TW202330802A - Resin composition, film, optical filter, solid imaging element, and image display device - Google Patents

Abstract

A resin composition comprising a colorant A and a resin B, wherein the colorant A comprises a pigment and the resin B comprises a random copolymer b1 comprising a repeating unit b-1 containing an acid group, a repeating unit b-2 containing a basic group, and a repeating unit b-3 including a polyalkyleneoxy structure; a film; an optical filter; a solid imaging element; and an image display device.

Description

Resin composition, film, optical filter, solid-state imaging device, and image display device

The invention relates to a resin composition containing color material. Also, the present invention relates to a film using a resin composition, an optical filter, a solid-state imaging device, and an image display device.

Manufacture of optical filters such as color filters using resin compositions containing coloring materials.

Also, Patent Document 1 describes an invention related to a pigment colorant composition, which is an oily pigment dispersion containing a pigment, a liquid medium, and a polymer dispersant, wherein, (1) The polymer dispersant is an anionic cationic AB block copolymer composed of more than 90% by mass of methacrylate monomers, composed of anionic A blocks and cationic B blocks, (2) The A block is composed of at least methacrylic acid, the acid value is 10-150 mgKOH/g and the number average molecular weight of the polymer block of A is 3000-20000, (3) The B block is composed of a methacrylate monomer having at least an amine group, the amine value is 50-400mgKOH/g and the average molecular weight of the B polymer block is 500-8000, A-B block copolymerization The content of the B block in the product is 5 to 50% by mass, (4) The degree of dispersion (weight average weight/number average molecular weight) representing the molecular weight distribution of the A-B block copolymer is 1.6 or less.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2013-203887

In recent years, there has been a strong demand for miniaturization and thinning of solid-state imaging devices. Therefore, in recent years, films including color materials such as color filters used in solid-state imaging devices are also required to be thinner. In order to achieve thinning while maintaining the desired spectral performance, it is necessary to increase the concentration of the coloring material in the resin composition used for film formation.

However, in the case of using a pigment-containing material as a color material, if the color material concentration of the resin composition is increased, the ratio of the material that can be adsorbed to the pigment such as resin is relatively reduced, so the pigment is likely to aggregate during the storage of the resin composition. tendency. For this reason, defects due to aggregates of pigments and the like may occur in films obtained using the resin composition.

Also, according to the studies of the present inventors, it is known that the block polymer containing the anionic A block and the cationic B block disclosed in Patent Document 1 tends to aggregate during the storage of the resin composition and is easy to be obtained after being obtained. defects in the film. It is presumed that such block polymers are biased toward ionic sites by acid-base interaction, and aggregates are easily aggregated by such biased ionic sites, resulting in aggregates in which the block polymers are firmly aggregated. Therefore, defects are easily generated in the obtained film.

Therefore, the object of this invention is to provide the resin composition which can form the film which suppresses generation|occurrence|production of a defect. Also, the present invention provides a film, an optical filter, a solid-state imaging device, and an image display device.

According to the studies of the present inventors, it was found that the above objects can be achieved by a resin composition described later, and the present invention has been accomplished. Accordingly, the present invention provides the following.

<1> A resin composition containing a color material A and a resin B, wherein, The above-mentioned color material A comprises a pigment, The above-mentioned resin B includes a random copolymer b1, and the random copolymer b1 includes a repeating unit b-1 containing an acid group, a repeating unit b-2 containing a base, and a repeating unit b-3 containing a polyalkylene oxide structure . <2> The resin composition as described in <1>, wherein The ratio of the acid value to the base value of the random copolymer b1 is 0.2-20. <3> The resin composition as described in <1> or <2>, wherein The molecular weight of the repeating unit b-3 is 350-1500. <4> The resin composition according to any one of <1> to <3>, wherein The above-mentioned polyalkyleneoxy structure is a polyethyleneoxy structure. <5> The resin composition according to any one of <1> to <4>, wherein The acid value of the said random copolymer b1 is 40-120 mgKOH/g. <6> The resin composition according to any one of <1> to <5>, wherein The base value of the said random copolymer b1 is 40-120 mgKOH/g. <7> The resin composition according to any one of <1> to <6>, wherein The above-mentioned repeating unit b-2 is a repeating unit derived from a compound whose conjugate acid has a pKa of 9.5 or more. <8> The resin composition according to any one of <1> to <7>, wherein The above-mentioned random copolymer b1 also contains repeating unit b-4 having a functional group X, and the aforementioned functional group X is selected from a group containing two or more aromatic rings, a group containing a heterocyclic group, and a group containing a condensed ring. group. <9> The resin composition according to any one of <1> to <8>, wherein Content of the said random copolymer b1 in the said resin B is 1-30 mass %. <10> The resin composition according to any one of <1> to <9>, wherein Content of the said random copolymer b1 in the total solid content of the said resin composition is 1-10 mass %. <11> The resin composition according to any one of <1> to <10>, wherein The above-mentioned color material A contains a pigment derivative. <12> The resin composition according to any one of <1> to <11>, further comprising a polymerizable compound and a photopolymerization initiator. <13> A film obtained from the resin composition according to any one of <1> to <12>. <14> An optical filter comprising the film described in <13>. <15> A solid-state imaging device having the film according to <13>. <16> An image display device comprising the film according to <13>. [Invention effect]

According to the present invention, it is possible to provide a resin composition capable of forming a film that suppresses generation of defects. In addition, a film, an optical filter, a solid-state imaging device, and an image display device can be provided.

Hereinafter, the content of the present invention will be described in detail. In this specification, "-" is used in the meaning which includes the numerical value described before and after it as a lower limit and an upper limit. In the notation of a group (atomic group) in this specification, the notation indicating substituted and unsubstituted includes a group (atomic group) without a substituent, and also includes a group (atomic group) having a substituent. For example, "alkyl" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. In addition, examples of the light used for exposure include the bright line spectrum of a mercury lamp, extreme ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, electron beams, and other actinic rays or radiation. In this specification, "(meth)acrylate" means both or either of acrylate and methacrylate, and "(meth)acrylic acid" means both or either of acrylic acid and methacrylic acid, "(Meth)acryl" means both or either of acryl and methacryl. In this specification, Me in the structural formulas represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. In this specification, the weight average molecular weight and number average molecular weight are polystyrene conversion values measured by the GPC (gel permeation chromatography) method. In this specification, the total solid content refers to the total mass of components excluding solvents from all the components of the composition. In this specification, a pigment refers to a color material that is not easily soluble in a solvent. In this specification, the term "step" not only includes independent steps, but also includes in this term as long as the expected function of the step is achieved even if it cannot be clearly distinguished from other steps. .

＜Resin composition＞ The resin composition of the present invention is characterized in that it contains colorant A and resin B, wherein, The above-mentioned color material A comprises a pigment, The above-mentioned resin B includes a random copolymer b1, and the random copolymer b1 includes a repeating unit b-1 containing an acid group, a repeating unit b-2 containing a base, and a repeating unit b-3 containing a polyalkylene oxide structure .

According to the resin composition of the present invention, by containing the aforementioned random copolymer b1, it is possible to form a film in which the generation of defects is suppressed. The reason why such an effect is obtained can be presumed as follows. It can be speculated that the above-mentioned random copolymer b1 includes the repeating unit b-1 containing an acid group and the repeating unit b-2 containing a base, so the acid group or base contained in these repeating units interacts with the pigment and adsorbs on pigment. In addition, it is presumed that the above-mentioned random copolymer b1 further includes the repeating unit b-3 containing a polyalkoxyl structure, so the polyalkoxyl structure functions as a steric repulsive group, thereby being able to inhibit the interaction between pigments. Adsorption, and the ability to suppress defects caused by pigments. Also, it is presumed that the above-mentioned random copolymer b1 is a random copolymer comprising repeating unit b-1 containing an acid group, repeating unit b-2 containing a base, and repeating unit b-3 containing a polyalkyleneoxy structure. Copolymer, therefore, reversible acid-base interaction between random copolymers b1 or random copolymer b1 and other resins easily occurs in the resin composition, and a soft coagulated state is easily maintained. Therefore, it is presumed that during storage of the resin composition, the aggregation of the resin component can be suppressed and the occurrence of micro-sinking and the like can be suppressed. In addition, it is presumed that by including the repeating unit b-3 containing a polyalkyleneoxy structure in the random copolymer b1, the solubility in a solvent can also be improved, and the softening point can also be lowered. Therefore, even in the resin composition Microprecipitates originating from the random copolymer b1 are generated in the material, and are softened or dissolved by heating during film formation and enter into the film. For this reason, it is presumed that the use of the resin composition of the present invention can form a film in which the generation of defects is suppressed.

Moreover, when using the resin composition of this invention and forming a pattern by photolithography, generation|occurrence|production of image development residue can also be suppressed. The detailed reason for obtaining this effect is not clear, but it is presumed that the above-mentioned random copolymer b1 contains acid groups and bases, so it tends to be biased towards the substrate side of the film during film formation, and can suppress the development residue components such as coloring materials. Adsorbed to the substrate. Moreover, since the random copolymer b1 includes the repeating unit b-3 containing a polyalkyleneoxy structure, it also has good compatibility with a developing solution and is easy to remove during development. For this reason, the resin composition of the present invention can also suppress generation of image development residue.

The resin composition of the present invention can be preferably used as a resin composition for optical filters. As an optical filter, a color filter, a near-infrared ray transmission filter, a near-infrared ray cut filter, etc. are mentioned, A color filter is preferable. Moreover, the resin composition of this invention can be used suitably as the resin composition for solid-state imaging devices. More specifically, it can be preferably used as a resin composition for an optical filter used in a solid-state imaging device, and can be more preferably used as a resin composition for forming colored pixels of a color filter used in a solid-state imaging device.

As a color filter, the filter which has the colored pixel which transmits the light of a specific wavelength is mentioned. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels, among which red pixels are preferred. Colored pixels of the color filter can be formed using a resin composition containing a color material.

The maximum absorption wavelength of the near-infrared cut filter is preferably in a wavelength range of 700 to 1800 nm, more preferably in a wavelength range of 700 to 1300 nm, and still more preferably in a wavelength range of 700 to 1000 nm. In addition, the transmittance of the near-infrared cut filter is preferably 70% or more in the entire wavelength range of 400 to 650 nm, more preferably 80% or more, and still more preferably 90% or more. Also, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. In addition, the ratio of the absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter to the absorbance A550 at a wavelength of 550 nm (absorbance Amax/absorbance A550) is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. More preferably, 100-400 is especially preferable. The near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing color material.

The near-infrared transmission filter is a filter that transmits at least part of near-infrared rays. The near-infrared transmission filter is preferably a filter that blocks at least a part of visible light and transmits at least a part of near-infrared rays. As a near-infrared ray transmission filter, it is preferable to mention that the maximum value of transmittance in the range of wavelength 400-640nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the wavelength is 1100-640nm. Filters and the like having spectral characteristics in which the minimum transmittance in the range of 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more). The near-infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5). (1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (3): The maximum value of the transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1000 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (4): The maximum value of the transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1100 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (5): The maximum value of the transmittance in the wavelength range of 400-1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1200-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%).

The resin composition of the present invention can also be used for light-shielding films and the like.

It is preferable that the solid content concentration of the resin composition of this invention is 5-30 mass %. The lower limit is preferably at least 7.5% by mass, more preferably at least 10% by mass. The upper limit is preferably at most 25% by mass, more preferably at most 20% by mass, and still more preferably at most 15% by mass.

Hereinafter, each component used for the resin composition of this invention is demonstrated.

＜＜Color material A＞＞ The resin composition of the present invention contains the color material A (hereinafter referred to as color material). Examples of the color material include a white color material, a black color material, a colored color material, and a near-infrared absorption color material. Moreover, a pigment derivative can also be used for a color material. Furthermore, in the present invention, the white color material includes not only pure white, but also light gray color materials close to white (such as off-white, thin gray, etc.).

As the coloring material contained in the resin composition of the present invention, those containing pigments can be used. The pigment may be any of inorganic pigments and organic pigments, and organic pigments are preferred from the viewpoints of color change, ease of dispersion, and safety. Also, the pigment preferably contains at least one selected from color pigments and near-infrared absorbing pigments, and more preferably contains color pigments.

The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably at most 180 nm, more preferably at most 150 nm, and still more preferably at most 100 nm. When the average primary particle diameter of the pigment is within the above-mentioned range, the dispersion stability of the pigment in the resin composition will be favorable. Furthermore, in the present invention, the primary particle size of the pigment can be obtained by observing the primary particle of the pigment with a transmission electron microscope and obtaining the obtained photograph. Specifically, the projected area of the primary particle of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle diameter of the pigment. Moreover, the average primary particle diameter in this invention is made into the arithmetic mean value about the primary particle diameter of the primary particle of 400 pigments. In addition, the primary particle of the pigment refers to unaggregated independent particles.

The crystallite size of pigments and pigment derivatives is preferably from 0.1 to 50 nm, more preferably from 0.5 to 30 nm, and still more preferably from 1 to 15 nm. The crystallite size can be obtained from the half-value width of the peak value of the diffraction angle using an X-ray diffraction device, and can be calculated using the Scherrer formula. The crystallite size of pigments and pigment derivatives can be adjusted by known methods such as adjustment of production conditions and pulverization after production.

The specific surface area of the pigment and pigment derivative is preferably 1 to 300 m ² /g. The lower limit is preferably at least 10 m ² /g, more preferably at least 30 m ² /g. The upper limit is preferably at most 250 m ² /g, more preferably at most 200 m ² /g. The value of the specific surface area can be measured according to the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: determination of the specific surface area of solids by gas adsorption (measurement of the specific surface area of solids based on gas adsorption).

It is preferable that the coloring material contained in the resin composition of the present invention contains pigments and pigment derivatives. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton. The details of the pigment derivative will be described later. It is preferable that content of a pigment derivative is 1-50 mass parts with respect to 100 mass parts of pigments. The lower limit is preferably at least 2 parts by mass, more preferably at least 3 parts by mass. The upper limit is preferably 30 parts by mass or less, more preferably 20 parts by mass or less. Pigment derivatives may be used alone or in combination of two or more.

The coloring material contained in the resin composition of the present invention may also contain a dye. When a dye is contained, the content of the dye is preferably 10 to 100 parts by mass relative to 100 parts by mass of the pigment. The upper limit is preferably at most 80 parts by mass, more preferably at most 70 parts by mass. The lower limit is preferably at least 20 parts by mass, more preferably at least 30 parts by mass, and still more preferably at least 40 parts by mass. One type of dye may be used alone, or two or more types may be used in combination. Moreover, it is also preferable that the coloring material contained in the resin composition of this invention does not contain a dye substantially. According to this aspect, a film excellent in light resistance or heat resistance can be formed. Not containing a dye substantially means that the content of the dye in the color material is 0.1% by mass or less, preferably 0.01% by mass or less, and is more preferably not contained.

(color material) As a color material, the color material which has a maximum absorption wavelength in the wavelength range of 400-700 nm is mentioned. For example, a yellow color material, an orange color material, a red color material, a green color material, a purple color material, a blue color material, etc. are mentioned. From the viewpoint of heat resistance, the color material is preferably a pigment (color pigment), more preferably a red pigment, a yellow pigment, and a blue pigment, and even more preferably a red pigment and a blue pigment. As a specific example of a color pigment, what is shown below is mentioned, for example.

Examples of red coloring materials include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, methimine compounds, ketone compounds, quinacridone compounds, perylene compounds, and thioindigo compounds. A diketopyrrolopyrrole compound, an anthraquinone compound, and an azo compound are preferable, and a diketopyrrolopyrrole compound is more preferable. Also, it is preferable that the red color material is a pigment.

Specific examples of red color materials include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41 , 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1 , 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170 ,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246 , 254, 255, 264, 269, 270, 272, 279, 291, 294, 295, 296, 297 and other red pigments. In addition, as a red coloring material, diketopyrrolopyrrole compounds in which at least one bromine atom is substituted in the structure described in JP-A-2017-201384 and in paragraphs 0016 to 0022 of JP-A-6248838 can also be used. The diketopyrrolopyrrole compound described, the diketopyrrolopyrrole compound described in International Publication No. 2012/102399, the diketopyrrolopyrrole compound described in International Publication No. 2012/117965, JP 2020 - Brominated diketopyrrolopyrrole compounds described in Gazette No. 085947, naphthol azo compounds described in JP 2012-229344 Gazette, red coloring materials described in JP 6516119 Gazette, Japan The red color material described in Patent No. 6525101, the brominated diketopyrrolopyrrole compound described in paragraph 0229 of Japanese Patent Application Laid-Open No. 2020-090632, and the brominated diketopyrrolopyrrole compound described in Korean Laid-Open Patent No. Anthraquinone compounds described in Korean Laid-Open Patent No. 10-2019-0140744, perylene compounds described in Japanese Patent Laid-Open No. 2020-079396, 0025 in Japanese Patent Laid-Open No. 2020-066702 Diketopyrrolopyrrole compounds described in paragraph 0041, etc. Also, as a red coloring material, a compound having a structure in which an aromatic ring group obtained by introducing a group bonded to an oxygen atom, a sulfur atom, or a nitrogen atom into an aromatic ring is bonded to two Ketopyrrolopyrrole skeleton.

As a red color material, C.I. Pigment Red 122, 177, 254, 255, 264, 269, 272 are more preferred, C.I. Pigment Red 254, 264, 272 are more preferred, and C.I. Pigment Red 254, 264 are further preferred.

Examples of the green color material include phthalocyanine compounds and squaraine compounds, among which phthalocyanine compounds are preferred, and phthalocyanine pigments are more preferred. Also, it is preferable that the green color material is a pigment.

Specific examples of green color materials include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Also, as a green color material, a zinc halide phthalocyanine pigment with an average number of halogen atoms of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 in one molecule can also be used. . Specific examples include compounds described in International Publication No. 2015/118720. In addition, as a green color material, the compound described in the specification of Chinese Patent Application No. 106909027, the phthalocyanine compound having a phosphoric acid ester as a ligand described in International Publication No. 2012/102395, Japanese Patent Laid-Open 2019 - Phthalocyanine compounds described in JP-A No. 008014, phthalocyanine compounds described in JP-A No. 2018-180023, compounds described in JP-A No. 2019-038958, JP-A No. 2020-070426 Aluminum phthalocyanine compounds described in , core-shell pigments described in Japanese Patent Application Laid-Open No. 2020-076995, etc.

As green color material, C.I. Pigment Green 7, 36, 58, 62, 63 are better, and C.I. Pigment Green 36, 58 are more preferable.

Specific examples of orange color materials include C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73 and other orange pigments.

As a yellow coloring material, an azo compound, an imine compound, an isoindoline compound, a pteridine compound, a quinoline yellow compound, and a perylene compound are mentioned. Specific examples of yellow color materials include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc. yellow paint.

Moreover, the nickel azobarbiturate complex compound of the following structure can also be used as a yellow color material. [chemical 1]

In addition, as a yellow coloring material, compounds described in JP-A-2017-201003, compounds described in JP-A-2017-197719, compounds 0011-0062 in JP-A-2017-171912 can also be used. Paragraphs, compounds described in paragraphs 0137-0276, compounds described in paragraphs 0010-0062, 0138-0295 of JP-A-2017-171913, paragraphs 0011-0062 of JP-A-2017-171914, Compounds described in paragraphs 0139 to 0190, compounds described in paragraphs 0010 to 0065, 0142 to 0222 of JP-A-2017-171915, and paragraphs 0011-0034 of JP-A-2013-054339 The quinophthalone compound, the quinophthalone compound described in paragraphs 0013 to 0058 of JP-A-2014-026228, the isoindoline compound described in JP-A-2018-062644, JP-A-2018 -The quinophthalone compound described in Gazette No. 203798, the quinophthalone compound described in JP-A-2018-062578, the quinophthalone compound described in JP-A-6432076, JP-A-2018- The quinophthalone compound described in Gazette No. 155881, the quinophthalone compound described in JP-A No. 2018-111757, the quinophthalone compound described in JP-A No. 2018-040835, JP-A-2017 - The quinophthalone compound described in Gazette No. 197640, the quinophthalone compound described in JP-A-2016-145282, the quinophthalone compound described in JP-A-2014-085565, JP-A The quinophthalone compound described in the 2014-021139 communique, the quinophthalone compound described in the Japanese Patent Application Publication No. 2013-209614, the quinophthalone compound described in the Japanese Patent Application Publication No. The quinophthalone compound described in the publication No. 2013-181015, the quinophthalone compound described in the Japanese Patent Application Publication No. 2013-061622, the quinophthalone compound described in the Japanese Patent Application Publication No. The quinophthalone compound described in Japanese Patent Application Laid-Open No. 2012-226110, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-074987, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-081565, The quinophthalone compound described in JP-A-2008-074986, the quinophthalone compound described in JP-A-2008-074985, and the quinophthalone compound described in JP-A-2008-050420 , the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-031281, the quinophthalone compound described in Japanese Patent Application Publication No. 48-032765, and the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2019-008014 Compounds, quinophthalone compounds described in Japanese Patent No. 6607427, methine dyes described in Japanese Patent Laid-Open No. 2019-073695, methine dyes described in Japanese Patent Laid-Open No. 2019-073696 , the methine dyes described in JP-A-2019-073697, the methine dyes described in JP-A-2019-073698, and the Korean patent publication No. 10-2014-0034963 Compounds, compounds described in Japanese Patent Application Laid-Open No. 2017-095706, compounds described in Taiwan Patent Application Publication No. 201920495, compounds described in Japanese Patent No. 6607427, Japanese Patent Application Publication No. 2020-033525 Compounds described in JP-A-2020-033524, JP-A-2020-033523, JP-A-2020-033522, JP-A Compounds described in Publication No. 2020-033521, Compounds described in International Publication No. 2020/045200, Compounds described in International Publication No. 2020/045199, Compounds described in International Publication No. 2020/045197 , Azo compounds described in JP-A No. 2020-093994, perylene compounds described in JP-A No. 2020-083982, perylene compounds described in International Publication No. 2020/105346, JP 2020 - The quinophthalone compound described in Gazette No. 517791, the compound represented by the following formula (QP1), and the compound represented by the following formula (QP2). Moreover, from the viewpoint of improving the color value, those obtained by multimerizing these compounds can also be preferably used. [Chem 2]

In formula (QP1), X ¹ to X ¹⁶ each independently represent a hydrogen atom or a halogen atom, and Z ¹ represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by the formula (QP1) include compounds described in paragraph 0016 of Japanese Patent No. 6443711. [chemical 3]

In formula (QP2), Y ¹ to Y ³ each independently represent a halogen atom. n and m represent the integer of 0-6, and p represents the integer of 0-5. (n+m) is 1 or more. Specific examples of the compound represented by the formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

Specific examples of purple color materials include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

Specific examples of blue color materials include C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88 and other blue pigments. In addition, an aluminum phthalocyanine compound having a phosphorus atom can also be used as a blue color material. Specific examples include compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraphs 0047 of JP-A-2011-157478.

