WO2022019255A1

WO2022019255A1 - Resin composition, film, optical filter, solid-state imaging element, image display device and resin

Info

Publication number: WO2022019255A1
Application number: PCT/JP2021/026921
Authority: WO
Inventors: 雅臣牧野; 祐士金子
Original assignee: 富士フイルム株式会社
Priority date: 2020-07-22
Filing date: 2021-07-19
Publication date: 2022-01-27
Also published as: TW202206500A; JP7397201B2; JPWO2022019255A1; CN115702213B; KR20230013085A; CN115702213A

Abstract

Provided is a resin composition that includes a color material A containing a colorant, a resin B, and a solvent C, said resin B including a resin b-1 that includes structural units represented by formula (1-A) and structural units represented by formula (1-B). Further provided are a film, an optical filter, a solid-state imaging element, an image display device, and a resin.

Description

Resin composition, film, optical filter, solid-state image sensor, image display device and resin

The present invention relates to a resin composition, a film, an optical filter, a solid-state image sensor, an image display device, and a resin.

In recent years, with the widespread use of digital cameras, camera-equipped mobile phones, etc., demand for solid-state image sensors such as charge-coupled device (CCD) image sensors has increased significantly. A film containing a pigment such as a color filter is used for the solid-state image sensor. A film containing a color material such as a color filter is manufactured by using a resin composition containing a pigment, a resin, and a solvent.

For example, Patent Document 1 describes a resin composition containing a pigment, a dispersant, a binder resin, an epoxy compound, and a solvent, wherein the dispersants are a tetracarboxylic acid anhydride (b1) and a tricarboxylic acid anhydride (b2). ), A polyester moiety X1'having a carboxy group formed by reacting an acid anhydride group in one or more acid anhydrides (b) with a hydroxyl group in a hydroxyl group-containing compound (a), and ethylenically unsaturated. The monomer (c) is radically polymerized and has a vinyl polymer moiety X2'having a thermally crosslinkable functional group, and the thermally crosslinkable functional group is a hydroxyl group, an oxetane group, a t-butyl group, or a block. An invention relating to a resin composition containing a dispersant (X), which is at least one selected from the group consisting of an isocyanate group and a (meth) acryloyl group, is described.

Japanese Unexamined Patent Publication No. 2016-17325

In a resin composition containing a pigment, a resin and a solvent, it is preferable that the dispersibility of the pigment is good. If the dispersibility of the pigment is insufficient, the pigment tends to aggregate and coarsen in the resin composition, or the viscosity of the resin composition tends to increase. Further, even if the viscosity of the resin composition immediately after production is low, the viscosity may increase with time.

According to the study by the present inventor, it was found that the dispersibility of the pigment is not sufficient even in the resin composition described in Patent Document 1, and there is room for further improvement.

Therefore, an object of the present invention is to provide a resin composition having excellent dispersibility of a pigment. Another object of the present invention is to provide a film, an optical filter, a solid-state image pickup device, and an image display device using a resin composition. Further, an object of the present invention is to provide a resin.

Examples of typical embodiments of the present invention are shown below.
<1> Color material A containing a pigment and
Resin B and
Containing solvent C,
The resin B includes a resin b-1 containing a structural unit represented by the formula (1-A) and a structural unit represented by the formula (1-B).
Resin composition;

Wherein ^{(1-A), X 11} represents a tetravalent linking ^{group, X 12} represents a 2 + n valent linking ^{group, Y 11} represents O or ^{NR ^{^Y11,}} ^R ^11, R ¹² and ^{R Y11} are Each independently represents a hydrogen atom or substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer greater than or equal to 1.
In formula (1-B), X ⁵¹ represents a tetravalent linking group, X ⁵² represents a divalent linking group, Y ⁵¹ represents O or NR ^Y ⁵¹ , and R 51, R ⁵² , R ⁶¹ and R. ^Y51 independently represents a hydrogen atom or a substituent.
<2> The structural unit represented by the above formula (1-A), the structural unit of the structure in which n is 0 in the above formula (1-A), and the structural unit represented by the above formula (1-B). The resin composition according to <1>, wherein the ratio of the structural unit represented by the above formula (1-B) in moles is 10 to 90 mol%.
<3> The ratio of the number of moles of the structural unit represented by the formula (1-B) to the number of moles of the structural unit represented by the formula (1-A) is 0.2 to 5, <1> or <. 2> The resin composition according to.
<4> The resin composition according to any one of <1> to <3>, wherein the divalent linking group represented ^{by Lp 1 of the} above formula (1-A) is a group containing a sulfur atom.
<5> Any of <1> to <4>, wherein ^{X 11} of the above formula (1-A) and X ^{51 of the above formula (1-B) are groups each independently containing an aromatic hydrocarbon ring.} The resin composition according to one.
<6> The resin composition according to any one of <1> to <5>, wherein ^{X 52} of the above formula (1-B) is a group containing a fluorine atom and an aromatic hydrocarbon ring.
^{<7> The polymer chain represented by P 1 of the} above formula (1-A) contains a repeating unit of at least one structure selected from a poly (meth) acrylic structure, a polystyrene structure, a polyether structure and a polyester structure. 1> The resin composition according to any one of <6>.
^{<8> The polymer chain represented by P 1 of the} above formula (1-A) contains a repeating unit represented by any of the formulas (P1-1) to (P1-6), <1> to <6. > The resin composition according to any one of the above;

In the formula, ^RG1 and ^RG2 each represent an alkylene group;
^RG3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group;
Q ^G1 represents -O- or -NR ^q- , and R ^q represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group;
^LG1 represents a single bond or an arylene group;
^LG2 represents a single bond or a divalent linking group;
^RG4 represents a hydrogen atom or substituent;
^RG5 represents a hydrogen atom or a methyl group and ^RG6 represents an aryl group.
<9> substituent represented by R ^G4 ethylenically unsaturated bond-containing group, an epoxy group, at least one selected from an oxetanyl group, and t- butyl group, a resin composition according to <8>.
<10> The resin composition according to any one of <1> to <9>, wherein the solvent C contains at least one selected from an ester solvent, an ether solvent, an alcohol solvent and a ketone solvent. ..
<11> The resin composition according to any one of <1> to <10>, wherein the coloring material A contains at least one selected from a diketopyrrolopyrrole pigment and a phthalocyanine pigment.
<12> The resin composition according to any one of <1> to <11>, which further contains a polymerizable monomer.
<13> The resin composition according to any one of <1> to <12>, further comprising a photopolymerization initiator.
<14> A film obtained by using the resin composition according to any one of <1> to <13>.
<15> An optical filter having the film according to <14>.
<16> A solid-state image sensor having the film according to <14>.
<17> An image display device having the film according to <14>.
<18> A resin containing a structural unit represented by the formula (1-A) and a structural unit represented by the formula (1-B);

Wherein ^{(1-A), X 11} represents a tetravalent linking ^{group, X 12} represents a 2 + n valent linking ^{group, Y 11} represents O or ^{NR ^{^Y11,}} ^R ^11, R ¹² and ^{R Y11} are Each independently represents a hydrogen atom or substituent, Lp ¹ represents a divalent linking group, P ¹ represents a polymer chain, and n represents an integer greater than or equal to 1.
In formula (1-B), X ⁵¹ represents a tetravalent linking group, X ⁵² represents a divalent linking group, Y ⁵¹ represents O or NR ^Y ⁵¹ , and R 51, R ⁵² , R ⁶¹ and R. ^Y51 independently represents a hydrogen atom or a substituent.

According to the present invention, it is possible to provide a resin composition having excellent dispersibility of a pigment. Further, it is possible to provide a film, an optical filter, a solid-state image pickup device, and an image display device using a resin composition. In addition, a resin can be provided.

Hereinafter, the main embodiments of the present invention will be described. However, the present invention is not limited to the specified embodiments.
In the present specification, "to" is used to mean that the numerical values described before and after it are included as the lower limit value and the upper limit value.
In the notation of a group (atomic group) in the present specification, the notation not describing substitution and non-substitution also includes a group having a substituent (atomic group) as well as a group having no substituent (atomic group). For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
As used herein, the term "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams, unless otherwise specified. Examples of the light used for exposure include the emission line spectrum of a mercury lamp, far ultraviolet rays typified by an excimer laser, extreme ultraviolet rays (EUV light), X-rays, active rays such as electron beams, or radiation.
In the present specification, the (meth) allyl group represents both allyl and metharyl, or either, and "(meth) acrylate" represents both acrylate and methacrylate, or either, and "(meth)". "Acrylic" represents both acrylic and methacrylic, or either, and "(meth) acryloyl" represents both acryloyl and methacrylic, or either.
In the present specification, the weight average molecular weight and the number average molecular weight are polystyrene-equivalent values measured by a GPC (gel permeation chromatography) method.
In the present specification, the near infrared ray means light having a wavelength of 700 to 2500 nm.
As used herein, the total solid content means the total mass of all the components of the composition excluding the solvent.
In the present specification, the term "process" does not only refer to an independent process, but also to the present term if the intended action of the process is achieved even if it cannot be clearly distinguished from other processes. included.
As used herein, the term pigment means a compound that is difficult to dissolve in a solvent.
In the present specification, a symbol (for example, A) added before or after a name is a term used to distinguish components, and the type of component, the number of components, and the structure. It does not limit the superiority or inferiority of the elements.

<Resin composition>
The resin composition of the present invention contains a coloring material A containing a pigment, a resin B, and a solvent C, and the resin B is a structural unit represented by the formula (1-A) and the formula (1-B). ), The resin b-1 (hereinafter, also referred to as a specific resin) containing the structural unit represented by) is contained.

The resin composition of the present invention is excellent in dispersibility of pigments. Such the effect details are obtained for unknown reasons, this particular resin, the X ⁵¹ is a tetravalent linking group, an amide group (-C (= O) -NR 61 - , etc.) is attached Since it has a structural unit represented by the formula (1-B), which is a structural unit, the adsorption of the specific resin to the pigment surface is good. Also, this particular resin is a structural unit of the polyester structure having a polymer chain P ^1, since it has a structural unit represented by the formula (1-A), the polymer chain P ¹ and a steric repulsion group Therefore, aggregation of pigments can be suppressed. For this reason, it is presumed that the resin composition having excellent dispersibility of the pigment could be obtained.

Further, since this specific resin has a structural unit represented by (1-B), it is difficult to be decomposed even at a high temperature by using the resin composition of the present invention, and the film is not easily decomposed even after heat treatment at a high temperature. It is possible to form a film having excellent heat resistance, which is less likely to shrink. Therefore, even if a film is formed using the resin composition of the present invention and then the obtained film is heat-treated at a high temperature (for example, 300 ° C. or higher), the film shrinkage is suppressed and the film is formed on the film. Even when another film such as an inorganic film is formed, it is possible to suppress the occurrence of cracks in the other film. Therefore, according to the resin composition of the present invention, the process window of the process after manufacturing the film can be expanded.

When a film having a thickness of 0.60 μm was formed by heating at 200 ° C. for 30 minutes using the resin composition of the present invention, the film was heat-treated at 300 ° C. for 5 hours under a nitrogen atmosphere. The thickness of the film is preferably 70% or more, more preferably 80% or more, and further preferably 90% or more of the thickness of the film before the heat treatment.
The thickness of the film after being heat-treated at 350 ° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more, preferably 80% or more of the thickness of the film before the heat treatment. Is more preferable, and 90% or more is further preferable.
The thickness of the film after being heat-treated at 400 ° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more, preferably 80% or more of the thickness of the film before the heat treatment. Is more preferable, and 90% or more is further preferable.
The above physical properties can be achieved by a method such as adjusting the type and content of the specific resin to be used.

Further, when the resin composition of the present invention was heated at 200 ° C. for 30 minutes to form a film having a thickness of 0.60 μm, the film was heat-treated at 300 ° C. for 5 hours under a nitrogen atmosphere. In addition, the rate of change ΔA of the absorbance of the film after the heat treatment represented by the following formula (A1) is preferably 50% or less, more preferably 45% or less, and more preferably 40% or less. It is more preferably 35% or less, and particularly preferably 35% or less.
ΔA (%) = | 100- (A2 / A1) x 100 | ... (A1)
ΔA is the rate of change in the absorbance of the membrane after heat treatment.
A1 is the maximum value of the absorbance in the wavelength range of 400 to 1100 nm of the film before the heat treatment.
A2 is the absorbance of the film after the heat treatment, and is the absorbance at a wavelength indicating the maximum value of the absorbance in the wavelength range of 400 to 1100 nm of the film before the heat treatment.
The above physical properties can be achieved by a method such as adjusting the type and content of the specific resin to be used.

Further, when the resin composition of the present invention is heated at 200 ° C. for 30 minutes to form a film having a thickness of 0.60 μm, the wavelength λ1 showing the maximum value of the absorbance of the film in the wavelength range of 400 to 1100 nm. The absolute value of the difference from the wavelength λ2, which indicates the maximum value of the absorbance of the film after heat-treating the film at 300 ° C. for 5 hours in a nitrogen atmosphere, is preferably 50 nm or less, preferably 45 nm or less. It is more preferably present, and further preferably 40 nm or less.
The above physical properties can be achieved by a method such as adjusting the type and content of the specific resin to be used.

Further, when the resin composition of the present invention was heated at 200 ° C. for 30 minutes to form a film having a thickness of 0.60 μm, the film was heat-treated at 300 ° C. for 5 hours in a nitrogen atmosphere. _{The maximum value of the rate of change ΔA λ} of the absorbance in the wavelength range of 400 to 1100 nm after the heat treatment is preferably 30% or less, more preferably 27% or less, and further preferably 25% or less. preferable. The rate of change in absorbance is a value calculated from the following formula (2).
ΔA _λ = | 100- (A2 _λ / A1 _λ ) × 100 | ... (2)
ΔA _λ is the rate of change in absorbance at the wavelength λ of the film after heat treatment.
A1 _λ is the absorbance at the wavelength λ of the film before heat treatment.
A2 _λ is the absorbance at the wavelength λ of the film after the heat treatment.
The above physical properties can be achieved by a method such as adjusting the type and content of the specific resin to be used.

The resin composition of the present invention is preferably used as a resin composition for an optical filter. Examples of the optical filter include a color filter, a near-infrared transmission filter, a near-infrared cut filter, and the like, and a color filter is preferable. Further, the resin composition of the present invention can be preferably used as a resin composition for a solid-state image sensor, and more preferably as a resin composition for forming pixels of an optical filter used in a solid-state image sensor.

Examples of the color filter include filters having colored pixels that transmit light of a specific wavelength, and at least one colored pixel selected from red pixels, blue pixels, green pixels, yellow pixels, cyan pixels, and magenta pixels. It is preferable that the filter has. The color filter can be formed by using a resin composition containing a chromatic color material.

Examples of the near-infrared cut filter include a filter having a maximum absorption wavelength in the wavelength range of 700 to 1800 nm. The maximum absorption wavelength of the near-infrared cut filter is preferably in the wavelength range of 700 to 1300 nm, and more preferably in the wavelength range of 700 to 1100 nm. Further, the transmittance of the near-infrared cut filter in the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, still more preferably 90% or more. Further, the transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. Further, the absorbance Amax / absorbance A550, which is the ratio of the absorbance Amax at the maximum absorption wavelength of the near-infrared cut filter to the absorbance A550 at a wavelength of 550 nm, is preferably 20 to 500, more preferably 50 to 500. , 70 to 450, more preferably 100 to 400, and particularly preferably 100 to 400. The near-infrared cut filter can be formed by using a resin composition containing a near-infrared absorbing color material.

The near-infrared ray transmission filter is a filter that transmits at least a part of near-infrared rays. The near-infrared transmission filter is preferably a filter that blocks at least a part of visible light and transmits at least a part of near-infrared light. As a near-infrared transmissive filter, the maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the transmittance in the wavelength range of 1100 to 1300 nm. A filter satisfying the spectral characteristics having a minimum value of 70% or more (preferably 75% or more, more preferably 80% or more) is preferably mentioned. The near-infrared transmission filter is preferably a filter that satisfies any of the following spectral characteristics (1) to (5).
(1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more).
(2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more).
(3): The maximum value of the transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 1000 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more).
(4): The maximum value of the transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 1100 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more).
(5): The maximum value of the transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 1200 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more).

A preferred embodiment of the spectral characteristics of the resin composition of the present invention is that when a film having a thickness of 5 μm is formed using the resin composition, the wavelength of the light transmittance in the thickness direction of the film is 360 to 700 nm. Examples thereof include an embodiment satisfying the spectral characteristics in which the maximum value in the range is 50% or more. A resin composition satisfying such spectral characteristics can be preferably used as a resin composition for forming pixels of a color filter. Specifically, it can be preferably used as a resin composition for forming colored pixels selected from red pixels, blue pixels, green pixels, yellow pixels, cyan pixels and magenta colors.

The resin composition having the above spectral characteristics preferably contains a chromatic coloring material. For example, a resin composition containing a red color material and a yellow color material can be preferably used as a resin composition for forming red pixels. Further, the resin composition containing the blue color material and the purple color material can be preferably used as the resin composition for forming blue pixels. Further, the resin composition containing the green color material can be preferably used as the resin composition for forming green or cyan color pixels. When the resin composition is used as a resin composition for forming green pixels, it is also preferable to further contain a yellow color material in addition to the green color material.

Another preferred embodiment of the spectral characteristics of the resin composition of the present invention is that Amin / B, which is the ratio of the minimum absorbance Amin in the wavelength range of 400 to 640 nm to the absorbance B in the wavelength range of 1500 nm, is 5 or more. An embodiment that satisfies a certain spectral characteristic can be mentioned. A resin composition satisfying such spectral characteristics can be preferably used as a resin composition for forming a near-infrared transmission filter. The value of Amin / B, which is the above-mentioned absorbance ratio, is preferably 7.5 or more, more preferably 15 or more, and even more preferably 30 or more.

Here, the absorbance Aλ at the wavelength λ is defined by the following equation (λ1).
Aλ = -log (Tλ / 100) ... (λ1)
Aλ is the absorbance at the wavelength λ, and Tλ is the transmittance (%) at the wavelength λ.
In the present invention, the value of the absorbance may be a value measured in the state of a solution or a value of a film formed by using the composition. When measuring the absorbance in the state of a film, the composition is applied onto a glass substrate by a method such as spin coating, and the film is dried at 100 ° C. for 120 seconds using a hot plate or the like for measurement. Is preferable.

The resin composition of the present invention preferably satisfies any of the following spectral characteristics (Ir1) to (Ir5).
(Ir1): The value of A1 / B1, which is the ratio of the minimum value A1 of the absorbance in the wavelength range of 400 to 640 nm and the maximum value B1 of the absorbance in the wavelength range of 800 to 1500 nm, is 4.5 or more. It is preferably 5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this aspect, it is possible to form a film capable of transmitting light having a wavelength of more than 750 nm by blocking light in the wavelength range of 400 to 640 nm.
(Ir2): The value of A2 / B2, which is the ratio of the minimum value A2 of the absorbance in the wavelength range of 400 to 750 nm and the maximum value B2 of the absorbance in the wavelength range of 900 to 1500 nm, is 4.5 or more. It is preferably 5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this aspect, it is possible to form a film capable of transmitting light having a wavelength of more than 850 nm by blocking light in the wavelength range of 400 to 750 nm.
(Ir3): The value of A3 / B3, which is the ratio of the minimum value A3 of the absorbance in the wavelength range of 400 to 830 nm and the maximum value B3 of the absorbance in the wavelength range of 1000 to 1500 nm, is 4.5 or more. It is preferably 5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this aspect, it is possible to form a film capable of transmitting light having a wavelength of more than 950 nm by blocking light in the wavelength range of 400 to 830 nm.
(Ir4): The value of A4 / B4, which is the ratio of the minimum value A4 of the absorbance in the wavelength range of 400 to 950 nm and the maximum value B4 of the absorbance in the wavelength range of 1100 to 1500 nm, is 4.5 or more. It is preferably 5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this aspect, it is possible to form a film capable of transmitting light having a wavelength of more than 1050 nm by blocking light in the wavelength range of 400 to 950 nm.
(Ir5): The value of A5 / B5, which is the ratio of the minimum value A5 of the absorbance in the wavelength range of 400 to 1050 nm and the maximum value B5 of the absorbance in the wavelength range of 1200 to 1500 nm, is 4.5 or more. It is preferably 5 or more, more preferably 15 or more, and even more preferably 30 or more. According to this aspect, it is possible to form a film capable of transmitting light having a wavelength of more than 1150 nm by blocking light in the wavelength range of 400 to 1050 nm.

It is also preferable that the resin composition of the present invention is a resin composition for pattern formation by a photolithography method. According to this aspect, pixels having a fine size can be easily formed. Therefore, it can be particularly preferably used as a resin composition for forming pixels of an optical filter used in a solid-state image sensor. For example, a resin composition containing a component having an ethylenically unsaturated bond-containing group (for example, a resin having an ethylenically unsaturated bond-containing group or a monomer having an ethylenically unsaturated bond-containing group) and a photopolymerization initiator. Can be preferably used as a resin composition for pattern formation in a photolithography method. It is also preferable that the resin composition for pattern formation in the photolithography method further contains an alkali-soluble resin.

The resin composition of the present invention can also be used as a resin composition for forming a black matrix or a resin composition for forming a light-shielding film.

Hereinafter, each component used in the resin composition of the present invention will be described.

<Color material A>
The resin composition of the present invention contains a coloring material A (hereinafter referred to as a coloring material). Examples of the coloring material include a white coloring material, a black coloring material, a chromatic coloring material, and a near-infrared absorbing coloring material. In the present invention, the white color material includes not only pure white color material but also a light gray color material close to white (for example, grayish white, light gray, etc.).

The color material preferably contains at least one selected from the group consisting of a chromatic color material, a black color material, and a near-infrared absorbing color material, and is selected from the group consisting of a chromatic color material and a near-infrared absorbing color material. It is more preferable to contain at least one chromatic color material, further preferably to contain a chromatic color material, and at least one chromatic color selected from the group consisting of a red color material, a yellow color material, a blue color material and a purple color material. It is more preferable to include a material.

