KR102404458B1 - Plating apparatus and plating processing method - Google Patents

Abstract

The position of the substrate holder is easily adjusted.
The plating module 400 includes a plating bath 410 for accommodating a plating solution, and a substrate for holding and holding a substrate Wf in a state to face a plated surface Wf-a in the plating solution accommodated in the plating bath 410 . A holder 440 , a lifting mechanism 480 for raising and lowering the substrate holder 440 , and a moving mechanism 490 for moving the substrate holder 440 in a direction orthogonal to the lifting direction of the substrate holder 440 . include

Description

Plating apparatus and plating processing method

This application relates to a plating apparatus and a plating processing method.

As an example of a plating apparatus, a cup-type electrolytic plating apparatus is known. The cup-type electrolytic plating apparatus immerses a substrate (for example, a semiconductor wafer) held in a substrate holder with a surface to be plated facing downward in a plating solution, and applies a voltage between the substrate and an anode to apply a voltage between the substrate and the surface of the substrate. A conductive film is deposited.

In a cup-type electrolytic plating apparatus, it is calculated|required to make the plating film thickness formed in a board|substrate uniform over the whole board|substrate. In this regard, for example, in Patent Document 1, by disposing a ring-shaped shielding member capable of shielding an electric field between the anode and the substrate, the current density in the vicinity of the outer edge of the substrate is lowered, thereby reducing the substrate. It is disclosed to suppress the formation of a thick plating film around the periphery of the .

Japanese Patent Laid-Open No. 2014-51697

However, since there is a fear that the plating film thickness of the entire substrate cannot be sufficiently uniformed only by arranging the shielding member, another method for equalizing the plating film thickness is required.

In this point, the inventors of this application discovered that the positional relationship between the anode axis of a plating apparatus and the axis center of a board|substrate affected the profile of a plating film thickness. Also, adjusting the positional relationship between the axis of the anode and the axis of the substrate is important, for example, in aligning the axis when assembling a plating apparatus. In addition, when starting a new plating process in which the type of substrate or the type of plating solution is different, based on the tendency of the profile of the plating film thickness of the substrate in the plating process, the axis of the anode and the axis of the substrate are aligned, Alternatively, adjustment such as daring to shift the shaft center is required. In order to adjust the positional relationship between the axis of the anode and the axis of the substrate, it is important to easily adjust the position of the substrate holder holding the substrate.

Then, one object of this application is to perform position adjustment of a board|substrate holder easily.

According to one embodiment, a plating tank for accommodating a plating solution, a substrate holder for holding a substrate in a state to be plated facing the plating solution accommodated in the plating bath, a lifting mechanism for lifting and lowering the substrate holder, and the substrate; A plating apparatus is disclosed, including a moving mechanism for moving the substrate holder in a direction orthogonal to a lifting/lowering direction of the holder.

1 is a perspective view showing the overall configuration of a plating apparatus of the present embodiment.
Fig. 2 is a plan view showing the overall configuration of the plating apparatus of the present embodiment.
Fig. 3 is a longitudinal sectional view schematically showing the configuration of the plating module of the present embodiment.
Fig. 4 is a perspective view schematically showing the configuration of the plating module of the present embodiment.
5 : is a figure which shows the plating film thickness profile of the board|substrate at the time of adjusting the position of the X direction of a board|substrate holder.
6 is a flowchart illustrating a plating method according to the present embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. In the drawings to be described below, the same or corresponding components are denoted by the same reference numerals, and overlapping descriptions are omitted.

<Entire configuration of plating device>

1 is a perspective view showing an overall configuration of a plating apparatus of the present embodiment. Fig. 2 is a plan view showing the overall configuration of the plating apparatus of the present embodiment. 1 and 2 , the plating apparatus 1000 includes a load port 100 , a transfer robot 110 , an aligner 120 , a pre-wet module 200 , a pre-soak module 300 , and plating. A module 400 , a cleaning module 500 , a spin rinse dryer 600 , a conveying device 700 , and a control module 800 are provided.

