TW202244137A - Resin composition, film, optical filter, solid-state imaging element, image display device, resin, and method for producing resin - Google Patents

Abstract

A resin composition comprising color material A containing a pigment, resin B and solvent C, wherein resin B comprises resin B1 that is a product of a reaction between a resin having a primary or secondary amino group and a macromonomer having an acid anhydride structure at a terminus. A film, an optical filter, a solid-state imaging element, an image display device, a resin, and a method for producing a resin.

Description

Resin composition, film, optical filter, solid-state imaging device, image display device, resin and method for producing resin

The present invention relates to a resin composition, a film, an optical filter, a solid-state imaging device, an image display device, a resin and a method for producing the resin.

In recent years, with the popularization of digital cameras and mobile phones with cameras, etc., the demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors has increased significantly. A solid-state imaging device uses a film containing a pigment such as a color filter. A film containing a color material such as a color filter is manufactured using a resin composition containing a pigment, a resin, and a solvent.

For example, Patent Document 1 describes an invention related to a resin composition. The resin composition contains a pigment, a dispersant, a binder resin, an epoxy compound, and a solvent. The dispersant has a polyester part X1' and a polyester part X2', The aforementioned polyester part X1' is formed by reacting an acid anhydride group in an acid anhydride (b) selected from one or more tetracarboxylic anhydrides (b1) and tricarboxylic anhydrides (b2) with a hydroxyl group in a hydroxyl group-containing compound (a) and has a carboxyl group, the aforementioned polyester moiety X2' is formed by free-radical polymerization of an ethylenically unsaturated monomer (c) and has a thermally crosslinkable functional group, the thermally crosslinkable functional group contains a dispersant (X), and the aforementioned The dispersant (X) is at least one selected from the group consisting of hydroxyl group, oxetanyl group, tertiary butyl group, blocked isocyanate group and (meth)acryl group.

[Patent Document 1] Japanese Patent Laid-Open No. 2016-170325

In the resin composition containing pigment, resin and solvent, the dispersibility of the pigment is better. If the dispersibility of the pigment is insufficient, the pigment aggregates and becomes coarse in the resin composition, or the viscosity of the resin composition tends to increase. Moreover, even if the viscosity of the resin composition immediately after manufacture is low, a viscosity may increase with time.

In addition, in the manufacturing process of solid-state imaging devices, it has been studied in recent years to use a resin composition containing a coloring material, a resin, and a solvent to form a film such as a color filter, and then subject it to a heat treatment that requires a high temperature (for example, 300°C or higher). the content of the steps. Therefore, in recent years, further improvement in heat resistance has been desired for a film obtained using a resin composition containing a coloring material, a resin, and a solvent.

According to the investigation of the present inventors, it can be seen that in the resin composition described in Patent Document 1, the dispersibility of the pigment is not sufficient and there is room for further improvement. Also, it was found that there is still room for improvement regarding the heat resistance of a film obtained using the resin composition described in Patent Document 1.

Therefore, an object of the present invention is to provide a resin composition capable of forming a film having excellent pigment dispersibility and excellent heat resistance. Also, an object of the present invention is to provide a film, an optical filter, a solid-state imaging device, and an image display device using a resin composition. Moreover, the object of this invention is to provide the manufacturing method of a resin and a resin.

Examples of representative embodiments of the present invention are shown below.

式（b1）中，波線表示鍵結鍵，X ^b1表示n+2價的連接基，X ^b2表示O或NR ^x1，R ^x1表示氫原子或取代基，L ^b1表示單鍵或2價的連接基，P ^b1表示聚合物鏈，R ^b1表示氫原子、取代基或相對離子，n表示1以上的整數。 ＜3＞如＜1＞或＜2＞所述之樹脂組成物，其中 上述樹脂B1為包含由式（1-1）、式（1-2）或式（1-3）表示之重複單元之樹脂， [化學式2]

式中，R ¹～R ⁹分別獨立地表示氫原子或取代基，L ¹表示單鍵或2價的連接基，L ²及L ³分別獨立地表示2價的連接基，L ⁴表示單鍵或2價的連接基，X ^b11表示n+2價的連接基，X ^b12表示O或NR ^x11，R ^x11表示氫原子或取代基，L ^b11表示單鍵或2價的連接基，P ^b11表示聚合物鏈，R ^b11表示氫原子、取代基或相對離子，n表示1以上的整數。 ＜4＞如＜3＞所述之樹脂組成物，其中 上述式（1-1）的L ^b11、式（1-2）的L ^b11及式（1-3）的L ^b11為包含硫原子之2價的連接基。 ＜5＞如＜3＞或＜4＞所述之樹脂組成物，其中 上述式（1-1）的P ^b11所表示之聚合物鏈、式（1-2）的P ^b11所表示之聚合物鏈及式（1-3）的P ^b11所表示之聚合物鏈為包含選自聚醚結構、聚酯結構、聚（甲基）丙烯酸結構及聚苯乙烯結構中之至少1種結構的重複單元之聚合物鏈。 ＜6＞如＜3＞至＜5＞之任一項所述之樹脂組成物，其中 上述式（1-1）的P ^b11所表示之聚合物鏈、式（1-2）的P ^b11所表示之聚合物鏈及式（1-3）的P ^b11所表示之聚合物鏈包含選自含乙烯性不飽和鍵之基團、環氧基、氧雜環丁基及三級丁基中之至少1種。 ＜7＞如＜3＞至＜6＞之任一項所述之樹脂組成物，其中 上述樹脂B1包含由上述式（1-1）表示之重複單元並且上述樹脂B1中的由上述式（1-1）表示之重複單元的含量為30莫耳%以上、或者 上述樹脂B1包含由上述式（1-2）表示之重複單元並且上述樹脂B1中的由上述式（1-2）表示之重複單元的含量為30莫耳%以上、或者 上述樹脂B1包含由上述式（1-3）表示之重複單元並且上述樹脂B1中的由上述式（1-3）表示之重複單元的含量為30莫耳%以上。 ＜8＞如＜3＞至＜7＞之任一項所述之樹脂組成物，其中 由上述式（1-1）表示之重複單元為由下述式（2-1）表示之重複單元， 由上述式（1-2）表示之重複單元為由下述式（2-2）表示之重複單元， 由上述式（1-3）表示之重複單元為由下述式（2-3）表示之重複單元， [化學式3]

式中，L ¹表示單鍵或2價的連接基，L ²及L ³分別獨立地表示2價的連接基，L ⁴表示單鍵或2價的連接基，L ^b11表示單鍵或2價的連接基，P ^b11表示聚合物鏈。 ＜9＞如＜1＞至＜8＞之任一項所述之樹脂組成物，其中 上述色材A含有選自二酮吡咯并吡咯顏料及酞青顏料中之至少1種。 ＜10＞如＜1＞至＜9＞之任一項所述之樹脂組成物，其還含有聚合性單體。 ＜11＞如＜1＞至＜10＞之任一項所述之樹脂組成物，其還含有光聚合起始劑。 ＜12＞一種膜，其使用＜1＞至＜11＞之任一項所述之樹脂組成物來獲得。 ＜13＞一種濾光器，其具有＜12＞所述之膜。 ＜14＞一種固體攝像元件，其具有＜12＞所述之膜。 ＜15＞一種圖像顯示裝置，其具有＜12＞所述之膜。 ＜16＞一種樹脂，其包含由式（1-1）、式（1-2）或式（1-3）表示之重複單元， [化學式4]

式中，R ¹～R ⁹分別獨立地表示氫原子或取代基，L ¹表示單鍵或2價的連接基，L ²及L ³分別獨立地表示2價的連接基，L ⁴表示單鍵或2價的連接基，X ^b11表示n+2價的連接基，X ^b12表示O或NR ^x11，R ^x11表示氫原子或取代基，L ^b11表示單鍵或2價的連接基，P ^b11表示聚合物鏈，R ^b11表示氫原子、取代基或相對離子，n表示1以上的整數。 ＜17＞一種樹脂之製造方法，其包括使具有一級胺基或二級胺基之樹脂與在末端具有酸酐結構之巨單體進行反應之步驟。 [發明效果] <1> A resin composition comprising: a color material A including a pigment; a resin B; and a solvent C, the above-mentioned resin B includes a resin B1, and the above-mentioned resin B1 is a resin having a primary amino group or a secondary amino group and at the end A reaction product of a macromonomer with an anhydride structure. <2> The resin composition as described in <1>, wherein the above-mentioned resin B1 is a resin having a structure represented by formula (b1), [Chemical formula 1]

In the formula (b1), the wavy line represents the bonding bond, X ^b1 represents the n+2 valent linking group, X ^b2 represents O or NR ^x1 , R ^x1 represents a hydrogen atom or a substituent, L ^b1 represents a single bond or a divalent connection group, P ^b1 represents a polymer chain, R ^b1 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more. <3> The resin composition as described in <1> or <2>, wherein the above-mentioned resin B1 is composed of a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3). resin, [chemical formula 2]

In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, and L ⁴ represents a single bond or a 2-valent linking group, X ^b11 represents an n+2-valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a 2-valent linking group, and P ^b11 represents A polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more. <4> The resin composition as described in <3>, wherein L ^b11 of the above-mentioned formula (1-1), L ^b11 of the formula (1-2) and L ^b11 of the formula (1-3) are sulfur atoms 2-valent linking group. <5> The resin composition as described in <3> or <4>, wherein the polymer chain represented by P ^b11 of the above formula (1-1), the polymer represented by P ^b11 of the formula (1-2) Chain and the polymer chain represented by P ^b11 of formula (1-3) is a repeating unit comprising at least one structure selected from polyether structure, polyester structure, poly(meth)acrylic acid structure and polystyrene structure the polymer chain. <6> The resin composition according to any one of <3> to <5>, wherein the polymer chain represented by P ^b11 of the above formula (1-1), the polymer chain represented by P ^b11 of the formula (1-2) The polymer chain represented by and the polymer chain represented by P ^b11 of the formula (1-3) include groups selected from ethylenically unsaturated bond-containing groups, epoxy groups, oxetanyl groups and tertiary butyl groups. At least 1 species. <7> The resin composition as described in any one of <3> to <6>, wherein the above-mentioned resin B1 contains a repeating unit represented by the above-mentioned formula (1-1) and the above-mentioned formula (1-1) in the above-mentioned resin B1 -1) The content of the repeating unit represented by 30 mol% or more, or the above-mentioned resin B1 contains the repeating unit represented by the above-mentioned formula (1-2) and the repeating unit represented by the above-mentioned formula (1-2) in the above-mentioned resin B1 The content of the unit is 30 mol% or more, or the above-mentioned resin B1 contains the repeating unit represented by the above-mentioned formula (1-3) and the content of the repeating unit represented by the above-mentioned formula (1-3) in the above-mentioned resin B1 is 30 mol% ear% or more. <8> The resin composition according to any one of <3> to <7>, wherein the repeating unit represented by the above formula (1-1) is a repeating unit represented by the following formula (2-1), The repeating unit represented by the above formula (1-2) is a repeating unit represented by the following formula (2-2), and the repeating unit represented by the above formula (1-3) is represented by the following formula (2-3) The repeating unit of [chemical formula 3]

In the formula, L ¹ represents a single bond or a divalent linker, L ² and L ³ independently represent a 2-valent linker, L ⁴ represents a single bond or a 2-valent linker, L ^b11 represents a single bond or a 2-valent linker The linking group of , P ^b11 represents the polymer chain. <9> The resin composition according to any one of <1> to <8>, wherein the color material A contains at least one selected from diketopyrrolopyrrole pigments and phthalocyanine pigments. <10> The resin composition according to any one of <1> to <9>, which further contains a polymerizable monomer. <11> The resin composition according to any one of <1> to <10>, further comprising a photopolymerization initiator. <12> A film obtained using the resin composition according to any one of <1> to <11>. <13> An optical filter comprising the film described in <12>. <14> A solid-state imaging device having the film according to <12>. <15> An image display device comprising the film according to <12>. <16> A resin comprising a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), [chemical formula 4]

In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, and L ⁴ represents a single bond or a 2-valent linking group, X ^b11 represents an n+2-valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a 2-valent linking group, and P ^b11 represents A polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more. <17> A method for producing a resin comprising the step of reacting a resin having a primary or secondary amino group with a macromonomer having an acid anhydride structure at its terminal. [Invention effect]

According to the present invention, it is possible to provide a resin composition capable of forming a film having excellent pigment dispersibility and excellent heat resistance. In addition, it is possible to provide a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition. In addition, it is possible to provide a resin and a method for producing the resin.

Hereinafter, main embodiments of the present invention will be described. However, the present invention is not limited to the illustrated embodiments. In this specification, "-" is used in the meaning which includes the numerical value described before and after it as a lower limit and an upper limit. Regarding the notation of a group (atomic group) in this specification, the notation of being substituted and the notation of unsubstituted include both a group (atomic group) having no substituent and a group (atomic group) having a substituent. For example, "alkyl" includes not only an unsubstituted alkyl group (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. In addition, examples of the light used for exposure include active rays or radiation such as bright-line spectrum of mercury lamps and excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams. In this specification, (meth)allyl means both or either of allyl and methallyl, and "(meth)acrylate" means both or both of acrylate and methacrylate. Either, "(meth)acrylic acid" means both or either of acrylic acid and methacrylic acid, and "(meth)acryl" means both or either of acryl and methacryl. By. In this specification, the weight average molecular weight and number average molecular weight are polystyrene conversion values measured by the GPC (gel permeation chromatography) method. In this specification, near-infrared rays refer to light having a wavelength of 700 to 2500 nm. In this specification, the total solid content refers to the total mass of components excluding solvents from all the components of the composition. In this specification, the use of "step" not only refers to an independent step, but also includes it in this step as long as it can exert the expected function of the step even if it cannot be clearly distinguished from other steps. in the language. In this specification, a pigment refers to a color material that is not easily soluble in a solvent. In this specification, the symbols attached before or after the names (for example, A, etc.) are terms used to distinguish constituent elements, and do not limit the types, quantities, and pros and cons of constituent elements.

＜Resin composition＞ The resin composition of the present invention is characterized in that it contains: Color material A containing pigment; Resin B; and solvent C, Resin B includes resin B1, which is a reaction product of a resin having primary or secondary amine groups and a macromonomer having an acid anhydride structure at the end.

The resin composition of the present invention has excellent pigment dispersibility. The detailed reason for obtaining such an effect is not clear, but it is presumed that the resin B1 has an amide bond formed by the reaction of a resin having a primary amino group or a secondary amino group with a macromonomer having an acid anhydride structure at the terminal and The polymer chains are bonded via amide bonds. Therefore, the amide bonds of resin B1 promote the adsorption of resin B1 on the pigment surface and the polymer chains become steric repulsive groups, which can inhibit the aggregation of pigments and the like. As a result, It is presumed that a resin composition having excellent pigment dispersibility can be obtained.

Also, by using the resin composition of the present invention, it is possible to form a film having excellent heat resistance which is difficult to separate even at high temperature and hardly shrinks after heat treatment at high temperature. The detailed reason for obtaining such an effect is not clear, but it is presumed that it is because, by the reaction of the resin having the primary or secondary amino group of resin B1 and the macromonomer having an acid anhydride structure at the end, the acyl The portion of the amine bond is ring-closed by heating during film formation to form an imide ring or the like. Therefore, even if the obtained film is subjected to high-temperature (for example, 300° C. or higher) heat treatment after forming a film using the resin composition of the present invention, film shrinkage can be suppressed even when another film such as an inorganic film is formed on the film. , It is also possible to suppress the occurrence of cracks and the like in other films. Therefore, according to the resin composition of the present invention, it is possible to expand the process window of the steps after film production.

When the resin composition of the present invention is heated at 200°C for 30 minutes to form a film with a thickness of 0.60 μm, the thickness of the film after heat treatment at 300°C for 5 hours in a nitrogen atmosphere is equal to the thickness of the film before heat treatment. More than 70% of the thickness of the film is preferred, more than 80% is more preferred, and more than 90% is further preferred. In addition, the thickness of the film after heating the film at 350° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, and furthermore 90% or more. Better, more than 95% is especially good. In addition, the thickness of the film after heating the film at 400° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, and furthermore 90% or more. Better, more than 95% is especially good.

In addition, when the resin composition of the present invention is heated at 200° C. for 30 minutes to form a film with a thickness of 0.60 μm, when the film is heat-treated at 300° C. for 5 hours in a nitrogen atmosphere, the heat-treated film has the following properties: The absorbance change rate ΔA represented by the formula (A1) is preferably 50% or less, more preferably 45% or less, still more preferably 40% or less, and most preferably 35% or less. ΔA (%)=|100-(A2/A1)×100|...(A1) ΔA is the change rate of absorbance of the film after heat treatment, A1 is the maximum value of the absorbance of the film before heat treatment in the range of wavelength 400-1100nm, A2 is the absorbance of the film after the heat treatment, and is the absorbance at a wavelength showing the maximum value of the absorbance of the film before the heat treatment in the wavelength range of 400 to 1100 nm. The above physical properties can be realized by adjusting the type or content of the specific resin used.

In addition, when the resin composition of the present invention is heated at 200° C. for 30 minutes to form a film with a thickness of 0.60 μm, the wavelength λ1 showing the maximum absorbance of the film in the wavelength range of 400 to 1100 nm is the same as that shown in nitrogen atmosphere, The absolute value of the difference between the maximum absorbance value and the wavelength λ2 of the film after heating the film at 300°C for 5 hours is preferably 50 nm or less, more preferably 45 nm or less, still more preferably 40 nm or less. The above physical properties can be realized by adjusting the type or content of the specific resin used.

In addition, when the resin composition of the present invention is heated at 200° C. for 30 minutes to form a film with a thickness of 0.60 μm, when the above-mentioned film is heat-treated at 300° C. for 5 hours in a nitrogen atmosphere, the heat-treated film has a wavelength of The maximum value of the absorbance change rate ΔA _λ in the range of 1100 nm is preferably 30% or less, more preferably 27% or less, still more preferably 25% or less. In addition, the rate of change in absorbance is a value calculated from the following formula (2). ΔA _λ =|100-(A2 _λ /A1 _λ )×100|...(2) ΔA _λ is the change rate of absorbance of the film after heat treatment in the wavelength λ, and A1 _λ is the change rate of the film before heat treatment in the wavelength λ A2 _λ is the absorbance of the heat-treated film in the wavelength λ. The above physical properties can be realized by adjusting the type or content of the specific resin used.

The resin composition of the present invention can be preferably used as a resin composition for optical filters. As an optical filter, a color filter, a near-infrared ray transmission filter, a near-infrared ray cut filter, etc. are mentioned, A color filter is preferable. In addition, the resin composition of the present invention can be preferably used as a resin composition for a solid-state imaging device, and can be more preferably used as a resin composition for forming a pixel of an optical filter used in a solid-state imaging device.

Examples of color filters include filters having colored pixels that transmit light of a specific wavelength, having at least one color selected from red pixels, blue pigments, green pixels, yellow pixels, cyan pixels, and magenta pixels A pixel filter is preferred. The color filter can be formed using a resin composition containing a color material.

Examples of the near-infrared cut filter include filters having a maximum absorption wavelength within a wavelength range of 700 to 1800 nm. It is preferable that the maximum absorption wavelength of the near-infrared cut filter exists in the wavelength range of 700 to 1300 nm, and it is more preferable that the maximum absorption wavelength of the near-infrared cut filter exists in the wavelength range of 700 to 1100 nm. In addition, the transmittance of the near-infrared cut filter is preferably 70% or higher in the entire wavelength range of 400 to 650 nm, more preferably 80% or higher, and still more preferably 90% or higher. Also, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. In addition, the ratio of the absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter to the absorbance A550 at a wavelength of 550 nm, that is, the absorbance Amax/absorbance A550 is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. More preferably, 100-400 is especially preferable. The near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing color material.

The near-infrared pass filter is a filter that passes at least part of near-infrared rays. The near-infrared transmission filter is preferably a filter that blocks at least a part of visible light and transmits at least a part of near-infrared rays. As a near-infrared ray transmission filter, it is preferable to mention that the maximum transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the wavelength is 1100 to 640 nm. Filters and the like having spectral characteristics whose minimum transmittance in the range of 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more). The near-infrared ray transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5). (1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (3): The maximum value of the transmittance in the wavelength range of 400-830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1000-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (4): The maximum value of the transmittance in the wavelength range of 400-950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1100-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). (5): The maximum value of the transmittance in the wavelength range of 400-1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1200-1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%).

As a preferred aspect of the spectral characteristics possessed by the resin composition of the present invention, when the resin composition is used to form a film with a thickness of 5 μm, the transmittance of light in the thickness direction of the film is satisfied at a wavelength of 360 The maximum value in the range of ~700nm is 50% or more of the aspect of the spectral characteristic. A resin composition satisfying such spectroscopic characteristics can be preferably used as a resin composition for forming a pixel of a color filter. Specifically, it can be preferably used as a resin composition for forming colored pixels selected from red pixels, blue pixels, green pixels, yellow pixels, cyan pixels, and magenta.

It is preferable that the resin composition having the above-mentioned spectroscopic properties contains a color material. For example, a resin composition including a red color material and a yellow color material can be preferably used as a resin composition for forming a red pixel. Moreover, the resin composition containing a blue color material and a violet color material can be suitably used as the resin composition for blue pixel formation. Also, a resin composition containing a green color material can be preferably used as a resin composition for forming a green or cyan pixel. When using the resin composition as the resin composition for green pixel formation, it is also preferable to contain a yellow color material in addition to a green color material.

As another preferred aspect of the spectroscopic properties of the resin composition of the present invention, the ratio of the minimum value Amin of the absorbance in the wavelength range of 400 to 640nm to the absorbance B at the wavelength of 1500nm, that is, Amin/B is an aspect of the spectral characteristic of 5 or more. A resin composition satisfying such spectral characteristics can be preferably used as a resin composition for forming a near-infrared transmission filter. The above absorbance ratio, that is, the value of Amin/B is preferably 7.5 or higher, more preferably 15 or higher, and still more preferably 30 or higher.

Here, the absorbance Aλ in the wavelength λ is defined by the following formula (λ1). Aλ=-log(Tλ/100)...(λ1) Aλ is the absorbance within the wavelength λ, and Tλ is the transmittance (%) within the wavelength λ. In the present invention, the value of absorbance may be a value measured in a solution state, or may be a value of a film formed using a composition. In the case of measuring absorbance in the state of a film, it is preferable to use a film obtained by applying the composition on a glass substrate by a method such as spin coating and drying at 100°C for 120 seconds using a hot plate or the like. .

It is preferable that the resin composition of the present invention satisfies any one of the following spectral characteristics (Ir1) to (Ir5). (Ir1): the ratio of the minimum absorbance value A1 in the wavelength range of 400 to 640 nm to the maximum absorbance value B1 in the wavelength range of 800 to 1500 nm, that is, the value of A1/B1 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is still more preferable. According to this aspect, it is possible to form a film that blocks light in a wavelength range of 400 to 640 nm and transmits light exceeding a wavelength of 750 nm. (Ir2): The ratio of the minimum value A2 of absorbance in the range of wavelength 400-750nm to the maximum value of absorbance B2 in the range of wavelength 900-1500nm, that is, the value of A2/B2 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is still more preferable. According to this aspect, it is possible to form a film that blocks light in a wavelength range of 400 to 750 nm and transmits light exceeding a wavelength of 850 nm. (Ir3): The ratio of the minimum absorbance value A3 in the wavelength range of 400 to 830 nm to the maximum absorbance value B3 in the wavelength range of 1000 to 1500 nm, that is, the value of A3/B3 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is still more preferable. According to this aspect, it is possible to form a film that blocks light in a wavelength range of 400 to 830 nm and transmits light exceeding a wavelength of 950 nm. (Ir4): The ratio of the minimum value A4 of absorbance in the range of wavelength 400-950nm to the maximum value of absorbance B4 in the range of wavelength 1100-1500nm, that is, the value of A4/B4 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is still more preferable. According to this aspect, it is possible to form a film that blocks light in a wavelength range of 400 to 950 nm and transmits light exceeding a wavelength of 1050 nm. (Ir5): The ratio of the minimum value A5 of absorbance in the range of wavelength 400-1050nm to the maximum value of absorbance B5 in the range of wavelength 1200-1500nm, that is, the value of A5/B5 is 4.5 or more, preferably 7.5 or more, 15 or more is more preferable, and 30 or more is still more preferable. According to this aspect, it is possible to form a film that blocks light in a wavelength range of 400 to 1050 nm and transmits light exceeding a wavelength of 1150 nm.

It is also preferable that the resin composition of the present invention is a resin composition for pattern formation by photolithography. According to this aspect, fine-sized pixels can be easily formed. Therefore, it can be used particularly suitably as the resin composition for pixel formation of the optical filter used for a solid-state imaging device. For example, a component containing an ethylenically unsaturated bond-containing group (for example, a resin having an ethylenically unsaturated bond-containing group or a monomer having an ethylenically unsaturated bond-containing group) and a photopolymerization initiator The resin composition of the agent can be preferably used as the resin composition for pattern formation by photolithography. It is also preferable that the resin composition for pattern formation by photolithography further contains an alkali-soluble resin.

The resin composition of this invention can also be used as the resin composition for black matrix formation, or the resin composition for light-shielding film formation.

Hereinafter, each component used for the resin composition of this invention is demonstrated.

＜＜Color material A＞＞ The resin composition of the present invention contains the color material A (hereinafter referred to as color material). Examples of the color material include a white color material, a black color material, a colored color material, and a near-infrared absorption color material. Furthermore, in the present invention, the white color material includes not only pure white, but also light gray color materials close to white (such as off-white, thin gray, etc.).

