TW202230577A - Substrate bonding apparatus and substrate bonding method - Google Patents

Abstract

The invention provides a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus and a substrate bonding method capable of reducing bonding defects of substrates while bonding the substrates to each other. The substrate bonding apparatus comprises a chamber, a first chuck disposed inside the chamber for sucking a first substrate; a second chuck disposed inside the chamber in a manner facing toward the first chuck and arranged opposite to the first chuck and capable of relative moving in vertical and horizontal directions for sucking a second substrate; and an arranging module having a camera unit capable of identifying the first sort key of the first substrate and the second sort key of the second substrate, and configured with a frame capable of moving up and down.

Description

Substrate bonding apparatus and substrate bonding method

The present invention relates to a board bonding apparatus and a board bonding method, and more particularly, to a board bonding apparatus and a board bonding method that reduce bonding defects of the boards when the boards are bonded to each other.

Recently, with the development of technology and industry, there has been an increasing demand for high integration of semiconductor devices or substrates (hereinafter referred to as "substrates"). In this case, when a highly integrated substrate is arranged in a horizontal plane and is commercialized by wiring connection, problems such as increase in wiring length, increase in wiring impedance, and wiring delay arise.

Therefore, a three-dimensional integration technique using three-dimensional stacking of substrates has been proposed. In this three-dimensional integration technique, for example, bonding of the upper and lower substrates is performed using a bonding apparatus.

In order to join the upper and lower substrates, it is important to arrange the upper and lower substrates, and for this, in the case of the prior art device, there are upper and lower cameras.

The lower substrate is recognized by the upper camera to calculate the coordinates, the upper substrate is recognized by the lower camera to calculate the coordinates, and the upper and lower substrates are moved and arranged along the coordinates.

However, in the case of the device of the prior art, when the upper camera and the lower camera are accurately arranged on the vertical line, the coordinate error of the upper and lower substrates does not occur. However, in the case of the prior art device, the upper and lower cameras are repeatedly moved in the horizontal or vertical direction, and the vertical alignment of the upper and lower cameras is displaced or distorted, resulting in frequent coordinate errors.

Furthermore, in the conventional apparatus, the vertical alignment of the upper camera and the lower camera depends on the manual work of the operator, and the deviation of the vertical alignment greatly occurs depending on the skill of the operator, and the vertical alignment is performed by manual work. , and greatly reduce the efficiency of the joint device.

[Technical problem to be solved by invention]

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate bonding apparatus and a substrate bonding method in which the substrate bonding apparatus for mutually bonding substrates performs the vertical alignment step of vertically arranging the camera units for recognizing the sorting keys of the substrates to reduce the sorting order. The coordinate error of the key. [Technical solution for problem solving]

The object of the present invention as described above is achieved by a substrate bonding device, the substrate bonding device includes: a cavity; a first chuck arranged inside the cavity to adsorb the first substrate; and a second chuck to face the The first chuck is arranged inside the cavity, and is arranged in a vertical and horizontal direction relative to the first chuck to adsorb the second substrate; and an arrangement module has the function of identifying the first chuck. The camera unit of the first sorting key of the substrate and the second sorting key of the second substrate is provided with a frame that can move up and down.

Here, the camera unit is movably arranged relative to the frame.

In addition, the camera unit can be moved and tilted in the horizontal direction of the frame.

Further, the frame includes: a pair of vertical members, which are arranged at a predetermined interval; At least one of the members is arranged to be movable up and down relative to the vertical member.

In addition, the camera unit includes: a first camera unit, which identifies the second sorting key; and a second camera unit, which identifies the first sorting key and is disposed opposite to the first camera unit.

Further, the pair of leveling members includes a first leveling member and a second leveling member, the first camera unit is provided on the first leveling member, and the second camera unit is provided on the second leveling member .

