TWI769848B - Pre-wetting module of coating device and pre-wetting method of coating treatment - Google Patents

Abstract

The efficiency of cleaning treatment and degassing treatment of the treated surface of the substrate is improved.

Book The pre-wetting module 200 of the invention includes: a stage 220 configured to hold the back surface of the substrate WF with the surface to be processed WF-a facing upward; a rotating mechanism 224 configured to rotate the stage 220; and pre-wetting The chamber 260 has a cover member 262 on the opposite surface 262a facing the processed surface WF-a of the substrate WF, and a cylindrical member 264 attached to the outer edge of the opposite surface 262a of the cover member 262; The elevating mechanism 230 constituted by raising and lowering; the degassing liquid supply member constituted in such a manner as to supply the degassing liquid to the pre-wetting space 269 formed between the pre-wetting chamber 260 and the processed surface WF-a of the substrate WF 204; a nozzle 268 attached to the opposite surface 262a of the cover member 262; and a cleaning liquid supply member 202 configured to supply the cleaning liquid to the processed surface WF-a of the substrate WF via the nozzle 268.

Description

Pre-wetting module of coating device and pre-wetting method of coating treatment

The present application relates to a pre-wetting module of a coating device and a pre-wetting method for coating processing.

A plating apparatus for plating a substrate (such as a semiconductor wafer) includes: a pre-wetting module for performing various pretreatments such as degassing treatment on the substrate; Plating module.

For example, Patent Document 1 discloses that a holder holding a substrate is disposed in a pre-wetting tank, and pre-treatment is performed by supplying a pre-wetting liquid to the space exposed in the backside of the substrate while evacuating the space. The pre-wetting module.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2018-104799

However, there is still room for improvement in the prior art in terms of improving the efficiency of the cleaning process and the degassing process of the processed surface of the substrate.

That is, in the conventional technique, the space exposed on the surface to be processed of the substrate is filled with a pre-wet solution to perform degassing treatment, so it may not be possible to remove dust or the like formed inside the pattern on the surface to be processed. In addition, even if dust and the like can be removed outside the pattern, since the exposed space of the processed surface of the substrate is a closed space, it will re-adhere to the processed surface of the substrate, and as a result, it may not be able to be cleaned thoroughly. In addition, in the conventional technique, the degassing process is performed in a state where the substrate is vertically suspended. Therefore, since the surface to be processed of the substrate faces the lateral direction, the process of replacing the air inside the pattern formed on the surface to be processed with the degassing liquid may not be performed efficiently.

Therefore, one object of the present application is to improve the efficiency of the cleaning process and the degassing process of the surface to be processed of the substrate.

An embodiment discloses a pre-wetting module comprising: a stage configured to hold the back surface of a substrate facing upward to be processed; a rotation mechanism configured to rotate the stage; A pre-wet chamber is provided with: a cover member having an opposite surface opposite to the processed surface of the substrate, and a cylindrical member mounted on the outer edge of the opposite surface of the cover member; elevating A mechanism is constructed in such a way as to elevate the pre-wetting chamber, and a degassing liquid supply means is configured to supply the degassing liquid to the pre-wetting space formed between the pre-wetting chamber and the surface to be processed of the substrate. The nozzle is attached to the opposing surface of the cover member, and the cleaning liquid supply member is configured to supply the cleaning liquid to the surface to be processed of the substrate through the nozzle.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or equivalent constituent elements are denoted by the same symbols, and overlapping descriptions are omitted.

<The overall structure of the coating apparatus> FIG. 1 is a perspective view showing the overall configuration of the coating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment. As shown in FIGS. 1 and 2 , the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wetting module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , The spin-rinsing dryer 600 , the conveying device 700 , and the control module 800 .

The loading port 100 is used for loading substrates stored in cassettes such as FOUPs (front opening pods) not shown in the coating apparatus 1000 , or modules for unloading the substrates from the coating apparatus 1000 to the cassettes. In this embodiment, four load ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the load ports 100 are not limited. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 transfer substrates between the transfer robot 110 and the transfer device 700 , the transfer of the substrates can be performed via a temporary stage (not shown).

The aligner 120 is used to remove the oxide film with high resistance, such as the surface of the seed layer formed on the plated surface of the substrate before the plating process, to remove the orientation range of the substrate or to perform etching, and to perform cleaning or activation of plating grooves. The module whose position is aligned with the specified direction. In this embodiment, two aligners 120 are arranged in parallel in the horizontal direction, but the number and arrangement of the aligners 120 are not limited. The pre-wetting module 200 wets the plated surface of the substrate before the plating treatment with a treatment liquid such as pure water or degassed water, and replaces the air inside the pattern formed on the substrate surface with the treatment liquid. The pre-wet module 200 is configured to perform a pre-wet treatment for easily supplying the plating solution inside the pattern by replacing the treatment solution inside the pattern with a plating solution during plating. In this embodiment, two pre-wetting modules 200 are arranged in parallel in the up-down direction, but the number and arrangement of the pre-wetting modules 200 are not limited.

