JP7133699B2 - Plating equipment and plating method - Google Patents

Description

The present application relates to a plating apparatus and a plating method. This application claims priority from International Application PCT/JP2020/045051 filed on December 3, 2020. The entire disclosure, including the specification, claims, drawings and abstract of International Application No. PCT/JP2020/045051, is incorporated herein by reference in its entirety.

A cup-type electroplating apparatus is known as an example of the plating apparatus. A cup-type electroplating apparatus immerses a substrate (for example, a semiconductor wafer) held in a substrate holder with the surface to be plated facing downward in a plating solution, and applies a voltage between the substrate and the anode to A conductive film is deposited on the surface of the

It is known that a cup-type electroplating apparatus uses a shielding member to shield an electric field formed between an anode and a substrate. For example, in Patent Document 1, an anode mask ring is placed between the anode and the substrate to reduce the current density in the vicinity of the outer edge of the substrate, thereby forming a thick plating film around the outer edge of the substrate. It is disclosed to suppress the

JP 2014-51697 A

However, in the conventional electroplating apparatus, the anode mask ring is fixed at an arbitrary height on the inner wall of the plating tank, so that the anode and the outer edge of the substrate are always shielded by the anode mask ring. If a specific portion of the substrate is always shielded in this way, it may become extremely difficult to form a plating film on that portion. There may be a need to shield a specific portion of the substrate only at the timing of .

Accordingly, one object of the present application is to realize a plating apparatus and a plating method capable of shielding a specific portion of a substrate at a desired timing.

According to one embodiment, a plating bath for containing a plating solution, an anode arranged in the plating bath, a substrate holder for holding a substrate with the surface to be plated facing downward, and a rotating mechanism for rotating a substrate holder; and a shielding mechanism for moving a shielding member between the anode and the substrate according to the rotation angle of the substrate holder, the shielding mechanism comprising a cam member; a rotary drive mechanism configured to rotate the cam member; a driven member configured to push the shielding member to a shielding position between the anode and the substrate as the cam member rotates; A plating apparatus is disclosed, comprising:

FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. FIG. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. FIG. 3 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shield member is retracted. FIG. 4 is a top view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shield member is retracted. FIG. 5 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shielding member has moved between the anode and the substrate. FIG. 6 is a top view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shielding member has moved between the anode and the substrate. FIG. 7A is a top view showing patterned and non-patterned areas of a substrate. FIG. 7B is a top view showing the area of the substrate covered by the shielding member. FIG. 8 is a top view showing the structure of the disk cam of one embodiment. FIG. 9 is a flow chart of a plating method using the plating module of one embodiment. FIG. 10 is a flow chart of the shielding step in the plating method using the plating module of one embodiment. FIG. 11 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shield member is retracted. FIG. 12 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shielding member has moved between the anode and the substrate. FIG. 13 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 14 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 15 is a plan view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 16 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 17 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 18 is a perspective view schematically showing the configuration of part of the shielding mechanism of one embodiment. FIG. 19 is a plan view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 20 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 21 is a plan view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 22 is a flow chart of a plating method using the plating module of one embodiment. FIG. 23 is a flow chart of the shielding step in the plating method using the plating module of the embodiment of FIGS. 13-15. FIG. 24 is a flow chart of the shielding step in the plating method using the plating module of the embodiment of FIGS. 16-19. FIG. 25 is a flowchart of a shielding step in a plating method using the plating module of the embodiment of FIGS. 20 and 21; FIG. 26 is a longitudinal sectional view schematically showing the configuration of the plating module of one embodiment. FIG. 27 is a flow chart of a plating method using the plating module of one embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

<Overall Configuration of Plating Equipment>
FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. FIG. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. As shown in FIGS. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, and a transfer device. 700 and a control module 800 .

The load port 100 is a module for loading substrates stored in cassettes such as FOUPs (not shown) into the plating apparatus 1000 and for unloading substrates from the plating apparatus 1000 to cassettes. Although four load ports 100 are arranged horizontally in this embodiment, the number and arrangement of the load ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates among the load port 100 , the aligner 120 and the transport device 700 . When transferring substrates between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrates via a temporary placement table (not shown).

The aligner 120 is a module for aligning the positions of orientation flats, notches, etc. of the substrate in a predetermined direction. Although two aligners 120 are arranged horizontally in this embodiment, the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 replaces the air inside the pattern formed on the substrate surface with the treatment liquid by wetting the surface to be plated of the substrate before the plating treatment with a treatment liquid such as pure water or degassed water. The pre-wet module 200 is configured to perform a pre-wet process that facilitates the supply of the plating solution to the inside of the pattern by replacing the treatment solution inside the pattern with the plating solution during plating. Although two pre-wet modules 200 are arranged vertically in this embodiment, the number and arrangement of the pre-wet modules 200 are arbitrary.

In the presoak module 300, for example, an oxide film having a large electric resistance existing on the surface of a seed layer formed on the surface to be plated of the substrate before plating is etched away with a processing liquid such as sulfuric acid or hydrochloric acid, and the surface of the plating substrate is cleaned. Alternatively, it is configured to perform a pre-soak process for activation. In this embodiment, two presoak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the presoak modules 300 are arbitrary. The plating module 400 applies plating to the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged vertically and four horizontally, and a total of 24 plating modules 400 are provided. The number and arrangement of are arbitrary.

The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. Although two spin rinse dryers are arranged vertically in this embodiment, the number and arrangement of the spin rinse dryers are arbitrary. The transport device 700 is a device for transporting substrates between a plurality of modules within the plating apparatus 1000 . Control module 800 is configured to control a plurality of modules of plating apparatus 1000 and may comprise, for example, a general purpose or dedicated computer with input/output interfaces to an operator.

An example of a series of plating processes by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100 . Subsequently, the transport robot 110 takes out the substrate from the cassette of the load port 100 and transports the substrate to the aligner 120 . The aligner 120 aligns orientation flats, notches, etc. of the substrate in a predetermined direction. The transport robot 110 transfers the substrate aligned by the aligner 120 to the transport device 700 .