It is preferable that the color material comprises at least one selected from the group including color color material, black color material and near-infrared absorption color material, and at least one selected from the group including color color material and near-infrared absorption color material One kind is more preferred, it is further preferred to include a color material, and it is further preferred to include at least one color material selected from the group consisting of a red color material, a yellow color material, a blue color material, and a purple color material.

In addition, it is also preferable that the color material includes a color color material and a near-infrared absorption color material, and it is also preferable that two or more kinds of color color materials and a near-infrared absorption color material are included. Also, black may be formed by a combination of two or more color materials. In addition, it is also preferable that the color material includes a black color material and a near-infrared absorption color material. According to these aspects, the resin composition of the present invention can be preferably used as a resin composition for forming a near infrared transmission filter. Regarding the combination of two or more color materials to form black color materials, refer to JP-A-2013-077009, JP-A-2014-130338, International Publication No. 2015/166779, and the like.

As the coloring material contained in the resin composition of the present invention, those containing pigments can be used. The pigment may be any of inorganic pigments and organic pigments, and organic pigments are preferred from the viewpoints of color change, ease of dispersion, and safety. In addition, the pigment preferably contains at least one selected from a color pigment and a near-infrared absorbing pigment, and more preferably contains a color pigment.

In addition, the pigment includes pigments selected from phthalocyanine pigments, dimethicone pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, azo pigments, diketopyrrolopyrrole pigments, pyrrolopyrrole pigments, isoindoline pigments, At least one of phthalocyanine pigments and pteridine-based pigments is preferred, more preferably at least one selected from phthalocyanine pigments, diketopyrrolopyrrole pigments, and pyrrolopyrrole pigments, including phthalocyanine pigments or diketopyrrolopyrrole pigments. Ketopyrrolopyrrole pigments are further preferred. In addition, for the reason that it is easy to form a film whose spectral characteristics do not change even after heating to a high temperature (for example, 300° C. or higher), the phthalocyanine pigment does not have a central metal or the phthalocyanine pigment has copper or zinc as a central metal. better.

The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably at most 180 nm, more preferably at most 150 nm, and still more preferably at most 100 nm. When the average primary particle diameter of the pigment is within the above-mentioned range, the dispersion stability of the pigment in the resin composition will be favorable. Furthermore, in the present invention, the primary particle size of the pigment can be obtained by observing the primary particle of the pigment with a transmission electron microscope and obtaining the obtained photograph. Specifically, the projected area of the primary particle of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle diameter of the pigment. Moreover, the average primary particle diameter in this invention is made into the arithmetic mean value about the primary particle diameter of the primary particle of 400 pigments. In addition, the primary particle of the pigment refers to unaggregated independent particles.

(color material) As a color material, the color material which has a maximum absorption wavelength in the wavelength range of 400-700 nm is mentioned. For example, a yellow color material, an orange color material, a red color material, a green color material, a purple color material, a blue color material, etc. are mentioned. From the viewpoint of heat resistance, the color material is preferably a pigment (color pigment), more preferably a red pigment, a yellow pigment, and a blue pigment, and even more preferably a red pigment and a blue pigment. As a specific example of a color pigment, what is shown below is mentioned, for example.

Examples of C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc. (the above are yellow pigments), C.I. Pigment Orange 2, 5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73 etc. (the above are orange pigments), C.I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4 , 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3 ,83,88,90,105,112,119,122,123,144,146,149,150,155,166,168,169,170,171,172,175,176,177,178,179,184 ,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,269,270,272,279,291 , 294, 295, 296, 297, etc. (the above are red pigments), C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine), 65, 66, etc. (the above are green pigments), C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, 61, etc. (the above are purple pigments), C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88, etc. ( above for the blue pigment).

Among these color pigments, the red pigments C.I. Pigment Red 254, C.I. Pigment Red 264, C.I. Pigment Red 272, C.I. Pigment Red 272, and C.I. Pigment Red 122, C.I. Pigment Red 177, and C.I. Pigment Red 179 are preferred. Also, as blue pigments, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:6, and C.I. Pigment Blue 16 are preferable.

Also, as a green pigment, a zinc halide phthalocyanine pigment having an average number of halogen atoms of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 per molecule can also be used. Specific examples include compounds described in International Publication No. 2015/118720. In addition, as green pigments, compounds described in Chinese Patent Application No. 106909027, phthalocyanine compounds having phosphoric acid esters as ligands described in International Publication No. 2012/102395, Japanese Patent Laid-Open No. 2019- Phthalocyanine compounds described in JP-A No. 008014, phthalocyanine compounds described in JP-A No. 2018-180023, compounds described in JP-A No. 2019-038958, JP-A No. 2020-070426 The aluminum phthalocyanine compound described, the core-shell type pigment described in Japanese Patent Application Laid-Open No. 2020-076995, etc.

Moreover, as a blue pigment, the aluminum phthalocyanine pigment which has a phosphorus atom can also be used. Specific examples include compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraphs 0047 of JP-A-2011-157478.

Moreover, the nickel azobarbiturate complex compound of the following structure can also be used as a yellow pigment. [chemical formula 5]

In addition, as the yellow pigment, compounds described in JP-A-2017-201003, compounds described in JP-A-2017-197719, and paragraphs 0011 to 0062 of JP-A-2017-171912 can also be used. , Compounds described in paragraphs 0137-0276, compounds described in paragraphs 0010-0062, 0138-0295 of JP-A-2017-171913, paragraphs 0011-0062, 0139 of JP-A-2017-171914 Compounds described in paragraphs 0190, 0010-0065, 0142-0222 of JP-A-2017-171915, 0011-0034 of JP-2013-054339 Quinophthalone compounds, quinophthalone compounds described in paragraphs 0013-0058 of JP-A-2014-026228, isoindoline compounds described in JP-A-2018-062644, JP-A-2018- The quinophthalone compound described in Gazette No. 203798, the quinophthalone compound described in JP-A-2018-062578, the quinophthalone compound described in JP-A-6432076, JP-A-2018-155881 The quinophthalone compound described in the Publication No. 2018-111757, the quinophthalone compound described in the Japanese Patent Application Publication No. 2018-040835, the The quinophthalone compound described in Gazette No. 197640, the quinophthalone compound described in JP-A No. 2016-145282, the quinophthalone compound described in JP-A No. 2014-085565, JP-A-2014 -Quinophthalone compounds described in Gazette No. 021139, quinophthalone compounds described in JP 2013-209614 Gazette, quinophthalone compounds described in JP 2013-209435 Gazette, JP The quinophthalone compound described in the 2013-181015 communique, the quinophthalone compound described in the Japanese Patent Application Publication No. 2013-061622, the quinophthalone compound described in the Japanese Patent Application Publication No. The quinophthalone compound described in the publication No. 2012-226110, the quinophthalone compound described in the Japanese Patent Application Publication No. 2008-074987, the quinophthalone compound described in the Japanese Patent Application Publication No. 2008-081565, Japan The quinophthalone compound described in JP-A-2008-074986, the quinophthalone compound described in JP-A-2008-074985, the quinophthalone-a compound described in JP-A-2008-050420 Compounds, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2008-031281, quinophthalone compounds described in Japanese Patent Application Publication No. 48-032765, and quinoline compounds described in Japanese Patent Application Publication No. 2019-008014 Yellow compounds, quinoline yellow compounds described in Japanese Patent No. 6607427, compounds described in Korean Laid-Open Patent No. 10-2014-0034963, compounds described in Japanese Patent Laid-Open No. 2017-095706, Taiwan Compounds described in Patent Application Publication No. 201920495, Compounds described in Japanese Patent No. 6607427, Compounds described in JP-A-2020-033525, JP-A-2020-033524 Compounds, compounds described in Japanese Patent Application Laid-Open No. 2020-033523, compounds described in Japanese Patent Laid-Open No. 2020-033522, compounds described in Japanese Patent Laid-Open No. 2020-033521, International Publication No. 2020/ Compounds described in No. 045200, compounds described in International Publication No. 2020/045199, compounds described in International Publication No. 2020/045197, azo compounds described in Japanese Patent Laid-Open No. 2020-093994, The perylene compound described in Japanese Patent Application Laid-Open No. 2020-083982, the perylene compound described in International Publication No. 2020/105346, and the quinophthalone compound described in Japanese National Publication No. 2020-517791 are represented by the following formula: A compound represented by (QP1) and a compound represented by the following formula (QP2). Moreover, from the viewpoint of improving the color value, those obtained by multimerizing these compounds can also be preferably used. [chemical formula 6]

In formula (QP1), X ¹ to X ¹⁶ each independently represent a hydrogen atom or a halogen atom, and Z ¹ represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by the formula (QP1) include compounds described in paragraph 0016 of Japanese Patent No. 6443711. [chemical formula 7]

In formula (QP2), Y ¹ to Y ³ each independently represent a halogen atom. n and m represent the integer of 0-6, and p represents the integer of 0-5. (n+m) is 1 or more. Specific examples of the compound represented by the formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

As the pigment, diketopyrrolopyrrole compounds described in JP-A-2017-201384 in which at least one bromine atom is substituted in the structure, and two of the diketopyrrolopyrrole compounds described in paragraphs 0016 to 0022 of JP-A-6248838 can also be used. Ketopyrrolopyrrole compound, diketopyrrolopyrrole compound described in International Publication No. 2012/102399, diketopyrrolopyrrole compound described in International Publication No. 2012/117965, JP-A-2020-085947 The brominated diketopyrrolopyrrole compound described in , the naphthol azo compound described in Japanese Patent Application Laid-Open No. 2012-229344, the red pigment described in Japanese Patent No. 6516119, and Japanese Patent No. 6525101 The red pigment described in , the brominated diketopyrrolopyrrole compound described in paragraph 0229 of Japanese Patent Laid-Open No. 2020-090632, the anthraquinone compound described in Korean Laid-Open Patent No. 10-2019-0140741, Anthraquinone compounds described in Korean Laid-Open Patent No. 10-2019-0140744, perylene compounds described in JP-A-2020-079396, paragraphs 0025-0041 of JP-A-2020-066702 Diketopyrrolopyrrole compounds, etc. Also, as a red pigment, one having a structure in which an aromatic ring group is bonded to a diketopyrrolopyrrole skeleton by introducing a group in which an oxygen atom, a sulfur atom, or a nitrogen atom is bonded to an aromatic ring can also be used. compound.

For the preferred diffraction angles of various pigments, refer to Japanese Patent No. 6561862, Japanese Patent No. 6413872, Japanese Patent No. 6281345, Japanese Patent Application Publication No. 2020-026503, Japanese Patent Application Publication No. 2020- No. 033526 bulletin, these contents are incorporated into this specification. In addition, as the pyrrolopyrrole pigment, one having a crystallite size of 140 Å or less in the plane direction corresponding to the largest peak in the X-ray diffraction pattern among the eight planes of the crystal lattice (±1±1±1) is also used. better. Furthermore, it is also preferable to set the physical properties of the pyrrolopyrrole pigment as described in paragraphs 0028 to 0073 of JP-A-2020-097744.

In addition, as a color material, the triarylmethane dye polymer described in Korean Laid-Open Patent No. 10-2020-0028160, the Kusama compound described in Japanese Patent Application Laid-Open No. 2020-117638, the International Publication No. A phthalocyanine compound described in No. 2020/174991, an isoindoline compound described in JP-A-2020-160279, or a salt thereof.

Two or more kinds of color materials may be used in combination. Also, when two or more color materials are used in combination, black may be formed by combining two or more color materials. Examples of such combinations include the following aspects (1) to (7). In the case where two or more color materials are contained in the resin composition and black is represented by a combination of two or more color materials, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. thing. (1) The form that contains red color material and blue color material. (2) Forms containing red color material, blue color material and yellow color material. (3) Forms containing red color material, blue color material, yellow color material and purple color material. (4) Forms containing red color material, blue color material, yellow color material, purple color material and green color material. (5) Forms containing red color material, blue color material, yellow color material and green color material. (6) Forms containing red color material, blue color material and green color material. (7) Forms containing yellow and purple color materials.

(white color material) Examples of white color materials include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silicon dioxide, talc, mica, aluminum hydroxide, calcium silicate, Aluminum silicate, hollow resin particles, zinc sulfide and other inorganic pigments (white pigments). The white pigment is preferably particles having titanium atoms, more preferably titanium oxide. Also, the white pigment is preferably particles having a refractive index of 2.10 or higher with respect to light having a wavelength of 589 nm. The aforementioned refractive index is preferably from 2.10 to 3.00, more preferably from 2.50 to 2.75.

In addition, as the white pigment, titanium oxide described in "Titanium Oxide Physical Properties and Applied Technology, Kiyono Gakushu, pp. 13-45, June 25, 1991, Gihodo Publishing" can also be used.

The white pigment is not limited to a single inorganic substance, and particles compounded with other raw materials can also be used. For example, particles having pores or other raw materials inside, particles with a plurality of inorganic particles attached to the core particle, core and core composite particles composed of a core particle including polymer particles and a shell layer including inorganic nanoparticle particles are used. better. As the core-core composite particle composed of the core particle including the above-mentioned polymer particle and the shell layer including the inorganic nanoparticle, for example, the description in paragraphs 0012 to 0042 of JP-A-2015-047520 can be referred to. incorporated into this manual.

Hollow inorganic particles can also be used as a white pigment. The hollow inorganic particle refers to an inorganic particle having a structure of a cavity inside, and refers to an inorganic particle having a cavity surrounded by an outer shell. Examples of the hollow inorganic particles include hollow inorganic particles described in JP-A-2011-075786, International Publication No. 2013/061621, JP-A-2015-164881, etc., and these contents are incorporated in this specification. .

(black color material) It does not specifically limit as a black color material, A well-known thing can be used. For example, examples of inorganic black color materials include inorganic pigments (inorganic black pigments) such as carbon black, titanium black, and graphite. Carbon black and titanium black are preferred, and titanium black is more preferred. Titanium black refers to black particles containing titanium atoms, preferably subvalent titanium oxide or titanium oxynitride. The surface of titanium black can be modified as required for the purposes of improving dispersibility and inhibiting cohesion. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide or zirconium oxide. In addition, treatment with a water-repellent substance as disclosed in JP-A-2007-302836 can also be performed. Regarding titanium black, it is preferable that both the primary particle diameter and the average primary particle diameter of each particle are small. Specifically, the average primary particle diameter is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles and adjusting the content ratio of Si atoms to Ti atoms in the dispersion to be in the range of 0.20 to 0.50, etc. may be mentioned. Regarding the above-mentioned dispersion, the description in paragraphs 0020 to 0105 of JP-A-2012-169556 can also be referred to, and the content is incorporated in this specification. Examples of commercially available titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (product name: manufactured by Mitsubishi Materials Corporation), Tilack D (product name: Ako Kasei Co., Ltd.), etc. C.I. Pigment Black 1, 7, etc. can also be used as an inorganic black pigment.

Moreover, as an organic black coloring material, a bisbenzofuranone compound, an imine compound, a perylene compound, an azo compound, etc. are mentioned. Examples of the bisbenzofuranone compound include compounds described in JP 2010-534726, JP 2012-515233, JP 2012-515234, etc. Obtained from "Irgaphor Black". Examples of the perylene compound include compounds described in paragraphs 0016 to 0020 of JP-A-2017-226821, C.I. Pigment Black 31, 32, and the like. Examples of the methylimine compound include compounds described in JP-A-01-170601, JP-A-02-034664, etc., for example, as "CHROMOFINE" manufactured by Dainichiseika Color & Chemicals Mfg.Co., Ltd. BLACK A1103".

The color material used in the resin composition of the present invention may be only the above-mentioned black color material, or may also include color color material. According to this aspect, it is easy to obtain a resin composition capable of forming a film excellent in light-shielding properties in the visible region. When using black color material and colored color material together as a color material, the mass ratio of the two is preferably black color material:color color material=100:10-300, more preferably 100:20-200. Moreover, it is preferable to use a black pigment as the above-mentioned black color material, and it is preferable to use a color pigment as the above-mentioned color color material.

As a preferable combination of a black color material and a color color material, the following are mentioned, for example. (A-1) Forms containing organic black and blue color materials. (A-2) Forms containing organic black color materials, blue color materials and yellow color materials. (A-3) Forms containing organic black color materials, blue color materials, yellow color materials and red color materials. (A-4) Forms containing organic black color materials, blue color materials, yellow color materials and purple color materials.

In the aspect of (A-1) above, the mass ratio of organic black color material to blue color material is organic black color material:blue color material=100:1~70 is better, 100:5~60 is more preferable, 100:10-50 is more preferable. In the form of (A-2) above, the mass ratio of organic black color material, blue color material and yellow color material is organic black color material:blue color material:yellow color material=100:10～90:10～90 More preferably, 100:15-85:15-80 is more preferable, and 100:20-80:20-70 is still more preferable. In the above (A-3) form, the mass ratio of organic black color material, blue color material, yellow color material and red color material is organic black color material:blue color material:yellow color material:red color material=100: 20-150:1-60:10-100 is preferable, 100:30-130:5-50:20-90 is more preferable, and 100:40-120:10-40:30-80 is still more preferable. In the above (A-4), the mass ratio of organic black color material, blue color material, yellow color material and purple color material is organic black color material:blue color material:yellow color material:purple color material=100: 20-150:1-60:10-100 is preferable, 100:30-130:5-50:20-90 is more preferable, and 100:40-120:10-40:30-80 is still more preferable.

(Near Infrared Absorbing Color Material) The near infrared absorbing color material is preferably a pigment, more preferably an organic pigment. Moreover, it is preferable that the near-infrared absorption color material has a maximum absorption wavelength in the range exceeding wavelength 700nm and 1400nm or less. Also, the maximum absorption wavelength of the near-infrared absorbing color material is preferably 1200 nm or less, more preferably 1000 nm or less, and still more preferably 950 nm or less. In addition, the near-infrared absorbing color material is such that the ratio of the absorbance A ₅₅₀ at a wavelength of 550 nm to the absorbance A _max at the maximum absorption wavelength, that is, A ₅₅₀ /A _max is preferably 0.1 or less, more preferably 0.05 or less, and 0.03 or less. Preferably, less than 0.02 is particularly preferred. The lower limit is not particularly limited, and may be, for example, 0.0001 or more, or 0.0005 or more. When the ratio of the above-mentioned absorbances is within the above-mentioned range, a near-infrared-absorbing color material excellent in visible light transparency and near-infrared shielding properties can be obtained. In the present invention, the maximum absorption wavelength of the near-infrared-absorbing color material and the absorbance at each wavelength are values obtained from the absorption spectrum of a film formed using a resin composition containing the near-infrared-absorbing color material.

Examples of near-infrared absorbing color materials include pyrrolopyrrole compounds, cyanine compounds, squaraine compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, and ketones. Onium compounds, oxonol compounds, imonium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, imine compounds, anthraquinone compounds, bisbenzofuranone compounds, metal oxides, metal boron compounds etc. Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614 , compounds described in paragraphs 0037-0052 of JP-A-2011-068731 , International Publication No. Compounds described in paragraphs 0010 to 0033 of No. 2015/166873, etc. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Laid-Open No. 2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169, International Publication No. 2016/ Compounds described in Paragraph 0040 of No. 181987, compounds described in JP-A No. 2015-176046, compounds described in Paragraph 0072 of International Publication No. 2016/190162, compounds described in JP-A No. 2016-074649 Compounds described in paragraphs 0196 to 0228, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in International Publication No. 2017/135359, JP-A-2017-114956 Compounds described, compounds described in Japanese Patent No. 6197940, compounds described in International Publication No. 2016/120166, etc. Examples of cyanine compounds include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, JP 2015 - Compounds described in Publication No. 172004, Compounds described in Japanese Patent Application Laid-Open No. 2015-172102, Compounds described in Japanese Patent Application Publication No. 2008-088426, Paragraph 0090 of International Publication No. 2016/190162 Compounds described, compounds described in JP-A-2017-031394, etc. Examples of the crotonium compound include compounds described in JP-A-2017-082029. Examples of iminium compounds include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, and compounds described in JP-A-2007-092060 . Compounds described in paragraphs 0048 to 0063 of International Publication No. 2018/043564. Examples of the phthalocyanine compound include compounds described in paragraph 0093 of JP-A-2012-077153, phthalocyanine-titanium compounds described in JP-A-2006-343631, JP-A-2013-195480 Compounds described in paragraphs 0013 to 0029, vanadium phthalocyanine compounds described in Patent No. 6081771, vanadium phthalocyanine compounds described in International Publication No. 2020/071486, and vanadium phthalocyanine compounds described in International Publication No. 2020/071470 The recorded phthalocyanine compounds. As a naphthalocyanine compound, the compound described in paragraph 0093 of Unexamined-Japanese-Patent No. 2012-077153 is mentioned. Examples of the disulfide metal complexes include compounds described in Japanese Patent No. 5733804 . Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details of tungsten oxide, paragraph 0080 of JP-A-2016-006476 can be referred to, and this content is incorporated in this specification. Lanthanum boride etc. are mentioned as a metal boride. Commercially available lanthanum borides include LaB ₆ -F (manufactured by JAPAN NEW METALS CO., LTD.) and the like. In addition, as metal borides, compounds described in International Publication No. 2017/119394 can also be used. F-ITO (manufactured by DOWA HOLDINGS CO., LTD.) etc. are mentioned as a commercial item of indium tin oxide.

In addition, as a near-infrared absorbing coloring material, squarylium compounds described in JP-A-2017-197437, squarylium compounds described in JP-A-2017-025311, International Publication No. 2016 The squaraine compound described in /154782, the squaraine compound described in Japanese Patent No. 5884953, the squaraine compound described in Japanese Patent No. 6036689, the squaraine compound described in Japanese Patent No. 5810604 The squaraine compound described, the squaraine compound described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the compound containing a pyrrole ring described in paragraphs 0019 to 0075 of JP-A-2018-054760 , Compounds containing a pyrrole ring described in paragraphs 0078 to 0082 of JP-A-2018-040955, compounds containing a pyrrole ring described in paragraphs 0043-0069 of JP-A-2018-002773, JP-A A squaraine compound having an aromatic ring at the amide α-position described in paragraphs 0024 to 0086 of No. 2018-041047, an amide-linked squaraine compound described in JP-A-2017-179131, Japan A compound having a pyrrole double-type squaraine skeleton or a crotonium skeleton described in JP-A-2017-141215, a dihydroxycarbazole-type squaraine compound described in JP-A-2017-082029, Asymmetric compounds described in paragraphs 0027 to 0114 of JP-A-2017-068120, pyrrole-ring-containing compounds (carbazole-type) described in JP-A-2017-067963, Japanese Patent No. 6251530 Phthalocyanine compounds described in the gazette, etc.

It is preferable that content of the coloring material in the total solid content of a resin composition is 20-90 mass %. The lower limit is preferably at least 30% by mass, more preferably at least 40% by mass, and still more preferably at least 50% by mass. The upper limit is preferably at most 80% by mass, more preferably at most 70% by mass. Moreover, it is preferable that content of the pigment in the total solid content of a resin composition is 20-90 mass %. The lower limit is preferably at least 30% by mass, more preferably at least 40% by mass, and still more preferably at least 50% by mass. The upper limit is preferably at most 80% by mass, more preferably at most 70% by mass. In addition, the content of the dye in the color material is preferably at most 50% by mass, more preferably at most 40% by mass, and still more preferably at most 30% by mass. Moreover, it is also preferable that the resin composition of this invention does not contain a dye substantially from the reason that it is easy to suppress the change of the film thickness when the obtained film is heated to high temperature more effectively. When the resin composition of the present invention does not substantially contain a dye, the content of the dye in the total solid content of the resin composition of the present invention is preferably 0.1% by mass or less, more preferably 0.05% by mass or less, and does not contain For the best.

＜＜Resin B＞＞ (specific resin (resin B1)) The resin composition of the present invention includes resin B (hereinafter also referred to as resin). The resin contained in the resin composition includes a reaction product of a resin having a primary or secondary amino group and a macromonomer having an acid anhydride structure at the terminal, that is, resin B1 (hereinafter also referred to as a specific resin).

First, the resin (henceforth, also referred to as amine polymer M) which has the said primary amine group or secondary amine group which is a specific resin is demonstrated. As the amine polymer M, resins having primary or secondary amine groups are sufficient, and examples include polyalkyleneimine, polyallylamine, polydiallylamine, aminoethylated acrylic polymer things etc. Furthermore, in this specification, the primary amino group refers to a group represented by -NH ₂ . Also, the secondary amino group refers to a group represented by *-NH-*, where "*" is a linking part with a carbon atom.

The amine polymer M is preferably a resin having a primary amine group. In addition, the amine polymer M is preferably a resin having 3 or more amine groups, more preferably a resin having a total of 3 or more primary amine groups and secondary amine groups, and a resin having 3 or more primary amine groups for further improvement.

Here, polyalkyleneimine is a polymer of ring-opening polymerized alkyleneimine, which is a polymer having at least a secondary amine group. The polyalkyleneimine contains primary or tertiary amine groups in addition to secondary amine groups. Specific examples of alkyleneimine include ethyleneimine, propyleneimine, 1,2-buteneimine, 2,3-buteneimine, etc., and ethyleneimine or propyleneimine is preferable. , ethyleneimine is more preferred. That is, the polyalkyleneimine is preferably polyethyleneimine.

The polyalkyleneimine may be a linear polymer or a polymer having a branched structure. Examples of linear polyethyleneimine include those commercially available from FUJIFILM Wako Pure Chemical Corporation. Examples of commercially available polyethyleneimine having a branched structure include Epomin series (manufactured by NIPPON SHOKUBAI CO., LTD.).