For the preferred diffraction angles of various pigments, refer to Japanese Patent No. 6561862, Japanese Patent No. 6413872, Japanese Patent No. 6281345, Japanese Patent Application Publication No. 2020-026503, Japanese Patent Application Publication No. 2020- No. 033526 bulletin, these contents are incorporated into this specification. In addition, as the pyrrolopyrrole pigment, one having a crystallite size of 140 Å or less in the plane direction corresponding to the largest peak in the X-ray diffraction pattern among the eight planes of the crystal lattice (±1±1±1) is also used. better. Furthermore, it is also preferable to set the physical properties of the pyrrolopyrrole pigment as described in paragraphs 0028 to 0073 of JP-A-2020-097744.

In addition, from the viewpoint of improving spectral characteristics, it is also preferable to use a zinc halide phthalocyanine pigment having a Raman spectrum described in Japanese Patent No. 6744002 as a pigment. Also, from the viewpoint of viscosity adjustment, it is also preferable to use the second 㗁𠯤 pigment for controlling the contact angle described in International Publication No. 2019/107166 as a pigment.

Dyes can also be used as coloring materials. The dye is not particularly limited, and known dyes can be used. For example, pyrazole azo series, anilino azo series, triarylmethane series, anthraquinone series, anthrapyridone series, benzylidene series, oxonol series, pyrazolotriazole azo series, pyridine Ketoazo-based, cyanine-based, pyrrolo-pyrazolemethine-based azo-based, phthalocyanine-based, benzopyran-based, indigo-based, pyrromethene-based and other dyes.

A pigment multimer can also be used for a color material. It is preferable that a dye multimer is used as a dye dissolved in a solvent. Also, pigment multimers may form particles. When the pigment multimer is a particle, it is usually used in a dispersed state in a solvent. The pigment multimer in a particulate state can be obtained, for example, by emulsion polymerization, and specific examples thereof include compounds and production methods described in JP-A-2015-214682. The pigment multimer has two or more pigment structures in one molecule, preferably three or more pigment structures. The upper limit is not particularly limited, but can also be set to 100 or less. The plural pigment structures contained in one molecule may be the same pigment structure or different pigment structures. The weight average molecular weight (Mw) of the pigment multimer is preferably 2,000 to 50,000. The lower limit is more preferably 3000 or more, and more preferably 6000 or more. The upper limit is more preferably 30,000 or less, and further preferably 20,000 or less. As the pigment polymer, JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, and International Publication No. 2016/031442 can also be used. Compounds described in et al.

Also, as a color material, a diarylmethane compound described in JP 2020-504758, a triaryl methane dye polymer described in Korean Laid-Open Patent No. 10-2020-0028160, Japan A star compound described in Japanese Patent Laid-Open No. 2020-117638, a phthalocyanine compound described in International Publication No. 2020/174991, an isoindoline compound described in Japanese Patent Laid-Open No. 2020-160279, or the etc., the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069442, the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069730, Korean Publication The compound represented by Formula 1 described in Patent No. 10-2020-0069070, the compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069067, the compound represented by Formula 1 described in Korean Patent Publication No. 10-2020- Compounds represented by Formula 1 described in Publication No. 0069062, zinc halide phthalocyanine pigments described in Patent No. 6809649, and isoindoline compounds described in Japanese Patent Application Laid-Open No. 2020-180176. The color material can be a rotaxane, and the pigment skeleton can be used in a cyclic structure of a rotaxane, a rod structure, or both structures. As a color material, it is also possible to use the quinophthalone compound represented by Formula 1 of Korean Laid-Open Patent No. 10-2020-0030759, the polymer dye described in Korean Laid-Open Patent No. 10-2020-0061793, Japan The colorant described in JP-A-2022-029701, the isoindoline compound described in International Publication No. 2022/014635, the aluminum phthalocyanine compound described in International Publication No. 2022/024926, JP-A Compounds described in Publication No. 2022-045895 and compounds described in International Publication No. 2022/050051.

Two or more kinds of color materials may be used in combination. Moreover, when using 2 or more types of color color materials in combination, you may form black with the combination of 2 or more types of color color materials. Examples of such combinations include the following aspects (1) to (7). In the case where two or more color materials are contained in the resin composition and black is represented by a combination of two or more color materials, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. things. (1) The form that contains red color material and blue color material. (2) Forms containing red color material, blue color material and yellow color material. (3) Forms containing red color material, blue color material, yellow color material and purple color material. (4) Forms containing red color material, blue color material, yellow color material, purple color material and green color material. (5) Forms containing red color material, blue color material, yellow color material and green color material. (6) Forms containing red color material, blue color material and green color material. (7) Forms containing yellow and purple color materials.

(white color material) Examples of white color materials include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silicon dioxide, talc, mica, aluminum hydroxide, calcium silicate, Aluminum silicate, hollow resin particles, zinc sulfide and other inorganic pigments (white pigments). The white pigment is preferably particles having titanium atoms, more preferably titanium oxide. In addition, the white pigment is preferably particles having a refractive index of 2.10 or higher with respect to light having a wavelength of 589 nm. The aforementioned refractive index is preferably from 2.10 to 3.00, more preferably from 2.50 to 2.75.

In addition, as the white pigment, titanium oxide described in "Titanium Oxide Physical Properties and Applied Technology, Kiyono Gakushu, pp. 13-45, June 25, 1991, Gihodo Publishing" can also be used.

The white pigment is not limited to a single inorganic substance, and particles compounded with other materials may also be used. For example, particles with pores or other raw materials inside, particles with a plurality of inorganic particles attached to the core particle, core and core composite particles composed of a core particle including polymer particles and a shell layer including inorganic nanoparticles are used as better. As the core-core composite particle composed of the core particle including the above-mentioned polymer particle and the shell layer including inorganic nanoparticles, for example, the description in paragraphs 0012 to 0042 of Japanese Patent Laid-Open No. 2015-047520 can be referred to. incorporated into this manual.

Hollow inorganic particles can also be used as a white pigment. The hollow inorganic particle refers to an inorganic particle having a structure of a cavity inside, and refers to an inorganic particle having a cavity surrounded by an outer shell. Examples of the hollow inorganic particles include hollow inorganic particles described in JP-A-2011-075786, International Publication No. 2013/061621, JP-A-2015-164881, etc., and these contents are incorporated in this specification. .

(black color material) It does not specifically limit as a black color material, A well-known thing can be used. For example, examples of inorganic black color materials include inorganic pigments (black pigments) such as carbon black, titanium black, and graphite. Carbon black and titanium black are preferred, and titanium black is more preferred.

Titanium black is black particles containing titanium atoms, preferably subvalent titanium oxide or titanium oxynitride. The surface of titanium black can be modified as needed for the purpose of improving dispersibility, suppressing coagulation, and the like. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide or zirconium oxide. In addition, treatment with a water-repellent substance as disclosed in JP-A-2007-302836 can also be performed. Regarding titanium black, it is preferable that both the primary particle diameter and the average primary particle diameter of each particle are small. Specifically, the average primary particle diameter is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles and adjusting the content ratio of Si atoms to Ti atoms in the dispersion to be in the range of 0.20 to 0.50, etc. may be mentioned. Regarding the above-mentioned dispersion, the description in paragraphs 0020 to 0105 of JP-A-2012-169556 can also be referred to, and the content is incorporated in this specification. Examples of commercially available titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (product name: manufactured by Mitsubishi Materials Corporation), Tilack D (product name: Ako Kasei Co., Ltd.), etc.

Examples of carbon black include furnace black, channel black, thermal black, acetylene black, and lamp black. As carbon black, carbon black produced by a known method such as an oil furnace method or a gas black method can be used, and a commercially available item can also be used. Examples of commercially available carbon blacks include C.I. Pigment Black 7, Color Black S170 (manufactured by Degussa AG), and the like.

As carbon black, surface-treated carbon black can also be used. By surface treatment, the surface state of carbon black particles can be modified and the dispersion stability in the composition can be improved. Examples of surface treatment include resin-based coating treatment, acid group-introducing surface treatment, and silane coupling agent-based surface treatment. As the carbon black for the surface, carbon black for coating with a resin is preferable. By coating the surface of the carbon black particles with the resin, the light-shielding properties and insulating properties of the film can be improved. In addition, the reliability of the image display device and the like can be improved by reducing leakage current and the like. Therefore, the film can be preferably used in cases where light-shielding properties and insulating properties are required, and the like. Examples of coating resins include epoxy resins, polyamide resins, polyamideimide resins, novolak resins, phenol resins, urea resins, melamine resins, polyurethane resins, diallyl phthalate resins, Alkylbenzene resin, polystyrene resin, polycarbonate resin, polybutylene terephthalate and modified polyphenylene ether. The content of the coating resin is preferably 0.1 to 40% by mass, more preferably 0.5 to 30% by mass, based on the total of the carbon black and the coating resin, from the viewpoint of better light-shielding properties and insulating properties of the film.

Moreover, as an organic black coloring material, a bisbenzofuranone compound, an imine compound, a perylene compound, an azo compound, etc. are mentioned. Examples of the bisbenzofuranone compound include compounds described in JP 2010-534726 A, JP 2012-515233 A, JP 2012-515234 A, etc. Obtained from "Irgaphor Black". Examples of the perylene compound include compounds described in paragraphs 0016 to 0020 of JP-A-2017-226821, C.I. Pigment Black 31, 32, and the like. Examples of the methylimine compound include compounds described in JP-A-01-170601, JP-A-02-034664, etc., for example, as "CHROMOFINE" manufactured by Dainichiseika Color & Chemicals Mfg.Co., Ltd. BLACK A1103".

The color material used in the resin composition of the present invention may be only the above-mentioned black color material, or may also include color color material. By using the black color material and the color color material together, it is easy to obtain a resin composition capable of forming a film excellent in light-shielding properties in the visible region. In the case of using black color material and color color material together, the mass ratio of both is black color material:color color material=100:10-300 is better, and 100:20-200 is more preferable.

As a preferable combination of a black color material and a color color material, the following are mentioned, for example. (A-1) Forms containing organic black and blue color materials. (A-2) Forms containing organic black color materials, blue color materials and yellow color materials. (A-3) Forms containing organic black color materials, blue color materials, yellow color materials and red color materials. (A-4) Forms containing organic black color materials, blue color materials, yellow color materials and purple color materials.

In the aspect of (A-1) above, the mass ratio of organic black color material to blue color material is organic black color material:blue color material=100:1~70 is better, 100:5~60 is more preferable, 100:10-50 is more preferable. In the form of (A-2) above, the mass ratio of organic black color material, blue color material and yellow color material is organic black color material:blue color material:yellow color material=100:10～90:10～90 More preferably, 100:15-85:15-80 is more preferable, and 100:20-80:20-70 is still more preferable. In the above (A-3) form, the mass ratio of organic black color material, blue color material, yellow color material and red color material is organic black color material:blue color material:yellow color material:red color material=100: 20-150:1-60:10-100 is preferable, 100:30-130:5-50:20-90 is more preferable, and 100:40-120:10-40:30-80 is still more preferable. In the above (A-4), the mass ratio of organic black color material, blue color material, yellow color material and purple color material is organic black color material:blue color material:yellow color material:purple color material=100: 20-150:1-60:10-100 is preferable, 100:30-130:5-50:20-90 is more preferable, and 100:40-120:10-40:30-80 is still more preferable.

(Near-infrared Absorbing Color Material) The near-infrared absorbing color material is preferably a compound having a maximum absorption wavelength on the side longer than the wavelength of 700 nm. The infrared absorber is preferably a compound with a maximum absorption wavelength in the range of more than 700nm to 1800nm, more preferably a compound with a maximum absorption wavelength in the range of more than 700nm to 1400nm, and a compound with a wavelength of more than 700nm to 1200nm The compound which has a maximum absorption wavelength in the following range is more preferable, and the compound which has a maximum absorption wavelength in the range which exceeds wavelength 700nm and 1000nm or less is especially preferable. Also, the ratio A ¹ /A ² of the absorbance A ¹ at a wavelength of 500 nm and the absorbance A ² at the maximum absorption wavelength of the near-infrared absorbing color material is preferably 0.08 or less, more preferably 0.04 or less. Also, the near-infrared absorbing color material is preferably a pigment, more preferably an organic pigment.

Examples of near-infrared absorbing color materials include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, and ketones. Onium compounds, oxonol compounds, imonium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, imine compounds, anthraquinone compounds, bisbenzofuranone compounds, metal oxides, metal boron compounds etc. Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614 , compounds described in paragraphs 0037-0052 of JP-A-2011-068731 , International Publication No. Compounds described in paragraphs 0010 to 0033 of No. 2015/166873, etc. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Laid-Open No. 2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169, International Publication No. 2016/ Compounds described in Paragraph 0040 of No. 181987, compounds described in JP-A No. 2015-176046, compounds described in Paragraph 0072 of International Publication No. 2016/190162, compounds described in JP-A No. 2016-074649 Compounds described in paragraphs 0196 to 0228, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in International Publication No. 2017/135359, JP-A-2017-114956 Compounds described, compounds described in Japanese Patent No. 6197940, compounds described in International Publication No. 2016/120166, etc. Examples of cyanine compounds include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, JP 2015 - Compounds described in Publication No. 172004, Compounds described in Japanese Patent Application Laid-Open No. 2015-172102, Compounds described in Japanese Patent Application Publication No. 2008-088426, Paragraph 0090 of International Publication No. 2016/190162 Compounds described, compounds described in JP-A-2017-031394, etc. Examples of the crotonium compound include compounds described in JP-A-2017-082029. Examples of iminium compounds include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, and compounds described in JP-A-2007-092060 . Compounds described in paragraphs 0048 to 0063 of International Publication No. 2018/043564. Examples of the phthalocyanine compound include the compounds described in paragraph 0093 of JP-A-2012-077153, the phthalocyanine-titanium compounds described in JP-A-2006-343631, and the compounds described in JP-A-2013-195480. Compounds described in paragraphs 0013 to 0029, vanadium phthalocyanine compounds described in Patent No. 6081771, vanadium phthalocyanine compounds described in International Publication No. 2020/071486, and vanadium phthalocyanine compounds described in International Publication No. 2020/071470 The recorded phthalocyanine compounds. Examples of the naphthalocyanine compound include compounds described in paragraph 0093 of JP-A-2012-077153. Examples of the dithioalkene metal complexes include compounds described in Japanese Patent No. 5733804 . Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details of tungsten oxide, paragraph 0080 of JP-A-2016-006476 can be referred to, and this content is incorporated in this specification. Lanthanum boride etc. are mentioned as a metal boride. Commercially available lanthanum borides include LaB ₆ -F (manufactured by JAPAN NEW METALS CO., LTD.) and the like. In addition, as metal borides, compounds described in International Publication No. 2017/119394 can also be used. F-ITO (manufactured by DOWA HOLDINGS CO., LTD.) etc. are mentioned as a commercial item of indium tin oxide.

In addition, as a near-infrared absorbing coloring material, squarylium compounds described in JP-A-2017-197437, squarylium compounds described in JP-A-2017-025311, International Publication No. 2016 The squaraine compound described in /154782, the squaraine compound described in Japanese Patent No. 5884953, the squaraine compound described in Japanese Patent No. 6036689, the squaraine compound described in Japanese Patent No. 5810604 The squaraine compound described, the squaraine compound described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the compound containing a pyrrole ring described in paragraphs 0019 to 0075 of JP-A-2018-054760 , Compounds containing a pyrrole ring described in paragraphs 0078 to 0082 of JP-A-2018-040955, compounds containing a pyrrole ring described in paragraphs 0043-0069 of JP-A-2018-002773, JP-A A squaraine compound having an aromatic ring at the amide α-position described in paragraphs 0024 to 0086 of No. 2018-041047, an amide-linked squaraine compound described in JP-A-2017-179131, Japan A compound having a pyrrole double-type squaraine skeleton or a crotonium skeleton described in JP-A-2017-141215, a dihydroxycarbazole-type squaraine compound described in JP-A-2017-082029, Asymmetric compounds described in paragraphs 0027 to 0114 of JP-A-2017-068120, pyrrole-ring-containing compounds (carbazole-type) described in JP-A-2017-067963, JP-A-6251530 Phthalocyanine compounds and the like described in the gazette.

(pigment derivatives) In this invention, a pigment derivative can also be used for a color material. In the present invention, it is preferable to use a pigment and a pigment derivative in combination. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton.

Examples of the dye skeleton constituting the pigment derivative include quinoline dye skeleton, benzimidazolone dye skeleton, benzisoindole dye skeleton, benzothiazole dye skeleton, imonium dye skeleton, squarylium dye skeleton, gram Ketonium Dye Skeleton, Oxonol Dye Skeleton, Pyrrolopyrrole Dye Skeleton, Diketopyrrolopyrrole Dye Skeleton, Azo Dye Skeleton, Aimine Dye Skeleton, Phthalocyanine Skeleton, Naphthalocyanine Skeleton, Anthraquinone Dye Skeleton, quinacridone pigment skeleton, bisindolinone pigment skeleton, perinone pigment skeleton, perylene pigment skeleton, thioindigo pigment skeleton, isoindoline pigment skeleton, isoindolinone pigment skeleton, quinoline yellow Dye skeleton, dithiol dye skeleton, triarylmethane dye skeleton, pyrromethene dye skeleton, etc.

Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group, and salts thereof. The atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), alkaline earth metal ions (Ca ²⁺ , Mg ^{2+ ,} etc.), ammonium ions, imidazolium ions, pyridinium ions, etc. ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR ^X1 is preferable. As the sulfonamide group, a group represented by -NHSO ₂ R ^X2 is preferable. As the imidic acid group, a group represented by -SO ₂ NHSO ₂ R ^X3 , -CONHSO ₂ R ^X4 , -CONHCOR ^X5 or -SO ₂ NHCOR ^X6 is preferable, and -SO ₂ NHSO ₂ R ^X3 is more preferable. R ^X1 to R ^X6 each independently represent an alkyl group or an aryl group. The alkyl and aryl groups represented by R ^X1 to R ^X6 may have a substituent. As the substituent, a halogen atom is preferable, and a fluorine atom is more preferable.

Examples of the base include an amino group, a pyridyl group and salts thereof, ammonium group salts, and phthalimidomethyl group. Examples of the atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

The pigment derivative is preferably a compound having a structure in which a base is bonded to the pigment skeleton. Moreover, it is also preferable that the pigment derivative is a compound having a urea structure, an amide structure or a urethane structure.

Specific examples of pigment derivatives include compounds described in Examples described later, compounds described in JP-A-56-118462, compounds described in JP-A-63-264674, Compounds described in JP-A-01-217077, compounds described in JP-A-03-009961, compounds described in JP-A-03-026767, JP-A-03-153780 Compounds described in JP 03-045662, JP 04-285669, JP 06-145546, JP Compounds described in KOKAI Publication No. 06-212088, compounds described in Japanese Patent Application Publication No. 06-240158, compounds described in Japanese Patent Application Publication No. 10-030063, compounds disclosed in Japanese Patent Application Publication No. 10-195326 Compounds described, compounds described in paragraphs 0086 to 0098 of International Publication No. 2011/024896, compounds described in paragraphs 0063 to 0094 of International Publication No. 2012/102399, paragraph 0082 of International Publication No. 2017/038252 Compounds described in , compounds described in paragraph 0171 of JP-A-2015-151530, compounds described in paragraphs 0162-0183 of JP-A-2011-252065, JP-A-2003-081972 Compounds described in Japanese Patent No. 5299151, Compounds described in Japanese Patent Laid-Open No. 2015-172732, Compounds described in Japanese Patent Laid-Open No. 2014-199308, Japanese Patent Laid-Open No. 2014 - Compounds described in JP-A No. 085562, compounds described in JP-A No. 2014-035351, compounds described in JP-A No. 2008-081565, compounds described in JP-A No. 2019-109512 Compounds, compounds described in JP-A-2019-133154, diketopyrrolopyrrole compounds having a thiol linker described in International Publication No. 2020/002106, JP-A-2018-168244 The described benzimidazolone compounds or their salts.

It is preferable that content of the coloring material in the total solid content of a resin composition is 30-80 mass %. The lower limit is preferably at least 40% by mass, more preferably at least 50% by mass. The upper limit is preferably at most 70% by mass, more preferably at most 65% by mass.

The content of the pigment in the total solid content of the resin composition is preferably 30% by mass or more, more preferably 40% by mass or more, still more preferably 45% by mass or more, still more preferably 50% by mass or more, and 55% by mass More than % is especially good. The upper limit is preferably at most 80% by mass, more preferably at most 77.5% by mass, and still more preferably at most 75% by mass. According to the resin composition of the present invention, even when the content of the pigment is high, by containing the above-mentioned random copolymer b1, it is possible to form a film in which the occurrence of defects is suppressed. In addition, generation of development residue can also be suppressed. Therefore, when the content of the pigment is high, the resin composition of the present invention exhibits the effects of the present invention remarkably.

The content of the pigment in the color material is preferably from 20 to 100% by mass, more preferably from 50 to 100% by mass, and still more preferably from 70 to 100% by mass. Moreover, the total content of the pigment and the pigment derivative in the color material is preferably 25 to 100 mass %, more preferably 55 to 100 mass %, and still more preferably 75 to 100 mass %.

＜＜Resin B＞＞ The resin composition of the present invention contains resin B (hereinafter, referred to as resin). The resin is blended, for example, for dispersing a pigment or the like in a resin composition or for a binder. In addition, the resin mainly used for dispersing a pigment etc. in a resin composition is called a dispersing agent. However, such use of the resin is an example, and the resin can also be used for purposes other than these uses.

(specific resin) The resin contained in the resin composition of the present invention contains a random copolymer of repeating units b-1 containing acid groups, repeating units b-2 containing bases, and repeating units b-3 containing polyalkoxy groups. Substance b1 (hereinafter also referred to as specific resin). Here, the random copolymer refers to a copolymer in which two or more repeating units are randomly arranged. On the other hand, the term "blocked copolymer" refers to a copolymer composed of two or more types of monomers, in which polymer chains each composed of the same type of monomer are bonded to one chain.