The transport device 700 transports the substrate received from the transport robot 110 to the pre-wet module 200 . The pre-wet module 200 pre-wets the substrate. The transport device 700 transports the pre-wet processed substrate to the pre-soak module 300 . The presoak module 300 applies a presoak treatment to the substrate. The transport device 700 transports the presoaked substrate to the plating module 400 . The plating module 400 applies plating to the substrate.

The transport device 700 transports the plated substrate to the cleaning module 500 . The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the cleaned substrate to the spin rinse dryer 600 . A spin rinse dryer 600 performs a drying process on the substrate. The transport device 700 delivers the dried substrate to the transport robot 110 . The transport robot 110 transports the substrate received from the transport device 700 to the cassette of the load port 100 . Finally, the cassette containing the substrates is unloaded from the load port 100 .

<Configuration of plating module>
Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described. FIG. 3 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shield member is retracted. As shown in FIG. 3, plating module 400 includes plating bath 410 for containing a plating solution. The plating module 400 includes a membrane 420 that vertically separates the interior of the plating bath 410 . The interior of the plating bath 410 is partitioned into a cathode area 422 and an anode area 424 by a membrane 420 .

Cathode region 422 and anode region 424 are each filled with a plating solution. Plating module 400 includes a nozzle 426 opening toward cathode region 422 and a supply 428 for supplying plating solution to cathode region 422 through nozzle 426 . The plating module 400 similarly includes a mechanism for supplying the plating solution to the anode region 424, but illustration thereof is omitted. An anode 430 is provided on the bottom surface of the plating bath 410 in the anode area 424 . A resistor 450 is disposed in the cathode region 422 so as to face the membrane 420 . The resistor 450 is a member for uniformizing the plating process on the surface to be plated Wf-a of the substrate Wf, and is composed of a plate-like member having a large number of holes.

The plating module 400 also includes a substrate holder 440 for holding the substrate Wf with the surface to be plated Wf-a facing downward. The substrate holder 440 includes power contacts for powering the substrate Wf from a power source (not shown). The substrate holder 440 includes a seal ring holder 442 for supporting the outer edge of the plated surface Wf-a of the substrate Wf, and a frame 446 for holding the seal ring holder 442 to a substrate holder main body (not shown). Prepare. Further, the substrate holder 440 includes a back plate 444 for pressing the back surface of the plated surface Wf-a of the substrate Wf, and a shaft 448 attached to the back surface of the substrate pressing surface of the back plate 444 .

The plating module 400 includes an elevating mechanism 443 for elevating the substrate holder 440, and the substrate Wf rotates around the virtual axis of the shaft 448 (virtual rotation axis vertically extending through the center of the surface to be plated Wf-a). and a rotation mechanism 447 for rotating the substrate holder 440 so as to rotate the substrate holder 440 . The lifting mechanism 443 and the rotating mechanism 447 can be implemented by known mechanisms such as motors. The plating module 400 uses the elevating mechanism 443 to immerse the substrate Wf in the plating solution in the cathode region 422, and applies a voltage between the anode 430 and the substrate Wf, thereby causing the surface Wf-a of the substrate Wf to be plated. Configured for plating.

The plating module 400 includes a shielding member 482 for shielding an electric field formed between the anode 430 and the substrate Wf when placed between the anode 430 and the substrate Wf. The shielding member 482 may be, for example, a plate-shaped shielding plate. The shielding member 482 is inserted through the side wall of the plating bath 410 into the cathode region 422 and has a flange 484 attached to the end not inserted into the plating bath 410 . In this embodiment, the shielding member 482 is not always placed between the anode 430 and the substrate Wf, but is configured to shield a specific portion of the substrate Wf at desired timing. This point will be described below.

FIG. 4 is a top view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shield member is retracted. As shown in FIGS. 3 and 4, the plating module 400 includes a shielding mechanism 460 that moves the shielding member 482 between the anode 430 and the substrate Wf according to the rotation angle of the substrate holder 440 by the rotation mechanism 447. FIG. Shielding mechanism 460 comprises a cam member 461 attached to substrate holder 440 . The cam member 461 includes a disc cam 462 attached to the top surface of the seal ring holder 442 . The shielding mechanism 460 includes a follower 470 that pushes the shielding member 482 between the anode 430 and the substrate Wf in response to being pressed by the projection 462a of the cam member 461 (disc cam 462).

The follower 470 has a follower 473 that is pushed by the projection 462 a of the disc cam 462 and moves away from the substrate holder 440 . A base 472 is attached to the upper outer wall surface of the plating bath 410 , and the follower 473 is supported by the base 472 so as to be able to reciprocate radially around a shaft 448 . The follower 473 is a rod-shaped member extending radially around the shaft 448 . Attached to one end of the follower 473 is a first roller 471 that rotates around an axis parallel to the axis of rotation of the shaft 448 . Attached to the other end of follower 473 is a second roller 475 rotatable about an axis perpendicular to both the direction of the axis of rotation of shaft 448 and radial directions about shaft 448 .

The follower 470 has a link 474 that rotates in response to pressure from the follower 473 to push the shielding member 482 between the anode 430 and the substrate Wf. The link 474 is a rod-shaped member supported by the base 472 so as to be rotatable around a rotation shaft 476 provided on the base 472 . The rotating shaft 476 is parallel to the rotating shaft of the second roller 475 . The link 474 is supported by the base 472 so that one side of the link 474 sandwiching the rotating shaft 476 can contact the second roller 475 . A third roller 478 rotatable around an axis parallel to the rotation axis of the second roller 475 is attached to the other end of the link 474 across the rotation axis 476 . Link 474 is supported on base 472 such that third roller 478 can contact flange 484 of shield member 482 .

The follower 470 includes a pressing member 479 that pushes the shielding member 482 back away from between the anode 430 and the substrate Wf when the shielding member 482 is not pushed out by the link 474 . The pressing member 479 is, for example, a compression coil spring with one end attached to the outer wall of the plating bath 410 and the other end attached to the flange 484 of the shielding member 482, but is not limited thereto.