The prepreg module 300 is, for example, to perform etching with sulfuric acid or hydrochloric acid, etc., to remove the oxide film with high resistance existing on the surface of the seed layer of the plated surface of the substrate before the plating treatment, cleaning or activation plating. The prepreg treatment of the substrate surface is constituted. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs plating processing on the substrate. In this embodiment, there are two sets of plating modules 400 in which three are arranged in parallel in the vertical direction and 12 of the four are arranged in parallel in the horizontal direction, and a total of 24 plating modules 400 are provided. The quantity and configuration are not limited.

The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the up-down direction, but the number and arrangement of the cleaning modules 500 are not limited. The spin-rinsing dryer 600 is a module for rotating and drying the substrate after the cleaning process at a high speed. In this embodiment, two spin-rinsing-dryers are arranged side by side in the vertical direction, but the number and arrangement of the spin-rinsing-dryers are not limited. The conveying apparatus 700 is an apparatus for conveying a substrate between a plurality of modules in the plating apparatus 1000 . The control module 800 is configured to control a plurality of modules of the coating apparatus 1000, and may be configured by, for example, a general computer or a dedicated computer having an input/output interface with the operator.

An example of a series of plating processes in the plating apparatus 1000 will be described below. First, the substrates accommodated in the cassette are carried into the loading port 100 . Continuing, the transfer robot 110 takes out the substrate from the cassette of the loading port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the orientation range of the substrate or the position of the groove and the like in a specified direction. The transfer robot 110 delivers the substrate aligned by the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wetting module 200 . The pre-wetting module 200 performs pre-wetting treatment on the substrate. The conveying device 700 conveys the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg processing on the substrate. The conveying device 700 conveys the prepreg-treated substrate to the plating module 400 . The plating module 400 performs plating processing on the substrate.

The transfer device 700 transfers the substrate after the plating process to the cleaning module 500 . The cleaning module 500 performs cleaning processing on the substrate. The transfer device 700 transfers the substrate after the cleaning process to the spin rinse dryer 600 . The spin rinse dryer 600 performs drying processing on the substrate. The transfer device 700 sends the substrate after the drying process to the transfer robot 110 . The transfer robot 110 transfers the substrates received from the transfer device 700 to the cassettes of the loading port 100 . Finally, the cassette in which the substrates are accommodated is carried out from the load port 100 .

<Constitution of pre-wetting module> Next, the configuration of the pre-wetting module 200 will be described. Since the two pre-wetting modules 200 in this embodiment have the same configuration, only one pre-wetting module 200 will be described.

Fig. 3 is a longitudinal sectional view schematically showing the structure of a pre-wetting module according to an embodiment. FIG. 4 is a longitudinal sectional view schematically showing a state in which a cleaning process is performed using the pre-wetting module of one embodiment. As shown in FIG. 3 , the pre-wetting module 200 includes a disk-shaped stage 220 configured to hold the substrate WF. The stage 220 has a substrate holding surface 220-a for holding the back surface of the processed surface WF-a of the substrate WF, and is configured to hold the substrate WF with the processed surface WF-a facing upward. The stage 220 is connected to a vacuum source (not shown), and is configured by vacuum sucking the back surface of the substrate WF to hold the substrate WF. A shaft 222 extending in the vertical direction is attached to the center of the lower surface of the stage 220 . The pre-wetting module 200 includes a rotation mechanism 224 configured to rotate the stage 220 around the axis of the shaft 222 . The rotation mechanism 224 is configured to rotate the stage 220 when cleaning and degassing are performed.

The pre-wetting module 200 includes a pre-wetting chamber 260 arranged on the upper part of the stage 220 . The pre-wetting chamber 260 includes: a disk-shaped cover member 262 having an opposing surface 262a facing the processed surface WF-a of the substrate WF; and a cylindrical member 264 attached to the outer edge of the opposing surface 262a of the cover member 262 . The pre-wetting module 200 includes an elastic member 265 attached to the lower end of the cylindrical member 264 . The elastic member 265 is, for example, an O-ring.