[repeat unit b-1] The specific resin contains repeating unit b-1 (hereinafter also referred to as repeating unit b-1) having an acidic group. Examples of the acid group include a carboxyl group, a phosphoric acid group, a sulfo group, and a phenolic hydroxyl group, and a carboxyl group is preferred.

The number of acid groups contained in the repeating unit b-1 may be one or two or more. The number of acid groups contained in the repeating unit b-1 is preferably 1 to 4, more preferably 1 or 2.

As repeating unit b-1, the repeating unit represented by following formula (bb-1) is mentioned. [chemical 4]

R ^b11 to R ^b13 of the formula (bb-1) each independently represent a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by R ^b11 -R ^b13 is preferably 1-10, more preferably 1-3, and still more preferably 1.

L ^b11 in the formula (bb-1) represents a single bond or a linking group with a valence of n1+1. However, when n1 is 2 or more, L ^b11 is a linking group having a valency of n1+1. Examples of the n1+1-valent linking group represented by L ^b11 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, and a group formed by combining two or more of them. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.

A ^b11 of the formula (bb-1) represents an acid group. Examples of the acid group represented by A ^b11 include a carboxyl group, a phosphoric acid group, a sulfo group, and a phenolic hydroxyl group, and a carboxyl group is preferable.

n1 in the formula (bb-1) represents an integer of 1 or more, preferably an integer of 1 to 4, more preferably 1 or 2.

Specific examples of the repeating unit b-1 include repeating units derived from compounds of the structures shown below. [chemical 5]

The content of the repeating unit b-1 in the specific resin is preferably 0.1 to 50% by mass. The lower limit is preferably at least 0.5% by mass, more preferably at least 1% by mass. The upper limit is preferably at most 30% by mass, more preferably at most 20% by mass.

[Repeating Unit b-2] The specific resin contains the repeating unit b-2 (hereinafter also referred to as the repeating unit b-2) containing a base. The base is preferably an amino group. Examples of the amine group include groups represented by -NR ^a1 R ^am2 and cyclic amine groups, and groups represented by -NR ^a1 R ^am2 are preferred.

Among the groups represented by -NR ^{am1 Ram2} , ^Ram1 and ^Ram2 independently represent a hydrogen atom, an alkyl group and an aryl group, preferably an alkyl group. The number of carbon atoms in the alkyl group is preferably 1-10, more preferably 1-5, still more preferably 1-3, and particularly preferably 1 or 2. The alkyl group may be any of straight chain, branched chain and cyclic shape, but straight chain or branched chain is preferable, and straight chain is more preferable. The carbon number of the aryl group is preferably 6-30, more preferably 6-20, and still more preferably 6-12.

Examples of the cyclic amino group include pyrrolidinyl, piperidinyl, piperidinyl, morpholinyl and the like. These groups may also have substituents. As a substituent, an alkyl group, an aryl group, etc. are mentioned.

The number of bases contained in the repeating unit b-2 may be one, or two or more. The number of bases contained in the repeating unit b-2 is preferably 1 to 4, more preferably 1 or 2.

The repeating unit b-2 is preferably a repeating unit derived from a compound whose conjugate acid has a pKa of 9.5 or more. According to this aspect, it is possible to form a film that suppresses the occurrence of defects. The pKa of the conjugate acid of the above compound is preferably 6 or more, more preferably 9 or more. The upper limit of the pKa of the conjugate acid of the above compound is preferably 12 or less, more preferably 10 or less. The pKa of the conjugate acid of a compound can be measured by neutralization titration. As a measurement method, there is a method of adding a mixed solution of 50 mM sulfuric acid and dimethyl sulfide to 20 mL of a dimethyl sulfide solution having a concentration of 1 mM of the measurement sample and calculating the pKa of the conjugate acid from the neutralization titration curve. The pH at the time of neutralization titration can be measured using an ISFET (Ion Sensitive Field Effect Transistor) electrode.

As repeating unit b-2, the repeating unit represented by following formula (bb-2) is mentioned. [chemical 6]

R ^b21 to R ^b23 of the formula (bb-2) each independently represent a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by ^Rb21 - ^Rb23 is preferably 1-10, more preferably 1-3, and is still more preferably 1.

L ^b21 in formula (bb-2) represents a single bond or a linking group with a valence of n2+1. However, when n2 is 2 or more, L ^b21 is an n2+1-valent linking group. Examples of the n2+1-valent linking group represented by L ^b21 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, OCO-, -S-, and a group formed by combining two or more of them. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned. The n2+1-valent linking group represented by L ^b21 may contain a urea bond (-NH-CO-NH-) or a urethane bond (-NH-COO- or -OCO-NH-).

A ^b21 of the formula (bb-2) represents a base. As the base represented by A ^b21 , an amino group is preferable.

n2 in the formula (bb-2) represents an integer of 1 or more, preferably an integer of 1 to 4, more preferably 1 or 2.

Specific examples of the repeating unit b-2 include repeating units derived from compounds b-2-1 to b-2-22 described in Examples described later.

The content of the repeating unit b-2 in the specific resin is preferably 0.1 to 50% by mass. The lower limit is preferably at least 1% by mass, more preferably at least 5% by mass. The upper limit is preferably 45% by mass or less, more preferably 35% by mass or less.

[repeat unit b-3] The specific resin contains repeating unit b-3 (hereinafter also referred to as repeating unit b-3) containing a polyalkyleneoxy structure.

The molecular weight of the repeating unit b1-3 is preferably 350-1500. When the molecular weight is within the above range, it is possible to form a film in which the occurrence of defects is further suppressed. Moreover, generation|occurrence|production of development residue can also be suppressed more effectively. In addition, the temporal increase in the viscosity of the resin composition can be suppressed, and the temporal stability can be further improved. The upper limit of the molecular weight of the repeating unit b1-3 is preferably 1400 or less, more preferably 1200 or less. The lower limit is preferably 400 or more. In addition, in this specification, the molecular weight of the repeating unit b-3 is the value calculated from the molecular weight of the raw material monomer used for polymerizing the same repeating unit. When the molecular weight of the raw material monomer can be calculated from the structural formula, the value of the molecular weight of the raw material monomer is the value calculated from the structural formula as the value of the molecular weight of the repeating unit b-3. When the molecular weight of the raw material monomer cannot be calculated from the structural formula, the value of the weight average molecular weight of the raw material monomer is used as the value of the molecular weight of the repeating unit b-3.

The polyalkyleneoxy structure is a structure having an alkyleneoxy group as a repeating unit and consisting of two or more alkyleneoxy groups. The polyalkyleneoxy structure may be composed of one type of alkyleneoxy group, or may be composed of two types of alkyleneoxy groups. The number of carbon atoms in the alkylene group constituting the polyalkylene group structure is preferably 1-5, more preferably 1-3, still more preferably 2 or 3, and particularly preferably 2. The number of alkyleneoxy groups constituting the polyalkyleneoxy group structure is preferably 4 to 40. The lower limit is preferably 5 or more, more preferably 8 or more. The upper limit is preferably 35 or less, and more preferably 30 or less.

The above-mentioned polyalkylene oxide structure is polytetramethylene structure, polypropyleneoxy structure, polyethyleneoxy structure, polytetramethylene-polyethyleneoxy copolymer structure and polypropyleneoxy-polyethyleneoxy copolymer structure. The structure is preferable, the polyethyleneoxy structure, the polytetramethylene-polyethyleneoxy copolymer structure and the polypropyleneoxy-polyethyleneoxy copolymer structure are more preferable, and the polyethyleneoxy structure is further preferable.

The terminal structure of the polyoxyalkylene structure is not particularly limited. It may be a hydrogen atom or a substituent. As a substituent, an alkyl group, an aryl group, etc. are mentioned. The carbon number of the alkyl group is preferably 1-30, more preferably 1-20. Alkyl is The alkyl group is preferably linear or branched. An alkyl group may have a substituent. As a substituent, a halogen atom, an aryl group, etc. are mentioned. The alkyl group is preferably an unsubstituted alkyl group. The carbon number of the aryl group is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The aryl group may have a substituent. As a substituent, a halogen atom, an alkyl group, etc. are mentioned. The terminal structure of the polyoxyalkylene structure is preferably a hydrogen atom or an alkyl group, more preferably an alkyl group.

As repeating unit b-3, the repeating unit represented by following formula (bb-3) is mentioned. [chemical 7]

R ^b31 to R ^b33 of the formula (bb-3) each independently represent a hydrogen atom or an alkyl group. The alkyl group represented by R ^b31 to R ^b33 has preferably 1 to 10 carbon atoms, more preferably 1 to 3 carbon atoms, and more preferably 1 carbon atoms.

L ^b31 in formula (bb-3) represents a single bond or a divalent linking group. Examples of the divalent linking group represented by L ^b31 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, OCO- , -S- and a group formed by combining two or more of these. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.

A ^b31 of the formula (bb-3) represents a polyalkyleneoxy structure. Examples of the polyalkyleneoxy structure represented by A ^b31 include those mentioned above.

A ^b32 of the formula (bb-3) represents a hydrogen atom or a substituent. As a substituent, an alkyl group, an aryl group, etc. are mentioned. The carbon number of the alkyl group is preferably 1-30, more preferably 1-20. The alkyl group is preferably linear or branched. An alkyl group may have a substituent. As a substituent, a halogen atom, an aryl group, etc. are mentioned. The alkyl group is preferably an unsubstituted alkyl group. The carbon number of the aryl group is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The aryl group may have a substituent. As a substituent, a halogen atom, an alkyl group, etc. are mentioned. A ^b32 is preferably a hydrogen atom or an alkyl group.

Specific examples of the repeating unit b-3 include repeating units derived from the compounds shown below. [chemical 8] [chemical 9]

The content of the repeating unit b-3 in the specific resin is preferably 20 to 90% by mass. The lower limit is preferably at least 25% by mass, more preferably at least 30% by mass. The upper limit is preferably 85% by mass or less, more preferably 75% by mass or less.

[repeat unit b-4] The specific resin also includes a repeating unit b-4 (hereinafter, also referred to as Repeating unit b-4) is preferred. According to this aspect, it is possible to form a film that further suppresses the occurrence of defects. Moreover, generation|occurrence|production of development residue can also be suppressed more effectively. In addition, the temporal increase in the viscosity of the resin composition can be suppressed, and the temporal stability can be further improved.

It is preferable that the above-mentioned functional group X which the repeating unit b-4 has is a group containing a ketone structure. It is also preferable that the above-mentioned functional group X is a group having 2 to 4 ring structures. In this aspect, the number of ring structures contained in the functional group X is preferably 2 to 3. It is also preferred that the above-mentioned functional group X is a group containing 2 to 5 heteroatoms. In this aspect, the number of heteroatoms contained in the functional group X is preferably 2 to 4.

The functional group X is preferably a group having 2 to 4 ring structures and containing 2 to 5 heteroatoms, more preferably a group having 2 to 3 ring structures and containing 2 to 4 heteroatoms. In particular, the functional group X is a group containing a ketone structure, having 2 to 4 ring structures (preferably 2 to 3 ring structures) and containing 2 to 5 (preferably 2 to 4) heteroatoms Group is better. By using a group having such a structure as the functional group X, it is possible to form a film in which the occurrence of defects is further suppressed.

The functional group X contains naphthalimide structure, acridone structure, 9-oxosulfurone star structure, xanthone structure, allium ketone structure, benzimidazole structure, benzothiazole structure, benzo㗁Azole structure, benzotriazole structure, benzodiazole structure, benzothiadiazole structure, benzothia𠯤 structure, benzo㗁𠯤 structure, benzoylurea structure, isothiazolinone structure, phenanthiazolinone structure, phenanthiadiazole structure Structure, phenanthrene structure, dihydroxyacridine structure, phenanthrene structure, dibenzopyran structure, oxene structure, carbazole structure, carboline structure, dibenzothiophene structure, dibenzofuran structure, pyrimidine structure , pyryrone structure, quinazoline structure, quinoline structure, quinoline structure, imidazole structure, thiazole structure, indole structure, benzothiophene structure, benzopyran structure, quinolinone structure, thiolone structure . Indolinone structure, anthraquinone structure, tetrazole structure, benzophenone structure, trioxane structure, azobenzene structure, benzylidene aniline structure, phenanthrene structure, barbituric acid structure, perylene structure, perionone Structure, quinoline yellow structure, caprolactam structure, saccharin structure, biphenyl structure, triaryl benzene structure, triaryl amine structure, benzodihydrothiazolone structure or benzodiazolinone structure good, Contains naphthalimide structure, acridone structure, xanthone structure, onionone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, benzotriazole structure, benzodiazole Azole structure, benzothiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, dihydroxyacridine structure, phenanthiadiazole structure, dibenzopyran structure, carbazole structure, carboline structure, dibenzothiophene Structure, Dibenzofuran structure, Pyrimidine structure, Pyramide structure, Quinazoline structure, Quinoline structure, Imidazole structure, Thiazole structure, Indole structure, Benzothiophene structure, Benzopyran structure, Quinolinone structure , thioketone structure, thiol structure, phthalimine structure, naphthalene-2,3-dicarboxyimide structure, pyrazole structure, pyrazolinoline structure, isoindoline structure, iso Indolinone structure, anthraquinone structure, tetrazole structure, benzophenone structure, trioxane structure, azobenzene structure, benzylidene aniline structure, phenanthrene structure, barbituric acid structure, perylene structure, perionone Structure, saccharin structure, biphenyl structure, triarylbenzene structure, triarylamine structure, benzodihydrothiazolone structure or benzoxazolone structure are more preferred, Contains naphthalimide structure, acridone structure, xanthone structure, onionone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, benzotriazole structure, benzodiazole Azole structure, benzothiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, phenanthiadiazole structure, dihydroxyacridine structure, phenanthiadiazole structure, dibenzopyran structure, carboline structure, dibenzothiophene structure, diphenyl Furan structure, pyrimidine structure, pyrimidine structure, quinazoline structure, quinoline structure, thiophenone structure, pyridine structure, phthalimide structure, pyrazolinium structure, isoindoline A group with a ketone structure, a tetrazole structure, a benzylidene aniline structure, a benzodihydrothiazolone structure or a benzoxazolone structure is more preferable, Contains naphthalimide structure, acridone structure, xanthone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, benzotriazole structure, benzodiazole structure, benzo Thiadiazole structure, phenanthiazolone structure, phenanthiazolone structure, phenanthiazolium structure, phthalimine structure, pyrazolinium structure, tetrazole structure, benzodihydrothiazolone structure or benzo The group of the oxazolinone structure is further preferred, Contains naphthalimide structure, acridone structure, benzimidazole structure, benzothiazole structure, benzoxazole structure, phenanthiazole structure, phenanthiazolinium structure, morphothiazolinium structure, phthaloyl The group of imine structure, pyrazolium structure or tetrazole structure is further preferred, A group containing a naphthalimide structure or an acridone structure is particularly preferable because it is easy to form a film that further suppresses the generation of defects.

Specific examples of the functional group X include a group having the structure shown below and a group having a structure in which these groups are bonded to a substituent. As a substituent, the group mentioned in the substituent T mentioned later is mentioned. In the following formulae, * represents a linking bond, and R represents a hydrogen atom or a substituent. As a substituent, the group mentioned in the substituent T mentioned later is mentioned. [chemical 10] [chemical 11] [chemical 12] [chemical 13]

Examples of the above-mentioned substituent T include the following groups. Halogen atom (such as fluorine atom, chlorine atom, bromine atom, iodine atom), alkyl group (preferably an alkyl group with 1 to 30 carbon atoms), alkenyl group (preferably an alkenyl group with 2 to 30 carbon atoms), Alkynyl (preferably an alkynyl group with 2 to 30 carbons), aryl (preferably an aryl group with 6 to 30 carbons), heterocyclic group (preferably a heterocyclic group with 1 to 30 carbons), Amino group (preferably an amino group with 0 to 30 carbons), alkoxy group (preferably an alkoxy group with 1 to 30 carbons), aryloxy group (preferably an aryloxy group with 6 to 30 carbons) ), heterocyclic epoxy group (preferably a heterocyclic epoxy group with 1 to 30 carbons), acyl group (preferably an acyl group with 2 to 30 carbons), alkoxycarbonyl group (preferably a carbon number with 2 to 30 alkoxycarbonyl), aryloxycarbonyl (preferably aryloxycarbonyl with 7 to 30 carbons), heteroepoxycarbonyl (preferably heteroepoxycarbonyl with 2 to 30 carbons), acyloxy (preferably an acyloxy group with 2 to 30 carbons), an amide group (preferably an amide group with 2 to 30 carbons), an aminocarbonylamine group (preferably an aminocarbonylamine group with 2 to 30 carbons) ), alkoxycarbonylamine (preferably alkoxycarbonylamine with 2 to 30 carbons), aryloxycarbonylamine (preferably aryloxycarbonylamine with 7 to 30 carbons), Aminosulfonyl group (preferably sulfamoylamino group with 0-30 carbon atoms), sulfamoylamino group (preferably sulfamoylamino group with 0-30 carbon atoms), carbamoyl group (more preferably carbamoyl with 1 to 30 carbons), alkylthio (preferably alkylthio with 1 to 30 carbons), arylthio (preferably arylthio with 6 to 30 carbons), Heterocyclic thio group (preferably a heterocyclic thio group with 1 to 30 carbons), alkylsulfonyl group (preferably an alkylsulfonyl group with 1 to 30 carbons), alkylsulfonylamino group ( preferably an alkylsulfonylamino group with 1 to 30 carbons), an arylsulfonyl group (preferably an arylsulfonyl group with 6 to 30 carbons), an arylsulfonylamino group (preferably is an arylsulfonylamino group with 6 to 30 carbons), a heterocyclic sulfonyl group (preferably a heterocyclic sulfonyl group with 1 to 30 carbons), a heterocyclic sulfonylamino group (preferably a carbon Heterocyclic sulfinylamino group with a number of 1 to 30), alkylsulfinyl group (preferably an alkylsulfinyl group with a carbon number of 1 to 30), arylsulfinyl group (preferably a carbon number 6-30 arylsulfinyl group), heterocyclic sulfinyl group (preferably heterocyclic sulfinyl group with 1-30 carbon numbers), ureido group (preferably urea group with 1-30 carbon number ), hydroxyl, nitro, carboxylic acid amido, sulfonamide, imide, phosphino, mercapto, cyano, alkylsulfinate, arylsulfinate, arylazo group, heterocyclic azo group, phosphinyl group, phosphinyloxy group, phosphinylamino group, silyl group, hydrazine group, imino group. When these groups are groups that can further be substituted, they may further have a substituent.

As repeating unit b-4, the repeating unit represented by following formula (bb-4) is mentioned. [chemical 14]

R ^b41 to R ^b43 of the formula (bb-4) each independently represent a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by ^Rb41 - ^Rb43 is preferably 1-10, more preferably 1-3, and still more preferably 1.

L ^b41 in formula (bb-4) represents a single bond or a divalent linking group. Examples of the divalent linking group represented by L ^b41 include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, OCO- , -S- and a group formed by combining two or more of these. An aliphatic hydrocarbon group and an aromatic hydrocarbon group may have a substituent. As a substituent, a hydroxyl group, a halogen atom, etc. are mentioned.

A ^b41 of the formula (bb-4) represents the above-mentioned functional group X.

Specific examples of the repeating unit b-4 include repeating units derived from compounds b-4-1 to b-4-6 described in Examples described later.

The content of the repeating unit b-4 in the specific resin is preferably 1 to 40% by mass. The lower limit is preferably at least 3% by mass, and more preferably at least 10% by mass. The upper limit is preferably at most 35% by mass, more preferably at most 30% by mass.

[repeat unit b-5] The specific resin may contain repeating units (hereinafter, repeating unit b-5) other than the above-mentioned repeating unit b-1 to repeating unit b-4.

As repeating unit b-5, the repeating unit etc. which have functional groups, such as an alkyl group, a phenyl group, and a hydroxyl group, are mentioned.

The content of the repeating unit b-5 in the specific resin is preferably at most 30% by mass, more preferably at most 25% by mass, and still more preferably at most 20% by mass.

[Concrete example of specific resin] Specific examples of the specific resin include resins P1 to P65 shown in Examples described later.

[Physical properties of specific resins] The acid value of the specific resin is preferably 10 to 200 mgKOH/g. The upper limit is preferably 180 mgKOH/g or less, more preferably 140 mgKOH/g or less, and still more preferably 120 mgKOH/g or less. The lower limit is preferably at least 20 mgKOH/g, more preferably at least 30 mgKOH/g, and still more preferably at least 40 mgKOH/g. When the acid value of a specific resin exists in the said range, the film which suppresses defect color unevenness can be formed. In addition, when forming a pattern by photolithography, it is also possible to more effectively suppress the generation of development residue. The acid value of the specific resin is particularly preferably 40 to 120 mgKOH/g.

The base value of the specific resin is preferably 10 to 200 mgKOH/g. The upper limit is preferably 180 mgKOH/g or less, more preferably 140 mgKOH/g or less, and still more preferably 120 mgKOH/g or less. The lower limit is preferably at least 20 mgKOH/g, more preferably at least 30 mgKOH/g, and still more preferably at least 40 mgKOH/g. When the base value of the specific resin is within the above range, it is possible to form a film in which defect color unevenness is suppressed. In addition, when forming a pattern by photolithography, it is also possible to more effectively suppress the generation of development residue. The acid value of the specific resin is particularly preferably 40 to 120 mgKOH/g.

The ratio of the acid value to the base value (acid value/base value) of the specific resin is preferably 0.1 to 30, because it can form a film that further suppresses the generation of defects and can also suppress the generation of development residue. 0.2-20 is more preferable. The lower limit is preferably at least 0.3, more preferably at least 0.4. The upper limit is preferably 10 or less, more preferably 8 or less, and still more preferably 4 or less.

The weight average molecular weight of the specific resin is preferably 3,000 to 100,000. When the weight average molecular weight of a specific resin exists in the said range, the film which suppressed generation|occurrence|production of a defect further can be formed. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more, for the reason that generation of image development residue can be more effectively suppressed even when a pattern is formed by photolithography. The upper limit is preferably 50,000 or less, and more preferably 30,000 or less, for the reasons of suppressing an increase in the viscosity of the resin composition over time and further improving the temporal stability.

(other resins) The resin composition of the present invention may contain resins (hereinafter, also referred to as other resins) different from the above-mentioned specific resins.