As a commercial item of polyallylamine, PAA series (made by NITTOBO MEDICAL Co., Ltd.) etc. are mentioned. As a commercial item of polydiallylamine, PAS series (made by NITTOBO MEDICAL Co., Ltd.) etc. are mentioned. Commercially available aminoethylated acrylic polymers include POLYMENT series (manufactured by NIPPON SHOKUBAI CO., LTD.) and the like.

The amine polymer M is preferably a compound having a molecular weight distribution. Moreover, the molecular weight of the amine polymer M is preferably from 300 to 100,000, more preferably from 300 to 10,000, and still more preferably from 300 to 2,000. In addition, when it can be measured by the boiling point raising method, the value of the molecular weight of the amine polymer M uses the value of the number average molecular weight measured by the boiling point raising method. Also, when it is impossible or difficult to measure by the boiling point elevation method, the value of the number average molecular weight measured by the viscosity method is used. Moreover, when it cannot measure by a viscosity method or it is difficult to measure by a viscosity method, the value of the number average molecular weight in terms of polystyrene conversion value measured by the GPC (gel permeation chromatography) method is used.

The amine value of the amine polymer M is preferably at least 5 mgKOH/g, more preferably at least 280 mgKOH/g, still more preferably at least 560 mgKOH/g, most preferably at least 840 mgKOH/g. Although the upper limit is not specified, it is generally 1500 mgKOH/g or less.

Next, a macromonomer having an acid anhydride structure at a terminal of a specific resin (hereinafter also referred to as a macromonomer AH) will be described.

Here, the macromonomer refers to a polymer compound having a reactive group at the terminal. The macromonomer AH is preferably a compound having an acid anhydride structure at the end of the polymer chain. Also, the number of terminal acid anhydride structures in the macromonomer AH is preferably one. The macromonomer AH is preferably a compound represented by the formula (AH1). R ^AH1 -(L ^AH1 -P ^AH1 ) _m ...(AH1) In the formula (AH1), R ^AH1 represents a group having an acid anhydride structure, L ^AH1 represents a divalent linking group, ^PAH1 represents a polymer chain, and m represents An integer of 1 to 5.

As the group having an acid anhydride structure represented by R ^AH1 of the formula (AH1), a group having a cyclic acid anhydride structure is preferable. Examples of the group containing a cyclic acid anhydride structure include groups containing structures represented by formulas (AH-1) to (AH-6) shown below, and formula (AH-3) is preferred. [chemical formula 8]

Specific examples of groups having an acid anhydride structure represented by R ^AH1 include groups represented by the following formula (AAH-1) to formula (AAH-10), represented by formula (AAH-10) The group is preferred. In the following formula, * is a connection part with L ^AH1 of formula (AH1). [chemical formula 9]

Examples of the divalent linking group represented by L ^AH1 in the formula (AH1) include hydrocarbon groups, heterocyclic groups, -NR ^LH1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO -, -OCO-, -S-, -NR ^LH1 CO-, -CONR ^LH1 -, and a group formed by combining two or more of these. R ^LH1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Also, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The types of heteroatoms constituting the heterocyclic group include nitrogen atom, oxygen atom, sulfur atom and the like. The number of heteroatoms constituting the heterocyclic group is preferably 1-3. The heterocyclic group may be a monocyclic ring or a condensed ring. A hydrocarbon group and a heterocyclic group may have a substituent. As a substituent, the substituent T mentioned later is mentioned.

The polymer chain represented by PAH1 of the formula ( ^AH1 ) is a polymer chain containing repeating units of at least one structure selected from polyether structure, polyester structure, poly(meth)acrylic acid structure and polystyrene structure More preferably, a polymer chain comprising repeating units of at least one structure selected from poly(meth)acrylic acid structures and polystyrene structures is more preferred. From the viewpoint of pigment dispersibility and heat resistance, poly A polymer chain of repeating units of a (meth)acrylic acid structure is further preferred.

The polymer chain represented by ^PAH1 may have a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl, (meth)allyl, and (meth)acryl; rings such as epoxy and oxetanyl; Like ether group, blocked isocyanate group, etc. Furthermore, in this specification, a blocked isocyanate group refers to a group capable of generating an isocyanate group by heat, for example, a group that can preferably exemplify a group that reacts a blocking agent with an isocyanate group to protect the isocyanate group. Examples of the blocking agent include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, thiol compounds, imidazole compounds, imide compounds, and the like. Examples of the blocking agent include compounds described in paragraphs 0115 to 0117 of JP-A-2017-067930, and the contents thereof are incorporated in the present specification. Moreover, it is preferable that a blocked isocyanate group is a group which can generate an isocyanate group by heat of 90-260 degreeC.

It is also preferable that the polymer chain represented by ^PAH1 has a tertiary alkyl group. As a tertiary alkyl group, a tertiary butyl group etc. are mentioned.

It is also preferable that the polymer chains represented by ^PAH1 respectively contain epoxy groups, oxetanyl groups and tertiary butyl groups.

The polymer chain represented by ^PAH1 preferably contains repeating units represented by any one of formula (P1-1) to formula (P1-6), including formula (P1-5) or formula (P1-6) The repeating unit represented is more preferable, and the repeating unit represented by formula (P1-5) is further preferable. [chemical formula 10]

In the above formula, R ^G1 and R ^G2 each represent an alkylene group. As the alkylene group represented by R ^G1 and R ^G2 , a linear or branched alkylene group having 1 to 20 carbons is preferable, and a linear or branched alkylene group having 2 to 16 carbons is preferable. A group is more preferable, and a linear or branched alkylene group having 3 to 12 carbon atoms is still more preferable.

In the above formula, R ^G3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group, preferably a hydrogen atom or a methyl group.

In the above formula, Q ^G1 represents -O- or -NR ^q -, and R ^q represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group. Q ^G1 is preferably -O-. The carbon number of the alkyl group represented by ^Rq is preferably 1-30, more preferably 1-15, still more preferably 1-8, still more preferably 1-5, and particularly preferably 1-3. The alkyl group may be linear, branched, or cyclic. Linear or branched is preferred, and linear is more preferred. The carbon number of the aryl group represented by R ^q is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The heterocyclic group represented by ^Rq may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The types of heteroatoms constituting the heterocyclic group include nitrogen atom, oxygen atom, sulfur atom and the like. The number of heteroatoms constituting the heterocyclic group is preferably 1-3. The heterocyclic group may be a monocyclic ring or a condensed ring. The above-mentioned alkyl group, aryl group and heterocyclic group may have a substituent or may be unsubstituted. As a substituent, the substituent T mentioned later is mentioned.

In the above formula, L ^G1 represents a single bond or an aryl group, preferably a single bond.

In the above formula, L ^G2 represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylylene group (preferably an arylylene group having 6 to 20 carbon atoms), -NR ^LG1 - , -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^LG1 CO-, -CONR ^LG1 - and combinations of two or more of these Group, alkylene is preferred. R ^LG1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. The above-mentioned alkylene and aromatic may have substituents or may be unsubstituted. As a substituent, the substituent T mentioned later is mentioned.

In the above formula, R ^G4 represents a hydrogen atom or a substituent. Examples of substituents include hydroxyl group, carboxyl group, alkyl group, aryl group, heterocyclic group, alkoxy group, aryloxy group, heterocyclic epoxy group, alkyl sulfide group, aryl sulfide group, heterocyclic sulfide group Groups, groups containing ethylenically unsaturated bonds, epoxy groups, oxetanyl groups and blocked isocyanate groups, etc. R ^G4 is preferably at least one selected from the group consisting of alkyl, aryl, ethylenically unsaturated bond-containing group, epoxy group, and oxetanyl group, and is selected from groups containing ethylenically unsaturated bond , epoxy group, oxetanyl group and tertiary butyl group is more preferably at least one.

In the above formula, R ^G5 represents a hydrogen atom or a methyl group, and R ^G6 represents an aryl group. The carbon number of the aryl group represented by R ^G6 is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The aryl group represented by R ^G6 may have a substituent. Examples of substituents include hydroxyl group, carboxyl group, alkyl group, aryl group, heterocyclic group, alkoxy group, aryloxy group, heterocyclic epoxy group, alkyl sulfide group, aryl sulfide group, heterocyclic sulfide group Groups, groups containing ethylenically unsaturated bonds, epoxy groups, oxetanyl groups and blocked isocyanate groups, etc.

The polymer chain represented by ^PAH1 may contain two or more types of repeating units.

The weight average molecular weight of the polymer chain represented by ^PAH1 is preferably from 500 to 100,000, more preferably from 1,000 to 50,000, and still more preferably from 2,000 to 20,000. When the weight average molecular weight of the polymer chain is within the above range, it is easier to obtain better pigment dispersibility. The weight average molecular weight of the polymer chains can be measured by GPC (Gel Permeation Chromatography). More specifically, it can be calculated from the weight average molecular weight of the raw material monomer used to introduce the polymer chain.

Examples of the above-mentioned substituent T include the following groups. Alkyl (preferably an alkyl group with 1 to 30 carbons), alkenyl (preferably an alkenyl with 2 to 30 carbons), alkynyl (preferably an alkynyl with 2 to 30 carbons), aryl (preferably an aryl group with 6 to 30 carbons), amine group (preferably an amine group with 0 to 30 carbons), alkoxy group (preferably an alkoxy group with 1 to 30 carbons), aryloxy group (preferably an aryloxy group with 6 to 30 carbons), heteroaryloxy group (preferably a heteroaryloxy group with 1 to 30 carbons), acyl group (preferably an acyl group with 2 to 30 carbons) ), alkoxycarbonyl (preferably alkoxycarbonyl with 2 to 30 carbons), aryloxycarbonyl (preferably aryloxycarbonyl with 7 to 30 carbons), acyloxy (preferably 2 to 30 carbons) ～30 acyloxy group), amide group (preferably amide group with 2 to 30 carbons), alkoxycarbonylamine group (preferably alkoxycarbonylamine group with 2 to 30 carbons), Aryloxycarbonylamine (preferably aryloxycarbonylamine with 7 to 30 carbons), sulfamoyl (preferably sulfamoyl with 0 to 30 carbons), carbamoyl (preferably preferably carbamoyl with 1 to 30 carbons), alkylthio (preferably alkylthio with 1 to 30 carbons), arylthio (preferably arylthio with 6 to 30 carbons), Heteroarylthio (preferably heteroarylthio with 1 to 30 carbons), alkylsulfonyl (preferably alkylsulfonyl with 1 to 30 carbons), arylsulfonyl (preferably arylsulfonyl with 6 to 30 carbons), heteroarylsulfonyl (preferably heteroarylsulfonyl with 1 to 30 carbons), alkylsulfinyl (preferably with 1 to 30 alkylsulfinyl), arylsulfinyl (preferably arylsulfinyl with 6 to 30 carbons), heteroarylsulfinyl (preferably 1 carbon ~30 heteroaryl sulfinyl groups), urea groups (preferably ureido groups with 1 to 30 carbons), phosphoamido groups (preferably phosphoamido groups with 1 to 30 carbons), hydroxyl groups, Mercapto, halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom, etc.), cyano group, sulfo group, carboxyl group, nitro group, hydroxamic acid group, sulfinic acid group, hydrazine group, imino group, heterocyclic group . When these groups are groups that can be further substituted, they may also have a substituent. As further substituents, groups, cross-linkable groups, and the like described above for the substituent T are exemplified.

m in the formula (AH1) represents an integer of 1 to 5, preferably 1 or 2, and more preferably 1.

式（AH2）中，L ^AH2表示2價的連接基，P ^AH2表示聚合物鏈。 The macromonomer AH is preferably a compound represented by the formula (AH2). [chemical formula 11]

In the formula (AH2), ^LAH2 represents a divalent linking group, and ^PAH2 represents a polymer chain.

Examples of the divalent linking group represented by LAH2 in the formula ( ^AH2 ) include hydrocarbon groups, heterocyclic groups, -NR ^LH2 -, -SO-, -SO ₂ -, -CO-, -O-, -COO -, -OCO-, -S-, -NR ^LH2 CO-, -CONR ^LH2 -, and a combination of two or more of these. R ^LH2 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Also, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The types of heteroatoms constituting the heterocyclic group include nitrogen atom, oxygen atom, sulfur atom and the like. The number of heteroatoms constituting the heterocyclic group is preferably 1-3. The heterocyclic group may be a monocyclic ring or a condensed ring. A hydrocarbon group and a heterocyclic group may have a substituent. The substituent T mentioned above is mentioned as a substituent.

PAH2 in formula ( ^AH2 ) has the same meaning as PAH1 in formula ( ^AH1 ).

The weight average molecular weight of the macromer AH is preferably from 500 to 100,000, more preferably from 1,000 to 50,000, and still more preferably from 2,000 to 20,000.

The macromonomer AH can be synthesized, for example, by the following method. [1] A method of synthesizing a polymer obtained by radically polymerizing a radically polymerizable compound using a mercaptan chain transfer agent having a hydroxyl group or an amine group, and an acid anhydride. [2] A method of synthesizing a polymer having a thiol group at its terminal and an unsaturated acid anhydride by enethiol addition. [3] A method of synthesizing a radical polymerizable compound by radical polymerization using a mercaptan chain transfer agent having an acid anhydride group.

式（b1）中，波線表示鍵結鍵，X ^b1表示n+2價的連接基，X ^b2表示O或NR ^x1，R ^x1表示氫原子或取代基，L ^b1表示單鍵或2價的連接基，P ^b1表示聚合物鏈，R ^b1表示氫原子、取代基或相對離子，n表示1以上的整數。 It is preferable that the specific resin is a resin containing a structure represented by formula (b1). [chemical formula 12]

In the formula (b1), the wavy line represents the bonding bond, X ^b1 represents the n+2 valent linking group, X ^b2 represents O or NR ^x1 , R ^x1 represents a hydrogen atom or a substituent, L ^b1 represents a single bond or a divalent connection group, P ^b1 represents a polymer chain, R ^b1 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more.

Examples of the n+2-valent linking group represented by X ^b1 of the formula (b1) include a group containing a hydrocarbon group. Examples of groups containing hydrocarbon groups include hydrocarbon groups; combining hydrocarbon groups with heterocyclic groups, -C(CF ₃ ) ₂ -, -NR ^Xb1 -, -SO-, -SO ₂ -, -CO-, -O A group consisting of at least one of -, -COO-, -OCO-, -S-, -NR ^Xb1 CO-, and -CONR ^Xb1 -. R ^Xb1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Also, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The types of heteroatoms constituting the heterocyclic group include nitrogen atom, oxygen atom, sulfur atom and the like. The number of heteroatoms constituting the heterocyclic group is preferably 1-3. The heterocyclic group may be a monocyclic ring or a condensed ring. A hydrocarbon group and a heterocyclic group may have a substituent. The substituent T mentioned above is mentioned as a substituent. The n+2-valent linking group represented by X ^b1 in formula (b1) is preferably a group containing a cyclic aliphatic hydrocarbon group or a group containing an aromatic hydrocarbon group, and a group containing an aromatic hydrocarbon group is more preferable , a group containing a phenyl ring group is further preferred.

X ^b2 in formula (b1) represents O or NR ^x1 , and R ^x1 represents a hydrogen atom or a substituent. An alkyl group, an aryl group, etc. are mentioned as a substituent represented by ^Rx1 . An alkyl group or an aryl group may further have a substituent. As a substituent, what was demonstrated in the said substituent T is mentioned. X ^b2 in the formula (b1) is preferably O.

L ^b1 in the formula (b1) represents a single bond or a divalent linking group, and a divalent linking group is preferable. Examples of the divalent linking group represented by L ^b1 include hydrocarbon group, heterocyclic group, -NR ^Lb1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO- , -S-, -NR ^Lb1 CO-, -CONR ^Lb1 - and a group formed by combining two or more of these. R ^Lb1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Also, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The types of heteroatoms constituting the heterocyclic group include nitrogen atom, oxygen atom, sulfur atom and the like. The number of heteroatoms constituting the heterocyclic group is preferably 1-3. The heterocyclic group may be a monocyclic ring or a condensed ring. A hydrocarbon group and a heterocyclic group may have a substituent. The substituent T mentioned above is mentioned as a substituent.

式（L-1）中，*1為與式（b1）的X ^b2的連接部，*2為與式（b1）的P ^b1的連接部，L ^b10表示以單鍵或連接基鍵結烴基或2以上的烴基之基團。 The divalent linking group represented by L ^b1 is preferably a divalent linking group containing a sulfur atom, more preferably a group represented by formula (L-1). [chemical formula 13]

In formula (L-1), *1 is the connection part with X ^b2 of formula (b1), *2 is the connection part with P ^b1 of formula (b1), and L ^b10 represents a hydrocarbon group bonded by a single bond or a linker Or a group of 2 or more hydrocarbon groups.

Examples of the hydrocarbon group represented by L ^b10 include those described for L ^b1 . Examples of linking groups connecting two or more hydrocarbon groups include -NR ^Lb1 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^Lb1 CO- and -CONR ^Lb1- . R ^Lb1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom.

P ^b1 in formula (b1) represents a polymer chain. The meaning of the polymer chain represented by P ^b1 in formula (b1) is the same as that of the polymer chain represented by P ^AH1 in formula (AH1), and the preferred range is also the same.

R ^b1 in formula (b1) represents a hydrogen atom, a substituent or a counter ion. As a substituent represented by R ^b1 , the group containing an alkyl group, an aryl group, and a crosslinkable group etc. are mentioned. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl, (meth)allyl, and (meth)acryl; rings such as epoxy and oxetanyl; Like ether group, blocked isocyanate group, etc. An alkyl group or an aryl group may further have a substituent. As a substituent, the group etc. which were demonstrated in the said substituent T are mentioned. Examples of counter ions represented by R ^b1 include alkali metal ions (Li ⁺ , Na ⁺ , K ⁺ , etc.), ammonium ions, imidazolium ions, pyridinium ions, phosphonium ions, and the like. R ^b1 in formula (b1) is preferably a hydrogen atom or a substituent, more preferably a hydrogen atom or a group containing a crosslinkable group, and even more preferably a hydrogen atom.

n in the formula (b1) represents an integer of 1 or more, preferably an integer of 1 to 4, more preferably 1 or 2, and still more preferably 1.

式中，R ¹～R ⁹分別獨立地表示氫原子或取代基，L ¹表示單鍵或2價的連接基，L ²及L ³分別獨立地表示2價的連接基，L ⁴表示單鍵或2價的連接基，X ^b11表示n+2價的連接基，X ^b12表示O或NR ^x11，R ^x11表示氫原子或取代基，L ^b11表示單鍵或2價的連接基，P ^b11表示聚合物鏈，R ^b11表示氫原子、取代基或相對離子，n表示1以上的整數。 Resin B1 is preferably a resin comprising repeating units represented by formula (1-1), formula (1-2) or formula (1-3), including those represented by formula (1-1) or formula (1-3) A resin of the repeating unit represented by is more preferable, and a resin including the repeating unit represented by the formula (1-3) is further preferable. A resin including a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) is the resin of the present invention. [chemical formula 14]

In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, and L ⁴ represents a single bond or a 2-valent linking group, X ^b11 represents an n+2-valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a 2-valent linking group, and P ^b11 represents A polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more.

Examples of substituents represented by R ¹ to R ⁹ include alkyl groups, aryl groups and halogen atoms, among which alkyl groups are preferred. R ¹ to R ⁹ are preferably hydrogen atoms.

L ¹ in formula (1-1) represents a single bond or a divalent linking group. Examples of divalent linking groups include hydrocarbon groups, -NR ^L11 -, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, -NR ^L11 CO -, -CONR ^L11 - and a group formed by combining two or more of them. R ^L11 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, preferably a hydrogen atom. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. In addition, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Also, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The hydrocarbon group may have a substituent. The substituent T mentioned above is mentioned as a substituent. L ¹ in formula (1-1) is preferably a single bond or a hydrocarbon group, more preferably a single bond or an aliphatic hydrocarbon group, further preferably a single bond or an alkylene group, a single bond, -CH ₂ - or -C ₂ H ₄ - is especially preferred.

L ² and L ³ in formula (1-2) each independently represent a divalent linking group. Examples ^of the divalent linking group include groups described in L1. L ² and L ³ are preferably hydrocarbon groups, more preferably aliphatic hydrocarbon groups, further preferably alkylene groups, and particularly preferably -CH ₂ -.

L ⁴ in formula (1-3) represents a single bond or a divalent linking group. Examples ^of the divalent linking group include groups described in L1. L ⁴ is preferably a hydrocarbon group, more preferably an aliphatic hydrocarbon group, further preferably an alkylene group, and particularly preferably -C ₂ H ₄ -.

The meanings of X ^b11 , X ^b12 , L ^b11 , P ^b11 , and R ^b11 in formulas (1-1) to (1-3) are the same as those of X ^b1 , X ^b2 , L ^b1 , P ^b1 , and R ^b1 in formula (b1). The meanings are the same, and the preferred ranges are also the same.

式中，L ¹表示單鍵或2價的連接基，L ²及L ²分別獨立地表示2價的連接基，L ⁴表示單鍵或2價的連接基，L ^b11表示單鍵或2價的連接基，P ^b11表示聚合物鏈。 The repeating unit represented by the above formula (1-1) is preferably a repeating unit represented by the following formula (2-1). Furthermore, it is preferable that the repeating unit represented by the above formula (1-2) is a repeating unit represented by the following formula (2-2). Furthermore, it is preferable that the repeating unit represented by the above formula (1-3) is a repeating unit represented by the following formula (2-3). [chemical formula 15]

^In the ^formula , L1 represents ^a single bond or a divalent linker, L2 and L2 independently represent a divalent linker, L4 represents a single bond or a divalent linker, ^Lb11 represents a single bond or a divalent ^linker The linking group of , P ^b11 represents the polymer chain.

The meanings of L ¹ to L ⁴ , L ^b11 and P ^b11 in formula (2-1) to formula (2-3) are the same as those of L ¹ to L ⁴ and L ^b11 in formula (1-1) to formula (1-3) and P ^b11 have the same meaning.

When the specific resin is a resin containing the repeating unit represented by the above formula (1-1), the content of the repeating unit represented by the formula (1-1) in the specific resin is preferably 5 mol % or more, 10 mol% or more is more preferable, 20 mol% or more is still more preferable, and 30 mol% or more is especially preferable from the viewpoint of the dispersibility of a pigment and the heat resistance of the obtained film. The upper limit can also be set to 100 mol %, can also be set to 80 mol % or less, and can also be set to 60 mol % or less. Also, in the case where the specific resin is a resin containing a repeating unit represented by the above formula (1-2), the content of the repeating unit represented by the formula (1-2) in the specific resin is 5 mol % or more. Excellent, more preferably 10 mol% or more, more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of the dispersibility of the pigment and the heat resistance of the obtained film. The upper limit can also be set to 100 mol %, can also be set to 80 mol % or less, and can also be set to 60 mol % or less. Also, in the case where the specific resin is a resin containing a repeating unit represented by the above formula (1-3), the content of the repeating unit represented by the formula (1-3) in the specific resin is 5 mol % or more. Excellent, more preferably 10 mol% or more, more preferably 20 mol% or more, and particularly preferably 30 mol% or more from the viewpoint of the dispersibility of the pigment and the heat resistance of the obtained film. The upper limit can also be set to 100 mol %, can also be set to 80 mol % or less, and can also be set to 60 mol % or less.

The specific resin may also contain other repeating units other than the repeating units represented by formula (1-1) to formula (1-3). Examples of other repeating units include repeating units having an acid group, repeating units having a hydroxyl group, repeating units having an amine group, repeating units having an ammonium salt, repeating units having a cross-linking group, and those containing a dye moiety. Repeating units of groups, repeating units with other functional groups, etc. The above-mentioned acid group or amine group may be a salt.

作為其他官能基，可舉出烷基、芳基等。 Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl, (meth)allyl, and (meth)acryl; rings such as epoxy and oxetanyl; Like ether group, blocked isocyanate group, etc. As an acidic group, a carboxyl group, a sulfo group, a phosphoric acid group etc. are mentioned. Examples of the group having a dye partial structure include those derived from a group selected from benzimidazolone dyes, benzimidazolone dyes, quinoline yellow pigments, phthalocyanine dyes, anthraquinone dyes, diketopyrrolopyrrole dyes, A group of a partial structure of a dye among quinacridone dyes, azo dyes, isoindolinone dyes, isoindoline dyes, dioxin dyes, perylene dyes, and thioindigo dyes. As a specific example of the group which has a dye partial structure, the group of the structure shown below is mentioned. [chemical formula 16]

An alkyl group, an aryl group, etc. are mentioned as another functional group.

When the specific resin contains other repeating units, the content of the other repeating units in the specific resin is preferably 50 mol % or less, more preferably 40 mol % or less, still more preferably 30 mol % or less. The lower limit is preferably at least 1 mol%, more preferably at least 5 mol%, and still more preferably at least 10 mol%.

When the specific resin contains repeating units with acid groups, the content of the repeating units with acid groups in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and 30 mol% or less for further improvement. The lower limit is preferably at least 1 mol%, more preferably at least 5 mol%, and still more preferably at least 10 mol%.

In the case where the specific resin contains a repeating unit having a hydroxyl group, the content of the repeating unit having a hydroxyl group in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and further preferably 30 mol% or less. better. The lower limit is preferably at least 1 mol%, more preferably at least 5 mol%, and still more preferably at least 10 mol%.

When the specific resin contains repeating units having amino groups, the content of repeating units having amino groups in the specific resin is preferably 50 mol% or less, more preferably 40 mol% or less, and 30 mol% or less for further improvement. The lower limit is preferably at least 1 mol%, more preferably at least 5 mol%, and still more preferably at least 10 mol%.

