TW202323239A - Curable composition, production method for cured product, membrane, optical element, image sensor, solid-state imaging device, image display device, and radical polymerization initiator - Google Patents

Curable composition, production method for cured product, membrane, optical element, image sensor, solid-state imaging device, image display device, and radical polymerization initiator Download PDF

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TW202323239A
TW202323239A TW111141956A TW111141956A TW202323239A TW 202323239 A TW202323239 A TW 202323239A TW 111141956 A TW111141956 A TW 111141956A TW 111141956 A TW111141956 A TW 111141956A TW 202323239 A TW202323239 A TW 202323239A
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牧野雅臣
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日商富士軟片股份有限公司
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Abstract

An embodiment of the present invention provides: a curable composition comprising a radical polymerization initiator represented by formula 1 and a radically polymerizable compound; a method for producing a cured product of the curable composition; a method for producing a cured product using the curable composition; a film; an optical device; an image sensor; a solid-state imaging device or an image display device; or a novel radical polymerization initiator. In formula 1, Ar1 and Ar2 each independently represent an aromatic group, L11 represents a single bond, L12 represents a divalent linking group, R11, R12, and R15 each independently represent a substituent, R13 and R14 each independently represent a hydrogen atom or a substituent, X1 represents a single bond, O, S, or NR16, R16 represents a hydrogen atom or a substituent, and Y1 represents a single bond or a carbonyl group.

Description

硬化性組成物、硬化物的製造方法、膜、光學元件、影像感測器、固體攝像元件、圖像顯示裝置及自由基聚合起始劑Curable composition, method for producing cured product, film, optical element, image sensor, solid-state imaging element, image display device, and radical polymerization initiator

本揭示係有關一種硬化性組成物、硬化物的製造方法、膜、光學元件、影像感測器、固體攝像元件、圖像顯示裝置及自由基聚合起始劑。The disclosure relates to a curable composition, a method for producing a cured product, a film, an optical element, an image sensor, a solid-state imaging element, an image display device, and a radical polymerization initiator.

使用包含著色劑、光聚合起始劑及聚合性化合物之硬化性組成物製造濾色器等濾光器。 作為以往的硬化性組成物,已知有專利文獻1或2中記載之組成物。 在專利文獻1及2中,記載有一種包含具有茀結構之肟系光聚合起始劑之組成物。 Optical filters such as color filters are produced using a curable composition containing a colorant, a photopolymerization initiator, and a polymerizable compound. As a conventional curable composition, the composition described in Patent Document 1 or 2 is known. Patent Documents 1 and 2 describe a composition containing an oxime-based photopolymerization initiator having a terpene structure.

[專利文獻1]日本特開2014-137466號公報 [專利文獻2]日本特開2017-61498號公報 [Patent Document 1] Japanese Unexamined Patent Publication No. 2014-137466 [Patent Document 2] Japanese Patent Laid-Open No. 2017-61498

本揭示之實施形態所要解決的課題為提供一種從所獲得之硬化物產生之釋氣少的硬化性組成物。 又,本揭示之另一實施形態所要解決的課題為提供一種使用上述硬化性組成物之硬化物的製造方法、膜、光學元件、影像感測器、固體攝像元件或圖像顯示裝置。 進而,本揭示之另一實施形態所要解決的課題為提供一種新型自由基聚合起始劑。 The problem to be solved by the embodiments of the present disclosure is to provide a curable composition with little outgassing from the obtained cured product. Moreover, the problem to be solved by another embodiment of the present disclosure is to provide a method for producing a cured product using the above-mentioned curable composition, a film, an optical element, an image sensor, a solid-state imaging device, or an image display device. Furthermore, the problem to be solved by another embodiment of this disclosure is to provide a novel radical polymerization initiator.

用於解決上述課題之方案中包括以下態樣。 <1>一種硬化性組成物,其包含由下述式1表示之自由基聚合起始劑及自由基聚合性化合物。 Means for solving the above-mentioned problems include the following aspects. <1> A curable composition comprising a radical polymerization initiator represented by the following formula 1 and a radical polymerizable compound.

[化學式1]

Figure 02_image001
[chemical formula 1]
Figure 02_image001

式1中,Ar 1及Ar 2分別獨立地表示芳香環,L 11表示單鍵,L 12表示2價連結基,p1表示0以上且Ar 1中的芳香環上可取代的所有位置數-3以下的整數,p2表示0以上且Ar 2中的芳香環上可取代的所有位置數-4以下的整數,R 11、R 12及R 15分別獨立地表示取代基,R 13及R 14分別獨立地表示氫原子或取代基,X 1表示單鍵O、S或NR 16,R 16表示氫原子或取代基,Y 1表示單鍵或羰基,R 12~R 16中2個以上可以鍵結而形成環。 In Formula 1, Ar 1 and Ar 2 independently represent an aromatic ring, L 11 represents a single bond, L 12 represents a divalent linking group, p1 represents 0 or more and the number of all positions that can be substituted on the aromatic ring in Ar 1 is -3 The following integers, p2 represents an integer of 0 or more and the number of all substitutable positions on the aromatic ring in Ar2 is -4 or less, R 11 , R 12 and R 15 independently represent substituents, and R 13 and R 14 independently represent ground represents a hydrogen atom or a substituent, X 1 represents a single bond O, S or NR 16 , R 16 represents a hydrogen atom or a substituent, Y 1 represents a single bond or a carbonyl group, two or more of R 12 to R 16 may be bonded and Form a ring.

<2>如<1>所述之硬化性組成物,其中 由上述式1表示之自由基聚合起始劑為由下述式2表示之化合物。 <2> The curable composition as described in <1>, wherein The radical polymerization initiator represented by the above formula 1 is a compound represented by the following formula 2.

[化學式2]

Figure 02_image004
[chemical formula 2]
Figure 02_image004

式2中,R 21表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 22及R 25分別獨立地表示烷基羰基、芳基羰基、雜芳基羰基、烷基、烷氧基、芳基、雜芳基、芳氧基、鹵素原子、硝基或氰基,p3表示0~3的整數,p4表示0~2的整數,R 23及R 24分別獨立地表示氫原子、烷基或芳基,R 26及R 27分別獨立地表示氫原子、烷基或芳基,Y 2表示單鍵或羰基,Y 2為羰基時,可以存在複數個之R 26及可以存在複數個之R 27中的至少1個不是氫原子,n為1~3的整數,R 22~R 27中2個以上可以鍵結而形成環。 In formula 2, R 21 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 22 and R 25 independently represent an alkyl carbonyl group, an aryl carbonyl group, a heteroaryl carbonyl group, Alkyl, alkoxy, aryl, heteroaryl, aryloxy, halogen atom, nitro or cyano, p3 represents an integer from 0 to 3, p4 represents an integer from 0 to 2, R 23 and R 24 are independent represents a hydrogen atom, an alkyl group or an aryl group, R 26 and R 27 independently represent a hydrogen atom, an alkyl group or an aryl group, Y 2 represents a single bond or a carbonyl group, and when Y 2 is a carbonyl group, there may be a plurality of R 26 And at least one of R 27 that may exist in plural is not a hydrogen atom, n is an integer of 1 to 3, and two or more of R 22 to R 27 may be bonded to form a ring.

<3>如<1>或<2>所述之硬化性組成物,其中 由上述式1表示之自由基聚合起始劑為由下述式3表示之化合物。 <3> The curable composition as described in <1> or <2>, wherein The radical polymerization initiator represented by the above formula 1 is a compound represented by the following formula 3.

[化學式3]

Figure 02_image006
[chemical formula 3]
Figure 02_image006

式3中,R 31表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 32表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 33及R 34分別獨立地表示氫原子或烷基,R 36~R 39分別獨立地表示氫原子、烷基或芳基,R 32~R 34中2個以上可以鍵結而形成環,R 36與R 37可以鍵結而形成環。 In formula 3, R 31 represents alkyl, alkenyl, aryl, heteroaryl, alkoxy or aryloxy, R 32 represents hydrogen atom, halogen atom, nitro, aryl, heteroaryl, alkoxy , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 33 and R 34 independently represent a hydrogen atom or an alkyl group, R 36 ~R 39 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 32 to R 34 may be bonded to form a ring, and R 36 and R 37 may be bonded to form a ring.

[化學式4]

Figure 02_image008
[chemical formula 4]
Figure 02_image008

式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。 In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group.

<4>如<1>或<2>所述之硬化性組成物,其中 由上述式1表示之自由基聚合起始劑為由下述式4表示之化合物。 <4> The curable composition as described in <1> or <2>, wherein The radical polymerization initiator represented by the above formula 1 is a compound represented by the following formula 4.

[化學式5]

Figure 02_image010
[chemical formula 5]
Figure 02_image010

式4中,R 41表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 42表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 43及R 44分別獨立地表示氫原子或烷基,R 46及R 47分別獨立地表示氫原子、烷基或芳基,R 42~R 44中2個以上可以鍵結而形成環,R 46與R 47可以鍵結而形成環,R 42為氫原子、鹵素原子、硝基、烷氧基、芳氧基或由下述式I或式II表示之基團時,R 46及R 47不會均成為氫原子,R 42為芳基、雜芳基、一級~三級胺基、烷硫基或芳硫基時,R 46及R 47可以均為氫原子。 In formula 4, R 41 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 42 represents a hydrogen atom, a halogen atom, a nitro group, an aryl group, a heteroaryl group, an alkoxy group , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 43 and R 44 independently represent a hydrogen atom or an alkyl group, R 46 and R 47 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 42 to R 44 may be bonded to form a ring, R 46 and R 47 may be bonded to form a ring, R 42 is a hydrogen atom, When a halogen atom, nitro, alkoxy, aryloxy group or a group represented by the following formula I or formula II, R 46 and R 47 will not both become hydrogen atoms, and R 42 is aryl, heteroaryl, In the case of a primary to tertiary amino group, an alkylthio group or an arylthio group, both R 46 and R 47 may be hydrogen atoms.

[化學式6]

Figure 02_image012
[chemical formula 6]
Figure 02_image012

式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。 In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group.

<5>如<1>至<4>之任一項所述之硬化性組成物,其進一步包含著色劑。 <6>如<5>所述之硬化性組成物,其中 上述著色劑的含量相對於硬化性組成物的總固體成分為50質量%以上。 <7>如<1>至<6>之任一項所述之硬化性組成物,其進一步包含樹脂。 <8>如<7>所述之硬化性組成物,其中 上述樹脂為具有接枝鏈之接枝聚合物,且上述接枝鏈包含選自包括聚醚鏈、聚酯鏈及聚丙烯酸鏈之群組中之至少1種,且上述接枝鏈的重量平均分子量為1,000以上。 <9>如<7>或<8>所述之硬化性組成物,其中 上述樹脂具有(甲基)丙烯醯基、環氧基或氧環丁烷基。 <10>如<1>至<9>之任一項所述之硬化性組成物,其進一步包含顏料衍生物。<11>一種硬化物的製造方法,其包括對<1>至<10>之任一項所述之硬化性組成物照射波長150nm~300nm的光之步驟。 <12>如<11>所述之硬化物的製造方法,其中 上述光為準分子雷射。 <13>一種膜,其藉由硬化<1>至<10>之任一項所述之硬化性組成物而成。 <14>一種光學元件,其包含<13>所述之膜。 <15>一種影像感測器,其包含<13>所述之膜。 <16>一種固體攝像元件,其包含<13>所述之膜。 <17>一種圖像顯示裝置,其包含<13>所述之膜。 <18>一種自由基聚合起始劑,其由下述式3或式4表示。 <5> The curable composition according to any one of <1> to <4>, further comprising a colorant. <6> The curable composition as described in <5>, wherein The content of the coloring agent is 50% by mass or more relative to the total solid content of the curable composition. <7> The curable composition according to any one of <1> to <6>, further comprising a resin. <8> The curable composition as described in <7>, wherein The above-mentioned resin is a graft polymer having grafted chains, and the above-mentioned grafted chains include at least one selected from the group consisting of polyether chains, polyester chains, and polyacrylic acid chains, and the weight average of the above-mentioned grafted chains is The molecular weight is 1,000 or more. <9> The curable composition according to <7> or <8>, wherein The aforementioned resin has a (meth)acryl group, an epoxy group, or an oxetanyl group. <10> The curable composition according to any one of <1> to <9>, further comprising a pigment derivative. <11> A method for producing a cured product, comprising the step of irradiating the curable composition described in any one of <1> to <10> with light having a wavelength of 150 nm to 300 nm. <12> The method for producing a hardened product as described in <11>, wherein The above light is excimer laser. <13> A film obtained by curing the curable composition according to any one of <1> to <10>. <14> An optical element comprising the film according to <13>. <15> An image sensor comprising the film described in <13>. <16> A solid-state imaging device including the film according to <13>. <17> An image display device comprising the film according to <13>. <18> A radical polymerization initiator represented by the following formula 3 or formula 4.

[化學式7]

Figure 02_image014
[chemical formula 7]
Figure 02_image014

式3中,R 31表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 32表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 33及R 34分別獨立地表示氫原子或烷基,R 36~R 39分別獨立地表示氫原子、烷基或芳基,R 32~R 34中2個以上可以鍵結而形成環,R 36與R 37可以鍵結而形成環。 In formula 3, R 31 represents alkyl, alkenyl, aryl, heteroaryl, alkoxy or aryloxy, R 32 represents hydrogen atom, halogen atom, nitro, aryl, heteroaryl, alkoxy , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 33 and R 34 independently represent a hydrogen atom or an alkyl group, R 36 ~R 39 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 32 to R 34 may be bonded to form a ring, and R 36 and R 37 may be bonded to form a ring.

[化學式8]

Figure 02_image016
[chemical formula 8]
Figure 02_image016

式4中,R 41表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 42表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 43及R 44分別獨立地表示氫原子或烷基,R 46及R 47分別獨立地表示氫原子、烷基或芳基,R 42~R 44中2個以上可以鍵結而形成環,R 46與R 47可以鍵結而形成環,R 42為氫原子、鹵素原子、硝基、烷氧基、芳氧基或由下述式I或式II表示之基團時,R 46及R 47不會均成為氫原子,R 42為芳基、雜芳基、一級~三級胺基、烷硫基或芳硫基時,R 46及R 47可以均為氫原子。 In formula 4, R 41 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 42 represents a hydrogen atom, a halogen atom, a nitro group, an aryl group, a heteroaryl group, an alkoxy group , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 43 and R 44 independently represent a hydrogen atom or an alkyl group, R 46 and R 47 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 42 to R 44 may be bonded to form a ring, R 46 and R 47 may be bonded to form a ring, R 42 is a hydrogen atom, When a halogen atom, nitro, alkoxy, aryloxy group or a group represented by the following formula I or formula II, R 46 and R 47 will not both become hydrogen atoms, and R 42 is aryl, heteroaryl, In the case of a primary to tertiary amino group, an alkylthio group or an arylthio group, both R 46 and R 47 may be hydrogen atoms.

[化學式9]

Figure 02_image018
[chemical formula 9]
Figure 02_image018

式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。 [發明效果] In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group. [Invention effect]

根據本揭示之一實施形態,提供一種從所獲得之硬化物產生之釋氣少的硬化性組成物。 又,根據本揭示之另一實施形態,提供一種使用上述硬化性組成物之硬化物的製造方法、膜、光學元件、影像感測器、固體攝像元件或圖像顯示裝置。 進而,根據本揭示之另一實施形態,提供一種新型自由基聚合起始劑。 According to one aspect of the present disclosure, there is provided a curable composition with little outgassing from the obtained cured product. Also, according to another embodiment of the present disclosure, there is provided a method for producing a cured product using the curable composition, a film, an optical element, an image sensor, a solid-state imaging element, or an image display device. Furthermore, according to another embodiment of the present disclosure, a novel radical polymerization initiator is provided.

以下,對本揭示的內容進行詳細說明。以下記載之構成要件的說明根據本揭示的代表性實施態樣而完成,但本揭示並不限於該種實施態樣。 本說明書中,“~”以將記載於其前後之數值作為下限值及上限值而包括之含義來使用。 本說明書中之基團(原子團)的標記中,未標有經取代及未經取代之標記包括不具有取代基之基團(原子團)的同時包括具有取代基之基團(原子團)。例如,“烷基”不僅包括不具有取代基之烷基(未經取代之烷基),亦包括具有取代基之烷基(經取代之烷基)。 本說明書中,“曝光”只要沒有特別指定,不僅包括使用光之曝光,使用電子束、離子束等粒子束之描畫亦包括在曝光中。又,作為曝光中所使用之光,可舉出水銀燈的明線光譜、以準分子雷射為代表之遠紫外線、極紫外線(EUV光)、X射線、電子束等活性光線或放射線。 本說明書中,“(甲基)丙烯酸酯”表示丙烯酸酯及甲基丙烯酸酯兩者或任一者,“(甲基)丙烯酸”表示丙烯酸及甲基丙烯酸兩者或任一者,“(甲基)丙烯醯基”表示丙烯醯基及甲基丙烯醯基兩者或任一者。 本說明書中,結構式中的Me表示甲基,Et表示乙基,Bu表示丁基,Ph表示苯基。 本說明書中,重量平均分子量及數量平均分子量為藉由GPC(凝膠滲透層析)法測定之聚苯乙烯換算值。 本說明書中,總固體成分係指從組成物的所有成分中去除溶劑之成分的總質量。 本說明書中,顏料係指不易溶解於溶劑的著色劑。 本說明書中,“步驟”這一用語,不僅包括獨立之步驟,即使在無法與其他步驟明確區分的情況下,只要實現該步驟所期待的作用,則亦包括在本用語中。 以下,對本揭示進行詳細說明。 Hereinafter, the contents of the present disclosure will be described in detail. The description of the constituent requirements described below is based on typical embodiments of the present disclosure, but the present disclosure is not limited to such embodiments. In this specification, "-" is used in the meaning which includes the numerical value described before and after it as a lower limit and an upper limit. Among the notations of groups (atomic groups) in this specification, notation of substituted and unsubstituted includes groups (atomic groups) without substituents and groups (atomic groups) with substituents. For example, "alkyl" includes not only an alkyl group having no substituent (unsubstituted alkyl group), but also an alkyl group having a substituent (substituted alkyl group). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. In addition, examples of the light used for exposure include bright line spectra of mercury lamps, extreme ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, electron beams, and other active rays or radiation. In this specification, "(meth)acrylate" means both or either of acrylate and methacrylate, "(meth)acrylic acid" means both or either of acrylic acid and methacrylic acid, "(meth) "group) acryl" means both or either of acryl and methacryl. In this specification, Me in the structural formulas represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. In this specification, a weight average molecular weight and a number average molecular weight are polystyrene conversion values measured by the GPC (gel permeation chromatography) method. In this specification, the total solid content refers to the total mass of components excluding solvents from all the components of the composition. In this specification, a pigment refers to a colorant that is hardly soluble in a solvent. In this specification, the term "step" includes not only an independent step, but also includes in this term as long as the expected action of the step is achieved even if it cannot be clearly distinguished from other steps. Hereinafter, this disclosure will be described in detail.

(硬化性組成物) 本揭示之硬化性組成物包含由下述式1表示之自由基聚合起始劑及自由基聚合性化合物。 又,本揭示之硬化性組成物能夠較佳地用作基於波長150nm~300nm的光之曝光用硬化性組成物,能夠更佳地用作波長150nm~300nm的準分子雷射曝光用硬化性組成物。 (hardening composition) The curable composition of the present disclosure contains a radical polymerization initiator represented by the following formula 1 and a radical polymerizable compound. Also, the curable composition disclosed in the present disclosure can be preferably used as a curable composition for exposure by light with a wavelength of 150 nm to 300 nm, and can be more preferably used as a curable composition for excimer laser exposure with a wavelength of 150 nm to 300 nm. things.

[化學式10]

Figure 02_image020
[chemical formula 10]
Figure 02_image020

式1中,Ar 1及Ar 2分別獨立地表示芳香環,L 11表示單鍵,L 12表示2價連結基,p1表示0以上且Ar 1中的芳香環上可取代的所有位置數-3以下的整數,p2表示0以上且Ar 2中的芳香環上可取代的所有位置數-4以下的整數,R 11、R 12及R 15分別獨立地表示取代基,R 13及R 14分別獨立地表示氫原子或取代基,X 1表示單鍵O、S或NR 16,R 16表示氫原子或取代基,Y 1表示單鍵或羰基,R 12~R 16中2個以上可以鍵結而形成環。 In Formula 1, Ar 1 and Ar 2 independently represent an aromatic ring, L 11 represents a single bond, L 12 represents a divalent linking group, p1 represents 0 or more and the number of all positions that can be substituted on the aromatic ring in Ar 1 is -3 The following integers, p2 represents an integer of 0 or more and the number of all substitutable positions on the aromatic ring in Ar2 is -4 or less, R 11 , R 12 and R 15 independently represent substituents, and R 13 and R 14 independently represent ground represents a hydrogen atom or a substituent, X 1 represents a single bond O, S or NR 16 , R 16 represents a hydrogen atom or a substituent, Y 1 represents a single bond or a carbonyl group, two or more of R 12 to R 16 may be bonded and Form a ring.

本發明人進行深入研究之結果,發現藉由採用上述構成,可獲得從所獲得之硬化物產生之釋氣少的硬化性組成物。 由於由上述式1表示之自由基聚合起始劑具有環狀肟結構,因此有時上述環狀肟結構中的氮原子所鍵結之碳原子與鄰位的α碳原子之間的鍵斷裂而產生自由基。推測由於此處產生之自由基與具有茀環結構之部分連結且不易產生揮發成分,因此能夠抑制從藉由硬化上述硬化性組成物而成之硬化物在硬化後排出的氣體(釋氣)。 As a result of intensive studies by the present inventors, it was found that by adopting the above-mentioned constitution, a curable composition with little outgassing from the obtained cured product can be obtained. Since the radical polymerization initiator represented by the above-mentioned formula 1 has a cyclic oxime structure, the bond between the carbon atom to which the nitrogen atom in the above-mentioned cyclic oxime structure is bonded and the adjacent α-carbon atom is sometimes broken and Generate free radicals. It is presumed that since the free radicals generated here are linked to the part having the oxene ring structure and volatile components are less likely to be generated, gas (outgassing) emitted from the hardened product obtained by hardening the above-mentioned hardened composition after hardening can be suppressed.

本揭示之硬化性組成物可較佳地用作濾光器用硬化性組成物。作為濾光器,可舉出濾色器及紅外線透射濾波器等,濾色器為較佳。亦即,本揭示之硬化性組成物可較佳地用作濾色器用硬化性組成物。更具體而言,能夠較佳地用作濾色器的像素形成用硬化性組成物。作為像素的種類,可舉出紅色像素、綠色像素、藍色像素、品紅色像素、青色像素、黃色像素等。The curable composition disclosed herein can be preferably used as a curable composition for optical filters. As an optical filter, a color filter, an infrared transmission filter, etc. are mentioned, and a color filter is preferable. That is, the curable composition of the present disclosure can be preferably used as a curable composition for color filters. More specifically, it can be suitably used as a curable composition for pixel formation of a color filter. Examples of the types of pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels.

作為紅外線透射濾波器,可較佳地舉出滿足在波長400nm~640nm的範圍內之透射率的最大值為20%以下(較佳為15%以下,更佳為10%以下),在波長1,100nm~1,300nm的範圍內之透射率的最小值為70%以上(較佳為75%以上,更佳為80%以上)的分光特性之濾波器等。紅外線透射濾波器為滿足以下(1)~(5)中的任一個分光特性之濾波器為較佳。 (1):在波長400nm~640nm的範圍內之透射率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且在波長800nm~1,500nm的範圍內之透射率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (2):在波長400nm~750nm的範圍內之透射率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且在波長900nm~1,500nm的範圍內之透射率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (3):在波長400nm~830nm的範圍內之透射率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且在波長1,000nm~1,500nm的範圍內之透射率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (4):在波長400nm~950nm的範圍內之透射率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且在波長1,100nm~1,500nm的範圍內之透射率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 (5):在波長400nm~1,050nm的範圍內之透射率的最大值為20%以下(較佳為15%以下,更佳為10%以下)且在波長1,200nm~1,500nm的範圍內之透射率的最小值為70%以上(較佳為75%以上,更佳為80%以上)之濾波器。 As an infrared transmission filter, it is preferable to mention that the maximum value of the transmittance in the wavelength range of 400nm to 640nm is 20% or less (preferably 15% or less, more preferably 10% or less), at a wavelength of 1,100 A filter or the like having a spectral characteristic with a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) within the range of nm to 1,300 nm. The infrared transmission filter is preferably a filter that satisfies any one of the spectral characteristics in (1) to (5) below. (1): The maximum transmittance in the wavelength range of 400nm to 640nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 800nm to 1,500nm The filter whose minimum value is 70% or more (preferably 75% or more, more preferably 80% or more). (2): The maximum value of the transmittance in the wavelength range of 400nm to 750nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 900nm to 1,500nm The filter whose minimum value is 70% or more (preferably 75% or more, more preferably 80% or more). (3): The maximum transmittance in the wavelength range of 400nm to 830nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1,000nm to 1,500nm A filter with a minimum rate of 70% or more (preferably 75% or more, more preferably 80% or more). (4): The maximum transmittance in the wavelength range of 400nm to 950nm is 20% or less (preferably 15% or less, more preferably 10% or less) and the transmittance in the wavelength range of 1,100nm to 1,500nm A filter with a minimum rate of 70% or more (preferably 75% or more, more preferably 80% or more). (5): The maximum value of transmittance in the wavelength range of 400nm to 1,050nm is 20% or less (preferably 15% or less, more preferably 10% or less) and within the wavelength range of 1,200nm to 1,500nm A filter with a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more).

又,本揭示之硬化性組成物可較佳地用作固體攝像元件用。更具體而言,可較佳地用作用於固體攝像元件之濾光器用硬化性組成物,更佳地用作用於固體攝像元件之濾色器用硬化性組成物。Also, the curable composition of the present disclosure can be suitably used as a solid-state imaging device. More specifically, it can be preferably used as a curable composition for an optical filter used in a solid-state imaging device, and more preferably used as a curable composition for a color filter used in a solid-state imaging device.

本揭示之硬化性組成物的固體成分濃度為5質量%~40質量%為較佳。下限為7.5質量%以上為更佳,10質量%以上為進一步較佳。上限為35質量%以下為更佳,30質量%以下為進一步較佳。The solid content concentration of the curable composition of the present disclosure is preferably 5% by mass to 40% by mass. The lower limit is more preferably at least 7.5% by mass, and more preferably at least 10% by mass. The upper limit is more preferably at most 35% by mass, and is still more preferably at most 30% by mass.

<由式1表示之自由基聚合起始劑> 本揭示之硬化性組成物包含由上述式1表示之自由基聚合起始劑。 又,由上述式1表示之自由基聚合起始劑為光自由基聚合起始劑為較佳,藉由波長150nm~300nm的光產生自由基之光自由基聚合起始劑為更佳。 作為由上述式1表示之自由基起始劑產生自由基之曝光波長,150nm~460nm為較佳,150nm~420nm為更佳,150nm~380nm為進一步較佳,150nm~300nm為特佳。 <Radical polymerization initiator represented by formula 1> The curable composition of the present disclosure contains the radical polymerization initiator represented by the above formula 1. In addition, the radical polymerization initiator represented by the above formula 1 is preferably a photoradical polymerization initiator, more preferably a photoradical polymerization initiator that generates radicals by light having a wavelength of 150 nm to 300 nm. The exposure wavelength at which the radical initiator represented by the above formula 1 generates radicals is preferably 150nm to 460nm, more preferably 150nm to 420nm, still more preferably 150nm to 380nm, and most preferably 150nm to 300nm.

從產生自所獲得之硬化物之釋氣的抑制性(以下,亦簡稱為“釋氣抑制性”。)及靈敏度的觀點考慮,式1中的Ar 1及Ar 2分別獨立地為苯環或萘環為較佳,苯環為特佳。 另外,關於上述芳香環上可取代的所有位置數,苯環的情況下為6,萘環的情況下為10。 式1中的L 11的鍵結位置只要在式1中的2個芳香環上,則並沒有特別限制,從產生自所獲得之硬化物之釋氣的抑制性及靈敏度的觀點考慮,上述2個芳香環均為苯環時,1個鍵結位置為Y 1的鍵結位置的對位為較佳,又,從釋氣抑制性及靈敏度的觀點考慮,2個鍵結位置分別為R 13及R 14所鍵結之碳原子鍵結之位置的鄰位為較佳。 從合成上的觀點考慮,式1中的X 1為單鍵為較佳。 從釋氣抑制性及靈敏度的觀點考慮,式1中的L 12為伸烷基或伸烯基為較佳,伸烷基為更佳,碳數(碳原子數)1~10的伸烷基為較佳,碳數1~3的伸烷基為更佳。 L 12中的上述伸烷基可以具有後述取代基。作為上述伸烷基可具有的取代基,烷基或芳基為較佳,碳數1~8的烷基或碳數6~10的芳基為更佳,甲基或苯基為進一步較佳,甲基為特佳。 從釋氣抑制性及靈敏度的觀點考慮,式1中的Y 1分別獨立地為羰基為較佳。 從釋氣抑制性及靈敏度的觀點考慮,包含式1中的L 12、X 1及Y 1之環為5員環~8員環為較佳,5員環~7員環為較佳,5員環或6員環為進一步較佳,5員環為特佳。 Ar1 and Ar2 in Formula 1 are each independently a benzene ring or Naphthalene ring is preferred, and benzene ring is particularly preferred. In addition, the number of all substitutable positions on the above-mentioned aromatic ring is 6 in the case of a benzene ring, and 10 in the case of a naphthalene ring. The bonding position of L11 in Formula 1 is not particularly limited as long as it is on the two aromatic rings in Formula 1. From the viewpoint of the suppression and sensitivity of outgassing from the obtained cured product, the above-mentioned 2 When the two aromatic rings are all benzene rings, one of the bonding positions is preferably the para position of the bonding position of Y1 , and from the viewpoint of outgassing inhibition and sensitivity, the two bonding positions are respectively R13 And the position ortho to the carbon atom bonded by R 14 is preferred. From the viewpoint of synthesis, X in Formula 1 is preferably a single bond. From the viewpoint of outgassing suppression and sensitivity, L12 in Formula 1 is preferably an alkylene or alkenylene, more preferably an alkylene, and an alkylene with a carbon number (carbon number) of 1 to 10 More preferably, an alkylene group having 1 to 3 carbon atoms is more preferable. The above-mentioned alkylene group in L12 may have a substituent described below. As the substituent that the above-mentioned alkylene group may have, an alkyl group or an aryl group is preferable, an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 10 carbon atoms is more preferable, and a methyl group or a phenyl group is still more preferable. , methyl is particularly preferred. It is preferable that Y 1 in Formula 1 are each independently a carbonyl group from the viewpoint of outgassing suppression property and sensitivity. From the viewpoint of outgassing inhibition and sensitivity, the ring including L 12 , X 1 and Y 1 in Formula 1 is preferably a 5- to 8-membered ring, more preferably a 5- to 7-membered ring, and 5 to 7-membered rings are more preferable. A ring of 6 members or 6 members is further preferred, and a ring of 5 members is particularly preferred.

式1的R 11~R 15中的取代基並沒有特別限制,可較佳地舉出碳數0~100的取代基,更佳地舉出碳數0~50的取代基。作為上述取代基,例如,可舉出鹵素原子、羥基、胺基、烷基、環烷基、雜環基、芳基、雜芳基、醯基、硝基、氰基、磺基、烷基胺基羰基、烷氧基羰基、烷硫基、芳硫基、𠰌啉基、烷氧基烷基、羧基、羧基烷基等。又,該等取代基可以進一步具有取代基,取代基彼此可以鍵結而形成環結構。 又,可以由式1的R 12~R 16中2個以上鍵結而形成之環可以為脂肪族烴環,可以為雜脂肪族環,可以為芳香族烴環,亦可以為雜芳香族環,但脂肪族烴環或雜脂肪族環為較佳。 The substituents in R 11 to R 15 in Formula 1 are not particularly limited, and preferably include substituents with 0 to 100 carbon atoms, and more preferably include substituents with 0 to 50 carbon atoms. Examples of the above substituent include halogen atom, hydroxyl group, amino group, alkyl group, cycloalkyl group, heterocyclic group, aryl group, heteroaryl group, acyl group, nitro group, cyano group, sulfo group, alkyl group Aminocarbonyl, alkoxycarbonyl, alkylthio, arylthio, thiolinyl, alkoxyalkyl, carboxy, carboxyalkyl, etc. In addition, these substituents may further have a substituent, and the substituents may be bonded together to form a ring structure. In addition, the ring formed by bonding two or more of R 12 to R 16 in Formula 1 may be an aliphatic hydrocarbon ring, a heteroaliphatic ring, an aromatic hydrocarbon ring, or a heteroaromatic ring , but an aliphatic hydrocarbon ring or a heteroaliphatic ring is preferred.

從釋氣抑制性及靈敏度的觀點考慮,式1中的R 11為烷基、烯基、芳基、雜芳基、烷氧基或芳氧基為較佳,烷基或芳基為更佳,甲基、乙基、丙基、異丙基、丁基、三級丁基或苯基為進一步較佳,甲基為特佳。 From the viewpoint of outgassing suppression and sensitivity, R in Formula 1 is preferably alkyl, alkenyl, aryl, heteroaryl, alkoxy or aryloxy, more preferably alkyl or aryl , methyl, ethyl, propyl, isopropyl, butyl, tertiary butyl or phenyl are further preferred, and methyl is particularly preferred.

從釋氣抑制性、靈敏度及與基板的密接性(亦簡稱為“密接性”。)的觀點考慮,式1中的R 12為烷氧基、芳氧基、硝基、氰基、鹵素原子或由下述式I或式II表示之基團為較佳,烷氧基、芳氧基、硝基、氰基、鹵素原子或由下述式I或式II表示之基團為更佳,硝基、鹵素原子或由下述式I或式II表示之基團為進一步較佳,由下述式I或式II表示之基團為特佳。 從釋氣抑制性、靈敏度及密接性的觀點考慮,式1中的p1為0或1為較佳,1為更佳。 又,從釋氣抑制性、靈敏度及密接性的觀點考慮,式1中的R 12的取代位置包含L 11的鍵結位置的對位為較佳。 From the viewpoint of outgassing suppression, sensitivity, and adhesion to the substrate (also simply referred to as "adhesion"), R 12 in Formula 1 is an alkoxy group, an aryloxy group, a nitro group, a cyano group, or a halogen atom Or the group represented by following formula I or formula II is better, alkoxy group, aryloxy group, nitro group, cyano group, halogen atom or the group represented by following formula I or formula II is better, A nitro group, a halogen atom, or a group represented by the following formula I or II is further preferred, and a group represented by the following formula I or II is particularly preferred. From the viewpoint of outgassing suppression, sensitivity, and adhesiveness, p1 in Formula 1 is preferably 0 or 1, and 1 is more preferable. Also, from the viewpoint of outgassing suppression, sensitivity, and adhesiveness, the substitution position of R 12 in Formula 1 includes the para position of the bonding position of L 11 is preferable.

[化學式11]

Figure 02_image022
[chemical formula 11]
Figure 02_image022

式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。 In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group.

式I及式II中的R 101~R 105及R 201~R 205分別獨立地為氫原子或烷基為較佳,氫原子或甲基為更佳。 式I及式II中的Z為O或S為較佳,O為更佳。 R 101 -R 105 and R 201 -R 205 in formulas I and II are preferably independently hydrogen atoms or alkyl groups, more preferably hydrogen atoms or methyl groups. Z in Formula I and Formula II is preferably O or S, and O is more preferred.

從釋氣抑制性及靈敏度的觀點考慮,式1中的R 13及R 14分別獨立地為氫原子、烷基或芳基為較佳,烷基為更佳,碳數1~20的烷基為進一步較佳,碳數1~8的烷基為特佳。 又,如上所述,式1中的R 13及R 14分別獨立地具有取代基,例如,可舉出具有選自包括醚鍵、硫醚鍵及酯鍵之群組中之至少1種鍵之態樣。 進而,從合成上的觀點考慮,式1中的R 13及R 14為相同基團為較佳。 From the viewpoint of outgassing suppression and sensitivity, R 13 and R 14 in Formula 1 are each independently a hydrogen atom, an alkyl group or an aryl group is preferred, an alkyl group is more preferred, and an alkyl group having 1 to 20 carbon atoms More preferably, an alkyl group having 1 to 8 carbon atoms is particularly preferable. Also, as described above, R13 and R14 in Formula 1 each independently have a substituent, for example, one having at least one bond selected from the group consisting of an ether bond, a thioether bond, and an ester bond appearance. Furthermore, from the viewpoint of synthesis, R 13 and R 14 in Formula 1 are preferably the same group.

從釋氣抑制性、靈敏度及密接性的觀點考慮,式1中的R 15為烷氧基、芳氧基、硝基、氰基或鹵素原子為較佳。 從釋氣抑制性、靈敏度及密接性的觀點考慮,式1中的p2為0或1為較佳,0為更佳。 R 15 in Formula 1 is preferably an alkoxy group, an aryloxy group, a nitro group, a cyano group, or a halogen atom from the viewpoints of outgassing suppression, sensitivity, and adhesion. From the viewpoint of outgassing suppression, sensitivity, and adhesiveness, p2 in Formula 1 is preferably 0 or 1, and 0 is more preferable.

從釋氣抑制性、靈敏度及溶解性的觀點考慮,由上述式1表示之自由基聚合起始劑的分子量為275以上且未達1,000為較佳,275~800為更佳,290~600為特佳。From the viewpoints of outgassing inhibition, sensitivity, and solubility, the molecular weight of the radical polymerization initiator represented by the above formula 1 is preferably 275 or more and less than 1,000, more preferably 275 to 800, and 290 to 600. Excellent.

從釋氣抑制性及靈敏度的觀點考慮,由上述式1表示之自由基聚合起始劑為由下述式2表示之自由基聚合起始劑為較佳。It is preferable that the radical polymerization initiator represented by the above formula 1 is a radical polymerization initiator represented by the following formula 2 from the viewpoint of outgassing suppression property and sensitivity.

[化學式12]

Figure 02_image024
[chemical formula 12]
Figure 02_image024

式2中,R 21表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 22及R 25分別獨立地表示烷基羰基、芳基羰基、雜芳基羰基、烷基、烷氧基、芳基、雜芳基、芳氧基、鹵素原子、硝基或氰基,p3表示0~3的整數,p4表示0~2的整數,R 23及R 24分別獨立地表示氫原子、烷基或芳基,R 26及R 27分別獨立地表示氫原子、烷基或芳基,Y 2表示單鍵或羰基,Y 2為羰基時,可以存在複數個之R 26及可以存在複數個之R 27中的至少1個不是氫原子,n為1~3的整數,R 22~R 27中2個以上可以鍵結而形成環。 In formula 2, R 21 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 22 and R 25 independently represent an alkyl carbonyl group, an aryl carbonyl group, a heteroaryl carbonyl group, Alkyl, alkoxy, aryl, heteroaryl, aryloxy, halogen atom, nitro or cyano, p3 represents an integer from 0 to 3, p4 represents an integer from 0 to 2, R 23 and R 24 are independent represents a hydrogen atom, an alkyl group or an aryl group, R 26 and R 27 independently represent a hydrogen atom, an alkyl group or an aryl group, Y 2 represents a single bond or a carbonyl group, and when Y 2 is a carbonyl group, there may be a plurality of R 26 And at least one of R 27 that may exist in plural is not a hydrogen atom, n is an integer of 1 to 3, and two or more of R 22 to R 27 may be bonded to form a ring.

式2的R 21~R 27中的各基團可以進一步具有在上述式1中記載的取代基。 又,可以由式2的R 22~R 27中2個以上鍵結而形成之環可以為脂肪族烴環,可以為雜脂肪族環,可以為芳香族烴環,亦可以為雜芳香族環,但脂肪族烴環或雜脂肪族環為較佳。 Each of R 21 to R 27 in Formula 2 may further have a substituent described in Formula 1 above. In addition, the ring formed by bonding two or more of R 22 to R 27 in Formula 2 may be an aliphatic hydrocarbon ring, a heteroaliphatic ring, an aromatic hydrocarbon ring, or a heteroaromatic ring , but an aliphatic hydrocarbon ring or a heteroaliphatic ring is preferred.

從釋氣抑制性及靈敏度的觀點考慮,式2中的R 21為烷基或芳基為較佳,甲基、乙基、丙基、異丙基、丁基、三級丁基或苯基為更佳,甲基為特佳。 From the viewpoint of outgassing inhibition and sensitivity, R in formula 2 is preferably alkyl or aryl , methyl, ethyl, propyl, isopropyl, butyl, tertiary butyl or phenyl More preferred, methyl is especially preferred.

從釋氣抑制性、靈敏度及密接性的觀點考慮,式2中的R 22為鹵素原子、硝基、芳基、雜芳基或由上述式I或式II表示之基團為較佳,鹵素原子、硝基、芳基、雜芳基或由上述式I或式II表示之基團為更佳,鹵素原子、硝基或由上述式I或式II表示之基團為進一步較佳,由上述式I或式II表示之基團為特佳。 從釋氣抑制性、靈敏度及密接性的觀點考慮,式2中的p3為0或1為較佳,1為更佳。 又,從釋氣抑制性、靈敏度及密接性的觀點考慮,式2中的R 22的取代位置包含式2中的2個芳香環藉由單鍵鍵結之鍵結位置的對位為較佳。 From the viewpoints of outgassing inhibition, sensitivity, and adhesion, R in Formula 2 is preferably a halogen atom, nitro, aryl, heteroaryl, or a group represented by the above-mentioned formula I or formula II, and halogen Atom, nitro, aryl, heteroaryl or the group represented by the above formula I or formula II is more preferred, halogen atom, nitro or the group represented by the above formula I or formula II is further preferred, by The group represented by the above-mentioned formula I or formula II is particularly preferred. From the viewpoint of outgassing suppression, sensitivity, and adhesiveness, p3 in Formula 2 is preferably 0 or 1, and 1 is more preferable. Also, from the viewpoints of outgassing suppression, sensitivity, and adhesion, the substitution position of R22 in Formula 2 includes the para position of the bonding position of the two aromatic rings in Formula 2 bonded by a single bond. .

從釋氣抑制性及靈敏度的觀點考慮,式2中的R 23及R 24分別獨立地為烷基為較佳,碳數1~20的烷基為更佳,碳數1~8的烷基為特佳。 又,如上所述,式2中的R 23及R 24可以分別獨立地具有取代基,例如,可舉出具有選自包括醚鍵、硫醚鍵及酯鍵之群組中之至少1種鍵之態樣。 進而,從合成上的觀點考慮,式2中的R 23及R 24為相同基團為較佳。 From the viewpoint of outgassing suppression and sensitivity, R23 and R24 in Formula 2 are preferably alkyl groups independently, more preferably alkyl groups with 1 to 20 carbons, and alkyl groups with 1 to 8 carbons For the best. In addition, as described above, R23 and R24 in Formula 2 may each independently have a substituent, for example, include at least one bond selected from the group consisting of an ether bond, a thioether bond, and an ester bond. the state of mind. Furthermore, from the viewpoint of synthesis, R 23 and R 24 in Formula 2 are preferably the same group.

從釋氣抑制性、靈敏度及密接性的觀點考慮,式2中的R 25為烷氧基、芳氧基、硝基、氰基或鹵素原子為較佳。 從釋氣抑制性、靈敏度及密接性的觀點考慮,式2中的p4為0或1為較佳,0為更佳。 From the viewpoints of outgassing suppression, sensitivity, and adhesion, R 25 in Formula 2 is preferably an alkoxy group, an aryloxy group, a nitro group, a cyano group, or a halogen atom. From the viewpoint of outgassing suppression, sensitivity, and adhesiveness, p4 in Formula 2 is preferably 0 or 1, and 0 is more preferable.

從釋氣抑制性及靈敏度的觀點考慮,式2中的R 26及R 27分別獨立地為氫原子、烷基或芳基為較佳,氫原子或烷基為更佳,氫原子或碳數1~8的烷基為進一步較佳,氫原子或甲基為特佳。 又,從釋氣抑制性、靈敏度及溶解性的觀點考慮,式2中的R 26及R 27中僅式2的肟基的α位的R 26為烷基,且其餘的R 26及R 27為氫原子為較佳,僅式2的肟基的α位的R 26為甲基,且其餘的R 26及R 27為氫原子為更佳。 從釋氣抑制性及靈敏度的觀點考慮,式2中的n為1或2為較佳,1為更佳。 From the viewpoint of outgassing suppression and sensitivity, R26 and R27 in formula 2 are independently hydrogen atom, alkyl or aryl group, preferably hydrogen atom or alkyl group, hydrogen atom or carbon number An alkyl group of 1 to 8 is further preferred, and a hydrogen atom or a methyl group is particularly preferred. Also, from the viewpoints of outgassing inhibition, sensitivity, and solubility, among R 26 and R 27 in formula 2, only R 26 at the alpha position of the oxime group in formula 2 is an alkyl group, and the remaining R 26 and R 27 It is preferable to be a hydrogen atom, and only R 26 at the alpha position of the oxime group in formula 2 is a methyl group, and it is more preferable that the rest of R 26 and R 27 are hydrogen atoms. From the viewpoint of outgassing suppression and sensitivity, n in Formula 2 is preferably 1 or 2, and 1 is more preferable.

從釋氣抑制性及靈敏度的觀點考慮,式2中的Y 2分別獨立地為羰基為較佳。 It is preferable that Y 2 in Formula 2 are each independently a carbonyl group from the viewpoint of outgassing suppression property and sensitivity.

從釋氣抑制性及靈敏度的觀點考慮,由上述式1表示之自由基聚合起始劑為由下述式3表示之自由基聚合起始劑為更佳。The radical polymerization initiator represented by the above formula 1 is more preferably a radical polymerization initiator represented by the following formula 3 from the viewpoint of outgassing suppression property and sensitivity.

[化學式13]

Figure 02_image026
[chemical formula 13]
Figure 02_image026

式3中,R 31表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 32表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 33及R 34分別獨立地表示氫原子或烷基,R 36~R 39分別獨立地表示氫原子、烷基或芳基,R 32~R 34中2個以上可以鍵結而形成環,R 36與R 37可以鍵結而形成環。 In formula 3, R 31 represents alkyl, alkenyl, aryl, heteroaryl, alkoxy or aryloxy, R 32 represents hydrogen atom, halogen atom, nitro, aryl, heteroaryl, alkoxy , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 33 and R 34 independently represent a hydrogen atom or an alkyl group, R 36 ~R 39 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 32 to R 34 may be bonded to form a ring, and R 36 and R 37 may be bonded to form a ring.

式3中的R 31、R 33及R 34的較佳態樣與上述式2中的R 21、R 23及R 24的較佳態樣相同。 從釋氣抑制性、靈敏度及密接性的觀點考慮,式3中的R 32為鹵素原子、硝基、芳基、雜芳基或由上述式I或式II表示之基團為較佳,鹵素原子、硝基或由上述式I或式II表示之基團為更佳,由上述式I或式II表示之基團為特佳。 從釋氣抑制性及靈敏度的觀點考慮,式3中的R 36、R 37及R 39分別獨立地為氫原子、烷基或芳基為較佳,氫原子為更佳。 從釋氣抑制性、靈敏度及溶解性的觀點考慮,式3中的R 38為氫原子、烷基或芳基為較佳,烷基為更佳,碳數1~8的烷基為進一步較佳,甲基為特佳。 又,可以由式3的R 32~R 34中2個以上鍵結而形成之環或可以由R 36與R 37鍵結而形成之環可以為脂肪族烴環,亦可以為雜脂肪族環。 Preferred aspects of R 31 , R 33 and R 34 in Formula 3 are the same as those of R 21 , R 23 and R 24 in Formula 2 above. From the viewpoints of outgassing inhibition, sensitivity and adhesion, R in Formula 3 is preferably a halogen atom, nitro, aryl, heteroaryl or a group represented by the above-mentioned formula I or formula II, and halogen Atoms, nitro groups, or groups represented by the above formula I or II are more preferred, and groups represented by the above formula I or II are particularly preferred. From the viewpoint of outgassing suppression and sensitivity, R 36 , R 37 and R 39 in Formula 3 are each independently preferably a hydrogen atom, an alkyl group or an aryl group, more preferably a hydrogen atom. From the viewpoints of outgassing inhibition, sensitivity and solubility, R in Formula 3 is preferably a hydrogen atom, an alkyl group or an aryl group, more preferably an alkyl group, and an alkyl group with 1 to 8 carbon atoms is further more preferable. Preferably, methyl is especially preferred. Also, the ring that may be formed by bonding two or more of R 32 to R 34 in Formula 3 or the ring that may be formed by bonding R 36 and R 37 may be an aliphatic hydrocarbon ring or a heteroaliphatic ring .

又,從釋氣抑制性及靈敏度的觀點考慮,由上述式1表示之自由基聚合起始劑為由下述式4表示之自由基聚合起始劑為較佳。Furthermore, it is preferable that the radical polymerization initiator represented by the above-mentioned formula 1 is a radical polymerization initiator represented by the following formula 4 from the viewpoint of outgassing suppression property and sensitivity.

[化學式14]

Figure 02_image028
[chemical formula 14]
Figure 02_image028

式4中,R 41表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 42表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 43及R 44分別獨立地表示氫原子或烷基,R 46及R 47分別獨立地表示氫原子、烷基或芳基,R 42~R 44中2個以上可以鍵結而形成環,R 46與R 47可以鍵結而形成環,R 42為氫原子、鹵素原子、硝基、烷氧基、芳氧基或由下述式I或式II表示之基團時,R 46及R 47不會均成為氫原子,R 42為芳基、雜芳基、一級~三級胺基、烷硫基或芳硫基時,R 46及R 47可以均為氫原子。 In formula 4, R 41 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 42 represents a hydrogen atom, a halogen atom, a nitro group, an aryl group, a heteroaryl group, an alkoxy group , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 43 and R 44 independently represent a hydrogen atom or an alkyl group, R 46 and R 47 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 42 to R 44 may be bonded to form a ring, R 46 and R 47 may be bonded to form a ring, R 42 is a hydrogen atom, When a halogen atom, nitro, alkoxy, aryloxy group or a group represented by the following formula I or formula II, R 46 and R 47 will not both become hydrogen atoms, and R 42 is aryl, heteroaryl, In the case of a primary to tertiary amino group, an alkylthio group or an arylthio group, both R 46 and R 47 may be hydrogen atoms.