In addition, the camera unit is provided with: a moving plate, which can be moved horizontally relative to the frame; a recognition camera, arranged on the moving plate to identify the first sorting key or the second sorting key; and a sorting camera, for the arrangement of the moving plate.

Also, the moving plate can be disposed obliquely with respect to the frame.

Moreover, the mobile board is further provided with a camera sorting key, which is identified by the sorting camera of the relative camera unit.

In addition, a hollow portion is formed in the center of the frame so that the first chuck and the second chuck can be moved.

In addition, the object of the present invention as described above relates to a substrate bonding method including a frame; a substrate bonding apparatus in which a first camera unit and a second camera unit are provided on the frame, the substrate bonding method comprising the steps of using the first camera unit and the second camera unit. Two camera units are used to identify the first sort key of the first substrate; the first camera unit is used to identify the second sort key of the second substrate; Before the step of identifying the first sort key, or between the step of identifying the first sort key and the step of identifying the second sort key, or after the step of identifying the second sort key, including The vertical alignment step of arranging the first camera unit and the second camera unit in a direction.

In addition, the first camera unit and the second camera unit are installed so as to be movable in a horizontal direction and inclined with respect to the frame, and in the vertical arrangement step, the first camera unit and the second camera unit are arranged to The first camera unit and the second camera unit are arranged in a vertical direction by moving or tilting in the horizontal direction.

Furthermore, between the step of recognizing the first sort key and the step of recognizing the second sort key, an up and down movement step of moving the first camera unit and the second camera unit up and down is also included.

Furthermore, between the step of recognizing the first sorting key and the step of recognizing the second sorting key, the step of moving up and down at least one of the first camera unit and the second camera unit is further included. [Effect of invention]

According to the present invention having the above-described structure, the vertical alignment step of vertically arranging the camera units for recognizing the sorting keys of the substrates is performed in the substrate bonding apparatus for mutually bonding the substrates to reduce the coordinate error of the sorting keys.

Hereinafter, the structure of the substrate bonding apparatus and the substrate bonding method according to the embodiment of the present invention will be specifically described with reference to the accompanying drawings.

1 is a side view of a substrate bonding apparatus 1000 according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the internal structure of the substrate bonding apparatus 1000 shown in FIG. 1 .

Referring to FIGS. 1 and 2 , the substrate bonding apparatus 1000 includes: a cavity 100; a first chuck 520 disposed inside the cavity 100 to adsorb the first substrate 10; and a second chuck 510 to face the The first chuck 520 is arranged inside the cavity 100 , and is arranged to move relative to the first chuck 520 in the vertical and horizontal directions to adsorb the second substrate 20 ; and the arrangement module 200 , the camera units 300A, 300B, 300C, 300D have the first sorting key 12 for identifying the first substrate 10 and the second sorting key 22 for identifying the second substrate 20 , and include a frame 210 that can move up and down.

The cavity 100 internally provides a space 102 for accommodating the first substrate 10 and the second substrate 20 . The cavity 100 includes, for example, a cavity body (not shown) and a cavity guide (not shown) that seals the upper portion of the opening of the cavity body. The structure of the cavity 100 is only used for illustration, and can be appropriately deformed.

Inside the cavity 100 , a first chuck 520 and a second chuck 510 are provided for attracting and fixing the substrates 10 and 20 to be bonded to each other. The first chuck 520 and the second chuck 510 are realized by vacuum chucks, electrostatic chucks, and mechanical clamping chucks. The case of the disk configuration will be described.

The first chuck 520 is disposed inside the cavity 100 at the lower inner side of the alignment module 200 , and the first substrate introduced into the cavity 100 is adsorbed by a robot arm (not shown) or the like. 10 and fixed.

FIG. 3 is a plan view showing the first substrate 10 .

Referring to FIG. 3 , the first substrate 10 is formed with a pattern 14 on the upper surface or the first surface, and a first sorting key 12 for bonding with the second substrate 20 is formed. There are a plurality of the first sort keys 12, and in order to accurately arrange the substrates, they are symmetrically arranged around the center of the substrate. The number and position of the first sorting keys 12 are appropriately modified. In addition, since the second substrate 20 has the same structure as that of the first substrate 10, repeated description is omitted.