The load port 100 is a module for loading a substrate stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 , or for unloading a substrate from the plating apparatus 1000 to the cassette. In the present embodiment, four load ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring a substrate, and is configured to transfer a substrate between the load port 100 , the aligner 120 , and the transfer device 700 . When transferring a substrate between the transfer robot 110 and the transfer device 700 , the transfer robot 110 and the transfer device 700 can transfer the substrate through a temporary placement table (not shown).

The aligner 120 is a module for aligning a position such as an orientation flat or a notch of a substrate in a predetermined direction. Although the two aligners 120 are arranged side by side in the horizontal direction in this embodiment, the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 replaces the air inside the pattern formed on the substrate surface with the treatment liquid by immersing the plated surface of the substrate before plating with a treatment liquid such as pure water or degassed water. The pre-wet module 200 is configured to perform a pre-wet process for facilitating supply of the plating solution to the inside of the pattern by replacing the treatment solution inside the pattern with the plating solution during plating. In the present embodiment, the two pre-wet modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wet modules 200 are arbitrary.

In the presoak module 300, for example, an oxide film having a high electrical resistance existing on the surface of a seed layer formed on the plated surface of the substrate before plating is removed by etching with a treatment solution such as sulfuric acid or hydrochloric acid to clean the surface of the substrate to be plated. or to perform an activating pre-soak process. In the present embodiment, two pre-soak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-soak modules 300 are arbitrary. The plating module 400 performs a plating process on the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged in parallel with 3 units in the vertical direction and 4 units in the horizontal direction, and a total of 24 plating modules 400 are provided. 400), the number and arrangement are arbitrary.

The cleaning module 500 is configured to perform a cleaning treatment on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating treatment. Although the two cleaning modules 500 are arranged side by side in the vertical direction in the present embodiment, the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. Although two spin rinse dryers are arranged side by side in the vertical direction in this embodiment, the number and arrangement of the spin rinse dryers are arbitrary. The conveying apparatus 700 is an apparatus for conveying a substrate between a plurality of modules in the plating apparatus 1000 . The control module 800 is configured to control a plurality of modules of the plating apparatus 1000 , and may be configured as, for example, a general computer or a dedicated computer having an input/output interface with an operator.

An example of a series of plating processes by the plating apparatus 1000 is demonstrated. First, the substrate accommodated in the cassette is loaded into the load port 100 . Subsequently, the transfer robot 110 takes out the substrate from the cassette of the load port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the positions of the orientation flat and the notch of the substrate in a predetermined direction. The transfer robot 110 transfers the substrate aligned with the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wet module 200 . The pre-wet module 200 performs a pre-wet process on the substrate. The transfer device 700 transfers the pre-wetted substrate to the pre-soak module 300 . The presoak module 300 performs a presoak process on the substrate. The transfer device 700 transfers the substrate subjected to the presoak process to the plating module 400 . The plating module 400 performs a plating process on the substrate.

The transfer device 700 transfers the substrate subjected to the plating process to the cleaning module 500 . The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate subjected to the cleaning process to the spin rinse dryer 600 . The spin rinse dryer 600 performs a drying process on the substrate. The conveying apparatus 700 delivers the board|substrate to which the drying process was performed to the conveyance robot 110 . The transfer robot 110 transfers the substrate received from the transfer apparatus 700 to the cassette of the load port 100 . Finally, the cassette containing the substrate is unloaded from the load port 100 .