Further, the coloring material preferably contains a chromatic color material and a near-infrared absorbing color material, and preferably contains two or more kinds of chromatic color materials and a near-infrared absorbing color material. Further, black may be formed by a combination of two or more kinds of chromatic color materials. Further, it is also preferable that the coloring material contains a black coloring material and a near-infrared absorbing coloring material. According to these aspects, the resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared transmission filter. For the combination of the coloring materials forming black color by the combination of two or more kinds of chromatic color materials, Japanese Patent Application Laid-Open No. 2013-077009, Japanese Patent Application Laid-Open No. 2014-130338, International Publication No. 2015/166779 and the like can be referred to.

As the coloring material contained in the coloring composition of the present invention, one containing a pigment is used. The pigment may be either an inorganic pigment or an organic pigment, but is preferably an organic pigment from the viewpoint of many color variations, ease of dispersion, safety and the like. Further, the pigment preferably contains at least one selected from a chromatic pigment and a near-infrared absorbing pigment, and more preferably contains a chromatic pigment.

The pigment may include at least one selected from phthalocyanine pigments, dioxazine pigments, quinacridone pigments, anthraquinone pigments, perylene pigments, azo pigments, diketopyrrolopyrrole pigments, pyrolopyrrolop pigments, isoindrin pigments and quinophthalone pigments. It is more preferable that it contains at least one selected from a phthalocyanine pigment, a diketopyrrolopyrrole pigment and a pyrolopyrrolop pigment, and even more preferably it contains a phthalocyanine pigment or a diketopyrrolopyrrole pigment. Further, the phthalocyanine pigment has a phthalocyanine pigment having no central metal and copper or zinc as the central metal because it is easy to form a film whose spectral characteristics do not easily change even after heating to a high temperature (for example, 300 ° C. or higher). Phthalocyanine pigments are preferred.

The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, still more preferably 100 nm or less. When the average primary particle size of the pigment is in the above range, the dispersion stability of the pigment in the resin composition is good. In the present invention, the primary particle size of the pigment can be obtained from a photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of the primary particles of the pigment is obtained, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment. Further, the average primary particle size in the present invention is an arithmetic average value of the primary particle size for the primary particles of 400 pigments. Further, the primary particles of the pigment refer to independent particles without aggregation.

(Coloring material)
Examples of the chromatic color material include a color material having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. For example, a yellow color material, an orange color material, a red color material, a green color material, a purple color material, a blue color material, and the like can be mentioned. From the viewpoint of heat resistance, the chromatic color material is preferably a pigment (chromatic pigment), more preferably a red pigment, a yellow pigment, and a blue pigment, and even more preferably a red pigment and a blue pigment. Specific examples of the chromatic pigment include those shown below.

C. I. Pigment Yellow 1,2,3,4,5,6,10,11,12,13,14,15,16,17,18,20,24,31,32,34,35,35: 1,36, 36: 1,37,37: 1,40,42,43,53,55,60,61,62,63,65,73,74,77,81,83,86,93,94,95,97, 98,100,101,104,106,108,109,110,113,114,115,116,117,118,119,120,123,125,126,127,128,129,137,138,139, 147,148,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179, 180,181,182,185,187,188,193,194,199,213,214,215,228,231,232 (methine type), 233 (quinoline type), 234 (aminoketone type), 235 (aminoketone type) ), 236 (aminoketone type), etc. (above, yellow pigment),
C. I. Pigment Orange 2,5,13,16,17: 1,31,34,36,38,43,46,48,49,51,52,55,59,60,61,62,64,71,73, etc. (The above is orange pigment),
C. I. Pigment Red 1,2,3,4,5,6,7,9,10,14,17,22,23,31,38,41,48:1,48: 2,48:3,48:4 49,49: 1,49: 2,52: 1,52: 2,53: 1,57: 1,60: 1,63: 1,66,67,81: 1,81: 2,81: 3, 83,88,90,105,112,119,122,123,144,146,149,150,155,166,168,169,170,171,172,175,176,177,178,179,184 185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,269,270,272,279,291 294 (xanthene type, Ultramarine, Blush Red), 295 (monoazo type), 296 (diazo type), 297 (aminoketone type), etc. (above, red pigment),
C. I. Pigment Green 7,10,36,37,58,59,62,63,64 (phthalocyanine type), 65 (phthalocyanine type), 66 (phthalocyanine type), etc. (above, green pigment),
C. I. Pigment Violet 1,19,23,27,32,37,42,60 (triarylmethane type), 61 (xanthene type), etc. (above, purple pigment),
C. I. Pigment Blue 1,2,15,15: 1,15: 2,15: 3,15: 4,15: 6,16,22,29,60,64,66,79,80,87 (monoazo system), 88 (methine-based) and the like (above, blue pigment).

Among these chromatic pigments, C.I. I. Pigment Red 254, C.I. I. Pigment Red 264, C.I. I. Pigment Red 272, C.I. I. Pigment Red 122, C.I. I. Pigment Red 177 is preferred. Further, as the blue pigment, C.I. I. Pigment Blue 15: 3, C.I. I. Pigment Blue 15: 4, C.I. I. Pigment Blue 15: 6, C.I. I. Pigment Blue 16 is preferred.

Further, as a green pigment, a halogenated zinc phthalocyanine pigment having an average of 10 to 14 halogen atoms in one molecule, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms. Can also be used. Specific examples include the compounds described in International Publication No. 2015/118720. Further, as a green pigment, the compound described in Chinese Patent Application No. 106900927, the phthalocyanine compound having a phosphate ester described in International Publication No. 2012/102395 as a ligand, and Japanese Patent Application Laid-Open No. 2019-008014. Phthalocyanine compounds, phthalocyanine compounds described in JP-A-2018-180023, compounds described in JP-A-2019-038958, and the like can also be used.

Further, as the blue pigment, an aluminum phthalocyanine compound having a phosphorus atom can also be used. Specific examples thereof include the compounds described in paragraph numbers 0022 to 0030 of JP2012-247591A and paragraph numbers 0047 of JP2011-157478A.

Further, as the yellow pigment, the compounds described in JP-A-2017-201003, the compounds described in JP-A-2017-197719, and paragraph numbers 0011 to 0062 and 0137-0276 of JP-A-2017-171912 are described. Compounds, compounds described in paragraphs 0010 to 0062, 0138 to 0295 of JP-A-2017-171913, compounds described in paragraph numbers 0011 to 0062, 0139-0190 of JP-A-2017-171914, JP-A-2017- The compounds described in paragraphs 0010 to 0065 and 0142 to 0222 of JP-A-171915, the quinophthalone compounds described in paragraph numbers 0011 to 0034 of JP2013-054339, paragraph numbers 0013 to 0058 of JP-A-2014-026228. The quinophthalone compound described in JP-A-2018-062644, the quinophthalone compound described in JP-A-2018-203798, the quinophthalone compound described in JP-A-2018-062578, Patent No. 6432076. The quinophthalone compound described in JP-A-2018-155881, the quinophthalone compound described in JP-A-2018-11175, the quinophthalone compound described in JP-A-2018-040835, the quinophthalone compound described in JP-A-2018-040835, JP-A-2017- The quinophthalone compound described in JP-A-197640, the quinophthalone compound described in JP-A-2016-145282, the quinophthalone compound described in JP-A-2014-0855565, the quinophthalone compound described in JP-A-2014-021139, JP-A-B. The quinophthalone compound described in Japanese Patent Application Laid-Open No. 2013-209614, the quinophthalone compound described in JP-A-2013-209435, the quinophthalone compound described in JP-A-2013-181015, the quinophthalone compound described in JP-A-2013-061622, The quinophthalone compound described in JP2013-032486, the quinophthalone compound described in JP2012-226110, the quinophthalone compound described in JP2008-074987, and the quinophthalone described in JP2008-081565. Compounds, quinophthalone compounds described in JP-A-2008-074986, quinophthalone compounds described in JP-A-2008-074985, quinophthalone compounds described in JP-A-2008-050420, JP-A-2. The quinophthalone compound described in Japanese Patent Publication No. 008-031281, the quinophthalone compound described in JP-A-48-032765, the quinophthalone compound described in JP-A-2019-008014, the quinophthalone compound described in Japanese Patent Application Laid-Open No. 6607427, published in Korea. Compounds described in Japanese Patent No. 10-2014-0034963, compounds described in JP-A-2017-095706, compounds described in Taiwan Patent Application Publication No. 201920495, compounds described in Japanese Patent Application Laid-Open No. 6607427, special examples. A quinophthalone dimer described in Japanese Patent Publication No. 2020-033521, a compound represented by the following formula (QP1), and a compound represented by the following formula (QP2) can also be used. Further, a multimerized version of these compounds is also preferably used from the viewpoint of improving the color value.

In the formula (QP1), X ¹ to X ¹⁶ independently represent a hydrogen atom or a halogen atom, and Z ¹ represents an alkylene group having 1 to 3 carbon atoms. Specific examples of the compound represented by the formula (QP1) include the compound described in paragraph No. 0016 of Japanese Patent No. 6443711.

Wherein ^{^{(QP2), Y 1 ~ Y}} 3 represents a halogen atom independently. n and m represent integers of 0 to 6, and p represents an integer of 0 to 5. (N + m) is 1 or more. Specific examples of the compound represented by the formula (QP2) include the compounds described in paragraphs 0047 to 0048 of Japanese Patent No. 6432077.

As the red pigment, a diketopyrrolopyrrole compound in which at least one bromine atom is substituted in the structure described in JP-A-2017-201384, a diketopyrrolopyrrole compound described in paragraphs 0016 to 0022 of Patent No. 6248838, Diketopyrrolopyrrole compound described in WO2012 / 102399, diketopyrrolopyrrole compound described in WO2012 / 117965, naphtholazo compound described in JP2012-229344, patent No. 6516119. , The compound described in Japanese Patent No. 6525101, and the like can also be used. Further, as the red pigment, a compound having a structure in which an aromatic hydrocarbon group having an oxygen atom, a sulfur atom or a nitrogen atom bonded to the aromatic hydrocarbon ring is bonded to a diketopyrrolopyrrole skeleton is used. It can also be used. As such a compound, a compound represented by the formula (DPP1) is preferable, and a compound represented by the formula (DPP2) is more preferable.

In the above formula, R ¹¹ and R ¹³ independently represent a substituent, R ¹² and R ¹⁴ independently represent a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, and n 11 and n 13 are independent of each other. And X ¹² and X ¹⁴ independently represent an oxygen atom, a sulfur atom or a nitrogen atom, and when X ¹² is an oxygen atom or a sulfur atom, m12 represents 1 and X. ^{When 12} is a nitrogen atom, m12 represents 2, m14 represents 1 when X ¹⁴ is an oxygen atom or a sulfur atom, and m14 represents 2 when X ¹⁴ is a nitrogen atom. The ^{substituents represented by R 11} and R ¹³ include an alkyl group, an aryl group, a halogen atom, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heteroaryloxycarbonyl group, an amide group, a cyano group, a nitro group and a trifluoro group. Preferred specific examples include a methyl group, a sulfoxide group, and a sulfo group.

Regarding the diffraction angles preferably possessed by various pigments, the descriptions of Japanese Patent No. 6561862, Japanese Patent No. 6413872, and Japanese Patent No. 6281345 can be referred to, and the contents thereof are incorporated in the present specification.

The chromatic dyes include pyrazole azo compound, anilino azo compound, triarylmethane compound, anthraquinone compound, anthrapyridone compound, benzylidene compound, oxonol compound, pyrazolotriazole azo compound, pyridone azo compound, cyanine compound, phenothiazine compound and pyrrolopyrazole azomethine compound. , Xanthene compound, phthalocyanine compound, benzopyran compound, indigo compound, pyrromethene compound and the like. Further, the methine dye described in JP-A-2019-073695, the methine dye described in JP-A-2019-073696, the methine dye described in JP-A-2019-073697, and JP-A-2019-073698 are described. It is also possible to use the methine dye of.

Two or more kinds of chromatic color materials may be used in combination. Further, when two or more kinds of chromatic color materials are used in combination, black may be formed by a combination of two or more kinds of chromatic color materials. Examples of such a combination include the following aspects (1) to (7). When two or more kinds of chromatic color materials are contained in the resin composition and a combination of two or more kinds of chromatic color materials exhibits black color, the resin composition of the present invention forms a near-infrared ray transmitting filter. It can be preferably used as a resin composition for use.
(1) An embodiment containing a red color material and a blue color material.
(2) An embodiment containing a red color material, a blue color material, and a yellow color material.
(3) An embodiment containing a red color material, a blue color material, a yellow color material, and a purple color material.
(4) An embodiment containing a red color material, a blue color material, a yellow color material, a purple color material, and a green color material.
(5) An embodiment containing a red color material, a blue color material, a yellow color material, and a green color material.
(6) An embodiment containing a red color material, a blue color material, and a green color material.
(7) An embodiment containing a yellow color material and a purple color material.

(White color material)
White coloring materials include titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, Examples thereof include hollow resin particles and inorganic pigments (white pigments) such as zinc sulfide. The white pigment is preferably particles having a titanium atom, and more preferably titanium oxide. Further, the white pigment is preferably particles having a refractive index of 2.10 or more with respect to light having a wavelength of 589 nm. The above-mentioned refractive index is preferably 2.10 to 3.00, and more preferably 2.50 to 2.75.

Further, as the white pigment, titanium oxide described in "Titanium Oxide Physical Properties and Applied Technology, by Manabu Kiyono, pp. 13-45, published on June 25, 1991, published by Gihodo Publishing" can also be used.

The white pigment is not limited to a single inorganic substance, but particles compounded with other materials may be used. For example, particles having pores or other materials inside, particles in which a large number of inorganic particles are attached to core particles, core particles composed of core particles composed of polymer particles, and core and shell composite particles composed of a shell layer composed of inorganic nanoparticles are used. Is preferable. As the core and shell composite particles composed of the core particles composed of the polymer particles and the shell layer composed of the inorganic nanoparticles, for example, the description in paragraphs 0012 to 0042 of JP2015-047520 can be referred to. This content is incorporated herein.

Hollow inorganic particles can also be used as the white pigment. Hollow inorganic particles are inorganic particles having a structure having cavities inside, and refer to inorganic particles having cavities surrounded by an outer shell. Examples of the hollow inorganic particles include the hollow inorganic particles described in JP-A-2011-075786, International Publication No. 2013/06621, JP-A-2015-164881, and the like, and the contents thereof are incorporated in the present specification. Is done.

(Black color material)
The black color material is not particularly limited, and known materials can be used. For example, examples of the inorganic black coloring material include inorganic pigments (black pigments) such as carbon black, titanium black, and graphite, with carbon black and titanium black being preferable, and titanium black being more preferable. Titanium black is black particles containing a titanium atom, and low-order titanium oxide or titanium oxynitride is preferable. Titanium black can modify the surface as needed for the purpose of improving dispersibility and suppressing cohesion. For example, it is possible to coat the surface of titanium black with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconium oxide. Further, it is also possible to treat with a water-repellent substance as shown in Japanese Patent Application Laid-Open No. 2007-302836. Examples of the black pigment include Color Index (CI) Pigment Black 1, 7 and the like. Titanium black preferably has a small primary particle size and an average primary particle size of each particle. Specifically, it is preferable that the average primary particle size is 10 to 45 nm. Titanium black can also be used as a dispersion. For example, a dispersion containing titanium black particles and silica particles and having a content ratio of Si atoms and Ti atoms in the dispersion adjusted to be in the range of 0.20 to 0.50 can be mentioned. Regarding the above dispersion, the description in paragraphs 0020 to 0105 of JP2012-169556A can be referred to, and the contents thereof are incorporated in the present specification. Examples of commercially available titanium black products include titanium black 10S, 12S, 13R, 13M, 13M-C, 13RN, 13M-T (trade name: manufactured by Mitsubishi Materials Corporation), Tilak D (Tilak) D (trade name: manufactured by Mitsubishi Materials Corporation). Product name: Ako Kasei Co., Ltd.) and the like.

Further, examples of the organic black color material include a bisbenzofuranone compound, an azomethine compound, a perylene compound, and an azo compound. Examples of the bisbenzofuranone compound include the compounds described in JP-A-2010-534726, JP-A-2012-515233, JP-A-2012-515234, etc., for example, as "Irgaphor Black" manufactured by BASF. It is available. Examples of the perylene compound include the compounds described in paragraphs 0016 to 0020 of JP-A-2017-226821, C.I. I. Pigment Black 31, 32 and the like can be mentioned. Examples of the azomethin compound include the compounds described in JP-A No. 01-17601, JP-A-02-0346664, and the like, and can be obtained as, for example, "Chromofine Black A1103" manufactured by Dainichiseika Co., Ltd.

The coloring material used in the resin composition of the present invention may be only the above-mentioned black coloring material, or may further contain a chromatic coloring material. According to this aspect, it is easy to obtain a resin composition capable of forming a film having excellent light-shielding property in the visible region. When a black color material and a chromatic color material are used in combination as the color material, the mass ratio of the two is preferably black color material: chromatic color material = 100: 10 to 300, preferably 100: 20 to 200. Is more preferable. Further, it is preferable to use a black pigment as the black color material, and it is preferable to use a chromatic pigment as the chromatic color material.

Preferred combinations of the black color material and the chromatic color material include, for example, the following.
(A-1) An embodiment containing an organic black color material and a blue color material.
(A-2) An embodiment containing an organic black color material, a blue color material, and a yellow color material.
(A-3) An embodiment containing an organic black color material, a blue color material, a yellow color material, and a red color material.
(A-4) An embodiment containing an organic black color material, a blue color material, a yellow color material, and a purple color material.

In the above aspect (A-1), the mass ratio of the organic black color material to the blue color material is preferably organic black color material: blue color material = 100: 1 to 70, preferably 100: 5 to 60. It is more preferable that there is, and it is further preferable that it is 100:10 to 50.
In the above aspect (A-2), the mass ratio of the organic black color material, the blue color material, and the yellow color material is organic black color material: blue color material: yellow color material = 100: 10 to 90: 10 to 90. It is preferably 100:15 to 85:15 to 80, more preferably 100:20 to 80:20 to 70, and even more preferably 100:20 to 80:20 to 70.
In the above aspect (A-3), the mass ratio of the organic black color material, the blue color material, the yellow color material, and the red color material is the organic black color material: blue color material: yellow color material: red color material = 100. : 20 to 150: 1 to 60: 10 to 100, more preferably 100: 30 to 130: 5 to 50: 20 to 90, 100: 40 to 120: 10 to 40: 30 to It is more preferably 80.
In the above aspect (A-4), the mass ratio of the organic black color material, the blue color material, the yellow color material, and the purple color material is the organic black color material: blue color material: yellow color material: purple color material = 100. : 20 to 150: 1 to 60: 10 to 100, more preferably 100: 30 to 130: 5 to 50: 20 to 90, 100: 40 to 120: 10 to 40: 30 to It is more preferably 80.

(Near infrared absorbing color material)
The near-infrared absorbing color material is preferably a pigment, more preferably an organic pigment. Further, the near-infrared absorbing color material preferably has a maximum absorption wavelength in a range of more than 700 nm and 1400 nm or less. The maximum absorption wavelength of the near-infrared absorbing color material is preferably 1200 nm or less, more preferably 1000 nm or less, and further preferably 950 nm or less. Further, the near-infrared absorbing color material _{preferably has A 550} / A _max, which is the ratio _{of the absorbance A 550 at} _{a wavelength of 550 nm and the absorbance A max} at the maximum absorption wavelength, to be 0.1 or less, preferably 0.05 or less. It is more preferably 0.03 or less, and particularly preferably 0.02 or less. The lower limit is not particularly limited, but may be, for example, 0.0001 or more, and may be 0.0005 or more. When the above-mentioned absorbance ratio is in the above range, a near-infrared absorbing color material having excellent visible light transparency and near-infrared shielding property can be obtained. In the present invention, the maximum absorption wavelength of the near-infrared absorbing color material and the value of the absorbance at each wavelength are values obtained from the absorption spectrum of the film formed by using the resin composition containing the near-infrared absorbing color material.

The near-infrared absorbing color material is not particularly limited, but is limited to pyrolopyrrole compound, cyanine compound, squarylium compound, phthalocyanine compound, naphthalocyanine compound, quaterylene compound, merocyanine compound, croconium compound, oxonol compound, iminium compound, dithiol compound, and tria. Examples thereof include a reelmethane compound, a pyrromethene compound, an azomethin compound, an anthraquinone compound, a dibenzofuranone compound, and a dithiolene metal complex. Examples of the pyrrolopyrrole compound include the compounds described in paragraphs 0016 to 0058 of JP2009-263614, the compounds described in paragraphs 0037-0052 of JP2011-066731A, and International Publication No. 2015/166783. Examples thereof include the compounds described in paragraphs 0010 to 0033. Examples of the squarylium compound include the compounds described in paragraphs 0044 to 0049 of JP2011-208101A, the compounds described in paragraphs 0060 to 0061 of Patent No. 6065169, and paragraph numbers 0040 of International Publication No. 2016/181987. , The compound described in JP-A-2015-176046, the compound described in paragraph No. 0072 of International Publication No. 2016/190162, the compound described in paragraph No. 0196-0228 of JP-A-2016-0734649. , The compound described in paragraph No. 0124 of JP-A-2017-066963, the compound described in International Publication No. 2017/135359, the compound described in JP-A-2017-114956, the compound described in Japanese Patent Application Laid-Open No. 6197940, Examples thereof include the compounds described in International Publication No. 2016/120166. Examples of the cyanine compound include the compounds described in paragraphs 0044 to 0045 of JP-A-2009-108267, the compounds described in paragraph numbers 0026-0030 of JP-A-2002-194040, and JP-A-2015-172004. , The compound described in JP-A-2015-172102, the compound described in JP-A-2008-084246, the compound described in paragraph No. 0090 of International Publication No. 2016/190162, JP-A-2017-031394. Examples thereof include the compounds described in. Examples of the croconium compound include the compounds described in JP-A-2017-082029. Examples of the iminium compound include the compound described in JP-A-2008-528706, the compound described in JP-A-2012-02239, the compound described in JP-A-2007-09260, and International Publication No. 2018/043564. Examples thereof include the compounds described in paragraphs 0048 to 0063 of. Examples of the phthalocyanine compound include the compound described in paragraph No. 0093 of JP2012-077153, the oxytitanium phthalocyanine described in JP2006-343631, and paragraphs 0013 to 0029 of JP2013-195480. , The vanadium phthalocyanine compound described in Japanese Patent No. 6081771, and the compound described in International Publication No. 2020/071470. Examples of the naphthalocyanine compound include the compounds described in paragraph No. 0093 of JP2012-07715A. Examples of the dithiolene metal complex include the compounds described in Japanese Patent No. 5733804.

