TW202336042A - Resin composition, film, optical filter, solid-state imaging element, and image display device - Google Patents

Abstract

Provided is a resin composition containing a resin B and a colorant A that contains a pigment, wherein the quantity of the colorant A in the total solids content of the resin composition is at least 50 mass%, and the resin B contains a resin b having a repeat unit b1 that contains at least one group selected from between a urea group and a urethane group. Also provided are a film, an optical filter, a solid-state imaging element, and a image display device.

Description

Resin compositions, films, optical filters, solid-state imaging devices, and image display devices

The present invention relates to a resin composition containing color materials. Furthermore, the present invention relates to a film, an optical filter, a solid-state imaging element, and an image display device using a resin composition.

As described in Patent Document 1, a technology for manufacturing optical filters such as color filters using a resin composition containing a color material and a resin is being developed.

[Patent Document 1] Japanese Patent Application Publication No. 2018-101073

In recent years, there has been a strong demand for solid-state imaging elements to be miniaturized or thinned. Therefore, in recent years, there has been a demand for further thinning of films containing color materials such as color filters used in solid-state imaging elements. In order to maintain the desired spectroscopic performance and achieve thinning, it is necessary to increase the color material concentration of the resin composition used for film formation.

However, when a color material containing a pigment is used, if the color material concentration of the resin composition is increased, the proportion of materials capable of adsorbing pigments such as resin is relatively reduced. Therefore, the pigment is likely to agglomerate during storage of the resin composition. Furthermore, the viscosity of the resin composition tends to increase over time.

Therefore, an object of the present invention is to provide a resin composition excellent in storage stability. Furthermore, another object of the present invention is to provide a film, an optical filter, a solid-state imaging element, and an image display device.

Based on investigations by the present inventors, it was found that the above object can be achieved by a resin composition described below, and the present invention was completed. Accordingly, the present invention provides the following.

<1> A resin composition comprising: a pigment-containing color material A; and a resin B, wherein the content of the color material A in the total solid content of the resin composition is 50% by mass or more, and the resin B contains a repeating Resin b of unit b1, the repeating unit b1 contains at least one group selected from the group consisting of urea group and urethane group. <2> The resin composition according to <1>, wherein the repeating unit b1 is a repeating unit containing a urea group. <3> The resin composition according to <1>, wherein the repeating unit b1 is a repeating unit represented by formula (b1-2), [Chemical 1] In the formula ^{(b1-2), R 11 represents a} hydrogen atom or an alkyl group, A monocyclic aromatic hydrocarbon group with an electron-donating group as a substituent, a monocyclic aromatic heterocyclic group that may have an electron-withdrawing group or an electron-donating group as a substituent, or a group represented by the formula (R-101) , -L ¹⁰¹ -(R ¹⁰¹ -O) _n1 -R ¹⁰² ･･････(R-101) In the formula (R-101), L ¹⁰¹ represents a single bond or a divalent linking group, and R ¹⁰¹ represents an alkylene group, R ¹⁰² represents a hydrogen atom or an alkyl group, and n1 represents an integer from 2 to 45. <4> The resin composition according to <3>, wherein X ¹¹ in the above formula (b1-2) is -COO-CH ₂ -CH ₂ -, -COO-CH ₂ -CH ₂ -O-CH ₂ - CH ₂ -, -C ₆ H ₄ - or -C ₆ H ₄ -CH ₂ -. <5> The resin composition according to any one of <1> to <4>, wherein the resin b further contains a repeating unit b2 having a graft chain. <6> The resin composition according to <5>, wherein the graft chain is a polymer chain containing a repeating unit selected from a polyether structure and a polyester structure. <7> The resin composition according to <5>, wherein the graft chain is a polymer chain containing a polyalkyleneoxy structure. <8> The resin composition according to any one of <1> to <7>, wherein the pigment is selected from the group consisting of diketopyrrolopyrrole pigments, isoindoline pigments, quinoline yellow pigments, and azo pigments At least 1 of them. <9> A film obtained using the resin composition according to any one of <1> to <8>. <10> An optical filter including the film according to <9>. <11> A solid-state imaging element including the film according to <9>. <12> An image display device including the film according to <9>. [Effects of the invention]

According to the present invention, it is possible to provide a resin composition excellent in storage stability. Furthermore, a film, an optical filter, a solid-state imaging element, and an image display device can be provided.

Hereinafter, the contents of the present invention will be described in detail. In this specification, "～" is used in the sense that the numerical values described before and after it are included as the lower limit and the upper limit. Among the labels for groups (atomic groups) in this specification, the labels indicating unsubstituted and unsubstituted include groups (atomic groups) without substituents as well as groups (atomic groups) with substituents. For example, "alkyl" includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups). In this specification, "exposure" includes not only exposure using light but also exposure using particle beams such as electron beams and ion beams, unless otherwise specified. Examples of the light used for exposure include the bright line spectrum of a mercury lamp, actinic rays or radiation such as far ultraviolet rays, extreme ultraviolet rays (EUV light), X-rays, and electron beams represented by excimer lasers. In this specification, "(meth)acrylate" means both or either acrylate and methacrylate, "(meth)acrylic acid" means both or either acrylic acid and methacrylic acid, and "(meth)acrylic acid" means both or either acrylic acid and methacrylic acid. "Meth)acrylyl" means both or either of acrylyl and methacrylyl. In this specification, Me in the structural formula represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. In this specification, the weight average molecular weight and the number average molecular weight are polystyrene-converted values measured by the GPC (gel permeation chromatography) method. In this specification, the total solid content refers to the total mass of components excluding solvents from all components of the composition. In this specification, pigments refer to color materials that are not easily soluble in solvents. In this specification, the term "step" includes not only independent steps, but also includes steps that cannot be clearly distinguished from other steps, as long as the expected effect of the step is achieved.

＜Resin composition＞ The resin composition of the present invention includes a color material A containing a pigment and a resin B. The characteristics of the resin composition are: The content of color material A in the total solid content of the above-mentioned resin composition is 50 mass% or more, The resin B includes a resin b having a repeating unit b1, and the repeating unit b1 contains at least one group selected from the group consisting of a urea group and a urethane group.

According to the resin composition of the present invention, by including the above-mentioned resin b, it is possible to suppress an increase in the viscosity of the resin composition over time even if the content of the color material A in the total solid content of the resin composition is 50 mass % or more. Therefore, the resin composition of the present invention has excellent storage stability. The reason why this effect is obtained is presumed to be due to the following reasons. It is speculated that the resin b contains a repeating unit b1 of at least one group selected from a urea group and a urethane group, so the urethane group or urea group contained in the repeating unit b1 is hydrogen bonded By interacting with the pigment, the resin b is strongly adsorbed on the surface of the pigment. As a result, the resin b exists in the vicinity of the pigment in the resin composition. Therefore, it is presumed that the resin b can suppress the aggregation of the pigment, and as a result, the storage stability of the resin composition can be improved.

In addition, the resin composition of the present invention can suppress the aggregation of the pigment by the resin b, so the pigment has excellent dispersibility and can suppress the generation of coarse particles.

Furthermore, even when a pattern is formed by photolithography using the resin composition of the present invention, the generation of development residue can be suppressed. The reason why such an effect is obtained is presumed to be that since the resin b1 is strongly adhered to the surface of the pigment through hydrogen bonds, the emulsification of the pigment during development is improved, and the resin composition can be effectively developed to remove the unexposed portions. For this reason, the resin composition of the present invention can also suppress the generation of development residue.

The resin composition of the present invention can be preferably used as a resin composition for optical filters. Examples of the optical filter include a color filter, a near-infrared transmission filter, a near-infrared cutoff filter, and the like, and a color filter is preferred. Furthermore, the resin composition of the present invention can be suitably used as a solid-state imaging element. More specifically, it can be preferably used as a resin composition for an optical filter used in a solid-state imaging device, and more preferably as a resin composition for forming a colored pixel of a color filter used in a solid-state imaging device.

Examples of the color filter include a filter having colored pixels that transmit light of a specific wavelength. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels, with red pixels being more preferred. The colored pixels of the color filter can be formed using a resin composition containing a color material.

The maximum absorption wavelength of the near-infrared cutoff filter is preferably in the range of 700 to 1800 nm, more preferably in the range of 700 to 1300 nm, and still more preferably in the range of 700 to 1000 nm. In addition, the transmittance of the near-infrared cut filter in the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more. In addition, the transmittance at at least one location within the wavelength range of 700 to 1800 nm is preferably 20% or less. In addition, the ratio of the absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter to the absorbance A550 at the wavelength of 550 nm (absorbance Amax/absorbance A550) is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. More preferably, 100 to 400 is particularly preferred. The near-infrared cut filter can be formed using a resin composition containing a near-infrared absorbing color material.

The near-infrared transmission filter is a filter that transmits at least a part of near-infrared rays. The near-infrared transmission filter is preferably a filter that blocks at least part of visible light and transmits at least part of near-infrared rays. Preferable examples of the near-infrared transmission filter include those that have a maximum value of transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and at a wavelength of 400 to 640 nm. Filters with spectral characteristics such that the minimum value of transmittance in the range of 1100 to 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more). The near-infrared transmission filter is preferably a filter that satisfies the spectral characteristics of any one of the following (1) to (5). (1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 800 to 1500 nm A filter with a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more). (2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 900 to 1500 nm A filter with a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more). (3): The maximum value of the transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1000 to 1500 nm A filter with a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more). (4): The maximum value of the transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1100 to 1500 nm A filter with a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more). (5): The maximum value of the transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1200 to 1500 nm A filter with a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more).

The resin composition of the present invention can also be used for light-shielding films and the like.

The resin composition of the present invention preferably has a solid content concentration of 5 to 30% by mass. The lower limit is preferably 7.5% by mass or more, and more preferably 10% by mass or more. The upper limit is preferably 25 mass% or less, more preferably 20 mass% or less, and still more preferably 15 mass% or less.

Each component used in the resin composition of the present invention will be described below.

＜＜Color A＞＞ The resin composition of the present invention contains color material A (hereinafter referred to as color material). Examples of color materials include white color materials, black color materials, chromatic color materials, and near-infrared absorbing color materials. In addition, pigment derivatives can also be used as the color material. Furthermore, in the present invention, white color materials include not only pure white, but also light gray color materials that are close to white (such as off-white, light gray, etc.).

The color material contained in the resin composition of the present invention may contain a pigment. The pigment may be either an inorganic pigment or an organic pigment, but organic pigments are preferred from the viewpoints of the amount of color variation, ease of dispersion, and safety. Furthermore, the pigment preferably contains at least one selected from the group consisting of color pigments and near-infrared absorbing pigments, and more preferably contains a color pigment.

Furthermore, the color material is selected from the group consisting of phthalocyanine pigments, dimethacin pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, azo pigments, methimine pigments, diketopyrrolopyrrole pigments, and pyrrolopyrrole pigments. , at least one of the group consisting of isoindoline pigments and quinoline yellow pigments is preferred, including those selected from the group consisting of pyrrolopyrrole pigments, diketopyrrolopyrrole pigments, isoindoline pigments, and quinoline yellow pigments and azo pigments are more preferred, and include a group selected from the group consisting of pyrrolopyrrole pigments and diketopyrrolopyrrole pigments because the effect of the present invention is more significantly exhibited. Those having at least one of them are further preferred.

The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, and more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and still more preferably 100 nm or less. If the average primary particle diameter of the pigment is within the above range, the dispersion stability of the pigment in the resin composition will be good. In addition, in the present invention, the primary particle diameter of the pigment can be determined from the photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of the primary particles of the pigment is determined, and the equivalent circle diameter corresponding thereto is calculated as the primary particle diameter of the pigment. In addition, the average primary particle diameter in the present invention is the arithmetic average of the primary particle diameters of 400 primary particles of the pigment. In addition, the primary particles of the pigment refer to independent particles that are not agglomerated.

The crystallite size of organic pigments and pigment derivatives is preferably 0.1 to 50 nm, more preferably 0.5 to 30 nm, and further preferably 1 to 15 nm. The crystallite size can be determined from the half-value width of the peak of the diffraction angle using an X-ray diffractometer and calculated using Scherrer's formula. The crystallite size of organic pigments and pigment derivatives can be adjusted by known methods such as adjustment of production conditions and post-production pulverization.

The color material contained in the resin composition of the present invention preferably contains a pigment and a pigment derivative. Examples of pigment derivatives include compounds having a structure in which an acid group or a base is bonded to a pigment skeleton. Details of the pigment derivatives will be discussed later. The content of the pigment derivative is preferably 1 to 30 parts by mass, and further preferably 3 to 20 parts by mass relative to 100 parts by mass of the pigment. Only one type of pigment derivative may be used, or two or more types may be used in combination.

The color material contained in the resin composition of the present invention may further contain a dye. When a dye is included, the content of the dye is preferably 10 to 100 parts by mass relative to 100 parts by mass of the pigment. The upper limit is preferably 80 parts by mass or less, and more preferably 70 parts by mass or less. The lower limit is preferably 20 parts by mass or more, more preferably 30 parts by mass or more, and still more preferably 40 parts by mass or more. Only one type of dye may be used, or two or more types may be used in combination. Furthermore, it is also preferable that the coloring material contained in the resin composition of the present invention contains substantially no dye. According to this aspect, a film excellent in light resistance or heat resistance can be formed. Substantially no dye means that the content of the dye in the color material is 0.1% by mass or less, preferably 0.01% by mass or less, and more preferably no dye.

(color material) Examples of color materials include color materials having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. For example, yellow color materials, orange color materials, red color materials, green color materials, purple color materials, blue color materials, etc. can be cited. From the viewpoint of heat resistance, the color material is preferably a pigment (color pigment), more preferably a red pigment, a yellow pigment, and a blue pigment, and further preferably a red pigment and a blue pigment. Specific examples of color pigments include those shown below.

Examples of the red color material include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, formimine compounds, Kuchiyamaguchi star compounds, quinacridone compounds, perylene compounds, thioindigo compounds, and the like. , diketopyrrolopyrrole compounds, anthraquinone compounds, and azo compounds are preferred, and diketopyrrolopyrrole compounds are more preferred. Moreover, it is preferable that the red color material is a pigment.

Specific examples of red color materials include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41 , 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1 ,66,67,81:1,81:2,81:3,83,88,90,105,112,119,122,123,144,146,149,150,155,166,168,169,170 ,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246 , 254, 255, 264, 269, 270, 272, 279, 291, 294, 295, 296, 297 and other red pigments. In addition, as the red color material, diketopyrrolopyrrole compounds in which at least one bromine atom is substituted in the structure described in Japanese Patent Application Laid-Open No. 2017-201384 and those described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838 can also be used. Diketopyrrolopyrrole compound, diketopyrrolopyrrole compound described in International Publication No. 2012/102399, diketopyrrolopyrrole compound described in International Publication No. 2012/117965, Japanese Patent Application Laid-Open No. 2020-085947 The brominated diketopyrrolopyrrole compound described in Japanese Patent Application Laid-Open No. 2012-229344, the naphthol azo compound described in Japanese Patent Publication No. 6516119, the red color material described in Japanese Patent No. 6525101 Red color material, brominated diketopyrrolopyrrole compound described in paragraph 0229 of Japanese Patent Application Laid-Open No. 2020-090632, anthraquinone compound described in Korean Patent Publication No. 10-2019-0140741, Korean Patent Publication No. 10 - Anthraquinone compounds described in Japanese Patent Application Publication No. 2019-0140744, perylene compounds described in Japanese Patent Application Publication No. 2020-079396, diketopyrrolopyrrole compounds described in paragraphs 0025 to 0041 of Japanese Patent Application Publication No. 2020-066702, etc. . In addition, as the red color material, a compound having the following structure can also be used: an aromatic ring group in which a group bonded with an oxygen atom, a sulfur atom or a nitrogen atom is introduced into an aromatic ring, and a diketopyrrolopyrrole skeleton. bond.

As the red color material, C.I. Pigment Red 122, 177, 254, 255, 264, 269, and 272 are preferred, C.I. Pigment Red 254, 264, and 272 are more preferred, and C.I. Pigment Red 254 and 272 are further preferred.

Examples of green color materials include phthalocyanine compounds, squaraine compounds, and the like. Phthalocyanine compounds are preferred, and phthalocyanine pigments are more preferred. Furthermore, the green color material is preferably a pigment.

Specific examples of green color materials include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. In addition, as the green color material, it is also possible to use a halide zinc phthalocyanine pigment with an average number of halogen atoms in one molecule of 10 to 14, an average number of bromine atoms in one molecule of 8 to 12, and an average number of chlorine atoms in 2 to 5. . Specific examples include compounds described in International Publication No. 2015/118720. In addition, as the green color material, the compound described in Chinese Patent Application No. 106909027, the phthalocyanine compound having a phosphate ester as a ligand described in International Publication No. 2012/102395, and Japanese Patent Application Laid-Open No. 2019-008014 can also be used. Phthalocyanine compounds described in Japanese Patent Application Publication No. 2018-180023, phthalocyanine compounds described in Japanese Patent Application Publication No. 2019-038958, aluminum phthalocyanine compounds described in Japanese Patent Application Publication No. 2020-070426 Cyanine compounds, core-shell pigments described in Japanese Patent Application Laid-Open No. 2020-076995, etc.

As a green color material, C.I. Pigment Green 7, 36, 58, 62, and 63 are preferred, and C.I. Pigment Green 36 and 58 are even more preferred.

Specific examples of the orange color material include C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73 and other orange pigments.

Examples of the yellow color material include azo compounds, imine compounds, isoindoline compounds, pteridine compounds, quinoline compounds, and perylene compounds. Specific examples of yellow color materials include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc. Yellow pigment.

Moreover, as a yellow color material, the nickel azobarbiturate complex of the following structure can also be used. [Chemicalization 2]

In addition, as the yellow color material, the compounds described in Japanese Patent Application Laid-Open No. 2017-201003, the compounds described in Japanese Patent Application Laid-Open No. 2017-197719, and the compounds 0011 to 0062 and 0137 of Japanese Patent Application Laid-Open No. 2017-171912 can also be used. Compounds described in paragraphs 0276 to 0276, compounds described in paragraphs 0010 to 0062 and 0138 to 0295 of Japanese Patent Application Laid-Open No. 2017-171913, and compounds described in paragraphs 0011 to 0062 and 0139 to 0190 of Japanese Patent Application Laid-Open No. 2017-171914. Compounds, compounds described in paragraphs 0010 to 0065 and 0142 to 0222 of Japanese Patent Application Publication No. 2017-171915, quinoline compounds described in paragraphs 0011 to 0034 of Japanese Patent Application Publication No. 2013-054339, Japanese Patent Application Publication No. 2014- Quinoline yellow compounds described in paragraphs 0013 to 0058 of Publication No. 026228, isoindoline compounds described in Japanese Patent Application Laid-Open No. 2018-062644, quinoline yellow compounds described in Japanese Patent Application Laid-Open No. 2018-203798, Japan Quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2018-062578, quinophthaline compounds described in Japanese Patent Application Publication No. 6432076, quinophthaline compounds described in Japanese Patent Application Publication No. 2018-155881, Japanese Patent Application Laid-Open No. 2018- Quinophthalone compounds described in Japanese Patent Application Laid-Open No. 111757, quinophthalene compounds described in Japanese Patent Application Laid-Open No. 2018-040835, quinophthaline compounds described in Japanese Patent Application Laid-Open No. 2017-197640, Japanese Patent Application Laid-Open No. 2016-145282 The quinophthalone compound described in the publication, the quinophthalone compound described in the Japanese Patent Application Laid-Open No. 2014-085565, the quinophthalone compound described in the Japanese Patent Application Laid-Open No. 2014-021139, the quinophthalone compound described in the Japanese Patent Application Laid-Open No. 2013-209614 The quinophthalone compound described in Japanese Patent Application Laid-Open No. 2013-209435, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 2013-181015, and the quinophthaline compound described in Japanese Patent Application Laid-Open No. 2013-061622 Quinophthalone compound, quinoline compound described in Japanese Patent Application Laid-Open No. 2013-032486, quinophthalate compound described in Japanese Patent Application Laid-Open No. 2012-226110, quinoline described in Japanese Patent Application Laid-Open No. 2008-074987 Yellow compound, quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-081565, quinophthalate compound described in Japanese Patent Application Laid-Open No. 2008-074986, quinophthaline compound described in Japanese Patent Application Laid-Open No. 2008-074985 , the quinoline yellow compound described in Japanese Patent Publication No. 2008-050420, the quinoline yellow compound described in Japanese Patent Publication No. 2008-031281, the quinoline yellow compound described in Japanese Patent Publication No. 48-032765, Japan Quinophthalone compounds described in Japanese Patent Application Publication No. 2019-008014, quinophthalone compounds described in Japanese Patent Application Publication No. 6607427, methine dyes described in Japanese Patent Application Publication No. 2019-073695, Japanese Patent Application Publication No. 2019- The methine dye described in Japanese Patent Application Publication No. 073696, the methine dye described in Japanese Patent Application Publication No. 2019-073697, the methine dye described in Japanese Patent Application Publication No. 2019-073698, Korean Patent Publication No. 10-2014 - Compounds described in Japanese Patent Application Publication No. 0034963, compounds described in Japanese Patent Application Publication No. 2017-095706, compounds described in Taiwan Patent Application Publication No. 201920495, compounds described in Japanese Patent Application Publication No. 6607427, Japanese Patent Application Publication No. 2020 Compounds described in Japanese Patent Application Publication No. -033525, compounds described in Japanese Patent Application Publication No. 2020-033524, compounds described in Japanese Patent Application Publication No. 2020-033523, compounds described in Japanese Patent Application Publication No. 2020-033522, Japanese Patent Application Laid-Open No. 2020-033522 Compounds described in Japanese Patent Application Publication No. 2020-033521, compounds described in International Publication No. 2020/045200, compounds described in International Publication No. 2020/045199, compounds described in International Publication No. 2020/045197, Japanese Patent Application Laid-Open No. Azo compounds described in Japanese Patent Application Publication No. 2020-093994, perylene compounds described in Japanese Patent Application Publication No. 2020-083982, perylene compounds described in International Publication No. 2020/105346, Japanese Patent Application Publication No. 2020-517791 A quinoline yellow compound, a compound represented by the following formula (QP1), and a compound represented by the following formula (QP2). In addition, from the viewpoint of improving the color value, those in which these compounds are polymerized can also be preferably used. [Chemical 3]

In the formula (QP1), X ¹ to X ¹⁶ each independently represent a hydrogen atom or a halogen atom, and Z ¹ represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by formula (QP1) include the compound described in paragraph 0016 of Japanese Patent No. 6443711. [Chemical 4]

In formula (QP2), Y ¹ to Y ³ each independently represent a halogen atom. n and m represent an integer from 0 to 6, and p represents an integer from 0 to 5. (n+m) is 1 or more. Specific examples of the compound represented by formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

Specific examples of the purple color material include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

Specific examples of the blue color material include C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88 and other blue pigments. Furthermore, as the blue color material, an aluminum phthalocyanine compound having a phosphorus atom can also be used. Specific examples include compounds described in paragraphs 0022 to 0030 of Japanese Patent Application Laid-Open No. 2012-247591 and paragraph 0047 of Japanese Patent Application Laid-Open No. 2011-157478.

In addition, the diarylmethane compound described in Japanese Patent Publication No. 2020-504758 can also be used as the green color material or the blue color material.

Regarding the preferred diffraction angles of various pigments, please refer to Japanese Patent No. 6561862, Japanese Patent No. 6413872, Japanese Patent No. 6281345, Japanese Patent Publication No. 2020-026503, and Japanese Patent Publication No. 2020-033526. records, these contents are incorporated into this manual. In addition, as the pyrrolopyrrole pigment, it is better to use one whose crystallite size is 140 Å or less in the direction of the plane corresponding to the maximum peak in the X-ray diffraction pattern among the eight planes of the lattice (±1±1±1). good. In addition, the physical properties of the pyrrolopyrrole pigment are preferably as described in paragraphs 0028 to 0073 of Japanese Patent Application Laid-Open No. 2020-097744.

Furthermore, as a pigment, from the viewpoint of improving spectral characteristics, it is also preferable to use a halide zinc phthalocyanine pigment having a Raman spectrum described in Japanese Patent No. 6744002. Furthermore, as the pigment, from the viewpoint of viscosity adjustment, it is also preferable to use the pigment with a controlled contact angle described in International Publication No. 2019/107166.

Dyes can also be used for colored materials. The dye is not particularly limited, and known dyes can be used. Examples include pyrazole azo series, anilinoazo series, triarylmethane series, anthraquinone series, anthrapyridone series, benzylidene series, oxocyanine series, pyrazotriazole azo series, Pyridone azo series, cyanine series, thiophene series, pyrrolopyrazole azomethine series, Kouyamaguchi galaxy, phthalocyanine series, benzopyran series, indigo series, pyrrromethylene series and other dyes .

Pigment polymers can also be used as color materials. It is preferable that the dye polymer is dissolved in a solvent and used. In addition, the dye multimer may form particles. When the pigment polymer is in the form of particles, it is usually used in a state of being dispersed in a solvent. The dye multimer in a particle state can be obtained by, for example, emulsion polymerization. Specific examples include the compound and the production method described in Japanese Patent Application Laid-Open No. 2015-214682. The pigment multimer has two or more pigment structures in one molecule, preferably three or more pigment structures. The upper limit is not particularly limited, but it can also be set to 100 or less. The plurality of pigment structures in one molecule may be the same pigment structure or may be different pigment structures. The weight average molecular weight (Mw) of the dye multimer is preferably 2,000 to 50,000. It is more preferable that the lower limit is 3,000 or more, and it is further more preferable that it is 6,000 or more. It is more preferable that the upper limit is 30,000 or less, and it is further more preferable that it is 20,000 or less. The dye multimer can also be used as Japanese Patent Application Laid-Open Nos. 2011-213925, 2013-041097, 2015-028144, 2015-030742, and International Publication No. 2016/031442. Compounds described in etc.