Next, the operation of the shielding member 482 by the shielding mechanism 460 will be described. 3 and 4, when the protrusion 462a of the disk cam 462 is not pressing the first roller 471, the biasing force of the pressing member 479 presses the flange 484 away from the plating tank 410. As shown in FIGS. As a result, the shielding member 482 moves to a position retracted from between the anode 430 and the substrate Wf. Further, when the flange 484 is pushed away from the plating tank 410, the flange 484 pushes the third roller 478, causing the link 474 to rotate counterclockwise. Then, one side of the link 474 sandwiching the rotating shaft 476 presses the second roller 475 toward the center of the shaft 448 . This causes follower 473 to move toward the center of shaft 448 .

FIG. 5 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shielding member has moved between the anode and the substrate. FIG. 6 is a top view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shielding member has moved between the anode and the substrate. As shown in FIGS. 5 and 6, when the substrate holder 440 rotates within a predetermined rotation angle range, the protrusion 462a of the disk cam 462 presses the first roller 471, thereby causing the first roller 471 to rotate. roller 471 moves away from the center of shaft 448 . Along with this, the follower 473 moves away from the center of the shaft 448 , and the second roller 475 presses one side of the link 474 across the rotating shaft 476 . As a result, the link 474 rotates clockwise, and the third roller 478 presses the flange 484 toward the plating tank 410 against the biasing force of the pressing member 479 . As a result, the shielding member 482 is pushed out between the anode 430 and the substrate Wf. When the substrate holder 440 rotates beyond the predetermined rotation angle range, the shielding member 482 moves to the retracted position from between the anode 430 and the substrate Wf, as described with reference to FIGS.

Next, the relationship between the non-pattern area of the substrate and the shielding member will be described. FIG. 7 is a top view showing the relationship between the non-pattern area of the substrate and the shielding member. FIG. 7A is a top view showing patterned and non-patterned areas of a substrate. FIG. 7B is a top view showing the area of the substrate covered by the shielding member. FIG. 7A is a view of the state in which the substrate holder 440 is within a predetermined rotation angle range as shown in FIGS. Illustration is omitted. FIG. 7B is a view of the shielding member 482 pushed out between the anode 430 and the substrate Wf as shown in FIGS. 5 and 6, viewed from the plating surface Wf-a of the substrate Wf.

As shown in FIG. 7A, the substrate Wf has a notch Wf-n (notch). The substrate Wf is placed on the substrate holder 440 so that the notch Wf-n and the protrusion 462a of the disc cam 462 are at the same rotation angle. The surface to be plated Wf-a of the substrate Wf includes a pattern region Wf-b in which a pattern such as a circuit is formed, a non-pattern region Wf-c in which a pattern such as a circuit around the notch Wf-n is not formed, have As shown in FIG. 7B, the shielding mechanism 460 pushes the shielding member 482 between the anode 430 and the notch Wf-n of the substrate Wf when the notch Wf-n of the substrate Wf is rotated within a predetermined angle range. Configured. The shielding member 482 is pushed out between the anode 430 and the notch Wf-n of the substrate Wf by the shielding mechanism 460 so as to cover the notch Wf-n and the non-patterned area Wf-c around the notch Wf-n. Configured. In this embodiment, the notch Wf-n or the non-patterned area Wf-c has been described as an example of the specific portion of the substrate Wf, but the specific portion of the substrate Wf is not limited to these. Further, in the present embodiment, the non-patterned area Wf-c has been described as an example of the specific area around the notch Wf-n, but the specific area around the notch Wf-n is not limited to this.

According to the present embodiment, the shielding member 482 is not always arranged between the anode 430 and the substrate Wf, but rather the shielding member 482 is moved between the anode 430 and the substrate Wf depending on the rotation angle of the substrate holder 440 . It has a shielding mechanism 460 that moves to. Therefore, a specific portion of the substrate Wf to be covered by the shielding member 482 can be shielded at desired timing. For example, if the specific portion of the substrate Wf is the non-patterned area Wf-c around the notch Wf-n, the notch Wf-n and the non-patterned area Wf-c around the notch Wf-n are arranged at desired timings. can be shielded by The non-pattern area Wf-c is the pattern area W
Since the substrate Wf is exposed unlike fb, the electric field is concentrated in the non-pattern region Wf-c, and as a result, the plating film thickness in the pattern region Wf-b may become uneven. On the other hand, in the present embodiment, the non-pattern region Wf-c can be covered with the shielding member 482 at a desired timing, so that the electric field concentration in the non-pattern region Wf-c can be appropriately suppressed. The plating film thickness of the region Wf-b can be made uniform. In this embodiment, the notch Wf-n and the non-pattern area around the notch Wf-n are covered with the shielding member 482. However, the present invention is not limited to this. can be covered.

Further, in the present embodiment, an example in which one projection 462a of the disc cam 462 is provided has been shown, but the present invention is not limited to this. , a plurality of protrusions 462a of the disk cam 462 may be provided according to the arrangement of specific portions of the substrate Wf. Also, in the present embodiment, an example in which one shielding mechanism 460 is provided has been shown, but the present invention is not limited to this, and a plurality of shielding mechanisms 460 may be provided along the circumferential direction of the plating bath 410 . Thereby, the specific portion of the substrate Wf can be covered with the shielding member 482 when the specific portion of the substrate Wf is within a plurality of different predetermined rotation angle ranges. For example, the number and arrangement angles of the shielding mechanisms 460 may be adjusted so that the plating film thickness of the pattern region Wf-b is uniform.

FIG. 8 is a top view showing the structure of the disk cam of one embodiment. In the above-described embodiment, an example in which the disc cam 462 is formed as an integral structure has been shown, but the present invention is not limited to this. As shown in FIG. 8, the disk cam 462 includes a body member 463 attached to the substrate holder 440 (seal ring holder 442) and a projecting member 464 detachably attached to the body member 463. good too. As shown in FIG. 8, the projection member 464 includes a first projection member 464-1 and a second projection member 464-2 having a different shape from the first projection member 464-1. According to the embodiment of FIG. 8, the protruding members 464 can be interchanged for different types of substrates. Since the projection sizes of the first projecting member 464-1 and the second projecting member 464-2 are different, the amount of movement of the shielding member 482 between the anode 430 and the substrate Wf can be varied. Therefore, for example, when the size of a specific portion of the substrate Wf is different, it is sufficient to replace only the projecting member 464 instead of replacing the shielding mechanism 460 or the entire disk cam 462. It is possible to respond quickly to substrates of

Next, a plating method using the plating module 400 of this embodiment will be described. FIG. 9 is a flow chart of a plating method using the plating module of one embodiment. It should be noted that the following plating method is started with the projecting member 464 not attached to the body member 463 of the disc cam 462 .

