TW202233699A - 樹脂組成物、表面之保護方法以及被加工物之加工方法 - Google Patents
樹脂組成物、表面之保護方法以及被加工物之加工方法 Download PDFInfo
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Abstract
[課題]提供一種新技術,其在隔著表面保護薄片對被保持台保持之晶圓實施加工時,防止起因於表面保護薄片的表面不平坦之加工不良,且可在加工後容易地從晶圓剝離表面保護薄片。[解決手段]一種樹脂組成物,其用於在被加工物隔著表面保護薄片形成樹脂層,且包含:(甲基)丙烯酸酯、鏈轉移劑及光聚合起始劑。
Description
本發明是關於一種用於形成保護被加工物的表面之保護層的樹脂組成物以及被加工物之加工方法。
以往,例如如專利文獻1所公開,已知一種表面保護薄片,其保護被背面研削之晶圓的表面。
藉由在此種表面保護薄片的表面形成糊層,且將糊層黏貼在晶圓的表面,而藉由黏著力將表面保護薄片與晶圓一體化。
但是,尤其是在晶圓的表面形成有元件之情形中,若表面保護薄片的糊殘留於元件,則即使在之後的清洗步驟也難以去除糊,而有會使元件損傷的疑慮。再者,尤其是在元件表面形成有凸塊等突起電極之情形,難以去除附著於凸塊的根部之糊,而可能會引起安裝不良等問題。
[習知技術文獻]
[專利文獻]
[專利文獻1]日本特開2017-85122號公報
[發明所欲解決的課題]
於是,考慮利用不具有糊層之表面保護薄片。但是,在凸塊的高度大於表面保護薄片的厚度之情形等中,黏貼於晶圓之表面保護薄片的表面不平坦,而會形成凹凸。假若,於在此狀態下隔著表面保護薄片以保持台保持晶圓之情形中,因已露出之晶圓的上表面高度不均一,故擔心在加工晶圓的背面側時會產生各式各樣的問題。
具體而言,會擔心產生下述等不良狀況:在經背面研削之晶圓產生厚度偏差;在已進行SD加工(隱形切割(註冊商標)加工)之情形所形成之改質層產生高度偏差,而在之後的分割步驟會產生未被分割的區域等;在由刀片或雷射等所形成之槽的深度產生偏差。
於此,考慮在表面保護薄片上層積樹脂層,填埋晶圓的表面上由凸塊等所形成之凹凸,藉此使表面保護薄片的表面平坦,而使晶圓的上表面高度均一。
但是,擔心在加工後剝離表面保護薄片時,表面保護薄片與樹脂層分離,而導致僅樹脂層剝離。此情形,表面保護薄片會持續黏貼在晶圓,而導致無法將表面保護薄片整體從晶圓剝離。
並且,即使在利用具有糊層之表面保護薄片之情形中,也要求表面保護薄片不與樹脂層分離,並使表面保護薄片整體從晶圓剝離。
因此,本發明之目的在於提供一種新技術,其在隔著表面保護薄片對被保護台保持之晶圓實施加工時,防止起因於表面保護薄片的表面不平坦之加工不良,且可在加工後容易地從晶圓剝離表面保護薄片。
[解決課題的技術手段]
根據本發明之一態樣,提供一種樹脂組成物,其用於在被加工物隔著表面保護薄片形成樹脂層,且包含:(甲基)丙烯酸酯、鏈轉移劑及光聚合起始劑。
較佳為,該樹脂組成物中之該鏈轉移劑的含量相對於該光聚合起始劑為0.4~5倍。
較佳為,該鏈轉移劑為硫醇。
根據本發明之另一態樣,提供一種表面之保護方法,其係使用樹脂組成物之被加工物的一側的表面之保護方法,且具備:表面保護薄片密接步驟,其使該表面保護薄片密接於被加工物的該表面;及保護層形成步驟,其將該樹脂組成物供給至該表面保護薄片上,且將光照射至該樹脂組成物使其硬化而形成樹脂層,在被加工物的該表面形成至少具有該表面保護薄片與該樹脂層之保護層。