In addition, as the color material, the triarylmethane dye polymer described in Korean Patent Publication No. 10-2020-0028160, the Yamaguchi star compound described in Japanese Patent Publication No. 2020-117638, and the International Publication No. 2020 can be used. Phthalocyanine compounds described in /174991, isoindoline compounds described in Japanese Patent Application Laid-Open No. 2020-160279 or their salts, and represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069442 The compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069730, the compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069070, Korean Patent Publication No. 10 -The compound represented by Formula 1 described in Publication No. 2020-0069067, the compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069062, the halide zinc phthalocyanine pigment described in Japanese Patent No. 6809649 , the isoindoline compound described in Japanese Patent Application Laid-Open No. 2020-180176. The color material can be a rotaxane, and the pigment skeleton can be used for the ring structure of the rotaxane, the rod-shaped structure, or both structures.

Two or more color materials can be used in combination. Moreover, when two or more kinds of color color materials are used in combination, black can be formed by the combination of two or more kinds of color color materials. Examples of such combinations include the following aspects (1) to (7). When the resin composition contains two or more color materials and the combination of the two or more color materials produces black, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. . (1) Containing red color materials and blue color materials. (2) Containing red color materials, blue color materials and yellow color materials. (3) Containing red color materials, blue color materials, yellow color materials and purple color materials. (4) Containing red color materials, blue color materials, yellow color materials, purple color materials and green color materials. (5) Containing red color materials, blue color materials, yellow color materials and green color materials. (6) Containing red color materials, blue color materials and green color materials. (7) Containing yellow color materials and purple color materials.

(white color material) Examples of the white color material include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silicon dioxide, talc, mica, aluminum hydroxide, calcium silicate, Inorganic pigments (white pigments) such as aluminum silicate, hollow resin particles, and zinc sulfide. It is preferred that the white pigment is particles containing titanium atoms, and titanium oxide is even more preferred. Moreover, it is preferable that the white pigment is a particle whose refractive index with respect to light with a wavelength of 589 nm is 2.10 or more. The aforementioned refractive index is preferably 2.10 to 3.00, and more preferably 2.50 to 2.75.

In addition, as the white pigment, titanium oxide described in "Titanium Oxide: Physical Properties and Application Technology, Kiyono Gakusho, pp. 13 to 45, issued on June 25, 1991, published by GIHIDO SHUPPAN CO., Ltd." can also be used.

The white pigment may not only be composed of a single inorganic substance, but may also be composed of particles compounded with other materials. For example, particles with pores or other materials inside, particles with a plurality of inorganic particles attached to the core particles, and core-shell composites including core particles composed of polymer particles and shells composed of inorganic nanoparticles are used. Particles are better. As the core-shell composite particles including core particles composed of polymer particles and shell layers composed of inorganic nanoparticles, for example, the description in paragraphs 0012 to 0042 of Japanese Patent Application Laid-Open No. 2015-047520 can be referred to. are incorporated into this manual.

White pigments can also use hollow inorganic particles. Hollow inorganic particles refer to inorganic particles that have a hollow structure inside and are surrounded by a shell. Examples of hollow inorganic particles include hollow inorganic particles described in Japanese Patent Application Laid-Open No. 2011-075786, International Publication No. 2013/061621, Japanese Patent Application Publication No. 2015-164881, etc., and these contents are incorporated in this description.

(black color material) The black color material is not particularly limited, and known ones can be used. For example, examples of inorganic black color materials include inorganic pigments (black pigments) such as carbon black, titanium black, and graphite. Carbon black and titanium black are preferred, and titanium black is more preferred. Titanium black refers to black particles containing titanium atoms, preferably low-order titanium oxide or titanium oxynitride. The surface of titanium black can be modified if necessary for the purpose of improving dispersibility, inhibiting aggregation, etc. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide or zirconium oxide. Furthermore, it can also be treated with a water-repellent substance as shown in Japanese Patent Application Laid-Open No. 2007-302836. Examples of black pigments include C.I. Pigment Black 1, 7, and the like. It is preferable that each particle of titanium black has a small primary particle size and an average primary particle size. Specifically, the average primary particle diameter is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silicon dioxide particles, and the content ratio of Si atoms to Ti atoms in the dispersion is adjusted to a range of 0.20 to 0.50. Regarding the above-mentioned dispersion, please refer to the description in paragraphs 0020 to 0105 of Japanese Patent Application Laid-Open No. 2012-169556, and this content is incorporated into this specification. Examples of commercially available titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R-N, and 13M-T (trade name: Mitsubishi Materials Corporation), Tilack D (trade name: Mitsubishi Materials Corporation) Manufactured by Ako Kasei Co., Ltd.), etc.

Examples of the organic black color material include bisbenzofuranone compounds, methine azo compounds, perylene compounds, and azo compounds. Examples of the dibenzofuranone compound include compounds described in Japanese Patent Application Publication No. 2010-534726, Japanese Patent Application Publication No. 2012-515233, Japanese Patent Application Publication No. 2012-515234, and the like. For example, it can be used as a dibenzofuranone compound manufactured by BASF Corporation. "Irgaphor Black" obtained. Examples of the perylene compound include the compounds described in paragraphs 0016 to 0020 of Japanese Patent Application Laid-Open No. 2017-226821, C.I. Pigment Black 31, 32, and the like. Examples of the azomethine compound include compounds described in Japanese Patent Application Laid-Open No. 01-170601, Japanese Patent Application Laid-Open No. 02-034664, and the like. For example, the azomethine compound can be manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd. "CHROMO FINE BLACK A1103" was obtained.

The color material used in the resin composition of the present invention may only be the above-mentioned black color material, or may further include a color color material. According to this aspect, it is easy to obtain a resin composition capable of forming a film with excellent light-shielding properties in the visible region. When a black color material and a color color material are used together as a color material, the mass ratio of the two is black color material: color color material = 100:10 to 300 is preferred, and 100:20 to 200 is even more preferred.

Preferable combinations of black color materials and color color materials include the following, for example. (A-1) Contains organic black color materials and blue color materials. (A-2) Contains organic black color materials, blue color materials, and yellow color materials. (A-3) Containing organic black color materials, blue color materials, yellow color materials and red color materials. (A-4) Containing organic black color materials, blue color materials, yellow color materials and purple color materials.

In the aspect (A-1) above, the mass ratio of the organic black color material to the blue color material is organic black color material: blue color material = 100:1~70 is preferred, and 100:5~60 is more preferred. , 100:10～50 is further preferred. In the above aspect (A-2), the mass ratio of the organic black color material, blue color material and yellow color material is organic black color material: blue color material: yellow color material = 100:10～90:10～90 It is preferable, 100:15～85:15～80 is more preferable, and 100:20～80:20～70 is still more preferable. In the aspect (A-3) above, the mass ratio of the organic black color material, blue color material, yellow color material and red color material is organic black color material: blue color material: yellow color material: red color material = 100 :20～150:1～60: 10～100 is more preferable, 100:30～130:5～50:20～90 is more preferable, 100:40～120:10～40:30～80 is still more preferable . In the aspect (A-4) above, the mass ratio of the organic black color material, blue color material, yellow color material and purple color material is organic black color material: blue color material: yellow color material: purple color material = 100 :20～150:1～60: 10～100 is more preferable, 100:30～130:5～50:20～90 is more preferable, 100:40～120:10～40:30～80 is still more preferable .

(Near-infrared absorbing color material) The near-infrared absorbing color material is preferably a compound that has a maximum absorption wavelength on the longer wavelength side than the wavelength of 700 nm. The infrared absorber is preferably a compound that has a maximum absorption wavelength in the range between 700 nm and 1800 nm, and a compound that has a maximum absorption wavelength in a range between 700 nm and 1400 nm is more preferred. Compounds having a maximum absorption wavelength in the following ranges are more preferred, and compounds having a maximum absorption wavelength in a range exceeding 700 nm to 1000 nm are particularly preferred. Moreover, the ratio A ¹ /A ² of the absorbance A ¹ at a wavelength of 500 nm and the absorbance A ² at the maximum absorption wavelength of the near-infrared absorbing color material is preferably 0.08 or less, and more preferably 0.04 or less. Furthermore, the near-infrared absorbing color material is preferably a pigment, and more preferably an organic pigment.

Examples of the near-infrared absorbing color material include pyrrolopyrrole compounds, cyanine compounds, squaraine compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, and quinonium compounds. Compounds, oxocyanine compounds, immonium compounds, dithiol compounds, triarylmethane compounds, pyrrromethylene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, disulfene metal azines compounds, metal oxides, metal borides, etc. Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of Japanese Patent Application Laid-Open No. 2009-263614, compounds described in paragraphs 0037 to 0052 of Japanese Patent Application Laid-Open No. 2011-068731, and International Publication No. 2015/ Compounds described in paragraphs 0010 to 0033 of No. 166873, etc. Examples of the squaraine compound include compounds described in paragraphs 0044 to 0049 of Japanese Patent Publication No. 2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent Publication No. 6065169, and International Publication No. 2016/181987. Compounds described in paragraph 0040 of Japanese Patent Application Laid-Open No. 2015-176046, compounds described in paragraph 0072 of International Publication No. 2016/190162, compounds described in paragraphs 0196 to 0228 of Japanese Patent Application Laid-Open No. 2016-074649 Compounds described, compounds described in paragraph 0124 of Japanese Patent Application Laid-Open No. 2017-067963, compounds described in International Publication No. 2017/135359, compounds described in Japanese Patent Application Publication No. 2017-114956, Japanese Patent Application No. 6197940 Compounds described in, Compounds described in International Publication No. 2016/120166, etc. Examples of cyanine compounds include compounds described in paragraphs 0044 to 0045 of Japanese Patent Application Laid-Open No. 2009-108267, compounds described in paragraphs 0026 to 0030 of Japanese Patent Application Publication No. 2002-194040, and compounds described in Japanese Patent Application Laid-Open No. 2015-172004. Compounds described in Japanese Patent Application Publication No. 2015-172102, Compounds described in Japanese Patent Application Publication No. 2008-088426, Compounds described in Paragraph 0090 of International Publication No. 2016/190162, Japanese Patent Application Publication No. 2016/190162 Compounds etc. described in the publication No. 2017-031394. Examples of the crotonium compound include compounds described in Japanese Patent Application Laid-Open No. 2017-082029. Examples of the immonium compound include compounds described in Japanese Patent Application Publication No. 2008-528706, compounds described in Japanese Patent Application Publication No. 2012-012399, compounds described in Japanese Patent Application Publication No. 2007-092060, and International Publications. Compounds described in paragraphs 0048 to 0063 of No. 2018/043564. Examples of the phthalocyanine compound include the compound described in paragraph 0093 of Japanese Patent Application Laid-Open No. 2012-077153, titanyl phthalocyanine described in Japanese Patent Application Laid-Open No. 2006-343631, and 0013 of Japanese Patent Application Laid-Open No. 2013-195480. Compounds described in paragraphs ～0029, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, vanadium phthalocyanine compounds described in International Publication No. 2020/071486, phthalocyanine compounds described in International Publication No. 2020/071470 . Examples of the naphthalocyanine compound include compounds described in paragraph 0093 of Japanese Patent Application Laid-Open No. 2012-077153. Examples of the disulfene metal complex include compounds described in Japanese Patent No. 5733804. Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, tungsten oxide, and the like. For details about tungsten oxide, you can refer to paragraph 0080 of Japanese Patent Application Laid-Open No. 2016-006476, and this content is incorporated into this specification. Examples of metal borides include lanthanum boride and the like. Examples of commercially available lanthanum boride include LaB ₆ -F (manufactured by Japan New Metals Co., Ltd.). In addition, as the metal boride, the compound described in International Publication No. 2017/119394 can also be used. Examples of commercially available products of indium tin oxide include F-ITO (manufactured by DOWA HIGHTECH CO., LTD.).

In addition, as the near-infrared absorbing color material, the squarylium compound described in Japanese Patent Application Laid-Open No. 2017-197437, the squarylium compound described in Japanese Patent Application Laid-Open No. 2017-025311, and International Publication No. 2016/154782 can also be used. Squarylium compounds described in Japanese Patent No. 5884953, squarylyanine compounds described in Japanese Patent No. 6036689, squarylyanine compounds described in Japanese Patent No. 5810604 , the squaraine compound described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the pyrrole ring-containing compound described in paragraphs 0019 to 0075 of Japanese Patent Application Laid-Open No. 2018-054760, and the pyrrole ring-containing compound described in Japanese Patent Application Publication No. 2018-040955 The pyrrole ring-containing compound described in paragraphs 0078 to 0082 of Japanese Patent Application Laid-Open No. 2018-002773, the pyrrole ring-containing compound described in paragraphs 0043 to 0069 of Japanese Patent Application Laid-Open No. 2018-041047, and the pyrrole ring-containing compound described in paragraphs 0024 to 0086 of Japanese Patent Application Laid-Open No. 2018-041047 Squarylium compounds having an aromatic ring at the amide α position, amide-linked squarylyanine compounds described in Japanese Patent Application Laid-Open No. 2017-179131, and squarylium compounds having a pyrrole bi-type described in Japanese Patent Application Laid-Open No. 2017-141215 Compounds with cyanine skeleton or ketonium skeleton, dihydrocarbazole bisquaryl cyanine compounds described in Japanese Patent Application Laid-Open No. 2017-082029, and other compounds described in paragraphs 0027 to 0114 of Japanese Patent Application Laid-Open No. 2017-068120 Symmetrical compound, pyrrole ring-containing compound (carbazole type) described in Japanese Patent Application Laid-Open No. 2017-067963, phthalocyanine compound described in Japanese Patent Application Publication No. 6251530, formula described in Japanese Patent Application Publication No. 2020-075959 Acid cyanine compounds, copper complex compounds described in Korean Patent Publication No. 10-2019-0135217, etc.

(pigment derivatives) In the present invention, pigment derivatives can also be used as the color material. In the present invention, it is preferable to use a pigment and a pigment derivative in combination. Examples of pigment derivatives include compounds having a structure in which an acid group or a base is bonded to a pigment skeleton.

Examples of the pigment skeleton constituting the pigment derivative include quinoline pigment skeleton, benzimidazolone pigment skeleton, benzoisoindole pigment skeleton, benzothiazole pigment skeleton, imine pigment skeleton, and squaraine pigment Skeleton, ketonium pigment skeleton, oxocyanine pigment skeleton, pyrrolopyrrole pigment skeleton, diketopyrrolopyrrole pigment skeleton, azo pigment skeleton, methimine pigment skeleton, phthalocyanine pigment skeleton, naphthalocyanine pigment skeleton, Anthraquinone pigment skeleton, quinacridone pigment skeleton, di㗁𠯤 pigment skeleton, purpurone pigment skeleton, perylene pigment skeleton, thioindigo pigment skeleton, isoindoline pigment skeleton, isoindolinone pigment skeleton, quinoline Yellow pigment skeleton, dithiol pigment skeleton, triarylmethane pigment skeleton, pyrromethane pigment skeleton, etc.

Examples of the acid group include a carboxyl group, a sulfo group, a phosphoric acid group, a boric acid group, a carboxylic acid amide group, a sulfonamide group, a amide acid group, and salts thereof. Examples of atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ^{+ ,} etc.), alkaline earth metal ions (Ca ²⁺ , Mg ^{2+ ,} etc.), ammonium ions, imidazolium ions, and pyridinium ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR ^X1 is preferred. As the sulfonamide group, a group represented by -NHSO ₂ R ^X2 is preferred. As the amide acid group, a group represented by -SO ₂ NHSO ₂ R ^X3 , -CONHSO ₂ R ^X4 , -CONHCOR ^X5 or -SO ₂ NHCOR ^X6 is preferred, and -SO ₂ NHSO ₂ ^R R ^X1 to R ^X6 each independently represent an alkyl group or an aryl group. The alkyl group and aryl group represented by R ^X1 to R ^X6 may have a substituent. As the substituent, a halogen atom is preferred, and a fluorine atom is more preferred.

Examples of the base include an amino group, a pyridyl group and a salt thereof, a salt of an ammonium group, and a phthalimide methyl group. Examples of atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonic acid ions, phenoxide ions, and the like.

Specific examples of the pigment derivatives include compounds described in the examples described below, compounds described in Japanese Patent Application Laid-Open No. Sho 56-118462, compounds described in Japanese Patent Application Laid-Open No. Sho 63-264674, and Japanese Patent Application Laid-Open No. Sho 63-264674. Compounds described in Japanese Patent Application Publication No. 01-217077, compounds described in Japanese Patent Application Publication No. 03-009961, compounds described in Japanese Patent Application Publication No. 03-026767, compounds described in Japanese Patent Application Publication No. 03-153780, Compounds described in Japanese Patent Application Publication No. 03-045662, compounds described in Japanese Patent Application Publication No. 04-285669, compounds described in Japanese Patent Application Publication No. 06-145546, compounds described in Japanese Patent Application Publication No. 06-212088 Compounds, compounds described in Japanese Patent Application Publication No. 06-240158, compounds described in Japanese Patent Application Publication No. 10-030063, compounds described in Japanese Patent Application Publication No. 10-195326, 0086 of International Publication No. 2011/024896 Compounds described in paragraphs 0098 to 0098, compounds described in paragraphs 0063 to 0094 of International Publication No. 2012/102399, compounds described in paragraph 0082 of International Publication No. 2017/038252, and 0171 of Japanese Patent Application Publication No. 2015-151530 Compounds described in paragraphs, compounds described in paragraphs 0162 to 0183 of Japanese Patent Application Publication No. 2011-252065, compounds described in Japanese Patent Application Publication No. 2003-081972, compounds described in Japanese Patent Application Publication No. 5299151, compounds described in Japanese Patent Application Publication No. 5299151, Compounds described in Japanese Patent Application Publication No. 2015-172732, compounds described in Japanese Patent Application Publication No. 2014-199308, compounds described in Japanese Patent Application Publication No. 2014-085562, compounds described in Japanese Patent Application Publication No. 2014-035351, Compounds described in Japanese Patent Application Laid-Open No. 2008-081565, compounds described in Japanese Patent Application Laid-Open No. 2019-109512, compounds described in Japanese Patent Application Laid-Open No. 2019-133154, compounds described in International Publication No. 2020/002106 A diketopyrrolopyrrole compound with a thiol linkage group, a benzimidazolone compound described in Japanese Patent Application Laid-Open No. 2018-168244, or a salt thereof, etc.

The content of the color material in the total solid content of the resin composition is 50 mass% or more, preferably 55 mass% or more, more preferably 60 mass% or more, and still more preferably 65 mass% or more. The upper limit is preferably 80 mass% or less, more preferably 77.5 mass% or less, and still more preferably 75 mass% or less.

The content of the pigment in the total solid content of the resin composition is preferably 30% by mass or more, more preferably 45% by mass or more, and still more preferably 55% by mass or more. The upper limit is preferably 80 mass% or less, more preferably 77.5 mass% or less, and still more preferably 75 mass% or less. According to the resin composition of the present invention, even when the pigment content is high, the storage stability is excellent. Therefore, when the pigment content is high, the effects of the present invention are more significantly exhibited.

The content of the pigment in the color material is preferably 20 to 100% by mass, more preferably 50 to 100% by mass, and further preferably 70 to 100% by mass. Moreover, the total content of the pigment and the pigment derivative in the color material is preferably 25 to 100 mass %, more preferably 55 to 100 mass %, and still more preferably 75 to 100 mass %.

＜＜Resin B＞＞ The resin composition of the present invention contains resin B (hereinafter referred to as resin). For example, the resin is blended for the purpose of dispersing pigments in a resin composition and the purpose of a binder. In addition, resins mainly used to disperse pigments and the like in resin compositions are also called dispersants. However, this use of the resin is an example, and the resin can be used for purposes other than such uses.

(specific resin) The resin contained in the resin composition of the present invention includes a resin b (hereinafter, also referred to as a specific resin) having a repeating unit b1 containing at least one selected from the group consisting of a urea group and a urethane group. group. Specific resins will be described below.

[repeating unit b1] The specific resin contains a repeating unit b1 (hereinafter also referred to as repeating unit b1) containing at least one group selected from a urea group and a urethane group. It is preferred that the repeating unit b1 is a repeating unit containing a urea group.

The repeating unit b1 is preferably a repeating unit represented by formula (b1-1). [Chemistry 5]

In the formula (b1-1 ⁾ , R ¹ represents a hydrogen ^atom or an alkyl group, X ¹ represents a divalent linking group, Ring group or group represented by formula (R-101); -L ¹⁰¹ - (R ¹⁰¹ -O) _n1 -R ¹⁰² ･･････(R-101) In formula (R-101), L ¹⁰¹ represents a single bond or a bivalent connecting group, R ¹⁰¹ represents an alkylene group, R ¹⁰² represents a hydrogen atom or an alkyl group, and n1 represents an integer of 2 to 45.

The number of carbon atoms in the alkyl group represented by R ¹ is preferably 1 to 10, more preferably 1 to 3, and 1 is even more preferably. R ¹ is preferably a hydrogen atom or a methyl group.

Examples of the divalent linking group represented by X ¹ include hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, and combinations thereof A group consisting of 2 or more of these. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The carbon number of the hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 12. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxyl group, a halogen atom, and the like. The divalent linking group represented by X ¹ is -COO-CH ₂ -CH ₂ -, -COO-CH ₂ -CH ₂ -O-CH ₂ -CH ₂ -, -C ₆ H ₄ - or -C ₆ H ₄ -CH ₂ - is preferred.

X ² represents -O- or -NH-, and -NH- is preferred.

The carbon number of the aliphatic hydrocarbon group represented by R ² is 1 or more, and 3 or more is preferred because the pigment adsorption property is further improved through hydrophobic interaction and the storage stability of the resin composition can be further improved. 5 or more is preferred. Above is better, and above 8 is even better. The upper limit is preferably 30 or less, more preferably 20 or less, and still more preferably 15 or less. The aliphatic hydrocarbon group may be linear, branched, or cyclic. However, since the storage stability of the resin composition can be further improved, a linear or branched chain is preferred, and a straight chain is more preferred. Examples of aliphatic hydrocarbon groups include alkyl groups, alkenyl groups, alkynyl groups, and the like. The aliphatic hydrocarbon group may have a substituent. Examples of the substituent include substituent T described below. In addition, it is also preferable that the aliphatic hydrocarbon group has no substituent.

The aromatic hydrocarbon group and aromatic heterocyclic group represented by R ² may be monocyclic or polycyclic. The hetero atom constituting the ring of the aromatic heterocyclic group preferably contains at least one selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom, and more preferably contains a nitrogen atom. The number of heteroatoms in the ring constituting the aromatic heterocyclic group is preferably 1 to 4, more preferably 1 to 3, and still more preferably 1 or 2. When the aromatic hydrocarbon group represented by R ² is polycyclic, the number of ring structures contained in the aromatic hydrocarbon group is preferably 2 to 10. The upper limit is preferably 8 or less, and even more preferably 5 or less. In order to further improve the storage stability of the resin composition, the lower limit is preferably 3 or more, and more preferably 4 or more. When the aromatic heterocyclic group represented by R ² is polycyclic, the number of ring structures contained in the aromatic heterocyclic group is preferably 2 to 10. The upper limit is preferably 8 or less, and even more preferably 5 or less. In order to further improve the storage stability of the resin composition, the lower limit is preferably 3 or more, and more preferably 4 or more. The aromatic hydrocarbon group and aromatic heterocyclic group represented by R ² may have a substituent. Examples of the substituent include the substituent T described below, and an electron withdrawing group or an electron withdrawing group is preferred. Here, the electron-withdrawing group refers to a substituent that can more easily attract electrons to the bonded atom than a hydrogen atom, and the electron-pushing group refers to a substituent that can more easily donate electrons to the bonded atom than a hydrogen atom. The substituent on the side of the atom. Specific examples of the electron withdrawing group include a halogen atom, a halogenated alkyl group, an alkoxycarbonyl group, a cyano group, a nitro group, a carboxyl group, a sulfonyl group, and the like, with a cyano group, a halogen atom, and a halogenated alkyl group being preferred. Specific examples of the electron-donating group include an alkyl group, an alkoxy group, a hydroxyl group, an amino group, and the like, with an alkoxy group, a hydroxyl group, or an amino group being preferred.

When the aromatic hydrocarbon group represented by R ² is polycyclic or the aromatic heterocyclic group represented by R ² is polycyclic, the pigment adsorption property can be further improved through π-π interaction, thereby further improving the resin composition. storage stability. When the aromatic hydrocarbon group represented by R ² has an electron-withdrawing group or an electron-donating group as a substituent, the electronic state of the urea group or urethane group can be changed to further improve the pigment adsorption property, thereby enabling Further improve the storage stability of the resin composition. When the aromatic heterocyclic group represented by R ² is a monocyclic ring, the electronic state of the urea group or urethane group can be changed to further improve the pigment adsorption property, thereby further improving the storage stability of the resin composition. sex.

When the aromatic hydrocarbon group represented by R ² is a monocyclic ring, it is preferred to have an electron-withdrawing group or an electron-donating group as a substituent. When the aromatic hydrocarbon group represented by R ² is polycyclic, it may or may not have a substituent. The aromatic heterocyclic group represented by R ² may or may not have a substituent.