In the plating method of the present embodiment, first, among the plurality of projecting members (for example, the first projecting member 464-1 and the second projecting member 464-2) of the disc cam 462 having different projecting sizes, the substrate holder 440 A projecting member corresponding to the type of the substrate Wf to be held is selected and attached to the body member 463 of the disc cam 462 (step 101). Here, it is assumed that the first projecting member 464-1 is attached to the body member 463. As shown in FIG. Subsequently, the plating method installs the substrate Wf on the substrate holder 440 (step 102). Step 102 is executed by, for example, placing the substrate Wf with the surface to be plated Wf-a facing downward on the seal ring holder 442 by a robot hand or the like (not shown) and pressing the back surface of the substrate Wf with the back plate 444. can do.

Subsequently, in the plating method, the substrate holder 440 is lowered into the plating bath 410 by the lifting mechanism 443 (lowering step 103). Subsequently, the plating method rotates the substrate holder 440 by the rotation mechanism 447 (rotation step 104).

The plating method moves the shielding member 482 between the anode 430 and the substrate Wf according to the rotation angle of the substrate holder 440 in the rotation step 104 (shielding step 105). Shielding step 105 may be performed by shielding mechanism 460 . Details of the shielding step 105 will be described later. Subsequently, the plating method continues with rotating step 104 and shielding step 105 by applying a voltage between anode 430 located in plating bath 410 and substrate Wf held on substrate holder 440 . The plating surface Wf-a is plated (plating step 106).

Subsequently, the plating method determines whether the plating process should be terminated (step 107). For example, when the plating method determines that the plating process should not be finished because the predetermined time has not elapsed since the plating process started (step 107, No), the process returns to the rotation step 106. continue.

On the other hand, in the plating method, for example, when it is determined that the plating process should be finished because a predetermined time has elapsed since the start of the plating process (step 107, Yes), the substrate holder 440 is rotated by the rotation mechanism 447. Stop (step 108). Subsequently, in the plating method, the substrate holder 440 is lifted by the lift mechanism 443 (step 109), and the plating process ends.

Next, the details of the shielding step 105 will be described. FIG. 10 is a flow chart of the shielding step in the plating method using the plating module of one embodiment. The shielding step 105 removes the circle attached to the substrate holder 440 when the substrate holder 440 is within a predetermined rotation angle range, specifically when the notch Wf-n of the substrate Wf is rotated within a predetermined angle range. The follower 473 is moved away from the substrate holder 440 by the first projecting member 464-1 of the plate cam 462 (step 105-1).

Subsequently, in the shielding step 105, the link 474 is rotated in response to pressure from the follower 473 to move the shielding member 482 between the anode 430 and the substrate Wf, specifically between the anode 430 and the notch Wf-n of the substrate Wf. (step 105-2). As a result, the notch Wf-n and the non-patterned area Wf-c around the notch Wf-n are covered with the shielding member 482 . Subsequently, in the shielding step 105, the shielding member 482 is shielded by the pressing member 479 when the shielding member 482 is not pushed out between the anode 430 and the substrate Wf, that is, when the substrate holder 440 rotates outside the range of the predetermined rotation angle. The member 482 is pushed back away from between the anode 430 and the substrate Wf (step 105-3). The shielding step 105 repeats steps 105-1 to 105-3 while rotating the substrate holder 440 by the rotation mechanism 447. FIG.

According to the plating method of the present embodiment, the shielding member 482 is not always placed between the anode 430 and the substrate Wf. It is moved between the anode 430 and the substrate Wf. Therefore, a specific portion of the substrate Wf to be covered by the shielding member 482 can be shielded at desired timing.

Next, another embodiment of the plating module 400 will be described. FIG. 11 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shield member is retracted. FIG. 12 is a vertical cross-sectional view schematically showing the configuration of the plating module of one embodiment, showing a state in which the shielding member has moved between the anode and the substrate. Configurations similar to those of the embodiment shown in FIGS. 3 to 10 are denoted by the same reference numerals, and redundant description is omitted.

As shown in FIGS. 11 and 12, plating module 400 includes shielding mechanism 485 for moving shielding member 481 . The shielding mechanism 485 is configured to operate in accordance with a command signal based on information regarding the rotation angle of the substrate holder 440 input from the control module 800 . Specifically, the shielding mechanism 485 moves the shielding member 481 between the anode 430 and the substrate Wf as shown in FIG. It is configured to move to a position away from (hereinafter referred to as "retracted position" as appropriate). 12, the shielding mechanism 485 moves the shielding member 481 to a position between the anode 430 and the substrate Wf (hereafter referred to position”). That is, the shielding mechanism 485 is configured to linearly move the shielding member 481 between the retracted position and the shielding position according to the rotation angle of the substrate holder 440 . A specific example of the shielding mechanism 485 will be described below.

FIG. 13 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 14 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 15 is a plan view schematically showing the configuration of the shielding mechanism of one embodiment. 15(a) shows the shielding member 481 at the retracted position, and FIG. 15(b) shows the shielding member 481 at the shielding position.

As shown in FIGS. 13 to 15, the shielding mechanism 485 includes a cam member 487, a rotation drive mechanism 486 configured to rotate the cam member 487, and a shielding member 481 as the cam member 487 rotates. a driven member 488 configured to translate between a position and a retracted position. The rotary drive mechanism 486 can be implemented by a known mechanism such as a rotary motor.

The cam member 487 has a cam body 487b configured to be rotated by the rotary drive mechanism 486 and a rotor 487a attached to the cam body 487b. The rotor 487a is attached to the cam body 487b at a position eccentric to the rotating shaft of the rotary drive mechanism 486. As shown in FIG.