Examples of other resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, Resin, polyether resin, polyphenylene resin, polyarylether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin , silicone resin, etc. In addition, as the resin, resins described in the examples of International Publication No. 2016/088645, resins described in JP-A 2017-057265, resins described in JP-A 2017-032685, Resins described in JP-A 2017-075248, resins described in JP-A 2017-066240, resins described in JP-A 2017-167513, and resins described in JP-A 2017-173787 Resins, the resins described in paragraphs 0041 to 0060 of JP-A-2017-206689, the resins described in paragraphs 0022-0071 of JP-A-2018-010856, and the resins described in JP-A-2016-222891 Block polyisocyanate resin (cyanate resin), the resin described in JP-A-2020-122052, the resin described in JP-A-2020-111656, the resin described in JP-A-2020-139021, Resin containing a constituent unit having a ring structure on the main chain and a constituent unit having a biphenyl group on the side chain described in JP-A-2017-138503, 0199-0233 of JP-A-2020-186373 The resin described in the paragraph, the alkali-soluble resin described in Japanese Patent Laid-Open No. 2020-186325, and the resin represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0078339.

The weight average molecular weight (Mw) of other resins is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4000 or more, more preferably 5000 or more.

As other resins, it is preferable to use a resin having an acid group. As an acidic group, a carboxyl group, a phosphoric acid group, a sulfonic acid group, a phenolic hydroxyl group etc. are mentioned, for example.

The acid value of the resin with acid groups is preferably 30-500 mgKOH/g. The lower limit is more preferably 40 mgKOH/g or more, and particularly preferably 50 mgKOH/g or more. The upper limit is more preferably 400 mgKOH/g or less, further preferably 300 mgKOH/g or less, and particularly preferably 200 mgKOH/g or less. The weight average molecular weight (Mw) of the resin having an acid group is preferably from 5,000 to 100,000, more preferably from 5,000 to 50,000. Moreover, it is preferable that the number average molecular weight (Mn) of the resin which has an acid group is 1000-20000.

The resin having an acidic group preferably contains repeating units having an acidic group on the side chain, and more preferably contains 5 to 70 mol % of repeating units having an acidic group on the side chain in all the repeating units of the resin. The upper limit of the content of the repeating unit having an acid group on the side chain is preferably 50 mol % or less, more preferably 30 mol % or less. The lower limit of the content of the repeating unit having an acid group in the side chain is preferably 10 mol % or more, more preferably 20 mol % or more.

Regarding resins having acid groups, reference can be made to the descriptions in paragraphs 0558 to 0571 of JP-A-2012-208494 (corresponding to paragraphs 0685-0700 of US Patent Application Publication No. 2012/0235099), JP-A-2012-198408 No. 0076 to 0099 of the Publication No. 0076 to 0099, these contents are incorporated into this specification. Moreover, the resin which has an acid group can also use a commercial item. Moreover, there are no particular limitations on the method for introducing an acid group into the resin, and examples thereof include the method described in Japanese Patent No. 6349629 . Moreover, as a method of introducing an acid group into a resin, the method of making an acid anhydride react with the hydroxyl group produced|generated in the ring-opening reaction of an epoxy group, and introducing an acid group is also mentioned.

As another resin, the resin which has a base can also be used. Resins with bases can also be used as dispersants. The amine value of the resin having a base is preferably 5-300 mgKOH/g. The lower limit is preferably at least 10 mgKOH/g, more preferably at least 20 mgKOH/g. The upper limit is preferably 200 mgKOH/g or less, more preferably 100 mgKOH/g or less. Commercially available resins having bases include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, BYK-LPN6919 (the above are manufactured by BYK Chemie), SOLSPERSE 11200, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 352 00, 37500, 38500, 39000 , 53095, 56000, 7100 (the above are manufactured by Lubrizol Japan Limited.), Efka PX 4300, 4330, 4046, 4060, 4080 (the above are manufactured by BASF Corporation), etc. In addition, as the resin having a base, the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665 and the block copolymer (B) described in paragraphs 0046-0076 of JP-A-2018-156021 can also be used. The described block copolymer A1, the vinyl resin having a base described in paragraphs 0150 to 0153 of JP-A-2019-184763.

As another resin, a compound derived from a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) is used (hereinafter, these compounds may also be referred to as "ether dimer". ) The resin of the repeating unit of the monomer component is also preferred.

[chemical 15]

In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [chemical 16] In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of the formula (ED2), the description in JP 2010-168539 A can be referred to, and the content is incorporated in this specification.

As a specific example of the ether dimer, for example, the description in paragraph 0317 of JP-A-2013-029760 can be referred to, and the content is incorporated in this specification.

As other resins, it is also preferable to use a resin comprising a repeating unit derived from the compound represented by formula (X). [chemical 17] In the formula, ^R1 represents a hydrogen atom or a methyl group, ^R21 and ^R22 each independently represent an alkylene group, and n represents an integer of 0-15. The carbon number of the alkylene group represented by R ²¹ and R ²² is preferably 1-10, more preferably 1-5, still more preferably 1-3, particularly preferably 2 or 3. n represents an integer of 0-15, preferably an integer of 0-5, more preferably an integer of 0-4, and further preferably an integer of 0-3.

Examples of the compound represented by the formula (X) include ethylene oxide or propylene oxide modified (meth)acrylate of p-cumylphenol, and the like. As a commercial item, ARONIX M-110 (made by TOAGOSEI CO., LTD.) etc. are mentioned.

As another resin, it is also preferable to use a resin having a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups and cyclic ether groups. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a styryl group, a (meth)allyl group, and a (meth)acryl group. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned, and an epoxy group is preferable. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed.

It is also preferable to use a resin having an aromatic carboxyl group (hereinafter also referred to as resin Ac) as another resin. In resin Ac, the aromatic carboxyl group may be included in the main chain of the repeating unit, or may be included in the side chain of the repeating unit. The aromatic carboxyl group is preferably contained in the main chain of the repeating unit. In addition, in this specification, an aromatic carboxyl group is a group of the structure which bonded one or more carboxyl groups to an aromatic ring. Among the aromatic carboxyl groups, the number of carboxyl groups bonded to the aromatic ring is preferably 1 to 4, more preferably 1 to 2.

Resin Ac is preferably a resin containing at least one repeating unit selected from repeating units represented by formula (Ac-1) and repeating units represented by formula (Ac-2). [chemical 18] In formula (Ac-1), Ar ¹ represents a group containing an aromatic carboxyl group, L ¹ represents -COO- or -CONH-, and L ² represents a divalent linking group. In formula (Ac-2), Ar ¹⁰ represents a group containing an aromatic carboxyl group, L ¹¹ represents -COO- or -CONH-, L ¹² represents a trivalent linking group, and P ¹⁰ represents a polymer chain.

Examples of the aromatic carboxyl group-containing group represented by Ar ¹ in the formula (Ac-1) include a structure derived from an aromatic tricarboxylic anhydride, a structure derived from an aromatic tetracarboxylic anhydride, and the like. Examples of the aromatic tricarboxylic acid anhydride and the aromatic tetracarboxylic acid anhydride include compounds of the following structures. [chemical 19]

In the above formula, Q ¹ represents a single bond, -O-, -CO-, -COOCH ₂ CH ₂ OCO-, -SO ₂ -, -C(CF ₃ ) ₂ -, represented by the following formula (Q-1) or a group represented by the following formula (Q-2). [chemical 20]

The aromatic carboxyl group-containing group represented by Ar ¹ may have a crosslinkable group. The cross-linkable group is preferably an ethylenically unsaturated bond-containing group and a cyclic ether group, more preferably an ethylenically unsaturated bond-containing group. Specific examples of the aromatic carboxyl-containing group represented by Ar ¹ include groups represented by formula (Ar-11), groups represented by formula (Ar-12), groups represented by formula (Ar-13 ) represents the group, etc. [chem 21]

In formula (Ar-11), n1 represents an integer of 1 to 4, 1 or 2 is preferable, and 2 is more preferable. In formula (Ar-12), n2 represents an integer of 1 to 8, preferably an integer of 1 to 4, more preferably 1 or 2, and still more preferably 2. In formula (Ar-13), n3 and n4 each independently represent an integer of 0 to 4, an integer of 0 to 2 is preferable, 1 or 2 is more preferable, and 1 is still more preferable. However, at least one of n3 and n4 is an integer of 1 or more. In the formula (Ar-13), Q ¹ represents a single bond, -O-, -CO-, -COOCH ₂ CH ₂ OCO-, -SO ₂ -, -C(CF ₃ ) ₂ -, from the above formula (Q- 1) The group represented by or the group represented by the above-mentioned formula (Q-2). In formulas (Ar-11) to (Ar-13), *1 represents a bonding position with L ¹ .

In the formula (Ac-1), L ¹ represents -COO- or -CONH-, preferably -COO-.

Examples of the divalent linking group represented by ^L2 in formula (Ac-1) include alkylene, arylylene, -O-, -CO-, -COO-, -OCO-, -NH-, -S- and a group formed by combining two or more of these. The number of carbon atoms in the alkylene group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The alkylene group may be any of linear, branched and cyclic. The carbon number of the arylylene group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. An alkylene group and an arylylene group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. The divalent linking group represented by L ² is preferably a group represented by -L ^2a -O-. L ^2a can include an alkylene group; an arylylene group; a group formed by a combination of an alkylene group and an arylylene group; at least one selected from the group consisting of an alkylene group and an arylylene group and a group selected from -O-, -CO A combination of at least one of -, -COO-, -OCO-, -NH-, and -S-, preferably an alkylene group. The number of carbon atoms in the alkylene group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The alkylene group may be any of linear, branched and cyclic. An alkylene group and an arylylene group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned.

The aromatic carboxyl group-containing group represented by Ar ¹⁰ in formula (Ac-2) has the same meaning as Ar ¹ in formula (Ac-1), and the preferred range is also the same.

In the formula (Ac-2), L ¹¹ represents -COO- or -CONH-, preferably -COO-.

Examples of the trivalent linking group represented by ^L12 in the formula (Ac-2) include hydrocarbon groups, -O-, -CO-, -COO-, -OCO-, -NH-, -S-, and combinations thereof. Groups formed by more than two types. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. The carbon number of the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The hydrocarbon group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. The trivalent linking group represented by L ¹² is preferably a group represented by formula (L12-1), more preferably a group represented by formula (L12-2). [chem 22]

In formula (L12-1), L ^12b represents a trivalent linking group, X ¹ represents S, *1 represents the bonding position with L ¹¹ of formula (Ac-2), and *2 represents the bonding position with formula (Ac-2) The bonding position of P ¹⁰ . Examples of the trivalent linking group represented by ^L12b include a hydrocarbon group; a combination of a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH-, and -S- As the resulting group, etc., a hydrocarbon group or a combination of a hydrocarbon group and -O- is preferable.

In formula (L12-2), L ^12c represents a trivalent linking group, X ¹ represents S, *1 represents the bonding position with L ¹¹ of formula (Ac-2), *2 represents the bonding position with formula (Ac-2) The bonding position of P ¹⁰ . Examples of the trivalent linking group represented by ^L12c include a hydrocarbon group; a combination of a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH-, and -S- The resulting groups, etc., are preferably hydrocarbon groups.

In the formula (Ac-2), P ¹⁰ represents a polymer chain. The polymer chain represented by ^P10 preferably has at least one structure selected from the group consisting of polyester structure, polyether structure, polystyrene structure and poly(meth)acrylic acid structure. The weight average molecular weight of the polymer chain ^P10 is preferably 500-20000. The lower limit is preferably 1000 or more. The upper limit is preferably 10,000 or less, more preferably 5,000 or less, and still more preferably 3,000 or less. When the weight average molecular weight of ^P10 is within the above-mentioned range, the dispersibility of the pigment in the composition will be good. In the case where the resin having an aromatic carboxyl group is a resin having a repeating unit represented by formula (Ac-2), the resin can be preferably used as a dispersant.

The polymer chain represented by ^P10 may contain a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups and cyclic ether groups.

As another resin, it is preferable to use at least one kind selected from the group consisting of graft polymers, star polymers, and resins in which at least one end of the polymer chain is sealed with an acid group. Such a resin can be preferably used as a dispersant.

Examples of the graft polymer include a resin containing a repeating unit having a graft chain, a resin having a repeating unit represented by the above formula (Ac-2), and the like. Examples of the graft chain include a graft chain containing at least one structure selected from a polyester structure, a polyether structure, a polystyrene structure, and a poly(meth)acrylic acid structure. The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. As a substituent, an alkyl group, an alkoxy group, an alkylsulfide group etc. are mentioned. Among them, from the viewpoint of improving the dispersibility of the pigment, a group having a steric repulsion effect is preferred, and an alkyl group or alkoxy group having 5 to 30 carbon atoms is preferred. The alkyl and alkoxy groups may be linear, branched, or cyclic, and linear or branched are preferred.

Specific examples of the graft polymer include paragraphs 0025 to 0094 of JP-A-2012-255128 , paragraphs 0022-0097 of JP-A-2009-203462 , and paragraphs 0102 and 2012 of JP-A-2012-255128 . ~ Resins described in paragraph 0166.

Examples of the star polymer include resins having a structure in which a plurality of polymer chains are bonded to the core. Specific examples of the star polymer include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962 .

Examples of resins in which at least one end of the polymer chain is sealed with an acid group include at least one of polymer chains containing at least one structure selected from the group consisting of polyester structures, polyether structures, and poly(meth)acrylic acid structures. A resin whose ends are sealed with acid groups. Examples of the acid group sealing the terminal of the polymer chain include a carboxyl group, a sulfo group, and a phosphoric acid group.

Other resins can also be used as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the acidic dispersant (acidic resin) means a resin having more acidic groups than basic groups. As the acidic dispersant (acidic resin), when the total amount of the amount of acid groups and the amount of basic groups is 100 mol%, a resin having an amount of acid groups of 70 mol% or more is preferable. The acidic group contained in the acidic dispersant (acidic resin) is preferably a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10-105 mgKOH/g. In addition, the basic dispersant (basic resin) means a resin having more basic groups than acid groups. As the basic dispersant (basic resin), when the total amount of the amount of acid groups and the amount of basic groups is 100 mol%, the resin with the amount of basic groups exceeding 50 mol% is preferable. It is preferable that the basic group which the basic dispersant has is an amine group.

The dispersant can also be obtained as a commercial product, and as such specific examples, the Disperbyk series manufactured by BYK Chemie (such as Disperbyk-111, 161, 2001, etc.), the SOLSPERSE series manufactured by Lubrizol Japan Limited (such as SOLSPERSE 20000, 76500, etc.), AJISPER series manufactured by Ajinomoto Fine-Techno Co., Inc., A208F (manufactured by DKS Co. Ltd.), H-3606 (manufactured by DKS Co. Ltd.), SANDET ET (manufactured by Sanyo Chemical Industries, Ltd. . System), etc. Moreover, the product described in paragraph 0129 of JP-A-2012-137564 and the product described in paragraph 0235 of JP-A-2017-194662 can also be used as a dispersant.

It is preferable that content of the resin in the total solid content of a resin composition is 1-50 mass %. The upper limit is preferably at most 40% by mass, more preferably at most 30% by mass. The lower limit is preferably at least 5% by mass, more preferably at least 10% by mass.

It is preferable that content of the specific resin in the total solid content of a resin composition is 1-10 mass %. The upper limit is preferably at most 9% by mass, more preferably at most 7.5% by mass. The lower limit is preferably at least 1.5% by mass, more preferably at least 3% by mass.

It is preferable that content of the specific resin among the resin contained in a resin composition is 1-30 mass %. The upper limit is preferably at most 25% by mass, more preferably at most 20% by mass. The lower limit is preferably at least 3% by mass, more preferably at least 5% by mass.

The resin composition of this invention may contain only 1 type of resin, and may contain 2 or more types. When containing 2 or more types of resin, it is preferable that these total amounts are in the said range.

＜＜Polymer compound＞＞ It is preferable that the resin composition of this invention has a polymeric compound. Examples of the polymerizable compound include compounds having an ethylenically unsaturated bond-containing group, and the like. Examples of the ethylenically unsaturated bond-containing group include vinyl, (meth)allyl, (meth)acryl, and the like. The polymerizable compound used in the present invention is preferably a radically polymerizable compound.

The polymerizable compound may be in any chemical form such as a monomer, a prepolymer, or an oligomer, but a monomer is preferred. It is preferable that the molecular weight of a polymeric compound is 100-2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

From the viewpoint of temporal stability of the resin composition, it is preferable that the ethylenically unsaturated bond-containing group value (hereinafter referred to as C=C value) of the polymerizable compound is 2 to 14 mmol/g. The lower limit is preferably at least 3 mmol/g, more preferably at least 4 mmol/g, and still more preferably at least 5 mmol/g. The upper limit is preferably at most 12 mmol/g, more preferably at most 10 mmol/g, and still more preferably at most 8 mmol/g. The C=C value of the polymerizable compound is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the polymerizable compound by the molecular weight of the polymerizable compound.

The polymerizable compound is preferably a compound containing 3 or more ethylenically unsaturated bond-containing groups, and more preferably a compound containing 4 or more ethylenically unsaturated bond-containing groups. From the viewpoint of temporal stability of the resin composition, the upper limit of the ethylenically unsaturated bond-containing groups is preferably 15 or less, more preferably 10 or less, and still more preferably 6 or less. Furthermore, the polymerizable compound is preferably a trifunctional or higher (meth)acrylate compound, more preferably a 3-15 functional (meth)acrylate compound, and a 3-10 functional (meth)acrylate compound is More preferably, a 3-6 functional (meth)acrylate compound is especially preferable. Specific examples of polymerizable compounds include paragraphs 0095 to 0108 of JP-A-2009-288705, paragraphs 0227 of JP-A-2013-029760, and paragraphs 0254-0257 of JP-A-2008-292970. , Paragraph 0034-0038 of JP-A-2013-253224, paragraph 0477 of JP-A-2012-208494, JP-A-2017-048367, JP-A-6057891, JP-A-6031807 The compounds described are incorporated into this specification.

Examples of the polymerizable compound include diperythritol tri(meth)acrylate, diperythritol tetra(meth)acrylate, dippentyl penta(meth)acrylate, dipentyl Tetrol hexa(meth)acrylate and modified products of these compounds, etc. Examples of modifiers include ethoxylated dipenteoerythritol hexa(meth)acrylate, compounds having a structure in which (meth)acryloyl groups of the above-mentioned compounds are bonded via alkyleneoxy groups, and the like. Specific examples include compounds represented by formula (Z-4), compounds represented by formula (Z-5), and the like.

[chem 23]

In formulas (Z-4) and (Z-5), E independently represent -((CH ₂ ) _y CH ₂ O)- or -((CH ₂ ) _y CH(CH ₃ )O)-, y respectively independently represent an integer of 0 to 10, and X each independently represent a (meth)acryl group, a hydrogen atom, or a carboxyl group. In formula (Z-4), the total number of (meth)acryloyl groups is 3 or 4, m each independently represents an integer of 0-10, and the total number of each m is an integer of 0-40. In formula (Z-5), the total number of (meth)acryloyl groups is 5 or 6, n each independently represents an integer of 0-10, and the total number of each n is an integer of 0-60.

In formula (Z-4), m is preferably an integer of 0-6, more preferably an integer of 0-4. Moreover, it is preferable that the total of each m is an integer of 2-40, the integer of 2-16 is more preferable, and the integer of 4-8 is especially preferable. In formula (Z-5), n is preferably an integer of 0-6, more preferably an integer of 0-4. Moreover, it is preferable that the total of each n is an integer of 3-60, the integer of 3-24 is more preferable, and the integer of 6-12 is especially preferable. Also, E in formula (Z-4) or formula (Z-5), namely -((CH ₂ ) _y CH ₂ O)- or -((CH ₂ ) _y CH(CH ₃ )O)- is The form in which the terminal on the oxygen atom side is bonded to X is preferable.

Moreover, as a polymeric compound, the polyneopentaerythritol poly(meth)acrylate represented by following formula (Z-6) can also be used. [chem 24] In formula (Z-6), X ¹ to X ⁶ each independently represent a hydrogen atom or a (meth)acryloyl group, and n represents an integer of 1-10. However, at least one of X ¹ to X ⁶ is a (meth)acryloyl group.

The polymeric compound used in the present invention is selected from the group consisting of diperythritol hexa(meth)acrylate, dipenteoerythritol penta(meth)acrylate, polyneopentaerythritol poly(meth)acrylate And at least one of the group of these modified bodies is preferable. Commercially available products include KAYARAD D-310, DPHA, DPEA-12 (manufactured by Nippon Kayaku Co., Ltd.), NK ESTER A-DPH-12E, TPOA-50 (by Shin-Nakamura Chemical Co., Ltd.), etc.

Also, as the polymerizable compound, diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available, M-460; manufactured by TOAGOSEI CO., LTD.), neopentylitol Tetra(meth)acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), NK OLIGO UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by TAISEI FINE CHEMICAL CO,. LTD.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL CO., LTD.), EBECRYL80 (manufactured by DAICEL-ALLNEX LTD., amine-containing tetrafunctional acrylate), etc.

Also, as polymerizable compounds, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane ethylene oxide modified Trifunctional (meth)acrylate compounds such as tri(meth)acrylate, isocyanuric acid ethylene oxide modified tri(meth)acrylate, neopentylitol tri(meth)acrylate, etc. better. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 ( Nippon Kayaku Co., Ltd.), etc.

Moreover, as a polymerizable compound, the compound which has an acid group, such as a carboxyl group, a sulfo group, and a phosphoric acid group, can also be used. Commercially available products of such compounds include ARONIX M-305, M-510, M-520, ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), and the like.

Moreover, the compound which has a caprolactone structure can also be used as a polymeric compound. Regarding the compound having the caprolactone structure, the description in paragraphs 0042 to 0045 of JP-A-2013-253224 can also be referred to, and the content is incorporated in this specification. As for the compound which has a caprolactone structure, DPCA-20, DPCA-30, DPCA-60, DPCA-120 etc. marketed by Nippon Kayaku Co., Ltd. as KAYARAD DPCA series are mentioned, for example.

In addition, as the polymerizable compound, a polymerizable compound having a fennel skeleton can also be used. As a commercial item, OGSOL EA-0200, EA-0300 (Osaka Gas Chemicals Co., Ltd. make, the (meth)acrylate monomer which has a fennel skeleton) etc. are mentioned.

Moreover, it is also preferable to use a compound which does not substantially contain environmental control substances, such as toluene, as a polymeric compound. Commercially available products of such compounds include KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.), and the like.

