TW202229658A - Wetting method and plating device of substrate wherein the method includes a holding step, a supply step and two descending steps - Google Patents

Abstract

The present invention reduces an amount of air bubbles adhering to a surface to be plated with a simple structure. A wetting method of a substrate of the present invention comprises: a holding step 102 of holding a back surface of a substrate by a back plate in such a way that the plated surface of the substrate is opposite to a liquid surface of a plating solution accommodated in a plating tank; a supply step 104 of supplying the plating solution in the plating tank so that a central part of the liquid surface of the plating solution is bumped by flowing the plating solution upward through a plurality of through holes arranged in the central part of a resistor body in the plating tank; a first descending step 106 of descending a support member for supporting an outer edge portion of the plated surface of the substrate held by a holding member toward the liquid surface of the plating solution; and a second descending step 108 of descending the holding member when the support member and holding member descend in the first descending step 106 in the circumstance that the central part of the liquid surface of the plating solution is bumped in the supply step 104.

Description

Substrate contacting method and plating device

The present application relates to a liquid contact method and a plating device for a substrate.

As an example of a plating apparatus, a cup-type electrolytic plating apparatus is known. The cup-type electrolytic plating device faces the surface to be plated downward, immerses the substrate (such as a semiconductor wafer) held in the substrate holder in the plating solution, and applies a voltage between the substrate and the anode to conduct electricity. The film is deposited on the surface of the substrate.

When the cup-type electrolytic plating apparatus immerses the substrate in the plating solution, air bubbles tend to adhere to the surface to be plated, and the air bubbles adhering to the surface to be plated will affect the plating performance and are therefore unsuitable. Therefore, for example, Patent Document 1 discloses that the amount of air bubbles adhering to the plated surface is reduced by inclining the plated surface of the substrate with respect to the horizontal and sequentially contacting the plating solution from the lower end side of the inclined substrate. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-19496

(The problem that the invention intends to solve)

However, the conventional technique tends to complicate the structure of the electrolytic plating apparatus in order to reduce the amount of air bubbles adhering to the surface to be plated.

That is, during the plating process, since the plated surfaces of the anode and the substrate should be parallel, the prior art requires the substrate to be inclined when the substrate is in contact with the plating solution, and then the substrate is placed in contact with the plating solution. The tilt recovery mechanism. Such a mechanism complicates the construction of the electrolytic plating apparatus.

Therefore, an object of this application is to reduce the amount of air bubbles adhering to the surface to be plated with a simple structure. (Technical means to solve problems)

An embodiment discloses a method for contacting a substrate with liquid, comprising: a holding step of holding the back surface of the substrate by a holding member in such a way that the plated surface of the substrate is opposite to the liquid surface of the plating solution accommodated in the plating tank a supplying step, in which the plating solution flows upwardly through a plurality of through holes arranged in the central portion of the resistor body in the plating tank, by supplying the plating solution in the plating tank to make the plating solution The central portion of the liquid level of the liquid is raised; the first descending step is to descend the support member for supporting the outer edge portion of the plated surface of the substrate held by the holding member toward the liquid level of the plating liquid; and the second descending step wherein the support member and the holding member lowered by the first lowering step sandwich the substrate in a state where the central portion of the liquid surface of the plating solution is raised by the supplying step. Component descends.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding elements are denoted by the same symbols, and repeated descriptions are omitted. <The overall structure of the coating device>

FIG. 1 is a perspective view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment. As shown in FIGS. 1 and 2 , the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wetting module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , The spin-rinsing dryer 600 , the conveying device 700 , and the control module 800 .

The loading port 100 is a module for carrying substrates accommodated in cassettes such as FOUPs (front opening pods), not shown, into the plating apparatus 1000 , or a module for unloading substrates from the plating apparatus 1000 to the cassettes. In this embodiment, four load ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the load ports 100 are not limited. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 transfer substrates between the transfer robot 110 and the transfer device 700 , the transfer of the substrates can be performed via a temporary stage (not shown).

The aligner 120 is a module for aligning the positions of the orientation planes and grooves of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged in parallel in the horizontal direction, but the number and arrangement of the aligners 120 are not limited. The pre-wetting module 200 replaces the air inside the pattern formed on the substrate surface with the treatment liquid by wetting the plated surface of the substrate before the plating treatment with a treatment liquid such as pure water or degassed water. The pre-wet module 200 is configured to perform a pre-wet treatment that facilitates supply of the plating solution inside the pattern by replacing the treatment solution inside the pattern with a plating solution during plating. In this embodiment, two pre-wetting modules 200 are arranged in parallel in the up-down direction, but the number and arrangement of the pre-wetting modules 200 are not limited.