<Configuration of plating module>

Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same structure, only one plating module 400 is demonstrated. Fig. 3 is a longitudinal sectional view schematically showing the configuration of a plating module according to the present embodiment. As shown in FIG. 3 , the plating module 400 includes a plating tank 410 for accommodating a plating solution. The plating module 400 includes a membrane 420 that is vertically spaced apart from the inside of the plating bath 410 . The inside of the plating bath 410 is divided into a cathode region 422 and an anode region 424 by a membrane 420 . A plating solution is respectively filled in the cathode region 422 and the anode region 424 . An anode 430 is provided on the bottom surface of the plating bath 410 of the anode region 424 . A resistor 450 is disposed in the cathode region 422 to face the membrane 420 . The resistor 450 is a member for achieving uniformity of the plating process on the plated surface Wf-a of the substrate Wf, and is constituted by a plate-shaped member having a large number of holes formed therein. The plating module 400 may include, on the upper portion of the resistor 450 , a paddle (not shown) for stirring the plating solution. In addition, the plating module 400 includes a sensor 455 for measuring the thickness of the plating film formed on the to-be-plated surface Wf-a of the substrate Wf by the plating process. In the present embodiment, the sensor 455 is disposed at the center of the upper surface of the resistor 450 , but it is not limited thereto, and the location of the sensor 455 is arbitrary.

In addition, the plating module 400 includes a substrate holder 440 for holding the substrate Wf in a state where the plated surface Wf-a faces downward. The substrate holder 440 is provided with a power supply contact for supplying power to the substrate Wf from a power source (not shown). A shaft 442 is fixed to the upper surface of the substrate holder 440 . A holding member 448 for holding the substrate holder 440 is provided on the shaft 442 . The holding member 448 includes a horizontal holder 444 for holding the substrate holder 440 via a shaft 442 and a vertical holder 446 for holding the horizontal holder 444 . include The vertical holding stand 446 is installed on the elevating linear guide 482 so as to be movable in the vertical direction.

The plating module 400 includes a rotation mechanism 460 for rotating the substrate holder 440 so that the substrate Wf rotates around a virtual rotation axis extending vertically from the center of the surface to be plated Wf-a. do. The rotation mechanism 460 can be implemented by a well-known mechanism, such as a motor, for example. In the present embodiment, a pulley 462 is provided on the shaft 442 , and a belt 464 is provided on the pulley 462 . Rotation mechanism 460 is configured to rotate substrate holder 440 by rotating shaft 442 via belt 464 and pulley 462 .

In addition, the plating module 400 includes a tilt mechanism 470 for tilting the substrate holder 440 . In the present embodiment, the inclination mechanism 470 includes a cylinder 472 connected to a vertical holder 446 via a rotation shaft, and a piston rod 474 connected to a horizontal holder 444 via a rotation shaft. . The tilt mechanism 470 can adjust the angle of the substrate holder 440 by pulling the piston rod 474 by the cylinder 472 . The inclination mechanism 470 is not limited to the above configuration, and can be realized by a known mechanism such as a tilt mechanism.

The plating module 400 includes a lifting mechanism 480 for raising and lowering the substrate holder 440 along the Z-axis (vertical direction). In the present embodiment, the lifting mechanism 480 includes a lifting/lowering linear guide 482 extending in the lifting/lowering direction and a lifting/lowering drive member ( 484). The raising/lowering drive member 484 can be implemented by well-known mechanisms, such as a motor, for example. The elevating mechanism 480 is configured to elevate the substrate holder 440 by moving the vertical holder 446 in the vertical direction along the elevating linear guide 482 . The plating module 400 uses the lifting mechanism 480 to immerse the substrate Wf in the plating solution of the cathode region 422 , and applies a voltage between the anode 430 and the substrate Wf, whereby the substrate It is comprised so that the plating process may be given to the to-be-plated surface Wf-a of (Wf).

The plating module 400 includes a moving mechanism 490 for moving the substrate holder 440 in a direction orthogonal to the elevation direction of the substrate holder 440 . Hereinafter, the movement mechanism 490 is demonstrated. Fig. 4 is a perspective view schematically showing the configuration of the plating module of the present embodiment. In FIG. 4 , the rotation mechanism 460 , the inclination mechanism 470 , the lifting mechanism 480 , and the like are omitted for clarity of illustration.

As shown in FIG. 4 , the moving mechanism 490 includes a first moving mechanism 490- for moving the substrate holder 440 in a first direction (Y-axis direction) orthogonal to the elevating direction (Z-axis direction). 1) and a second moving mechanism 490 - 2 for moving the substrate holder 440 in the elevating direction and in a second direction (X-axis direction) orthogonal to the first direction.