根據本發明之又另一態樣,提供一種被加工物之加工方法,其係使用樹脂組成物的被加工物之加工方法,且具備:表面保護薄片密接步驟,其使該表面保護薄片密接於被加工物的該表面;保護層形成步驟,其將該樹脂組成物供給至該表面保護薄片上,且將光照射於該樹脂組成物使其硬化而形成樹脂層,在被加工物的該表面形成至少具有該表面保護薄片與該樹脂層之保護層;薄化加工步驟,其以保持台保持該保護層測,且將被加工物的背面側進行加工並薄化;及剝離步驟,其使該保護層從被加工物的表面剝離。
[發明功效]
在本發明中,藉由密接於被加工物的表面之表面保護薄片與層積於表面保護薄片之樹脂層而形成保護層。樹脂層係由包含(甲基)丙烯酸酯、鏈轉移劑及光聚合起始劑之樹脂組成物所形成。藉此,即使在表面保護薄片的表面形成凹凸,也可藉由樹脂層而吸收凹凸,可平坦地形成保護層的表面。並且,可使表面保護薄片與樹脂層穩固地一體化,而可使兩者不分離且一體地從晶圓剝離。
以下,參照隨附圖式,說明本發明實施方式。圖1為表示被加工物的一例亦即晶圓10者。晶圓10是將矽作為母材之半導體晶圓,在圓板狀的晶圓10的表面10a中,在藉由多條切割道12而劃分成格子狀之多個區域形成有IC或LSI等元件14。
如圖1的放大部分所示,在各元件14的周緣部分形成有從晶圓10的表面10a突出之多個凸塊16(電極),藉由此凸塊16而在晶圓10的表面10a形成凹凸。此外,於在切割道12形成TEG(Test Element Group,測試元件組)之情形中,也藉由此TEG而在晶圓10的表面10a形成凹凸。
作為本發明的加工對象之被加工物,除了圖1所示之方式以外,還有各種被加工物,不僅是半導體晶圓,光元件晶圓或樹脂基板、玻璃、陶瓷等也成為加工對象,且不受限於此等。
關於如以上般的在表面10a形成由凸塊10所導致的凹凸之晶圓10,針對在表面10a形成保護層之方法進行說明。在以下的實施方式中,依序實施圖2所示之流程圖的各步驟。
<表面保護薄片密接步驟>
如圖1及圖3(A)(B)所示,為以下步驟:使表面保護薄片20密接於被加工物亦即晶圓10的表面10a。表面保護薄片20是由PO(聚烯烴)、PVC(聚氯乙烯)、PET(聚對苯二甲酸乙二酯)、聚偏二氯乙烯(PVDC)、PE(聚乙烯)等所構成之薄片狀的構件,PO因對凸塊16的凹凸的追隨性良好,故特別適合使用。
表面保護薄片20的背面20b係與晶圓10的表面10a密接,且預定在之後被剝離。表面保護薄片20的背面20b不形成發揮黏著力之糊層,可使用表面保護薄片20不會黏貼於晶圓10的表面10a的元件14或凸塊16者。
此外,也可為在表面保護薄片20的背面20b的整面或一部分形成發揮黏著力之糊層者。例如,可在表面保護薄片20的背面20b中,以沿著晶圓10的外周緣的方式形成環狀的糊層,且在形成元件14之區域的外側的區域中,透過糊層而使表面保護薄片20接著於晶圓10。
在本實施方式中,如圖3(A)所示,設為使表面保護薄片20的背面20b覆蓋於晶圓10的表面10a之狀態,並將晶圓10安裝在真空安裝裝置3的真空腔室30內的加熱台32上。接著,使真空腔室30內與真空源34連通而進行抽真空,且以加熱台32加熱晶圓10而使表面10a的溫度上升。藉此,如圖3(B)所示,已軟化之表面保護薄片20一邊沿著凸塊16等凹凸一邊密接於晶圓10的表面10a。
如圖3(B)所示,表面保護薄片20雖會形成沿著凸塊16等凹凸之凹凸,但藉由後述之樹脂層50(圖5(B))會解決此凹凸。
