TW202234964A - Multi-layered asymmetric conductive fabric tape and preparation method thereof - Google Patents

Abstract

Provided are a multi-layered asymmetric conductive fabric tape and a preparation method thereof. The multi-layered asymmetric conductive fabric tape comprises: a first conductive adhesive layer, which is an anisotropic conductive adhesive layer, comprising first metal conductive particles; a second conductive adhesive layer, which is an isotropic conductive adhesive layer, comprising second metal conductive particles; and a conductive fabric layer located between the first conductive adhesive layer and the second conductive adhesive layer, wherein the conductive fabric layer has pores or interstices and at least part of the first and second metal conductive particles contact each other through the pores or interstices. The multi-layered asymmetric conductive fabric tape of the present disclosure can achieve great conduction performance in the case that the ground hole is small, be suitable for a vacuum press process, and has excellent air permeability, peelability and adhesion.

Description

A kind of multi-layer asymmetric conductive cloth tape and preparation method thereof

The present disclosure relates to flexible printed circuits (FPCs), and more particularly, to multi-layer asymmetric conductive cloth tapes.

The development trend of electronic and communication products requires the development of flexible printed circuit (FPC) components towards light, thin, short, and highly integrated. FPC needs to be laminated with conductive adhesive and its reinforcing structure after multiple processes. At present, the more commonly used conductive adhesive products in the market have the problem of strong bonding force with FPC material but insufficient bonding force with steel sheet, or bonding force with steel sheet. The problem of strong but insufficient bonding force with the FPC material, it is difficult to take into account the requirements of strong bonding force with both, resulting in the risk of the steel sheet falling off easily or the steel sheet and the conductive adhesive falling off from the FPC in the downstream process. , causing the entire FPC to be scrapped.

In addition, the current FPC process is gradually improving, and the grounding aperture is required to be smaller and smaller, and there are also new requirements for the grounding reliability of circuit components in electronic products. However, due to the overflow and fluidity of the glue itself, the conduction effect of the conductive glue material on extremely small apertures is not ideal, and there will be a situation where the conduction resistance value is large, and the resistance after the surface mount technology (SMT) process. The value also increases. Although some new technologies mention the use of the piercing effect of large-particle metal powder to solve this problem or even avoid the design of openings, it is found in practice that the cost of this material is high, and it is difficult to promote it on a large scale. It can only be applied to some high-end products. In addition, due to the large particle size of the conductive particles in the production process, the finished product is required to be thin, making it difficult to guarantee the actual production process technology and yield.

In addition, the conductive adhesive products currently developed in the industry are generally only suitable for the pressure transfer and general fast pressure process of FPC factories. However, due to the more stringent requirements for dimensional stability and appearance of FPC boards, general fast pressure will affect the appearance of FPC boards. , the pressure transmission has a great influence on the dimensional stability of the FPC board, so the FPC factories turn to promote the new process of vacuum fast pressing, which can reduce the impact on the appearance and foot safety during the pressing process through the buffering effect of the vacuum air bag. However, vacuum fast pressing is limited by pressure, which leads to the problem of unstable or insufficient continuity of conductive adhesive products when using this pressing method. Therefore, there is an urgent need to develop a new material.

0.4mm)的情況下獲得優異的導通效果，同時亦可遮蔽外來信號的干擾。而且，在與鋼片等貼合後組成加強部件也可有效防止安裝部位出現變形，並因鋼片挺性較佳而利於FPC零部件安裝搬運等操作。再者，本發明通過同向型與異向型導電黏著劑層的結合及不對稱型結構設計，可在傳壓、一般快壓及真空快壓條件下都獲得較好的小孔徑導通效果，有效解決真空快壓小孔徑導通性不穩或者不足的問題。 The main technical problem solved by the present disclosure is to provide a multi-layer asymmetric conductive cloth tape and a preparation method thereof. The conductive cloth tape and the steel sheet are bonded together to form a reinforcing member, and when they are bonded to the opening position on the FPC, they can pass The combination of the upper and lower anisotropic conductive adhesive layers and the bonding effect of metal particles of different shapes and particle sizes contained in them, so that the ground aperture in the FPC is very small (

0.4mm) to obtain excellent conduction effect, and can also shield the interference of external signals. Moreover, the reinforcing parts formed after bonding with the steel sheet can also effectively prevent the deformation of the installation site, and because of the better stiffness of the steel sheet, it is convenient for the installation and handling of FPC parts. Furthermore, through the combination of the isotropic and anisotropic conductive adhesive layers and the asymmetrical structure design, the present invention can obtain a better small aperture conduction effect under the conditions of pressure transmission, general fast pressure and vacuum fast pressure. Effectively solve the problem of unstable or insufficient continuity of vacuum fast pressure small aperture.