The first moving mechanism 490-1 includes a first linear guide 4792 extending in a first direction, a first support 493 provided on the first linear guide 492, and a first support 493 . and a first driving member 491 for moving along the first linear guide 492 . The second moving mechanism 490 - 2 includes a second linear guide 496 extending in the second direction, a second support 497 provided on the second linear guide 496 , and a second support 497 . and a second driving member 495 for moving along the second linear guide 496 . The 1st movement mechanism 490-1 and the 2nd movement mechanism 490-2 can be implement|achieved with well-known mechanisms, such as a linear guide, for example.

The 1st movement mechanism 490-1 and the 2nd movement mechanism 490-2 are overlapped on the base 494, and are arrange|positioned. In this embodiment, the 1st movement mechanism 490-1 is arrange|positioned on the base 494, and the 2nd movement mechanism 490-2 is arrange|positioned on the 1st movement mechanism 490-1. The lifting/lowering linear guide 482 is fixed on the second support 497 . In addition, you may replace the arrangement|positioning of the 1st moving mechanism 490-1 and the 2nd moving mechanism 490-2. You may provide only either one of the 1st movement mechanism 490-1 and the 2nd movement mechanism 490-2. The rotating mechanism 460 , the inclination mechanism 470 , the lifting mechanism 480 , and the moving mechanism 490 may be controlled through the control module 800 .

Since the plating module 400 of this embodiment is provided with the moving mechanism 490, the board|substrate in the direction (X-axis direction and Y-axis direction) orthogonal to the raising/lowering direction (Z-axis direction) of the board|substrate holder 440. The holder 440 may be easily moved. Accordingly, the plating module 400 can easily adjust the position of the substrate holder 440 . For example, since the plating module 400 is a large device and the number of parts is large, due to the tolerance of each part and assembly tolerance, when the plating module 400 is installed, the substrate holder 440 (substrate holder 440 ) )), and the axial center of the anode 430 and the axial center of the substrate (Wf) held by the aligning difficulties accompany. In this regard, according to the plating module 400 of the present embodiment, the moving mechanism 490 is a substrate holder so that the axis of the anode 430 and the axis of the substrate Wf held by the substrate holder 440 are aligned. 440 can be moved. For example, the substrate holder 440 may be moved in the X-axis direction and the Y-axis direction through an input interface included in the control module 800 . Accordingly, the plating module 400 of the present embodiment can easily perform axial alignment in order to ensure the uniformity of the entire substrate of the plating film thickness.

In particular, when a plurality (24 units) of plating modules 400 are included as in the plating apparatus 1000 of the present embodiment, the substrate holder 440 and the anode 430 are formed for each plating module 400 . It takes a lot of effort to perform shaft alignment. In this respect, if the moving mechanism 490 is provided as in the present embodiment, the plurality of plating modules 400 can be easily axially aligned.

In addition, the moving mechanism 490 of the plating module 400 of the present embodiment can be configured to move the substrate holder 440 based on the plating film thickness measured by the sensor 455 . That is, for the purpose of improving the uniformity of the plating film thickness of the substrate Wf, for example, in order to fine-tune the film thickness of the outer edge of the substrate Wf, the anode 430 and the substrate Wf are It is known to adjust the distance between them (distance in the Z direction). However, if the distance between the anode 430 and the substrate Wf is increased, the distance between the substrate and the paddle increases, and there is a concern that the plating solution stirring efficiency in the vicinity of the surface to be plated Wf-a decreases. On the other hand, the inventors of the present application have found that the positional relationship between the axis of the anode 430 and the axis of the substrate Wf affects the profile of the plating film thickness.

5 : is a figure which shows the plating film thickness profile of the board|substrate at the time of adjusting the position of the X direction of a board|substrate holder. In Fig. 5, the horizontal axis is the radius (mm) of the substrate Wf, and the vertical axis is the plating film thickness (arbitrary unit). 5 shows the case where the axis of the substrate Wf and the axis of the anode 430 are aligned (X=0), and the case where the axis of the substrate Wf is shifted in the X direction with respect to the axis of the anode 430 The profile of the plating film thickness of (X=0.2, 0.4, 0.6, 1.0) is shown.