Examples of the near-infrared absorbing color material include a squarylium compound described in JP-A-2017-197437, a squarylium compound described in JP-A-2017-025311, a squarylium compound described in International Publication No. 2016/154782, and a patent. Squarylium compound described in Japanese Patent No. 5884953, Squalylium compound described in Japanese Patent No. 6036689, Squalylium compound described in Japanese Patent No. 5810604, Squalylium compound described in paragraph Nos. 0090 to 0107 of International Publication No. 2017/213047. , Pyrol ring-containing compounds described in paragraphs 0019 to 0075 of JP-A-2018-054760, pyrrol ring-containing compounds described in paragraphs 0078-0082 of JP-A-2018-040955, JP-A-2018-002773. The pyrrol ring-containing compound described in paragraphs 0043 to 0069 of JP-A-2018-041047, the squarylium compound having an aromatic ring at the amide α-position described in paragraph numbers 0024-0086 of JP-A-2018-041047, and JP-A-2017-179131. The amide-linked squarylium compound of JP-A-2017-141215, a compound having a pyrrolbis-type squarylium skeleton or a croconium skeleton described in JP-A-2017-141215, a dihydrocarbazole-type squarylium compound described in JP-A-2017-082029, JP-A-2017. The asymmetric compound described in paragraphs 0027 to 0114 of Japanese Patent Application Laid-Open No. 068120, the pyrrol ring-containing compound (carbazole type) described in JP-A-2017-067963, and the phthalocyanine compound described in Japanese Patent No. 6251530. It is also possible to use the coloring materials described in JP2013-077009A, JP2014-130338A, International Publication No. 2015/166779, or combinations of the coloring materials described in these documents.

The content of the coloring material in the total solid content of the resin composition is preferably 20 to 90% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and further preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 70% by mass or less.
Further, the content of the pigment in the total solid content of the resin composition is preferably 20 to 90% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, and further preferably 50% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 70% by mass or less.
The content of the dye in the coloring material is preferably 50% by mass or less, more preferably 40% by mass or less, and further preferably 30% by mass or less.
Further, it is also preferable that the resin composition of the present invention does not substantially contain a dye because it is easy to more effectively suppress the change in film thickness when the obtained film is heated to a high temperature. When the resin composition of the present invention contains substantially no dye, the content of the dye in the total solid content of the resin composition of the present invention is preferably 0.1% by mass or less, preferably 0.05% by mass. The following is more preferable, and it is particularly preferable that the content is not contained.

<Resin B>
(Specific resin (resin b-1))
The resin composition of the present invention contains resin B (hereinafter, also referred to as resin). The resin contained in the resin composition is a resin b-1 (hereinafter, also referred to as a specific resin) containing a structural unit represented by the formula (1-A) and a structural unit represented by the formula (1-B). include. The specific resin is also the resin of the present invention.

First, the structural unit represented by the formula (1-A) in the specific resin will be described.

[N]
In the formula (1-A), n represents an integer of 1 or more, preferably an integer of 1 to 4, more preferably 1 or 2, and even more preferably 1.

[X ¹¹ ]
In the formula (1-A), the ^{tetravalent linking group represented by X 11} is preferably a group containing a hydrocarbon group. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched or cyclic. Further, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Further, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the substituent T described later.

Examples of the group containing the above-mentioned hydrocarbon group include a hydrocarbon group and a group in which two or more hydrocarbon groups are bonded by a single bond or a linking group.

As the linking group for linking the above two or more hydrocarbon groups, -NR ^X1- , -SO-, -SO _2- , -CO-, -O-, -COO-, -OCO-, -S-,- Examples thereof include NR ^X1 CO-, -CONR ^X1- and -C (CF ₃ ) _2- . ^RX1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom.

The ^{tetravalent linking group represented by X 11} is preferably a group containing an aliphatic hydrocarbon ring or an aromatic hydrocarbon ring, and more preferably a group containing an aromatic hydrocarbon ring. Further, tetravalent linking group represented by X ¹¹ is a fluorine atom or a sulfonyl group, since they can improve the solubility in solvents of the specific resin - is preferably a group containing a (-SO _2). Among them, the ^{tetravalent linking group represented by X 11} is a group containing a fluorine atom and an aromatic hydrocarbon ring because it can form a film having excellent solubility in a solvent of a specific resin and excellent heat resistance. Is preferable. The group containing a fluorine atom and an aromatic hydrocarbon ring is a group in which two or more aromatic hydrocarbon groups are bonded with a linking group, and the linking group is a linking group containing a fluorine atom, or 2 It is preferable that the group is a group in which the above aromatic hydrocarbon groups are bonded by a single bond or a linking group, and the above aromatic hydrocarbon group is substituted with a group containing a fluorine atom. Examples of the linking group containing a fluorine atom include -C (CF ₃ ) _2- and the like. As the group containing a fluorine atom, an alkyl fluoride group is preferable, and a trifluoromethyl group is more preferable.

Further, ^{it is also preferable that the tetravalent linking group represented by X 11} is a group represented by any of the formulas (D-1) to (D-3).

In formulas (D-1) to (D-3), Cy independently represents an aliphatic hydrocarbon ring, R ^d1 represents a linear or branched aliphatic hydrocarbon group, and X ^d1 Represents a single bond or a divalent linking group, and * ¹ to * ⁴ represent a linking hand, respectively.

The aliphatic hydrocarbon ring represented by Cy in the formulas (D-1) to (D-3) may be a monocyclic ring or a condensed ring. Further, the aliphatic hydrocarbon ring may have a crosslinked structure. The aliphatic hydrocarbon ring represented by Cy is preferably a monocyclic aliphatic hydrocarbon ring or an aliphatic hydrocarbon ring having a crosslinked structure.

In formula (D-1), * ¹ and * ² , * ³ and * ⁴ are preferably present at adjacent positions in the aliphatic hydrocarbon ring Cy.

^{R d1} of the formula (D-2) represents a linear or branched aliphatic hydrocarbon group, and is preferably a linear or branched aliphatic saturated hydrocarbon group. The number of carbon atoms of the aliphatic hydrocarbon group is preferably 2 to 10, more preferably 2 to 4, and even more preferably 2. In the formula (D-2), ^{it is preferable that * 3} and * ⁴ are present one by one in the adjacent carbon atom in the aliphatic hydrocarbon group R ^d1. In formula (D-2), * ³ and * ⁴ are preferably present at adjacent positions in the aliphatic hydrocarbon ring Cy.

In formula (D-3), X ^d1 represents a single bond or a divalent linking group, which is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, −O. -, -C (= O)-, -S-, -S (= O) _2- , -NHC (= O)-, or a group in which two or more of these are combined is preferable, and the group is substituted with a fluorine atom. It is more likely that the group is selected from an alkylene group having 1 to 3 carbon atoms, —O—, −C (= O) −, —S—, or —S (= O) _2-. It is preferable that it is −CH _2- , —O—, —S—, —S (= O) _2- , —C (CF ₃ ) _2- , or —C (CH ₃ ) _2- .

Further, ^{it is also preferable that the tetravalent linking group represented by X 11} is a group represented by the formula (E-1).

In the formula (E-1), Ar independently represents an aromatic hydrocarbon ring, X ^e1 represents a divalent linking group containing a fluorine atom, and * ¹ to * ⁴ represent bonds to other structures, respectively. Represents a part.
The number of carbon atoms of the aromatic hydrocarbon ring represented by Ar in the formula (E-1) is preferably 6 to 30, and more preferably 6 to 20. The aromatic hydrocarbon ring represented by Ar is preferably a benzene ring.
^{For X e1} of the formula (E-1), an alkylene group having 1 to 10 carbon atoms substituted with a fluorine atom is preferable, an alkylene group having 1 to 5 carbon atoms substituted with a fluorine atom is more preferable, and —C (CF). ₃ ) _2- , -C (CF ₃ ) (C ₂ F ₅ )-or -C (C ₂ F ₅ ) _2- is more preferable, and -C (CF ₃ ) _2- is particularly preferable. In formula (D-1), * ¹ and * ² , * ³ and * ⁴ are preferably present at adjacent positions in the aromatic ring structure Ar.

Specific examples of the tetravalent linking group represented by X ¹¹ include a group having a structure represented by any of the formulas (I-1) to (I-28).

In formulas (I-1) to (I-28), X ¹ to X ³ represent a single bond or a divalent linking group, L represents -CH = CH- or -CH _2- , and R ¹ and R ² independently represents a hydrogen atom or a substituent, R ¹ and R ² may be bonded to form a ring structure, and * represents a link with another structure in the formula (1).

As the divalent linking group represented by ^{X 1} to X ³ _{, -C (Rx) 2-} (Rx indicates a hydrogen atom or a substituent. When Rx is a substituent, they may be linked to each other to form a ring. Good), _{-O-, -SO 2-} , -CO-, -S-, -NR ^N- , phenylene groups, or combinations thereof. ^RN represents a hydrogen atom, an alkyl group or an aryl group. When Rx indicates a substituent, a specific example thereof includes an alkyl group which may be substituted with a fluorine atom.
X ¹ ~ ^{X 3} are each independently a single bond, -SO ₂ - or -C _{(Rx) 2} - are preferred, -SO ₂ - or -C _{(Rx) 2} - are more preferable, -C (Rx ) ₂ -is more preferable. Further, as for -C (Rx) _2- , -C (CH ₃ ) _2- or -C (CF ₃ ) _2- is preferable, and -C (CF ₃ ) _2- is more preferable.

L is preferably -CH = CH-.

R ¹ and R ² are each independently preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom, a methyl group or an ethyl group, and even more preferably a hydrogen atom.

[X ¹² ]
In formula (1-A), X ¹² represents a 2 + n-valent linking group. Examples of the 2 + n-valent linking group represented by X ¹² include a hydrocarbon group or a group in which two or more hydrocarbon groups are bonded by a single bond or a linking group. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group, and an aliphatic hydrocarbon group is preferable. The number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched or cyclic. Further, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Further, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the substituent T described later.
As the linking group for linking the above two or more hydrocarbon groups, -NR ^X1- , -N <, -SO-, -SO _2- , -CO-, -O-, -COO-, -OCO-,- Examples thereof include S-, -NR ^X1 CO-, -CONR ^X1- and -C (CF ₃ ) _2-. ^RX1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom. It is preferable that the carbon atom of X ¹² ^{is bonded to Lp 1.} It is also preferable that the nitrogen atom of ^{X 12} ^{is bonded to Lp 1.}

[R ¹¹ and R ¹² ]
In formula (1-A), R ¹¹ and R ¹² each independently represent a hydrogen atom or substituent.

Examples of the substituent include an alkyl group, an aryl group, a heterocyclic group and the like. The number of carbon atoms of the alkyl group is preferably 1 to 30, more preferably 1 to 15, further preferably 1 to 8, further preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched or cyclic, preferably linear or branched, more preferably linear. The aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 12 carbon atoms. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. Examples of the heteroatom constituting the heterocyclic group include a nitrogen atom, an oxygen atom, and a sulfur atom. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a condensed ring. The above-mentioned alkyl group, aryl group and heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include a substituent T described later, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, a blocked isocyanate group and the like.

In formula (1-A), R ¹¹ and R ¹² are preferably hydrogen atoms.

In the formula ^{(1-A), Y 11} represents O or ^{NR ^Y11,} ^{R Y11} represents a hydrogen atom or a substituent. ^Examples of the substituent represented by RY11 include an alkyl group, an aryl group, a heterocyclic group and the like. Details of these groups include the groups described in the sections ^{R 11} and R ^{12 of formula (1-A).} ^RY11 is preferably a hydrogen atom.

[Lp ¹ ]
In formula (1-A), Lp ¹ represents a divalent linking group. The divalent linking group includes a hydrocarbon group, -NR ^Lp1- , -SO-, -SO _2- , -CO- ^{, -O-, -COO-, -OCO-, -S-, and -NR Lp1} CO. -, -CONR ^Lp1- , and a group consisting of a combination of two or more of these can be mentioned. ^RLp1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched or cyclic. Further, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Further, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxy group and the like. The divalent linking group is preferably a group containing an oxygen atom or a sulfur atom, more preferably a group containing a sulfur atom, and further preferably a group containing —S—.

The ^{divalent linking group represented by Lp 1} is preferably a group represented by the formula (Lp-1) or the formula (Lp-2), and is preferably a group represented by the formula (Lp-1). More preferred.

In the formula, the formula (Lp-1) and the formula (Lp-2), Lp ¹¹ represents a single bond or a divalent linking group, and * 1 is a linking hand with ^{X 12 of the formula (1-A).} * 2 is a connecting hand with ^{P 1} of the formula (1-A).

Examples of the divalent linking group represented by Lp ¹¹ include a hydrocarbon group and a group having a structure in which two or more hydrocarbon groups are bonded by a single bond or a linking group. Examples of the hydrocarbon group include those described above. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxy group and the like. The linking groups that link two or more hydrocarbon groups include -NR ^Lp1- , -SO-, -SO _2- , -CO-, -O-, -COO-, -OCO-, -S-, and -NR. ^Examples include Lp1 CO- and -CONR ^Lp1-.

[P ¹ ]
In formula (1-A), P ¹ represents a polymer chain. The weight average molecular weight of P ^{1 is preferably 500 to 50,000.} The lower limit is preferably 800 or more, and more preferably 1000 or more. The upper limit is preferably 20,000 or less, and more preferably 10,000 or less. When the weight average molecular weight of the polymer chain is in the above range, better dispersibility of the pigment can be easily obtained. The weight average molecular weight of the polymer chain can be measured by a GPC (gel permeation chromatography) method. More specifically, it can be calculated from the weight average molecular weight of the raw material monomer used for introducing the polymer chain.

The ^{polymer chain represented by P 1} preferably contains repeating units of at least one structure selected from poly (meth) acrylic structure, polystyrene structure, polyether structure and polyester structure, and poly (meth) acrylic structure and polystyrene structure. It is more preferable to include a repeating unit having at least one structure selected from the above, and it is further preferable to include a repeating unit having a poly (meth) acrylic structure from the viewpoint of dispersibility and heat resistance of the pigment. Further, ^{when the polymer chain represented by P 1} has repeating units having a polyether structure, the number of repeating units is preferably 9 or more. When the ^{polymer chain represented by P 1} has repeating units of a polyester structure, the number of repeating units is preferably 5 or more.

The ^{polymer chain represented by P 1} may have a crosslinkable group. Examples of the crosslinkable group include an ethylenically unsaturated bond-containing group such as a vinyl group, a (meth) allyl group and a (meth) acryloyl group, a cyclic ether group such as an epoxy group and an oxetane group, and a blocked isocyanate group. In the present specification, the blocked isocyanate group is a group capable of generating an isocyanate group by heat, and for example, a group in which a blocking agent and an isocyanate group are reacted to protect the isocyanate group can be preferably exemplified. Examples of the blocking agent include oxime compounds, lactam compounds, phenol compounds, alcohol compounds, amine compounds, active methylene compounds, pyrazole compounds, mercaptan compounds, imidazole compounds, imide compounds and the like. Examples of the blocking agent include the compounds described in paragraphs 0115 to 0117 of JP-A-2017-06793, the contents of which are incorporated in the present specification. Further, the blocked isocyanate group is preferably a group capable of generating an isocyanate group by heat at 90 to 260 ° C.

It is also preferable that the polymer chain represented by P ^{1 has a tertiary alkyl group.} Examples of the tertiary alkyl group include a t-butyl group.

The ^{polymer chain represented by P 1} preferably contains a repeating unit represented by any of the formulas (P1-1) to (P1-6), and is preferably represented by the formula (P1-5) or the formula (P1-6). It is more preferable to include the repeating unit represented by the formula (P1-5), and further preferably to include the repeating unit represented by the formula (P1-5).

In the above formula, ^RG1 and ^RG2 each represent an alkylene group. The alkylene group represented R ^G1 and R ^G2 are, it is preferable, a linear or branched alkylene group having 2 to 16 carbon atoms is a linear or branched alkylene group having 1 to 20 carbon atoms More preferably, it is a linear or branched alkylene group having 3 to 12 carbon atoms.

In the above formula, ^RG3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group, and is preferably a hydrogen atom or a methyl group.

In the above formula, Q ^G1 represents -O- or -NR ^q- , and R ^q represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group. Q ^G1 is preferably —O—.
The number of carbon atoms of the alkyl group represented by R ^q is 1-30, more preferably 1-15, more preferably 1-8, more preferably more 1 to 5, it is 1-3 especially preferred. The alkyl group may be linear, branched or cyclic, preferably linear or branched, more preferably linear.
The number of carbon atoms of the aryl group R ^q represents is preferably 6 to 30, more preferably 6 to 20, more preferably 6 to 12.
The ^{heterocyclic group represented by R q} may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. Examples of the heteroatom constituting the heterocyclic group include a nitrogen atom, an oxygen atom, and a sulfur atom. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic ring or a fused ring.
The above-mentioned alkyl group, aryl group and heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include the substituent T described later.

In the above formula, L ^G1 represents a single bond or an arylene group, is preferably a single bond.

In the above formula, ^LG2 represents a single bond or a divalent linking group. The divalent linking group includes an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NR ^LG1- , -SO-, and -SO _2. -, -CO-, ^{-O-, -COO-, -OCO-} ^{, -S-, -NR LG1} CO-, -CONR LG1-, and a group consisting of a combination of two or more of these can be mentioned as an alkylene group or a group. It is preferably a group containing an arylene group. The above-mentioned alkylene group and arylene may have a substituent or may be unsubstituted. Examples of the substituent include the substituent T described later. ^RLG1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom.

In the above formula, ^RG4 represents a hydrogen atom or a substituent. Substituents include hydroxy group, carboxy group, alkyl group, aryl group, heterocyclic group, alkoxy group, aryloxy group, heterocyclic oxy group, alkylthioether group, arylthioether group, heterocyclic thioether group and ethylenically unsaturated group. Examples thereof include a bond-containing group, an epoxy group, an oxetanyl group and a blocked isocyanate group. R ^G4 represents an alkyl group, an aryl group, an ethylenically unsaturated bond-containing group is preferably at least one selected from epoxy group and oxetanyl group, an ethylenically unsaturated bond-containing group, an epoxy group, oxetanyl group, and More preferably, it is at least one selected from t-butyl groups.

In the above formula, ^RG5 represents a hydrogen atom or a methyl group, and ^RG6 represents an aryl group. The ^{aryl group represented by RG6} preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 12 carbon atoms. The ^{aryl group represented by RG6} may have a substituent. Substituents include hydroxy group, carboxy group, alkyl group, aryl group, heterocyclic group, alkoxy group, aryloxy group, heterocyclic oxy group, alkylthioether group, arylthioether group, heterocyclic thioether group and ethylenically unsaturated group. Examples thereof include a bond-containing group, an epoxy group, an oxetanyl group and a blocked isocyanate group.

The ^{polymer chain represented by P 1} may contain two or more repeating units.

(Substituent T)
An alkyl group (preferably an alkyl group having 1 to 30 carbon atoms), an alkenyl group (preferably an alkenyl group having 2 to 30 carbon atoms), an alkynyl group (preferably an alkynyl group having 2 to 30 carbon atoms), an aryl group (preferably an aryl group). Aryl groups with 6 to 30 carbon atoms), amino groups (preferably amino groups with 0 to 30 carbon atoms), alkoxy groups (preferably alkoxy groups with 1 to 30 carbon atoms), aryloxy groups (preferably 6 to 30 carbon atoms). 30 aryloxy groups), heteroaryloxy groups (preferably heteroaryloxy groups with 1 to 30 carbon atoms), acyl groups (preferably acyl groups with 2 to 30 carbon atoms), alkoxycarbonyl groups (preferably 2 carbon atoms). ~ 30 alkoxycarbonyl groups), aryloxycarbonyl groups (preferably aryloxycarbonyl groups with 7-30 carbon atoms), acyloxy groups (preferably acyloxy groups with 2-30 carbon atoms), acylamino groups (preferably 2 carbon atoms). ~ 30 acylamino groups), alkoxycarbonylamino groups (preferably alkoxycarbonylamino groups having 2 to 30 carbon atoms), aryloxycarbonylamino groups (preferably aryloxycarbonylamino groups having 7 to 30 carbon atoms), sulfamoyl groups (preferably aryloxycarbonylamino groups having 7 to 30 carbon atoms). Preferably, a sulfamoyl group having 0 to 30 carbon atoms), a carbamoyl group (preferably a carbamoyl group having 1 to 30 carbon atoms), an alkylthio group (preferably an alkylthio group having 1 to 30 carbon atoms), an arylthio group (preferably 6 carbon atoms). ~ 30 arylthio groups), heteroarylthio groups (preferably heteroarylthio groups with 1 to 30 carbon atoms), alkylsulfonyl groups (preferably alkylsulfonyl groups with 1 to 30 carbon atoms), arylsulfonyl groups (preferably carbons). Arylsulfonyl groups with a number of 6 to 30), heteroarylsulfonyl groups (preferably heteroarylsulfonyl groups with 1 to 30 carbon atoms), alkylsulfinyl groups (preferably alkylsulfinyl groups with 1 to 30 carbon atoms), arylsulfinyl groups (preferably arylsulfinyl groups with 1 to 30 carbon atoms). Arylsulfinyl groups with 6 to 30 carbon atoms), heteroarylsulfinyl groups (preferably heteroarylsulfinyl groups with 1 to 30 carbon atoms), ureido groups (preferably ureido groups with 1 to 30 carbon atoms), phosphate amides. Group (preferably a phosphate amide group having 1 to 30 carbon atoms), hydroxy group, mercapto group, halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom, etc.), cyano group, sulfo group, carboxy group, nitro Group, hydroxamic acid group, sulfino group, hydrazino group, imino group, heterocyclic group. These groups may have additional substituents if they are further substitutable groups. Further examples of the substituent include the group described in Substituent T described above.

Next, the structural unit represented by the formula (1-B) in the specific resin will be described.

[X ⁵¹ ]
In the formula (1-B), the ^{tetravalent linking group represented by X 51} is preferably a group containing a hydrocarbon group. Examples of the hydrocarbon group include those described in the section ^{X 11} of the formula (1-A).

