples of radiation (light) that can be used for exposure include g-rays, i-rays, and the like. In addition, light having a wavelength of 300 nm or less (preferably light having a wavelength of 180 to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and KrF rays (wavelength: 248 nm) are preferred. In addition, a light source with a long wavelength of 300 nm or more can also be used.
又,在曝光時,可以連續照射光而進行曝光,亦可以脈衝照射而進行曝光(脈衝曝光)。再者,脈衝曝光係指以短時間(例如,毫秒級以下)的循環反覆進行光的照射和暫停而進行曝光之方式的曝光方法。In addition, at the time of exposure, exposure may be performed by continuously irradiating light, or may be performed by pulsed irradiation (pulse exposure). In addition, pulse exposure refers to an exposure method in which light is irradiated and paused repeatedly in a cycle of short time (for example, millisecond order or less) to perform exposure.
照射量(曝光量)例如為0.03~2.5J/cm 2為較佳,0.05~1.0J/cm 2為更佳。關於曝光時的氧濃度,能夠適當地選擇,除在大氣下進行以外,例如可以在氧濃度為19體積%以下的低氧環境下(例如,15體積%、5體積%或實質上無氧)進行曝光,亦可以在氧濃度超過21體積%之高氧環境下(例如,22體積%、30體積%或50體積%)進行曝光。又,曝光照度能夠適當地設定,通常能夠從1000W/m 2~100000W/m 2(例如,5000W/m 2、15000W/m 2或35000W/m 2)的範圍選擇。氧濃度和曝光照度可以適當地組合條件,例如能夠設為氧濃度10體積%且照度10000W/m 2、氧濃度35體積%且照度20000W/m 2等。 The amount of irradiation (exposure amount) is, for example, preferably 0.03 to 2.5 J/cm 2 , more preferably 0.05 to 1.0 J/cm 2 . The oxygen concentration at the time of exposure can be appropriately selected. In addition to performing in the atmosphere, for example, it can be performed in a low-oxygen environment with an oxygen concentration of 19% by volume or less (for example, 15% by volume, 5% by volume, or substantially no oxygen). Exposure may be performed under a high oxygen environment (for example, 22 volume %, 30 volume % or 50 volume %) with an oxygen concentration exceeding 21 volume %. In addition, the exposure illuminance can be appropriately set, and usually can be selected from the range of 1000 W/m 2 to 100,000 W/m 2 (for example, 5,000 W/m 2 , 15,000 W/m 2 , or 35,000 W/m 2 ). The conditions of oxygen concentration and exposure illuminance can be appropriately combined, for example, an oxygen concentration of 10 vol % and an illuminance of 10000 W/m 2 , an oxygen concentration of 35 vol % and an illuminance of 20000 W/m 2 , etc. can be set.
接著,顯影去除樹脂組成物層的未曝光部分而形成圖案(像素)。樹脂組成物層的未曝光部分的顯影去除能夠使用顯影液來進行。藉此,曝光步驟中的未曝光部分的樹脂組成物層溶出於顯影液中,僅殘留經光硬化之部分。顯影液的溫度例如為20~30℃為較佳。顯影時間為20~180秒鐘為較佳。又,為了提高殘渣去除性,可以重複進行複數次每隔60秒鐘甩掉顯影液進而供給新的顯影液之步驟。Next, unexposed portions of the resin composition layer are removed by development to form a pattern (pixel). The development and removal of the unexposed portion of the resin composition layer can be performed using a developer. Thereby, the resin composition layer of the unexposed part in the exposure step is dissolved in the developing solution, and only the photohardened part remains. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal performance, the step of shaking off the developing solution every 60 seconds and supplying a new developing solution may be repeated several times.
顯影液可舉出有機溶劑、鹼顯影液等,可較佳地使用鹼顯影液。作為鹼顯影液,用純水稀釋鹼劑而得之鹼性水溶液(鹼顯影液)為較佳。作為鹼劑,例如可舉出氨、乙胺、二乙胺、二甲基乙醇胺、二甘醇胺(diglycolamine)、二乙醇胺、羥胺、乙二胺、四甲基氫氧化銨、四乙基氫氧化銨、四丙基氫氧化銨、四丁基氫氧化銨、乙基三甲基氫氧化銨、苄基三甲基氫氧化銨、二甲基雙(2-羥基乙基)氫氧化銨、膽鹼、吡咯、哌啶、1,8-二氮雜雙環-[5.4.0]-7-十一碳烯等有機鹼性化合物或氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸氫鈉、矽酸鈉、偏矽酸鈉等無機鹼性化合物。在環境方面及安全方面上,鹼劑較佳為分子量大的化合物。鹼性水溶液的鹼劑的濃度為0.001~10質量%為較佳,0.01~1質量%為更佳。又,顯影液可進一步含有界面活性劑。從方便運輸或保管等觀點考慮,顯影液可以暫時製造成濃縮液,使用時稀釋成所需濃度。稀釋倍率並無特別限定,例如能夠設定於1.5~100倍的範圍。又,顯影之後用純水進行清洗(沖洗)亦較佳。又,藉由旋轉已形成有顯影後的樹脂組成物層之支撐體,並且向顯影後的樹脂組成物層供給沖洗液來進行沖洗為較佳。又,藉由使吐出沖洗液之噴嘴從支撐體的中心部向支撐體的周緣部移動來進行亦較佳。此時,在從噴嘴的支撐體中心部向周緣部移動時,可以在逐漸降低噴嘴的移動速度的同時使其移動。藉由以該種方式進行沖洗,能夠抑制沖洗的面內偏差。又,藉由使噴嘴從支撐體中心部向周緣部移動的同時逐漸降低支撐體的轉速亦可獲得相同的效果。As a developing solution, an organic solvent, an alkali developing solution, etc. are mentioned, and an alkali developing solution can be used preferably. As the alkaline developing solution, an alkaline aqueous solution (alkali developing solution) obtained by diluting the alkaline agent with pure water is preferable. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylhydrogen Ammonium Oxide, Tetrapropylammonium Hydroxide, Tetrabutylammonium Hydroxide, Ethyltrimethylammonium Hydroxide, Benzyltrimethylammonium Hydroxide, Dimethylbis(2-Hydroxyethyl)ammonium Hydroxide, Choline, pyrrole, piperidine, 1,8-diazabicyclo-[5.4.0]-7-undecene and other organic basic compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, Sodium silicate, sodium metasilicate and other inorganic alkaline compounds. In terms of environment and safety, the alkali agent is preferably a compound with a large molecular weight. The concentration of the alkaline agent in the alkaline aqueous solution is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 1% by mass. In addition, the developer may further contain a surfactant. From the viewpoint of convenient transportation and storage, the developer solution can be temporarily made into a concentrated solution and diluted to a desired concentration when used. The dilution ratio is not particularly limited, and can be set, for example, within a range of 1.5 to 100 times. Moreover, it is also preferable to wash (rinse) with pure water after image development. Further, it is preferable to perform rinsing by rotating the support on which the developed resin composition layer has been formed, and supplying a rinsing liquid to the developed resin composition layer. Moreover, it is also preferable to carry out by moving the nozzle which discharges a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving from the central part of the support body of the nozzle to the peripheral part, the moving speed of the nozzle may be gradually reduced while moving. By performing rinsing in this manner, in-plane variation in rinsing can be suppressed. Also, the same effect can be obtained by gradually reducing the rotational speed of the support while moving the nozzle from the center portion of the support to the peripheral portion.
顯影之後,實施乾燥之後進行追加曝光處理、加熱處理(後烘烤)為較佳。追加曝光處理、後烘烤為用於製成完全硬化者之顯影後的硬化處理。後烘烤中的加熱溫度例如為100~240℃為較佳,200~240℃為更佳。能夠以成為上述條件之方式,使用加熱板或對流烘箱(熱風循環式乾燥機)、高頻加熱機等加熱機構,以連續式或間歇式對顯影後的膜進行後烘烤。在進行追加曝光處理之情況下,用於曝光之光為波長400nm以下的光為較佳。又,追加曝光處理可以藉由韓國公開專利第10-2017-0122130號公報中所記載之方法進行。After image development, it is preferable to perform additional exposure processing and heat processing (post-baking) after performing drying. Additional exposure treatment and post-baking are hardening treatments after development to make fully hardened ones. The heating temperature in the post-baking is, for example, preferably 100 to 240°C, more preferably 200 to 240°C. The film after development can be post-baked continuously or intermittently using a heating mechanism such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater so as to meet the above conditions. When performing an additional exposure process, it is preferable that the light used for exposure is light of wavelength 400nm or less. In addition, the additional exposure treatment can be performed by the method described in Korean Laid-Open Patent No. 10-2017-0122130.