In view of this, the present disclosure provides a multi-layer asymmetric conductive cloth tape, including:

The first conductive adhesive layer, which is an anisotropic conductive adhesive layer, includes first metal conductive particles;

The second conductive adhesive layer, which is a co-directional conductive adhesive layer, includes second metal conductive particles; and

A conductive cloth layer is located between the first conductive adhesive layer and the second conductive adhesive layer, wherein the conductive cloth layer has holes or voids, and at least part of the first metal conductive particles and the second metal are conductive The particles contact each other through the holes or voids.

In a specific embodiment, the shape of the first metal conductive particles is at least one selected from the group consisting of dendritic, needle-like, flake-like and spherical.

In a specific embodiment, the shape of the second metal conductive particles is at least two selected from the group consisting of dendritic shape, needle shape, flake shape and spherical shape.

In a specific embodiment, the shape of the first metal conductive particles includes a dendritic shape, the shape of the second metal conductive particles includes a flake shape and a dendritic shape, and the flake metal conductive particles in the second metal conductive particles and The weight ratio of the dendritic metal conductive particles is 1:2 to 1:4.

In an embodiment, the particle size D90 of the first conductive metal particles is greater than the particle size D90 of the second conductive metal particles.

In a specific embodiment, the particle size of the first conductive metal particles is 25 μm to 55 μm, and the particle size of the second conductive metal particles is 10 μm to 15 μm.

In a specific embodiment, the first conductive adhesive layer and the second conductive adhesive layer are thermosetting adhesive layers including adhesive resin, and the content ratio of the second metal conductive particles in the second conductive adhesive layer is higher than that of the second conductive adhesive layer. higher than the content ratio of the first metal conductive particles in the first conductive adhesive layer.

In a specific embodiment, the content ratio of the first metal conductive particles in the first conductive adhesive layer is 20% by weight to 55% by weight, and the content of the second metal conductive particles in the second conductive adhesive layer is 20% by weight to 55% by weight. The content ratio is 45% by weight to 75% by weight.

In a specific embodiment, the materials of the first and second metal conductive particles are selected from the group consisting of gold, silver, copper, nickel, silver-plated copper, silver-plated nickel, gold-plated copper, gold-plated nickel and alloys thereof. at least one of them.

In a specific embodiment, the material of the first metal conductive particles is nickel or silver-plated nickel, and the material of the second metal conductive particles is nickel, silver-plated copper, silver-plated nickel or gold-plated copper.

In an embodiment, the material of the first metal conductive particles is different from the material of the second metal conductive particles.

In an embodiment, the thickness of the first conductive adhesive layer is greater than the thickness of the second conductive adhesive layer.

In an embodiment, the thickness of the first conductive adhesive layer is 35 μm to 50 μm, and the thickness of the second conductive adhesive layer is 10 μm to 25 μm.

In a specific embodiment, the conductive cloth layer is composed of a grey cloth and a metal plating layer on the surface of the grey cloth. In another embodiment, the metal plating layer is a copper-nickel layer Cu-Ni, a copper-cobalt layer Cu-Co, a copper-tin layer Cu-Sn, a copper-silver layer Cu-Ag, a copper-iron-nickel layer Cu-Fe-Ni, copper-gold layer Cu-Au or copper-plated layer Cu. In another specific embodiment, the metal plating layer is a copper-nickel plating layer Cu-Ni and a copper-silver plating layer Cu-Ag.

The present disclosure further provides the method for the multi-layer asymmetric conductive cloth tape, including:

mixing the first metal conductive particles with an adhesive resin to obtain a first conductive adhesive mixture;

mixing the second metal conductive particles with another adhesive resin to obtain a second conductive adhesive mixture;

coating the first conductive adhesive mixture on the surface of the carrier layer to obtain the first conductive adhesive layer;

pasting the first conductive adhesive layer on the surface of the conductive cloth layer;

coating the second conductive adhesive mixture on the surface of another carrier layer to obtain the second conductive adhesive layer; and

The second conductive adhesive layer is attached on the other surface of the conductive cloth layer.