When the specific resin contains repeating units with cross-linking groups, the content of the repeating units with cross-linking groups in the specific resin is preferably 50 mole % or less, more preferably 40 mole % or less, and 30 Mole% or less is further preferred. The lower limit is preferably at least 1 mol%, more preferably at least 5 mol%, and still more preferably at least 10 mol%.

In the case where the specific resin contains a repeating unit having a pigment partial structure, the content of the repeating unit having a pigment partial structure in the specific resin is preferably 50 mol % or less, more preferably 40 mol % or less, and 30 mol % % or less is further preferred. The lower limit is preferably at least 1 mol%, more preferably at least 5 mol%, and still more preferably at least 10 mol%.

In the case where the specific resin contains repeating units with other functional groups, the content of the repeating units with other functional groups in the specific resin is preferably 50 mole % or less, more preferably 40 mole % or less, 30 mole % % or less is further preferred. The lower limit is preferably at least 1 mol%, more preferably at least 5 mol%, and still more preferably at least 10 mol%.

As a preferable aspect of a specific resin, the aspect of [1]-[10] shown below is mentioned. [1] An aspect in which the specific resin consists only of repeating units represented by formula (1-1), formula (1-2) or formula (1-3). [2] The specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having an amine group. [3] The specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having an acid group or a hydroxyl group. [4] The specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), a repeating unit having an acid group or a hydroxyl group, and a repeating unit having an amine group . [5] The specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having a crosslinkable group. [6] Specific resins having repeating units represented by formula (1-1), formula (1-2) or formula (1-3), repeating units having crosslinkable groups, and repeating units having amino groups . [7] The specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), a repeating unit having a crosslinkable group, a repeating unit having an acid group or a hydroxyl group, and An aspect of the repeating unit having an amine group. [8] The specific resin has a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3) and a repeating unit having a dye partial structure. [9] In the above-mentioned [2] to [7], an aspect having a repeating unit of a dye partial structure is also included. [10] In the above [2] to [9], embodiments of repeating units having other functional groups are also included.

The acid value of the specific resin is preferably at least 1 mgKOH/g, more preferably at least 5 mgKOH/g, and still more preferably at least 10 mgKOH/g. The upper limit is preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, and still more preferably 100 mgKOH/g or less.

It is preferable that the weight average molecular weight of a specific resin is 1,000-200,000. The upper limit is preferably 100,000 or less, more preferably 50,000 or less. The lower limit is preferably at least 1500, more preferably at least 2000, and still more preferably at least 3000.

In the specific resin, it is preferable that all the primary amine groups of the above-mentioned amine polymer M are consumed by the reaction of the above-mentioned macromonomer AH. According to this aspect, the storage stability of the resin composition can be further improved.

The amine value of the specific resin is preferably at most 560 mgKOH/g, more preferably at most 300 mgKOH/g, and still more preferably at most 150 mgKOH/g. The lower limit may be 0 mgKOH/g, 5 mgKOH/g or more, 25 mgKOH/g or more, 50 mgKOH/g or more, or 100 mgKOH/g or more. When the amine value of the specific resin is 0 mgKOH/g, the effect of improving the transparency of the resin can be expected. In addition, when the amine value of the specific resin is 5 mgKOH/g or more (preferably 25 mgKOH/g or more, more preferably 50 mgKOH/g or more, and still more preferably 100 mgKOH/g or more), the adsorption property in the pigment can be expected Good and improve the effect of dispersion.

The 5% mass reduction temperature of the specific resin based on TG/DTA (thermal mass measurement/differential thermal measurement) under a nitrogen atmosphere is preferably 280°C or higher, more preferably 300°C or higher, and more preferably 320°C or higher. The upper limit of the above-mentioned 5% mass reduction temperature is not particularly limited, and may be, for example, 1,000° C. or lower. The above-mentioned 5% mass loss temperature was determined by the known TG/DTA measurement method as the temperature at which the rate of mass loss becomes 5% when left standing at a specific temperature for 5 hours under a nitrogen atmosphere. Also, the mass loss rate of the specific resin when left to stand at 300° C. for 5 hours under a nitrogen atmosphere is preferably 10% or less, more preferably 5% or less, and still more preferably 2% or less. The lower limit of the aforementioned mass reduction rate is not particularly limited, and may be 0% or more. The aforementioned mass reduction rate is a value calculated as a ratio of mass reduction in the specific resin before and after standing at 300° C. for 5 hours under a nitrogen atmosphere.

Specific examples of the specific resin include resins B-1 to B-35 described in Examples described later.

The specific resin can be synthesized by reacting the above-mentioned amine polymer M with the above-mentioned macromonomer AH. By reacting the above-mentioned amine polymer M with the above-mentioned macromonomer AH, the amine group of the amine polymer M and the acid anhydride group of the macromonomer AH undergo an addition ring-opening reaction, thereby following the ring-opening of the acid anhydride group and The amide bond together forms a carboxyl group. According to this synthesis method, the reaction can be carried out under very mild conditions without using a catalyst or the like. In addition, since by-products such as halogen and water are not produced, purification treatment and the like can also be omitted or simplified.

When the amine polymer M and the macromonomer AH are mixed to react the two, the ratio of the acid anhydride group of the macromonomer AH to 1 mole of the amine group of the amine polymer M is preferably 0.05 to 1 mole. , the ratio of 0.1 to 1 mole is more preferable, and the ratio of 0.2 to 1 mole is still more preferable.

When manufacturing a specific resin, it is possible to add a compound selected from cyclic anhydrides (succinic anhydride, glutaric anhydride, maleic anhydride, phthalic anhydride, Anhydride, cis-4-cyclohexene-1,2-dicarboxylic anhydride, (±)-trans-1,2-cyclohexanedicarboxylic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride, 5- norcamphene-2,3-dicarboxylic anhydride, exo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride, 4-methylcyclohexane-1,2-di carboxylic anhydride, trimellitic anhydride, 2,3-naphthalene dicarboxylic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, 2-sulfobenzoic anhydride, tetrabromo-o-sulfobenzoic anhydride, etc.), Acyl chloride compounds having a group containing an ethylenically unsaturated bond, acyl chloride compound having an epoxy group, acyl chloride compound having an oxetanyl group, and acyl chloride compound having a pigment moiety structure and a group containing an ethylenically unsaturated bond at least one compound among the compounds. In this way, the amine group of the amine polymer M reacts with the above-mentioned compounds, and an acid group, a group containing an ethylenically unsaturated bond, an epoxy group, an oxetanyl group, or a dye partial structure can be added to the resin. The group and other functional groups.

(other resins) The resin composition of the present invention may contain resins other than the above-mentioned specific resins as the resin. Examples of other resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, and polyresins. , polyether resin, polyphenylene resin, polyaryl ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, Silicone resin, etc. In addition, as other resins, the resins described in the examples of International Publication No. 2016/088645, the resins described in JP-A-2017-057265, and the resins described in JP-A-2017-032685 can also be used. , the resin described in JP-A 2017-075248, the resin described in JP-A 2017-066240, the resin described in JP-A 2017-167513, the resin described in JP-A 2017-173787 The resin described in paragraphs 0041 to 0060 of Japanese Patent Application Laid-Open No. 2017-206689, the resin described in paragraphs 0022 to 0071 of Japanese Patent Laid-Open No. 2018-010856, the resin described in Japanese Patent Laid-Open No. 2016-222891 Blocked polyisocyanate resin (cyanate resin), resin described in JP 2020-122052 A, resin described in JP 2020-111656 A, resin described in JP 2020-139021 A . The resin described in JP-A-2017-138503 that contains a constituent unit having a ring structure on the main chain and a constituent unit having a biphenyl group on the side chain. Moreover, as other resins, by-products at the time of synthesizing specific resins may be contained.

The weight average molecular weight (Mw) of other resins is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4000 or more, more preferably 5000 or more.

Other resins are preferably alkali-developable resins or resins used as dispersants.

〔Resin with alkali developability〕 The weight average molecular weight (Mw) of the alkali-developable resin is preferably 3,000 to 2,000,000. The upper limit is more preferably at most 1,000,000, and is still more preferably at most 500,000. The lower limit is more preferably 4,000 or more, and still more preferably 5,000 or more.

Examples of alkali-developable resins include (meth)acrylic resins, polyimide resins, polyether resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and polyimide resins. , (meth)acrylic resin and polyimide resin are preferred, and (meth)acrylic resin is more preferred.

As the resin having alkali developability, it is preferable to use a resin having an acidic group. Examples of the acid group include a phenolic hydroxyl group, a carboxyl group, a sulfonic acid group, a phosphoric acid group, a phosphonic acid group, an active imide group, a sulfonamide group, and the like, and a carboxyl group is preferred. Also, as the resin having an acid group, a resin in which an acid group is introduced by reacting an acid anhydride with a hydroxyl group formed on the ring-opening of epoxy can also be used. Examples of such resins include resins described in Japanese Patent No. 6349629 . A resin having an acid group can be used, for example, as an alkali-soluble resin.

The alkali-developable resin preferably contains repeating units having an acid group, and more preferably contains 1 to 70 mol % of repeating units having an acid group in all the repeating units of the resin. The upper limit of the content of the repeating unit having an acid group is preferably 50 mol% or less, more preferably 40 mol% or less. The lower limit of the content of the repeating unit having an acid group is preferably 2 mol % or more, more preferably 5 mol % or more.

The acid value of the alkali-developable resin is preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, still more preferably 120 mgKOH/g or less, and most preferably 100 mgKOH/g or less. In addition, the acid value of the alkali-developable resin is preferably at least 5 mgKOH/g, more preferably at least 10 mgKOH/g, and still more preferably at least 20 mgKOH/g.

It is also preferable that the alkali-developable resin has an ethylenically unsaturated bond-containing group. Examples of ethylenically unsaturated bond-containing groups include vinyl, allyl, (meth)acryl, etc., allyl and (meth)acryl are preferred, and (meth)acryl Acyl group is more preferred.

Alkali-developable resins include compounds represented by the following formula (ED1) and/or compounds represented by the following formula (ED2) (hereinafter, these compounds are sometimes also referred to as "ether dimer ".) The repeating unit of the monomer component is also preferred.

[chemical formula 17]

式（ED2）中，R表示氫原子或碳數1～30的有機基。關於式（ED2）的詳細內容，能夠參閱日本特開2010-168539號公報的記載，該內容被編入本說明書中。 In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [chemical formula 18]

In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of the formula (ED2), the description in JP 2010-168539 A can be referred to, and the content is incorporated in this specification.

As a specific example of the ether dimer, for example, the description in paragraph 0317 of JP-A-2013-029760 can be referred to, and the content is incorporated in this specification.

式（X）中，R ₁表示氫原子或甲基，R ₂表示碳數2～10的伸烷基，R ₃表示氫原子或可以包含苯環之碳數1～20的烷基。n表示1～15的整數。 It is also preferable that the alkali-developable resin contains a repeating unit derived from a compound represented by the following formula (X). [chemical formula 19]

In formula (X), R ₁ represents a hydrogen atom or a methyl group, R ₂ represents an alkylene group having 2 to 10 carbons, and R ₃ represents a hydrogen atom or an alkyl group having 1 to 20 carbons that may include a benzene ring. n represents the integer of 1-15.

As resin which has alkali developability, resin etc. which have the following structures are mentioned, for example. In the following structural formulas, Me represents a methyl group. [chemical formula 20]

〔Dispersant〕 The resin composition of the present invention can also contain a resin as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the acidic dispersant (acidic resin) means a resin having more acidic groups than basic groups. Among acidic dispersants (acidic resins), when the total amount of acid groups and basic groups is set to 100 mol%, the resin with acid groups accounting for more than 70 mol% is better, and in essence only Resins containing acid groups are more preferred. It is preferable that the acidic group which the acidic dispersant (acidic resin) has is a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably from 40 to 105 mgKOH/g, more preferably from 50 to 105 mgKOH/g, and still more preferably from 60 to 105 mgKOH/g. In addition, the basic dispersant (basic resin) means a resin having more basic groups than acid groups. Alkaline dispersant (basic resin) is preferably a resin whose amount of basic groups exceeds 50 mol% when the total amount of acid groups and basic groups is set to 100 mol%. The basic group that the basic dispersant has is an amine group.

It is preferable that the resin used as a dispersant comprises a repeating unit having an acid group.

It is also preferred that the resin used as the dispersant is a graft polymer. Examples of the graft polymer include resins described in paragraphs 0025 to 0094 of JP-A-2012-255128, and the contents thereof are incorporated in the present specification.

It is also preferable that the resin used as the dispersant is a polyimide-based dispersant (polyimide resin) containing nitrogen atoms in at least one of the main chain and the side chain. As a polyimide-based dispersant, a resin having a main chain and a side chain and having a basic nitrogen atom in at least one of the main chain and the side chain is preferable, and the main chain includes a part having a functional group of pKa14 or less structure, the number of atoms in the side chain is 40 to 10,000. The basic nitrogen atom is not particularly limited as long as it is a basic nitrogen atom. Examples of the polyimide-based dispersant include resins described in paragraphs 0102 to 0166 of JP-A-2012-255128, and the content is incorporated in this specification.

It is also preferable that the resin used as the dispersant has a structure in which a plurality of polymer chains are bonded to the core. Examples of such resins include dendrimers (including star polymers). Moreover, as a specific example of a dendrimer, polymer compound C-1-C-31 etc. which are described in paragraph 0196-0209 of Unexamined-Japanese-Patent No. 2013-043962 are mentioned.

In addition, as the dispersant, the capped copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, and those described in Japanese Patent Application Laid-Open No. 2018-087939 can also be used. Resin, polyethyleneimine having a polyester side chain described in International Publication No. 2016/104803, a capped copolymer described in International Publication No. 2019/125940, and Japanese Patent Application Laid-Open No. 2020-066687 The end-capped polymer having an acrylamide structural unit described in Japanese Patent Laid-Open No. 2020-066688, the end-capped polymer having an acrylamide structural unit described in International Publication No. 2016/104803 Agents, resins described in Japanese Patent Application Laid-Open No. 2019-095548, etc.

The dispersant is also available as a commercial product, and such specific examples include DISPERBYK series manufactured by BYK Chemie GmbH (for example, DISPERBYK-111, 161, etc.), Solsperse series manufactured by Lubrizol (for example, Solsperse 36000, etc.), and the like. . Moreover, the pigment dispersing agent described in paragraph 0041-0130 of Unexamined-Japanese-Patent No. 2014-130338 can also be used, and this content is incorporated in this specification.

In addition, the resin demonstrated as the said dispersant can also be used for purposes other than a dispersant. For example, it can also be used as an adhesive.

The content of the resin in the total solid content of the resin composition is preferably 5 to 60% by mass. The lower limit is preferably at least 10% by mass, more preferably at least 15% by mass. The upper limit is preferably at most 50% by mass, more preferably at most 40% by mass.

It is preferable that content of the said specific resin in the total solid content of a resin composition is 5-60 mass %. The lower limit is preferably at least 10% by mass, more preferably at least 15% by mass. The upper limit is preferably at most 50% by mass, more preferably at most 40% by mass.

It is preferable that content of the said specific resin is 10-80 mass parts with respect to 100 mass parts of pigments. The lower limit is preferably at least 20 parts by mass, more preferably at least 30 parts by mass. The upper limit is preferably at most 70 parts by mass, more preferably at most 50 parts by mass.

In addition, the resin composition of the present invention preferably contains 20% by mass or more of the specific resin in the components that remove the coloring material from the total solid content of the resin composition, more preferably contains 30% by mass or more, and contains 40% by mass or more. Further better. The upper limit can also be set to 100 mass %, can also be set to 90 mass % or less, and can also be set to 85 mass % or less. When the content of the specific resin is within the above range, it is easy to form a film excellent in heat resistance, and it is easier to suppress shrinkage of the film after heating and the like. In addition, when an inorganic film or the like is formed on the surface of a film obtained by using the resin composition of the present invention, even if the laminate is exposed to high temperature, it is possible to suppress the occurrence of cracks or the like on the inorganic film. Moreover, it is preferable that the total content of the coloring material and the said specific resin in the total solid content of a resin composition is 25-100 mass %. The lower limit is more preferably at least 30% by mass, and more preferably at least 40% by mass. The upper limit is more preferably 90% by mass or less, and further preferably 80% by mass or less.

In the resin composition, the content of the above-mentioned other resins is preferably at most 230 parts by mass, more preferably at most 200 parts by mass, and still more preferably at most 150 parts by mass, relative to 100 parts by mass of the above-mentioned specific resin. The lower limit may be 0 parts by mass, may be 5 parts by mass or more, and may be 10 parts by mass or more. Moreover, it is also preferable that the resin composition does not substantially contain the above-mentioned other resins. According to this aspect, it becomes easy to form a film more excellent in heat resistance. The fact that other resins are not substantially contained means that the content of other resins in the total solid content of the resin composition is 0.1% by mass or less, preferably 0.05% by mass or less, and more preferably not contained.

＜＜Solvent C＞＞ The resin composition of the present invention contains a solvent C (hereinafter, referred to as a solvent). The solvent is basically not particularly limited as long as it satisfies the solubility of each component and the applicability of the resin composition. The solvent is preferably an organic solvent. Examples of the organic solvent include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. Regarding such details, paragraph 0223 of International Publication No. 2015/166779 can be referred to, and this content is incorporated in this specification. Also, a cyclic alkyl-substituted ester solvent and a cyclic alkyl-substituted ketone solvent can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, methylene chloride, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, and ethyl celuxoacetate. , ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone , 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, Butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylacrylamide, 3-butoxy-N,N-di Methacrylamide, Propylene Glycol Diacetate, 3-Methoxybutanol, Methyl Ethyl Ketone, γ-Butyrolactone, Cyclobutane, Anisole, 1,4-Diacetyloxybutanol alkane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl yl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, sometimes for reasons such as the environment, it is better to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents (for example, it can be set to 50 mass ppm (parts per million) or less, may be 10 mass ppm or less, may also be 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent with a low metal content, and it is preferable that the metal content of the organic solvent is, for example, 10 mass ppb (parts per billion) or less. As needed, an organic solvent at the mass ppt (parts per trillion) level, for example, provided by Toyo Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015) can be used. Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and still more preferably 3 μm or less. The filter is preferably made of polytetrafluoroethylene, polyethylene or nylon.

Organic solvents may contain isomers (compounds with the same number of atoms but different structures). In addition, isomers may contain only 1 type, and may contain plural types.

The content of the peroxide in the organic solvent is preferably 0.8 mmol/L or less, and it is more preferably not substantially containing the peroxide.

The content of the solvent in the resin composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and still more preferably from 30 to 90% by mass.

＜＜Pigment Derivatives＞＞ The resin composition of the present invention may contain pigment derivatives. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton.

Examples of the dye skeleton constituting the pigment derivative include quinoline dye skeleton, benzimidazolone dye skeleton, benzisoindole dye skeleton, benzothiazole dye skeleton, squarylium dye skeleton, crotonium dye skeleton, Oxonol dye skeleton, pyrrolopyrrole dye skeleton, diketopyrrolopyrrole dye skeleton, azo dye skeleton, azimine dye skeleton, phthalocyanine dye skeleton, naphthalocyanine dye skeleton, anthraquinone dye skeleton, quinacridone Pigment skeleton, di㗁𠯤 pigment skeleton, perinone (perinone) pigment skeleton, perylene pigment skeleton, thioindigo pigment skeleton, isoindoline pigment skeleton, isoindolinone pigment skeleton, quinoline yellow pigment skeleton, immonium (iminium) pigment skeleton, dithiol pigment skeleton, triarylmethane pigment skeleton, pyrromethene pigment skeleton, etc.

Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amine group, an imidic acid group, and salts thereof. The atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ⁺ , etc.), alkaline earth metal ions (Ca ²⁺ , Mg ²⁺ , etc.), ammonium ions, imidazolium ions, pyridinium ions, etc. ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR ^X1 is preferable. As the sulfonamide group, a group represented by -NHSO ₂ R ^X2 is preferable. As the imidic acid group, a group represented by -SO ₂ NHSO ₂ R ^X3 , -CONHSO ₂ R ^X4 , -CONHCOR ^X5 or -SO ₂ NHCOR ^X6 is preferable, and -SO ₂ NHSO ₂ R ^X3 is more preferable. R ^X1 to R ^X6 each independently represent an alkyl group or an aryl group. The alkyl and aryl groups represented by R ^X1 to R ^X6 may have a substituent. As the substituent, a halogen atom is preferable, and a fluorine atom is more preferable.

Examples of the base include an amino group, a pyridyl group and salts thereof, ammonium group salts, and phthalimidomethyl group. Examples of the atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

As the pigment derivative, a pigment derivative excellent in visible light transparency (hereinafter also referred to as a transparent pigment derivative) can also be used. The maximum molar absorption coefficient (εmax) of the transparent pigment derivative in the wavelength region of 400 to 700nm is preferably 3000L･mol ^-1 ･cm ^-1 or less, more preferably 1000L･mol ^-1 ･cm ^-1 or less Preferably, 100L･mol ^-1 ･cm ^-1 or less is more preferred. The lower limit of εmax is, for example, 1 L･mol ^-1 ･cm ^-1 or more, and may be 10 L･mol ^-1 ･cm ^-1 or more.

Specific examples of pigment derivatives include compounds described in Examples described later, JP-A-56-118462, JP-A-63-264674, JP-A-01-217077, JP-A-03-009961, JP-A-03-026767, JP-A-03-153780, JP-A-03-045662, JP-A-04-285669, JP-A-06- 145546, JP-A-06-212088, JP-A-06-240158, JP-10-030063, JP-10-195326, 0086-0086 of International Publication No. 2011/024896 Paragraph 0098, Paragraphs 0063 to 0094 of International Publication No. 2012/102399, Paragraph 0082 of International Publication No. 2017/038252, Paragraph 0171 of Japanese Patent Application Laid-Open No. 2015-151530, 0162 to 0162 of Japanese Patent Laid-Open No. 2011-252065 Paragraph 0183, JP 2003-081972, JP 5299151, JP 2015-172732, JP 2014-199308, JP 2014-085562, JP 2014 -JP-A-035351, JP-A-2008-081565, JP-A-2019-109512, diketopyrrolopyrrole having a thiol linker described in International Publication No. 2020/002106 compound.

The content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, based on 100 parts by mass of the pigment. Pigment derivatives may be used alone or in combination of two or more.

＜＜Polymerizable monomer＞＞ It is preferable that the resin composition of this invention contains a polymerizable monomer. As the polymerizable monomer, for example, known compounds capable of crosslinking by radicals, acids, or heat can be used. Examples of the polymerizable monomer include a compound having an ethylenically unsaturated bond-containing group, a compound having a cyclic ether group, and the like, and a compound having an ethylenically unsaturated bond-containing group is preferred. As a group containing an ethylenically unsaturated bond, a vinyl group, (meth)allyl group, (meth)acryl group etc. are mentioned. As a cyclic ether group, an epoxy group, an oxetanyl group, etc. are mentioned. A compound having an ethylenically unsaturated bond-containing group can be preferably used as a radically polymerizable monomer. In addition, a compound having a cyclic ether group can be preferably used as a cationically polymerizable monomer. It is preferable that a polymerizable monomer is a polyfunctional polymerizable monomer. That is, the polymerizable monomer is preferably a monomer having two or more polymerizable groups such as ethylenically unsaturated bond-containing groups or cyclic ether groups.

The molecular weight of the polymerizable monomer is preferably 100-3000. The upper limit is more preferably 2,000 or less, and more preferably 1,500 or less. The lower limit is more preferably 150 or more, and more preferably 250 or more.

(Compounds with groups containing ethylenically unsaturated bonds) As a compound having an ethylenically unsaturated bond-containing group used as a polymerizable monomer, a polyfunctional compound is preferable. That is, the compound containing 2 or more ethylenically unsaturated bond-containing groups is preferred, the compound containing 3 or more ethylenically unsaturated bond-containing groups is more preferable, and the compound containing 3 to 15 ethylenically unsaturated bond-containing groups A compound having a group with a saturated bond is further preferred, and a compound containing 3 to 6 groups containing an ethylenically unsaturated bond is even more preferred. Moreover, it is preferable that the compound which has an ethylenically unsaturated bond-containing group is a 3-15 functional (meth)acrylate compound, and it is more preferable that it is a 3-6 functional (meth)acrylate compound. Specific examples of compounds having an ethylenically unsaturated bond-containing group include paragraphs 0095 to 0108 of JP-A-2009-288705, paragraph 0227 of JP-A-2013-029760, JP-A-2008 - Paragraphs 0254 to 0257 of Japanese Patent Application Publication No. 292970, paragraphs 0034 to 0038 of Japanese Patent Application Publication No. 2013-253224, paragraph 0477 of Japanese Patent Application Publication No. 2012-208494, Japanese Patent Application Publication No. 2017-048367, and Japanese Patent Publication No. 6057891 Publication, Japanese Patent No. 6031807, and Japanese Patent Application Laid-Open No. 2017-194662, and these contents are incorporated into this specification.

Also, as a compound having an ethylenically unsaturated bond-containing group, dipentaerythritol tri(meth)acrylate (a commercially available product is KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra( Meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available as KAYARAD D-310; Nippon Kayaku Co. , Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK ESTER A-DPH-12E; Shin-Nakamura Chemical Co., Ltd. (manufactured) and compounds in which (meth)acryl groups are bonded via ethylene glycol and/or propylene glycol residues (for example, SR454 and SR499 commercially available from SARTOMER Company, Inc.) are preferred. Also, as a compound having an ethylenically unsaturated bond-containing group, diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available, M-460; TOAGOSEI CO., Ltd.), neopentylitol tetraacrylate (manufactured by Shin Nakamura Chemical Co., Ltd., NK Ester A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., Ltd.), NK Oligo UA-7200 (manufactured by Shin Nakamura Chemical Co., Ltd.), 8UH -1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL Co., Ltd.), etc.