L ¹⁰¹ in the formula (R-101) represented by R ² represents a single bond or a divalent linking group. Examples of the divalent linking group include a hydrocarbon group, a group in which two or more hydrocarbon groups are bonded via a single bond or a divalent linking group, and the like. Examples of the bivalent linking group that binds the hydrocarbon groups include -O-, -CO-, -COO-, -OCO-, -NH-, -NHCO-, -CONH-, -SO-, -SO ₂ - and -S-et al. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The carbon number of the hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 12. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxyl group, a halogen atom, and the like.

R ¹⁰¹ in the formula (R-101) represented by R ² represents an alkylene group. The number of carbon atoms in the alkylene group represented by R ¹⁰¹ is preferably 1 to 5, more preferably 1 to 3, and further preferably 2 or 3. The alkylene group represented by R ¹⁰¹ is preferably linear or branched.

R ¹⁰² in the formula (R-101) represented by R ² represents a hydrogen atom or an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 30, and further preferably 1 to 20. The alkyl group is preferably straight chain or branched chain. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and the like. The alkyl group is preferably an unsubstituted alkyl group.

n1 in the formula (R-101) represented by R ² represents an integer from 2 to 45. The lower limit of n1 is preferably 4 or more, more preferably 6 or more, and still more preferably 9 or more. The upper limit is preferably 40 or less, more preferably 30 or less, and still more preferably 23 or less.

When R ² is a group represented by formula (R-101), the storage stability of the resin composition can be further improved.

The repeating unit b1 is preferably a repeating unit represented by formula (b1-2). [Chemical 6]

In the formula ^{(b1-2), R 11 represents a} hydrogen atom or an alkyl group, A monocyclic aromatic hydrocarbon group with an electron-donating group as a substituent, a monocyclic aromatic heterocyclic group that may have an electron-withdrawing group or an electron-donating group as a substituent, or the above represented by the formula (R-101) group.

The meanings of R ¹¹ and X ¹¹ in the formula (b1-2) are the same as the meanings of R ¹ and X ¹ in the formula (b1-1).

The polycyclic aromatic ring group represented by R ¹² in formula (b1-2) may be a polycyclic aromatic hydrocarbon group or a polycyclic aromatic heterocyclic group. In order to further improve the storage stability of the resin composition, polycyclic aromatic hydrocarbon groups are preferred. The number of ring structures contained in the polycyclic aromatic ring group is preferably 2 to 10. The upper limit is preferably 8 or less, and even more preferably 5 or less. In order to further improve the storage stability of the resin composition, the lower limit is preferably 3 or more, and more preferably 4 or more. Specific examples of the polycyclic aromatic ring group include naphthyl ring group, anthracene ring group, acenaphthylene ring group, vinyl naphthyl ring group, pyrenyl ring group, phenanthrenyl ring group, fluorenyl ring group, pyrene ring group, quinone ring group Phenoline ring base, isoquinoline ring base, quinoline ring base, fused pentaphenyl ring base, benzopyrene ring base, terzoline base, terphenylene ring base, corannulene ring base, coronene base , ovalene ring group, etc. The polycyclic aromatic ring group may or may not have a substituent. Examples of the substituent include substituent T described below. Substituents may be electron-withdrawing groups or electron-donating groups.

The number of carbon atoms in the aliphatic hydrocarbon group represented by R ¹² in formula (b1-2) is preferably 30 or less, more preferably 20 or less, and still more preferably 15 or less. The above-mentioned aliphatic hydrocarbon group may be linear, branched, or cyclic. However, since the storage stability of the resin composition can be further improved, linear or branched chains are preferred, and straight chains are more preferred. . Examples of the aliphatic hydrocarbon group include an alkyl group, an alkenyl group, an alkynyl group, and the like. An alkyl group is preferred, and a linear alkyl group is more preferred. The aliphatic hydrocarbon group may or may not have a substituent. Examples of the substituent include substituent T described below. Substituents may be electron-withdrawing groups or electron-donating groups.

Examples of the monocyclic aromatic hydrocarbon group represented by R ¹² in formula (b1-2) include a benzene ring group. The ring heteroatom constituting the above-mentioned monocyclic aromatic heterocyclic group represented by R ¹² preferably contains at least one selected from a nitrogen atom, an oxygen atom and a sulfur atom, and more preferably contains a nitrogen atom. The number of heteroatoms in the ring constituting the aromatic heterocyclic group is preferably 1 to 4, more preferably 1 to 3, and still more preferably 1 or 2. The above-mentioned monocyclic aromatic heterocyclic group is preferably a 5-membered ring or a 6-membered ring, and more preferably a 6-membered ring.

As the electron-withdrawing group that the above-mentioned monocyclic aromatic hydrocarbon group represented by R ¹² of the formula (b1-2) has and the above-mentioned monocyclic aromatic heterocyclic group represented by R ¹² may have an electron-withdrawing group, Examples include the electron-withdrawing groups mentioned above. The above-mentioned monocyclic aromatic hydrocarbon group preferably has an electron-withdrawing group at the para position of the aromatic hydrocarbon group. According to this aspect, the storage stability of the resin composition can be further improved. The above-mentioned monocyclic aromatic hydrocarbon group and the above-mentioned monocyclic aromatic heterocyclic group may have two or more electron-withdrawing groups. As the electron-donating group that the above-mentioned monocyclic aromatic hydrocarbon group represented by R ¹² of the formula (b1-2) may have, and the electron-donating group that the above-mentioned monocyclic aromatic heterocyclic group represented by R ¹² may have, Examples include the electron-withdrawing groups mentioned above. The above-mentioned monocyclic aromatic hydrocarbon group and the above-mentioned monocyclic aromatic heterocyclic group may have two or more electron-donating groups.

Specific examples of the repeating unit b1 include repeating units A-1 to A-48 described in the Examples described below.

The content of the repeating unit b1 in the specific resin is preferably 1 to 60% by mass. The lower limit is preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is preferably 55 mass% or less, and more preferably 50 mass% or less.

[repeating unit b2] It is preferable that the specific resin further contains, in addition to the above-mentioned repeating unit b1, a repeating unit b2 having a graft chain (hereinafter also referred to as repeating unit b2). When the specific resin contains the repeating unit b2, the storage stability of the resin composition can be further improved. In addition, the dispersibility of the pigment can be further improved and the generation of coarse particles can be suppressed.

Examples of the graft chain having the repeating unit b2 include a polymer chain containing at least one structure selected from the group consisting of a polyester structure, a polyether structure, a polystyrene structure, and a poly(meth)acrylic acid structure. Polymer chains with repeating units in polyether structures and polyester structures are preferred, and polymer chains with polyether structures are even more preferred. Furthermore, it is preferred that the polymer chain of the polyether structure is a polymer chain containing a polyalkyleneoxy structure. That is, it is preferable that the graft chain is a polymer chain containing a polyalkyleneoxy structure.

Here, the polyalkyleneoxy structure refers to a structure composed of two or more alkyleneoxy groups with an alkyleneoxy group as a repeating unit. The polyalkyleneoxy structure may be composed of one type of alkyleneoxy group or two types of alkyleneoxy groups. The number of carbon atoms in the alkyleneoxy group constituting the polyalkyleneoxy group structure is preferably 1 to 5, more preferably 1 to 3, further preferably 2 or 3, and particularly preferably 2. The number of alkyleneoxy groups constituting the polyalkyleneoxy structure is preferably 4 to 40. The lower limit is preferably 5 or more, and 8 or more is even better. The upper limit is preferably 35 or less, and 30 or less is even better.

The above-mentioned polyalkyleneoxy structure is polybutyloxy structure, polypropyleneoxy structure, polyethyloxy structure, polybutyloxy-polyethyloxy copolymer structure and polyethyleneoxy structure. The propyloxy-polyethyleneoxy copolymer structure is preferred, the polyethyleneoxy structure, the polybutyloxy-polyethyleneoxy copolymer structure and the polypropyloxy-polyethyleneoxy copolymer structure. An ethyloxy copolymer structure is more preferred, and a polyethyleneoxy copolymer structure is further preferred.

The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, an aryloxy group, and the like. The carbon number of the alkyl group and the alkoxy group is preferably 1 to 30, more preferably 1 to 20. It is preferred that the alkyl group and the alkoxy group be straight chain or branched chain. The alkyl group and the alkoxy group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and the like. The alkyl group and alkoxy group are preferably unsubstituted alkyl groups. The carbon number of the aryl group and aryloxy group is preferably 6 to 30, more preferably 6 to 20, and further preferably 6 to 12. The aryl group and the aryloxy group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, and the like.

When the graft chain is a polymer chain containing a polyalkyleneoxy structure, the terminal structure is preferably a hydrogen atom or an alkyl group, and more preferably an alkyl group.

Furthermore, graft chain refers to a molecular chain branched from the main chain. In addition, the main chain refers to the molecular chain with the most branch points.

The weight average molecular weight of the graft chain is preferably 500 to 30,000, more preferably 1,000 to 10,000, and still more preferably 1,000 to 10,000.

Examples of the repeating unit b2 include a repeating unit represented by the following formula (b2-1). [Chemical 7]

R ^b21 to R ^b23 in the formula (b2-1) each independently represent a hydrogen atom or an alkyl group. The number of carbon atoms in the alkyl group represented by R ^b21 to R ^b23 is preferably 1 to 10, more preferably 1 to 3, and 1 is even more preferably.

L ^b21 in the formula (b2-1) represents a single bond or a bivalent linking group. Examples of the divalent linking group represented by L ^b21 include hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, and combinations thereof A group consisting of 2 or more of these. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The carbon number of the hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 12. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxyl group, a halogen atom, and the like.

A ^b21 in formula (b2-1) represents a graft chain. The preferred range of the graft chain represented by A ^b21 is the same as the above content.

Specific examples of the repeating unit b2 include repeating units D-1 to D-7 described in the Examples to be described later.

The content of the repeating unit b2 in the specific resin is preferably 1 to 80% by mass. The lower limit is preferably 15% by mass or more, and more preferably 30% by mass or more. The upper limit is preferably 75 mass% or less, and more preferably 70 mass% or less.

[repeating unit b3] As a repeating unit other than the repeating unit b1 and the repeating unit b2, the specific resin may further contain a repeating unit b3 having an acid group (hereinafter also referred to as repeating unit b3). When the specific resin further contains the repeating unit b3, the storage stability of the resin composition can be further improved. In addition, the dispersibility of the pigment can be further improved, and the generation of coarse particles can also be suppressed. In addition, the generation of development residue can also be suppressed.

Examples of the acid group having the repeating unit b3 include a carboxyl group, a phosphate group, a sulfo group and a phenolic hydroxyl group, with a carboxyl group being preferred.

The number of acid groups contained in the repeating unit b3 may be one, or two or more. The number of acid groups contained in the repeating unit b3 is preferably 1 to 4, and more preferably 1 or 2.

Examples of the repeating unit b3 include a repeating unit represented by the following formula (b3-1). [Chemical 8]

R ^b31 to R ^b33 in the formula (b3-1) each independently represent a hydrogen atom or an alkyl group. The number of carbon atoms in the alkyl group represented by R ^b31 to R ^b33 is preferably 1 to 10, more preferably 1 to 3, and 1 is even more preferably.

L ^b31 in the formula (b3-1) represents a single bond or an n1+1 valence linking group. Among them, when n3 is 2 or more, L ^b31 is an n3+1 valence linking group. Examples of the n3+1 valent linking group represented by L ^b31 include hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S- and groups formed by combining two or more of these. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The carbon number of the hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 12. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxyl group, a halogen atom, and the like.

A ^b31 in formula (b3-1) represents an acid group. Examples of the acid group represented by A ^b31 include a carboxyl group, a phosphate group, a sulfo group and a phenolic hydroxyl group, with a carboxyl group being preferred.

n3 in the formula (b3-1) represents an integer of 1 or more, an integer of 1 to 4 is preferred, and 1 or 2 is more preferred.

Specific examples of the repeating unit b3 include repeating units having the structures shown below. [Chemical 9]

The content of the repeating unit b3 in the specific resin is preferably 0.1 to 60% by mass. The lower limit is preferably 1.0% by mass or more, and more preferably 2.5% by mass or more. The upper limit is preferably 40 mass% or less, and more preferably 30 mass% or less.

[repeating unit b4] The specific resin may further contain a repeating unit b4 having a crosslinkable group (hereinafter also referred to as repeating unit b4).

Examples of the crosslinkable group possessed by the repeating unit b4 include a group containing an ethylenically unsaturated bond and a cyclic ether group. Examples of the group containing an ethylenically unsaturated bond include a vinyl group, a styrene group, a (meth)allyl group, a (meth)acrylyl group, and the like. Examples of the cyclic ether group include an epoxy group, an oxetanyl group, and the like, with an epoxy group being preferred. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure formed by condensation of an epoxy ring and a saturated hydrocarbon ring.

Examples of the repeating unit b4 include a repeating unit represented by the following formula (b4-1). [Chemical 10]

R ^b41 to R ^b43 in the formula (b4-1) each independently represent a hydrogen atom or an alkyl group. The number of carbon atoms in the alkyl group represented by R ^b41 to R ^b43 is preferably 1 to 10, more preferably 1 to 3, and 1 is even more preferably.

L ^b41 in formula (b4-1) represents a single bond or a bivalent linking group. Examples of the divalent linking group represented by L ^b41 include hydrocarbon groups, -NH-, -SO-, -SO ₂ -, -CO-, -O-, -COO-, -OCO-, -S-, and combinations thereof A group consisting of 2 or more of these. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The carbon number of the hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 12. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxyl group, a halogen atom, and the like.

A ^b41 in formula (b4-1) represents a crosslinkable group.

Specific examples of the repeating unit b4 include repeating units having the structures shown below. [Chemical 11]

The content of the repeating unit b4 in the specific resin is preferably 70 mass% or less, more preferably 60 mass% or less, and still more preferably 50 mass% or less. The lower limit may be 2.5% by mass or more, or may be 5% by mass or more.

[repeating unit b5] The specific resin may further contain a repeating unit b5 (hereinafter also referred to as repeating unit b5) in addition to the above-mentioned repeating units b1 to repeating units b4.

Examples of the repeating unit b5 include repeating units having functional groups such as an alkyl group, a phenyl group, a hydroxyl group, an amino group, and a cyano group. [Chemical 12]

The content of the repeating unit b5 in the specific resin is preferably 50 mass% or less, more preferably 40 mass% or less, and further preferably 30 mass% or less. The lower limit may be 2.5% by mass or more, or may be 5.0% by mass or more.

[Specific examples of specific resins] Specific examples of the specific resin include resins P1 to P109 shown in Examples to be described later.

[Physical properties of specific resin] The acid value of the specific resin is preferably 10 to 250 mgKOH/g. The upper limit is preferably 200 mgKOH/g or less, more preferably 180 mgKOH/g or less, and still more preferably 150 mgKOH/g or less. The lower limit is preferably 20 mgKOH/g or more, and more preferably 30 mgKOH/g or more. If the acid value of the specific resin is within the above range, the resin composition will have excellent storage stability. Furthermore, the dispersibility of the pigment in the resin composition is good, and the generation of coarse particles in the resin composition can be more effectively suppressed. In addition, when a pattern is formed by photolithography, the generation of development residue can be more effectively suppressed.

The weight average molecular weight of the specific resin is preferably 3,000 to 100,000. The lower limit is preferably 5,000 or more, more preferably 8,000 or more, further preferably 10,000 or more, and particularly preferably 12,000 or more. The upper limit is preferably 80,000 or less, and 60,000 or less is even better. If the weight average molecular weight of the specific resin is within the above range, the resin composition will have excellent storage stability. Furthermore, the dispersibility of the pigment in the resin composition is good, and the generation of coarse particles in the resin composition can be more effectively suppressed. In addition, when a pattern is formed by photolithography, the generation of development residue can be more effectively suppressed.

The specific absorbance represented by the following formula (A _λ ) of the specific resin is preferably 3 or less, more preferably 2 or less, and further preferably 1 or less. E=A/(c×l) ･･････(A _λ ) In the formula (A _λ ), E represents the specific absorbance of the specific resin at the maximum absorption wavelength of 400 to 800 nm, and A represents the wavelength The absorbance of a specific resin at the maximum absorption wavelength between 400 and 800 nm, l represents the cell length in cm, and c represents the concentration of the specific resin in the solution in mg/ml.

When the specific resin has a crosslinking group, the amount of the crosslinking group of the specific resin is preferably 0.01 to 2.5 mmol/g. The lower limit is preferably 0.2 mmol/g or more, and more preferably 0.5 mmol/g or more. The upper limit is preferably 2 mmol/g or less, and more preferably 1.5 mmol/g or less. When the crosslinkable group amount of the specific resin is within the above range, the dispersibility of the pigment in the resin composition and the curability of the resin composition will be good. In addition, the crosslinkable group amount of a specific resin means the numerical value which shows the molar amount of the crosslinkable group per 1g of solid content of a specific resin.

(Other resins) The resin composition of the present invention may contain a resin different from the above-mentioned specific resin (hereinafter also referred to as other resin).

Examples of other resins include (meth)acrylic resin, epoxy resin, (meth)acrylamide resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polyarylate resin, Polyurethane resin, polyether polyphenylene resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamide imide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene Resin, siloxane resin, etc. In addition, as the resin, the resin described in the Examples of International Publication No. 2016/088645, the resin described in Japanese Patent Application Laid-Open No. 2017-057265, the resin described in Japanese Patent Application Laid-Open No. 2017-032685, and the Japanese Patent Application Publication No. 2017-032685 can also be used. The resin described in Japanese Patent Application Publication No. 2017-075248, the resin described in Japanese Patent Application Publication No. 2017-066240, the resin described in Japanese Patent Application Publication No. 2017-167513, the resin described in Japanese Patent Application Publication No. 2017-173787 , the resin described in paragraphs 0041 to 0060 of Japanese Patent Application Publication No. 2017-206689, the resin described in paragraphs 0022 to 0071 of Japanese Patent Application Publication No. 2018-010856, and the block described in Japanese Patent Application Publication No. 2016-222891 Polyisocyanate resin, resin described in Japanese Patent Application Publication No. 2020-122052, resin described in Japanese Patent Application Publication No. 2020-111656, resin described in Japanese Patent Application Publication No. 2020-139021, Japanese Patent Application Publication No. 2017-138503 Resin containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain described in the publication, resin described in paragraphs 0199 to 0233 of Japanese Patent Application Laid-Open No. 2020-186373, Japanese Patent Application Laid-Open No. 2020 -The alkali-soluble resin described in Publication No. 186325, and the resin represented by Formula 1 described in Korean Patent Publication No. 10-2020-0078339.

The weight average molecular weight (Mw) of other resins is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and even more preferably 500,000 or less. A lower limit of 4,000 or more is preferred, and a lower limit of 5,000 or more is even better.

As other resins, it is preferable to use a resin having an acid group. Examples of acidic groups include carboxyl groups, phosphate groups, sulfo groups, phenolic hydroxyl groups, and the like.

The acid value of the resin with acid groups is preferably 30 to 500 mgKOH/g. It is more preferable that the lower limit is 40 mgKOH/g or more, and it is particularly preferable that it is 50 mgKOH/g or more. The upper limit is more preferably 400 mgKOH/g or less, more preferably 300 mgKOH/g or less, and particularly preferably 200 mgKOH/g or less. The weight average molecular weight (Mw) of the resin having acid groups is preferably 5,000 to 100,000, more preferably 5,000 to 50,000. In addition, the number average molecular weight (Mn) of the resin having an acidic group is preferably 1,000 to 20,000.

The resin having acidic groups preferably contains repeating units having acidic groups on the side chains, and it is more preferable that the resin contains 5 to 70 mol% of repeating units having acidic groups on the side chains of the total repeating units of the resin. The upper limit of the content of the repeating unit having an acid group on the side chain is preferably 50 mol% or less, and more preferably 30 mol% or less. The lower limit of the content of the repeating unit having an acid group on the side chain is preferably 10 mol% or more, and more preferably 20 mol% or more.

Regarding the resin having an acid group, for example, the description of paragraphs 0558 to 0571 of Japanese Patent Application Publication No. 2012-208494 (corresponding to paragraphs 0685 to 0700 of the specification of U.S. Patent Application Publication No. 2012/0235099) and Japanese Patent Application Publication No. 2012 -The descriptions in paragraphs 0076 to 0099 of Public Gazette No. 198408 are incorporated into this manual. In addition, commercially available resins having acidic groups can also be used. In addition, the method for introducing acid groups into the resin is not particularly limited, but an example thereof is the method described in Japanese Patent No. 6349629. Moreover, as a method of introducing an acid group into a resin, the method of making the hydroxyl group produced|generated by the ring-opening reaction of an epoxy group react with an acid anhydride, and introducing an acid group is also mentioned.

As other resins, resins having a base can also be used. The resin having a base is preferably a resin containing a repeating unit having a base on the side chain, and a copolymer having a repeating unit having a base on the side chain and a repeating unit without a base is even more preferred, and has Block copolymers having repeating units of bases and repeating units without bases on the side chains are further preferred. Resins with basic bases can also be used as dispersants. The amine value of the resin having a base is preferably 5 to 300 mgKOH/g. The lower limit is preferably 10 mgKOH/g or more, and more preferably 20 mgKOH/g or more. The upper limit is preferably 200 mgKOH/g or less, and more preferably 100 mgKOH/g or less.

Commercially available resins having bases include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, BYK-LPN6919 (the above are manufactured by BYK-Chemie GmbH), SOLSPERSE 11200, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 3520 0.37500.38500. 39000, 53095, 56000, 7100 (the above are manufactured by Japan Lubrizol Corporation), Efka PX 4300, 4330, 4046, 4060, 4080 (the above are manufactured by BASF), etc. In addition, the block copolymer (B) described in paragraphs 0063 to 0112 of Japanese Patent Application Laid-Open No. 2014-219665, and the block copolymer (B) described in paragraphs 0046 to 0076 of Japanese Patent Application Laid-Open No. 2018-156021 can also be used as the resin having a base. The block copolymer A1 and the vinyl resin having a base described in paragraphs 0150 to 0153 of Japanese Patent Application Laid-Open No. 2019-184763 are incorporated into this specification.

As other resins, it is also preferable to use resins having acidic groups and resins having alkaline groups. According to this aspect, the storage stability of the resin composition can be further improved. When a resin having an acidic group and a resin having an alkali group are used together, the content of the resin having an alkali group is preferably 20 to 500 parts by mass, and 30 to 300 parts by mass relative to 100 parts by mass of the resin having an acidic group. Parts by mass are more preferably, and 50 to 200 parts by mass are still more preferably.

As other resins, it is also preferable to use a resin containing a repeating unit derived from a monomer component including a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) (hereinafter , sometimes these compounds are also called "ether dimers".).

[Chemical 13]

In the formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [Chemical 14] In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. Regarding the details of the formula (ED2), you can refer to the description of Japanese Patent Application Laid-Open No. 2010-168539, and this content is incorporated into this specification.

Regarding specific examples of the ether dimer, for example, the description in paragraph 0317 of Japanese Patent Application Laid-Open No. 2013-029760 can be referred to, and this content is incorporated into this specification.

As other resins, it is also preferable to use a resin containing a repeating unit derived from a compound represented by formula (X). [Chemical 15] In the formula, R ¹ represents a hydrogen atom or a methyl group, R ²¹ and R ²² each independently represent an alkylene group, and n represents an integer of 0 to 15. The number of carbon atoms in the alkylene group represented by R ²¹ and R ²² is preferably 1 to 10, more preferably 1 to 5, further preferably 1 to 3, and particularly preferably 2 or 3. n represents an integer of 0 to 15, and an integer of 0 to 5 is preferred, an integer of 0 to 4 is more preferred, and an integer of 0 to 3 is further preferred.

Examples of the compound represented by formula (X) include ethylene oxide or propylene oxide modified (meth)acrylate of para-cumyl phenol. Examples of commercially available products include ARONIX M-110 (manufactured by TOAGOSEI CO., LTD.) and the like.

As other resins, it is also preferable to use a resin having a crosslinkable group. Examples of the crosslinkable group include a group containing an ethylenically unsaturated bond and a cyclic ether group. Examples of the group containing an ethylenically unsaturated bond include a vinyl group, a styrene group, a (meth)allyl group, a (meth)acrylyl group, and the like. Examples of the cyclic ether group include an epoxy group, an oxetanyl group, and the like, with an epoxy group being preferred. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure formed by condensation of an epoxy ring and a saturated hydrocarbon ring.

As other resin, it is also preferable to use a resin having an aromatic carboxyl group (hereinafter also referred to as resin Ac). In the resin Ac, the aromatic carboxyl group may be included in the main chain of the repeating unit or in the side chain of the repeating unit. It is preferred that the aromatic carboxyl group is included in the main chain of the repeating unit. In addition, in this specification, the aromatic carboxyl group refers to a group having a structure in which one or more carboxyl groups are bonded to an aromatic ring. Among the aromatic carboxyl groups, the number of carboxyl groups bonded to the aromatic ring is preferably 1 to 4, and more preferably 1 to 2.

The resin Ac is preferably a resin containing at least one repeating unit selected from the repeating unit represented by the formula (Ac-1) and the repeating unit represented by the formula (Ac-2). [Chemical 16] In the formula (Ac-1), Ar ¹ represents a group containing an aromatic carboxyl group, L ¹ represents -COO- or -CONH-, and L ² represents a bivalent linking group. In formula (Ac-2), Ar ¹⁰ represents a group containing an aromatic carboxyl group, L ¹¹ represents -COO- or -CONH-, L ¹² represents a trivalent linking group, and P ¹⁰ represents a polymer chain.