Referring to FIG. 1 and FIG. 2 again, the first chuck 520 is adsorbed and fixed on the second surface of the first substrate 10 by negative pressure, that is, the second surface on which the pattern 14 is not formed.

In addition, the second chuck 510 is disposed inside the cavity 100 on the inner upper portion of the alignment module 200 . The second chuck 510 is disposed toward the first chuck 520 . That is, the second chuck 510 is disposed opposite to the first chuck 520 , and is installed to be movable relative to the first chuck 520 in the vertical and horizontal directions. For example, the first chuck 520 and the second chuck 510 can all be moved in vertical and horizontal directions.

The second substrate 20 is turned upside down, that is, the first surface on which the second sorting keys 22 are formed is introduced into the cavity 100 in a downward direction. The second chuck 510 adsorbs and fixes the second surface of the second sorting key 22 on which the second substrate 20 is not formed. In this case, the second sorting keys 22 of the second substrate 20 are disposed toward the first substrate 10 .

In addition, an arrangement module 200 having camera units 300A, 300B, 300C, and 300D is arranged inside the cavity 100 .

The camera units 300A, 300B, 300C, 300D identify the first sorting key 12 of the first substrate 10 and the second sorting key 22 of the second substrate 20 . In this case, the arrangement module 200 has a frame 210 on which the camera units 300A, 300B, 300C, and 300D are installed.

That is, in the present invention, the camera units 300A, 300B, 300C, and 300D are provided on the frame 210 to prevent misalignment or twisting among the camera units 300A, 300B, 300C, and 300D as much as possible.

And, the frame 210 is moved up and down. For this purpose, driving parts 410 and 420 are provided inside the cavity 100 , and the driving parts 410 and 420 are connected to the frame 210 to move up and down.

When the frame 210 moves up and down, the camera units 300A, 300B, 300C, and 300D mounted on the frame 210 move together to minimize errors between the camera units 300A, 300B, 300C, and 300D. wait.

In this case, the camera units 300A, 300B, 300C, 300D include: first camera units 300A, 300B, identifying the second sorting key 22 of the second substrate 20; second camera units 300C, 300D, identifying the The first sort key 12 of the first substrate 10 is disposed opposite to the first camera units 300A and 300B.

The first camera units 300A and 300B are provided as a pair, and as shown in the drawings, are disposed at the lower part of the frame 210 and facing the upper part. In addition, the second camera units 300C and 300D are also provided as a pair, and as shown in the drawings, are arranged on the upper part of the frame 210 and toward the lower part.

FIG. 4 is a front view and a perspective view of the alignment module 200 . FIG. 4(A) is a front view of the arrangement module 200 , and FIG. 4(B) is a perspective view of the arrangement module 200 .

Referring to FIG. 4 , the frame 210 of the arrangement module 200 includes: a pair of vertical members 213 and 214 , which are separated and arranged at a predetermined distance in advance; Ends. In this case, at least one of the pair of horizontal members 211 and 212 is arranged to be movable up and down with respect to the vertical members 213 and 214 .

For example, the first leveling member 212 in the lower part is arranged to move up and down with respect to the pair of vertical members 213 and 214 , or the second leveling member 211 in the upper part can move up and down relative to the pair of vertical members 213 and 214 . configuration. In addition, the first level member 212 and the second level member 211 are all arranged to be movable up and down with respect to the pair of vertical members 213 and 214 . Hereinafter, a description will be given assuming that the first level member 212 is arranged to move up and down.

In addition, the first camera units 300A and 300B are provided on the first level member 212 , and the second camera units 300C and 300D are provided on the second level member 211 . The first camera units 300A and 300B are arranged on the upper surface of the first level member 212 so as to face upward. A pair of 1st camera units 300A and 300B are mutually spaced apart from each other and are arrange|positioned at a predetermined distance.