In addition, as polymerizable compounds, such as the amino groups described in JP-A-48-041708, JP-A-51-037193, JP-A-02-032293, JP-A-02-016765 Formate acrylates or Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 have ethylene oxide Urethane compounds with an alkane skeleton are also preferred. In addition, polymerizable compounds having an amino structure or a thioether structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238 are used. Also better. In addition, as the polymerizable compound, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, Commercial items such as AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO., LTD.).

It is preferable that content of the polymeric compound in the total solid content of a resin composition is 1-30 mass %. The upper limit is preferably at most 25% by mass, more preferably at most 20% by mass, and still more preferably at most 10% by mass. The lower limit is preferably at least 2% by mass. The resin composition of this invention may contain only 1 type of polymeric compound, and may contain 2 or more types. When containing 2 or more types of polymeric compounds, it is preferable that these total amounts are in the said range.

＜＜Photopolymerization Initiator＞＞ The resin composition of the present invention can contain a photopolymerization initiator. When the resin composition of the present invention contains a polymerizable compound, it is preferable that the resin composition of the present invention further contains a photopolymerization initiator. It does not specifically limit as a photoinitiator, It can select suitably from well-known photoinitiator. For example, a compound having photosensitivity to rays from the ultraviolet range to the visible range is preferable. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (for example, compounds having a trioxane skeleton, compounds having a oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic Peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, and the like. From the viewpoint of exposure sensitivity, photopolymerization initiators are trihalomethyl triazine compounds, benzyl dimethyl ketal compounds, α-hydroxy ketone compounds, α-amino ketone compounds, acyl Phosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, hexaarylbisimidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes Compounds, halomethyl oxadiazole compounds and 3-aryl substituted coumarin compounds are preferred, and compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and acyl phosphine compounds are more preferred Preferably, an oxime compound is further more preferred. Also, examples of photopolymerization initiators include compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in JP-A-6301489, MATERIAL STAGE 37-60p, vol. .19, No.3, 2019, the peroxide-based photopolymerization initiator, the photopolymerization initiator described in International Publication No. 2018/221177, and the photopolymerization initiator described in International Publication No. 2018/110179 Photopolymerization initiator, photopolymerization initiator described in JP 2019-043864 A, photopolymerization initiator described in JP 2019-044030 A, JP 2019-167313 A The peroxide-based initiator described in JP-A-2020-055992, the aminoacetophenone-based initiator with oxazolidinyl group described in JP-A No. 2013-190459 Oxime-based photopolymerization initiators described, polymers described in JP-A-2020-172619, compounds represented by formula 1 described in International Publication No. 2020/152120, JP-A-2021-181406 Compounds described in the gazette, photopolymerization initiators described in JP 2022-013379 A, compounds represented by formula (1) described in JP 2022-015747 A, JP 2021- Fluorine-containing stilbexime ester-based photopolymerization initiators described in Gazette No. 507058, photopolymerization initiators described in Chinese Patent Application Publication No. 110764367, and JP 2022-518535 Gazette A photopolymerization initiator, a photopolymerization initiator described in International Publication No. 2021/175855, and the like are incorporated in this specification.

Specific examples of hexaarylbisimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-bis Phenyl-1,1'-biimidazole, etc.

Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (the above are manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, Irgacure 127 (the above are manufactured by BASF company), etc. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (the above are manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (the above are BASF Corporation), etc. Examples of commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (the above are manufactured by IGM Resins B.V.), Irgacure 819, and Irgacure TPO (the above are manufactured by BASF Corporation), and the like.

Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J.C.S. Compounds described in Perkin II (1979, pp.1653-1660), compounds described in J.C.S. Perkin II (1979, pp.156-162), Journal of Photopolymer Science and Technology (1995, pp.202) -232), compounds described in JP-A-2000-066385, compounds described in JP-A-2004-534797, compounds described in JP-A-2006-342166 , Compounds described in Japanese Patent Application Laid-Open No. 2017-019766, Compounds described in Japanese Patent No. 6065596, Compounds described in International Publication No. 2015/152153, International Publication No. 2017/051680 Compounds described in JP-A-2017-198865, compounds described in paragraphs 0025-0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. Specific examples of oxime compounds include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, Aminobutan-2-one, 2-Acetyloxyiminopentan-3-one, 2-Acetyloxyimino-1-phenylpropan-1-one, 2-Benzoyl Oxyimino-1-phenylpropan-1-one, 3-(4-tosyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1 -Phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (the above are manufactured by BASF Corporation), TR-PBG-304, TR-PBG-327 (manufactured by TRONLY Corporation), ADEKA OPTOMER N-1919 ( ADEKA Corporation make, and the photoinitiator 2) described in Unexamined-Japanese-Patent No. 2012-014052. In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and low discoloration. As a commercial item, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (the above are made by ADEKA CORPORATION) etc. are mentioned.

As a photopolymerization initiator, an oxime compound having an oxene ring can also be used. Specific examples of oxime compounds having a stilbene ring include compounds described in JP-A-2014-137466, compounds described in JP-A-6636081, Korean Laid-Open Patent No. 10-2016-0109444 Compounds listed in the gazette.

An oxime compound having a skeleton in which at least one benzene ring in a carbazole ring becomes a naphthalene ring can also be used as a photopolymerization initiator. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.

An oxime compound having a fluorine atom can also be used as a photopolymerization initiator. Specific examples of oxime compounds having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36-40 described in JP-A-2014-500852, JP-A Compound (C-3) described in Publication No. 2013-164471, etc.

As a photopolymerization initiator, an oxime compound having a nitro group can be used. It is also preferable to form an oxime compound having a nitro group as a dimer. Specific examples of oxime compounds having a nitro group include compounds described in paragraphs 0031 to 0047 of JP-A-2013-114249 and in paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466 , Compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

An oxime compound having a benzofuran skeleton can also be used as a photopolymerization initiator. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

An oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used as a photopolymerization initiator. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.

As the photopolymerization initiator, an oxime compound (hereinafter also referred to as an oxime compound OX) having an aromatic ring group Ar ^OX1 in which an electron-withdrawing group is introduced into an aromatic ring can also be used. Examples of the electron-withdrawing group included in the aromatic ring group Ar ^OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, Arylsulfonyl, cyano, acyl and nitro are preferred, acyl is more preferred, and benzoyl is still more preferred. The benzoyl group may have a substituent. As a substituent, a halogen atom, a cyano group, a nitro group, a hydroxyl group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic epoxy group, an alkenyl group, an alkylsulfanyl group, an arylthio group Alkyl, acyl or amine are preferred, alkyl, alkoxy, aryl, aryloxy, heteroepoxy, alkylsulfanyl, arylsulfanyl or amine are more preferred, alkyl An oxy group, an alkylsulfanyl group or an amino group is further preferred.

The oxime compound OX is preferably at least one selected from the compound represented by the formula (OX1) and the compound represented by the formula (OX2), more preferably the compound represented by the formula (OX2). [chem 25] In the formula, R ^X1 represents an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic epoxy group, an alkylsulfanyl group, an arylsulfanyl group, an alkylsulfinyl group , arylsulfinyl, alkylsulfonyl, arylsulfonyl, acyl, acyloxy, amino, phosphonyl, carbamoyl or sulfamoyl, R ^X2 represents alkyl, Alkenyl, alkoxy, aryl, aryloxy, heterocyclyl, heterocyclyloxy, alkylsulfanyl, arylsulfanyl, alkylsulfinyl, arylsulfinyl, alkyl A sulfonyl group, an arylsulfonyl group, an acyloxy group or an amino group, and R ^X3 to R ^X14 each independently represent a hydrogen atom or a substituent; however, at least one of R ^X10 to R ^X14 is an electron-withdrawing group.

Examples of the electron-withdrawing group include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, a cyano group, and an acyl group. A group and a nitro group are preferred, an acyl group is more preferred, and a benzoyl group is further preferred.

In the above formula, R ^X12 is an electron-withdrawing group, and R ^X10 , R ^X11 , R ^X13 , and R ^X14 are preferably hydrogen atoms.

Specific examples of the oxime compound OX include compounds described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600.

Specific examples of oxime compounds preferably used in the present invention are shown below, but the present invention is not limited thereto.

[chem 26] [chem 27] [chem 28]

The oxime compound is preferably a compound having a maximum absorption wavelength within a wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength within a wavelength range of 360 to 480 nm. Also, from the viewpoint of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or 405 nm, more preferably 1,000 to 300,000, still more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorptivity of a compound can be measured using a known method. For example, it is preferable to measure at a concentration of 0.01 g/L using an ethyl acetate solvent with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).

It is also preferable to use Irgacure OXE01 (manufactured by BASF) and/or Irgacure OXE02 (manufactured by BASF) in combination with Omnirad 2959 (manufactured by IGM Resins B.V.) as a photopolymerization initiator.

As the photopolymerization initiator, a bifunctional or trifunctional or higher photoradical polymerization initiator can be used. By using such radical photopolymerization initiators, two or more radicals are generated from one molecule of the radical photopolymerization initiators, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity is lowered, the solubility in a solvent or the like is improved, and precipitation becomes difficult over time, thereby improving the temporal stability of the resin composition. Specific examples of difunctional or trifunctional or more photoradical polymerization initiators include JP 2010-527339, JP 2011-524436, International Publication No. 2015/004565, JP Dimers of oxime compounds described in paragraphs 0407 to 0412 of Table No. 2016-532675, paragraphs 0039 to 0055 of International Publication No. 2017/033680, compounds described in Japanese Patent Publication No. 2013-522445 (E ) and compound (G), Cmpd 1-7 described in International Publication No. 2016/034963, the oxime ester photoinitiator described in paragraph 0007 of JP 2017-523465, JP 2017- Photoinitiators described in paragraphs 0020 to 0033 of Japanese Patent Application Publication No. 167399, photopolymerization initiators (A) described in paragraphs 0017 to 0026 of Japanese Patent Application Laid-Open No. 2017-151342, and Japanese Patent Publication No. 6469669 The oxime ester photoinitiator etc. described.

It is preferable that content of the photoinitiator in the total solid content of a resin composition is 0.1-20 mass %. The lower limit is preferably at least 0.5% by mass, more preferably at least 1% by mass. The upper limit is preferably at most 15% by mass, more preferably at most 10% by mass. In the resin composition of this invention, only 1 type may be used for a photoinitiator, and 2 or more types may be used. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Solvent＞＞ It is preferable that the resin composition of this invention contains a solvent. An organic solvent is mentioned as a solvent. The type of solvent is basically not particularly limited as long as it satisfies the solubility of each component and the applicability of the composition. Examples of the organic solvent include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. Regarding such details, refer to paragraph 0223 of International Publication No. 2015/166779, which is incorporated in this specification. Also, a cyclic alkyl-substituted ester solvent and a cyclic alkyl-substituted ketone solvent can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celuxoacetate , ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone , 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, Butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylacrylamide, 3-butoxy-N,N-di Methacrylamide, Propylene Glycol Diacetate, 3-Methoxybutanol, Methyl Ethyl Ketone, Gamma-Butyrolactone, Cyclobutane, Anisole, 1,4-Diacetyloxybutanol alkane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl yl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, sometimes it is better to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents due to environmental reasons (for example, it can be set to 50% by mass relative to the total amount of organic solvents) ppm (parts per million) or less, may be 10 mass ppm or less, may also be 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent with a low metal content. The metal content of the organic solvent is preferably, for example, 10 mass ppb (parts per billion, one part per billion) or less. According to needs, organic solvents of ppt (parts per trillion) level can be used, such organic solvents are provided by Toyo Gosei Co., Ltd, for example (Chemical Industry Daily, November 13, 2015).

Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and still more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene or nylon.

Organic solvents may contain isomers (compounds with the same atomic number but different structures). In addition, the isomer may contain only 1 type, and may contain plural types.

The content rate of the peroxide in an organic solvent is preferably 0.8 mmol/L or less, and it is more preferable not to contain a peroxide substantially.

The content of the solvent in the resin composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and still more preferably from 30 to 90% by mass.

Moreover, it is preferable that the resin composition of this invention does not contain an environmental control substance substantially from a viewpoint of environmental control. Furthermore, in the present invention, substantially not containing environmental control substances means that the content of environmental control substances in the resin composition is 50 mass ppm or less, preferably 30 mass ppm or less, and more preferably 10 mass ppm or less. 1 mass ppm or less is particularly preferred. Examples of environmental control substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzenes such as chlorobenzene. These are registered as environmental control substances under REACH (Registration Evaluation Authorization and Restriction of Chemicals) control, PRTR (Pollutant Release and Transfer Register) law, VOC (Volatile Organic Compounds) control, etc., and their usage and disposal methods are strictly regulated. These compounds may be used as solvents in the production of components used in resin compositions, etc., and may be mixed into resin compositions as residual solvents. From the standpoint of human safety and environmental considerations, it is preferable to reduce these substances as much as possible. As a method for reducing the environmentally regulated substances, there may be mentioned a method of heating and reducing pressure in the system to a temperature equal to or higher than the boiling point of the environmentally regulated substances, and distilling the environmentally regulated substances from the system to reduce them. In addition, when distilling a small amount of environmentally controlled substances, it is also useful to make the solvent azeotrope with a solvent having the same boiling point in order to improve efficiency. In addition, when a compound having radical polymerizability is contained, a polymerization inhibitor or the like may be added for vacuum distillation in order to suppress intermolecular crosslinking due to radical polymerization during vacuum distillation. These distillation methods can be performed at any stage of raw materials, products of reacting raw materials (such as polymerized resin solutions and polyfunctional monomer solutions), or resin compositions prepared by mixing these compounds, etc. carried out in one stage.

＜＜Thermohardener＞＞ The resin composition of the present invention may contain a thermosetting agent as a component other than the aforementioned resin and polymerizable compound. As a thermosetting agent, the compound which has a cyclic ether group is mentioned. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed. It is preferable that the compound which has a cyclic ether group is a compound which has an epoxy group (it is also called an epoxy compound hereafter). As an epoxy compound, the compound which has 1 or more epoxy groups in 1 molecule is mentioned, The compound which has 2 or more epoxy groups is preferable. The epoxy compound is preferably a compound having 1 to 100 epoxy groups in 1 molecule. The upper limit of the epoxy group contained in an epoxy compound can be 10 or less, for example, and can also be 5 or less. It is preferable that the lower limit of the epoxy group contained in an epoxy compound is 2 or more. As the epoxy compound, it is also possible to use paragraphs 0034-0036 of JP-A-2013-011869, paragraphs 0147-0156 of JP-A-2014-043556, and paragraphs 0085-0092 of JP-A-2014-089408. The compounds described are the compounds described in JP-A-2017-179172. These contents are incorporated into this manual.

Compounds with cyclic ether groups can be low-molecular compounds (for example, the molecular weight is less than 2000, and the molecular weight is less than 1000), and they can also be macromolecules (for example, the molecular weight is more than 1000, in the case of polymers) , and the weight average molecular weight is above 1000). The weight average molecular weight of the compound having a cyclic ether group is preferably from 200 to 100,000, more preferably from 500 to 50,000. The upper limit of the weight average molecular weight is more preferably 10,000 or less, particularly preferably 5,000 or less, and still more preferably 3,000 or less.

Examples of commercially available compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC CORPORATION), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP . Moreover, the compound described in the Example mentioned later can also be used as a compound which has a cyclic ether group.

It is preferable that content of the thermosetting agent in the total solid content of a resin composition is 0.1-20 mass %. The lower limit is, for example, more preferably 0.5 mass % or more, and still more preferably 1 mass % or more. The upper limit is, for example, more preferably 15 mass % or less, and further preferably 10 mass % or less. A thermosetting agent may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Polyalkyleneimine＞＞ The resin composition of the present invention can also contain polyalkyleneimine. Polyalkyleneimines are used, for example, as dispersing aids for pigments. The dispersing aid refers to a material for improving the dispersibility of color materials such as pigments in the resin composition. Polyalkyleneimine refers to a polymer formed by ring-opening polymerization of alkyleneimine. It is preferable that the polyalkyleneimine is a polymer having a branched chain structure respectively containing a primary amine group, a secondary amine group and a tertiary amine group. The carbon number of the alkyleneimine is preferably 2-6, more preferably 2-4, further preferably 2 or 3, and particularly preferably 2.

The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, still more preferably 10,000 or less, and particularly preferably 2,000 or less. In addition, about the value of the molecular weight of a polyalkylene imine, when molecular weight can be calculated from a structural formula, the molecular weight of a polyalkylene imine is the value calculated from a structural formula. On the other hand, in the case where the molecular weight of the specific amine compound cannot be calculated from the structural formula or is difficult to calculate, the value of the number average molecular weight measured by the boiling point increase method is used. Also, when it is impossible or difficult to measure by the boiling point elevation method, the value of the number average molecular weight measured by the viscosity method is used. Moreover, when it cannot measure by a viscosity method or it is difficult to measure by a viscosity method, the value of the number average molecular weight in terms of polystyrene conversion value measured by the GPC (gel permeation chromatography) method is used.

The amine value of the polyalkyleneimine is preferably at least 5 mmol/g, more preferably at least 10 mmol/g, and still more preferably at least 15 mmol/g.

Specific examples of alkyleneimine include ethyleneimine, propyleneimine, 1,2-buteneimine, 2,3-buteneimine, etc., and ethyleneimine or propyleneimine is preferable. , ethyleneimine is more preferred. The polyalkyleneimine is particularly preferably polyethyleneimine. Furthermore, relative to the total of the primary amine groups, secondary amine groups, and tertiary amine groups, polyethyleneimine preferably contains 10 mol% or more of primary amine groups, more preferably 20 mol% or more, and contains 30 mol% or more. Mole % or more is further preferred. Examples of commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (manufactured by NIPPON SHOKUBAI CO., LTD.). .

The content of the polyalkyleneimine in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The lower limit is preferably at least 0.2% by mass, more preferably at least 0.5% by mass, and still more preferably at least 1% by mass. The upper limit is preferably at most 4.5% by mass, more preferably at most 4% by mass, and still more preferably at most 3% by mass. Moreover, it is preferable that content of polyalkyleneimine is 0.5-20 mass parts with respect to 100 mass parts of pigments. The lower limit is preferably at least 0.6 parts by mass, more preferably at least 1 part by mass, and still more preferably at least 2 parts by mass. The upper limit is preferably at most 10 parts by mass, more preferably at most 8 parts by mass. The polyalkyleneimine may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

＜＜Hardening Accelerator＞＞ The resin composition of the present invention may contain a curing accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine chloride compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, onium salt compounds, and the like. Specific examples of the hardening accelerator include compounds described in paragraphs 0094 to 0097 of International Publication No. 2018/056189, compounds described in paragraphs 0246 to 0253 of Japanese Patent Application Laid-Open No. 2015-034963, Japanese Patent Application Laid-Open No. Compounds described in paragraphs 0186 to 0251 of JP-A-2013-041165, ionic compounds described in JP-A-2014-055114, and paragraphs 0071-0080 of JP-A-2012-150180 Compound, an alkoxysilane compound having an epoxy group described in JP-A-2011-253054, a compound described in paragraphs 0085-0092 of JP-A No. 5765059, JP-A-2017-036379 Carboxyl-containing epoxy hardeners as described in The content of the hardening accelerator in the total solid content of the resin composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass.

<<ultraviolet absorber>> The resin composition of the present invention can contain an ultraviolet absorber. Examples of the ultraviolet absorber include conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriene compounds, indoles Indole compounds, trisulfone compounds, dibenzoyl compounds, etc. Specific examples of such compounds include paragraphs 0038 to 0052 of JP 2009-217221, paragraphs 0052 to 0072 of JP 2012-208374, and paragraphs 0317 to 0072 of JP 2013-068814. The compounds described in Paragraph 0334 and Paragraphs 0061 to 0080 of JP-A-2016-162946 are incorporated in this specification. As a specific example of an ultraviolet absorber, the compound etc. of the following structures are mentioned. Commercially available ultraviolet absorbents include, for example, UV-503 (manufactured by DAITO CHEMICAL CO., LTD.), Tinuvin series and Uvinul series produced by BASF Corporation, Sumika Chemtex Company, Limited Sumisorb series, and the like. Moreover, as a benzotriazole compound, MYUA series by MIYOSHI OIL & FAT CO., LTD. is mentioned (Chemical Industry Daily, February 1, 2016). In addition, as the ultraviolet absorber, compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059 to 0076 of International Publication No. 2016/181987, and compounds described in International Publication No. 2020/137819 can also be used. Thioaryl substituted benzotriazole UV absorbers described in [chem 29]

The content of the ultraviolet absorber in the total solid content of the resin composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. The ultraviolet absorber may be only 1 type, and may be 2 or more types. In the case of two or more, the total amount is preferably within the above range.

＜＜Polymerization inhibitor＞＞ The resin composition of the present invention can contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, pyrogallol, tertiary butylcatechol, benzoquinone, 4,4' -Thiobis(3-methyl-6-tertiary butylphenol), 2,2'-methylenebis(4-methyl-6-tertiary butylphenol), N-nitrosophenyl Hydroxylamine salts (ammonium salts, primary cerium salts, etc.). Among them, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5% by mass. A polymerization inhibitor may be only 1 type, and may be 2 or more types. In the case of two or more, the total amount is preferably within the above range.

＜＜Silane coupling agent＞＞ The resin composition of the present invention can contain a silane coupling agent. In this specification, a silane coupling agent refers to a silane compound having a hydrolyzable group and a functional group other than it. Also, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As a hydrolyzable group, a halogen atom, an alkoxy group, an acyloxy group etc. are mentioned, for example, An alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)allyl groups, (meth)acryl groups, mercapto groups, epoxy groups, oxetanyl groups, amine groups, and urea groups. group, thioether group, isocyanate group, phenyl group, etc., amino group, (meth)acryl group and epoxy group are preferred. Specific examples of the silane coupling agent include N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-602), N-β-aminoethyl-γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-603), N-β-aminoethyl-γ-amine propyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-602), γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-903), γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-903), 3-methacryloxypropylmethyldimethoxy 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502), 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502) 503) etc. Further, specific examples of the silane coupling agent include compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraphs 0056-0066 of JP-A-2009-242604 , which are incorporated into this manual. The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.01 to 15% by mass, more preferably 0.05 to 10% by mass. Only 1 type may be sufficient as a silane coupling agent, and 2 or more types may be sufficient as it. In the case of two or more, the total amount is preferably within the above range.