In the formula (Ac-1), examples of the aromatic carboxyl group-containing group represented by Ar ¹ include a structure derived from an aromatic tricarboxylic anhydride, a structure derived from an aromatic tetracarboxylic anhydride, and the like. Examples of aromatic tricarboxylic acid anhydrides and aromatic tetracarboxylic acid anhydrides include compounds with the following structures. [Chemical 17]

In the above formula, Q ¹ represents a single bond, -O-, -CO-, -COOCH ₂ CH ₂ OCO-, -SO ₂ -, -C (CF ₃ ) ₂ -, and is represented by the following formula (Q-1) or a group represented by the following formula (Q-2). [Chemical 18]

The aromatic carboxyl group-containing group represented by Ar ¹ may have a crosslinking group. The crosslinkable group is preferably a group containing an ethylenically unsaturated bond and a cyclic ether group, and a group containing an ethylenically unsaturated bond is more preferably a group. Specific examples of the aromatic carboxyl group-containing group represented by Ar ¹ include a group represented by formula (Ar-11), a group represented by formula (Ar-12), a group represented by formula (Ar-13) ) represents groups, etc. [Chemical 19]

In formula (Ar-11), n1 represents an integer from 1 to 4, 1 or 2 is preferred, and 2 is more preferred. In formula (Ar-12), n2 represents an integer of 1 to 8, and an integer of 1 to 4 is preferred, 1 or 2 is more preferred, and 2 is further preferred. In the formula (Ar-13), n3 and n4 each independently represent an integer of 0 to 4. An integer of 0 to 2 is preferred, 1 or 2 is more preferred, and 1 is further preferred. Among them, at least one of n3 and n4 is an integer greater than 1. In the formula (Ar-13), Q ¹ represents a single bond, -O-, -CO-, -COOCH ₂ CH ₂ OCO-, -SO ₂ -, -C (CF ₃ ) ₂ -. From the above formula (Q- The group represented by 1) or the group represented by the above formula (Q-2). In the formulas (Ar-11) to (Ar-13), *1 represents the bonding position with L ¹ .

In formula (Ac-1), L ¹ represents -COO- or -CONH-, preferably -COO-.

In the formula (Ac-1), examples of the bivalent linking group represented by L ² include an alkylene group, an aryl group, -O-, -CO-, -COO-, -OCO-, and -NH-. , -S- and groups formed by combining two or more of these. The number of carbon atoms in the alkylene group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 15. The alkylene group may be linear, branched, or cyclic. The number of carbon atoms in the aryl group is preferably 6 to 30, more preferably 6 to 20, and still more preferably 6 to 10. The alkylene group and the aryl group may have a substituent. Examples of the substituent include hydroxyl group and the like. The bivalent linking group represented by L ² is preferably a group represented by -L ^2a -O-. L ^2a includes an alkylene group; an aryl group; a group formed by combining an alkylene group and an aryl group; a combination of at least one selected from an alkylene group and an aryl group and a group selected from -O-, -CO A group consisting of at least one of -, -COO-, -OCO-, -NH- and -S-, and an alkylene group is preferred. The number of carbon atoms in the alkylene group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 15. The alkylene group may be linear, branched, or cyclic. The alkylene group and the aryl group may have a substituent. Examples of the substituent include hydroxyl group and the like.

In the formula (Ac-2), the aromatic carboxyl group-containing group represented by Ar ¹⁰ has the same meaning as Ar ¹ in the formula (Ac-1), and the preferred range is also the same.

In the formula (Ac-2), L ¹¹ represents -COO- or -CONH-, preferably -COO-.

In formula (Ac-2), examples of the trivalent connecting group represented by L ¹² include hydrocarbon groups, -O-, -CO-, -COO-, -OCO-, -NH-, -S-, and combinations thereof A group consisting of two or more of these. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and further preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The number of carbon atoms of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and still more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include hydroxyl group and the like. The trivalent linking group represented by L ¹² is preferably a group represented by formula (L12-1), and more preferably a group represented by formula (L12-2). [Chemistry 20]

In formula (L12-1), L ^12b represents a trivalent linking group, X ¹ represents S, *1 represents the bonding position with L 11 of formula (Ac-2), and *2 represents the bonding position with L ¹¹ of formula (Ac-2). P ¹⁰ bonding position. Examples of the trivalent linking group represented by L ^12b include a hydrocarbon group; a combination of a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH- and -S- A group formed by a hydrocarbon group or a group formed by combining a hydrocarbon group and -O- is preferred.

In formula (L12-2), L ^12c represents a trivalent linking group, X ¹ represents S, *1 represents the bonding position with L 11 of formula (Ac-2), and *2 represents the bonding position with L ¹¹ of formula (Ac-2) P ¹⁰ bonding position. Examples of the trivalent linking group represented by L ^12c include a hydrocarbon group; a hydrocarbon group obtained by combining a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH- and -S-. groups, etc., hydrocarbon groups are preferred.

In formula (Ac-2), P ¹⁰ represents a polymer chain. The polymer chain represented by P ¹⁰ preferably has at least one structure selected from the group consisting of polyester structure, polyether structure, polystyrene structure and poly(meth)acrylic acid structure. The weight average molecular weight of the polymer chain P ¹⁰ is preferably 500 to 20,000. A lower limit of 1,000 or more is preferred. The upper limit is preferably 10,000 or less, more preferably 5,000 or less, and further preferably 3,000 or less. If the weight average molecular weight of ^P10 is within the above range, the dispersibility of the pigment in the composition will be good. In the case where the resin having an aromatic carboxyl group is a resin having a repeating unit represented by formula (Ac-2), the resin can be preferably used as a dispersant.

The polymer chain represented by P ¹⁰ may contain a crosslinking group. Examples of the crosslinkable group include a group containing an ethylenically unsaturated bond and a cyclic ether group.

As the other resin, it is preferable to use at least one selected from the group consisting of graft polymers, star polymers, block copolymers, and resins in which at least one end of the polymer chain is sealed with an acid group. This resin can be preferably used as a dispersant.

Examples of the graft polymer include a resin having a repeating unit containing a graft chain, a resin having a repeating unit represented by the above formula (Ac-2), and the like. Examples of the graft chain include a graft chain containing at least one structure selected from a polyester structure, a polyether structure, a polystyrene structure, and a poly(meth)acrylic acid structure. The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. Examples of the substituent include an alkyl group, an alkoxy group, an alkylthioether group, and the like. Among them, from the viewpoint of improving the dispersibility of the pigment, a group having a steric repulsion effect is preferred, and an alkyl group or alkoxy group having 5 to 30 carbon atoms is preferred. The alkyl group and the alkoxy group may be linear, branched, or cyclic, and linear or branched are preferred.

Specific examples of the graft polymer include paragraphs 0025 to 0094 of Japanese Patent Application Laid-Open No. 2012-255128, paragraphs 0022 to 0097 of Japanese Patent Application Laid-Open No. 2009-203462, and paragraph 0102 of Japanese Patent Application Laid-Open No. 2012-255128. ~The resin described in paragraph 0166.

Examples of star-shaped polymers include resins having a structure in which a plurality of polymer chains are bonded to a core. Specific examples of the star polymer include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of Japanese Patent Application Laid-Open No. 2013-043962, and the like.

As a block copolymer, there is a block of a polymer having repeating units containing acidic groups or bases (hereinafter also referred to as block A) and a block of a polymer having repeating units containing no acidic groups or bases. (Hereinafter, also referred to as block B) block copolymer is preferred. As the block copolymer, the block copolymer (B) described in paragraphs 0063 to 0112 of Japanese Patent Application Laid-Open No. 2014-219665 and the block copolymer described in paragraphs 0046 to 0076 of Japanese Patent Application Laid-Open No. 2018-156021 can also be used. Item A1, which content is incorporated into this description.

Examples of the resin in which at least one end of the polymer chain is sealed with an acid group include at least one end of the polymer chain containing at least one structure selected from the group consisting of a polyester structure, a polyether structure, and a poly(meth)acrylic acid structure. A resin with a structure sealed by an acidic base. Examples of the acid group that seals the end of the polymer chain include a carboxyl group, a sulfo group, and a phosphate group.

Other resins can also be used as dispersants. Examples of the dispersant include acidic dispersants (acidic resins) and alkaline dispersants (basic resins). Here, the acidic dispersant (acidic resin) means a resin in which the amount of acid groups is greater than the amount of base groups. As an acidic dispersant (acidic resin), when the total amount of acid groups and base groups is 100 mol%, a resin having an acid group amount of 70 mol% or more is preferred. It is preferable that the acidic group of the acidic dispersant (acidic resin) is a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mgKOH/g. In addition, the alkaline dispersant (alkaline resin) means a resin in which the amount of base groups is greater than the amount of acid groups. As an alkaline dispersant (basic resin), when the total amount of acid groups and bases is 100 mol%, a resin in which the amount of bases exceeds 50 mol% is preferred. The alkaline dispersant preferably has an amine group as its base.

Dispersants are also available as commercial products, and specific examples thereof include the Disperbyk series manufactured by BYK-Chemie GmbH (for example, Disperbyk-111, 161, 2001, etc.), the SOLSPERSE series manufactured by Lubrizol Japan Ltd. (for example, SOLSPERSE20000, 76500, etc.), Ajispar series manufactured by Ajinomoto Fine-Techno Co., Inc., A208F (manufactured by DKS Co. Ltd.), H-3606 (manufactured by DKS Co. Ltd.), SANDET ET (manufactured by SANYO KASEI CO., LTD. .manufacturing), etc. In addition, the products described in Paragraph 0129 of Japanese Patent Application Laid-Open No. 2012-137564 and the products described in Paragraph 0235 of Japanese Patent Application Laid-Open No. 2017-194662 can also be used as the dispersant.

The content of the resin in the total solid content of the resin composition is preferably 1 to 50% by mass. The upper limit is preferably 40 mass% or less, and more preferably 30 mass% or less. The lower limit is preferably 5% by mass or more, and more preferably 10% by mass or more.

The content of the specific resin in the total solid content of the resin composition is preferably 1 to 50% by mass. The upper limit is preferably 40 mass% or less, and more preferably 30 mass% or less. The lower limit is preferably 5% by mass or more, and more preferably 10% by mass or more.

The content of the specific resin in the resin contained in the resin composition is preferably 10 to 100% by mass, more preferably 25 to 100% by mass, and further preferably 45 to 100% by mass.

The resin composition of the present invention may contain only one type of resin, or may contain two or more types of resin. When two or more types of resins are contained, the total amount is preferably within the above range.

＜＜Polymerizable compounds＞＞ The resin composition of the present invention preferably contains a polymerizable compound. Examples of the polymerizable compound include compounds having a group containing an ethylenically unsaturated bond. Examples of the group containing an ethylenically unsaturated bond include vinyl, (meth)allyl, (meth)acrylyl, and the like. The polymerizable compound used in the present invention is preferably a radical polymerizable compound.

The polymerizable compound may be in any chemical form such as a monomer, a prepolymer, or an oligomer, but a monomer is preferred. The molecular weight of the polymerizable compound is preferably 100 to 2,500. The upper limit is preferably 2,000 or less, and 1,500 or less is even better. The lower limit is preferably 150 or more, and 250 or more is even better.

From the viewpoint of storage stability of the resin composition, the group value (hereinafter, referred to as C=C value) containing an ethylenically unsaturated bond of the polymerizable compound is preferably 2 to 14 mmol/g. The lower limit is preferably 3 mmol/g or more, more preferably 4 mmol/g or more, and still more preferably 5 mmol/g or more. The upper limit is preferably 12 mmol/g or less, more preferably 10 mmol/g or less, and still more preferably 8 mmol/g or less. The C=C value of a polymerizable compound is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the polymerizable compound by the molecular weight of the polymerizable compound.

The polymerizable compound is preferably a compound containing three or more groups containing an ethylenically unsaturated bond, and more preferably a compound containing four or more groups containing an ethylenically unsaturated bond. From the viewpoint of storage stability of the resin composition, the upper limit of the groups containing ethylenically unsaturated bonds is preferably 15 or less, more preferably 10 or less, and still more preferably 6 or less. In addition, the polymerizable compound is preferably a (meth)acrylate compound with three or more functions, more preferably a (meth)acrylate compound with 3 to 15 functions, and a (meth)acrylate compound with 3 to 10 functions is More preferably, a 3- to 6-functional (meth)acrylate compound is particularly preferred. Specific examples of the polymerizable compound include paragraphs 0095 to 0108 of Japanese Patent Application Laid-Open No. 2009-288705, paragraph 0227 of Japanese Patent Application Laid-Open No. 2013-029760, and paragraphs 0254 to 0257 of Japanese Patent Application Laid-Open No. 2008-292970. , Paragraphs 0034 to 0038 of Japanese Patent Publication No. 2013-253224, Paragraph 0477 of Japanese Patent Publication No. 2012-208494, Japanese Patent Publication No. 2017-048367, Japanese Patent Publication No. 6057891, and Japanese Patent Publication No. 6031807 The compounds described are incorporated into this specification.

Examples of the polymerizable compound include dineopenterythritol tri(meth)acrylate, dipenterythritol tetra(meth)acrylate, dipenterythritol penta(meth)acrylate, and dineopenterythritol penta(meth)acrylate. Tetrol hexa(meth)acrylate and modified forms of these compounds, etc. Examples of the modified form include compounds having a structure in which the (meth)acrylyl groups of the above-mentioned compounds, such as ethoxylated dipenterythritol hexa(meth)acrylate, are bonded via an alkyleneoxy group. Specific examples include compounds represented by formula (Z-4), compounds represented by formula (Z-5), and the like.

[Chemistry 21]

In formulas (Z-4) and (Z-5), E each independently represents - ((CH ₂ ) _y CH ₂ O) - or - ((CH ₂ ) _y CH (CH ₃ ) O) -, and y each independently represents Each independently represents an integer of 0 to 10, and X each independently represents a (meth)acrylyl group, a hydrogen atom or a carboxyl group. In formula (Z-4), the total number of (meth)acrylyl groups is 3 or 4, m each independently represents an integer of 0 to 10, and the total of each m is an integer of 0 to 40. In formula (Z-5), the total number of (meth)acrylyl groups is 5 or 6, n each independently represents an integer of 0 to 10, and the total number of n is an integer of 0 to 60.

In Formula (Z-4), m is preferably an integer of 0 to 6, and more preferably an integer of 0 to 4. Moreover, the total of each m is preferably an integer of 2 to 40, more preferably an integer of 2 to 16, and particularly preferably an integer of 4 to 8. In the formula (Z-5), n is preferably an integer from 0 to 6, and more preferably an integer from 0 to 4. Moreover, the total of each n is preferably an integer of 3 to 60, more preferably an integer of 3 to 24, and particularly preferably an integer of 6 to 12. In addition, E in the formula (Z-4) or the formula (Z-5) - ((CH ₂ ) _y CH ₂ O) - or - ((CH ₂ ) _y CH (CH ₃ ) O) - is oxygen The end of the atom side is bonded to X in the preferred form.

Furthermore, as the polymerizable compound, polyneopenterythritol poly(meth)acrylate represented by the following formula (Z-6) can also be used. [Chemistry 22] In formula (Z-6), X ¹ to X ⁶ each independently represent a hydrogen atom or a (meth)acrylyl group, and n represents an integer of 1 to 10. Among them, at least one of X ¹ to X ⁶ is a (meth)acrylyl group.

The polymerizable compound used in the present invention is selected from the group consisting of dipenterythritol hexa(meth)acrylate, dipenterythritol penta(meth)acrylate, and polyneopenterythritol poly(meth)acrylate. And at least one of the group consisting of these modified bodies is preferred. Examples of commercially available products include KAYARAD D-310, DPHA, DPEA-12 (the above are manufactured by Nippon Kayaku Co., Ltd.), NK ESTER A-DPH-12E, and TPOA-50 (SHIN-NAKAMURA CHEMICAL Co., Ltd., Ltd.) etc.

In addition, as the polymerizable compound, diglycerin EO (ethylene oxide) modified (meth)acrylate (commercially available product, M-460; manufactured by TOAGOSEI CO., LTD.), neopentyl erythritol can also be used. Tetraacrylate (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 ( Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (TOAGOSEI CO., LTD.), NK Oligo UA-7200 (SHIN-NAKAMURA CHEMICAL Co., Ltd.), 8UH-1006, 8UH-1012 ( Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (KYOEISHA CHEMICAL Co., LTD.), EBECRYL80 (DAICEL-ALLNEX LTD., amine-containing 4-functional acrylate), etc.

In addition, as the polymerizable compound, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethylene oxide-modified tri(meth)acrylate, and trimethylolpropane ethylene oxide-modified were used. Trifunctional (meth)acrylate compounds such as tri(meth)acrylate, ethylene oxide isocyanurate modified tri(meth)acrylate, and neopentylerythritol tri(meth)acrylate are also Better. Commercially available products of trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 ( Manufactured by Nippon Kayaku Co., Ltd.), etc.

In addition, as the polymerizable compound, a compound having an acid group such as a carboxyl group, a sulfo group, or a phosphoric acid group can also be used. Commercially available products of such compounds include ARONIX M-305, M-510, M-520, ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), and the like.

In addition, as the polymerizable compound, a compound having a caprolactone structure can also be used. Regarding the compound having a caprolactone structure, please refer to the description in paragraphs 0042 to 0045 of Japanese Patent Application Laid-Open No. 2013-253224, which content is incorporated into this specification. Examples of compounds having a caprolactone structure include DPCA-20, DPCA-30, DPCA-60, and DPCA-120, which are commercially available as the KAYARAD DPCA series from Nippon Kayaku Co., Ltd.

In addition, as the polymerizable compound, a polymerizable compound having a fluorine skeleton can also be used. Examples of commercially available products include OGSOL EA-0200 and EA-0300 ((meth)acrylate monomer having a fluorine skeleton, manufactured by Osaka Gas Chemicals Co., Ltd.).

In addition, as the polymerizable compound, it is also preferable to use a compound that does not substantially contain environmentally controlled substances such as toluene. Commercially available products of such compounds include KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.), and the like.

Examples of polymerizable compounds include aminomethyl compounds described in Japanese Patent Publication No. 48-041708, Japanese Patent Publication No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Publication No. 02-016765. Acid ester acrylates or ethylene oxide systems described in Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 Backbone urethane compounds are also preferred. In addition, polymerizable compounds having an amino group structure or a sulfide structure in the molecule described in Japanese Patent Application Laid-Open Nos. 63-277653, 63-260909, and 01-105238 may also be used. Better. In addition, as the polymerizable compound, UA-7200 (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, Commercially available products such as AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL Co., LTD.).

The content of the polymerizable compound in the total solid content of the resin composition is preferably 1 to 35% by mass. The upper limit is preferably 30 mass% or less, more preferably 25 mass% or less, still more preferably 20 mass% or less, and particularly preferably 10 mass% or less. The lower limit is preferably 2 mass% or more, and more preferably 5 mass% or more. The resin composition of the present invention may contain only one type of polymerizable compound, or may contain two or more types of polymerizable compounds. When two or more types of polymerizable compounds are contained, the total amount is preferably within the above range.

＜＜Photopolymerization initiator＞＞ The resin composition of the present invention can contain a photopolymerization initiator. When the resin composition of the present invention contains a polymerizable compound, it is preferred that the resin composition of the present invention further contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, compounds that are photosensitive to light from the ultraviolet region to the visible region are preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (for example, compounds having a trioxadiazole skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbisimidazole compounds, oxime compounds, organic Peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the perspective of exposure sensitivity, photopolymerization initiators include trihalomethyltrifluoroethylene compounds, benzyldimethyl ketal compounds, α-hydroxyketone compounds, α-aminoketone compounds, acylphosphine compounds, and oxidation compounds. Phosphine compounds, metallocene compounds, oxime compounds, hexaarylbisimidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halomethane compounds Preferred are ethadiazole compounds and 3-aryl substituted coumarin compounds, and compounds selected from the group consisting of oxime compounds, α-hydroxyketone compounds, α-aminoketone compounds and acylphosphine compounds are more preferred, and oxime compounds are more preferred. For further improvement. Examples of the photopolymerization initiator include compounds described in paragraphs 0065 to 0111 of Japanese Patent Application Laid-Open No. 2014-130173, compounds described in Japanese Patent Publication No. 6301489, and MATERIAL STAGE 37 to 60p, vol. 19 , the peroxide-based photopolymerization initiator described in No. 3, 2019, the photopolymerization initiator described in International Publication No. 2018/221177, the photopolymerization initiator described in International Publication No. 2018/110179 , the photopolymerization initiator described in Japanese Patent Application Publication No. 2019-043864, the photopolymerization initiator described in Japanese Patent Application Publication No. 2019-044030, the peroxide system described in Japanese Patent Application Publication No. 2019-167313 Initiator, the aminoacetophenone-based initiator having an oxazolidinyl group described in Japanese Patent Application Laid-Open No. 2020-055992, the oxime-based photopolymerization initiator described in Japanese Patent Application Publication No. 2013-190459, The polymer described in Japanese Patent Application Laid-Open No. 2020-172619, the compound represented by Formula 1 described in International Publication No. 2020/152120, and the like are incorporated in this specification.

Specific examples of hexaarylbisimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-di Phenyl-1,1'-bisimidazole, etc.

Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (the above products are manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (the above products are manufactured by BASF). manufactured by the company), etc. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (the above are manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (the above are manufactured by IGM Resins B.V.). Manufactured by BASF Corporation), etc. Examples of commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (the above products are manufactured by IGM Resins B.V.), Irgacure 819, and Irgacure TPO (the above products are manufactured by BASF), and the like.

Examples of the oxime compound include compounds described in Japanese Patent Application Publication No. 2001-233842, compounds described in Japanese Patent Application Publication No. 2000-080068, compounds described in Japanese Patent Application Publication No. 2006-342166, and J.C.S. Perkin II ( Compounds described in J.C.S. Perkin II (1979, pp. 156-162), Journal of Photopolymer Science and Technology (1995, pp. 202-232) Compounds, compounds described in Japanese Patent Application Publication No. 2000-066385, compounds described in Japanese Patent Application Publication No. 2004-534797, compounds described in Japanese Patent Application Publication No. 2006-342166, Japanese Patent Application Publication No. 2017-019766 Compounds described in, Compounds described in Japanese Patent Publication No. 6065596, Compounds described in International Publication No. 2015/152153, Compounds described in International Publication No. 2017/051680, Compounds described in Japanese Patent Publication No. 2017-198865 compounds, compounds described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, and 3-propyloxyiminobutan-2-one. Aminobutan-2-one, 2-acetyloxyiminopentan-3-one, 2-acetyloxyiminopentan-1-one, 2-benzylpropan-1-one Oxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1 -Phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyl oxime), etc. Examples of commercially available products include Irgacure-OXE01, Irgacure-OXE02, Irgacure-OXE03, Irgacure-OXE04 (the above are manufactured by BASF), TR-PBG-304, TR-PBG-327 (manufactured by TRONLY), and Adeka Optomer N-1919 (photopolymerization initiator 2 manufactured by ADEKA CORPORATION and described in Japanese Patent Application Publication No. 2012-014052). In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and resistance to discoloration. Examples of commercially available products include ADEKA ARKLS NCI-730, NCI-831, and NCI-930 (the above are manufactured by ADEKA CORPORATION).

As the photopolymerization initiator, an oxime compound having a fluorine ring can also be used. Specific examples of the oxime compound having a fluorine ring include the compounds described in Japanese Patent Application Laid-Open No. 2014-137466, the compounds described in Japanese Patent Publication No. 6636081, and the compounds described in Korean Patent Publication No. 10-2016-0109444. Recorded compounds.

As the photopolymerization initiator, an oxime compound having at least one benzene ring of a carbazole ring serving as the skeleton of a naphthalene ring can also be used. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.

As the photopolymerization initiator, an oxime compound having a fluorine atom can also be used. Specific examples of the oxime compound having a fluorine atom include compounds described in Japanese Patent Application Publication No. 2010-262028, compounds 24, 36 to 40 described in Japanese Patent Application Publication No. 2014-500852, and Japanese Patent Application Publication No. 2013- Compound (C-3) described in Publication No. 164471, etc.

As the photopolymerization initiator, an oxime compound having a nitro group can be used. It is also preferable that the oxime compound having a nitro group is a dimer. Specific examples of the oxime compound having a nitro group include compounds described in paragraphs 0031 to 0047 of Japanese Patent Application Laid-Open No. 2013-114249 and paragraphs 0008 to 0012 and 0070 to 0079 of Japanese Patent Application Laid-Open No. 2014-137466, The compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

As the photopolymerization initiator, an oxime compound having a benzofuran skeleton can also be used. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

As the photopolymerization initiator, an oxime compound in which a substituent having a hydroxyl group is bonded to a carbazole skeleton can also be used. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055.

As the photopolymerization initiator, an oxime compound (hereinafter also referred to as an oxime compound OX) having an aromatic ring group Ar ^OX1 in which an electron-withdrawing group is introduced into the aromatic ring can also be used. Examples of the electron-withdrawing group of the aromatic ring group Ar ^OX1 include a hydroxyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, and an alkylsulfinyl group. Arylsulfonyl group, cyano group, acyl group and nitro group are preferred, acyl group is more preferred, and benzyl group is further preferred. The benzoyl group may have a substituent. As a substituent, halogen atom, cyano group, nitro group, hydroxyl group, alkyl group, alkoxy group, aryl group, aryloxy group, heterocyclic group, heterocyclic oxy group, alkenyl group, alkyl sulfanyl group (sulfanyl group) , arylthio group, acyl group or amine group is preferred, alkyl group, alkoxy group, aryl group, aryloxy group, heterocyclic oxy group, alkylthio group, arylthio group or amine group is More preferably, an alkoxy group, an alkylthio group or an amino group is still more preferably.