Also, as a compound having a group having an ethylenically unsaturated bond, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane Methylpropane ethylene oxide modified tri(meth)acrylate, isocyanurate ethylene oxide modified tri(meth)acrylate, neopentylthritol tri(meth)acrylate and other trifunctional (Meth)acrylate compounds are also preferred. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 ( Nippon Kayaku Co., Ltd.), etc.

As the compound having an ethylenically unsaturated bond-containing group, a compound having an acidic group can also be used. By using the compound which has an acid group, generation|occurrence|production of image development residue can be suppressed. Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, and the like, and a carboxyl group is preferable. As a commercial item of the polymerizable monomer which has an acid group, ARONIX M-305, M-510, M-520, ARONIX TO-2349 (made by TOAGOSEI CO., LTD.) etc. are mentioned. The preferred acid value of the polymerizable compound having an acid group is 0.1 to 40 mgKOH/g, more preferably 5 to 30 mgKOH/g.

A compound having an ethylenically unsaturated bond-containing group is also a preferred aspect of a compound having a caprolactone structure. Compounds having a caprolactone structure are commercially available from Nippon Kayaku Co., Ltd., for example, as KAYARAD DPCA series, and examples thereof include DPCA-20, DPCA-30, DPCA-60, and DPCA-120.

As a compound having an ethylenically unsaturated bond-containing group, a compound having an alkyleneoxy group can also be used. Compounds with alkyleneoxy groups are preferably compounds with ethyleneoxy and/or propyleneoxy groups, and compounds with ethyleneoxy groups are more preferred, with 3 to 6 functional groups having 4 to 20 ethyleneoxy groups ( Meth)acrylate compounds are further preferred. Commercially available compounds having an alkylene group include, for example, tetrafunctional (meth)acrylate SR-494 having four ethoxy groups manufactured by Sartomer Company, Inc., and Nippon Kayaku Co., Ltd. KAYARAD TPA-330, a 3-functional (meth)acrylate with 3 iso-butoxyl groups.

As a compound having an ethylenically unsaturated bond-containing group, a compound having a fennel skeleton can also be used. As a commercial item of the compound which has a fennel skeleton, OGSOL EA-0200, EA-0300 (made by Osaka Gas Chemicals Co., Ltd., the (meth)acrylate monomer which has a fennel skeleton) etc. are mentioned.

It is also preferable to use a compound that does not substantially contain environmental regulation substances such as toluene as the compound having an ethylenically unsaturated bond-containing group. As commercially available products of these compounds, KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.), etc. are mentioned.

As a compound having an ethylenically unsaturated bond-containing group, such as Japanese Patent Publication No. 48-041708, Japanese Patent Application Laid-Open No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Publication No. 02-016765 Urethane acrylates described in the gazette or in Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 The described urethane compounds having an oxirane-based skeleton are also preferred. In addition, polymerizable monomers having an amino structure or a thioether structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238 are used. The body is also better. In addition, as the polymerizable monomer, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, and UA-306I can also be used. , AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO., LTD.) and the like are commercially available.

(compounds with cyclic ether groups) As a compound having a cyclic ether group that is also used as a polymerizable monomer, a compound having an epoxy group (hereinafter also referred to as an epoxy compound), a compound having an oxetanyl group (hereinafter also referred to as an epoxy compound), and a compound having an oxetanyl group (hereinafter also referred to as for oxetane compounds). The epoxy compound is preferably a polyfunctional epoxy compound. That is, it is preferable that an epoxy compound is a compound which has 2 or more epoxy groups. The upper limit of the number of epoxy groups is preferably 20 or less, more preferably 10 or less. Moreover, it is preferable that the oxetane compound is a polyfunctional oxetane compound. That is, the oxetane compound is preferably a compound having two or more oxetane groups. The upper limit of the number of oxetanyl groups is preferably 20 or less, more preferably 10 or less.

Commercially available epoxy compounds include JER828, JER1007, JER157S70 (manufactured by Mitsubishi Chemical Corporation), JER157S65 (manufactured by Mitsubishi Chemical Holdings Corporation), etc., listed in paragraph 0189 of JP-A-2011-221494 Sales etc. Other commercially available products include ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (the above are manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (the above are manufactured by ADEKA Corporation), DENACOL EX-611, EX-612, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-411, EX- 421, EX-313, EX-314, EX-321, EX-211, EX-212, EX-810, EX-811, EX-850, EX-851, EX-821, EX-830, EX-832, EX-841, EX-911, EX-941, EX-920, EX-931, EX-212L, EX-214L, EX-216L, EX-321L, EX-850L, DLC-201, DLC-203, DLC- 204, DLC-205, DLC-206, DLC-301, DLC-402, EX-111, EX-121, EX-141, EX-145, EX-146, EX-147, EX-171, EX-192 ( The above are manufactured by Nagase ChemteX Corporation), YH-300, YH-301, YH-302, YH-315, YH-324, YH-325 (the above are manufactured by NIPPON STEEL & SUMIKIN CHEMICAL Co., Ltd.), CELLOXIDE 2021P, 2081, 2000, 3000, EHPE3150, EPOLEAD GT400, SERUBINASU B0134, B0177 (manufactured by Daicel Corporation), TETRAD-X (manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC.), etc.

As commercially available oxetane compounds, OXT-201, OXT-211, OXT-212, OXT-213, OXT-121, OXT-221, OX-SQ TX-100, (the above are TOAGOSEI CO. , LTD. system), etc.

The content of the polymerizable monomer in the total solid content of the resin composition is preferably 0.1 to 40% by mass. The lower limit is preferably at least 0.5% by mass, more preferably at least 1% by mass. The upper limit is preferably at most 30% by mass, more preferably at most 20% by mass.

In the case of using a compound having an ethylenically unsaturated bond-containing group as the polymerizable monomer, the content of the compound having an ethylenically unsaturated bond-containing group as the polymerizable monomer is relative to the above-mentioned specific resin 100 1-50 mass parts are preferable. The lower limit is preferably at least 3 parts by mass, more preferably at least 5 parts by mass. The upper limit is preferably at most 40 parts by mass, more preferably at most 30 parts by mass.

When using a compound having a cyclic ether group as a polymerizable monomer, the content of the compound having a cyclic ether group as a polymerizable monomer is 1 to 50 parts by mass relative to 100 parts by mass of the above-mentioned specific resin. good. The lower limit is preferably at least 3 parts by mass, more preferably at least 5 parts by mass. The upper limit is preferably at most 40 parts by mass, more preferably at most 30 parts by mass.

In the case of using a compound having an ethylenically unsaturated bond-containing group and a compound having a cyclic ether group as the polymerizable monomer, the ratio of the resin composition to the compound having an ethylenically unsaturated bond-containing group is 100 It is preferable to contain 10-500 mass parts of the compound which has a cyclic ether group. The lower limit is preferably at least 20 parts by mass, more preferably at least 30 parts by mass. The upper limit is preferably at most 400 parts by mass, more preferably at most 300 parts by mass. As long as the ratio of both is within the above-mentioned range, a film more excellent in heat resistance (crack suppression and film shrinkage suppression) can be formed.

＜＜Photopolymerization Initiator＞＞ It is preferable that the resin composition of this invention contains a photoinitiator. It does not specifically limit as a photoinitiator, It can select suitably from well-known photoinitiator. For example, a compound having photosensitivity to rays from the ultraviolet range to the visible range is preferable. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (for example, compounds having a trioxane skeleton, compounds having a oxadiazole skeleton, etc.), acylphosphine compounds, bis-imidazole compounds, oxime compounds, and organic peroxides. , sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, etc. From the viewpoint of exposure sensitivity, photopolymerization initiators are trihalomethyl triazine compounds, benzyl dimethyl ketal compounds, α-hydroxy ketone compounds, α-amino ketone compounds, acyl Phosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, bis-imidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halogen Methyl oxadiazole compounds and 3-aryl substituted coumarin compounds are preferred, and compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and acyl phosphine compounds are more preferred. Compounds are further preferred. Also, examples of photopolymerization initiators include compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in JP-A-6301489, MATERIAL STAGE 37-60p, vol. .19, No.3, 2019, the peroxide-based photopolymerization initiator, the photopolymerization initiator described in International Publication No. 2018/221177, and the photopolymerization initiator described in International Publication No. 2018/110179 Photopolymerization initiator, photopolymerization initiator described in JP 2019-043864 A, photopolymerization initiator described in JP 2019-044030 A, JP 2019-167313 A The peroxide-based initiator described in JP-A-2020-055992, the aminoacetophenone-based initiator with oxazolidinyl group described in JP-A No. 2013-190459 The oxime-based photopolymerization initiators described, the polymers described in JP 2020-172619 A, and the like are incorporated in this specification.

Examples of bisimidazole compounds include 2,2-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)- 4,4',5,5-tetrakis(3,4,5-trimethoxyphenyl)-1,2'-biimidazole, 2,2'-bis(2,3-dichlorophenyl)-4 ,4',5,5'-tetraphenylbisimidazole and 2,2'-bis(o-chlorophenyl)-4,4,5,5'-tetraphenyl-1,2'-bisimidazole, etc. Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (the above are manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, Irgacure 127 (the above are manufactured by BASF company), etc. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (the above are manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (the above are BASF Corporation), Api307 (1-(biphenyl-4-yl)-2-methyl-2-portolinylpropan-1-one) (MFCI Corporation), etc. Examples of commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (the above are manufactured by IGM Resins B.V.), Irgacure 819, and Irgacure TPO (the above are manufactured by BASF Corporation) and the like.

Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J.C.S. Compounds described in Perkin II (1979, pp.1653-1660), compounds described in J.C.S. Perkin II (1979, pp.156-162), Journal of Photopolymer Science and Technology (1995, pp.202) -232), compounds described in JP-A-2000-066385, compounds described in JP-A-2004-534797, compounds described in JP-A-2006-342166 , Compounds described in Japanese Patent Application Laid-Open No. 2017-019766, Compounds described in Japanese Patent No. 6065596, Compounds described in International Publication No. 2015/152153, International Publication No. 2017/051680 Compounds described in Japanese Patent Application Laid-Open No. 2017-198865, compounds described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. Specific examples of oxime compounds include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, Aminobutan-2-one, 2-Acetyloxyiminopentan-3-one, 2-Acetyloxyimino-1-phenylpropan-1-one, 2-Benzoyl Oxyimino-1-phenylpropan-1-one, 3-(4-tosyloxy)iminobutan-2-one and 2-ethoxycarbonyloxyimino-1 -Phenylpropan-1-one and the like. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (manufactured by BASF Corporation), TR-PBG-304 (manufactured by Changzhou Tronly New Electronic Materials CO., LTD.), Adeka Optomer N- 1919 (manufactured by ADEKA CORPORATION, photopolymerization initiator 2 described in JP 2012-014052 A). In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and low discoloration. As a commercial item, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (the above are made by ADEKA CORPORATION) etc. are mentioned.

As a photopolymerization initiator, an oxime compound having an oxene ring can also be used. Specific examples of the oxime compound having an oxene ring include compounds described in JP-A-2014-137466.

Moreover, the oxime compound which has at least one benzene ring which has a carbazole ring as a skeleton of a naphthalene ring can also be used as a photoinitiator. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.

An oxime compound having a fluorine atom can also be used as a photopolymerization initiator. Specific examples of oxime compounds having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36-40 described in JP-A-2014-500852, JP-A Compound (C-3) described in Publication No. 2013-164471, etc.

An oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used as a photopolymerization initiator. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.

As a photopolymerization initiator, an oxime compound having a nitro group can be used. It is also preferable to form an oxime compound having a nitro group as a dimer. Specific examples of oxime compounds having a nitro group include compounds described in paragraphs 0031 to 0047 of JP-A-2013-114249 and in paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466 , Compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

An oxime compound having a benzofuran skeleton can also be used as a photopolymerization initiator. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

An oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used as a photopolymerization initiator. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.

Specific examples of oxime compounds are shown below, but the present invention is not limited thereto.

[化學式22]

[化學式23]

[chemical formula 21]

[chemical formula 22]

[chemical formula 23]

The oxime compound is preferably a compound having a maximum absorption wavelength within a wavelength range of 350-500 nm, and more preferably a compound having a maximum absorption wavelength within a wavelength range of 360-480 nm. Also, from the viewpoint of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or 405 nm, more preferably 1,000 to 300,000, still more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorptivity of a compound can be measured by a known method. For example, it is preferable to measure at a concentration of 0.01 g/L using ethyl acetate with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).

As the photopolymerization initiator, a bifunctional or trifunctional or higher photoradical polymerization initiator can be used. By using such radical photopolymerization initiators, two or more radicals are generated from one molecule of the radical photopolymerization initiators, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity is lowered, the solubility in a solvent or the like is improved, and precipitation becomes difficult over time, thereby improving the temporal stability of the resin composition. Specific examples of difunctional or trifunctional or more photoradical polymerization initiators include JP 2010-527339, JP 2011-524436, International Publication No. 2015/004565, JP Dimers of oxime compounds described in paragraphs 0407 to 0412 of Table No. 2016-532675, paragraphs 0039 to 0055 of International Publication No. 2017/033680, compounds described in Japanese Patent Publication No. 2013-522445 (E ) and compound (G), Cmpd 1-7 described in International Publication No. 2016/034963, the oxime ester photoinitiator described in paragraph 0007 of JP 2017-523465, JP 2017- Photoinitiators described in paragraphs 0020 to 0033 of Japanese Patent Application Laid-Open No. 167399, photopolymerization initiators (A) described in paragraphs 0017 to 0026 of Japanese Patent Application Laid-Open No. 2017-151342, and Japanese Patent No. 6469669 The oxime compound etc. as described.

It is preferable that content of the photoinitiator in the total solid content of a resin composition is 0.1-30 mass %. The lower limit is preferably at least 0.5% by mass, more preferably at least 1% by mass. The upper limit is preferably at most 20% by mass, more preferably at most 15% by mass. A photoinitiator may use only 1 type, and may use 2 or more types.

＜＜Silane coupling agent＞＞ The resin composition of the present invention can contain a silane coupling agent. In this specification, a silane coupling agent means a silane compound which has a hydrolyzable group and a functional group other than it. Also, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As a hydrolyzable group, a halogen atom, an alkoxy group, an acyloxy group etc. are mentioned, for example, An alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)allyl groups, (meth)acryl groups, mercapto groups, epoxy groups, amine groups, urea groups, and thioether groups. , isocyanate group, phenyl group, etc., amino group, (meth)acryl group and epoxy group are preferred. Specific examples of the silane coupling agent include the compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and the compounds described in paragraphs 0056-0066 of JP-A-2009-242604, and these The contents are incorporated into this manual.

The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The upper limit is preferably at most 3% by mass, more preferably at most 2% by mass. The lower limit is preferably at least 0.5% by mass, more preferably at least 1% by mass. The silane coupling agent may be only one type, or may be two or more types.

＜＜Hardening Accelerator＞＞ The resin composition of the present invention may further contain a curing accelerator for the purpose of accelerating the reaction of the resin or the polymerizable monomer or lowering the curing temperature. Hardening accelerators can also use methylol-based compounds (such as compounds exemplified as crosslinking agents in paragraph 0246 of JP-A-2015-034963), amines, phosphonium salts, amidine salts, and amide compounds (such as Hardeners described in paragraph 0186 of JP-A-2013-041165), base generators (such as ionic compounds described in JP-A-2014-055114), cyanate compounds (such as JP-A 2012-150180 Bulletin No. 0071), alkoxysilane compounds (such as the alkoxysilane compounds with epoxy groups described in Japanese Patent Application Laid-Open No. 2011-253054), onium salt compounds ( For example, the compound exemplified as the acid generator in paragraph 0216 of JP-A-2015-034963, the compound described in JP-A-2009-180949) and the like.

When the resin composition of the present invention contains a hardening accelerator, the content of the hardening accelerator is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass, in the total solid content of the resin composition.

＜＜Polymerization inhibitor＞＞ The resin composition of the present invention can contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, gallol, tertiary butylcatechol, benzoquinone, 4,4'-sulfur Substituent bis(3-methyl-6-tertiary butylphenol), 2,2'-methylene bis(4-methyl-6-tertiary butylphenol), N-nitrosophenyl hydroxylamine salt (ammonium salt, first cerium salt, etc.). Among them, p-methoxyphenol is preferred. The content of the polymerization inhibitor is preferably 0.0001 to 5% by mass in the total solid content of the resin composition.

＜＜Surfactant＞＞ The resin composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone-based surfactants can be used. The surfactant is preferably a fluorine-based surfactant or a silicone-based surfactant. Surfactants include the surfactants described in paragraphs 0238 to 0245 of International Publication No. 2015/166779, and the content is incorporated in this specification.

The fluorine content in the fluorine-based surfactant is preferably from 3 to 40% by mass, more preferably from 5 to 30% by mass, and particularly preferably from 7 to 25% by mass. A fluorine-based surfactant having a fluorine content within this range is effective from the viewpoint of thickness uniformity of a coating film and liquid-saving property, and has good solubility in a resin composition.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP 2014-041318 (corresponding to paragraphs 0060 to 0064 of International Publication No. 2014/017669), etc. Surfactants described in paragraphs 0117 to 0132 of Publication No. 2011-132503, and these contents are incorporated into this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F- 144, R-30, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F- 559, F-560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41, R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (the above are manufactured by DIC CORPORATION), FLUORAD FC430, FC431, FC171 (the above are manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH -40 (manufactured by AGC INC. above), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (manufactured by OMNOVA SOLUTIONS INC. above), Futurgent208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS , FTX-218 (the above are made by NEOS), etc.

It is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorine-based surfactant. For such a fluorine-based surfactant, the description in JP-A-2016-216602 can be referred to, and the content is incorporated in this specification.

上述化合物的重量平均分子量較佳為3000～50000，例如為14000。上述化合物中，表示重複單元的比例之%為莫耳%。 As the fluorine-based surfactant, a blocked polymer can also be used. For example, the compound described in Unexamined-Japanese-Patent No. 2011-089090 is mentioned. The fluorine-based surfactant can also preferably use a fluorine-containing polymer compound, which includes: a repeating unit derived from a (meth)acrylate compound having a fluorine atom; Repeating unit of (meth)acrylate compound of preferably 5 or more) alkyleneoxy groups (preferably ethoxyl groups, propoxyl groups). The following compounds are also exemplified as the fluorine-based surfactant used in the present invention. [chemical formula 24]

The weight average molecular weight of the above compound is preferably 3000-50000, for example 14000. In the above-mentioned compounds, % representing the ratio of repeating units is mole %.

In addition, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group on a side chain can also be used. Specific examples include compounds described in paragraphs 0050-0090 and 0289-0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102, and RS-102 manufactured by DIC CORPORATION CO., LTD. -718K, RS-72-K, etc. Moreover, the compound described in paragraph 0015-0158 of Unexamined-Japanese-Patent No. 2015-117327 can also be used as a fluorine-type surfactant.

Also, from the viewpoint of environmental control, it is also preferable to use the surfactant described in International Publication No. 2020/084854 as a substitute for the surfactant having a perfluoroalkyl group having 6 or more carbon atoms.

式（fi-1）中，m表示1或2，n表示1～4的整數，a表示1或2，X ^a+表示a價的金屬離子、一級銨離子、二級銨離子、三級銨離子、四級銨離子或NH ₄ ⁺。 Furthermore, it is also preferable to use a fluoroimide chlorine-containing compound represented by the formula (fi-1) as a surfactant. [chemical formula 25]

In the formula (fi-1), m represents 1 or 2, n represents an integer from 1 to 4, a represents 1 or 2, X ^a+ represents a-valent metal ions, primary ammonium ions, secondary ammonium ions, and tertiary ammonium ions , quaternary ammonium ion or NH ₄ ⁺ .

Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propane Oxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonyl ether Phenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF Corporation) , Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF Corporation), Solsperse 20000 (manufactured by Japan Lubrizol Corporation), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D -6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

Examples of cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzalkonium chloride, alkylpyridinium salts, imidazolium salts, and the like. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzyl ammonium chloride, cetylpyridinium chloride, stearyl Aminomethylpyridinium chloride, etc.

Examples of anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyldiphenyl ether disulfonate, sodium alkylnaphthalenesulfonate, dioxane Sodium Sulfosuccinate, Sodium Stearate, Potassium Oleate, Dioctyl Sodium Sulfosuccinate, Sodium Polyoxyethylene Alkyl Ether Sulfate, Sodium Polyoxyethylene Alkyl Phenyl Ether Sulfate, Dialkyl Sulfonate Sodium succinate, sodium stearate, sodium oleate, tertiary octylphenoxyethoxypolyethoxyethylsulfate sodium salt, etc.

Examples of silicone-based surfactants include DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH8400, SH 8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (the above are Dow Toray Co., Ltd.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF- 6002, KF-6003 (the above are made by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (the above are BYK Chemie GmbH), etc.

Moreover, the compound of the following structure can also be used as a silicone type surfactant. [chemical formula 26]

In the total solid content of the resin composition, the content of the surfactant is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% to 3.0% by mass. Surfactant may be only 1 type, and may be 2 or more types. In the case of two or more, the total amount is preferably within the above range.

＜＜Ultraviolet absorber＞＞ The resin composition of the present invention can contain an ultraviolet absorber. As the ultraviolet absorber, conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriene compounds, indole compounds, Three 𠯤 compounds, etc. For such details, refer to paragraphs 0052 to 0072 of Japanese Patent Application Laid-Open No. 2012-208374, paragraphs 0317 to 0334 of Japanese Patent Application Laid-Open No. 2013-068814, and paragraphs 0061 to 0080 of Japanese Patent Application Laid-Open No. 2016-162946 and these contents are incorporated into this manual. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by DAITO CHEMICAL CO., LTD.), Tinuvin series and Uvinul series produced by BASF Corporation, Sumika Chemtex Company, Limited Sumisorb series, and the like. Moreover, as a benzotriazole compound, MYUA series by MIYOSHI OIL & FAT CO., LTD. is mentioned (Chemical Industry Daily, February 1, 2016). In addition, as the ultraviolet absorber, compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059 to 0076 of International Publication No. 2016/181987, and compounds described in International Publication No. 2020/137819 can also be used. Thioaryl substituted benzotriazole UV absorbers described in In the total solid content of the resin composition, the content of the ultraviolet absorber is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. The ultraviolet absorber may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that the total amount is in the said range.

＜＜Antioxidant＞＞ The resin composition of the present invention can contain an antioxidant. As an antioxidant, a phenolic compound, a phosphite compound, a thioether compound, etc. are mentioned. As the phenolic compound, any phenolic compound called a phenolic antioxidant can be used. A hindered phenol compound is mentioned as a preferable phenol compound. A compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable. Furthermore, it is also preferable that the antioxidant is a compound having a phenolic group and a phosphite group in the same molecule. Moreover, phosphorus antioxidant can also be used preferably as an antioxidant. In addition, as an antioxidant, compounds described in Korean Laid-Open Patent No. 10-2019-0059371 can also be used. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Antioxidant may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that the total amount is in the said range.

＜＜Other ingredients＞＞ The resin composition of the present invention may contain sensitizers, fillers, thermosetting accelerators, plasticizers, and other additives (for example, conductive particles, defoamers, flame retardants, leveling agents, peeling agents, etc.) Accelerators, fragrances, surface tension regulators, chain transfer agents, etc.). Properties such as film physical properties can be adjusted by appropriately containing these components. Regarding these components, for example, the descriptions in JP-A-2012-003225 and after paragraph 0183 (paragraph 0237 of the corresponding U.S. Patent Application Publication No. 2013/0034812 specification), JP-A-2008-250074 0101-0104, 0107-0109, etc., and these contents are incorporated into this specification. Moreover, the resin composition may contain a latent antioxidant as needed. Examples of potential antioxidants include compounds in which the part that functions as an antioxidant is protected by a protecting group, and the protecting group is heated at 100 to 250°C or heated at 80 to 200°C in the presence of an acid/base catalyst. A compound that decomposes upon heating and functions as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219. As a commercial item, ADEKA ARKLSGPA-5001 (made by ADEKA CORPORATION) etc. are mentioned.

The resin composition of the present invention may contain a metal oxide in order to adjust the refractive index of the obtained film. Examples of metal oxides include TiO ₂ , ZrO ₂ , Al ₂ O ₃ , SiO ₂ and the like. The primary particle size of the metal oxide is preferably from 1 to 100 nm, more preferably from 3 to 70 nm, and still more preferably from 5 to 50 nm. Metal oxides may have a core-shell structure. Also, in this case, the core portion may be hollow.

The resin composition of the present invention may contain a light resistance improver. Examples of light resistance improving agents include compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, compounds described in paragraphs 0029-0034 of JP-A-2017-146350, compounds described in JP-A-2017-146350, JP-A Compounds described in paragraphs 0036-0037, 0049-0052 of No. 2017-129774, compounds described in paragraphs 0031-0034, 0058-0059 of JP-A No. 2017-129674, JP-A No. 2017-122803 Compounds described in paragraphs 0036 to 0037 and 0051 to 0054 of the publication, compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, and paragraphs 0034 to 0047 of Japanese Patent Application Laid-Open No. 2017-186546 The compounds described in paragraphs 0019 to 0041 of JP-A-2015-025116, the compounds described in paragraphs 0101-0125 of JP-A-2012-145604, and the compounds described in JP-A-2012-103475 Compounds described in paragraphs 0018 to 0021, compounds described in paragraphs 0015 to 0018 of JP-A-2011-257591, compounds described in paragraphs 0017-0021 of JP-A-2011-191483, JP-A-2011-257591 Compounds described in paragraphs 0108 to 0116 of Unexamined Publication No. 2011-145668, compounds described in paragraphs 0103 to 0153 of Japanese Patent Application Laid-Open No. 2011-253174, and the like.