＜＜Surfactant＞＞ The resin composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and polysiloxane-based surfactants can be used. The surfactant is preferably a polysiloxane-based surfactant or a fluorine-based surfactant. Regarding the surfactant, the surfactant described in paragraphs 0238 to 0245 of International Publication No. 2015/166779 can be referred to, and the content is incorporated in this specification.

The fluorine content in the fluorine-based surfactant is preferably from 3 to 40% by mass, more preferably from 5 to 30% by mass, and particularly preferably from 7 to 25% by mass. A fluorine-based surfactant having a fluorine content within this range is effective in terms of the uniformity of the thickness of the coating film and the liquid-saving properties, and its solubility in the resin composition is also good.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP-A-2014-041318 (corresponding to paragraphs 0060-0064 of International Publication No. 2014/017669), etc. The surfactants described in paragraphs 0117 to 0132 of KOKAI Publication No. 2011-132503 and the surfactants described in JP-A-2020-008634 are incorporated in this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F- 144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F- 560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (manufactured by DIC CORPORATION), FLUORAD FC430, FC431, FC171 ( The above are manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (above Made by AGC INC.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (the above are made by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FT X- 218 (the above are made by NEOS), etc.

As the fluorine-based surfactant, an acrylic compound having a molecular structure having a functional group containing a fluorine atom is preferably used, and when heat is applied, the functional group containing a fluorine atom is partially cut and the fluorine atom is volatilized. Examples of such fluorine-based surfactants include MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, MEGAFACE DS-21.

As the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine-atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. Examples of such fluorine-based surfactants include fluorine-based surfactants described in JP-A-2016-216602, which are incorporated in the present specification.

As the fluorine-based surfactant, a blocked polymer can also be used. Fluorine-based surfactants can also preferably use fluorine-containing polymer compounds, which include: repeating units derived from (meth)acrylate compounds having fluorine atoms; It is preferably a repeating unit of (meth)acrylate compound of 5 or more) alkyleneoxy (preferably ethyleneoxy, propyleneoxy). In addition, the fluorine-containing surfactant described in paragraphs 0016 to 0037 of JP-A-2010-032698 and the following compounds are also exemplified as the fluorine-based surfactant used in the present invention. [chem 30] The weight average molecular weight of the above compound is preferably 3000-50000, for example 14000. In the above-mentioned compounds, % representing the ratio of repeating units is mole %.

In addition, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group on a side chain can also be used. Specific examples include the compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102, RS-718K, RS- 72-K et al. Moreover, the compound described in paragraph 0015-0158 of Unexamined-Japanese-Patent No. 2015-117327 can also be used as a fluorine-type surfactant.

Also, from the viewpoint of environmental control, it is also preferable to use the surfactant described in International Publication No. 2020/084854 as a substitute for the surfactant having a perfluoroalkyl group having 6 or more carbon atoms.

Furthermore, it is also preferable to use a fluoroimide chlorine-containing compound represented by the formula (fi-1) as a surfactant. [chem 31] In the formula (fi-1), m represents 1 or 2, n represents an integer from 1 to 4, a represents 1 or 2, X ^a+ represents a-valent metal ions, primary ammonium ions, secondary ammonium ions, and tertiary ammonium ions , quaternary ammonium ion or NH ₄ ⁺ .

Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propane Oxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonyl ether Phenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF Corporation) , Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF Corporation), Solsperse 20000 (manufactured by Japan Lubrizol Corporation), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D -6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

Examples of polysiloxane-based surfactants include DOWSIL SH8400, SH 8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (manufactured by Dow Toray Co., Ltd.), TSF- 4300, TSF-4445, TSF-4460, TSF-4452 (the above are manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (the above are Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (the above are manufactured by BYK Chemie), etc.

Moreover, the compound of the following structures can also be used among polysiloxane-type surfactants. [chem 32]

The content of the surfactant in the total solid content of the resin composition is preferably 0.001% by mass to 5% by mass, more preferably 0.005% to 3% by mass. Surfactant may be only 1 type, and may be 2 or more types. In the case of two or more, the total amount is preferably within the above range.

＜＜Antioxidant＞＞ The resin composition of the present invention can contain an antioxidant. As an antioxidant, a phenolic compound, a phosphite compound, a thioether compound, etc. are mentioned. As the phenolic compound, any phenolic compound called a phenolic antioxidant can be used. A hindered phenol compound is mentioned as a preferable phenol compound. A compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable. Moreover, it is also preferable that an antioxidant is a compound which has a phenolic group and a phosphite group in the same molecule. Moreover, phosphorus antioxidant can also be used preferably as an antioxidant. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2] Dioxaphosphine-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tertiary butyldibenzo[d,f] [1,3,2]dioxaphosphine-2-yl)oxy]ethyl]amine, bis(2,4-di-tertiary butyl-6-methylphenyl) Ethyl phosphate etc. Examples of commercially available antioxidants include ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (the above are manufactured by ADEKA Corporation), etc. In addition, as an antioxidant, compounds described in paragraphs 0023 to 0048 of Patent No. 6268967, compounds described in International Publication No. 2017/006600, compounds described in International Publication No. 2017/164024, Korean A compound described in Publication Patent No. 10-2019-0059371. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Antioxidant may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that a total amount exists in the said range.

＜＜Other ingredients＞＞ The resin composition of the present invention may contain sensitizers, hardening accelerators, fillers, thermosetting accelerators, plasticizers and other additives (such as conductive particles, defoamers, flame retardants, leveling agents, etc.) , peeling accelerators, fragrances, surface tension regulators, chain transfer agents, etc.). Properties such as film physical properties can be adjusted by appropriately containing these components. Regarding these components, for example, reference can be made to the description in paragraph 0183 and subsequent paragraphs of Japanese Patent Application Publication No. 2012-003225 (paragraph 0237 of the corresponding U.S. Patent Application Publication No. 2013/0034812 specification), and the description in Japanese Patent Application Publication No. 2008-250074. 0101-0104, 0107-0109, etc., these contents are incorporated into this specification. Moreover, the resin composition of this invention may contain a latent antioxidant as needed. As potential antioxidants, there can be mentioned compounds in which the part that acts as an antioxidant is protected by a protecting group, and the protecting group is heated at 100 to 250°C or heated at 80 to 200°C in the presence of an acid/alkali catalyst. A compound that decomposes upon heating and acts as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219. As a commercial item of a latent antioxidant, ADEKA ARKLS GPA-5001 (made by ADEKA CORPORATION) etc. are mentioned.

The resin composition of the present invention may contain a metal oxide in order to adjust the refractive index of the obtained film. Examples of metal oxides include TiO ₂ , ZrO ₂ , Al ₂ O ₃ , SiO ₂ and the like. The primary particle size of the metal oxide is preferably from 1 to 100 nm, more preferably from 3 to 70 nm, and still more preferably from 5 to 50 nm. Metal oxides may have a core-shell structure. Also, in this case, the core portion may be hollow.

The resin composition of the present invention may contain a light resistance improver. Examples of light resistance improvers include compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, compounds described in paragraphs 0029-0034 of JP-A-2017-146350, compounds described in JP-A-2017-146350, JP-A Compounds described in paragraphs 0036-0037, 0049-0052 of No. 2017-129774, compounds described in paragraphs 0031-0034, 0058-0059 of JP-A No. 2017-129674, JP-A No. 2017-122803 Compounds described in paragraphs 0036 to 0037 and 0051 to 0054 of the publication, compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, and paragraphs 0034 to 0047 of Japanese Patent Application Laid-Open No. 2017-186546 The compounds described in paragraphs 0019 to 0041 of JP-A-2015-025116, the compounds described in paragraphs 0101-0125 of JP-A-2012-145604, and the compounds described in JP-A-2012-103475 Compounds described in paragraphs 0018 to 0021, compounds described in paragraphs 0015 to 0018 of Japanese Patent Application Laid-Open No. 2011-257591, compounds described in paragraphs 0017 to 0021 of Japanese Patent Application Laid-Open No. 2011-191483, Japanese Patent Application Laid-Open No. Compounds described in paragraphs 0108 to 0116 of Unexamined Publication No. 2011-145668, compounds described in paragraphs 0103 to 0153 of Japanese Patent Application Laid-Open No. 2011-253174, and the like.

It is also preferable that the resin composition of the present invention does not substantially contain terephthalate. Here, "substantially not containing" means that the content of terephthalate in the total amount of the resin composition is 1000 mass ppb or less, more preferably 100 mass ppb or less, and particularly preferably zero.

The free metal content of the resin composition of the present invention is preferably 100 ppm or less, more preferably 50 ppm or less. The type of metal is not particularly limited, and examples thereof include alkali metals, alkaline earth metals, transition metals, Al, Sn, Pb, Bi, and the like. Also, the free halogen content is preferably 100 ppm or less, more preferably 50 ppm or less. Methods for reducing free metals and halogens in the resin composition include washing with ion-exchanged water, filtration, ultrafiltration, purification with emphasis on ion exchange, and the like.

From the viewpoint of environmental regulation, the use of perfluoroalkanesulfonic acids and their salts and perfluoroalkylcarboxylic acids and their salts are sometimes regulated. In the resin composition of the present invention, in the case of reducing the content of the above-mentioned compounds, perfluoroalkylsulfonic acid (especially, perfluoroalkylsulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and The content of its salt and perfluoroalkylcarboxylic acid (especially, perfluoroalkylcarboxylic acid with 6 to 8 carbon atoms in the perfluoroalkyl group) and its salt is 0.01ppb to 0.01ppb to the total solid content of the resin composition. The range of 1,000 ppb is preferable, the range of 0.05 ppb to 500 ppb is more preferable, and the range of 0.1 ppb to 300 ppb is still more preferable. The resin composition of the present invention may not substantially contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. For example, by using a compound that can replace perfluoroalkylsulfonic acid and its salt and a compound that can replace perfluoroalkylcarboxylic acid and its salt, it is also possible to select a compound that does not substantially contain perfluoroalkylsulfonic acid and its salt and Resin composition of perfluoroalkyl carboxylic acid and its salt. Examples of compounds that can be substituted for regulated compounds include compounds that are excluded from regulated objects due to differences in the carbon number of perfluoroalkyl groups. However, the above-mentioned content does not prevent the use of perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. The resin composition of the present invention may also contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt within the maximum allowable range.

The water content of the resin composition of the present invention is usually 3% by mass or less, preferably 0.01 to 1.5% by mass, more preferably 0.1 to 1.0% by mass. Moisture content can be measured by the Karl Fischer method.

The resin composition of the present invention can be used with its viscosity adjusted for adjustment of film surface shape (flatness, etc.), adjustment of film thickness, and the like. The value of the viscosity can be appropriately selected according to needs, but for example, at 25° C., it is preferably 0.3 mPa･s to 50 mPa･s, more preferably 0.5 mPa･s to 20 mPa･s. As a method of measuring the viscosity, for example, it can be measured using a cone-plate type viscometer with the temperature adjusted to 25°C.

＜＜Containment container＞＞ The container for the resin composition is not particularly limited, and known containers can be used. Also, as a storage container, for the purpose of suppressing impurities from mixing into the raw material or resin composition, it is also preferable to use a multi-layer bottle whose inner wall is composed of 6 types of 6-layer resins or a bottle with 6 types of resins in a 7-layer structure. As such a container, the container described in Unexamined-Japanese-Patent No. 2015-123351 is mentioned, for example. In addition, it is also preferable that the inner wall of the container is made of glass or stainless steel for the purpose of preventing elution of metal from the inner wall of the container, improving the stability of the resin composition over time, or suppressing deterioration of the components.

＜Preparation method of resin composition＞ The resin composition of the present invention can be prepared by mixing the aforementioned components. When preparing the resin composition, all the components can be dissolved and/or dispersed in the solvent at the same time to prepare the resin composition, and each component can also be suitably used as two or more solutions or dispersions as needed, and when used ( At the time of coating) these are mixed to prepare a resin composition.

Also, it is preferable to include a process of dispersing the pigment when preparing the resin composition. Examples of the mechanical force used to disperse the pigment in the process of dispersing the pigment include compression, extrusion, impact, shearing, cavitation, and the like. Specific examples of these processes include bead milling, sand milling, roller milling, ball milling, paint stirring, micro jets, high-speed impellers, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, and the like. In addition, in pulverization of pigments under sand milling (bead milling), it is preferable to perform treatment under the conditions that the pulverization efficiency can be improved by using small-diameter beads and increasing the filling rate of the microbeads. Moreover, it is preferable to remove coarse particles by filtration, centrifugation, etc. after pulverization. Also, regarding the process and dispersing machine for dispersing pigments, it is preferable to use "Compendium of Dispersion Technology, published by JOHOKIKO CO., LTD., July 15, 2005" or "Use Suspension (solid/liquid dispersion system) Dispersion technology and industrial practical application comprehensive data collection centered on it, published by the publishing department of the Management Development Center, October 10, 1978", the process and dispersion machine recorded in paragraph 0022 of Japanese Patent Application Laid-Open No. 2015-157893. In addition, in the process of dispersing the pigment, it is possible to carry out the micronization treatment of the particles by the salt milling step. For materials, equipment, processing conditions, and the like used in the salt milling step, for example, the descriptions in JP-A-2015-194521 and JP-A-2012-046629 can be referred to. Examples of materials for the dispersed microbeads include zirconia, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, alumina, stainless steel, and glass. In addition, an inorganic compound having a Mohs hardness of 2 or more can also be used for the microbeads. The above microbeads may be contained in the composition at 1 to 10000 ppm.

When preparing a resin composition, it is preferable to filter the resin composition with a filter in order to remove impurities or reduce defects. As a filter, if it is a filter conventionally used for a filtration use etc., it can use without limitation in particular. For example, fluorine resins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide-based resins such as nylon (such as nylon-6, nylon-6,6), polyethylene, polypropylene, etc. (PP) and other polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins) and other materials. Among these materials, polypropylene (including high density polypropylene) and nylon are preferred.

The pore size of the filter is preferably from 0.01 to 7.0 μm, more preferably from 0.01 to 3.0 μm, and still more preferably from 0.05 to 0.5 μm. As long as the pore size of the filter is within the above range, fine impurities can be removed more reliably. For the pore diameter value of the filter, you can refer to the nominal value of the filter manufacturer. As for the filter, various filters provided by NIHON PALL Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, etc. can be used.

Moreover, it is also preferable to use a fibrous filter material as a filter. As a fibrous filter material, a polypropylene fiber, a nylon fiber, a glass fiber etc. are mentioned, for example. Examples of commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.

When using filters, it is possible to combine different filters (for example, 1st filter and 2nd filter, etc.). In this case, the filtration by each filter may be performed only once, or may be performed two or more times. Also, filters with different pore diameters may be combined within the above range. Moreover, it is also possible to perform filtration with the 1st filter only for a dispersion liquid, and to filter with a 2nd filter after mixing other components. In addition, the filter can be appropriately selected according to the hydrophilicity and hydrophobicity of the composition.

＜Film＞ The film of the present invention is a film obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be used for optical filters such as color filters, near-infrared transmission filters, and near-infrared cut filters.

The film thickness of the film of this invention can be adjusted suitably according to the objective. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and still more preferably 5 μm or less. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.3 μm.

In the case of using the film of the present invention as a color filter, the film of the present invention preferably has a green, red, blue, cyan, magenta or yellow hue, more preferably has a green, blue or cyan hue, It is further preferred to have a green hue. Also, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels, among which red pixels are more preferred.

＜Membrane manufacturing method＞ Next, the method for producing the film of the present invention will be described. The film of the present invention can be produced through the step of applying the resin composition of the present invention. In the film manufacturing method, it is preferable to further include a step of forming a pattern (pixel). As a method for forming a pattern (pixel), photolithography and dry etching are mentioned, and photolithography is preferred. By forming a pattern by photolithography using the resin composition of the present invention, it is also possible to further suppress generation of development residue.

It is preferable that the pattern formation based on the photolithography method includes the following steps: using the resin composition of the present invention to form a resin composition layer on a support; exposing the resin composition layer into a pattern; The exposure part is developed and removed to form a pattern (pixel). If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixel) (post-baking step) may also be provided.

In the step of forming the resin composition layer, the resin composition layer of the present invention is used to form the resin composition layer on the support. It does not specifically limit as a support body, According to a use, it can select suitably. For example, a glass substrate, a silicon substrate, etc. are mentioned, and a silicon substrate is preferable. In addition, a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, and the like may be formed on the silicon substrate. In addition, a black matrix is sometimes formed on a silicon substrate to isolate each pixel. In addition, in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or planarize the surface of the substrate, a base layer may be provided on the silicon substrate. When measured with diiodomethane, the surface contact angle of the base layer is preferably 20-70°. Also, 30° to 80° is preferable when measured with water.

As a coating method of the resin composition, a known method can be used. For example, there may be mentioned dropping method (drip casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); , the method described in Japanese Patent Application Laid-Open No. 2009-145395); inkjet (such as on-demand method, piezoelectric method, thermal method), nozzle jetting and other discharge printing, flexographic printing, screen printing, gravure printing, Various printing methods such as reverse offset printing and metal mask printing; transfer printing using a mold, etc.; nanoimprinting, etc. The application method in inkjet is not particularly limited, for example, "Inkjet that can be promoted and used-infinite possibilities appearing in the patent-, issued in February 2005, Sumitbe Techon Research Co.,Ltd." The method shown (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830, The method described in Japanese Unexamined Patent Application Publication No. 2006-169325 and the like. In addition, regarding the coating method of the resin composition, the descriptions in International Publication No. 2017/030174 and International Publication No. 2017/018419 can be referred to, and these contents are incorporated in this specification.

The resin composition layer formed on the support may be dried (prebaked). In the case of producing a film by a low-temperature process, pre-baking may not be performed. In the case of prebaking, the prebaking temperature is preferably 150° C. or lower, more preferably 120° C. or lower, and still more preferably 110° C. or lower. The lower limit may be, for example, 50°C or higher, or may be 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and still more preferably 80 to 220 seconds. Prebaking can be performed with a hot plate, an oven, or the like.

Next, the resin composition layer is exposed in a pattern (exposure step). For example, the resin composition layer can be exposed in a patterned form by exposing the resin composition layer through a mask having a predetermined mask pattern using a stepper, a scanning exposure machine, or the like. Thereby, the exposed part can be cured.

Examples of radiation (light) that can be used for exposure include g-rays, i-rays, and the like. In addition, light having a wavelength of 300 nm or less (preferably light having a wavelength of 180 to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and KrF rays (wavelength: 248 nm) are preferred. In addition, a light source with a long wavelength of 300 nm or more can also be used. As a light source, an electrodeless ultraviolet lamp system, mixed curing of ultraviolet rays and infrared rays can be used.

In addition, at the time of exposure, exposure may be performed by continuously irradiating light, or may be performed by pulsed irradiation (pulse exposure). In addition, pulse exposure refers to an exposure method in which light irradiation and pauses are repeated in a cycle for a short time (eg, millisecond order or less) to perform exposure.

The amount of irradiation (exposure amount) is, for example, preferably 0.03 to 2.5 J/cm ² , more preferably 0.05 to 1.0 J/cm ² . The oxygen concentration at the time of exposure can be appropriately selected. In addition to performing in the atmosphere, for example, it can be performed in a low-oxygen environment with an oxygen concentration of 19% by volume or less (for example, 15% by volume, 5% by volume, or substantially no oxygen). The exposure may be performed under a high-oxygen environment (for example, 22 vol%, 30 vol%, or 50 vol%) in which the oxygen concentration exceeds 21 vol%. In addition, the exposure illuminance can be appropriately set, and usually can be selected from the range of 1000 W/m ² to 100,000 W/m ² (for example, 5,000 W/m ² , 15,000 W/m ² , or 35,000 W/m ² ). The conditions of oxygen concentration and exposure illuminance can be appropriately combined, for example, an oxygen concentration of 10 vol % and an illuminance of 10000 W/m ² , an oxygen concentration of 35 vol % and an illuminance of 20000 W/m ² , etc. can be set.

Next, unexposed portions of the resin composition layer are removed by development to form a pattern (pixel). The development and removal of the unexposed portion of the resin composition layer can be performed using a developer. Thereby, the resin composition layer of the unexposed part in an exposure process dissolves in a developing solution, and only the photohardened part remains. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal performance, the step of shaking off the developing solution every 60 seconds and supplying a new developing solution may be repeated several times.

As a developing solution, an organic solvent, an alkali developing solution, etc. are mentioned, and an alkali developing solution can be used preferably. As the alkaline developing solution, an alkaline aqueous solution (alkali developing solution) obtained by diluting the alkaline agent with pure water is preferable. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylhydrogen Ammonium Oxide, Tetrapropylammonium Hydroxide, Tetrabutylammonium Hydroxide, Ethyltrimethylammonium Hydroxide, Benzyltrimethylammonium Hydroxide, Dimethylbis(2-Hydroxyethyl)ammonium Hydroxide, Choline, pyrrole, piperidine, 1,8-diazabicyclo-[5.4.0]-7-undecene and other organic basic compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, Sodium silicate, sodium metasilicate and other inorganic alkaline compounds. The alkaline agent is preferably a compound with a large molecular weight in terms of the environment and safety. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. In addition, the developer may further contain a surfactant. From the viewpoint of convenient transportation and storage, the developer solution can be temporarily made into a concentrated solution and diluted to a desired concentration when used. The dilution ratio is not particularly limited, and can be set, for example, within a range of 1.5 to 100 times. Moreover, it is also preferable to wash (rinse) with pure water after image development. Further, it is preferable to perform rinsing by rotating the support on which the developed resin composition layer has been formed, and supplying a rinsing liquid to the developed resin composition layer. Moreover, it is also preferable to carry out by moving the nozzle which discharges a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving from the central part of the support body of the nozzle to the peripheral part, the moving speed of the nozzle may be gradually reduced while moving. By performing rinsing in this manner, in-plane variation in rinsing can be suppressed. Also, the same effect can be obtained by gradually reducing the rotational speed of the support while moving the nozzle from the center portion of the support to the peripheral portion.

After image development, it is preferable to perform additional exposure processing and heat processing (post-baking) after performing drying. Additional exposure treatment and post-baking are hardening treatments after development to make fully hardened ones. The heating temperature in the post-baking is, for example, preferably 100 to 300°C, more preferably 200 to 270°C. The film after development can be post-baked continuously or intermittently using a heating mechanism such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater so as to meet the above conditions. When performing an additional exposure process, it is preferable that the light used for exposure is light of wavelength 400nm or less. In addition, the additional exposure treatment can be performed by the method described in Korean Laid-Open Patent No. 10-2017-0122130.