The ^{tetravalent linking group represented by X 51} is preferably a group containing an aliphatic hydrocarbon ring or an aromatic hydrocarbon ring, and more preferably a group containing an aromatic hydrocarbon ring. Further, tetravalent linking group represented by X ⁵¹ is a fluorine atom or a sulfonyl group, since they can improve the solubility in solvents of the specific resin - is preferably a group containing a (-SO _2). Among them, the ^{tetravalent linking group represented by X 51} is a group containing a fluorine atom and an aromatic hydrocarbon ring because it can form a film having excellent solubility in a solvent of a specific resin and excellent heat resistance. Is preferable. The group containing a fluorine atom and an aromatic hydrocarbon ring is a group in which two or more aromatic hydrocarbon groups are bonded with a linking group, and the linking group is a linking group containing a fluorine atom, or 2 It is preferable that the group is a group in which the above aromatic hydrocarbon groups are bonded by a single bond or a linking group, and the above aromatic hydrocarbon group is substituted with a group containing a fluorine atom. Examples of the linking group containing a fluorine atom include -C (CF ₃ ) _2- and the like. As the group containing a fluorine atom, an alkyl fluoride group is preferable, and a trifluoromethyl group is more preferable.

As a specific example of the tetravalent linking group represented by ^{X 51} , the structures represented by the formulas (I-1) to (I-28) mentioned as specific examples of the tetravalent linking group represented ^{by X 11} The group etc. can be mentioned.

The tetravalent linking group represented by ^{X 51} may have a group represented by " ^{-Lp 51-} P ^{51" as a substituent.} Lp ⁵¹ represents a divalent linking group and P ⁵¹ represents a polymer chain. Examples of the ^{divalent linking group represented by Lp 51} include those described as the divalent linking group represented ^{by Lp 1 in} the formula (1-A). Examples of the ^{polymer chain represented by P 51} include those described as the ^{polymer chain P 1} represented by the formula (1-A).

[X ⁵² ]
In the formula (1-B), ^{examples of the divalent linking group represented by X 52} include a hydrocarbon group or a group in which two or more hydrocarbon groups are bonded by a single bond or a linking group.

Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched or cyclic. Further, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Further, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the substituent T described later.

The linking groups that link two or more hydrocarbon groups include -O-, -S-, -C (CH ₃ ) _2- , -C (CF ₃ ) _2- , -CO-, -SO ₂ -,-. SiR _2- (R independently represents a hydrocarbon group, preferably an alkyl group or a phenyl group having 1 to 4 carbon atoms), a polysiloxane group (-Si (R)-(O-Si) _n- , R represents a hydrocarbon group, and an alkyl group or a phenyl group having 1 to 4 carbon atoms is preferable. N represents an integer of 1 or more, and 1 to 10 is preferable).

The ^{divalent linking group represented by X 52} is preferably a group containing an aliphatic hydrocarbon ring or an aromatic hydrocarbon ring, and more preferably a group containing an aromatic hydrocarbon ring. Further, the divalent linking group is X ⁵² represents a fluorine atom or a sulfonyl group, since they can improve the solubility in solvents of the specific resin - is preferably a group containing a (-SO _2). Among them, the ^{divalent linking group represented by X 52} is a group containing a fluorine atom and an aromatic hydrocarbon ring because it can form a film having excellent solubility in a solvent of a specific resin and excellent heat resistance. Is preferable. The group containing a fluorine atom and an aromatic hydrocarbon ring is a group in which two or more aromatic hydrocarbon groups are bonded with a linking group, and the linking group is a linking group containing a fluorine atom, or 2 It is preferable that the group is a group in which the above aromatic hydrocarbon groups are bonded by a single bond or a linking group, and the above aromatic hydrocarbon group is substituted with a group containing a fluorine atom. Examples of the linking group containing a fluorine atom include -C (CF ₃ ) _2- and the like. As the group containing a fluorine atom, an alkyl fluoride group is preferable, and a trifluoromethyl group is more preferable. When the ^{divalent linking group represented by X 52} is a group containing a fluorine atom and an aromatic hydrocarbon ring, for example, a group having the following structure is preferable.

In the above structure, * represents a binding site with another structure.

The ^{divalent linking group represented by X 52} is preferably a group having a structure derived from a diamine compound. Examples of the diamine compound include the following compounds.

The divalent linking group represented by ^{X 52} may have a group represented by " ^{-Lp 51-} P ^{51" as a substituent.} Lp ⁵¹ and P ⁵¹ are synonymous with those described in ^{X 51.}

[R ⁵¹ , R ⁵² and R ⁶¹ ],
In formula (1-B), R ⁵¹ , R ⁵² and R ⁶¹ each independently represent a hydrogen atom or a substituent. Examples of the substituent include an alkyl group, an aryl group, a heterocyclic group and the like. Details of these groups include the groups described in the sections ^{R 11} and R ^{12 of formula (1-A).} In formula (1-B), R ⁵¹ and R ⁵² are preferably hydrogen atoms. Further, ^{it is preferable that R 61} and R ⁶² are also hydrogen atoms.

[Y ⁵¹ ]
In the formula ^{(1-B), Y 51} represents O or ^{NR ^Y51,} ^{R Y51} represents a hydrogen atom or a substituent. ^Examples of the substituent represented by RY51 include an alkyl group, an aryl group, a heterocyclic group and the like. Details of these groups include the groups described in the sections ^{R 11} and R ^{12 of formula (1-A).} ^RY51 is preferably a hydrogen atom. ^Further, it is preferable that ^{Y 51} is ^{NR Y51.}

The specific resin may contain an imide cyclized structure having a structure represented by the above-mentioned formula (1-B).

The specific resin may further contain a structural unit having a structure in which n in the formula (1-A) is 0, that is, a structural unit represented by the following formula (1-A-0). By further including the structural unit represented by the formula (1-A-0) in the specific resin, the acid value of the resin can be adjusted, and the adsorptivity with the pigment can be adjusted. Further, it is also preferable that the specific resin does not substantially contain the structural unit represented by the formula (1-A-0). According to this aspect, the density of the three-dimensional repulsive group of the resin can be increased, and the stability of the pigment can be further improved. Here, when the specific resin does not substantially contain the structural unit represented by the formula (1-A-0), the structural unit represented by the formula (1-A) and the structural unit represented by the formula (1-A-) are not included. The ratio of the structural unit represented by the formula (1-A-0) in mol to the total of the structural unit of the structure of 0) and the structural unit represented by the formula (1-B) is 0. It means that it is 5 mol% or less, preferably 0.1 mol% or less, further preferably 0.01 mol% or less, and the structural unit represented by the formula (1-A-0). Is particularly preferable not to contain.

Wherein ^(1-A-0), X 11 represents a tetravalent linking ^{group, X 12a} represents a divalent linking ^{group, Y 11} represents O or ^{NR ^{^Y11,}} ^R ^11, R ¹² and ^{R Y11} Represents a hydrogen atom or substituent independently of each other.
^X ^11, Y 11 of the formula ^(1-A-0), R 11 and ^{R 12} are synonymous with ^X ^{^11,} Y ^11, ^R 11 and ^{R 12} of formula (1-A).
^{Examples of the divalent linking group represented by X 12a of the} formula (1-A-0) include a hydrocarbon group or a group in which two or more hydrocarbon groups are bonded by a single bond or a linking group. Examples of the hydrocarbon group include an aliphatic hydrocarbon group and an aromatic hydrocarbon group, and an aliphatic hydrocarbon group is preferable. The number of carbon atoms of the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched or cyclic. Further, the cyclic aliphatic hydrocarbon group may be a monocyclic ring or a condensed ring. Further, the cyclic aliphatic hydrocarbon group may have a crosslinked structure. The number of carbon atoms of the aromatic hydrocarbon group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the above-mentioned substituent T. As the linking group for linking the above two or more hydrocarbon groups, -NR ^X1- , -SO-, -SO _2- , -CO-, -O-, -COO-, -OCO-, -S-,- Examples thereof include NR ^X1 CO-, -CONR ^X1- and -C (CF ₃ ) _2- . ^RX1 represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and is preferably a hydrogen atom.

At least one end of the specific resin may be sealed with an end sealant, or a polymer chain may be bonded. Examples of the terminal encapsulant include monoamines, acid anhydrides, monocarboxylic acids, monocarboxylic acid salts, monocarboxylic acid halide compounds, monocarboxylic acid active esters and the like, and examples thereof include monosubstituted acid anhydrides or 1-substituted acid anhydrides. Substituted amines can be used. Further, as the terminal encapsulant, for example, the compounds described in paragraphs 0034 to 0036 of JP-A-2019-101440 can also be used. Further, by sealing the end of the specific resin with a terminal sealant having a hydroxy group, a carboxy group, a sulfoic acid group, a thiol group, a vinyl group, an ethynyl group or an allyl group, the dissolution rate of the specific resin in an alkaline solution can be determined. The mechanical properties of the obtained cured film can be easily adjusted to a preferable range. Examples of the polymer chain include a polymer chain containing a repeating unit of at least one structure selected from a poly (meth) acrylic structure, a polystyrene structure, a polyether structure and a polyester structure. These details include those described as the polymer chain P ¹ described above.

In the specific resin, the structural unit represented by the formula (1-A) and the structural unit of the structure in which n of the formula (1-A) is 0 (that is, the structural unit represented by the above-mentioned formula (1-A-0)) are represented. The ratio of the structural unit represented by the formula (1-B) in molars to the total of the structural unit represented by the formula (1-B) and the structural unit represented by the formula (1-B) (= {formula (1-B)). The number of moles of the structural unit represented by) / (the number of moles of the structural unit represented by the formula (1-A) + the number of moles of the structural unit of the structure in which n in the formula (1-A) is 0 + the formula ( The number of moles of the structural unit represented by 1-B))} × 100) is preferably 10 to 90 mol%. When the ratio of the structural units represented by the formula (1-B) is in the above range, the resin composition can be a resin composition capable of forming a film having excellent dispersibility of the pigment and excellent heat resistance. That is, when the ratio of the structural unit represented by the formula (1-B) is 90 mol% or less, excellent pigment dispersibility can be obtained. Further, when the ratio of the structural unit represented by the formula (1-B) is 10 mol% or more, a film having excellent heat resistance can be formed. The upper limit of the ratio of the structural unit represented by the above formula (1-B) is preferably 80 mol% or less, more preferably 70 mol% or less, and 60 mol% or less from the viewpoint of pigment dispersibility. Is more preferable. The lower limit of the ratio of the structural unit represented by the above formula (1-B) is preferably 20 mol% or more, more preferably 30 mol% or more, and more preferably 40 mol% or more from the viewpoint of heat resistance of the obtained film. It is more preferably mol% or more.

In the specific resin, the ratio of the number of moles of the structural unit represented by the formula (1-B) to the number of moles of the structural unit represented by the formula (1-A) (= represented by the formula (1-B)). The number of moles of the structural unit / the number of moles of the structural unit represented by the formula (1-A)) is preferably 0.1 to 10. When the above ratio is within the above range, a resin composition capable of forming a film having excellent dispersibility of the pigment and excellent heat resistance can be obtained. That is, when the above ratio is 10 or less, excellent pigment dispersibility can be obtained. Further, if the above ratio is 0.1 or more, a film having excellent heat resistance can be formed. The upper limit of the above ratio is preferably 5 or less, and more preferably 3 or less. The lower limit of the ratio is preferably 0.2 or more, and more preferably 0.3 or more.

The acid value of the specific resin is preferably 10 to 150 mgKOH / g. The upper limit is preferably 100 mgKOH / g or less, more preferably 80 mgKOH / g or less. The lower limit is preferably 20 mgKOH / g or more, and more preferably 30 mgKOH / g or more.

The weight average molecular weight (Mw) of the specific resin is preferably 2000 to 200,000, more preferably 2500 to 100,000, and even more preferably 3000 to 50,000.

The 5% mass reduction temperature of the specific resin by TG / DTA (thermogravimetric measurement / differential thermal measurement) in a nitrogen atmosphere is preferably 280 ° C. or higher, more preferably 300 ° C. or higher, and 320 ° C. or higher. Is more preferable. The upper limit of the 5% mass reduction temperature is not particularly limited, and may be, for example, 1,000 ° C. or lower. The 5% mass loss temperature is determined by a known TG / DTA measuring method as a temperature at which the mass loss rate becomes 5% when the mixture is allowed to stand at a specific temperature for 5 hours in a nitrogen atmosphere.
Further, the specific resin preferably has a mass reduction rate of 10% or less, more preferably 5% or less, and more preferably 2% or less when left to stand at 300 ° C. for 5 hours in a nitrogen atmosphere. More preferred. The lower limit of the mass reduction rate is not particularly limited, and may be 0% or more.
The mass reduction rate is a value calculated as the rate of mass reduction in the specific resin before and after standing at 300 ° C. for 5 hours in a nitrogen atmosphere.

The specific resin can be synthesized, for example, by the following method (1) or (2).
(1) A method of polycondensing an acid dianhydride and a macromonomer having two hydroxy groups to obtain a polyester prepolymer of terminal acid dianhydride, and then adding diamine as a polymerization extender for synthesis.
(2) A method of polycondensing an acid dianhydride and a diamine to obtain an amic acid prepolymer of a terminal acid dianhydride, and then adding a macromonomer having two hydroxy groups at the terminal as a polymerization extender for synthesis.

In the above synthesis methods (1) and (2), an end-capping agent can be used if necessary. The terminal encapsulant is not particularly limited as long as it is a compound having one functional group of any one of a hydroxy group, a primary amino group and an acid anhydride group in one molecule. The terminal encapsulant may be a polymer as long as the above conditions are satisfied.

The macromonomer having two hydroxy groups at the terminal used in the above synthesis methods (1) and (2) is a radical using, for example, a chain transfer agent having two hydroxy groups and one or two mercapto groups. The polymerizable compound can be synthesized by radical polymerization. Further, it can also be synthesized by the method described in JP-A-2016-170325.

(Other resins)
The resin composition of the present invention may contain a resin other than the above-mentioned specific resin as the resin. Examples of the other resin include a resin having alkali developability, a resin as a dispersant, and the like. In addition, it may contain a by-product of synthesizing the specific resin.

[Resin with alkali developability]
The weight average molecular weight (Mw) of the alkali-developable resin is preferably 3000 to 2000000. The upper limit is more preferably 1,000,000 or less, still more preferably 500,000 or less. The lower limit is more preferably 4000 or more, further preferably 5000 or more.

Examples of the resin having alkali developability include (meth) acrylic resin, polyimine resin, polyether resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, and polyimide resin, and (meth) acrylic resin and polyimine resin. Is preferable, and (meth) acrylic resin is more preferable. Further, as other resins, the resin described in paragraph numbers 0041 to 0060 of JP-A-2017-206689, the resin described in paragraph numbers 0022-0071 of JP-A-2018-010856, JP-A-2017-057256. , The resin described in JP-A-2017-032685, the resin described in JP-A-2017-075248, and the resin described in JP-A-2017-066240 can also be used.

Further, as the resin having alkali developability, it is preferable to use a resin having an acid group. According to this aspect, the developability of the resin composition can be further improved. Examples of the acid group include a phenolic hydroxy group, a carboxy group, a sulfo group, a phosphoric acid group, a phosphonic acid group, an active imide group, a sulfonamide group and the like, and a carboxy group is preferable. Further, as the resin having an acid group, a resin in which an acid anhydride is reacted with a hydroxy group generated by epoxy ring opening and an acid group is introduced may be used. Examples of such a resin include the resin described in Japanese Patent No. 6349629. The resin having an acid group can be used, for example, as an alkali-soluble resin.

The alkali-developable resin preferably contains a repeating unit having an acid group in the side chain, and more preferably contains 1 to 70 mol% of the repeating unit having an acid group in the side chain in all the repeating units of the resin. The upper limit of the content of the repeating unit having an acid group in the side chain is preferably 50 mol% or less, more preferably 40 mol% or less. The lower limit of the content of the repeating unit having an acid group in the side chain is preferably 2 mol% or more, and more preferably 5 mol% or more.

The acid value of the alkali-developable resin is preferably 200 mgKOH / g or less, more preferably 150 mgKOH / g or less, further preferably 120 mgKOH / g or less, and particularly preferably 100 mgKOH / g or less. The acid value of the resin having an acid group is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, and even more preferably 20 mgKOH / g or more.

It is also preferable that the resin having alkali developability further has an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, an allyl group, a (meth) acryloyl group, and the like, an allyl group and a (meth) acryloyl group are preferable, and a (meth) acryloyl group is more preferable.

The resin having an ethylenically unsaturated bond-containing group preferably contains a repeating unit having an ethylenically unsaturated bond-containing group in the side chain, and the repeating unit having an ethylenically unsaturated bond-containing group in the side chain is the whole of the resin. It is more preferable to contain 5 to 80 mol% in the repeating unit. The upper limit of the content of the repeating unit having an ethylenically unsaturated bond-containing group in the side chain is preferably 60 mol% or less, more preferably 40 mol% or less. The lower limit of the content of the repeating unit having an ethylenically unsaturated bond-containing group in the side chain is preferably 10 mol% or more, more preferably 15 mol% or more.

The alkali-developable resin contains a compound represented by the following formula (ED1) and / or a compound represented by the following formula (ED2) (hereinafter, these compounds may be referred to as "ether dimer"). It is also preferable to include repeating units derived from the monomer component.

In the formula (ED1), R ¹ and R ² each independently represent a hydrocarbon group having 1 to 25 carbon atoms which may have a hydrogen atom or a substituent.

In the formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For the details of the formula (ED2), the description in JP-A-2010-168539 can be referred to, and the contents thereof are incorporated in the present specification.

As a specific example of the ether dimer, for example, paragraph number 0317 of JP2013-029760A can be referred to, and this content is incorporated in the present specification.

The alkali-developable resin preferably contains a repeating unit derived from the compound represented by the following formula (X).

In formula (X), R ₁ represents a hydrogen atom or a methyl group, R ₂ represents an alkylene group having 2 to 10 carbon atoms, and R ₃ represents a hydrogen atom or a benzene ring having 1 to 20 carbon atoms. Represents the alkyl group of. n represents an integer from 1 to 15.

Examples of the resin having alkali developability include a resin having the following structure.

[Dispersant]
The resin composition of the present invention may also contain a resin as a dispersant. Examples of the dispersant include an acidic dispersant (acidic resin) and a basic dispersant (basic resin). Here, the acidic dispersant (acidic resin) represents a resin in which the amount of acid groups is larger than the amount of basic groups. The acid dispersant (acidic resin) is preferably a resin in which the amount of acid groups is 70 mol% or more when the total amount of the amount of acid groups and the amount of basic groups is 100 mol%, and is substantially acid. A resin consisting only of a group is more preferable. The acid group of the acidic dispersant (acidic resin) is preferably a carboxy group. The acid value of the acidic dispersant (acidic resin) is preferably 40 to 105 mgKOH / g, more preferably 50 to 105 mgKOH / g, and even more preferably 60 to 105 mgKOH / g. Further, the basic dispersant (basic resin) represents a resin in which the amount of basic groups is larger than the amount of acid groups. The basic dispersant (basic resin) is preferably a resin in which the amount of basic groups exceeds 50 mol% when the total amount of the amount of acid groups and the amount of basic groups is 100 mol%. The basic group of the basic dispersant is preferably an amino group.

The resin used as the dispersant preferably contains a repeating unit having an acid group.

It is also preferable that the resin used as the dispersant is a graft polymer. Examples of the graft polymer include the resins described in paragraphs 0025 to 0094 of JP2012-255128, the contents of which are incorporated in the present specification.

It is also preferable that the resin used as the dispersant is a polyimine-based dispersant (polyimine resin) containing a nitrogen atom in at least one of the main chain and the side chain. The polyimine-based dispersant has a main chain having a partial structure having a functional group of pKa14 or less, a side chain having 40 to 10,000 atoms, and a basic nitrogen atom in at least one of the main chain and the side chain. The resin to have is preferable. The basic nitrogen atom is not particularly limited as long as it is a nitrogen atom exhibiting basicity. Examples of the polyimine-based dispersant include the resins described in paragraphs 0102 to 0166 of JP2012-255128A, the contents of which are incorporated in the present specification.

It is also preferable that the resin used as the dispersant is a resin having a structure in which a plurality of polymer chains are bonded to the core portion. Examples of such a resin include dendrimers (including star-shaped polymers). Specific examples of the dendrimer include the polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP2013-043962.

The dispersant is also available as a commercially available product, and specific examples thereof include DISPERBYK series manufactured by BYK Chemie (for example, DISPERBYK-111, 161 etc.) and Solsperse series manufactured by Lubrizol (for example, Solsperse 36000). And so on. Further, the pigment dispersants described in paragraphs 0041 to 0130 of JP2014-130338A can also be used, and the contents thereof are incorporated in the present specification. The dispersants are JP-A-2018-150498, JP-A-2017-100116, JP-A-2017-100115, JP-A-2016-108520, JP-A-2016-10851, JP-A-2015. The compound described in JP-A-232105 may be used.

The resin described above as the dispersant can also be used for purposes other than the dispersant. For example, it can also be used as a binder.

The content of the resin in the total solid content of the resin composition is preferably 5 to 60% by mass. The lower limit is preferably 10% by mass or more, more preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less.

The content of the above-mentioned specific resin in the total solid content of the resin composition is preferably 5 to 60% by mass. The lower limit is preferably 10% by mass or more, more preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less.

The content of the above-mentioned specific resin is preferably 10 to 80 parts by mass with respect to 100 parts by mass of the pigment. The lower limit is preferably 20 parts by mass or more, and more preferably 30 parts by mass or more. The upper limit is preferably 70 parts by mass or less, more preferably 50 parts by mass or less.

Further, the resin composition of the present invention preferably contains the specific resin in an amount of 20% by mass or more, more preferably 30% by mass or more, and more preferably 40% by mass, in the components obtained by removing the coloring material from the total solid content of the resin composition. It is more preferable to contain% or more. The upper limit may be 100% by mass, 90% by mass or less, or 85% by mass or less. When the content of the specific resin is within the above range, it is easy to form a film having excellent heat resistance, and it is easy to suppress film shrinkage after heating. Furthermore, when an inorganic film or the like is formed on the surface of a film obtained by using the resin composition of the present invention, even if the laminate is exposed to a high temperature, cracks or the like are suppressed in the inorganic film. You can also.
The total content of the coloring material and the above-mentioned specific resin in the total solid content of the resin composition is preferably 25 to 100% by mass. The lower limit is more preferably 30% by mass or more, further preferably 40% by mass or more. The upper limit is more preferably 90% by mass or less, further preferably 80% by mass or less.