The pre-humidification module 200 includes an elevating mechanism 230 configured to elevate the pre-humidification chamber 260 . The elevating mechanism 230 is configured by raising and lowering the bracket 234 attached to the pre-wetting chamber 260 along the shaft 232 extending in the vertical direction, thereby raising and lowering the pre-wetting chamber 260 . The elevating mechanism 230 can be realized by, for example, a conventional mechanism such as a motor. The elevating mechanism 230 is configured to elevate the pre-wetting chamber 260 between the degassing position shown in FIG. 3 and the cleaning position shown in FIG. 4 . As shown in FIG. 4 , the cleaning position is a position where the pre-wetting chamber 260 (elastic member 265 ) does not come into contact with the processed surface WF-a of the substrate WF. As shown in FIG. 3 , the degassing position is a position lower than the cleaning position, and in this embodiment, the pre-wetting chamber 260 (elastic member 265 ) is in contact with the processed surface WF-a of the substrate WF.

In this embodiment, the diameter of the cylindrical member 264 is substantially the same as the diameter of the substrate WF, and the elastic member 265 is in contact with the outer edge of the processed surface WF-a of the substrate WF, but it is not limited to this. For example, the diameter of the cylindrical member 264 may be larger than the diameter of the substrate WF so that the elastic member 265 is in contact with the substrate holding surface 220-a. When the pre-wetting chamber 260 is in the degassing position, a pre-wetting space 269 is formed between the pre-wetting chamber 260 and the processed surface WF-a of the substrate WF.

The pre-wetting module 200 includes a degassed liquid supply member 204 for supplying a degassed liquid (eg, degassed water) to the pre-wet space 269 . The pre-humidification module 200 includes: a degassing liquid piping 240 connecting the degassing liquid supply member 204 and the pre-wetting space 269 via a cylindrical member 264; and a degassing liquid valve 242 configured to open and close the degassing liquid piping 240 . The degassing liquid valve 242 is configured to be closed when the degassing process is not being performed, and opened when the degassing process is being performed. As shown in FIG. 3 , the degassing liquid supply means 204 supplies the degassing liquid to the pre-wetting space 269 through the degassing liquid piping 240 in a state where the pre-wetting chamber 260 is arranged at the degassing position by the elevating mechanism 230 . constituted in a manner.

The pre-wetting module 200 includes a plurality of nozzles 268 attached to the opposite surface 262 a of the cover member 262 . The pre-wetting module 200 includes a cleaning liquid supply member 202 configured to supply a cleaning liquid (for example, pure water) to the processed surface WF-a of the substrate WF via the nozzles 268 . The pre-wetting module 200 includes a cleaning fluid pipe 270 connecting the cleaning fluid supply member 202 and the nozzle 268 , and a cleaning fluid valve 272 configured to open and close the cleaning fluid pipe 270 . The cleaning fluid valve 272 is configured to be closed when the cleaning process is not performed, and opened when the cleaning process is performed. As shown in FIG. 4 , the cleaning liquid supply member 202 supplies the cleaning liquid to the surface to be processed WF-a of the substrate WF through the nozzles 268 in a state in which the pre-wet chamber 260 is arranged at the cleaning position by the elevating mechanism 230 and constitute.

The pre-wetting module 200 includes a substrate station 250 for transferring the substrate WF with the stage 220 . The substrate stage 250 includes a first arm member 250-1 and a second arm member 250-2 for holding the back surface of the processed surface WF-a of the substrate WF. The first arm member 250-1 and the second arm member 250-2 are arranged side by side in the horizontal direction and are spaced apart. The first arm member 250-1 and the second arm member 250-2 can be moved in the horizontal direction and the vertical direction by a driving device not shown. The substrate stage 250 is configured such that the substrate WF received from the transfer device 700 is installed on the stage 220 , and the substrate WF after cleaning and degassing is received from the stage 220 and sent to the transfer device 700 .

The pre-humidification module 200 includes an open pipe 290 that communicates the pre-moisture space 269 and the outside (atmosphere) of the pre-moisture chamber 260 via the cover member 262 , and an open valve 292 configured to open and close the open pipe 290 . The opening valve 292 is configured to be opened until the pre-wet space 269 is filled with the degassing liquid during the degassing process. That is, during the degassing process, when there is air in the pre-wet space 269, the air may be dissolved into the degassing liquid, and the efficiency of the degassing process may decrease. Therefore, in order to fill the pre-wetting space 269 with the degassing liquid during the degassing process, the open valve 292 is opened, and air is discharged from the pre-wetting space 269, which is a closed space. In addition, the opening valve 292 is constituted so as to be closed after filling the pre-wetting space 269 with the degassed liquid. This is because if the pre-wetting space 269 is filled with the degassing liquid, the degassing process is accelerated, and when the degassing liquid is continuously supplied from the degassing liquid supply means 204, when the opening valve 292 is opened, the degassing liquid will pass through the open valve 292. The piping 290 flows out.