基於乾式蝕刻法之圖案形成包括如下步驟為較佳:使用本發明的樹脂組成物在支撐體上形成樹脂組成物層,並使該整個樹脂組成物層硬化而形成硬化物層之步驟;在該硬化物層上形成光阻劑層之步驟;將光阻劑層曝光成圖案狀之後,進行顯影而形成阻劑圖案之步驟;及將該阻劑圖案作為遮罩並使用蝕刻氣體對硬化物層進行乾式蝕刻之步驟。在形成光阻層時,進一步實施預烘烤處理為較佳。尤其,作為光阻層的形成步驟,實施曝光後的加熱處理、顯影後的加熱處理(後烘烤處理)之形態為較佳。關於利用乾式蝕刻法之圖案形成,能夠參閱日本特開2013-064993號公報的0010~0067段的記載,且該內容被編入本說明書中。The pattern formation based on the dry etching method preferably includes the following steps: using the resin composition of the present invention to form a resin composition layer on a support, and curing the entire resin composition layer to form a hardened layer; A step of forming a photoresist layer on the hardened layer; a step of developing the photoresist layer after exposing the photoresist layer into a pattern; and using the resist pattern as a mask and using an etching gas to treat the hardened layer The step of performing dry etching. When forming the photoresist layer, it is better to further perform pre-baking treatment. In particular, a form in which heat treatment after exposure and heat treatment after development (post-baking treatment) are performed as a step of forming a photoresist layer is preferable. Regarding the pattern formation by the dry etching method, descriptions in paragraphs 0010 to 0067 of JP-A-2013-064993 can be referred to, and the contents thereof are incorporated in this specification.
<濾光器> 本發明的濾光器具有上述之本發明的膜。作為濾光器的種類,可舉出濾色器、近紅外線截止濾波器及近紅外線透過濾波器等,濾色器為較佳。濾色器作為其像素具有本發明的膜為較佳,作為著色像素具有本發明的膜為更佳,作為綠色像素具有本發明的膜為進一步較佳。 <Filter> The optical filter of the present invention has the above-mentioned film of the present invention. As a kind of optical filter, a color filter, a near-infrared ray cut filter, a near-infrared ray transmission filter, etc. are mentioned, A color filter is preferable. A color filter preferably has the film of the present invention as its pixel, more preferably has the film of the present invention as a colored pixel, and still more preferably has the film of the present invention as a green pixel.
濾光器可以在本發明的膜的表面設置保護層。藉由設置保護層,能夠賦予阻氧化、低反射化、親疏水化、既定波長的光(紫外線、近紅外線等)的遮蔽等各種作用。作為保護層的厚度,0.01~10μm為較佳,0.1~5μm為更佳。作為保護層的形成方法,可舉出塗佈保護層形成用樹脂組成物而形成之方法、化學氣相沉積法、用黏合材料貼付所成型之樹脂之方法等。作為構成保護層之成分,可舉出(甲基)丙烯酸樹脂、烯-硫醇樹脂、聚碳酸酯樹脂、聚醚樹脂、聚芳酯樹脂、聚碸樹脂、聚醚碸樹脂、聚苯樹脂、聚伸芳基醚氧化膦樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚烯烴樹脂、環狀烯烴樹脂、聚酯樹脂、苯乙烯樹脂、多元醇樹脂、聚偏二氯乙烯樹脂、三聚氰胺樹脂、聚胺酯樹脂、芳香族聚醯胺樹脂、聚醯胺樹脂、醇酸樹脂、環氧樹脂、改質聚矽氧樹脂、氟樹脂、聚碳酸酯樹脂、聚丙烯腈樹脂、纖維素樹脂、Si、C、W、Al 2O 3、Mo、SiO 2、Si 2N 4等,可以含有兩種以上的該等成分。例如,在用於阻氧化之保護層之情況下,保護層含有多元醇樹脂、SiO 2及Si 2N 4為較佳。又,在用於低反射化之保護層之情況下,保護層含有(甲基)丙烯酸樹脂和氟樹脂為較佳。 In the optical filter, a protective layer may be provided on the surface of the film of the present invention. By providing a protective layer, various effects such as oxidation resistance, low reflection, hydrophilicity and hydrophobicity, and shielding of light of a predetermined wavelength (ultraviolet rays, near-infrared rays, etc.) can be imparted. The thickness of the protective layer is preferably from 0.01 to 10 μm, more preferably from 0.1 to 5 μm. Examples of the method for forming the protective layer include a method of applying a resin composition for forming a protective layer, a chemical vapor deposition method, and a method of attaching the molded resin with an adhesive material. Examples of components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyethene resins, polyethersulfur resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin , melamine resin, polyurethane resin, aromatic polyamide resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluorine resin, polycarbonate resin, polyacrylonitrile resin, cellulose resin , Si, C, W, Al 2 O 3 , Mo, SiO 2 , Si 2 N 4 , etc., may contain two or more of these components. For example, when used as a protective layer for preventing oxidation, it is preferable that the protective layer contains polyol resin, SiO 2 and Si 2 N 4 . Also, when used as a low-reflection protective layer, it is preferable that the protective layer contains (meth)acrylic resin and fluororesin.
在塗佈樹脂組成物而形成保護層之情況下,作為樹脂組成物之塗佈方法,能夠使用旋塗法、澆鑄法、網板印刷法、噴墨法等公知的方法。樹脂組成物中所含之有機溶劑能夠使用公知的有機溶劑(例如,丙二醇1-單甲醚2-乙酸酯、環戊酮、乳酸乙酯等)。在藉由化學氣相沉積法形成保護層之情況下,作為化學氣相沉積法,能夠使用公知的化學氣相沉積法(熱化學氣相沉積法、電漿化學氣相沉積法、光化學氣相沉積法)。When coating a resin composition to form a protective layer, well-known methods, such as a spin coating method, a casting method, a screen printing method, and an inkjet method, can be used as a coating method of a resin composition. As the organic solvent contained in the resin composition, known organic solvents (for example, propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used. In the case of forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical gas phase deposition method).
依據需要,保護層還可以含有有機・無機微粒、既定波長的光(例如,紫外線、近紅外線等)的吸收劑、折射率調節劑、抗氧化劑、黏附劑、界面活性劑等添加劑。作為有機・無機微粒的例子,例如,可舉出高分子微粒(例如,聚矽氧樹脂微粒、聚苯乙烯微粒、三聚氰胺樹脂微粒)、氧化鈦、氧化鋅、氧化鋯、氧化銦、氧化鋁、氮化鈦、氧氮化鈦、氟化鎂、中空二氧化矽、二氧化矽、碳酸鈣、硫酸鋇等。既定波長的光的吸收劑能夠使用公知的吸收劑。該等添加劑的含量能夠適當地進行調節,但是相對於保護層的總質量為0.1~70質量%為較佳,1~60質量%為進一步較佳。The protective layer may contain additives such as organic and inorganic fine particles, light absorbers of predetermined wavelengths (eg, ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesives, and surfactants, as necessary. Examples of organic and inorganic fine particles include polymer fine particles (such as silicone resin particles, polystyrene particles, melamine resin particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, Titanium nitride, titanium oxynitride, magnesium fluoride, hollow silicon dioxide, silicon dioxide, calcium carbonate, barium sulfate, etc. As an absorber for light of a predetermined wavelength, known absorbers can be used. The content of these additives can be appropriately adjusted, but is preferably 0.1 to 70% by mass, more preferably 1 to 60% by mass, based on the total mass of the protective layer.
又,作為保護層,亦能夠使用日本特開2017-151176號公報的0073~0092段中所記載之保護層。Moreover, as a protective layer, the protective layer described in paragraph 0073-0092 of Unexamined-Japanese-Patent No. 2017-151176 can also be used.
濾光器亦可以具有如下結構:在藉由隔壁例如以格子狀隔開之空間嵌入有各像素。The optical filter may also have a structure in which pixels are embedded in spaces separated by partition walls, for example, in a grid pattern.
<固體攝像元件> 本發明的固體攝像元件具有上述本發明的膜。作為固體攝像元件的結構,只要係具備本發明的膜,且作為固體攝像元件而發揮作用之結構,則並無特別限定,例如可舉出如下結構。 <Solid state image sensor> The solid-state imaging device of the present invention has the above-mentioned film of the present invention. The structure of the solid-state imaging device is not particularly limited as long as it is provided with the film of the present invention and functions as a solid-state imaging device, and examples thereof include the following structures.