The driven member 488 includes a driven slider 489 arranged on a pedestal 490-1 and a linear guide 490-2 configured to guide the driven slider 489. As shown in FIG. A groove 490-1a is formed in the upper surface of the pedestal 490-1 along the same direction as the linear movement direction between the shielding position and the retracted position of the shielding member 481. As shown in FIG. The driven slider 489 is arranged on the pedestal 490-1 via a linear motion guide 490-2 arranged in the groove 490-1a. Linear guide 490-2 is configured to guide driven slider 489 along groove 490-1a. This allows the driven slider 489 to reciprocate in the direction of the groove 490-1a. The driven slider 489 is arranged to face the rotary drive mechanism 486 with the cam member 487 interposed therebetween. A cam groove 489 a is formed along the vertical direction on the surface of the driven slider 489 facing the rotation drive mechanism 486 . A rotor 487a of the cam member 487 is fitted in the cam groove 489a. The shielding member 481 is attached to the driven slider 489 via a plate-shaped bracket 483 extending in the vertical direction.

When the rotary drive mechanism 486 rotates the cam member 487 (cam main body 487b), the rotor 487a rotates around the rotary shaft of the rotary drive mechanism 486. As shown in FIG. At this time, the rotor 487a presses the side surface of the cam groove 489a. As a result, the driven slider 489 moves along the groove 490-1a. When the cam member 487 is rotated by half (180°) from the state (retracted position) shown in FIGS. 13 and 14, the driven slider 489 moves the shielding member 481 to the shielding position. When the cam member 487 is further rotated by half (180°) from this state, the driven slider 489 moves the shielding member 481 to the retracted position. That is, the driven slider 489 reciprocates along the groove 490-1a as the cam member 487 rotates, thereby allowing the shielding member 481 to linearly move between the shielding position and the retracted position.

The rotation drive mechanism 486 is configured to rotate the cam member 487 according to the rotation angle of the substrate holder 440 . That is, as in the above-described embodiment, the rotation drive mechanism 486 is a cam member that pushes the shielding member 481 to the shielding position when a specific portion such as a non-patterned area of the substrate Wf is rotated within a predetermined angular range. 487 can be rotated. Thereby, a specific portion such as a non-pattern area of the substrate Wf can be covered with the shielding member 481 . Further, the rotation drive mechanism 486 can rotate the cam member 487 so as to return the shielding member 481 to the retracted position when the non-pattern area rotates outside the predetermined angular range. According to this embodiment, the non-pattern area is not always covered with the shielding member 481, but the non-pattern area can be covered with the shielding member 481 at a desired timing. As a result, the plating film thickness in the pattern area can be made uniform.

Further, as shown in FIG. 15 and the like, the shielding member 481 has a mask member 481a having an arc shape corresponding to a part of the peripheral portion of the disk-shaped substrate Wf. Since the non-patterned area may be formed in an arcuate shape at the peripheral edge of the substrate Wf, only the non-patterned area is adequately covered by covering the non-patterned area of the substrate Wf using the arc-shaped mask member 481a. can be done. This point also applies to the following embodiments.

FIG. 16 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 17 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 18 is a perspective view schematically showing the configuration of part of the shielding mechanism of one embodiment. FIG. 19 is a plan view schematically showing the configuration of the shielding mechanism of one embodiment. 19(a) shows the shielding member 481 at the retracted position, and FIG. 19(b) shows the shielding member 481 at the shielding position.

As shown in FIGS. 16-19, the shielding mechanism 485 is configured by rotating the belt 492 wrapped around the first pulley 492-1 and the second pulley 492-2 and the first pulley 492-1. and a rotary drive mechanism 491 configured to rotate the belt 492 . The rotation drive mechanism 491 can be implemented by a known mechanism such as a rotary motor. Shielding mechanism 485 also includes an eccentric cam member 493, which is one form of cam member, coupled to second pulley 492-2. The eccentric cam member 493 is configured to rotate around a rotating shaft 493a as the second pulley 492-2 rotates. The shielding mechanism 485 includes a driven cam member 494, which is one form of a driven member configured to push the shielding member 481 to the shielding position in response to being pressed by the protrusion 493b of the eccentric cam member 493. Specifically, a bracket 495-1 is attached to the driven cam member 494, and a horizontally extending shaft 495-2 is attached to the bracket 495-1. A linear motion guide 496 is attached to the shaft 495 . The shielding member 481 is attached to the shaft 495 via a plate-like bracket 483 extending vertically.

As a result, as shown in FIG. 19B, when the eccentric cam member 493 rotates and the driven cam member 494 is pressed in the first direction by the protrusion 493b of the eccentric cam member 493, the shaft 495 and the bracket 483 are moved. The shielding member 481 is pushed out to the shielding position through. On the other hand, the driven cam member 494 is configured to be pushed back in the second direction opposite to the first direction when not pressed by the projection 493b of the eccentric cam member 493. As shown in FIG. As a result, as shown in FIG. 19(a), when the eccentric cam member 493 is further rotated and the pressure of the driven cam member 494 by the projection 493b of the eccentric cam member 493 is released, the shielding member 481 is pushed back to the retracted position. be

The rotation drive mechanism 491 is configured to rotate the first pulley 492 - 1 according to the rotation angle of the substrate holder 440 . That is, as in the above-described embodiments, the rotation drive mechanism 491 is configured to push the shielding member 481 to the shielding position when a specific portion such as a non-patterned area of the substrate Wf is rotated within a predetermined angular range. pulley 492-1 can be rotated. Thereby, a specific portion such as a non-pattern area of the substrate Wf can be covered with the shielding member 481 . Further, the rotation driving mechanism 491 can rotate the first pulley 492-1 so that the shielding member 481 returns to the retracted position when the non-pattern area rotates outside the predetermined angular range. According to this embodiment, the non-pattern area is not always covered with the shielding member 481, but the non-pattern area can be covered with the shielding member 481 at a desired timing. As a result, the plating film thickness in the pattern area can be made uniform.