式4中的R 41~R 44的較佳態樣與上述式3中的R 31~R 34的較佳態樣相同。 式4中的R 46及R 47的較佳態樣與上述式3中的R 38及R 39的較佳態樣相同。 由上述式1表示之自由基聚合起始劑為由上述式3或式4表示之自由基聚合起始劑為更佳,由上述式4表示之自由基聚合起始劑為特佳。 Preferred aspects of R 41 to R 44 in Formula 4 are the same as those of R 31 to R 34 in Formula 3 above. Preferred aspects of R 46 and R 47 in Formula 4 are the same as those of R 38 and R 39 in Formula 3 above. The radical polymerization initiator represented by the above formula 1 is more preferably the radical polymerization initiator represented by the above formula 3 or formula 4, and the radical polymerization initiator represented by the above formula 4 is particularly preferable.

由上述式1表示之自由基聚合起始劑在ArF吸收區域即波長193nm、KrF吸收區域即波長248nm及i射線吸收區域即波長365nm中的任一處具有吸收為較佳,在ArF吸收區域即波長193nm及KrF吸收區域即波長248nm中的任一處具有吸收為更佳。 從靈敏度的觀點考慮,由上述式1表示之自由基聚合起始劑在波長193nm、248nm或365nm中任一處的莫耳吸光係數為10L・mol -1・cm -1以上為較佳,100L・mol -1・cm -1以上為更佳,1,000L・mol -1・cm -1以上為特佳。 其中,從靈敏度及密接性的觀點考慮,由上述式1表示之自由基聚合起始劑在乙腈溶液中,25℃下,相對於波長248nm的光之莫耳吸光係數為1,000L・mol -1・cm -1以上為較佳,2,000以上為更佳,3,000以上為特佳。上限並沒有限定,50,000以下為較佳,30,000以下為更佳,10,000以下為特佳。藉由將莫耳吸光係數的上限設定為10,000以下,曝光光源的透射性提高,密接性得到改善。 又,從靈敏度及密接性的觀點考慮,由上述式1表示之自由基聚合起始劑在乙腈溶液中,25℃下,波長248nm處的莫耳吸光係數為1,000以上,波長405nm處的莫耳吸光係數未達1,000為較佳。 The radical polymerization initiator represented by the above-mentioned formula 1 preferably has absorption in any one of the ArF absorption region, i.e. wavelength 193nm, the KrF absorption region, i.e. wavelength 248nm, and i-ray absorption region, i.e. wavelength 365nm, and in the ArF absorption region i.e. It is more preferable to have absorption at any one of the wavelength 193nm and the KrF absorption region, that is, the wavelength 248nm. From the viewpoint of sensitivity, the molar absorption coefficient of the radical polymerization initiator represented by the above formula 1 at any wavelength of 193nm, 248nm or 365nm is preferably 10L·mol -1 ·cm -1 or more, 100L・mol -1・cm -1 or more is more preferable, and 1,000L・mol -1・cm -1 or more is especially preferable. Among them, from the viewpoint of sensitivity and adhesion, the radical polymerization initiator represented by the above formula 1 has a molar absorption coefficient of 1,000 L·mol -1 with respect to light having a wavelength of 248 nm at 25°C in an acetonitrile solution.・More than cm -1 is better, more than 2,000 is more preferable, and more than 3,000 is especially good. The upper limit is not limited, but it is preferably 50,000 or less, more preferably 30,000 or less, and particularly preferably 10,000 or less. By setting the upper limit of the molar absorptivity to 10,000 or less, the transmittance of the exposure light source is improved, and the adhesiveness is improved. In addition, from the viewpoint of sensitivity and adhesion, the radical polymerization initiator represented by the above formula 1 has a molar absorption coefficient of 1,000 or more at a wavelength of 248 nm at 25° C. in an acetonitrile solution, and a molar absorption coefficient at a wavelength of 405 nm. The absorbance coefficient is preferably less than 1,000.

作為由上述式1表示之自由基聚合起始劑的具體例,可較佳地舉出A-1~A-119。然而,當然不限定於該等。另外,Me表示甲基。As a specific example of the radical polymerization initiator represented by said Formula 1, A-1 - A-119 are mentioned preferably. However, of course, it is not limited to these. In addition, Me represents a methyl group.

[化學式15]

Figure 02_image030
[chemical formula 15]
Figure 02_image030

[化學式16]

Figure 02_image032
[chemical formula 16]
Figure 02_image032

[化學式17]

Figure 02_image034
[chemical formula 17]
Figure 02_image034

[化學式18]

Figure 02_image036
[chemical formula 18]
Figure 02_image036

[化學式19]

Figure 02_image038
[chemical formula 19]
Figure 02_image038

[化學式20]

Figure 02_image040
[chemical formula 20]
Figure 02_image040

[化學式21]

Figure 02_image042
[chemical formula 21]
Figure 02_image042

本揭示之硬化性組成物可以單獨包含1種由上述式1表示之自由基聚合起始劑,亦可以包含2種以上。使用2種以上時,該等的合計量在下述範圍內為較佳。 從釋氣抑制性及簡便的觀點考慮,由上述式1表示之自由基聚合起始劑的含量相對於硬化性組成物的總固體成分,0.01質量%~30質量%為較佳,0.05質量%~20質量%為更佳,0.1質量%~10質量%為進一步較佳,1質量%~8質量%為特佳。 The curable composition of the present disclosure may contain one type of radical polymerization initiator represented by the above formula 1 alone, or may contain two or more types. When using 2 or more types, it is preferable that these total amounts are in the following range. From the viewpoint of outgassing suppression and simplicity, the content of the radical polymerization initiator represented by the above formula 1 is preferably 0.01% by mass to 30% by mass, and 0.05% by mass relative to the total solid content of the curable composition. -20 mass % is more preferable, 0.1 mass % - 10 mass % is still more preferable, and 1 mass % - 8 mass % is especially preferable.

又,由上述式1表示之自由基聚合起始劑在波長450nm以上不具有吸收為為較佳,在波長420nm以上不具有吸收為更佳。亦即,由上述式1表示之自由基聚合起始劑為白色~淡黃色為較佳。若為上述顏色,對濾色器的分光的影響少而較佳。Also, the radical polymerization initiator represented by the above formula 1 preferably has no absorption at a wavelength of 450 nm or more, and more preferably does not have absorption at a wavelength of 420 nm or more. That is, the radical polymerization initiator represented by the above formula 1 is preferably white to pale yellow. If it is the above-mentioned color, the effect on the light spectrum of the color filter is small, which is preferable.

由上述式1表示之自由基聚合起始劑的製造方法並沒有特別限制,可以藉由公知的方法製造,亦可以參考公知的方法製造。 又,作為由上述式1表示之自由基聚合起始劑的製造方法,例如,可較佳地舉出以下方法。在下述方法中,可獲得由Y 1為單鍵的上述式1表示之自由基聚合起始劑。 準備9,9-未經取代的茀化合物,使用三級丁氧基鉀(tBuOK)作為鹼,使2莫耳當量的溴化化合物(R 1-Br)與上述茀化合物進行反應,由此製作了茀環的9位被二取代的化合物(9,9-二取代茀化合物)。使用氯化鋁(AlCl 3)觸媒,進行伴有α-溴醯基溴與9,9-二取代茀化合物的重排反應之環形成反應而製作環狀酮化合物。針對環狀酮化合物,在乙酸鈉(AcONa)存在下,使鹽酸羥胺與羰基進行反應,形成肟基,在三乙胺(TEA)存在下,使醯氯化合物(R 3COCl)與肟基進行反應,由此製作了由上述式1表示之自由基聚合起始劑。 The method for producing the radical polymerization initiator represented by the above formula 1 is not particularly limited, and it can be produced by a known method, or can be produced with reference to a known method. Moreover, as a manufacturing method of the radical polymerization initiator represented by said Formula 1, for example, the following method is mentioned preferably. In the following method, the radical polymerization initiator represented by the above formula 1 in which Y 1 is a single bond can be obtained. To prepare the 9,9-unsubstituted stilbene compound, 2 molar equivalents of the brominated compound (R 1 -Br) were reacted with the above stilbene compound using tertiary butoxypotassium (tBuOK) as a base to produce A compound in which the 9-position of the stilbene ring is disubstituted (9,9-disubstituted stilbene compound). A cyclic ketone compound is produced by performing a ring formation reaction involving a rearrangement reaction between α-bromoacyl bromide and a 9,9-disubstituted stilbene compound using an aluminum chloride (AlCl 3 ) catalyst. For cyclic ketone compounds, in the presence of sodium acetate (AcONa), react hydroxylamine hydrochloride with carbonyl to form an oxime group, and in the presence of triethylamine (TEA), make acyl chloride (R 3 COCl) react with an oxime group reaction, thereby producing a radical polymerization initiator represented by the above formula 1.

[化學式22]

Figure 02_image044
[chemical formula 22]
Figure 02_image044

又,作為由上述式1表示之自由基聚合起始劑的其他製造方法,例如,可較佳地舉出以下方法。在下述方法中,可獲得由Y 1為羰基的上述式1表示之自由基聚合起始劑。 在上述方法中,製作9,9-二取代茀化合物之後,使用氯化鋁(AlCl 3)觸媒,進行伴有α-溴醯基溴與9,9-二取代茀化合物的重排反應之環形成反應,製作R 2的取代位置與以上不同的環狀酮化合物。針對所獲得之環狀酮化合物,使用甲醇鈉(NaOMe)作為鹼,使亞硝酸異戊酯進行反應,在羰基的α位形成肟基,在三乙胺(TEA)存在下,使醯氯化合物(R 3COCl)與肟基進行反應,由此製作由上述式1表示之自由基聚合起始劑。 Moreover, as another manufacturing method of the radical polymerization initiator represented by said Formula 1, for example, the following method can be mentioned preferably. In the following method, the radical polymerization initiator represented by the above formula 1 in which Y 1 is a carbonyl group can be obtained. In the above method, after the 9,9-disubstituted fennel compound is prepared, aluminum chloride (AlCl 3 ) catalyst is used to carry out the rearrangement reaction involving α-bromoacyl bromide and the 9,9-disubstituted fennel compound. Ring formation reaction to produce cyclic ketone compounds in which the substitution position of R2 is different from the above. For the obtained cyclic ketone compound, use sodium methoxide (NaOMe) as a base to react isoamyl nitrite to form an oxime group at the α position of the carbonyl group, and in the presence of triethylamine (TEA), make the acyl chloride compound (R 3 COCl) reacts with an oxime group to produce a radical polymerization initiator represented by the above formula 1.

[化學式23]

Figure 02_image046
[chemical formula 23]
Figure 02_image046

<其他自由基聚合起始劑> 本揭示之硬化性組成物可以包含由上述式1表示之自由基聚合起始劑以外的其他自由基聚合起始劑。 作為其他自由基聚合起始劑,可舉出肟化合物、α-胺基苯乙酮化合物、α-羥基酮化合物、醯基膦化合物等。 其中,肟化合物為較佳。 藉由同時使用由上述式1表示之自由基聚合起始劑和其他自由基聚合起始劑,能夠獲得平衡性更優異之矩形性良好的圖案。 <Other radical polymerization initiators> The curable composition of the present disclosure may contain other radical polymerization initiators other than the radical polymerization initiator represented by Formula 1 above. Examples of other radical polymerization initiators include oxime compounds, α-aminoacetophenone compounds, α-hydroxyketone compounds, acylphosphine compounds, and the like. Among them, oxime compounds are preferred. By using the radical polymerization initiator represented by the above-mentioned formula 1 together with other radical polymerization initiators, it is possible to obtain a rectangular pattern with better balance.

作為肟化合物,可舉出日本特開2001-233842號公報中記載之化合物、日本特開2000-080068號公報中記載之化合物、日本特開2006-342166號公報中記載之化合物、J.C.S.Perkin II(1979年,第1653-1660頁)中記載之化合物、J.C.S.Perkin II(1979年,第156-162頁)中記載之化合物、Journal of Photopolymer Science and Technology(1995年,第202-232頁)中記載之化合物、日本特開2000-066385號公報中記載之化合物、日本特表2004-534797號公報中記載之化合物、日本特表2006-342166號公報中記載之化合物、日本特開2017-019766號公報中記載之化合物、日本專利第6065596號公報中記載之化合物、國際公開第2015/152153號中記載之化合物、國際公開第2017/051680號中記載之化合物、日本特開2017-198865號公報中記載之化合物、國際公開第2017/164127號的0025~0038段中記載之化合物、國際公開第2013/167515號中記載之化合物、日本特開2020-172619號公報中記載之聚合物、國際公開第2020/152120號中記載之化合物、國際公開第2021/023144號中記載之肟酯化合物等。作為肟化合物的具體例,可舉出3-苯甲醯氧基亞胺基丁-2-酮、3-乙醯氧基亞胺基丁-2-酮、3-丙醯氧基亞胺基丁-2-酮、2-乙醯氧基亞胺基戊-3-酮、2-乙醯氧基亞胺基-1-苯基丙-1-酮、2-苯甲醯氧基亞胺基-1-苯基丙-1-酮、3-(4-甲苯磺醯氧基)亞胺基丁-2-酮及2-乙氧基羰氧基亞胺基-1-苯基丙-1-酮等、1-[4-(苯硫基)苯基]-3-環己烷-丙-1,2-二酮-2-(O-乙醯肟)。作為市售品,可舉出Irgacure-OXE01、Irgacure-OXE02、Irgacure-OXE03、Irgacure-OXE04(以上為BASF公司製)、TR-PBG-304、TR-PBG-327(TRONLY公司製)、Adeka Optomer N-1919(ADEKA CORPORATION製,日本特開2012-014052號公報中記載之光聚合起始劑2)。 又,作為肟化合物,使用無著色性之化合物或透明性高且不易變色的化合物亦較佳。作為市售品,可舉出ADEKA ARKLS NCI-730、NCI-831、NCI-930(以上為ADEKA CORPORATION製)等。 又,作為其他自由基聚合起始劑,亦能夠使用日本特表2020-507664號公報中記載之茀基胺基酮類光起始劑。 Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J.C.S.Perkin II ( Compounds described in 1979, pp. 1653-1660), compounds described in J.C.S. Perkin II (1979, pp. 156-162), Journal of Photopolymer Science and Technology (1995, pp. 202-232) Compounds described in Japanese Patent Application Laid-Open No. 2000-066385, Compounds described in Japanese Patent Application Publication No. 2004-534797, Compounds described in Japanese Patent Application Publication No. 2006-342166, Japanese Patent Application Publication No. 2017-019766 Compounds described in Japanese Patent No. 6065596, Compounds described in International Publication No. 2015/152153, Compounds described in International Publication No. 2017/051680, Japanese Patent Application Publication No. 2017-198865 Compounds described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, polymers described in Japanese Patent Laid-Open No. 2020-172619, and International Publication No. 2020 Compounds described in /152120, oxime ester compounds described in International Publication No. 2021/023144, and the like. Specific examples of oxime compounds include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, Butan-2-one, 2-Acetyloxyiminopentan-3-one, 2-Acetyloxyimino-1-phenylpropan-1-one, 2-Benzyloxyimine Base-1-phenylpropan-1-one, 3-(4-tosyloxy)iminobutan-2-one and 2-ethoxycarbonyloxyimino-1-phenylpropan- 1-ketone, etc., 1-[4-(phenylthio)phenyl]-3-cyclohexane-propan-1,2-dione-2-(O-acetyloxime). Commercially available items include Irgacure-OXE01, Irgacure-OXE02, Irgacure-OXE03, Irgacure-OXE04 (the above are manufactured by BASF Corporation), TR-PBG-304, TR-PBG-327 (manufactured by TRONLY Corporation), Adeka Optomer N-1919 (manufactured by ADEKA CORPORATION, photopolymerization initiator 2 described in JP 2012-014052 A). In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and low discoloration. As a commercial item, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (the above are made by ADEKA CORPORATION) etc. are mentioned. In addition, as other radical polymerization initiators, the fenylaminoketone-based photoinitiators described in JP 2020-507664 A can also be used.

作為肟化合物,亦能夠使用具有茀環之肟化合物。作為具有茀環之肟化合物的具體例,可舉出日本特開2014-137466號公報中記載之化合物、日本專利第6636081號公報中記載之化合物、韓國公開專利第10-2016-0109444號公報中記載之化合物。As the oxime compound, an oxime compound having a terme ring can also be used. Specific examples of oxime compounds having a stilbene ring include the compounds described in JP-A-2014-137466, the compounds described in JP-A-6636081, and the compounds described in Korean Laid-Open Patent No. 10-2016-0109444. listed compounds.

作為肟化合物,亦能夠使用具有咔唑環的至少一個苯環成為萘環之骨架之肟化合物。作為此類肟化合物的具體例,可舉出國際公開第2013/083505號中記載之化合物。As an oxime compound, the oxime compound which has at least one benzene ring which has a carbazole ring as a skeleton of a naphthalene ring can also be used. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.

作為肟化合物,亦能夠使用具有氟原子之肟化合物。作為具有氟原子之肟化合物的具體例,可舉出日本特開2010-262028號公報中記載之化合物、日本特表2014-500852號公報中記載之化合物24、36~40、日本特開2013-164471號公報中記載之化合物(C-3)等。As an oxime compound, the oxime compound which has a fluorine atom can also be used. Specific examples of oxime compounds having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36-40 described in JP-A-2014-500852, JP-A-2013- Compound (C-3) described in Publication No. 164471, etc.

作為肟化合物,能夠使用具有硝基之肟化合物。具有硝基之肟化合物設為二聚體亦較佳。作為具有硝基之肟化合物的具體例,可舉出日本特開2013-114249號公報的0031~0047段、日本特開2014-137466號公報的0008~0012、0070~0079段中記載之化合物、日本專利4223071號公報的0007~0025段中記載之化合物、ADEKA ARKLS NCI-831(ADEKA CORPORATION製)。As the oxime compound, an oxime compound having a nitro group can be used. It is also preferred that the oxime compound having a nitro group be a dimer. Specific examples of oxime compounds having a nitro group include compounds described in paragraphs 0031 to 0047 of JP-A-2013-114249 , compounds described in paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466 , A compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

作為肟化合物,亦能夠使用具有苯并呋喃骨架之肟化合物。作為具體例,可舉出國際公開第2015/036910號中記載之OE-01~OE-75。As an oxime compound, the oxime compound which has a benzofuran skeleton can also be used. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

作為肟化合物,亦能夠使用在咔唑骨架上鍵結了具有羥基之取代基之肟化合物。作為此類光聚合起始劑,可舉出國際公開第2019/088055號中記載之化合物等。As the oxime compound, an oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.

作為光肟化合物,亦能夠使用具有對芳香族環導入了拉電子基團之芳香族環基Ar OX1之肟化合物(以下,亦稱為肟化合物OX。)。作為上述芳香族環基Ar OX1所具有之拉電子基團,可舉出醯基、硝基、三氟甲基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、氰基,醯基及硝基為較佳,從容易形成耐光性優異之膜的理由考慮,醯基為更佳,苯甲醯基為進一步較佳。苯甲醯基可以具有取代基。作為取代基,鹵素原子、氰基、硝基、羥基、烷基、烷氧基、芳基、芳氧基、雜環基、雜環氧基、烯基、烷基氫硫基、芳基氫硫基、醯基或胺基為較佳,烷基、烷氧基、芳基、芳氧基、雜環氧基、烷基氫硫基、芳基氫硫基或胺基為更佳,烷氧基、烷基氫硫基或胺基為進一步較佳。 As the photoxime compound, an oxime compound (hereinafter, also referred to as an oxime compound OX.) having an aromatic ring group Ar OX1 having an electron-withdrawing group introduced into an aromatic ring can also be used. Examples of the electron-withdrawing group included in the aromatic ring group Ar OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, An arylsulfonyl group, a cyano group, an acyl group, and a nitro group are preferable, an acyl group is more preferable, and a benzoyl group is still more preferable from the viewpoint of being easy to form a film excellent in light resistance. The benzoyl group may have a substituent. As a substituent, a halogen atom, a cyano group, a nitro group, a hydroxyl group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic epoxy group, an alkenyl group, an alkylthiol group, an arylhydrogen group Thio group, acyl group or amino group are preferred, alkyl group, alkoxy group, aryl group, aryloxy group, heterocyclic epoxy group, alkyl sulfide group, aryl sulfide group or amine group are more preferred, alkyl group An oxy group, an alkylsulfhydryl group or an amine group is further preferred.

本揭示之硬化性組成物含有由下述通式(I)表示之肟酯化合物亦較佳。It is also preferable that the curable composition of the present disclosure contains an oxime ester compound represented by the following general formula (I).

[化學式24]

Figure 02_image048
[chemical formula 24]
Figure 02_image048

通式(I)中,R 1及R 2分別獨立地表示R 111、OR 111、COR 111、SR 111、CONR 112R 113或CN。 R 111、R 112及R 113分別獨立地表示氫原子、碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳基烷基或碳原子數2~20的雜環基,由R 111、R 112及R 113表示之基團的氫原子可以進一步被R 121、OR 121、COR 121、SR 121、NR 122R 123、CONR 122R 123、-NR 122-OR 123、-NCOR 122-OCOR 123、NR 122COR 121、OCOR 121、COOR 121、SCOR 121、OCSR 121、COSR 121、CSOR 121、羥基、硝基、CN、鹵素原子或COOR 121取代。 R 121、R 122及R 123分別獨立地表示氫原子、碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳基烷基或碳原子數2~20的雜環基。由R 121、R 122及R 123表示之基團的氫原子可以進一步被硝基、CN、鹵素原子、羥基或羧基取代。 由R 111、R 112、R 113、R 121、R 122及R 123表示之基團的伸烷基部分在不會藉由-O-、-S-、-COO-、-OCO-、-NR 124-、-NR 124CO-、-NR 124COO-、-OCONR 124-、-SCO-、-COS-、-OCS-或-CSO-與氧原子相鄰的條件下可以斷開1~5次。R 124表示氫原子、碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳基烷基或碳原子數2~20的雜環基。由R 111、R 112、R 113、R 121、R 122、R 123及R 124表示之基團的烷基部分可以具有分支側鏈,亦可以為環狀烷基。 In the general formula (I), R 1 and R 2 each independently represent R 111 , OR 111 , COR 111 , SR 111 , CONR 112 R 113 or CN. R 111 , R 112 and R 113 each independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a carbon number 2 to 20 heterocyclic groups, the hydrogen atoms of the groups represented by R 111 , R 112 and R 113 can be further replaced by R 121 , OR 121 , COR 121 , SR 121 , NR 122 R 123 , CONR 122 R 123 , - NR 122 -OR 123 , -NCOR 122 -OCOR 123 , NR 122 COR 121 , OCOR 121 , COOR 121 , SCOR 121 , OCSR 121 , COSR 121 , CSOR 121 , hydroxyl, nitro, CN, halogen atom or COOR 121 substitution. R 121 , R 122 and R 123 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a carbon number 2 to 20 heterocyclic groups. The hydrogen atoms of the groups represented by R 121 , R 122 and R 123 may be further substituted with a nitro group, CN, a halogen atom, a hydroxyl group or a carboxyl group. The alkylene moieties of the groups represented by R 111 , R 112 , R 113 , R 121 , R 122 and R 123 are not affected by -O-, -S-, -COO-, -OCO-, -NR 124 -, -NR 124 CO-, -NR 124 COO-, -OCONR 124 -, -SCO-, -COS-, -OCS- or -CSO- can be disconnected 1 to 5 times under the condition that the oxygen atom is adjacent . R 124 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. The alkyl portion of the groups represented by R 111 , R 112 , R 113 , R 121 , R 122 , R 123 and R 124 may have a branched side chain or may be a cyclic alkyl group.

通式(I)中,R 3表示氫原子、碳原子數1~20的烷基、碳原子數6~30的芳基、碳原子數7~30的芳基烷基或碳原子數2~20的雜環基。由R 3表示之基團的烷基部分可以具有分支側鏈,亦可以為環狀烷基。 又,R 3與R 7、R 3與R 8、R 4與R 5、R 5與R 6及R 6與R 7分別可以連結而形成環。 由R 3表示之基團的氫原子可以進一步被R 121、OR 121、COR 121、SR 121、NR 122R 123、CONR 122R 123、-NR 122-OR 123、-NCOR 122-OCOR 123、NR 122COR 121、OCOR 121、COOR 121、SCOR 121、OCSR 121、COSR 121、CSOR 121、羥基、硝基、CN、鹵素原子或COOR 121取代。 In the general formula (I), R 3 represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or an alkyl group with 2 to 30 carbon atoms. 20 heterocyclyl. The alkyl portion of the group represented by R 3 may have a branched side chain or may be a cyclic alkyl group. Also, R 3 and R 7 , R 3 and R 8 , R 4 and R 5 , R 5 and R 6 , and R 6 and R 7 may be linked to form a ring. The hydrogen atom of the group represented by R 3 may be further replaced by R 121 , OR 121 , COR 121 , SR 121 , NR 122 R 123 , CONR 122 R 123 , -NR 122 -OR 123 , -NCOR 122 -OCOR 123 , NR 122 Substituted by COR 121 , OCOR 121 , COOR 121 , SCOR 121 , OCSR 121 , COSR 121 , CSOR 121 , hydroxyl group, nitro group, CN, halogen atom or COOR 121 .

通式(I)中,R 4、R 5、R 6及R 7分別獨立地表示R 111、OR 111、SR 111、COR 114、CONR 115R 116、NR 112COR 111、OCOR 111、COOR 114、SCOR 111、OCSR 111、COSR 114、CSOR 111、羥基、CN或鹵素原子,R 4與R 5、R 5與R 6及R 6與R 7分別可以連結而形成環。R 114、R 115及R 116表示氫原子或碳原子數1~20的烷基,由R 114、R 115及R 116表示之基團的烷基部分可以具有分支側鏈,亦可以為環狀烷基。 In general formula (I), R 4 , R 5 , R 6 and R 7 independently represent R 111 , OR 111 , SR 111 , COR 114 , CONR 115 R 116 , NR 112 COR 111 , OCOR 111 , COOR 114 , SCOR 111 , OCSR 111 , COSR 114 , CSOR 111 , hydroxyl group, CN or a halogen atom, R 4 and R 5 , R 5 and R 6 , and R 6 and R 7 may be linked to form a ring. R 114 , R 115 and R 116 represent a hydrogen atom or an alkyl group with 1 to 20 carbon atoms, and the alkyl part of the group represented by R 114 , R 115 and R 116 may have a branched side chain or may be cyclic alkyl.

通式(I)中,R 8表示R 111、OR 111、SR 111、COR 111、CONR 112R 113、NR 112COR 111、OCOR 111、COOR 111、SCOR 111、OCSR 111、COSR 111、CSOR 111、羥基、CN或鹵素原子。 通式(I)中,n表示0或1。 In general formula (I), R 8 represents R 111 , OR 111 , SR 111 , COR 111 , CONR 112 R 113 , NR 112 COR 111 , OCOR 111 , COOR 111 , SCOR 111 , OCSR 111 , COSR 111 , CSOR 111 , Hydroxyl, CN or halogen atom. In general formula (I), n represents 0 or 1.

作為肟化合物OX的具體例,可舉出日本專利第4600600號公報的0083~0105段中記載之化合物。Specific examples of the oxime compound OX include compounds described in paragraphs 0083 to 0105 of Japanese Patent No. 4600600.

又,作為肟化合物,能夠特佳地例示以下所示的化合物。Moreover, as an oxime compound, the compound shown below can be illustrated particularly preferably.

[化學式25]

Figure 02_image050
[chemical formula 25]
Figure 02_image050

[化學式26]

Figure 02_image052
[chemical formula 26]
Figure 02_image052

[化學式27]

Figure 02_image054
[chemical formula 27]
Figure 02_image054

[化學式28]

Figure 02_image056
[chemical formula 28]
Figure 02_image056

[化學式29]

Figure 02_image058
[chemical formula 29]
Figure 02_image058

[化學式30]

Figure 02_image060
[chemical formula 30]
Figure 02_image060

與其他自由基聚合起始劑同時使用時的質量比率並沒有特別限制,從釋氣抑制性的觀點考慮,由上述式1表示之自由基聚合起始劑的含量相對於聚合起始劑的總質量,10質量%以上為較佳,50質量%以上為更佳,80質量%以上為進一步較佳,90質量%以上為特佳。The mass ratio when used together with other radical polymerization initiators is not particularly limited. From the viewpoint of outgassing suppression, the content of the radical polymerization initiator represented by the above formula 1 relative to the total amount of the polymerization initiator The mass is preferably 10% by mass or more, more preferably 50% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more.

<自由基聚合性化合物> 本揭示之硬化性組成物包含自由基聚合性化合物。 作為自由基聚合性化合物,可舉出具有乙烯性不飽和基之化合物等。 <Radical polymerizable compound> The curable composition of the present disclosure contains a radically polymerizable compound. As a radically polymerizable compound, the compound etc. which have an ethylenically unsaturated group are mentioned.

作為樹脂類型自由基聚合性化合物,可舉出包含具有自由基聚合性基之重複單元之樹脂等。樹脂類型聚合性化合物的重量平均分子量(Mw)為2,000~2,000,000為較佳。重量平均分子量的上限為1,000,000以下為更佳,500,000以下為進一步較佳。重量平均分子量的下限為3,000以上為更佳,5,000以上為進一步較佳。Examples of the resin-type radically polymerizable compound include resins containing a repeating unit having a radically polymerizable group, and the like. It is preferable that the weight average molecular weight (Mw) of a resin type polymeric compound is 2,000-2,000,000. The upper limit of the weight average molecular weight is more preferably at most 1,000,000, and is still more preferably at most 500,000. The lower limit of the weight average molecular weight is more preferably 3,000 or more, and is still more preferably 5,000 or more.

單體類型自由基聚合性化合物(聚合性單體)的分子量未達2,000為較佳,1,500以下為更佳。聚合性單體的分子量的下限為100以上為較佳,200以上為更佳。The molecular weight of the monomer type radically polymerizable compound (polymerizable monomer) is preferably less than 2,000, more preferably 1,500 or less. The lower limit of the molecular weight of the polymerizable monomer is preferably 100 or more, more preferably 200 or more.

又,作為聚合性單體的具有乙烯性不飽和基之化合物為3~15官能(甲基)丙烯酸酯化合物為較佳,3~6官能(甲基)丙烯酸酯化合物為更佳。作為具體例,可舉出日本特開2009-288705號公報的0095~0108段、日本特開2013-029760號公報的0227段、日本特開2008-292970號公報的0254~0257段、日本特開2013-253224號公報的0034~0038段、日本特開2012-208494號公報的0477段、日本特開2017-048367號公報、日本專利第6057891號公報、日本專利第6031807號公報、日本特開2017-194662號公報中記載之化合物,該等內容編入本說明書中。Moreover, it is preferable that the compound which has an ethylenically unsaturated group as a polymerizable monomer is a 3-15 functional (meth)acrylate compound, and it is more preferable that it is a 3-6 functional (meth)acrylate compound. Specific examples include paragraphs 0095 to 0108 of JP-A 2009-288705, paragraph 0227 of JP-A 2013-029760, paragraphs 0254-0257 of JP-A 2008-292970, JP-A Paragraphs 0034 to 0038 of Publication No. 2013-253224, Paragraph 0477 of Japanese Patent Application Laid-Open No. 2012-208494, Japanese Patent Publication No. 2017-048367, Japanese Patent Publication No. 6057891, Japanese Patent Publication No. 6031807, Japanese Patent Publication No. 2017 - Compounds described in Publication No. 194662, the content of which is incorporated in this specification.

作為具有乙烯性不飽和基之化合物,可舉出二新戊四醇三(甲基)丙烯酸酯(市售品為KAYARAD D-330;Nippon Kayaku Co.,Ltd.製)、二新戊四醇四(甲基)丙烯酸酯(市售品為KAYARAD D-320;Nippon Kayaku Co.,Ltd.製)、二新戊四醇五(甲基)丙烯酸酯(市售品為KAYARAD D-310;Nippon Kayaku Co.,Ltd.製)、二新戊四醇六(甲基)丙烯酸酯(市售品為KAYARAD DPHA;Nippon Kayaku Co.,Ltd.製,NK ESTER A-DPH-12E;Shin-Nakamura Chemical Co.,Ltd.製)及該等化合物的(甲基)丙烯醯基經由乙二醇和/或丙二醇殘基鍵結之結構的化合物(例如,由SARTOMER Company,Inc.市售之SR454、SR499)等。又,作為具有乙烯性不飽和基之化合物,亦能夠使用二甘油EO(環氧乙烷)改質(甲基)丙烯酸酯(市售品為M-460;TOAGOSEI CO.,LTD.製)、新戊四醇四丙烯酸酯(SHIN-NAKAMURA CHEMICAL Co.,Ltd.製,NK ESTER A-TMMT)、1,6-己二醇二丙烯酸酯(Nippon Kayaku Co.,Ltd.製,KAYARAD HDDA)、RP-1040(Nippon Kayaku Co.,Ltd.製)、ARONIX TO-2349(TOAGOSEI CO.,LTD.製)、NK Oligo UA-7200(SHIN-NAKAMURA CHEMICAL Co.,Ltd.製)、8UH-1006、8UH-1012(Taisei Fine Chemical Co.,Ltd.製)、LIGHT ACRYLATE POB-A0(KYOEISHA CHEMICAL Co.,LTD.製)等。Examples of the compound having an ethylenically unsaturated group include diperythritol tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), diperythritol Tetra(meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), Dineopentaerythritol penta(meth)acrylate (commercially available as KAYARAD D-310; Nippon Kayaku Co., Ltd.), diperythritol hexa(meth)acrylate (commercially available as KAYARAD DPHA; Nippon Kayaku Co., Ltd., NK ESTER A-DPH-12E; Shin-Nakamura Chemical Co., Ltd.) and compounds whose (meth)acryloyl groups are bonded via ethylene glycol and/or propylene glycol residues (for example, SR454, SR499 commercially available from SARTOMER Company, Inc.) wait. Also, as a compound having an ethylenically unsaturated group, diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available as M-460; manufactured by TOAGOSEI CO., LTD.), Neopentylitol tetraacrylate (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), NK Oligo UA-7200 (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL Co., Ltd.), etc.

又,作為具有乙烯性不飽和基之化合物,使用三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷環氧丙烷改質三(甲基)丙烯酸酯、三羥甲基丙烷環氧乙烷改質三(甲基)丙烯酸酯、異三聚氰酸環氧乙烷改質三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯等3官能(甲基)丙烯酸酯化合物亦較佳。作為3官能(甲基)丙烯酸酯化合物的市售品,可舉出ARONIX M-309、M-310、M-321、M-350、M-360、M-313、M-315、M-306、M-305、M-303、M-452、M-450(TOAGOSEI CO.,LTD.製)、NK ESTER A9300、A-GLY-9E、A-GLY-20E、A-TMM-3、A-TMM-3L、A-TMM-3LM-N、A-TMPT、TMPT(SHIN-NAKAMURA CHEMICAL Co.,Ltd.製)、KAYARAD GPO-303、TMPTA、THE-330、TPA-330、PET-30(Nippon Kayaku Co.,Ltd.製)等。In addition, as compounds having ethylenically unsaturated groups, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane ring Trifunctional (meth)acrylates such as ethylene oxide modified tri(meth)acrylate, isocyanuric acid ethylene oxide modified tri(meth)acrylate, neopentylthritol tri(meth)acrylate, etc. Acrylate compounds are also preferred. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, and M-306 , M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO.,LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A- TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 (Nippon Kayaku Co., Ltd.), etc.

具有乙烯性不飽和基之化合物可以進一步具有羧基、磺基、磷酸基等酸基。作為此類化合物的市售品,可舉出ARONIX M-305、M-510、M-520、ARONIX TO-2349(TOAGOSEI CO.,LTD.製)等。The compound having an ethylenically unsaturated group may further have an acid group such as a carboxyl group, a sulfo group, or a phosphoric acid group. Commercially available products of such compounds include ARONIX M-305, M-510, M-520, ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), and the like.

作為具有乙烯性不飽和基之化合物,亦能夠使用具有己內酯結構之化合物。關於具有己內酯結構之化合物,能夠參考日本特開2013-253224號公報的0042~0045段的記載,該內容編入本說明書中。關於具有己內酯結構之化合物,例如,可舉出由Nippon Kayaku Co.,Ltd.市售之DPCA-20、DPCA-30、DPCA-60、DPCA-120等。As a compound which has an ethylenically unsaturated group, the compound which has a caprolactone structure can also be used. About the compound which has a caprolactone structure, the description of paragraph 0042-0045 of Unexamined-Japanese-Patent No. 2013-253224 can be referred, and this content is incorporated in this specification. As for the compound having a caprolactone structure, for example, DPCA-20, DPCA-30, DPCA-60, DPCA-120 etc. commercially available from Nippon Kayaku Co., Ltd. are mentioned.

作為具有乙烯性不飽和基之化合物,亦能夠使用具有乙烯性不飽和基及伸烷氧基之化合物。此類化合物為具有乙烯性不飽和基及乙烯氧基和/或丙烯氧基之化合物為較佳,具有乙烯性不飽和基及乙烯氧基之化合物為更佳,具有4~20個乙烯氧基之3~6官能(甲基)丙烯酸酯化合物為進一步較佳。作為市售品,例如可舉出SARTOMER Company,Inc.製具有4個乙烯氧基之4官能(甲基)丙烯酸酯SR494、Nippon Kayaku Co.,Ltd.製具有3個異丁烯氧基之3官能(甲基)丙烯酸酯KAYARAD TPA-330等。As a compound which has an ethylenically unsaturated group, the compound which has an ethylenically unsaturated group and an alkyleneoxy group can also be used. Such compounds are preferably compounds with ethylenically unsaturated groups and ethyleneoxy and/or propyleneoxy groups, more preferably compounds with ethylenically unsaturated groups and ethyleneoxy groups, and have 4 to 20 ethyleneoxy groups The 3-6 functional (meth)acrylate compound is further preferred. As commercially available products, for example, tetrafunctional (meth)acrylate SR494 having 4 ethyleneoxy groups manufactured by SARTOMER Company, Inc., and trifunctional (meth)acrylate having 3 isobutyloxy groups manufactured by Nippon Kayaku Co., Ltd. Meth)acrylate KAYARAD TPA-330, etc.

作為具有乙烯性不飽和基之化合物,亦能夠使用具有茀骨架之聚合性化合物。作為市售品,可舉出OGSOL EA-0200、EA-0300(Osaka Gas Chemicals Co.,Ltd.製具有茀骨架之(甲基)丙烯酸酯單體)等。As a compound having an ethylenically unsaturated group, a polymerizable compound having a fennel skeleton can also be used. As a commercial item, OGSOL EA-0200, EA-0300 (Osaka Gas Chemicals Co., Ltd. make, the (meth)acrylate monomer which has a fennel skeleton), etc. are mentioned.

作為具有乙烯性不飽和基之化合物,使用實質上不含有甲苯等環境管制物質之化合物亦較佳。作為此類化合物的市售品,可舉出KAYARAD DPHA LT、KAYARAD DPEA-12 LT(Nippon Kayaku Co.,Ltd.製)等。As the compound having an ethylenically unsaturated group, it is also preferable to use a compound that does not substantially contain environmentally regulated substances such as toluene. As a commercial item of such a compound, KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.) etc. are mentioned.

作為具有乙烯性不飽和基之化合物,使用UA-7200(SHIN-NAKAMURA CHEMICAL Co.,Ltd.製)、DPHA-40H(Nippon Kayaku Co.,Ltd.製)、UA-306H、UA-306T、UA-306I、AH-600、T-600、AI-600、LINC-202UA(KYOEISHA CHEMICAL Co.,LTD.製)、8UH-1006、8UH-1012(以上為Taisei Fine Chemical Co.,Ltd.製)、LIGHT ACRYLATE POB-A0(KYOEISHA CHEMICAL Co.,LTD.製)等亦較佳。As the compound having an ethylenically unsaturated group, UA-7200 (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA -306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL Co., LTD.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL Co., LTD.) and the like are also preferable.

自由基聚合性化合物的含量相對於硬化性組成物的總固體成分,0.1質量%~50質量%為較佳。下限為0.5質量%以上為更佳,1質量%以上為進一步較佳。上限為45質量%以下為更佳,40質量%以下為進一步較佳。 本揭示之硬化性組成物中,自由基聚合性化合物可以僅使用1種,亦可以使用2種以上。使用2種以上時,該等的合計量在上述範圍內為較佳。 The content of the radically polymerizable compound is preferably 0.1% by mass to 50% by mass relative to the total solid content of the curable composition. The lower limit is more preferably at least 0.5% by mass, and more preferably at least 1% by mass. The upper limit is more preferably 45% by mass or less, and more preferably 40% by mass or less. In the curable composition of the present disclosure, only one type of radically polymerizable compound may be used, or two or more types may be used. When using 2 or more types, it is preferable that these total amounts are in the said range.

<著色劑> 本揭示之硬化性組成物包含著色劑為較佳。 作為著色劑,可舉出彩色著色劑及黑色著色劑等。作為彩色著色劑,可舉出在波長400nm~700nm的範圍內具有極大吸收波長之著色劑。例如,可舉出綠色著色劑、紅色著色劑、黃色著色劑、紫色著色劑、藍色著色劑、橙色著色劑等。 著色劑可以為顏料,亦可以為染料。 又,作為著色劑,從著色性及分散性的觀點考慮,選自包括二酮吡咯并吡咯顏料、喹吖啶酮顏料、蒽醌顏料、苝顏料、酞菁顏料、異吲哚啉顏料、喹啉黃顏料、偶氮顏料、甲亞胺顏料及二㗁𠯤顏料之群組中之至少1種顏料為較佳,選自包括二酮吡咯并吡咯顏料、酞菁顏料及異吲哚啉顏料之群組中之至少1種顏料為更佳。 進而,作為著色劑,從進一步發揮本揭示中的效果的觀點考慮,包含鈦原子或鋯原子之顏料為較佳,包含鈦原子或鋯原子之黑色顏料為更佳。 <Coloring agent> Preferably, the curable composition of the present disclosure contains a colorant. As a coloring agent, a chromatic coloring agent, a black coloring agent, etc. are mentioned. As a color coloring agent, the coloring agent which has a maximum absorption wavelength in the wavelength range of 400 nm - 700 nm is mentioned. For example, a green coloring agent, a red coloring agent, a yellow coloring agent, a purple coloring agent, a blue coloring agent, an orange coloring agent etc. are mentioned. The coloring agent may be a pigment or a dye. In addition, as a coloring agent, from the viewpoint of colorability and dispersibility, diketopyrrolopyrrole pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, phthalocyanine pigments, isoindoline pigments, quinine pigments, Preferably, at least one pigment selected from the group consisting of diketopyrrolopyrrole pigments, phthalocyanine pigments, and isoindoline pigments is selected from the group consisting of phthalocyanine pigments, azocyanine pigments, and diketopyrrolopyrrole pigments. At least one pigment in the group is more preferred. Furthermore, as a coloring agent, from the viewpoint of further exhibiting the effects of the present disclosure, a pigment containing a titanium atom or a zirconium atom is preferable, and a black pigment containing a titanium atom or a zirconium atom is more preferable.

顏料的平均一次粒徑為1nm~200nm為較佳。下限為5nm以上為更佳,10nm以上為進一步較佳。上限為180nm以下為更佳,150nm以下為進一步較佳,100nm以下為特佳。另外,在本說明書中,顏料的一次粒徑能夠藉由透射式電子顯微鏡觀察顏料的一次粒子,並根據所獲得之圖像照片來求出。具體而言,求出顏料的一次粒子的投影面積,並算出與其相對應之等效圓直徑作為顏料的一次粒徑。又,將本說明書中的平均一次粒徑設為針對400個顏料的一次粒子之一次粒徑的算數平均值。又,顏料的一次粒子係指未凝聚的獨立粒子。 根據將顏料的CuKα射線作為X射線源時的X射線衍射光譜中的源自任意結晶面之峰的半值寬求出的微晶尺寸為0.1nm~100nm為較佳,0.5nm~50nm為更佳,1nm~30nm為進一步較佳,5nm~25nm為特佳。 The average primary particle size of the pigment is preferably 1 nm to 200 nm. The lower limit is more preferably 5 nm or more, and still more preferably 10 nm or more. The upper limit is more preferably 180 nm or less, further preferably 150 nm or less, and particularly preferably 100 nm or less. In addition, in this specification, the primary particle diameter of a pigment can be calculated|required from the obtained image photograph by observing the primary particle of a pigment with a transmission electron microscope. Specifically, the projected area of the primary particle of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle diameter of the pigment. Moreover, the average primary particle diameter in this specification is made into the arithmetic mean value of one primary particle diameter with respect to the primary particle of 400 pigments. In addition, the primary particle of the pigment refers to unaggregated independent particles. The crystallite size calculated from the half-value width of the peak originating from an arbitrary crystal plane in the X-ray diffraction spectrum when the CuKα ray of the pigment is used as the X-ray source is preferably 0.1 nm to 100 nm, more preferably 0.5 nm to 50 nm. Preferably, 1 nm to 30 nm is more preferable, and 5 nm to 25 nm is particularly preferable.

作為綠色著色劑,可舉出酞菁化合物及方酸菁化合物,酞菁化合物為較佳。又,綠色著色劑為顏料為較佳。作為綠色著色劑的具體例,可舉出C.I.顏料綠7、10、36、37、58、59、62、63、64、65、66等綠色顏料。又,作為綠色著色劑,亦能夠使用在一分子中的鹵素原子數平均為10~14個、溴原子數平均為8~12個、氯原子數平均為2~5個之鹵化鋅酞菁顏料。作為具體例,可舉出國際公開第2015/118720號中記載之化合物。又,作為綠色著色劑,亦能夠使用中國專利申請第106909027號說明書中記載之化合物、國際公開第2012/102395號中記載之將磷酸酯作為配位體之酞菁化合物、日本特開2019-008014號公報中記載之酞菁化合物、日本特開2018-180023號公報中記載之酞菁化合物、日本特開2019-038958號公報中記載之化合物、日本特開2020-070426號公報中記載之鋁酞菁化合物、日本特開2020-076995號公報中記載之核殼型色素、日本特表2020-504758號公報中記載之二芳基甲烷化合物等。Examples of the green colorant include phthalocyanine compounds and squarylium compounds, and phthalocyanine compounds are preferred. Moreover, it is preferable that a green coloring agent is a pigment. Specific examples of green colorants include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. In addition, as a green colorant, a zinc halide phthalocyanine pigment with an average number of halogen atoms of 10 to 14, an average number of bromine atoms of 8 to 12, and an average number of chlorine atoms of 2 to 5 in one molecule can also be used. . Specific examples include compounds described in International Publication No. 2015/118720. In addition, as a green coloring agent, compounds described in the specification of Chinese Patent Application No. 106909027, phthalocyanine compounds described in International Publication No. 2012/102395, which use phosphate as a ligand, and Japanese Patent Application Laid-Open No. 2019-008014 Phthalocyanine compounds described in Japanese Patent Laid-Open No. 2018-180023, compounds described in Japanese Patent Laid-Open No. 2019-038958, aluminum phthalocyanines described in Japanese Patent Laid-Open No. 2020-070426 Cyanine compounds, core-shell pigments described in JP-A-2020-076995, diarylmethane compounds described in JP-A-2020-504758, etc.

綠色著色劑為C.I.顏料綠7、36、58、59、62、63為較佳,C.I.顏料綠7、36、58、59為更佳。The green colorant is preferably C.I. Pigment Green 7, 36, 58, 59, 62, 63, and C.I. Pigment Green 7, 36, 58, 59 is more preferred.