The beneficial effects of the present disclosure have at least the following points:

0.4mm)的情況下具有良好的導通性能；同時因第二導電黏著劑層中的第二金屬導電粒子的粒徑較小，經壓合後不會造成FPC表面的其他材料層被破壞或有顆粒點凸出，對FPC板材起到保護作用； 1. After the FPC high temperature lamination process, the large particles of the first metal conductive particles in the first conductive adhesive layer can contact the second metal conductive particles in the lower layer through the holes or voids in the conductive cloth layer, and the second metal conductive particles and Ground hole contact can be achieved when the ground hole is very small (

0.4mm), it has good conduction performance; at the same time, due to the small particle size of the second metal conductive particles in the second conductive adhesive layer, other material layers on the FPC surface will not be damaged or damaged after lamination. The particle points are protruding, which protects the FPC sheet;

2. In the conductive cloth tape of the present disclosure, the thickness of the first conductive adhesive layer is 35 μm to 50 μm, the thickness of the second conductive adhesive layer is 10 μm to 25 μm, and the thickness of the first and second conductive adhesive layers and the conductive cloth layer is 10 μm to 25 μm. The total thickness ranges from 45 μm to 60 μm. In actual production, because the conductive cloth layer has a mesh or fibrous structure, the first and second conductive adhesives will penetrate into the holes of the conductive cloth layer, so the actual total thickness will be smaller than that of the conductive cloth layer and the first and second conductive layers. The sum of the thicknesses of the conductive adhesive layers is usually equivalent to the sum of the thicknesses of the first and second conductive adhesive layers. And the thickness will be further reduced after lamination. For example, the thickness of the finished conductive cloth tape is 60μm, and the thickness after lamination is only about 42μm to 45μm;

3. In the present disclosure, through the combination of isotropic and anisotropic conductive adhesives and asymmetric structural design, in the downstream FPC process, no matter under the conditions of pressure transmission, general fast pressure, or vacuum fast pressure, better performance can be obtained. Small aperture conduction effect, effectively solve the problem of unstable or insufficient conduction of small aperture in vacuum fast pressure;

0.4mm)導通性及穩定性不足的缺陷；另一方面，可通過上下層厚度及生產工藝參數的調節，使得該導電布 膠帶之上下層分別與鋼片和FPC結合並經FPC壓合熟化工藝後，於進行剝離測試時的破壞介面會出現在中間的導電布層，不會出現單純導電膠層與FPC或者鋼片結合力不足的問題，大大減少FPC加強零部件在搬運、移動或者運輸過程中脫落的狀況； 4. When the conductive cloth tape of the present disclosure is used, due to the thin conductive cloth layer and good flexibility, after the conductive cloth tape is combined with the steel sheet and subjected to the downstream lamination process, the metal conductive particles in the conductive adhesive layer will pass through the conductive adhesive layer. The holes or voids in the cloth are used to realize the connection of the upper and lower conductive particles and the adhesive. Due to the relatively high content of the metal conductive particles in the lower layer, the probability of the metal conductive particles being in contact with the surface of the FPC is greatly increased, which can effectively solve the problems encountered in the FPC process. Very small aperture (

0.4mm) the defect of insufficient continuity and stability; on the other hand, the upper and lower layers of the conductive cloth tape can be combined with the steel sheet and FPC respectively through the adjustment of the thickness of the upper and lower layers and the production process parameters, and then undergo the FPC pressing and curing process. After the peeling test, the damaged interface will appear in the middle conductive cloth layer, and there will be no problem of insufficient bonding force between the conductive adhesive layer and the FPC or steel sheet, which greatly reduces the handling, moving or transportation of FPC reinforced parts. the condition of falling off;

5. The conductive cloth layer of the present disclosure uses fiber cloth as the base material, which has good flexibility and wear resistance, and is soft in texture. The design of this intermediate conductive cloth layer greatly improves the problems of insufficient peelability and insufficient adhesion of the conductive adhesive on the market in the FPC process, which makes the FPC easy to fall off;

6. Because of its fibrous or mesh structure, the conductive fabric layer of the present disclosure is conducive to the connection between the upper and lower conductive adhesive layers and the metal conductive particles through the holes or voids therein. In the downstream process of FPC, there will be no explosion after SMT, which can effectively solve the problem of post-SMT explosion encountered by conductive adhesives currently in the market.