In addition, the second camera units 300C and 300D are arranged on the lower surface of the second level member 211 so as to face downward. The pair of second camera units 300C and 300D are spaced apart from each other by a predetermined distance therebetween.

As shown above, in order to match the focal length of the first camera unit 300A, 300B or the second camera unit 300C, 300D, the frame 210 itself moves up and down to match the focal length. However, the interior of the substrate bonding apparatus 1000 is generally small, and the vertical movement distance of the frame 210 is insufficient due to other components. In this case, together with the up and down movement of the frame 210, the level members 211 and 212 are moved up and down to match the focal length.

In addition, the distance between the pair of first camera units 300A, 300B and the distance between the pair of second camera units 300C, 300D are the same. Since the first camera units 300A, 300B and the second camera units 300C, 300D are arranged in a vertical line, the coordinates of the first sort key 12 and the second sort key 22 can be accurately identified.

In addition, an opening portion 220 is formed in the central portion of the array module 200 . That is, the opening portion 220 is formed in the center portion of the pair of vertical members 213 and 214 and the horizontal members 211 and 212 . The first chuck 520 and the second chuck 510 are arranged to move in the horizontal direction through the opening portion 220 .

In addition, as described above, when the first camera units 300A, 300B and the second camera units 300C, 300D are installed in the frame 210, the vertical movement of the frame 210 or the leveling member 211, When the 212 moves up and down, a vertical position error of the first camera units 300A, 300B and the second camera units 300C, 300D or the first camera units 300A, 300B and the second camera units 300C, 300D occurs twist. In this case, an error occurs in the coordinate values of the sorting keys of the first substrate 10 and the second substrate 20 , and finally misalignment of the first substrate 10 and the second substrate 20 occurs, resulting in poor bonding.

Therefore, in the present invention, in order to solve this problem, the camera units 300A, 300B, 300C, and 300D can be moved relative to the frame 210 . For example, the camera units 300A, 300B, 300C, and 300D can be moved in the horizontal direction and installed obliquely on the frame 210 . When the camera units 300A, 300B, 300C, and 300D are arranged to move relative to the frame 210, the above-mentioned problems can be solved by vertically aligning the first camera units 300A, 300B and the second camera units 300C, 300D. .

FIG. 5 is a perspective view showing a state of the first camera units 300A and 300B mounted on the frame 210 . FIG. 5(A) shows a pair of first camera units 300A, 300B set in the frame 210, and FIG. 5(B) shows one first camera unit 300A of the pair of first camera units 300A, 300B.

Referring to FIG. 5 , the first camera unit 300A includes: a moving plate 310A that can be moved in a horizontal direction relative to the frame 210 ; a first identifying camera 320A that is disposed on the moving plate 310A to identify the second sequence key 22; and a first sorting camera 330A for the alignment of the moving plate 310A.

The moving plate 310A is provided inside the groove portion 210A of the first leveling member 212 . The moving plate 310A can also be disposed to protrude from the first level member 212, but in the case of the present embodiment, the moving plate 310A is inserted into the groove portion 210A and disposed. In this case, the upper surface of the moving plate 310A is in the same plane as the upper surface of the first leveling member 212 .

In addition, the moving plate 310A is arranged to move in the horizontal direction with respect to the frame 210 . For example, the moving plate 310A is arranged to be linearly movable along the x-axis and the y-axis in the horizontal direction inside the groove portion 210A. For this reason, the groove portion 210A is further formed in the direction of the x-axis and the y-axis as compared with the moving plate 310A on the plane. Thus, the moving plate 310A provides a space for moving along the x-axis and the y-axis direction.

The moving plate 310A is moved in the horizontal direction by a horizontal direction driving unit (not shown) including a linear motor, a piezo actuator, or the like. The structure of the horizontal direction driving unit can be realized in various forms.