Further, the pre-humidification module 200 includes a discharge pipe 280 for discharging the degassed liquid stored in the pre-moisture space 269 through the cylindrical member 264 , and a discharge valve 282 configured to open and close the discharge pipe 280 . The discharge piping 280 is connected to the buffer tank 286 . The discharge valve 282 is configured to be closed during the degassing process and to be opened after the degassing process is completed. After the degassing process is completed, the degassed liquid is stored in the buffer tank 286 via the discharge piping 280 .

The pre-humidification module 200 is provided with the bypass piping 294 which connects the opening piping 290 and the discharge piping 280, and the bypass valve 296 comprised so that the bypass piping 294 may be opened and closed. The bypass piping 294 is connected to the ratio opening valve 292 of the opening piping 290 on the side of the pre-humidification space 269 , and the ratio discharging valve 282 to the discharge piping 280 is on the side of the buffer tank 286 . The bypass valve 296 is configured to be closed until the pre-wet space 269 is filled with degassing liquid during the degassing process. Therefore, when the bypass valve 296 is opened, the air is sent to the buffer tank 286 through the open pipe 290, the bypass pipe 294, and the discharge pipe 280 before the pre-humidification space 269 is filled with the degassing liquid, and the air dissolves Degassed liquid into buffer tank 286. In addition, the bypass valve 296 is constituted so that the pre-wetting space 269 is opened after being filled with the degassed liquid. This is to promote the degassing process even after the pre-wet space 269 is filled with the degassed liquid, and when the degassed liquid is continuously supplied from the degassed liquid supply means 204, the degassed liquid flowing through the open pipe 290 is passed through the bypass pipe 294 And the discharge piping 280 is sent to the buffer tank 286.

When the pre-wetting module 200 of the present embodiment is used, the degassing treatment can be performed with the treated surface WF-a of the substrate WF facing upward. Therefore, the air inside the pattern such as the resist layer (Resist) of the surface to be treated WF-a easily rises to the degassing liquid and dissolves in, and as a result, the air inside the pattern can be efficiently replaced with the degassing liquid. In addition, when the pre-wetting module 200 of the present embodiment is used, since the cleaning liquid is sprayed from the nozzle 268 disposed opposite to the surface to be processed WF-a to clean the surface to be processed WF-a, the surface WF-a to be processed can be cleaned efficiently from the inside of the pattern Remove dust and the like inside the pattern of the processed surface WF-a. In addition, when the pre-wetting module 200 of the present embodiment is used, the stage 220 is rotated while the pre-wetting chamber 260 is in the cleaning position where the pre-wetting chamber 260 is not in contact with the processed surface WF-a of the substrate WF. The cleaning process is performed, so that dust and the like removed from the interior of the pattern do not adhere to the surface to be processed WF-a again, but can flow out to the outside in the radial direction of the substrate WF. It can be understood from the above that when the pre-wetting module 200 of the present embodiment is used, the efficiency of the cleaning process and the degassing process can be improved.

The above-mentioned embodiment shows an example in which the deaeration process is performed in a state where the pre-wetting chamber 260 is arranged at the deaeration position where the elastic member 265 is in contact with the surface to be processed WF-a of the substrate WF, but it is not limited to this. FIG. 5 is a longitudinal sectional view schematically showing the structure of a pre-wetting module of another embodiment. Since the embodiment shown in FIG. 5 is the same as the embodiment shown in FIG. 4 except that the elastic member 265 is not installed on the lower end of the cylindrical member 264 and the degassing position of the pre-wetting chamber 260 is different, the repeated structure is omitted. instruction of.

In the present embodiment, the degassing position is, as shown in FIG. 5 , a position where a gap 266 is formed between the lower end of the cylindrical member 264 and the processed surface WF-a of the substrate WF. The elevating mechanism 230 is configured such that the pre-humidification chamber 260 is arranged at a position where a gap 266 is formed between the lower end of the cylindrical member 264 and the processed surface WF-a of the substrate WF when the degassing process is performed. By forming the gap 266 , the degassing liquid supplied to the pre-wetting space 269 leaks to the outside of the pre-wetting space 269 through the gap 266 when the degassing process is performed. At this time, if the gap between the lower end of the cylindrical member 264 and the surface to be processed WF-a of the substrate WF is too large, the amount of degassing liquid flowing out from the gap increases during the degassing process. 204 is continuously supplied with degassed liquid, and it is still difficult to fill the pre-wet space 269 with the degassed liquid. Therefore, the gap 266 is preferably a gap where the amount of the degassed liquid leaking from the gap 266 during the degassing process is smaller than the amount of the degassed liquid supplied from the degassed liquid supply member 204 to the pre-wet space 269, for example, a coefficient cm or less, and The interval should be a few mm or less.