In the resin composition of the present invention, the content of free metals that are not bonded or coordinated with pigments, etc. is preferably 100 ppm or less, more preferably 50 ppm or less, still more preferably 10 ppm or less, and is particularly preferably substantially free of metals. . According to this aspect, stabilization of pigment dispersibility (aggregation suppression), improvement of spectroscopic characteristics accompanying improvement of dispersibility, stabilization of curable components, and suppression of conductivity fluctuations associated with elution of metal atoms and metal ions can be expected. , Improvement of display characteristics and other effects. In addition, JP-A-2012-153796, JP-A 2000-345085, JP-A 2005-200560, JP-08-043620, JP-A 2004-145078, JP 2014-119487, JP 2010-083997, JP 2017-090930, JP 2018-025612, JP 2018-025797, JP 2017- Effects described in Publication No. 155228, Japanese Patent Application Laid-Open No. 2018-036521, etc. Examples of the above-mentioned free metals include Na, K, Ca, Sc, Ti, Mn, Cu, Zn, Fe, Cr, Co, Mg, Al, Sn, Zr, Ga, Ge, Ag, Au, Pt , Cs, Ni, Cd, Pb, Bi, etc. In addition, in the resin composition of the present invention, the content of free halogens that are not bonded or coordinated with pigments, etc. is preferably 100 ppm or less, more preferably 50 ppm or less, still more preferably 10 ppm or less, and substantially does not contain Excellent. Examples of the halogen include F, Cl, Br, I and anions of these. Methods for reducing free metals or halogens in the resin composition include methods such as washing with ion-exchanged water, filtration, ultrafiltration, and purification with ion-exchange resins.

From the viewpoint of environmental regulation, the use of perfluoroalkanesulfonic acids and their salts and perfluoroalkylcarboxylic acids and their salts are sometimes regulated. In the resin composition of the present invention, in the case of reducing the content rate of the above-mentioned compounds, perfluoroalkylsulfonic acid (especially, perfluoroalkylsulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and its The content of salts and perfluoroalkylcarboxylic acids (especially perfluoroalkylcarboxylic acids with 6 to 8 carbon atoms in the perfluoroalkyl group) and their salts is 0.01ppb to 1,000 with respect to the total solid content of the resin composition The range of ppb is preferable, the range of 0.05ppb-500ppb is more preferable, and the range of 0.1ppb-300ppb is still more preferable. The resin composition of the present invention may not substantially contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. For example, by using a compound that can replace perfluoroalkylsulfonic acid and its salt and a compound that can replace perfluoroalkylcarboxylic acid and its salt, it is also possible to select a compound that does not substantially contain perfluoroalkylsulfonic acid and its salt and Resin composition of perfluoroalkyl carboxylic acid and its salt. Examples of compounds that can be substituted for regulated compounds include compounds that are excluded from regulated objects due to differences in the carbon number of perfluoroalkyl groups. However, the above-mentioned content does not prevent the use of perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. The resin composition of the present invention may also contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt within the maximum allowable range.

It is also preferable that the resin composition of the present invention does not substantially contain terephthalate. Here, "substantially not containing" means that the content of terephthalate in the total amount of the resin composition is 1000 mass ppb or less, more preferably 100 mass ppb or less, and particularly preferably zero.

＜Containment container＞ The container for the resin composition is not particularly limited, and known containers can be used. In addition, as a storage container, for the purpose of preventing impurities from mixing into the raw material or resin composition, it is also preferable to use a multi-layer bottle whose inner wall is composed of 6 types of 6-layer resins or a bottle with 6 types of resins in a 7-layer structure. As such a container, the container described in Unexamined-Japanese-Patent No. 2015-123351 is mentioned, for example. In addition, it is also preferable that the inner wall of the container is made of glass or stainless steel for the purpose of preventing metal elution from the inner wall of the container, improving the storage stability of the resin composition, or suppressing deterioration of the components.

＜Preparation method of resin composition＞ The resin composition of the present invention can be prepared by mixing the aforementioned components. When preparing a resin composition, all the components can be dissolved and/or dispersed in an organic solvent at the same time to prepare the resin composition, or each component can be appropriately used as two or more solutions or dispersions, and when used (At the time of coating) These are mixed to prepare a resin composition.

Moreover, when preparing a resin composition, it is preferable to include the step of dispersing a pigment. In the step of dispersing the pigment, compression, pressing, impact, shearing, cavitation, etc. are mentioned as mechanical force for dispersing the pigment. Specific examples of these steps include bead milling, sand milling, roller milling, ball milling, paint stirring, micro jets, high-speed impellers, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, and the like. In addition, in pulverization of pigments under sand milling (bead milling), it is preferable to perform treatment under the conditions that the pulverization efficiency can be improved by using small-diameter beads and increasing the filling rate of the microbeads. Moreover, it is preferable to remove coarse particles by filtration, centrifugation, etc. after pulverization. Also, regarding the procedure and dispersing machine for dispersing the pigment, it is preferable to use "Compendium of Dispersion Technology, JOHOKIKO CO., LTD. Issued, July 15, 2005" or "Using Suspension (Solid/Liquid Dispersion System) Centered Dispersion Technology and Industrial Practical Application Comprehensive Data Collection, Issued by the Publishing Department of the Management Development Center, October 10, 1978", the steps and dispersion machines recorded in paragraph 0022 of Japanese Patent Application Laid-Open No. 2015-157893. In addition, in the step of dispersing the pigment, particle size reduction treatment may be performed by a salt milling step. For raw materials, equipment, processing conditions and the like used in the salt milling step, for example, reference can be made to the descriptions in JP-A-2015-194521 and JP-A-2012-046629.

When preparing a resin composition, it is preferable to filter the resin composition with a filter in order to remove impurities or reduce defects. As the filter, any filter can be used without particular limitation as long as it is conventionally used for filtration purposes and the like. For example, fluorine resins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (such as nylon-6, nylon-6,6), polyethylene, polypropylene ( PP) and other polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins) and other raw material filters. Among these raw materials, polypropylene (including high-density polypropylene) and nylon are preferred.

The pore size of the filter is preferably from 0.01 to 7.0 μm, more preferably from 0.01 to 3.0 μm, and still more preferably from 0.05 to 0.5 μm. As long as the pore diameter of the filter is within the above-mentioned range, fine impurities can be removed more reliably. For the pore diameter value of the filter, you can refer to the nominal value of the filter manufacturer. As for the filter, various filters provided by NIHON PALL Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, etc. can be used.

Moreover, it is also preferable to use a fibrous filter material as a filter. As a fibrous filter material, a polypropylene fiber, a nylon fiber, a glass fiber etc. are mentioned, for example. Examples of commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.

When using filters, it is possible to combine different filters (for example, 1st filter and 2nd filter, etc.). In this case, the filtration by each filter may be performed only once, or may be performed two or more times. Also, filters with different pore diameters may be combined within the above range. Moreover, it is also possible to perform filtration with the 1st filter only for a dispersion liquid, and to filter with a 2nd filter after mixing other components. In addition, the filter can be appropriately selected according to the hydrophilicity and hydrophobicity of the resin composition.

＜How to make resin＞ Next, the manufacturing method of the resin of this invention is demonstrated. The method for producing the resin of the present invention includes the step of reacting a resin having primary or secondary amine groups with a macromonomer having an acid anhydride structure at the end. Examples of the resin having a primary or secondary amine group include the amine polymer M described in the section of the specific resin. Examples of the macromonomer having an acid anhydride structure at the terminal include the macromonomer AH described in the section of the specific resin.

By reacting a resin with a primary or secondary amine group with a macromonomer with an anhydride structure at the end, the amine group of the resin with a primary or secondary amine group (amine polymer M) and the terminal The acid anhydride group addition ring-opening reaction of the macromonomer (macromonomer AH) with an acid anhydride structure forms a carboxyl group along with the ring opening of the acid anhydride group and the amide bond.

When the amine polymer M and the macromonomer AH are mixed to react the two, the ratio of the acid anhydride group of the macromonomer AH to 1 mole of the amine group of the amine polymer M is preferably 0.05 to 1 mole. , the ratio of 0.1 to 1 mole is more preferable, and the ratio of 0.2 to 1 mole is still more preferable.

In the manufacturing method of the resin of the present invention, during or after the reaction of the amine polymer M and the macromonomer AH, a compound selected from cyclic anhydrides (succinic anhydride, glutaric anhydride, maleic anhydride, phthalic anhydride) can be added. Acid anhydride, itaconic anhydride, cis-4-cyclohexene-1,2-dicarboxylic anhydride, (±)-trans-1,2-cyclohexanedicarboxylic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride Anhydride, 5-norcamphene-2,3-dicarboxylic anhydride, exo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride, 4-methylcyclohexane-1 ,2-dicarboxylic anhydride, trimellitic anhydride, 2,3-naphthalene dicarboxylic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, 2-sulfobenzoic anhydride, tetrabromo-o-sulfobenzoic anhydride acid anhydrides, etc.), acyl chloride compounds having groups containing ethylenically unsaturated bonds, acyl chloride compounds having epoxy groups, acyl chloride compounds having oxetanyl groups, and acyl chloride compounds having a pigment partial structure and containing ethylenically unsaturated bonds At least one compound among the compounds of the group. In this way, the amine group of the amine polymer M reacts with the above-mentioned compounds, and an acid group, a group containing an ethylenically unsaturated bond, an epoxy group, an oxetanyl group, or a dye partial structure can be added to the resin. The group and other functional groups.

＜Film＞ The film of the present invention is a film obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be used for filters such as color filters, near-infrared transmission filters, and near-infrared cut filters. Moreover, the film of this invention can also be used for a black matrix, a light-shielding film, etc.

The film thickness of the film of the present invention can be appropriately adjusted depending on the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and still more preferably 5 μm or less. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.3 μm.

When the film of the present invention is used as a color filter, it is preferable that the film of the present invention has a hue of green, red, blue, cyan, magenta, or yellow. Also, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

When the film of the present invention is used as a near-infrared cut filter, it is preferable that the maximum absorption wavelength of the film of the present invention exists in the range of wavelength 700 to 1800 nm, more preferably in the range of wavelength 700 to 1300 nm. It is still more preferable in the range of wavelength 700-1100nm. In addition, the transmittance of the film in the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more. In addition, the film preferably has a transmittance of at least one point in the wavelength range of 700 to 1800 nm of 20% or less. Also, the ratio of absorbance Amax at the maximum absorption wavelength to absorbance A550 at a wavelength of 550 nm, that is, absorbance Amax/absorbance A550 is preferably 20 to 500, more preferably 50 to 500, further preferably 70 to 450, and 100 to 500. 400 is the best.

When the film of the present invention is used as a near-infrared ray transmission filter, it is preferable that the film of the present invention has any one of the following spectral characteristics (i1) to (i5), for example. (i1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 640 nm and transmit light exceeding the wavelength of 750 nm. (i2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 750 nm and transmit light exceeding the wavelength of 850 nm. (i3): The maximum value of the transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1000 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 830 nm and transmit light exceeding the wavelength of 950 nm. (i4): The maximum value of the transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1100 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 950 nm and transmit light exceeding the wavelength of 1050 nm. (i5): The maximum value of the transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the minimum value of the transmittance in the wavelength range of 1200 to 1500 nm The filter is more than 70% (preferably more than 75%, more preferably more than 80%). A film having such spectroscopic properties can shield light in the wavelength range of 400 to 1050 nm and transmit light exceeding the wavelength of 1150 nm.

In the film of the present invention, the thickness of the film after heat treatment at 300° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, and 90% or more. It is more preferable, more than 95% is more preferable, and more than 99% is particularly preferable. In addition, the thickness of the film after heating the film at 350° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, and furthermore 90% or more. More preferably, more than 95% is even better, and more than 99% is especially good. In addition, the thickness of the film after heating the film at 400° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more of the thickness of the film before heat treatment, more preferably 80% or more, and furthermore 90% or more. More preferably, more than 95% is even better, and more than 99% is especially good.

＜Membrane manufacturing method＞ The film of the present invention can be produced through the step of coating the above-mentioned resin composition of the present invention on a support. In the film production method of the present invention, it is preferable to further include a step of forming a pattern (pixel). As a pattern (pixel) formation method, a photolithography method and a dry etching method are mentioned, and a photolithography method is preferable.

(photolithography) First, the case where a film is produced by patterning by photolithography will be described. It is preferable that the pattern formation based on the photolithography method comprises the following steps: a step of using the resin composition of the present invention to form a resin composition layer on a support; a step of exposing the resin composition layer into a pattern; and combining the resin The step of developing and removing the unexposed part of the object layer to form a pattern (pixel). If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixel) (post-baking step) may also be provided.

In the step of forming the resin composition layer of the present invention, the resin composition layer is formed on the support using the resin composition. There are no particular limitations on the support, and it can be appropriately selected depending on the application. For example, a glass substrate, a silicon substrate, etc. are mentioned, and a silicon substrate is preferable. In addition, a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, and the like may be formed on the silicon substrate. In addition, a black matrix is sometimes formed on a silicon substrate to isolate each pixel. In addition, in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or planarize the surface of the substrate, a base layer may be provided on the silicon substrate. When measured with diiodomethane, the surface contact angle of the base layer is preferably 20-70°. Also, 30° to 80° is preferable when measured with water. When the surface contact angle of the base layer is within the above-mentioned range, the wettability of the resin composition is good. The adjustment of the surface contact angle of the base layer can be performed, for example, by adding a surfactant or the like.

As a coating method of the resin composition, a known method can be used. For example, there can be mentioned dropping method (drip casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); For example, the method described in Japanese Patent Laid-Open No. 2009-145395); inkjet (such as drop-on-demand method, piezoelectric method, thermal method), jet printing such as nozzle jetting, flexographic printing, screen printing, gravure printing , reverse offset printing, metal mask printing and other printing methods; transfer printing using molds, etc.; nanoimprinting, etc. The application method in inkjet is not particularly limited, for example, "Inkjet that can be promoted and used - infinite possibilities in the patent -, issued in February 2005, Sumitbe Techon Research Co., Ltd." The method shown (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830, The method described in Japanese Unexamined Patent Application Publication No. 2006-169325 and the like. Moreover, the methods described in International Publication No. 2017/030174 and International Publication No. 2017/018419 can also be used for the coating method of the resin composition, and these contents are incorporated in this specification.

The resin composition layer formed on the support may be dried (prebaked). In the case of producing a film by a low-temperature step, pre-baking may not be performed. In the case of prebaking, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and still more preferably 110°C or lower. The lower limit may be, for example, 50° C. or higher, or may be 80° C. or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and still more preferably 80 to 220 seconds. Prebaking can be performed with a hot plate, an oven, or the like.

Next, the resin composition layer is exposed in a pattern (exposure step). For example, the resin composition layer can be exposed in a patterned form by exposing the resin composition layer through a mask having a predetermined mask pattern using a stepper, a scanning exposure machine, or the like. Thereby, the exposed part can be cured.

Examples of radiation (light) that can be used for exposure include g-rays, i-rays, and the like. In addition, light having a wavelength of 300 nm or less (preferably light having a wavelength of 180 to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and KrF rays (wavelength: 248 nm) are preferred. In addition, a light source with a long wavelength of 300 nm or more can also be used.

In addition, at the time of exposure, exposure may be performed by continuously irradiating light, or may be performed by pulsed irradiation (pulse exposure). In addition, the pulse exposure refers to the exposure method of the system which repeats light irradiation and a pause in the period of a short time (for example, millisecond order or less) and performs exposure. In pulse exposure, the pulse width is preferably not more than 100 nanoseconds (ns), more preferably not more than 50 ns, and still more preferably not more than 30 ns. The lower limit of the pulse width is not particularly limited, but can be set to 1 femtosecond (fs) or more, and can also be set to 10 femtoseconds or more. The frequency is preferably at least 1 kHz, more preferably at least 2 kHz, and still more preferably at least 4 kHz. The upper limit of the frequency is preferably at most 50 kHz, more preferably at most 20 kHz, and still more preferably at most 10 kHz. The maximum instantaneous illuminance is preferably 50000000W/ ^m2 or more, more preferably 100000000W/ ^m2 or more, and still more preferably 200000000W/ ^m2 or more. In addition, the upper limit of the maximum instantaneous illuminance is preferably not more than 1000000000 W/m ² , more preferably not more than 800000000 W/m ² , and still more preferably not more than 500000000 W/m ² . In addition, the pulse width refers to the time during which light is irradiated in a pulse cycle. Also, the frequency means the number of pulse cycles per second. Also, the maximum instantaneous illuminance refers to the average illuminance during the time of irradiating light in the pulse cycle. Moreover, a pulse cycle means the cycle which made the irradiation and pause of the light in pulse exposure into 1 cycle.

The amount of irradiation (exposure amount) is, for example, preferably 0.03 to 2.5 J/cm ² , more preferably 0.05 to 1.0 J/cm ² . The oxygen concentration at the time of exposure can be appropriately selected. In addition to performing in the atmosphere, for example, it can be performed under a low oxygen environment (for example, 15 volume %, 5 volume % or substantially no oxygen) with an oxygen concentration of 19 volume % or less. Exposure may be performed under a high-oxygen environment (for example, 22 volume %, 30 volume %, or 50 volume %) with an oxygen concentration exceeding 21 volume %. In addition, the exposure illuminance can be set appropriately, and usually can be selected from the range of 1000W/m ² to 100000W/m ² (for example, 5000W/m ² , 15000W/m ² or 35000W/m ² ). The conditions of oxygen concentration and exposure illuminance can be appropriately combined, for example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W/m ² , an oxygen concentration of 35% by volume and an illuminance of 20,000 W/m ² .

Next, unexposed portions of the resin composition layer are removed by development to form a pattern (pixel). The development and removal of the unexposed portion of the resin composition layer can be performed using a developing solution. Thereby, the resin composition layer of the unexposed part in the exposure step is dissolved in the developing solution, and only the photohardened part remains. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. Moreover, in order to improve the residue removal property, the process of throwing off the developing solution every 60 seconds and supplying a new developing solution may be repeated several times.

As a developing solution, an organic solvent, an alkali developing solution, etc. are mentioned, and an alkali developing solution can be used preferably. As the alkaline developing solution, an alkaline aqueous solution (alkaline developing solution) in which an alkaline agent is diluted with pure water is preferable. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylhydrogen Ammonium Oxide, Tetrapropylammonium Hydroxide, Tetrabutylammonium Hydroxide, Ethyltrimethylammonium Hydroxide, Benzyltrimethylammonium Hydroxide, Dimethylbis(2-Hydroxyethyl)ammonium Hydroxide, Organic basic compounds such as choline, pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene, or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, Sodium silicate, sodium metasilicate and other inorganic alkaline compounds. From the viewpoint of environment and safety, it is preferable that the alkali agent is a compound with relatively large molecular weight. The concentration of the alkaline agent in the alkaline aqueous solution is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 1% by mass. In addition, the developer may further contain a surfactant. As a surfactant, the above-mentioned surfactants are mentioned, and a nonionic surfactant is preferable. From the viewpoint of convenient transportation and storage, the developer can be temporarily prepared as a concentrated solution and diluted to a desired concentration when used. The dilution ratio is not particularly limited, and can be set, for example, within a range of 1.5 to 100 times. Moreover, it is also preferable to wash (rinse) with pure water after image development. Moreover, it is preferable to perform rinsing by rotating the support body on which the developed resin composition layer was formed, and supplying the rinse liquid to the developed resin composition layer. Moreover, it is also preferable to carry out by moving the nozzle which discharges a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving from the central part of the support body of the nozzle to the peripheral part, the moving speed of the nozzle may be gradually reduced while moving. By performing rinsing in this manner, in-plane variation in rinsing can be suppressed. Also, the same effect can be obtained by gradually reducing the rotational speed of the support while moving the nozzle from the center portion of the support to the peripheral portion.

After image development, it is preferable to perform additional exposure processing and heat processing (post-baking) after performing drying. Additional exposure treatment and post-baking are hardening treatments after development to make fully hardened ones. The heating temperature in the post-baking is, for example, preferably 100 to 240°C, more preferably 200 to 240°C. Moreover, the heating temperature in a post-baking can also be set as 240-400 degreeC, it can also be set as 250-350 degreeC, and it can also be set as 300-350 degreeC. The heating time in the post-baking is, for example, preferably from 5 minutes to 5 hours, more preferably from 1 to 4 hours, and still more preferably from 2 to 4 hours. The film after development can be post-baked continuously or intermittently using a heating mechanism such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater so as to meet the above conditions. When performing additional exposure processing, it is preferable that the light used for exposure is light of wavelength 400nm or less. In addition, the additional exposure treatment can be performed by the method described in Korean Laid-Open Patent No. 10-2017-0122130.

(dry etching method) The pattern formation based on the dry etching method preferably includes the following steps: using the resin composition of the present invention to form a resin composition layer on a support, and curing the entire resin composition layer to form a hardened layer; A step of forming a photoresist layer on the hardened layer; a step of developing the photoresist layer after exposing the photoresist layer into a pattern; and using the resist pattern as a mask and using an etching gas to treat the hardened layer The step of performing dry etching. When forming a photoresist layer, it is preferable to further perform a prebaking process. In particular, a form in which heat treatment after exposure and heat treatment after development (post-baking treatment) are performed as a step of forming a photoresist layer is preferable. Regarding the pattern formation by the dry etching method, descriptions in paragraphs 0010 to 0067 of JP-A-2013-064993 can be referred to, and the contents thereof are incorporated in this specification.

＜Filter＞ The optical filter of the present invention has the above-mentioned film of the present invention. As the type of optical filter, examples of the optical filter include a color filter, a near-infrared ray transmission filter, a near-infrared ray cut filter, and the like, and a color filter is preferred. As a color filter, a colored pixel having the film of the present invention as a color filter is preferable. The optical filter of the present invention can be used in a solid-state imaging device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), an image display device, or the like.

In the optical filter, the film thickness of the film of the present invention can be appropriately adjusted depending on the purpose. For example, the film thickness is preferably 5 μm or less, more preferably 1 μm or less, and still more preferably 0.6 μm or less. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.3 μm.

The width of the pixels included in the filter is preferably 0.4 to 10.0 μm. The lower limit is preferably at least 0.4 μm, more preferably at least 0.5 μm, and still more preferably at least 0.6 μm. The upper limit is preferably 5.0 μm or less, more preferably 2.0 μm or less, still more preferably 1.0 μm or less, still more preferably 0.8 μm or less. In addition, the Young's modulus of the pixel is preferably 0.5 to 20 GPa, more preferably 2.5 to 15 GPa.

It is preferable that each pixel included in the filter has high flatness. Specifically, the surface roughness Ra of the pixel is preferably 100 nm or less, more preferably 40 nm or less, and still more preferably 15 nm or less. The lower limit is not specified, but is preferably 0.1 nm or more, for example. The surface roughness of a pixel can be measured using AFM (atomic force microscope) Dimension 3100 manufactured by Veeco, for example. In addition, the water contact angle on the pixel can be appropriately set to a preferable value, and is typically in the range of 50 to 110°. The contact angle can be measured, for example, using a contact angle meter CV-DT·A type (manufactured by Kyowa Interface Science Co., LTD.). Moreover, it is preferable that the volume resistance value of a pixel is high. Specifically, the volume resistance value of the pixel is preferably 10 ⁹ Ω･cm or higher, more preferably 10 ¹¹ Ω･cm or higher. There is no upper limit, for example, 10 ¹⁴ Ω･cm or less is preferable. The volume resistance value of the pixel can be measured using an ultrahigh resistance meter 5410 (manufactured by Advantest Corporation).

In the optical filter, a protective layer may be provided on the surface of the film of the present invention. By providing a protective layer, various functions such as oxidation resistance, low reflection, hydrophilicity and hydrophobicity, and shielding of light of a specific wavelength (ultraviolet rays, near-infrared rays, etc.) can be imparted. The thickness of the protective layer is preferably from 0.01 to 10 μm, more preferably from 0.1 to 5 μm. Examples of methods for forming the protective layer include a method of coating a protective layer-forming resin composition dissolved in an organic solvent, a chemical vapor deposition method, and a method of attaching the molded resin with an adhesive material. Examples of components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyethene resins, polyethersulfur resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin , melamine resin, polyurethane resin, aramid resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluorine resin, polycarbonate resin, polyacrylonitrile resin, cellulose resin , Si, C, W, Al ₂ O ₃ , Mo, SiO ₂ , Si ₂ N ₄ , etc., may contain two or more of these components. For example, in the case of a protective layer used for oxidation prevention, it is preferable that the protective layer contains polyol resin, SiO ₂ and Si ₂ N ₄ . Also, when used for a low-reflection protective layer, it is preferable that the protective layer contains (meth)acrylic resin and fluororesin.

When the protective layer is formed by applying the resin composition for forming the protective layer, well-known methods such as spin coating, casting, screen printing, and ink-jet methods can be used as the coating method of the resin composition for protecting the protective layer. Methods. As the organic solvent contained in the protective layer forming resin composition, known organic solvents (for example, propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used. In the case of forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical gas phase deposition method).

The protective layer may contain additives such as organic and inorganic fine particles, absorbers for light of specific wavelengths (eg, ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesives, and surfactants as needed. Examples of organic and inorganic fine particles include polymer fine particles (such as silicone resin particles, polystyrene particles, melamine resin particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, Titanium nitride, titanium oxynitride, magnesium fluoride, hollow silicon dioxide, silicon dioxide, calcium carbonate, barium sulfate, etc. As the absorber for light of a specific wavelength, known absorbers can be used. The content of these additives can be appropriately adjusted, but is preferably 0.1 to 70% by mass, more preferably 1 to 60% by mass, based on the total mass of the protective layer. Moreover, as a protective layer, the protective layer described in paragraph 0073-0092 of Unexamined-Japanese-Patent No. 2017-151176 can also be used.