The oxime compound OX is preferably at least one selected from the compound represented by formula (OX1) and the compound represented by formula (OX2), and the compound represented by formula (OX2) is more preferably selected. [Chemistry 23] In the formula, ^R R ^X2 represents an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkyl thiol group, an aryl thiol group, an alkyl sulfinyl group, an aryl sulfonyl group, sulfonyl group ^{, alkylsulfonyl} group, arylsulfonyl group ^, acyloxy group or ^amine group, R Electron pulling groups.

Examples of the electron withdrawing group include acyl group, nitro group, trifluoromethyl group, alkylsulfinyl group, arylsulfinyl group, alkylsulfonyl group, arylsulfonyl group, cyano group, acyl group, A group and a nitro group are preferred, a hydroxyl group is more preferred, and a benzyl group is further preferred.

In the above formula, it is preferable that ^RX12 is an electron withdrawing group and ^RX10 , ^RX11 , ^RX13 , and ^RX14 are hydrogen atoms.

Specific examples of the oxime compound OX include the compounds described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600.

Specific examples of oxime compounds that can be preferably used in the present invention are shown below, but the present invention is not limited to these.

[Chemistry 24] [Chemical 25] [Chemical 26]

The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. In addition, from the viewpoint of sensitivity, the oxime compound preferably has a high Mohr absorption coefficient at a wavelength of 365 nm or a wavelength of 405 nm, more preferably 1,000 to 300,000, further preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of a compound can be measured using a known method. For example, it is preferable to measure with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian) using an ethyl acetate solvent at a concentration of 0.01 g/L.

As a photopolymerization initiator, it is also preferable to use Irgacure OXE01 (manufactured by BASF) and/or Irgacure OXE02 (manufactured by BASF) and Omnirad 2959 (manufactured by IGM Resins B.V.) in combination.

As the photopolymerization initiator, a bifunctional or trifunctional or higher photoradical polymerization initiator can be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, so good sensitivity can be obtained. Furthermore, when a compound with an asymmetric structure is used, the crystallinity decreases and the solubility in a solvent or the like increases, making it difficult to precipitate over time, thereby improving the storage stability of the resin composition. Specific examples of the bifunctional or trifunctional or higher-functional photoradical polymerization initiator include Japanese Patent Application Publication No. 2010-527339, Japanese Patent Application Publication No. 2011-524436, International Publication No. 2015/004565, and Japanese Patent Application Publication No. 2015/004565. The dimer of the oxime compound described in paragraphs 0407 to 0412 of Table 2016-532675, paragraphs 0039 to 0055 of International Publication No. 2017/033680, the compound (E) described in Japanese Patent Publication No. 2013-522445, and Compound (G), Cmpd1 to 7 described in International Publication No. 2016/034963, oxime ester photoinitiator described in paragraph 0007 of Japanese Patent Application Publication No. 2017-523465, Japanese Patent Application Publication No. 2017-167399 The photoinitiator described in paragraphs 0020 to 0033, the photopolymerization initiator (A) described in paragraphs 0017 to 0026 of Japanese Patent Application Laid-Open No. 2017-151342, the oxime ester photoinitiator described in Japanese Patent No. 6469669 starter, etc.

The content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less. In the resin composition of the present invention, only one type of photopolymerization initiator may be used, or two or more types of photopolymerization initiators may be used. When two or more types are used, the total amount is preferably within the above range.

＜＜Solvent＞＞ The resin composition of the present invention preferably contains a solvent. Examples of the solvent include organic solvents. The type of solvent is basically not particularly limited as long as it satisfies the solubility of each component or the coatability of the composition. Examples of the organic solvent include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, hydrocarbon solvents, and the like. For details, please refer to paragraph 0223 of International Publication No. 2015/166779, which is incorporated into this specification. Furthermore, ester solvents in which a cyclic alkyl group is substituted and ketone solvents in which a cyclic alkyl group is substituted can also be suitably used. Specific examples of the organic solvent include polyethylene glycol monomethyl ether, methylene chloride, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, and ethylcelusacetate. , Ethyl lactate, diglyme, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone , 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate , butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropylamide, 3-butoxy-N,N- Dimethylpropamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, γ-butyrolactone, cycloterine, anisole, 1,4-diethyloxy Butane, diethylene glycol monoethyl ether acetate, 1,3-butanediol diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropyl alcohol, etc. However, sometimes it is preferable to reduce the number of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, it can be set to 50 mass based on the total amount of organic solvents). ppm (parts per million: parts per million) or less, it can also be set to 10 mass ppm or less, or it can be set to 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent with a small metal content. The metal content of the organic solvent is preferably 10 mass ppb (parts per billion) or less, for example. Organic solvents with a quality of ppt (parts per trillion: parts per trillion) level can be used as needed, and such organic solvents are provided by Toyo Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015).

Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) or filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and further preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene or nylon.

Organic solvents can contain isomers (compounds with the same number of atoms but different structures). In addition, only one type of isomer may be contained, or a plurality of types of isomers may be contained.

It is preferable that the content rate of peroxide in the organic solvent is 0.8 mmol/L or less, and it is more preferable that it contains substantially no peroxide.

The content of the solvent in the resin composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and further preferably 30 to 90% by mass.

Furthermore, from the viewpoint of environmental control, it is preferable that the resin composition of the present invention substantially does not contain environmentally controlled substances. Furthermore, in the present invention, substantially free of environmentally regulated substances means that the content of environmentally regulated substances in the resin composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, and further preferably 10 ppm by mass or less. 1 mass ppm or less is particularly preferred. Examples of environmentally controlled substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzene such as chlorobenzene. These substances are registered as environmentally controlled substances in accordance with REACH (Registration Evaluation Authorization and Restriction of CHemicals) rules, PRTR (Pollutant Release and Transfer Register) law, VOC (Volatile Organic Compounds) control, etc., and the usage amount or treatment method are strictly controlled. These compounds may be used as solvents when producing components used in the resin composition, and may be mixed into the resin composition as residual solvents. From the viewpoint of human safety and environmental considerations, it is better to reduce these substances as much as possible. An example of a method for reducing environmentally regulated substances is to heat or depressurize the system to a temperature above the boiling point of the environmentally regulated substances, and then distill the environmentally regulated substances from the system to thereby reduce them. In addition, when removing a small amount of environmentally controlled substances by distillation, it is also useful to azeotrope the solvent with a solvent having the same boiling point as the solvent in order to improve efficiency. In addition, when a compound having radical polymerizability is contained, in order to suppress cross-linking between molecules due to radical polymerization reaction during vacuum distillation removal, a polymerization inhibitor or the like may be added to perform vacuum distillation removal. These distillation removal methods can be performed at any stage, such as the raw material stage, the stage of a product of reacting the raw materials (for example, a resin solution or a polyfunctional monomer solution after polymerization), or the stage of a resin composition produced by mixing these compounds. carried out in one stage.

＜＜Thermal cross-linking agent＞＞ The resin composition of the present invention may contain a thermal crosslinking agent as a component other than the above-mentioned resin and polymerizable compound. Examples of the thermal crosslinking agent include compounds having a cyclic ether group. Examples of the cyclic ether group include an epoxy group, an oxetanyl group, and the like. The epoxy group may be an alicyclic epoxy group. In addition, the alicyclic epoxy group refers to a monovalent functional group having a cyclic structure formed by condensation of an epoxy ring and a saturated hydrocarbon ring. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of the epoxy compound include compounds having one or more epoxy groups in one molecule, and compounds having two or more epoxy groups are preferred. The epoxy compound is preferably a compound having 1 to 100 epoxy groups in one molecule. The upper limit of the epoxy groups contained in the epoxy compound can be, for example, 10 or less, or 5 or less. The lower limit of the epoxy groups contained in the epoxy compound is preferably 2 or more. As the epoxy compound, Paragraphs 0034 to 0036 of Japanese Patent Application Laid-Open No. 2013-011869, Paragraphs 0147 to 0156 of Japanese Patent Application Laid-Open No. 2014-043556, and Paragraphs 0085 to 0092 of Japanese Patent Application Laid-Open No. 2014-089408 can also be used. The compounds described are compounds described in Japanese Patent Application Laid-Open No. 2017-179172. These contents are incorporated into this manual.

The compound with a cyclic ether group can be a low molecular compound (for example, the molecular weight is less than 2000, and further, the molecular weight is less than 1000), or it can be a macromolecule compound (for example, the molecular weight is more than 1000, which is a polymer) In this case, the weight average molecular weight is 1000 or more). The weight average molecular weight of the compound having a cyclic ether group is preferably 200 to 100,000, more preferably 500 to 50,000. The upper limit of the weight average molecular weight is more preferably 10,000 or less, particularly preferably 5,000 or less, and still more preferably 3,000 or less.

Examples of commercially available compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, and G- 0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (the above are manufactured by NOF CORPORATION., polymers containing epoxy groups), etc. Moreover, as the compound which has a cyclic ether group, the compound described in the Example mentioned later can also be used.

The content of the thermal cross-linking agent in the total solid content of the resin composition is preferably 0.1 to 20% by mass. The lower limit is, for example, more preferably 0.5% by mass or more, and still more preferably 1% by mass or more. The upper limit is, for example, more preferably 15% by mass or less, and still more preferably 10% by mass or less. Only one type of thermal cross-linking agent may be used, or two or more types may be used. When two or more types are used, the total amount is preferably within the above range.

＜＜Polyalkyleneimine＞＞ The resin composition of the present invention may also contain polyalkyleneimine. Polyalkyleneimines are used, for example, as dispersion aids for pigments. Dispersion aids refer to materials used to improve the dispersion of pigments and other color materials in resin compositions. Polyalkyleneimine refers to a polymer obtained by ring-opening polymerization of alkyleneimine. The polyalkyleneimine is preferably a polymer having a branched chain structure containing primary amine groups, secondary amine groups and tertiary amine groups respectively. The number of carbon atoms in the alkylene imine is preferably 2 to 6, more preferably 2 to 4, further preferably 2 or 3, and particularly preferably 2.

The molecular weight of the polyalkyleneimine is preferably 200 or more, and more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, still more preferably 10,000 or less, and particularly preferably 2,000 or less. Furthermore, regarding the value of the molecular weight of the polyalkyleneimine, when the molecular weight can be calculated from the structural formula, the molecular weight of the polyalkyleneimine is the value calculated from the structural formula. On the other hand, when the molecular weight of a specific amine compound cannot be calculated from the structural formula or is difficult to calculate, the value of the number average molecular weight measured by the boiling point elevation method is used. In addition, when it is impossible or difficult to measure using the boiling point elevation method, the value of the number average molecular weight measured using the viscometry method is used. In addition, when it is impossible or difficult to measure by viscometry, the polystyrene-converted number average molecular weight value measured by GPC (gel permeation chromatography) method is used.

The amine value of the polyalkyleneimine is preferably 5 mmol/g or more, more preferably 10 mmol/g or more, and still more preferably 15 mmol/g or more.

Specific examples of alkylene imine include ethylene imine, propylene imine, 1,2-butylene imine, 2,3-butylene imine, and the like. Preferred is propylene imine, and even more preferred is propylene imine. The polyalkyleneimine is particularly preferably polyethyleneimine. Furthermore, polyethyleneimine preferably contains 10 mol% or more of primary amine groups based on the total of primary amine groups, secondary amine groups, and tertiary amine groups, and preferably contains 20 mol% or more of primary amine groups. An amine group is more preferred, and a primary amine group containing 30 mol% or more is still more preferred. Commercially available products of polyethyleneimine include EPOMIN SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (the above are manufactured by NIPPON SHOKUBAI CO., LTD.) wait.

The content of the polyalkyleneimine in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The lower limit is preferably 0.2 mass% or more, more preferably 0.5 mass% or more, and further preferably 1 mass% or more. The upper limit is preferably 4.5 mass% or less, more preferably 4 mass% or less, and still more preferably 3 mass% or less. In addition, the content of the polyalkyleneimine is preferably 0.5 to 20 parts by mass relative to 100 parts by mass of the pigment. The lower limit is preferably 0.6 parts by mass or more, more preferably 1 part by mass or more, and still more preferably 2 parts by mass or more. The upper limit is preferably 10 parts by mass or less, and more preferably 8 parts by mass or less. Only one type of polyalkyleneimine may be used, or two or more types may be used. When two or more types are used, the total amount is preferably within the above range.

＜＜Harding accelerator＞＞ The resin composition of the present invention may contain a hardening accelerator. Examples of the hardening accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine salt compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, onium salt compounds, and the like. Specific examples of the hardening accelerator include compounds described in paragraphs 0094 to 0097 of International Publication No. 2018/056189, compounds described in paragraphs 0246 to 0253 of Japanese Patent Application Laid-Open No. 2015-034963, and Japanese Patent Application Laid-Open No. 2013. - Compounds described in paragraphs 0186 to 0251 of Japanese Patent Application Publication No. 041165, ionic compounds described in Japanese Patent Application Laid-Open No. 2014-055114, compounds described in paragraphs 0071 to 0080 of Japanese Patent Application Publication No. 2012-150180, Japanese Patent Application Laid-Open No. 2012-150180 Alkoxysilane compound having an epoxy group described in Publication No. 2011-253054, compound described in paragraphs 0085 to 0092 of Japanese Patent Publication No. 5765059, ring containing carboxyl group described in Japanese Patent Application Laid-Open No. 2017-036379 Oxygen hardener, etc. The content of the hardening accelerator in the total solid content of the resin composition is preferably 0.3 to 8.9% by mass, and further preferably 0.8 to 6.4% by mass.

<<Ultraviolet absorber>> The resin composition of the present invention can contain an ultraviolet absorber. Examples of the ultraviolet absorber include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyl trisulfonate compounds, and indepine compounds. Indole compounds, tri-𠯤 compounds, etc. Specific examples of such compounds include paragraphs 0038 to 0052 of Japanese Patent Application Laid-Open No. 2009-217221, paragraphs 0052 to 0072 of Japanese Patent Application Laid-Open No. 2012-208374, and paragraphs 0317 to 0317 of Japanese Patent Application Laid-Open No. 2013-068814. Paragraph 0334 and compounds described in Paragraphs 0061 to 0080 of Japanese Patent Application Laid-Open No. 2016-162946, these contents are incorporated into this specification. Specific examples of ultraviolet absorbers include compounds having the following structures. Examples of commercially available ultraviolet absorbers include UV-503 (manufactured by DAITO CHEMICAL CO., LTD.), BASF's Tinuvin series, Uvinul series, and Sumika Chemtex Company, Limited's Sumisorb series. Examples of the benzotriazole compound include the MYUA series manufactured by MIYOSHI OIL & FAT CO., LTD. (Chemical Industry Daily, February 1, 2016). In addition, as the ultraviolet absorber, the compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, the compounds described in paragraphs 0059 to 0076 of International Publication No. 2016/181987, and the compounds described in International Publication No. 2020/137819 can also be used. Thioaryl-substituted benzotriazole type UV absorber. [Chemical 27]

The content of the ultraviolet absorber in the total solid content of the resin composition is preferably 0.01 to 10% by mass, and more preferably 0.01 to 5% by mass. In the present invention, only one type of ultraviolet absorber may be used, or two or more types of ultraviolet absorbers may be used. When two or more types are used, the total amount is preferably within the above range.

＜＜Polymerization inhibitor＞＞ The resin composition of the present invention can contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, gallic acid, tertiary butylcatechol, benzoquinone, and 4,4'-thio Bis(3-methyl-6-tertiary butylphenol), 2,2'-methylenebis(4-methyl-6-tertiary butylphenol), N-nitrosophenylhydroxylamine salt ( Ammonium salt, first cerium salt, etc.). Among them, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5% by mass. The polymerization inhibitor may be only one type or two or more types. When there are two or more types, the total amount is preferably within the above range.

＜＜Silane Coupling Agent＞＞ The resin composition of the present invention can contain a silane coupling agent. In the present invention, a silane coupling agent refers to a silane compound having a hydrolyzable group and functional groups other than the hydrolyzable group. In addition, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond through at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, a hydroxyl group, and the like, with an alkoxy group being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)allyl groups, (meth)acrylyl groups, mercapto groups, epoxy groups, oxetanyl groups, and amino groups. , urea group, thioether group, isocyanate group, phenyl group, etc., amine group, (meth)acrylyl group and epoxy group are preferred. Specific examples of the silane coupling agent include N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-602), N-β-aminoethyl-γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-603), N-β-aminoethyl-γ-amine Propyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBE-602), γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) KBM-903), γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBE-903), 3-methacryloxypropylmethyldimethyl Oxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-502), 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-503) etc. Specific examples of the silane coupling agent include compounds described in paragraphs 0018 to 0036 of Japanese Patent Application Laid-Open No. 2009-288703, and compounds described in paragraphs 0056 to 0066 of Japanese Patent Application Laid-Open No. 2009-242604. and other contents are incorporated into this manual. The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.01 to 15.0 mass%, and more preferably 0.05 to 10.0 mass%. The silane coupling agent may be only one type or two or more types. When there are two or more types, the total amount is preferably within the above range.

＜＜Surfactant＞＞ The resin composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and polysiloxane surfactants can be used. The surfactant is preferably a polysiloxane-based surfactant or a fluorine-based surfactant. Regarding surfactants, please refer to the surfactants described in paragraphs 0238 to 0245 of International Publication No. 2015/166779, and this content is incorporated into this specification.

The fluorine content in the fluorine-based surfactant is preferably 3 to 40 mass%, more preferably 5 to 30 mass%, and particularly preferably 7 to 25 mass%. A fluorine-based surfactant having a fluorine content within this range is effective from the viewpoint of uniformity of thickness of the coating film and liquid saving, and has good solubility in the resin composition.

Examples of the fluorine-based surfactant include surfactants described in paragraphs 0060 to 0064 of Japanese Patent Application Laid-Open No. 2014-041318 (corresponding to paragraphs 0060 to 0064 of International Publication No. 2014/017669), Japanese Patent Application Laid-Open No. 2014/017669, etc. The surfactants described in paragraphs 0117 to 0132 of Publication No. 2011-132503 and the surfactants described in Japanese Patent Application Laid-Open No. 2020-008634 are incorporated into this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F -144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F -560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41 , R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (the above are manufactured by DIC Corporation), FLUORAD FC430, FC431, FC171 (The above are manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 ( The above are manufactured by AGC INC.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (the above are manufactured by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FTX -218 (the above are manufactured by NEOS COMPANY LIMITED), etc.

It is also preferable to use an acrylic compound as the fluorine-based surfactant. The acrylic compound has a molecular structure including a functional group containing a fluorine atom, and when heated, the part of the functional group containing the fluorine atom is cut off and the fluorine atom is volatilized. . Examples of such fluorine-based surfactants include the MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)). For example, MEGAFACE DS-21.

It is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorine-based surfactant. Examples of such fluorine-based surfactants include the fluorine-based surfactants described in Japanese Patent Application Laid-Open No. 2016-216602, the contents of which are incorporated into this specification.

Block polymers can also be used as fluorine-based surfactants. As the fluorine-based surfactant, a fluorine-containing polymer compound can preferably be used. The fluorine-containing polymer compound contains: a repeating unit derived from a (meth)acrylate compound having a fluorine atom; and a fluorine-containing polymer compound derived from a (meth)acrylate compound having 2 or more ( The repeating unit of a (meth)acrylate compound is preferably an alkyleneoxy group (preferably 5 or more) (preferably an vinyloxy group or a propyleneoxy group). In addition, the fluorine-containing surfactant described in paragraphs 0016 to 0037 of Japanese Patent Application Laid-Open No. 2010-032698 or the following compounds can also be exemplified as the fluorine-based surfactant used in the present invention. [Chemistry 28] The weight average molecular weight of the above compound is preferably 3,000 to 50,000, for example, 14,000. In the above compounds, the percentage expressed as the proportion of repeating units is molar %.

In addition, a fluorine-containing polymer having a group containing an ethylenically unsaturated bond in the side chain can also be used as the fluorine-based surfactant. Specific examples include compounds described in paragraphs 0050 to 0090 and paragraphs 0289 to 0295 of Japanese Patent Application Laid-Open No. 2010-164965, MEGAFACE RS-101, RS-102, RS-718K, and RS-72- manufactured by DIC Corporation. K et al. In addition, the compounds described in paragraphs 0015 to 0158 of Japanese Patent Application Laid-Open No. 2015-117327 can also be used as the fluorine-based surfactant.

Furthermore, from the viewpoint of environmental control, it is also preferable to use the surfactant described in International Publication No. 2020/084854 as a substitute for the surfactant having a perfluoroalkyl group with a carbon number of 6 or more.

Furthermore, it is also preferable to use a fluorine-containing imine salt compound represented by formula (fi-1) as a surfactant. [Chemical 29] In formula (fi-1), m represents 1 or 2, n represents an integer from 1 to 4, a represents 1 or 2, X ^a+ represents a-valent metal ion, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, Quaternary ammonium ion or NH ₄ ⁺ .

Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerolpropane Oxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonyl Phenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitol fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF Corporation), SOLSPERSE 20000 (manufactured by Japan Lubrizol Corporation), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILMWako Pure Chemical Corporation), PIONIN D-6112 , D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Industry Co., Ltd.), etc.

Examples of polysilicone-based surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (the above are manufactured by Dow Corning Toray Co., Ltd.), TSF- 4300, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (the above are manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (the above are Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (the above are manufactured by BYK-Chemie GmbH), etc.

Moreover, the compound of the following structure can also be used as a polysiloxane surfactant. [Chemical 30]

The content of the surfactant in the total solid content of the resin composition is preferably 0.001 mass% to 5.0 mass%, and more preferably 0.005 to 3.0 mass%. The surfactant may be only one type, or may be two or more types. When there are two or more types, the total amount is preferably within the above range.

＜＜Antioxidants＞＞ The resin composition of the present invention can contain antioxidants. Examples of antioxidants include phenol compounds, phosphite compounds, thioether compounds, and the like. As the phenolic compound, any phenolic compound known as a phenolic antioxidant can be used. Preferable phenol compounds include hindered phenol compounds. Compounds having a substituent at the position adjacent to the phenolic hydroxyl group (ortho position) are preferred. As the substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. Moreover, it is also preferable that the antioxidant is a compound having a phenol group and a phosphite group in the same molecule. Moreover, as an antioxidant, a phosphorus-type antioxidant can also be suitably used. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2] Dioxaphosphineheterocycloheptadien-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tertiary butyldibenzo[d,f] [1,3,2]dioxaphosphineheterocycloheptadien-2-yl)oxy]ethyl]amine, ethyl bis(2,4-di-tertiary butyl-6-methyl phosphite) phenyl) etc. Examples of commercially available antioxidants include ADEKA STAB AO-20, ADEKA STAB AO-30, ADEKA STAB AO-40, ADEKA STAB AO-50, ADEKA STAB AO-50F, ADEKA STAB AO-60, and ADEKA STAB AO-60G, ADEKA STAB AO-80, ADEKA STAB AO-330 (the above are manufactured by ADEKA CORPORATION), etc. In addition, the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, the compounds described in International Publication No. 2017/006600, the compounds described in International Publication No. 2017/164024, and Korean Patent Publication can also be used as antioxidants. Compounds described in Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, and more preferably 0.3 to 15% by mass. Only one type of antioxidant may be used, or two or more types may be used. When two or more types are used, the total amount is preferably within the above range.

＜＜Other ingredients＞＞ The resin composition of the present invention may optionally contain sensitizers, hardening accelerators, fillers, thermal hardening accelerators, plasticizers and other auxiliaries (for example, conductive particles, defoaming agents, flame retardants, leveling agents , peeling accelerators, spices, surface tension regulators, chain transfer agents, etc.). By appropriately containing these components, film physical properties and other properties can be adjusted. Regarding these components, for example, the descriptions of paragraphs 0183 and onwards of Japanese Patent Application Laid-Open No. 2012-003225 (corresponding to paragraph 0237 of the specification of U.S. Patent Application Publication No. 2013/0034812), and the descriptions of Japanese Patent Application Laid-Open No. 2008-250074 The descriptions in paragraphs 0101 to 0104, 0107 to 0109, etc. are incorporated into this manual. In addition, the resin composition of the present invention may contain a latent antioxidant if necessary. Examples of potential antioxidants include compounds in which a site functioning as an antioxidant is protected by a protective group and the protective group is detached by heating at 100 to 250°C or heating at 80 to 200°C in the presence of an acid/alkali catalyst. and acts as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and Japanese Patent Application Laid-Open No. 2017-008219. Examples of commercially available latent antioxidants include ADEKA ARKLS GPA-5001 (manufactured by ADEKA CORPORATION).

The resin composition of the present invention may contain a synthetic raw material for a specific resin or a compound having a hydroxyl group or an amine group that is a decomposition product of the specific resin.

In order to adjust the refractive index of the obtained film, the resin composition of the present invention may contain a metal oxide. Examples of metal oxides include TiO ₂ , ZrO ₂ , Al ₂ O ₃ , SiO ₂ and the like. The primary particle diameter of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and further preferably 5 to 50 nm. Metal oxides may have a core-shell structure. In addition, at this time, the core part may be hollow.