According to this embodiment, in addition to improving the efficiency of the cleaning process and the degassing process as in the embodiment shown in FIG. 3, the efficiency of the degassing process can be further improved. That is, according to the present embodiment, since the degassing liquid leaks from the gap 266 during the degassing process, a flow path of the degassing liquid is formed from the center of the processed surface WF-a of the substrate WF to the outer edge. . Therefore, the degassing liquid into which air is dissolved in the pattern of the protective layer of the surface to be processed WF-a or the like can be leaked from the gap 266, and the degassing liquid without air supplied from the degassing liquid supply member 204 can be sequentially Sent to the processed surface WF-a. As a result, since the air inside the pattern can be efficiently replaced with the degassing liquid, the degassing treatment can be efficiently performed.

Next, the pre-wetting method of this embodiment is demonstrated. FIG. 6 is a flow chart showing a pre-wetting method using a pre-wetting module of an embodiment. As shown in FIG. 6 , in the pre-wetting method, the substrate WF is set on the stage 220 with the substrate stage 250 facing the to-be-processed surface WF-a upward (setting step 101 ). Continuing, the pre-wetting method rotates the stage 220 by the rotation mechanism 224 (rotation step 102). The rotating step 102 continues until the subsequent cleaning process and degassing process are completed.

Continuing, the pre-wetting method configures the pre-wetting chamber 260 in the cleaning position (first configuration step 103). Continuing, in the pre-wetting method, in the state where the pre-wetting chamber 260 is arranged at the cleaning position in the first arrangement step 103, the cleaning solution valve 272 is opened, and the cleaning solution is supplied to the processed surface WF- of the substrate WF through the nozzle 268 a (cleaning step 104). Continuing, the pre-wetting method determines whether the cleaning process of the substrate WF is completed (step 105 ). In the pre-wetting method, the cleaning step 104 is repeatedly performed until the cleaning process of the substrate WF is completed.

In addition, in the pre-wetting method, when it is determined that the cleaning process of the substrate WF has been completed (step 105 , Yes), the pre-wetting chamber 260 is arranged at a degassing position lower than the cleaning position (second arrangement step 106 ). In the case of the pre-wetting module 200 of the embodiment shown in FIG. 3 , the second disposition step 106 is at the degassing position where the elastic member 265 mounted on the lower end of the cylindrical member 264 is in contact with the processed surface WF-a of the substrate WF A pre-wetting chamber 260 is configured. In addition, in the case of the pre-wetting module 200 of the embodiment shown in FIG. 5, the second arrangement step 106 is to form a degassing gap 266 between the lower end of the cylindrical member 264 and the processed surface WF-a of the substrate WF The location configures the pre-wetting chamber 260 .

Continuing, in the pre-wetting method, when the opening valve 292 provided in the opening piping 290 is closed, the opening valve 292 is opened (the opening step 107 ). Continuing, in the pre-wetting method, when the bypass valve 296 provided in the bypass piping 294 is opened, the bypass valve 296 is closed (bypass operation stop step 108 ). Thereby, the air in the pre-humidification space 269 can be released to the atmosphere, and the air in the pre-humidification space 269 can be prevented from flowing into the buffer tank 286 . In addition, the second configuration step 106 to the bypass operation stop step 108 may be replaced in sequence, or may be performed simultaneously.

Continuing, the pre-wetting method opens the degassing liquid valve 242 and supplies the degassing liquid to the pre-wetting space 269 in a state where the pre-wetting chamber 260 is arranged at the degassing position in the second arrangement step 106 (the degassing step 109 ). When the degassing step 109 is performed and the degassing liquid is supplied to the pre-wetting space 269 , the pre-wetting method causes the degassing liquid supplied to the pre-wetting space 269 to leak to the outside of the pre-wetting space 269 through the gap 266 (leaking step 110 ) . The leakage step 110 is not performed when the pre-wetting method of the pre-wetting module 200 of the embodiment shown in FIG. 3 is used.