FIG. 20 is a perspective view schematically showing the configuration of the shielding mechanism of one embodiment. FIG. 21 is a plan view schematically showing the configuration of the shielding mechanism of one embodiment. 21(a) shows the shielding member 481 at the retracted position, and FIG. 21(b) shows the shielding member 481 at the shielding position.

As shown in FIGS. 20 and 21, the shielding mechanism 485 includes a direct drive mechanism 497 configured to linearly move the shielding member 481 between the shielding position and the retracted position. Specifically, the linear drive mechanism 497 includes a slider 497a configured to horizontally reciprocate in accordance with the drive of the linear drive mechanism 497. As shown in FIG. The shielding member 481 is attached to the slider 497a via a plate-shaped bracket 483 extending in the vertical direction. By driving the direct drive mechanism 497, the shielding member 481 can be linearly moved between the shielding position and the retracted position. The linear drive mechanism 497 can be implemented by a known mechanism such as a linear motor.

The linear drive mechanism 497 is configured to linearly move the shielding member 481 between the shielding position and the retracted position according to the rotation angle of the substrate holder 440 . That is, as in the above-described embodiment, the direct drive mechanism 497 is configured to push the shielding member 481 to the shielding position when a specific portion such as a non-patterned area of the substrate Wf is rotated within a predetermined angular range. be done. Thereby, a specific portion such as a non-pattern area of the substrate Wf can be covered with the shielding member 481 . Further, the direct drive mechanism 497 is configured to return the shielding member 481 to the retracted position when the non-pattern area rotates outside the predetermined angular range. According to this embodiment, the non-pattern area is not always covered with the shielding member 481, but the non-pattern area can be covered with the shielding member 481 at a desired timing. As a result, the plating film thickness in the pattern area can be made uniform.

Next, a plating method using the plating module 400 shown in FIGS. 11 to 21 will be described. FIG. 22 is a flow chart of a plating method using the plating module of one embodiment.

In the plating method of this embodiment, first, the substrate Wf is placed on the substrate holder 440 (step 201). Step 201 is executed by, for example, placing the substrate Wf with the surface to be plated Wf-a facing downward on the seal ring holder 442 by a robot hand or the like (not shown) and pressing the back surface of the substrate Wf by the back plate 444. can do.

Subsequently, in the plating method, the substrate holder 440 is lowered into the plating tank 410 by the lifting mechanism 443 (lowering step 202). Subsequently, the plating method rotates the substrate holder 440 by the rotation mechanism 447 (rotation step 203).

The plating method moves the shielding member 481 between the anode 430 and the substrate Wf according to the rotation angle of the substrate holder 440 in the rotation step 203 (shielding step 204). Shielding step 204 may be performed by shielding mechanism 485 . Details of the shielding step 204 will be described later. Subsequently, the plating method continues with rotating step 203 and shielding step 204 by applying a voltage between anode 430 located in plating bath 410 and substrate Wf held on substrate holder 440 . The plating surface Wf-a is plated (plating step 205). In this embodiment, the plating process (plating step 205) is performed after the substrate is immersed in the plating solution in the plating bath 410. may be performed from the time when at least a part of the substrate is immersed in the plating solution.

The plating method then determines whether the plating process should end (step 206). For example, when the plating method determines that the plating process should not be finished because the predetermined time has not elapsed since the plating process started (step 206, No), the process returns to the plating step 205. continue.

On the other hand, in the plating method, for example, when it is determined that the plating process should be finished because a predetermined time has passed since the start of the plating process (step 206, Yes), the substrate holder 440 is rotated by the rotation mechanism 447. Stop (step 207). Subsequently, in the plating method, the substrate holder 440 is lifted by the lift mechanism 443 (step 208), and the plating process ends.

Next, the details of the shielding step 204 will be described. FIG. 23 is a flow chart of the shielding step in the plating method using the plating module of the embodiment of FIGS. 13-15. It is assumed that when the non-patterned area of the substrate Wf is outside the range of the predetermined rotation angle, the rotation driving mechanism 486 is stopped and the shielding member 481 is at the retracted position as shown in FIG. 15(a). The shielding step 204 rotates the cam member 487 using the rotation driving mechanism 486 when the non-patterned area of the substrate Wf rotates within a predetermined angular range (step 204-1).

As a result, the shielding step 204 moves the driven slider 489 in the first direction as shown in FIG. to push the shielding member 481 to the shielding position (step 204-2). Thereby, the non-pattern area of the substrate Wf is covered with the shielding member 481 . Subsequently, the shielding step 204 further rotates the cam member 487 from the state shown in FIG. 15(b) to move the driven slider 489 to the second direction opposite to the first direction as shown in FIG. 15(a). direction to push back the shielding member 481 to the retracted position (step 204-3). The shielding step 204 repeats steps 204-1 to 204-3 while rotating the substrate holder 440 by the rotation mechanism 447. FIG. Although steps 204-2 and 204-3 are separate steps for convenience of explanation, these two steps are realized by rotating the cam member 487 once (360°). Further, the rotation speed of the rotation drive mechanism 486 is adjusted so that the shielding member 481 is pushed back to the retracted position when the substrate holder 440 rotates out of the range of the predetermined rotation angle.

According to the plating method of the present embodiment, the shielding member 481 is not always placed at the shielding position, but the shielding step 204 moves the shielding member 481 to the shielding position according to the rotation angle of the substrate holder 440 . Therefore, a specific portion of the substrate Wf to be covered by the shielding member 481 can be shielded at desired timing.

FIG. 24 is a flow chart of the shielding step in the plating method using the plating module of the embodiment of FIGS. 16-19. It is assumed that when the non-patterned area of the substrate Wf is outside the range of the predetermined rotation angle, the rotation drive mechanism 491 is stopped and the shielding member 481 is at the retracted position as shown in FIG. 19(a). The shielding step 204 rotates the eccentric cam member 493 by rotating the first pulley 492-1 using the rotation drive mechanism 491 when the non-patterned area of the substrate Wf rotates within the predetermined angle range (step 204- 4).