The optical filter may also have a structure in which pixels are embedded in spaces separated by partition walls, for example, in a grid pattern. In addition, the resin composition of the present invention can also be preferably used in the pixel structure described in International Publication No. 2019/102887.

＜Solid state image sensor＞ The solid-state imaging device of the present invention has the above-mentioned film of the present invention. The structure of the solid-state imaging device of the present invention is not particularly limited as long as it includes the film of the present invention and functions as a solid-state imaging device, and examples thereof include the following structures.

The structure of the solid-state imaging device is as follows: on the substrate, there are a plurality of photoelectric sensors that constitute the light-receiving area of the solid-state imaging device (CCD (charge-coupled device) image sensor, CMOS (complementary metal oxide film semiconductor) image sensor, etc.) The transmission electrode composed of diode and polysilicon, etc. has a light-shielding film with only the light-receiving part opening of the photodiode on the photodiode and the transmission electrode, and has a light-shielding film covering the entire surface of the light-shielding film and the photodiode. A device protection film made of silicon nitride or the like is formed in the form of a light receiving part, and a color filter is provided on the device protection film. Furthermore, it may be a structure that has a light-condensing mechanism (for example, a microlens, etc., the same below) on the lower side of the color filter (closer to the substrate) on the device protective film, or one that has a light-condensing mechanism on the color filter. structure etc. Also, the color filter may have a structure in which colored pixels are embedded in spaces separated by partition walls, for example, in a grid pattern. In this case, the refractive index of the partition wall is preferably lower than the refractive index of each colored pixel. Examples of imaging devices having such structures include JP-A-2012-227478, JP-A-2014-179577, International Publication No. 2018/043654, and US Patent Application Publication No. 2018/0040656. The device described in. Also, providing an ultraviolet absorbing layer within the structure of the solid-state imaging device as in JP-A-2019-211559 can also improve light resistance. The imaging device including the solid-state imaging device of the present invention can be used not only as a digital camera or an electronic device (mobile phone, etc.) having an imaging function, but also as a vehicle-mounted camera or a surveillance camera. In addition, the solid-state imaging device incorporating the color filter of the present invention may further incorporate other color filters, near-infrared cut filters, organic photoelectric conversion films, and the like in addition to the color filter of the present invention.

＜Image Display Device＞ The image display device of the present invention has the above-mentioned film of the present invention. As an image display device, a liquid crystal display device, an organic electroluminescent display device, etc. are mentioned. The definition of the image display device or the details of each image display device are described, for example, in "Electronic Display Devices (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd., 1990)", "Display Devices (Ibuki Shun Chapter, Sangyo Tosho Publishing Co., Ltd., issued in 1989)", etc. Also, liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". The liquid crystal display device to which the present invention can be applied is not particularly limited, and for example, it can be applied to liquid crystal display devices of various types described in the above-mentioned "Next Generation Liquid Crystal Display Technology". [Example]

Hereinafter, the present invention will be described in more detail with reference to examples. Materials, usage amounts, ratios, processing contents, processing procedures and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

<Measuring method of weight average molecular weight (Mw)> The weight average molecular weight of the sample was measured by gel permeation chromatography (GPC) under the following conditions. The type of column: the column connected with TOSOH TSKgel Super HZM-H, TOSOH TSKgel Super HZ4000 and TOSOH TSKgel Super HZ2000 Developing solvent: tetrahydrofuran Column temperature: 40°C Flow rate (sample injection volume): 1.0 μL (sample concentration: 0.1% by mass) Device name: HLC-8220GPC manufactured by TOSOH Corporation Detector: RI (Refractive Index) detector Calibration Curve Base Resin: Polystyrene Resin

＜Measuring method of acid value＞ The acid value of the sample was measured as follows. That is, the measurement sample was dissolved in a mixed solvent of tetrahydrofuran/water = 9/1 (mass ratio), and the obtained The solution was neutralized and titrated with 0.1 mol/L potassium hydroxide aqueous solution at 25°C. Using the inflection point of the titration pH curve as the titration end point, the acid value was calculated by the following formula. A=56.11×Vs×0.5×f/w A: acid value (mgKOH/g) Vs: the amount of 0.1mol/L potassium hydroxide aqueous solution required for titration (mL) f: titer of 0.1mol/L potassium hydroxide aqueous solution w: mass of the sample (g) (solid content conversion)

＜Measurement method of amine value＞ The amine value of the sample was measured as follows. That is, the measurement sample was dissolved in acetic acid, and the obtained solution was raised from 0.1 mol/L to The chloric acid/acetic acid solution was subjected to a neutralization titration. Using the inflection point of the titration pH curve as the titration end point, the amine value was calculated by the following formula. B=56.11×Vs×0.1×f/w B: Amine value (mgKOH/g) Vs: the amount of 0.1mol/L perchloric acid/acetic acid solution required for titration (mL) f: Titration of 0.1mol/L perchloric acid/acetic acid solution w: mass of the sample (g) (solid content conversion)

<Resin synthesis method> (Synthesis Example 1) Synthesis of Resin B-1 Add 100.1 g of methyl methacrylate and 128.2 g of butyl acrylate to a 3-neck flask purged with nitrogen, and use 350 g of propylene glycol monomethyl ether Acetate was diluted. It was heated to 75°C under a nitrogen atmosphere. Next, 20.9 g of mercaptoethanol and 2.0 g of a polymerization initiator (V-601, manufactured by FUJIFILM Wako Pure Chemical Corporation) were added, and heated and stirred at 75° C. for 8 hours in a nitrogen atmosphere to obtain a hydroxyl-terminated polymer with the following structure The solution. The weight average molecular weight of the obtained hydroxyl-terminated polymer was 2,300. [chemical formula 27]

Next, the obtained solution of the hydroxyl-terminated polymer was cooled to 5°C, 32.1 g of trimellitic anhydride chloride was added, and 15.3 g of pyridine was added dropwise over 6 hours. Furthermore, it stirred at room temperature for 24 hours, filtered off the insoluble matter, and obtained the solution of the macromonomer which has an acid anhydride structure at the terminal of the following structure. The weight average molecular weight of the obtained macromonomer having an acid anhydride structure at the end was 2500. [chemical formula 28]

Next, the obtained solution of the macromonomer having an acid anhydride structure at the terminal was heated to 50° C., and 7.1 g of polyethyleneimine (Epomin SP-003, manufactured by NIPPON SHOKUBAI CO., LTD.) was added thereto. Furthermore, it heated and stirred at 50 degreeC for 5 hours. 280 g of propylene glycol monomethyl ether acetate was added to adjust the solid content concentration to obtain a propylene glycol monomethyl ether acetate solution having a solid content concentration of 30% by mass of resin B-1 having the following structure. The obtained resin B-1 had a weight average molecular weight of 6600, an acid value of 21 mgKOH/g, and an amine value of 33 mgKOH/g.

(Synthesis Examples 2 to 35) Synthesis of Resins B-2 to B-35 Resins B-2 to B-35 were respectively synthesized by the same method as resin B-1.

[化學式30]

[化學式31]

[化學式32]

[化學式33]

[化學式34]

[化學式35]

[化學式36]

The structures, weight average molecular weight (Mw), acid value, and amine value of resins B-1 to B-35 are shown below. In addition, the numerical value attached to the main chain represents a molar ratio. Also, in polymerization, the numerical value attached to the repeating unit indicates the number of the repeating unit. [chemical formula 29]

[chemical formula 30]

[chemical formula 31]

[chemical formula 32]

[chemical formula 33]

[chemical formula 34]

[chemical formula 35]

[chemical formula 36]

[Table 1] Mw of the resin Acid value of resin (mgKOH/g) Amine value of resin (mgKOH/g) B-1 6600 twenty one 33 B-2 13100 11 33 B-3 26300 5 33 B-4 28100 45 47 B-5 62500 20 117 B-6 11300 111 143 B-7 6900 89 127 B-8 11400 67 77 B-9 34700 5 25 B-10 36800 5 twenty four B-11 73500 3 5 B-12 9500 11 46 B-13 6800 125 64 B-14 9000 5 146 B-15 22500 5 58 B-16 5400 92 41 B-17 3400 146 64 B-18 13500 7 65 B-19 18900 5 twenty one B-20 113000 1 65 B-21 918750 0 twenty four B-22 50000 3 18 B-23 113000 1 15 B-24 188000 1 15 B-25 64000 72 0 B-26 32000 79 0 B-27 37000 54 0 B-28 37000 67 0 B-29 15800 5 55 B-30 26300 5 33 B-31 5700 37 77 B-32 25600 8 51 B-33 8900 25 16 B-34 7300 38 10 B-35 19100 18 0

＜Manufacture of dispersion liquid＞ Use a bead mill (zirconia beads with a diameter of 0.3 mm), mix and disperse the mixture of the raw materials listed in the following table for 3 hours, and then use a high-pressure disperser NANO-3000-10 with a decompression mechanism (manufactured by Nippon BEE Co., Ltd.), dispersion treatment was performed at a flow rate of 500 g/min under a pressure of 2000 MPa. This dispersion treatment was repeated 10 times to obtain each dispersion liquid.

[Table 2] color material Pigment derivatives Resin (dispersant) Compare Resins solvent PR 264 PR 254 PR 291 PO 71 PY 215 derivative 1 derivative 2 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 cB-1 S-1 S-2 S-3 Dispersion R1 20.8 - - - - 5.2 - 9.2 - - - - - - - - - 64.8 - - Dispersion R2 - 24.2 - - - - 5.6 9.8 - - - - - - - - - 55.6 - 4.8 Dispersion R3 11.6 10.6 - - - - 4.6 11.2 - - - - - - - - - - 62.0 - Dispersion R4 26.0 - - - - - - 9.2 - - - - - - - - - 64.8 - - Dispersion R5 20.8 - - - - 5.2 - - 9.2 - - - - - - - - 64.8 - - Dispersion R6 20.8 - - - - 5.2 - - - 9.2 - - - - - - - 64.8 - - Dispersion R7 20.8 - - - - 5.2 - - - - 9.2 - - - - - - 64.8 - - Dispersion R8 20.8 - - - - 5.2 - - - - - 9.2 - - - - - 64.8 - - Dispersion R9 20.8 - - - - 5.2 - - - - - - 9.2 - - - - 64.8 - - Dispersion R10 20.8 - - - - 5.2 - - - - - - - 9.2 - - - 64.8 - - Dispersion R11 20.8 - - - - 5.2 - - - - - - - - 9.2 - - 64.8 - - Dispersion R12 20.8 - - - - 5.2 - - - - - - - - - 9.2 - 64.8 - - Dispersion R13 - - 24.2 - - - 5.6 9.8 - - - - - - - - - 55.6 - 4.8 Dispersion R14 10.4 - - 10.4 - - 5.6 9.8 - - - - - - - - - 55.6 - 4.8 Dispersion R15 10.4 - - 5.2 5.2 - 5.6 9.8 - - - - - - - - - 55.6 - 4.8 Dispersion CR1 20.8 - - - - 5.2 - - - - - - - - - - 9.2 64.8 - - Dispersion CR2 26.0 - - - - - - - - - - - - - - - 9.2 64.8 - - [table 3] color material Pigment derivatives Resin (dispersant) Compare Resins solvent PB 15:6 PB 16 PR 122 derivative 1 derivative 2 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 cB-1 S-1 S-2 S-3 Dispersion B1 22.6 - - 5.0 9.8 - - - - - - - - - - 2.6 2.6 57.4 Dispersion B2 - 22.3 - 4.2 - 10.3 - - - - - - - - - 20.1 - 43.1 Dispersion B3 5.4 22.4 - 5.6 - - 10.5 - - - - - - - - 52.9 - 3.2 Dispersion B4 - 22.3 - 4.2 10.3 - - - - - - - - - - 20.1 - 43.1 Dispersion B5 26.7 - - 10.3 20.1 - 43.1 Dispersion B6 - 22.3 - 4.2 - - 10.3 - - - - - - - - 20.1 - 43.1 Dispersion B7 - 22.3 - 4.2 - - - 10.3 - - - - - - - 20.1 - 43.1 Dispersion B8 - 22.3 - 4.2 - - - - 10.3 - - - - - - 20.1 - 43.1 Dispersion B9 - 22.3 - 4.2 - - - - - 10.3 - - - - - 20.1 - 43.1 Dispersion B10 - 22.3 - 4.2 - - - - - - 10.3 - - - - 20.1 - 43.1 Dispersion B11 - 22.3 - 4.2 - - - - - - - 10.3 - - - 20.1 - 43.1 Dispersion B12 - 22.3 - 4.2 - - - - - - - - 10.3 - - 20.1 - 43.1 Dispersion B13 - 22.3 - 4.2 - - - - - - - - - 10.3 - 20.1 - 43.1 Dispersion B14 20.0 2.6 4.2 9.8 2.6 2.6 57.4 Dispersion CB1 - 22.3 - 4.2 - - - - - - - - - - 10.3 20.1 - 43.1 Dispersion CB2 - 26.7 - - - - - - - - - - - - 10.3 20.1 - 43.1 [Table 4] color material Pigment derivatives Resin (dispersant) Compare Resins solvent PB 7 PG 36 PG 58 PY 185 PY 215 derivative 2 B-20 B-21 B-22 B-23 B-24 B-25 B-26 B-27 B-28 B-29 cB-1 S-1 Dispersion G1 12.3 - - - - 2.5 2.5 - - 2.3 - - - - - - - 80.4 Dispersion G2 - 11.9 - 2.5 - 2.3 - 2.8 - - - - 1.1 - - - - 79.4 Dispersion G3 10.1 - 2.0 2.5 - 2.6 - - 5.3 - - - - - - - - 77.5 Dispersion G4 - - 10.2 - 3.0 2.3 7.6 - - - - - - - - - - 76.9 Dispersion G5 - - 12.5 - 3.0 - 7.6 - - - - - - - - - - 76.9 Dispersion G6 - - 10.2 - 3.0 2.3 - 7.6 - - - - - - - - - 76.9 Dispersion G7 - - 10.2 - 3.0 2.3 - - 7.6 - - - - - - - - 76.9 Dispersion G8 - - 10.2 - 3.0 2.3 - - - 7.6 - - - - - - - 76.9 Dispersion G9 - - 10.2 - 3.0 2.3 - - - - 7.6 - - - - - - 76.9 Dispersion G10 - - 10.2 - 3.0 2.3 - - - - - 7.6 - - - - - 76.9 Dispersion G11 - - 10.2 - 3.0 2.3 - - - - - - 7.6 - - - - 76.9 Dispersion G12 - - 10.2 - 3.0 2.3 - - - - - - - 7.6 - - - 76.9 Dispersion G13 - - 10.2 - 3.0 2.3 - - - - - - - - 7.6 - - 76.9 Dispersion G14 - - 10.2 - 3.0 2.3 - - - - - - - - - 7.6 - 76.9 Dispersion CG1 - - 10.2 - 3.0 2.3 - - - - - - - - - - 7.6 76.9 Dispersion CG2 - - 12.5 - 3.0 - - - - - - - - - - - 7.6 76.9 [table 5] color material Pigment derivatives Resin (dispersant) Compare Resins solvent IR pigment derivative 3 B-1 B-10 B-16 B-25 B-30 B-31 B-32 cB-1 S-1 Dispersion I1 24.3 7.2 5.5 - - - - - - - 63.0 Dispersion I2 24.3 7.2 - 5.5 - - - - - - 63.0 Dispersion I3 24.3 7.2 - - 5.5 - - - - - 63.0 Dispersion I4 24.3 7.2 - - - 5.5 - - - - 63.0 Dispersion I5 24.3 7.2 - - - - 5.5 2.2 - - 60.8 Dispersion I6 24.3 7.2 - - - - - - 5.5 - 63.0 Dispersion I7 31.5 - 5.5 63.0 Dispersion CI1 24.3 7.2 - - - - - - - 5.5 63.0 Dispersion CI2 31.5 - - - - - - - - 5.5 63.0 [Table 6] color material Pigment derivatives Resin (dispersant) Compare Resins solvent PR 264 PR 179 PB 15:6 PB 16 PY 215 PV23 IRGA PHOR E PBk3 2 derivative 1 derivative 2 B-1 B-4 B-5 B-10 B-12 B-13 B-16 B-17 B-18 B-25 B-26 B-27 cB-1 S-1 S-2 S-3 Dispersion Bk1 6.8 - - 4.4 1.0 - - - 1.2 - 6.5 - - - - - - - - - - - - 62.4 - 17.7 Dispersion Bk2 - 9.9 - 1.3 - - - - - 1.5 - 4.5 - - - - - - - - - - - 62.6 20.2 - Dispersion Bk3 6.8 - - 4.4 1.0 - - - 1.2 - - - 6.5 - - - - - - - - - - 62.4 17.7 - Dispersion Bk4 - - 12.4 - - - - - 1.2 - 2.0 - - 3.2 - - - - - - - - - 62.2 9.7 9.3 Dispersion Bk5 - - - 6.3 - - 6.3 - - 2.1 2.0 - - - 3.2 - - - - - - - - 62.2 17.9 - Dispersion Bk6 - - 3.1 - - - 3.1 3.1 - 2.1 2.0 - - - - 3.2 - - - - - - - 64.8 18.6 - Dispersion Bk7 - - 4.2 - - 4.2 - - 1.0 1.0 2.0 - - - - - 2.5 - - - - - - 64.0 21.1 - Dispersion Bk8 6.8 - - 4.4 1.0 - - - 2.3 - 2.0 - - - - - - 2.2 - - - - - 62.4 18.9 - Dispersion Bk9 - 9.9 - 1.3 - - - - - 1.5 2.0 - - - - - - - 2.2 - - - - 62.6 20.5 - Dispersion Bk10 6.8 - - 4.4 1.0 - - - 1.2 - - 6.5 - - - - - - - - - - - 62.4 - 17.7 Dispersion Bk11 6.8 - - 4.4 1.0 - - - 1.2 - - - 6.5 - - - - - - - - - - 62.4 - 17.7 Dispersion Bk12 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - 6.5 - - - - - - - - - 60.8 - 19.0 Dispersion Bk13 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - - 6.5 - - - - - - - - 60.8 - 19.0 Dispersion Bk14 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - - - 6.5 - - - - - - - 61.6 - 18.2 Dispersion Bk15 6.8 - - 4.4 1.0 - - - 1.2 - - - - - - - 6.5 - - - - - - 62.4 - 17.7 Dispersion Bk16 6.8 - - 4.4 1.0 - - - 1.2 0.3 - - - - - - - 6.5 - - - - - 60.5 - 19.3 Dispersion Bk17 6.8 - - 4.4 1.0 - - - 1.2 - - - - - - - - - 6.5 - - - - 62.4 - 17.7 Dispersion Bk18 6.8 - - 4.4 1.0 - - - 1.2 - - - - - - - - - - 6.5 - - - 62.4 - 17.7 Dispersion Bk19 8.0 - - 4.4 1.0 - - - - - - - - - - - - - - 6.5 - - - 62.4 - 17.7 Dispersion Bk20 6.8 - - 4.4 1.0 - - - 1.2 0.2 - - - - - - - - - - 6.5 - - 60.8 - 19.1 Dispersion Bk21 6.8 - - 4.4 1.0 - - - 1.2 0.2 - - - - - - - - - - - 6.5 - 60.8 - 19.1 Dispersion CBk1 6.8 - - 4.4 1.0 - - - 1.2 - - - - - - - - - - - - - 6.5 62.4 - 17.7 Dispersion CBk2 - 9.9 - 1.3 - - - - - 1.5 - - - - - - - - - - - - 6.5 62.6 - 18.2 Dispersion CBk3 - - - 6.3 - - 6.3 - - 2.1 - - - - - - - - - - - - 6.5 62.2 - 16.6 Dispersion CBk4 8.0 - - 4.4 1.0 - - - - - - - - - - - - - - - - - 6.5 62.4 - 17.7

IRGAPHORE： Irgaphor Black S 0100 CF（BASF公司製、下述結構的化合物、內醯胺顏料） [化學式38]

PBk32：C.I.顏料黑32（下述結構的化合物、苝顏料） [化學式39]

The unit of the numerical value showing the compounding quantity of each raw material described in the said table|surface is a mass part. Among the raw materials shown in the above table, the details of the raw materials indicated by abbreviations are as follows. [Color materials] PR122: CI Pigment Red 122 (red pigment, quinacridone pigment) PR179: CI Pigment Red 179 (red pigment, perylene pigment) PR254: CI Pigment Red 254 (red pigment, diketopyrrolopyrrole pigment) PR264 : CI Pigment Red 264 (red pigment, diketopyrrolopyrrole pigment) PR291: CI Pigment Red 291 (red pigment, diketopyrrolopyrrole pigment) PO71: CI Pigment Orange 71 (orange pigment, diketopyrrolopyrrole pigment) PB15:6: CI Pigment Blue 15:6 (blue pigment, phthalocyanine pigment) PB16: CI Pigment Blue 16 (blue pigment, phthalocyanine pigment) PG7: CI Pigment Green 7 (green pigment, phthalocyanine pigment) PG36: CI Pigment Green 36 (green pigment, phthalocyanine pigment) PG58: CI Pigment Green 58 (green pigment, phthalocyanine pigment) PY185: CI Pigment Yellow 185 (yellow pigment, isoindoline pigment) PY215: CI Pigment Yellow 215 (yellow Pigments, pteridine-based pigments) PV23: CI Pigment Violet 23 (purple pigments, bi㗁𠯤 pigments) IR pigments: compounds with the following structure (near-infrared absorbing pigments, in the structural formula, Me represents a methyl group, and Ph represents a phenyl group) [chemical formula 37]

IRGAPHORE: Irgaphor Black S 0100 CF (manufactured by BASF Corporation, compound of the following structure, lactam pigment) [chemical formula 38]

PBk32: CI Pigment Black 32 (compound of the following structure, perylene pigment) [Chemical formula 39]

衍生物2：下述結構的化合物 [化學式41]

衍生物3：下述結構的化合物 [化學式42]

[Pigment Derivatives] Derivative 1: a compound of the following structure [Chemical Formula 40]

Derivative 2: a compound of the following structure [Chemical Formula 41]

Derivative 3: a compound of the following structure [Chemical Formula 42]

〔Resin (dispersant)〕 (specific resin) B-1～B-32: Resins mentioned above

(Comparative resin) cB-1: Resin with the following structure (weight-average molecular weight: 10885, acid value: 74 mgKOH/g. The description of "polymerization" means that the repeating unit of the structure represented by "polymerization" is linked by the numerical value of the suffix The polymer chains forming the structure are bonded to sulfur atoms (S).) [Chemical formula 43]

〔Solvent〕 S-1: Propylene glycol monomethyl ether acetate S-2: Propylene glycol monomethyl ether S-3: Cyclohexanone

＜Manufacture of resin composition＞ The resin compositions of Examples and Comparative Examples were prepared by mixing the raw materials described in the following tables.