此外,如圖3(A)所示,除了藉由以加熱台32加熱晶圓10而使表面保護薄片20軟化以外,也可藉由直接加熱表面保護薄片20之加熱器或燈,而使表面保護薄片20軟化。
<保護層形成步驟>
如圖4及圖5(A)(B)所示,為以下步驟:將樹脂組成物5供給至表面保護薄片20上,且將光照射至樹脂組成物5使其硬化而形成樹脂層50,在被加工物亦即晶圓10的表面10a形成至少具有表面保護薄片20與樹脂層50之保護層6。
具體而言,如圖4所示,首先,設為以下狀態:在工作台40的平坦的支撐面40a上配設使紫外線穿透之薄膜41,並在薄膜41的上表面載置預定量的樹脂組成物5。樹脂組成物5如後述般為可無間隙地進入形成於表面保護薄片20之凹凸的狀態者,除了設為黏度高且具有流動性之液體者以外,也可使用無定形性的凝膠狀者、能變形的固體(片狀的凝膠等)者。此外,也可不使用薄膜41,而設為直接將樹脂組成物5載置於工作台40的支撐面40a之狀態。
工作台40係以玻璃等透明構件所構成,且為使從配置於下方之光照射器46的光源46a所照射之紫外線穿透者。光源46a可利用照射預定波長的紫外線之LED燈(或低壓水銀燈等)所構成。
薄膜41可利用使紫外線穿透之樹脂而構成,例如,可利用PET(聚對苯二甲酸乙二酯)而構成。並且,薄膜41也可使用藉由與樹脂組成物5相同之樹脂預先成形成片狀者。
接著,設為已藉由晶圓保持單元60的吸附保持面62保持晶圓10的背面10b之狀態,並將表面保護薄片20配置於下側。吸附保持面62連通吸引源63,且藉由負壓而吸附保持晶圓10的背面10b。表面保護薄片20被配置於下側,成為與載置於薄膜41之樹脂組成物5對向的狀態。晶圓保持單元60的吸附保持面62被構成為與工作台40的平坦的支撐面40a成為平行。
接著,如圖5(A)所示,使晶圓保持單元60下降,藉此以表面保護薄片20將樹脂組成物5推壓展開,而成為以樹脂組成物5填埋表面保護薄片20與薄膜41之間的間隙之狀態。如圖5(B)所示,樹脂組成物5無間隙地進入形成於表面保護薄片20之凹凸。
接著,如圖5(A)所示,將來自光源46之預定波長的紫外線透過工作台40及薄膜41而照射至樹脂組成物5。藉此,樹脂組成物5藉由紫外線而硬化並形成樹脂層50。
如以上般進行,如圖5(B)所示,在被加工物亦即晶圓10的表面10a形成具有表面保護薄片20與樹脂層50之保護層6。在本實施方式中,成為薄膜41已層積於保護層6之狀態,薄膜41的下表面41a係以沿著工作台40的支撐面40a的方式成為平坦。也可將薄膜41作為保護層6的構成要素,由表面保護薄片20、樹脂層50、薄膜41這三層構成保護層6。
此外,如圖6(A)(B)所示,在表面保護薄片密接步驟中,也可使已與環狀框架24一體化之表面保護薄片20密接於晶圓10。此情形,環狀框架24與表面保護薄片20係藉由配置於比晶圓10的位置更外側之糊層26而一體化。
然後,如圖7及圖8(A)所示,在保護層形成步驟中,使樹脂層50層積於已與環狀框架24一體化之表面保護薄片20。然後,如圖8(B)所示,在將樹脂層50層積而形成保護層6後,藉由雷射加工裝置等,切斷表面保護薄片20而分離環狀框架24,藉此如圖8(C)所示,構成已形成保護層6之晶圓10。此外,也可不分離環狀框架24,與晶圓10一體地進行操作處理。