The prepreg module 300 is etched with sulfuric acid and hydrochloric acid to remove, for example, the high-resistance oxide film that exists on the surface of the seed layer on the plated surface of the substrate before the plating treatment, and then cleans or activates the substrate. The surface is constituted by prepreg treatment. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs a plating process on the substrate. In the present embodiment, there are two sets of plating modules 400 in which three are arranged in parallel in the vertical direction and 12 out of four are arranged in parallel in the horizontal direction, and a total of 24 plating modules 400 are provided. The quantity and configuration are not limited.

The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the up-down direction, but the number and arrangement of the cleaning modules 500 are not limited. The spin-rinsing dryer 600 is a module for rotating and drying the substrate after the cleaning process at a high speed. In this embodiment, two spin-rinsing-dryers are arranged side by side in the vertical direction, but the number and arrangement of the spin-rinsing-dryers are not limited. The conveying apparatus 700 is an apparatus for conveying a substrate between a plurality of modules in the plating apparatus 1000 . The control module 800 is configured to control a plurality of modules of the coating apparatus 1000, and may be configured by, for example, a general computer or a dedicated computer having an input/output interface with the operator.

An example of a serial plating process by the plating apparatus 1000 will be described below. First, the substrates accommodated in the cassette are carried into the loading port 100 . Next, the transfer robot 110 takes out the substrate from the cassette of the loading port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the positions of the orientation planes, grooves, etc. of the substrate in a specified direction. The transfer robot 110 sends the substrate whose direction is aligned by the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wetting module 200 . The pre-wetting module 200 performs pre-wetting treatment on the substrate. The conveying device 700 conveys the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg processing on the substrate. The conveying device 700 conveys the prepreg-treated substrate to the plating module 400 . The plating module 400 performs plating processing on the substrate.

The transfer device 700 transfers the substrate after the plating process to the cleaning module 500 . The cleaning module 500 performs cleaning processing on the substrate. The transfer device 700 transfers the substrate after the cleaning process to the spin rinse dryer 600 . The spin rinse dryer 600 performs drying processing on the substrate. The transfer device 700 sends the substrate after the drying process to the transfer robot 110 . The transfer robot 110 transfers the substrates received from the transfer device 700 to the cassettes of the loading port 100 . Finally, the cassette in which the substrates are accommodated is carried out from the load port 100 . <Constitution of the coating module>

Next, the structure of the plating module 400 will be described. The 24 sets of plating modules 400 in this embodiment have the same configuration, so only a single set of the plating modules 400 will be described.

FIG. 3 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the substrate is not held. FIG. 4 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the substrate is held. As shown in FIGS. 3 and 4 , the plating module 400 includes a plating tank 410 for accommodating a plating solution. Moreover, the plating module 400 is provided with the board|substrate holder 440 for holding the back surface of the board|substrate Wf in the state in which the to-be-plated surface Wf-a faces downward and opposes the liquid surface of the plating solution. The substrate holder 440 is provided with a feeding contact for feeding power to the substrate Wf from a power source (not shown).

In addition, the plating module 400 includes a diaphragm 420 that partitions the inside of the plating tank 410 in the up-down direction. The inside of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by a membrane 420 . An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424 . The resistor body 450 is arranged in the cathode region 422 to face the separator 420 . The resistor body 450 is constituted by a plate-shaped member in which a plurality of through holes 450a are formed. The plurality of through holes 450a are distributed in a region corresponding to the plated surface Wf-a of the substrate Wf. Each through hole 450a communicates with the upper region and the lower region of the resistor body 450 . The resistor 450 is a member that seeks to achieve uniform plating thickness on the plating surface Wf-a of the substrate Wf. That is, since the feeding contact is provided on the outer edge of the substrate Wf, the electric field is concentrated on the outer edge of the substrate Wf due to the resistance between the outer edge and the central part of the substrate Wf, so that the outer edge of the substrate Wf is The thickness of the plating film at the edge portion increases. In this regard, by disposing the resistor 450 between the anode 430 and the substrate Wf, it is possible to suppress the electric field from concentrating on the outer edge of the substrate Wf, and to achieve a uniform plating film thickness on the plating surface Wf-a of the substrate Wf change.