100: the first conductive adhesive layer

200: Conductive cloth layer

300: Second conductive adhesive layer

400: carrier layer

FIG. 1 is a schematic structural diagram of an embodiment of the multi-layer asymmetric conductive cloth tape of the present disclosure.

The embodiments of the present disclosure will be described below through specific specific embodiments, and those with ordinary knowledge in the technical field of the present disclosure can easily understand the scope and effect of the present disclosure based on the contents described herein. However, the specific embodiments described herein are not intended to limit the present disclosure. The listed technical features or solutions can be combined with each other. The present disclosure can also be implemented or applied through other different embodiments. The details can also be given different changes or modifications according to different viewpoints and applications without departing from the present disclosure.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present disclosure. Therefore, it has no technical substantive significance, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this disclosure without affecting the effect and purpose of this disclosure. The technical content disclosed by the disclosure shall be within the scope of coverage. At the same time, terms such as "above", "first", "second", etc. quoted in this specification are only for the convenience of description, and are not used to limit the scope of implementation of the present disclosure. Changes or adjustments, provided that there is no substantial change in the technical content, shall also be regarded as the scope of the implementation of this disclosure.

When "comprising", "comprising" or "having" a specific element herein, unless otherwise specified, other elements, components, structures, regions, parts, devices, systems, steps, or connection relationships may be included. , rather than excluding these other elements.

The singular forms "a" and "the" herein also include the plural unless the context clearly dictates otherwise, and the "or" and "and/or" are used interchangeably herein.

The numerical ranges stated herein are inclusive and combinable, and any value falling within the numerical range herein can be taken as the maximum or minimum value to derive the following range; for example, a numerical range of "25 μm to 55 μm” should It is understood to encompass any sub-range between a minimum value of 25 μm and a maximum value of 55 μm, for example: 30 μm to 55 μm, 25 μm to 50 μm, and 30 μm to 50 μm, etc. sub-ranges. Furthermore, if a numerical value falls within each range stated herein (eg, between the maximum value and the minimum value), it should be deemed to be included within the scope of the present disclosure.

The multi-layer asymmetric conductive cloth tape of the present disclosure includes: a first conductive adhesive layer, a second conductive adhesive layer and a conductive cloth layer, the conductive cloth layer is located between the first conductive adhesive layer and the second conductive adhesive between layers, wherein the first conductive adhesive layer includes first metal conductive particles, the second conductive adhesive layer includes second metal conductive particles, and the conductive fabric layer has holes or voids that allow at least A portion of the first and second metal conductive particles are in contact. Multilayer asymmetric type The specific structure of the conductive cloth is shown in FIG. 1 . The multi-layer asymmetric conductive cloth tape includes a first conductive adhesive layer 100 , a second conductive adhesive layer 300 and a conductive cloth layer 200 .

In a specific embodiment, the first conductive adhesive layer is an anisotropic conductive adhesive layer; the second conductive adhesive layer is an isotropic conductive adhesive layer, both of which are different.

In the present disclosure, the shape of the first conductive metal particles in the first conductive adhesive layer is at least one selected from the group consisting of dendritic, needle, flake, and spherical; the shape of the second conductive metal particles is selected from At least two kinds selected from the group consisting of dendritic, needle-like, flake-like and spherical.

In a specific embodiment, the shape of the first metal conductive particles is dendritic, which can ensure that the metal conductive particles conduct in the vertical direction of the conductive cloth tape.

In a specific embodiment, the shapes of the second metal conductive particles are flake-like and dendritic, and the weight ratio of the flake-like metal conductive particles to the dendritic metal conductive particles is 1:2 to 1:4 to ensure that the metal is conductive. The particles have good conductivity in the vertical direction of the conductive cloth tape.

In a specific embodiment, the particle size of the first metal conductive particles is larger than the particle size of the second metal conductive particles.