攝像元件的結構如下:在基板上具有由構成固體攝像元件(CCD(電荷耦合元件)影像感測器、CMOS(互補型金屬氧化膜半導體)影像感測器等)的受光區域之複數個光電二極體及多晶矽等構成之傳輸電極,在光電二極體及傳輸電極上具有僅光電二極體的受光部開口之遮光膜,在遮光膜上具有以覆蓋遮光膜整個表面及光電二極體受光部之方式形成之由氮化矽等構成之元件保護膜,在元件保護膜上具有濾色器。而且,可以為在設備保護膜上且在濾色器的下側(靠近基板的側)具有聚光機構(例如,微透鏡等。以下相同)之結構或在濾色器上具有聚光機構之結構等。又,濾色器亦可以具有如下結構:在藉由隔壁例如以方格狀隔開之空間嵌入有各著色像素。該情況下的隔壁的折射率比各著色像素低為較佳。作為具有這種結構之攝像裝置的例,可舉出日本特開2012-227478號公報、日本特開2014-179577號公報、國際公開第2018/043654號中所記載之裝置。又,如日本特開2019-211559號公報中所示,在固體攝像元件的結構內設置紫外線吸收層亦可以改善耐光性。具備本發明的固體攝像元件之攝像裝置除了能夠用作數位相機或具有攝像功能之電子設備(移動電話等)之外,亦能夠用作車載攝像機或監視攝像機。The structure of the imaging element is as follows: on the substrate, there are a plurality of photodiodes that constitute the light-receiving area of the solid-state imaging element (CCD (Charge Coupled Device) image sensor, CMOS (Complementary Metal Oxide Film Semiconductor) image sensor, etc.) The transmission electrode composed of polar body and polysilicon, etc. has a light-shielding film on the photodiode and the transmission electrode that only the light-receiving part of the photodiode is opened. An element protection film made of silicon nitride or the like is formed in a partial manner, and a color filter is provided on the element protection film. Furthermore, it may be a structure that has a light-condensing mechanism (for example, a microlens, etc., the same below) on the lower side of the color filter (closer to the substrate) on the device protective film, or one that has a light-condensing mechanism on the color filter. structure etc. In addition, the color filter may have a structure in which colored pixels are embedded in spaces partitioned by partition walls, for example, in a grid pattern. In this case, the refractive index of the partition wall is preferably lower than that of each colored pixel. Examples of imaging devices having such a configuration include devices described in JP-A-2012-227478, JP-A-2014-179577, and WO2018/043654. In addition, as shown in Japanese Patent Laid-Open No. 2019-211559, light resistance can also be improved by providing an ultraviolet absorbing layer within the structure of the solid-state imaging device. The imaging device including the solid-state imaging device of the present invention can be used not only as a digital camera or an electronic device (mobile phone, etc.) having an imaging function, but also as a vehicle-mounted camera or a surveillance camera.
<圖像顯示裝置> 本發明的圖像顯示裝置具有上述之本發明的膜。作為圖像顯示裝置,可舉出液晶顯示裝置或有機電致發光顯示裝置等。關於圖像顯示裝置的定義或各圖像顯示裝置之詳細內容,例如記載於“電子顯示器設備(佐佐木昭夫著,Kogyo Chosakai Publishing Co.,Ltd.,1990年發行)”、“顯示器設備(伊吹順章著,Sangyo Tosho Publishing Co.,Ltd.,1989年發行)”等。又,關於液晶顯示裝置,例如記載於“下一代液晶顯示器技術(內田龍男編輯,Kogyo Chosakai Publishing Co.,Ltd.,1994年發行)”。對能夠應用本發明之液晶顯示裝置並沒有特別限制,例如能夠應用於上述的“下一代液晶顯示器技術”中所記載之各種方式的液晶顯示裝置。 [實施例] <Image Display Device> The image display device of the present invention has the above-mentioned film of the present invention. As an image display device, a liquid crystal display device, an organic electroluminescent display device, etc. are mentioned. The definition of the image display device or the details of each image display device are described, for example, in "Electronic Display Devices (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd., 1990)", "Display Devices (Ibuki Shun Chapter, Sangyo Tosho Publishing Co., Ltd., issued in 1989)", etc. Also, liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". The liquid crystal display device to which the present invention can be applied is not particularly limited, and for example, it can be applied to liquid crystal display devices of various types described in the above-mentioned "Next Generation Liquid Crystal Display Technology". [Example]
以下,舉出實施例對本發明進行進一步具體的說明。以下實施例所示之材料、使用量、比率、處理內容、處理順序等,只要不脫離本發明的主旨,則能夠適當地變更。因此,本發明的範圍並不限定於以下所示者之具體例。Hereinafter, an Example is given and this invention is demonstrated further concretely. Materials, usage amounts, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.
<關於樹脂P1~P188、PP1~PP23、PP101~PP136、CP1~CP3>
樹脂P1~P188、PP1~PP23、PP101~PP136、CP1~CP3分別為包含下述表所示之重複單元之樹脂。一併記載為樹脂的酸值及重量平均分子量(Mw)。樹脂P1~P188、PP1、PP2、PP101~PP136為上述之特定樹脂。
[表1]
[重複單元1] A-1:下述結構的重複單元(具有萘二甲醯亞胺結構之重複單元) A-2:下述結構的重複單元(具有萘二甲醯亞胺結構之重複單元) A-3:下述結構的重複單元(具有吖啶酮結構之重複單元) A-4:下述結構的重複單元(具有苯并噻唑結構之重複單元) A-5:下述結構的重複單元(具有苯并咪唑結構之重複單元) A-6:下述結構的重複單元(具有苯并㗁唑結構之重複單元) A-7:下述結構的重複單元(具有苯并三唑結構之重複單元) A-8:下述結構的重複單元(具有四唑結構之重複單元) A-9:下述結構的重複單元(具有鄰苯二甲醯亞胺結構之重複單元) A-10:下述結構的重複單元(具有鄰苯二甲醯亞胺結構之重複單元) A-11:下述結構的重複單元(具有咔唑結構之重複單元) A-12:下述結構的重複單元(具有茀結構之重複單元) A-13:下述結構的重複單元(具有苯并咪唑酮結構之重複單元) A-14:下述結構的重複單元(具有蒽醌結構之重複單元) A-15:下述結構的重複單元(具有苯并噻𠯤結構之重複單元) A-16:下述結構的重複單元(具有苯并㗁𠯤結構之重複單元) A-17:下述結構的重複單元(具有苯甲醯脲結構之重複單元) A-18:下述結構的重複單元(具有異吲哚啉結構之重複單元) A-19:下述結構的重複單元(具有異吲哚啉酮結構之重複單元) A-20:下述結構的重複單元(具有啡㗁𠯤結構之重複單元) A-21:下述結構的重複單元(具有啡噻𠯤結構之重複單元) A-22:下述結構的重複單元(具有二羥基吖啶結構之重複單元) A-23:下述結構的重複單元(具有苯并二氫噻唑酮結構之重複單元) A-24:下述結構的重複單元(具有苯并㗁唑啉酮結構之重複單元) A-25:下述結構的重複單元(具有咪唑結構之重複單元) A-26:下述結構的重複單元(具有噻唑結構之重複單元) A-27:下述結構的重複單元(具有嘧啶結構之重複單元) A-28:下述結構的重複單元(具有喹唑啉結構之重複單元) A-29:下述結構的重複單元(具有吡𠯤結構之重複單元) A-30:下述結構的重複單元(具有喹㗁啉結構之重複單元) A-31:下述結構的重複單元(具有萘-2,3-二羧基醯亞胺結構之重複單元) A-32:下述結構的重複單元(具有喹啉結構之重複單元) A-33:下述結構的重複單元(具有二苯甲酮結構之重複單元) A-34:下述結構的重複單元(具有三𠯤結構之重複單元) A-35:下述結構的重複單元(具有9-氧硫口山口星結構之重複單元) A-36:下述結構的重複單元(具有口克唍結構之重複單元) A-37:下述結構的重複單元(具有硫口克唍酮結構之重複單元) A-38:下述結構的重複單元(具有偶氮苯結構之重複單元) A-39:下述結構的重複單元(具有二苯并哌喃結構之重複單元) A-40:下述結構的重複單元(具有亞苄苯胺結構之重複單元) A-41:下述結構的重複單元(具有啡𠯤結構之重複單元) A-42:下述結構的重複單元(具有巴比妥酸結構之重複單元) A-43:下述結構的重複單元(具有氧雜蒽酮結構之重複單元) A-44:下述結構的重複單元(具有糖精結構之重複單元) A-45:下述結構的重複單元(具有啡㗁噻結構之重複單元) A-46:下述結構的重複單元(具有吡唑結構之重複單元) A-47:下述結構的重複單元(具有吡唑琳桐結構之重複單元) A-48:下述結構的重複單元(具有己內醯胺結構之重複單元) A-49:下述結構的重複單元(具有吲哚結構之重複單元) A-50:下述結構的重複單元(具有聯苯結構之重複單元) A-51:下述結構的重複單元(具有苯并噻吩結構之重複單元) A-52:下述結構的重複單元(具有咔啉結構之重複單元) A-53:下述結構的重複單元(具有苯并㗁二唑結構之重複單元) A-54:下述結構的重複單元(具有苯并噻二唑結構之重複單元) A-55:下述結構的重複單元(具有三芳基苯結構之重複單元) A-56:下述結構的重複單元(具有三芳基胺結構之重複單元) A-57:下述結構的重複單元(具有異噻唑啉酮結構之重複單元) [化學式35] [化學式36] [化學式37] [化學式38] [化學式39] [化學式40] [Repeating unit 1] A-1: Repeating unit of the following structure (repeating unit having a naphthalimide structure) A-2: Repeating unit of the following structure (repeating unit having a naphthalimide structure ) A-3: repeating unit of the following structure (repeating unit having an acridone structure) A-4: repeating unit of the following structure (repeating unit having a benzothiazole structure) A-5: repeating of the following structure Unit (repeating unit having a benzimidazole structure) A-6: Repeating unit having the following structure (repeating unit having a benzoxazole structure) A-7: Repeating unit having the following structure (repeating unit having a benzotriazole