The board|substrate holder 440 is provided with the support member 442 for supporting the outer edge part of the plating surface Wf-a of the board|substrate Wf. The support member 442 includes: a seal ring holder 449 having a support surface 449a facing the outer edge portion of the plated surface Wf-a of the substrate Wf; an annular seal member 445 arranged on the support surface 449a; The ring holder 449 is held by the frame 446 of the substrate holder body (not shown).

Moreover, the board|substrate holder 440 is provided with the holding member 441 for holding the back surface of the plated surface Wf-a of the board|substrate Wf. The holding member 441 includes: a rear plate 444 configured to suck and hold the back surface of the plated surface Wf-a of the substrate Wf; The back surface plate 444 is connected to a vacuum source (not shown), and is configured to suction and hold the back surface of the substrate Wf by vacuum suction from the vacuum source.

The plating module 400 includes: an elevating mechanism 443 for raising and lowering the substrate holder 440; The rotation mechanism 447 is used to rotate the substrate holder 440 in a way of rotating around. The elevating mechanism 443 and the rotating mechanism 447 can be realized by, for example, a known mechanism such as a motor. The plating module 400 uses the lifting mechanism 443 to immerse the substrate Wf in the plating solution of the cathode region 422 , and applies a voltage between the anode 430 and the substrate Wf to deposit the substrate Wf on the plated surface Wf-a of the substrate Wf. It is constituted by the method of carrying out the plating treatment.

The cathode region 422 and the anode region 424 are respectively filled with a plating solution. Specifically, the plating module 400 includes a plating solution supply member 425 configured to supply the plating solution toward the center of the lower region of the resistor body 450 . The plating solution supply member 425 includes: a plurality of nozzles 426 opening toward the center of the lower region of the resistor body 450 of the cathode region 422; and a supply source 428 for supplying the plating solution to the cathode region 422 through the plurality of nozzles 426 . The plurality of nozzles 426 are arranged along the circumferential direction on the side wall of the coating tank 410 below the resistive body 450 . The plating module 400 also includes a mechanism for supplying a plating solution to the anode region 424 in the same manner as in the anode region 424 , but the illustration is omitted here.

The plurality of nozzles 426 are configured to supply the plating solution obliquely upward toward the central portion of the lower region of the resistor body 450 . After the plating tank 410 is filled with the plating liquid, the plating liquid supplied from the plurality of nozzles 426 collides with the plating liquid supplied from the plurality of nozzles 426 at the center of the lower region of the resistor body 450 . A turbulent flow is formed, and an upward flow of the plating solution rectified by passing upward through the plurality of through holes 450a of the resistor body 450 is formed. As a result, as shown in FIG. 3 and FIG. 4, the center part of the liquid surface of the plating solution swelled.

The elevating mechanism 443 is configured to elevate the seal ring holder 449 and the back plate 444 individually. Specifically, the elevating mechanism 443 includes: a first elevating member 443 - 1 for elevating the seal ring holder 449 ; and a second elevating member 443 - 2 for elevating the rear panel 444 .

FIG. 5 is a longitudinal sectional view schematically showing the structure of the coating module of the present embodiment, and shows a state in which the seal ring holder is lowered. As shown in FIG. 5, the first elevating member 443-1 lowers the seal ring holder 449 to a liquid contact position for making the plating surface Wf-a of the substrate Wf in contact with the liquid surface of the plating liquid constitute. Here, the so-called liquid contact position is lower than the part LL-a where the liquid level of the plating solution is raised (the highest part of the raised part LL-a), and is lower than the part where the liquid surface of the plating solution is not raised LL-b high position.

FIG. 6 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the back plate is lowered and the substrate is brought into contact with the liquid. FIG. 7 is a longitudinal cross-sectional view schematically showing the structure of the coating module of the present embodiment, and shows a state in which the rear panel is lowered to extract air. FIG. 8 is a longitudinal cross-sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the back plate is lowered to seal the substrate.