For example, the particle size of the first metal conductive particles may be 25 μm to 55 μm, such as 25, 26, 27, 28, 29, 30, 32.5, 35, 37.5, 40, 42.5, 45, 47.5, 50, 52.5 or 55 μm . If the particle size of the metal conductive particles is too large (evaluated by D90), it may cause problems with the coating head during the coating process; if the particle size of the metal conductive particles is too small, the connection and contact probability of the upper and lower conductive adhesive layers may be small, and the conduction Resistance stability is not good.

The particle size of the second metal conductive particles may be 10 μm to 15 μm, such as 10, 11, 12, 13, 14 or 15 μm. If the particle size of the conductive metal particles is too large, it may lead to problems with the coating head during the production process, which may lead to problems with the coating head during the coating process; if the particle size of the conductive metal particles is too small, it may lead to the connection between the upper and lower conductive adhesive layers. Small, the stability of the on-resistance is not good.

In a specific embodiment, the first and second conductive adhesive layers are thermosetting adhesive layers including adhesive resin and metal conductive particles. In a specific embodiment, the content ratio of the second metal conductive particles in the second conductive adhesive layer is higher than the content ratio of the first metal conductive particles in the first conductive adhesive layer.

For example, the content ratio of the first metal conductive particles in the first conductive adhesive layer is 20% to 55% by weight, 30% to 50% by weight, or 35% to 50% by weight, such as 20, 22.5 , 25, 27.5, 30, 32.5, 35, 37.5, 40, 42.5, 45, 47.5, 50, 52.5 or 55 wt%. If the content ratio of metal conductive particles is too high, it may lead to too much powder and waste; if the content ratio of metal conductive particles is too low, the conduction effect may be poor.

The content ratio of the second metal conductive particles in the second conductive adhesive layer is 45% to 75% by weight, 50% to 70% by weight, or 55% to 70% by weight, such as 45, 47.5, 50, 52.5 , 55, 57.5, 60, 62.5, 65, 67.5, 70, 72.5 or 75% by weight, the second metal conductive particles and the first metal conductive particles are different in size and shape to enhance the conduction effect.

The adhesive resin can be selected from epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, phenol resin, melamine resin and The polyimide resin constitutes at least one of the group. In one embodiment, the adhesive resin is an acrylic resin. In the present disclosure, the first and second conductive adhesive layers can generally be selected from the same type of adhesive resin to avoid incompatibility problems caused by different adhesive systems.

The materials of the first and second metal conductive particles are at least one selected from the group consisting of gold, silver, copper, nickel, silver-plated copper, silver-plated nickel, gold-plated copper, gold-plated nickel and alloys, or the aforementioned materials and graphite and other conductive compounds are further mixed.

In a specific embodiment, the material of the first metal conductive particles is nickel or silver-plated nickel, and the material of the second metal conductive particles is nickel, silver-plated nickel, silver-plated copper or gold-plated copper.

In an embodiment, the material of the first metal conductive particles is different from the material of the second metal conductive particles. The second metal conductive particles and the first metal conductive particles are also different in material, which can further enhance the conduction effect.

In an embodiment, the thickness of the first conductive adhesive layer is greater than the thickness of the second conductive adhesive layer.

For example, the thickness of the first conductive adhesive layer may be 35 μm to 50 μm, such as 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49 or 50 μm , and the thickness of the second conductive adhesive layer may be 10 μm to 25 μm, such as 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24 or 25 μm.

In the multi-layer asymmetric conductive cloth tape of the present disclosure, the thickness of the conductive cloth layer may be 5 μm to 15 μm, such as 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 or 15 μm. If the conductive cloth layer is too thick, the metal conductive particles in the first and second conductive adhesive layers may not be in contact or have poor contact; if it is too thin, it may be unfavorable for production and increase production costs.

In a specific embodiment, the conductive cloth layer is composed of a grey cloth and a metal plating layer on the surface of the grey cloth, and the metal plating layer can be formed on the surface of the conductive cloth layer by an electroplating process. When the metal conductive particles in the conductive adhesive layer are in contact with each other through the holes or voids of the conductive cloth layer to achieve conduction, the metal plating layer can further ensure the conduction effect.

The metal plating layer may be a copper-nickel plating layer, a copper-cobalt plating layer, a copper-tin plating layer, a copper-silver plating layer, a copper-iron-nickel plating layer, a copper-gold plating layer, a copper-gold plating layer or a copper plating layer. In a specific embodiment, the metal plating layer is a copper-nickel plating layer and a copper-silver plating layer.