structure) Repeating unit) A-8: Repeating unit of the following structure (repeating unit having a tetrazole structure) A-9: Repeating unit of the following structure (repeating unit having a phthalimide structure) A-10: Repeating unit of the following structure (repeating unit having a phthalimide structure) A-11: Repeating unit of the following structure (repeating unit having a carbazole structure) A-12: Repeating unit of the following structure ( Repeating unit having a fennel structure) A-13: Repeating unit having the following structure (repeating unit having benzimidazolone structure) A-14: Repeating unit having the following structure (repeating unit having anthraquinone structure) A-15 : Repeating unit of the following structure (repeating unit having a benzothiazyl structure) A-16: Repeating unit of the following structure (repeating unit having a benzothiazium structure) A-17: Repeating unit of the following structure ( Repeating unit having a benzoylurea structure) A-18: Repeating unit having the following structure (repeating unit having isoindoline structure) A-19: Repeating unit having the following structure (repeating unit having isoindolinone structure) Repeating unit) A-20: Repeating unit of the following structure (repeating unit having the structure of phenothiazine) A-21: Repeating unit of the following structure (repeating unit having the structure of phenothiazine) A-22: The structure of Repeating unit (repeating unit with dihydroxyacridine structure) A-23: Repeating unit with the following structure (repeating unit with benzodihydrothiazolone structure) A-24: Repeating unit with the following structure (with benzene Repeating unit of oxazolinone structure) A-25: Repeating unit of the following structure (repeating unit having an imidazole structure) A-26: Repeating unit of the following structure (repeating unit having a thiazole structure) A-27: Repeating unit of the following structure (repeating unit having a pyrimidine structure) A-28: Repeating unit of the following structure (repeating unit having a quinazoline structure) A-29: Repeating unit of the following structure (repeating unit having a pyrimidine structure) repeating unit) A-30: repeating unit of the following structure (repeating unit having a quinoline structure) A-31: repeating unit of the following structure (repeating unit having a naphthalene-2,3-dicarboxyimide structure ) A-32: Repeating unit of the following structure (repeating unit having a quinoline structure) A-33: Repeating unit of the following structure (repeating unit having a benzophenone structure) A-34: The following structure Repeating unit (repeating unit with triple structure) A-35: Repeating unit with Repeating unit of the structure) A-37: Repeating unit of the following structure (repeating unit having a thiocroxenone structure) A-38: Repeating unit of the following structure (repeating unit having an azobenzene structure) A- 39: Repeating unit of the following structure (repeating unit having a dibenzopyran structure) A-40: Repeating unit of the following structure (repeating unit having a benzylidene aniline structure) A-41: Repeating unit of the following structure (repeating unit having a phenanthrone structure) A-42: repeating unit having the following structure (repeating unit having barbituric acid structure) A-43: repeating unit having the following structure (repeating unit having xanthone structure ) A-44: Repeating unit of the following structure (repeating unit having a saccharin structure) A-45: Repeating unit of the following structure (repeating unit having a morphine structure) A-46: Repeating unit of the following structure ( Repeating unit having a pyrazole structure) A-47: Repeating unit having the following structure (repeating unit having pyrazole structure) A-48: Repeating unit having the following structure (repeating unit having caprolactam structure) A-49: Repeating unit of the following structure (repeating unit having an indole structure) A-50: Repeating unit of the following structure (repeating unit having a biphenyl structure) A-51: Repeating unit of the following structure (having Repeating unit of benzothiophene structure) A-52: Repeating unit of the following structure (repeating unit having a carboline structure) A-53: Repeating unit of the following structure (repeating unit having a benzodiazole structure) A -54: Repeating unit of the following structure (repeating unit having a benzothiadiazole structure) A-55: Repeating unit of the following structure (repeating unit having a triarylbenzene structure) A-56: Repeating of the following structure Unit (repeating unit having a triarylamine structure) A-57: a repeating unit of the following structure (repeating unit having an isothiazolinone structure) [Chemical Formula 35] [chemical formula 36] [chemical formula 37] [chemical formula 38] [chemical formula 39] [chemical formula 40]
[重複單元2] B-2、B-3、B-6、B-7、B-9、B-11、B-14:下述結構的重複單元(具有酸基之重複單元) [化學式41] [Repeat unit 2] B-2, B-3, B-6, B-7, B-9, B-11, B-14: Repeat units of the following structure (repeat units having an acid group) [Chemical formula 41 ]
[重複單元3] C-1、C-3、C-5、C-7、C-9、C-10、C-12、C-13、C-14、C-17、C-18、C-19:下述結構的重複單元 [化學式42] [Repeat unit 3] C-1, C-3, C-5, C-7, C-9, C-10, C-12, C-13, C-14, C-17, C-18, C -19: repeating unit of the following structure [Chemical Formula 42]
[重複單元4] D-1、D-3、D-5、D-7:下述結構的重複單元(具有接枝鏈之重複單元) [化學式43] [Repeating unit 4] D-1, D-3, D-5, D-7: Repeating units of the following structure (repeating units having grafted chains) [Chemical formula 43]
[重複單元5] E-2、E-3、E-6:下述結構的重複單元(具有交聯性基之重複單元) [化學式44] [Repeating unit 5] E-2, E-3, E-6: Repeating units of the following structure (repeating units having a crosslinkable group) [Chemical formula 44]
[重複單元6] F-1~F-6:下述結構的重複單元 [化學式45] [Repeating unit 6] F-1 to F-6: Repeating units of the following structure [Chemical formula 45]
[重複單元7] F-7:下述結構的重複單元 [化學式46] [Repeating Unit 7] F-7: A repeating unit of the following structure [Chemical Formula 46]
<顏料分散液的製造>
使用珠磨(使用直徑為0.1mm的氧化鋯珠),將混合下述表中所記載之材料之混合液混合及分散3小時之後,進而使用附減壓機構之高壓分散機NANO-3000-10(Nippon BEE Co.,Ltd.製),在2000MPa的壓力下以流量500g/min進行了分散處理。10次重複該分散處理,從而獲得了各顏料分散液。下述表中所記載之數值為質量份的值。一併記載各顏料分散液中的顏料的平均粒徑(nm)、黏度的值(mPa・s)。顏料的平均粒徑使用nanoSAQLA(Otsuka Electronics Co.,Ltd.製)並且藉由動態光散射法進行了測量。關於顏料分散液的黏度,藉由將顏料分散液的溫度調整為25℃進行了測量。
[表9]