In the resin composition, the content of the above-mentioned other resin is preferably 230 parts by mass or less, more preferably 200 parts by mass or less, and 150 parts by mass with respect to 100 parts by mass of the above-mentioned specific resin. The following is more preferable. The lower limit may be 0 parts by mass, 5 parts by mass or more, or 10 parts by mass or more. It is also preferable that the resin composition does not substantially contain the above-mentioned other resins. According to this aspect, it is easy to form a film having more excellent heat resistance. The case where the other resin is substantially not contained means that the content of the other resin in the total solid content of the resin composition is 0.1% by mass or less, and is 0.05% by mass or less. It is preferable, and it is more preferable that it is not contained.

<Solvent C>
The resin composition of the present invention contains a solvent C (hereinafter referred to as a solvent). The solvent is basically not particularly limited as long as it satisfies the solubility of each component and the coatability of the resin composition. The solvent is preferably an organic solvent. Examples of the organic solvent include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, hydrocarbon-based solvents, and the like, from ester-based solvents, ether-based solvents, alcohol-based solvents, and ketone-based solvents. It is preferably at least one selected. For these details, paragraph No. 0223 of International Publication No. 2015/166779 can be referred to, the contents of which are incorporated herein by reference. Further, an ester solvent substituted with a cyclic alkyl group and a ketone solvent substituted with a cyclic alkyl group can also be preferably used. Specific examples of the organic solvent include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2 -Heptanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethylcarbitol acetate, butylcarbitol acetate, propylene Glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N, N-dimethylpropanamide, 3-butoxy-N, N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane , Anisole, etc. However, aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents may need to be reduced for environmental reasons (for example, 50 parts by mass (parts) with respect to the total amount of organic solvent. Per millision) or less, 10 mass ppm or less, or 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent having a low metal content, and the metal content of the organic solvent is preferably, for example, 10 mass ppb (parts per parts) or less. If necessary, an organic solvent at the mass ppt (parts per trillion) level may be used, and such an organic solvent is provided by, for example, Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015). Examples of the method for removing impurities such as metals from the organic solvent include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter. The filter pore diameter of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene or nylon.

The organic solvent may contain isomers (compounds having the same number of atoms but different structures). Further, only one kind of isomer may be contained, or a plurality of kinds may be contained.

The content of peroxide in the organic solvent is preferably 0.8 mmol / L or less, and more preferably substantially free of peroxide.

The content of the solvent in the resin composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and even more preferably 30 to 90% by mass.

<Pigment derivative>
The resin composition of the present invention preferably contains a pigment derivative. Examples of the pigment derivative include compounds having a structure in which a part of the chromophore is replaced with an acid group, a basic group or a phthalimide methyl group. The chromogens constituting the pigment derivative include quinoline skeleton, benzoimidazolone skeleton, diketopyrrolopyrrole skeleton, azo skeleton, phthalocyanine skeleton, anthracinone skeleton, quinacridone skeleton, dioxazine skeleton, perinone skeleton, perylene skeleton, thioindigo skeleton, and iso. Indoline skeleton, isoindolinone skeleton, quinophthalone skeleton, slene skeleton, metal complex skeleton, etc. Preferably, the azo skeleton and the benzoimidazolone skeleton are more preferable. As the acid group of the pigment derivative, a sulfo group and a carboxy group are preferable, and a sulfo group is more preferable. As the basic group of the pigment derivative, an amino group is preferable, and a tertiary amino group is more preferable.

As the pigment derivative, a pigment derivative having excellent visible light transparency (hereinafter, also referred to as a transparent pigment derivative) can be used. The maximum value of the molar extinction coefficient in the wavelength region of 400 ~ 700 nm of the transparent pigment derivative (.epsilon.max) is that it is preferable, 1000L ^· mol ^-1 ^· ^cm -1 or less is not more than 3000L ^· mol ^-1 ^· ^cm -1 Is more preferable, and 100 L · mol ^-1 · cm ^-1 or less is further preferable. The lower limit of εmax is, for example, 1 L · mol ^-1 · cm ^-1 or more, and ^{may be 10 L · mol -1} · cm ^-1 or more.

Specific examples of the pigment derivative include JP-A-56-118462, JP-A-63-264674, JP-A-01-217777, JP-A-03-09961 and JP-A-03-026767. Japanese Patent Application Laid-Open No. 03-153780, Japanese Patent Application Laid-Open No. 03-405662, Japanese Patent Application Laid-Open No. 04-285646, Japanese Patent Application Laid-Open No. 06-145546, Japanese Patent Application Laid-Open No. 06-212088, Japanese Patent Application Laid-Open No. 06-240158, Japanese Patent Application Laid-Open No. 10-030063, Japanese Patent Laid-Open No. 10-195326, paragraph numbers 0086 to 0998 of International Publication No. 2011/024896, paragraph numbers 0063 to 0094 of International Publication No. 2012/102399, International Publication No. 2017/038252. Paragraph No. 1982, Paragraph No. 0171 of JP-A-2015-151530, Paragraph Nos. 0162 to 0183 of JP-A-2011-52065, JP-A-2003-081972, Japanese Patent No. 5299151, JP-A-2015-172732 Examples thereof include the compounds described in JP-A-2014-199308, JP-A-2014-085562, JP-A-2014-035351, JP-A-2008-081565, and JP-A-2019-109512.

The content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass with respect to 100 parts by mass of the pigment. As the pigment derivative, only one kind may be used, or two or more kinds may be used in combination.

<Polymerizable monomer>
The resin composition of the present invention preferably contains a polymerizable monomer. As the polymerizable monomer, for example, a known compound that can be crosslinked by radicals, acids or heat can be used. Examples of the polymerizable monomer include a compound having an ethylenically unsaturated bond-containing group, a compound having a cyclic ether group, and the like, and a compound having an ethylenically unsaturated bond-containing group is preferable. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a (meth) allyl group, and a (meth) acryloyl group. Examples of the cyclic ether group include an epoxy group and an oxetane group. A compound having an ethylenically unsaturated bond-containing group can be preferably used as a radically polymerizable monomer. Further, the compound having a cyclic ether group can be preferably used as a cationically polymerizable monomer. The polymerizable monomer is preferably a polyfunctional polymerizable monomer. That is, the polymerizable monomer is preferably a monomer having two or more polymerizable groups such as an ethylenically unsaturated bond-containing group and a cyclic ether group.

The molecular weight of the polymerizable monomer is preferably 100 to 3000. The upper limit is more preferably 2000 or less, and even more preferably 1500 or less. The lower limit is more preferably 150 or more, and even more preferably 250 or more.

(Compound having an ethylenically unsaturated bond-containing group)
The compound having an ethylenically unsaturated bond-containing group used as the polymerizable monomer is preferably a polyfunctional compound. That is, it is preferably a compound containing two or more ethylenically unsaturated bond-containing groups, more preferably a compound containing three or more ethylenically unsaturated bond-containing groups, and three ethylenically unsaturated bond-containing groups. It is more preferably a compound containing up to 15 elements, and even more preferably a compound containing 3 to 6 ethylenically unsaturated bond-containing groups. Further, the compound having an ethylenically unsaturated bond-containing group is preferably a 3- to 15-functional (meth) acrylate compound, and more preferably a 3- to 6-functional (meth) acrylate compound. Specific examples of the compound having an ethylenically unsaturated bond-containing group include paragraph Nos. 0095 to 0108 of JP2009-288705, paragraph 0227 of JP2013-209760, and paragraphs of JP-A-2008-292970. Nos. 0254 to 0257, paragraph numbers 0034 to 0038 of JP2013-253224A, paragraph numbers 0477 of JP2012-208494A, JP-A-2017-048367, Patent No. 6057891 and Patent No. 6031807. , JP-A-2017-194662, and the contents thereof are incorporated in the present specification.

Compounds having an ethylenically unsaturated bond-containing group include dipentaerythritol tri (meth) acrylate (commercially available KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.) and dipentaerythritol tetra (meth) acrylate (commercially available). KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta (meth) acrylate (commercially available KAYARAD D-310; manufactured by Nihon Kayaku Co., Ltd.), dipentaerythritol hexa (meth) ) Acrylate (as a commercial product, KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK ester A-DPH-12E; manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), and these (meth) acryloyl groups are ethylene glycol and / or Compounds having a structure bonded via a propylene glycol residue (for example, SR454, SR499 commercially available from Sartmer) are preferable. Compounds having an ethylenically unsaturated bond-containing group include diglycerin EO (ethylene oxide) modified (meth) acrylate (commercially available M-460; manufactured by Toa Synthetic) and pentaerythritol tetraacrylate (Shin-Nakamura Chemical Industry Co., Ltd. (Shin-Nakamura Chemical Industry Co., Ltd.). NK Ester A-TMMT (manufactured by Nippon Kayaku Co., Ltd.), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Nippon Kayaku Co., Ltd.) Toa Synthetic Co., Ltd., NK Oligo UA-7200 (Shin-Nakamura Chemical Industry Co., Ltd.), 8UH-1006, 8UH-1012 (Taisei Fine Chemical Co., Ltd.), Light Acrylate POB-A0 (Kyoeisha Chemical Co., Ltd.) ), Etc. can also be used.

Examples of the compound having an ethylenically unsaturated bond-containing group include trimethylolpropane tri (meth) acrylate, trimethylolpropane propylene oxide modified tri (meth) acrylate, trimethylolpropane ethylene oxide modified tri (meth) acrylate, and isocyanuric acid ethylene oxide modified. It is also preferable to use a trifunctional (meth) acrylate compound such as a tri (meth) acrylate or a pentaerythritol tri (meth) acrylate. Commercially available trifunctional (meth) acrylate compounds include Aronix M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, and M-305. , M-303, M-452, M-450 (manufactured by Toa Synthetic Co., Ltd.), NK ester A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A -TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin Nakamura Chemical Industry Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 (manufactured by Nippon Kayaku Co., Ltd.) And so on.

As the compound having an ethylenically unsaturated bond-containing group, a compound having an acid group can also be used. By using a compound having an acid group, the generation of development residue can be suppressed. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group and the like, and a carboxy group is preferable. Examples of commercially available products of the polymerizable monomer having an acid group include Aronix M-305, M-510, M-520, and Aronix TO-2349 (manufactured by Toagosei Co., Ltd.). The preferable acid value of the polymerizable monomer having an acid group is 0.1 to 40 mgKOH / g, and more preferably 5 to 30 mgKOH / g. When the acid value of the polymerizable compound is 0.1 mgKOH / g or more, the solubility in a developing solution is good, and when the acid value is 40 mgKOH / g or less, it is advantageous in production and handling.

It is also a preferable embodiment that the compound having an ethylenically unsaturated bond-containing group is a compound having a caprolactone structure. Compounds having a caprolactone structure are commercially available from Nippon Kayaku Co., Ltd. as the KAYARAD DPCA series, and examples thereof include DPCA-20, DPCA-30, DPCA-60, and DPCA-120.

As the compound having an ethylenically unsaturated bond-containing group, a compound having an alkyleneoxy group can also be used. The compound having an alkyleneoxy group is preferably a compound having an ethyleneoxy group and / or a propyleneoxy group, more preferably a compound having an ethyleneoxy group, and a 3 to 6 functional (meth) acrylate having 4 to 20 ethyleneoxy groups. Compounds are more preferred. Commercially available products of the compound having an alkyleneoxy group include, for example, SR-494, which is a tetrafunctional (meth) acrylate having four ethyleneoxy groups manufactured by Sartmer, and a trifunctional (meth) acrylate having three isobutyleneoxy groups. A certain KAYARAD TPA-330 and the like can be mentioned.

As the compound having an ethylenically unsaturated bond-containing group, a compound having a fluorene skeleton can also be used. Examples of commercially available compounds having a fluorene skeleton include Ogsol EA-0200 and EA-0300 (manufactured by Osaka Gas Chemical Co., Ltd., a (meth) acrylate monomer having a fluorene skeleton).

As the compound having an ethylenically unsaturated bond-containing group, it is also preferable to use a compound that does not substantially contain an environmentally regulatory substance such as toluene. Examples of commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

Examples of the compound having an ethylenically unsaturated bond-containing group are described in JP-A-48-041708, JP-A-51-037193, JP-B-02-032293, and JP-B-02-016765. Such urethane acrylates and urethane compounds having an ethylene oxide-based skeleton described in Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418. Is also suitable. Further, it is also preferable to use a polymerizable compound having an amino structure or a sulfide structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A No. 01-105238. The polymerizable compounds are UA-7200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, Commercially available products such as T-600, AI-600, and LINK-202UA (manufactured by Kyoeisha Chemical Co., Ltd.) can also be used.

(Compound having a cyclic ether group)
Examples of the compound having a cyclic ether group, which is also used as a polymerizable monomer, include a compound having an epoxy group (hereinafter, also referred to as an epoxy compound) and a compound having an oxetane group (hereinafter, also referred to as an oxetane compound). The epoxy compound is preferably a polyfunctional epoxy compound. That is, the epoxy compound is preferably a compound having two or more epoxy groups. The upper limit of the number of epoxy groups is preferably 20 or less, and more preferably 10 or less. Further, the oxetane compound is preferably a polyfunctional oxetane compound. That is, the oxetane compound is preferably a compound having two or more oxetane groups. The upper limit of the number of oxetane groups is preferably 20 or less, and more preferably 10 or less.

Commercially available epoxy compounds include JER828, JER1007, JER157S70 (manufactured by Mitsubishi Chemical Corporation), JER157S65 (manufactured by Mitsubishi Chemical Holdings, Inc.), etc. Can be mentioned. Other commercially available products include ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (all manufactured by ADEKA Co., Ltd.), NC-2000, NC-3000, NC-7300, XD-1000, EPPN. -501, EPPN-502 (all manufactured by ADEKA Co., Ltd.), Denacol EX-611, EX-612, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-411, EX 421, EX-313, EX-314, EX-321, EX-211, EX-212, EX-810, EX-811, EX-850, EX-851, EX-821, EX-830, EX-832 , EX-841, EX-911, EX-941, EX-920, EX-931, EX-212L, EX-214L, EX-216L, EX-321L, EX-850L, DLC-201, DLC-203, DLC -204, DLC-205, DLC-206, DLC-301, DLC-402, EX-111, EX-121, EX-141, EX-145, EX-146, EX-147, EX-171, EX-192 (Made by Nagase Chemtech), YH-300, YH-301, YH-302, YH-315, YH-324, YH-325 (Made by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), Serokiside 2021P, 2081, 2000, 3000, EHPE3150, Epolide GT400, Serviners B0134, B0177 (manufactured by Daicel Co., Ltd.), TETRAD-X (manufactured by Mitsubishi Gas Chemical Co., Ltd.) and the like can be mentioned.

Commercially available products of oxetane compounds include OXT-201, OXT-221, OXT-212, OXT-213, OXT-121, OXT-221, OX-SQ TX-100, etc. (all manufactured by Toagosei Co., Ltd.). Can be used.

The content of the polymerizable monomer in the total solid content of the resin composition is preferably 0.1 to 40% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The upper limit is preferably 30% by mass or less, more preferably 20% by mass or less.

When a compound having an ethylenically unsaturated bond-containing group is used as the polymerizable monomer, the content of the compound having an ethylenically unsaturated bond-containing group as the polymerizable monomer is 1 with respect to 100 parts by mass of the above-mentioned specific resin. It is preferably about 50 parts by mass. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.

When a compound having a cyclic ether group as a polymerizable monomer is used, the content of the compound having a cyclic ether group as a polymerizable monomer may be 1 to 50 parts by mass with respect to 100 parts by mass of the above-mentioned specific resin. preferable. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.

When a compound having an ethylenically unsaturated bond-containing group and a compound having a cyclic ether group are used as the polymerizable monomer, the resin composition is a cyclic ether with respect to 100 parts by mass of the compound having an ethylenically unsaturated bond-containing group. It is preferable to contain 10 to 500 parts by mass of the compound having a group. The lower limit is preferably 20 parts by mass or more, and more preferably 30 parts by mass or more. The upper limit is preferably 400 parts by mass or less, and more preferably 300 parts by mass or less. When the ratio of both is within the above range, a film having more excellent heat resistance (suppression of cracks and film shrinkage) can be formed.

<Photopolymerization initiator>
The resin composition of the present invention preferably contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and may be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light rays in the ultraviolet region to the visible region is preferable. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (for example, compounds having a triazine skeleton, compounds having an oxadiazole skeleton, compounds having an imidazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazoles, oxime compounds, and organic compounds. Examples thereof include peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds and α-aminoketone compounds. From the viewpoint of exposure sensitivity, the photopolymerization initiator is a trihalomethyltriazine compound, a biimidazole compound, a benzyldimethylketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, or an oxime compound. , Triarylimidazole dimer, onium compound, benzothiazole compound, benzophenone compound, acetophenone compound, cyclopentadiene-benzene-iron complex, halomethyloxadiazole compound and 3-aryl substituted coumarin compound, preferably biimidazole compound, A compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound is more preferable, and an oxime compound is further preferable. Further, as the photopolymerization initiator, the compound described in paragraphs 0065 to 0111 of JP-A-2014-130173, the compound described in Japanese Patent No. 6301489, MATERIAL STAGE 37-60p, vol. 19, No. Peroxide-based photopolymerization initiator described in 3, 2019, photopolymerization initiator described in International Publication No. 2018/221177, photopolymerization initiator described in International Publication No. 2018/110179, JP-A-2019-043864. Examples thereof include the photopolymerization initiator described in JP-A-2019-044030, the photopolymerization initiator described in JP-A-2019-167313, and the contents thereof are described in the present invention. Incorporated in the specification.

Examples of the biimidazole compound include 2,2-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenylbiimidazole, 2,2'-bis (o-chlorophenyl) -4,4', 5 , 5-Tetrakiss (3,4,5-trimethoxyphenyl) -1,2'-biimidazole, 2,2'-bis (2,3-dichlorophenyl) -4,4', 5,5'-tetraphenyl Examples thereof include biimidazole and 2,2'-bis (o-chlorophenyl) -4,4,5,5'-tetraphenyl-1,2'-biimidazole. Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (above, IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure27, Irgacure29. (Manufactured by the company) and the like. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (above, IGM Resins BV), Irgacure 907, Irgacure 369, Irgacure 369, Irger Made) and so on. Examples of commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (above, manufactured by IGM Resins BV), Irgacure 819, and Irgacure TPO (above, manufactured by BASF).

Examples of the oxime compound include the compound described in JP-A-2001-233842, the compound described in JP-A-2000-080068, the compound described in JP-A-2006-342166, and J. Am. C. S. The compound according to Perkin II (1979, pp. 1653-1660), J. Mol. C. S. The compound described in Perkin II (1979, pp. 156-162), the compound described in Journal of Photopolisr Science and Technology (1995, pp. 202-232), the compound described in JP-A-2000-066385, the compound described in JP-A-2000-066385. Compounds described in JP-A-2004-534977, compounds described in JP-A-2006-342166, compounds described in JP-A-2017-109766, compounds described in Japanese Patent Application Laid-Open No. 6065596, International Publication No. 2015. The compound described in / 152153, the compound described in International Publication No. 2017/051680, the compound described in JP-A-2017-198865, the compound described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, Examples thereof include the compounds described in International Publication No. 2013/167515. Specific examples of the oxime compound include 3-benzoyloxyiminobutane-2-one, 3-acetoxyiminovtan-2-one, 3-propionyloxyiminobutane-2-one, 2-acetoxyiminopentane-3-one, and the like. 2-acetoxyimino-1-phenylpropane-1-one, 2-benzoyloxyimino-1-phenylpropane-1-one, 3- (4-toluenesulfonyloxy) iminobutane-2-one, and 2-ethoxycarbonyloxy Examples thereof include imino-1-phenylpropane-1-one. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (above, manufactured by BASF), TR-PBG-304 (manufactured by Changzhou Powerful Electronics New Materials Co., Ltd.), ADEKA PTOMER N-1919 (Co., Ltd.). Examples thereof include a photopolymerization initiator 2) manufactured by ADEKA and described in JP2012-014552A. Further, as the oxime compound, it is also preferable to use a compound having no coloring property or a compound having high transparency and hardly discoloring. Examples of commercially available products include ADEKA ARCLUS NCI-730, NCI-831, and NCI-930 (all manufactured by ADEKA Corporation).

An oxime compound having a fluorene ring can also be used as the photopolymerization initiator. Specific examples of the oxime compound having a fluorene ring include the compounds described in JP-A-2014-137466.

Further, as the photopolymerization initiator, an oxime compound having a skeleton in which at least one benzene ring of the carbazole ring is a naphthalene ring can also be used. Specific examples of such an oxime compound include the compounds described in International Publication No. 2013/083505.

An oxime compound having a fluorine atom can also be used as the photopolymerization initiator. Specific examples of the oxime compound having a fluorine atom are described in the compounds described in JP-A-2010-262028, compounds 24, 36-40 described in JP-A-2014-500852, and JP-A-2013-164471. Compound (C-3) and the like can be mentioned.

As the photopolymerization initiator, an oxime compound in which a substituent having a hydroxy group is bonded to the carbazole skeleton can also be used. Examples of such a photopolymerization initiator include the compounds described in International Publication No. 2019/088055.

An oxime compound having a nitro group can be used as the photopolymerization initiator. The oxime compound having a nitro group is also preferably a dimer. Specific examples of the oxime compound having a nitro group include the compounds described in paragraphs 0031 to 0047 of JP2013-114249A and paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466. Examples thereof include the compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARCULDS NCI-831 (manufactured by ADEKA Corporation).

An oxime compound having a benzofuran skeleton can also be used as the photopolymerization initiator. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

Specific examples of the oxime compound are shown below, but the present invention is not limited thereto.

The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Further, the molar extinction coefficient of the oxime compound at a wavelength of 365 nm or a wavelength of 405 nm is preferably high, more preferably 1000 to 300,000, still more preferably 2000 to 300,000, and more preferably 5000 to 200,000. It is particularly preferable to have. The molar extinction coefficient of a compound can be measured using a known method. For example, it is preferable to measure at a concentration of 0.01 g / L using ethyl acetate with a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).

