TW202234959A - 半加成工法用積層體及使用其之印刷配線板 - Google Patents

半加成工法用積層體及使用其之印刷配線板 Download PDF

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Publication number
TW202234959A
TW202234959A TW110140955A TW110140955A TW202234959A TW 202234959 A TW202234959 A TW 202234959A TW 110140955 A TW110140955 A TW 110140955A TW 110140955 A TW110140955 A TW 110140955A TW 202234959 A TW202234959 A TW 202234959A
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TW
Taiwan
Prior art keywords
layer
silver
group
mentioned
semi
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TW110140955A
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English (en)
Chinese (zh)
Inventor
深澤憲正
冨士川亘
村川昭
白髪潤
Original Assignee
日商Ｄｉｃ股份有限公司
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Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202234959A publication Critical patent/TW202234959A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW110140955A 2020-11-05 2021-11-03 半加成工法用積層體及使用其之印刷配線板 TW202234959A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184977 2020-11-05
JPJP2020-184977 2020-11-05

Publications (1)

Publication Number Publication Date
TW202234959A true TW202234959A (zh) 2022-09-01

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ID=81457868

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Application Number Title Priority Date Filing Date
TW110140955A TW202234959A (zh) 2020-11-05 2021-11-03 半加成工法用積層體及使用其之印刷配線板

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JP (1) JPWO2022097484A1 (https=)
TW (1) TW202234959A (https=)
WO (1) WO2022097484A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026004596A1 (ja) * 2024-06-25 2026-01-02 太陽ホールディングス株式会社 第１積層構造体、第２積層構造体、及びプリント配線板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4011968B2 (ja) * 2002-05-14 2007-11-21 富士通株式会社 配線基板およびその製造方法ならびに導体張板
JP6274609B2 (ja) * 2012-04-19 2018-02-07 アキレス株式会社 両面回路基板の製造方法
CN111492722A (zh) * 2018-06-26 2020-08-04 Dic株式会社 印刷电路板用层叠体和使用其的印刷电路板
CN112219459B (zh) * 2018-06-26 2024-06-28 Dic株式会社 具有金属图案的成型体的制造方法

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JPWO2022097484A1 (https=) 2022-05-12
WO2022097484A1 (ja) 2022-05-12

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