The opening valve 292 opened by the opening step 107 is opened in the degassing step 109 until the pre-wetting space 269 is filled with the degassing liquid. In addition, the bypass valve 296 closed by the bypass operation stop step 108 is closed in the degassing step 109 until the pre-wet space 269 is filled with the degassing liquid. That is, the pre-wetting method determines whether or not the pre-wetting space 269 has been filled with the degassed liquid (step 111 ). Step 111 is performed, for example, using a liquid level sensor provided in the pre-wetting chamber 260 . In the pre-wetting method, the degassing step 109 and the leaking step 110 are repeatedly performed until the pre-wetting space 269 is filled with the degassing liquid.

In addition, when the pre-humidification method determines that the pre-humidification space 269 is filled with the degassing liquid (step 111, YES), the open valve 292 is closed if the open valve 292 is opened (operation stop step 112), and if the bypass valve 292 is opened 296 is closed, then the bypass valve 296 is opened (bypass step 113). Thereby, the degassing liquid supplied to the pre-wetting space 269 can flow into the buffer tank 286 via the bypass pipe 294 and be reused.

Continuing, the pre-wetting method determines whether the degassing process of the substrate WF has ended (step 114 ). The pre-wetting method returns to the degassing step 109 and repeats the process until the degassing process of the substrate WF ends. In addition, in the pre-wetting method, when it is determined that the degassing process of the substrate WF has been completed (step 114 , YES), the discharge valve 282 is opened (step 115 ). Thereby, the degassed liquid can be discharged from the pre-wet space 269 . Continuing, in the pre-wetting method, the substrate WF is carried out from the pre-wetting module 200 by the substrate stage 250 and the transfer device 700 (step 116 ), and the pre-processing is ended.

Several embodiments of the present invention have been described above. However, the embodiments of the present invention described above are intended to facilitate the understanding of the present inventors and do not limit the present invention. This invention can be changed and improved in the range which does not deviate from the meaning, and it is a matter of course that this invention includes the equivalents. In addition, the respective constituent elements described in the scope of the claims and the specification can be arbitrarily combined or omitted within the scope of solving at least a part of the above-mentioned problems or the scope of achieving at least a part of the effects.

An embodiment of the present application discloses a pre-wetting module including: a stage configured to hold the back surface of a substrate to be processed facing upward; and a rotation mechanism for rotating the stage and constitute a pre-wetting chamber having a cover member having an opposing surface opposite to the treated surface of the substrate, and a cylindrical member attached to an outer edge of the opposing surface of the cover member, and a lift mechanism, which is a The pre-wetting chamber is formed in such a manner as to be raised and lowered; the degassing liquid supply means is formed to supply the degassing liquid to the pre-wetting space formed between the pre-wetting chamber and the surface to be processed of the substrate; A nozzle is attached to the said opposing surface of the said cover member; and a cleaning liquid supply member is comprised so that a cleaning liquid may be supplied to the to-be-processed surface of the said substrate through the said nozzle.

Furthermore, an embodiment of the present application discloses a pre-wetting module, wherein the cleaning solution supply member is located at a cleaning position where the pre-wetting chamber does not contact the processed surface of the substrate or the substrate holding surface of the stage, by means of the cleaning position. In a state where the pre-wetting chamber is arranged by the elevating mechanism, the cleaning liquid is supplied to the surface to be processed of the substrate through the nozzle, and the degassing liquid supply means is located at a degassing position lower than the cleaning position. It is constituted by supplying a degassing liquid to the pre-wetting space in a state where the pre-wetting chamber is arranged by a lift mechanism.

Furthermore, an embodiment of the present application discloses a pre-wetting module. When the lifting mechanism is used for degassing treatment, the lower end of the cylindrical member is located between the treated surface of the substrate or the substrate holding surface of the stage. The pre-humidification chamber is arranged in a degassing position with a gap formed therebetween.

Furthermore, an embodiment of the present application discloses a pre-wetting module. The pre-wetting chamber includes an elastic member, which is mounted on the lower end of the cylindrical member. When the lifting mechanism is performing degassing treatment, the elastic member is connected to the elastic member. The pre-wetting chamber is configured in such a manner that the degassing position where the processed surface of the substrate or the substrate holding surface of the stage is in contact is arranged.

Furthermore, an embodiment of the present application discloses a pre-wetting module, further comprising: an opening pipe that communicates with the outside of the pre-wetting space and the pre-wetting chamber through the cover member; and an opening valve that opens and closes The above-mentioned open piping is constructed.

Furthermore, an embodiment of the present application discloses a pre-humidification module further comprising: a discharge pipe for discharging the degassed liquid stored in the pre-moisture space; and a discharge valve for opening and closing the discharge pipe The bypass piping is configured to connect the open piping and the discharge piping, and a bypass valve is configured to open and close the bypass piping.