As the photopolymerization initiator, a bifunctional or trifunctional or higher photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, so that good sensitivity can be obtained. Further, when a compound having an asymmetric structure is used, the crystallinity is lowered, the solubility in a solvent or the like is improved, the precipitation is less likely to occur with time, and the stability of the resin composition with time can be improved. .. Specific examples of the bifunctional or trifunctional or higher functional photo-radical polymerization initiators include Japanese Patent Publication No. 2010-527339, Japanese Patent Publication No. 2011-524436, International Publication No. 2015/004565, and Japanese Patent Publication No. 2016-532675. Dimerics of oxime compounds described in paragraphs 0407 to 0412, paragraphs 0039 to 0055 of International Publication No. 2017/033680, compounds (E) and compounds described in JP-A-2013-522445. G), Cmpd1-7 described in International Publication No. 2016/034943, Oxime Esters Photoinitiator described in paragraph No. 0007 of JP-A-2017-523465, JP-A-2017-167399. Photoinitiator described in paragraphs 0020 to 0033, photopolymerization initiator (A) described in paragraphs 0017 to 0026 of JP-A-2017-151342, oxime described in Japanese Patent No. 6469669. Examples include compounds.

The content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 30% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The upper limit is preferably 20% by mass or less, more preferably 15% by mass or less. Only one kind of photopolymerization initiator may be used, or two or more kinds may be used.

<Silane coupling agent>
The resin composition of the present invention can contain a silane coupling agent. As used herein, the silane coupling agent means a silane compound having a hydrolyzable group and other functional groups. Further, the hydrolyzable group refers to a substituent that is directly linked to a silicon atom and can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, an acyloxy group and the like, and an alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of the functional group other than the hydrolyzable group include a vinyl group, a (meth) allyl group, a (meth) acryloyl group, a mercapto group, an epoxy group, an amino group, a ureido group, a sulfide group, an isocyanate group and a phenyl group. And the like, an amino group, a (meth) acryloyl group and an epoxy group are preferable. Specific examples of the silane coupling agent include the compounds described in paragraphs 0018 to 0036 of JP2009-288703 and the compounds described in paragraphs 0056 to 0066 of JP2009-242604A. The contents of are incorporated herein by reference.

The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The upper limit is preferably 3% by mass or less, more preferably 2% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The silane coupling agent may be only one kind or two or more kinds.

<Curing accelerator>
The resin composition of the present invention may further contain a curing accelerator for the purpose of accelerating the reaction of the resin or the polymerizable compound and lowering the curing temperature. The curing accelerator is a methylol-based compound (for example, a compound exemplified as a cross-linking agent in paragraph No. 0246 of JP-A-2015-034963), amines, a phosphonium salt, an amidin salt, and an amide compound (for example, JP-A-2015). The curing agent described in paragraph No. 0186 of Japanese Patent Application Laid-Open No. 2013-041165), the base generator (for example, the ionic compound described in JP-A-2014-0551114), and the cyanate compound (for example, JP-A-2012-150180). The compound described in paragraph No. 0071), the alkoxysilane compound (for example, the alkoxysilane compound having an epoxy group described in JP-A-2011-253504), and the onium salt compound (for example, the paragraph number of JP-A-2015-0349463). A compound exemplified as an acid generator in 0216, a compound described in JP-A-2009-180949) and the like can also be used.

When the resin composition of the present invention contains a curing accelerator, the content of the curing accelerator is preferably 0.3 to 8.9% by mass, preferably 0.8 to 6.4% by mass in the total solid content of the resin composition. More preferably by mass.

<Polymerization inhibitor>
The resin composition of the present invention can contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis (3-methyl-6-tert-butylphenol), and the like. Examples thereof include 2,2'-methylenebis (4-methyl-6-t-butylphenol) and N-nitrosophenylhydroxyamine salts (ammonium salt, first cerium salt, etc.). Of these, p-methoxyphenol is preferable. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5% by mass.

<Surfactant>
The resin composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicon-based surfactant can be used. As for the surfactant, the surfactant described in paragraph Nos. 0238 to 0245 of International Publication No. 2015/166779 is mentioned, and the content thereof is incorporated in the present specification.

The surfactant is preferably a fluorine-based surfactant. By containing a fluorine-based surfactant in the resin composition, the liquid characteristics (particularly, fluidity) can be further improved, and the liquid saving property can be further improved. It is also possible to form a film having a small thickness unevenness.

The fluorine content in the fluorine-based surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass. A fluorine-based surfactant having a fluorine content within this range is effective in terms of uniformity in the thickness of the coating film and liquid saving, and has good solubility in the resin composition.

Examples of the fluorine-based surfactant include the surfactants described in paragraphs 0060 to 0064 of Japanese Patent Laid-Open No. 2014-041318 (paragraphs 0060 to 0064 of International Publication No. 2014/017669) and the like, Japanese Patent Application Laid-Open No. 2011-. The surfactants described in paragraphs 0117 to 0132 of Japanese Patent Application Laid-Open No. 132503 and the surfactants described in JP-A-2020-008634 are mentioned, and the contents thereof are incorporated in the present specification. Commercially available products of fluorine-based surfactants include, for example, Megafax F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144. , F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560. , F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, R-41, R-41-LM, R-01, R-40, R -40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (above, manufactured by DIC Co., Ltd.), Fluorard FC430, FC431, FC171 (above, Sumitomo) 3M Co., Ltd.), Surfron S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (above, AGC Co., Ltd.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Surfactant 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F (manufactured by NEOS), etc. Can be mentioned.

Further, as the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. For such a fluorine-based surfactant, the description in JP-A-2016-216602 can be referred to, and the content thereof is incorporated in the present specification.

As the fluorine-based surfactant, a block polymer can also be used. For example, the compounds described in JP-A-2011-089090 can be mentioned. The fluorine-based surfactant has a repeating unit derived from a (meth) acrylate compound having a fluorine atom and 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy groups and propyleneoxy groups) (meth). A fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used. The following compounds are also exemplified as the fluorine-based surfactant used in the present invention.

The weight average molecular weight of the above compounds is preferably 3000 to 50,000, for example 14000. Among the above compounds,% indicating the ratio of the repeating unit is mol%.

Further, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain can also be used. Specific examples thereof include compounds described in paragraphs 0050 to 0090 and paragraph numbers 0289 to 0295 of JP2010-164965, for example, Megafuck RS-101, RS-102, RS-718K manufactured by DIC Corporation. , RS-72-K and the like. As the fluorine-based surfactant, the compounds described in paragraphs 0015 to 0158 of JP-A-2015-117327 can also be used.

The content of the surfactant in the total solid content of the resin composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005 to 3.0% by mass. The surfactant may be only one kind or two or more kinds. In the case of two or more types, it is preferable that the total amount is within the above range.

<UV absorber>
The resin composition of the present invention can contain an ultraviolet absorber. As the ultraviolet absorber, a conjugated diene compound, an aminodiene compound, a salicylate compound, a benzophenone compound, a benzotriazole compound, an acrylonitrile compound, a hydroxyphenyltriazine compound, an indole compound, a triazine compound and the like can be used. For details thereof, refer to paragraph numbers 0052 to 0072 of JP2012-208374A, paragraph numbers 0317 to 0334 of JP2013-066814, and paragraph numbers 0061 to 0080 of JP2016-162946. It can be taken into consideration and these contents are incorporated in the present specification. Examples of commercially available products of ultraviolet absorbers include UV-503 (manufactured by Daito Kagaku Co., Ltd.). Examples of the benzotriazole compound include the MYUA series made of Miyoshi Oil & Fat (The Chemical Daily, February 1, 2016). Further, as the ultraviolet absorber, the compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967 can also be used. The content of the ultraviolet absorber in the total solid content of the resin composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. Only one kind of ultraviolet absorber may be used, or two or more kinds may be used. When two or more kinds are used, it is preferable that the total amount is within the above range.

<Antioxidant>
The resin composition of the present invention can contain an antioxidant. Examples of the antioxidant include phenol compounds, phosphite ester compounds, thioether compounds and the like. As the phenol compound, any phenol compound known as a phenolic antioxidant can be used. Preferred phenolic compounds include hindered phenolic compounds. A compound having a substituent at a site (ortho position) adjacent to the phenolic hydroxy group is preferable. As the above-mentioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable. Further, as the antioxidant, a compound having a phenol group and a phosphite ester group in the same molecule is also preferable. Further, as the antioxidant, a phosphorus-based antioxidant can also be preferably used. Further, as the antioxidant, the compound described in Korean Patent Publication No. 10-2019-0059371 can also be used. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. Only one kind of antioxidant may be used, or two or more kinds may be used. When two or more kinds are used, it is preferable that the total amount is within the above range.

<Other ingredients>
The resin composition of the present invention may be used as a sensitizer, a thermosetting accelerator, a plasticizer and other auxiliaries (eg, conductive particles, fillers, defoamers, flame retardants, leveling agents, etc.), if necessary. It may contain a peeling accelerator, a fragrance, a surface tension adjusting agent, a chain transfer agent, etc.). By appropriately containing these components, properties such as film physical characteristics can be adjusted. These components are described in, for example, paragraph No. 0183 or later of JP2012-003225A (paragraph number 0237 of the corresponding US Patent Application Publication No. 2013/0034812), paragraph 2008-250074. The descriptions of Nos. 0101 to 0104, 0107 to 0109, etc. can be taken into consideration, and these contents are incorporated in the present specification. In addition, the resin composition may contain a latent antioxidant, if necessary. The latent antioxidant is a compound in which the site that functions as an antioxidant is protected by a protecting group, and is heated at 100 to 250 ° C. or at 80 to 200 ° C. in the presence of an acid / base catalyst. This includes compounds in which the protecting group is desorbed and functions as an antioxidant. Examples of the latent antioxidant include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219. Examples of commercially available products include ADEKA ARKULS GPA-5001 (manufactured by ADEKA Corporation) and the like.

The resin composition of the present invention may contain a metal oxide in order to adjust the refractive index of the obtained film. Examples of the metal oxide include TiO ₂ , ZrO ₂ , Al ₂ O ₃ , SiO _{2 and the} like. The primary particle size of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, still more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. Further, in this case, the core portion may be hollow.

The resin composition of the present invention may contain a light resistance improving agent. Examples of the light resistance improving agent include the compounds described in paragraphs 0036 to 0037 of JP-A-2017-198787, the compounds described in paragraphs 0029 to 0034 of JP-A-2017-146350, and JP-A-2017-129774. The compounds described in paragraphs 0036 to 0037 and 0049 to 0052, the compounds described in paragraphs 0031 to 0034 and 0058 to 0059 of JP-A-2017-129674, paragraph numbers 0036 to 0037 of JP-A-2017-122803. , 0051 to 0054, the compounds described in paragraphs 0025 to 0039 of International Publication No. 2017/164127, the compounds described in paragraphs 0034 to 0047 of JP-A-2017-186546, the compounds of JP-A-2015-025116. The compounds described in paragraph numbers 0019 to 0041 of JP-A, the compounds described in paragraph numbers 0101 to 0125 of JP2012-145604, the compounds described in paragraph numbers 0018 to 0021 of JP-A-2012-103475, the present invention. The compounds described in paragraphs 0015 to 0018 of JP-A-2011-257591, the compounds described in paragraph numbers 0017 to 0021 of JP-A-2011-191483, and paragraph numbers 0108 to 0116 of JP-A-2011-145668. , And the compounds described in paragraphs 0103 to 0153 of JP-A-2011-253174.

The resin composition of the present invention preferably has a free metal content of 100 ppm or less, more preferably 50 ppm or less, and further preferably 10 ppm or less, which is not bonded or coordinated with a pigment or the like. , It is particularly preferable that it is not substantially contained. According to this aspect, stabilization of pigment dispersibility (agglomeration suppression), improvement of spectral characteristics due to improvement of dispersibility, stabilization of curable components, suppression of conductivity fluctuation due to elution of metal atoms / metal ions, and display. Effects such as improvement of characteristics can be expected. In addition, JP-A-2012-153996, JP-A-2000-34585, JP-A-2005-2005, JP-A-08-043620, JP-A-2004-145878, JP-A-2014-119487, Described in JP-A-2010-083979, JP-A-2017-090930, JP-A-2018-025612, JP-A-2018-025797, JP-A-2017-155228, JP-A-2018-036521 and the like. The effect that was done is also obtained. Examples of the types of free metals include Na, K, Ca, Sc, Ti, Mn, Cu, Zn, Fe, Cr, Co, Mg, Al, Sn, Zr, Ga, Ge, Ag, Au, Pt, and the like. Examples thereof include Cs, Ni, Cd, Pb and Bi. Further, the resin composition of the present invention preferably has a content of free halogen not bonded or coordinated with a pigment or the like of 100 ppm or less, more preferably 50 ppm or less, and more preferably 10 ppm or less. It is more preferable, and it is particularly preferable that it is not substantially contained. Examples of the halogen include F, Cl, Br, I and their anions. Examples of the method for reducing free metals and halogens in the resin composition include washing with ion-exchanged water, filtration, ultrafiltration, and purification with an ion-exchange resin.

From the viewpoint of environmental regulation, the use of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt may be restricted. In the resin composition of the present invention, when the content of the above-mentioned compound is reduced, the perfluoroalkyl sulfonic acid (particularly the perfluoroalkyl sulfonic acid having 6 to 8 carbon atoms in the perfluoroalkyl group), a salt thereof, and a per. The content of the fluoroalkylcarboxylic acid (particularly the perfluoroalkylcarboxylic acid having 6 to 8 carbon atoms in the perfluoroalkyl group) and its salt is 0.01 ppb to 1,000 ppb with respect to the total solid content of the resin composition. It is preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb. The resin composition of the present invention may be substantially free of perfluoroalkyl sulfonic acid and salts thereof, as well as perfluoroalkyl carboxylic acid and salts thereof. For example, by using a compound that can substitute for perfluoroalkyl sulfonic acid and its salt, and a compound that can substitute for perfluoroalkyl carboxylic acid and its salt, perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid can be used. And a resin composition that is substantially free of salts thereof may be selected. Examples of compounds that can substitute for the regulated compound include compounds excluded from the regulation due to the difference in the number of carbon atoms of the perfluoroalkyl group. However, the above-mentioned contents do not prevent the use of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt. The resin composition of the present invention may contain a perfluoroalkyl sulfonic acid and a salt thereof, and a perfluoroalkyl carboxylic acid and a salt thereof within the maximum allowable range.

It is also preferable that the resin composition of the present invention does not substantially contain a terephthalic acid ester. Here, "substantially free" means that the content of the terephthalic acid ester is 1000 mass ppb or less in the total amount of the resin composition, and more preferably 100 mass ppb or less. Zero is particularly preferred.

<Accommodation container>
The storage container for the resin composition is not particularly limited, and a known storage container can be used. In addition, as a storage container, for the purpose of suppressing contamination of raw materials and resin compositions with impurities, a multi-layer bottle having a container inner wall composed of 6 types and 6 layers of resin and a bottle having 6 types of resin having a 7-layer structure. It is also preferable to use. Examples of such a container include the container described in JP-A-2015-123351. Further, the inner wall of the container is preferably made of glass or stainless steel for the purpose of preventing metal elution from the inner wall of the container, improving the storage stability of the resin composition, and suppressing the deterioration of the components.

<Preparation method of resin composition>
The resin composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the resin composition, all the components may be simultaneously dissolved and / or dispersed in an organic solvent to prepare a resin composition, or if necessary, each component may be appropriately dissolved in two or more solutions or dispersions. However, these may be mixed at the time of use (at the time of application) to prepare a resin composition.

Further, when preparing the resin composition, it is preferable to include a process of dispersing the pigment. In the process of dispersing the pigment, the mechanical force used for dispersing the pigment includes compression, squeezing, impact, shearing, cavitation and the like. Specific examples of these processes include bead mills, sand mills, roll mills, ball mills, paint shakers, microfluidizers, high speed impellers, sand grinders, flow jet mixers, high pressure wet atomization, ultrasonic dispersion and the like. Further, in the pulverization of the pigment in the sand mill (bead mill), it is preferable to use beads having a small diameter and to perform the treatment under the condition that the pulverization efficiency is increased by increasing the filling rate of the beads. Further, it is preferable to remove coarse particles by filtration, centrifugation or the like after the pulverization treatment. In addition, the process and disperser for dispersing pigments are "Dispersion Technology Complete Works, Published by Information Organization Co., Ltd., July 15, 2005" and "Dispersion technology centered on suspension (solid / liquid dispersion system) and industrial". Practical application The process and disperser described in paragraph No. 0022 of JP-A-2015-157893, "Comprehensive Data Collection, Published by Management Development Center Publishing Department, October 10, 1978" can be preferably used. Further, in the process of dispersing the pigment, the particles may be miniaturized in the salt milling step. For the materials, equipment, processing conditions, etc. used in the salt milling step, for example, the descriptions in JP-A-2015-194521 and JP-A-2012-046629 can be referred to.

When preparing the resin composition, it is preferable to filter the resin composition with a filter for the purpose of removing foreign substances and reducing defects. As the filter, any filter that has been conventionally used for filtration or the like can be used without particular limitation. For example, fluororesins such as polytetrafluoroethylene (PTFE) and polyvinylidene fluoride (PVDF), polyamide resins such as nylon (eg, nylon-6, nylon-6,6), and polyolefin resins such as polyethylene and polypropylene (PP) (for example, A filter using a material such as (including a high-density, ultra-high molecular weight polyethylene resin) and the like can be mentioned. Among these materials, polypropylene (including high-density polypropylene) and nylon are preferable.

The pore diameter of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and even more preferably 0.05 to 0.5 μm. If the pore diameter of the filter is within the above range, fine foreign matter can be removed more reliably. For the hole diameter value of the filter, the nominal value of the filter manufacturer can be referred to. As the filter, various filters provided by Nippon Pole Co., Ltd. (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantech Toyo Co., Ltd., Japan Entegris Co., Ltd. (formerly Nippon Microlith Co., Ltd.), KITZ Microfilter Co., Ltd., etc. can be used. ..

It is also preferable to use a fiber-like filter medium as the filter. Examples of the fiber-like filter medium include polypropylene fiber, nylon fiber, glass fiber and the like. Examples of commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.) and SHPX type series (SHPX003, etc.) manufactured by Roki Techno Co., Ltd.

When using a filter, different filters (for example, a first filter and a second filter) may be combined. At that time, the filtration with each filter may be performed only once or twice or more. Further, filters having different pore diameters may be combined within the above-mentioned range. Further, the filtration with the first filter may be performed only on the dispersion liquid, and after mixing the other components, the filtration may be performed with the second filter. Further, the filter can be appropriately selected according to the hydrophobicity of the resin composition.

(film)
The film of the present invention is a film obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be used for an optical filter such as a color filter, a near-infrared transmission filter, and a near-infrared cut filter. The film of the present invention can also be used as a black matrix, a light-shielding film, or the like.

The film thickness of the film of the present invention can be appropriately adjusted according to the purpose. For example, the film thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, still more preferably 0.3 μm or more.

When the film of the present invention is used as a color filter, the film of the present invention preferably has a hue of green, red, blue, cyan, magenta or yellow. Further, the film of the present invention can be preferably used as a colored pixel of a color filter. Examples of the colored pixel include a red pixel, a green pixel, a blue pixel, a magenta color pixel, a cyan color pixel, and a yellow pixel.

When the film of the present invention is used as a near-infrared cut filter, the maximum absorption wavelength of the film of the present invention preferably exists in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm. It is more preferably present in the wavelength range of 700 to 1100 nm. Further, the transmittance of the film in the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, still more preferably 90% or more. Further, the transmittance at at least one point in the wavelength range of 700 to 1800 nm of the film is preferably 20% or less. The absorbance Amax / absorbance A550, which is the ratio of the absorbance Amax at the maximum absorption wavelength to the absorbance A550 at a wavelength of 550 nm, is preferably 20 to 500, more preferably 50 to 500, and 70 to 450. It is more preferably present, and particularly preferably 100 to 400.

When the film of the present invention is used as a near-infrared ray transmitting filter, it is preferable that the film of the present invention has, for example, any of the following spectral characteristics (i1) to (i5).
(I1): The maximum value of the transmittance in the wavelength range of 400 to 640 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 800 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more). A film having such spectral characteristics can block light in the wavelength range of 400 to 640 nm and transmit light having a wavelength of more than 750 nm.
(I2): The maximum value of the transmittance in the wavelength range of 400 to 750 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 900 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more). A film having such spectral characteristics can block light in the wavelength range of 400 to 750 nm and transmit light having a wavelength of more than 850 nm.
(I3): The maximum value of the transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 1000 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more). A film having such spectral characteristics can block light in the wavelength range of 400 to 830 nm and transmit light having a wavelength exceeding 950 nm.
(I4): The maximum value of the transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 1100 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more). A film having such spectral characteristics can block light in the wavelength range of 400 to 950 nm and transmit light having a wavelength exceeding 1050 nm.
(I5): The maximum value of the transmittance in the wavelength range of 400 to 1050 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum value of the transmittance in the wavelength range of 1200 to 1500 nm is. A filter of 70% or more (preferably 75% or more, more preferably 80% or more). A film having such spectral characteristics can block light in the wavelength range of 400 to 1050 nm and transmit light having a wavelength exceeding 1150 nm.

The thickness of the film of the present invention after being heat-treated at 300 ° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more, preferably 80% or more of the thickness of the film before the heat treatment. It is more preferably 90% or more, further preferably 95% or more, and particularly preferably 99% or more.
The thickness of the film after being heat-treated at 350 ° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more, preferably 80% or more of the thickness of the film before the heat treatment. Is more preferably 90% or more, further preferably 95% or more, and particularly preferably 99% or more.
The thickness of the film after being heat-treated at 400 ° C. for 5 hours in a nitrogen atmosphere is preferably 70% or more, preferably 80% or more of the thickness of the film before the heat treatment. Is more preferably 90% or more, further preferably 95% or more, and particularly preferably 99% or more.

<Membrane manufacturing method>
The film of the present invention can be produced through the steps of applying the above-mentioned resin composition of the present invention onto a support. The film manufacturing method of the present invention preferably further includes a step of forming a pattern (pixel). Examples of the pattern (pixel) forming method include a photolithography method and a dry etching method, and a photolithography method is preferable.