As a result, the shielding step 204 moves the shielding member 481 to the shielding position as shown in FIG. (step 204-5). Thereby, the non-pattern area of the substrate Wf is covered with the shielding member 481 . Subsequently, the shielding step 204 further rotates the eccentric cam member 493 from the state shown in FIG. moves in the opposite second direction to push the shielding member 481 back to the retracted position shown in FIG. 19(a) (step 204-6). The shielding step 204 repeats steps 204-4 to 204-6 while rotating the substrate holder 440 by the rotating mechanism 447. FIG. Although steps 204-5 and 204-6 are separate steps for convenience of explanation, these two steps are realized by one rotation (360° rotation) of the eccentric cam member 493. FIG. Further, the rotation speed of the rotation drive mechanism 491 is adjusted so that the shielding member 481 is pushed back to the retracted position when the substrate holder 440 rotates out of the range of the predetermined rotation angle.

According to the plating method of the present embodiment, the shielding member 481 is not always placed at the shielding position, but the shielding step 204 moves the shielding member 481 to the shielding position according to the rotation angle of the substrate holder 440 . Therefore, a specific portion of the substrate Wf to be covered by the shielding member 481 can be shielded at desired timing.

FIG. 25 is a flowchart of a shielding step in a plating method using the plating module of the embodiment of FIGS. 20 and 21; It is assumed that when the non-patterned area of the substrate Wf is outside the range of the predetermined rotation angle, the direct drive mechanism 497 is stopped and the shielding member 481 is at the retracted position as shown in FIG. 21(a). The shielding step 204 drives the direct drive mechanism 497 when the non-patterned area of the substrate Wf rotates within a predetermined angular range (step 204-7).

As a result, the shielding step 204 pushes the shielding member 481 to the shielding position by moving the slider 497a in the first direction, as shown in FIG. 21(b) (step 204-8). Thereby, the non-pattern area of the substrate Wf is covered with the shielding member 481 . Subsequently, the shielding step 204 moves the shielding member 481 as shown in FIG. It is pushed back to the retracted position (step 204-9). The shielding step 204 repeats steps 204-7 to 204-9 while rotating the substrate holder 440 by the rotating mechanism 447. FIG. Further, the drive speed of the direct drive mechanism 497 is adjusted so that the shielding member 481 is pushed back to the retracted position when the substrate holder 440 rotates out of the range of the predetermined rotation angle.

According to the plating method of the present embodiment, the shielding member 481 is not always placed at the shielding position, but the shielding step 204 moves the shielding member 481 to the shielding position according to the rotation angle of the substrate holder 440 . Therefore, a specific portion of the substrate Wf to be covered by the shielding member 481 can be shielded at desired timing.

Next, another embodiment of the plating module 400 will be described. FIG. 26 is a longitudinal sectional view schematically showing the configuration of the plating module of one embodiment. Configurations similar to those of the embodiments shown in FIGS. 3 to 25 are denoted by the same reference numerals, and redundant description is omitted.

As shown in FIG. 26, the plating module 400 includes a film thickness sensor 498 configured to measure the plating thickness of the substrate Wf and a shielding sensor 498 based on the plating thickness of the substrate Wf measured by the thickness sensor 498. a shielding mechanism 499 configured to move the member 481 to the shielding position. The shielding mechanism 499 is configured to operate according to a command signal based on information about the plating film thickness of the substrate Wf input from the control module 800 . The shielding mechanism 499 can have a structure similar to any of the shielding mechanisms 485 shown in FIGS. 13-21.

The film thickness sensor 498 is configured to measure the plating film thickness of the peripheral portion of the surface to be plated of the substrate Wf. The film thickness sensor 498 is attached to the resistor 450 so as to face the peripheral edge of the substrate Wf. The film thickness sensor 498 can measure the plating film thickness by scanning the periphery while the substrate Wf rotates once. However, the film thickness sensor 498 may be configured to measure the plating film thickness of the entire plating surface of the substrate Wf. For the film thickness sensor 498, for example, a distance sensor that measures the distance between the film thickness sensor 498 and the substrate Wf (plating film) or a displacement sensor that measures the displacement of the plated surface of the substrate Wf can be employed. Further, as the film thickness sensor 498, a sensor for estimating the forming speed of the plating film thickness may be adopted. Film thickness sensor 498 may be, for example, an optical sensor such as a white confocal sensor, an electric potential sensor, a magnetic field sensor, or an eddy current sensor.

The shielding mechanism 499 is configured to linearly move the shielding member 481 between the retracted position and the shielding position so that the plating film thickness of the peripheral portion of the substrate Wf is uniform. Specifically, when there is a region where the plating film thickness is thicker than other regions in the distribution of the plating film thickness in the peripheral portion of the substrate Wf, the shielding mechanism 499 allows the region with the thick plating film thickness to fall within a predetermined angle range. It is configured to move the shielding member 481 to the retracted position when outside. Further, the shielding mechanism 499 is configured to move the shielding member 481 to the shielding position when the region with the thick plating film is within the predetermined angle range. Therefore, according to the present embodiment, since the shielding member 481 can cover the area of the substrate Wf where the plating film thickness is large, the plating film thickness of the peripheral portion of the substrate Wf can be made uniform.

Next, a plating method using the plating module 400 shown in FIG. 26 will be described. FIG. 27 is a flow chart of a plating method using the plating module of one embodiment.

In the plating method of this embodiment, first, the substrate Wf is placed on the substrate holder 440 (step 301). Step 301 is executed by, for example, placing the substrate Wf with the surface to be plated Wf-a facing downward on the seal ring holder 442 by a robot hand or the like (not shown) and pressing the back surface of the substrate Wf with the back plate 444. can do.

Subsequently, in the plating method, the substrate holder 440 is lowered into the plating tank 410 by the lifting mechanism 443 (lowering step 302). Subsequently, the plating method rotates the substrate holder 440 by the rotation mechanism 447 (rotation step 303).