作為紅色著色劑,可舉出二酮吡咯并吡咯化合物、蒽醌化合物、偶氮化合物、萘酚化合物、甲亞胺化合物、口山口星化合物、喹吖啶酮化合物、苝化合物、硫靛藍化合物,二酮吡咯并吡咯化合物、蒽醌化合物、偶氮化合物為較佳,二酮吡咯并吡咯化合物為更佳。又,紅色著色劑為顏料為較佳。作為紅色著色劑的具體例,可舉出C.I.(顏料索引)顏料紅1、2、3、4、5、6、7、9、10、14、17、22、23、31、38、41、48:1、48:2、48:3、48:4、49、49:1、49:2、52:1、52:2、53:1、57:1、60:1、63:1、66、67、81:1、81:2、81:3、83、88、90、105、112、119、122、123、144、146、149、150、155、166、168、169、170、171、172、175、176、177、178、179、184、185、187、188、190、200、202、206、207、208、209、210、216、220、224、226、242、246、254、255、264、269、270、272、279、291、294、295、296、297等紅色顏料。又,作為紅色著色劑,亦能夠使用日本特開2017-201384號公報中記載之結構中至少1個溴原子經取代之二酮吡咯并吡咯化合物、日本專利第6248838號的0016~0022段中記載之二酮吡咯并吡咯化合物、國際公開第2012/102399號中記載之二酮吡咯并吡咯化合物、國際公開第2012/117965號中記載之二酮吡咯并吡咯化合物、日本特開2020-085947號公報中記載之溴化二酮吡咯并吡咯化合物、日本特開2012-229344號公報中記載之萘酚偶氮化合物、日本專利第6516119號公報中記載之紅色著色劑、日本專利第6525101號公報中記載之紅色著色劑、日本特開2020-090632號公報的0229段中記載之溴化二酮吡咯并吡咯化合物、韓國公開專利第10-2019-0140741號公報中記載之蒽醌化合物、韓國公開專利第10-2019-0140744號公報中記載之蒽醌化合物、日本特開2020-079396號公報中記載之苝化合物、日本特開2020-083982號公報中記載之苝化合物、日本特開2018-035345號公報中記載之口山口星化合物、特開2020-066702號公報的0025~0041段中記載之二酮吡咯并吡咯化合物等。又,作為紅色著色劑,亦能夠使用具有如下結構之化合物:對芳香族環導入了鍵結有氧原子、硫原子或氮原子之基團之芳香族環基與二酮吡咯并吡咯骨架鍵結之結構。作為紅色著色劑,亦能夠使用Lumogen F Orange 240(BASF公司製,紅色顏料,苝顏料)。Examples of the red coloring agent include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, imine compounds, kousuka compounds, quinacridone compounds, perylene compounds, and thioindigo compounds, A diketopyrrolopyrrole compound, an anthraquinone compound, and an azo compound are preferable, and a diketopyrrolopyrrole compound is more preferable. Moreover, it is preferable that a red coloring agent is a pigment. Specific examples of red colorants include C.I. (Pigment Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 269, 270, 272, 279, 291, 294, 295, 296, 297 and other red pigments. In addition, as a red coloring agent, diketopyrrolopyrrole compounds in which at least one bromine atom is substituted in the structure described in JP-A-2017-201384, described in paragraphs 0016 to 0022 of JP-A-6248838 can also be used. Diketopyrrolopyrrole compound, diketopyrrolopyrrole compound described in International Publication No. 2012/102399, diketopyrrolopyrrole compound described in International Publication No. 2012/117965, Japanese Patent Laid-Open No. 2020-085947 The brominated diketopyrrolopyrrole compound described in, the naphthol azo compound described in Japanese Patent Application Laid-Open No. 2012-229344, the red coloring agent described in Japanese Patent No. 6516119, and the red coloring agent described in Japanese Patent No. 6525101 The red colorant, the brominated diketopyrrolopyrrole compound described in paragraph 0229 of JP-A-2020-090632, the anthraquinone compound described in Korean Laid-Open Patent No. 10-2019-0140741, the Korean Laid-Open Patent No. Anthraquinone compounds described in JP-A No. 10-2019-0140744, perylene compounds described in JP-A No. 2020-079396, perylene compounds described in JP-A No. 2020-083982, JP-A No. 2018-035345 Kusama Kuchi compounds described in JP-A-2020-066702, diketopyrrolopyrrole compounds described in paragraphs 0025 to 0041 of JP-A-2020-066702, and the like. Also, as a red coloring agent, a compound having a structure in which an aromatic ring group introduced into an aromatic ring with a group bonded to an oxygen atom, a sulfur atom, or a nitrogen atom is bonded to a diketopyrrolopyrrole skeleton can also be used. The structure. As a red colorant, Lumogen F Orange 240 (manufactured by BASF, red pigment, perylene pigment) can also be used.

紅色著色劑為C.I.顏料紅122、177、179、254、255、264、269、272、291為較佳,C.I.顏料紅254、264、272為更佳。The red colorant is preferably C.I. Pigment Red 122, 177, 179, 254, 255, 264, 269, 272, 291, and C.I. Pigment Red 254, 264, 272 is more preferable.

作為黃色著色劑,可舉出偶氮化合物、甲亞胺化合物、異吲哚啉化合物、蝶啶基化合物、喹啉黃化合物及苝化合物等。黃色著色劑為顏料為較佳,偶氮顏料、甲亞胺顏料、異吲哚啉顏料、蝶啶基顏料、喹啉黃顏料或苝顏料為更佳,偶氮顏料或甲亞胺顏料為更佳。 作為黃色著色劑的具體例,可舉出C.I.顏料黃1、2、3、4、5、6、10、11、12、13、14、15、16、17、18、20、24、31、32、34、35、35:1、36、36:1、37、37:1、40、42、43、53、55、60、61、62、63、65、73、74、77、81、83、86、93、94、95、97、98、100、101、104、106、108、109、110、113、114、115、116、117、118、119、120、123、125、126、127、128、129、137、138、139、147、148、150、151、152、153、154、155、156、161、162、164、166、167、168、169、170、171、172、173、174、175、176、177、179、180、181、182、185、187、188、193、194、199、213、214、215、228、231、232、233、234、235、236等黃色顏料。 As a yellow coloring agent, an azo compound, an imine compound, an isoindoline compound, a pteridyl compound, a quinoline yellow compound, a perylene compound, etc. are mentioned. The yellow colorant is preferably a pigment, more preferably an azo pigment, an imine pigment, an isoindoline pigment, a pteridine-based pigment, a quinoline yellow pigment or a perylene pigment, and more preferably an azo pigment or an imine pigment. good. Specific examples of yellow colorants include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236, etc. yellow paint.

又,作為黃色著色劑,亦能夠使用下述結構的偶氮巴比妥酸鎳錯合物。Moreover, as a yellow coloring agent, the nickel azobarbiturate complex compound of the following structure can also be used.

[化學式31]

Figure 02_image062
[chemical formula 31]
Figure 02_image062

又,作為黃色著色劑,亦能夠使用日本特開2017-201003號公報中記載之化合物、日本特開2017-197719號公報中記載之化合物、日本特開2017-171912號公報的0011~0062、0137~0276段中記載之化合物、日本特開2017-171913號公報的0010~0062、0138~0295段中記載之化合物、日本特開2017-171914號公報的0011~0062、0139~0190段中記載之化合物、日本特開2017-171915號公報的0010~0065、0142~0222段中記載之化合物、日本特開2013-054339號公報的0011~0034段中記載之喹啉黃化合物、日本特開2014-026228號公報的0013~0058段中記載之喹啉黃化合物、日本特開2018-062644號公報中記載之異吲哚啉化合物、日本特開2018-203798號公報中記載之喹啉黃化合物、日本特開2018-062578號公報中記載之喹啉黃化合物、日本專利第6432076號公報中記載之喹啉黃化合物、日本特開2018-155881號公報中記載之喹啉黃化合物、日本特開2018-111757號公報中記載之喹啉黃化合物、日本特開2018-040835號公報中記載之喹啉黃化合物、日本特開2017-197640號公報中記載之喹啉黃化合物、日本特開2016-145282號公報中記載之喹啉黃化合物、日本特開2014-085565號公報中記載之喹啉黃化合物、日本特開2014-021139號公報中記載之喹啉黃化合物、日本特開2013-209614號公報中記載之喹啉黃化合物、日本特開2013-209435號公報中記載之喹啉黃化合物、日本特開2013-181015號公報中記載之喹啉黃化合物、日本特開2013-061622號公報中記載之喹啉黃化合物、日本特開2013-032486號公報中記載之喹啉黃化合物、日本特開2012-226110號公報中記載之喹啉黃化合物、日本特開2008-074987號公報中記載之喹啉黃化合物、日本特開2008-081565號公報中記載之喹啉黃化合物、日本特開2008-074986號公報中記載之喹啉黃化合物、日本特開2008-074985號公報中記載之喹啉黃化合物、日本特開2008-050420號公報中記載之喹啉黃化合物、日本特開2008-031281號公報中記載之喹啉黃化合物、日本特公昭48-032765號公報中記載之喹啉黃化合物、日本特開2019-008014號公報中記載之喹啉黃化合物、日本專利第6607427號公報中記載之喹啉黃化合物、韓國公開專利第10-2014-0034963號公報中記載之化合物、日本特開2017-095706號公報中記載之化合物、台灣專利申請公開第201920495號公報中記載之化合物、日本專利第6607427號公報中記載之化合物、日本特開2020-033525號公報中記載之化合物、日本特開2020-033524號公報中記載之化合物、日本特開2020-033523號公報中記載之化合物、日本特開2020-033522號公報中記載之化合物、日本特開2020-033521號公報中記載之化合物、國際公開第2020/045200號中記載之化合物、國際公開第2020/045199號中記載之化合物、國際公開第2020/045197號中記載之化合物、日本特開2020-093994號中記載之偶氮化合物、國際公開第2020/105346號中記載之苝化合物、日本特表2020-517791號中記載之喹啉黃化合物、由下述式(QP1)表示之化合物、由下述式(QP2)表示之化合物。 又,從提高色值的觀點考慮,亦可較佳地使用對該等化合物進行了多聚體化者。 Moreover, as a yellow coloring agent, the compound described in JP-A-2017-201003, the compound described in JP-A-2017-197719, the compound of 0011-0062, 0137 in JP-A-2017-171912 can also be used. Compounds described in Paragraph 0276, Compounds described in Paragraphs 0010-0062, 0138-0295 of JP-A-2017-171913, Paragraphs 0011-0062, 0139-0190 of JP-A-2017-171914 Compounds, compounds described in paragraphs 0010 to 0065 and 0142 to 0222 of JP-A-2017-171915, quinophthalone compounds described in paragraphs 0011-0034 of JP-A-2013-054339, JP-A-2014- Quinophthalone compounds described in paragraphs 0013 to 0058 of Publication No. 026228, isoindoline compounds described in Japanese Patent Application Laid-Open No. 2018-062644, quinophthalone compounds described in Japanese Patent Application Publication No. 2018-203798, Japan The quinophthalone compound described in JP-A-2018-062578, the quinophthalone compound described in Japanese Patent No. 6432076, the quinophthalone compound described in JP-A-2018-155881, JP-A-2018- The quinophthalone compound described in JP-A No. 111757, the quinophthalone compound described in JP-A No. 2018-040835, the quinophthalone compound described in JP-A No. 2017-197640, JP-A No. 2016-145282 The quinophthalone compound described in the gazette, the quinophthalone compound described in the Japanese Patent Application Laid-Open No. 2014-085565, the quinophthalone compound described in the Japanese Patent Laid-Open No. 2014-021139, and the quinophthalone compound described in the Japanese Patent Laid-Open No. 2013-209614 The quinophthalone compound described in JP-A No. 2013-209435, the quinophthalone compound described in JP-A No. 2013-181015, and the compound described in JP-A No. 2013-061622 Quinoline yellow compounds, quinoline yellow compounds described in JP 2013-032486 A, quinoline yellow compounds described in JP 2012-226110 A, quinolines described in JP 2008-074987 A Yellow compound, quinophthalone compound described in Japanese Patent Application Laid-Open No. 2008-081565, quinophthalone yellow compound described in Japanese Patent Application Laid-Open No. 2008-074986, quinophthalone yellow compound described in Japanese Patent Application Laid-Open No. 2008-074985 , the quinophthalone compound described in Japanese Patent Application Publication No. 2008-050420, the quinophthalone compound described in Japanese Patent Application Publication No. 2008-031281, the quinophthalone compound described in Japanese Patent Application Publication No. 48-032765, Japan Quinophthalone compounds described in Japanese Patent Laid-Open No. 2019-008014, quinophthalone compounds described in Japanese Patent No. 6607427, compounds described in Korean Laid-Open Patent No. 10-2014-0034963, Japanese Patent Laid-Open No. 2017- Compounds described in Publication No. 095706, Compounds described in Taiwan Patent Application Publication No. 201920495, Compounds described in Japanese Patent No. 6607427, Compounds described in Japanese Patent Laid-Open No. 2020-033525, Japanese Patent Laid-Open No. 2020- Compounds described in Japanese Patent Application Laid-Open No. 033524, Compounds described in Japanese Patent Application Laid-Open No. 2020-033523, Compounds described in Japanese Patent Laid-Open No. 2020-033522, Compounds described in Japanese Patent Laid-Open No. 2020-033521 Compounds described in No. 2020/045200, compounds described in International Publication No. 2020/045199, compounds described in International Publication No. 2020/045197, azo compounds described in Japanese Patent Application Laid-Open No. 2020-093994, The perylene compound described in No. 2020/105346, the quinophthalone compound described in JP No. 2020-517791, the compound represented by the following formula (QP1), and the compound represented by the following formula (QP2). Moreover, from the viewpoint of improving the color value, those obtained by multimerizing these compounds can also be preferably used.

[化學式32]

Figure 02_image064
[chemical formula 32]
Figure 02_image064

式(QP1)中,X 1~X 16各自獨立地表示氫原子或鹵素原子,Z 1表示碳數1~3的伸烷基。 作為由式(QP1)表示之化合物的具體例,可舉出日本專利第6443711號公報的0016段中記載之化合物。 In formula (QP1), X 1 to X 16 each independently represent a hydrogen atom or a halogen atom, and Z 1 represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by the formula (QP1) include compounds described in paragraph 0016 of Japanese Patent No. 6443711.

[化學式33]

Figure 02_image066
[chemical formula 33]
Figure 02_image066

式(QP2)中,Y 1~Y 3分別獨立地表示鹵素原子。n、m表示0~6的整數,p表示0~5的整數。(n+m)為1以上。作為由式(QP2)表示之化合物的具體例,可舉出日本專利6432077號公報的0047~0048段中記載之化合物。 In formula (QP2), Y 1 to Y 3 each independently represent a halogen atom. n and m represent the integer of 0-6, and p represents the integer of 0-5. (n+m) is 1 or more. Specific examples of the compound represented by the formula (QP2) include compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

黃色著色劑為C.I.顏料黃117、129、138、139、150、185為較佳。The yellow colorant is preferably C.I. Pigment Yellow 117, 129, 138, 139, 150, 185.

作為橙色著色劑,可舉出C.I.顏料橙2、5、13、16、17:1、31、34、36、38、43、46、48、49、51、52、55、59、60、61、62、64、71、73等橙色顏料。Examples of orange colorants include C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61 , 62, 64, 71, 73 and other orange pigments.

作為紫色著色劑,可舉出C.I.顏料紫1、19、23、27、32、37、42、60、61等紫色顏料。Examples of the purple colorant include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

作為藍色著色劑,可舉出C.I.顏料藍1、2、15、15:1、15:2、15:3、15:4、15:6、16、22、29、60、64、66、79、80、87、88等。又,作為藍色著色劑,亦能夠使用具有磷原子之鋁酞菁化合物。作為具體例,可舉出日本特開2012-247591號公報的0022~0030段、日本特開2011-157478號公報的0047段中記載之化合物。Examples of blue colorants include C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, 88, etc. Moreover, as a blue coloring agent, the aluminum phthalocyanine compound which has a phosphorus atom can also be used. Specific examples include compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraphs 0047 of JP-A-2011-157478.

彩色著色劑亦能夠使用染料。作為染料,並沒有特別限制,能夠使用公知的染料。例如,可舉出吡唑偶氮系、苯胺基偶氮系、三芳基甲烷系、蒽醌系、蒽吡啶酮系、亞苄基系、氧雜菁系、吡唑并三唑偶氮系、吡啶酮偶氮系、花青系、啡噻𠯤系、吡咯并吡唑甲亞胺系、口山口星系、酞菁系、苯并哌喃系、靛藍系、吡咯亞甲基系等染料。A dye can also be used as a color coloring agent. The dye is not particularly limited, and known dyes can be used. For example, pyrazole azo series, anilino azo series, triarylmethane series, anthraquinone series, anthrapyridone series, benzylidene series, oxonol series, pyrazolotriazole azo series, Pyridone azo-based, cyanine-based, pyrrolo-pyrazole-based, pyrrolopyrazole-based, phthalocyanine-based, benzopyran-based, indigo-based, pyrromethene-based and other dyes.

彩色著色劑亦能夠使用色素多聚體。色素多聚體為溶解於有機溶劑中而使用之染料為較佳。又,色素多聚體可以形成粒子。色素多聚體為粒子時,通常以分散在溶劑中的狀態使用。粒子狀態的色素多聚體例如能夠藉由乳化聚合獲得,可舉出日本特開2015-214682號公報中記載之化合物及製造方法作為具體例。色素多聚體為在一分子中具有2個以上色素結構者,具有3個以上色素結構為較佳。上限並沒有特別限定,亦能夠設為100以下。一分子中所具有之複數個色素結構可以為相同的色素結構,亦可以為不同的色素結構。色素多聚體的重量平均分子量(Mw)為2000~50000為較佳。下限為3000以上為更佳,6000以上為進一步較佳。上限為30000以下為更佳,20000以下為進一步較佳。色素多聚體亦能夠使用日本特開2011-213925號公報、日本特開2013-041097號公報、日本特開2015-028144號公報、日本特開2015-030742號公報、國際公開第2016/031442號等中記載之化合物。A pigment multimer can also be used as a color coloring agent. It is preferable that the dye multimer is used as a dye dissolved in an organic solvent. Also, pigment multimers may form particles. When the pigment multimer is in the form of particles, it is usually used in a dispersed state in a solvent. The pigment multimer in particle state can be obtained by emulsion polymerization, for example, and the compound and production method described in JP-A-2015-214682 can be mentioned as a specific example. A pigment multimer has two or more pigment structures in one molecule, preferably three or more pigment structures. The upper limit is not particularly limited, and may be 100 or less. The plural pigment structures contained in one molecule may be the same pigment structure or different pigment structures. The weight average molecular weight (Mw) of the pigment multimer is preferably 2,000 to 50,000. The lower limit is more preferably 3000 or more, and more preferably 6000 or more. The upper limit is more preferably 30,000 or less, and further preferably 20,000 or less. As the pigment polymer, JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, and International Publication No. 2016/031442 can also be used. Compounds described in et al.

彩色著色劑能夠使用日本特表2020-504758號公報中記載之二芳基甲烷化合物、韓國公開專利第10-2020-0028160號公報中記載之三芳基甲烷染料聚合物、日本特開2020-117638號公報中記載之口山口星化合物、國際公開第2020/174991號中記載之酞菁化合物、日本特開2020-160279號公報中記載之異吲哚啉化合物或該等的鹽、韓國公開專利第10-2020-0069442號公報中記載之由式1表示之化合物、韓國公開專利第10-2020-0069730號公報中記載之由式1表示之化合物、韓國公開專利第10-2020-0069070號公報中記載之由式1表示之化合物、韓國公開專利第10-2020-0069067號公報中記載之由式1表示之化合物、韓國公開專利第10-2020-0069062號公報中記載之由式1表示之化合物、日本專利第6809649號中記載之鹵化鋅酞菁顏料、日本特開2020-180176號公報中記載之異吲哚啉化合物。彩色著色劑可以為輪烷,色素骨架可以用於輪烷的環狀結構,亦可以用於棒狀結構,亦可以用於兩種結構。As the coloring agent, diarylmethane compounds described in Japanese PCT Publication No. 2020-504758, triarylmethane dye polymers described in Korean Laid-Open Patent No. 10-2020-0028160, and Japanese Patent Laid-Open No. 2020-117638 can be used. Kuchi Yamaguchi compounds described in the gazette, phthalocyanine compounds described in International Publication No. 2020/174991, isoindoline compounds described in Japanese Patent Laid-Open No. 2020-160279 or their salts, Korean Laid-Open Patent No. 10 - Compounds represented by Formula 1 described in Publication No. 2020-0069442, compounds represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069730, and Korean Laid-Open Patent No. 10-2020-0069070 The compound represented by Formula 1, the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069067, the compound represented by Formula 1 described in Korean Laid-Open Patent No. 10-2020-0069062, Zinc halide phthalocyanine pigments described in Japanese Patent No. 6809649, and isoindoline compounds described in Japanese Patent Application Laid-Open No. 2020-180176. The colored coloring agent can be a rotaxane, and the pigment skeleton can be used in a cyclic structure of a rotaxane, a rod structure, or both structures.

彩色著色劑亦可以組合使用2種以上。又,組合使用2種以上的彩色著色劑時,可以藉由2種以上的彩色著色劑的組合形成黑色。A color coloring agent can also be used in combination of 2 or more types. Also, when two or more color colorants are used in combination, black can be formed by the combination of two or more color colorants.

作為黑色著色劑,並沒有特別限定,能夠使用公知者。例如,作為無機黑色著色劑,可舉出碳黑、鈦黑、氧氮化鋯、石墨等,碳黑、鈦黑或氧氮化鋯為較佳,鈦黑或氧氮化鋯為更佳。鈦黑係指含有鈦原子之黑色粒子,低次氧化鈦、氧氮化鈦為較佳。鈦黑能夠以提高分散性、抑制凝聚性等為目的,根據需要進行表面修飾。例如,能夠用氧化矽、氧化鈦、氧化鍺、氧化鋁、氧化鎂或氧化鋯包覆鈦黑的表面。又,亦能夠進行利用如日本特開2007-302836號公報中示出之撥水性物質的處理。作為黑色著色劑,亦能夠使用顏料索引(C.I.)顏料黑1、7。關於鈦黑,各粒子的一次粒徑及平均一次粒徑均小為較佳。具體而言,平均一次粒徑為10~45nm為較佳。鈦黑亦能夠用作分散物。例如,可舉出如下分散物:包含鈦黑粒子及二氧化矽粒子,將分散物中的Si原子與Ti原子的含有比調整在0.20~0.50的範圍內之分散物等。關於上述分散物,能夠參考日本特開2012-169556號公報的0020~0105段的記載,該內容編入本說明書中。作為鈦黑的市售品的例子,可舉出鈦黑10S、12S、13R、13M、13M-C、13R-N、13M-T(產品名:Mitsubishi Materials Corporation製)、Tilack D(產品名:Ako Kasei Co.,Ltd.製)等。 作為有機黑色著色劑,可舉出雙苯并呋喃酮化合物、甲亞胺化合物、苝化合物、偶氮化合物等,雙苯并呋喃酮化合物、苝化合物為較佳。作為雙苯并呋喃酮化合物,可舉出日本特表2010-534726號公報、日本特表2012-515233號公報、日本特表2012-515234號公報、國際公開2014/208348號、日本特表2015-525260號公報等中記載之化合物,例如能夠作為BASF公司製“Irgaphor Black”獲得。作為苝化合物,可舉出C.I.顏料黑31、32等。作為甲亞胺化合物,可舉出本日本特開平01-170601號公報、日本特開平02-034664號公報等中記載之化合物,例如能夠作為Dainichiseika Color & Chemicals Mfg.Co.,Ltd.製“CHROMO FINE BLACK A1103”獲得。又,作為有機黑色著色劑,亦可以使用日本特開2017-226821號公報的0016~0020段中記載之苝黑(Lumogen Black FK4280等)。 It does not specifically limit as a black coloring agent, A well-known thing can be used. For example, carbon black, titanium black, zirconium oxynitride, graphite, etc. are mentioned as an inorganic black coloring agent, Carbon black, titanium black, or zirconium oxynitride is preferable, and titanium black or zirconium oxynitride is more preferable. Titanium black refers to black particles containing titanium atoms, preferably low-suboxide titanium and titanium oxynitride. Titanium black can be surface-modified as needed for the purpose of improving dispersibility, suppressing cohesion, and the like. For example, the surface of titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconium oxide. In addition, treatment using a water-repellent substance as disclosed in JP-A-2007-302836 can also be performed. As the black colorant, Pigment Black 1 and 7 of Pigment Index (C.I.) can also be used. Regarding titanium black, it is preferable that both the primary particle diameter and the average primary particle diameter of each particle are small. Specifically, the average primary particle diameter is preferably 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion including titanium black particles and silica particles, and a dispersion in which the content ratio of Si atoms and Ti atoms in the dispersion is adjusted within a range of 0.20 to 0.50, etc. are mentioned. Regarding the above-mentioned dispersion, the description in paragraphs 0020 to 0105 of JP-A-2012-169556 can be referred to, and the content is incorporated in this specification. Examples of commercially available titanium black include titanium black 10S, 12S, 13R, 13M, 13M-C, 13R-N, 13M-T (product name: manufactured by Mitsubishi Materials Corporation), Tilack D (product name: Ako Kasei Co., Ltd.), etc. Examples of the organic black colorant include a bisbenzofuranone compound, an imine compound, a perylene compound, an azo compound, and the like, and a bisbenzofuranone compound and a perylene compound are preferable. Examples of the bisbenzofuranone compound include JP 2010-534726, JP 2012-515233, JP 2012-515234, International Publication 2014/208348, JP 2015- The compound described in Publication No. 525260 etc. is available as "Irgaphor Black" manufactured by BASF Corporation, for example. C.I. Pigment Black 31, 32 etc. are mentioned as a perylene compound. Examples of the formimine compound include compounds described in Japanese Patent Application Laid-Open No. 01-170601, Japanese Patent Laid-Open No. 02-034664, etc., for example, "CHROMO" manufactured by Dainichiseika Color & Chemicals Mfg.Co., Ltd. FINE BLACK A1103" was obtained. In addition, as the organic black colorant, perylene black (Lumogen Black FK4280, etc.) described in paragraphs 0016 to 0020 of JP-A-2017-226821 can also be used.

本揭示之硬化性組成物可以單獨包含著色劑,亦可以包含2種以上。使用2種以上時,該等的合計量在下述範圍內為較佳。 從進一步發揮本揭示中的效果的觀點考慮,著色劑的含量相對於硬化性組成物的總固體成分為10質量%~75質量%為較佳。上限為70質量%以下為更佳,65質量%以下為進一步較佳。下限為20質量%以上為更佳,30質量%以上為進一步較佳,50質量%以上為特佳。 The curable composition of the present disclosure may contain coloring agents alone, or may contain two or more of them. When using 2 or more types, it is preferable that these total amounts are in the following range. From the viewpoint of further exhibiting the effects of the present disclosure, the content of the coloring agent is preferably 10% by mass to 75% by mass relative to the total solid content of the curable composition. The upper limit is more preferably at most 70% by mass, and more preferably at most 65% by mass. The lower limit is more preferably at least 20% by mass, more preferably at least 30% by mass, and particularly preferably at least 50% by mass.

<樹脂> 本揭示之硬化性組成物包含樹脂為較佳。 本揭示之硬化性組成物能夠使用樹脂作為自由基聚合性化合物。自由基聚合性化合物使用至少包含樹脂者為較佳。例如,以使顏料分散於硬化性組成物中等之用途或黏合劑的用途配合樹脂。另外,將主要用於使顏料分散於硬化性組成物中等之樹脂亦稱為分散劑。然而,樹脂的此類用途為一例,亦能夠以此類用途以外的用途為目的使用樹脂。 另外,具有自由基聚合性基之樹脂亦屬於自由基聚合性化合物。 <Resin> Preferably, the curable composition of the present disclosure contains a resin. The curable composition of the present disclosure can use a resin as a radically polymerizable compound. It is preferable to use what contains resin at least as a radically polymerizable compound. For example, resins are used for dispersing pigments in curable compositions or for binders. In addition, resins mainly used to disperse pigments in curable compositions are also called dispersants. However, such use of the resin is an example, and the resin can also be used for purposes other than such use. In addition, resins having radically polymerizable groups also belong to radically polymerizable compounds.

樹脂的重量平均分子量為3000~2000000為較佳。上限為1000000以下為較佳,500000以下為更佳。下限為4000以上為較佳,5000以上為更佳。The weight average molecular weight of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4000 or more, more preferably 5000 or more.

作為樹脂,可舉出(甲基)丙烯酸樹脂、環氧樹脂、烯-硫醇樹脂、聚碳酸酯樹脂、聚醚樹脂、聚芳酯樹脂、聚碸樹脂、聚醚碸樹脂、聚苯樹脂、聚伸芳基醚氧化膦樹脂、聚醯亞胺樹脂、聚醯胺樹脂、聚醯胺醯亞胺樹脂、聚烯烴樹脂、環烯烴樹脂、聚酯樹脂、苯乙烯樹脂、乙酸乙烯酯樹脂、聚乙烯醇樹脂、聚乙烯縮醛樹脂、聚胺酯樹脂、聚脲樹脂等。在該等樹脂中,可以單獨使用1種,亦可以混合使用2種以上。作為環烯烴樹脂,從提高耐熱性的觀點考慮,降莰烯樹脂為較佳。作為降莰烯樹脂的市售品,例如可舉出JSR Corporation製ARTON系列(例如,ARTON F4520)等。又,作為樹脂,亦能夠使用國際公開第2016/088645號的實施例中記載之樹脂、日本特開2017-057265號公報中記載之樹脂、日本特開2017-032685號公報中記載之樹脂、日本特開2017-075248號公報中記載之樹脂、日本特開2017-066240號公報中記載之樹脂、日本特開2017-167513號公報中記載之樹脂、日本特開2017-173787號公報中記載之樹脂、日本特開2017-206689號公報的0041~0060段中記載之樹脂、日本特開2018-010856號公報的0022~0071段中記載之樹脂、日本特開2016-222891號公報中記載之封端聚異氰酸酯樹脂、日本特開2020-122052號公報中記載之樹脂、日本特開2020-111656號公報中記載之樹脂、日本特開2020-139021號公報中記載之樹脂、日本特開2017-138503號公報中記載之包含主鏈具有環結構之結構單元及側鏈具有聯苯基之結構單元之樹脂。 又,作為樹脂,亦能夠較佳地使用具有茀骨架之樹脂。關於具有茀骨架之樹脂,能夠參考美國專利申請公開第2017/0102610號說明書的記載,該內容編入本說明書中。又,作為樹脂,亦能夠使用日本特開2020-186373號公報的0199~0233段中記載之樹脂、日本特開2020-186325號公報中記載之鹼可溶性樹脂、韓國公開專利第10-2020-0078339號公報中記載之由式1表示之樹脂。 Examples of the resin include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyphenolic resins, polyethersulfonic resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamide resin, polyamide imide resin, polyolefin resin, cycloolefin resin, polyester resin, styrene resin, vinyl acetate resin, poly Vinyl alcohol resin, polyvinyl acetal resin, polyurethane resin, polyurea resin, etc. Among these resins, one type may be used alone, or two or more types may be used in combination. As the cycloolefin resin, norcamphene resin is preferable from the viewpoint of improving heat resistance. As a commercial item of norcamphene resin, the ARTON series by JSR Corporation (for example, ARTON F4520) etc. are mentioned, for example. In addition, as the resin, resins described in the examples of International Publication No. 2016/088645, resins described in Japanese Patent Laid-Open No. 2017-057265, resins described in Japanese Patent Laid-Open No. 2017-032685, Japanese Resin described in JP-A No. 2017-075248, resin described in JP-A No. 2017-066240, resin described in JP-A No. 2017-167513, resin described in JP-A No. 2017-173787 , Resins described in paragraphs 0041 to 0060 of JP-A No. 2017-206689, resins described in paragraphs 0022-0071 of JP-A No. 2018-010856, end caps described in JP-A No. 2016-222891 Polyisocyanate resin, resin described in JP-A No. 2020-122052, resin described in JP-A No. 2020-111656, resin described in JP-A No. 2020-139021, JP-A No. 2017-138503 The resin described in the publication includes a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain. In addition, as the resin, a resin having a fennel skeleton can also be preferably used. Regarding the resin having a fenugreek skeleton, reference can be made to the description of US Patent Application Publication No. 2017/0102610, and the content is incorporated in this specification. In addition, as the resin, resins described in paragraphs 0199 to 0233 of JP-A-2020-186373, alkali-soluble resins described in JP-A-2020-186325, Korean Laid-Open Patent No. 10-2020-0078339 can also be used. The resin represented by Formula 1 described in the Publication No.

作為樹脂,使用具有酸基之樹脂為較佳。作為酸基,例如可舉出羧基、磷酸基、磺基、酚性羥基等。該等酸基可以僅為1種,亦可以為2種以上。例如,具有酸基之樹脂能夠用作鹼可溶性樹脂。具有酸基之樹脂的酸值為30~500mgKOH/g為較佳。下限為50mgKOH/g以上為較佳,70mgKOH/g以上為更佳。上限為400mgKOH/g以下為較佳,200mgKOH/g以下為更佳,150mgKOH/g以下為進一步較佳,120mgKOH/g以下為最佳。As the resin, it is preferable to use a resin having an acid group. As an acidic group, a carboxyl group, a phosphoric acid group, a sulfo group, a phenolic hydroxyl group etc. are mentioned, for example. These acid groups may be only one type, or may be two or more types. For example, a resin having an acid group can be used as the alkali-soluble resin. The acid value of the resin with acid groups is preferably 30-500 mgKOH/g. The lower limit is preferably at least 50 mgKOH/g, more preferably at least 70 mgKOH/g. The upper limit is preferably 400 mgKOH/g or less, more preferably 200 mgKOH/g or less, further preferably 150 mgKOH/g or less, most preferably 120 mgKOH/g or less.

作為樹脂,包括包含源自由式(ED1)表示之化合物和/或由式(ED2)表示之化合物(以下,有時將該等化合物亦稱為“醚二聚體”。)之重複單元之樹脂亦較佳。The resin includes a resin comprising a repeating unit derived from a compound represented by formula (ED1) and/or a compound represented by formula (ED2) (hereinafter, these compounds may also be referred to as "ether dimer".) Also better.

[化學式34]

Figure 02_image068
[chemical formula 34]
Figure 02_image068

式(ED1)中,R 1及R 2分別獨立地表示氫原子或可以具有取代基之碳數1~25的烴基。 In formula (ED1), R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.

[化學式35]

Figure 02_image070
[chemical formula 35]
Figure 02_image070

式(ED2)中,R表示氫原子或碳數1~30的有機基團。作為式(ED2)的具體例,能夠參考日本特開2010-168539號公報的記載。In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. As a specific example of the formula (ED2), the description in JP-A-2010-168539 can be referred to.

關於醚二聚體的具體例,能夠參考日本特開2013-029760號公報的0317段,該內容編入本說明書中。For specific examples of ether dimers, Paragraph 0317 of JP-A-2013-029760 can be referred to, and the content is incorporated in this specification.

作為樹脂,使用具有聚合性基之樹脂亦較佳。聚合性基可舉出乙烯性不飽和基及環狀醚基。其中,從釋氣抑制性的觀點考慮,具有(甲基)丙烯醯基、環氧基或氧環丁烷基為較佳。It is also preferable to use a resin having a polymerizable group as the resin. Examples of the polymerizable group include ethylenically unsaturated groups and cyclic ether groups. Among them, it is preferable to have a (meth)acryl group, an epoxy group, or an oxetanyl group from the viewpoint of outgassing suppression.

又,作為樹脂,亦能夠使用具有選自由式(Ep-1)表示之重複單元及由式(Ep-2)表示之重複單元中的至少1種重複單元(以下,亦稱為重複單元Ep)之樹脂(以下,亦稱為樹脂Ep)。上述樹脂Ep可以僅包含由式(Ep-1)表示之重複單元及由式(Ep-2)表示之重複單元中任一個重複單元,亦可以分別包含由式(Ep-1)表示之重複單元和由式(Ep-2)表示之重複單元。包含兩種重複單元時,由式(Ep-1)表示之重複單元與由式(Ep-2)表示之重複單元之比以莫耳比計,由式(Ep-1)表示之重複單元:由式(Ep-2)表示之重複單元=5:95~95:5為較佳,10:90~90:10為更佳,20:80~80:20為進一步較佳。Also, as a resin, one having at least one repeating unit selected from repeating units represented by formula (Ep-1) and repeating units represented by formula (Ep-2) (hereinafter also referred to as repeating unit Ep) can also be used. The resin (hereinafter also referred to as resin Ep). The above-mentioned resin Ep may only contain repeating units represented by formula (Ep-1) and repeating units represented by formula (Ep-2), or may contain repeating units represented by formula (Ep-1) respectively and a repeating unit represented by formula (Ep-2). When two kinds of repeating units are included, the ratio of the repeating unit represented by formula (Ep-1) to the repeating unit represented by formula (Ep-2) is in molar ratio, and the repeating unit represented by formula (Ep-1): The repeating unit represented by the formula (Ep-2) is preferably 5:95 to 95:5, more preferably 10:90 to 90:10, and still more preferably 20:80 to 80:20.

[化學式36]

Figure 02_image072
[chemical formula 36]
Figure 02_image072

式(Ep-1)、(Ep-2)中,L 1表示單鍵或2價連結基,R 1表示氫原子或取代基。作為R 1所表示之取代基,可舉出烷基及芳基,烷基為較佳。烷基的碳數為1~10為較佳,1~5為更佳,1~3為進一步較佳。R 1為氫原子或甲基為較佳。作為L 1所表示之2價連結基,可舉出伸烷基(較佳為碳數1~12的伸烷基)、伸芳基(較佳為碳數6~20的伸芳基)、-NH-、-SO-、-SO 2-、-CO-、-O-、-COO-、-OCO-、-S-及組合該等中的2個以上而成之基團。伸烷基可以為直鏈狀、支鏈狀及環狀中的任一種,直鏈狀或支鏈狀為較佳。又,伸烷基可以具有取代基,亦可以未經取代。作為取代基,可舉出羥基、烷氧基等。 In formulas (Ep-1) and (Ep-2), L 1 represents a single bond or a divalent linking group, and R 1 represents a hydrogen atom or a substituent. Examples of the substituent represented by R1 include an alkyl group and an aryl group, and an alkyl group is preferred. The carbon number of the alkyl group is preferably 1-10, more preferably 1-5, and still more preferably 1-3. R 1 is preferably a hydrogen atom or a methyl group. Examples of the divalent linking group represented by L include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylylene group (preferably an arylylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO 2 -, -CO-, -O-, -COO-, -OCO-, -S-, and a combination of two or more of these. The alkylene group may be any of linear, branched and cyclic, and linear or branched is preferred. In addition, the alkylene group may have a substituent or may be unsubstituted. As a substituent, a hydroxyl group, an alkoxy group, etc. are mentioned.

樹脂Ep中的上述重複單元Ep的含量在樹脂Ep的所有重複單元中為1莫耳%~100莫耳%為較佳。上限為90莫耳%以下為更佳,80莫耳%以下為進一步較佳。下限為2莫耳%以上為更佳,3莫耳%以上為進一步較佳。The content of the repeating unit Ep in the resin Ep is preferably 1 mol% to 100 mol% of all the repeating units in the resin Ep. The upper limit is more preferably 90 mol% or less, and more preferably 80 mol% or less. The lower limit is more preferably at least 2 mol%, and more preferably at least 3 mol%.

樹脂Ep可以包含上述重複單元Ep以外的其他重複單元。作為其他重複單元,可舉出具有酸基之重複單元、具有乙烯性不飽和基之重複單元等。The resin Ep may contain other repeating units other than the above-mentioned repeating unit Ep. As another repeating unit, the repeating unit which has an acidic group, the repeating unit which has an ethylenically unsaturated group, etc. are mentioned.

作為酸基,可舉出酚性羥基、羧基、磺基、磷酸基,酚性羥基或羧基為較佳,羧基為更佳。Examples of the acid group include a phenolic hydroxyl group, a carboxyl group, a sulfo group, and a phosphoric acid group, with a phenolic hydroxyl group or a carboxyl group being preferred, and a carboxyl group being more preferred.

作為乙烯性不飽和基,可舉出乙烯基、苯乙烯基、(甲基)烯丙基、(甲基)丙烯醯基等。Examples of the ethylenically unsaturated group include a vinyl group, a styryl group, a (meth)allyl group, a (meth)acryl group, and the like.

樹脂Ep包含具有酸基之重複單元時,樹脂Ep中的具有酸基之重複單元的含量在樹脂Ep的所有重複單元中為5莫耳%~85莫耳%為較佳。上限為60莫耳%以下為更佳,40莫耳%以下為進一步較佳。下限為8莫耳%以上為更佳,10莫耳%以上為進一步較佳。When the resin Ep contains a repeating unit having an acid group, the content of the repeating unit having an acid group in the resin Ep is preferably 5 mol% to 85 mol% of all the repeating units in the resin Ep. The upper limit is more preferably 60 mol% or less, and more preferably 40 mol% or less. The lower limit is more preferably at least 8 mol%, and more preferably at least 10 mol%.

樹脂Ep包含具有乙烯性不飽和基之重複單元時,樹脂Ep中的具有乙烯性不飽和基之重複單元的含量在樹脂Ep的所有重複單元中為1莫耳%~65莫耳%為較佳。上限為45莫耳%以下為更佳,30莫耳%以下為進一步較佳。下限為2莫耳%以上為更佳,3莫耳%以上為進一步較佳。When the resin Ep contains a repeating unit having an ethylenically unsaturated group, the content of the repeating unit having an ethylenically unsaturated group in the resin Ep is preferably 1 mol% to 65 mol% of all the repeating units in the resin Ep . The upper limit is more preferably 45 mol% or less, and more preferably 30 mol% or less. The lower limit is more preferably at least 2 mol%, and more preferably at least 3 mol%.

樹脂Ep進一步包含具有芳香族烴環之重複單元為較佳。作為芳香族烴環,苯環或萘環為較佳,苯環為較佳。芳香族烴環可以具有取代基。作為取代基,可舉出烷基等。具有環狀醚基之樹脂包含具有芳香族烴環之重複單元時,具有芳香族烴環之重複單元的含量在具有環狀醚基之樹脂的所有重複單元中為1莫耳%~65莫耳%為較佳。上限為45莫耳%以下為更佳,30莫耳%以下為進一步較佳。下限為2莫耳%以上為更佳,3莫耳%以上為進一步較佳。作為具有芳香族烴環之重複單元,可舉出源自乙烯基甲苯、(甲基)丙烯酸苄酯等具有芳香族烴環之單官能聚合性化合物之重複單元。It is preferable that the resin Ep further includes a repeating unit having an aromatic hydrocarbon ring. As the aromatic hydrocarbon ring, a benzene ring or a naphthalene ring is preferable, and a benzene ring is more preferable. The aromatic hydrocarbon ring may have a substituent. An alkyl group etc. are mentioned as a substituent. When the resin with a cyclic ether group contains repeating units with an aromatic hydrocarbon ring, the content of the repeating unit with an aromatic hydrocarbon ring is 1 mol % to 65 mol in all the repeating units of the resin with a cyclic ether group % is better. The upper limit is more preferably 45 mol% or less, and more preferably 30 mol% or less. The lower limit is more preferably at least 2 mol%, and more preferably at least 3 mol%. Examples of the repeating unit having an aromatic hydrocarbon ring include repeating units derived from monofunctional polymerizable compounds having an aromatic hydrocarbon ring, such as vinyltoluene and benzyl (meth)acrylate.

作為樹脂,使用包含源自由式(X)表示之化合物之重複單元之樹脂亦較佳。As the resin, it is also preferable to use a resin comprising a repeating unit derived from the compound represented by formula (X).

[化學式37]

Figure 02_image074
[chemical formula 37]
Figure 02_image074

式中,R 1表示氫原子或甲基,R 21及R 22分別獨立地表示伸烷基,n表示0~15的整數。R 21及R 22所表示之伸烷基的碳數為1~10為較佳,1~5為更佳,1~3為進一步較佳,2或3為特佳。n表示0~15的整數,0~5的整數為較佳,0~4的整數為更佳,0~3的整數為進一步較佳。 In the formula, R1 represents a hydrogen atom or a methyl group, R21 and R22 each independently represent an alkylene group, and n represents an integer of 0-15. The carbon number of the alkylene group represented by R 21 and R 22 is preferably 1-10, more preferably 1-5, still more preferably 1-3, particularly preferably 2 or 3. n represents an integer of 0-15, preferably an integer of 0-5, more preferably an integer of 0-4, and further preferably an integer of 0-3.

作為由式(X)表示之化合物,可舉出對枯基苯酚(para-cumyl phenol)的環氧乙烷或環氧丙烷改質(甲基)丙烯酸酯等。作為市售品,可舉出ARONIX M-110(TOAGOSEI CO.,LTD.製)等。Examples of the compound represented by the formula (X) include ethylene oxide or propylene oxide modified (meth)acrylate of p-cumylphenol (para-cumyl phenol). As a commercial item, ARONIX M-110 (made by TOAGOSEI CO., LTD.) etc. are mentioned.

作為樹脂,使用具有芳香族羧基之樹脂(以下,亦稱為樹脂Ac)亦較佳。樹脂Ac中,芳香族羧基可以包含於重複單元的主鏈,亦可以包含於重複單元的側鏈。芳香族羧基包含於重複單元的主鏈為較佳。另外,本說明書中,芳香族羧基係指1個以上羧基鍵結於芳香族環之結構的基團。芳香族羧基中,鍵結於芳香族環之羧基數為1~4個為較佳,1~2個為更佳。It is also preferable to use a resin (hereinafter also referred to as resin Ac) having an aromatic carboxyl group as the resin. In resin Ac, the aromatic carboxyl group may be included in the main chain of the repeating unit, or may be included in the side chain of the repeating unit. An aromatic carboxyl group is preferably included in the main chain of the repeating unit. In addition, in this specification, an aromatic carboxyl group means the group of the structure which bonded one or more carboxyl groups to an aromatic ring. Among the aromatic carboxyl groups, the number of carboxyl groups bonded to the aromatic ring is preferably 1 to 4, more preferably 1 to 2.

樹脂Ac為包含選自由式(Ac-1)表示之重複單元及由式(Ac-2)表示之重複單元中之至少1種重複單元之樹脂為較佳。Resin Ac is preferably a resin containing at least one repeating unit selected from repeating units represented by formula (Ac-1) and repeating units represented by formula (Ac-2).

[化學式38]

Figure 02_image076
[chemical formula 38]
Figure 02_image076

式(Ac-1)中,Ar 1表示包含芳香族羧基之基團,L 1表示-COO-或-CONH-,L 2表示2價連結基。 式(Ac-2)中,Ar 10表示包含芳香族羧基之基團,L 11表示-COO-或-CONH-,L 12表示3價連結基,P 10表示聚合物鏈。 In formula (Ac-1), Ar 1 represents a group including an aromatic carboxyl group, L 1 represents -COO- or -CONH-, and L 2 represents a divalent linking group. In formula (Ac-2), Ar 10 represents a group including an aromatic carboxyl group, L 11 represents -COO- or -CONH-, L 12 represents a trivalent linking group, and P 10 represents a polymer chain.

式(Ac-1)中,作為Ar 1所表示之包含芳香族羧基之基團,可舉出源自芳香族三羧酸酐之結構、源自芳香族四羧酸酐之結構等。作為芳香族三羧酸酐及芳香族四羧酸酐,可舉出下述結構的化合物。 In formula (Ac-1), as the group containing an aromatic carboxyl group represented by Ar 1 , a structure derived from an aromatic tricarboxylic anhydride, a structure derived from an aromatic tetracarboxylic anhydride, and the like are exemplified. Examples of the aromatic tricarboxylic acid anhydride and the aromatic tetracarboxylic acid anhydride include compounds of the following structures.

[化學式39]

Figure 02_image078
[chemical formula 39]
Figure 02_image078

上述式中,Q 1表示單鍵、-O-、-CO-、-COOCH 2CH 2OCO-、-SO 2-、-C(CF 32-、由下述式(Q-1)表示之基團或由下述式(Q-2)表示之基團。 In the above formula, Q 1 represents a single bond, -O-, -CO-, -COOCH 2 CH 2 OCO-, -SO 2 -, -C(CF 3 ) 2 -, represented by the following formula (Q-1) or a group represented by the following formula (Q-2).

[化學式40]

Figure 02_image080
[chemical formula 40]
Figure 02_image080

Ar 1所表示之包含芳香族羧基之基團可以具有聚合性基。聚合性基為乙烯性不飽和基及環狀醚基為較佳,乙烯性不飽和基為更佳。 作為Ar 1所表示之包含芳香族羧基之基團的具體例,可舉出由式(Ar-11)表示之基團、由式(Ar-12)表示之基團、由式(Ar-13)表示之基團等。 The group containing an aromatic carboxyl group represented by Ar 1 may have a polymerizable group. The polymerizable group is preferably an ethylenically unsaturated group and a cyclic ether group, more preferably an ethylenically unsaturated group. Specific examples of the group containing an aromatic carboxyl group represented by Ar 1 include groups represented by formula (Ar-11), groups represented by formula (Ar-12), groups represented by formula (Ar-13 ) represents the group, etc.

[化學式41]

Figure 02_image082
[chemical formula 41]
Figure 02_image082

式(Ar-11)中,n1表示1~4的整數,1或2為較佳,2為更佳。 式(Ar-12)中,n2表示1~8的整數,1~4的整數為較佳,1或2為更佳,2為進一步較佳。 式(Ar-13)中,n3及n4分別獨立地表示0~4的整數,0~2的整數為較佳,1或2為更佳,1為進一步較佳。其中,n3及n4中的至少一個為1以上的整數。 式(Ar-13)中,Q 1表示單鍵、-O-、-CO-、-COOCH 2CH 2OCO-、-SO 2-、-C(CF 32-、由上述式(Q-1)表示之基團或由上述式(Q-2)表示之基團。 式(Ar-11)~(Ar-13)中,*1表示與L 1的鍵結位置。 In formula (Ar-11), n1 represents an integer of 1 to 4, 1 or 2 is preferable, and 2 is more preferable. In formula (Ar-12), n2 represents an integer of 1 to 8, preferably an integer of 1 to 4, more preferably 1 or 2, and still more preferably 2. In formula (Ar-13), n3 and n4 each independently represent an integer of 0 to 4, an integer of 0 to 2 is preferable, 1 or 2 is more preferable, and 1 is still more preferable. However, at least one of n3 and n4 is an integer of 1 or more. In the formula (Ar-13), Q 1 represents a single bond, -O-, -CO-, -COOCH 2 CH 2 OCO-, -SO 2 -, -C(CF 3 ) 2 -, from the above formula (Q- 1) The group represented by or the group represented by the above-mentioned formula (Q-2). In formulas (Ar-11) to (Ar-13), *1 represents a bonding position with L 1 .

式(Ac-1)中,L 1表示-COO-或CONH-,表示-COO-為較佳。 In the formula (Ac-1), L 1 represents -COO- or CONH-, preferably -COO-.