(Photolithography method)
First, a case where a film is manufactured by forming a pattern by a photolithography method will be described. The pattern formation by the photolithography method includes a step of forming a resin composition layer on a support using the resin composition of the present invention, a step of exposing the resin composition layer in a pattern, and a step of exposing the resin composition layer in a pattern. It is preferable to include a step of developing and removing the exposed portion to form a pattern (pixel). If necessary, a step of baking the resin composition layer (pre-baking step) and a step of baking the developed pattern (pixels) (post-baking step) may be provided.

In the step of forming the resin composition layer, the resin composition layer of the present invention is used to form the resin composition layer on the support. The support is not particularly limited and may be appropriately selected depending on the intended use. Examples thereof include a glass substrate and a silicon substrate, and a silicon substrate is preferable. Further, a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, or the like may be formed on the silicon substrate. Further, a black matrix that separates each pixel may be formed on the silicon substrate. Further, the silicon substrate may be provided with a base layer for improving the adhesion with the upper layer, preventing the diffusion of substances, or flattening the surface of the substrate. The surface contact angle of the base layer is preferably 20 to 70 ° when measured with diiodomethane. Further, it is preferably 30 to 80 ° when measured with water. When the surface contact angle of the base layer is within the above range, the coating property of the resin composition is good. The surface contact angle of the base layer can be adjusted by, for example, adding a surfactant.

As a method for applying the resin composition, a known method can be used. For example, a drop method (drop cast); a slit coat method; a spray method; a roll coat method; a rotary coating method (spin coating); a cast coating method; a slit and spin method; a pre-wet method (for example, JP-A-2009-145395). Methods described in the publication); Inkjet (for example, on-demand method, piezo method, thermal method), ejection system printing such as nozzle jet, flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing, etc. Various printing methods; transfer method using a mold or the like; nano-imprint method and the like can be mentioned. The method of application in inkjet is not particularly limited, and is, for example, the method shown in "Expandable / usable inkjet-infinite possibilities seen in patents-, published in February 2005, Sumi Betechno Research" (especially from page 115). Page 133), JP-A-2003-262716, JP-A-2003-185831, JP-A-2003-261827, JP-A-2012-126830, JP-A-2006-169325, and the like. Can be mentioned. Further, as a method for applying the resin composition, the methods described in International Publication No. 2017/030174 and International Publication No. 2017/018419 can also be used, and these contents are incorporated in the present specification.

The resin composition layer formed on the support may be dried (prebaked). When the membrane is manufactured by a low temperature process, prebaking may not be performed. When prebaking is performed, the prebake temperature is preferably 150 ° C. or lower, more preferably 120 ° C. or lower, still more preferably 110 ° C. or lower. The lower limit can be, for example, 50 ° C. or higher, or 80 ° C. or higher. The prebake time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, still more preferably 80 to 220 seconds. Pre-baking can be performed on a hot plate, an oven, or the like.

Next, the resin composition layer is exposed in a pattern (exposure step). For example, the resin composition layer can be exposed in a pattern by exposing the resin composition layer through a mask having a predetermined mask pattern using a stepper exposure machine, a scanner exposure machine, or the like. As a result, the exposed portion can be cured.

Examples of radiation (light) that can be used for exposure include g-line and i-line. Further, light having a wavelength of 300 nm or less (preferably light having a wavelength of 180 to 300 nm) can also be used. Examples of the light having a wavelength of 300 nm or less include KrF line (wavelength 248 nm), ArF line (wavelength 193 nm) and the like, and KrF line (wavelength 248 nm) is preferable. Further, a long wave light source having a diameter of 300 nm or more can also be used.

Further, at the time of exposure, light may be continuously irradiated for exposure, or pulsed irradiation may be performed for exposure (pulse exposure). The pulse exposure is an exposure method of a method in which light irradiation and pause are repeated in a cycle of a short time (for example, a millisecond level or less). In the case of pulse exposure, the pulse width is preferably 100 nanoseconds (ns) or less, more preferably 50 nanoseconds or less, and even more preferably 30 nanoseconds or less. The lower limit of the pulse width is not particularly limited, but may be 1 femtosecond (fs) or more, and may be 10 femtoseconds or more. The frequency is preferably 1 kHz or higher, more preferably 2 kHz or higher, and even more preferably 4 kHz or higher. The upper limit of the frequency is preferably 50 kHz or less, more preferably 20 kHz or less, and further preferably 10 kHz or less. Maximum instantaneous intensity is preferably at 50000000W / ^{m 2} or more, more preferably 100000000W / ^{m 2} or more, more preferably 200000000W / ^{m 2} or more. The upper limit of the maximum instantaneous intensity is preferably at 1000000000W / ^{m 2} or less, more preferably 800000000W / ^{m 2} or less, further preferably 500000000W / ^{m 2} or less. The pulse width is the time during which light is irradiated in the pulse period. The frequency is the number of pulse cycles per second. Further, the maximum instantaneous illuminance is the average illuminance within the time when the light is irradiated in the pulse period. Further, the pulse cycle is a cycle in which irradiation and pause of light in pulse exposure are set as one cycle.

Irradiation dose (exposure dose), for example, preferably 0.03 ~ 2.5J / cm ^2, more preferably 0.05 ~ 1.0J / cm ^2. The oxygen concentration at the time of exposure can be appropriately selected, and in addition to the oxygen concentration performed in the atmosphere, for example, in a low oxygen atmosphere having an oxygen concentration of 19% by volume or less (for example, 15% by volume, 5% by volume, or substantially). It may be exposed in an oxygen-free environment), or may be exposed in a high oxygen atmosphere (for example, 22% by volume, 30% by volume, or 50% by volume) in which the oxygen concentration exceeds 21% by volume. The exposure illuminance can be set as appropriate, and is usually selected from the range of ^{1000 W / m 2} to 100,000 ^{W / m 2} (for example, 5000 W / m ² , 15,000 W / m ² , or 35,000 W / m ^2). Can be done. Oxygen concentration and exposure illuminance may appropriately combined conditions, for example, illuminance 10000 W / ^{m 2} at an oxygen concentration of 10 vol%, oxygen concentration of 35 vol% can be such illuminance 20000W / ^{m 2.}

Next, the unexposed portion of the resin composition layer is developed and removed to form a pattern (pixel). The unexposed portion of the resin composition layer can be developed and removed using a developing solution. As a result, the resin composition layer in the unexposed portion in the exposure step is eluted in the developer, and only the photocured portion remains. The temperature of the developer is preferably, for example, 20 to 30 ° C. The development time is preferably 20 to 180 seconds. Further, in order to improve the residue removability, the steps of shaking off the developer every 60 seconds and supplying a new developer may be repeated several times.

Examples of the developing solution include organic solvents and alkaline developing solutions, and alkaline developing solutions are preferably used. As the alkaline developer, an alkaline aqueous solution (alkaline developer) obtained by diluting an alkaline agent with pure water is preferable. Examples of the alkaline agent include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxyamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and tetrabutylammonium hydroxide. , Ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis (2-hydroxyethyl) ammonium hydroxide, choline, pyrrole, piperidine, 1,8-diazabicyclo [5.4.0] -7-undecene and other organic substances. Examples thereof include alkaline compounds and inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium hydrogencarbonate, sodium silicate and sodium metasilicate. As the alkaline agent, a compound having a large molecular weight is preferable in terms of environment and safety. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. Further, the developer may further contain a surfactant. Examples of the surfactant include the above-mentioned surfactants, and nonionic surfactants are preferable. From the viewpoint of convenience of transfer and storage, the developer may be once produced as a concentrated solution and diluted to a concentration required for use. The dilution ratio is not particularly limited, but can be set in the range of, for example, 1.5 to 100 times. It is also preferable to wash (rinse) with pure water after development. Further, it is preferable that the rinsing is performed by supplying the rinsing liquid to the developed resin composition layer while rotating the support on which the developed resin composition layer is formed. It is also preferable to move the nozzle for discharging the rinse liquid from the central portion of the support to the peripheral edge of the support. At this time, when moving the nozzle from the central portion of the support to the peripheral portion, the nozzle may be moved while gradually reducing the moving speed. By rinsing in this way, in-plane variation of the rinse can be suppressed. Further, the same effect can be obtained by gradually reducing the rotation speed of the support while moving the nozzle from the central portion of the support to the peripheral portion.

It is preferable to perform additional exposure treatment or heat treatment (post-baking) after development and drying. Additional exposure processing and post-baking are post-development curing treatments to complete the curing. The heating temperature in the post-bake is, for example, preferably 100 to 240 ° C, more preferably 200 to 240 ° C. Post-baking can be performed on the developed film in a continuous or batch manner using a heating means such as a hot plate, a convection oven (hot air circulation type dryer), or a high frequency heater so as to meet the above conditions. .. When the additional exposure process is performed, the light used for the exposure is preferably light having a wavelength of 400 nm or less. Further, the additional exposure process may be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

(Dry etching method)
The pattern formation by the dry etching method includes a step of forming a resin composition layer on a support using the resin composition of the present invention and curing the entire resin composition layer to form a cured product layer. A step of forming a photoresist layer on the cured product layer, a step of exposing the photoresist layer in a pattern and then developing to form a resist pattern, and a step of etching the cured product layer using this resist pattern as a mask. It is preferable to include a step of dry etching with a gas. In forming the photoresist layer, it is preferable to further perform a prebaking treatment. In particular, as a process for forming the photoresist layer, it is desirable to carry out a heat treatment after exposure and a heat treatment (post-baking treatment) after development. Regarding the pattern formation by the dry etching method, the description in paragraphs 0010 to 0067 of JP2013-064993 can be referred to, and this content is incorporated in the present specification.

<Optical filter>
The optical filter of the present invention has the above-mentioned film of the present invention. Examples of the type of optical filter include a color filter, a near-infrared transmission filter, a near-infrared cut filter, and the like, and a color filter is preferable. As the color filter, it is preferable to have the film of the present invention as the colored pixels of the color filter. The optical filter of the present invention can be used for a solid-state image pickup device such as a CCD (charge-coupled device) or CMOS (complementary metal oxide semiconductor), an image display device, or the like.

In the optical filter, the film thickness of the film of the present invention can be appropriately adjusted according to the purpose. The film thickness is preferably 5 μm or less, more preferably 1 μm or less, and even more preferably 0.6 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, still more preferably 0.3 μm or more.

The width of the pixels included in the optical filter is preferably 0.4 to 10.0 μm. The lower limit is preferably 0.4 μm or more, more preferably 0.5 μm or more, and further preferably 0.6 μm or more. The upper limit is preferably 5.0 μm or less, more preferably 2.0 μm or less, further preferably 1.0 μm or less, and even more preferably 0.8 μm or less. The Young's modulus of the pixel is preferably 0.5 to 20 GPa, more preferably 2.5 to 15 GPa.

It is preferable that each pixel included in the optical filter has high flatness. Specifically, the surface roughness Ra of the pixel is preferably 100 nm or less, more preferably 40 nm or less, and further preferably 15 nm or less. The lower limit is not specified, but it is preferably 0.1 nm or more, for example. The surface roughness of the pixel can be measured using, for example, an AFM (atomic force microscope) Measurement 3100 manufactured by Veeco. Further, the contact angle of water on the pixel can be appropriately set to a preferable value, but is typically in the range of 50 to 110 °. The contact angle can be measured using, for example, a contact angle meter CV-DT · A type (manufactured by Kyowa Interface Science Co., Ltd.). Further, it is preferable that the volume resistance value of the pixel is high. Specifically, it is preferred that the volume resistivity value of the pixel is 10 ⁹ Ω · cm or more, and more preferably 10 ¹¹ Ω · cm or more. The upper limit is not specified, but ^{it is preferably 10 14} Ω · cm or less, for example. The volume resistance value of the pixel can be measured using an ultra-high resistance meter 5410 (manufactured by Advantest).

In the optical filter, a protective layer may be provided on the surface of the film of the present invention. By providing the protective layer, various functions such as oxygen blocking, low reflection, prohydrophobicization, and shielding of light of a specific wavelength (ultraviolet rays, near infrared rays, etc.) can be imparted. The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. Examples of the method for forming the protective layer include a method of applying a resin composition for forming a protective layer dissolved in an organic solvent to form the protective layer, a chemical vapor deposition method, and a method of attaching the molded resin with an adhesive. The components constituting the protective layer include (meth) acrylic resin, en-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, and polyimide. Resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin, melamine resin, urethane resin, aramid resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluorine Examples thereof include resins, polycarbonate resins, polyacrylonitrile resins, cellulose resins, Si, C, W, Al ₂ O ₃ , Mo, SiO ₂ , Si ₂ N _{4, and the} like, and two or more of these components may be contained. For example, in the case of a protective layer for the purpose of blocking oxygen, it is preferable that _{the protective layer contains a polyol resin, SiO 2} , and Si ₂ N _4. Further, in the case of a protective layer for the purpose of reducing reflection, it is preferable that the protective layer contains a (meth) acrylic resin and a fluororesin.

When the protective layer forming resin composition is applied to form the protective layer, known methods such as a spin coating method, a casting method, a screen printing method, and an inkjet method are used as the coating method of the protective layer forming resin composition. Can be used. As the organic solvent contained in the resin composition for forming the protective layer, a known organic solvent (for example, propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used. When the protective layer is formed by the chemical vapor deposition method, the known chemical vapor deposition method (thermochemical vapor deposition method, plasma chemical vapor deposition method, photochemical vapor deposition method) is used as the chemical vapor deposition method. Can be used.

The protective layer may be an additive such as organic / inorganic fine particles, an absorber for light of a specific wavelength (for example, ultraviolet rays, near infrared rays, etc.), a refractive index adjusting agent, an antioxidant, an adhesive, and a surfactant, if necessary. May be contained. Examples of organic / inorganic fine particles include polymer fine particles (for example, silicone resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, and titanium oxynitride. , Magnesium fluoride, hollow silica, silica, calcium carbonate, barium sulfate and the like. A known absorber can be used as the absorber of light having a specific wavelength. The content of these additives can be adjusted as appropriate, but is preferably 0.1 to 70% by mass, more preferably 1 to 60% by mass, based on the total mass of the protective layer. Further, as the protective layer, the protective layer described in paragraphs 0073 to 0092 of JP-A-2017-151176 can also be used.

The optical filter may have a structure in which each pixel is embedded in a space partitioned by a partition wall, for example, in a grid pattern. Further, the resin composition of the present invention can also be suitably used for the pixel configuration described in International Publication No. 2019/1028887.

<Solid image sensor>
The solid-state image sensor of the present invention has the above-mentioned film of the present invention. The configuration of the solid-state image pickup device of the present invention is not particularly limited as long as it includes the film of the present invention and functions as a solid-state image pickup device, and examples thereof include the following configurations.

On the substrate, there are a plurality of photodiodes constituting the light receiving area of a solid-state image pickup device (CCD (charge-coupled device) image sensor, CMOS (complementary metal oxide semiconductor) image sensor, etc.) and a transfer electrode made of polysilicon or the like. A device protective film made of silicon nitride or the like formed on the photodiode and the transfer electrode so as to have a light-shielding film in which only the light-receiving part of the photodiode is open, and to cover the entire surface of the light-shielding film and the light-receiving part of the photodiode. And has a color filter on the device protective film. Further, a configuration having a condensing means (for example, a microlens or the like; the same applies hereinafter) on the device protective film under the color filter (near the substrate), a configuration having a condensing means on the color filter, and the like. There may be. Further, the color filter may have a structure in which each colored pixel is embedded in a space partitioned by a partition wall, for example, in a grid pattern. In this case, the partition wall preferably has a lower refractive index than each colored pixel. Examples of the image pickup apparatus having such a structure are described in JP-A-2012-227478, JP-A-2014-179757, International Publication No. 2018/043654, and US Patent Application Publication No. 2018/0040656. Equipment is mentioned. Further, as in Japanese Patent Application Laid-Open No. 2019-21159, an ultraviolet absorbing layer may be provided in the structure of the solid-state image sensor to improve the light resistance. The image pickup device provided with the solid-state image pickup device of the present invention can be used not only for digital cameras and electronic devices having an image pickup function (mobile phones and the like), but also for in-vehicle cameras and surveillance cameras. Further, in the solid-state image sensor incorporating the color filter of the present invention, in addition to the color filter of the present invention, another color filter, a near-infrared cut filter, an organic photoelectric conversion film and the like may be incorporated.

<Image display device>
The image display device of the present invention has the above-mentioned film of the present invention. Examples of the image display device include a liquid crystal display device and an organic electroluminescence display device. For details on the definition of image display devices and the details of each image display device, see, for example, "Electronic Display Devices (Akio Sasaki, Kogyo Chosakai Co., Ltd., published in 1990)", "Display Devices (Junaki Ibuki, Industrial Books). Co., Ltd. (issued in 1989) ”. Further, the liquid crystal display device is described in, for example, "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, Kogyo Chosakai Co., Ltd., published in 1994)". The liquid crystal display device to which the present invention can be applied is not particularly limited, and can be applied to, for example, various types of liquid crystal display devices described in the above-mentioned "next-generation liquid crystal display technology".

The present invention will be described in more detail with reference to examples below. The materials, amounts used, ratios, treatment contents, treatment procedures, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

<Measurement of weight average molecular weight (Mw) of sample>
The weight average molecular weight of the sample was measured by gel permeation chromatography (GPC) under the following conditions.
Column type: TOSOH TSKgel Super HZM-H, TOSOH TSKgel Super HZ4000, and TOSOH TSKgel Super HZ2000 linked column developing solvent: tetrahydrofuran Column temperature: 40 ° C.
Flow rate (sample injection amount): 1.0 μL (sample concentration: 0.1% by mass)
Device name: Tosoh HLC-8220GPC
Detector: RI (refractive index) detector Calibration curve base resin: Polystyrene resin

<Measurement of acid value of sample>
The acid value of the sample represents the mass of potassium hydroxide required to neutralize the acidic component per 1 g of solid content in the sample. The acid value of the sample was measured as follows. That is, the measurement sample was dissolved in a mixed solvent of tetrahydrofuran / water = 9/1 (mass ratio), and the obtained solution was used at 25 ° C. using a potentiometric titrator (trade name: AT-510, manufactured by Kyoto Denshi Kogyo). Then, neutralization titration was performed with a 0.1 mol / L potassium hydroxide aqueous solution. The acid value was calculated by the following equation with the inflection point of the titration pH curve as the titration end point.
A = 56.11 x Vs x 0.5 x f / w
A: Acid value (mgKOH / g)
Vs: Amount of 0.1 mol / L potassium hydroxide aqueous solution required for titration (mL)
f: Potency of 0.1 mol / L potassium hydroxide aqueous solution w: Mass of sample (g) (in terms of solid content)

<Synthesis of terminal hydroxy group macromonomer>
(Synthesis Example 1-1) Example of Synthesis of Terminal Hydroxy Group Macromonomer DHM-1 181.3 g of methyl methacrylate and 200.2 g of butyl acrylate were added to a nitrogen-substituted three-necked flask, and 590 g of propylene glycol monomethyl ether acetate. Diluted with. This was heated to 75 ° C. under a nitrogen atmosphere. Next, 21.3 g of 3-mercapto-1,2-propanediol and 3.6 g of a polymerization initiator (V-601, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) were added, and the temperature was 75 ° C. for 8 hours under a nitrogen atmosphere. It was stirred while heating. The weight average molecular weight of the obtained terminal hydroxy group macromonomer DHM-1 was 3200.

(Synthesis Examples 1-2 to 1-13) Examples of Synthesis of Terminal Hydroxy Group Macromonomers DHM-2 to DHM-13 Synthetic Terminal Hydroxy Group Macromonomers DHM-2 to DHM-13 in the same manner as in Synthesis Example 1-1 did.

(Synthesis Example 1-14) Synthesis example of terminal hydroxy group macromonomer DHM-14 5.6 g of compound (AAA-2), 69 g of ε-caprolactone, 0.8 g of monobutyltin oxide in a nitrogen-substituted three-necked flask. Was added and heated and stirred at 90 ° C. for 2 hours and at 120 ° C. for 6 hours. After cooling to 5 ° C., 0.5 g of acetyl chloride was added, and the mixture was further stirred for 2 hours. Next, 0.1 g of pyridinium p-toluenesulfonic acid and 0.8 g of pure water were added at 60 ° C., and the mixture was stirred for 10 hours to hydrolyze acetal to obtain terminal hydroxy group macromonomer DHM-14.

(Synthesis Examples 1-15 to 1-17) Examples of Synthesis of Terminal Hydroxy Group Macromonomers DHM-15 to DHM-17 Synthetic Terminal Hydroxy Group Macromonomers DHM-15 to DHM-17 in the same manner as in Synthesis Example 1-14 did.

(Synthesis Example 1-18) Synthesis example of terminal hydroxy group macromonomer DHM-18 181.3 g of Blemmer AME-400 (manufactured by NOF CORPORATION) was added to a nitrogen-substituted three-necked flask, and propylene glycol monomethyl ether acetate was added. Diluted with 500 g of. This was heated to 60 ° C. under a nitrogen atmosphere, 19.7 g of diethanolamine was added, and the mixture was heated and stirred for 2 hours to carry out a Michael addition reaction to obtain a terminal hydroxy group macromonomer DHM-18.

(Synthesis Examples 1-19, 1-20) Examples of Synthesis of Terminal Hydroxy Group Macromonomers DHM-19 and DHM-20 Terminal Hydroxy Group Macromonomers DHM-19 and DHM-20 are synthesized in the same manner as in Synthesis Example 1-18. did.

(Synthesis Example 2-1) Synthesis Example of Terminal Hydroxy Group Macromonomer MHM-1 181.3 g of methyl methacrylate and 200.2 g of butyl acrylate were added to a nitrogen-substituted three-necked flask, and 590 g of propylene glycol monomethyl ether acetate. Diluted with. This was heated to 75 ° C. under a nitrogen atmosphere. Next, 23.5 g of 6-mercaptohexanol and 3.3 g of a polymerization initiator (V-601, manufactured by Wako Pure Chemical Industries, Ltd.) were added, and the mixture was heated and stirred at 75 ° C. for 8 hours under a nitrogen atmosphere. The weight average molecular weight of the obtained terminal hydroxy group macromonomer MHM-1 was 2700.