The second elevating member 443 - 2 lowers the back panel 444 so as to sandwich the substrate Wf between the back panel 444 and the seal ring holder 449 . Specifically, first, as shown in FIG. 6 , the second elevating member 443 - 2 lowers the back plate 444 to the portion LL- where the center portion of the plated surface Wf-a of the substrate Wf contacts the raised portion LL- of the plating solution. a. Continuing, as shown in FIG. 7, the second elevating member 443-2 makes the rear plate so as to expand the portion LL-a where the liquid level of the plating solution is raised in the outer peripheral direction of the plated surface Wf-a of the substrate Wf 444 gradually declined.

Thereby, the air between the liquid level of the plating solution and the plating surface Wf-a of the substrate Wf is pushed toward the outer periphery of the plating surface Wf-a, and passes through the space between the plating surface Wf-a and the sealing member 445. discharged from time to time. 8, the second elevating member 443-2 lowers the back plate 444 until the outer edge of the plated surface Wf-a of the substrate Wf contacts the sealing member 445, thereby sealing the plated surface Wf-a. After the plated surface Wf-a of the board|substrate Wf is sealed, the 1st raising/lowering member 443-1 and the 2nd raising/lowering member 443-2 are comprised so that the board|substrate Wf may fall to the predetermined position for performing a plating process.

As described above, when the plating module 400 of the present embodiment is used, a plurality of through holes 450 a through the resistor body 450 can be formed by supplying the plating solution from the plurality of nozzles 426 to the lower region of the resistor body 450 . Since the upward flow is rectified toward the upper region of the resistor body 450, the center portion of the liquid surface of the plating solution can be effectively raised. In addition, when the plating module 400 of the present embodiment is used, the center portion of the liquid surface of the plating liquid is raised, and the plating liquid of the raised portion LL-a is expanded in the outer peripheral direction of the surface to be plated Wf-a Furthermore, the board|substrate Wf is lowered|hung, and the air adhering to the to-be-plated surface Wf-a can be removed from the to-be-plated surface Wf-a. As a result, when the plating module 400 of the present embodiment is used, it is not necessary to use a complicated mechanism such as a tilting mechanism for tilting the substrate Wf and immersing it in the plating solution, and a simple mechanism can reduce the amount of adhesion to the substrate Wf. The amount of air bubbles on the plated surface Wf-a.

Next, the liquid contact method of the board|substrate using the plating module 400 of this embodiment is demonstrated. FIG. 9 is a flow chart of a method of liquid contacting a substrate according to the present embodiment.

The substrate liquid contact method of the present embodiment firstly holds the back surface of the substrate Wf such that the plating surface Wf-a of the substrate Wf faces the liquid surface of the plating solution as shown in FIG. 4 (holding step 102). The holding step 102 holds the back surface of the substrate Wf by vacuum suction using the back surface plate 444 .

Continuing, as shown in FIG. 4 , the liquid contacting method of the substrate is to supply the plating liquid in the plating tank 410 in such a way that the plating liquid flows upward through the plurality of through holes 450a in the central part of the resistor body 450, Then, the center portion of the liquid surface of the plating solution is raised (supply step 104 ). The supplying step 104 includes a step of supplying the plating solution from the plurality of nozzles 426 arranged on the side wall of the plating tank 410 along the circumferential direction toward the center of the lower region of the resistor body 450 . As a result, the plating solution supplied from the plurality of nozzles 426 collides at the center of the lower region of the resistor body 450 to form a turbulent flow, and forms a rise that is rectified by flowing upward through the plurality of through holes 450a of the resistor body 450 flow. As a result, as shown in FIG. 4, the center part of the liquid surface of the plating solution swelled. In addition, the execution order of the maintaining step 102 and the supplying step 104 can be replaced or executed simultaneously.

Continuing, as shown in FIG. 5 , the liquid contacting method of the substrate is performed by lowering the seal ring holder 449 toward the liquid level of the plating solution (the first lowering step 106 ). The first lowering step 106 includes lowering the seal ring holder 449 to a point where the sealing member 445 is lower than the portion LL-a where the liquid level of the plating solution is raised and higher than the portion LL-b where the liquid level of the plating solution is not raised. fluid position. In other words, the first lowering step 106 includes the step of lowering the seal ring holder 449 so that the sealing member 445 is located between the raised portion LL-a of the plating solution and the unraised portion LL-b. Therefore, if the sealing member 445 is higher than the portion LL-a where the liquid level of the plating solution is raised, the air adhering to the plated surface Wf-a of the substrate Wf cannot be extracted, and if the sealing member 445 is higher than the plating solution If the LL-b of the portion where the liquid level is not raised is low, the plating liquid will intrude into the support surface 449a of the seal ring holder 449 . In addition, the first descending step 106 may be performed earlier than the holding step 102 and the supplying step 104 , or may be performed simultaneously with the holding step 102 and the supplying step 104 .