Furthermore, an embodiment of the present application discloses a pre-wetting method including: a setting step of setting a substrate on a stage with the surface to be processed facing up; a rotating step of rotating the stage; and a first arrangement a step of disposing a pre-wetting chamber having a cover member having an opposite surface opposite to the processed surface of the substrate and a cylindrical member mounted on an outer edge of the opposite surface of the cover member at a cleaning position; cleaning step wherein the pre-wetting chamber is arranged at the cleaning position by the first arrangement step, and a cleaning solution is supplied to the surface to be processed of the substrate through a nozzle mounted on the opposite surface of the cover member; the first Two arranging steps in which the pre-wetting chamber is arranged at a degassing position lower than the cleaning position; and a degassing step in which the pre-wetting chamber is arranged in the degassing position by the second arranging step In this state, the degassed liquid is supplied to the pre-wet space.

Furthermore, an embodiment of the present application discloses a pre-wetting method, wherein the second disposing step is to form a gap between the lower end of the cylindrical member and the processed surface of the substrate or the substrate holding surface of the stage. The degassing position is configured in such a way that the aforementioned pre-wetting chamber is arranged.

Furthermore, one embodiment of the present application discloses a pre-wetting method further including a leaking step of leaking the degassed liquid supplied to the pre-wetting space to the outside of the pre-wetting space through the gap.

Furthermore, an embodiment of the present application discloses a pre-wetting method, wherein the second disposition step is based on the elastic member mounted on the lower end of the cylindrical member, the processed surface of the substrate or the substrate holding surface of the stage. The contacting degassing position is configured in such a way that the aforementioned pre-wetting chamber is arranged.

Furthermore, an embodiment of the present application discloses a pre-wetting method, further comprising: an opening step of opening an opening valve provided in an opening pipe that communicates with the outside of the pre-wetting space and the pre-wetting chamber via the cover member, Until the pre-wetting space is filled with degassing liquid in the degassing step; and the operation stop step is to close the opening valve after the pre-wetting space is filled with degassing liquid in the degassing step.

Furthermore, an embodiment of the present application discloses a pre-wetting method, further comprising: a bypass operation stop step, which is provided to connect a discharge pipe for discharging the degassed liquid stored in the pre-wetting space and the open pipe. The bypass valve of the bypass piping until the pre-wet space is filled with degassing liquid in the degassing step; , open the aforementioned bypass valve.

200: Pre-wet module 202: Cleaning fluid supply member 204: Degassing liquid supply member 220: stage 220-a: Substrate holding surface 222: Shaft 224: Rotary Mechanism 230: Lifting mechanism 232: Shaft 234: Bracket 240: Degassing liquid piping 242: Degassing liquid valve 250: Substrate stage 250-1: First Arm Member 250-2: Second Arm Member 260: Pre-wet chamber 262: Cover member 262a: Opposite side 264: Cylindrical member 265: elastic member 266: Gap 268: Nozzle 269: Pre-wet space 270: Cleaning fluid piping 272: Cleaning fluid valve 280: Discharge piping 282: Discharge valve 286: Buffer slot 290: Open piping 292: Open valve 294: Bypass piping 296: Bypass valve 1000: Coating device WF: Substrate WF-a: processed surface

FIG. 1 is a perspective view showing the overall configuration of the coating apparatus of the present embodiment.

FIG. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment.

Fig. 3 is a longitudinal sectional view schematically showing the structure of a pre-wetting module according to an embodiment. FIG. 4 is a longitudinal sectional view schematically showing a state in which a cleaning process is performed using the pre-wetting module of one embodiment. FIG. 5 is a longitudinal sectional view schematically showing the structure of a pre-wetting module of another embodiment. FIG. 6 is a flow chart showing a pre-wetting method using a pre-wetting module of an embodiment.

200: Pre-wet module

202: Cleaning fluid supply member

204: Degassing liquid supply member

220: stage

220-a: Substrate holding surface

222: Shaft

224: Rotary Mechanism

230: Lifting mechanism

232: Shaft

234: Bracket

240: Degassing liquid piping

242: Degassing liquid valve

250: Substrate stage

250-1: First Arm Member

250-2: Second Arm Member

260: Pre-wet chamber

262: Cover member

262a: Opposite side

264: Cylindrical member

265: elastic member

268: Nozzle

269: Pre-wet space

270: Cleaning fluid piping

272: Cleaning fluid valve

280: Discharge piping

282: Discharge valve

286: Buffer slot

290: Open piping

292: Open valve

294: Bypass piping

296: Bypass valve

WF: Substrate

WF-a: processed surface

Claims (8)