在以上說明的例子中,雖使以晶圓保持單元60保持之晶圓10從上方下降,且將載置於工作台40之樹脂組成物5推壓展開,而在表面保護薄片20與薄膜41之間形成樹脂層50,但也可將晶圓10載置於工作台40並將樹脂組成物5載置於表面保護薄片20,且從樹脂組成物5的上方覆蓋薄膜41而將樹脂組成物5推壓展開。
樹脂組成物5係包含(甲基)丙烯酸酯、鏈轉移劑及光聚合起始劑所構成。所謂(甲基)丙烯酸酯,係指為丙烯酸化合物之丙烯酸酯、或為甲基丙烯酸化合物之甲基丙烯酸酯。(甲基)丙烯酸酯可使用具有胺基甲酸酯鍵(胺基甲酸酯基)者、及/或不具有胺基甲酸酯鍵(胺基甲酸酯基)者。
所謂具有胺基甲酸酯鍵之(甲基)丙烯酸酯,係指在分子內具有胺基甲酸酯基之(甲基)丙烯酸酯。例如,可使用Light acrylate IAA、AT-600、UA-306H、UA-306T、UA-306I、UA-510H、UF-8001G、DAUA-167、UF-07DF(皆為共榮社化學股份有限公司製)、R-1235、R-1220、RST-201、RST-402、R-1301、R-1304、R-1214、R-1302XT、GX-8801A、R-1603、R-1150D、DOCR-102、DOCR-206(皆為第一工業製藥股份有限公司製)、UX-3204、UX-4101、UXT-6100、UX-6101、UX-7101、UX-8101、UX-0937、UXF-4001-M35、UXF-4002、DPHA-40H、UX-5000、UX-5102D-M20、UX-5103D、UX-5005、UX-3204、UX-4101、UX-6101、UX-7101、UX-8101、UX-0937、UXF-4001-M35、UXF-4002、UXT-6100、DPHA-40H、UX-5000、UX-5102D-M20、UX-5103、UX-5105(皆為日本化藥股份有限公司製)。
不具有胺基甲酸酯鍵之(甲基)丙烯酸酯,係指在分子內不具有胺基甲酸酯鍵(胺基甲酸酯基)者。例如,可使用丙烯酸四氫糠酯(tetrahydrofurfuryl acrylate)、丙烯酸異莰酯(isobornyl acrylate)、1,9-壬二醇二丙烯酸酯(1,9-nonanediol diacrylate)等。
作為鏈轉移劑,可使用以下者。1-丁硫醇、3-巰基丙酸環己酯(cyclohexy 3-mercaptopropionate)、1-癸硫醇(1-decanethiol)、2,4-二苯基-4-甲基-1-戊烯、1-十二烷硫醇(1-dodecanthiol)、3-巰基丙酸十二烷酯、巰基乙酸2-乙基己酯(2-ethylhexyl mercaptoacetate)、巰基乙酸乙酯、1-十六烷硫醇、3-巰基丙酸己酯、2-巰基乙醇、3-巰基-1,2-丙二醇、巰基乙酸、2-巰基乙磺酸鈉、3-巰基丙酸、巰基乙酸甲酯、巰基丁二酸、3-巰基丙酸甲酯、3-巰基丙酸十八烷酯、3-巰基丙酸辛酯、1-辛硫醇、1-十八烷硫醇、3-巰基丙酸十三烷酯、苯硫酚等。
其中,特別適合使用1-十二烷硫醇。
光聚合起始劑為用於使樹脂組成物5的光(紫外線)聚合開始者,可使用以下者。1-羥基環己基苯基酮(1-hydroxycyclohexyl phenyl ketone)(例如,BASF公司製的Irgacure(註冊商標)184等)、α-羥基烷基苯基酮(α-hydroxyalkyl phenone)(例如,IGM Resins B.V.公司製的Omnirad(註冊商標)184等)等。此外,光聚合起始劑的份量在可維持樹脂組成物5的硬化性之範圍內任意地調整。