Continuing, in the liquid contact method of the substrate, the back plate 444 is lowered so that the substrate Wf is sandwiched between the back plate 444 and the seal ring holder 449 in a state where the center portion of the liquid surface of the plating solution is raised in the supply step 104 . (Second descent step 108). As shown in FIG. 6 , the second descending step 108 includes bringing the back surface into contact with the central portion of the plating surface Wf-a of the substrate Wf and the portion LL-a where the liquid surface of the plating solution is raised by the supplying step 104. The step of lowering the panel 444. In addition, as shown in FIGS. 7 and 8 , the second lowering step 108 includes a step of lowering the back plate 444 so that the outer edge portion of the plated surface Wf-a of the substrate Wf is brought into contact with the sealing member 445 .

Continuing, the substrate wetted method is to lower the back plate 444 and the seal ring holder 449 together so as to arrange the substrate Wf at the designated position for performing the plating process (third lowering step 110 ). After arranging the substrate Wf at a predetermined position, the plating module 400 performs a plating process on the substrate Wf.

In the case of using the substrate liquid contact method of the present embodiment, the center portion of the liquid surface of the plating solution is raised, and the raised portion LL-a of the plating solution is expanded in the outer peripheral direction of the plating surface Wf-a, and further By lowering the substrate Wf, the air adhering to the plating surface Wf-a can be removed from the plating surface Wf-a. As a result, when the substrate liquid contact method of the present embodiment is employed, a complicated mechanism such as a tilting mechanism for tilting the substrate Wf and immersing it in the plating solution is not used, and the plated surface Wf adhering to the substrate Wf can be reduced in a simple configuration. - the amount of air bubbles in a.

Although some embodiments of the present invention have been described above, the embodiments of the present invention described above are for the purpose of facilitating the understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from the scope of the gist, and it is needless to say that the equivalents thereof are included in the present invention. In addition, within the scope of at least a part of solving the above problems, or the scope of achieving at least a part of the effect, the various elements described in the scope of the patent application and the specification can be arbitrarily combined or omitted.

An embodiment of the present application discloses a method for contacting a substrate with liquid, which includes: a holding step, which is held by a holding member in such a way that the plated surface of the substrate is opposite to the liquid surface of the plating solution accommodated in the plating tank The back surface of the substrate; the supplying step is to supply the plating solution in the plating tank by supplying the plating liquid in the plating tank in such a way that the plating liquid flows upward through a plurality of through holes arranged in the central part of the resistor body in the plating tank the center portion of the liquid surface of the plating solution is raised; the first descending step is to lower the support member for supporting the outer edge portion of the plated surface of the substrate held by the holding member toward the liquid level of the plating solution; and the first step of descending A second lowering step in which the support member and the holding member lowered by the first lowering step sandwich the substrate in a state where the center portion of the liquid surface of the plating solution is raised in the supplying step. The aforementioned holding member is lowered.

Furthermore, an embodiment of the present application discloses a method for contacting a substrate with liquid, wherein the first lowering step includes lowering the supporting member to the supporting member formed so as to seal the outer edge portion of the plated surface of the substrate. The sealing member is lower than the raised portion of the liquid level of the plating solution, and is higher than the non-raised portion of the liquid level of the plating solution.

Furthermore, an embodiment of the present application discloses a liquid contact method for a substrate, wherein the second descending step includes the following steps: using the center portion of the plated surface of the substrate and the liquid of the plating solution through the supplying step. The holding member is lowered so that the raised portion of the surface is in contact with the liquid; and the holding member is lowered so that the outer edge portion of the plated surface of the substrate comes into contact with the sealing member.

Furthermore, an embodiment of the present application discloses a method for contacting a substrate with liquid, wherein the supplying step includes supplying plating from a plurality of nozzles arranged on the sidewall of the plating tank along the circumferential direction toward the center of the lower region of the resistor body. The steps of immersion.

Furthermore, an embodiment of the present application discloses a method for contacting a substrate with liquid, wherein the holding step includes the step of using the holding member to adsorb and hold the back surface of the plated surface of the substrate.