(Synthesis Examples 2-2 to 2-10) Examples of Synthesis of Terminal Hydroxy Group Macromonomers MHM-2 to MHM-10 Synthetic Terminal Hydroxy Group Macromonomers MHM-2 to MHM-10 in the same manner as in Synthesis Example 2-1 did.

(Synthesis Example 2-11) Synthesis example of terminal encapsulant macromonomer MHM-11 In a nitrogen-substituted three-necked flask, 4.3 g of compound (AAA-3), 69 g of ε-caprolactone, and 0. 8 g was added, and the mixture was heated and stirred at 90 ° C. for 2 hours and at 120 ° C. for 6 hours. After cooling to 5 ° C., 0.5 g of acetyl chloride was added, and the mixture was further stirred for 2 hours. Next, 1.8 g of boron tribromide was added at 0 ° C. and the mixture was stirred for 10 hours to deprotect the terminal methoxy group. The insoluble matter in the obtained polymer solution was removed by filtration to obtain the terminal encapsulant macromonomer MHM-11.

(Synthesis Examples 2-12 to 2-15) Synthesis Example of Terminal Hydroxy Group Macromonomers MHM-12 to MHM-15 Synthetic Terminal Hydroxy Group Macromonomers MHM-12 to MHM-15 in the same manner as in Synthesis Example 2-11. did.

(Synthesis Example 2-16) Synthesis example of terminal encapsulant macromonomer MHM-16 181.3 g of methyl methacrylate and 200.2 g of butyl acrylate were added to a nitrogen-substituted three-necked flask to obtain propylene glycol monomethyl ether acetate. It was diluted with 590 g. This was heated to 75 ° C. under a nitrogen atmosphere. Next, 16.5 g of 6-mercaptohexanol and 1.9 g of a polymerization initiator (V-601, manufactured by Wako Pure Chemical Industries, Ltd.) were added, and the mixture was heated and stirred at 75 ° C. for 8 hours under a nitrogen atmosphere. To this, add 0.2 g of inorganic bismuth (Neostan U-600, manufactured by Nitto Kasei Co., Ltd.) and 18.1 g of 2-acryloyloxyethyl isocyanate (Carens AOI, manufactured by Showa Denko Co., Ltd.) at an additional 60 ° C. The urethanization reaction was carried out by heating and stirring for 8 hours. 10.8 g of the compound (AAA-4) was added to the obtained reaction solution, and the mixture was further heated and stirred at 60 ° C. for 8 hours to carry out a Michael addition reaction. The weight average molecular weight of the obtained terminal encapsulant macromonomer MHM-16 was 6400.

(Synthesis Examples 2-17 to 2-20) Examples of Synthesis of Terminal Hydroxy Group Macromonomers MHM-17 to MHM-20 Synthetic Terminal Hydroxy Group Macromonomers MHM-17 to MHM-20 in the same manner as in Synthesis Example 2-16 did.

The structures and weight average molecular weights (Mw) of the terminal hydroxy group macromonomers DHM-1 to DHM-20 and MHM-1 to MHM-20 are shown below. In Poly, DHM-1, DHM-3, DHM-6-9, DHM-12, DHM-13, DHM-19, DHM-20, MHM-1, MHM-4 to MHM-6, MHM-9, MHM The numerical values added to the repeating units of -10, MHM-16, MHM-17, and MHM-20 represent the molar ratio of the repeating units, and are added to the repeating units of DHM-14 to DHM-18 and MHM-11 to MHM-15. The value given represents the number of repeating units. The structure described in Poly is P ¹ of the formula (1-A).

<Example of resin synthesis>
(Synthesis Example 3-1) Synthesis of Resin B-1 32.0 g (solid content equivalent) of terminal hydroxy group macromonomer DHM-1 in a nitrogen-substituted three-necked flask, pyromellitic acid anhydride (acid dianhydride AA) -1: 4.4 g of Tokyo Kasei) and 10 g of propylene glycol monomethyl ether acetate were added and heated to 80 ° C. To this, 1.1 g of 1,3-phenylenediamine (diamine DA-1: manufactured by Tokyo Chemical Industry Co., Ltd.) was added, and the mixture was further heated and stirred at 80 ° C. for 6 hours to obtain a 30% propylene glycol monomethyl ether acetate solution of resin B-1. Obtained. The obtained resin B-1 had a weight average molecular weight of 17200 and an acid value of 57 mgKOH / g.

(Synthetic Examples 3-2 to 2-93) Synthesis of Resins B-2-B-93 Except for changing the acid dianhydride, diol, diamine, and terminal encapsulant to the types and charging amounts shown in the table below. Synthesized the resins B-2 to B-93 in the same manner as in Synthesis Example 3-1. The weight average molecular weight (Mw) and acid value of each resin are shown in the table below. Further, in the column of the molar ratio 1, the structural unit represented by the formula (1-A), the structural unit of the structure in which n of the formula (1-A) is 0, and the structural unit represented by the formula (1-B) are represented. The ratio of the structural unit represented by the formula (1-B) in moles to the total with the structural units (= {the number of moles of the structural unit represented by the formula (1-B) / (formula (1-B)). The number of moles of the structural unit represented by A) + the number of moles of the structural unit of the structure in which n in the formula (1-A) is 0 + the number of moles of the structural unit represented by the formula (1-B))} × The value of 100) is described. Further, in the column of the ratio 1 of the number of moles, the ratio of the number of moles of the structural unit represented by the formula (1-B) to the number of moles of the structural unit represented by the formula (1-A) (= the ratio of the number of moles of the structural unit represented by the formula (1-B)). The value of the number of moles of the structural unit represented by B) / the number of moles of the structural unit represented by the formula (1-A)) is described. The value of the molar ratio 1 and the value of the molar ratio 1 are the values calculated from the charged amount used for the synthesis of each resin.

The diols DHM-1 to DHM-20 are the terminal hydroxy group macromonomers DHM-1 to DHM-20 having the above-mentioned structures, respectively. The terminal sealants MHM-1 to MHM-20 are terminal hydroxy group macromonomers MHM-1 to MHM-20 having the above-mentioned structures, respectively. The acid dianhydrides AA-1 to AA-8, the diamines DA-1 to DA-7, and the terminal sealants ED-1 to ED-3 are compounds having the following structures, respectively.

<Manufacturing of dispersion>
The mixed solution containing the raw materials shown in the table below is mixed and dispersed for 3 hours using a bead mill (using zirconia beads having a diameter of 0.3 mm), and then a high pressure disperser with a decompression mechanism NANO-3000-10 (Nippon BEE). A dispersion treatment was carried out at a flow rate of 500 g / min under a pressure of 2000 MPa using (manufactured by Co., Ltd.). This dispersion treatment was repeated 10 times to obtain each dispersion.

The unit of numerical values shown in the above table is parts by mass. Among the raw materials shown in the above table, the details of the raw materials shown by abbreviations are as follows.
[Color material]
PR264: C.I. I. Pigment Red 264 (red pigment, diketopyrrolopyrrole pigment)
PR254: C.I. I. Pigment Red 254 (red pigment, diketopyrrolopyrrole pigment)
PR179: C.I. I. Pigment Red 179
PB15: 6: C.I. I. Pigment Blue 15: 6 (blue pigment, phthalocyanine pigment)
PB16: C.I. I. Pigment Blue 16 (blue pigment, phthalocyanine pigment)
PG7: C.I. I. Pigment Green 7
PG36: C.I. I. Pigment Green 36
PG58: C.I. I. Pigment Green 58
PY129: C.I. I. Pigment Yellow 129
PY185: C.I. I. Pigment Yellow 185
PY215: C.I. I. Pigment Yellow 215
PV23: C.I. I. Pigment Violet 23
IRGAPHORE: Irgaphor Black S 0100 CF (manufactured by BASF, a compound having the following structure, a lactam pigment)

PBk32: C.I. I. Pigment Black 32 (compound with the following structure, perylene pigment)

[Pigment derivative]
Derivative 1: Compound with the following structure

Derivative 2: A compound having the following structure

[Resin (dispersant)]
(Specific resin)
B-1, B-2, B-3, B-4, B-5, B-6, B-7, B-8, B-9, B-10, B-11, B-12, B- 13, B-14, B-15, B-16, B-17, B-18, B-19, B-20, B-21, B-22, B-23, B-24, B-25, B-26, B-27, B-28, B-29, B-30, B-31, B-32, B-33, B-46, B-47, B-48, B-49, B- 50, B-51, B-52, B-53, B-54, B-55, B-56, B-57, B-58, B-60, B-61, B-62, B-63, B-65, B-67, B-69, B-71, B-73, B-74, B-75, B-77, B-79, B-80, B-81, B-82, B- 83, B-84, B-85, B-90, B-91, B-92, B-93: Resin described above

(Comparative resin)
cB-1: Resin having the following structure (weight average molecular weight is 10885, acid value is 74 mgKOH / g. In the description of "Polym", the repeating units of the structure indicated by "Polym" are combined by the number of subscripts. It shows that the polymer chain of the structure is bonded to the sulfur atom (S).)

〔solvent〕
C-1: Propylene glycol monomethyl ether acetate C-2: Propylene glycol monomethyl ether C-3: Cyclohexanone

<Manufacturing of resin composition>
The raw materials shown in the table below were mixed to prepare resin compositions of Examples and Comparative Examples.

Of the raw materials listed in the above table, the details of the raw materials indicated by abbreviations are as follows.

[Dispersion]
Dispersions R1 to R26, B1 to B25, G1 to G27, Bk1 to Bk20, CR1, CB1, CG1, CBk1 to 3: Dispersions described above

〔resin〕
Ba-1: Resin having the following structure (the numerical value added to the main chain is the molar ratio. Weight average molecular weight 11000)

Ba-2: Resin having the following structure (the numerical value added to the main chain is the molar ratio. Weight average molecular weight 15000)

Ba-3: Resin having the following structure (the numerical value added to the main chain is the molar ratio. The total value of x, y and z is 50. Mw = 15000).

Bb-1: Resin having the following structure (the numerical value added to the main chain is the molar ratio. Weight average molecular weight 13000)

[Polymerizable monomer]
D-1: Acrylate compound (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., a mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate)
D-2: Epoxy compound (TETRAD-X, manufactured by Mitsubishi Gas Chemical Company, Inc., N, N, N', N'-tetraglycidyl-m-xylylenediamine)
D-3: Oxetane compound (OXT-221, manufactured by Toagosei Co., Ltd., 3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane)
D-4: Oxetane compound (OX-SQ TX-100, manufactured by Toagosei Co., Ltd.)

[Photopolymerization initiator]
E-1: Omnirad 379EG (manufactured by IGM Resins B.V., 2-dimethylamino-2- (4-methyl-benzyl) -1- (4-morpholin-4-yl-phenyl) -butane-1- on)
E-2: Irgure OXE01 (Oxime compound manufactured by BASF)
E-3: Compound with the following structure

<Evaluation>
[Evaluation of dispersibility]
(Storage stability)
In each Example and Comparative Example, the viscosity (mPa · s) of the resin composition was measured by "RE-85L" manufactured by Toki Sangyo Co., Ltd. After the above measurement, the resin composition was allowed to stand at 45 ° C. under the conditions of light shielding for 3 days, and the viscosity (mPa · s) was measured again. The storage stability was evaluated according to the following evaluation criteria from the viscosity difference (ΔVis) before and after standing. It can be said that the smaller the value of the viscosity difference (ΔVis), the better the storage stability of the resin composition and the better the dispersibility of the pigment. In each of the above viscosity measurements, the temperature and humidity were controlled to 22 ± 5 ° C. and 60 ± 20% in a laboratory, and the temperature of the resin composition was adjusted to 25 ° C.

-Evaluation criteria-
A: ΔVis was 0.5 mPa · s or less.
B: ΔVis exceeded 0.5 mPa · s and was 1.0 mPa · s or less.
C: ΔVis exceeded 1.0 mPa · s and was 2.0 mPa · s or less.
D: ΔVis exceeded 2.0 mPa · s and was 2.5 mPa · s or less.
E: ΔVis exceeded 2.5 mPa · s.

(Particle size)
The resin composition obtained above was dispensed into a 20 ml sample bottle and diluted with propylene glycol monomethyl ether acetate so that the solid content concentration became 0.2% by mass. Using a 2 ml measuring quartz cell at a temperature of 25 ° C. and a dynamic light scattering type particle size distribution measuring device (LB-500, manufactured by Horiba Seisakusho Co., Ltd.) according to JIS8826: 2005, the data of the diluted solution was taken in 50 times. Then, the particle size (number average particle size) of the obtained arithmetic average pigment based on the number of pieces was obtained. It can be said that the smaller the value of the number average particle diameter of the pigment, the better the dispersibility of the pigment.
-Evaluation criteria-
A: The number average particle size of the pigment was 0.05 μm or less.
B: The number average particle size of the pigment exceeded 0.05 μm and was 0.10 μm or less.
C: The number average particle size of the pigment exceeded 0.10 μm and was 0.20 μm or less.
D: The number average particle size of the pigment was more than 0.20 μm and 0.50 μm or less.
E: The number average particle size of the pigment exceeded 0.50 μm.

[Evaluation of membrane shrinkage rate]
In each Example and Comparative Example, the resin composition was applied on a glass substrate by spin coating, dried (prebaked) at 100 ° C. for 120 seconds using a hot plate, and then heated at 200 ° C. for 30 minutes using an oven. (Post-baked) to produce a film having a thickness of 0.60 μm. The film thickness is measured by scraping a part of the film to expose the surface of the glass substrate and measuring the step between the surface of the glass substrate and the coating film (the film thickness of the coating film) using a stylus type step meter (DektakXT, manufactured by BRUKER). did. Then, the obtained membrane was heat-treated at 300 ° C. for 5 hours under a nitrogen atmosphere. The film thickness after the heat treatment was measured in the same manner, the film shrinkage rate was obtained from the following formula, and the film shrinkage rate was evaluated according to the following evaluation criteria. Both T ₀ and T ₁ below were measured in a laboratory where the temperature and humidity were controlled to 22 ± 5 ° C. and 60 ± 20%, with the substrate temperature adjusted to 25 ° C. It can be said that the smaller the membrane shrinkage rate, the more the membrane shrinkage is suppressed, which is a preferable result.
Membrane shrinkage rate (%) = (1- (T ₁ / T ₀ )) x 100
T ₀ : Film thickness immediately after production (= 0.60 μm)
T ₁ : Film thickness after heat treatment at 300 ° C for 5 hours in a nitrogen atmosphere-evaluation criteria-
A: The membrane shrinkage rate was 1% or less.
B: The membrane shrinkage rate was more than 1% and 5% or less.
C: The membrane shrinkage rate was more than 5% and 10% or less.
D: The membrane shrinkage rate was more than 10% and 30% or less.
E: The membrane shrinkage rate exceeded 30%.

[Evaluation of cracks]
In each Example and Comparative Example, the resin composition was applied on a glass substrate by spin coating, dried (prebaked) at 100 ° C. for 120 seconds using a hot plate, and then heated at 200 ° C. for 30 minutes using an oven. (Post-baked) to produce a film having a thickness of 0.60 μm. _{Next, SiO 2} was laminated at 200 nm on the surface of the obtained film by a sputtering method to form an inorganic film. The film on which the inorganic film was formed was heat-treated at 300 ° C. for 5 hours in a nitrogen atmosphere. The surface of the inorganic film after the heat treatment was observed with an optical microscope, ^{the number of cracks per 1 cm 2} was counted, and the presence or absence of cracks was evaluated according to the following evaluation criteria.
-Evaluation criteria-
A: The number of cracks per ^{1 cm 2 was 0.}
B: The number of cracks per ^{1 cm 2 was 1 to 10.}
The number of cracks per C: 1 cm ^{2 was 11 to 50.}
The number of cracks per D: 1 cm ^{2 was 51 to 100.}
E: The number of cracks per ^{1 cm 2 was 101 or more.}

When the resin composition of the example was used, the storage stability and the particle size were excellently evaluated, and the dispersibility of the pigment was excellent, as compared with the case where the resin composition of the comparative example was used. Furthermore, when the resin composition of the example was used, the film shrinkage rate was small and the generation of cracks was suppressed as compared with the case of using the resin composition of the comparative example. Therefore, it can be said that it is possible to expand the process window in the process after manufacturing the film as compared with the resin composition of the comparative example.

(Example 1000: Pattern formation by photolithography method)
The resin composition of Example 1 was applied on a silicon wafer by spin coating, dried at 100 ° C. for 120 seconds (pre-baked) using a hot plate, and then heated at 200 ° C. for 30 minutes (post-baked) using an oven. A resin composition layer having a thickness of 0.60 μm was formed. Next, with respect to this resin composition layer, an i-line stepper exposure apparatus FPA-3000i5 + (Canon, Inc.) is provided via a mask pattern in which square non-masked portions having a side of 1.1 μm are arranged in a region of 4 mm × 3 mm. ) Was irradiated with light having a wavelength of 365 nm at an exposure amount of ^{500 mJ / cm 2.} Next, the silicon wafer on which the resin composition layer after exposure is formed is placed on a horizontal rotary table of a spin shower developer (DW-30 type, manufactured by Chemitronics Co., Ltd.), and a developer (CD) is placed. -2000, manufactured by Fujifilm Electronics Materials Co., Ltd., was paddle-developed at 23 ° C. for 60 seconds. Next, while rotating the silicon wafer at a rotation speed of 50 rpm, pure water was supplied from above the center of rotation in a shower shape from the ejection nozzle to perform a rinsing treatment, and then spray-dried to form a pattern (pixel).

The produced silicon wafer with pixels was divided into two, and one was heat-treated at 300 ° C. for 5 hours in a nitrogen atmosphere (hereinafter, one is a substrate before heat treatment at 300 ° C. and the other is a substrate after heat treatment at 300 ° C.). When the cross sections of the pixels formed on the substrate before the heat treatment at 300 ° C. and the substrate after the heat treatment at 300 ° C. were evaluated by a scanning electron microscope (SEM), the height of the pixels formed on the substrate after the heat treatment at 300 ° C. was evaluated. The thickness (thickness) was 97% of the height (thickness) of the pixels formed on the substrate before the heat treatment at 300 ° C.

Claims

Color material A containing pigment and
Resin B and
Containing solvent C,
The resin B includes a resin b-1 containing a structural unit represented by the formula (1-A) and a structural unit represented by the formula (1-B).
Resin composition;

Wherein (1-A), X 11 represents a tetravalent linking group, X 12 represents a 2 + n valent linking group, Y 11 represents O or NR Y11, R 11, R 12 and R Y11 are Each independently represents a hydrogen atom or substituent, Lp 1 represents a divalent linking group, P 1 represents a polymer chain, and n represents an integer greater than or equal to 1.
In formula (1-B), X 51 represents a tetravalent linking group, X 52 represents a divalent linking group, Y 51 represents O or NR Y 51 , and R 51, R 52 , R 61 and R. Y51 independently represents a hydrogen atom or a substituent.
The sum of the structural unit represented by the formula (1-A), the structural unit of the structure in which n is 0 in the formula (1-A), and the structural unit represented by the formula (1-B). The resin composition according to claim 1, wherein the ratio of the structural unit represented by the formula (1-B) in moles is 10 to 90 mol%.
The invention according to claim 1 or 2, wherein the ratio of the number of moles of the structural unit represented by the formula (1-B) to the number of moles of the structural unit represented by the formula (1-A) is 0.2 to 5. Resin composition.
The resin composition according to any one of claims 1 to 3, wherein the divalent linking group represented by Lp 1 of the formula (1-A) is a group containing a sulfur atom.
The invention according to any one of claims 1 to 4, wherein X 11 of the formula (1-A) and X 51 of the formula (1-B) are groups each independently containing an aromatic hydrocarbon ring. Resin composition.
The resin composition according to any one of claims 1 to 5, wherein X 52 of the formula (1-B) is a group containing a fluorine atom and an aromatic hydrocarbon ring.
The polymer chain represented by P 1 of the formula (1-A) contains a repeating unit of at least one structure selected from a poly (meth) acrylic structure, a polystyrene structure, a polyether structure and a polyester structure, according to claims 1 to 1. Item 6. The resin composition according to any one of 6.
Any one of claims 1 to 6, wherein the polymer chain represented by P 1 of the formula (1-A) contains a repeating unit represented by any of the formulas (P1-1) to (P1-6). The resin composition according to the section;

In the formula, RG1 and RG2 each represent an alkylene group;
RG3 represents a hydrogen atom, a methyl group, a fluorine atom, a chlorine atom or a hydroxymethyl group;
Q G1 represents -O- or -NR q- , and R q represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group;
LG1 represents a single bond or an arylene group;
LG2 represents a single bond or a divalent linking group;
RG4 represents a hydrogen atom or substituent;
RG5 represents a hydrogen atom or a methyl group and RG6 represents an aryl group.
Substituents represented by R G4 ethylenically unsaturated bond-containing group, an epoxy group, at least one selected from an oxetanyl group, and t- butyl group, a resin composition according to claim 8.
The resin composition according to any one of claims 1 to 9, wherein the solvent C contains at least one selected from an ester solvent, an ether solvent, an alcohol solvent and a ketone solvent.
The resin composition according to any one of claims 1 to 10, wherein the coloring material A contains at least one selected from a diketopyrrolopyrrole pigment and a phthalocyanine pigment.
The resin composition according to any one of claims 1 to 11, further comprising a polymerizable monomer.
The resin composition according to any one of claims 1 to 12, further comprising a photopolymerization initiator.
A film obtained by using the resin composition according to any one of claims 1 to 13.
An optical filter having the film according to claim 14.
A solid-state imaging device having the film according to claim 14.
An image display device having the film according to claim 14.
A resin containing a structural unit represented by the formula (1-A) and a structural unit represented by the formula (1-B);

Wherein (1-A), X 11 represents a tetravalent linking group, X 12 represents a 2 + n valent linking group, Y 11 represents O or NR Y11, R 11, R 12 and R Y11 are Each independently represents a hydrogen atom or substituent, Lp 1 represents a divalent linking group, P 1 represents a polymer chain, and n represents an integer greater than or equal to 1.
In formula (1-B), X 51 represents a tetravalent linking group, X 52 represents a divalent linking group, Y 51 represents O or NR Y 51 , and R 51, R 52 , R 61 and R. Y51 independently represents a hydrogen atom or a substituent.