As shown in FIG. 5 , if the axis center of the substrate Wf is daringly shifted in the X direction with respect to the axis center of the anode 430 , the film thickness of the substrate Wf changes particularly at the outer edge. In the present embodiment, when plating is performed with the axis center of the substrate Wf shifted by 0.6 mm with respect to the axis center of the anode 430, the uniformity of the plating film thickness of the substrate Wf can be improved. According to this embodiment, since the axis center of the substrate holder 440 can be adjusted with respect to the axis center of the anode 430, there is no separation between the substrate Wf and the paddle, that is, the stirring efficiency of the plating liquid is reduced. Without it, the uniformity of the plating film thickness can be improved.

Further, even if the initial setting is made so that the uniformity of the plating film thickness is improved, it is difficult to continuously ensure the uniformity of the plating film thickness due to the aging of the plating module 400 or a change in the plating process. In this case, a readjustment operation of the plating module 400 is required as a maintenance operation. In this respect, according to the present embodiment, since the axis center of the substrate holder 440 (substrate Wf) side can be adjusted through the control module 800 , the positions of the substrate holders 440 of the plurality of plating modules 400 . is a parameter, and it is possible to directly adjust the position of the substrate holder 440 .

Next, the plating processing method of this embodiment is demonstrated. 6 is a flowchart illustrating a plating method according to the present embodiment. The flowchart of FIG. 6 shows the process at the time of installation of the plating module 400 as an example.

As shown in FIG. 6 , in the plating method, the substrate holder 440 is moved in a direction orthogonal to the elevation direction of the substrate holder 440 using the moving mechanism 490 (first moving step 110 ). ). Specifically, in the first moving step 110 , the axis of the anode 430 disposed inside the plating bath 410 and the axis of the substrate Wf held by the substrate holder 440 are aligned with the substrate. The holder 440 is moved. The first movement step 110 includes a first movement step of moving the substrate holder 440 in a first direction (X-axis direction) orthogonal to the elevation direction (Z-axis direction), and a first movement step of moving the substrate holder 440 in the elevation direction. and a second moving step of moving in a second direction (Y-axis direction) orthogonal to the first direction. The first movement step 110 may be executed, for example, by an operator inputting movement amounts in the X-axis direction and the Y-axis direction of the substrate holder 440 through the input interface of the control module 800 . By the first moving step 110 , the alignment of the axes between the substrate Wf and the anode 430 is completed.

Then, in the plating method, the substrate Wf is installed in the substrate holder 440 (step 120). Then, in the plating method, the substrate holder 440 is lowered in the plating tank 410 using the lifting mechanism 480 (lowering step 130 ). Subsequently, in the plating method, the substrate holder 440 is rotated using the rotation mechanism 460 , and the substrate Wf held by the substrate holder 440 lowered in the plating bath 410 is applied. A plating process is performed (plating step 140).

Then, the plating method measures the plating film thickness formed in the to-be-plated surface Wf-a of the board|substrate Wf by the plating step 140 (measurement step 150). The measurement step 150 can measure the plating film thickness using the sensor 455 .

Then, the plating method moves the substrate holder 440 using the moving mechanism 490 based on the plating film thickness measured by the measurement step 150 (2nd moving step 160). In the second moving step 160, for example, while shifting the axis of the substrate Wf in the X direction and/or the Y direction with respect to the axis of the anode 430, the substrate is placed at a position where the uniformity of the plating film thickness is highest. The holder 440 may be moved.

Then, the plating method determines whether or not the plating process should be finished (determination step 170). The determination step 170 may determine whether or not the plating process should be terminated, for example, based on whether a predetermined time has elapsed since the start of the plating process, or whether a predetermined plating film thickness has been formed, etc. . In the plating method, if it is determined that the plating process should not be finished (determining step 170, NO), the process returns to the plating step 140 to repeat the process. On the other hand, in the plating method, if it is determined that the plating process should be finished (decision step 170, "Yes"), the process ends.