It is preferable that the pattern formation based on the dry etching method comprises the steps of: using the resin composition of the present invention to form a resin composition layer on a support, and hardening the entire resin composition layer to form a hardened layer; forming a photoresist layer on the layer; exposing the photoresist layer in a patterned shape and then developing it to form a resist pattern; and using the resist pattern as a mask to dry-etch the hardened layer with an etching gas. When forming the photoresist layer, it is also preferable to perform pre-baking treatment. In particular, as a formation process of the photoresist layer, a form in which heat treatment after exposure and heat treatment after development (post-baking treatment) are performed is preferable. Regarding the pattern formation by the dry etching method, the description in paragraphs 0010 to 0067 of JP-A-2013-064993 can be referred to, and the content is incorporated in this specification.

＜Optical Filter＞ The optical filter of the present invention has the above-mentioned film of the present invention. Examples of the type of optical filter include a color filter, a near-infrared cut filter, and a near-infrared transmission filter, among which a color filter is preferred. A color filter preferably has the film of the present invention as its pixel, more preferably has the film of the present invention as a colored pixel, and still more preferably has the film of the present invention as a red pixel.

Optical filter A protective layer may be provided on the surface of the film of the present invention. By providing a protective layer, various functions such as oxidation resistance, low reflection, hydrophilicity and hydrophobicity, and shielding of light of a specific wavelength (ultraviolet rays, near-infrared rays, etc.) can be imparted. The thickness of the protective layer is preferably from 0.01 to 10 μm, more preferably from 0.1 to 5 μm. The method of forming the protective layer includes a method of applying a resin composition for forming a protective layer, a chemical vapor deposition method, and a method of attaching the molded resin with an adhesive material. Examples of components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyresins, polyether resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin , melamine resin, polyurethane resin, aromatic polyamide resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluorine resin, polycarbonate resin, polyacrylonitrile resin, cellulose resin , Si, C, W, Al ₂ O ₃ , Mo, SiO ₂ , Si ₂ N ₄ , etc., may contain two or more of these components. For example, when used as a protective layer for preventing oxidation, it is preferable that the protective layer contains polyol resin, SiO ₂ and Si ₂ N ₄ . Also, when used as a low-reflection protective layer, it is preferable that the protective layer contains (meth)acrylic resin and fluororesin.

When coating a resin composition to form a protective layer, well-known methods, such as a spin coating method, a casting method, a screen printing method, and an inkjet method, can be used as a coating method of a resin composition. As the organic solvent contained in the resin composition, known organic solvents (for example, propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used. In the case of forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical gas phase deposition method).

The protective layer may also contain additives such as organic/inorganic particles, absorbers for light of specific wavelengths (eg, ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesives, and surfactants, as required. Examples of organic/inorganic fine particles include polymer fine particles (for example, silicone resin particles, polystyrene particles, melamine resin particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, nitrogen Titanium oxide, titanium oxynitride, magnesium fluoride, hollow silicon dioxide, silicon dioxide, calcium carbonate, barium sulfate, etc. As the absorber for light of a specific wavelength, known absorbers can be used. The content of these additives can be appropriately adjusted, but is preferably 0.1 to 70% by mass, more preferably 1 to 60% by mass, based on the total mass of the protective layer.

Moreover, as a protective layer, the protective layer described in paragraph 0073-0092 of Unexamined-Japanese-Patent No. 2017-151176 can also be used.

The optical filter may also have a structure in which pixels are embedded in spaces separated by partition walls, for example, in a grid pattern.

＜Solid state image sensor＞ The solid-state imaging device of the present invention has the above-mentioned film of the present invention. The structure of the solid-state imaging device is not particularly limited as long as it is provided with the film of the present invention and functions as a solid-state imaging device, and examples thereof include the following structures.

The structure of the solid-state imaging device is as follows: on the substrate, there are a plurality of photodiodes that constitute the light-receiving area of the solid-state imaging device (CCD (charge-coupled device) image sensor, CMOS (complementary metal oxide semiconductor) image sensor, etc.) The transmission electrode composed of polar body and polysilicon, etc., has a light-shielding film with only the light-receiving part of the photodiode on the photodiode and the transmission electrode, and has a method of covering the entire surface of the light-shielding film and the light-receiving part of the photodiode on the light-shielding film. An element protective film made of silicon nitride or the like is formed, and a color filter is provided on the element protective film. In addition, it may have a light-condensing mechanism (for example, a microlens, etc., the same below) on the element protection film and on the lower side of the color filter (the side closer to the substrate), or a light-condensing mechanism on the color filter. structure etc. In addition, the color filter may have a structure in which colored pixels are embedded in spaces partitioned by partition walls, for example, in a grid pattern. In this case, the refractive index of the partition wall is preferably lower than that of each colored pixel. Examples of imaging devices having such a configuration include devices described in JP-A-2012-227478, JP-A-2014-179577, and WO2018/043654. In addition, as shown in Japanese Patent Laid-Open No. 2019-211559, light resistance can also be improved by providing an ultraviolet absorbing layer within the structure of the solid-state imaging device. The imaging device including the solid-state imaging device of the present invention can be used not only as a digital camera or an electronic device (mobile phone, etc.) having an imaging function, but also as a vehicle-mounted camera or a surveillance camera.

＜Image Display Device＞ The image display device of the present invention has the above-mentioned film of the present invention. As an image display device, a liquid crystal display device, an organic electroluminescent display device, etc. are mentioned. Definitions of image display devices or details of each image display device are described, for example, in "Electronic Display Components (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd., 1990)", "Display Components (by Shun Ibuki) Chapter, Sangyo Tosho Publishing Co., Ltd., issued in 1989)", etc. Also, liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and it can be applied, for example, to liquid crystal display devices of various types described in the above-mentioned "next-generation liquid crystal display technology". [Example]

Hereinafter, the present invention will be described more specifically with reference to examples. Materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed unless departing from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

＜Resins P1～P65, CP1, CP2＞ Resins P1 to P65, CP1, and CP2 are the compounds described in the compound b-1 column, the compound described in the compound b-2 column, the compound described in the compound b-3 column and the compound b- A random copolymer of the compound described in the column of 4. That is, resins P1 to P65, CP1, and CP2 have a repeating unit derived from the compound described in compound b-1, a repeating unit derived from the compound described in compound b-2, and a repeating unit derived from the compound described in compound b-3. A repeating unit of the compound described, a random copolymer derived from a repeating unit of the compound described in compound b-4. Furthermore, the repeating unit derived from the compound described in compound b-1 is a repeating unit containing an acid group, and the repeating unit derived from the compound described in compound b-2 is a repeating unit b-2 containing a base, The repeating unit derived from the compound described in compound b-3 is a repeating unit containing a polyalkyleneoxy structure.

[Table 1] Compound b-1 Compound b-2 Compound b-3 Compound b-4 type quality% type conjugate acid pKa quality% type molecular weight quality% type quality% P1 b-1-2 2.5 b-2-1 8.88 27.5 b-3-11 564.8 70.0 - - P2 b-1-2 10.6 b-2-1 8.88 19.4 b-3-11 564.8 70.0 - - P3 b-1-2 10.6 b-2-1 8.88 19.4 b-3-2 496.59 70.0 - - P4 b-1-2 9.5 b-2-2 8.94 20.5 b-3-2 496.59 70.0 - - P5 b-1-2 8.6 b-2-3 9.07 21.4 b-3-2 496.59 70.0 - - P6 b-1-2 9.5 b-2-4 9.07 20.5 b-3-2 496.59 70.0 - - P7 b-1-2 10.7 b-2-5 9.68 19.3 b-3-2 496.59 70.0 - - P8 b-1-2 11.3 b-2-6 8.88 18.7 b-3-2 496.59 70.0 - - P9 b-1-2 7.9 b-2-7 9.45 22.1 b-3-2 496.59 70.0 - - P10 b-1-2 15.1 b-2-8 9.80 14.9 b-3-2 496.59 70.0 - - P11 b-1-2 9.1 b-2-9 6.70 20.9 b-3-2 496.59 70.0 - - P12 b-1-2 11.3 b-2-10 8.88 18.7 b-3-2 496.59 70.0 - - P13 b-1-2 11.3 b-2-11 9.08 18.7 b-3-2 496.59 70.0 - - P14 b-1-2 10.1 b-2-12 9.14 19.9 b-3-2 496.59 70.0 - - P15 b-1-2 10.1 b-2-13 9.68 19.9 b-3-2 496.59 70.0 - - P16 b-1-2 11.8 b-2-14 9.74 18.2 b-3-2 496.59 70.0 - - P17 b-1-2 7.8 b-2-15 8.93 22.2 b-3-2 496.59 70.0 - - P18 b-1-2 7.5 b-2-16 9.61 22.5 b-3-2 496.59 70.0 - - P19 b-1-2 7.0 b-2-17 9.66 23.0 b-3-2 496.59 70.0 - - P20 b-1-2 7.0 b-2-18 9.66 23.0 b-3-2 496.59 70.0 - - P21 b-1-2 7.2 b-2-19 9.64 22.8 b-3-2 496.59 70.0 - - P22 b-1-2 7.5 b-2-20 9.52 22.5 b-3-2 496.59 70.0 - - P23 b-1-2 6.7 b-2-21 10.14 23.3 b-3-2 496.59 70.0 - - P24 b-1-2 6.0 b-2-22 9.58 24.0 b-3-2 496.59 70.0 - - P25 b-1-2 2.0 b-2-5 9.68 28.0 b-3-2 496.59 70.0 - - P26 b-1-2 4.0 b-2-5 9.68 26.0 b-3-2 496.59 70.0 - - P27 b-1-2 6.0 b-2-5 9.68 24.0 b-3-2 496.59 70.0 - - P28 b-1-2 8.0 b-2-5 9.68 22.0 b-3-2 496.59 70.0 - - P29 b-1-2 10.0 b-2-5 9.68 20.0 b-3-2 496.59 70.0 - - P30 b-1-2 12.0 b-2-5 9.68 18.0 b-3-2 496.59 70.0 - - P31 b-1-2 14.0 b-2-5 9.68 16.0 b-3-2 496.59 70.0 - - P32 b-1-2 16.0 b-2-5 9.68 14.0 b-3-2 496.59 70.0 - - P33 b-1-2 18.0 b-2-5 9.68 12.0 b-3-2 496.59 70.0 - - P34 b-1-2 20.0 b-2-5 9.68 10.0 b-3-2 496.59 70.0 - - P35 b-1-2 22.0 b-2-5 9.68 8.0 b-3-2 496.59 70.0 - - P36 b-1-2 24.0 b-2-5 9.68 6.0 b-3-2 496.59 70.0 - - P37 b-1-2 26.0 b-2-5 9.68 4.0 b-3-2 496.59 70.0 - - P38 b-1-2 28.0 b-2-5 9.68 2.0 b-3-2 496.59 70.0 - - P39 b-1-2 3.6 b-2-5 9.68 6.4 b-3-2 496.59 90.0 - - P40 b-1-2 7.1 b-2-5 9.68 12.9 b-3-2 496.59 80.0 - -

[Table 2] Compound b-1 Compound b-2 Compound b-3 Compound b-4 type quality% type conjugate acid pKa quality% type molecular weight quality% type quality% P41 b-1-2 14.2 b-2-5 9.68 25.8 b-3-2 496.59 60.0 - - P42 b-1-2 17.8 b-2-5 9.68 32.2 b-3-2 496.59 50.0 - - P43 b-1-2 24.9 b-2-5 9.68 45.1 b-3-2 496.59 30.0 - - P44 b-1-2 10.6 b-2-5 9.68 19.4 b-3-2 496.59 50.0 b-4-1 20.0 P45 b-1-2 10.6 b-2-5 9.68 19.4 b-3-2 496.59 50.0 b-4-2 20.0 P46 b-1-2 10.6 b-2-5 9.68 19.4 b-3-2 496.59 50.0 b-4-3 20.0 P47 b-1-2 10.6 b-2-5 9.68 19.4 b-3-2 496.59 50.0 b-4-4 20.0 P48 b-1-2 10.6 b-2-5 9.68 19.4 b-3-2 496.59 50.0 b-4-5 20.0 P49 b-1-2 10.6 b-2-5 9.68 19.4 b-3-2 496.59 50.0 b-4-6 20.0 P50 b-1-2 10.7 b-2-5 9.68 19.3 b-3-3 1113.34 70.0 - - P51 b-1-2 10.7 b-2-5 9.68 19.3 b-3-5 957.29 70.0 - - P52 b-1-2 10.7 b-2-5 9.68 19.3 b-3-6 430.63 70.0 - - P53 b-1-2 10.7 b-2-5 9.68 19.3 b-3-9 774.99 70.0 - - P54 b-1-2 10.7 b-2-5 9.68 19.3 b-3-13 438.51 70.0 - - P55 b-1-2 10.7 b-2-5 9.68 19.3 b-3-17 385.48 70.0 - - P56 b-1-2 10.7 b-2-5 9.68 19.3 b-3-18 817.02 70.0 - - P57 b-1-2 10.7 b-2-5 9.68 19.3 b-3-19 576.81 70.0 - - P58 b-1-3 17.9 b-2-5 9.68 12.1 b-3-2 496.59 70.0 - - P59 b-1-6 14.6 b-2-5 9.68 15.4 b-3-2 496.59 70.0 - - P60 b-1-14 16.0 b-2-5 9.68 14.0 b-3-2 496.59 70.0 - - P61 b-1-2 10.7 b-2-5 9.68 19.3 b-3-2 496.59 70.0 - - P62 b-1-2 10.7 b-2-5 9.68 19.3 b-3-2 496.59 70.0 - - P63 b-1-2 10.7 b-2-5 9.68 19.3 b-3-2 496.59 70.0 - - P64 b-1-2 10.7 b-2-5 9.68 19.3 b-3-2 496.59 70.0 - - P65 b-1-2 10.7 b-2-5 9.68 19.3 b-3-2 496.59 70.0 - - CP1 b-1-2 40.0 - - - b-3-2 496.59 60.0 - - CP2 - - b-2-5 9.68 60 - - - b-4-2 40.0

(Compound b-1) b-1-2, b-1-3, b-1-6, b-1-14: Compounds with the following structures [Chem. 33]

(Compound b-2) b-2-1 to b-2-22: Compounds with the following structures [Chem. 34]

(Compound b-3) b-3-2, b-3-3, b-3-5, b-3-6, b-3-9, b-3-11, b-3-13, b- 3-17, b-3-18, b-3-19: Compounds with the following structures [Chem. 35]

(Compound b-4) b-4-1 to b-4-6: Compounds with the following structures [Chem. 36]

The acid value, base value, ratio of acid value to base value (acid value/base value), and weight average molecular weight of resins P1 to P65, CP1, and CP2 are as follows.

[table 3] Acid value (mgKOH/g) Alkaline value (mgKOH/g) Acid value/base value Weight average molecular weight P1 16.29 98.15 0.17 15000 P2 69.09 69.24 1.00 15000 P3 69.09 69.24 1.00 15000 P4 62.03 62.03 1.00 15000 P5 56.24 56.21 1.00 15000 P6 62.05 62.02 1.00 15000 P7 69.47 69.47 1.00 15000 P8 73.41 73.42 1.00 15000 P9 51.72 51.72 1.00 15000 P10 98.30 98.30 1.00 15000 P11 59.00 58.99 1.00 15000 P12 73.41 73.42 1.00 15000 P13 73.73 73.74 1.00 15000 P14 65.67 65.66 1.00 15000 P15 65.67 65.66 1.00 15000 P16 76.77 76.76 1.00 15000 P17 51.10 51.10 1.00 15000 P18 49.02 49.02 1.00 15000 P19 45.32 45.31 1.00 15000 P20 45.32 45.31 1.00 15000 P21 47.09 47.09 1.00 15000 P22 48.88 48.87 1.00 15000 P23 43.57 43.55 1.00 15000 P24 39.28 39.28 1.00 15000 P25 13.04 100.56 0.13 15000 P26 26.07 93.38 0.28 15000 P27 39.11 86.20 0.45 15000 P28 52.14 79.01 0.66 15000 P29 65.18 71.83 0.91 15000 P30 78.21 64.65 1.21 15000 P31 91.25 57.46 1.59 15000 P32 104.28 50.28 2.07 15000 P33 117.32 43.10 2.72 15000 P34 130.35 35.91 3.63 15000 P35 143.39 28.73 4.99 15000 P36 156.42 21.55 7.26 15000 P37 169.46 14.37 11.80 15000 P38 182.49 7.18 25.41 15000 P39 23.15 23.16 1.00 15000 P40 46.31 46.31 1.00 15000

[Table 4] Acid value (mgKOH/g) Alkaline value (mgKOH/g) Acid value/base value Weight average molecular weight P41 92.61 92.63 1.00 15000 P42 115.77 115.78 1.00 15000 P43 162.03 162.12 1.00 15000 P44 69.09 69.68 0.99 15000 P45 69.09 69.68 0.99 15000 P46 69.09 69.68 0.99 15000 P47 69.09 69.68 0.99 15000 P48 69.09 69.68 0.99 15000 P49 69.09 69.68 0.99 15000 P50 69.47 69.47 1.00 15000 P51 69.47 69.47 1.00 15000 P52 69.47 69.47 1.00 15000 P53 69.47 69.47 1.00 15000 P54 69.47 69.47 1.00 15000 P55 69.47 69.47 1.00 15000 P56 69.47 69.47 1.00 15000 P57 69.47 69.47 1.00 15000 P58 43.56 43.55 1.00 15000 P59 55.28 55.32 1.00 15000 P60 50.32 50.35 1.00 15000 P61 69.47 69.47 1.00 3000 P62 69.47 69.47 1.00 6000 P63 69.47 69.47 1.00 11000 P64 69.47 69.47 1.00 26000 P65 69.47 69.47 1.00 31000 CP1 260.70 0.00 - 15000 CP2 0.00 215.49 - 15000

＜About Resin CP3＞ Resin CP3 is a capped copolymer synthesized by the following method. 303 parts by mass of propylene glycol monomethyl ether, 3.6 parts by mass of iodine, 17.7 parts by mass of 2,2'-azobis(4- Methoxy-2,4-dimethylvaleronitrile), 77.7 parts by mass of methyl methacrylate, 77.7 parts by mass of butyl methacrylate, 38.8 parts by mass of 2-ethylhexyl methacrylate, 38.8 parts by mass Parts of methoxypolyethylene glycol methacrylate, 19.4 parts by mass of benzyl methacrylate, 50.0 parts by mass of methacrylic acid and 1.0 parts by mass of 3,5-two-tertiary butyl-4-hydroxy toluene. Then, polymerization was carried out at 40° C. for 7 hours while flowing nitrogen gas, to obtain a solution of the A polymer block. The polymerization ratio of the A polymer block calculated from the solid content was 90.4%. Also, the number average molecular weight of the A polymer block was 7400, the molecular weight distribution (PDI) was 1.35, the peak molecular weight was 10200, and the acid value was 107.5 mgKOH/g. Next, 62.8 parts by mass of 2-dimethylaminoethyl methacrylate, 1.3 parts by mass of 2,2'-azobis(4 -methoxy-2,4-dimethylvaleronitrile) and 62.8 parts by mass of propylene glycol monomethyl ether were polymerized at the same temperature for 4 hours to form a B polymer block. Then, after the flow of nitrogen gas was stopped, it was heated to 80° C. to free the iodine bonded to the end of the polymer chain, thereby obtaining a polymer solution containing resin CP3 as an A-B block copolymer. In addition, the dissociation of iodine was judged when the polymer solution became a brown transparent liquid. The obtained solution of the A-B block copolymer had a solid content of 48.9% by mass, and the polymerization rate of the B polymer block calculated from the solid content was approximately 100%. Also, the number average molecular weight of the A-B block copolymer (resin CP3) was 9500, the PDI was 1.40, the peak molecular weight was 13500, the acid value was 88.8 mgKOH/g, and the amine value was 61.2 mgKOH/g. Also, the number average molecular weight of the B polymer block was 2100.

＜Manufacture of Pigment Dispersion Liquid＞ Use a bead mill (zirconia beads with a diameter of 0.1 mm), mix and disperse the mixture of the materials listed in the following table for 3 hours, and then use a high-pressure disperser with a decompression mechanism (NANO-3000- 10. manufactured by Nippon BEE Co., Ltd.), dispersed at a flow rate of 500 g/min under a pressure of 2000 MPa. This dispersion treatment was repeated 10 times to prepare each pigment dispersion liquid. The numerical values described in the following tables are the values of parts by mass. In addition, the average particle diameter (nm) and the value of the viscosity (mPa･s) of the pigment in each pigment dispersion liquid are described together. Furthermore, the average particle size of the pigment was measured by a dynamic light scattering method using a multi-subject nanoparticle size measurement system (nanoSAQLA, manufactured by Otsuka Electronics Co., Ltd.), and the temperature of the pigment dispersion was adjusted to 25 °C to measure the viscosity of the pigment dispersion.