The resin composition of the present invention may contain a light resistance improving agent. Examples of the light resistance improving agent include compounds described in paragraphs 0036 to 0037 of Japanese Patent Application Laid-Open No. 2017-198787, compounds described in paragraphs 0029 to 0034 of Japanese Patent Application Laid-Open No. 2017-146350, and compounds described in Japanese Patent Application Laid-Open No. 2017-146350. Compounds described in paragraphs 0036 to 0037 and 0049 to 0052 of Japanese Patent Application Publication No. 129774, compounds described in paragraphs 0031 to 0034 and paragraphs 0058 to 0059 of Japanese Patent Application Laid-Open No. 2017-129674, and compounds described in Japanese Patent Application Laid-Open No. 2017-122803 Compounds described in paragraphs 0036 to 0037 and 0051 to 0054, compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, compounds described in paragraphs 0034 to 0047 of Japanese Patent Application Publication No. 2017-186546, Japan Compounds described in paragraphs 0019 to 0041 of Japanese Patent Application Laid-Open No. 2015-025116, compounds described in paragraphs 0101 to 0125 of Japanese Patent Application Laid-Open No. 2012-145604, and compounds described in paragraphs 0018 to 0021 of Japanese Patent Application Laid-Open No. 2012-103475 Compounds, compounds described in paragraphs 0015 to 0018 of Japanese Patent Application Laid-Open No. 2011-257591, compounds described in paragraphs 0017 to 0021 of Japanese Patent Application Publication No. 2011-191483, and compounds described in paragraphs 0108 to 0108 of Japanese Patent Application Laid-Open No. 2011-145668 Compounds described in paragraph 0116, compounds described in paragraphs 0103 to 0153 of Japanese Patent Application Laid-Open No. 2011-253174, and the like.

It is also preferred that the resin composition of the present invention contains substantially no terephthalate ester. Here, "substantially free" means that the content of terephthalate ester in the total amount of the resin composition is 1000 ppb by mass or less, more preferably 100 ppb by mass or less, and particularly preferably 0.

From the viewpoint of environmental regulation, the use of perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts is sometimes regulated. In the resin composition of the present invention, when the content rate of the above-mentioned compounds is reduced, perfluoroalkyl sulfonic acid (especially perfluoroalkyl group having a carbon number of 6 to 8) is increased relative to the total solid content of the resin composition. Fluoroalkylsulfonic acid) and its salts, and perfluoroalkylcarboxylic acids (especially perfluoroalkylcarboxylic acids with a perfluoroalkyl group having 6 to 8 carbon atoms) and their salts are contained in a ratio of 0.01 ppb to 1,000 ppb The range of is preferred, the range of 0.05ppb to 500ppb is more preferred, and the range of 0.1ppb to 300ppb is further preferred. The resin composition of the present invention may be substantially free of perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts. For example, by using compounds that can replace perfluoroalkyl sulfonic acid and its salts, and compounds that can replace perfluoroalkyl carboxylic acids and its salts, you can choose to be substantially free of perfluoroalkyl sulfonic acid and its salts, and resin compositions of perfluoroalkylcarboxylic acids and their salts. Examples of compounds that can replace the regulated compounds include compounds that are excluded from the subject of regulation due to differences in the number of carbon atoms in the perfluoroalkyl group. Among them, the above content does not prevent the use of perfluoroalkyl sulfonic acid and its salts and perfluoroalkyl carboxylic acid and its salts. The resin composition of the present invention may contain perfluoroalkylsulfonic acid and its salts, and perfluoroalkylcarboxylic acid and its salts within the maximum allowable range.

The moisture content of the resin composition of the present invention is usually 3% by mass or less, preferably 0.01 to 1.5% by mass, and more preferably in the range of 0.1 to 1.0% by mass. Moisture content can be measured using the Karl Fischer method.

The resin composition of the present invention can be used by adjusting the viscosity for the purpose of adjusting the film surface shape (flatness, etc.), adjusting the film thickness, etc. The value of viscosity can be appropriately selected as needed. For example, 0.3mPa·s to 50mPa·s at 25°C is more preferred, and 0.5mPa·s to 20mPa·s is more preferred. As a method of measuring viscosity, for example, a cone and plate viscometer can be used to measure the viscosity in a state where the temperature is adjusted to 25°C.

＜＜Container＞＞ There is no particular limitation on the container for storing the resin composition, and a known container can be used. In addition, as a storage container, in order to prevent impurities from being mixed into raw materials or resin compositions, it is also preferable to use a multi-layer bottle with an inner wall composed of six types of six-layer resins or a bottle with a seven-layer structure of six types of resins. Examples of such a container include the container described in Japanese Patent Application Laid-Open No. 2015-123351. In addition, the inner wall of the container is preferably made of glass, stainless steel, etc. for the purpose of preventing metal from eluting from the inner wall of the container, improving the storage stability of the resin composition, or suppressing deterioration of components.

＜Preparation method of resin composition＞ The resin composition of the present invention can be prepared by mixing the aforementioned components. When preparing a resin composition, all the components can be dissolved and/or dispersed in a solvent at the same time to prepare the resin composition, or each component can be appropriately used as 2 or more parts of a solution or dispersion as needed (when coating) These were mixed to prepare a composition.

In addition, when preparing the resin composition, it is preferable to include a process of dispersing pigments. In the pigment dispersion process, examples of mechanical forces used to disperse pigments include compression, extrusion, impact, shearing, pitting, and the like. Specific examples of these processes include bead milling, sand milling, roller milling, ball milling, paint stirring, micro-jet flow, high-speed impeller, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, and the like. In addition, when grinding the pigment in a sand mill (bead mill), it is preferable to perform the process under conditions that improve the grinding efficiency by using microbeads with small diameters, increasing the filling rate of microbeads, etc. In addition, after the grinding process, it is preferable to remove coarse particles by filtration, centrifugation, etc. In addition, regarding the process and dispersing machine for dispersing pigments, "Encyclopedia of Dispersion Technology, published by JOHOKIKO CO., LTD., July 15, 2005" or "Suspension (solid/liquid dispersion system)" can be preferably used. The Center's Comprehensive Data Collection on Dispersion Technology and Industrial Applications, published by the Publication Department of the Business Development Center, October 10, 1978", the process and dispersion machine described in paragraph 0022 of Japanese Patent Application Publication No. 2015-157893. In addition, in the process of dispersing pigments, the particles can be refined through a salt grinding step. Materials, equipment, processing conditions, etc. used in the salt grinding step can be referred to the descriptions of Japanese Patent Application Laid-Open No. 2015-194521 and Japanese Patent Application Laid-Open No. 2012-046629, for example. Examples of materials used for dispersed beads include zirconium dioxide, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, alumina, stainless steel and glass. In addition, an inorganic compound having a Mohs hardness of 2 or more can also be used for the beads. The resin composition may contain 1 to 10,000 ppm of the above beads.

When preparing a resin composition, it is preferable to filter the resin composition with a filter for the purpose of removing impurities, reducing defects, etc. As a filter, any filter that has been conventionally used for filtration purposes and the like can be used without particular restrictions. Examples include the use of fluororesins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (for example, nylon-6, nylon-6,6), polyethylene, and polypropylene. (PP) and other polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins) and other materials. Among these materials, polypropylene (including high-density polypropylene) and nylon are preferred.

The pore diameter of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and further preferably 0.05 to 0.5 μm. If the pore size of the filter is within the above range, fine foreign matter can be removed more reliably. Regarding the pore size of the filter, you can refer to the nominal value of the filter manufacturer. As for the filter, various filters provided by Nihon Pall Ltd. (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, etc. can be used.

In addition, it is also preferable to use a fibrous filter material as the filter. Examples of fibrous filter materials include polypropylene fiber, nylon fiber, glass fiber, and the like. Commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.

When using filters, you can combine different filters (e.g. 1st filter and 2nd filter, etc.). At this time, filtration using each filter may be performed only once, or may be performed two or more times. Furthermore, filters with different pore sizes can be combined within the above range. Alternatively, only the dispersion may be filtered with the first filter, and the other components may be mixed and then filtered with the second filter. In addition, the filter can be appropriately selected depending on the hydrophilicity and hydrophobicity of the composition.

＜Membrane＞ The film of the present invention is a film obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be used in filters such as color filters, near-infrared transmission filters, and near-infrared cutoff filters.

The film thickness of the film of the present invention can be appropriately adjusted depending on the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and still more preferably 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and still more preferably 0.3 μm or more.

When the film of the present invention is used as a color filter, the film of the present invention preferably has a green, red, blue, cyan, magenta or yellow hue, and is more preferably a green, blue or cyan hue, and has a green hue. For further improvement. Furthermore, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels, with red pixels being more preferred.

＜Membrane manufacturing method＞ Next, the manufacturing method of the film of this invention is demonstrated. The film of the present invention can be produced by applying the resin composition of the present invention. It is preferable that the film manufacturing method further includes a step of forming a pattern (pixel). Examples of methods for forming patterns (pixels) include photolithography and dry etching, with photolithography being preferred. By using the resin composition of the present invention and forming a pattern using photolithography, the generation of development residue can be further suppressed.

Pattern formation using photolithography preferably includes the following steps: forming a resin composition layer on a support using the resin composition of the present invention; exposing the resin composition layer in a pattern; and developing and removing it. The step of forming patterns (pixels) on the unexposed portions of the resin composition layer. If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixel) (post-baking step) may be provided.

In the step of forming the resin composition layer, the resin composition layer of the present invention is used to form the resin composition layer on the support. The support is not particularly limited and can be appropriately selected depending on the use. For example, a glass substrate, a silicon substrate, etc. are mentioned, and a silicon substrate is preferable. In addition, a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, etc. may also be formed on the silicon substrate. In addition, a black matrix is sometimes formed on the silicon substrate to isolate each pixel. Furthermore, the silicon substrate may be provided with a base layer for improving adhesion with the upper layer, preventing diffusion of substances, or flattening the surface of the substrate. The surface contact angle of the base layer is preferably 20 to 70° when measured with diiodomethane. In addition, when measuring with water, 30 to 80° is preferred.

As a coating method of the resin composition, a known method can be used. For example, dropping method (drip casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); cast coating method; slit spin coating method; prewet method (for example, Japan Methods described in Japanese Patent Application Laid-Open No. 2009-145395); inkjet (for example, drop-on-demand method, piezoelectric method, thermal method), nozzle jet and other ejection system printing, flexographic printing, screen printing, gravure printing, reverse offset printing Various printing methods such as transfer printing and metal mask printing; transfer printing methods using molds, etc.; nanoimprinting methods, etc. There are no particular limitations on the application method of inkjet. For example, "Expansion and Usage of Inkjet - Infinite Possibilities Appeared in Patents -", published in February 2005, Sumitbe Techon Research Co., Ltd. method (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830, Japan The method described in Japanese Patent Application Publication No. 2006-169325, etc. In addition, regarding the coating method of the resin composition, you can refer to the descriptions of International Publication No. 2017/030174 and International Publication No. 2017/018419, and these contents are incorporated into this description.

The resin composition layer formed on the support may be dried (prebaked). When the film is manufactured by a low-temperature process, pre-baking is not required. When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and further preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and further preferably 80 to 220 seconds. Prebaking can be performed using a heating plate, oven, etc.

Next, the resin composition layer is exposed in a pattern (exposure step). For example, the resin composition layer can be exposed in a pattern by using a stepper exposure machine, a scanning exposure machine, etc. through a mask having a predetermined mask pattern. Thereby, the exposed portion can be hardened.

Examples of radiation (light) that can be used during exposure include g-rays, i-rays, and the like. In addition, light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and KrF rays (wavelength: 248 nm) are preferred. In addition, a long-wavelength light source of 300 nm or more can also be used.

In addition, during exposure, light may be continuously irradiated for exposure, or pulse irradiation may be performed for exposure (pulse exposure). In addition, pulse exposure refers to an exposure method in which light is irradiated and paused repeatedly to perform exposure in a short period of time (for example, milliseconds or less).

For example, the irradiation amount (exposure amount) is preferably 0.03 to 2.5 J/cm ² , and more preferably 0.05 to 1.0 J/cm ² . The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, for example, it can also be performed in a low-oxygen environment with an oxygen concentration of 19 volume % or less (for example, 15 volume %, 5 volume %, or substantially no oxygen). Exposure can also be carried out in a high oxygen environment with an oxygen concentration exceeding 21 volume % (for example, 22 volume %, 30 volume % or 50 volume %). In addition, the exposure illuminance can be appropriately set, and can usually be selected from the range of 1000W/m ² to 100000W/m ² (for example, 5000W/m ² , 15000W/m ² or 35000W/m ² ). The conditions of oxygen concentration and exposure illuminance can be combined appropriately. For example, the oxygen concentration can be 10 volume % and the illuminance is 10000 W/m ² , the oxygen concentration can be 35 volume % and the illuminance is 20000 W/m ² , etc.

Next, the unexposed portion of the resin composition layer is removed by development to form a pattern (pixel). The unexposed portion of the resin composition layer can be removed by development using a developing solution. Thereby, the resin composition layer in the unexposed portion in the exposure step is dissolved into the developer, leaving only the photohardened portion. For example, the temperature of the developer is preferably 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal performance, the step of shaking off the developer every 60 seconds and supplying new developer may be repeated several times.

Examples of the developer include organic solvents, alkali developers, and the like, and an alkali developer is preferably used. As an alkali developer, an alkaline aqueous solution (alkali developer) obtained by diluting an alkali agent with pure water is preferred. Examples of the alkaline agent include ammonia, ethylamine, diethylamine, dimethylethanolamine, diethylene glycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, and tetraethyl hydroxide. Ammonium, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, bile Alkali, pyrrole, piperidine, 1,8-diazabicyclo-[5.4.0]-7-undecene and other organic basic compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, silicon Inorganic alkaline compounds such as sodium silicate and sodium metasilicate. From an environmental and safety perspective, it is better for the alkaline agent to be a compound with a large molecular weight. The concentration of the alkali agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, and more preferably 0.01 to 1% by mass. Moreover, the developer may further contain a surfactant. From the viewpoint of ease of transportation, storage, etc., the developer can be first produced as a concentrated solution and then diluted to a required concentration when used. The dilution ratio is not particularly limited, but can be set in the range of 1.5 to 100 times, for example. In addition, it is also preferable to wash (rinse) with pure water after development. Furthermore, it is preferable to perform rinsing by supplying a rinsing liquid to the developed resin composition layer while rotating the support on which the developed resin composition layer is formed. It is also preferable to move the nozzle that sprays the rinse liquid from the center of the support body to the peripheral edge of the support body. At this time, when moving the nozzle from the center part of the support body to the peripheral part, the moving speed of the nozzle may be gradually reduced while moving the nozzle. By performing flushing in this manner, in-plane unevenness of flushing can be suppressed. In addition, the same effect can also be obtained by gradually reducing the rotation speed of the support body while moving the nozzle from the center part of the support body to the peripheral part.

After development, it is preferable to perform additional exposure processing and heat processing (post-baking) after drying. The additional exposure process and post-baking are hardening processes after development for complete hardening. The heating temperature in post-baking is, for example, preferably 100 to 240°C, more preferably 200 to 240°C. In order to achieve the above conditions, heating mechanisms such as heating plates, convection ovens (hot air circulation dryers), and high-frequency heating machines can be used to post-bake the developed film in a continuous or intermittent manner. When performing additional exposure processing, it is preferable that the light used for exposure is light with a wavelength of 400 nm or less. In addition, the additional exposure process can be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

Pattern formation by dry etching preferably includes the following steps: forming a resin composition layer on a support using the resin composition of the present invention, and solidifying the entire resin composition layer to form a hardened material layer; The steps of forming a photoresist layer on the hardened material layer; the steps of exposing the photoresist layer in a pattern and then developing it to form a resist pattern; and using the resist pattern as a mask to use etching gas to etch the hardened material. The step of dry etching the layer. When forming the photoresist layer, it is better to further perform a pre-baking process. In particular, as the formation process of the photoresist layer, it is desirable to perform heat treatment after exposure and heat treatment after development (post-baking treatment). Regarding the formation of patterns by dry etching, please refer to paragraphs 0010 to 0067 of Japanese Patent Application Laid-Open No. 2013-064993, which content is incorporated into this specification.

＜Optical filter＞ The optical filter of the present invention has the above-mentioned film of the present invention. Examples of types of optical filters include color filters, near-infrared cutoff filters, near-infrared transmission filters, and the like, with color filters being preferred. The color filter preferably has the film of the present invention as its pixels, more preferably has the film of the present invention as the colored pixels, and further preferably has the film of the present invention as the red pixels.

The optical filter may be provided with a protective layer on the surface of the film of the present invention. By providing a protective layer, various functions can be provided, such as blocking oxygen oxidation, making it low-reflective, making it hydrophilic and hydrophobic, and blocking light of specific wavelengths (ultraviolet, near-infrared, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, and more preferably 0.1 to 5 μm. Examples of methods for forming the protective layer include a method of applying a resin composition for forming a protective layer, a chemical vapor deposition method, a method of attaching a molded resin with an adhesive material, and the like. Examples of components constituting the protective layer include (meth)acrylic resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polystyrene resin, polyetherstyrene resin, and polyphenylene resin. Polyarylene ether phosphine oxide resin, polyimide resin, polyamide imide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin , melamine resin, urethane resin, polyarylamine resin, polyamide resin, alkyd resin, epoxy resin, modified polysiloxane resin, fluorine resin, polyacrylonitrile resin, cellulose resin, Si, C, W, Al ₂ O ₃ , Mo, SiO ₂ , Si ₂ N ₄ , etc. may contain two or more of these components. For example, in the case of a protective layer with the purpose of blocking oxygen oxidation, it is preferable that the protective layer contains polyol resin, SiO ₂ and Si ₂ N ₄ . In addition, in the case of a protective layer for the purpose of low reflection, the protective layer preferably contains (meth)acrylic resin and fluororesin.

When the resin composition is applied to form the protective layer, known methods such as spin coating, casting, screen printing, and inkjet can be used as the coating method of the resin composition. As the organic solvent contained in the resin composition, a known organic solvent (for example, propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used. When the protective layer is formed by the chemical vapor deposition method, as the chemical vapor deposition method, a known chemical vapor deposition method (thermal chemical vapor deposition method, plasma chemical vapor deposition method, photochemical vapor deposition method) can be used Law).

If necessary, the protective layer may contain organic/inorganic particles, absorbers for specific wavelengths of light (for example, ultraviolet, near-infrared, etc.), refractive index adjusters, antioxidants, adhesives, surfactants and other additives. Examples of organic/inorganic fine particles include polymer fine particles (for example, polysilicone resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, Titanium nitride, titanium oxynitride, magnesium fluoride, hollow silicon dioxide, silicon dioxide, calcium carbonate, barium sulfate, etc. As an absorber for light of a specific wavelength, a known absorber can be used. The content of these additives can be appropriately adjusted, but relative to the total mass of the protective layer, 0.1 to 70 mass % is more preferred, and 1 to 60 mass % is further more preferred.

In addition, as the protective layer, the protective layer described in paragraphs 0073 to 0092 of Japanese Patent Application Laid-Open No. 2017-151176 can also be used.

The optical filter may have a structure in which each pixel is embedded in a space divided by partition walls into, for example, a grid shape.

＜Solid-state imaging device＞ The solid-state imaging element of the present invention has the above-mentioned film of the present invention. The structure of the solid-state imaging element is not particularly limited as long as it is provided with the film of the present invention and functions as a solid-state imaging element. Examples thereof include the following structures.

A solid-state imaging device has a structure in which a plurality of photodiodes constituting the light-receiving area of a solid-state imaging device (CCD (Charge Coupled Device) image sensor, CMOS (Complementary Metal Oxide Semiconductor) image sensor, etc.) are provided on a substrate. The transmission electrode is composed of silicon and polysilicon, and has a light-shielding film on the photodiode and the transmission electrode with only the light-receiving part of the photodiode opening. The light-shielding film has a light-shielding film formed in such a manner as to cover the entire light-shielding film and the light-receiving part of the photodiode. The element protective film composed of silicon nitride, etc. has a color filter on the element protective film. Furthermore, a structure in which a light condensing mechanism (for example, a microlens, etc.; the same applies to the following) is provided on the element protective film and below the color filter (closer to the substrate side) or a structure in which a light condensing mechanism is provided on the color filter may be used. wait. Furthermore, the color filter may have a structure in which each pixel is embedded in a space divided by partition walls into, for example, a grid shape. At this time, it is preferable that the refractive index of the partition wall is lower than that of each colored pixel. Examples of imaging devices having such a structure include devices described in Japanese Patent Application Publication No. 2012-227478, Japanese Patent Application Publication No. 2014-179577, and International Publication No. 2018/043654. Furthermore, as shown in Japanese Patent Application Publication No. 2019-211559, an ultraviolet absorbing layer can be provided in the structure of the solid-state imaging element to improve light resistance. The imaging device equipped with the solid-state imaging element of the present invention can be used not only as a digital camera or an electronic device (mobile phone, etc.) with imaging functions, but also as a driving recorder or a surveillance camera.

<Image display device> The image display device of the present invention has the film of the present invention described above. Examples of image display devices include liquid crystal display devices, organic electroluminescence display devices, and the like. The definition of an image display device and the details of each image display device are described in, for example, "Electronic Display Devices (by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd., 1990)" and "Display Devices (Jun Ibuki)" Chapter book, Sangyo Tosho Publishing Co., Ltd., released in 1989)" and so on. Further, the liquid crystal display device is described in, for example, "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". The liquid crystal display device to which the present invention can be applied is not particularly limited. For example, it can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology". [Example]

Hereinafter, an Example is given and this invention is demonstrated more concretely. The materials, usage amounts, proportions, treatment contents, treatment procedures, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Moreover, in the structural formula shown below, Et represents an ethyl group, Me represents a methyl group, and Bu represents a butyl group.

<Synthesis Example> (Synthesis of Monomer A-1a) After adding 30.0g (0.23mol) of 2-hydroxyethyl methacrylate, 0.3g of dibutyltin acetate, and 60.0g of ethyl acetate into a three-necked flask, the temperature was raised. to 50℃. Next, 27.4 g (0.23 mol) of phenyl isocyanate was added dropwise to the mixture. After the dropwise addition was completed, the reaction liquid was further stirred for 3 hours and concentrated, thereby obtaining 57.4 g of monomer A-1a. [Chemical 31]

(Synthesis of Monomer A-2a) Monomer A-2a was synthesized in the same manner as monomer A-1a. [Chemical 32]

(Synthesis of Monomer A-3a) After adding 30.0g (0.19mol) of 2-ethyl methacrylate, 0.3g of dibutyltin acetate, and 60.0g of ethyl acetate into a three-necked flask, raise the temperature to 50 ℃. Next, 14.3 g (0.19 mol) of n-butanol was added dropwise to the mixture. After the dropwise addition was completed, the reaction liquid was further stirred for 3 hours and concentrated, thereby obtaining 41.3 g of monomer A-3a. [Chemical 33]

(Synthesis of Monomer A-4a) After adding 100 g (0.64 mol) of 2-isocyanate ethyl methacrylate and 1000 g of ethyl acetate into a three-necked flask, the mixture was cooled with ice water until the internal temperature reached 5°C. Next, 38.1 g (0.64 mol) of n-propylamine was added dropwise so that the internal temperature would not exceed 25°C. After completion of the dropwise addition, the mixture was further stirred for 1 hour, and the precipitated solid was filtered and then air-dried to obtain 138.1 g of monomer A-4a. [Chemical 34]

(Synthesis of monomers A-5a to A-48a) Monomers A-5a to A-48a were synthesized in the same manner as monomer A-4a.

[Chemical 35] [Chemical 36] [Chemical 37]

(Synthesis of P1 resin) Add 13.0g (0.151mol) of monomer B-2a, 29.9g (0.120mol) of monomer A-1a, 50.0g (0.050mol) of monomer D-5a, into a three-necked flask. 210 g of 1-methoxy-2-propanol were obtained to obtain a mixture. Next, the mixture was stirred while blowing nitrogen gas, and the temperature of the mixture was raised to 75°C. Next, 1.46 g of dodecyl mercaptan was added to the mixture, followed by 0.37 g of 2,2'-azobis(2-methylpropionic acid methyl ester) (hereinafter referred to as V-601). , to initiate the polymerization reaction. After the mixture was heated at 75° C. for 3 hours, 0.37 g of V-601 was further added to the mixture. After 2 hours, 0.37 g of V-601 was further added to the mixture, and the temperature was raised to 90° C. A precursor polymer was obtained by stirring the mixture for 3 hours. To a three-necked flask that had been fully replaced with air, 305.5g of the precursor polymer, 7.00g (0.035mol) of 4-hydroxybutyl acrylate glycidyl ether, and 2.42g (0.011 mol) of N,N-dimethyldodecylamine, 0.25g (0.0016mol) of 2,2,6,6-tetramethylpiperidine 1-oxyl (TEMPO), 34.7g of 1-methoxy -2-Propanol was stirred for 48 hours, thereby obtaining a 30 mass% solution of resin P1. [Chemical 38]

(Synthesis of resins P2 to P86 and P104 to P109) Resins P2 to P86 and P104 to P109 were synthesized in the same method as resin P-1.

(Synthesis of Resin P87> Add 2.5g (0.029mol) of monomer B-2a, 7.5g (0.030mol) of monomer A-1a, 15.0g (0.150mol) of monomer C-1a, 58.3g of 1 -methoxy-2-propanol to obtain a mixture. Next, the mixture was stirred while blowing nitrogen gas, and the temperature of the mixture was raised to 75°C. Next, 0.95 g of dodecyl mercaptan was added to the mixture, and then , 0.24g of V-601 was added to initiate the polymerization reaction. After the mixture was heated at 75°C for 3 hours, 0.24g of V-601 was added to the mixture. After 2 hours, 0.24g of V-601 was added to the mixture. g of V-601, and raised the temperature to 90°C. Resin P87 was obtained by stirring the mixture for 3 hours. [Chemical 39]

(Synthesis of resins P88 to P103> Resins P88 to P103 were synthesized in the same method as resin P-87.