In addition, the moving plate 310A can be tilted with respect to the frame 210 . For example, the moving plate 310A can be disposed obliquely around at least one of the x-axis and the y-axis.

The moving plate 310A can be disposed obliquely by a rotation drive unit (not shown). The structure of the rotation driving part is realized in various forms.

In addition, a first recognition camera 320A for recognizing the second sorting key 22 is provided on the moving board 310A.

The first identification camera 320A identifies the second sorting key 22 of the second substrate 20 . Also, as shown in FIG. 4 , the second identification cameras 320C and 320D of the second camera units 300C and 300D identify the first sorting keys 12 of the first substrate 10 .

In addition, in the case of bonding the first substrate 10 and the second substrate 20, very high precision is required, and thus the magnifications of the identification cameras 320A, 320B, 320C, and 320D are relatively high. In this case, the recognition cameras 320A, 320B, 320C, 320D have higher magnifications and very short focal lengths.

Therefore, as shown in FIG. 4 , when the first camera units 300A, 300B and the second camera units 300C, 300D are arranged in the vertical direction, it is difficult to identify relative cameras 320A, 320B, 320C, 320D The case where the camera units are arranged.

Therefore, in the case of this embodiment, sequence cameras 330A, 330B, 330C, 330D are provided in the camera units 300A, 300B, 300C, 300D. The sorting cameras 330A, 330B, 330C, and 330D are used for vertical alignment of the first camera units 300A, 300B and the second camera units 300C, 300D. In this case, the sorting cameras 330A, 330B, 330C, and 330D have relatively low magnifications compared to the recognition cameras 320A, 320B, 320C, and 320D, and on the contrary, recognize camera units whose focal lengths are longer and face each other.

For example, as shown in FIG. 4 and FIG. 5 , the first sequence cameras 330A and 330B are arranged opposite to the second sequence cameras 330C and 330D of the opposite second camera units 300C and 300D. In this case, the first sorting cameras 330A, 330B and the second sorting cameras 330C, 330D identify each other, and through this, the first camera units 300A, 300B and the second camera units 300C, 300D are accurately arranged in the vertical direction At least one of the first camera units 300A, 300B and the second camera units 300C, 300D is moved or tilted in the horizontal direction.

Since the second camera units 300C and 300D opposed to the first camera units 300A and 300B have the same configuration as the first camera units 300A and 300B described above, repeated descriptions are omitted.

In addition, FIG. 6 shows a first camera unit 3000A of another embodiment. FIG. 6(A) is a plan view of the first camera unit 3000A, and FIG. 6(B) is a side view showing the configuration of the first camera unit 3000A and the second camera unit 3000B.

Referring to FIG. 6 , the first camera unit 3000A of this embodiment is compared with the above-mentioned embodiment, and a first camera sorting key 3400A is also set.

That is, the first camera unit 3000A sets the first identification camera 3200A, the first sorting camera 3300A and the first camera sorting key 3400A together on the mobile board 3100A.

The first camera sorting key 3400A is identified by the opposite camera unit, that is, the second sorting camera 3300B of the second camera unit 3000B. And, the second camera sorting key 3400B of the second camera unit 3000B is identified by the first sorting camera 3300A of the first camera unit 3000A.

As shown in FIG. 6(B) , the first sorting camera 3300A of the first camera unit 3000A and the second camera sorting key 3400B of the second camera unit 3000B are arranged relatively. In addition, the first camera sorting key 3400A of the first camera unit 3000A is arranged opposite to the second sorting camera 3300B of the second camera unit 3000B.

Therefore, coordinates are detected by identifying the second camera sorting key 3400B by the first sorting camera 3300A, and coordinates are detected by identifying the first camera sorting key 3400A by the second sorting camera 3300B.