In addition, since the flowchart of FIG. 6 shows the process at the time of installation of the plating module 400, although the axial alignment of the board|substrate Wf and the anode 430 (1st movement step 110) was performed initially, 1 moving step 110 does not have to be executed. In addition, although the flowchart of FIG. 6 showed the example of moving the substrate holder 440 (2nd moving step 160), performing a plating process, it is not limited to this. For example, the plating module 400 may perform plating on a plurality of substrates by shifting the axis of the substrate Wf from the axis of the anode 430 by different amounts, as shown in FIG. 5 . . As a result, the plating module 400 can obtain a plurality of plating film thickness profiles, and by comparing them, it is possible to obtain an optimal movement amount. In this case, the plating module 400 can move the substrate holder 440 based on the optimal amount of movement required before the plating process with respect to the substrate on which the same plating process is performed.

As mentioned above, although some embodiment of this invention was described, embodiment of said invention is for making the understanding of this invention easy, and does not limit this invention. It goes without saying that the present invention can be changed and improved without departing from the spirit thereof, and that equivalents thereof are included in the present invention. In addition, within the range which can solve at least a part of the above-mentioned subject, or the range which exhibits at least a part of an effect, arbitrary combinations of each component described in a claim and the specification, or abbreviation|omission is possible.

According to an embodiment of the present application, a plating tank for accommodating a plating solution, a substrate holder for holding a substrate in a state to be plated facing the plating solution accommodated in the plating tank, a lifting mechanism for lifting and lowering the substrate holder; and a moving mechanism for moving the substrate holder in a direction orthogonal to an elevation direction of the substrate holder.

Further, according to an embodiment of the present application, the moving mechanism includes a first moving mechanism for moving the substrate holder in a first direction orthogonal to the raising/lowering direction, and a first moving mechanism for moving the substrate holder in the raising/lowering direction and the first direction. Disclosed is a plating apparatus comprising a second moving mechanism for moving in a second direction orthogonal to .

Further, as an embodiment of the present application, the first moving mechanism includes a first linear guide extending in the first direction, a first support provided on the first linear guide, and the first support to the first a first driving member for moving along the linear guide, wherein the second moving mechanism includes a second linear guide extending in the second direction, a second support provided on the second linear guide, and the second and a second driving member for moving the support along the second linear guide, wherein the first moving mechanism and the second moving mechanism are overlapped on a base, and the elevating mechanism includes the first support or Disclosed is a plating apparatus comprising: a lifting linear guide installed on a second support and extending in the lifting direction; and a lifting/lowering drive member for moving a holding member holding the substrate holder along the lifting linear guide.

Further, as an embodiment of the present application, the moving mechanism includes: a plating apparatus for moving the substrate holder so as to align an axis of an anode disposed inside the plating bath and an axis of a substrate held by the substrate holder; start

Moreover, this application further includes a sensor for measuring the plating film thickness formed in the said to-be-plated surface of the said board|substrate by a plating process as an embodiment, and the said moving mechanism, The said plating film thickness measured by the said sensor A plating apparatus, configured to move the substrate holder based on

In addition, this application discloses a plating apparatus including a plurality of plating modules including the plating tank, the substrate holder, the elevating mechanism, and the moving mechanism as an embodiment.

Further, according to an embodiment of the present application, a moving step of moving a substrate holder for holding a substrate in a state to be plated with a plating solution accommodated in a plating bath in a direction perpendicular to an elevation direction of the substrate holder; A plating processing method is disclosed, comprising a lowering step of lowering a substrate holder into the plating bath, and a plating step of performing a plating treatment on a substrate held by the substrate holder lowered in the plating bath.

Further, as an embodiment of the present application, the moving step includes a first moving step of moving the substrate holder in a first direction orthogonal to the lifting/lowering direction, and moving the substrate holder in the lifting/lowering direction and the first direction. A plating processing method including a second moving step of moving in a second orthogonal direction is disclosed.