作為式(Ac-1)中L 2所表示之2價連結基,可舉出伸烷基、伸芳基、-O-、-CO-、-COO-、-OCO-、-NH-、-S-及組合該等中的2種以上而成之基團。伸烷基的碳數為1~30為較佳,1~20為更佳,1~15為進一步較佳。伸烷基可以為直鏈、支鏈、環狀中的任一種。伸芳基的碳數為6~30為較佳,6~20為更佳,6~10為進一步較佳。伸烷基及伸芳基可以具有取代基。作為取代基,可舉出羥基等。L 2所表示之2價連結基為由-L 2a-O-表示之基團為較佳。L 2a可舉出伸烷基;伸芳基;伸烷基與伸芳基組合而成之基團;選自伸烷基及伸芳基中之至少1種與選自-O-、-CO-、-COO-、-OCO-、-NH-及-S-中之至少1種組合而成之基團等,伸烷基為較佳。伸烷基的碳數為1~30為較佳,1~20為更佳,1~15為進一步較佳。伸烷基可以為直鏈、支鏈、環狀中的任一種。伸烷基及伸芳基可以具有取代基。作為取代基,可舉出羥基等。 Examples of the divalent linking group represented by L2 in formula (Ac-1) include alkylene, arylylene, -O-, -CO-, -COO-, -OCO-, -NH-, - S- and a group formed by combining two or more of these. The number of carbon atoms in the alkylene group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The alkylene group may be any of linear, branched and cyclic. The carbon number of the arylylene group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. An alkylene group and an arylylene group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. The divalent linking group represented by L 2 is preferably a group represented by -L 2a -O-. L 2a can include an alkylene group; an arylylene group; a group formed by a combination of an alkylene group and an arylylene group; at least one selected from the group consisting of an alkylene group and an arylylene group and a group selected from -O-, -CO A group formed by combining at least one of -, -COO-, -OCO-, -NH-, and -S-, etc., preferably an alkylene group. The number of carbon atoms in the alkylene group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The alkylene group may be any of linear, branched and cyclic. An alkylene group and an arylylene group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned.

作為式(Ac-2)中Ar 10所表示之包含芳香族羧基之基團,與式(Ac-1)的Ar 1的含義相同,較佳態樣亦相同。 The group containing an aromatic carboxyl group represented by Ar 10 in formula (Ac-2) has the same meaning as Ar 1 in formula (Ac-1), and the preferred aspects are also the same.

式(Ac-2)中,L 11表示-COO-或CONH-,表示-COO-為較佳。 In the formula (Ac-2), L 11 represents -COO- or CONH-, preferably -COO-.

式(Ac-2)中,作為L 12所表示之3價連結基,可舉出烴基、以及烴基與選自-O-、-CO-、-COO-、-OCO-、-NH-、及-S-中之至少1種組合而成之基團。烴基可舉出脂肪族烴基、芳香族烴基。脂肪族烴基的碳數為1~30為較佳,1~20為更佳,1~15為進一步較佳。脂肪族烴基可以為直鏈、支鏈、環狀中的任一種。芳香族烴基的碳數為6~30為較佳,6~20為更佳,6~10為進一步較佳。烴基可以具有取代基。作為取代基,可舉出羥基等。L 12所表示之3價連結基為由式(L12-1)表示之基團為較佳,由式(L12-2)表示之基團為更佳。 In formula (Ac-2), as the trivalent linking group represented by L 12 , hydrocarbon groups and hydrocarbon groups selected from -O-, -CO-, -COO-, -OCO-, -NH-, and A group formed by combining at least one of -S-. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-30, more preferably 1-20, and still more preferably 1-15. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-30, more preferably 6-20, and still more preferably 6-10. The hydrocarbon group may have a substituent. As a substituent, a hydroxyl group etc. are mentioned. The trivalent linking group represented by L 12 is preferably a group represented by formula (L12-1), more preferably a group represented by formula (L12-2).

[化學式42]

Figure 02_image084
[chemical formula 42]
Figure 02_image084

式(L12-1)中,L 12b表示3價連結基,X 1表示S,*1表示與式(Ac-2)的L 11的鍵結位置,*2表示與式(Ac-2)的P 10的鍵結位置。作為L 12b所表示之3價連結基,可舉出烴基、以及烴基與選自-O-、-CO-、-COO-、-OCO-、-NH-及-S-中之至少1種組合而成之基團等,烴基或烴基與-O-組合而成之基團為較佳。 In formula (L12-1), L 12b represents a trivalent linking group, X 1 represents S, *1 represents the bonding position with L 11 of formula (Ac-2), and *2 represents the bonding position with formula (Ac-2) Bonding position of P 10 . Examples of the trivalent linking group represented by L12b include a hydrocarbon group and a combination of a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH-, and -S- As the resulting group, etc., a hydrocarbon group or a combination of a hydrocarbon group and -O- is preferable.

式(L12-2)中,L 12c表示3價連結基,X 1表示S,*1表示與式(Ac-2)的L 11的鍵結位置,*2表示與式(Ac-2)的P 10的鍵結位置。作為L 12c所表示之3價連結基,可舉出烴基、以及烴基與選自-O-、-CO-、-COO-、-OCO-、-NH-及-S-中之至少1種組合而成之基團等,烴基為較佳。 In formula (L12-2), L 12c represents a trivalent linking group, X 1 represents S, *1 represents the bonding position with L 11 of formula (Ac-2), and *2 represents the bond with formula (Ac-2) Bonding position of P 10 . Examples of the trivalent linking group represented by L 12c include a hydrocarbon group and a combination of a hydrocarbon group and at least one selected from -O-, -CO-, -COO-, -OCO-, -NH-, and -S- The resulting groups, etc., are preferably hydrocarbon groups.

式(Ac-2)中,P 10表示聚合物鏈。P 10所表示之聚合物鏈具有選自聚(甲基)丙烯酸重複單元、聚醚重複單元、聚酯重複單元及多元醇重複單元中之至少1種重複單元為較佳。聚合物鏈P 10的重量平均分子量為500~20,000為較佳。下限為1,000以上為更佳。上限為10,000以下為更佳,5,000以下為進一步較佳,3,000以下為特佳。只要P 10的重量平均分子量在上述範圍內,則顏料在組成物中的分散性良好。具有芳香族羧基之樹脂為具有由式(Ac-2)表示之重複單元之樹脂時,該樹脂可較佳地用作分散劑。 In the formula (Ac-2), P 10 represents a polymer chain. The polymer chain represented by P10 preferably has at least one repeating unit selected from poly(meth)acrylic acid repeating units, polyether repeating units, polyester repeating units and polyol repeating units. The weight average molecular weight of the polymer chain P10 is preferably 500-20,000. The lower limit is more preferably 1,000 or more. The upper limit is more preferably 10,000 or less, further preferably 5,000 or less, and particularly preferably 3,000 or less. As long as the weight average molecular weight of P 10 is within the above range, the dispersibility of the pigment in the composition will be good. When the resin having an aromatic carboxyl group is a resin having a repeating unit represented by formula (Ac-2), the resin can be preferably used as a dispersant.

P 10所表示之聚合物鏈可以包含聚合性基。作為聚合性基,可舉出乙烯性不飽和基。 The polymer chain represented by P10 may contain a polymerizable group. Examples of the polymerizable group include ethylenically unsaturated groups.

本揭示之硬化性組成物含有作為分散劑的樹脂為較佳。作為分散劑,可舉出酸性分散劑(酸性樹脂)、鹼性分散劑(鹼性樹脂)。在此,酸性分散劑(酸性樹脂)表示酸基的量多於鹼基的量之樹脂。作為酸性分散劑(酸性樹脂),將酸基的量和鹼基的量的合計量設為100莫耳%時,酸基的量為70莫耳%以上之樹脂為較佳。酸性分散劑(酸性樹脂)所具有之酸基為羧基為較佳。酸性分散劑(酸性樹脂)的酸值為10mgKOH/g~105mgKOH/g為較佳。又,鹼性分散劑(鹼性樹脂)表示鹼基的量多於酸基的量之樹脂。作為鹼性分散劑(鹼性樹脂),將酸基的量與鹼基的量的合計量設為100莫耳%時,鹼基的量超過50莫耳%的樹脂為較佳。 鹼性分散劑所具有之鹼基為胺基為較佳。 The curable composition of the present disclosure preferably contains a resin as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the acidic dispersant (acidic resin) means a resin having more acidic groups than basic groups. As the acidic dispersant (acidic resin), when the total amount of the amount of acid groups and the amount of bases is 100 mol%, a resin having an amount of acid groups of 70 mol% or more is preferable. It is preferable that the acidic group which the acidic dispersant (acidic resin) has is a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10 mgKOH/g-105 mgKOH/g. In addition, the basic dispersant (basic resin) means a resin having more basic groups than acid groups. As the basic dispersant (basic resin), when the total amount of the amount of acid groups and the amount of bases is 100 mol %, a resin with an amount of bases exceeding 50 mol % is preferable. The base that the alkaline dispersant has is preferably an amine group.

用作分散劑之樹脂為接枝聚合物亦較佳。關於接枝聚合物的詳細內容,能夠參考日本特開2012-255128號公報的0025~0094段的記載,該內容編入本說明書中。 又,從分散穩定性的觀點考慮,上述樹脂較佳為具有接枝鏈之接枝聚合物,且上述接枝鏈包含選自包括聚醚鏈、聚酯鏈及聚丙烯酸鏈之群組中之至少1種,且上述接枝鏈的重量平均分子量為1,000以上。 It is also preferred that the resin used as the dispersant is a graft polymer. For details of the graft polymer, the description in paragraphs 0025 to 0094 of JP-A-2012-255128 can be referred to, and the content is incorporated in this specification. Also, from the viewpoint of dispersion stability, the above-mentioned resin is preferably a graft polymer having a grafted chain, and the above-mentioned grafted chain includes a polyether chain, a polyester chain, and a polyacrylic acid chain. At least one kind, and the weight average molecular weight of the above-mentioned graft chain is 1,000 or more.

用作分散劑之樹脂為在主鏈及側鏈中的至少一個上包含氮原子之聚亞胺系分散劑亦較佳。作為聚亞胺系分散劑,具有主鏈及側鏈且在主鏈及側鏈中的至少一個上具有鹼性氮原子之樹脂為較佳,該主鏈包含具有pKa14以下的官能基之部分結構,該側鏈的原子數為40~10000。鹼性氮原子只要為呈鹼性之氮原子,則並沒有特別限制。聚亞胺系分散劑能夠參考日本特開2012-255128號公報的0102~0166段的記載,該內容編入本說明書中。It is also preferable that the resin used as the dispersant is a polyimide-based dispersant containing nitrogen atoms in at least one of the main chain and the side chain. As a polyimide-based dispersant, a resin having a main chain and a side chain and having a basic nitrogen atom on at least one of the main chain and the side chain is preferable, and the main chain includes a partial structure having a functional group of pKa14 or less , the number of atoms in the side chain is 40 to 10,000. The basic nitrogen atom is not particularly limited as long as it is a basic nitrogen atom. As for the polyimide-based dispersant, the description in paragraphs 0102 to 0166 of JP-A-2012-255128 can be referred to, and the content is incorporated in this specification.

用作分散劑之樹脂為在核部鍵結有複數個聚合物鏈之結構的樹脂亦較佳。作為此類樹脂,例如可舉出樹枝狀聚合物(包括星型聚合物)。又,作為樹枝狀聚合物的具體例,可舉出日本特開2013-043962號公報的0196~0209段中記載之高分子化合物C-1~C-31等。It is also preferable that the resin used as the dispersant has a structure in which a plurality of polymer chains are bonded to the core. Examples of such resins include dendrimers (including star polymers). Moreover, specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962 .

用作分散劑之樹脂為包含側鏈具有乙烯性不飽和基之重複單元之樹脂亦較佳。側鏈具有乙烯性不飽和基之重複單元在樹脂的所有重複單元中的含量為10莫耳%以上為較佳,10莫耳%~80莫耳%為更佳,20莫耳%~70莫耳%為進一步較佳。It is also preferable that the resin used as a dispersant is a resin containing a repeating unit having an ethylenically unsaturated group in a side chain. The content of repeating units with ethylenically unsaturated groups in the side chains in all the repeating units of the resin is preferably 10 mol% or more, more preferably 10 mol% to 80 mol%, and 20 mol% to 70 mol% % is further preferred.

又,用作分散劑的樹脂為側鏈包含氧環丁烷基之樹脂為較佳,包含側鏈具有氧環丁烷基之重複單元之樹脂為更佳。 進而,側鏈包含氧環丁烷基之樹脂為接枝聚合物為較佳。 作為側鏈包含氧環丁烷基之樹脂,可較佳地舉出後述實施例中記載者。上述樹脂中的側鏈具有氧環丁烷基之重複單元在樹脂的所有重複單元中的含量為10莫耳%以上為較佳,10莫耳%~80莫耳%為更佳,20莫耳%~70莫耳%為進一步較佳。 作為具有氧環丁烷基之樹脂,例如,能夠使用國際公開第2021/182268號或國際公開第2021/187257號中記載之樹脂。 Also, the resin used as a dispersant is preferably a resin containing an oxetanyl group in the side chain, and more preferably a resin containing a repeating unit having an oxetanyl group in the side chain. Furthermore, it is preferable that the resin whose side chain contains an oxetanyl group is a graft polymer. As a resin containing an oxetanyl group in a side chain, those described in the Examples described later are preferably mentioned. The content of repeating units with oxetane groups in the side chains of the above resins in all the repeating units of the resin is preferably 10 mole % or more, more preferably 10 mole % to 80 mole %, and 20 mole % % to 70 mol% is further preferred. As the resin having an oxetanyl group, for example, resins described in International Publication No. 2021/182268 or International Publication No. 2021/187257 can be used.

又,作為分散劑,亦能夠使用日本特開2018-087939號公報中記載之樹脂、日本專利第6432077號公報的0219~0221段中記載之嵌段共聚物(EB-1)~(EB-9)、國際公開第2016/104803號中記載之具有聚酯側鏈之聚乙烯亞胺、國際公開第2019/125940號中記載之嵌段共聚物、日本特開2020-066687號公報中記載之具有丙烯醯胺結構單元之嵌段聚合物、日本特開2020-066688號公報中記載之具有丙烯醯胺結構單元之嵌段聚合物、國際公開第2016/104803號中記載之分散劑等。Also, as a dispersant, resins described in JP-A-2018-087939 and block copolymers (EB-1) to (EB-9) described in paragraphs 0219-0221 of JP-A-6432077 can also be used. ), the polyethyleneimine having polyester side chains described in International Publication No. 2016/104803, the block copolymer described in International Publication No. 2019/125940, and the polyethylenimine described in Japanese Patent Laid-Open No. 2020-066687 A block polymer of an acrylamide structural unit, a block polymer having an acrylamide structural unit described in JP-A-2020-066688, a dispersant described in International Publication No. 2016/104803, etc.

分散劑能夠作為市售品獲得,作為此類具體例,可舉出BYK-Chemie GmbH製Disperbyk系列(例如,Disperbyk-111、161、2001等)、Japan Lubrizol Corporation製SOLSPERSE系列(例如,SOLSPERSE 20000、76500等)、Ajinomoto Fine-Techno Co.,Inc.製Ajispar系列等。又,亦能夠使用日本特開2012-137564號公報的0129段中記載之產品、日本特開2017-194662號公報的0235段中記載之產品作為分散劑。The dispersant can be obtained as a commercial product, and such specific examples include the Disperbyk series manufactured by BYK-Chemie GmbH (for example, Disperbyk-111, 161, 2001, etc.), the SOLSPERSE series manufactured by Japan Lubrizol Corporation (for example, SOLSPERSE 20000, 76500, etc.), Ajispar series manufactured by Ajinomoto Fine-Techno Co., Inc., etc. Moreover, the product described in paragraph 0129 of JP-A-2012-137564 and the product described in paragraph 0235 of JP-A-2017-194662 can also be used as a dispersant.

本揭示之硬化性組成物包含樹脂作為自由基聚合性化合物時,樹脂的含量相對於硬化性組成物的總固體成分,1質量%~70質量%為較佳。下限為2質量%以上為更佳,3質量%以上為進一步較佳,5質量%以上為特佳。上限為65質量%以下為更佳,60質量%以下為進一步較佳。 又,具有酸基之樹脂的含量相對於硬化性組成物的總固體成分,1質量%~70質量%為較佳。下限為2質量%以上為更佳,3質量%以上為進一步較佳,5質量%以上為特佳。上限為65質量%以下為更佳,60質量%以下為進一步較佳。 又,鹼可溶性樹脂的含量相對於硬化性組成物的總固體成分,1質量%~70質量%為較佳。下限為2質量%以上為更佳,3質量%以上為進一步較佳,5質量%以上為特佳。上限為65質量%以下為更佳,60質量%以下為進一步較佳。 本揭示之硬化性組成物含有作為分散劑的樹脂時,作為分散劑的樹脂的含量相對於硬化性組成物的總固體成分,0.1質量%~30質量%為較佳。上限為25質量%以下為更佳,20質量%以下為進一步較佳。下限為0.5質量%以上為更佳,1質量%以上為進一步較佳。又,作為分散劑的樹脂的含量相對於著色劑100質量份,1質量份~100質量份為較佳。上限為80質量份以下為更佳,70質量份以下為進一步較佳,60質量份以下為特佳。下限為5質量份以上為更佳,10質量份以上為進一步較佳,20質量份以上為特佳。 本揭示之硬化性組成物可以僅包含1種樹脂,亦可以包含2種以上。包含2種以上樹脂時,該等的合計量在上述範圍內為較佳。 When the curable composition disclosed herein contains a resin as a radically polymerizable compound, the content of the resin is preferably 1% by mass to 70% by mass relative to the total solid content of the curable composition. The lower limit is more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. The upper limit is more preferably 65% by mass or less, and more preferably 60% by mass or less. Also, the content of the resin having an acid group is preferably 1% by mass to 70% by mass relative to the total solid content of the curable composition. The lower limit is more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. The upper limit is more preferably 65% by mass or less, and more preferably 60% by mass or less. Also, the content of the alkali-soluble resin is preferably 1% by mass to 70% by mass relative to the total solid content of the curable composition. The lower limit is more preferably 2% by mass or more, still more preferably 3% by mass or more, and particularly preferably 5% by mass or more. The upper limit is more preferably 65% by mass or less, and more preferably 60% by mass or less. When the curable composition of the present disclosure contains a resin as a dispersant, the content of the resin as a dispersant is preferably 0.1% by mass to 30% by mass relative to the total solid content of the curable composition. The upper limit is more preferably at most 25% by mass, and is still more preferably at most 20% by mass. The lower limit is more preferably at least 0.5% by mass, and more preferably at least 1% by mass. Moreover, content of the resin which is a dispersing agent is preferably 1 mass part - 100 mass parts with respect to 100 mass parts of coloring agents. The upper limit is more preferably at most 80 parts by mass, further preferably at most 70 parts by mass, and particularly preferably at most 60 parts by mass. The lower limit is more preferably 5 parts by mass or more, further preferably 10 parts by mass or more, and particularly preferably 20 parts by mass or more. The curable composition of this disclosure may contain only 1 type of resin, and may contain 2 or more types. When two or more types of resins are included, it is preferable that the total amount thereof is within the above range.

<溶劑> 本揭示之硬化性組成物含有溶劑為較佳。作為溶劑,可舉出有機溶劑。溶劑的種類只要滿足各成分的溶解性、組成物的塗佈性,則基本上沒有特別限制。作為有機溶劑,可舉出酯系溶劑、酮系溶劑、醇系溶劑、醯胺系溶劑、醚系溶劑、烴系溶劑等。關於該等的詳細內容,能夠參考國際公開第2015/166779號的0223段,該內容編入本說明書中。又,亦能夠較佳地使用經環狀烷基取代之酯系溶劑、經環狀烷基取代之酮系溶劑。作為有機溶劑的具體例,可舉出聚乙二醇單甲醚、二氯甲烷、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙基賽路蘇乙酸酯、乳酸乙酯、二乙二醇二甲醚、乙酸丁酯、3-甲氧基丙酸甲酯、2-庚酮、2-戊酮、3-戊酮、4-庚酮、環己酮、2-甲基環己酮、3-甲基環己酮、4-甲基環己酮、環庚酮、環辛酮、乙酸環己酯、環戊酮、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯、丙二醇單甲醚、丙二醇單甲醚乙酸酯、3-甲氧基-N,N-二甲基丙醯胺、3-丁氧基-N,N-二甲基丙醯胺、丙二醇二乙酸酯、3-甲氧基丁醇、甲基乙基酮、γ-丁內酯、環丁碸、苯甲醚、1,4-二乙醯氧基丁烷、二乙二醇單乙醚乙酸酯、1,3-丁二醇二乙酸酯、二丙二醇甲醚乙酸酯、二丙酮醇(亦稱為4-羥基-4-甲基-2-戊酮)、2-甲氧基丙基乙酸酯、2-甲氧基-1-丙醇、異丙醇等。 然而,有時出於環境方面等原因,減少作為有機溶劑之芳香族烴類(苯、甲苯、二甲苯、乙苯等)為較佳(例如,相對於有機溶劑總量,能夠設為50質量ppm(parts per million:百萬分率)以下,亦能夠設為10質量ppm以下,亦能夠設為1質量ppm以下)。 <Solvent> It is preferable that the curable composition disclosed herein contains a solvent. An organic solvent is mentioned as a solvent. The type of solvent is basically not particularly limited as long as it satisfies the solubility of each component and the applicability of the composition. Examples of the organic solvent include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. Regarding such details, reference can be made to paragraph 0223 of International Publication No. 2015/166779, which is incorporated in this specification. In addition, ester-based solvents substituted with a cyclic alkyl group and ketone-based solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celuxoacetate , ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone , 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate , Butyl Carbitol Acetate, Propylene Glycol Monomethyl Ether, Propylene Glycol Monomethyl Ether Acetate, 3-Methoxy-N,N-Dimethylpropionamide, 3-Butoxy-N,N- Dimethylacrylamide, Propylene Glycol Diacetate, 3-Methoxybutanol, Methyl Ethyl Ketone, γ-Butyrolactone, Cyclobutane, Anisole, 1,4-Diacetyloxy Butane, diethylene glycol monoethyl ether acetate, 1,3-butanediol diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as 4-hydroxy-4-methyl-2 -pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, sometimes for reasons such as the environment, it is better to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents (for example, it can be set to 50 mass ppm (parts per million: parts per million) or less, may be 10 mass ppm or less, may also be 1 mass ppm or less).

本揭示中,使用金屬含量少的有機溶劑為較佳。有機溶劑的金屬含量例如10質量ppb(parts per billion:十億分率)以下為較佳。可以根據需要使用質量ppt(parts per trillion:兆分率)級別的有機溶劑,此類有機溶劑例如由Toyo Gosei Co.,Ltd提供(化學工業日報,2015年11月13日)。In this disclosure, it is preferable to use an organic solvent with a low metal content. The metal content of the organic solvent is preferably, for example, 10 mass ppb (parts per billion: parts per billion) or less. Organic solvents at the ppt (parts per trillion: parts per million) level can be used as needed, and such organic solvents are provided by Toyo Gosei Co., Ltd, for example (Chemical Industry Daily, November 13, 2015).

作為從有機溶劑中去除金屬等雜質之方法,例如能夠舉出蒸餾(分子蒸餾、薄膜蒸餾等)或使用了過濾器之過濾。作為用於過濾之過濾器的過濾器孔徑,10μm以下為較佳,5μm以下為更佳,3μm以下為進一步較佳。過濾器的材質為聚四氟乙烯、聚乙烯或尼龍為較佳。Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and still more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene or nylon.

有機溶劑可以包含異構物(原子數相同,但結構不同的化合物)。又,異構物可以僅包含1種,亦可以包含複數種。Organic solvents can contain isomers (compounds with the same number of atoms but different structures). In addition, the isomer may contain only 1 type, and may contain plural types.

過氧化物在有機溶劑中的含有率為0.8mmol/L以下為較佳,實質上不包含過氧化物為更佳。It is preferable that the content rate of a peroxide in an organic solvent is 0.8 mmol/L or less, and it is more preferable not to contain a peroxide substantially.

溶劑在硬化性組成物中的含量為10質量%~95質量%為較佳,20質量%~90質量%為更佳,30質量%~90質量%為進一步較佳。The content of the solvent in the curable composition is preferably 10% by mass to 95% by mass, more preferably 20% by mass to 90% by mass, and still more preferably 30% by mass to 90% by mass.

又,從環境管制的觀點考慮,本揭示之硬化性組成物實質上不含有環境管制物質為較佳。此外,在本揭示中,實質上不含有環境管制物質係指,硬化性組成物中的環境管制物質的含量為50質量ppm以下,30質量ppm以下為較佳,10質量ppm以下為進一步較佳,1質量ppm以下為特佳。例如,環境管制物質可舉出苯;甲苯、二甲苯等烷基苯類;氯苯等鹵化苯類等。該等以REACH(關於化學品註冊、評估、許可和限制;Registration Evaluation Authorization and Restriction of CHemicals)法案、PRTR(污染物釋出轉運申報;Pollutant Release and Transfer Register)法、VOC(揮發性有機物;Volatile Organic Compounds)管制等為基礎,註冊為環境管制物質,並嚴格管制使用量和操作方法。該等化合物在製造用於硬化性組成物中之各成分等時,有時用作溶劑,有時作為殘留溶劑混入硬化性組成物中。從對人的安全性、對環境保護的觀點考慮,盡可能減少該等物質為較佳。作為減少環境管制物質之方法,可舉出對系統內部進行加熱和減壓而設為環境管制物質的沸點以上,藉此從系統內部蒸餾去除並減少環境管制物質的方法。又,在蒸餾去除少量的環境管制物質時,為了提高效率,使其與具有與該溶劑相同的沸點之溶劑共沸亦有用。又,含有具有自由基聚合性之化合物時,可以添加聚合抑制劑等而進行減壓蒸餾去除,以抑制在減壓蒸餾去除中進行自由基聚合反應而導致分子間的交聯。該等蒸餾去除方法能夠在原料的階段、使原料進行反應之產物(例如聚合後的樹脂溶液、多官能單體溶液)的階段或藉由混合該等化合物而製作之硬化性組成物的階段等任一階段實施。Moreover, from the viewpoint of environmental control, it is preferable that the curable composition of the present disclosure does not substantially contain an environmental control substance. In addition, in the present disclosure, the term "substantially not containing environmentally regulated substances" means that the content of the environmentally regulated substances in the curable composition is 50 mass ppm or less, preferably 30 mass ppm or less, and more preferably 10 mass ppm or less. , below 1 mass ppm is particularly preferred. Examples of environmental control substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzenes such as chlorobenzene. These are based on REACH (Registration, Evaluation, Authorization and Restriction of Chemicals; Registration Evaluation Authorization and Restriction of Chemicals) Act, PRTR (Pollutant Release and Transfer Register) Act, VOC (Volatile Organic Compounds; Volatile Organic Compounds) control, etc., registered as an environmental control substance, and strictly regulated the amount of use and operation method. These compounds are sometimes used as solvents when producing components used in curable compositions, etc., and are sometimes mixed into curable compositions as residual solvents. From the standpoint of human safety and environmental protection, it is preferable to reduce these substances as much as possible. As a method of reducing environmentally regulated substances, there is a method of distilling and reducing the environmentally regulated substances from the inside of the system by heating and reducing the pressure inside the system to a temperature above the boiling point of the environmentally regulated substances. In addition, when distilling off a small amount of environmentally controlled substances, it is also useful to azeotrope with a solvent having the same boiling point as the solvent in order to increase efficiency. In addition, when a compound having radical polymerizability is contained, a polymerization inhibitor or the like may be added and removed by vacuum distillation to suppress intermolecular crosslinking caused by radical polymerization reaction during vacuum distillation. These distillation removal methods can be used at the stage of raw materials, at the stage of products made by reacting raw materials (such as polymerized resin solutions, multifunctional monomer solutions), or at the stage of hardening compositions produced by mixing these compounds, etc. implemented at any stage.

<顏料衍生物> 本揭示之硬化性組成物能夠含有顏料衍生物。顏料衍生物例如可用作分散助劑。作為顏料衍生物,可舉出具有色素骨架上鍵結了酸基或鹼基之結構之化合物。 <Pigment Derivatives> The curable composition of the present disclosure can contain pigment derivatives. Pigment derivatives can be used, for example, as dispersing aids. Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton.

作為構成顏料衍生物之色素骨架,可舉出喹啉色素骨架、苯并咪唑酮色素骨架、苯并吲哚色素骨架、苯并噻唑色素骨架、亞銨(iminium)色素骨架、方酸菁色素骨架、克酮鎓色素骨架、氧雜菁色素骨架、吡咯并吡咯色素骨架、二酮吡咯并吡咯色素骨架、偶氮色素骨架、甲亞胺色素骨架、酞菁色素骨架、萘酞菁色素骨架、蒽醌色素骨架、喹吖酮色素骨架、二㗁𠯤色素骨架、紫環酮色素骨架、苝色素骨架、硫靛藍色素骨架、異吲哚啉色素骨架、異吲哚啉酮色素骨架、喹啉黃色素骨架、二硫醇色素骨架、三芳基甲烷色素骨架、吡咯亞甲基色素骨架等。Examples of the dye skeleton constituting the pigment derivative include a quinoline dye skeleton, a benzimidazolone dye skeleton, a benzindole dye skeleton, a benzothiazole dye skeleton, an iminium dye skeleton, and a squarylium dye skeleton. , crotonium dye skeleton, oxonol dye skeleton, pyrrolopyrrole dye skeleton, diketopyrrolopyrrole dye skeleton, azo dye skeleton, formimine dye skeleton, phthalocyanine dye skeleton, naphthalocyanine dye skeleton, anthracene Quinone pigment skeleton, quinacridone pigment skeleton, dioxane pigment skeleton, perylene pigment skeleton, thioindigo pigment skeleton, isoindoline pigment skeleton, isoindolinone pigment skeleton, quinoline yellow pigment skeleton, dithiol dye skeleton, triarylmethane dye skeleton, pyrromethene dye skeleton, etc.

作為酸基,可舉出羧基、磺基、磷酸基、硼酸基、羧酸醯胺基、磺酸醯胺基、醯亞胺酸基及該等的鹽等。作為構成鹽之原子或原子團,可舉出鹼金屬離子(Li +、Na +、K +等)、鹼土類金屬離子(Ca 2+、Mg 2+等)、銨離子、咪唑鎓離子、吡啶鎓離子、鏻離子等。作為羧酸醯胺基,由-NHCOR X1表示之基團為較佳。作為磺酸醯胺基,由-NHSO 2R X2表示之基團為較佳。作為醯亞胺酸基,由-SO 2NHSO 2R X3、-CONHSO 2R X4、-CONHCOR X5或-SO 2NHCOR X6表示之基團為較佳,-SO 2NHSO 2R X3為更佳。R X1~R X6分別獨立地表示烷基或芳基。R X1~R X6所表示之烷基及芳基可以具有取代基。作為取代基,鹵素原子為較佳,氟原子為更佳。 Examples of the acid group include a carboxyl group, a sulfo group, a phosphoric acid group, a boronic acid group, a carboxylic acid amido group, a sulfonamide acid group, an imidic acid group, and salts thereof. The atoms or atomic groups constituting the salt include alkali metal ions (Li + , Na + , K +, etc.), alkaline earth metal ions (Ca 2+ , Mg 2+ , etc.), ammonium ions, imidazolium ions, pyridinium ions, etc. ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR X1 is preferable. As the sulfonamide group, a group represented by -NHSO 2 R X2 is preferable. As the imidic acid group, a group represented by -SO 2 NHSO 2 R X3 , -CONHSO 2 R X4 , -CONHCOR X5 or -SO 2 NHCOR X6 is preferable, and -SO 2 NHSO 2 R X3 is more preferable. R X1 to R X6 each independently represent an alkyl group or an aryl group. The alkyl and aryl groups represented by R X1 to R X6 may have a substituent. As the substituent, a halogen atom is preferable, and a fluorine atom is more preferable.

作為鹼基,可舉出胺基、吡啶基及其鹽、銨基的鹽以及酞醯亞胺甲基。作為構成鹽之原子或原子團,可舉出氫氧化物離子、鹵素離子、羧酸離子、磺酸離子、酚鹽離子等。Examples of the base include an amino group, a pyridyl group and salts thereof, ammonium group salts, and phthalimidomethyl group. Examples of the atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, phenoxide ions, and the like.

顏料衍生物亦能夠使用可見透明性優異之顏料衍生物(以下,亦稱為透明顏料衍生物)。透明顏料衍生物在400nm~700nm的波長區域內之莫耳吸光係數的最大值(εmax)為3,000L・mol -1・cm -1以下為較佳,1,000L・mol -1・cm -1以下為更佳,100L・mol -1・cm -1以下為進一步較佳。εmax的下限例如為1L・mol -1・cm -1以上,亦可以為10L・mol -1・cm -1以上。 Pigment derivatives can also use pigment derivatives excellent in visibility and transparency (hereinafter also referred to as transparent pigment derivatives). The maximum molar absorption coefficient (εmax) of transparent pigment derivatives in the wavelength region of 400nm to 700nm is preferably 3,000L・mol -1・cm -1 or less, and 1,000L・mol -1・cm -1 or less More preferably, less than 100L·mol -1 ·cm -1 is still more preferable. The lower limit of εmax is, for example, 1 L·mol −1 ·cm −1 or more, and may be 10 L·mol −1 ·cm −1 or more.

作為顏料衍生物的具體例,可舉出日本特開昭56-118462號公報中記載之化合物、日本特開昭63-264674號公報中記載之化合物、日本特開平01-217077號公報中記載之化合物、日本特開平03-009961號公報中記載之化合物、日本特開平03-026767號公報中記載之化合物、日本特開平03-153780號公報中記載之化合物、日本特開平03-045662號公報中記載之化合物、日本特開平04-285669號公報中記載之化合物、日本特開平06-145546號公報中記載之化合物、日本特開平06-212088號公報中記載之化合物、日本特開平06-240158號公報中記載之化合物、日本特開平10-030063號公報中記載之化合物、日本特開平10-195326號公報中記載之化合物、國際公開第2011/024896號的0086~0098段中記載之化合物、國際公開第2012/102399號的0063~0094段中記載之化合物、國際公開第2017/038252號的0082段中記載之化合物、日本特開2015-151530號公報的0171段中記載之化合物、日本特開2011-252065號公報的0162~0183段中記載之化合物、日本特開2003-081972號公報中記載之化合物、日本專利第5299151號公報中記載之化合物、日本特開2015-172732號公報中記載之化合物、日本特開2014-199308號公報中記載之化合物、日本特開2014-085562號公報中記載之化合物、日本特開2014-035351號公報中記載之化合物、日本特開2008-081565號公報中記載之化合物、日本特開2019-109512號公報中記載之化合物、日本特開2019-133154號公報中記載之化合物、國際公開第2020/002106號中記載之具有硫醇連結基之二酮吡咯并吡咯化合物、日本特開2018-168244號公報中記載之苯并咪唑酮化合物或該等的鹽。Specific examples of pigment derivatives include compounds described in JP-A-56-118462, compounds described in JP-A-63-264674, and compounds described in JP-A-01-217077. Compounds, compounds described in JP-A-03-009961, compounds described in JP-A-03-026767, compounds described in JP-A-03-153780, compounds described in JP-A-03-045662 Compounds described, compounds described in JP-A-04-285669, compounds described in JP-A-06-145546, compounds described in JP-A-06-212088, JP-A-06-240158 Compounds described in the gazette, compounds described in Japanese Patent Laid-Open No. 10-030063, compounds described in Japanese Patent Laid-Open No. 10-195326, compounds described in paragraphs 0086 to 0098 of International Publication No. 2011/024896, International Compounds described in paragraphs 0063 to 0094 of Publication No. 2012/102399, compounds described in paragraph 0082 of International Publication No. 2017/038252, compounds described in paragraph 0171 of JP-A-2015-151530, JP-A Compounds described in paragraphs 0162 to 0183 of Publication No. 2011-252065, compounds described in Japanese Patent Application Laid-Open No. 2003-081972, compounds described in Japanese Patent Publication No. 5299151, compounds described in Japanese Patent Application Publication No. 2015-172732 Compounds, compounds described in JP 2014-199308 A, compounds described in JP 2014-085562 A, compounds described in JP 2014-035351 A, JP 2008-081565 A Compounds described, compounds described in JP-A-2019-109512, compounds described in JP-A-2019-133154, diketopyrroloxyls having a thiol linking group described in International Publication No. 2020/002106 Pyrrole compounds, benzimidazolone compounds described in JP-A-2018-168244, or salts thereof.

顏料衍生物的含量相對於著色劑100質量份,1質量份~30質量份為較佳,3質量份~20質量份為更佳。又,顏料衍生物與著色劑的合計含量相對於硬化性組成物的總固體成分,35質量%以上為較佳,40質量%以上為更佳,45質量%以上為進一步較佳,50質量%以上為特佳。上限為70質量%以下為較佳,65質量%以下為更佳。顏料衍生物可以單獨使用1種,亦可以同時使用2種以上。The content of the pigment derivative is preferably from 1 to 30 parts by mass, more preferably from 3 to 20 parts by mass, based on 100 parts by mass of the colorant. In addition, the total content of the pigment derivative and the colorant is preferably at least 35% by mass, more preferably at least 40% by mass, more preferably at least 45% by mass, and even more preferably at least 50% by mass, based on the total solid content of the curable composition. The above is excellent. The upper limit is preferably at most 70% by mass, more preferably at most 65% by mass. A pigment derivative may be used individually by 1 type, and may use 2 or more types together.

<聚伸烷基亞胺> 本揭示之硬化性組成物能夠含有聚伸烷基亞胺。聚伸烷基亞胺例如可用作顏料的分散助劑。分散助劑係指用於在硬化性組成物中提高顏料的分散性之材料。聚伸烷基亞胺係指將伸烷基亞胺開環聚合而成且至少具有二級胺基之聚合物。聚伸烷基亞胺除了包含二級胺基以外,亦可以包含一級胺基或三級胺基。聚伸烷基亞胺為具有分別包含一級胺基、二級胺基及三級胺基之支鏈結構之聚合物為較佳。伸烷基亞胺的碳數為2~6為較佳,2~4為更佳,2或3為進一步較佳,2為特佳。 <Polyalkyleneimine> The curable composition of the present disclosure can contain polyalkyleneimine. Polyalkyleneimines can be used, for example, as dispersing aids for pigments. A dispersing aid refers to a material used to improve the dispersibility of a pigment in a curable composition. Polyalkyleneimine refers to a polymer formed by ring-opening polymerization of alkyleneimine and having at least a secondary amine group. The polyalkyleneimine may contain primary or tertiary amine groups in addition to secondary amine groups. It is preferable that the polyalkyleneimine is a polymer having a branched chain structure respectively including primary amine groups, secondary amine groups and tertiary amine groups. The carbon number of the alkyleneimine is preferably 2-6, more preferably 2-4, further preferably 2 or 3, and particularly preferably 2.

聚伸烷基亞胺的分子量為200以上為較佳,250以上為更佳。上限為100,000以下為較佳,50,000以下為更佳,10,000以下為進一步較佳,2,000以下為特佳。另外,關於聚伸烷基亞胺的分子量的值,能夠由結構式計算分子量時,聚伸烷基亞胺的分子量為由結構式計算之值。另一方面,特定胺化合物的分子量無法由結構式計算或不易計算時,使用藉由沸點上升法測定之數量平均分子量的值。又,藉由沸點上升法亦無法測定或不易測定時,使用藉由黏度法測定之數量平均分子量的值。又,藉由黏度法亦無法測定或藉由黏度法不易測定時,使用以藉由GPC(凝膠滲透層析)法測定之聚苯乙烯換算值計之數量平均分子量的值。The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably at most 100,000, more preferably at most 50,000, further preferably at most 10,000, and particularly preferably at most 2,000. In addition, when the molecular weight of polyalkyleneimine can be calculated from a structural formula about the value of the molecular weight of a polyalkyleneimine, the molecular weight of a polyalkyleneimine is the value calculated from a structural formula. On the other hand, when the molecular weight of the specific amine compound cannot be calculated from the structural formula or is difficult to calculate, the value of the number average molecular weight measured by the boiling point increase method is used. In addition, when it is impossible or difficult to measure by the boiling point elevation method, the value of the number average molecular weight measured by the viscosity method is used. Moreover, when it cannot measure by a viscosity method or it is difficult to measure by a viscosity method, the value of the number average molecular weight in terms of the polystyrene conversion value measured by the GPC (gel permeation chromatography) method is used.

聚伸烷基亞胺的胺值為5mmol/g以上為較佳,10mmol/g以上為更佳,15mmol/g以上為進一步較佳。The amine value of the polyalkyleneimine is preferably at least 5 mmol/g, more preferably at least 10 mmol/g, and still more preferably at least 15 mmol/g.

作為伸烷基亞胺的具體例,可舉出乙烯亞胺、丙烯亞胺、1,2-丁烯亞胺、2,3-丁烯亞胺等,乙烯亞胺或丙烯亞胺為較佳,乙烯亞胺為更佳。聚伸烷基亞胺為聚乙烯亞胺為特佳。又,聚乙烯亞胺中,相對於一級胺基、二級胺基及三級胺基的合計,一級胺基包含10莫耳%以上為較佳,包含20莫耳%以上為更佳,包含30莫耳%以上為進一步較佳。作為聚乙烯亞胺的市售品,可舉出EPOMIN SP-003、SP-006、SP-012、SP-018、SP-200、P-1000(以上,NIPPON SHOKUBAI CO.,LTD.製)等。Specific examples of alkyleneimine include ethyleneimine, propyleneimine, 1,2-buteneimine, 2,3-buteneimine, etc., and ethyleneimine or propyleneimine is preferable. , ethyleneimine is more preferred. The polyalkyleneimine is particularly preferably polyethyleneimine. In addition, in polyethyleneimine, it is preferable that the primary amine group contains 10 mol% or more, more preferably 20 mol% or more, and contains More than 30 mol % is more preferable. Examples of commercially available polyethyleneimines include EPOMIN SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (manufactured by NIPPON SHOKUBAI CO., LTD.). .

硬化性組成物的總固體成分中的聚伸烷基亞胺的含量為0.1質量%~5質量%為較佳。下限為0.2質量%以上為更佳,0.5質量%以上為進一步較佳,1質量%以上為特佳。上限為4.5質量%以下為更佳,4質量%以下為進一步較佳,3質量%以下為特佳。又,聚伸烷基亞胺的含量相對於顏料100質量份,0.5質量份~20質量份為較佳。下限為0.6質量份以上為更佳,1質量份以上為進一步較佳,2質量份以上為特佳。上限為10質量份以下為更佳,8質量份以下為進一步較佳。聚伸烷基亞胺可以僅使用1種,亦可以使用2種以上。在使用2種以上時,該等的合計量在上述範圍內為較佳。The content of the polyalkyleneimine in the total solid content of the curable composition is preferably 0.1% by mass to 5% by mass. The lower limit is more preferably 0.2 mass % or more, still more preferably 0.5 mass % or more, and particularly preferably 1 mass % or more. The upper limit is more preferably 4.5 mass % or less, still more preferably 4 mass % or less, and particularly preferably 3 mass % or less. In addition, the content of the polyalkyleneimine is preferably 0.5 to 20 parts by mass relative to 100 parts by mass of the pigment. The lower limit is more preferably at least 0.6 parts by mass, still more preferably at least 1 part by mass, and particularly preferably at least 2 parts by mass. The upper limit is more preferably 10 parts by mass or less, and is still more preferably 8 parts by mass or less. The polyalkyleneimine may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

<硬化促進劑> 本揭示之硬化性組成物能夠含有硬化促進劑。作為硬化促進劑,可舉出硫醇化合物、羥甲基化合物、胺化合物、鏻鹽化合物、脒鹽化合物、醯胺化合物、鹼產生劑、異氰酸酯化合物、烷氧基矽烷化合物、鎓鹽化合物等。作為硬化促進劑的具體例,可舉出國際公開第2018/056189號的0094~0097段中記載之化合物、日本特開2015-034963號公報的0246~0253段中記載之化合物、日本特開2013-041165號公報的0186~0251段中記載之化合物、日本特開2014-055114號公報中記載之離子性化合物、日本特開2012-150180號公報的0071~0080段中記載之化合物、日本特開2011-253054號公報中記載之具有環氧基之烷氧基矽烷化合物、日本專利第5765059號公報的0085~0092段中記載之化合物、日本特開2017-036379號公報中記載之含有羧基之環氧硬化劑等。硬化性組成物的總固體成分中的硬化促進劑的含量為0.3質量%~8.9質量%為較佳,0.8質量%~6.4質量%為更佳。 <Hardening Accelerator> The curable composition of the present disclosure can contain a curing accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine salt compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, onium salt compounds, and the like. Specific examples of the hardening accelerator include compounds described in paragraphs 0094 to 0097 of International Publication No. 2018/056189, compounds described in paragraphs 0246 to 0253 of JP 2015-034963 A, JP 2013 - Compounds described in paragraphs 0186 to 0251 of JP-041165, ionic compounds described in JP-A-2014-055114, compounds described in JP-A-2012-150180, paragraphs 0071-0080, JP-A Alkoxysilane compounds having an epoxy group described in Publication No. 2011-253054, compounds described in paragraphs 0085 to 0092 of Japanese Patent No. 5765059, rings containing carboxyl groups described in Japanese Patent Application Laid-Open No. 2017-036379 Oxygen Hardener etc. The content of the hardening accelerator in the total solid content of the curable composition is preferably 0.3% by mass to 8.9% by mass, more preferably 0.8% by mass to 6.4% by mass.

<紅外線吸收劑> 本揭示之硬化性組成物能夠含有紅外線吸收劑。例如,使用本揭示之硬化性組成物形成紅外線透射濾波器時,關於藉由在硬化性組成物中含有紅外線吸收劑而獲得之膜,能夠使透射光的波長轉變為更長波長側。紅外線吸收劑為在比波長700nm更長的波長側具有極大吸收波長之化合物為較佳。紅外線吸收劑為在超過波長700nm且1800nm以下的範圍內具有極大吸收波長之化合物為較佳。又,紅外線吸收劑在波長500nm處的吸光度A 1與在極大吸收波長處的吸光度A 2之比A 1/A 2為0.08以下為較佳,0.04以下為更佳。 <Infrared Absorber> The curable composition of the present disclosure may contain an infrared absorber. For example, when an infrared transmission filter is formed using the curable composition of the present disclosure, the wavelength of transmitted light can be shifted to a longer wavelength side for a film obtained by including an infrared absorber in the curable composition. The infrared absorber is preferably a compound having a maximum absorption wavelength on the longer wavelength side than the wavelength of 700 nm. The infrared absorbing agent is preferably a compound having a maximum absorption wavelength in a range from 700 nm to 1800 nm. Also, the ratio A 1 / A 2 of the absorbance A 1 at a wavelength of 500 nm to the absorbance A 2 at the maximum absorption wavelength of the infrared absorber is preferably 0.08 or less, more preferably 0.04 or less.

作為紅外線吸收劑,可舉出吡咯并吡咯化合物、花青化合物、方酸菁化合物、酞青化合物、萘酞青化合物、夸特銳烯(quaterrylene)化合物、部花青化合物、克酮鎓化合物、氧雜菁化合物、亞銨化合物、二硫醇化合物、三芳基甲烷化合物、吡咯亞甲基化合物、甲亞胺化合物、蒽醌化合物、二苯并呋喃酮化合物、二硫烯金屬錯合物、金屬氧化物、金屬硼化物等。作為吡咯并吡咯化合物,可舉出日本特開2009-263614號公報的0016~0058段中記載之化合物、日本特開2011-068731號公報的0037~0052段中記載之化合物、國際公開第2015/166873號的0010~0033段中記載之化合物等。作為方酸菁化合物,可舉出日本特開2011-208101號公報的0044~0049段中記載之化合物、日本專利第6065169號公報的0060~0061段中記載之化合物、國際公開第2016/181987號的0040段中記載之化合物、日本特開2015-176046號公報中記載之化合物、國際公開第2016/190162號的0072段中記載之化合物、日本特開2016-074649號公報的0196~0228段中記載之化合物、日本特開2017-067963號公報的0124段中記載之化合物、國際公開第2017/135359號中記載之化合物、日本特開2017-114956號公報中記載之化合物、日本專利6197940號公報中記載之化合物、國際公開第2016/120166號中記載之化合物等。作為花青化合物,可舉出日本特開2009-108267號公報的0044~0045段中記載之化合物、日本特開2002-194040號公報的0026~0030段中記載之化合物、日本特開2015-172004號公報中記載之化合物、日本特開2015-172102號公報中記載之化合物、日本特開2008-088426號公報中記載之化合物、國際公開第2016/190162號的0090段中記載之化合物、日本特開2017-031394號公報中記載之化合物等。作為克酮鎓化合物,可舉出日本特開2017-082029號公報中記載之化合物。作為亞銨化合物,例如可舉出日本特表2008-528706號公報中記載之化合物、日本特開2012-012399號公報中記載之化合物、日本特開2007-092060號公報中記載之化合物、國際公開第2018/043564號的0048~0063段中記載之化合物。作為酞菁化合物,可舉出日本特開2012-077153號公報的0093段中記載之化合物、日本特開2006-343631號公報中記載之酞菁氧鈦、日本特開2013-195480號公報的0013~0029段中記載之化合物、日本專利第6081771號公報中記載之釩酞菁化合物、國際公開第2020/071486號中記載之釩酞菁化合物、國際公開第2020/071470號中記載之酞菁化合物。作為萘酞菁化合物,可舉出日本特開2012-077153號公報的0093段中記載之化合物。作為二硫烯金屬錯合物,可舉出日本專利第5733804號公報中記載之化合物。作為金屬氧化物,例如可舉出氧化銦錫、氧化銻錫、氧化鋅、Al摻雜氧化鋅、氟摻雜二氧化錫、鈮摻雜二氧化鈦、氧化鎢等。關於氧化鎢的詳細內容,能夠參考日本特開2016-006476號公報的0080段,該內容編入本說明書中。作為金屬硼化物,可舉出硼化鑭等。作為硼化鑭的市售品,可舉出LaB 6-F(Japan New Metals Co.,Ltd.製)等。又,作為金屬硼化物,亦能夠使用國際公開第2017/119394號中記載之化合物。作為氧化銦錫的市售品,可舉出F-ITO(DOWA HIGHTECH CO.,LTD.製)等。 Examples of infrared absorbers include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, crotonium compounds, Oxygenol compounds, imonium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, amethanimine compounds, anthraquinone compounds, dibenzofuranone compounds, disulfide metal complexes, metal oxides, metal borides, etc. Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614 , compounds described in paragraphs 0037-0052 of JP-A-2011-068731 , international publication 2015/ Compounds described in paragraphs 0010 to 0033 of No. 166873, etc. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of JP-A-2011-208101, compounds described in paragraphs 0060-0061 of JP-A-6065169, WO2016/181987 Compounds described in paragraph 0040 of JP-A-2015-176046, compounds described in paragraph 0072 of International Publication No. 2016/190162, and paragraphs 0196-0228 of JP-A-2016-074649 Compounds described, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in International Publication No. 2017/135359, compounds described in JP-A-2017-114956, JP-A-6197940 Compounds described in , compounds described in International Publication No. 2016/120166, etc. Examples of cyanine compounds include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, JP 2015-172004 Compounds described in Publication No. 2015-172102, Compounds described in Japanese Patent Application Publication No. 2008-088426, Compounds described in Paragraph 0090 of International Publication No. 2016/190162, Japanese Patent Application Laid-Open No. Compounds described in Publication No. 2017-031394, etc. Examples of the crotonium compound include compounds described in JP-A-2017-082029. Examples of iminium compounds include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, compounds described in JP-A-2007-092060, international publications Compounds described in paragraphs 0048 to 0063 of No. 2018/043564. Examples of the phthalocyanine compound include the compound described in paragraph 0093 of JP-A-2012-077153, the oxytitanium phthalocyanine described in JP-A-2006-343631, and the compound described in JP-A-2013-195480. Compounds described in paragraphs ~0029, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, vanadium phthalocyanine compounds described in International Publication No. 2020/071486, phthalocyanine compounds described in International Publication No. 2020/071470 . As a naphthalocyanine compound, the compound described in paragraph 0093 of Unexamined-Japanese-Patent No. 2012-077153 is mentioned. Examples of the disulfide metal complexes include compounds described in Japanese Patent No. 5733804 . Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details of tungsten oxide, paragraph 0080 of JP-A-2016-006476 can be referred to, and this content is incorporated in this specification. Lanthanum boride etc. are mentioned as a metal boride. Commercially available lanthanum borides include LaB 6 -F (manufactured by Japan New Metals Co., Ltd.) and the like. In addition, as the metal boride, the compound described in International Publication No. 2017/119394 can also be used. As a commercial item of indium tin oxide, F-ITO (made by DOWA HIGHTECH CO., LTD.) etc. are mentioned.