上述表的用縮寫記載之材料的詳細內容如下。 (色材) PR254:C.I.顏料紅254(二酮吡咯并吡咯化合物、紅色顏料) PR272:C.I.顏料紅272(二酮吡咯并吡咯化合物、紅色顏料) PY139:C.I.顏料黃139(異吲哚啉化合物、黃色顏料) PG36:C.I.顏料綠36(酞青化合物、綠色顏料) PG58:C.I.顏料綠58(酞青化合物、綠色顏料) PB15:6:C.I.顏料藍15:6(酞青化合物、藍色顏料) PV23:C.I.顏料紫23(二㗁𠯤化合物、紫色顏料) PBk32:C.I.顏料黑32(苝化合物、有機黑色顏料) IR色材1:下述結構的化合物(近紅外線吸收顏料) [化學式47] The details of the materials described in the abbreviations in the above table are as follows. (Color material) PR254: CI Pigment Red 254 (diketopyrrolopyrrole compound, red pigment) PR272: CI Pigment Red 272 (diketopyrrolopyrrole compound, red pigment) PY139: CI Pigment Yellow 139 (isoindoline compound , yellow pigment) PG36: CI Pigment Green 36 (phthalocyanine compound, green pigment) PG58: CI Pigment Green 58 (phthalocyanine compound, green pigment) PB15:6: CI Pigment Blue 15:6 (phthalocyanine compound, blue pigment ) PV23: CI Pigment Violet 23 (two 㗁𠯤 compound, purple pigment) PBk32: CI Pigment Black 32 (perylene compound, organic black pigment) IR color material 1: Compound with the following structure (near infrared absorbing pigment) [Chemical formula 47]
衍生物1~3:下述結構的化合物(顏料衍生物) [化學式48] Derivatives 1 to 3: Compounds of the following structures (pigment derivatives) [Chemical formula 48]
(樹脂) P1~P188、PP1~PP23、PP101~PP136、CP1、CP2、CP3:上述之樹脂 CP11:Plysurf A208F(DKS Co.Ltd.製、具有磷酸基(pKa=約2)之樹脂、末端酸型) CP12:Plysurf H-3606(DKS Co.Ltd.製、具有羧基(pKa=約4.5)之樹脂、末端酸型) CP13:下述結構的樹脂(具有磺基(pKa=約2)之樹脂、末端酸型) [化學式49] (Resin) P1-P188, PP1-PP23, PP101-PP136, CP1, CP2, CP3: the above-mentioned resin CP11: Plysurf A208F (manufactured by DKS Co. Ltd., resin having a phosphate group (pKa = about 2), terminal acid type) CP12: Plysurf H-3606 (manufactured by DKS Co. Ltd., resin with carboxyl group (pKa = about 4.5), terminal acid type) CP13: resin with the following structure (resin with sulfo group (pKa = about 2) , terminal acid type) [Chemical formula 49]
(溶劑) 溶劑1:丙二醇單甲醚乙酸酯 溶劑2:環戊酮 溶劑3:1-甲氧基-2-丙醇 (solvent) Solvent 1: Propylene Glycol Monomethyl Ether Acetate Solvent 2: Cyclopentanone Solvent 3: 1-methoxy-2-propanol
<樹脂組成物的製造> 將各原材料以以下所示之配方1~7的比率進行混合,藉由孔徑0.45μm的尼龍製過濾器(NIHON PALL Corporation製)進行過濾,從而製造了各樹脂組成物。下述表中,將樹脂組成物的總固體成分中的色材的含量的值記載於“色材的含量”的一欄中。 <Manufacture of resin composition> Each raw material was mixed at the ratio of formulations 1 to 7 shown below, and filtered through a nylon filter (manufactured by NIHON PALL Corporation) with a pore size of 0.45 μm to manufacture each resin composition. In the following tables, the value of the content of the coloring material in the total solid content of the resin composition is described in the column of "content of the coloring material".
(配方1) 下述表中所記載之顏料分散液……520質量份 聚合性化合物1……6.6質量份 聚合性化合物2……12.6質量份 樹脂溶液1……3質量份 光聚合起始劑1……5質量份 界面活性劑1……0.1質量份 熱硬化劑1……2質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (Recipe 1) Pigment dispersion described in the following table...520 parts by mass Polymeric compound 1...6.6 parts by mass Polymeric compound 2...12.6 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...5 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1...2 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方2) 下述表中所記載之顏料分散液……566.4質量份 聚合性化合物1……6.6質量份 聚合性化合物2……6.1質量份 樹脂溶液1……3質量份 光聚合起始劑1……5質量份 界面活性劑1……0.1質量份 熱硬化劑1……2質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (Recipe 2) Pigment dispersions listed in the following table...566.4 parts by mass Polymeric compound 1...6.6 parts by mass Polymeric compound 2...6.1 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...5 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1...2 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方3) 下述表中所記載之顏料分散液……603.6質量份 聚合性化合物1……6.6質量份 聚合性化合物2……1.9質量份 樹脂溶液1……3質量份 光聚合起始劑1……4質量份 界面活性劑1……0.1質量份 熱硬化劑1……2質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (recipe 3) The pigment dispersion liquid recorded in the following table...603.6 parts by mass Polymeric compound 1...6.6 parts by mass Polymeric compound 2...1.9 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...4 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1...2 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方4) 下述表中所記載之顏料分散液……650質量份 聚合性化合物1……6.6質量份 聚合性化合物2……1.4質量份 樹脂溶液1……3質量份 光聚合起始劑1……5質量份 界面活性劑1……0.1質量份 熱硬化劑1……2質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (Recipe 4) Pigment dispersion described in the following table...650 parts by mass Polymeric compound 1...6.6 parts by mass Polymeric compound 2...1.4 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...5 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1...2 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方5) 下述表中所記載之顏料分散液……566.4質量份 聚合性化合物1……3.9質量份 聚合性化合物2……15.9質量份 樹脂溶液1……3質量份 光聚合起始劑1……5質量份 界面活性劑1……0.1質量份 熱硬化劑1……1質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (Recipe 5) Pigment dispersions listed in the following table...566.4 parts by mass Polymeric compound 1...3.9 parts by mass Polymeric compound 2...15.9 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...5 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1……1 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方6) 下述表中所記載之顏料分散液……371.4質量份 染料1……21質量份 聚合性化合物1……6.6質量份 聚合性化合物2……12.4質量份 樹脂溶液1……3質量份 光聚合起始劑1……5質量份 界面活性劑1……0.1質量份 熱硬化劑1……2質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (Recipe 6) Pigment dispersions listed in the following table... 371.4 parts by mass Dye 1...21 parts by mass Polymeric compound 1...6.6 parts by mass Polymeric compound 2...12.4 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...5 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1...2 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方7) 下述表中所記載之顏料分散液……566.4質量份 聚合性化合物1……3.9質量份 聚合性化合物2……5.7質量份 樹脂溶液1……3質量份 光聚合起始劑1……3質量份 界面活性劑1……0.1質量份 熱硬化劑1……1質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (Recipe 7) Pigment dispersions listed in the following table...566.4 parts by mass Polymeric compound 1...3.9 parts by mass Polymeric compound 2...5.7 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...3 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1……1 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方8) 下述表中所記載之顏料分散液……696.4質量份 聚合性化合物1……3.9質量份 聚合性化合物2……1.1質量份 樹脂溶液1……3質量份 光聚合起始劑1……3質量份 界面活性劑1……0.1質量份 熱硬化劑1……1質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (Recipe 8) The pigment dispersion liquid recorded in the following table... 696.4 parts by mass Polymeric compound 1...3.9 parts by mass Polymeric compound 2...1.1 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...3 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1……1 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