<Resins P1 to P109 and CP1> Resins P1 to P109 and CP1 are resins each containing repeating units shown in the table below. The acid value and weight average molecular weight (Mw) of the resin are also reported. [Table 1] Repeating unit 1 Repeating unit 2 Repeat unit 3 Repeating unit 4 Repeating unit 5 Acid value (mgKOH/g) Mw Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) P1 A-1 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P2 A-2 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P3 A-3 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P4 A-4 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P5 A-5 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P6 A-6 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P7 A-7 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P8 A-8 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P9 A-9 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P10 A-10 30 B-2 10 0 D-5 50 E-2 10 62 24000 P11 A-11 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P12 A-12 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P13 A-13 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P14 A-14 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P15 A-15 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P16 A-16 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P17 A-17 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P18 A-18 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P19 A-19 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P20 A-20 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P21 A-21 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P22 A-22 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P23 A-23 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P24 A-24 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P25 A-25 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 [Table 2] Repeating unit 1 Repeating unit 2 Repeat unit 3 Repeating unit 4 Repeating unit 5 Acid value (mgKOH/g) Mw Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) P26 A-26 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P27 A-27 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P28 A-28 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P29 A-29 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P30 A-30 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P31 A-31 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P32 A-32 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P33 A-33 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P34 A-34 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P35 A-35 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P36 A-36 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P37 A-37 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P38 A-38 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P39 A-39 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P40 A-40 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P41 A-41 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P42 A-42 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P43 A-43 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P44 A-44 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P45 A-45 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P46 A-46 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P47 A-47 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P48 A-48 30 B-2 10 - 0 D-5 50 E-2 10 62 24000 P49 A-24 30 B-2 5 C-1 5 D-5 50 E-2 10 31 24000 P50 A-24 30 B-2 15 - 0 D-5 45 E-2 10 93 24000 [table 3] Repeating unit 1 Repeating unit 2 Repeat unit 3 Repeating unit 4 Repeating unit 5 Acid value (mgKOH/g) Mw Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) P51 A-24 30 B-2 20 - 0 D-5 40 E-2 10 124 24000 P52 A-24 30 B-2 25 - 0 D-5 35 E-2 10 155 24000 P53 A-24 25 B-2 30 - 0 D-5 35 E-2 10 186 24000 P54 A-7 30 B-2 5 C-1 5 D-5 50 E-2 10 31 24000 P55 A-7 30 B-2 15 - 0 D-5 45 E-2 10 93 24000 P56 A-7 30 B-2 20 - 0 D-5 40 E-2 10 124 24000 P57 A-7 30 B-2 25 - 0 D-5 35 E-2 10 155 24000 P58 A-7 25 B-2 30 - 0 D-5 35 E-2 10 186 24000 P59 A-7 30 B-2 10 C-1 5 D-5 45 E-2 10 62 24000 P60 A-7 30 B-2 10 C-3 5 D-5 45 E-2 10 62 24000 P61 A-7 30 B-2 10 C-9 5 D-5 45 E-2 10 62 24000 P62 A-7 30 B-2 10 C-17 5 D-5 45 E-2 10 62 24000 P63 A-24 10 B-2 10 - 0 D-5 70 E-2 10 62 24000 P64 A-24 20 B-2 10 - 0 D-5 60 E-2 10 62 24000 P65 A-24 40 B-2 10 - 0 D-5 40 E-2 10 62 24000 P66 A-24 50 B-2 10 - 0 D-5 30 E-2 10 62 24000 P67 A-6 10 B-2 10 - 0 D-5 70 E-2 10 62 24000 P68 A-6 20 B-2 10 - 0 D-5 60 E-2 10 62 24000 P69 A-6 40 B-2 10 - 0 D-5 40 E-2 10 62 24000 P70 A-6 50 B-2 10 - 0 D-5 30 E-2 10 62 24000 P71 A-24 30 B-2 10 - 0 D-5 55 E-2 5 62 24000 P72 A-24 30 B-2 10 - 0 D-5 45 E-2 15 62 24000 P73 A-24 25 B-2 10 - 0 D-5 40 E-2 25 62 24000 P74 A-6 30 B-2 10 - 0 D-5 55 E-2 5 62 24000 P75 A-6 30 B-2 10 - 0 D-5 45 E-2 15 62 24000 [Table 4] Repeating unit 1 Repeating unit 2 Repeat unit 3 Repeating unit 4 Repeating unit 5 Acid value (mgKOH/g) Mw Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) P76 A-6 25 B-2 10 - 0 D-5 40 E-2 25 62 24000 P77 A-24 20 B-3 30 - 0 D-5 40 E-3 10 73 24000 P78 A-24 30 B-6 20 - 0 D-5 40 E-6 10 76 24000 P79 A-24 30 B-2 10 - 0 D-5 50 E-2 10 62 8000 P80 A-24 30 B-2 10 - 0 D-5 50 E-2 10 62 15000 P81 A-24 30 B-2 10 - 0 D-5 50 E-2 10 62 30000 P82 A-24 32.8 B-2 8.5 - 0 D-5 40 E-2 18.7 53 50000 P83 A-11 30 B-2 10 - 0 D-5 50 E-2 10 62 10000 P84 A-11 30 B-2 10 - 0 D-5 50 E-2 10 62 18000 P85 A-11 30 B-2 10 - 0 D-5 50 E-2 10 62 35000 P86 A-11 30 B-2 10 - 0 D-5 50 E-2 10 62 60000 P87 A-1 30 B-2 10 C-1 60 - 0 - 0 62 24000 P88 A-1 30 B-2 10 - 0 D-1 60 - 0 62 24000 P89 A-1 30 B-2 10 - 0 D-5 60 - 0 62 24000 P90 A-4 30 B-2 10 - 0 D-5 60 - 0 62 24000 P91 A-24 30 B-2 10 - 0 D-5 60 - 0 62 24000 P92 A-24 20 B-3 30 - 0 D-5 50 - 0 73 24000 P93 A-24 30 B-6 20 - 0 D-5 50 - 0 76 24000 P94 A-24 20 B-7 30 - 0 D-5 50 - 0 60 24000 P95 A-24 30 B-9 20 - 0 D-5 50 - 0 70 24000 P96 A-24 30 B-11 15 - 0 D-5 55 - 0 40 24000 P97 A-24 30 B-14 20 - 0 D-5 50 - 0 63 24000 P98 A-11 20 B-3 30 - 0 D-5 50 - 0 73 24000 P99 A-11 30 B-6 20 - 0 D-5 50 - 0 76 24000 P100 A-11 20 B-7 30 - 0 D-5 50 - 0 60 24000 [table 5] Repeating unit 1 Repeating unit 2 Repeat unit 3 Repeating unit 4 Repeating unit 5 Acid value (mgKOH/g) Mw Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) Kind Content(mass%) P101 A-11 20 B-9 20 - 0 D-5 60 - 0 70 24000 P102 A-11 30 B-11 15 - 0 D-5 55 - 0 40 24000 P103 A-11 30 B-14 20 - 0 D-5 50 - 0 63 24000 P104 A-24 30 B-2 10 - 0 D-1 50 E-2 10 62 24000 P105 A-24 30 B-2 10 - 0 D-2 50 E-2 10 62 24000 P106 A-24 30 B-2 10 - 0 D-3 50 E-2 10 62 24000 P107 A-24 30 B-2 10 - 0 D-4 50 E-2 10 62 24000 P108 A-24 30 B-2 10 - 0 D-6 50 E-2 10 62 24000 P109 A-24 30 B-2 10 - 0 D-7 50 E-2 10 62 24000 CPl - 0 B-2 10 C-1 30 - 60 - 0 62 24000

[Repeating unit 1] A-1 to A-48: Repeating units of the following structure (repeating units having a urea group or a urethane group) [Chemical 40] [Chemical 41] [Chemical 42] [Chemical 43]

[Repeating unit 2] B-2, B-3, B-6, B-7, B-9, B-11, B-14: Repeating unit of the following structure (repeating unit having an acid group) [Chemical 44 ]

[Repeating unit 3] C-1, C-3, C-9, C-17: Repeating unit of the following structure [Chemical 45]

[Repeating unit 4] D-1 to D-7: Repeating units of the following structure (repeating units with grafted chains) [Chemical 46]

[Repeating unit 5] E-2, E-3, E-6: Repeating units of the following structure (repeating units having a cross-linking group) [Chemical 47]

＜Manufacture of Pigment Dispersion＞ Using a bead mill (using zirconium dioxide beads with a diameter of 0.1 mm), mix and disperse the mixture obtained by mixing the materials listed in the table below for 3 hours, and then use high-pressure dispersion with a pressure reducing mechanism. Machine NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) was used to perform dispersion processing at a pressure of 2000 MPa and a flow rate of 500 g/min. This dispersion process was repeated 10 times to obtain each pigment dispersion liquid. The numerical values described in the following tables are parts by mass. The average particle diameter (nm) of the pigment in each pigment dispersion liquid and the viscosity value (mPa·s) of each pigment dispersion liquid are also described in the table below. The average particle size of the pigment was measured by the dynamic light scattering method using a particle size measuring device (nanoSAQLA, manufactured by Otsuka Electronics Co., Ltd.). The viscosity of the pigment dispersion was measured using a viscometer (RE-85L, manufactured by Toki Sangyo Co., Ltd.) while adjusting the temperature of the pigment dispersion to 25°C.

[Table 6] Pigment dispersion color material Pigments derivative PR272 PR254 PR224 PY139 PY150 PY185 PG36 PB15:6 PV23 IR color material 1 PBk32 Derivative 1 Derivative 2 Derivative 3 Derivative 4 R1 2.25 2.25 1.31 0.83 R2 2.25 2.25 1.31 0.83 R3 2.25 2.25 1.31 0.83 R4 2.25 2.25 1.31 0.83 R5 2.25 2.25 1.31 0.83 R6 2.25 2.25 1.31 0.83 R7 2.25 2.25 1.31 0.83 R8 2.25 2.25 1.31 0.83 R9 2.25 2.25 1.31 0.83 R10 2.25 2.25 1.31 0.83 R11 2.25 2.25 1.31 0.83 R12 2.25 2.25 1.31 0.83 R13 2.25 2.25 1.31 0.83 R14 2.25 2.25 1.31 0.83 R15 2.25 2.25 1.31 0.83 R16 2.25 2.25 1.31 0.83 R17 2.25 2.25 1.31 0.83 R18 2.25 2.25 1.31 0.83 R19 2.25 2.25 1.31 0.83 R20 2.25 2.25 1.31 0.83 R21 2.25 2.25 1.31 0.83 R22 2.25 2.25 1.31 0.83 R23 2.25 2.25 1.31 0.83 R24 2.25 2.25 1.31 0.83 R25 2.25 2.25 1.31 0.83 [Table 7] Pigment dispersion Resin Solvent physical properties Resin 1 Resin 2 Average particle size (nm) Viscosity (mPa·s) Kind parts by mass Kind parts by mass Solvent 1 Solvent 2 Solvent 3 R1 P1 2.8 44.9 0 11.9 101 4.1 R2 P2 2.8 44.9 0 11.9 101 4.1 R3 P3 2.8 44.9 0 11.9 110 4.5 R4 P4 2.8 44.9 0 11.9 60 3.0 R5 P5 2.8 44.9 0 11.9 60 3.0 R6 P6 2.8 44.9 0 11.9 60 3.0 R7 P7 2.8 44.9 0 11.9 60 3.0 R8 P8 2.8 44.9 0 11.9 70 3.2 R9 P9 2.8 44.9 0 11.9 70 3.2 R10 P10 2.8 44.9 0 11.9 70 3.2 R11 P11 2.8 44.9 0 11.9 60 3.0 R12 P12 2.8 44.9 0 11.9 70 3.2 R13 P13 2.8 44.9 0 11.9 70 3.2 R14 P14 2.8 44.9 0 11.9 91 3.7 R15 P15 2.8 44.9 0 11.9 70 3.2 R16 P16 2.8 44.9 0 11.9 70 3.2 R17 P17 2.8 44.9 0 11.9 70 3.2 R18 P18 2.8 44.9 0 11.9 70 3.2 R19 P19 2.8 44.9 0 11.9 101 4.1 R20 P20 2.8 44.9 0 11.9 101 4.1 R21 P21 2.8 44.9 0 11.9 101 4.1 R22 P22 2.8 44.9 0 11.9 101 4.1 R23 P23 2.8 44.9 0 11.9 101 4.1 R24 P24 2.8 44.9 0 11.9 101 4.1 R25 P25 2.8 44.9 0 11.9 101 4.1

[Table 8] Pigment dispersion color material Pigments derivative PR272 PR254 PR224 PY139 PY150 PY185 PG36 PB15:6 PV23 IR color material 1 PBk32 Derivative 1 Derivative 2 Derivative 3 Derivative 4 R26 2.25 2.25 1.31 0.83 R27 2.25 2.25 1.31 0.83 R28 2.25 2.25 1.31 0.83 R29 2.25 2.25 1.31 0.83 R30 2.25 2.25 1.31 0.83 R31 2.25 2.25 1.31 0.83 R32 2.25 2.25 1.31 0.83 R33 2.25 2.25 1.31 0.83 R34 2.25 2.25 1.31 0.83 R35 2.25 2.25 1.31 0.83 R36 2.25 2.25 1.31 0.83 R37 2.25 2.25 1.31 0.83 R38 2.25 2.25 1.31 0.83 R39 2.25 2.25 1.31 0.83 R40 2.25 2.25 1.31 0.83 R41 2.25 2.25 1.31 0.83 R42 2.25 2.25 1.31 0.83 R43 2.25 2.25 1.31 0.83 R44 2.25 2.25 1.31 0.83 R45 2.25 2.25 1.31 0.83 R46 2.25 2.25 1.31 0.83 R47 2.25 2.25 1.31 0.83 R48 2.25 2.25 1.31 0.83 R49 2.25 2.25 1.31 0.83 R50 2.25 2.25 1.31 0.83 [Table 9] Pigment dispersion Resin Solvent physical properties Resin 1 Resin 2 Average particle size (nm) Viscosity (mPa·s) Kind parts by mass Kind parts by mass Solvent 1 Solvent 2 Solvent 3 R26 P26 2.8 44.9 0 11.9 101 4.1 R27 P27 2.8 44.9 0 11.9 101 4.1 R28 P28 2.8 44.9 0 11.9 70 3.2 R29 P29 2.8 44.9 0 11.9 70 3.2 R30 P30 2.8 44.9 0 11.9 60 3.0 R31 P31 2.8 44.9 0 11.9 60 3.0 R32 P32 2.8 44.9 0 11.9 60 3.0 R33 P33 2.8 44.9 0 11.9 60 3.0 R34 P34 2.8 44.9 0 11.9 60 3.0 R35 P35 2.8 44.9 0 11.9 70 3.2 R36 P36 2.8 44.9 0 11.9 60 3.0 R37 P37 2.8 44.9 0 11.9 60 3.0 R38 P38 2.8 44.9 0 11.9 60 3.0 R39 P39 2.8 44.9 0 11.9 60 3.0 R40 P40 2.8 44.9 0 11.9 60 3.0 R41 P41 2.8 44.9 0 11.9 60 3.0 R42 P42 2.8 44.9 0 11.9 60 3.0 R43 P43 2.8 44.9 0 11.9 60 3.0 R44 P44 2.8 44.9 0 11.9 70 3.2 R45 P45 2.8 44.9 0 11.9 70 3.2 R46 P46 2.8 44.9 0 11.9 60 3.0 R47 P47 2.8 44.9 0 11.9 60 3.0 R48 P48 2.8 44.9 0 11.9 60 3.0 R49 P49 2.8 44.9 0 11.9 60 3.0 R50 P50 2.8 44.9 0 11.9 60 3.0

[Table 10] Pigment dispersion color material Pigments derivative PR272 PR254 PR224 PY139 PY150 PY185 PG36 PB15:6 PV23 IR color material 1 PBk32 Derivative 1 Derivative 2 Derivative 3 Derivative 4 R51 2.25 2.25 1.31 0.83 R52 2.25 2.25 1.31 0.83 R53 2.25 2.25 1.31 0.83 R54 2.25 2.25 1.31 0.83 R55 2.25 2.25 1.31 0.83 R56 2.25 2.25 1.31 0.83 R57 2.25 2.25 1.31 0.83 R58 2.25 2.25 1.31 0.83 R59 2.25 2.25 1.31 0.83 R60 2.25 2.25 1.31 0.83 R61 2.25 2.25 1.31 0.83 R62 2.25 2.25 1.31 0.83 R63 2.25 2.25 1.31 0.83 R64 2.25 2.25 1.31 0.83 R65 2.25 2.25 1.31 0.83 R66 2.25 2.25 1.31 0.83 R67 2.25 2.25 1.31 0.83 R68 2.25 2.25 1.31 0.83 R69 2.25 2.25 1.31 0.83 R70 2.25 2.25 1.31 0.83 R71 2.25 2.25 1.31 0.83 R72 2.25 2.25 1.31 0.83 R73 2.25 2.25 1.31 0.83 R74 2.25 2.25 1.31 0.83 R75 2.25 2.25 1.31 0.83 [Table 11] Pigment dispersion Resin Solvent physical properties Resin 1 Resin 2 Average particle size (nm) Viscosity (mPa・s) Kind parts by mass Kind parts by mass Solvent 1 Solvent 2 Solvent 3 R51 P51 2.8 44.9 0 11.9 60 3.0 R52 P52 2.8 44.9 0 11.9 70 3.2 R53 P53 2.8 44.9 0 11.9 70 3.2 R54 P54 2.8 44.9 0 11.9 60 3.0 R55 P55 2.8 44.9 0 11.9 60 3.0 R56 P56 2.8 44.9 0 11.9 60 3.0 R57 P57 2.8 44.9 0 11.9 70 3.2 R58 P58 2.8 44.9 0 11.9 70 3.2 R59 P59 2.8 44.9 0 11.9 60 3.0 R60 P60 2.8 44.9 0 11.9 60 3.0 R61 P61 2.8 44.9 0 11.9 60 3.0 R62 P62 2.8 44.9 0 11.9 60 3.0 R63 P63 2.8 44.9 0 11.9 70 3.2 R64 P64 2.8 44.9 0 11.9 60 3.0 R65 P65 2.8 44.9 0 11.9 60 3.0 R66 P66 2.8 44.9 0 11.9 60 3.0 R67 P67 2.8 44.9 0 11.9 70 3.2 R68 P68 2.8 44.9 0 11.9 60 3.0 R69 P69 2.8 44.9 0 11.9 60 3.0 R70 P70 2.8 44.9 0 11.9 60 3.0 R71 P71 2.8 44.9 0 11.9 60 3.0 R72 P72 2.8 44.9 0 11.9 60 3.0 R73 P73 2.8 44.9 0 11.9 60 3.0 R74 P74 2.8 44.9 0 11.9 60 3.0 R75 P75 2.8 44.9 0 11.9 60 3.0

[Table 12] Pigment dispersion color material Pigments derivative PR272 PR254 PR224 PY139 PY150 PY185 PG36 PB15:6 PV23 IR color material 1 PBk32 Derivative 1 Derivative 2 Derivative 3 Derivative 4 R76 2.25 2.25 1.31 0.83 R77 2.25 2.25 1.31 0.83 R78 2.25 2.25 1.31 0.83 R79 2.25 2.25 1.31 0.83 R80 2.25 2.25 1.31 0.83 R81 2.25 2.25 1.31 0.83 R82 2.25 2.25 1.31 0.83 R83 2.25 2.25 1.31 0.83 R84 2.25 2.25 1.31 0.83 R85 2.25 2.25 1.31 0.83 R86 2.25 2.25 1.31 0.83 R87 2.25 2.25 1.31 0.83 R88 2.25 2.25 1.31 0.83 R89 2.25 2.25 1.31 0.83 R90 2.25 2.25 1.31 0.83 R91 2.25 2.25 1.31 0.83 R92 2.25 2.25 1.31 0.83 R93 2.25 2.25 1.31 0.83 R94 2.25 2.25 1.31 0.83 R95 2.25 2.25 1.31 0.83 R96 2.25 2.25 1.31 0.83 R97 2.25 2.25 1.31 0.83 R98 2.25 2.25 1.31 0.83 R99 2.25 2.25 1.31 0.83 R100 2.25 2.25 1.31 0.83 [Table 13] Pigment dispersion Resin Solvent physical properties Resin 1 Resin 2 Average particle size (nm) Viscosity (mPa·s) Kind parts by mass Kind parts by mass Solvent 1 Solvent 2 Solvent 3 R76 P76 2.8 44.9 0 11.9 60 3.0 R77 P77 2.8 44.9 0 11.9 60 3.0 R78 P78 2.8 44.9 0 11.9 60 3.0 R79 P79 2.8 44.9 0 11.9 70 3.2 R80 P80 2.8 44.9 0 11.9 60 3.0 R81 P81 2.8 44.9 0 11.9 60 3.0 R82 P82 2.8 44.9 0 11.9 60 3.0 R83 P83 2.8 44.9 0 11.9 70 3.2 R84 P84 2.8 44.9 0 11.9 60 3.0 R85 P85 2.8 44.9 0 11.9 60 3.0 R86 P86 2.8 44.9 0 11.9 60 3.0 R87 P87 1.4 CP11 1.4 44.9 0 11.9 110 4.5 R88 P88 1.4 CP11 1.4 44.9 0 11.9 105 4.3 R89 P89 1.4 CP11 1.4 44.9 0 11.9 101 4.1 R90 P90 1.4 CP11 1.4 44.9 0 11.9 91 3.7 R91 P91 1.4 CP11 1.4 44.9 0 11.9 60 3.0 R92 P92 1.4 CP11 1.4 44.9 0 11.9 60 2.9 R93 P93 1.4 CP11 1.4 44.9 0 11.9 60 2.9 R94 P94 1.4 CP11 1.4 44.9 0 11.9 76 3.5 R95 P95 1.4 CP11 1.4 44.9 0 11.9 60 2.9 R96 P96 1.4 CP11 1.4 44.9 0 11.9 80 3.6 R97 P97 1.4 CP11 1.4 44.9 0 11.9 84 3.7 R98 P98 1.4 CP11 1.4 44.9 0 11.9 60 2.8 R99 P99 1.4 CP11 1.4 44.9 0 11.9 60 2.8 R100 P100 1.4 CP11 1.4 44.9 0 11.9 78 3.6

[Table 14] Pigment dispersion color material Pigments derivative PR272 PR254 PR224 PY139 PY150 PY185 PG36 PB15:6 PV23 IR color material 1 PBk32 Derivative 1 Derivative 2 Derivative 3 Derivative 4 R101 2.25 2.25 1.31 0.83 R102 2.25 2.25 1.31 0.83 R103 2.25 2.25 1.31 0.83 R104 2.25 2.25 1.31 0.83 R105 2.25 2.25 1.31 0.83 R106 2.25 2.25 1.31 0.83 R107 2.25 2.25 1.31 0.83 R108 2.25 2.25 1.31 0.83 R109 2.25 2.25 1.31 0.83 R110 2.25 2.25 1.31 0.83 R111 2.25 2.25 1.31 0.83 R112 2.25 2.25 1.31 0.83 R113 2.25 2.25 1.31 0.83 R114 2.25 2.25 1.31 0.83 R115 2.25 2.25 1.31 0.83 R116 2.25 2.25 1.31 0.83 R117 2.25 2.25 1.31 0.83 R118 2.25 2.25 1.31 0.83 R119 2.25 2.25 2.14 R120 2.25 2.25 2.14 R121 2.25 2.25 1.31 0.21 0.62 R122 2.25 2.25 1.31 0.42 0.42 R123 2.25 2.25 1.31 0.62 0.21 R124 2.25 2.25 1.31 0.83 R125 2.25 2.25 1.31 0.83 [Table 15] Pigment dispersion Resin Solvent physical properties Resin 1 Resin 2 Average particle size (nm) Viscosity (mPa·s) Kind parts by mass Kind parts by mass Solvent 1 Solvent 2 Solvent 3 R101 P101 1.4 CP11 1.4 44.9 0 11.9 60 2.8 R102 P102 1.4 CP11 1.4 44.9 0 11.9 86 3.9 R103 P103 1.4 CP11 1.4 44.9 0 11.9 89 4.0 R104 P104 2.8 44.9 0 11.9 68 3.2 R105 P105 2.8 44.9 0 11.9 69 3.2 R106 P106 2.8 44.9 0 11.9 66 3.3 R107 P107 2.8 44.9 0 11.9 61 3.1 R108 P108 2.8 44.9 0 11.9 62 3.1 R109 P109 2.8 44.9 0 11.9 62 3.1 R110 P7 1.3 44.9 0 11.9 62 3.1 R111 P7 1.7 44.9 0 11.9 62 3.1 R112 P7 2.0 44.9 0 11.9 62 3.1 R113 P7 2.3 44.9 0 11.9 62 3.1 R114 P7 2.7 44.9 0 11.9 62 3.1 R115 P7 3.0 44.9 0 11.9 62 3.1 R116 P24 2.8 44.9 0 11.9 56 2.7 R117 P24 2.8 44.9 0 11.9 64 3.2 R118 P24 2.8 44.9 0 11.9 66 3.3 R119 P7 2.8 44.9 0 11.9 86 3.9 R120 P24 2.8 44.9 0 11.9 86 3.9 R121 P6 2.8 44.9 0 11.9 58 2.9 R122 P6 2.8 44.9 0 11.9 59 3.0 R123 P6 2.8 44.9 0 11.9 60 3.0 R124 P7 1.4 P87 1.4 44.9 0 11.9 70 3.2 R125 P24 1.4 P87 1.4 44.9 0 11.9 70 3.2