After detecting the coordinates of the first camera sorting key 3400A and the second camera sorting key 3400B, horizontally move or tilt at least one of the first camera unit 3000A or the second camera unit 3000B, and arrange the first camera unit 3000A or the second camera unit 3000B. The vertical direction of the camera unit 3000A and the second camera unit 3000B.

Next, a method for bonding substrates using the substrate bonding apparatus 1000 having the above-described configuration will be examined.

First, the substrate bonding method includes the following steps: using the second camera units 300C, 300D to identify the first sort key 12 of the first substrate 10; using the first camera units 300A, 300B to identify the second The second sorting key 22 of the substrate 20; and the first substrate 10 and the second substrate 20 are arranged and bonded.

In this case, the substrate bonding method includes a vertical alignment step of arranging the first camera units 300A, 300B and the second camera units 300C, 300D in a vertical direction. This vertical alignment step precedes the step of identifying the first sort key 12 or between the step of identifying the first sort key 12 and the step of identifying the second sort key 22 or before the step of identifying the second sort key 22 steps are followed. In the following, the case where the vertical arrangement step is performed between the step of recognizing the first sort key 12 and the step of recognizing the second sort key 22 is examined.

FIG. 7 is a side view showing a state in which the first sort key 12 of the first substrate 10 is recognized. As shown in FIG. 7 , in the inner side of the cavity 100 , based on the alignment module 200 , the first substrate is mounted on the right side and the first chuck 520 and the second chuck 510 respectively. 10 and the loading area 106 of the second substrate 20 correspond to each other, and the left side of the arrangement module 200 corresponds to the bonding area 104 where the first substrate 10 and the second substrate 20 are bonded. This area distinction is only used for convenience of setting, and it is properly deformed.

Referring to FIG. 7 , in the loading area 106 , the first substrate 10 is adsorbed and fixed on the upper portion of the first chuck 520 . Furthermore, the first chuck 520 is inserted into the hollow portion 220 of the alignment module 200 . In this case, the second chuck 510 is separated from the alignment module 200 and stands by in the bonding area 104 .

In addition, when the first chuck 520 is inserted into the hollow portion 220, the first sort key 12 of the first substrate 10 is recognized by the second camera unit 300C.

Furthermore, as shown in FIG. 8 , the first chuck 520 is transferred in the alignment module 200 in a horizontal direction to move to the bonding area 104 .

After the first chuck 520 is separated from the alignment module 200, a vertical alignment step of aligning the first camera unit 300A and the second camera unit 300C in a vertical direction is performed.

In this case, the first sequence camera 330A of the first camera unit 300A and the second sequence camera 330C of the second camera unit 300C recognize each other, detect the coordinates, and move or tilt the first camera unit 300A and the first camera unit 300A in the horizontal direction. The two camera units 300C are arranged in the vertical direction.

9 and 10 are diagrams showing steps of vertical arrangement of the first camera unit 300A and the second camera unit 300C.

As shown in FIG. 9(A), in the case of identifying each other by the first camera unit 300A and the second camera unit 300C, the first camera unit 300A and the second camera unit 300C are separated from the vertical line and along the A distance error occurs in the horizontal plane.

In this case, at least one of the first camera unit 300A and the second camera unit 300C is moved in the horizontal direction, and as shown in FIG. 9(B), the first camera unit 300A and the second camera unit 300C are They are arranged on a vertical line and are arranged in a vertical direction.

And, as shown in FIG. 10(A), in the case of mutual recognition by the first camera unit 300A and the second camera unit 300C, the first camera unit 300A and the second camera unit 300C are at least one on a vertical line A twist occurs and an angular error occurs in the vertical direction.

In this case, at least one of the first camera unit 300A and the second camera unit 300C is inclined, and as shown in FIG. 10(B) , the first camera unit 300A and the second camera unit 300C are arranged on a vertical line And arrange vertically.

In addition, the coordinates are detected by recognizing the first sorting key 12, and before the second sorting key 22 is recognized, the vertical alignment of the first camera unit 300A and the second camera unit 300C is performed, and the detection of the In the case of the coordinates of the second sort key 22, the coordinate error of the first sort key 12 and the second sort key 22 is reduced.