(配方9) 下述表中所記載之顏料分散液……464.3質量份 聚合性化合物1……6.6質量份 聚合性化合物2……12.6質量份 樹脂溶液1……3質量份 光聚合起始劑1……5質量份 界面活性劑1……0.1質量份 熱硬化劑1……2質量份 溶劑1……200質量份 溶劑2……100質量份 溶劑3……21.96質量份 (recipe 9) The pigment dispersion liquid recorded in the following table... 464.3 parts by mass Polymeric compound 1...6.6 parts by mass Polymeric compound 2...12.6 parts by mass Resin solution 1...3 parts by mass Photopolymerization initiator 1...5 parts by mass Surfactant 1...0.1 parts by mass Thermosetting agent 1...2 parts by mass Solvent 1...200 parts by mass Solvent 2...100 parts by mass Solvent 3...21.96 parts by mass
染料1:下述結構的化合物(m=3、n=3、重量平均分子量7000) [化學式50] 聚合性化合物1:KAYARAD DPHA(Nippon Kayaku Co.,LTD.製) 聚合性化合物2:KAYARAD RP-1040(Nippon Kayaku Co.,Ltd.製) 樹脂溶液1:下述結構的樹脂(重量平均分子量9000、附註於重複單元之數值為質量比)的30質量%丙二醇單甲醚乙酸酯溶液 [化學式51] 光聚合起始劑1:Irgacure OXE01(BASF公司製、肟化合物) 界面活性劑1:KF6001(Shin-Etsu Chemical Co.,Ltd.製、聚矽氧系界面活性劑) 熱硬化劑1:下述結構的化合物T-1 [化學式52] 溶劑1:丙二醇單甲醚乙酸酯 溶劑2:環戊酮 溶劑3:1-甲氧基-2-丙醇 Dye 1: a compound of the following structure (m=3, n=3, weight average molecular weight 7000) [chemical formula 50] Polymeric compound 1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) Polymerizable compound 2: KAYARAD RP-1040 (manufactured by Nippon Kayaku Co., Ltd.) Resin solution 1: Resin with the following structure (weight average molecular weight 9000 , the value attached to the repeating unit is the mass ratio) of 30% by mass propylene glycol monomethyl ether acetate solution [chemical formula 51] Photopolymerization initiator 1: Irgacure OXE01 (manufactured by BASF, oxime compound) Surfactant 1: KF6001 (manufactured by Shin-Etsu Chemical Co., Ltd., silicone-based surfactant) Thermosetting agent 1: the following Structure of Compound T-1 [Chemical Formula 52] Solvent 1: Propylene glycol monomethyl ether acetate Solvent 2: Cyclopentanone Solvent 3: 1-methoxy-2-propanol
<性能評價> (顏色不均勻) 藉由旋塗法,將基底層形成用組成物(CT-4000、FUJIFILM Electronic Materials Co.,LTD.製)塗佈於玻璃基板上,以使膜厚成為0.1μm,並使用加熱板在220℃下加熱1小時形成了基底層。藉由旋塗法將各樹脂組成物塗佈於附該基底層之玻璃基板上,之後使用加熱板在100℃下加熱2分鐘,從而得到了膜厚0.5μm的組成物層。使用i射線步進機曝光裝置FPA-3000i5+(Canon Inc.製),以500mJ/cm 2的曝光量對該組成物層照射365nm的波長的光進行了曝光。使用氫氧化四甲基銨的0.3質量%水溶液,在23℃下對曝光後的組成物層進行了60秒鐘的旋覆浸沒顯影。然後,藉由旋轉噴淋並使用水進行沖洗,進而用純水進行了水洗。然後,用高壓空氣吹散水滴,使玻璃基板進行自然乾燥之後,使用加熱板在220℃下進行300秒鐘後烘烤,從而形成了膜。使用形成有該膜之玻璃基板(評價用基板)並藉由下述方法解析亮度分布,以平均中的任一個為±10%以上之像素數為基礎進行了顏色不均勻的評價。 對亮度分佈的測量方法進行說明。將評價用基板設置於光學顯微鏡的觀測透鏡與光源之間並朝向觀測透鏡照射光,使用設置有數位相機之光學顯微鏡MX-50(Olympus Corporation製)觀察了其光透射狀態。對任意選擇之5個區域進行了膜表面的攝影。以0~255為止的256階調的濃度分佈將攝影圖像的亮度進行數值化而保存。從該圖像解析亮度分佈,藉由與平均的偏差超過±10%之像素數量評價了顏色不均勻。評價基準為如下。若評價為A~C,則判斷為實用上沒有問題。 A:與平均的偏差超過±10%之像素數量為1000以下。 B:與平均的偏差超過±10%之像素數量超過1000且為3000以下。 C:與平均的偏差超過±10%之像素數量超過3000且為5000以下。 D:與平均的偏差超過±10%之像素數量超過5000。 <Performance evaluation> (uneven color) A composition for forming an underlayer (CT-4000, manufactured by FUJIFILM Electronic Materials Co., LTD.) was applied on a glass substrate by spin coating so that the film thickness became 0.1 μm, and heated at 220° C. for 1 hour using a hot plate to form a base layer. Each resin composition was coated on the glass substrate with the base layer by spin coating, and then heated at 100° C. for 2 minutes using a hot plate to obtain a composition layer with a film thickness of 0.5 μm. The composition layer was exposed to light having a wavelength of 365 nm at an exposure amount of 500 mJ/cm 2 using an i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.). The composition layer after exposure was subjected to spin-on-immersion development at 23° C. for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide. Then, it rinsed with water by a spin shower, and further rinsed with pure water. Then, water droplets were blown off with high-pressure air, and after the glass substrate was naturally dried, post-baking was performed at 220° C. for 300 seconds using a hot plate to form a film. Using the glass substrate (evaluation substrate) on which the film was formed, the luminance distribution was analyzed by the following method, and color unevenness was evaluated based on the number of pixels whose average was ±10% or more. The measurement method of the luminance distribution will be described. The substrate for evaluation was placed between the observation lens of the optical microscope and the light source, and light was irradiated toward the observation lens, and the light transmission state thereof was observed using an optical microscope MX-50 (manufactured by Olympus Corporation) equipped with a digital camera. Photographs of the film surface were performed on 5 randomly selected regions. The brightness of the photographed image is digitized and stored in a density distribution of 256 tones ranging from 0 to 255. The luminance distribution was analyzed from the image, and color unevenness was evaluated by the number of pixels whose deviation from the average exceeded ±10%. The evaluation criteria are as follows. When the evaluations were A to C, it was judged that there was no practical problem. A: The number of pixels whose deviation from the average exceeds ±10% is 1000 or less. B: The number of pixels whose deviation from the average exceeds ±10% exceeds 1000 and is 3000 or less. C: The number of pixels whose deviation from the average exceeds ±10% exceeds 3000 and is 5000 or less. D: The number of pixels whose deviation from the average exceeds ±10% exceeds 5,000.
(粗大粒子) 使用旋轉塗佈機將基底層形成用組成物(CT-4000、FUJIFILM Electronic Materials Co.,Ltd.製)塗佈於玻璃基板上,以使後烘烤後厚度成為0.1μm,並且使用加熱板在220℃下加熱300秒鐘來形成基底層,從而獲得了附基底層之玻璃基板(支撐體)。藉由旋塗法將各樹脂組成物塗佈於附該基底層之玻璃基板上,之後使用加熱板在100℃下加熱2分鐘,從而形成了膜厚0.5μm的層。用異物評價裝置Conplus III(Applied Materials, Inc.製)檢測該膜中所包含之異物,用肉眼觀察從所檢測之所有異物分類最大寬度1.0μm以上的異物(粗大粒子)的個數,計算了經分類之最大寬度1.0μm以上的粗大粒子的個數(每1cm 2的粗大粒子的個數)。 A:每1cm 2膜的粗大粒子的個數小於10個 B:每1cm 2膜的粗大粒子的個數為10個以上且小於30個 C:每1cm 2膜的粗大粒子的個數為30個以上且小於100個 D:每1cm 2膜的粗大粒子的個數為100個以上 (Coarse particles) A composition for forming a base layer (CT-4000, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was coated on a glass substrate using a spin coater so that the thickness after post-baking became 0.1 μm, and The base layer was formed by heating at 220° C. for 300 seconds using a hot plate to obtain a glass substrate (support) with the base layer. Each resin composition was coated on the glass substrate with the base layer by spin coating, and then heated at 100° C. for 2 minutes using a hot plate to form a layer with a film thickness of 0.5 μm. The foreign matter contained in the film was detected with a foreign matter evaluation device Conplus III (manufactured by Applied Materials, Inc.), and the number of foreign matter (coarse particles) with a maximum width of 1.0 μm or more was classified from all detected foreign matter with the naked eye, and calculated. The number of classified coarse particles with a maximum width of 1.0 μm or more (the number of coarse particles per 1 cm 2 ). A: The number of coarse particles per 1 cm 2 of the film is less than 10 B: The number of coarse particles per 1 cm 2 of the film is 10 or more and less than 30 C: The number of coarse particles per 1 cm 2 of the film is 30 More than and less than 100 D: The number of coarse particles per 1 cm 2 of the film is 100 or more