In the multi-layer asymmetric conductive cloth tape of the present disclosure, the conductive cloth layer has holes or voids. Specifically, a fiber cloth can be used, and the fiber cloth is a mesh cloth, a plain woven cloth or a non-woven cloth. The fibers can be observed under a microscope. Intricately overlapped to form a fibrous or mesh-like structure with numerous holes or voids of different sizes. The size of the holes or voids is not limited, only the holes or voids need to be available to A small part of the first and second metal conductive particles only need to be in contact with each other, so as to realize the connection between the upper and lower layers. Further, the size of the holes or voids in the fiber cloth can also allow at least part of the metal conductive particles in the first and second conductive adhesive layers to pass through. At the same time, due to the good air permeability of the conductive cloth layer, there will be no explosion phenomenon after SMT in the downstream process of FPC, and the solder resistance is good. On the other hand, the conductive cloth layer is based on ultra-thin fiber cloth, which has good flexibility and wear resistance, which can improve product reliability and mask performance. The whole continuity can be destroyed. The present disclosure, through the design of the intermediate conductive layer, greatly solves the problems of insufficient peeling force and insufficient adhesion in the current market conductive adhesive in the FPC manufacturing process, which causes the FPC to fall off easily.

In a specific embodiment, the multi-layer asymmetric conductive cloth tape of the present disclosure may include a carrier layer, which may cover the first and second conductive adhesive layers. As shown in FIG. 1 , the multi-layer asymmetric conductive The cloth tape includes a carrier layer 400 .

In an embodiment, the carrier layer can be a release layer or a low-adhesion carrier layer, and the thickness thereof can be 25 μm to 100 μm. In a specific embodiment, the release layer is a release film or a release paper, which can be a PET fluoroplastic release layer, a PET silicone oil release layer, a PET matte release layer, a PE release layer or a PE coated paper. Floor. In a specific embodiment, the release layer is a double-sided release layer or a single-sided release layer, preferably a double-sided release film layer.

The color of the release film (paper) can be pure white, milky white or transparent, preferably pure white or milky white, among which white double-sided PET release film is the best. The digital control automation equipment uses infrared induction when engraving lines. Because white has no reflected light problem, it can quickly and accurately locate. In manual work, the white color also has the function of identification, which can prevent artificial leakage and tearing. If the release paper is selected, it is required that the release paper and the conductive adhesive layer of the product are well attached and easy to peel off, and it is sufficient that there is no falling off during transportation.

The present disclosure provides a method for preparing the multi-layer asymmetric conductive cloth tape, comprising the following steps:

uniformly mixing the first metal conductive particles and the adhesive resin to obtain a first conductive adhesive mixture;

uniformly mixing the second metal conductive particles and the adhesive resin to obtain a second conductive adhesive mixture;

coating a first conductive adhesive mixture on the surface of the carrier layer to obtain a first conductive adhesive layer;

attaching a first conductive adhesive layer on the surface of the conductive cloth layer;

coating the second conductive adhesive mixture on the surface of the other carrier layer to obtain a second conductive adhesive layer;

attaching a second conductive adhesive layer on the other surface of the conductive cloth layer; and

Curing, winding and slitting, that is, the finished product of multi-layer asymmetric conductive cloth tape.

Examples and Comparative Examples

The multi-layer asymmetric conductive cloth tape is obtained by the aforementioned preparation method, and the parameters are listed in Table 1 in detail. Conduct continuity analysis and test on the conductive cloth tape after peeling off the upper and lower carrier layers (release layers). It is cured by general fast pressure and vacuum fast pressure respectively, and the continuity resistance value is tested with a high bridge tester. In addition, the commercially available general conductive adhesive products were measured by the same test method as a comparative example. The measurement results of Examples and Comparative Examples are recorded in Table 1 below.

Table 1

0.4mm)條件下確實展現更優異的導電效果，且穩定性及接著強度亦佳。相較之下，一般導電膠產品在小孔徑的條件下，其導通性明顯較差，甚至不導通。 As can be seen from Table 1 above, the asymmetric conductive cloth tape of the present disclosure has small holes (

0.4mm), it does show more excellent conductive effect, and the stability and bonding strength are also good. In contrast, the conductivity of general conductive adhesive products is obviously poor or even non-conductive under the condition of small aperture.