又,作為紅外線吸收劑,亦能夠使用日本特開2017-197437號公報中記載之方酸菁化合物、日本特開2017-025311號公報中記載之方酸菁化合物、國際公開第2016/154782號中記載之方酸菁化合物、日本專利第5884953號公報中記載之方酸菁化合物、日本專利第6036689號公報中記載之方酸菁化合物、日本專利第5810604號公報中記載之方酸菁化合物、國際公開第2017/213047號的0090~0107段中記載之方酸菁化合物、日本特開2018-054760號公報的0019~0075段中記載之含吡咯環化合物、日本特開2018-040955號公報的0078~0082段中記載之含吡咯環化合物、日本特開2018-002773號公報的0043~0069段中記載之含吡咯環化合物、日本特開2018-041047號公報的0024~0086段中記載之在醯胺α位具有芳香環之方酸菁化合物、日本特開2017-179131號公報中記載之醯胺連結型方酸菁化合物、日本特開2017-141215號公報中記載之具有吡咯雙型方酸菁骨架或克酮鎓骨架之化合物、日本特開2017-082029號公報中記載之二氫咔唑雙型方酸菁化合物、日本特開2017-068120號公報的0027~0114段中記載之非對稱型化合物、日本特開2017-067963號公報中記載之含吡咯環化合物(咔唑型)、日本專利第6251530號公報中記載之酞菁化合物、國際公開第2021/049441號的0144~0146段中記載之化合物等。In addition, as an infrared absorber, the squarylium compound described in JP-A-2017-197437, the squarylium compound described in JP-A-2017-025311, and the squaraine compound described in JP-A-2016/154782 can also be used. The squarylium compound described in Japanese Patent No. 5884953, the squarylium compound described in Japanese Patent No. 6036689, the squaraine compound described in Japanese Patent No. 5810604, the international The squaraine compound described in paragraphs 0090 to 0107 of Publication No. 2017/213047, the pyrrole ring-containing compound described in paragraphs 0019 to 0075 of Japanese Patent Application Laid-Open No. 2018-054760, and the 0078 Pyrrole ring-containing compounds described in paragraphs 0082 to 0082, pyrrole ring-containing compounds described in paragraphs 0043 to 0069 of JP-A-2018-002773, acylic acid compounds described in paragraphs 0024-0086 of JP-A-2018-041047 A squaraine compound having an aromatic ring at the amine α-position, an amide-linked squaraine compound described in JP-A-2017-179131, and a squaraine compound having a pyrrole double type described in JP-A-2017-141215 Skeleton or crotonium skeleton compound, dihydrocarbazole double-type squaraine compound described in JP-A-2017-082029, asymmetric type described in paragraphs 0027-0114 of JP-A-2017-068120 Compound, pyrrole ring-containing compound (carbazole type) described in JP-A-2017-067963, phthalocyanine compound described in JP-A-6251530, paragraphs 0144-0146 of International Publication No. 2021/049441 compounds etc.

紅外線吸收劑在硬化性組成物的總固體成分中的含量為1質量%~40質量%為較佳。下限為2質量%以上為更佳,5質量%以上為進一步較佳,10質量%以上為特佳。上限為30質量%以下為更佳,25質量%以下為進一步較佳。本揭示之硬化性組成物可以僅包含1種紅外線吸收劑,亦可以包含2種以上。包含2種以上的紅外線吸收劑時,該等的合計量在上述範圍內為較佳。The content of the infrared absorber in the total solid content of the curable composition is preferably 1% by mass to 40% by mass. The lower limit is more preferably 2% by mass or more, still more preferably 5% by mass or more, and particularly preferably 10% by mass or more. The upper limit is more preferably at most 30% by mass, and more preferably at most 25% by mass. The curable composition of this disclosure may contain only one kind of infrared absorbing agent, or may contain two or more kinds. When two or more types of infrared absorbers are included, the total amount of these is preferably within the above range.

<紫外線吸收劑> 本揭示之硬化性組成物能夠含有紫外線吸收劑。作為紫外線吸收劑,可舉出共軛二烯化合物、胺基二烯化合物、水楊酸酯化合物、二苯甲酮化合物、苯并三唑化合物、丙烯腈化合物、羥苯基三𠯤化合物、吲哚化合物、三𠯤化合物等。作為此類化合物的具體例,可舉出日本特開2009-217221號公報的0038~0052段、日本特開2012-208374號公報的0052~0072段、日本特開2013-068814號公報的0317~0334段、日本特開2016-162946號公報的0061~0080段中記載之化合物,該等內容編入本說明書中。作為紫外線吸收劑的市售品,例如,可舉出UV-503(DAITO CHEMICAL CO.,LTD.製)、BASF公司製Tinuvin系列、Uvinul系列、Sumika Chemtex Company製Sumisorb系列等。又,作為苯并三唑化合物,可舉出MIYOSHI OIL & FAT CO.,LTD.製MYUA系列(化學工業日報,2016年2月1日)。又,紫外線吸收劑亦能夠使用日本專利第6268967號公報的0049~0059段中記載之化合物、國際公開第2016/181987號的0059~0076段中記載之化合物、國際公開第2020/137819號中記載之硫芳基取代苯并三唑型紫外線吸收劑。紫外線吸收劑在硬化性組成物的總固體成分中的含量為0.01質量%~10質量%為較佳,0.01質量%~5質量%為更佳。紫外線吸收劑可以僅使用1種,亦可以使用2種以上。使用2種以上時,該等的合計量在上述範圍內為較佳。 <UV absorbers> The curable composition of the present disclosure can contain an ultraviolet absorber. Examples of ultraviolet absorbers include conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriene compounds, indoles Indole compounds, three 𠯤 compounds, etc. Specific examples of such compounds include paragraphs 0038 to 0052 of JP 2009-217221 , paragraphs 0052 to 0072 of JP 2012-208374 , and paragraphs 0317 to 0072 of JP 2013-068814 . Paragraph 0334 and the compounds described in paragraphs 0061 to 0080 of JP-A-2016-162946 are incorporated in this specification. Examples of commercially available ultraviolet absorbers include UV-503 (manufactured by DAITO CHEMICAL CO., LTD.), Tinuvin series and Uvinul series produced by BASF Corporation, Sumika Chemtex Company Sumisorb series, and the like. Moreover, as a benzotriazole compound, MYUA series by MIYOSHI OIL & FAT CO., LTD. is mentioned (Chemical Industry Daily, February 1, 2016). In addition, as the ultraviolet absorber, compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059 to 0076 of International Publication No. 2016/181987, and compounds described in International Publication No. 2020/137819 can also be used. A thioaryl substituted benzotriazole type UV absorber. The content of the ultraviolet absorber in the total solid content of the curable composition is preferably 0.01% by mass to 10% by mass, more preferably 0.01% by mass to 5% by mass. The ultraviolet absorber may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

<聚合抑制劑> 本揭示之硬化性組成物能夠含有聚合抑制劑。作為聚合抑制劑,可舉出氫醌、對甲氧基苯酚、二-三級丁基-對甲酚、五倍子酚、三級丁基鄰苯二酚、苯醌、4,4’-硫代雙(3-甲基-6-三級丁基苯酚)、2,2’-亞甲基雙(4-甲基-6-三級丁基苯酚)、N-亞硝基苯基羥胺鹽(銨鹽、第一鈰鹽等)。其中,對甲氧基苯酚為較佳。硬化性組成物的總固體成分中的聚合抑制劑的含量為0.0001質量%~5質量%為較佳。 聚合抑制劑可以僅為1種,亦可以為2種以上。2種以上的情況下,該等的合計量在上述範圍內為較佳。 <Polymerization inhibitor> The curable composition of the present disclosure can contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, gallicol, tertiary butylcatechol, benzoquinone, 4,4'-thio Bis(3-methyl-6-tertiary butylphenol), 2,2'-methylene bis(4-methyl-6-tertiary butylphenol), N-nitrosophenyl hydroxylamine salt ( ammonium salt, first cerium salt, etc.). Among them, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the curable composition is preferably 0.0001% by mass to 5% by mass. A polymerization inhibitor may be only 1 type, and may be 2 or more types. In the case of 2 or more, it is preferable that the total amount of these is within the said range.

<矽烷偶合劑> 本揭示之硬化性組成物能夠含有矽烷偶合劑。本揭示中,矽烷偶合劑係指具有水解性基和除其以外的官能基之矽烷化合物。又,水解性基係指與矽原子直接鍵結,並能夠藉由水解反應及縮合反應中的至少一種而產生矽氧烷鍵之取代基。作為水解性基,可舉出鹵素原子、烷氧基、醯氧基等,烷氧基為較佳。亦即,矽烷偶合劑為具有烷氧基矽基之化合物為較佳。又,作為水解性基以外的官能基,例如,可舉出乙烯基、(甲基)烯丙基、(甲基)丙烯醯基、巰基、環氧基、氧環丁烷基、胺基、脲基、硫醚基、異氰酸酯基、苯基等,胺基、(甲基)丙烯醯基及環氧基為較佳。作為矽烷偶合劑的具體例,有N-β-胺基乙基-γ-胺基丙基甲基二甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,產品名KBM-602)、N-β-胺基乙基-γ-胺基丙基三甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,產品名KBM-603)、N-β-胺基乙基-γ-胺基丙基三乙氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,產品名KBE-602)、γ-胺基丙基三甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,產品名KBM-903)、γ-胺基丙基三乙氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,產品名KBE-903)、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,產品名KBM-502)、3-甲基丙烯醯氧基丙基三甲氧基矽烷(Shin-Etsu Chemical Co.,Ltd.製,產品名KBM-503)等。又,關於矽烷偶合劑的具體例,可舉出日本特開2009-288703號公報的0018~0036段中記載之化合物、日本特開2009-242604號公報的0056~0066段中記載之化合物,該等內容編入本說明書中。硬化性組成物的總固體成分中的矽烷偶合劑的含量為0.01質量%~15.0質量%為較佳,0.05質量%~10.0質量%為更佳。 矽烷偶合劑可以僅為1種,亦可以為2種以上。2種以上的情況下,該等的合計量在上述範圍內為較佳。 <Silane coupling agent> The curable composition of the present disclosure can contain a silane coupling agent. In this disclosure, a silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. Also, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, an acyloxy group, and the like, and an alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)allyl groups, (meth)acryl groups, mercapto groups, epoxy groups, oxetanyl groups, amino groups, Urea group, thioether group, isocyanate group, phenyl group, etc., amine group, (meth)acryl group and epoxy group are preferred. Specific examples of the silane coupling agent include N-β-aminoethyl-γ-aminopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-602), N-β-aminoethyl-γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-603), N-β-aminoethyl-γ-amine propyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-602), γ-aminopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-903), γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBE-903), 3-methacryloxypropylmethyl dimethyl Oxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-502), 3-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-503), etc. Also, specific examples of silane coupling agents include compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraphs 0056-0066 of JP-A-2009-242604. etc. are included in this manual. The content of the silane coupling agent in the total solid content of the curable composition is preferably 0.01% by mass to 15.0% by mass, more preferably 0.05% by mass to 10.0% by mass. Only 1 type may be sufficient as a silane coupling agent, and 2 or more types may be sufficient as it. In the case of 2 or more, it is preferable that the total amount of these is within the said range.

<界面活性劑> 本揭示之硬化性組成物能夠含有界面活性劑。作為界面活性劑,能夠使用氟系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、陰離子系界面活性劑、聚矽氧系界面活性劑等各種界面活性劑。界面活性劑為聚矽氧系界面活性劑或氟系界面活性劑為較佳。關於界面活性劑,能夠參考國際公開第2015/166779號的0238~0245段中記載之界面活性劑,該內容編入本說明書中。 <Surfactant> The curable composition of the present disclosure can contain a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and polysiloxane-based surfactants can be used. The surfactant is preferably a polysiloxane-based surfactant or a fluorine-based surfactant. Regarding the surfactant, the surfactants described in paragraphs 0238 to 0245 of International Publication No. 2015/166779 can be referred to, and the content is incorporated in this specification.

氟系界面活性劑中的氟含有率為3質量%~40質量%為較佳,更佳為5質量%~30質量%,特佳為7質量%~25質量%。含氟率在該範圍內之氟系界面活性劑在塗佈膜的厚度均勻性和省液性方面有效,在硬化性組成物中的溶解性亦良好。The fluorine content in the fluorine-based surfactant is preferably 3% by mass to 40% by mass, more preferably 5% by mass to 30% by mass, particularly preferably 7% by mass to 25% by mass. A fluorine-based surfactant having a fluorine content within this range is effective in uniformity of coating film thickness and liquid-saving properties, and has good solubility in curable compositions.

作為氟系界面活性劑,可舉出日本特開2014-041318號公報的0060~0064段(對應之國際公開第2014/017669號的0060~0064段)等中記載之界面活性劑、日本特開2011-132503號公報的0117~0132段中記載之界面活性劑、日本特開2020-008634號公報中記載之界面活性劑,該內容編入本說明書中。作為氟系界面活性劑的市售品,例如,可舉出MEGAFACE F-171、F-172、F-173、F-176、F-177、F-141、F-142、F-143、F-144、F-437、F-475、F-477、F-479、F-482、F-554、F-555-A、F-556、F-557、F-558、F-559、F-560、F-561、F-565、F-563、F-568、F-575、F-780、EXP、MFS-330、R-01、R-40、R-40-LM、R-41、R-41-LM、RS-43、R-43、TF-1956、RS-90、R-94、RS-72-K、DS-21(以上為DIC Corporation製)、FLUORAD FC430、FC431、FC171(以上為Sumitomo 3M Limited製)、SURFLON S-382、SC-101、SC-103、SC-104、SC-105、SC-1068、SC-381、SC-383、S-393、KH-40(以上為AGC INC.製)、PolyFox PF636、PF656、PF6320、PF6520、PF7002(以上為OMNOVA SOLUTIONS INC.製)、Futurgent 208G、215M、245F、601AD、601ADH2、602A、610FM、710FL、710FM、710FS、FTX-218(以上為NEOS COMPANY LIMITED製)等。Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP-A-2014-041318 (corresponding to paragraphs 0060-0064 of International Publication No. 2014/017669), etc., JP-A The surfactants described in Paragraphs 0117 to 0132 of Publication No. 2011-132503 and the surfactants described in Japanese Patent Application Laid-Open No. 2020-008634 are incorporated in this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F -144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F -560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41 , R-41-LM, RS-43, R-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (the above are manufactured by DIC Corporation), FLUORAD FC430, FC431, FC171 (The above are manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 ( The above are made by AGC INC.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (the above are made by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FT x -218 (the above are manufactured by NEOS COMPANY LIMITED), etc.

氟系界面活性劑亦能夠較佳地使用丙烯酸系化合物,該丙烯酸系化合物具有包含含有氟原子之官能基之分子結構,且在加熱時含有氟原子之官能基的部分被切斷而氟原子揮發。作為此類氟系界面活性劑,可舉出DIC Corporation製MEGAFACE DS系列(化學工業日報(2016年2月22日)、日經產業新聞(2016年2月23日)),例如可舉出MEGAFACE DS-21。The fluorine-based surfactant can also preferably use an acrylic compound that has a molecular structure including a functional group containing a fluorine atom, and when heated, the portion of the functional group containing a fluorine atom is cut off and the fluorine atom volatilizes. . Examples of such fluorine-based surfactants include MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, MEGAFACE DS-21.

氟系界面活性劑使用具有氟化烷基或氟化伸烷基醚基之含氟原子乙烯基醚化合物與親水性乙烯基醚化合物的聚合物亦較佳。此類氟系界面活性劑可舉出日本特開2016-216602號公報中記載之氟系界面活性劑,該內容編入本說明書中。It is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorine-based surfactant. Examples of such fluorine-based surfactants include fluorine-based surfactants described in JP-A-2016-216602, which are incorporated in this specification.

氟系界面活性劑亦能夠使用嵌段聚合物。氟系界面活性劑亦能夠較佳地使用含氟高分子化合物,該含氟高分子化合物包含:源自具有氟原子之(甲基)丙烯酸酯化合物之重複單元;及源自具有2個以上(較佳為5個以上)伸烷氧基(較佳為乙烯氧基、丙烯氧基)之(甲基)丙烯酸酯化合物之重複單元。又,日本特開2010-032698號公報的0016~0037段中記載之含氟界面活性劑、下述化合物亦例示為本揭示中使用之氟系界面活性劑。A block polymer can also be used as a fluorine-type surfactant. The fluorine-based surfactant can also preferably use a fluorine-containing polymer compound, which contains: a repeating unit derived from a (meth)acrylate compound having a fluorine atom; It is preferably a repeating unit of (meth)acrylate compound having 5 or more) alkyleneoxy groups (preferably ethyleneoxy, propyleneoxy). In addition, the fluorine-containing surfactant described in paragraphs 0016 to 0037 of JP-A-2010-032698 and the following compounds are also exemplified as the fluorine-based surfactant used in the present disclosure.

[化學式43]

Figure 02_image086
[chemical formula 43]
Figure 02_image086

上述化合物的重量平均分子量較佳為3,000~50,000,例如為14,000。上述化合物中,表示重複單元的比例之%為莫耳%。The weight average molecular weight of the above-mentioned compound is preferably 3,000-50,000, for example, 14,000. In the above-mentioned compounds, % representing the ratio of repeating units is mole %.

又,氟系界面活性劑亦能夠使用側鏈具有乙烯性不飽和基之含氟聚合物。作為具體例,可舉出日本特開2010-164965號公報的0050~0090段及0289~0295段中記載之化合物、DIC Corporation製MEGAFACE RS-101、RS-102、RS-718K、RS-72-K等。又,氟系界面活性劑亦能夠使用日本特開2015-117327號公報的0015~0158段中記載之化合物。In addition, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated group in a side chain can also be used. Specific examples include compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102, RS-718K, RS-72- K et al. Moreover, the compound described in paragraph 0015-0158 of Unexamined-Japanese-Patent No. 2015-117327 can also be used as a fluorine-type surfactant.

又,將國際公開第2020/084854號中記載之界面活性劑用作具有碳數6以上的全氟烷基之界面活性劑的替代物,從環境管制的觀點考慮亦較佳。In addition, it is also preferable from the viewpoint of environmental control to use the surfactant described in International Publication No. 2020/084854 as a substitute for a surfactant having a perfluoroalkyl group having 6 or more carbon atoms.

又,將由式(fi-1)表示之含氟醯亞胺鹽化合物用作界面活性劑亦較佳。Furthermore, it is also preferable to use a fluoroimide salt-containing compound represented by the formula (fi-1) as a surfactant.

[化學式44]

Figure 02_image088
[chemical formula 44]
Figure 02_image088

式(fi-1)中,m表示1或2,n表示1~4的整數,a表示1或2,X a+表示a價金屬離子、一級銨離子、二級銨離子、三級銨離子、四級銨離子或NH 4 +In formula (fi-1), m represents 1 or 2, n represents an integer of 1 to 4, a represents 1 or 2, X a+ represents a-valent metal ion, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, Quaternary ammonium ion or NH 4 + .

作為非離子系界面活性劑,可舉出丙三醇(glycerol)、三羥甲基丙烷、三羥甲基乙烷及該等的乙氧基化物及丙氧基化物(例如,丙三醇丙氧基化物、丙三醇乙氧基化物等)、聚氧乙烯月桂基醚、聚氧乙烯硬脂基醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、山梨糖醇脂肪酸酯、Pluronic L10、L31、L61、L62、10R5、17R2、25R2(BASF公司製)、Tetronic 304、701、704、901、904、150R1(BASF公司製)、SOLSPERSE 20000(Japan Lubrizol Corporation製)、NCW-101、NCW-1001、NCW-1002(FUJIFILM Wako Pure Chemical Corporation製)、PIONIN D-6112、D-6112-W、D-6315(Takemoto Oil & Fat Co.,Ltd.製)、OLFIN E1010、Surfynol 104、400、440(Nissin Chemical Co.,Ltd.製)等。Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerol propane Oxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonyl ether Phenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF Corporation), Tetronic 304, 701, 704, 901, 904, 150R1 (by BASF Corporation), SOLSPERSE 20000 (by Japan Lubrizol Corporation), NCW-101, NCW-1001, NCW-1002 (by FUJIFILM Wako Pure Chemical Corporation), PIONIN D- 6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

作為聚矽氧系界面活性劑,可舉出DOWSIL SH8400、SH8400 FLUID、FZ-2122、67 Additive、74 Additive、M Additive、SF 8419 OIL(以上為Dow Corning Toray Co.,Ltd.製)、TSF-4300、TSF-4445、TSF-4460、TSF-4452(以上為Momentive Performance Materials Inc.製)、KP-341、KF-6000、KF-6001、KF-6002、KF-6003(以上為Shin-Etsu Chemical Co.,Ltd.製)、BYK-307、BYK-322、BYK-323、BYK-330、BYK-333、BYK-3760、BYK-UV3510(以上為BYK-Chemie GmbH製)等。Examples of polysiloxane-based surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (manufactured by Dow Corning Toray Co., Ltd.), TSF- 4300, TSF-4445, TSF-4460, TSF-4452 (the above are manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (the above are Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (manufactured by BYK-Chemie GmbH), etc.

又,聚矽氧系界面活性劑亦能夠使用下述結構的化合物。Moreover, the compound of the following structure can also be used for a polysiloxane type surfactant.

[化學式45]

Figure 02_image090
[chemical formula 45]
Figure 02_image090

硬化性組成物的總固體成分中的界面活性劑的含量為0.001質量%~5.0質量%為較佳,0.005質量%~3.0質量%為更佳。界面活性劑可以僅為1種,亦可以為2種以上。2種以上的情況下,該等的合計量在上述範圍內為較佳。The content of the surfactant in the total solid content of the curable composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% by mass to 3.0% by mass. Surfactant may be only 1 type, and may be 2 or more types. In the case of 2 or more, it is preferable that the total amount of these is within the said range.

<抗氧化劑> 本揭示之硬化性組成物能夠含有抗氧化劑。作為抗氧化劑,可舉出酚化合物、亞磷酸酯化合物、硫醚化合物等。作為酚化合物,能夠使用習知為酚系抗氧化劑之任意酚化合物。作為較佳之酚化合物,可舉出受阻酚化合物。在與酚性羥基相鄰之部位(鄰位)具有取代基之化合物為較佳。作為上述取代基,碳數1~22的經取代或未經取代之烷基為較佳。又,抗氧化劑為在同一分子內具有苯酚基和亞磷酸酯基之化合物亦較佳。又,抗氧化劑亦能夠較佳地使用磷系抗氧化劑。作為磷系抗氧化劑,可舉出三[2-[[2,4,8,10-四(1,1-二甲基乙基)二苯并[d,f][1,3,2]二氧雜膦雜環庚二烯-6-基]氧基]乙基]胺、三[2-[(4,6,9,11-四-三級丁基二苯并[d,f][1,3,2]二氧雜膦雜環庚二烯-2-基)氧基]乙基]胺、亞磷酸雙(2,4-二-三級丁基-6-甲基苯基)乙酯等。作為抗氧化劑的市售品,例如,可舉出ADEKA STAB AO-20、ADEKA STAB AO-30、ADEKA STAB AO-40、ADEKA STAB AO-50、ADEKA STAB AO-50F、ADEKA STAB AO-60、ADEKA STAB AO-60G、ADEKA STAB AO-80、ADEKA STAB AO-330(以上為ADEKA CORPORATION製)等。 又,抗氧化劑亦能夠使用日本專利第6268967號公報的0023~0048段中記載之化合物、國際公開第2017/006600號中記載之化合物、國際公開第2017/164024號中記載之化合物、韓國公開專利第10-2019-0059371號公報中記載之化合物。抗氧化劑在硬化性組成物的總固體成分中的含量為0.01質量%~20質量%為較佳,0.3質量%~15質量%為更佳。抗氧化劑可以僅使用1種,亦可以使用2種以上。使用2種以上時,該等的合計量在上述範圍內為較佳。 <Antioxidant> The curable composition of the present disclosure can contain an antioxidant. As an antioxidant, a phenolic compound, a phosphite compound, a thioether compound, etc. are mentioned. As the phenolic compound, any phenolic compound known as a phenolic antioxidant can be used. A hindered phenol compound is mentioned as a preferable phenol compound. A compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) is preferred. As the above-mentioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable. Moreover, it is also preferable that an antioxidant is a compound which has a phenol group and a phosphite group in the same molecule. Moreover, phosphorus antioxidant can also be used preferably as an antioxidant. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2] Dioxaphosphine-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tertiary butyldibenzo[d,f] [1,3,2]dioxaphosphine-2-yl)oxy]ethyl]amine, bis(2,4-di-tertiary-butyl-6-methylphenylphosphite ) ethyl ester etc. Examples of commercially available antioxidants include ADEKA STAB AO-20, ADEKA STAB AO-30, ADEKA STAB AO-40, ADEKA STAB AO-50, ADEKA STAB AO-50F, ADEKA STAB AO-60, ADEKA STAB AO-60, and ADEKA STAB AO-60. STAB AO-60G, ADEKA STAB AO-80, ADEKA STAB AO-330 (the above are manufactured by ADEKA CORPORATION), etc. In addition, as an antioxidant, compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, compounds described in International Publication No. 2017/006600, compounds described in International Publication No. 2017/164024, Korean Laid-Open Patent Compounds described in Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the curable composition is preferably 0.01% by mass to 20% by mass, more preferably 0.3% by mass to 15% by mass. Antioxidant may use only 1 type, and may use 2 or more types. When using 2 or more types, it is preferable that these total amounts are in the said range.

<其他成分> 本揭示之硬化性組成物可以根據需要含有增感劑、硬化促進劑、填料、熱硬化促進劑、可塑劑及其他助劑類(例如,導電性粒子、消泡劑、阻燃劑、調平劑、剝離促進劑、香料、表面張力調節劑、鏈轉移劑等)。藉由適當地含有該等成分,能夠調節膜物理性質等性質。關於該等成分,例如,能夠參考日本特開2012-003225號公報的0183段以後(對應之美國專利申請公開第2013/0034812號說明書的0237段)的記載、日本特開2008-250074號公報的0101~0104、0107~0109段等的記載,該等內容編入本說明書中。 又,本揭示之硬化性組成物可根據需要含有潛在抗氧化劑。作為潛在抗氧化劑,可舉出如下化合物:作為抗氧化劑發揮作用之部位被保護基保護且藉由以100℃~250℃加熱或在酸/鹼觸媒存在下以80℃~200℃加熱而保護基脫離並作為抗氧化劑發揮作用。作為潛在抗氧化劑,可舉出國際公開第2014/021023號、國際公開第2017/030005號、日本特開2017-008219號公報中記載之化合物。作為潛在抗氧化劑的市售品,可舉出ADEKA ARKLS GPA-5001(ADEKA CORPORATION製)等。 <Other ingredients> The curable composition disclosed herein may contain sensitizers, hardening accelerators, fillers, thermosetting accelerators, plasticizers, and other additives (for example, conductive particles, defoamers, flame retardants, leveling agents, etc.) agents, peel accelerators, fragrances, surface tension regulators, chain transfer agents, etc.). Properties such as membrane physical properties can be adjusted by appropriately containing these components. Regarding these components, for example, reference can be made to the descriptions in paragraphs 0183 and later of Japanese Patent Application Publication No. 2012-003225 (corresponding to paragraph 0237 of US Patent Application Publication No. 2013/0034812 specification), and the descriptions in Japanese Patent Application Publication No. 2008-250074. 0101-0104, 0107-0109, etc., these contents are incorporated into this specification. Moreover, the curable composition of this disclosure may contain a latent antioxidant as needed. Examples of potential antioxidants include compounds in which the site functioning as an antioxidant is protected by a protecting group and protected by heating at 100°C to 250°C or heating at 80°C to 200°C in the presence of an acid/alkali catalyst free radicals and act as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219. As a commercial item of a latent antioxidant, ADEKA ARKLS GPA-5001 (made by ADEKA CORPORATION) etc. are mentioned.

本揭示之硬化性組成物可以含有金屬氧化物以調節所獲得之膜的折射率。作為金屬氧化物,可舉出TiO 2、ZrO 2、Al 2O 3、SiO 2等。金屬氧化物的一次粒徑為1nm~100nm為較佳,3nm~70nm為更佳,5nm~50nm為進一步較佳。金屬氧化物可以具有核殼結構。又,此時,核部可以為中空狀。 The curable composition of the present disclosure may contain metal oxides to adjust the refractive index of the resulting film. Examples of metal oxides include TiO 2 , ZrO 2 , Al 2 O 3 , SiO 2 and the like. The primary particle size of the metal oxide is preferably from 1 nm to 100 nm, more preferably from 3 nm to 70 nm, and still more preferably from 5 nm to 50 nm. Metal oxides may have a core-shell structure. Also, at this time, the core portion may be hollow.

本揭示之硬化性組成物可以包含耐光性改良劑。作為耐光性改良劑,可舉出日本特開2017-198787號公報的0036~0037段中記載之化合物、日本特開2017-146350號公報的0029~0034段中記載之化合物、日本特開2017-129774號公報的0036~0037、0049~0052段中記載之化合物、日本特開2017-129674號公報的0031~0034、0058~0059段中記載之化合物、日本特開2017-122803號公報的0036~0037、0051~0054段中記載之化合物、國際公開第2017/164127號的0025~0039段中記載之化合物、日本特開2017-186546號公報的0034~0047段中記載之化合物、日本特開2015-025116號公報的0019~0041段中記載之化合物、日本特開2012-145604號公報的0101~0125段中記載之化合物、日本特開2012-103475號公報的0018~0021段中記載之化合物、日本特開2011-257591號公報的0015~0018段中記載之化合物、日本特開2011-191483號公報的0017~0021段中記載之化合物、日本特開2011-145668號公報的0108~0116段中記載之化合物、日本特開2011-253174號公報的0103~0153段中記載之化合物等。The curable composition of the present disclosure may contain a light resistance improver. Examples of light resistance improvers include compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, compounds described in paragraphs 0029-0034 of JP-A-2017-146350, compounds described in JP-A-2017-146350, Compounds described in paragraphs 0036 to 0037 and 0049 to 0052 of Japanese Patent Application Laid-Open No. 129774, compounds described in paragraphs 0031 to 0034 and 0058 to 0059 of Japanese Patent Application Laid-Open No. 2017-129674, and compounds described in paragraphs 0036 to 0058 of Japanese Patent Application Laid-Open No. 2017-122803 0037, compounds described in paragraphs 0051 to 0054, compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, compounds described in paragraphs 0034 to 0047 of JP 2017-186546 A, JP 2015 - Compounds described in paragraphs 0019 to 0041 of Japanese Patent Application Laid-Open No. 025116, compounds described in paragraphs 0101 to 0125 of Japanese Patent Application Laid-Open No. 2012-145604, compounds described in paragraphs 0018 to 0021 of Japanese Patent Application Laid-Open No. 2012-103475, Compounds described in paragraphs 0015 to 0018 of JP-A-2011-257591, compounds described in paragraphs 0017-0021 of JP-A-2011-191483, and paragraphs 0108-0116 of JP-A-2011-145668 Compounds described, compounds described in paragraphs 0103 to 0153 of JP-A-2011-253174, and the like.

本揭示之硬化性組成物實質上不含有對苯二甲酸酯亦較佳。在此,“實質上不含有”係指對苯二甲酸酯在硬化性組成物的總量中的含量為1000質量ppb以下,100質量ppb以下為更佳,零為特佳。It is also preferable that the curable composition of the present disclosure does not substantially contain terephthalate. Here, "substantially not containing" means that the content of terephthalate in the total amount of the curable composition is 1000 mass ppb or less, more preferably 100 mass ppb or less, and particularly preferably zero.

從環境管制的觀點考慮,有時會管制全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽的使用。本揭示之硬化性組成物中,在降低上述化合物的含有率時,相對於硬化性組成物的總固體成分,全氟烷基磺酸(尤其,全氟烷基的碳數為6~8的全氟烷基磺酸)及其鹽以及全氟烷基羧酸(尤其,全氟烷基的碳數為6~8的全氟烷基羧酸)及其鹽的含有率在0.01ppb~1,000ppb的範圍內為較佳,在0.05ppb~500ppb的範圍內為更佳,在0.1ppb~300ppb的範圍內為進一步較佳。本揭示之硬化性組成物亦可以實質上不含有全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽。例如,藉由使用能夠成為全氟烷基磺酸及其鹽的替代物之化合物以及能夠成為全氟烷基羧酸及其鹽的替代物之化合物,亦可以選擇實質上不含有全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽之硬化性組成物。作為能夠成為管制化合物的替代物之化合物,例如可舉出根據全氟烷基的碳數的差異而從管制對象排除之化合物。然而,上述內容並不妨礙全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽的使用。本揭示之硬化性組成物亦可以在最大容許範圍內含有全氟烷基磺酸及其鹽以及全氟烷基羧酸及其鹽。From the viewpoint of environmental control, the use of perfluoroalkane sulfonic acids and their salts and perfluoroalkyl carboxylic acids and their salts are sometimes regulated. In the curable composition of the present disclosure, when the content of the above-mentioned compounds is reduced, perfluoroalkylsulfonic acid (especially, perfluoroalkyl having 6 to 8 carbon atoms) Perfluoroalkyl sulfonic acid) and its salts, and perfluoroalkyl carboxylic acids (especially perfluoroalkyl carboxylic acids with 6 to 8 carbon atoms in the perfluoroalkyl group) and their salts in a content rate of 0.01ppb to 1,000 The range of ppb is preferable, the range of 0.05ppb to 500ppb is more preferable, and the range of 0.1ppb to 300ppb is still more preferable. The curable composition of the present disclosure may also substantially not contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt. For example, by using compounds that can be substitutes for perfluoroalkylsulfonic acids and their salts and compounds that can be substitutes for perfluoroalkylcarboxylic acids and their salts, it is also possible to select compounds that do not substantially contain perfluoroalkyl groups. Hardening compositions of sulfonic acids and their salts and perfluoroalkylcarboxylic acids and their salts. Examples of compounds that can serve as substitutes for regulated compounds include compounds that are excluded from control targets due to the difference in the number of carbon atoms in the perfluoroalkyl group. However, the above does not prevent the use of perfluoroalkylsulfonic acids and their salts and perfluoroalkylcarboxylic acids and their salts. The curable composition of the present disclosure may also contain perfluoroalkylsulfonic acid and its salt, and perfluoroalkylcarboxylic acid and its salt within the maximum allowable range.

本揭示之硬化性組成物的含水率為3質量%以下為較佳,0.01質量%~1.5質量%為更佳,0.1質量%~1.0質量%的範圍為進一步較佳。含水率能夠藉由Karl Fischer方法測定。The water content of the curable composition disclosed herein is preferably 3% by mass or less, more preferably 0.01% by mass to 1.5% by mass, and more preferably 0.1% by mass to 1.0% by mass. Moisture content can be determined by the Karl Fischer method.

本揭示之硬化性組成物能夠以膜面狀(平坦性等)的調整、膜厚的調整等為目的,調整黏度來使用。黏度的值能夠根據需要適當選擇,例如在25℃下,0.3mPa・s~50mPa・s為較佳,0.5mPa・s~20mPa・s為更佳。作為黏度的測定方法,例如,能夠使用錐板(cone plate)型黏度計,在將溫度調整為25℃之狀態下測定。 關於本揭示之硬化性組成物,從環境應對、抑制產生異物、抑制裝置污染等觀點考慮,硬化性組成物中的氯化物離子量為10,000ppm以下為較佳,1000ppm以下為更佳。為了使硬化性組成物中的氯化物離子在上述範圍內,可舉出使用氯化物離子含量少的原料之方法、藉由水洗、離子交換樹脂、過濾器過濾等去除氯化物離子之方法等。作為氯化物離子的測定方法,能夠使用公知的方法,例如,可舉出離子層析術、燃燒離子層析術等。 The curable composition of the present disclosure can be used by adjusting the viscosity for the purpose of adjusting the film surface shape (flatness, etc.), adjusting the film thickness, and the like. The value of the viscosity can be appropriately selected according to needs, for example, at 25° C., 0.3 mPa·s to 50 mPa·s is preferable, and 0.5 mPa·s to 20 mPa·s is more preferable. As a method for measuring the viscosity, for example, it can be measured using a cone plate (cone plate) type viscometer, in a state where the temperature is adjusted to 25°C. Regarding the curable composition of the present disclosure, from the viewpoints of environmental response, suppression of foreign matter generation, suppression of device contamination, etc., the amount of chloride ions in the curable composition is preferably 10,000 ppm or less, more preferably 1000 ppm or less. In order to make the chloride ions in the curable composition fall within the above range, methods of using a raw material with a low content of chloride ions, methods of removing chloride ions by washing with water, ion exchange resin, filter filtration, etc. are mentioned. As a method for measuring chloride ions, known methods can be used, for example, ion chromatography, combustion ion chromatography, and the like.

<收容容器> 作為本硬化性組成物的收容容器,並沒有特別限定,能夠使用公知的收容容器。又,作為收容容器,以抑制雜質混入原材料、硬化性組成物中為目的,使用由6種6層的樹脂構成容器內壁之多層瓶、將6種樹脂設為7層結構之瓶亦較佳。作為此類容器,例如,可舉出日本特開2015-123351號公報中記載之容器。又,容器內壁以防止金屬從容器內壁溶出,提高硬化性組成物的保存穩定性或抑制成分變質等為目的,設為玻璃製、不鏽鋼製等亦較佳。 <Containment container> The storage container for the present curable composition is not particularly limited, and known storage containers can be used. Also, as a storage container, for the purpose of preventing impurities from mixing into raw materials and curable compositions, it is also preferable to use a multi-layer bottle whose inner wall is composed of 6 types of 6-layer resins, or a bottle with 6 types of resins in a 7-layer structure. . As such a container, the container described in Unexamined-Japanese-Patent No. 2015-123351 is mentioned, for example. Furthermore, the inner wall of the container is preferably made of glass, stainless steel, etc. for the purpose of preventing elution of metal from the inner wall of the container, improving storage stability of the curable composition, or suppressing deterioration of components.

<硬化性組成物的製備方法> 本揭示之硬化性組成物能夠混合前述成分來製備。製備硬化性組成物時,可以將所有成分同時溶解和/或分散於溶劑中而製備硬化性組成物,亦可以根據需要將各成分適當地分為2份以上的溶液或分散液,並在使用時(塗佈時)將該等進行混合而製備硬化性組成物。 <Preparation method of curable composition> The curable composition of the present disclosure can be prepared by mixing the aforementioned components. When preparing a curable composition, all components can be dissolved and/or dispersed in a solvent at the same time to prepare a curable composition, or each component can be appropriately divided into two or more solutions or dispersions as needed, and used These are mixed at the time (at the time of coating) to prepare a curable composition.

又,在製備硬化性組成物時,包含分散顏料的製程為較佳。在顏料分散製程中,作為用於分散顏料的機械力,可舉出壓縮、擠壓、衝擊、剪斷、孔蝕等。作為該等製程的具體例,可舉出珠磨、砂磨、輥磨、球磨、塗料攪拌、微射流、高速葉輪、混砂、噴流混合、高壓濕式微粒化、超聲波分散等。又,顏料在砂磨機(珠磨機)中的粉碎中,在藉由使用直徑小的微珠、增加微珠的填充率等而提高粉碎效率之條件下進行處理為較佳。 又,粉碎處理後,藉由過濾、離心分離等去除粗粒子為較佳。又,關於顏料分散製程及分散機,能夠較佳地使用“分散技術大全集,JOHOKIKO CO.,LTD.發行,2005年7月15日”或“以懸浮液(固體/液體分散體系)為中心之分散技術與工業上的實際應用 綜合資料集,經營開發中心出版部發行,1978年10月10日”、日本特開2015-157893號公報的0022段中記載之製程及分散機。又,在顏料分散製程中,可以藉由鹽磨步驟進行粒子的微細化處理。例如,在鹽磨步驟中使用之材料、裝置、處理條件等能夠參考日本特開2015-194521號公報、日本特開2012-046629號公報的記載。作為用於分散的珠子,能夠使用二氧化鋯、瑪瑙、石英、二氧化鈦、碳化鎢、氮化矽、氧化鋁、不鏽鋼、玻璃或該等的組合。又,能夠使用莫氏硬度為2以上的無機化合物。在組成物中可以包含1~10000ppm的上述珠子。 Also, when preparing the curable composition, the process including dispersing the pigment is preferable. In the pigment dispersion process, examples of the mechanical force used to disperse the pigment include compression, extrusion, impact, shearing, and pitting. Specific examples of these processes include bead milling, sand milling, roller milling, ball milling, paint stirring, micro jets, high-speed impellers, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, and the like. In addition, in the pulverization of the pigment in a sand mill (bead mill), it is preferable to process under the conditions that the pulverization efficiency is improved by using small-diameter beads, increasing the filling rate of the microbeads, and the like. Also, after pulverization, it is preferable to remove coarse particles by filtration, centrifugation, or the like. Also, regarding the pigment dispersion process and dispersing machine, it is preferable to use "Compendium of Dispersion Technology, published by JOHOKIKO CO., LTD., July 15, 2005" or "Suspension (solid/liquid dispersion system) as the center Dispersion Technology and Industrial Practical Application Comprehensive Information Collection, Issued by the Publishing Department of the Management and Development Center, October 10, 1978", the process and dispersion machine recorded in paragraph 0022 of Japanese Patent Application Laid-Open No. 2015-157893. In addition, in the pigment dispersion process, the particles can be miniaturized through the salt milling step. For example, materials, devices, and processing conditions used in the salt milling step can refer to the descriptions in JP-A-2015-194521 and JP-A-2012-046629. As beads for dispersion, zirconia, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, alumina, stainless steel, glass, or combinations thereof can be used. Moreover, the inorganic compound whose Mohs' hardness is 2 or more can be used. The above-mentioned beads may be included in the composition at 1 to 10000 ppm.

製備硬化性組成物時,為了去除異物和減少缺陷等,用過濾器對硬化性組成物進行過濾為較佳。作為過濾器,只要為一直以來用於過濾用途等之過濾器,則能夠沒有特別限定地使用。例如可舉出使用聚四氟乙烯(PTFE)、聚偏氟乙烯(PVDF)等氟樹脂、尼龍(例如尼龍-6、尼龍-6,6)等聚醯胺系樹脂、聚乙烯、聚丙烯(PP)等聚烯烴樹脂(包括高密度、超高分子量的聚烯烴樹脂)等材料之過濾器。在該等材料之中,聚丙烯(包括高密度聚丙烯)及尼龍為較佳。When preparing a curable composition, it is preferable to filter the curable composition with a filter in order to remove foreign substances, reduce defects, and the like. As a filter, if it is a filter conventionally used for a filtration use etc., it can use without limitation in particular. For example, fluorine resins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (such as nylon-6, nylon-6,6), polyethylene, polypropylene ( PP) and other polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins) and other materials. Among these materials, polypropylene (including high density polypropylene) and nylon are preferred.

過濾器的孔徑為0.01μm~7.0μm為較佳,0.01μm~3.0μm為更佳,0.05μm~0.5μm為進一步較佳。只要過濾器的孔徑在上述範圍內,則能夠更確實地去除微細的異物。關於過濾器的孔徑值,能夠參考過濾器廠商的標稱值。關於過濾器,能夠使用由Nihon Pall Ltd.(DFA4201NXEY、DFA4201NAEY、DFA4201J006P等)、Advantec Toyo Kaisha,Ltd.、Nihon Entegris K.K.(Formerly Nippon Mykrolis Corporation)及KITZ MICROFILTER Corporation等提供之各種過濾器。The pore size of the filter is preferably from 0.01 μm to 7.0 μm, more preferably from 0.01 μm to 3.0 μm, and still more preferably from 0.05 μm to 0.5 μm. As long as the pore size of the filter is within the above range, fine foreign matter can be removed more reliably. Regarding the pore diameter value of the filter, you can refer to the nominal value of the filter manufacturer. As for the filter, various filters provided by Nihon Pall Ltd. (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, and the like can be used.

又,作為過濾器,使用纖維狀濾材亦較佳。作為纖維狀濾材,例如可舉出聚丙烯纖維、尼龍纖維、玻璃纖維等。作為市售品,可舉出ROKI TECHNO CO.,LTD.製SBP型系列(SBP008等)、TPR型系列(TPR002、TPR005等)、SHPX型系列(SHPX003等)。Moreover, it is also preferable to use a fibrous filter material as a filter. As a fibrous filter medium, a polypropylene fiber, a nylon fiber, a glass fiber etc. are mentioned, for example. Examples of commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.

在使用過濾器時,可以組合不同的過濾器(例如,第1過濾器和第2過濾器等)。此時,使用各過濾器之過濾可以僅進行1次,亦可以進行2次以上。又,可以在上述範圍內組合不同孔徑的過濾器。又,使用第1過濾器之過濾僅對分散液進行,在混合其他成分之後可以用第2過濾器進行過濾。又,能夠根據組成物的親疏水性,適當選擇過濾器。When using filters, different filters (for example, a 1st filter and a 2nd filter, etc.) can be combined. At this time, the filtration using each filter may be performed only once, or may be performed two or more times. Also, filters with different pore diameters may be combined within the above range. In addition, the filtration using the first filter is performed only on the dispersion liquid, and the second filter may be used for filtration after mixing other components. In addition, the filter can be appropriately selected according to the hydrophilicity and hydrophobicity of the composition.

(硬化物及膜) 本揭示之硬化物為使本揭示之硬化性組成物硬化而成之硬化物。 本揭示之膜為由本揭示之硬化性組成物獲得之膜,硬化本揭示之硬化性組成物而成之膜為較佳。本揭示之膜能夠用於濾色器、紅外線透射濾波器等濾光器等。尤其,具體而言,能夠較佳地用作濾色器的著色像素。作為著色像素,可舉出紅色像素、綠色像素、藍色像素、品紅色像素、青色像素、黃色像素等,綠色像素、藍色像素為較佳,綠色像素為進一步較佳。 (hardened material and film) The cured product of the present disclosure is a cured product obtained by curing the curable composition of the present disclosure. The film of the present disclosure is a film obtained from the curable composition of the present disclosure, preferably a film obtained by curing the curable composition of the present disclosure. The film of the present disclosure can be used for filters such as color filters, infrared transmission filters, and the like. In particular, specifically, it is a colored pixel that can be preferably used as a color filter. Examples of colored pixels include red pixels, green pixels, blue pixels, magenta pixels, cyan pixels, and yellow pixels, among which green pixels and blue pixels are preferable, and green pixels are still more preferable.

本揭示之膜的膜厚能夠根據目的適當調整,0.1μm~20μm為較佳。膜厚的上限為10μm以下為更佳,5μm以下為進一步較佳,3μm以下為特佳,1.5μm以下為最佳。膜厚的下限為0.2μm以上為更佳,0.3μm以上為進一步較佳。The film thickness of the film disclosed herein can be appropriately adjusted according to the purpose, and is preferably 0.1 μm to 20 μm. The upper limit of the film thickness is more preferably 10 μm or less, further preferably 5 μm or less, particularly preferably 3 μm or less, most preferably 1.5 μm or less. The lower limit of the film thickness is more preferably 0.2 μm or more, and more preferably 0.3 μm or more.