鏈轉移劑為用於使鏈轉移反應產生者。在本實施方式中,鏈轉移劑以切斷(甲基)丙烯酸酯彼此的反應之方式發揮功能,減少(甲基)丙烯酸酯的表觀分子量。由於將小單位的(甲基)丙烯酸酯彼此鍵結,故可使已硬化之樹脂組成物5的黏著力(黏力)提升。藉此,可造成以下狀況:藉由樹脂組成物5所形成之樹脂層50與表面保護薄片20被穩固地一體化,互相難以剝離。
作為樹脂組成物5的配合比率的一例,例如可設為以下。
(甲基)丙烯酸酯為80質量%以上且99.4質量%以下;
鏈轉移劑為0.5質量%以上且15質量%以下;
光聚合起始劑為0.1質量%以上且5質量%以下。
此外,關於(甲基)丙烯酸酯,例如可使用具有胺基甲酸酯鍵之(甲基)丙烯酸酯與不具有胺基甲酸酯鍵之(甲基)丙烯酸酯的質量%的比率為1:1者。
再者,在樹脂組成物5中之鏈轉移劑的含量較佳為相對於光聚合起始劑為0.4~5倍。其原因在於,若光聚合起始劑的含量過多,則會使含有鏈轉移劑的效果(黏著力的提升)降低。另一方面,其原因在於要防止以下情況:若鏈轉移劑的含量過多,則鏈轉移反應會頻繁發生,而變得難以進行紫外線硬化。
<薄化加工步驟>
如圖9(A)(B)所示,為以下步驟:以保持台70保持保護層6,且將晶圓10的背面10b側進行加工並薄化。
具體而言,將晶圓10的保護層6作為下側,將晶圓10載置於研削裝置的保持台70的吸引保持面72,並露出晶圓10的背面10b。使具有研削磨石74a之研削輪74旋轉,且將研削輪74往下方進行研削進給,藉此以研削磨石74a將晶圓10的背面10b研削至預定的厚度為止。此時,亦旋轉保持台70,晶圓10一邊旋轉一邊被研削。
在此薄化加工步驟時,因薄膜41的下表面41a成為平坦,故載置於平坦的吸引保持面72之晶圓10的背面10b亦成為平坦,而可使晶圓10的上表面高度(背面10b的高度)均一。藉此,可均一地薄化晶圓10,而可將晶圓10的厚度均一地完工。
此外,除了藉由使用研削磨石74a之研削加工進行薄化以外,也可藉由使用研磨墊之研磨加工或使用切割工具之切割加工進行薄化。
<剝離步驟>
如圖10(A)(B)所示,為以下步驟:使保護層6從晶圓10的表面10a剝離。
具體而言,如圖10(A)(B)所示,將晶圓10從研削裝置的保持台70(圖9(B))卸除並使其正反翻轉,將晶圓10的背面10b載置於剝離裝置的保持台80的吸引保持面82,並使保護層6露出。保持台80的吸引保持面82係與吸引源83連通,並藉由產生於吸引保持面82之負壓而吸引保持晶圓10的背面10b。
接著,將剝離用的剝離膠膜(peel tape)84貼附於保護層6,且以構成剝離裝置之夾具81拉扯剝離膠膜84,藉此使保護層6從晶圓10剝離。
如以上般進行,如圖11(A)所示,形成於晶圓10的表面10a之保護層6剝離,成為如圖11(B)所示之狀態。此時,因晶圓10的表面10a被表面保護薄片20覆蓋,故樹脂組成物5(樹脂層50)不會殘留於晶圓10的表面10a,並且,因表面保護薄片20上不存在糊層,故可容易地使表面保護薄片20剝離,而能防止在晶圓10的表面10a殘留異物。
如上述,在本發明中,藉由密接於被加工物的表面之表面保護薄片與層積於表面保護薄片之樹脂層而形成保護層。樹脂層係由包含(甲基)丙烯酸酯、鏈轉移劑及光聚合起始劑之樹脂組成物所形成。藉此,即使在表面保護薄片的表面形成凹凸,也可藉由樹脂層吸收凹凸,而可平坦地形成保護層的表面。並且,可將表面保護薄片與樹脂層穩固地一體化,而可使兩者不分離且一體地從晶圓剝離。
5:樹脂組成物