[table 5] Pigment dispersion Dispersant color material solvent physical properties pigment Pigment derivatives Average particle size (nm) Viscosity (mPa･s) Dispersant 1 PR254 PR272 PY139 PY185 PG36 PG58 PB15:6 PV23 IR color material 1 PBk32 derivative 1 derivative 2 derivative 3 Solvent 1 Solvent 2 Solvent 3 G1 9.6 8.0 17.0 2.5 178.1 40.0 10.0 70 3.6 G2 9.6 8.0 17.0 2.5 178.1 40.0 10.0 70 3.6 R1 9.6 10.0 10.0 5.0 2.5 178.1 40.0 10.0 70 3.6 R2 9.6 17.0 8.0 2.5 178.1 40.0 10.0 70 3.6 B1 9.6 20.0 5.0 2.5 178.1 40.0 10.0 70 3.6 Cy1 9.6 8.0 17.0 2.5 178.1 40.0 10.0 70 3.6 IR1 9.6 25.0 2.5 178.1 40.0 10.0 70 3.6 Bk1 9.6 25.0 2.5 178.1 40.0 10.0 70 3.6

[Table 6] Pigment dispersion Dispersant color material solvent physical properties pigment Average particle size (nm) Viscosity (mPa･s) Dispersant 1 Titanium black 1 carbon black 1 Solvent 1 Solvent 2 Solvent 3 Bk2 8.3 27.5 169.6 40.0 10.0 75 3.9 Bk3 8.3 27.5 169.6 40.0 10.0 75 3.9

The details of the materials described in the abbreviations in the above table are as follows. (Dispersant) Dispersant 1: Resin with the following structure (weight average molecular weight 28,000, the value attached to the main chain is the molar ratio, and the value attached to the side chain is the number of repeating units.) [Chemical 37]

(Pigment) PR254: CI Pigment Red 254 (Red Pigment) PR272: CI Pigment Red 272 (Red Pigment) PY139: CI Pigment Yellow 139 (Yellow Pigment) PY185: Color Index Pigment Yellow 185 (Yellow Pigment) PG36: CI Pigment Green 36 (green pigment) PG58: CI pigment green 58 (green pigment) PB15:6: CI pigment blue 15:6 (blue pigment) PV23: CI pigment purple 23 (purple pigment) PBk32: CI pigment black 32 (organic black pigment ) IR color material 1: a compound with the following structure (near infrared absorbing pigment) [Chemical 38] Titanium black 1: 13M-T (manufactured by Mitsubishi Materials Corporation) Carbon black 1: Color Black S170 (manufactured by Degussa AG, average primary particle size 17nm, BET specific surface area 200m ² /g, carbon black produced by a gas black method)

(Derivatives) Derivatives 1 to 3: Compounds with the following structures (pigment derivatives) [Chem. 39]

(solvent) Solvent 1: Propylene Glycol Monomethyl Ether Acetate (PGMEA) Solvent 2: Cyclopentanone Solvent 3: 1-methoxy-2-propanol

＜Manufacture of resin composition＞ (Examples 1-93, Comparative Examples 1-3) Each raw material was mixed at the ratio of formulation 1 shown below, and it filtered through the nylon filter (manufactured by NIHON PALL Corporation) with a pore size of 0.45 micrometers, and each resin composition was manufactured.

(Recipe 1) Pigment dispersions listed in the following table ･･･588.21 parts by mass Polymeric compound 1 ･･･1.5 parts by mass Polymeric compound 2 ･･･1.5 parts by mass Specific resins listed in the following table ･･･Parts by mass listed in the following table Binder resin 1 ･･･Parts by mass recorded in the following table Photopolymerization initiator 1 ･･･2 mass parts Surfactant 1 ･･･0.15 parts by mass Thermosetting agent 1 ･･･0.5 parts by mass Solvent 1 ･･･200 parts by mass Solvent 2 ･･･100 parts by mass Solvent 3 ･･･21.96 parts by mass

(Examples 94 to 127, Comparative Examples 4 to 6) Each raw material was mixed at the ratio of formulation 2 shown below, and it filtered through the nylon filter (manufactured by NIHON PALL Corporation) with a pore diameter of 0.45 micrometers, and each resin composition was manufactured.

(Recipe 2) Pigment dispersions listed in the following table ･･･588.21 parts by mass Polymeric compound 1 ･･･3.0 parts by mass Specific resins listed in the following table ･･･Parts by mass listed in the following table Binder resin 1 ･･･Parts by mass recorded in the following table Photopolymerization initiator 2 ･･･5.05 parts by mass Surfactant 1 ･･･0.15 parts by mass Thermosetting agent 1 ･･･0.5 parts by mass Solvent 1 ･･･102.3 parts by mass Solvent 2 ･･･15 parts by mass Solvent 3 ･･･15 parts by mass

Polymerizable compound 1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) Polymerizable compound 2: KAYARAD RP-1040 (manufactured by Nippon Kayaku Co., Ltd.) Binder resin 1: resin with the following structure (weight average molecular weight 25000. The value attached to the main chain is the molar ratio, and the value attached to the side chain is the number of repeating units.) [Chemical 40] Photopolymerization initiator 1: Irgacure OXE02 (manufactured by BASF, oxime compound) Photopolymerization initiator 2: Irgacure OXE03 (manufactured by BASF, oxime compound) Surfactant 1: KF6001 (Shin-Etsu Chemical Co., Ltd. system, polysiloxane-based surfactant) Thermosetting agent 1: Compound T-1 with the following structure [Chem. 41] Solvent 1: Propylene glycol monomethyl ether acetate (PGMEA) Solvent 2: Cyclopentanone Solvent 3: 1-methoxy-2-propanol

[Table 7] Types of Pigment Dispersions specific resin Content of binder resin 1 (parts by mass) Specific resin content in total solids (mass%) type Content (parts by mass) Example 1 R1 P1 16.67 23.33 5.00 Example 2 R1 P2 16.67 23.33 5.00 Example 3 R1 P3 16.67 23.33 5.00 Example 4 R1 P4 16.67 23.33 5.00 Example 5 R1 P5 16.67 23.33 5.00 Example 6 R1 P6 16.67 23.33 5.00 Example 7 R1 P7 16.67 23.33 5.00 Example 8 R1 P8 16.67 23.33 5.00 Example 9 R1 P9 16.67 23.33 5.00 Example 10 R1 P10 16.67 23.33 5.00 Example 11 R1 P11 16.67 23.33 5.00 Example 12 R1 P12 16.67 23.33 5.00 Example 13 R1 P13 16.67 23.33 5.00 Example 14 R1 P14 16.67 23.33 5.00 Example 15 R1 P15 16.67 23.33 5.00 Example 16 R1 P16 16.67 23.33 5.00 Example 17 R1 P17 16.67 23.33 5.00 Example 18 R1 P18 16.67 23.33 5.00 Example 19 R1 P19 16.67 23.33 5.00 Example 20 R1 P20 16.67 23.33 5.00 Example 21 R1 P21 16.67 23.33 5.00 Example 22 R1 P22 16.67 23.33 5.00 Example 23 R1 P23 16.67 23.33 5.00 Example 24 R1 P24 16.67 23.33 5.00 Example 25 R1 P25 16.67 23.33 5.00 Example 26 R1 P26 16.67 23.33 5.00 Example 27 R1 P27 16.67 23.33 5.00 Example 28 R1 P28 16.67 23.33 5.00 Example 29 R1 P29 16.67 23.33 5.00 Example 30 R1 P30 16.67 23.33 5.00 Example 31 R1 P31 16.67 23.33 5.00 Example 32 R1 P32 16.67 23.33 5.00 Example 33 R1 P33 16.67 23.33 5.00 Example 34 R1 P34 16.67 23.33 5.00 Example 35 R1 P35 16.67 23.33 5.00 Example 36 R1 P36 16.67 23.33 5.00 Example 37 R1 P37 16.67 23.33 5.00 Example 38 R1 P38 16.67 23.33 5.00 Example 39 R1 P39 16.67 23.33 5.00 Example 40 R1 P40 16.67 23.33 5.00 Example 41 R1 P41 16.67 23.33 5.00 Example 42 R1 P42 16.67 23.33 5.00 Example 43 R1 P43 16.67 23.33 5.00 Example 44 R1 P44 16.67 23.33 5.00 Example 45 R1 P45 16.67 23.33 5.00

[Table 8] Types of Pigment Dispersions specific resin Content of binder resin 1 (parts by mass) Specific resin content in total solids (mass%) type Content (parts by mass) Example 46 R1 P46 16.67 23.33 5.00 Example 47 R1 P47 16.67 23.33 5.00 Example 48 R1 P48 16.67 23.33 5.00 Example 49 R1 P49 16.67 23.33 5.00 Example 50 R1 P50 16.67 23.33 5.00 Example 51 R1 P51 16.67 23.33 5.00 Example 52 R1 P52 16.67 23.33 5.00 Example 53 R1 P53 16.67 23.33 5.00 Example 54 R1 P54 16.67 23.33 5.00 Example 55 R1 P55 16.67 23.33 5.00 Example 56 R1 P56 16.67 23.33 5.00 Example 57 R1 P57 16.67 23.33 5.00 Example 58 R1 P58 16.67 23.33 5.00 Example 59 R1 P59 16.67 23.33 5.00 Example 60 R1 P60 16.67 23.33 5.00 Example 61 R1 P61 16.67 23.33 5.00 Example 62 R1 P62 16.67 23.33 5.00 Example 63 R1 P63 16.67 23.33 5.00 Example 64 R1 P64 16.67 23.33 5.00 Example 65 R1 P65 16.67 23.33 5.00 Example 66 G1 P7 16.67 23.33 5.00 Example 67 G2 P7 16.67 23.33 5.00 Example 68 R2 P7 16.67 23.33 5.00 Example 69 B1 P7 16.67 23.33 5.00 Example 70 Cy1 P7 16.67 23.33 5.00 Example 71 IR1 P7 16.67 23.33 5.00 Example 72 Bk1 P7 16.67 23.33 5.00 Example 73 G1 P45 16.67 23.33 5.00 Example 74 G2 P45 16.67 23.33 5.00 Example 75 R2 P45 16.67 23.33 5.00 Example 76 B1 P45 16.67 23.33 5.00 Example 77 Cy1 P45 16.67 23.33 5.00 Example 78 IR1 P45 16.67 23.33 5.00 Example 79 Bk1 P45 16.67 23.33 5.00 Example 80 R1 P7 1.67 38.33 0.50 Example 81 R1 P7 3.33 36.67 1.00 Example 82 R1 P7 8.33 31.67 2.50 Example 83 R1 P7 13.33 26.67 4.00 Example 84 R1 P7 25.00 15.00 7.50 Example 85 R1 P7 33.33 6.67 10.00 Example 86 R1 P7 40.00 0.00 12.00 Example 87 R1 P45 1.67 38.33 0.50 Example 88 R1 P45 3.33 36.67 1.00 Example 89 R1 P45 8.33 31.67 2.50 Example 90 R1 P45 13.33 26.67 4.00 Example 91 R1 P45 25.00 15.00 7.50 Example 92 R1 P45 33.33 6.67 10.00 Example 93 R1 P45 40.00 0.00 12.00 Comparative example 1 R1 CP1 16.67 23.33 5.00 Comparative example 2 R1 CP2 16.67 23.33 5.00 Comparative example 3 R1 CP3 16.67 23.33 5.00

[Table 9] Types of Pigment Dispersions specific resin Content of binder resin 1 (parts by mass) Specific resin content in total solids (mass%) type Content (parts by mass) Example 94 Bk2 P1 16.67 23.33 5.00 Example 95 Bk2 P2 16.67 23.33 5.00 Example 96 Bk2 P5 16.67 23.33 5.00 Example 97 Bk2 P6 16.67 23.33 5.00 Example 98 Bk2 P7 16.67 23.33 5.00 Example 99 Bk2 P8 16.67 23.33 5.00 Example 100 Bk2 P10 16.67 23.33 5.00 Example 101 Bk2 P25 16.67 23.33 5.00 Example 102 Bk2 P26 16.67 23.33 5.00 Example 103 Bk2 P27 16.67 23.33 5.00 Example 104 Bk2 P30 16.67 23.33 5.00 Example 105 Bk2 P31 16.67 23.33 5.00 Example 106 Bk2 P34 16.67 23.33 5.00 Example 107 Bk2 P35 16.67 23.33 5.00 Example 108 Bk2 P36 16.67 23.33 5.00 Example 109 Bk2 P37 16.67 23.33 5.00 Example 110 Bk2 P38 16.67 23.33 5.00 Example 111 Bk2 P44 16.67 23.33 5.00 Example 112 Bk2 P50 16.67 23.33 5.00 Example 113 Bk2 P61 16.67 23.33 5.00 Example 114 Bk2 P62 16.67 23.33 5.00 Example 115 Bk2 P63 16.67 23.33 5.00 Example 116 Bk2 P64 16.67 23.33 5.00 Example 117 Bk2 P65 16.67 23.33 5.00 Example 118 Bk2 P7 1.67 38.33 0.50 Example 119 Bk2 P7 3.33 36.67 1.00 Example 120 Bk2 P7 8.33 31.67 2.50 Example 121 Bk2 P7 13.33 26.67 4.00 Example 122 Bk2 P7 25.00 15.00 7.50 Example 123 Bk2 P7 33.33 6.67 10.00 Example 124 Bk2 P7 40.00 0.00 12.00 Example 125 Bk3 P1 16.67 23.33 5.00 Example 126 Bk3 P6 16.67 23.33 5.00 Example 127 Bk3 P7 16.67 23.33 5.00 Comparative example 4 Bk2 CP1 16.67 23.33 5.00 Comparative Example 5 Bk2 CP2 16.67 23.33 5.00 Comparative Example 6 Bk2 CP3 16.67 23.33 5.00

＜Performance evaluation＞ (time defects) The newly produced resin composition was stored at 45° C. for 7 days. Thereafter, the resin composition was coated on the undercoated glass substrate using a spin coater so that the film thickness after the prebaking was 1.0 μm, and the prebaking was performed for 120 seconds using a hot plate at 100° C. A film is formed. About the obtained film, the 1-cm square part was observed with the optical microscope, the number of the crystalline defect of the size of 0.5 micrometer or more was counted, and the time-lapse defect was evaluated according to the following evaluation criteria. 5: The number of defects is 0 4: The number of defects is 1 to 3 3: The number of defects is 4 to 6 2: The number of defects is 7 to 9 1: The number of defects is 10 or more

(Development residue) The composition for forming the base layer (CT-4000, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was coated on an 8-inch (20.32 cm) silicon wafer using a spin coater to allow post-baking After baking, the thickness became 0.1 μm, and after heating at 220° C. for 300 seconds using a hot plate to form a base layer, a silicon wafer (support body) with a base layer was obtained. Next, each resin composition was applied by spin coating so that the film thickness after the post-baking would be 0.8 μm, and heated at 100° C. for 2 minutes using a hot plate. Then, exposure was performed by irradiating light with a wavelength of 365 nm at an exposure amount of 1000 mJ/cm ² through a mask of a dot pattern of 1.0 μm square using an i-ray stepper exposure device (FPA-3000i5+, manufactured by Canon Inc.). . Thereafter, the silicon wafer on which the exposed coating film was formed was placed on the horizontal turntable of a rotary shower developing machine (DW-30 type, manufactured by CHEMITRONICS CO., Ltd.), and a developer (CD-2000 , manufactured by FUJIFILM Electronic Materials Co., Ltd.) was subjected to spin-on-immersion development at 23° C. for 60 seconds. After development, the silicon wafer is fixed on the horizontal turntable by a vacuum chuck, and while the silicon wafer is rotated at a rotation speed of 50rpm by a rotating device, pure water is supplied in a spray form from a spray nozzle above the rotation center. Rinse treatment was performed, and spray drying was performed. In addition, a heat treatment (post-baking) was performed for 300 seconds using a hot plate at 200° C. to form pixels (patterns). The silicon wafer on which the pixel was formed was observed with a scanning electron microscope (SEM, magnification: 10000), and the development residue was evaluated based on the following evaluation criteria. 5: There is no residue at all outside the pixel formation area (unexposed area) 4: Slight residue is found outside the pixel formation area (unexposed area), but practically no problem 3: In the pixel formation area Residue is slightly confirmed outside (unexposed area), but there is no practical problem 2: Residue is confirmed outside the pixel formation area (unexposed area) 1: Remarkably observed outside the pixel formation area (unexposed area) residue

(Stability over time) The viscosity (mPa･s) of the newly produced resin composition was measured with a viscometer (RE-85L, manufactured by TOKI SANGYO CO., LTD.). Thereafter, the resin composition was allowed to stand at 45° C. under the conditions of shading from light for 5 days, and the viscosity (mPa･s) was measured again. Stability over time was evaluated based on the following evaluation criteria from the viscosity difference (ΔVis) before and after standing still. It can be said that the smaller the value of the viscosity difference (ΔVis), the better the temporal stability of the resin composition. The above viscosity measurements were all carried out in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, respectively, and the temperature of the resin composition was adjusted to 25°C. All measurements were performed in triplicate and average values were used. 5: Δvis is below 0.2mPa･s 4: Δvis exceeds 0.2mPa･s and is less than 0.3mPa･s 3: Δvis exceeds 0.3mPa･s and is less than 0.5mPa･s 2: Δvis exceeds 0.5mPa･s and is less than 1.0mPa･s 1: Δvis exceeds 1.0mPa･s

[Table 10] Defects over time Development residue Stability over time Example 1 3 3 3 Example 2 4 4 4 Example 3 4 4 4 Example 4 4 4 4 Example 5 4 4 4 Example 6 4 4 4 Example 7 5 5 5 Example 8 4 4 4 Example 9 4 4 4 Example 10 5 5 5 Example 11 4 4 4 Example 12 4 4 4 Example 13 4 4 4 Example 14 4 4 4 Example 15 5 5 5 Example 16 5 5 5 Example 17 4 4 4 Example 18 5 5 5 Example 19 5 5 5 Example 20 5 5 5 Example 21 5 5 5 Example 22 5 5 5 Example 23 5 5 5 Example 24 5 5 5 Example 25 4 4 4 Example 26 4 4 4 Example 27 5 5 5 Example 28 5 5 5 Example 29 5 5 5 Example 30 5 5 5 Example 31 5 5 5 Example 32 5 5 5 Example 33 5 5 5 Example 34 4 4 4 Example 35 4 4 4 Example 36 4 4 4 Example 37 4 4 4 Example 38 4 4 4 Example 39 5 4 4 Example 40 5 5 5 Example 41 5 5 5 Example 42 5 5 5 Example 43 4 4 4 Example 44 5 5 5 Example 45 5 5 5

[Table 11] Defects over time Development residue Stability over time Example 46 5 5 5 Example 47 5 5 5 Example 48 5 5 5 Example 49 5 5 5 Example 50 5 5 5 Example 51 5 4 4 Example 52 5 5 5 Example 53 5 4 4 Example 54 5 5 5 Example 55 5 4 4 Example 56 5 4 4 Example 57 4 4 4 Example 58 5 5 5 Example 59 5 5 5 Example 60 5 5 5 Example 61 5 4 5 Example 62 5 5 5 Example 63 5 5 5 Example 64 5 5 5 Example 65 5 5 4 Example 66 5 5 5 Example 67 5 5 5 Example 68 5 5 5 Example 69 5 5 5 Example 70 5 5 5 Example 71 5 5 5 Example 72 5 5 5 Example 73 5 5 5 Example 74 5 5 5 Example 75 5 5 5 Example 76 5 5 5 Example 77 5 5 5 Example 78 5 5 5 Example 79 5 5 5 Example 80 4 4 4 Example 81 5 5 5 Example 82 5 5 5 Example 83 5 5 5 Example 84 5 5 5 Example 85 5 5 5 Example 86 4 4 4 Example 87 4 4 4 Example 88 5 5 5 Example 89 5 5 5 Example 90 5 5 5 Example 91 5 5 5 Example 92 5 5 5 Example 93 4 4 4 Comparative example 1 2 1 1 Comparative example 2 1 1 2 Comparative example 3 2 2 2

[Table 12] Defects over time Development residue Stability over time Example 94 3 3 3 Example 95 4 4 4 Example 96 4 4 4 Example 97 4 4 4 Example 98 5 5 5 Example 99 4 4 4 Example 100 5 5 5 Example 101 4 4 4 Example 102 4 4 4 Example 103 5 5 5 Example 104 5 5 5 Example 105 5 5 5 Example 106 4 4 4 Example 107 4 4 4 Example 108 4 4 4 Example 109 4 4 4 Example 110 4 4 4 Example 111 5 5 5 Example 112 5 5 5 Example 113 5 4 5 Example 114 5 5 5 Example 115 5 5 5 Example 116 5 5 5 Example 117 5 5 4 Example 118 4 4 4 Example 119 5 5 5 Example 120 5 5 5 Example 121 5 5 5 Example 122 5 5 5 Example 123 5 5 5 Example 124 4 4 4 Example 125 3 3 3 Example 126 4 4 4 Example 127 5 5 5 Comparative example 4 2 1 1 Comparative Example 5 1 1 2 Comparative Example 6 2 2 2

As shown in the above table, the time-lapse defects, development residues, and time-lapse stability evaluations of Examples.

Films obtained from the resin compositions described in Examples can be suitably used for optical filters, solid-state imaging devices, and image display devices.

In Example 43, even when the polymerizable compound 2 was changed to the compound M-2 or M-3 of the structure shown below, the same effect was acquired. [chem 42]

In Example 43, even when the photopolymerization initiator 1 was changed to compounds I-2 to I-5 of the structures shown below, the same effect was obtained. [chem 43]

In Example 43, even when the thermosetting agent 1 was changed to compound T-2 or T-3 of the structure shown below, the same effect was acquired. [chem 44]

In Example 43, even when the surfactant 1 was changed to the compound shown below (a fluorine-based surfactant with a weight average molecular weight of 14,000, and the % representing the ratio of repeating units is molar %) or PolyFox PF6320 (OMNOVA SOLUTIONS INC., fluorine-based surfactant), the same effect can be obtained. [chem 45]

Claims (16)

A resin composition, which contains color material A and resin B, wherein Aforesaid color material A comprises pigment, The aforementioned resin B includes a random copolymer b1, and the aforementioned random copolymer b1 includes a repeating unit b-1 containing an acid group, a repeating unit b-2 containing a base, and a repeating unit b-3 containing a polyalkylene oxide structure . The resin composition as described in claim 1, wherein The ratio of the acid value to the base value of the random copolymer b1 is 0.2-20. The resin composition as described in Claim 1 or 2, wherein The molecular weight of the repeating unit b-3 is 350-1500. The resin composition as described in Claim 1 or 2, wherein The aforementioned polyalkylene oxide structure is a polyethylene oxide structure. The resin composition as described in Claim 1 or 2, wherein The acid value of the said random copolymer b1 is 40-120 mgKOH/g. The resin composition as described in Claim 1 or 2, wherein The base value of the said random copolymer b1 is 40-120 mgKOH/g. The resin composition as described in Claim 1 or 2, wherein The aforementioned repeating unit b-2 is a repeating unit derived from a compound whose conjugate acid has a pKa of 9.5 or more. The resin composition as described in Claim 1 or 2, wherein The aforementioned random copolymer b1 also contains repeating units b-4 having a functional group X, and the aforementioned functional group X is selected from a group containing two or more aromatic rings, a group containing a heterocyclic group, and a group containing a condensed ring. group. The resin composition as described in Claim 1 or 2, wherein Content of the said random copolymer b1 in the said resin B is 1-30 mass %. The resin composition as described in Claim 1 or 2, wherein Content of the said random copolymer b1 in the total solid content of the said resin composition is 1-10 mass %. The resin composition as described in Claim 1 or 2, wherein The aforementioned color material A includes a pigment derivative. The resin composition according to claim 1 or 2, further comprising a polymerizable compound and a photopolymerization initiator. A film obtained from the resin composition described in claim 1 or 2. An optical filter having the film described in claim 13. A solid-state imaging device having the film described in claim 13. An image display device having the film described in claim 13.