(硬化物的製造方法及膜的製造方法) 本揭示之硬化物的製造方法及本揭示之膜的製造方法並沒有特別限制,包括對本揭示之硬化性組成物照射波長150nm~300nm的光之步驟為較佳。 作為波長150nm~300nm的光,可舉出KrF射線(波長248nm)、ArF射線(波長193nm)等。 又,波長150nm~300nm的光為準分子雷射為較佳。 所獲得之硬化物的形狀並沒有特別限制,膜狀為較佳。 (Method for producing cured product and method for producing film) The method for producing the cured product of the present disclosure and the method for producing the film of the present disclosure are not particularly limited, but preferably include a step of irradiating the curable composition of the present disclosure with light having a wavelength of 150 nm to 300 nm. Examples of light having a wavelength of 150 nm to 300 nm include KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and the like. In addition, it is preferable that the light with a wavelength of 150 nm to 300 nm is an excimer laser. The shape of the obtained cured product is not particularly limited, but a film shape is preferred.

本揭示之膜能夠經過將本揭示之硬化性組成物塗佈於支撐體上之步驟來製造。膜的製造方法進一步包括形成圖案(像素)之步驟為較佳。作為圖案(像素)的形成方法,可舉出光微影法、乾式蝕刻法,光微影法為較佳。The film of the present disclosure can be produced through the step of coating the curable composition of the present disclosure on a support. It is preferable that the film manufacturing method further includes a step of forming a pattern (pixel). As a method for forming a pattern (pixel), photolithography and dry etching are mentioned, and photolithography is preferred.

基於光微影法之圖案形成包括使用本揭示之硬化性組成物而在支撐體上形成硬化性組成物層之步驟、以圖案狀曝光硬化性組成物層之步驟及顯影去除硬化性組成物層的未曝光部而形成圖案(像素)之步驟為較佳。亦可以根據需要設置對硬化性組成物層進行烘烤之步驟(預烘烤步驟)及對經顯影之圖案(像素)進行烘烤之步驟(後烘烤步驟)。Pattern formation based on photolithography includes the steps of forming a curable composition layer on a support using the curable composition disclosed herein, exposing the curable composition layer in a pattern, and developing and removing the curable composition layer. The step of forming a pattern (pixel) of the unexposed part is preferable. A step of baking the curable composition layer (pre-baking step) and a step of baking the developed pattern (pixel) (post-baking step) may also be provided as needed.

在形成硬化性組成物層之步驟中,使用本揭示之硬化性組成物,在支撐體上形成硬化性組成物層。作為支撐體,並沒有特別限定,能夠根據用途適當選擇。例如,可舉出玻璃基板、矽基板等,矽基板為較佳。又,可以在矽基板上形成有電荷耦合元件(CCD)、互補金屬氧化物半導體(CMOS)、透明導電膜等。又,有時會在矽基板上形成有隔離各像素之黑矩陣(black matrix)。又,為了改善與上部層的密接性、防止物質的擴散或者基板表面的平坦化,可以在矽基板上設置基底層。基底層可以使用從本說明書中記載之硬化性組成物去除著色劑而成之組成物、包含本說明書記載的樹脂、聚合性化合物、界面活性劑等之組成物等形成。用二碘甲烷測定時,基底層的表面接觸角為20°~70°為較佳。又,用水測定時,30°~80°為較佳。In the step of forming the curable composition layer, the curable composition layer of the present disclosure is used to form the curable composition layer on the support. It does not specifically limit as a support body, It can select suitably according to a use. For example, a glass substrate, a silicon substrate, etc. are mentioned, and a silicon substrate is preferable. In addition, a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a transparent conductive film, and the like may be formed on the silicon substrate. Also, sometimes a black matrix is formed on the silicon substrate to isolate each pixel. In addition, an underlayer may be provided on the silicon substrate in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or flatten the surface of the substrate. The base layer can be formed using a composition obtained by removing a colorant from a curable composition described in this specification, a composition including a resin described in this specification, a polymerizable compound, a surfactant, and the like. When measured with diiodomethane, the surface contact angle of the base layer is preferably 20° to 70°. Also, when measured with water, 30° to 80° is preferable.

作為硬化性組成物的塗佈方法,能夠使用公知的方法。例如,可舉出滴加法(滴鑄:drop cast);狹縫塗佈法;噴霧法;輥塗法;旋轉塗佈法(旋塗);流延塗佈法;狹縫旋塗法;預濕法(例如,日本特開2009-145395號公報中記載之方法);噴墨(例如按需方式、壓電方式、熱方式)、噴嘴噴射等噴出系印刷、柔版印刷、網版印刷、凹版印刷、逆轉偏移印刷、金屬遮罩印刷法等各種印刷法;使用模具等之轉印法;奈米壓印法等。作為噴墨中的適用方法,並沒有特別限定,例如可舉出“噴墨的拓展、使用-專利中出現之無限可能性-,2005年2月發行,Sumitbe Techon Research Co.,Ltd.”所示之方法(尤其第115頁~第133頁)或日本特開2003-262716號公報、日本特開2003-185831號公報、日本特開2003-261827號公報、日本特開2012-126830號公報、日本特開2006-169325號公報等中記載之方法。 又,關於硬化性組成物的塗佈方法,能夠參考國際公開第2017/030174號、國際公開第2017/018419號的記載,該等內容編入本說明書中。 As a coating method of the curable composition, known methods can be used. For example, drop casting method (drop casting: drop cast); slit coating method; spray method; roll coating method; spin coating method (spin coating); Wet method (for example, the method described in Japanese Patent Laid-Open No. 2009-145395); inkjet (for example, drop-on-demand method, piezoelectric method, thermal method), jet printing such as nozzle jetting, flexographic printing, screen printing, Various printing methods such as gravure printing, reverse offset printing, and metal mask printing; transfer printing using molds, etc.; nanoimprinting, etc. There are no particular limitations on the method of application to inkjet, and examples include "Inkjet Expansion and Use - Unlimited Possibilities Appearing in Patents - Issued in February 2005, Sumitbe Techon Research Co., Ltd." The method shown (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830, The method described in Japanese Unexamined Patent Publication No. 2006-169325 and the like. In addition, regarding the coating method of the curable composition, reference can be made to the descriptions in International Publication No. 2017/030174 and International Publication No. 2017/018419, and these contents are incorporated in this specification.

形成於支撐體上之硬化性組成物層可以進行乾燥(預烘烤)。在藉由低溫製程製造膜時,可以不進行預烘烤。進行預烘烤時,預烘烤溫度為150℃以下為較佳,120℃以下為更佳,110℃以下為進一步較佳。下限例如能夠設為50℃以上,亦能夠設為80℃以上。預烘烤時間為10秒~300秒為較佳,40秒~250秒為更佳,80秒~220秒為進一步較佳。預烘烤能夠利用加熱板、烘箱等來進行。The curable composition layer formed on the support may be dried (prebaked). Pre-baking may not be performed when a film is manufactured by a low-temperature process. When performing prebaking, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and still more preferably 110°C or lower. The lower limit may be, for example, 50°C or higher, or may be 80°C or higher. The prebaking time is preferably from 10 seconds to 300 seconds, more preferably from 40 seconds to 250 seconds, and still more preferably from 80 seconds to 220 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

接著,以圖案狀曝光硬化性組成物層(曝光步驟)。例如,使用步進曝光機、掃描曝光機等,隔著具有規定遮罩圖案之遮罩,對硬化性組成物層進行曝光,藉此能夠以圖案狀曝光。藉此,能夠硬化曝光部分。Next, the curable composition layer is exposed in a pattern (exposure step). For example, by exposing the curable composition layer through a mask having a predetermined mask pattern using a stepper, a scanning exposure machine, etc., it is possible to expose in a pattern form. Thereby, the exposed portion can be hardened.

作為能夠在曝光時使用之放射線(光),可舉出g射線、i射線等。又,亦能夠使用波長300nm以下的光(較佳為波長150nm~300nm的光)。作為波長300nm以下的光,可舉出KrF射線(波長248nm)、ArF射線(波長193nm)等,KrF射線(波長248nm)為較佳。又,亦能夠利用300nm以上的長波長光源。Examples of radiation (light) that can be used for exposure include g-rays, i-rays, and the like. In addition, light having a wavelength of 300 nm or less (preferably light having a wavelength of 150 nm to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF rays (wavelength: 248 nm), ArF rays (wavelength: 193 nm), and KrF rays (wavelength: 248 nm) are preferred. In addition, a long-wavelength light source of 300 nm or more can also be used.

又,在曝光時,可以連續照射光而進行曝光,亦可以實施脈衝式照射而進行曝光(脈衝曝光)。另外,脈衝曝光係指以短時間(例如,毫秒級以下)為週期,反覆進行光的照射和暫停而進行曝光之方式的曝光方法。Moreover, at the time of exposure, exposure may be performed by continuously irradiating light, or may be performed by performing pulsed irradiation (pulse exposure). In addition, pulse exposure refers to an exposure method in which light is irradiated and paused repeatedly for a short period of time (eg, millisecond order or less) to perform exposure.

照射量(曝光量)例如為0.03J/cm 2~2.5J/cm 2為較佳,0.05J/cm 2~1.0J/cm 2為更佳。曝光時的氧濃度能夠適當選擇,除了在大氣下進行以外,例如亦可以在氧濃度為19體積%以下的低氧環境下(例如,15體積%、5體積%或實質上無氧)進行曝光,亦可以在氧濃度超過21體積%之高氧環境下(例如,22體積%、30體積%或50體積%)進行曝光。又,曝光照度能夠適當設定,通常能夠選自1000W/m 2~100000W/m 2(例如,5000W/m 2、15000W/m 2或35000W/m 2)的範圍。氧濃度和曝光照度的條件可以適當組合,例如能夠設為氧濃度為10體積%且照度為10000W/m 2、氧濃度為35體積%且照度為20000W/m 2等。 The amount of irradiation (exposure amount) is, for example, preferably 0.03 J/cm 2 to 2.5 J/cm 2 , more preferably 0.05 J/cm 2 to 1.0 J/cm 2 . The oxygen concentration at the time of exposure can be appropriately selected. In addition to performing the exposure in the atmosphere, for example, the exposure can also be performed in a low-oxygen environment (for example, 15 volume %, 5 volume % or substantially no oxygen) with an oxygen concentration of 19 volume % or less. , and exposure can also be performed under a high oxygen environment (for example, 22 volume %, 30 volume % or 50 volume %) where the oxygen concentration exceeds 21 volume %. In addition, the exposure illuminance can be appropriately set, and usually can be selected from the range of 1000 W/m 2 to 100,000 W/m 2 (for example, 5,000 W/m 2 , 15,000 W/m 2 , or 35,000 W/m 2 ). Conditions of oxygen concentration and exposure illuminance can be appropriately combined, for example, the oxygen concentration is 10 vol % and the illuminance is 10000 W/m 2 , and the oxygen concentration is 35 vol % and the illuminance is 20000 W/m 2 .

接著,顯影去除硬化性組成物層的未曝光部而形成圖案(像素)。能夠使用顯影液,進行硬化性組成物層的未曝光部的顯影去除。藉此,曝光步驟中的未曝光部的硬化性組成物層溶出至顯影液中,僅殘留已光硬化之部分。例如,顯影液的溫度為20℃~30℃為較佳。顯影時間為20秒~180秒為較佳。又,為了提高殘渣去除性,可以反覆進行複數次如下步驟:每隔60秒甩掉顯影液,進而供給新的顯影液之步驟。Next, unexposed portions of the curable composition layer are removed by development to form a pattern (pixel). The development and removal of the unexposed portion of the curable composition layer can be performed using a developing solution. Thereby, the curable composition layer in the unexposed portion in the exposure step is eluted into the developing solution, and only the photocured portion remains. For example, the temperature of the developer is preferably 20°C to 30°C. The development time is preferably 20 seconds to 180 seconds. Also, in order to improve the residue removal performance, the step of shaking off the developing solution every 60 seconds and then supplying a new developing solution may be repeated several times.

顯影液可舉出有機溶劑、鹼顯影液等,可較佳地使用鹼顯影液。作為鹼顯影液,用純水稀釋鹼劑而得之鹼性水溶液(鹼顯影液)為較佳。作為鹼劑,例如可舉出氨、乙胺、二乙胺、二甲基乙醇胺、二乙二醇胺、二乙醇胺、羥胺、乙二胺、氫氧化四甲基銨、氫氧化四乙基銨、氫氧化四丙基銨、氫氧化四丁基銨、氫氧化乙基三甲基銨、氫氧化苄基三甲基銨、氫氧化二甲基雙(2-羥基乙基)銨、膽鹼、吡咯、哌啶、1,8-二氮雜雙環[5.4.0]-7-十一碳烯等有機鹼性化合物或者氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸氫鈉、矽酸鈉、偏矽酸鈉等無機鹼性化合物。從環境方面及安全方面考慮,鹼劑為分子量大的化合物為較佳。鹼性水溶液的鹼劑的濃度為0.001質量%~10質量%為較佳,0.01質量%~1質量%為更佳。又,顯影液可以進一步含有界面活性劑。從便於運輸、保管等觀點考慮,顯影液可以先製造成濃縮液而在使用時稀釋成所需濃度。稀釋倍率並沒有特別限定,例如能夠設定在1.5倍~100倍的範圍內。又,顯影之後用純水進行清洗(沖洗)亦較佳。又,如下進行沖洗為較佳:一邊使形成有顯影後的硬化性組成物層之支撐體旋轉,一邊向顯影後的硬化性組成物層供給沖洗液。又,藉由使噴出沖洗液之噴嘴從支撐體的中心部向支撐體的周緣部移動來進行亦較佳。此時,使噴嘴從支撐體中心部向周緣部移動時,可以使噴嘴逐漸降低移動速度的同時移動。藉由如此進行沖洗,能夠抑制沖洗的面內不均。又,使噴嘴從支撐體中心部向周緣部移動的同時逐漸降低支撐體的轉速亦可獲得相同的效果。As a developing solution, an organic solvent, an alkali developing solution, etc. are mentioned, and an alkali developing solution can be used preferably. As the alkaline developing solution, an alkaline aqueous solution (alkali developing solution) obtained by diluting the alkaline agent with pure water is preferable. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diethyleneglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide , Tetrapropylammonium Hydroxide, Tetrabutylammonium Hydroxide, Ethyltrimethylammonium Hydroxide, Benzyltrimethylammonium Hydroxide, Dimethylbis(2-Hydroxyethyl)ammonium Hydroxide, Choline , pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene and other organic basic compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate , sodium metasilicate and other inorganic alkaline compounds. From the viewpoint of environment and safety, it is preferable that the alkali agent is a compound with a large molecular weight. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 1% by mass. In addition, the developer may further contain a surfactant. From the viewpoint of convenient transportation and storage, the developer solution can be made into a concentrated solution first and then diluted to the required concentration when used. The dilution ratio is not particularly limited, and can be set, for example, within a range of 1.5 times to 100 times. Moreover, it is also preferable to wash (rinse) with pure water after image development. Moreover, it is preferable to perform rinsing by supplying a rinsing solution to the developed curable composition layer while rotating the support on which the developed curable composition layer is formed. Moreover, it is also preferable to carry out by moving the nozzle which ejects a rinsing liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving the nozzle from the central portion of the support to the peripheral portion, the nozzle can be moved while gradually reducing the moving speed. By performing rinsing in this way, in-plane unevenness of rinsing can be suppressed. Also, the same effect can be obtained by gradually reducing the rotational speed of the support while moving the nozzle from the center portion of the support to the peripheral portion.

顯影之後,在實施乾燥之後進行追加曝光處理、加熱處理(後烘烤)為較佳。追加曝光處理、後烘烤為用於製成完全硬化者之顯影後的硬化處理。後烘烤中的加熱溫度例如為100℃~240℃為較佳,200℃~240℃為更佳。能夠以成為上述條件之方式,使用加熱板或對流烘箱(熱風循環式乾燥機)、高頻加熱機等加熱機構,以連續式或分批式,對顯影後的膜進行後烘烤。進行追加曝光處理時,用於曝光之光為波長400nm以下的光為較佳。又,追加曝光處理可以藉由韓國公開專利第10-2017-0122130號公報中記載之方法進行。After image development, it is preferable to perform additional exposure processing and heat processing (post-baking) after performing drying. Additional exposure treatment and post-baking are hardening treatments after development to make fully hardened ones. The heating temperature in the post-baking is, for example, preferably 100°C to 240°C, more preferably 200°C to 240°C. The film after development can be post-baked continuously or batchwise using a heating mechanism such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater so as to satisfy the above conditions. When additional exposure processing is performed, light used for exposure is preferably light having a wavelength of 400 nm or less. Also, the additional exposure treatment can be performed by the method described in Korean Laid-Open Patent No. 10-2017-0122130.

藉由乾式蝕刻法之圖案形成包括如下步驟為較佳:使用本揭示之硬化性組成物在支撐體上形成硬化性組成物層,使該硬化性組成物層整體硬化而形成硬化物層之步驟、在該硬化物層上形成光阻層之步驟、以圖案狀曝光光阻層之後進行顯影而形成光阻圖案之步驟、將該光阻圖案作為遮罩,利用蝕刻氣體對硬化物層進行乾式蝕刻之步驟。形成光阻層時,進一步實施預烘烤處理為較佳。尤其,作為光阻層的形成製程,實施曝光後的加熱處理、顯影後的加熱處理(後烘烤處理)之形態為較佳。關於藉由乾式蝕刻法形成圖案的內容,能夠參考日本特開2013-064993號公報的0010~0067段的記載,該內容編入本說明書中。It is preferable that the pattern formation by the dry etching method includes the steps of: using the curable composition of the present disclosure to form a curable composition layer on a support, and curing the curable composition layer as a whole to form a cured layer , the step of forming a photoresist layer on the hardened layer, the step of pattern-exposing the photoresist layer and then developing to form a photoresist pattern, using the photoresist pattern as a mask, and drying the hardened layer with etching gas Etching step. When forming the photoresist layer, it is preferable to further perform pre-baking treatment. In particular, as a formation process of the photoresist layer, a form in which heat treatment after exposure and heat treatment after development (post-baking treatment) are performed is preferable. Regarding the content of forming a pattern by the dry etching method, the description in paragraphs 0010 to 0067 of JP-A-2013-064993 can be referred to, and the content is incorporated in this specification.

(光學元件) 本揭示之光學元件具有本揭示之膜。 作為光學元件,可舉出濾光器、透鏡、稜鏡、反射鏡、衍射光柵等。其中,可較佳地舉出濾光器。 作為濾光器的種類,可舉出濾色器及紅外線透射濾波器等,濾色器為較佳。濾色器具有本揭示之膜作為其著色像素為較佳。 (Optical element) The optical element of the present disclosure has the film of the present disclosure. Examples of optical elements include optical filters, lenses, lenses, reflection mirrors, and diffraction gratings. Among them, an optical filter is preferably used. As a kind of optical filter, a color filter, an infrared transmission filter, etc. are mentioned, and a color filter is preferable. The color filter preferably has the film of the present disclosure as its colored pixels.

濾光器中,本揭示之膜的膜厚能夠根據目的適當調整。膜厚為20μm以下為較佳,10μm以下為更佳,5μm以下為進一步較佳。膜厚的下限為0.1μm以上為較佳,0.2μm以上為更佳,0.3μm以上為進一步較佳。In an optical filter, the film thickness of the film of this disclosure can be adjusted suitably according to the purpose. The film thickness is preferably at most 20 μm, more preferably at most 10 μm, and still more preferably at most 5 μm. The lower limit of the film thickness is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.3 μm.

濾光器中包含之像素的寬度為0.4μm~10.0μm為較佳。下限為0.4μm以上為更佳,0.5μm以上為進一步較佳,0.6μm以上為特佳。上限為5.0μm以下為更佳,2.0μm以下為進一步較佳,1.0μm以下為特佳,0.8μm以下為最佳。又,像素的楊氏模量為0.5GPa~20GPa為較佳,2.5GPa~15GPa為更佳。The width of the pixels included in the filter is preferably 0.4 μm to 10.0 μm. The lower limit is more preferably 0.4 μm or more, still more preferably 0.5 μm or more, and particularly preferably 0.6 μm or more. The upper limit is more preferably 5.0 μm or less, more preferably 2.0 μm or less, particularly preferably 1.0 μm or less, most preferably 0.8 μm or less. In addition, the Young's modulus of the pixel is preferably 0.5 GPa to 20 GPa, more preferably 2.5 GPa to 15 GPa.

濾光器中包含之各像素具有高平坦性為較佳。具體而言,像素的表面粗糙度Ra為100nm以下為較佳,40nm以下為更佳,15nm以下為進一步較佳。下限並沒有規定,例如0.1nm以上為較佳。關於像素的表面粗糙度,例如能夠使用Veeco公司製AFM(原子力顯微鏡)Dimension3100來測定。又,像素上的水接觸角能夠設定為適當的較佳值,通常在50°~110°的範圍內。例如,能夠使用接觸角計CV-DT・A型(Kyowa Interface Science Co.,LTD.製)測定接觸角。又,像素的體積電阻值高為較佳。具體而言,像素的體積電阻值為10 9Ω・cm以上為較佳,10 11Ω・cm以上為更佳。上限並沒有規定,例如較佳為10 14Ω・cm以下。例如,能夠使用超高電阻計5410(ADVANTEST CORPORATION製)測定像素的體積電阻值。 It is preferable that each pixel included in the filter has high flatness. Specifically, the surface roughness Ra of the pixel is preferably 100 nm or less, more preferably 40 nm or less, and still more preferably 15 nm or less. The lower limit is not specified, but it is preferably 0.1 nm or more, for example. The surface roughness of a pixel can be measured using AFM (atomic force microscope) Dimension 3100 manufactured by Veeco, for example. In addition, the water contact angle on the pixel can be set to an appropriate preferable value, and is usually in the range of 50° to 110°. For example, the contact angle can be measured using a contact angle meter CV-DT・A type (manufactured by Kyowa Interface Science Co., Ltd.). Moreover, it is preferable that the volume resistance value of a pixel is high. Specifically, the volume resistance value of the pixel is preferably at least 10 9 Ω·cm, more preferably at least 10 11 Ω·cm. Although the upper limit is not specified, for example, it is preferably 10 14 Ω·cm or less. For example, the volume resistance value of the pixel can be measured using an ultrahigh resistance meter 5410 (manufactured by ADVANTEST CORPORATION).

濾光器中,亦可以在本揭示之膜的表面設置保護層。藉由設置保護層,能夠賦予阻氧化、低反射化、親疏水化、特定波長的光(紫外線、近紅外線等)的遮蔽等各種功能。作為保護層的厚度,0.01μm~10μm為較佳,0.1μm~5μm為更佳。作為保護層的形成方法,可舉出塗佈保護層形成用成物而形成之方法、化學氣相沉積法、用接著材料貼付所成型之樹脂之方法等。作為構成保護層之成分,可舉出(甲基)丙烯酸樹脂、烯-硫醇樹脂、聚碳酸酯樹脂、聚醚樹脂、聚芳酯樹脂、聚碸樹脂、聚醚碸樹脂、聚苯樹脂、聚伸芳基醚氧化膦樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚烯烴樹脂、環烯烴樹脂、聚酯樹脂、苯乙烯樹脂、多元醇樹脂、聚偏二氯乙烯樹脂、三聚氰胺樹脂、聚胺酯樹脂、芳香族聚醯胺樹脂、聚醯胺樹脂、醇酸樹脂、環氧樹脂、改質聚矽氧樹脂、氟樹脂、聚丙烯腈樹脂、纖維素樹脂、Si、C、W、Al 2O 3、Mo、SiO 2、Si 2N 4等,可以含有兩種以上的該等成分。例如,在以阻氧化為目的之保護層的情況下,保護層包含多元醇樹脂、SiO 2及Si 2N 4為較佳。又,在以低反射化為目的之保護層的情況下,保護層包含(甲基)丙烯酸樹脂和氟樹脂為較佳。 In the optical filter, a protective layer may be provided on the surface of the film of the present disclosure. By providing a protective layer, various functions such as oxidation resistance, low reflection, hydrophilicity and hydrophobicity, and shielding of light of specific wavelengths (ultraviolet rays, near-infrared rays, etc.) can be imparted. The thickness of the protective layer is preferably from 0.01 μm to 10 μm, more preferably from 0.1 μm to 5 μm. The method of forming the protective layer includes a method of applying a product for forming a protective layer, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive material. Examples of components constituting the protective layer include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyethene resins, polyethersulfur resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cycloolefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin, Melamine resin, polyurethane resin, aromatic polyamide resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluororesin, polyacrylonitrile resin, cellulose resin, Si, C, W , Al 2 O 3 , Mo, SiO 2 , Si 2 N 4 , etc., may contain two or more of these components. For example, in the case of a protective layer for the purpose of preventing oxidation, it is preferable that the protective layer contains polyol resin, SiO 2 and Si 2 N 4 . Moreover, in the case of the protective layer for the purpose of low reflection, it is preferable that the protective layer contains (meth)acrylic resin and fluororesin.

保護層可以根據需要含有有機/無機粒子、特定波長的光(例如,紫外線、近紅外線等)的吸收劑、折射率調節劑、抗氧化劑、密接劑、界面活性劑等添加劑。 作為有機/無機粒子的例子,例如,可舉出高分子粒子(例如,聚矽氧樹脂微粒、聚苯乙烯微粒、三聚氰胺樹脂微粒)、氧化鈦、氧化鋅、氧化鋯、氧化銦、氧化鋁、氮化鈦、氧氮化鈦、氟化鎂、中空二氧化矽、二氧化矽、碳酸鈣、硫酸鋇等。特定波長的光的吸收劑能夠使用公知的吸收劑。該等添加劑的含量能夠適當調整,相對於保護層的總質量,0.1質量%~70質量%為較佳,1質量%~60質量%為進一步較佳。 The protective layer may contain additives such as organic/inorganic particles, light absorbers of specific wavelengths (for example, ultraviolet rays, near-infrared rays, etc.), refractive index modifiers, antioxidants, adhesives, and surfactants as needed. Examples of organic/inorganic particles include polymer particles (for example, silicone resin particles, polystyrene particles, melamine resin particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, Titanium nitride, titanium oxynitride, magnesium fluoride, hollow silicon dioxide, silicon dioxide, calcium carbonate, barium sulfate, etc. As the absorber for light of a specific wavelength, known absorbers can be used. The content of these additives can be appropriately adjusted, but is preferably 0.1% by mass to 70% by mass, more preferably 1% by mass to 60% by mass, based on the total mass of the protective layer.

又,作為保護層,亦能夠使用日本特開2017-151176號公報的0073~0092段中記載之保護層。Moreover, as a protective layer, the protective layer described in paragraph 0073-0092 of Unexamined-Japanese-Patent No. 2017-151176 can also be used.

濾光器亦可以具有如下結構:例如在藉由隔壁分隔成方格狀之空間嵌入有各像素。The optical filter may also have a structure in which, for example, each pixel is embedded in a grid-like space partitioned by partition walls.

(影像感測器) 本揭示之影像感測器具有本揭示之膜。 作為影像感測器,可舉出固體攝像元件、X射線攝像元件、有機薄膜攝像元件等。其中,能夠較佳地用於固體攝像元件中。 本揭示之固體攝像元件包含本揭示之膜。作為固體攝像元件的結構,只要為作為固體攝像元件發揮作用之結構,則並沒有特別限定,例如可舉出如下結構。 (image sensor) The image sensor of the present disclosure has the film of the present disclosure. Examples of the image sensor include solid-state imaging elements, X-ray imaging elements, organic thin film imaging elements, and the like. Among them, it can be suitably used in a solid-state imaging device. The solid-state imaging device of the present disclosure includes the film of the present disclosure. The configuration of the solid-state imaging device is not particularly limited as long as it functions as a solid-state imaging device, and examples thereof include the following configurations.

亦即,在基板上具有由構成固體攝像元件(CCD(電荷耦合元件)影像感測器、CMOS(互補型金屬氧化膜半導體)影像感測器等)的受光區域之複數個光電二極體及多晶矽等組成之傳輸電極,在光電二極體及傳輸電極上具有僅光電二極體的受光部開口之遮光膜,在遮光膜上具有以覆蓋遮光膜整個表面及光電二極體受光部之方式形成之由氮化矽等組成之元件保護膜,在元件保護膜上具有濾色器。進而,亦可以為在元件保護膜上且在濾色器的下側(靠近基板的一側)具有聚光機構(例如,微透鏡等。以下相同)之結構或在濾色器上具有聚光機構之結構等。 又,濾色器亦可以具有如下結構:例如在藉由隔壁分隔成方格狀之空間嵌入有各著色像素。此時的隔壁的折射率比各著色像素低為較佳。作為具有此類結構之攝像裝置的例子,可舉出日本特開2012-227478號公報、日本特開2014-179577號公報、國際公開第2018/043654號中記載之裝置。又,如日本特開2019-211559號公報中所示,可以在固體攝像元件的結構內設置紫外線吸收層而改善耐光性。具備本揭示之固體攝像元件之攝像裝置除了能夠用作數位相機、具有攝像功能之電子裝置(行動電話等)以外,亦能夠用作車用攝影機、監視攝影機。 That is, on the substrate, there are a plurality of photodiodes and The transmission electrode composed of polysilicon, etc. has a light-shielding film with only the light-receiving part of the photodiode on the photodiode and the transmission electrode, and has a method on the light-shielding film to cover the entire surface of the light-shielding film and the light-receiving part of the photodiode An element protective film composed of silicon nitride or the like is formed, and a color filter is provided on the element protective film. Furthermore, it is also possible to have a light-condensing mechanism (such as a microlens, etc., the same below) on the element protection film and on the lower side of the color filter (the side closer to the substrate), or have a light-condensing mechanism on the color filter. organization structure, etc. In addition, the color filter may have a structure in which, for example, colored pixels are embedded in a grid-like space partitioned by partition walls. In this case, the refractive index of the partition wall is preferably lower than that of each colored pixel. Examples of imaging devices having such a configuration include devices described in JP-A-2012-227478, JP-A-2014-179577, and WO2018/043654. Also, as shown in JP-A-2019-211559, light resistance can be improved by providing an ultraviolet absorbing layer within the structure of the solid-state imaging device. The imaging device equipped with the solid-state imaging device of the present disclosure can be used not only as a digital camera, an electronic device (mobile phone, etc.) with an imaging function, but also as a car camera and a surveillance camera.

(圖像顯示裝置) 本揭示之圖像顯示裝置包含本揭示之膜。作為圖像顯示裝置,可舉出液晶顯示裝置、有機電致發光顯示裝置等。關於圖像顯示裝置的定義、各圖像顯示裝置的詳細內容,例如記載於“電子顯示裝置(佐佐木昭夫著,Kogyo Chosakai Publishing Co.,Ltd.,1990年發行)”、“顯示裝置(伊吹順章著,Sangyo Tosho Publishing Co.,Ltd.,1989年發行)”等。又,關於液晶顯示裝置,例如記載於“下一代液晶顯示技術(內田龍男編輯,Kogyo Chosakai Publishing Co.,Ltd.,1994年發行)”。能夠適用本揭示之液晶顯示裝置並沒有特別限制,例如能夠適用於上述“下一代液晶顯示技術”中記載之各種方式的液晶顯示裝置。 (image display device) The image display device of the present disclosure includes the film of the present disclosure. As an image display device, a liquid crystal display device, an organic electroluminescent display device, etc. are mentioned. The definition of an image display device and the details of each image display device are described, for example, in "Electronic Display Devices (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd., 1990)", "Display Devices (by Shun Ibuki). Chapter, Sangyo Tosho Publishing Co., Ltd., issued in 1989)", etc. Also, liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". The liquid crystal display devices to which the present disclosure can be applied are not particularly limited, and for example, can be applied to liquid crystal display devices of various types described in the above-mentioned "next-generation liquid crystal display technology".

(由式1表示之自由基聚合起始劑) 本揭示之自由基聚合起始劑為由下述式1表示之自由基聚合起始劑。 本揭示之自由基聚合起始劑為光自由基聚合起始劑為較佳,藉由波長150nm~300nm的光產生自由基之光自由基聚合起始劑為更佳。 (radical polymerization initiator represented by formula 1) The radical polymerization initiator of the present disclosure is a radical polymerization initiator represented by Formula 1 below. The radical polymerization initiator disclosed herein is preferably a photoradical polymerization initiator, more preferably a photoradical polymerization initiator that generates free radicals by light with a wavelength of 150 nm to 300 nm.

[化學式46]

Figure 02_image092
[chemical formula 46]
Figure 02_image092

式1中,Ar 1及Ar 2分別獨立地表示芳香環,L 11表示單鍵,L 12表示2價連結基,p1表示0以上且Ar 1中的芳香環上可取代的所有位置數-3以下的整數,p2表示0以上且Ar 2中的芳香環上可取代的所有位置數-4以下的整數,R 11、R 12及R 15分別獨立地表示取代基,R 13及R 14分別獨立地表示氫原子或取代基,X 1表示單鍵O、S或NR 16,R 16表示氫原子或取代基,Y 1表示單鍵或羰基,R 12~R 16中2個以上可以鍵結而形成環。 In Formula 1, Ar 1 and Ar 2 independently represent an aromatic ring, L 11 represents a single bond, L 12 represents a divalent linking group, p1 represents 0 or more and the number of all positions that can be substituted on the aromatic ring in Ar 1 is -3 The following integers, p2 represents an integer of 0 or more and the number of all substitutable positions on the aromatic ring in Ar2 is -4 or less, R 11 , R 12 and R 15 independently represent substituents, and R 13 and R 14 independently represent ground represents a hydrogen atom or a substituent, X 1 represents a single bond O, S or NR 16 , R 16 represents a hydrogen atom or a substituent, Y 1 represents a single bond or a carbonyl group, two or more of R 12 to R 16 may be bonded and Form a ring.

本揭示之自由基聚合起始劑中的由式1表示之自由基聚合起始劑的較佳態樣與硬化性組成物中由上述式1表示之自由基聚合起始劑的較佳態樣相同。A preferred aspect of the radical polymerization initiator represented by the formula 1 among the radical polymerization initiators of the present disclosure and a preferred aspect of the radical polymerization initiator represented by the above formula 1 in the curable composition same.

從釋氣抑制性及靈敏度的觀點考慮,本揭示之自由基聚合起始劑為由下述式3或式4表示之自由基聚合起始劑為較佳,由下述式3或式4表示之波長150nm~300nm的準分子雷射曝光用自由基聚合起始劑為更佳。From the viewpoint of outgassing suppression and sensitivity, the free radical polymerization initiator of the present disclosure is preferably a free radical polymerization initiator represented by the following formula 3 or formula 4, represented by the following formula 3 or formula 4 A radical polymerization initiator for excimer laser exposure with a wavelength of 150nm to 300nm is more preferable.

[化學式47]

Figure 02_image094
[chemical formula 47]
Figure 02_image094

式3中,R 31表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 32表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 33及R 34分別獨立地表示氫原子或烷基,R 36~R 39分別獨立地表示氫原子、烷基或芳基,R 32~R 34中2個以上可以鍵結而形成環,R 36與R 37可以鍵結而形成環。 In formula 3, R 31 represents alkyl, alkenyl, aryl, heteroaryl, alkoxy or aryloxy, R 32 represents hydrogen atom, halogen atom, nitro, aryl, heteroaryl, alkoxy , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 33 and R 34 independently represent a hydrogen atom or an alkyl group, R 36 ~R 39 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 32 to R 34 may be bonded to form a ring, and R 36 and R 37 may be bonded to form a ring.

[化學式48]

Figure 02_image096
[chemical formula 48]
Figure 02_image096

式4中,R 41表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 42表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 43及R 44分別獨立地表示氫原子或烷基,R 46及R 47分別獨立地表示氫原子、烷基或芳基,R 42~R 44中2個以上可以鍵結而形成環,R 46與R 47可以鍵結而形成環,R 42為氫原子、鹵素原子、硝基、烷氧基、芳氧基或由下述式I或式II表示之基團時,R 46及R 47不會均成為氫原子,R 42為芳基、雜芳基、一級~三級胺基、烷硫基或芳硫基時,R 46及R 47可以均為氫原子。 In formula 4, R 41 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 42 represents a hydrogen atom, a halogen atom, a nitro group, an aryl group, a heteroaryl group, an alkoxy group , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 43 and R 44 independently represent a hydrogen atom or an alkyl group, R 46 and R 47 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 42 to R 44 may be bonded to form a ring, R 46 and R 47 may be bonded to form a ring, R 42 is a hydrogen atom, When a halogen atom, nitro, alkoxy, aryloxy group or a group represented by the following formula I or formula II, R 46 and R 47 will not both become hydrogen atoms, and R 42 is aryl, heteroaryl, In the case of a primary to tertiary amino group, an alkylthio group or an arylthio group, both R 46 and R 47 may be hydrogen atoms.

[化學式49]

Figure 02_image098
[chemical formula 49]
Figure 02_image098

式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。 In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group.

本揭示之自由基聚合起始劑中的式3、式4、式I及式II的較佳態樣與以上在硬化性組成物中說明的式3、式4、式I及式II的較佳態樣相同。 [實施例] The preferred aspects of formula 3, formula 4, formula I and formula II in the free radical polymerization initiator disclosed herein are compared with formula 3, formula 4, formula I and formula II described above in the curable composition Good looks are the same. [Example]

以下,舉出實施例對本揭示進行進一步詳細的說明。以下實施例所示之材料、使用量、比例、處理內容、處理順序等,只要不脫離本揭示的主旨,則能夠適當變更。因此,本揭示的範圍並不限定於以下所示之具體例。以下所示之結構式中的Me表示甲基,Et表示乙基,Ph表示苯基。又,在本實施例中,只要沒有特別說明,則“%”、“份”分別表示“質量%”、“質量份”。 另外,實施例中使用的自由基聚合起始劑A-1~A-131為分別與以上作為由式1表示之自由基聚合起始劑的具體例說明的自由基聚合起始劑A-1~A-131相同的化合物。 Hereinafter, an Example is given and this indication is demonstrated in more detail. Materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed as long as they do not deviate from the spirit of the present disclosure. Therefore, the scope of the present disclosure is not limited to the specific examples shown below. Me in the structural formula shown below represents a methyl group, Et represents an ethyl group, and Ph represents a phenyl group. In addition, in the present examples, unless otherwise specified, "%" and "part" mean "mass%" and "mass part", respectively. In addition, the radical polymerization initiators A-1 to A-131 used in the examples are the radical polymerization initiator A-1 described above as a specific example of the radical polymerization initiator represented by Formula 1, respectively. - The same compound as A-131.

<自由基聚合起始劑的合成> -合成例1:自由基聚合起始劑A-1的合成- 在500mL燒瓶中添加茀16.6g,使其溶解於氯苯50mL。將其冷卻至0℃並添加氯化鋁14.6g,經30分鐘滴加了3-氯丙醯氯12.7g。升溫至25℃,並進一步攪拌了2小時。藉由乙酸乙酯300mL和1N(=1mol/L)鹽酸水200mL對所獲得之反應液進行分液,用硫酸鎂乾燥有機層之後,進行過濾而蒸餾去除了溶劑。藉由管柱層析法(己烷/乙酸乙酯=8/1)純化所獲得之混合物,獲得了2-(3-氯丙-1-酮)-9H-茀17.7g(產率為69%)。 在100mL燒瓶中,使2-(3-氯丙-1-酮)-9H-茀12.8g溶解於濃硫酸30mL,在100℃下加熱攪拌了2小時。將反應液倒入冰水300mL中,濾取所獲得之固體並進行了乾燥。藉由管柱層析法(己烷/乙酸乙酯=8/1)進行純化,獲得了3,9-二氫環戊[b]茀-1(2H)-酮9.4g(產率為85%)。 在200mL燒瓶中添加鹽酸羥胺2.6g和乙酸鈉4.1g,並使其溶解於四氫呋喃100mL及純水10mL的混合溶劑。添加3,9-二氫環戊[b]茀-1(2H)-酮5.9g,在50℃下加熱攪拌了12小時。將用純水使反應液結晶化而得之結晶用乙腈進行再結晶,由此獲得了3,9-二氫環戊[b]茀-1(2H)-酮肟4.3g(產率為74%)。 在200mL燒瓶中添加3,9-二氫環戊[b]茀-1(2H)-酮肟2.4g並溶解於乙酸乙酯50mL。將其冷卻至0℃,並添加了三乙胺1.5g。經30分鐘進一步滴加乙醯氯1.2g,進而在25℃下攪拌了2小時。藉由乙酸乙酯200mL和純水100mL進行分液,用硫酸鎂乾燥有機層之後進行過濾,在減壓下蒸餾去除,由此獲得了2.4g的自由基聚合起始劑A-1(產率為90%)。 <Synthesis of radical polymerization initiator> -Synthesis example 1: Synthesis of radical polymerization initiator A-1- 16.6 g of terpene was added to a 500 mL flask and dissolved in 50 mL of chlorobenzene. This was cooled to 0°C, 14.6 g of aluminum chloride was added, and 12.7 g of 3-chloropropionyl chloride was added dropwise over 30 minutes. The temperature was raised to 25° C., and further stirred for 2 hours. The obtained reaction solution was liquid-separated between 300 mL of ethyl acetate and 200 mL of 1N (=1 mol/L) hydrochloric acid water, and the organic layer was dried with magnesium sulfate, and filtered to distill off the solvent. The obtained mixture was purified by column chromatography (hexane/ethyl acetate=8/1) to obtain 17.7 g of 2-(3-chloropropan-1-one)-9H-fluorene (yield: 69 %). In a 100 mL flask, 12.8 g of 2-(3-chloropropan-1-one)-9H-tertilene was dissolved in 30 mL of concentrated sulfuric acid, and heated and stirred at 100° C. for 2 hours. The reaction solution was poured into 300 mL of ice water, and the obtained solid was collected by filtration and dried. Purified by column chromatography (hexane/ethyl acetate=8/1), obtained 9.4 g of 3,9-dihydrocyclopenta[b]fluorene-1(2H)-one (yield: 85 %). In a 200 mL flask, 2.6 g of hydroxylamine hydrochloride and 4.1 g of sodium acetate were added, and dissolved in a mixed solvent of 100 mL of tetrahydrofuran and 10 mL of pure water. 5.9 g of 3,9-dihydrocyclopenta[b]fluorene-1(2H)-one was added, followed by heating and stirring at 50° C. for 12 hours. The crystals obtained by crystallizing the reaction solution with pure water were recrystallized with acetonitrile, thereby obtaining 4.3 g of 3,9-dihydrocyclopenta[b]fluorene-1(2H)-ketoxime (yield: 74 %). Into a 200 mL flask was added 2.4 g of 3,9-dihydrocyclopenta[b]fluorene-1(2H)-ketoxime, and dissolved in 50 mL of ethyl acetate. This was cooled to 0° C., and 1.5 g of triethylamine was added thereto. Further, 1.2 g of acetyl chloride was added dropwise over 30 minutes, followed by further stirring at 25° C. for 2 hours. Liquid separation was performed by ethyl acetate 200mL and pure water 100mL, the organic layer was dried with magnesium sulfate, filtered, and distilled off under reduced pressure to obtain 2.4 g of radical polymerization initiator A-1 (yield is 90%).

-合成例2:自由基聚合起始劑A-4的合成- 在1L燒瓶中添加茀50g,並使其溶解於四氫呋喃(THF)500mL。將其冷卻至0℃,分5次添加了三級丁氧基鉀80.1g。進而經1小時在0℃下滴加1-溴丙烷88.6g,緩慢升溫至室溫,並在室溫下進一步攪拌了24小時。藉由純水1L和乙酸乙酯1L對所獲得之反應液進行分液,用硫酸鎂乾燥有機層並在減壓下蒸餾去除,由此獲得了作為橙色結晶的9,9-二丙基茀69g(產率為92%)。 在500mL燒瓶中添加9,9-二丙基茀25g,並使其溶解於氯苯200mL。將其冷卻至0℃並添加氯化鋁30g之後,經1小時滴加2-溴基異丁醯溴20.7g,恢復至室溫後進一步攪拌了4小時。將所獲得之反應液投入冰水1L中,濾取析出的固體,並用甲醇進行再結晶,由此獲得了9,9-二丙基-2-甲基-3,9-二氫環戊[b]茀-1(2H)-酮21.5g(產率為70%)。 在200mL燒瓶中添加鹽酸羥胺7.8g和乙酸鈉10g,並使其溶解於N,N-二甲基乙醯胺100mL及純水50mL的混合溶劑。添加9,9-二丙基-2-甲基-3,9-二氫環戊[b]茀-1(2H)-酮4.9g,在50℃下加熱攪拌了48小時。將用純水使反應液結晶化而得之結晶用乙腈進行再結晶,由此獲得了9,9-二丙基-2-甲基-3,9-二氫環戊[b]茀-1(2H)-酮肟4.3g(產率為83%)。 在200mL燒瓶中添加9,9-二丙基-2-甲基-3,9-二氫環戊[b]茀-1(2H)-酮肟4.3g並溶解於乙酸乙酯50mL。將其冷卻至0℃,並添加了三乙胺3.0g。經30分鐘進一步滴加乙醯氯2.4g,進而在25℃下攪拌了2小時。藉由乙酸乙酯200mL和純水100mL進行分液,用硫酸鎂乾燥有機層之後進行過濾,在減壓下蒸餾去除,由此獲得了3.9g的自由基聚合起始劑A-4(產率為87%)。 -Synthesis example 2: Synthesis of radical polymerization initiator A-4- 50 g of terpene was added to a 1 L flask, and dissolved in 500 mL of tetrahydrofuran (THF). This was cooled to 0° C., and 80.1 g of potassium tertiary butoxide was added in five portions. Furthermore, 88.6 g of 1-bromopropane was dripped at 0 degreeC over 1 hour, it heated up gradually to room temperature, and it stirred at room temperature further for 24 hours. The obtained reaction solution was separated with 1 L of pure water and 1 L of ethyl acetate, and the organic layer was dried over magnesium sulfate and distilled off under reduced pressure to obtain 9,9-dipropylterpineol as orange crystals. 69 g (92% yield). 25 g of 9,9-dipropyl terpene was added to a 500 mL flask, and it was dissolved in 200 mL of chlorobenzene. After cooling this to 0° C. and adding 30 g of aluminum chloride, 20.7 g of 2-bromoisobutyryl bromide was added dropwise over 1 hour, and after returning to room temperature, the mixture was stirred for further 4 hours. The obtained reaction solution was poured into 1 L of ice water, and the precipitated solid was collected by filtration and recrystallized with methanol to obtain 9,9-dipropyl-2-methyl-3,9-dihydrocyclopenta[ b] fennel-1(2H)-one 21.5 g (70% yield). In a 200 mL flask, 7.8 g of hydroxylamine hydrochloride and 10 g of sodium acetate were added, and dissolved in a mixed solvent of 100 mL of N,N-dimethylacetamide and 50 mL of pure water. 4.9 g of 9,9-dipropyl-2-methyl-3,9-dihydrocyclopenta[b]fluorene-1(2H)-one was added, and it heated and stirred at 50 degreeC for 48 hours. The crystals obtained by crystallizing the reaction solution with pure water were recrystallized with acetonitrile to obtain 9,9-dipropyl-2-methyl-3,9-dihydrocyclopenta[b]terrene-1 (2H)-Ketoxime 4.3 g (83% yield). In a 200 mL flask, 4.3 g of 9,9-dipropyl-2-methyl-3,9-dihydrocyclopenta[b]fluorene-1(2H)-ketoxime was added and dissolved in 50 mL of ethyl acetate. This was cooled to 0° C., and 3.0 g of triethylamine was added thereto. Further, 2.4 g of acetyl chloride was added dropwise over 30 minutes, followed by further stirring at 25° C. for 2 hours. Liquid separation was performed by ethyl acetate 200mL and pure water 100mL, the organic layer was dried with magnesium sulfate, filtered, and distilled off under reduced pressure to obtain 3.9 g of radical polymerization initiator A-4 (yield 87%).

-合成例3:自由基聚合起始劑A-64的合成- 在合成例1中,將茀變更為9,9-二丙基茀,將3-氯丙醯氯變更為3-氯丙醯氯,除此以外,以相同的方法合成了3-甲基-9,9-二丙基-3,9-二氫環戊[b]茀-1(2H)-酮。 在200mL燒瓶中添加3-甲基-9,9-二丙基-3,9-二氫環戊[b]茀-1(2H)-酮7.2g並溶解於THF。冷卻至0℃,添加甲醇鈉甲醇28%溶液5.1g,並添加亞硝酸異戊酯3.2g,在0℃下攪拌了4小時。將用純水使反應液結晶化而得之結晶用乙腈進行再結晶,由此獲得了2-(羥基亞胺基)-3-甲基-9,9-二丙基-3,9-二氫環戊[b]茀-1(2H)-酮8.1g(產率為79%)。 在200mL燒瓶中添加2-(羥基亞胺基)-3-甲基-9,9-二丙基-3,9-二氫環戊[b]茀-1(2H)-酮3.5g並溶解於乙酸乙酯50mL。將其冷卻至0℃,並添加了三乙胺1.9g。經30分鐘進一步滴加乙醯氯1.5g,進而在25℃下攪拌了2小時。藉由乙酸乙酯200mL和純水100mL進行分液,用硫酸鎂乾燥有機層之後進行過濾,在減壓下蒸餾去除,由此獲得了3.0g的自由基聚合起始劑A-64(產率為88%)。 -Synthesis example 3: Synthesis of radical polymerization initiator A-64- In Synthesis Example 1, 3-methyl- 9,9-Dipropyl-3,9-dihydrocyclopenta[b]fluorene-1(2H)-one. 7.2 g of 3-methyl-9,9-dipropyl-3,9-dihydrocyclopenta[b]fluorene-1(2H)-one was added to a 200 mL flask and dissolved in THF. After cooling to 0° C., 5.1 g of a sodium methoxide methanol 28% solution was added, and 3.2 g of isoamyl nitrite was added thereto, followed by stirring at 0° C. for 4 hours. The crystals obtained by crystallizing the reaction solution with pure water were recrystallized with acetonitrile to obtain 2-(hydroxyimino)-3-methyl-9,9-dipropyl-3,9-di Hydrocyclopenta[b]fluorene-1(2H)-one 8.1 g (79% yield). Add 3.5 g of 2-(hydroxyimino)-3-methyl-9,9-dipropyl-3,9-dihydrocyclopenta[b]fluorene-1(2H)-one to a 200 mL flask and dissolve In ethyl acetate 50mL. This was cooled to 0° C., and 1.9 g of triethylamine was added thereto. Further, 1.5 g of acetyl chloride was added dropwise over 30 minutes, followed by further stirring at 25° C. for 2 hours. Liquid separation was performed by ethyl acetate 200mL and pure water 100mL, the organic layer was dried with magnesium sulfate, filtered, and distilled off under reduced pressure to obtain 3.0 g of radical polymerization initiator A-64 (yield was 88%).