100: the first conductive adhesive layer

200: Conductive cloth layer

300: Second conductive adhesive layer

400: carrier layer

Claims (15)

A multi-layer asymmetric conductive cloth tape, comprising: The first conductive adhesive layer, which is an anisotropic conductive adhesive layer, includes first metal conductive particles; The second conductive adhesive layer, which is a co-directional conductive adhesive layer, includes second metal conductive particles; and A conductive cloth layer is located between the first conductive adhesive layer and the second conductive adhesive layer, wherein the conductive cloth layer has holes or voids, and at least part of the first metal conductive particles and the second metal are conductive The particles contact each other through the holes or voids. The multilayer asymmetric conductive cloth tape according to claim 1, wherein the shape of the first metal conductive particles is at least one selected from the group consisting of dendritic, needle-like, flake-like and spherical. The multi-layer asymmetric conductive cloth tape according to claim 1, wherein the shape of the second metal conductive particles is at least two selected from the group consisting of dendritic, needle-like, flake-like and spherical. The multilayer asymmetric conductive cloth tape according to claim 1, wherein the shape of the first metal conductive particles includes a dendritic shape, the shape of the second metal conductive particles includes a flake shape and a dendritic shape, and the second metal conductive particles The weight ratio of the sheet metal conductive particles and the dendritic metal conductive particles in the particles is 1:2 to 1:4. The multi-layer asymmetric conductive cloth tape according to claim 1, wherein the particle diameter D90 of the first metal conductive particles is greater than the particle diameter D90 of the second metal conductive particles. The multi-layer asymmetric conductive cloth tape according to claim 5, wherein the particle diameter of the first metal conductive particles is 25 μm to 55 μm, and the particle diameter of the second metal conductive particles is 10 μm to 15 μm. The multi-layer asymmetric conductive cloth tape according to claim 1, wherein the first conductive adhesive layer and the second conductive adhesive layer are thermosetting adhesive layers comprising adhesive resin, and the second conductive adhesive layer The content ratio of the second metal conductive particles is higher than the content ratio of the first metal conductive particles in the first conductive adhesive layer. The multi-layer asymmetric conductive cloth tape according to claim 7, wherein the content ratio of the first metal conductive particles in the first conductive adhesive layer is 20% by weight to 55% by weight, and the second conductive adhesive The content ratio of the second metal conductive particles in the layer is 45% by weight to 75% by weight. The multi-layer asymmetric conductive cloth tape according to claim 1, wherein the materials of the first metal conductive particles and the second metal conductive particles are selected from the group consisting of gold, silver, copper, nickel, silver-plated copper, silver-plated nickel, At least one of gold-plated copper, gold-plated nickel and alloys thereof. The multi-layer asymmetric conductive cloth tape according to claim 9, wherein the material of the first metal conductive particles is nickel or silver-plated nickel, and the material of the second metal conductive particles is nickel, silver-plated copper, silver-plated Nickel or gold plated copper. The multi-layer asymmetric conductive cloth tape of claim 10, wherein the material of the first metal conductive particles is different from the material of the second metal conductive particles. The multilayer asymmetric conductive cloth tape of claim 1, wherein the thickness of the first conductive adhesive layer is greater than the thickness of the second conductive adhesive layer. The multilayer asymmetric conductive cloth tape of claim 12, wherein the thickness of the first conductive adhesive layer is 35 μm to 50 μm, and the thickness of the second conductive adhesive layer is 10 μm to 25 μm. The multi-layer asymmetric conductive cloth tape according to claim 1, wherein the conductive cloth layer is composed of a grey cloth and a metal plating layer on the surface of the grey cloth. A method for preparing the multi-layer asymmetric conductive cloth tape as claimed in claim 1, comprising: mixing the first metal conductive particles with an adhesive resin to obtain a first conductive adhesive mixture; mixing the second metal conductive particles with another adhesive resin to obtain a second conductive adhesive mixture; coating the first conductive adhesive mixture on the surface of the carrier layer to obtain the first conductive adhesive layer; pasting the first conductive adhesive layer on the surface of the conductive cloth layer; coating the second conductive adhesive mixture on the surface of another carrier layer to obtain the second conductive adhesive layer; and The second conductive adhesive layer is attached on the other surface of the conductive cloth layer.

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