[Table 7] Dispersions resin polymerizable monomer Photopolymerization initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 1 Dispersion R1 54.6 Ba-1 12.0 D-1 5.0 E-1 5.0 S-1 23.4 Example 2 Dispersion R1 54.6 Ba-1 12.0 D-1 10.0 - - S-1 23.4 Example 3 Dispersion R2 56.4 Ba-1 4.0 D-1 4.0 E-1 3.0 S-1 32.6 Example 4 Dispersion R3 54.6 Ba-1 2.0 D-1 3.0 E-2 1.0 S-3 39.4 Example 5 Dispersion R4 53.4 Ba-1 8.0 D-1 3.0 E-1 3.0 S-3 32.6 Example 6 Dispersion R5 58.6 Ba-1 8.0 D-1 3.0 E-2 3.0 S-3 27.4 Example 7 Dispersion R6 55.0 Ba-1 8.0 D-1 3.0 E-3 3.0 S-3 31.0 Example 8 Dispersion R7 55.9 Ba-1 10.0 D-1 5.0 E-1 3.0 S-3 26.1 Example 9 Dispersion R8 57.2 Ba-1 10.0 D-1 5.0 E-2 3.0 S-3 24.8 Example 10 Dispersion R9 63.7 Ba-1 10.0 D-1 4.0 E-3 3.0 S-1 19.3 Example 11 Dispersion R10 56.9 Ba-1 12.0 D-1 4.0 E-3 3.0 S-3 24.1 Example 12 Dispersion R11 55.0 Ba-1 5.0 D-1 4.0 E-2 3.0 S-1 33.0 Example 13 Dispersion R12 55.0 Ba-1 5.0 D-1 3.0 E-2 3.0 S-1 S-2 17 17 Example 14 Dispersion R13 55.0 Ba-1 5.0 D-1 3.0 E-3 3.0 S-1 S-3 17 17 Example 15 Dispersion R14 55.0 Ba-2 5.0 D-2 2.0 E-3 3.0 S-1 35.0 Example 16 Dispersion R15 52.5 Ba-2 8.0 D-2 5.0 E-1 2.0 S-3 32.5 Example 17 Dispersion B1 52.0 Ba-2 8.0 D-2 5.0 E-1 3.0 S-3 32.0 Example 18 Dispersion B1 55.0 Ba-2 8.0 D-2 5.0 - - S-3 32.0 Example 19 Dispersion B1 60.0 Ba-2 8.0 - - - - S-3 32.0 Example 20 Dispersion B1 68.0 - - - - - - S-3 32.0 Example 21 Dispersion B2 57.9 Ba-2 8.0 D-2 5.0 E-1 3.0 S-3 26.2 Example 22 Dispersion B3 52.3 Ba-2 8.0 D-2 5.0 E-2 3.0 S-3 31.7 Example 23 Dispersion B4 56.7 Ba-2 8.0 D-2 2.0 E-2 2.0 S-3 31.3 Example 24 Dispersion B5 55.1 Ba-2 8.0 D-2 5.0 E-2 3.0 S-1 28.9 Example 25 Dispersion B6 58.0 Ba-2 10.0 D-2 5.0 E-3 3.0 S-1 24.0 Example 26 Dispersion B7 53.8 Ba-2 10.0 D-2 2.0 E-3 3.0 S-1 31.2 Example 27 Dispersion B8 54.1 Ba-2 10.0 D-2 5.0 E-3 3.0 S-1 27.9 Example 28 Dispersion B9 59.2 Ba-2 10.0 D-2 5.0 E-1 3.0 S-3 22.9 Example 29 Dispersion B10 56.4 Ba-2 8.0 D-2 5.0 E-2 2.0 S-3 28.6 Example 30 Dispersion B11 56.8 Ba-3 8.0 D-3 2.0 E-3 3.0 S-3 30.2 Example 31 Dispersion B12 63.7 Ba-3 9.0 D-3 5.0 E-1 3.0 S-3 19.3 Example 32 Dispersion B13 70.2 Ba-3 10.0 D-3 5.0 E-2 3.0 S-3 11.8 Example 33 Dispersion B14 55.0 Ba-3 5.0 D-4 5.0 E-3 2.0 S-1 33.0 Example 34 Dispersion G1 55.0 Ba-3 5.0 D-4 5.0 E-3 3.0 S-1 32.0 Example 35 Dispersion G2 55.0 Ba-3 5.0 D-4 5.0 E-3 3.0 S-1 32.0 [Table 8] Dispersions resin polymerizable monomer Photopolymerization initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 36 Dispersion G3 55.0 Ba-3 5.0 D-4 5.0 E-3 3.0 S-1 32.0 Example 37 Dispersion G4 55.0 Ba-3 5.0 D-4 2.0 E-3 2.0 S-1 36.0 Example 38 Dispersion G5 55.0 Ba-3 5.0 D-4 5.0 E-3 3.0 S-1 32.0 Example 39 Dispersion G6 53.8 Ba-3 8.0 D-4 2.0 E-3 1.0 S-1 35.2 Example 40 Dispersion G7 56.6 Ba-3 8.0 D-4 5.0 E-1 3.0 S-1 27.5 Example 41 Dispersion G8 59.8 Ba-3 8.0 D-4 5.0 E-2 3.0 S-1 24.2 Example 42 Dispersion G9 60.3 Ba-3 8.0 D-4 2.0 E-3 1.0 S-3 28.7 Example 43 Dispersion G10 57.1 B-1 8.0 D-1 5.0 E-1 2.0 S-3 27.9 Example 44 Dispersion G11 56.3 B-1 12.0 D-1 10.0 E-2 5.0 S-3 16.7 Example 45 Dispersion G12 55.9 B-30 8.0 D-1 5.0 E-3 5.0 S-3 26.1 Example 46 Dispersion G13 54.1 B-30 8.0 D-1 2.0 E-1 3.0 S-3 32.9 Example 47 Dispersion G14 55.9 B-1 8.0 D-1 2.0 E-2 3.0 S-3 31.1 Example 48 Dispersion I1 60.6 B-1 8.0 D-1 5.0 E-3 3.0 S-3 23.4 Example 49 Dispersion I2 55.0 B-1 8.0 D-1 5.0 E-3 3.0 S-3 29.0 Example 50 Dispersion I3 55.0 Ba-2 8.0 D-1 5.0 E-3 3.0 S-3 29.0 Example 51 Dispersion I4 55.0 Ba-2 5.0 D-1 2.0 E-2 3.0 S-1 35.0 Example 52 Dispersion I5 55.0 Ba-2 5.0 D-1 2.0 E-2 3.0 S-1 35.0 Example 53 Dispersion I6 55.0 Ba-2 5.0 D-1 2.0 E-3 3.0 S-1 35.0 Example 54 Dispersion I6 58.0 Ba-2 5.0 D-1 2.0 - - S-1 35.0 Example 55 Dispersion I6 60.0 Ba-2 5.0 - - - - S-1 35.0 Example 56 Dispersion I7 55.0 Ba-2 5.0 D-1 2.0 E-3 3.0 S-1 35.0 Example 57 Dispersion Bk1 55.0 Ba-2 10.0 D-1 11.5 E-2 5.0 S-1 31.5 Example 58 Dispersion Bk2 55.0 Ba-2 5.0 D-1 5.0 E-2 3.0 S-1 45.0 Example 59 Dispersion Bk3 55.0 Ba-2 5.0 D-1 5.0 E-2 3.0 S-1 45.0 Example 60 Dispersion Bk4 55.0 B-6 5.0 D-1 5.0 E-3 3.0 S-1 45.0 Example 61 Dispersion Bk5 55.0 B-11 5.0 D-1 2.0 E-2 3.0 S-1 35.0 Example 62 Dispersion Bk6 55.0 B-14 5.0 D-1 2.0 E-2 3.0 S-1 35.0 Example 63 Dispersion Bk7 55.0 B-24 5.0 D-1 2.0 E-2 3.0 S-1 35.0 Example 64 Dispersion Bk8 55.0 B-26 5.0 D-1 3.0 E-3 3.0 S-1 34.0 Example 65 Dispersion Bk9 55.0 B-29 5.0 D-1 3.0 E-1 E-3 1.5 1.5 S-3 34.0 Example 66 Dispersion Bk10 55.0 Ba-3 8.0 D-4 5.0 E-2 E-3 1.5 1.5 S-1 29.0 Example 67 Dispersion Bk11 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 68 Dispersion Bk12 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 69 Dispersion Bk13 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 70 Dispersion Bk14 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0

[Table 9] Dispersions resin polymerizable monomer Photopolymerization initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 71 Dispersion Bk15 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 72 Dispersion Bk16 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 73 Dispersion Bk17 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 74 Dispersion Bk18 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 75 Dispersion Bk19 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 76 Dispersion Bk20 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 77 Dispersion Bk21 55.0 Ba-3 8.0 D-4 5.0 E-3 3.0 S-1 29.0 Example 78 Dispersion R1 Dispersion B1 27.6 27.6 Ba-3 8.0 D-1 5.0 E-3 3.0 S-1 28.8 Example 79 Dispersion R1 Dispersion B6 27.6 27.6 Ba-3 8.0 D-1 D-4 2.5 2.5 E-3 3.0 S-1 33.8 Example 80 Dispersion R9 Dispersion B6 27.6 27.6 Ba-3 8.0 D-1 D-4 2.5 2.5 E-3 3.0 S-1 33.8 Example 81 Dispersion R1 Dispersion G1 Dispersion B1 18.3 18.3 18.3 Ba-3 8.0 D-1 D-4 2.5 2.5 E-3 3.0 S-1 34.1 Comparative example 1 Dispersion CR1 54.6 Bb-1 12.0 D-1 5.0 E-1 5.0 S-1 23.4 Comparative example 2 Dispersion CR2 55.0 Bb-1 5.0 D-2 2.0 E-3 3.0 S-1 35.0 Comparative example 3 Dispersion CB1 56.8 Bb-1 8.0 D-3 2.0 E-3 3.0 S-3 30.2 Comparative example 4 Dispersion CB2 57.1 Bb-2 8.0 D-1 5.0 E-1 2.0 S-3 27.9 Comparative Example 5 Dispersion CG1 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2 Comparative Example 6 Dispersion CG2 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2 Comparative Example 7 Dispersion CI1 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2 Comparative Example 8 Dispersion CI2 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2 Comparative Example 9 Dispersion CBk1 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2 Comparative Example 10 Dispersion CBk2 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2 Comparative Example 11 Dispersion CBk3 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2 Comparative Example 12 Dispersion CBk4 55.8 Bb-2 8.0 D-1 5.0 E-3 3.0 S-3 28.2

Among the raw materials described in the above table, the details of the raw materials indicated by abbreviations are as follows.

〔Dispersions〕 Dispersion liquid R1～R14, B1～B14, G1～G14, I1～I7, Bk1～Bk21, CR1, CR2, CB1, CB2, CG1, CG2, CI1, CI2, CBk1～4: the above dispersion liquid

Ba-2：下述結構的樹脂（附註於主鏈之數值為莫耳比。重量平均分子量15000） [化學式45]

Ba-3：下述結構的樹脂（附註於主鏈之數值為莫耳比。x、y與z的合計值為50。Mw=15000） [化學式46]

Bb-1：下述結構的樹脂（附註於主鏈之數值為莫耳比。重量平均分子量13000） [化學式47]

Bb-2：上述之樹脂cB-1 B-1、B-6、B-11、B-14、B-24、B-26、B-29、B-30：上述之結構的樹脂B-1、B-6、B-11、B-14、B-24、B-26、B-29、B-30 [Resin] Ba-1: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 11000) [Chemical formula 44]

Ba-2: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 15000) [Chemical formula 45]

Ba-3: Resin with the following structure (the value attached to the main chain is the molar ratio. The total value of x, y and z is 50. Mw=15000) [Chemical formula 46]

Bb-1: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 13000) [Chemical formula 47]

Bb-2: Resin cB-1 mentioned above B-1, B-6, B-11, B-14, B-24, B-26, B-29, B-30: Resin B-1 with the above structure , B-6, B-11, B-14, B-24, B-26, B-29, B-30

〔polymerizable monomer〕 D-1: Acrylic ester compound (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., a mixture of diperythritol hexaacrylate and diperythritol pentaacrylate) D-2: Epoxy compound (TETRAD-X, manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC., N,N,N',N'-tetraepoxypropyl-m-xylylenediamine) D-3: Oxetane compound (OXT-221, manufactured by TOAGOSEI CO., LTD., 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy] Methyl}oxetane) D-4: Oxetane compound (OX-SQ TX-100, manufactured by TOAGOSEI CO.,LTD.)

[Photopolymerization initiator] E-1: Omnirad 379EG (manufactured by IGM Resins BV, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-portoline-4 -yl-phenyl)-butan-1-one) E-2: Irgacure OXE01 (manufactured by BASF, oxime compound) E-3: Compound of the following structure [chemical formula 48]

〔Solvent〕 S-1: Propylene glycol monomethyl ether acetate S-2: Propylene glycol monomethyl ether S-3: Cyclohexanone

＜Evaluation＞ [Evaluation of dispersion] (storage stability) The viscosity (mPa･s) of the resin composition of each Example and the comparative example was measured with "RE-85L" manufactured by TOKI SANGYO CO., LTD. After the above measurement, the resin composition was left to stand under the conditions of 45° C. and shaded for 3 days, and the viscosity (mPa･s) was measured again. The storage stability was evaluated based on the following evaluation criteria from the viscosity difference (ΔVis) before and after the above standing. It can be said that the smaller the value of the viscosity difference (ΔVis), the better the storage stability of the resin composition and the better the dispersion of the pigment. The above viscosity measurements were all carried out in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, respectively, and the temperature of the resin composition was adjusted to 25°C.

-Evaluation criteria- A: Δvis is 0.5 mPa･s or less. B: Δvis exceeds 0.5 mPa･s and is 1.0 mPa･s or less. C: Δvis exceeds 1.0 mPa･s and is 2.0 mPa･s or less. D: Δvis exceeds 2.0 mPa･s and is 2.5 mPa･s or less. E: Δvis exceeds 2.5 mPa･s.

(particle size) Using a dynamic light scattering particle size distribution measuring device (manufactured by HORIBA, Ltd., LB-500) in accordance with JIS8826:2005, the resin composition obtained above was divided into 20ml sample bottles, and propylene glycol monomethyl ether Acetate was diluted and adjusted so that the solid content concentration would be 0.2% by mass. Using a 2ml quartz cell for measurement at a temperature of 25°C, data acquisition of the above-mentioned diluted solution was performed 50 times, and the arithmetic mean particle diameter (number average particle diameter) of the pigment based on the obtained number was obtained. It can be said that the smaller the value of the number average particle diameter of the pigment, the better the dispersibility of the pigment. -Evaluation criteria- A: The number average particle diameter of the pigment is 0.05 μm or less. B: The number average particle diameter of the pigment exceeds 0.05 μm and is 0.10 μm or less. C: The number average particle diameter of the pigment exceeds 0.10 μm and is 0.20 μm or less. D: The number average particle diameter of the pigment exceeds 0.20 μm and is 0.50 μm or less. E: The number average particle diameter of the pigment exceeds 0.50 μm.

[Evaluation of Film Shrinkage Rate] The resin composition of each example and comparative example was coated on a glass substrate by spin coating, dried (pre-baked) at 100°C for 120 seconds using a hot plate, and then dried in an oven. Heating (post-baking) at 200° C. for 30 minutes produced a film with a thickness of 0.60 μm. Regarding the film thickness, a portion of the film was scratched to expose the surface of the glass substrate, and the step between the surface of the glass substrate and the coating film (film thickness of the coating film) was measured using a stylus level gauge (DektakXT, manufactured by BRUKER CORPORATION). Next, the obtained film was heat-treated at 300° C. for 5 hours in a nitrogen atmosphere. The film thickness of the film after heat processing was measured similarly, the film shrinkage rate was calculated|required from the following formula, and the film shrinkage rate was evaluated according to the following evaluation criteria. The following T ₀ and T ₁ were all measured in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, respectively, and the temperature of the substrate was adjusted to 25°C. It can be said that the smaller the film shrinkage rate, the better the film shrinkage is suppressed, which is a better result. Film shrinkage (%)=(1-(T ₁ /T ₀ ))×100 T ₀ : Film thickness of the film immediately after production (=0.60 μm) T ₁ : Heat treatment at 300°C in nitrogen atmosphere 5 Film Thickness After Hours—Evaluation Criteria—A: The shrinkage rate of the film is 1% or less. B: The shrinkage rate of the film is more than 1% and not more than 5%. C: The film shrinkage rate exceeds 5% and is 10% or less. D: The film shrinkage rate exceeds 10% and is 30% or less. E: The shrinkage rate of the film exceeds 30%.

[Evaluation of Cracks] The resin composition of each example and comparative example was coated on a glass substrate by spin coating, dried (pre-baked) at 100° C. for 120 seconds using a hot plate, and then heated in an oven at 200 By heating (post-baking) for 30 minutes at °C, a film with a thickness of 0.60 μm was produced. Next, SiO ₂ was deposited on the surface of the obtained film at a thickness of 200 nm by a sputtering method to form an inorganic film. The film in which the inorganic film was formed on the surface was heat-treated at 300° C. for 5 hours in a nitrogen atmosphere. The surface of the heat-treated inorganic film was observed with an optical microscope, the number of cracks per 1 cm ² was counted, and the presence or absence of cracks was evaluated according to the following evaluation criteria. -Evaluation Criteria- A: The number of cracks per 1 cm ² was zero. B: The number of cracks per 1 cm ² is 1 to 10. C: The number of cracks per 1 cm ² is 11 to 50. D: The number of cracks per 1 cm ² is 51 to 100. E: The number of cracks per 1 cm ² is 101 or more.

[Evaluation method of precipitation defects] The resin compositions of Examples and Comparative Examples were applied on a silicon wafer by spin coating, and dried (prebaked) at 100° C. for 120 seconds using a hot plate to produce a film with a thickness of 0.60 μm. For the silicon wafer on which the film was formed, the number of impurities with a size of 1.0 μm or more present in the film was counted (impurity number 1) using a defect evaluation device (ComPLUS, manufactured by AMAT). Next, after heating the silicon wafer on which the film was formed at 250°C for 10 minutes, the number of impurities with a size of 1.0 μm or more existing in the film (impurity number 2) was calculated, and the impurity increase rate was calculated from the following formula, The degree of precipitation of defects (precipitation defects) was evaluated by the following criteria. It is practically desirable to judge criterion C or more. Calculated from impurity increase rate = (impurity number 2/impurity number 1). A: Impurity increase rate < 1.1 B: 1.1≤impurity increase rate＜1.3 C: 1.3≤impurity increase rate＜1.5 D: 1.5≤impurity increase rate＜3.0 E: 3.0≤impurity increase rate

[Table 10] Evaluation results dispersion heat resistance storage stability particle size Film shrinkage crack Precipitation defects Example 1 A B B B C Example 2 A B B B A Example 3 A B B B B Example 4 A B B B B Example 5 A B B B A Example 6 B B B B B Example 7 B B B B B Example 8 A A B B B Example 9 A B B B B Example 10 B A B B B Example 11 B A A B B Example 12 B A A B B Example 13 B B A A B Example 14 A B B B B Example 15 A B B B B Example 16 A B B B B Example 17 A B A A B Example 18 A B A A A Example 19 A B A A A Example 20 A B A A A Example 21 B B A A B Example 22 A B C A B Example 23 A B B A C Example 24 A B B A A Example 25 A B C B B Example 26 A A C B B Example 27 B A C B B Example 28 B B B B B Example 29 A A C B B Example 30 A A C B B

[Table 11] Evaluation results dispersion heat resistance storage stability particle size Film shrinkage crack Precipitation defects Example 31 A A C B B Example 32 B A C B B Example 33 A B B A B Example 34 B B B B B Example 35 B B A B B Example 36 B B B B B Example 37 B C C B C Example 38 B C C B A Example 39 B C A A B Example 40 B B B B B Example 41 B B A B B Example 42 B C A B B Example 43 A A A A B Example 44 A A A A B Example 45 A A A A B Example 46 A A A A B Example 47 B B C B B Example 48 A B B B B Example 49 A B B A B Example 50 A B B A B Example 51 A B B B B Example 52 A A A A B Example 53 A A A A C Example 54 A A A A B Example 55 A A A A B Example 56 A A A A A Example 57 A B B B B Example 58 A A B B B Example 59 A B B B B Example 60 A B A A B

[Table 12] Evaluation results dispersion heat resistance storage stability particle size Film shrinkage crack Precipitation defects Example 61 A B B B B Example 62 A B B B B Example 63 A B B B B Example 64 A B B B B Example 65 A B B B B Example 66 A A B B B Example 67 A B B B B Example 68 A B A A B Example 69 A B C B B Example 70 A A C B B Example 71 A A C B B Example 72 A A C B B Example 73 A A C B B Example 74 A A A A C Example 75 A A A A A Example 76 A A A A B Example 77 A A A A B Example 78 A A B A B Example 79 A B B B B Example 80 A C B B B Example 81 A B B A B Comparative example 1 C D. E. D. E. Comparative example 2 C D. E. D. D. Comparative example 3 C D. E. E. E. Comparative example 4 C D. E. E. D. Comparative Example 5 C D. E. D. E. Comparative Example 6 C D. E. D. D. Comparative Example 7 C D. D. E. E. Comparative Example 8 C D. D. E. D. Comparative Example 9 C D. E. D. E. Comparative Example 10 C D. E. D. D. Comparative Example 11 C D. E. D. D. Comparative Example 12 C D. E. D. D.

In the case of using the resin composition of the example, compared with the case of using the resin composition of the comparative example, both were excellent in the evaluation of storage stability and particle size, and were excellent in the dispersibility of the pigment. In addition, in the case of using the resin composition of the example, compared with the case of using the resin composition of the comparative example, the film shrinkage rate was small, and the generation of cracks and the generation of precipitation defects were suppressed. Therefore, it can be said that the resin composition of the example can realize the enlargement of the process window in the steps after film production, compared with the resin composition of the comparative example.

(Example 1000: Pattern formation by photolithography) The resin composition of Example 1 was coated on a silicon wafer by spin coating, and dried (pre-baked) at 100°C using a hot plate for 120 Seconds later, it was heated (post-baked) at 200° C. for 30 minutes in an oven to form a resin composition layer with a thickness of 0.60 μm. Next, a mask pattern in which square-shaped non-masked portions of 1.1 μm on one side are arranged in a region of 4 mm×3 mm is masked using an i-line stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.) for the resin composition layer. Exposure was performed by irradiating light with a wavelength of 365 nm at an exposure amount of 500 mJ/cm ² . Next, the silicon wafer on which the exposed resin composition layer was formed was placed on the horizontal turntable of a rotary shower developing machine (DW-30 type, manufactured by CHEMITRONICS CO., Ltd.), and a developer (CD-2000 , manufactured by FUJIFILM Electronic Materials Co., Ltd.) at 23° C. for 60 seconds for spin-on-dip image development. Next, while rotating the silicon wafer at a rotation speed of 50 rpm, pure water was supplied from above the center of rotation in a shower form from a shower head, rinsed, and then spray-dried to form a pattern (pixel).

The produced silicon wafer with pixels was divided into two, and one of them was heat-treated at 300°C for 5 hours in a nitrogen atmosphere (hereinafter, one of them was set as the substrate before heat treatment at 300°C, and the other was set as substrate after heat treatment at 300°C). As a result of evaluating the cross-sections of the pixels formed on the substrate before and after the 300°C heat treatment with a scanning electron microscope (SEM), the height (thickness) of the pixels formed on the substrate after the 300°C heat treatment 96% of the height (thickness) of the pixel on the substrate before heat treatment at 300°C.

none.

Claims (17)

A resin composition comprising: Color material A containing pigment; Resin B; and solvent C, The aforementioned resin B includes resin B1, and the aforementioned resin B1 is a reaction product of a resin having primary or secondary amino groups and a macromonomer having an acid anhydride structure at the end. The resin composition according to claim 1, wherein the aforementioned resin B1 is a resin comprising a structure represented by formula (b1), [chemical formula 1]

In the formula (b1), the wavy line represents the bonding bond, X ^b1 represents the n+2 valent linking group, X ^b2 represents O or NR ^x1 , R ^x1 represents a hydrogen atom or a substituent, L ^b1 represents a single bond or a divalent connection group, P ^b1 represents a polymer chain, R ^b1 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more. The resin composition according to claim 1 or claim 2, wherein the aforementioned resin B1 is a resin comprising a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), [ Chemical formula 2]

In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, and L ⁴ represents a single bond or a 2-valent linking group, X ^b11 represents an n+2-valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a 2-valent linking group, and P ^b11 represents A polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more. The resin composition according to claim 3, wherein L ^b11 of the aforementioned formula (1-1), L ^b11 of the formula (1-2) and L ^b11 of the formula (1-3) are divalent compounds containing sulfur atoms Connection base. The resin composition as described in claim 3, wherein the polymer chain represented by P ^b11 of the aforementioned formula (1-1), the polymer chain represented by P ^b11 of the formula (1-2), and the polymer chain represented by the formula (1-3 ) The polymer chain represented by P ^b11 is a polymer chain comprising a repeating unit of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic acid structure, and a polystyrene structure. The resin composition as described in claim 3, wherein the polymer chain represented by P ^b11 of the aforementioned formula (1-1), the polymer chain represented by P ^b11 of the formula (1-2), and the polymer chain represented by the formula (1-3 ) The polymer chain represented by P ^b11 contains at least one selected from the group consisting of ethylenically unsaturated bond-containing groups, epoxy groups, oxetanyl groups, and tertiary butyl groups. The resin composition as described in claim 3, wherein The aforementioned resin B1 contains the repeating unit represented by the aforementioned formula (1-1) and the content of the repeating unit represented by the aforementioned formula (1-1) in the aforementioned resin B1 is 30 mol% or more, or The aforementioned resin B1 contains the repeating unit represented by the aforementioned formula (1-2) and the content of the repeating unit represented by the aforementioned formula (1-2) in the aforementioned resin B1 is 30 mol% or more, or The aforementioned resin B1 includes the repeating unit represented by the aforementioned formula (1-3) and the content of the repeating unit represented by the aforementioned formula (1-3) in the aforementioned resin B1 is 30 mol % or more. The resin composition as described in claim 3, wherein the repeating unit represented by the aforementioned formula (1-1) is a repeating unit represented by the following formula (2-1), and the repeating unit represented by the aforementioned formula (1-2) The unit is a repeating unit represented by the following formula (2-2), the repeating unit represented by the aforementioned formula (1-3) is a repeating unit represented by the following formula (2-3), [chemical formula 3]

In the formula, L ¹ represents a single bond or a divalent linker, L ² and L ³ independently represent a 2-valent linker, L ⁴ represents a single bond or a 2-valent linker, L ^b11 represents a single bond or a 2-valent linker The linking group of , P ^b11 represents the polymer chain. The resin composition as described in claim 1 or claim 2, wherein The color material A contains at least one selected from diketopyrrolopyrrole pigments and phthalocyanine pigments. The resin composition according to claim 1 or claim 2, which further contains a polymerizable monomer. The resin composition according to Claim 1 or Claim 2, further comprising a photopolymerization initiator. A film obtained by using the resin composition described in any one of claim 1 to claim 11. An optical filter having the film described in claim 12. A solid-state imaging device having the film described in claim 12. An image display device having the film described in Claim 12. A resin comprising a repeating unit represented by formula (1-1), formula (1-2) or formula (1-3), [chemical formula 4]

In the formula, R ¹ to R ⁹ each independently represent a hydrogen atom or a substituent, L ¹ represents a single bond or a divalent linking group, L ² and L ³ each independently represent a divalent linking group, and L ⁴ represents a single bond or a 2-valent linking group, X ^b11 represents an n+2-valent linking group, X ^b12 represents O or NR ^x11 , R ^x11 represents a hydrogen atom or a substituent, L ^b11 represents a single bond or a 2-valent linking group, and P ^b11 represents A polymer chain, R ^b11 represents a hydrogen atom, a substituent or a counter ion, and n represents an integer of 1 or more. A method for producing a resin, which includes the step of reacting a resin having primary or secondary amino groups with a macromonomer having an acid anhydride structure at the end.