Furthermore, as shown in FIG. 11 , the second chuck 510 moves to the loading area 106 to suck and fix the second substrate 20 . In this case, the second substrate 20 is turned upside down and the second sort keys 22 are disposed downward.

Further, a step of moving up and down in which the frame 210 is moved up and down by a predetermined distance in advance is performed.

That is, as shown above, the first identification camera 320A of the first camera unit 300A and the second identification camera 320B of the second camera unit 300C have relatively short focal lengths to identify the first sort key 12, After that, in order to recognize the second sort key 22 , the first camera unit 300A needs to be raised toward the second substrate 20 .

In this case, the first camera unit 300A and the second camera unit 300C provided on the frame 210 move up and down together with the frame 210 .

After the frame 210 moves up and down, as shown in FIG. 12 , the second chuck 510 is inserted into the hollow portion 220 of the alignment module 200 .

When the second chuck 510 is inserted into the hollow portion 220 , the second sort key 22 of the second substrate 20 is recognized by the first camera unit 300A.

In addition, FIG. 13 shows the case where the said 1st level member 212 is raised and moved.

13 , when the frame 210 moves up and down, if the focal length of the first recognition camera 320A of the first camera unit 300A cannot be matched, the first level member 212 moves up and down to match the focal length.

In the case of the present embodiment, the case where the first leveling member 212 moves up and down will be described. As described above, at least one of the first leveling member 212 and the second leveling member 211 is moved up and down. Therefore, at least one of the first camera units 300A, 300B and the second camera units 300C, 300D is moved up and down to match the focal length.

Furthermore, as shown in FIG. 14 , the second chuck 510 is transferred to the bonding area 104 . In this case, the first chuck 520 is already on standby in the joining area.

Therefore, after the second chuck 510 is moved to the upper part of the first chuck 520, the first chuck 520 is precisely arranged by the coordinates of the first sorting key 12 and the second sorting key 22 After the second chuck 510 is used, the second chuck 510 is moved downward to bond the first substrate 10 and the second substrate 20 .

In addition, when the above-mentioned vertical arrangement step is performed before the step of recognizing the first sort key 12 , the coordinate error of the first sort key 12 and the second sort key 22 can also be reduced.

In addition, in the case where the above-mentioned vertical arrangement step is performed after the step of identifying the second sort key 22, the vertical arrangement step is performed after the coordinates of the first sort key 12 and the second sort key 22 are detected in advance. Therefore, in this case, in the vertical arrangement step, the first ordering is corrected by the amount of movement in the horizontal direction or the degree of inclination of the first camera unit 300A, 300B or the second camera unit 300C, 300D The step of calculating the coordinates of the key 12 and the second sorting key 22, and calculating the exact coordinates of the first sorting key 12 and the second sorting key 22.

In summary, the preferred embodiments of the present invention have been described, but those skilled in the art can implement the present invention with various modifications and variations without departing from the spirit and scope of the present invention described in the claims. Therefore, if the modified implementation basically includes the constituent elements of the claims of the present invention, it should be considered that all of them are included in the technical scope of the present invention.

100: cavity 200: Bonding Module 210: Frames 300: Camera unit 410, 420: Drive Department 1000: Engagement device

FIG. 1 is a side view of a substrate bonding apparatus according to an embodiment of the present invention; FIG. 2 is a perspective view showing the internal structure of the substrate bonding apparatus shown in FIG. 1; 3 is a plan view showing the first substrate; 4 is a front view and a perspective view of an arrangement module; 5 is a perspective view showing a state of a camera unit mounted on a frame; 6 is a diagram of a camera unit of another embodiment; 7 is a side view showing a state in which the first sort key of the first substrate is recognized; 8 is a side view showing a state in which the first camera unit and the second camera unit are vertically aligned by transferring the first substrate; 9 and 10 are drawings showing a method of vertically arranging camera units; 11 is a side view showing a state in which the alignment module is moved upward in order to identify the second substrate; 12 is a side view showing a state in which the second sort key of the second substrate is recognized; FIG. 13 is a side view showing a situation in which the first leveling member is raised; 14 is a side view showing a state in which the second substrate is transferred and the first substrate and the second substrate are joined.