Furthermore, an embodiment of the present application discloses a plating apparatus, which includes: a plating tank for accommodating a plating solution; a holding member for accommodating the plated surface of the substrate and the plated surface. The back surface of the substrate is held in such a way that the liquid level of the plating solution in the tank is opposite; the supporting member is used to support the outer edge portion of the plated surface of the substrate held by the above-mentioned holding member; the lifting mechanism is used to make the above-mentioned The holding member and the aforementioned supporting member are individually lifted and lowered; the resistor body is arranged in the aforementioned plating tank in a manner opposite to the plated surface of the aforementioned substrate, and a plurality of resistors are formed which communicate with the lower region and the upper region of the aforementioned resistor body a through hole; and a plating solution supply member configured to supply the plating solution toward the center of the lower region of the resistor body.

Furthermore, an embodiment of the present application discloses a plating apparatus, wherein the elevating mechanism includes: a first elevating member that lowers the supporting member to a position for making the plated surface of the substrate contact the plating solution. a liquid contact position of the liquid level; and a second lift member that lowers the holding member so that the support member and the holding member sandwiched between the substrate by the first lift member descended to the liquid contact position.

Furthermore, an embodiment of the present application discloses a coating apparatus, wherein the supporting member includes: a sealing ring holder having a supporting surface opposite to an outer edge portion of the plated surface of the substrate; and a sealing member, which It is arranged on the support surface; the liquid contact position is that the sealing member is lower than the portion where the center of the liquid surface of the plating solution is raised by supplying the plating solution from the plating solution supply member, and the sealing member is lower than the plating solution. At a position where the liquid level of the liquid is not elevated, the second lifting member is configured to lower the holding member so that the sealing member comes into contact with the outer edge of the plated surface of the substrate.

Furthermore, an embodiment of the present application discloses a plating apparatus, wherein the plating solution supply member includes: a plurality of nozzles arranged on the side wall of the plating tank along the circumferential direction; and a supply source, which is used for The plating solution is supplied from the plurality of nozzles.

Furthermore, an embodiment of the present application discloses a plating apparatus, wherein the plurality of nozzles supply the plating solution obliquely upward toward the center portion of the lower region of the resistor body, so that the center portion of the liquid surface of the plating solution is formed. Constructed in a raised manner.

Furthermore, one embodiment of the present application discloses a plating apparatus in which the holding member includes a back surface plate configured to adsorb and hold the back surface of the plated surface of the substrate.

Furthermore, an embodiment of the present application discloses a plating apparatus, wherein the resistance system is disposed in the plate-like member in the plating tank in a manner opposite to the plated surface of the substrate, and is disposed in the plating corresponding to the substrate. The above-mentioned plurality of through holes are formed in the area of the plated surface.

100: Load port 102: Keep Steps 104: Supply Step 106: First descent step 108: Second descent step 110: Transfer robot, third descending step 120: Aligner 200: Pre-wet module 300: Prepreg module 400: Plating module 410: Plating tank 420: Diaphragm 422: Cathode area 424: Anode area 425: Plating solution supply member 426: Nozzle 428: Supply Source 430: Anode 440: Substrate holder 441: Keeping Components 442: Support member 443: Lifting mechanism 443-1: First Lifting Member 443-2: Second Lifting Member 444: Back Panel 445: Sealing member 446: Frame 447: Rotary Mechanism 448: Shaft 449: Seal Ring Retainer 449a: Support surface 450: Resistor body 450a: Through hole 500: Cleaning Module 600: Spin Rinse Dryer 700: Conveyor 800: Control Module 1000: Coating device LL-a: The part where the liquid level rises LL-b: The part where the liquid level is not raised Wf: substrate Wf－a: Coated surface

FIG. 1 is a perspective view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 3 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the substrate is not held. FIG. 4 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the substrate is held. FIG. 5 is a longitudinal sectional view schematically showing the structure of the coating module of the present embodiment, and shows a state in which the seal ring holder is lowered. FIG. 6 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the back plate is lowered and the substrate is brought into contact with the liquid. FIG. 7 is a longitudinal cross-sectional view schematically showing the structure of the coating module of the present embodiment, and shows a state in which the rear panel is lowered to extract air. FIG. 8 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment, and shows a state in which the back plate is lowered to seal the substrate. FIG. 9 is a flow chart of the method of liquid contacting the substrate according to the present embodiment.