(顯影性) 使用旋轉塗佈機將基底層形成用組成物(CT-4000、FUJIFILM Electronic Materials Co.,Ltd.製)塗佈於8英吋(20.32cm)矽晶圓上,以使後烘烤後厚度成為0.1μm,並且使用加熱板在220℃下加熱300秒鐘來形成基底層,從而獲得了附基底層之矽晶圓(支撐體)。接著,藉由旋塗法塗佈各樹脂組成物以使後烘烤後的膜厚成為0.62μm。接著,使用加熱板,在100℃下加熱了2分鐘。接著,使用i射線步進機曝光裝置FPA-3000i5+(Canon Inc.製),以1000mJ/cm 2的曝光量隔著1.0μm四方的點圖案的遮罩曝光了365nm的波長的光。接著,將形成有曝光之塗佈膜之矽晶圓載置於旋轉・噴淋顯影機(DW-30型、CHEMITRONICS CO.,Ltd.製)的水平轉台上,使用CD-2000(FUJIFILM Electronic Materials Co.,Ltd.製)的60%稀釋液在23℃下進行60秒鐘旋覆浸沒顯影之後,以真空吸盤方式將矽晶圓固定於水平轉台,藉由旋轉裝置以轉速50rpm旋轉矽晶圓的同時由其旋轉中心的上方從噴出噴嘴以噴淋狀供給純水並且進行沖洗處理,之後進行了噴塗乾燥。此外,使用200℃的加熱板進行300秒鐘的加熱處理(後烘烤),從而形成了圖案(像素)。 關於形成有像素之矽晶圓,藉由掃描型電子顯微鏡(SEM)(倍率10000倍)進行觀察,並且依據下述評價基準評價了顯影性。 A:在像素的形成區域外(未曝光部分)完全確認不到殘渣 B:在像素的形成區域外(未曝光部分)極少確認到殘渣,但實用上沒有問題之程度 C:在像素的形成區域外(未曝光部分)稍微確認到殘渣,但實用上沒有問題之程度 D:在像素的形成區域外(未曝光部分)顯著確認到殘渣 (Development) The composition for forming the base layer (CT-4000, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was coated on an 8-inch (20.32 cm) silicon wafer using a spin coater to allow post-baking After baking, the thickness was 0.1 μm, and a base layer was formed by heating at 220° C. for 300 seconds using a hot plate, thereby obtaining a silicon wafer (support body) with a base layer. Next, each resin composition was applied by spin coating so that the film thickness after post-baking would be 0.62 μm. Next, using a hot plate, it heated at 100 degreeC for 2 minutes. Next, using an i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.), exposure was performed at an exposure dose of 1000 mJ/cm 2 through a mask of a 1.0 μm square dot pattern to light having a wavelength of 365 nm. Next, the silicon wafer on which the exposed coating film was formed was placed on the horizontal turntable of a spin-shower developing machine (DW-30 type, manufactured by CHEMITRONICS CO., Ltd.), using a CD-2000 (FUJIFILM Electronic Materials Co., Ltd. ., Ltd.) was developed at 23°C for 60 seconds by spin-coating and immersion development, and the silicon wafer was fixed on the horizontal turntable by a vacuum chuck, and the silicon wafer was rotated at a speed of 50rpm by a rotating device. Simultaneously, pure water is supplied from the spray nozzle above the center of rotation, rinsed, and then sprayed and dried. In addition, a heat treatment (post-baking) was performed for 300 seconds using a hot plate at 200° C. to form a pattern (pixel). The silicon wafer on which the pixels were formed was observed with a scanning electron microscope (SEM) (magnification: 10,000 times), and the developability was evaluated according to the following evaluation criteria. A: There is no residue at all outside the pixel forming area (unexposed part) B: Slightly found residue outside the pixel forming area (unexposed part), but practically no problem C: In the pixel forming area Residue is slightly confirmed outside (unexposed part), but there is no practical problem D: Residue is remarkably confirmed outside the formation area of the pixel (unexposed part)
(經時穩定性)
藉由TOKI SANGYO CO.,LTD.製“RE-85L”分別測量了實施例及比較例的樹脂組成物的黏度(mPa・s)。上述測量之後,在45℃、遮光、5天的條件下靜置樹脂組成物,再次測量了黏度(mPa・s)。從上述靜置前後的黏度差(ΔVis)依據下述評價基準評價了經時穩定性。可以說,黏度差(ΔVis)的數值愈小,樹脂組成物的經時穩定性愈良好。上述黏度測量均在將溫濕度分別控制在22±5℃、60±20%之實驗室中將樹脂組成物的溫度調節為25℃之狀態下進行了測量。所有測量均進行3次測量,使用了平均值。
A:Δvis為0.2mPa・s以下
B:Δvis超過0.2mPa・s且0.3mPa・s以下
C:Δvis超過0.3mPa・s且0.5mPa・s以下
D:Δvis超過0.5mPa・s
[表21]
如上述表所示,實施例的樹脂組成物能夠形成抑制顏色不均勻之膜。As shown in the above table, the resin compositions of Examples can form a film in which color unevenness is suppressed.
由實施例中所記載之樹脂組成物獲得之膜能夠較佳地用於濾光器、固體攝像元件、圖像顯示裝置。Films obtained from the resin compositions described in Examples can be suitably used for optical filters, solid-state imaging devices, and image display devices.
實施例43中,即使在將聚合性化合物2變更為以下所示之結構的化合物M-2或M-3之情況下,亦可獲得同樣的效果。 [化學式53] In Example 43, even when the polymerizable compound 2 was changed to the compound M-2 or M-3 of the structure shown below, the same effect was acquired. [chemical formula 53]
實施例43中,即使在將光聚合起始劑1變更為以下所示之結構的化合物I-2~I-5之情況下,亦可獲得同樣的效果。 [化學式54] In Example 43, even when the photopolymerization initiator 1 was changed to compounds I-2 to I-5 of the structures shown below, the same effect was obtained. [chemical formula 54]
實施例43中,即使在將熱硬化劑1變更為以下所示之結構的化合物T-2或T-3之情況下,亦可獲得同樣的效果。 [化學式55] In Example 43, even when the thermosetting agent 1 was changed to compound T-2 or T-3 of the structure shown below, the same effect was acquired. [chemical formula 55]
實施例43中,即使在將界面活性劑1變更為以下所示之結構的化合物(重量平均分子量14,000、表示重複單元的比例之%的數值為莫耳%之氟系界面活性劑)或PolyFox PF6320(OMNOVA SOLUTIONS INC. SOLUTIONS INC.製、氟系界面活性劑)之情況下,亦可獲得同樣的效果。 [化學式56] In Example 43, even when the surfactant 1 was changed to the compound shown below (a fluorine-based surfactant with a weight average molecular weight of 14,000, and the % representing the ratio of repeating units is molar %) or PolyFox PF6320 (OMNOVA SOLUTIONS INC. SOLUTIONS INC., fluorine-based surfactant), the same effect can be obtained. [chemical formula 56]
即使將實施例1的PG36置換成C.I.顏料綠7、C.I.顏料綠58或C.I.顏料綠59,亦可獲得同樣的結果。Even if PG36 in Example 1 was replaced with C.I. Pigment Green 7, C.I. Pigment Green 58 or C.I. Pigment Green 59, the same result could be obtained.
<影像感測器的製造例> [隔壁用組成物的製造] 混合各成分以使成為以下表的組成之後,藉由過濾用過濾器(Protego Plus PRL00S1S1、Entegris製)進行過濾之後,進而藉由過濾用過濾器(DFA4201J006、Pall製)進行過濾,獲得了隔壁用組成物。下述表中所記載之摻合量的數值為質量份。又,二氧化矽粒子液的摻合量為二氧化矽粒子液中的SiO 2的值。溶劑的摻合量的數值為合計二氧化矽粒子液中所包含之溶劑量之數值。 <Manufacture example of image sensor> [Manufacture of partition wall composition] After mixing the components to obtain the composition shown in the table below, filter with a filter for filtration (Protego Plus PRL00S1S1, manufactured by Entegris), and then filter with Filtration was performed with a filter (DFA4201J006, manufactured by Pall) to obtain a composition for partition walls. The numerical value of the compounding quantity described in the following table|surface is a mass part. In addition, the blending amount of the silica particle liquid is the value of SiO 2 in the silica particle liquid. The numerical value of the blending amount of the solvent is the numerical value of the total amount of the solvent contained in the silica particle liquid.