A pre-wetting module of a coating device, comprising: a stage configured to hold the backside of a substrate facing upward to be processed; a rotation mechanism configured to rotate the stage; A pre-wetting chamber comprising: a cover member having an opposite surface opposite to the processed surface of the substrate; a cylindrical member attached to an outer edge of the opposite surface of the cover member; and a lift mechanism for making The pre-wetting chamber is formed in such a way that the pre-wetting chamber is raised and lowered; the degassing liquid supply means is configured to supply the de-gassing liquid to the pre-wetting space formed between the pre-wetting chamber and the surface to be processed of the substrate; the nozzle, It is mounted on the opposite surface of the cover member; a cleaning liquid supply member is configured to supply cleaning liquid to the surface to be processed of the substrate through the nozzle; an open pipe communicates through the cover member The outside of the pre-wetting space and the pre-wetting chamber; an open valve, which is formed by opening and closing the open piping; a discharge pipe, which is used to discharge the degassed liquid stored in the pre-wetting space; a discharge valve, which is It is constructed by opening and closing the discharge piping; a bypass piping is connected with the opening piping and the discharging piping; and a bypass valve is constructed by opening and closing the bypass piping. The pre-wetting module according to claim 1, wherein the cleaning solution supply member is located in a cleaning position where the pre-wetting chamber does not contact the processed surface of the substrate or the substrate holding surface of the stage, by means of In the state where the pre-wetting chamber is arranged by the elevating mechanism, the cleaning liquid is supplied to the surface to be processed of the substrate through the nozzle, and the degassing liquid supply means is in a degassing position lower than the cleaning position. It is comprised so that a degassing liquid may be supplied to the said pre-wetting space in the state which arrange|positioned the said pre-wetting chamber by the said raising-lowering mechanism. The pre-wetting module according to claim 2, wherein a gap is formed between the lower end of the cylindrical member and the processed surface of the substrate or the substrate holding surface of the stage when the lifting mechanism is used for degassing treatment. The degassing position is configured in such a way that the aforementioned pre-wetting chamber is arranged. The pre-wetting module according to claim 2, wherein the pre-wetting chamber comprises an elastic member, which is mounted on the lower end of the cylindrical member, and when the lifting mechanism performs the degassing treatment, the elastic member and the substrate are processed between the elastic member and the substrate. The above-mentioned pre-wetting chamber is arranged in the degassing position where the surface or the substrate holding surface of the above-mentioned stage is in contact. A pre-wetting method for plating treatment, comprising: a setting step of placing a substrate on a stage with the surface to be processed up; a rotation step of rotating the stage; and a first arrangement step of placing a pre-wet The wet chamber is arranged at the cleaning position, and the pre-wet chamber has a cover member on the opposite surface opposite to the processed surface of the substrate, and a cylindrical member mounted on the outer edge of the opposite surface of the cover member; the cleaning step, the supplying a cleaning solution to the surface to be processed of the substrate through a nozzle mounted on the opposite surface of the cover member in a state in which the pre-wet chamber is arranged at the cleaning position by the first arrangement step; A second arranging step of arranging the pre-wetting chamber at a degassing position lower than the cleaning position; and a degassing step of arranging the pre-wetting chamber at the degassing position by the second arranging step In the state, the degassing liquid is supplied to the pre-wetting space; the opening step is to open the opening valve provided in the open piping that communicates the pre-wetting space and the outside of the pre-wetting chamber through the cover member, until the degassing In the degassing step, the pre-wetting space is filled with degassing liquid; the operation stopping step is to close the opening valve after the pre-wetting space is filled with degassing liquid in the degassing step; the bypass operation is stopped in the step of stopping the operation. closing the bypass valve connected to the bypass pipe connecting the discharge pipe for discharging the degassed liquid stored in the pre-wetting space and the bypass pipe of the open pipe, until the pre-wetting space is filled with the degassing liquid in the degassing step; and a bypass step, which is to open the bypass valve after filling the pre-wet space with degassed liquid in the degassing step. The pre-wetting method according to claim 5, wherein the second disposing step is to dispose the degassing position where a gap is formed between the lower end of the cylindrical member and the processed surface of the substrate or the substrate holding surface of the stage It is constructed in the form of a pre-wetting chamber. The pre-wetting method of claim 6, further comprising a leaking step of leaking the degassed liquid supplied to the pre-wetting space to the outside of the pre-wetting space through the gap. The pre-wetting method of claim 5, wherein the second disposing step is at a degassing position where the elastic member mounted on the lower end of the cylindrical member is in contact with the processed surface of the substrate or the substrate holding surface of the stage It is constituted by arranging the aforementioned pre-humidification chamber.

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