[Table 16] Pigment dispersion color material Pigments derivative PR272 PR254 PR224 PY139 PY150 PY185 PG36 PB15:6 PV23 IR color material 1 PBk32 Derivative 1 Derivative 2 Derivative 3 Derivative 4 R126 2.25 2.25 1.31 0.83 R127 2.25 2.25 1.31 0.83 R128 1.13 3.38 1.31 0.83 R129 3.38 1.13 1.31 0.83 R130 2.25 2.25 1.31 0.83 R131 2.25 2.25 1.31 0.83 R132 3.02 3.02 1.76 1.12 R133 2.25 2.25 1.31 0.83 R134 4.5 1.31 0.83 Y1 5.81 0.83 Y2 5.81 0.83 Y3 5.81 0.83 G1 1.31 4.5 0.83 G2 1.31 4.5 0.83 G3 1.31 4.5 0.83 G4 1.31 4.5 0.83 G5 1.31 4.5 0.83 G6 1.31 4.5 0.83 G7 1.31 4.5 0.83 [Table 17] Pigment dispersion Resin Solvent physical properties Resin 1 Resin 2 Average particle size (nm) Viscosity (mPa·s) Kind parts by mass Kind parts by mass Solvent 1 Solvent 2 Solvent 3 R126 P7 1.4 CP12 1.4 44.9 0 11.9 70 3.2 R127 P24 1.4 CP13 1.4 44.9 0 11.9 70 3.2 R128 P7 2.8 44.9 0 11.9 60 3.0 R129 P7 2.8 44.9 0 11.9 60 3.0 R130 P7 2.8 44.9 11.9 0 65 3.2 R131 P7 2.8 33.0 11.9 11.9 61 3.1 R132 P7 4.3 44.9 0 11.9 61 3.1 R133 P7 2.8 44.9 0 11.9 60 3.0 R134 P7 2.8 44.9 0 11.9 85 3.5 Y1 P7 2.8 44.9 0 11.9 60 3.0 Y2 P7 2.8 44.9 0 11.9 60 3.0 Y3 P7 2.8 44.9 0 11.9 60 3.0 G1 P1 2.8 44.9 11.9 0 120 4.7 G2 P3 2.8 44.9 11.9 0 130 4.9 G3 P4 2.8 44.9 11.9 0 110 4.3 G4 P10 2.8 44.9 11.9 0 100 4.2 G5 P7 2.8 44.9 11.9 0 85 3.5 G6 P11 2.8 44.9 11.9 0 85 3.5 G7 P24 2.8 44.9 11.9 0 85 3.5

[Table 18] Pigment dispersion color material Pigments derivative PR272 PR254 PR224 PY139 PY150 PY185 PG36 PB15:6 PV23 IR color material 1 PBk32 Derivative 1 Derivative 2 Derivative 3 Derivative 4 B1 4.36 1.45 0.83 B2 4.36 1.45 0.83 B3 4.36 1.45 0.83 B4 4.36 1.45 0.83 B5 4.36 1.45 0.83 B6 4.36 1.45 0.83 B7 4.36 1.45 0.83 Cy1 5.81 0.83 Cy2 5.81 0.83 Cy3 5.81 0.83 IR1 5.81 0.83 IR2 5.81 0.83 IR3 5.81 0.83 IR4 5.81 0.83 IR5 5.81 0.83 IR6 5.81 0.83 IR7 5.81 0.83 ikB 5.81 0.83 Bk2 5.81 0.83 Bk3 5.81 0.83 Bk4 5.81 0.83 Bk5 5.81 0.83 Bk6 5.81 0.83 Bk7 5.81 0.83 CR1 2.25 2.25 1.31 0.83 [Table 19] Pigment dispersion Resin Solvent physical properties Resin 1 Resin 2 Average particle size (nm) Viscosity (mPa·s) Kind parts by mass Kind parts by mass Solvent 1 Solvent 2 Solvent 3 B1 P1 2.8 44.9 11.9 0 120 4.7 B2 P3 2.8 44.9 11.9 0 130 4.9 B3 P4 2.8 44.9 11.9 0 110 4.3 B4 P10 2.8 44.9 11.9 0 100 4.2 B5 P7 2.8 44.9 11.9 0 85 3.5 B6 P11 2.8 44.9 11.9 0 85 3.5 B7 P24 2.8 44.9 11.9 0 85 3.5 Cy1 P7 2.8 44.9 11.9 0 85 3.5 Cy2 P11 2.8 44.9 11.9 0 85 3.5 Cy3 P24 2.8 44.9 11.9 0 85 3.5 IR1 P1 2.8 44.9 11.9 0 125 4.7 IR2 P3 2.8 44.9 11.9 0 135 4.9 IR3 P4 2.8 44.9 11.9 0 115 4.3 IR4 P10 2.8 44.9 11.9 0 105 4.2 IR5 P7 2.8 44.9 11.9 0 95 3.5 IR6 P11 2.8 44.9 11.9 0 95 3.5 IR7 P24 2.8 44.9 11.9 0 95 3.5 ikB P1 2.8 44.9 11.9 0 115 4.7 Bk2 P3 2.8 44.9 11.9 0 125 4.9 Bk3 P4 2.8 44.9 11.9 0 105 4.3 Bk4 P10 2.8 44.9 11.9 0 95 4.2 Bk5 P7 2.8 44.9 11.9 0 80 3.5 Bk6 P11 2.8 44.9 11.9 0 80 3.5 Bk7 P24 2.8 44.9 11.9 0 80 3.5 CR1 CP1 1.4 CP11 1.4 44.9 0 11.9 140 4.9

The details of the raw materials described with abbreviations in the above table are as follows. (Color material) PR224: CI Pigment Red 224 (perylene compound, red pigment) PR254: CI Pigment Red 254 (diketopyrrolopyrrole compound, red pigment) PR272: CI Pigment Red 272 (diketopyrrolopyrrole compound, red pigment) ) PY139: CI Pigment Yellow 139 (isoindoline compound, yellow pigment) PY150: CI Pigment Yellow 150 (azo compound, yellow pigment) PY185: CI Pigment Yellow 185 (isoindoline compound, yellow pigment) PG36: CI Pigment Green 36 (Phthalocyanine compound, green pigment) PB15: 6: CI Pigment Blue 15: 6 (Phthalocyanine compound, blue pigment) PV23: CI Pigment Violet 23 (Dimethocyanine compound, purple pigment) PBk32: CI Pigment Black 32 (Perylene compound, organic black pigment) IR color material 1: Compound with the following structure (pyrrolopyrrole compound, near-infrared absorbing pigment) [Chemical 48]

Derivative 1: Compound with the following structure [Chemical 49] Derivative 2: Compound with the following structure [Chemical 50] Derivative 3: Compound with the following structure [Chemical 51] Derivative 4: Compound with the following structure [Chemical 52]

(Resin) P1 to P109, CP1: The above-mentioned resin CP11: Plysurf A208F (manufactured by DKS Co. Ltd., a resin with a phosphate group (pKa = about 2), terminal acid group type) CP12: Plysurf H-3606 (DKS Co. Ltd., resin with a carboxyl group (pKa = about 4.5), terminal acid group type) CP13: Resin with the following structure (resin with a sulfo group (pKa = about 2), terminal acid group type) [Chemical 53]

(solvent) Solvent 1: Propylene glycol monomethyl ether acetate Solvent 2: cyclopentanone Solvent 3: Propylene glycol monomethyl ether

＜Manufacturing of resin composition＞ Each material was mixed at the ratio of Formulations 1 to 13 shown below and filtered through a nylon filter (manufactured by Nihon Pall Ltd.) with a pore diameter of 0.45 μm to produce each resin composition. In the following table, the value of the color material content in the total solid content of the resin composition is described in the column of "color material content".

(Recipe 1) Pigment dispersion liquid listed in the following table ･･････66.30 parts by mass Polymerizable compound 1 ･･････0.64 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

(Recipe 2) Pigment dispersion liquid listed in the following table ･･････64.80 parts by mass Polymerizable compound 1 ･･････2.14 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

(Recipe 3) Pigment dispersion liquid listed in the following table ･･････65.10 parts by mass Polymerizable compound 1 ･･････1.84 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

(Recipe 4) Pigment dispersion liquid listed in the following table ･･････65.40 parts by mass Polymerizable compound 1 ･･････1.54 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

(Recipe 5) Pigment dispersion liquid listed in the following table ･･････65.80 parts by mass Polymerizable compound 1 ･･････1.14 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

(Recipe 6) Pigment dispersion liquid listed in the following table ･･････66.10 parts by mass Polymerizable compound 1 ･･････0.84 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

(Recipe 7) Pigment dispersion liquid listed in the following table ･･････66.40 parts by mass Polymerizable compound 1 ･･････0.54 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

(Recipe 8) Pigment dispersion liquid listed in the following table ･･････165.75 parts by mass Polymerizable compound 1 ･･････0.64 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････64.90 parts by mass Solvent 2 ･･････8.10 parts by mass Solvent 3 ･･････8.10 parts by mass

(Recipe 9) Pigment dispersion liquid listed in the following table ･･････33.15 parts by mass Polymerizable compound 1 ･･････0.64 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････13.00 parts by mass Solvent 2 ･･････1.60 parts by mass Solvent 3 ･･････1.60 parts by mass

(Recipe 10) Pigment dispersion liquid listed in the following table ･･････163.50 parts by mass Polymerizable compound 1 ･･････0.64 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････64.90 parts by mass Solvent 2 ･･････8.10 parts by mass Solvent 3 ･･････8.10 parts by mass

(Recipe 11) Pigment dispersion liquid listed in the following table ･･････32.70 parts by mass Polymerizable compound 1 ･･････0.64 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････13.00 parts by mass Solvent 2 ･･････1.60 parts by mass Solvent 3 ･･････1.60 parts by mass

(Recipe 12) Pigment dispersion liquid listed in the following table ･･････70.00 parts by mass Polymerizable compound 2 ･･････0.84 parts by mass Photopolymerization initiator 1 ･･････0.32 parts by mass Surfactant 1 ･･････0.04 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････23.00 parts by mass Solvent 2 ･･････2.90 parts by mass Solvent 3 ･･････2.90 parts by mass

(Recipe 13) Pigment dispersion liquid listed in the following table ･･････63.30 parts by mass Polymerizable compound 1 ･･････0.32 parts by mass Thermal cross-linking agent 1 ･･････0.32 parts by mass Photopolymerization initiator 1 ･･････0.54 parts by mass Surfactant 1 ･･････0.02 parts by mass Polymerization inhibitor 1 ･･････0.03 parts by mass Solvent 1 ･･････26.00 parts by mass Solvent 2 ･･････3.20 parts by mass Solvent 3 ･･････3.20 parts by mass

Polymerizable compound 1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) Polymerizable compound 2: KAYARAD RP-1040 (manufactured by Nippon Kayaku Co., Ltd.) Photopolymerization initiator 1: Irgacure OXE02 (manufactured by BASF, Oxime compound) Surfactant 1: KF6000 (manufactured by Shin-Etsu Chemical Co., Ltd., polysiloxane-based surfactant) Polymerization inhibitor 1: p-methoxyphenol Thermal cross-linking agent 1: Compound with the following structure T-1 [chemical 54] Solvent 1: Propylene glycol monomethyl ether acetate Solvent 2: Cyclopentanone Solvent 3: Propylene glycol monomethyl ether

＜Performance Evaluation＞ (storage stability) The viscosity (mPa·s) of the resin compositions of the examples and comparative examples was measured using a viscometer (RE-85L, manufactured by Toki Sangyo Co., Ltd.). After the above measurement, the resin composition was left to stand at 45°C, shielded from light, for 5 days, and the viscosity (mPa·s) was measured again. The storage stability was evaluated based on the viscosity difference (ΔVis) before and after the above-mentioned standing in accordance with the following evaluation criteria. It can be said that the smaller the value of the viscosity difference (ΔVis), the better the storage stability of the resin composition. The above viscosity measurements were all performed in a laboratory where the temperature and humidity were controlled at 22±5°C and 60±20%, and the temperature of the resin composition was adjusted to 25°C. All determinations were performed three times and the average value was used. A: ΔVis is 0.2mPa·s or less B: ΔVis exceeds 0.2mPa·s and is less than 0.3mPa·s C: ΔVis exceeds 0.3mPa·s and is less than 0.5mPa·s D: ΔVis exceeds 0.5mPa・s

(Coarse particles) On the glass substrate, use a spin coater to apply the base layer forming composition (CT-4000, manufactured by FUJIFILM Electronic Materials Co., Ltd.) so that the thickness after post-baking becomes 0.1 μm, and use The hot plate was heated at 220°C for 300 seconds to form a base layer, and a glass substrate (support) with a base layer was obtained. Each resin composition was applied on the glass substrate with the base layer by spin coating, and then heated at 100° C. for 2 minutes using a hot plate to form a film with a thickness of 0.5 μm. The foreign matter contained in the film is detected with a foreign matter evaluation device (Compras III, manufactured by Applied Materials, Inc.), and foreign matter (coarse particles) with a maximum width of 1.0 μm or more is visually classified from all detected foreign matters, and then classified The number of classified coarse particles with a maximum width of 1.0 μm or more (number of coarse particles per 1 cm ² ) was counted. A: The number of coarse particles per 1 cm ² of the film is less than 10 B: The number of coarse particles per 1 cm ² of the film is 10 or more and less than 30 C: The number of coarse particles per 1 cm ² of the film is 30 or more and less than 100 D: The number of coarse particles per ^1cm2 of the film is 100 or more

(Developability) After applying the base layer forming composition (CT-4000, manufactured by FUJIFILM Electronic Materials Co., Ltd.) on an 8-inch (20.32cm) silicon wafer using a spin coater and then baking it The thickness reached 0.1 μm, and a heating plate was used to heat it at 220°C for 300 seconds to form a base layer, thereby obtaining a silicon wafer (support) with a base layer. Next, each resin composition was applied by a spin coating method so that the film thickness after post-baking reached 0.62 μm. Next, it was heated at 100° C. for 2 minutes using a hot plate. Next, i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.) was used to expose light of a wavelength of 365 nm through a mask of a 1.0 μm square dot pattern at an exposure dose of 1000 mJ/cm ² . Next, the exposed silicon wafer with the coating film formed on it was placed on the horizontal rotating stage of a spin/spray developing machine (model DW-30, manufactured by CHEMITRONICS CO., LTD.), and a CD-2000 (FUJIFILM Electronic Materials) was used. (manufactured by While rotating at a rotation speed of 50 rpm, pure water was supplied in a spray form from a discharge nozzle from above the rotation center to perform a rinsing process, and then spray drying was performed. Furthermore, a heating process (post-baking) for 300 seconds was performed using a 200°C hot plate to form a pattern (pixel). The silicon wafer on which the pixels were formed was observed using a scanning electron microscope (magnification: 10,000 times), and the developability was evaluated based on the following evaluation criteria. A: No residue is observed outside the pixel formation area (unexposed portion). B: A very small amount of residue is observed outside the pixel formation area (unexposed portion), but to the extent that it is not a problem in practice. C: On the pixel. A small amount of residue is observed outside the formation area (unexposed portion) of the pixel, but there is no practical problem. D: Residue is clearly observed outside the formation area (unexposed portion) of the pixel.

[Table 20] formula Pigment dispersion Color material content (mass %) performance Stability over time Coarse particles Developability Example 1 1 R1 62 B C B Example 2 1 R2 62 B C B Example 3 1 R3 62 B C B Example 4 1 R4 62 A A A Example 5 1 R5 62 A A A Example 6 1 R6 62 A A A Example 7 1 R7 62 A A A Example 8 1 R8 62 A A A Example 9 1 R9 62 B A A Example 10 1 R10 62 B A A Example 11 1 R11 62 A A A Example 12 1 R12 62 B A A Example 13 1 R13 62 B A A Example 14 1 R14 62 B B A Example 15 1 R15 62 B A A Example 16 1 R16 62 B A A Example 17 1 R17 62 B A A Example 18 1 R18 62 B A A Example 19 1 R19 62 A A A Example 20 1 R20 62 A A A Example 21 1 R21 62 A A A Example 22 1 R22 62 A A A Example 23 1 R23 62 A A A Example 24 1 R24 62 A A A Example 25 1 R25 62 A A A Example 26 1 R26 62 A A A Example 27 1 R27 62 A A A Example 28 1 R28 62 B A A Example 29 1 R29 62 B A A Example 30 1 R30 62 A A A Example 31 1 R31 62 A A A Example 32 1 R32 62 A A A Example 33 1 R33 62 A A A Example 34 1 R34 62 A A A Example 35 1 R35 62 A A A Example 36 1 R36 62 A A A Example 37 1 R37 62 A A A Example 38 1 R38 62 A A A Example 39 1 R39 62 A A A Example 40 1 R40 62 A A A Example 41 1 R41 62 A A A Example 42 1 R42 62 A A A Example 43 1 R43 62 A A A Example 44 1 R44 62 B A A Example 45 1 R45 62 B A A [Table 21] formula Pigment dispersion Color material content (mass %) performance Stability over time Coarse particles Developability Example 46 1 R46 62 A A A Example 47 1 R47 62 A A A Example 48 1 R48 62 A A A Example 49 1 R49 62 A A A Example 50 1 R50 62 A A A Example 51 1 R51 62 A A A Example 52 1 R52 62 B A A Example 53 1 R53 62 B A A Example 54 1 R54 62 A A A Example 55 1 R55 62 A A A Example 56 1 R56 62 A A A Example 57 1 R57 62 B A A Example 58 1 R58 62 B A A Example 59 1 R59 62 A A A Example 60 1 R60 62 A A A Example 61 1 R61 62 A A A Example 62 1 R62 62 A A A Example 63 1 R63 62 B A A Example 64 1 R64 62 A A A Example 65 1 R65 62 A A A Example 66 1 R66 62 A A A Example 67 1 R67 62 B A A Example 68 1 R68 62 A A A Example 69 1 R69 62 A A A Example 70 1 R70 62 A A A Example 71 1 R71 62 A A A Example 72 1 R72 62 A A A Example 73 1 R73 62 A A A Example 74 1 R74 62 A A A Example 75 1 R75 62 A A A Example 76 1 R76 62 A A A Example 77 1 R77 62 A A A Example 78 1 R78 62 A A A Example 79 1 R79 62 B A A Example 80 1 R80 62 A A A Example 81 1 R81 62 A A A Example 82 1 R82 62 A A A Example 83 1 R83 62 B A A Example 84 1 R84 62 A A A Example 85 1 R85 62 A A A Example 86 1 R86 62 A A A Example 87 1 R87 62 C C C Example 88 1 R88 62 B C B Example 89 1 R89 62 B C B Example 90 1 R90 62 B B A [Table 22] formula Pigment dispersion Color material content (mass %) performance Stability over time Coarse particles Developability Example 91 1 R91 62 A A A Example 92 1 R92 62 A A A Example 93 1 R93 62 A A A Example 94 1 R94 62 A A A Example 95 1 R95 62 A A A Example 96 1 R96 62 A A A Example 97 1 R97 62 A A A Example 98 1 R98 62 A A A Example 99 1 R99 62 A A A Example 100 1 R100 62 A A A Example 101 1 R101 62 A A A Example 102 1 R102 62 A A A Example 103 1 R103 62 A A A Example 104 1 R104 62 A A A Example 105 1 R105 62 A A A Example 106 1 R106 62 A A B Example 107 1 R107 62 A A A Example 108 1 R108 62 A A A Example 109 1 R109 62 A A A Example 110 2 R110 62 A A A Example 111 3 R111 62 A A A Example 112 4 R112 62 A A A Example 113 5 R113 62 A A A Example 114 6 R114 62 A A A Example 115 7 R115 62 A A A Example 116 1 R116 62 A A A Example 117 1 R117 62 A A A Example 118 1 R118 62 A A A Example 119 1 R119 62 B B A Example 120 1 R120 62 B B A Example 121 1 R121 62 A A A Example 122 1 R122 62 A A A Example 123 1 R123 62 A A A Example 124 1 R124 62 A A A Example 125 1 R125 62 A A A Example 126 1 R126 62 A A A Example 127 1 R127 62 A A A Example 128 1 R128 62 A A A Example 129 1 R129 62 A A A Example 130 1 R130 62 A A A Example 131 1 R131 62 A A A Example 132 12 R132 62 A A A Example 133 13 R133 62 A A A Example 134 1 R134 62 B B A Example 135 1 Y1 62 A A A [Table 23] formula Pigment dispersion Color material content (mass %) performance Stability over time Coarse particles Developability Example 136 1 Y2 62 A A A Example 137 1 Y3 62 A A A Example 138 1 G1 62 B C B Example 139 1 G2 62 B C B Example 140 1 G3 62 B B A Example 141 1 G4 62 B A A Example 142 1 G5 62 A A A Example 143 1 G6 62 A A A Example 144 1 G7 62 A A A Example 145 1 B1 62 B C B Example 146 1 B2 62 B C B Example 147 1 B3 62 B B A Example 148 1 B4 62 B A A Example 149 1 B5 62 A A A Example 150 1 B6 62 A A A Example 151 1 B7 62 A A A Example 152 1 Cy1 62 A A A Example 153 1 Cy2 62 A A A Example 154 1 Cy3 62 A A A Example 155 1 IR1 62 B C B Example 156 1 IR2 62 B C B Example 157 1 IR3 62 B B A Example 158 1 IR4 62 B A A Example 159 1 IR5 62 A A A Example 160 1 IR6 62 A A A Example 161 1 IR7 62 A A A Example 162 1 ikB 62 B C B Example 163 1 Bk2 62 B C B Example 164 1 Bk3 62 B B A Example 165 1 Bk4 62 B A A Example 166 1 Bk5 62 A A A Example 167 1 Bk6 62 A A A Example 168 1 Bk7 62 A A A Example 169 8 R7 67 A A A Example 170 9 R7 56 A A A Example 171 8 R11 67 A A A Example 172 9 R11 56 A A A Example 173 8 R24 67 A A A Example 174 9 R24 56 A A A Example 175 10 R112 73 A A A Example 176 11 R112 60 A A A Comparative example 1 1 CR1 62 D D D

As shown in the above table, the resin compositions of the Examples have excellent storage stability and developability, and can form films with few foreign matter.

The film obtained from the resin composition described in the Examples can be suitably used in optical filters, solid-state imaging devices, and image display devices.

In Example 6, even when the polymerizable compound 1 was changed to the compound M-2 or M-3 having the structure shown below, the same effect was obtained. [Chemical 55]

In Example 6, the same effect was obtained even when the photopolymerization initiator 1 was changed to the compounds I-2 to I-5 having the structures shown below. [Chemical 56]

In Example 133, even when the thermal crosslinking agent T-1 was changed to the compound T-2 or T-3 having the structure shown below, the same effect was obtained. [Chemistry 57]

In Example 6, surfactant 1 was changed to a compound with the following structure (weight average molecular weight: 14,000, the value indicating the percentage of repeating units is molar %, fluorine-based surfactant) or PolyFox PF6320 (fluorine-based surfactant manufactured by OMNOVA), the same effect was also obtained. [Chemical 58]

In Example 6, the same effect was obtained even when the polymerization inhibitor 1 was changed to compound H-2 or H-3 having the structure shown below. [Chemistry 59]

Claims (12)

A resin composition including a color material A containing a pigment and a resin B, The content of the color material A in the total solid content of the resin composition is 50% by mass or more, The resin B includes a resin b having a repeating unit b1, and the repeating unit b1 contains at least one group selected from the group consisting of a urea group and a urethane group. The resin composition as described in claim 1, wherein The aforementioned repeating unit b1 is a repeating unit containing a urea group. The resin composition as described in claim 1, wherein the aforementioned repeating unit b1 is a repeating unit represented by formula (b1-2), In the formula ^{(b1-2), R 11 represents a} hydrogen atom or an alkyl group, A monocyclic aromatic hydrocarbon group with an electron-donating group as a substituent, a monocyclic aromatic heterocyclic group that may have an electron-withdrawing group or an electron-donating group as a substituent, or a group represented by the formula (R-101) , -L ¹⁰¹ -(R ¹⁰¹ -O) _n1 -R ¹⁰² ･･････(R-101) In the formula (R-101), L ¹⁰¹ represents a single bond or a divalent linking group, and R ¹⁰¹ represents an alkylene group, R ¹⁰² represents a hydrogen atom or an alkyl group, and n1 represents an integer from 2 to 45. The resin composition according to claim 3, wherein X ¹¹ in the aforementioned formula (b1-2) is -COO-CH ₂ -CH ₂ -, -COO-CH ₂ -CH ₂ -O-CH ₂ -CH ₂ - , -C ₆ H ₄ - or -C ₆ H ₄ -CH ₂ -. The resin composition according to any one of claims 1 to 4, wherein The aforementioned resin b further contains a repeating unit b2 having a graft chain. The resin composition as described in claim 5, wherein The aforementioned graft chain is a polymer chain containing repeating units selected from a polyether structure and a polyester structure. The resin composition as described in claim 5, wherein The aforementioned graft chain is a polymer chain containing a polyalkyleneoxy structure. The resin composition as described in claim 1 or 2, wherein The aforementioned pigments include at least one selected from the group consisting of diketopyrrolopyrrole pigments, isoindoline pigments, quinoline yellow pigments, and azo pigments. A film obtained using the resin composition according to claim 1 or 2. An optical filter comprising the film according to claim 9. A solid-state imaging element including the film according to claim 9. An image display device comprising the film according to claim 9.