Claims (12)

A liquid contact method for a substrate, comprising: The holding step is to hold the back surface of the substrate by the holding member in such a way that the plated surface of the substrate is opposite to the liquid surface of the plating solution accommodated in the plating tank; The supplying step includes supplying the plating liquid in the plating tank so that the plating liquid flows upward through a plurality of through holes disposed in the center of the resistor body in the plating tank to make the plating liquid flow upward. The central part of the liquid surface bulges; a first descending step of descending the support member for supporting the outer edge portion of the plated surface of the substrate held by the holding member toward the liquid level of the plating solution; and The second descending step includes sandwiching the substrate with the support member and the holding member descended by the first descending step in a state where the center portion of the liquid surface of the plating solution is raised by the supplying step. way to lower the aforementioned holding member. The method for contacting a substrate with liquid according to claim 1, wherein the first lowering step comprises lowering the support member so that the sealing member of the support member formed so as to seal the outer edge portion of the plated surface of the substrate is lower than the plating member. A step in which the raised portion of the liquid level of the coating liquid is lower and higher than the portion where the liquid level of the plating liquid is not raised. The method for contacting a substrate with liquid according to claim 2, wherein the second descending step includes a step of contacting the center portion of the plated surface of the substrate with the liquid-contacting portion of the liquid surface raised portion of the plating solution by the supplying step. The above-mentioned holding member is lowered; and the above-mentioned holding member is lowered so that the outer edge portion of the plated surface of the above-mentioned substrate is in contact with the above-mentioned sealing member. The substrate liquid contact method according to claim 1, wherein the supplying step includes a step of supplying the plating solution from a plurality of nozzles arranged on the sidewall of the plating tank along the circumferential direction toward the center of the lower region of the resistor body. The liquid-wetting method of a substrate according to claim 1, wherein the holding step includes a step of adsorbing and holding the back surface of the plated surface of the substrate using the holding member. A coating device, comprising: a plating tank, which is used to accommodate the plating solution; a holding member for holding the back surface of the substrate in such a way that the plated surface of the substrate is opposite to the liquid surface of the plating solution accommodated in the plating tank; a support member for supporting the outer edge portion of the plated surface of the substrate held by the holding member; an elevating mechanism for raising and lowering the holding member and the supporting member individually; a resistor body, which is arranged in the plating tank so as to be opposite to the plated surface of the substrate, and has a plurality of through holes that communicate with the lower region and the upper region of the resistor body; and The plating solution supply means is configured to supply the plating solution toward the center of the lower region of the resistor body. The coating apparatus of claim 6, wherein the elevating mechanism comprises: a first elevating member that lowers the supporting member to a liquid contact position for making the surface to be plated of the substrate contact the liquid surface of the plating solution and a second elevating member which lowers the holding member in such a way that the support member and the holding member which are lowered to the liquid contact position by the first elevating member sandwich the substrate. The coating apparatus of claim 7, wherein the supporting member comprises: a seal ring holder having a supporting surface opposite to the outer edge of the plated surface of the substrate; and a sealing member disposed on the supporting surface ; The liquid contact position is a portion where the sealing member is lower than the portion where the center of the liquid surface of the plating solution is raised by supplying the plating solution from the plating solution supply member, and the sealing member is not raised from the liquid surface of the plating solution. part of the high position, The second elevating member is configured to lower the holding member until the sealing member comes into contact with the outer edge portion of the plated surface of the substrate. The coating apparatus according to claim 6, wherein the coating liquid supply member comprises: a plurality of nozzles arranged on the side wall of the coating tank along the circumferential direction; and a supply source for supplying the nozzles from the plurality of nozzles Supply the plating solution. The plating apparatus according to claim 9, wherein the plurality of nozzles are configured to supply the plating solution obliquely upward toward the center portion of the lower region of the resistor body to raise the center portion of the liquid surface of the plating solution. The plating apparatus according to claim 6, wherein the holding member includes a back surface plate which is configured to adsorb and hold the back surface of the plated surface of the substrate. The plating apparatus according to claim 6, wherein the resistance system is provided in the plate-like member in the plating tank so as to face the plated surface of the substrate, and a region corresponding to the plated surface of the substrate is formed with The aforementioned plurality of through holes.

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