100: cavity

200: Bonding Module

210: Frames

410, 420: Drive Department

1000: Engagement device

Claims (14)

A substrate bonding device, characterized in that: include: cavity; a first chuck, arranged inside the cavity to adsorb the first substrate; A second chuck is disposed inside the cavity in a manner facing the first chuck, and is disposed in a manner of relative movement in the vertical and horizontal directions relative to the first chuck to adsorb the second substrate; and The arrangement module is provided with a camera unit for identifying the first sorting key of the first substrate and the second sorting key of the second substrate, and includes a frame that can move up and down. The substrate bonding apparatus according to claim 1, wherein: The camera unit is movably arranged relative to the frame. The substrate bonding apparatus according to claim 1, wherein: The camera unit can be moved and tilted in the horizontal direction of the frame. The substrate bonding apparatus according to claim 3, wherein: The framework includes: A pair of vertical parts, separated and arranged according to the spacing specified in advance; a pair of leveling members interconnecting the upper and lower ends of the vertical members and for arranging the camera unit, At least one of the pair of horizontal members is arranged to be movable up and down with respect to the vertical member. The substrate bonding apparatus according to any one of claims 1 to 4, wherein: The camera unit includes: a first camera unit, identifying the second sort key; The second camera unit identifies the first sorting key and is disposed opposite to the first camera unit. The substrate bonding apparatus according to claim 5, wherein: The pair of leveling members includes a first leveling member and a second leveling member, The first camera unit is provided on the first level member, and the second camera unit is provided on the second level member. The substrate bonding apparatus according to any one of claims 1 to 4, wherein: The camera unit setup: a moving plate, which can be moved in a horizontal direction relative to the frame; identifying a camera, arranged on the moving board to identify the first sort key or the second sort key; and Sorting cameras for the arrangement of the moving board. The substrate bonding apparatus according to claim 7, wherein: The moving plate can be disposed obliquely with respect to the frame. The substrate bonding apparatus according to claim 8, wherein: On the mobile board also set: The camera sorting key, identified by the sorting camera of the relative camera unit. The substrate bonding apparatus according to claim 4, wherein: A hollow portion is formed in the center of the frame so as to be able to move the first chuck and the second chuck. A substrate bonding method, relating to a substrate bonding method including a frame; a substrate bonding device in which a first camera unit and a second camera unit are provided on the frame, the substrate bonding method being characterized by: It includes the following steps: using the second camera unit to identify the first sort key of the first substrate; using the first camera unit to identify a second sort key of the second substrate; and the first substrate and the second substrate are arranged and bonded, before the step of identifying the first sort key, or between the step of identifying the first sort key and the step of identifying the second sort key, or after the step of identifying the second sort key, A vertical arranging step of arranging the first camera unit and the second camera unit in a vertical direction is included. The substrate bonding method according to claim 11, wherein: The first camera unit and the second camera unit are arranged to be movable in a horizontal direction and inclined relative to the frame, In the vertical alignment step, the first camera unit and the second camera unit are aligned in the vertical direction by moving or tilting the first camera unit and the second camera unit in the horizontal direction. The substrate bonding method according to claim 11, wherein: Between the step of recognizing the first sort key and the step of recognizing the second sort key, an up and down movement step of moving the first camera unit and the second camera unit up and down is also included. The substrate bonding method according to claim 11, wherein: Between the step of recognizing the first sort key and the step of recognizing the second sort key, an up-down movement step of moving at least one of the first camera unit and the second camera unit up and down is further included.

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