[表31]
記載於上述表之原料如下。 (二氧化矽粒子液) P1:平均粒徑10nm的球狀二氧化矽的複數個為藉由含金屬氧化物之二氧化矽(連結材)連接成數珠狀之形狀的二氧化矽粒子(數珠狀二氧化矽)的溶液。 P2:Thrylya 4110:JGC Catalysts and Chemicals Ltd.製、平均粒徑60nm的二氧化矽粒子(中空結構的二氧化矽粒子)的溶液。SiO 2換算的固體成分濃度20質量% The raw materials described in the above table are as follows. (Silicon dioxide particle liquid) P1: A plurality of spherical silica particles with an average particle diameter of 10nm are silica particles (number of beads) connected in a bead-like shape by silica containing metal oxides (bonding material) beaded silica). P2: Thrylya 4110: JGC Catalysts and Chemicals Ltd. solution of silica particles (hollow-structure silica particles) having an average particle diameter of 60 nm. SiO 2 equivalent solid content concentration 20% by mass
(界面活性劑) F1:下述結構的化合物(重量平均分子量=3000) [化學式57] F2:Silwet L-7220(Momentive Performance Materials Inc.製) F3:PIONIN B-111(Takemoto Oil & Fat Co.,Ltd.製、月桂基三甲基銨氯化物) (Surfactant) F1: A compound of the following structure (weight average molecular weight=3000) [Chemical formula 57] F2: Silwet L-7220 (manufactured by Momentive Performance Materials Inc.) F3: PIONIN B-111 (manufactured by Takemoto Oil & Fat Co., Ltd., lauryltrimethylammonium chloride)
(添加劑) A1:NOD-N(Shin-Nakamura Chemical Co.,Ltd.製、下述結構的化合物) [化學式58] (Additive) A1: NOD-N (manufactured by Shin-Nakamura Chemical Co., Ltd., compound of the following structure) [Chemical formula 58]
(溶劑) S1:1,4-丁二醇二乙酸酯 S2:丙二醇單甲醚乙酸酯 S3:丙二醇單甲基醚 S4:乙醇 S5:水 (solvent) S1: 1,4-Butanediol diacetate S2: Propylene glycol monomethyl ether acetate S3: Propylene Glycol Monomethyl Ether S4: ethanol S5: water
[影像感測器的製造] 在矽晶圓上使用利用在上述中製造之隔壁用組成物在上述中製造之隔壁用組成物製作了日本特開2017-028241號公報的圖1的隔壁40~43。 接著,分別在被矽晶圓上的隔壁劃分之區域,使用綠色像素形成用組成物、紅色像素形成用組成物及藍色像素形成用組成物並且藉由光微影法進行圖案形成來形成綠色像素、紅色像素及藍色像素,製造了影像感測器。所獲得之影像感測器的靈敏度優異。 再者,綠色像素形成用組成物中使用了實施例1的樹脂組成物。又,紅色像素形成用組成物中使用了實施例70的樹脂組成物。又,藍色像素形成用組成物中使用了實施例76的樹脂組成物。 [Manufacturing of image sensors] The partition walls 40 to 43 in FIG. 1 of JP-A-2017-028241 were produced on a silicon wafer using the composition for partition walls produced above using the composition for partition walls produced above. Next, the green pixel-forming composition, the red pixel-forming composition, and the blue pixel-forming composition are used to form patterns by photolithography in the regions partitioned by the partition walls on the silicon wafer to form green pixel, red pixel, and blue pixel to make an image sensor. The resulting image sensor is excellent in sensitivity. In addition, the resin composition of Example 1 was used for the composition for green pixel formation. Also, the resin composition of Example 70 was used for the composition for forming a red pixel. Also, the resin composition of Example 76 was used for the composition for forming a blue pixel.
各隔壁用組成物的製造中,在代替Protego Plus PRL00S1S1(Entegris製)使用IonKleen SL(Pall製)作為過濾用過濾器進行過濾之情況下,亦可獲得與上述同樣的效果。In the production of each partition wall composition, the same effect as above was also obtained when filtering was performed using IonKleen SL (manufactured by Pall) instead of Protego Plus PRL00S1S1 (manufactured by Entegris) as a filter for filtration.
無。none.
Claims (16)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-014848 | 2021-02-02 | ||
JP2021014848 | 2021-02-02 | ||
JP2021-112705 | 2021-07-07 | ||
JP2021112705 | 2021-07-07 | ||
JP2021205760 | 2021-12-20 | ||
JP2021-205760 | 2021-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202237761A true TW202237761A (en) | 2022-10-01 |
Family
ID=82741542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111104022A TW202237761A (en) | 2021-02-02 | 2022-01-28 | Resin composition, film, optical filter, solid-state imaging element and image display device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022168743A1 (en) |
KR (1) | KR20230112139A (en) |
TW (1) | TW202237761A (en) |
WO (1) | WO2022168743A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240091054A (en) * | 2021-12-24 | 2024-06-21 | 후지필름 가부시키가이샤 | Resin compositions, membranes, optical filters, solid-state imaging devices and image display devices |
CN118151490B (en) * | 2024-05-09 | 2024-08-13 | 湖南初源新材料股份有限公司 | Photosensitive resin composition, photosensitive dry film and application thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5255807B2 (en) | 2007-09-28 | 2013-08-07 | 富士フイルム株式会社 | Pigment dispersion composition and photocurable composition dispersion for color filter obtained thereby |
JP5371449B2 (en) * | 2008-01-31 | 2013-12-18 | 富士フイルム株式会社 | Resin, pigment dispersion, colored curable composition, color filter using the same, and method for producing the same |
JP5535699B2 (en) * | 2010-03-12 | 2014-07-02 | 富士フイルム株式会社 | Pigment dispersion, ink composition using the same, and printed matter |
JP6082705B2 (en) * | 2014-01-31 | 2017-02-15 | 富士フイルム株式会社 | Coloring composition, cured film using the same, color filter, pattern forming method, color filter manufacturing method, solid-state imaging device, and image display device |
EP3202855A4 (en) * | 2014-10-03 | 2017-08-30 | FUJIFILM Corporation | Near-infrared absorbing composition, curable composition, cured film, near-infrared blocking filter, solid-state imaging element, infrared sensor, camera module, processed dye and method for producing processed dye |
-
2022
- 2022-01-28 KR KR1020237021311A patent/KR20230112139A/en unknown
- 2022-01-28 WO PCT/JP2022/003238 patent/WO2022168743A1/en active Application Filing
- 2022-01-28 JP JP2022579505A patent/JPWO2022168743A1/ja active Pending
- 2022-01-28 TW TW111104022A patent/TW202237761A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2022168743A1 (en) | 2022-08-11 |
KR20230112139A (en) | 2023-07-26 |
WO2022168743A1 (en) | 2022-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW202237761A (en) | Resin composition, film, optical filter, solid-state imaging element and image display device | |
TW202307142A (en) | Coloring composition, film, optical filter, solid-state imaging device, image display device, and dye multimer | |
TW202231790A (en) | Colored composition, film, optical filter, solid imaging element, image display device, and compound | |
JP2024124473A (en) | Compound | |
WO2022019253A1 (en) | Resin composition, film, optical filter, solid-state image sensor, image display device, resin, and compound | |
TW202400666A (en) | Resin composition, film, optical filter, solid-state imaging element, and image display device | |
TW202323314A (en) | Colored curable composition, method for producing cured product, film, optical element, image sensor, solid-state imaging element, image display device, and radical polymerization initiator | |
TW202231789A (en) | Coloring composition, film, optical filter, solid-state imaging element, image display device, and compound | |
TW202302703A (en) | Resin composition, film, optical filter, solid-state imaging element, and image display device | |
TW202248368A (en) | Colored composition, method for producing film, method for producing color filter, method for producing solid imaging element, and method for producing image display device | |
JP2022119701A (en) | Photosensitive composition, method for producing photosensitive composition, film, optical filter, solid state image sensor and image display device | |
TW202330802A (en) | Resin composition, film, optical filter, solid imaging element, and image display device | |
TW202309168A (en) | Composition, film, optical filter, optical sensor, and image display device | |
TW202337923A (en) | Coloring composition, film, optical filter, solid-state imaging element, and image display device | |
TW202311300A (en) | Colored composition, film, optical filter, solid imaging element, image display device, and compound | |
TW202202577A (en) | Coloring composition, film, color filter, solid-state imaging element, and image display device | |
TW202336118A (en) | Coloring composition, film, optical filter, solid-state imaging element and image display device | |
TW202244137A (en) | Resin composition, film, optical filter, solid-state imaging element, image display device, resin, and method for producing resin | |
TW202311251A (en) | Coloring composition, film, optical filter, solid-state imaging element, image display device, and compound | |
TW202338012A (en) | Coloring composition, film, optical filter, solid-state imaging element and image display device | |
WO2022019255A1 (en) | Resin composition, film, optical filter, solid-state imaging element, image display device and resin | |
TW202406947A (en) | Photosensitive composition, film, optical filter, solid-state imaging element and image display device | |
WO2022064904A1 (en) | Coloring composition, cured film, structure body, color filter, and display device | |
TW202336042A (en) | Resin composition, film, optical filter, solid-state imaging element, and image display device | |
WO2022080046A1 (en) | Coloring composition, film, color filter, optical sensor, and display device |