Further, as an embodiment of the present application, the moving step includes a first moving step of moving the substrate holder so as to match the axis of the anode disposed inside the plating bath and the axis of the substrate held by the substrate holder. It discloses a plating method comprising a.

In addition, as an embodiment, the present application further includes a measurement step of measuring a plated film thickness formed on the to-be-plated surface of the substrate by the plating step, wherein the moving step includes the plating measured by the measurement step. A plating processing method is disclosed, including a second moving step of moving the substrate holder based on the film thickness.

400: plating module
410: plating tank
430: anode
440: substrate holder
444: horizontal retaining support
446: vertical retaining support
448: retaining member
455: sensor
460: rotation mechanism
470: tilt mechanism
480: elevating mechanism
482: elevating linear guide
484: elevating drive member
490: moving mechanism
490-1: first moving mechanism
490-2: second moving mechanism
491: first driving member
492: first linear guide
493: first support
494: Expect
495: second driving member
496: second linear guide
497: second support
800: control module
1000: plating device
Wf: substrate
Wf-a: Surface to be plated

Claims (10)

a plating tank for accommodating the plating solution;
a disk-shaped anode disposed inside the plating bath;
a substrate holder for holding a disk-shaped substrate in a state in which a surface to be plated is facing downward in the plating solution accommodated in the plating bath;
an elevating mechanism for elevating the substrate holder so that the substrate held by the substrate holder moves in an elevating direction approaching or separating from the anode;
a moving mechanism for moving the substrate holder in a direction orthogonal to an elevation direction of the substrate holder;
The moving mechanism is
a first moving mechanism for moving the substrate holder in a first direction orthogonal to the lifting direction;
a second moving mechanism for moving the substrate holder in a second direction orthogonal to the lifting direction and the first direction;
The moving mechanism is configured to adjust the position of the axis of the substrate held by the substrate holder with respect to the axis of the disk-shaped anode disposed inside the plating bath by driving the first and second moving mechanisms. moving the substrate holder to
plating device. According to claim 1, wherein the first moving mechanism, a first linear guide extending in the first direction, a first support provided on the first linear guide, and the first support along the first linear guide a first drive member for moving;
The second moving mechanism includes a second linear guide extending in the second direction, a second support provided on the second linear guide, and a second drive for moving the second support along the second linear guide. including absence,
The first movement mechanism and the second movement mechanism are disposed to overlap on a base;
The lifting mechanism includes a lifting linear guide installed on the first support or second support and extending in the lifting direction, and a lifting driving member for moving a holding member for holding the substrate holder along the lifting linear guide. containing,
plating device. 3. The method according to claim 1 or 2, further comprising a sensor for measuring a thickness of a plating film formed on the to-be-plated surface of the substrate by plating,
the moving mechanism is configured to move the substrate holder based on a plating film thickness measured by the sensor;
plating device. The plating module according to claim 1 or 2, comprising a plurality of plating modules including the plating tank, the substrate holder, the lifting mechanism, and the moving mechanism.
plating device. a moving step of moving a substrate holder for holding a disk-shaped substrate in a state to be plated with the plating solution accommodated in the plating bath facing downward in a direction perpendicular to the elevation direction of the substrate holder;
a lowering step of lowering the substrate holder into the plating bath in the lifting direction in which the substrate held by the substrate holder approaches the disk-shaped anode disposed inside the plating bath;
a plating step of performing a plating process on a substrate held by a substrate holder lowered in the plating bath;
The moving step is
a first moving step of moving the substrate holder in a first direction orthogonal to the elevating direction;
a second moving step of moving the substrate holder in a second direction orthogonal to the lifting direction and the first direction;
The moving step may include, by the first moving step and the second moving step, to adjust the axis of the substrate held by the substrate holder with respect to the axis of the anode in the shape of a disk disposed inside the plating bath. moving the substrate holder,
plating method. The method according to claim 5, further comprising a measurement step of measuring a thickness of a plating film formed on the to-be-plated surface of the substrate by the plating step,
The moving step includes a second moving step of moving the substrate holder based on the plating film thickness measured by the measuring step.
plating method. delete delete delete delete

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