-合成例4:上述以外的自由基聚合起始劑的合成方法- 除了變更原料等以外,以與合成例1類似的方法,分別獲得了自由基聚合起始劑A-2、A-3、A-5~A-63及A-65~A-131。 -Synthesis example 4: Synthesis method of radical polymerization initiators other than the above- Radical polymerization initiators A-2, A-3, A-5 to A-63, and A-65 to A-131 were obtained in a similar manner to Synthesis Example 1, except that the raw materials were changed.

<分散液的製造> 將混合了下述表1中記載之原料之混合液,利用珠磨機(二氧化鋯珠0.1mm直徑),混合並分散了3小時。接著,使用附減壓機構之高壓分散機NANO-3000-10(Nippon BEE Co.,Ltd.製),在壓力2,000kg/cm 2及流量500g/分鐘的條件下進行了分散處理。將該分散處理重複至總計10次而獲得了分散液。表示下述表1中記載之配合量之數值為質量份。另外,分散劑的配合量的數值為以固體成分換算計的數值。 <Manufacture of Dispersion Liquid> A mixed liquid obtained by mixing the raw materials listed in Table 1 below was mixed and dispersed for 3 hours using a bead mill (zirconia beads with a diameter of 0.1 mm). Next, dispersion treatment was carried out at a pressure of 2,000 kg/cm 2 and a flow rate of 500 g/min using a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a decompression mechanism. This dispersion treatment was repeated a total of 10 times to obtain a dispersion liquid. The numerical values showing the compounding amounts described in the following Table 1 are parts by mass. In addition, the numerical value of the compounding quantity of a dispersing agent is a numerical value in conversion of a solid content.

[表1]    著色劑 顏料衍生物 樹脂(分散劑) 溶劑 PR 264 PR 254 PR 291 PO 71 PG 36 PG 58 PY 129 PY 139 PY 185 PY 215 PB 16 PB 15:6 IR 色素 TiBk 氧氮化Zr 衍生物 S-1 衍生物 S-2 P-1 P-2 P-3 P-4 P-5 S-1 S-2 S-3 分散液R1 10.4 - - - - - - - - - - - - - - - 5.6 7.8 - - - - 76.2 - - 分散液R2 - 12.1 - - - - - - - - - - - - - - 5.6 - 8.2 - - - 65.0 9.1 - 分散液R3 - - 13.1 - - - - - - - - - - - - - 4.6 - - 10.5 - - - 2.0 69.8 分散液R4 - - - 11.5 - - - - - - - - - - - - 5.0 - - - 8.3 - 75.2 - - 分散液R5 - - - 8.3 - - - - - 3.9 - - - - - 5.2 - - - 8.5 - - 59.8 - 14.3 分散液R6 - 15.5 - - - - - 5.3 - - - - - - - - 3.3 - 3.8 - - - 72.1 - - 分散液R7 - 15.5 - - - - - 5.3 - - - - - - - - - - 7.1 - - - 72.1 - - 分散液G1 - - - - 13.0 - - - - - - - - - - 5.2 - 9.8 - - - - 72.0 - - 分散液G2 - - - - - 11.9 - - - - - - - - - 1.2 4.0 - 10.3 - - - 64.8 7.8 - 分散液G3 - - - - 8.9 - 1.5 - 2.0 - - - - - - 5.2 - - - 10.2 - - 64.8 - 7.4 分散液G4 - - - - - 8.9 1.5 - 2.0 - - - - - - - 6.2 - - - 9.7 - 64.8 - 6.9 分散液G5 - - - - 8.9 - - - 3.6 - - - - - - - 5.8 - - - - 10.7 64.8 6.2 - 分散液B1 - - - - - - - - - - 10.1 - - - - 5.3 - 8.7 - - - - 64.8 - 11.1 分散液B2 - - - - - - - - - - 10.1 - - - - 5.6 - - 8.9 - - - 64.8 10.6 - 分散液B3 - - - - - - - - - - 5.0 5.0 - - - - 5.7 - - 7.5 - - 64.8 12.0 - 分散液B4 - - - - - - - - - - - 10.4 - - - - 5.5 - - - 7.4 - 64.8 - 11.9 分散液B5 - - - - - - - - - - - 10.4 - - - - 5.9 - - 6.9 - - 64.8 - 12.0 分散液I1 - - - - - - - - - - - - 5.3 - - - 6.3 9.3 - - - - 14.3 - 64.8 分散液I2 - - - - - - - - - - - - 6.2 - - 6.6 - - 9.4 - - - - - 77.8 分散液I3 - - - - - - - - - - - - 6.6 - - - 4.8 - - 7.3 - - - - 81.3 分散液Bk1 5.5 - - - - - - - - - 5.5 - - - - - 5.3 7.1 - - - - 76.6 - - 分散液Bk2 7.8 - - - - - - - - - 7.0 - - - - - 5.0 - 7.5 - - - 64.8 7.9 - 分散液Bk3 7.8 - - - - - - - - 1.5 3.5 - - - - 1.2 5.0 - - 7.8 - - 64.8 - 8.4 分散液Bk4 - 7.3 - - - - - - - - 3.8 - - - - 6.2 - - - - 7.9 - 64.8 10.0 - 分散液Bk5 - - 7.3 - - - - - - - 3.8 - - - - 5.2 5.6 - - - - 7.4 70.7 - - 分散液TBk1 - - - - - - - - - - - - - 16.8 - - 4.9 10.4 - - - - 64.8 3.1 - 分散液TBk2 - - - - - - - - - - - - - 16.8 - 0.5 5.6 - 10.2 - - - 55.6 - 11.3 分散液TBk3 - - - - - - - - - - - - - 7.8 7.8 - 5.2 - - 9.5 - - 55.6 - 14.1 分散液TBk4 - - - - - - - - - - - - - - 16.2 1.0 4.2 - - - 11.8 - 66.8 - - 分散液TBk5 - - - - - - - - - - - - - - 16.2 - 6.2 - - - - 9.2 68.4 - - [Table 1] Colorant Pigment derivatives Resin (dispersant) solvent PR 264 PR 254 PR 291 PO 71 PG 36 PG 58 PY 129 PY 139 PY 185 PY 215 PB 16 PB 15:6 IR pigment ikB Oxynitride Zr Derivative S-1 Derivative S-2 P-1 P-2 P-3 P-4 P-5 S-1 S-2 S-3 Dispersion R1 10.4 - - - - - - - - - - - - - - - 5.6 7.8 - - - - 76.2 - - Dispersion R2 - 12.1 - - - - - - - - - - - - - - 5.6 - 8.2 - - - 65.0 9.1 - Dispersion R3 - - 13.1 - - - - - - - - - - - - - 4.6 - - 10.5 - - - 2.0 69.8 Dispersion R4 - - - 11.5 - - - - - - - - - - - - 5.0 - - - 8.3 - 75.2 - - Dispersion R5 - - - 8.3 - - - - - 3.9 - - - - - 5.2 - - - 8.5 - - 59.8 - 14.3 Dispersion R6 - 15.5 - - - - - 5.3 - - - - - - - - 3.3 - 3.8 - - - 72.1 - - Dispersion R7 - 15.5 - - - - - 5.3 - - - - - - - - - - 7.1 - - - 72.1 - - Dispersion G1 - - - - 13.0 - - - - - - - - - - 5.2 - 9.8 - - - - 72.0 - - Dispersion G2 - - - - - 11.9 - - - - - - - - - 1.2 4.0 - 10.3 - - - 64.8 7.8 - Dispersion G3 - - - - 8.9 - 1.5 - 2.0 - - - - - - 5.2 - - - 10.2 - - 64.8 - 7.4 Dispersion G4 - - - - - 8.9 1.5 - 2.0 - - - - - - - 6.2 - - - 9.7 - 64.8 - 6.9 Dispersion G5 - - - - 8.9 - - - 3.6 - - - - - - - 5.8 - - - - 10.7 64.8 6.2 - Dispersion B1 - - - - - - - - - - 10.1 - - - - 5.3 - 8.7 - - - - 64.8 - 11.1 Dispersion B2 - - - - - - - - - - 10.1 - - - - 5.6 - - 8.9 - - - 64.8 10.6 - Dispersion B3 - - - - - - - - - - 5.0 5.0 - - - - 5.7 - - 7.5 - - 64.8 12.0 - Dispersion B4 - - - - - - - - - - - 10.4 - - - - 5.5 - - - 7.4 - 64.8 - 11.9 Dispersion B5 - - - - - - - - - - - 10.4 - - - - 5.9 - - 6.9 - - 64.8 - 12.0 Dispersion I1 - - - - - - - - - - - - 5.3 - - - 6.3 9.3 - - - - 14.3 - 64.8 Dispersion I2 - - - - - - - - - - - - 6.2 - - 6.6 - - 9.4 - - - - - 77.8 Dispersion I3 - - - - - - - - - - - - 6.6 - - - 4.8 - - 7.3 - - - - 81.3 Dispersion Bk1 5.5 - - - - - - - - - 5.5 - - - - - 5.3 7.1 - - - - 76.6 - - Dispersion Bk2 7.8 - - - - - - - - - 7.0 - - - - - 5.0 - 7.5 - - - 64.8 7.9 - Dispersion Bk3 7.8 - - - - - - - - 1.5 3.5 - - - - 1.2 5.0 - - 7.8 - - 64.8 - 8.4 Dispersion Bk4 - 7.3 - - - - - - - - 3.8 - - - - 6.2 - - - - 7.9 - 64.8 10.0 - Dispersion Bk5 - - 7.3 - - - - - - - 3.8 - - - - 5.2 5.6 - - - - 7.4 70.7 - - Dispersion TBk1 - - - - - - - - - - - - - 16.8 - - 4.9 10.4 - - - - 64.8 3.1 - Dispersion TBk2 - - - - - - - - - - - - - 16.8 - 0.5 5.6 - 10.2 - - - 55.6 - 11.3 Dispersion TBk3 - - - - - - - - - - - - - 7.8 7.8 - 5.2 - - 9.5 - - 55.6 - 14.1 Dispersion TBk4 - - - - - - - - - - - - - - 16.2 1.0 4.2 - - - 11.8 - 66.8 - - Dispersion TBk5 - - - - - - - - - - - - - - 16.2 - 6.2 - - - - 9.2 68.4 - -

以表示上述分散液的配方之表1中的縮寫表示之材料的詳細內容為如下。The details of the materials represented by the abbreviations in Table 1 representing the formulation of the above dispersion liquid are as follows.

<著色劑> PR264:C.I.顏料紅264[二酮吡咯并吡咯化合物,紅色顏料(R顏料)] PR254:C.I.顏料紅254[二酮吡咯并吡咯化合物,紅色顏料(R顏料)] PR291:C.I.顏料紅291[溴化二酮吡咯并吡咯化合物,紅色顏料(R顏料)] PO71:C.I.顏料橙71[二酮吡咯并吡咯化合物,橙色顏料(O顏料)] PG36:C.I.顏料綠36[銅酞菁錯合物,綠色顏料(G顏料)] PG58:C.I.顏料綠58[鋅酞菁錯合物,綠色顏料(G顏料)] PY129:C.I.顏料黃129[甲亞胺銅錯合物,黃色顏料(Y顏料)] PY139:C.I.顏料黃139[異吲哚啉化合物,黃色顏料(Y顏料)] PY185:C.I.顏料黃185[異吲哚啉化合物,黃色顏料(Y顏料)] PY215:C.I.顏料黃215[蝶啶化合物,黃色顏料(Y顏料)] PB16:C.I.顏料藍16[無金屬酞菁化合物,藍色顏料(B顏料)] PB15:6:C.I.顏料藍15:6[銅酞菁錯合物、藍色顏料(B顏料)] IR色素:下述結構的化合物(近紅外線吸收顏料,下述結構式中,Me表示甲基,Ph表示苯基。) <Coloring agent> PR264: C.I. Pigment Red 264 [diketopyrrolopyrrole compound, red pigment (R pigment)] PR254: C.I. Pigment Red 254 [diketopyrrolopyrrole compound, red pigment (R pigment)] PR291: C.I. Pigment Red 291 [brominated diketopyrrolopyrrole compound, red pigment (R pigment)] PO71: C.I. Pigment Orange 71 [diketopyrrolopyrrole compound, orange pigment (O pigment)] PG36: C.I. Pigment Green 36 [copper phthalocyanine complex, green pigment (G pigment)] PG58: C.I. Pigment Green 58 [zinc phthalocyanine complex, green pigment (G pigment)] PY129: C.I. Pigment Yellow 129 [formimine copper complex, yellow pigment (Y pigment)] PY139: C.I. Pigment Yellow 139 [isoindoline compound, yellow pigment (Y pigment)] PY185: C.I. Pigment Yellow 185 [isoindoline compound, yellow pigment (Y pigment)] PY215: C.I. Pigment Yellow 215 [pteridine compound, yellow pigment (Y pigment)] PB16: C.I. Pigment Blue 16 [metal-free phthalocyanine compound, blue pigment (B pigment)] PB15:6: C.I. Pigment Blue 15:6 [copper phthalocyanine complex, blue pigment (B pigment)] IR pigment: a compound with the following structure (near-infrared absorbing pigment, in the following structural formula, Me represents a methyl group, and Ph represents a phenyl group.)

[化學式50]

Figure 02_image100
[chemical formula 50]
Figure 02_image100

TiBk:鈦黑[黑色顏料(Bk顏料)] 氧氮化Zr:氧氮化鋯[黑色顏料(Bk顏料)] TiBk: Titanium black [black pigment (Bk pigment)] Zr Oxynitride: Zirconium Oxynitride [Black Pigment (Bk Pigment)]

<顏料衍生物> 衍生物S-1:下述化合物 衍生物S-2:下述化合物 <Pigment Derivatives> Derivative S-1: the following compound Derivative S-2: the following compound

[化學式51]

Figure 02_image102
[chemical formula 51]
Figure 02_image102

<分散劑> P-1:下述結構的樹脂的30質量%丙二醇單甲醚丙烯酸酯(PGMEA)溶液。主鏈中標註之數值為莫耳比,側鏈中標註之數值為重複單元數。Mw:20,000。 <Dispersant> P-1: 30 mass % propylene glycol monomethyl ether acrylate (PGMEA) solution of the resin of the following structure. The value marked in the main chain is the molar ratio, and the value marked in the side chain is the number of repeating units. Mw: 20,000.

[化學式52]

Figure 02_image104
[chemical formula 52]
Figure 02_image104

P-2:下述結構的樹脂的30質量%PGMEA溶液。主鏈中標註之數值為莫耳比,側鏈中標註之數值為重複單元數。Mw:28,000。式中,r=15、s=63、t=5、u=17、n=9。P-2: 30 mass % PGMEA solution of the resin of the following structure. The value marked in the main chain is the molar ratio, and the value marked in the side chain is the number of repeating units. Mw: 28,000. In the formula, r=15, s=63, t=5, u=17, n=9.

[化學式53]

Figure 02_image106
[chemical formula 53]
Figure 02_image106

P-3:下述結構的樹脂的30質量%PGMEA溶液。主鏈中標註之數值為莫耳比,側鏈中標註之數值為重複單元數。Mw:21,000。P-3: 30 mass % PGMEA solution of the resin of the following structure. The value marked in the main chain is the molar ratio, and the value marked in the side chain is the number of repeating units. Mw: 21,000.

[化學式54]

Figure 02_image108
[chemical formula 54]
Figure 02_image108

P-4:下述結構的樹脂的30質量%PGMEA溶液。側鏈中標註之數值為重複單元數。Mw:9,000。P-4: 30 mass % PGMEA solution of the resin of the following structure. The value marked in the side chain is the number of repeating units. Mw: 9,000.

[化學式55]

Figure 02_image110
[chemical formula 55]
Figure 02_image110

P-5:下述結構的樹脂的30質量%PGMEA溶液。側鏈中標註之數值為重複單元數。Mw:10,000。P-5: 30 mass % PGMEA solution of the resin of the following structure. The value marked in the side chain is the number of repeating units. Mw: 10,000.

[化學式56]

Figure 02_image112
[chemical formula 56]
Figure 02_image112

<溶劑> S-1:丙二醇單甲醚乙酸酯(PGMEA) S-2:丙二醇單甲醚(PGME) S-3:環己酮 <Solvent> S-1: Propylene Glycol Monomethyl Ether Acetate (PGMEA) S-2: Propylene Glycol Monomethyl Ether (PGME) S-3: Cyclohexanone

(實施例1~154、比較例1~8] <硬化性組成物的製造> 混合下述表2~表5中記載之分散液、下述表2~表5中記載之樹脂、下述表2~表5中記載之自由基聚合性化合物、下述表2~表5中記載之自由基聚合起始劑、下述表2~表5中記載之溶劑、環氧化合物(EHPE-3150,Daicel Corporation製)1質量份、紫外線吸收劑(TINUVIN326,BASF公司製)1質量份、以下所示之1質量份的界面活性劑1、聚合抑制劑(對甲氧基苯酚)0.1質量份,分別製作了實施例及比較例的硬化性組成物。 (Examples 1-154, Comparative Examples 1-8] <Manufacture of curable composition> Mix the dispersions listed in the following Tables 2 to 5, the resins listed in the following Tables 2 to 5, the radical polymerizable compounds listed in the following Tables 2 to 5, and the following Tables 2 to 5. The radical polymerization initiator described, the solvent described in the following Tables 2 to 5, epoxy compound (EHPE-3150, manufactured by Daicel Corporation) 1 part by mass, ultraviolet absorber (TINUVIN326, manufactured by BASF Corporation) 1 part by mass , 1 part by mass of the surfactant 1 shown below, and 0.1 part by mass of the polymerization inhibitor (p-methoxyphenol), the curable compositions of Examples and Comparative Examples were produced, respectively.

界面活性劑1:KF-6001(Shin-Etsu Chemical Co.,Ltd.製)的1質量%PGMEA溶液。Surfactant 1: 1% by mass PGMEA solution of KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd.).

[表2]    分散液 樹脂 自由基聚合性 化合物 自由基聚合 起始劑 溶劑 種類 質量份 種類 質量份 種類 質量份 種類 質量份 種類 質量份 實施例1 分散液R1 44.6 Ba-1 3.0 D-1 5.0 A-1 3.0 S-1 44.4 實施例2 分散液R2 44.6 Ba-1 2.0 D-2 10.0 A-2 3.0 S-1 40.4 實施例3 分散液R3 46.4 Ba-1 4.0 D-3 4.0 A-3 3.0 S-1 42.6 實施例4 分散液R4 44.6 Ba-1 2.0 D-4 3.0 A-4 3.0 S-3 47.4 實施例5 分散液R5 43.4 Ba-1 5.0 D-5 3.0 A-5 3.0 S-3 45.6 實施例6 分散液G1 48.6 Ba-1 5.0 D-1 3.0 A-6 3.0 S-3 40.4 實施例7 分散液G2 45.0 Ba-1 5.0 D-2 3.0 A-7 3.0 S-3 44.0 實施例8 分散液G3 45.9 Ba-1 5.0 D-3 5.0 A-8 3.0 S-3 41.1 實施例9 分散液G4 47.2 Ba-1 5.0 D-4 5.0 A-9 3.0 S-3 39.8 實施例10 分散液G5 43.6 Ba-1 5.0 D-5 4.0 A-10 3.0 S-1 44.4 實施例11 分散液B1 46.9 Ba-1 5.0 D-1 4.0 A-11 3.0 S-3 41.1 實施例12 分散液B2 45.0 Ba-1 5.0 D-2 4.0 A-12 3.0 S-1 43.0 實施例13 分散液B3 45.0 Ba-1 5.0 D-3 3.0 A-13 3.0 S-1 44.0 實施例14 分散液B4 45.0 Ba-1 5.0 D-4 3.0 A-14 3.0 S-1 44.0 實施例15 分散液B5 45.0 Ba-2 5.0 D-5 2.0 A-15 3.0 S-1 45.0 實施例16 分散液I1 42.5 Ba-2 3.0 D-1 5.0 A-16 3.0 S-3 46.5 實施例17 分散液I2 42.0 Ba-2 3.0 D-2 5.0 A-17 3.0 S-3 47.0 實施例18 分散液I3 45.0 Ba-2 3.0 D-3 5.0 A-18 3.0 S-3 44.0 實施例19 分散液Bk1 50.0 Ba-2 3.0 D-4 5.0 A-19 3.0 S-3 39.0 實施例20 分散液Bk2 58.0 Ba-2 3.0 D-5 5.0 A-20 3.0 S-3 31.0 實施例21 分散液Bk3 47.9 Ba-2 3.0 D-1 5.0 A-21 3.0 S-3 41.1 實施例22 分散液Bk4 42.4 Ba-2 3.0 D-2 5.0 A-22 3.0 S-3 46.6 實施例23 分散液Bk5 46.7 Ba-2 3.0 D-3 2.0 A-23 3.0 S-3 45.3 實施例24 分散液TBk1 45.1 Ba-2 3.0 D-4 5.0 A-24 3.0 S-1 43.9 實施例25 分散液TBk2 48.0 Ba-2 4.0 D-5 5.0 A-25 3.0 S-1 40.0 實施例26 分散液TBk3 43.8 Ba-2 4.0 D-1 2.0 A-26 3.0 S-1 47.2 實施例27 分散液TBk4 44.1 Ba-2 4.0 D-2 5.0 A-27 3.0 S-1 43.9 實施例28 分散液TBk5 49.2 Ba-2 4.0 D-3 5.0 A-28 3.0 S-3 38.8 實施例29 分散液R1 46.4 Ba-2 3.0 D-4 5.0 A-29 3.0 S-3 42.6 實施例30 分散液R2 46.8 Ba-3 3.0 D-5 2.0 A-30 3.0 S-3 45.2 實施例31 分散液R3 43.7 Ba-3 3.0 D-1 5.0 A-31 3.0 S-3 45.3 實施例32 分散液R4 40.2 Ba-3 3.0 D-2 5.0 A-32 3.0 S-3 48.8 實施例33 分散液R5 45.0 Ba-3 3.0 D-3 5.0 A-33 3.0 S-1 44.0 實施例34 分散液G1 45.0 Ba-3 3.0 D-4 5.0 A-34 3.0 S-1 44.0 實施例35 分散液G2 45.0 Ba-3 3.0 D-5 5.0 A-35 3.0 S-1 44.0 實施例36 分散液G3 45.0 Ba-3 3.0 D-1 5.0 A-36 3.0 S-1 44.0 實施例37 分散液G4 45.0 Ba-3 3.0 D-2 2.0 A-37 3.0 S-1 47.0 實施例38 分散液G5 45.0 Ba-3 3.0 D-3 5.0 A-38 3.0 S-1 44.0 實施例39 分散液B1 43.8 Ba-3 3.0 D-4 2.0 A-39 3.0 S-1 48.2 實施例40 分散液B2 46.6 Ba-3 3.0 D-5 5.0 A-40 3.0 S-1 42.4 實施例41 分散液B3 49.8 Ba-3 3.0 D-1 5.0 A-41 3.0 S-1 39.2 實施例42 分散液B4 40.3 Ba-3 3.0 D-2 2.0 A-42 3.0 S-3 51.7 實施例43 分散液B5 47.1 Ba-3 3.0 D-3 5.0 A-43 3.0 S-3 41.9 實施例44 分散液R2 46.3 Ba-1 12.0 D-4 5.0 A-44 2.0 S-3 34.7 實施例45 分散液R3 45.9 Ba-1 8.0 D-5 5.0 A-45 2.0 S-3 39.1 [Table 2] Dispersions resin free radical polymerizable compound Free Radical Polymerization Initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 1 Dispersion R1 44.6 Ba-1 3.0 D-1 5.0 A-1 3.0 S-1 44.4 Example 2 Dispersion R2 44.6 Ba-1 2.0 D-2 10.0 A-2 3.0 S-1 40.4 Example 3 Dispersion R3 46.4 Ba-1 4.0 D-3 4.0 A-3 3.0 S-1 42.6 Example 4 Dispersion R4 44.6 Ba-1 2.0 D-4 3.0 A-4 3.0 S-3 47.4 Example 5 Dispersion R5 43.4 Ba-1 5.0 D-5 3.0 A-5 3.0 S-3 45.6 Example 6 Dispersion G1 48.6 Ba-1 5.0 D-1 3.0 A-6 3.0 S-3 40.4 Example 7 Dispersion G2 45.0 Ba-1 5.0 D-2 3.0 A-7 3.0 S-3 44.0 Example 8 Dispersion G3 45.9 Ba-1 5.0 D-3 5.0 A-8 3.0 S-3 41.1 Example 9 Dispersion G4 47.2 Ba-1 5.0 D-4 5.0 A-9 3.0 S-3 39.8 Example 10 Dispersion G5 43.6 Ba-1 5.0 D-5 4.0 A-10 3.0 S-1 44.4 Example 11 Dispersion B1 46.9 Ba-1 5.0 D-1 4.0 A-11 3.0 S-3 41.1 Example 12 Dispersion B2 45.0 Ba-1 5.0 D-2 4.0 A-12 3.0 S-1 43.0 Example 13 Dispersion B3 45.0 Ba-1 5.0 D-3 3.0 A-13 3.0 S-1 44.0 Example 14 Dispersion B4 45.0 Ba-1 5.0 D-4 3.0 A-14 3.0 S-1 44.0 Example 15 Dispersion B5 45.0 Ba-2 5.0 D-5 2.0 A-15 3.0 S-1 45.0 Example 16 Dispersion I1 42.5 Ba-2 3.0 D-1 5.0 A-16 3.0 S-3 46.5 Example 17 Dispersion I2 42.0 Ba-2 3.0 D-2 5.0 A-17 3.0 S-3 47.0 Example 18 Dispersion I3 45.0 Ba-2 3.0 D-3 5.0 A-18 3.0 S-3 44.0 Example 19 Dispersion Bk1 50.0 Ba-2 3.0 D-4 5.0 A-19 3.0 S-3 39.0 Example 20 Dispersion Bk2 58.0 Ba-2 3.0 D-5 5.0 A-20 3.0 S-3 31.0 Example 21 Dispersion Bk3 47.9 Ba-2 3.0 D-1 5.0 A-21 3.0 S-3 41.1 Example 22 Dispersion Bk4 42.4 Ba-2 3.0 D-2 5.0 A-22 3.0 S-3 46.6 Example 23 Dispersion Bk5 46.7 Ba-2 3.0 D-3 2.0 A-23 3.0 S-3 45.3 Example 24 Dispersion TBk1 45.1 Ba-2 3.0 D-4 5.0 A-24 3.0 S-1 43.9 Example 25 Dispersion TBk2 48.0 Ba-2 4.0 D-5 5.0 A-25 3.0 S-1 40.0 Example 26 Dispersion TBk3 43.8 Ba-2 4.0 D-1 2.0 A-26 3.0 S-1 47.2 Example 27 Dispersion TBk4 44.1 Ba-2 4.0 D-2 5.0 A-27 3.0 S-1 43.9 Example 28 Dispersion TBk5 49.2 Ba-2 4.0 D-3 5.0 A-28 3.0 S-3 38.8 Example 29 Dispersion R1 46.4 Ba-2 3.0 D-4 5.0 A-29 3.0 S-3 42.6 Example 30 Dispersion R2 46.8 Ba-3 3.0 D-5 2.0 A-30 3.0 S-3 45.2 Example 31 Dispersion R3 43.7 Ba-3 3.0 D-1 5.0 A-31 3.0 S-3 45.3 Example 32 Dispersion R4 40.2 Ba-3 3.0 D-2 5.0 A-32 3.0 S-3 48.8 Example 33 Dispersion R5 45.0 Ba-3 3.0 D-3 5.0 A-33 3.0 S-1 44.0 Example 34 Dispersion G1 45.0 Ba-3 3.0 D-4 5.0 A-34 3.0 S-1 44.0 Example 35 Dispersion G2 45.0 Ba-3 3.0 D-5 5.0 A-35 3.0 S-1 44.0 Example 36 Dispersion G3 45.0 Ba-3 3.0 D-1 5.0 A-36 3.0 S-1 44.0 Example 37 Dispersion G4 45.0 Ba-3 3.0 D-2 2.0 A-37 3.0 S-1 47.0 Example 38 Dispersion G5 45.0 Ba-3 3.0 D-3 5.0 A-38 3.0 S-1 44.0 Example 39 Dispersion B1 43.8 Ba-3 3.0 D-4 2.0 A-39 3.0 S-1 48.2 Example 40 Dispersion B2 46.6 Ba-3 3.0 D-5 5.0 A-40 3.0 S-1 42.4 Example 41 Dispersion B3 49.8 Ba-3 3.0 D-1 5.0 A-41 3.0 S-1 39.2 Example 42 Dispersion B4 40.3 Ba-3 3.0 D-2 2.0 A-42 3.0 S-3 51.7 Example 43 Dispersion B5 47.1 Ba-3 3.0 D-3 5.0 A-43 3.0 S-3 41.9 Example 44 Dispersion R2 46.3 Ba-1 12.0 D-4 5.0 A-44 2.0 S-3 34.7 Example 45 Dispersion R3 45.9 Ba-1 8.0 D-5 5.0 A-45 2.0 S-3 39.1

[表3]    分散液 樹脂 自由基聚合性 化合物 自由基聚合 起始劑 溶劑 種類 質量份 種類 質量份 種類 質量份 種類 質量份 種類 質量份 實施例46 分散液G3 44.1 Ba-1 8.0 D-1 2.0 A-46 2.0 S-3 43.9 實施例47 分散液B5 45.9 Ba-1 8.0 D-2 2.0 A-47 2.0 S-3 42.1 實施例48 分散液Bk1 44.6 Ba-1 8.0 D-3 5.0 A-48 2.0 S-3 40.4 實施例49 分散液Bk3 44.6 Ba-1 8.0 D-4 5.0 A-49 2.0 S-3 40.4 實施例50 分散液TBk2 46.4 Ba-2 8.0 D-5 5.0 A-50 2.0 S-3 38.6 實施例51 分散液R2 44.6 Ba-2 5.0 D-1 2.0 A-51 2.0 S-1 46.4 實施例52 分散液R3 43.4 Ba-2 5.0 D-2 2.0 A-52 2.0 S-1 47.6 實施例53 分散液G3 48.6 Ba-2 5.0 D-3 2.0 A-53 2.0 S-1 42.4 實施例54 分散液B5 45.0 Ba-2 5.0 D-4 2.0 A-54 2.0 S-1 46.0 實施例55 分散液Bk1 45.9 Ba-2 5.0 D-5 5.0 A-55 2.0 S-1 42.1 實施例56 分散液Bk3 47.2 Ba-2 5.0 D-1 2.0 A-56 2.0 S-1 43.8 實施例57 分散液TBk2 43.6 Ba-2 10.0 D-2 6.0 A-57 2.0 S-1 38.4 實施例58 分散液R2 46.9 Ba-2 5.0 D-3 5.0 A-58 2.0 S-1 41.1 實施例59 分散液R3 45.0 Ba-2 5.0 D-4 5.0 A-59 2.0 S-1 43.0 實施例60 分散液G3 45.0 Ba-2 5.0 D-5 5.0 A-60 2.0 S-1 43.0 實施例61 分散液B5 45.0 Ba-2 5.0 D-1 2.0 A-61 2.0 S-1 46.0 實施例62 分散液Bk1 45.0 Ba-2 5.0 D-2 2.0 A-62 2.0 S-1 46.0 實施例63 分散液Bk3 42.5 Ba-2 5.0 D-3 2.0 A-63 2.0 S-1 48.5 實施例64 分散液TBk2 42.0 Ba-2 5.0 D-4 3.0 A-64 2.0 S-1 48.0 實施例65 分散液R2 45.0 Ba-2 5.0 D-5 3.0 A-65 2.0 S-3 45.0 實施例66 分散液R3 50.0 Ba-3 8.0 D-1 5.0 A-66 2.0 S-1 35.0 實施例67 分散液G3 58.0 Ba-3 8.0 D-2 5.0 A-67 2.0 S-1 27.0 實施例68 分散液B5 47.9 Ba-3 8.0 D-3 5.0 A-68 2.0 S-1 37.1 實施例69 分散液Bk1 42.4 Ba-3 8.0 D-4 5.0 A-69 2.0 S-1 42.6 實施例70 分散液Bk3 46.7 Ba-3 8.0 D-5 5.0 A-70 2.0 S-1 38.3 實施例71 分散液TBk2 45.1 Ba-3 8.0 D-1 5.0 A-71 2.0 S-1 39.9 實施例72 分散液R2 48.0 Ba-3 8.0 D-2 5.0 A-72 3.0 S-1 36.0 實施例73 分散液R3 43.8 Ba-3 8.0 D-3 5.0 A-73 3.0 S-1 40.2 實施例74 分散液G3 44.1 Ba-3 8.0 D-4 5.0 A-74 3.0 S-1 39.9 實施例75 分散液B5 49.2 Ba-3 8.0 D-5 5.0 A-75 3.0 S-1 34.8 實施例76 分散液Bk1 44.6 Ba-3 8.0 D-1 5.0 A-76 3.0 S-1 39.4 實施例77 分散液Bk3 44.6 Ba-3 8.0 D-2 5.0 A-77 3.0 S-1 39.4 實施例78 分散液TBk2 46.4 Ba-1 5.0 D-3 5.0 A-78 3.0 S-1 40.6 實施例79 分散液R2 44.6 Ba-1 5.0 D-4 5.0 A-79 3.0 S-1 42.4 實施例80 分散液R3 43.4 Ba-1 5.0 D-5 5.0 A-80 3.0 S-1 43.6 實施例81 分散液G3 48.6 Ba-1 5.0 D-1 5.0 A-81 3.0 S-1 38.4 實施例82 分散液B5 45.0 Ba-1 5.0 D-2 5.0 A-82 3.0 S-1 42.0 實施例83 分散液Bk1 45.9 Ba-1 5.0 D-3 5.0 A-83 3.0 S-1 41.1 實施例84 分散液Bk3 47.2 Ba-1 5.0 D-4 5.0 A-84 3.0 S-1 39.8 實施例85 分散液TBk2 43.6 Ba-1 5.0 D-5 5.0 A-85 3.0 S-1 43.4 實施例86 分散液R2 46.9 Ba-1 5.0 D-1 5.0 A-86 3.0 S-1 40.1 實施例87 分散液R3 45.0 Ba-1 5.0 D-2 5.0 A-87 3.0 S-1 42.0 實施例88 分散液G3 45.0 Ba-1 5.0 D-3 5.0 A-88 3.0 S-1 42.0 實施例89 分散液B5 45.0 Ba-1 5.0 D-4 5.0 A-89 3.0 S-1 42.0 實施例90 分散液Bk1 45.0 Ba-1 5.0 D-5 5.0 A-90 3.0 S-1 42.0 [table 3] Dispersions resin free radical polymerizable compound Free Radical Polymerization Initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 46 Dispersion G3 44.1 Ba-1 8.0 D-1 2.0 A-46 2.0 S-3 43.9 Example 47 Dispersion B5 45.9 Ba-1 8.0 D-2 2.0 A-47 2.0 S-3 42.1 Example 48 Dispersion Bk1 44.6 Ba-1 8.0 D-3 5.0 A-48 2.0 S-3 40.4 Example 49 Dispersion Bk3 44.6 Ba-1 8.0 D-4 5.0 A-49 2.0 S-3 40.4 Example 50 Dispersion TBk2 46.4 Ba-2 8.0 D-5 5.0 A-50 2.0 S-3 38.6 Example 51 Dispersion R2 44.6 Ba-2 5.0 D-1 2.0 A-51 2.0 S-1 46.4 Example 52 Dispersion R3 43.4 Ba-2 5.0 D-2 2.0 A-52 2.0 S-1 47.6 Example 53 Dispersion G3 48.6 Ba-2 5.0 D-3 2.0 A-53 2.0 S-1 42.4 Example 54 Dispersion B5 45.0 Ba-2 5.0 D-4 2.0 A-54 2.0 S-1 46.0 Example 55 Dispersion Bk1 45.9 Ba-2 5.0 D-5 5.0 A-55 2.0 S-1 42.1 Example 56 Dispersion Bk3 47.2 Ba-2 5.0 D-1 2.0 A-56 2.0 S-1 43.8 Example 57 Dispersion TBk2 43.6 Ba-2 10.0 D-2 6.0 A-57 2.0 S-1 38.4 Example 58 Dispersion R2 46.9 Ba-2 5.0 D-3 5.0 A-58 2.0 S-1 41.1 Example 59 Dispersion R3 45.0 Ba-2 5.0 D-4 5.0 A-59 2.0 S-1 43.0 Example 60 Dispersion G3 45.0 Ba-2 5.0 D-5 5.0 A-60 2.0 S-1 43.0 Example 61 Dispersion B5 45.0 Ba-2 5.0 D-1 2.0 A-61 2.0 S-1 46.0 Example 62 Dispersion Bk1 45.0 Ba-2 5.0 D-2 2.0 A-62 2.0 S-1 46.0 Example 63 Dispersion Bk3 42.5 Ba-2 5.0 D-3 2.0 A-63 2.0 S-1 48.5 Example 64 Dispersion TBk2 42.0 Ba-2 5.0 D-4 3.0 A-64 2.0 S-1 48.0 Example 65 Dispersion R2 45.0 Ba-2 5.0 D-5 3.0 A-65 2.0 S-3 45.0 Example 66 Dispersion R3 50.0 Ba-3 8.0 D-1 5.0 A-66 2.0 S-1 35.0 Example 67 Dispersion G3 58.0 Ba-3 8.0 D-2 5.0 A-67 2.0 S-1 27.0 Example 68 Dispersion B5 47.9 Ba-3 8.0 D-3 5.0 A-68 2.0 S-1 37.1 Example 69 Dispersion Bk1 42.4 Ba-3 8.0 D-4 5.0 A-69 2.0 S-1 42.6 Example 70 Dispersion Bk3 46.7 Ba-3 8.0 D-5 5.0 A-70 2.0 S-1 38.3 Example 71 Dispersion TBk2 45.1 Ba-3 8.0 D-1 5.0 A-71 2.0 S-1 39.9 Example 72 Dispersion R2 48.0 Ba-3 8.0 D-2 5.0 A-72 3.0 S-1 36.0 Example 73 Dispersion R3 43.8 Ba-3 8.0 D-3 5.0 A-73 3.0 S-1 40.2 Example 74 Dispersion G3 44.1 Ba-3 8.0 D-4 5.0 A-74 3.0 S-1 39.9 Example 75 Dispersion B5 49.2 Ba-3 8.0 D-5 5.0 A-75 3.0 S-1 34.8 Example 76 Dispersion Bk1 44.6 Ba-3 8.0 D-1 5.0 A-76 3.0 S-1 39.4 Example 77 Dispersion Bk3 44.6 Ba-3 8.0 D-2 5.0 A-77 3.0 S-1 39.4 Example 78 Dispersion TBk2 46.4 Ba-1 5.0 D-3 5.0 A-78 3.0 S-1 40.6 Example 79 Dispersion R2 44.6 Ba-1 5.0 D-4 5.0 A-79 3.0 S-1 42.4 Example 80 Dispersion R3 43.4 Ba-1 5.0 D-5 5.0 A-80 3.0 S-1 43.6 Example 81 Dispersion G3 48.6 Ba-1 5.0 D-1 5.0 A-81 3.0 S-1 38.4 Example 82 Dispersion B5 45.0 Ba-1 5.0 D-2 5.0 A-82 3.0 S-1 42.0 Example 83 Dispersion Bk1 45.9 Ba-1 5.0 D-3 5.0 A-83 3.0 S-1 41.1 Example 84 Dispersion Bk3 47.2 Ba-1 5.0 D-4 5.0 A-84 3.0 S-1 39.8 Example 85 Dispersion TBk2 43.6 Ba-1 5.0 D-5 5.0 A-85 3.0 S-1 43.4 Example 86 Dispersion R2 46.9 Ba-1 5.0 D-1 5.0 A-86 3.0 S-1 40.1 Example 87 Dispersion R3 45.0 Ba-1 5.0 D-2 5.0 A-87 3.0 S-1 42.0 Example 88 Dispersion G3 45.0 Ba-1 5.0 D-3 5.0 A-88 3.0 S-1 42.0 Example 89 Dispersion B5 45.0 Ba-1 5.0 D-4 5.0 A-89 3.0 S-1 42.0 Example 90 Dispersion Bk1 45.0 Ba-1 5.0 D-5 5.0 A-90 3.0 S-1 42.0

[表4]    分散液 樹脂 自由基聚合性 化合物 自由基聚合 起始劑 溶劑 種類 質量份 種類 質量份 種類 質量份 種類 質量份 種類 質量份 實施例91 分散液Bk3 42.5 Ba-1 5.0 D-1 5.0 A-91 3.0 S-1 44.5 實施例92 分散液TBk2 42.0 Ba-1 5.0 D-2 5.0 A-92 3.0 S-1 45.0 實施例93 分散液R2 45.0 Ba-1 5.0 D-3 5.0 A-93 3.0 S-1 42.0 實施例94 分散液R3 50.0 Ba-1 5.0 D-4 5.0 A-94 3.0 S-1 37.0 實施例95 分散液G3 58.0 Ba-1 5.0 D-5 5.0 A-95 3.0 S-1 29.0 實施例96 分散液B5 47.9 Ba-1 5.0 D-1 5.0 A-96 3.0 S-1 39.1 實施例97 分散液Bk1 42.4 Ba-1 5.0 D-2 5.0 A-97 3.0 S-1 44.6 實施例98 分散液Bk3 46.7 Ba-1 5.0 D-3 5.0 A-98 3.0 S-1 40.3 實施例99 分散液TBk2 45.1 Ba-1 5.0 D-4 5.0 A-99 3.0 S-1 41.9 實施例100 分散液R2 48.0 Ba-1 5.0 D-5 5.0 A-100 3.0 S-1 39.0 實施例101 分散液R3 43.8 Ba-1 5.0 D-1 5.0 A-101 3.0 S-1 43.2 實施例102 分散液G3 44.1 Ba-1 5.0 D-2 5.0 A-102 3.0 S-1 42.9 實施例103 分散液B5 49.2 Ba-1 5.0 D-3 5.0 A-103 3.0 S-1 37.8 實施例104 分散液Bk1 45.0 Ba-1 5.0 D-4 5.0 A-104 3.0 S-1 42.0 實施例105 分散液Bk3 45.9 Ba-1 5.0 D-5 5.0 A-105 3.0 S-1 41.1 實施例106 分散液TBk2 47.2 Ba-1 5.0 D-1 5.0 A-106 3.0 S-1 39.8 實施例107 分散液R2 43.6 Ba-1 5.0 D-2 5.0 A-107 3.0 S-1 43.4 實施例108 分散液R3 46.9 Ba-1 5.0 D-3 5.0 A-108 3.0 S-1 40.1 實施例109 分散液G3 45.0 Ba-1 5.0 D-4 5.0 A-109 3.0 S-1 42.0 實施例110 分散液B5 45.0 Ba-1 5.0 D-5 5.0 A-110 3.0 S-1 42.0 實施例111 分散液Bk1 45.0 Ba-1 5.0 D-1 5.0 A-111 3.0 S-1 42.0 實施例112 分散液Bk3 45.0 Ba-1 5.0 D-2 5.0 A-112 3.0 S-1 42.0 實施例113 分散液R2 42.5 Ba-1 5.0 D-1 5.0 A-4 3.0 S-1 44.5 實施例114 分散液R2 42.0 Ba-1 5.0 D-1 D-3 3.0 2.0 A-7 3.0 S-1 45.0 實施例115 分散液R2 45.0 Ba-1 5.0 D-2 D-4 3.0 2.0 A-22 3.0 S-1 42.0 實施例116 分散液R2 50.0 Ba-1 5.0 D-1 5.0 A-27 3.0 S-1 37.0 實施例117 分散液R2 58.0 Ba-1 5.0 D-1 5.0 A-32 3.0 S-1 29.0 實施例118 分散液R2 47.9 Ba-1 5.0 D-1 5.0 A-40 3.0 S-1 39.1 實施例119 分散液R2 42.4 Ba-1 5.0 D-1 5.0 A-64 3.0 S-1 44.6 實施例120 分散液R2 46.7 Ba-1 5.0 D-1 5.0 A-82 3.0 S-1 40.3 實施例121 分散液R2 45.1 Ba-1 5.0 D-1 5.0 A-87 3.0 S-1 41.9 實施例122 分散液R2 48.0 Ba-1 5.0 D-1 5.0 A-94 3.0 S-1 39.0 實施例123 分散液R2 43.8 Ba-1 5.0 D-1 5.0 A-104 3.0 S-1 43.2 實施例124 分散液G3 44.1 Ba-1 5.0 D-1 5.0 A-106 a-1 2.0 1.0 S-1 42.9 實施例125 分散液G3 49.2 Ba-1 5.0 D-1 5.0 A-4 a-2 1.0 2.0 S-1 37.8 實施例126 分散液G3 45.0 Ba-1 5.0 D-1 5.0 A-7 3.0 S-1 42.0 實施例127 分散液G3 45.9 Ba-1 5.0 D-1 5.0 A-22 3.0 S-1 41.1 實施例128 分散液G3 47.2 Ba-1 5.0 D-1 5.0 A-27 3.0 S-1 39.8 實施例129 分散液G3 43.6 Ba-1 5.0 D-1 5.0 A-32 3.0 S-1 43.4 實施例130 分散液G3 46.9 Ba-1 5.0 D-1 5.0 A-40 3.0 S-1 40.1 [Table 4] Dispersions resin free radical polymerizable compound Free Radical Polymerization Initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 91 Dispersion Bk3 42.5 Ba-1 5.0 D-1 5.0 A-91 3.0 S-1 44.5 Example 92 Dispersion TBk2 42.0 Ba-1 5.0 D-2 5.0 A-92 3.0 S-1 45.0 Example 93 Dispersion R2 45.0 Ba-1 5.0 D-3 5.0 A-93 3.0 S-1 42.0 Example 94 Dispersion R3 50.0 Ba-1 5.0 D-4 5.0 A-94 3.0 S-1 37.0 Example 95 Dispersion G3 58.0 Ba-1 5.0 D-5 5.0 A-95 3.0 S-1 29.0 Example 96 Dispersion B5 47.9 Ba-1 5.0 D-1 5.0 A-96 3.0 S-1 39.1 Example 97 Dispersion Bk1 42.4 Ba-1 5.0 D-2 5.0 A-97 3.0 S-1 44.6 Example 98 Dispersion Bk3 46.7 Ba-1 5.0 D-3 5.0 A-98 3.0 S-1 40.3 Example 99 Dispersion TBk2 45.1 Ba-1 5.0 D-4 5.0 A-99 3.0 S-1 41.9 Example 100 Dispersion R2 48.0 Ba-1 5.0 D-5 5.0 A-100 3.0 S-1 39.0 Example 101 Dispersion R3 43.8 Ba-1 5.0 D-1 5.0 A-101 3.0 S-1 43.2 Example 102 Dispersion G3 44.1 Ba-1 5.0 D-2 5.0 A-102 3.0 S-1 42.9 Example 103 Dispersion B5 49.2 Ba-1 5.0 D-3 5.0 A-103 3.0 S-1 37.8 Example 104 Dispersion Bk1 45.0 Ba-1 5.0 D-4 5.0 A-104 3.0 S-1 42.0 Example 105 Dispersion Bk3 45.9 Ba-1 5.0 D-5 5.0 A-105 3.0 S-1 41.1 Example 106 Dispersion TBk2 47.2 Ba-1 5.0 D-1 5.0 A-106 3.0 S-1 39.8 Example 107 Dispersion R2 43.6 Ba-1 5.0 D-2 5.0 A-107 3.0 S-1 43.4 Example 108 Dispersion R3 46.9 Ba-1 5.0 D-3 5.0 A-108 3.0 S-1 40.1 Example 109 Dispersion G3 45.0 Ba-1 5.0 D-4 5.0 A-109 3.0 S-1 42.0 Example 110 Dispersion B5 45.0 Ba-1 5.0 D-5 5.0 A-110 3.0 S-1 42.0 Example 111 Dispersion Bk1 45.0 Ba-1 5.0 D-1 5.0 A-111 3.0 S-1 42.0 Example 112 Dispersion Bk3 45.0 Ba-1 5.0 D-2 5.0 A-112 3.0 S-1 42.0 Example 113 Dispersion R2 42.5 Ba-1 5.0 D-1 5.0 A-4 3.0 S-1 44.5 Example 114 Dispersion R2 42.0 Ba-1 5.0 D-1 D-3 3.0 2.0 A-7 3.0 S-1 45.0 Example 115 Dispersion R2 45.0 Ba-1 5.0 D-2 D-4 3.0 2.0 A-22 3.0 S-1 42.0 Example 116 Dispersion R2 50.0 Ba-1 5.0 D-1 5.0 A-27 3.0 S-1 37.0 Example 117 Dispersion R2 58.0 Ba-1 5.0 D-1 5.0 A-32 3.0 S-1 29.0 Example 118 Dispersion R2 47.9 Ba-1 5.0 D-1 5.0 A-40 3.0 S-1 39.1 Example 119 Dispersion R2 42.4 Ba-1 5.0 D-1 5.0 A-64 3.0 S-1 44.6 Example 120 Dispersion R2 46.7 Ba-1 5.0 D-1 5.0 A-82 3.0 S-1 40.3 Example 121 Dispersion R2 45.1 Ba-1 5.0 D-1 5.0 A-87 3.0 S-1 41.9 Example 122 Dispersion R2 48.0 Ba-1 5.0 D-1 5.0 A-94 3.0 S-1 39.0 Example 123 Dispersion R2 43.8 Ba-1 5.0 D-1 5.0 A-104 3.0 S-1 43.2 Example 124 Dispersion G3 44.1 Ba-1 5.0 D-1 5.0 A-106a-1 2.0 1.0 S-1 42.9 Example 125 Dispersion G3 49.2 Ba-1 5.0 D-1 5.0 A-4 a-2 1.0 2.0 S-1 37.8 Example 126 Dispersion G3 45.0 Ba-1 5.0 D-1 5.0 A-7 3.0 S-1 42.0 Example 127 Dispersion G3 45.9 Ba-1 5.0 D-1 5.0 A-22 3.0 S-1 41.1 Example 128 Dispersion G3 47.2 Ba-1 5.0 D-1 5.0 A-27 3.0 S-1 39.8 Example 129 Dispersion G3 43.6 Ba-1 5.0 D-1 5.0 A-32 3.0 S-1 43.4 Example 130 Dispersion G3 46.9 Ba-1 5.0 D-1 5.0 A-40 3.0 S-1 40.1