6:保護層
10:晶圓
10a:表面
10b:背面
12:切割道
14:元件
16:凸塊
20:表面保護薄片
20b:背面
24:環狀框架
26:糊層
30:真空腔室
32:加熱台
34:真空源
40:工作台
40a:支撐面
41:薄膜
46:光照射器
46a:光源
50:樹脂層
60:晶圓保持單元
62:吸附保持面
70:保持台
72:吸引保持面
74:研削輪
74a:研削磨石
80:保持台
81:夾具
82:吸引保持面
84:剝離膠膜
圖1為表示被加工物的一例亦即晶圓之圖。
圖2為本發明的一實施方式之流程圖。
圖3(A)為表示由真空安裝裝置所進行之表面保護薄片的密接之剖面圖;圖3(B)為表示已使表面保護薄片密接於晶圓的表面之狀態之放大剖面圖。
圖4為表示保護層形成步驟之剖面圖。
圖5(A)為表示使樹脂組成物硬化之狀況之剖面圖;圖5(B)為表示已在晶圓的表面形成保護層之狀況之放大剖面圖。
圖6(A)為表示在表面保護薄片密接步驟中利用環狀框架之例子之剖面圖;圖6(B)為表示由真空安裝裝置所進行之表面保護薄片的密接之剖面圖。
圖7為表示保護層形成步驟的另一例之剖面圖。
圖8(A)為表示使樹脂組成物硬化之狀況之剖面圖;圖8(B)為表示已在晶圓的表面形成保護層之狀況之剖面圖;圖8(C)為已卸除環狀框架之狀態之剖面圖。
圖9(A)為表示已將晶圓的保護層配置在下側之狀態之剖面圖;圖9(B)為表示薄化加工步驟之剖面圖。
圖10(A)為表示將經薄化之晶圓載置於剝離裝置的保持台之剖面圖;圖10(B)為表示剝離步驟之剖面圖。
圖11(A)為表示在剝離步驟中保護層剝離之過程之剖面圖;圖11(B)為表示保護層被剝離後的狀態之剖面圖。
5:樹脂組成物
10:晶圓
10a:表面
10b:背面
20:表面保護薄片
40:工作台
40a:支撐面
41:薄膜
46:光照射器
46a:光源
60:晶圓保持單元
62:吸附保持面
63:吸引源
Claims (5)
- 一種樹脂組成物,其用於在被加工物隔著表面保護薄片形成樹脂層,且包含: (甲基)丙烯酸酯; 鏈轉移劑;及 光聚合起始劑。
- 如請求項1之樹脂組成物,其中,該樹脂組成物中之該鏈轉移劑的含量相對於該光聚合起始劑為0.4~5倍。
- 如請求項1或2之樹脂組成物,其中,該鏈轉移劑為硫醇。
- 一種表面之保護方法,其係使用如請求項1至3中任一項之樹脂組成物之被加工物的一側的表面之保護方法,且具備: 表面保護薄片密接步驟,其使該表面保護薄片密接於被加工物的該表面;及 保護層形成步驟,其將該樹脂組成物供給至該表面保護薄片上,且將光照射至該樹脂組成物使其硬化而形成樹脂層,在被加工物的該表面形成至少具有該表面保護薄片與該樹脂層之保護層。
- 一種被加工物之加工方法,其係使用如請求項1至3中任一項之樹脂組成物的被加工物之加工方法,且具備: 表面保護薄片密接步驟,其使該表面保護薄片密接於被加工物的表面; 保護層形成步驟,其在實施該表面保護薄片密接步驟後,將該樹脂組成物供給至該表面保護薄片上,且將光照射至該樹脂組成物使其硬化而形成樹脂層,在被加工物的該表面形成至少具有該表面保護薄片與該樹脂層之保護層; 薄化加工步驟,其在實施該保護層形成步驟後,以保持台保持該保護層側,且將被加工物的背面側進行加工並薄化;及 剝離步驟,其在實施該加工步驟後,使該保護層從被加工物的該表面剝離。
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