[表5]    分散液 樹脂 自由基聚合性 化合物 自由基聚合 起始劑 溶劑 種類 質量份 種類 質量份 種類 質量份 種類 質量份 種類 質量份 實施例131 分散液G3 45.0 Ba-1 5.0 D-1 5.0 A-38 3.0 S-1 42.0 實施例132 分散液G3 45.0 Ba-1 5.0 D-1 5.0 A-42 3.0 S-1 42.0 實施例133 分散液G3 45.0 Ba-1 5.0 D-1 5.0 A-46 3.0 S-1 42.0 實施例134 分散液G3 45.0 Ba-1 5.0 D-1 5.0 A-50 a-3 2.5 0.5 S-1 42.0 實施例135 分散液B5 42.5 Ba-1 5.0 D-1 5.0 A-56 3.0 S-1 44.5 實施例136 分散液B5 42.0 Ba-1 5.0 D-1 5.0 A-57 3.0 S-1 45.0 實施例137 分散液B5 45.0 Ba-1 5.0 D-1 5.0 A-79 3.0 S-1 42.0 實施例138 分散液B5 50.0 Ba-1 5.0 D-1 5.0 A-82 3.0 S-1 37.0 實施例139 分散液B5 58.0 Ba-1 5.0 D-1 5.0 A-83 3.0 S-1 29.0 實施例140 分散液B5 47.9 Ba-1 5.0 D-1 D-5 2.5 2.5 A-86 a-4 1.5 1.5 S-1 S-2 29.1 10.0 實施例141 分散液B5 42.4 Ba-1 5.0 D-2 D-5 5.0 A-90 3.0 S-1 S-3 34.6 10.0 實施例142 分散液B5 46.7 Ba-1 5.0 D-1 5.0 A-94 3.0 S-1 40.3 實施例143 分散液B5 45.1 Ba-1 5.0 D-1 5.0 A-92 3.0 S-1 41.9 實施例144 分散液B5 48.0 Ba-1 5.0 D-1 5.0 A-82 A-83 1.5 1.5 S-1 39.0 實施例145 分散液B5 43.8 Ba-1 5.0 D-1 5.0 A-94 3.0 S-1 43.2 實施例146 分散液R6 48.0 Ba-1 5.0 D-1 5.0 A-117 1.5 S-1 40.5 實施例147 分散液R6 55.0 Ba-1 5.0 D-1 5.0 A-118 1.0 S-1 34.0 實施例148 分散液R6 60.0 Ba-1 5.0 D-1 5.0 A-119 0.8 S-1 29.2 實施例149 分散液R6 70.0 Ba-1 5.0 D-1 5.0 A-120 1.0 S-1 19.0 實施例150 分散液R6 70.0 Ba-1 3.0 D-1 2.0 A-121 1.0 S-1 24.0 實施例151 分散液R6 70.0 Ba-1 3.0 D-1 2.0 A-122 1.0 S-1 24.0 實施例152 分散液R6 70.0 Ba-1 3.0 D-1 2.0 A-117 1.0 S-1 24.0 實施例153 分散液R6 70.0 Ba-1 3.0 D-1 2.0 A-118 0.5 S-1 24.5 實施例154 分散液R7 60.0 Ba-1 5.0 D-1 5.0 A-119 0.8 S-1 29.2 比較例1 分散液R2 44.1 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 42.9 比較例2 分散液R3 49.2 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 37.8 比較例3 分散液G3 45.0 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 42.0 比較例4 分散液B5 45.0 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 42.0 比較例5 分散液Bk1 45.0 Ba-1 5.0 D-1 5.0 CA-2 3.0 S-1 42.0 比較例6 分散液Bk3 45.0 Ba-1 5.0 D-1 5.0 CA-2 3.0 S-1 42.0 比較例7 分散液TBk2 45.0 Ba-1 5.0 D-1 5.0 CA-2 3.0 S-1 42.0 比較例8 分散液R7 60.0 Ba-1 5.0 D-1 5.0 CA-1 0.8 S-1 29.2 [table 5] Dispersions resin free radical polymerizable compound Free Radical Polymerization Initiator solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 131 Dispersion G3 45.0 Ba-1 5.0 D-1 5.0 A-38 3.0 S-1 42.0 Example 132 Dispersion G3 45.0 Ba-1 5.0 D-1 5.0 A-42 3.0 S-1 42.0 Example 133 Dispersion G3 45.0 Ba-1 5.0 D-1 5.0 A-46 3.0 S-1 42.0 Example 134 Dispersion G3 45.0 Ba-1 5.0 D-1 5.0 A-50a-3 2.5 0.5 S-1 42.0 Example 135 Dispersion B5 42.5 Ba-1 5.0 D-1 5.0 A-56 3.0 S-1 44.5 Example 136 Dispersion B5 42.0 Ba-1 5.0 D-1 5.0 A-57 3.0 S-1 45.0 Example 137 Dispersion B5 45.0 Ba-1 5.0 D-1 5.0 A-79 3.0 S-1 42.0 Example 138 Dispersion B5 50.0 Ba-1 5.0 D-1 5.0 A-82 3.0 S-1 37.0 Example 139 Dispersion B5 58.0 Ba-1 5.0 D-1 5.0 A-83 3.0 S-1 29.0 Example 140 Dispersion B5 47.9 Ba-1 5.0 D-1 D-5 2.5 2.5 A-86a-4 1.5 1.5 S-1 S-2 29.1 10.0 Example 141 Dispersion B5 42.4 Ba-1 5.0 D-2 D-5 5.0 A-90 3.0 S-1 S-3 34.6 10.0 Example 142 Dispersion B5 46.7 Ba-1 5.0 D-1 5.0 A-94 3.0 S-1 40.3 Example 143 Dispersion B5 45.1 Ba-1 5.0 D-1 5.0 A-92 3.0 S-1 41.9 Example 144 Dispersion B5 48.0 Ba-1 5.0 D-1 5.0 A-82 A-83 1.5 1.5 S-1 39.0 Example 145 Dispersion B5 43.8 Ba-1 5.0 D-1 5.0 A-94 3.0 S-1 43.2 Example 146 Dispersion R6 48.0 Ba-1 5.0 D-1 5.0 A-117 1.5 S-1 40.5 Example 147 Dispersion R6 55.0 Ba-1 5.0 D-1 5.0 A-118 1.0 S-1 34.0 Example 148 Dispersion R6 60.0 Ba-1 5.0 D-1 5.0 A-119 0.8 S-1 29.2 Example 149 Dispersion R6 70.0 Ba-1 5.0 D-1 5.0 A-120 1.0 S-1 19.0 Example 150 Dispersion R6 70.0 Ba-1 3.0 D-1 2.0 A-121 1.0 S-1 24.0 Example 151 Dispersion R6 70.0 Ba-1 3.0 D-1 2.0 A-122 1.0 S-1 24.0 Example 152 Dispersion R6 70.0 Ba-1 3.0 D-1 2.0 A-117 1.0 S-1 24.0 Example 153 Dispersion R6 70.0 Ba-1 3.0 D-1 2.0 A-118 0.5 S-1 24.5 Example 154 Dispersion R7 60.0 Ba-1 5.0 D-1 5.0 A-119 0.8 S-1 29.2 Comparative example 1 Dispersion R2 44.1 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 42.9 Comparative example 2 Dispersion R3 49.2 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 37.8 Comparative example 3 Dispersion G3 45.0 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 42.0 Comparative example 4 Dispersion B5 45.0 Ba-1 5.0 D-1 5.0 CA-1 3.0 S-1 42.0 Comparative Example 5 Dispersion Bk1 45.0 Ba-1 5.0 D-1 5.0 CA-2 3.0 S-1 42.0 Comparative example 6 Dispersion Bk3 45.0 Ba-1 5.0 D-1 5.0 CA-2 3.0 S-1 42.0 Comparative Example 7 Dispersion TBk2 45.0 Ba-1 5.0 D-1 5.0 CA-2 3.0 S-1 42.0 Comparative Example 8 Dispersion R7 60.0 Ba-1 5.0 D-1 5.0 CA-1 0.8 S-1 29.2

以表示上述以外的、上述硬化性組成物的配方之表2~表5中的縮寫表示之材料的詳細內容為如下。The details of the materials indicated by the abbreviations in Tables 2 to 5 representing the formulations of the above-mentioned curable composition other than the above are as follows.

<樹脂> Ba-1:下述結構的樹脂(主鏈中標註之數值為莫耳比。重量平均分子量為11,000) <Resin> Ba-1: Resin with the following structure (the value marked in the main chain is the molar ratio. The weight average molecular weight is 11,000)

[化學式57]

Figure 02_image114
[chemical formula 57]
Figure 02_image114

Ba-2:下述結構的樹脂(主鏈中標註之數值為莫耳比。重量平均分子量為15,000)Ba-2: Resin with the following structure (the value marked in the main chain is the molar ratio. The weight average molecular weight is 15,000)

[化學式58]

Figure 02_image116
[chemical formula 58]
Figure 02_image116

Ba-3:下述結構的樹脂(主鏈中標註之數值係莫耳比。x、y及z的合計值係50。Mw=15,000)Ba-3: Resin with the following structure (the value marked in the main chain is the molar ratio. The total value of x, y and z is 50. Mw=15,000)

[化學式59]

Figure 02_image118
[chemical formula 59]
Figure 02_image118

<自由基聚合性化合物> D-1:KAYARAD DPHA(6官能丙烯酸酯化合物,Nippon Kayaku Co.,Ltd.製) D-2:NK ESTER A-DPH-12E(環氧乙烷(EO)改質6官能丙烯酸酯化合物,SHIN-NAKAMURA CHEMICAL Co.,Ltd.製) D-3:NK ESTER A-TMMT(4官能丙烯酸酯化合物,SHIN-NAKAMURA CHEMICAL Co.,Ltd.製) D-4:ARONIX M-510(3~4官能丙烯酸酯化合物,TOAGOSEI CO.,LTD.製) D-5:LIGHT ACRYLATE DCP-A(2官能脂環式丙烯酸酯化合物,KYOEISHA CHEMICAL Co.,LTD.製) <Radical polymerizable compound> D-1: KAYARAD DPHA (6-functional acrylate compound, manufactured by Nippon Kayaku Co., Ltd.) D-2: NK ESTER A-DPH-12E (ethylene oxide (EO) modified 6-functional acrylate compound, manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.) D-3: NK ESTER A-TMMT (4-functional acrylate compound, manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.) D-4: ARONIX M-510 (3-4 functional acrylate compound, manufactured by TOAGOSEI CO., LTD.) D-5: LIGHT ACRYLATE DCP-A (bifunctional alicyclic acrylate compound, manufactured by KYOEISHA CHEMICAL Co.,LTD.)

<同時使用的自由基聚合起始劑> a-1:IRGACURE OXE01,BASF公司製,肟酯系聚合起始劑 a-2:IRGACURE OXE02,BASF公司製,肟酯系聚合起始劑 a-3:IRGACURE OXE03,BASF公司製,肟酯系聚合起始劑 a-4:Omnirad379EG,IGM resins B.V製,α胺基苯乙酮系聚合起始劑 <Radical polymerization initiator used at the same time> a-1: IRGACURE OXE01, manufactured by BASF Corporation, an oxime ester-based polymerization initiator a-2: IRGACURE OXE02, manufactured by BASF Corporation, an oxime ester-based polymerization initiator a-3: IRGACURE OXE03, manufactured by BASF Corporation, an oxime ester-based polymerization initiator a-4: Omnirad379EG, manufactured by IGM resins B.V, α-aminoacetophenone-based polymerization initiator

<比較用自由基聚合起始劑> CA-1:下述化合物(日本特開2017-61498號公報中記載之光聚合起始劑) CA-2:下述化合物(日本特開2014-137466號公報中記載之光聚合起始劑) <Radical polymerization initiator for comparison> CA-1: The following compound (photopolymerization initiator described in JP-A-2017-61498) CA-2: The following compound (photopolymerization initiator described in JP-A-2014-137466)

[化學式60]

Figure 02_image120
[chemical formula 60]
Figure 02_image120

<評價> 針對如上製作的各硬化性組成物,進行了以下評價。 <<釋氣(釋氣抑制性)>> 在矽晶圓上,使用旋轉塗佈機塗佈各硬化性組成物,接著,使用加熱板,進行100℃、120秒的加熱(預烘烤),獲得了膜厚為1.0μm的塗膜。 接著,使用i射線步進曝光裝置FPA-3000iS+(Canon Inc.製),隔著刻有0.8μm的棋盤圖案之遮罩,以400mJ/cm 2的曝光量進行了曝光。接著,在真空清潔烘箱中,在100℃環境下收集1小時釋氣,根據從氣相層析質量分析計(GC/MS)獲得之峰,計算了釋氣量。 -評價基準- A:釋氣未達0.01ppm。 B:釋氣為0.01ppm以上且未達0.05ppm C:釋氣為0.05ppm以上且未達0.10ppm D:釋氣為0.10ppm以上且未達1ppm E:釋氣為1ppm以上。 <Evaluation> The following evaluations were performed on each of the curable compositions produced as described above. <<Outgassing (outgassing suppression)>> Each curable composition is coated on a silicon wafer using a spin coater, and then heated at 100°C for 120 seconds using a hot plate (pre-baking) , and a coating film with a film thickness of 1.0 μm was obtained. Next, using an i-ray stepper exposure device FPA-3000iS+ (manufactured by Canon Inc.), exposure was performed at an exposure dose of 400 mJ/cm 2 through a mask engraved with a checkerboard pattern of 0.8 μm. Next, the outgassing was collected at 100°C for 1 hour in a vacuum-cleaned oven, and the amount of outgassing was calculated based on the peaks obtained from gas chromatography mass spectrometer (GC/MS). -Evaluation Criteria- A: Outgassing was less than 0.01 ppm. B: Outgassing is at least 0.01 ppm and less than 0.05 ppm C: Outgassing is at least 0.05 ppm and less than 0.10 ppm D: Outgassing is at least 0.10 ppm and less than 1 ppm E: Outgassing is at least 1 ppm.

<<靈敏度>> 在矽晶圓上,使用旋轉塗佈機塗佈各硬化性組成物,接著,使用加熱板,進行100℃、120秒的加熱(預烘烤),獲得了膜厚為1.0μm的塗膜。 接著,使用i射線步進曝光裝置FPA-3000iS+(Canon Inc.製),隔著刻有0.8μm的棋盤圖案之遮罩,以10mJ/cm 2的變量,照射了50~1000mJ/cm 2的範圍的曝光量(曝光步驟)。接著,使用氫氧化四甲基銨(TMAH)0.3%水溶液,在23℃下進行60秒的旋覆浸沒顯影,之後用純水,藉由20秒旋轉噴淋進行沖洗,進一步用純水進行了水洗。之後,吹氣去除附著在圖案表面的水滴,使圖案自然乾燥而獲得了圖案。 關於靈敏度的評價,測定上述曝光步驟中照射到光的區域在顯影後的膜厚相對於曝光前的膜厚100%為95%以上時的最少的曝光量(最佳曝光量),將其作為靈敏度而進行了評價。 上述最少的曝光量(最佳曝光量)的值越小,表示靈敏度越高。 -評價基準- A:未達50mJ/cm 2B:50mJ/cm 2以上且未達100mJ/cm 2C:100mJ/cm 2以上且未達200mJ/cm 2D:200mJ/cm 2以上且未達300mJ/cm 2E:300mJ/cm 2以上 <<Sensitivity>> Each curable composition was coated on a silicon wafer using a spin coater, and then heated (pre-baked) at 100°C for 120 seconds using a hot plate to obtain a film thickness of 1.0 μm coating film. Next, using the i-ray stepper FPA-3000iS+ (manufactured by Canon Inc.), the range of 50 to 1000 mJ/cm 2 was irradiated at a variable rate of 10 mJ/cm 2 through a mask engraved with a checkerboard pattern of 0.8 μm. exposure (exposure steps). Next, using a 0.3% aqueous solution of tetramethylammonium hydroxide (TMAH), perform spin-coating and immersion development at 23°C for 60 seconds, and then rinse with pure water for 20 seconds by rotary spraying, and further use pure water. wash. After that, water droplets adhering to the surface of the pattern were removed by blowing air, and the pattern was allowed to dry naturally to obtain a pattern. Regarding the evaluation of sensitivity, the minimum exposure amount (optimum exposure amount) at which the film thickness after development of the area irradiated with light in the above-mentioned exposure step is 95% or more of the film thickness before exposure to 100% is measured, and this is taken as the sensitivity. was evaluated. The smaller the value of the aforementioned minimum exposure amount (best exposure amount), the higher the sensitivity. -Evaluation criteria- A: less than 50mJ/cm 2 B: more than 50mJ/cm 2 and less than 100mJ/cm 2 C: more than 100mJ/cm 2 and less than 200mJ/cm 2 D: more than 200mJ/cm 2 and less than 300mJ/cm 2 E: 300mJ/cm 2 or more

<<密接性>> 在矽晶圓上,使用旋轉塗佈機塗佈各硬化性組成物,接著,使用加熱板,進行100℃、120秒的加熱(預烘烤),獲得了膜厚為1.0μm的塗膜。 接著,使用i射線步進曝光裝置FPA-3000iS+(Canon Inc.製),隔著刻有0.8μm的棋盤圖案之遮罩,以400mJ/cm 2的曝光量進行了曝光。接著,使用氫氧化四甲基銨(TMAH)0.3%水溶液,在23℃下進行60秒的旋覆浸沒顯影,之後用純水,藉由20秒旋轉噴淋進行沖洗,進一步用純水進行了水洗。之後,吹氣去除附著在圖案表面的水滴,使圖案自然乾燥而獲得了圖案。 利用SEM(Scanning Electron Microscope:掃描式電子顯微鏡,倍率:20,000倍)觀察形成有圖案之矽晶圓,從SEM照片觀察100幀中的圖案欠缺的幀的比率,評價了密接性。 評價基準為如下。 -評價基準- A:圖案欠缺的比率為0%。 B:圖案欠缺的比率超過0%且10%以下。 C:圖案欠缺的比率超過10%且20%以下。 D:圖案欠缺的比率超過20%且50%以下。 E:圖案欠缺的比率超過50%。 <<Adhesion>> Each curable composition was coated on a silicon wafer using a spin coater, and then heated (pre-baked) at 100°C for 120 seconds using a hot plate to obtain a film thickness of 1.0μm coating film. Next, using an i-ray stepper exposure device FPA-3000iS+ (manufactured by Canon Inc.), exposure was performed at an exposure dose of 400 mJ/cm 2 through a mask engraved with a checkerboard pattern of 0.8 μm. Next, using a 0.3% aqueous solution of tetramethylammonium hydroxide (TMAH), perform spin-coating and immersion development at 23°C for 60 seconds, and then rinse with pure water for 20 seconds by rotary spraying, and further use pure water. wash. After that, water droplets adhering to the surface of the pattern were removed by blowing air, and the pattern was allowed to dry naturally to obtain a pattern. The patterned silicon wafer was observed by SEM (Scanning Electron Microscope: magnification: 20,000 times), and the ratio of frames with missing patterns in 100 frames of SEM photographs was observed to evaluate the adhesion. The evaluation criteria are as follows. -Evaluation Criteria- A: The ratio of pattern defects was 0%. B: The ratio of pattern missing exceeds 0% and is 10% or less. C: The ratio of pattern lack exceeds 10% and is 20% or less. D: The ratio of pattern missing exceeds 20% and is 50% or less. E: The ratio of lack of patterns exceeds 50%.

<<底切>> 按照與上述密接性的評價相同的順序形成了圖案。利用SEM(Scanning Electron Microscope:掃描式電子顯微鏡,倍率:20,000倍)觀察所獲得之圖案的截面形狀,從SEM照片提取5個圖案,求出5個圖案的截面的平均斜率,並按照以下基準評價了圖案截面形狀1。另外,圖案的截面的斜率係指形成有圖案之部分中的矽晶圓上的圖案的厚度方向上的斜率。具體而言,測定了由矽晶圓的表面和圖案的厚度方向的邊構成之部分的角度。圖案的斜率相對於矽晶圓的表面超過90度係指圖案從矽晶圓側朝向圖案的表面側面積變大,亦即在圖案底面產生了邊緣(edge)而不佳。 -評價基準- A:角度超過80度且90度以下。 B:角度超過90度且100度以下。 C:角度超過100度且110度以下。 D:角度超過110度且150度以下。 E:角度超過150度。 <<Undercut>> Patterns were formed in the same procedure as in the evaluation of the above-mentioned adhesiveness. The cross-sectional shape of the obtained pattern was observed by SEM (Scanning Electron Microscope: magnification: 20,000 times), and 5 patterns were extracted from the SEM photograph, and the average slope of the cross-section of the 5 patterns was obtained, and evaluated according to the following criteria The cross-sectional shape of the pattern is 1. In addition, the slope of the cross section of the pattern refers to the slope in the thickness direction of the pattern on the silicon wafer in the portion where the pattern is formed. Specifically, the angle of the portion formed by the surface of the silicon wafer and the side in the thickness direction of the pattern was measured. The slope of the pattern exceeds 90 degrees relative to the surface of the silicon wafer, which means that the area of the pattern becomes larger from the side of the silicon wafer toward the surface of the pattern, that is, an edge is formed on the bottom of the pattern, which is not good. -Evaluation criteria- A: The angle exceeds 80 degrees and is 90 degrees or less. B: The angle exceeds 90 degrees and is 100 degrees or less. C: The angle exceeds 100 degrees and is 110 degrees or less. D: The angle exceeds 110 degrees and is 150 degrees or less. E: The angle exceeds 150 degrees.

<<溶解性>> 將以上獲得之各硬化性組成物100g放入塑膠容器中密封,在0℃下保存3個月之後,恢復至室溫之後,確認了有無析出物。使用濾紙(ADVANTEC No.4A,Advantec Toyo Kaisha,Ltd.製)過濾保存後的硬化性組成物,稱量了殘留於過濾後的濾紙上之析出物的重量。 -評價基準- A:完全未確認到析出物。 B:析出物未達0.1g。 C:析出物為0.1g以上且未達0.5g。 D:析出物為0.5g以上且未達1.0g。 E:析出物為1.0g以上。 <<Solubility>> 100 g of each curable composition obtained above was put into a plastic container and sealed, stored at 0° C. for 3 months, and then returned to room temperature to check for the presence or absence of precipitates. The stored curable composition was filtered using filter paper (ADVANTEC No. 4A, manufactured by Advantec Toyo Kaisha, Ltd.), and the weight of the precipitate remaining on the filtered filter paper was weighed. -Evaluation criteria- A: Precipitates were not confirmed at all. B: The precipitate was less than 0.1 g. C: The precipitate is 0.1 g or more and less than 0.5 g. D: A precipitate is 0.5 g or more and less than 1.0 g. E: The precipitate is 1.0 g or more.

將評價結果總結示於表6~表9。The evaluation results are collectively shown in Tables 6 to 9.

[表6]    評價結果 釋氣 靈敏度 密接性 底切 溶解性 實施例1 A B B C B 實施例2 A A B B A 實施例3 A A B B A 實施例4 A A A B A 實施例5 A C B B A 實施例6 A C B C A 實施例7 A B A B B 實施例8 A B B B B 實施例9 A B B B B 實施例10 A B C C B 實施例11 A B B C B 實施例12 A A B B A 實施例13 A A B B A 實施例14 A A B B A 實施例15 A A B B A 實施例16 A A B C A 實施例17 A A B B A 實施例18 A A B B A 實施例19 A A B C A 實施例20 A A B B A 實施例21 A A B B A 實施例22 A A A B A 實施例23 A A C C A 實施例24 A A B C A 實施例25 A A B B A 實施例26 A A B B A 實施例27 A A A B A 實施例28 A A C C A 實施例29 A A B C A 實施例30 A A B B A 實施例31 A A B B A 實施例32 A A A B A 實施例33 A A B B A 實施例34 A A B B A 實施例35 A A B B A 實施例36 A A B B A 實施例37 A A B B A 實施例38 A A C C A 實施例39 A A B C A 實施例40 A A A B A 實施例41 A A B B A 實施例42 A A B B A 實施例43 A A B B A 實施例44 A A B B A 實施例45 A A B B A [Table 6] Evaluation results outgassing sensitivity Closeness undercut Solubility Example 1 A B B C B Example 2 A A B B A Example 3 A A B B A Example 4 A A A B A Example 5 A C B B A Example 6 A C B C A Example 7 A B A B B Example 8 A B B B B Example 9 A B B B B Example 10 A B C C B Example 11 A B B C B Example 12 A A B B A Example 13 A A B B A Example 14 A A B B A Example 15 A A B B A Example 16 A A B C A Example 17 A A B B A Example 18 A A B B A Example 19 A A B C A Example 20 A A B B A Example 21 A A B B A Example 22 A A A B A Example 23 A A C C A Example 24 A A B C A Example 25 A A B B A Example 26 A A B B A Example 27 A A A B A Example 28 A A C C A Example 29 A A B C A Example 30 A A B B A Example 31 A A B B A Example 32 A A A B A Example 33 A A B B A Example 34 A A B B A Example 35 A A B B A Example 36 A A B B A Example 37 A A B B A Example 38 A A C C A Example 39 A A B C A Example 40 A A A B A Example 41 A A B B A Example 42 A A B B A Example 43 A A B B A Example 44 A A B B A Example 45 A A B B A

[表7]    評價結果 釋氣 靈敏度 密接性 底切 溶解性 實施例46 A B B B B 實施例47 A B B B B 實施例48 A B B C B 實施例49 A B B B B 實施例50 A B B B B 實施例51 A B B B B 實施例52 A B B B B 實施例53 A B B B B 實施例54 A A B B A 實施例55 A A B C A 實施例56 A A B B A 實施例57 A A B B A 實施例58 A A B B A 實施例59 A A B B A 實施例60 A A B B A 實施例61 B C C C C 實施例62 A A B C A 實施例63 A A B B A 實施例64 A A A B A 實施例65 A C B B A 實施例66 A C B B A 實施例67 B C C C C 實施例68 A B B B B 實施例69 A B B C B 實施例70 A B B B B 實施例71 B C C C C 實施例72 A A B B A 實施例73 A A B B A 實施例74 A A B B A 實施例75 A A B B A 實施例76 A A B C A 實施例77 A A B B A 實施例78 A A B B A 實施例79 A A B B A 實施例80 A A B B A 實施例81 A A B B A 實施例82 A A A B A 實施例83 A A B B A 實施例84 A A B B A 實施例85 A A B B A 實施例86 A B B B B 實施例87 A B A B B 實施例88 A B B B B 實施例89 A B B B B 實施例90 B B B B C [Table 7] Evaluation results outgassing sensitivity Closeness undercut Solubility Example 46 A B B B B Example 47 A B B B B Example 48 A B B C B Example 49 A B B B B Example 50 A B B B B Example 51 A B B B B Example 52 A B B B B Example 53 A B B B B Example 54 A A B B A Example 55 A A B C A Example 56 A A B B A Example 57 A A B B A Example 58 A A B B A Example 59 A A B B A Example 60 A A B B A Example 61 B C C C C Example 62 A A B C A Example 63 A A B B A Example 64 A A A B A Example 65 A C B B A Example 66 A C B B A Example 67 B C C C C Example 68 A B B B B Example 69 A B B C B Example 70 A B B B B Example 71 B C C C C Example 72 A A B B A Example 73 A A B B A Example 74 A A B B A Example 75 A A B B A Example 76 A A B C A Example 77 A A B B A Example 78 A A B B A Example 79 A A B B A Example 80 A A B B A Example 81 A A B B A Example 82 A A A B A Example 83 A A B B A Example 84 A A B B A Example 85 A A B B A Example 86 A B B B B Example 87 A B A B B Example 88 A B B B B Example 89 A B B B B Example 90 B B B B C

[表8]    評價結果 釋氣 靈敏度 密接性 底切 溶解性 實施例91 A A B B A 實施例92 B B B B C 實施例93 A A B B A 實施例94 B B A B C 實施例95 A A B B A 實施例96 A A B B A 實施例97 A A B C A 實施例98 B B B B C 實施例99 A A B B A 實施例100 B A B B C 實施例101 A A B B A 實施例102 B B B B C 實施例103 A B B B B 實施例104 A A A C A 實施例105 A A B B A 實施例106 A A A B A 實施例107 A A B B A 實施例108 B C C C C 實施例109 A B B B B 實施例110 A B B B B 實施例111 A B B C B 實施例112 B C C C C 實施例113 A A A A A 實施例114 A A A A A 實施例115 A A A A A 實施例116 A A A A A 實施例117 A A A A A 實施例118 A A A A A 實施例119 A A A A A 實施例120 A A A A A 實施例121 A A A A A 實施例122 A A A A A 實施例123 A A A A A 實施例124 A A A A A 實施例125 A A A A A 實施例126 A A A A A 實施例127 A A A A A 實施例128 A A A A A 實施例129 A A A A A 實施例130 A A A A A [Table 8] Evaluation results outgassing sensitivity Closeness undercut Solubility Example 91 A A B B A Example 92 B B B B C Example 93 A A B B A Example 94 B B A B C Example 95 A A B B A Example 96 A A B B A Example 97 A A B C A Example 98 B B B B C Example 99 A A B B A Example 100 B A B B C Example 101 A A B B A Example 102 B B B B C Example 103 A B B B B Example 104 A A A C A Example 105 A A B B A Example 106 A A A B A Example 107 A A B B A Example 108 B C C C C Example 109 A B B B B Example 110 A B B B B Example 111 A B B C B Example 112 B C C C C Example 113 A A A A A Example 114 A A A A A Example 115 A A A A A Example 116 A A A A A Example 117 A A A A A Example 118 A A A A A Example 119 A A A A A Example 120 A A A A A Example 121 A A A A A Example 122 A A A A A Example 123 A A A A A Example 124 A A A A A Example 125 A A A A A Example 126 A A A A A Example 127 A A A A A Example 128 A A A A A Example 129 A A A A A Example 130 A A A A A

[表9]    評價結果 釋氣 靈敏度 密接性 底切 溶解性 實施例131 A A A A A 實施例132 A A A A A 實施例133 A A A A A 實施例134 A A A A A 實施例135 A A A A A 實施例136 A A A A A 實施例137 A A A A A 實施例138 A A A A A 實施例139 A A A A A 實施例140 A A A A A 實施例141 A A A A A 實施例142 A A A A A 實施例143 A A A A A 實施例144 A A A A A 實施例145 A A A A A 實施例146 A A A A A 實施例147 A A A A A 實施例148 A A A A A 實施例149 A A A A A 實施例150 A A A B A 實施例151 A A A B A 實施例152 A A A B A 實施例153 A B B B A 實施例154 A A C C A 比較例1 E D D D D 比較例2 E D D D D 比較例3 E D D D D 比較例4 E D D D D 比較例5 D D D D D 比較例6 D D D D D 比較例7 D D D D D 比較例8 E D E E D [Table 9] Evaluation results outgassing sensitivity Closeness undercut Solubility Example 131 A A A A A Example 132 A A A A A Example 133 A A A A A Example 134 A A A A A Example 135 A A A A A Example 136 A A A A A Example 137 A A A A A Example 138 A A A A A Example 139 A A A A A Example 140 A A A A A Example 141 A A A A A Example 142 A A A A A Example 143 A A A A A Example 144 A A A A A Example 145 A A A A A Example 146 A A A A A Example 147 A A A A A Example 148 A A A A A Example 149 A A A A A Example 150 A A A B A Example 151 A A A B A Example 152 A A A B A Example 153 A B B B A Example 154 A A C C A Comparative example 1 E. D. D. D. D. Comparative example 2 E. D. D. D. D. Comparative example 3 E. D. D. D. D. Comparative example 4 E. D. D. D. D. Comparative Example 5 D. D. D. D. D. Comparative Example 6 D. D. D. D. D. Comparative Example 7 D. D. D. D. D. Comparative Example 8 E. D. E. E. D.

如上述表6~表9所示,與比較例的硬化性組成物相比,實施例的硬化性組成物為從所獲得之硬化物產生之釋氣少者。 又,如上述表6~表9所示,實施例的硬化性組成物的靈敏度、密接性、底切抑制性及溶解性亦優異。 As shown in Tables 6 to 9 above, the curable compositions of the examples had less outgassing from the obtained cured products than the curable compositions of the comparative examples. In addition, as shown in Tables 6 to 9 above, the curable compositions of Examples were also excellent in sensitivity, adhesiveness, undercut suppression, and solubility.

(實施例155) 將實施例30的自由基聚合起始劑A-30(3.0質量份)變更為自由基聚合起始劑A-30(1.5質量份)及下述a-5(1.5質量份),除此以外,以與實施例30相同的方法製作硬化性組成物且進行了評價。進行評價之結果,全部為A。 (Example 155) The radical polymerization initiator A-30 (3.0 mass parts) of Example 30 was changed to the radical polymerization initiator A-30 (1.5 mass parts) and the following a-5 (1.5 mass parts), except that , a curable composition was produced and evaluated in the same manner as in Example 30. As a result of the evaluation, all were A.

(實施例156) 將實施例36的自由基聚合起始劑A-36(3.0質量份)變更為自由基聚合起始劑A-36(1.5質量份)及下述a-6(1.5質量份),除此以外,以與實施例36相同的方法製作硬化性組成物且進行了評價。進行評價之結果,全部為A。 (Example 156) The radical polymerization initiator A-36 (3.0 mass parts) of Example 36 was changed to the radical polymerization initiator A-36 (1.5 mass parts) and the following a-6 (1.5 mass parts), except that , A curable composition was produced and evaluated in the same manner as in Example 36. As a result of the evaluation, all were A.

(實施例157) 將實施例40的自由基聚合起始劑A-40(3.0質量份)變更為自由基聚合起始劑A-40(1.5質量份)及下述a-7(1.5質量份),除此以外,以與實施例40相同的方法製作硬化性組成物且進行了評價。進行評價之結果,全部為A。 (Example 157) The radical polymerization initiator A-40 (3.0 parts by mass) of Example 40 was changed to the radical polymerization initiator A-40 (1.5 parts by mass) and the following a-7 (1.5 parts by mass), except that , a curable composition was produced and evaluated in the same manner as in Example 40. As a result of the evaluation, all were A.

(實施例158) 將實施例123的自由基聚合起始劑A-104(3.0質量份)變更為自由基聚合起始劑A-104(1.5質量份)及下述a-7(1.5質量份),除此以外,以與實施例123相同的方法製作硬化性組成物且進行了評價。進行評價之結果,全部為A。 (Example 158) The radical polymerization initiator A-104 (3.0 parts by mass) of Example 123 was changed to the radical polymerization initiator A-104 (1.5 parts by mass) and the following a-7 (1.5 parts by mass), except that , A curable composition was produced and evaluated in the same manner as in Example 123. As a result of the evaluation, all were A.

另外,a-5~a-7為以下的化合物。In addition, a-5 to a-7 are the following compounds.

a-5:由下述式表示之化合物 [化學式61]

Figure 02_image122
a-5: a compound represented by the following formula [Chemical Formula 61]
Figure 02_image122

a-6:由下述式表示之化合物 [化學式62]

Figure 02_image124
a-6: a compound represented by the following formula [Chemical Formula 62]
Figure 02_image124

a-7:由下述式表示之化合物 [化學式63]

Figure 02_image126
a-7: a compound represented by the following formula [Chemical Formula 63]
Figure 02_image126

各實施例的硬化性組成物即使照射KrF射線來代替i射線,亦可獲得相同的效果。作為KrF射線照射的條件,例如,能夠設定為曝光光:KrF射線(波長248nm)、曝光量:10mJ/cm 2~500mJ/cm 2、最大瞬間照度:250,000,000W/m 2(平均照度:30,000W/m 2)、脈衝寬度:30奈秒、頻率:4kHz。 Even when the curable composition of each Example was irradiated with KrF rays instead of i rays, the same effect was obtained. As the conditions for KrF ray irradiation, for example, exposure light: KrF ray (wavelength: 248nm), exposure amount: 10mJ/cm 2 -500mJ/cm 2 , maximum instantaneous illuminance: 250,000,000W/m 2 (average illuminance: 30,000W /m 2 ), pulse width: 30 nanoseconds, frequency: 4kHz.

2021年11月9日申請的日本申請特願2021-182791、及2022年9月22日申請的日本申請特願2022-151758的揭示的全部內容藉由參照併入本說明書中。 本說明書中記載之所有文獻、專利申請及技術規格與藉由參照併入各個文獻、專利申請及技術規格之情況被具體且分別記入之情況相同程度地,藉由參照併入本說明書中。 The disclosures of Japanese Patent Application No. 2021-182791 filed on November 9, 2021 and Japanese Patent Application No. 2022-151758 filed on September 22, 2022 are incorporated herein by reference. All documents, patent applications, and technical specifications described in this specification are incorporated by reference into this specification to the same extent as if each individual document, patent application, and technical specification was specifically and individually indicated to be incorporated by reference.

none

Figure 111141956-A0101-11-0002-2
Figure 111141956-A0101-11-0002-2

Claims (18)

一種硬化性組成物,其包含: 由下述式1表示之自由基聚合起始劑;及 自由基聚合性化合物,
Figure 03_image128
式1中,Ar 1及Ar 2分別獨立地表示芳香環,L 11表示單鍵,L 12表示2價連結基,p1表示0以上且Ar 1中的芳香環上可取代的所有位置數-3以下的整數,p2表示0以上且Ar 2中的芳香環上可取代的所有位置數-4以下的整數,R 11、R 12及R 15分別獨立地表示取代基,R 13及R 14分別獨立地表示氫原子或取代基,X 1表示單鍵O、S或NR 16,R 16表示氫原子或取代基,Y 1表示單鍵或羰基,R 12~R 16中2個以上可以鍵結而形成環。
A curable composition comprising: a radical polymerization initiator represented by the following formula 1; and a radical polymerizable compound,
Figure 03_image128
In Formula 1, Ar 1 and Ar 2 independently represent an aromatic ring, L 11 represents a single bond, L 12 represents a divalent linking group, p1 represents 0 or more and the number of all positions that can be substituted on the aromatic ring in Ar 1 is -3 The following integers, p2 represents an integer of 0 or more and the number of all substitutable positions on the aromatic ring in Ar2 is -4 or less, R 11 , R 12 and R 15 independently represent substituents, and R 13 and R 14 independently represent ground represents a hydrogen atom or a substituent, X 1 represents a single bond O, S or NR 16 , R 16 represents a hydrogen atom or a substituent, Y 1 represents a single bond or a carbonyl group, two or more of R 12 to R 16 may be bonded and Form a ring.
如請求項1所述之硬化性組成物,其中 由前述式1表示之自由基聚合起始劑為由下述式2表示之化合物,
Figure 03_image130
式2中,R 21表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 22及R 25分別獨立地表示烷基羰基、芳基羰基、雜芳基羰基、烷基、烷氧基、芳基、雜芳基、芳氧基、鹵素原子、硝基、氰基、一級~三級胺基、烷硫基或芳硫基,p3表示0~3的整數,p4表示0~2的整數,R 23及R 24分別獨立地表示氫原子、烷基或芳基,R 26及R 27分別獨立地表示氫原子、烷基或芳基,Y 2表示單鍵或羰基,Y 2為羰基時,可以存在複數個之R 26及可以存在複數個之R 27中的至少1個不是氫原子,n為1~3的整數,R 22~R 27中2個以上可以鍵結而形成環。
The curable composition according to claim 1, wherein the radical polymerization initiator represented by the aforementioned formula 1 is a compound represented by the following formula 2,
Figure 03_image130
In formula 2, R 21 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 22 and R 25 independently represent an alkyl carbonyl group, an aryl carbonyl group, a heteroaryl carbonyl group, Alkyl, alkoxy, aryl, heteroaryl, aryloxy, halogen atom, nitro, cyano, primary to tertiary amino, alkylthio or arylthio, p3 represents an integer from 0 to 3, p4 represents an integer of 0 to 2, R 23 and R 24 independently represent a hydrogen atom, an alkyl group or an aryl group, R 26 and R 27 represent a hydrogen atom, an alkyl group or an aryl group independently, and Y 2 represents a single bond or Carbonyl, when Y 2 is a carbonyl group, at least one of the plural R 26 and the plural R 27 that may exist is not a hydrogen atom, n is an integer of 1 to 3, and two or more of R 22 to R 27 may be bonds to form a ring.
如請求項1所述之硬化性組成物,其中 由前述式1表示之自由基聚合起始劑為由下述式3表示之化合物,
Figure 03_image132
式3中,R 31表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 32表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 33及R 34分別獨立地表示氫原子或烷基,R 36~R 39分別獨立地表示氫原子、烷基或芳基,R 32~R 34中2個以上可以鍵結而形成環,R 36與R 37可以鍵結而形成環,
Figure 03_image134
式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。
The curable composition according to claim 1, wherein the radical polymerization initiator represented by the aforementioned formula 1 is a compound represented by the following formula 3,
Figure 03_image132
In formula 3, R 31 represents alkyl, alkenyl, aryl, heteroaryl, alkoxy or aryloxy, R 32 represents hydrogen atom, halogen atom, nitro, aryl, heteroaryl, alkoxy , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 33 and R 34 independently represent a hydrogen atom or an alkyl group, R 36 ~R 39 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 32 ~R 34 may be bonded to form a ring, R 36 and R 37 may be bonded to form a ring,
Figure 03_image134
In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group.
如請求項1所述之硬化性組成物,其中 由前述式1表示之自由基聚合起始劑為由下述式4表示之化合物,
Figure 03_image136
式4中,R 41表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 42表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 43及R 44分別獨立地表示氫原子或烷基,R 46及R 47分別獨立地表示氫原子、烷基或芳基,R 42~R 44中2個以上可以鍵結而形成環,R 46與R 47可以鍵結而形成環,R 42為氫原子、鹵素原子、硝基、烷氧基、芳氧基或由下述式I或式II表示之基團時,R 46及R 47不會均成為氫原子,R 42為芳基、雜芳基、一級~三級胺基、烷硫基或芳硫基時,R 46及R 47可以均為氫原子,
Figure 03_image138
式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。
The curable composition according to claim 1, wherein the radical polymerization initiator represented by the aforementioned formula 1 is a compound represented by the following formula 4,
Figure 03_image136
In formula 4, R 41 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 42 represents a hydrogen atom, a halogen atom, a nitro group, an aryl group, a heteroaryl group, an alkoxy group , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 43 and R 44 independently represent a hydrogen atom or an alkyl group, R 46 and R 47 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 42 to R 44 may be bonded to form a ring, R 46 and R 47 may be bonded to form a ring, R 42 is a hydrogen atom, When a halogen atom, nitro, alkoxy, aryloxy group or a group represented by the following formula I or formula II, R 46 and R 47 will not both become hydrogen atoms, and R 42 is aryl, heteroaryl, For primary to tertiary amino groups, alkylthio groups or arylthio groups, R 46 and R 47 can both be hydrogen atoms,
Figure 03_image138
In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group.
如請求項1所述之硬化性組成物,其進一步包含著色劑。The curable composition according to claim 1, further comprising a colorant. 如請求項5所述之硬化性組成物,其中 前述著色劑的含量相對於硬化性組成物的總固體成分為50質量%以上。 The curable composition as described in Claim 5, wherein Content of the said coloring agent is 50 mass % or more with respect to the total solid content of a curable composition. 如請求項1所述之硬化性組成物,其進一步包含樹脂。The curable composition according to claim 1, further comprising a resin. 如請求項7所述之硬化性組成物,其中 前述樹脂為具有接枝鏈之接枝聚合物,且前述接枝鏈包含選自包括聚醚鏈、聚酯鏈及聚丙烯酸鏈之群組中之至少1種,且前述接枝鏈的重量平均分子量為1,000以上。 The curable composition as described in Claim 7, wherein The aforementioned resin is a graft polymer having grafted chains, and the aforementioned grafted chains include at least one selected from the group consisting of polyether chains, polyester chains, and polyacrylic acid chains, and the weight average of the aforementioned grafted chains The molecular weight is 1,000 or more. 如請求項7所述之硬化性組成物,其中 前述樹脂具有(甲基)丙烯醯基、環氧基或氧環丁烷基。 The curable composition as described in Claim 7, wherein The foregoing resin has a (meth)acryl group, an epoxy group, or an oxetanyl group. 如請求項1所述之硬化性組成物,其進一步包含顏料衍生物。The curable composition according to claim 1, further comprising pigment derivatives. 一種硬化物的製造方法,其包括對請求項1至請求項10之任一項所述之硬化性組成物照射波長150nm~300nm的光之步驟。A method for producing a cured product, comprising the step of irradiating the curable composition described in any one of claim 1 to claim 10 with light having a wavelength of 150 nm to 300 nm. 如請求項11所述之硬化物的製造方法,其中 前述光為準分子雷射。 The manufacturing method of the hardened object as described in Claim 11, wherein The aforementioned light is an excimer laser. 一種膜,其藉由硬化請求項1至請求項10之任一項所述之硬化性組成物而成。A film formed by curing the curable composition according to any one of claims 1 to 10. 一種光學元件,其包含請求項13所述之膜。An optical element comprising the film described in claim 13. 一種影像感測器,其包含請求項13所述之膜。An image sensor comprising the film described in claim 13. 一種固體攝像元件,其包含請求項13所述之膜。A solid-state imaging device comprising the film described in claim 13. 一種圖像顯示裝置,其包含請求項13所述之膜。An image display device comprising the film described in claim 13. 一種自由基聚合起始劑,其由下述式3或式4表示,
Figure 03_image132
式3中,R 31表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 32表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 33及R 34分別獨立地表示氫原子或烷基,R 36~R 39分別獨立地表示氫原子、烷基或芳基,R 32~R 34中2個以上可以鍵結而形成環,R 36與R 37可以鍵結而形成環,
Figure 03_image140
式4中,R 41表示烷基、烯基、芳基、雜芳基、烷氧基或芳氧基,R 42表示氫原子、鹵素原子、硝基、芳基、雜芳基、烷氧基、芳氧基、一級~三級胺基、烷硫基、芳硫基或由下述式I或式II表示之基團,R 43及R 44分別獨立地表示氫原子或烷基,R 46及R 47分別獨立地表示氫原子、烷基或芳基,R 42~R 44中2個以上可以鍵結而形成環,R 46與R 47可以鍵結而形成環,R 42為氫原子、鹵素原子、硝基、烷氧基、芳氧基或由下述式I或式II表示之基團時,R 46及R 47不會均成為氫原子,R 42為芳基、雜芳基、一級~三級胺基、烷硫基或芳硫基時,R 46及R 47可以均為氫原子,
Figure 03_image138
式I及式II中,*表示與其他結構的鍵結位置,R 101~R 105及R 201~R 205分別獨立地表示氫原子、烷基、芳基、烷氧基、芳氧基、羥基、胺基、硝基、氰基或鹵素原子,2個以上的R 101~R 105或2個以上的R 201~R 205可以鍵結而形成環,Z表示O、S或NR 207,R 207表示氫原子、烷基或芳基。
A radical polymerization initiator, which is represented by the following formula 3 or formula 4,
Figure 03_image132
In formula 3, R 31 represents alkyl, alkenyl, aryl, heteroaryl, alkoxy or aryloxy, R 32 represents hydrogen atom, halogen atom, nitro, aryl, heteroaryl, alkoxy , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 33 and R 34 independently represent a hydrogen atom or an alkyl group, R 36 ~R 39 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 32 ~R 34 may be bonded to form a ring, R 36 and R 37 may be bonded to form a ring,
Figure 03_image140
In formula 4, R 41 represents an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group or an aryloxy group, and R 42 represents a hydrogen atom, a halogen atom, a nitro group, an aryl group, a heteroaryl group, an alkoxy group , aryloxy group, primary to tertiary amino group, alkylthio group, arylthio group or a group represented by the following formula I or formula II, R 43 and R 44 independently represent a hydrogen atom or an alkyl group, R 46 and R 47 each independently represent a hydrogen atom, an alkyl group or an aryl group, two or more of R 42 to R 44 may be bonded to form a ring, R 46 and R 47 may be bonded to form a ring, R 42 is a hydrogen atom, When a halogen atom, nitro, alkoxy, aryloxy group or a group represented by the following formula I or formula II, R 46 and R 47 will not both become hydrogen atoms, and R 42 is aryl, heteroaryl, For primary to tertiary amino groups, alkylthio groups or arylthio groups, R 46 and R 47 can both be hydrogen atoms,
Figure 03_image138
In formula I and formula II, * represents the bonding position with other structures, and R 101 ~ R 105 and R 201 ~ R 205 independently represent a hydrogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a hydroxyl group , amine group, nitro group, cyano group or halogen atom, two or more R 101 to R 105 or two or more R 201 to R 205 can be bonded to form a ring, Z represents O, S or NR 207 , R 207 represents a hydrogen atom, an alkyl group or an aryl group.
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