Subsequently, in the plating method, the film thickness sensor 498 measures the plating film thickness of the peripheral portion of the substrate Wf (measurement step 304). Subsequently, the plating method moves the shielding member 481 between the anode 430 and the substrate Wf based on the plating film thickness of the peripheral portion of the substrate Wf obtained in the measurement step 304 (shielding step 305). Shielding step 305 may be performed by shielding mechanism 499 . Specifically, the shielding step 305 moves the shielding member 481 to the shielding position when the region with the thick plating film is within the predetermined angle range, and moves the shielding member 481 to the shielding position when the region with the thick plating film is outside the predetermined angle range. The shielding member 481 is moved to the retracted position.

Subsequently, the plating method continues with rotating step 303 through shielding step 305 while applying a voltage between the anode 430 located in the plating bath 410 and the substrate Wf held in the substrate holder 440. The plating surface Wf-a is plated (plating step 306). In this embodiment, the plating process (plating step 306) is performed after the substrate is immersed in the plating solution in the plating tank 410, but the plating process (plating step 306) is performed in the plating tank 410 may be performed from the time when at least a part of the substrate is immersed in the plating solution.

The plating method then determines whether the plating process should end (step 307). For example, when the plating method determines that the plating process should not end because the predetermined time has not elapsed since the plating process started (step 307, No), the process returns to the plating step 306. continue.

On the other hand, in the plating method, for example, when it is determined that the plating process should be finished because a predetermined time has elapsed since the start of the plating process (step 307, Yes), the substrate holder 440 is rotated by the rotation mechanism 447. Stop (step 308). Subsequently, in the plating method, the substrate holder 440 is lifted by the lift mechanism 443 (step 309), and the plating process ends.

According to the plating method of the present embodiment, since the shielding member 481 can cover the area of the substrate Wf where the plating film is thick, the plating film thickness of the peripheral portion of the substrate Wf can be made uniform.

Although some embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention, and do not limit the present invention. The present invention may be modified and improved without departing from its spirit, and the present invention includes equivalents thereof. In addition, any combination or omission of each component described in the claims and the specification is possible within the range that at least part of the above problems can be solved or at least part of the effect is achieved. is.

In one embodiment, the present application includes a plating tank for containing a plating solution, an anode arranged in the plating tank, a substrate holder for holding a substrate with the surface to be plated facing downward, a rotating mechanism for rotating the substrate holder; and a shielding mechanism for moving a shielding member between the anode and the substrate according to the rotation angle of the substrate holder, wherein the shielding mechanism includes a cam member and a shielding member. a rotary drive mechanism configured to rotate the cam member; and a driven member configured to push the shielding member to a shielding position between the anode and the substrate as the cam member rotates. A plating apparatus is disclosed, comprising:

Further, according to one embodiment of the present application, the cam member has a cam body configured to be rotated by the rotation drive mechanism, and a rotor attached to the cam body, and the driven member is configured to: A driven slider having a cam groove into which the rotor is fitted, wherein the shielding member is separated from the shielding position and between the anode and the substrate by pressure from the rotor accompanying rotation of the cam body. A plating apparatus is disclosed that includes a driven slider configured to translate between a retracted position and a retracted position.

Further, according to one embodiment, the shielding mechanism further includes a belt wrapped around a first pulley and a second pulley, and the cam member is an eccentric cam member connected to the second pulley. wherein the rotary drive mechanism is configured to rotate the eccentric cam member by rotating the first pulley, the driven member being pressed by a projection of the eccentric cam member in response to A plating apparatus is disclosed that includes a driven cam member configured to push the shielding member to the shielding position.

Further, the present application provides, as an embodiment, a plating bath for containing a plating solution, an anode arranged in the plating bath, and a substrate holder for holding a substrate with the surface to be plated facing downward. a rotating mechanism for rotating the substrate holder; and a shielding mechanism for moving a shielding member between the anode and the substrate in accordance with the rotation angle of the substrate holder, wherein the shielding mechanism comprises the a linear drive mechanism configured to linearly move a shielding member between a shielding position between the anode and the substrate and a retracted position away from between the anode and the substrate; A plating apparatus is disclosed.

Furthermore, the present application discloses, as one embodiment, a plating apparatus in which the shielding member has a mask member having an arc shape corresponding to a portion of the peripheral edge of the disk-shaped substrate.

Further, the present application provides, as an embodiment, a plating bath for containing a plating solution, an anode arranged in the plating bath, and a substrate holder for holding a substrate with the surface to be plated facing downward. a rotation mechanism for rotating the substrate holder; a film thickness sensor configured to measure the plating film thickness of the substrate; and based on the plating film thickness of the substrate measured by the film thickness sensor a shielding mechanism configured to move a shielding member to a shielding position between the anode and the substrate.

Furthermore, the present application provides, as an embodiment, a lowering step of lowering a substrate holder holding the substrate with the surface to be plated facing downward into the plating tank, a rotating step of rotating the substrate holder, and a step of rotating the substrate. a measuring step of measuring a plating film thickness; a shielding step of moving a shielding member between the anode and the substrate based on the plating film thickness of the substrate obtained by the measuring step; and an anode arranged in the plating bath. and a plating step of plating the surface to be plated by applying a voltage between the substrate and the substrate held by the substrate holder.

400 plating module 410 plating tank 430 anode 440 substrate holder 442 seal ring holder 443 lifting mechanism 444 back plate 446 frame 447 rotating mechanism 448 shaft 450 resistor 460 shielding mechanism 461 cam member 462 disk cam 462a projection 463 body member 464 projection member 464 -1 First projecting member 464-2 Second projecting member 470 Follower 471 First roller 472 Base 473 Follower 474 Link 475 Second roller 476 Rotating shaft 478 Third roller 479 Pressing member 481 Shielding member 481a Mask member 482 Shield member 484 Flange 485 Shield mechanism 486 Rotation drive mechanism 487 Cam member 487a Rotor 487b Cam body 488 Driven member 489 Driven slider 489a Cam groove 491 Rotation drive mechanism 492 Belt 492-1 First pulley 492-2 Second Pulley 493 Eccentric cam member 493b Projection 494 Follower cam member 497 Linear drive mechanism 498 Film thickness sensor 499 Shielding mechanism 1000 Plating apparatus Wf Substrate Wf-a Surface to be plated Wf-b Patterned area Wf-c Non-patterned area Wf-n Notch

Claims (7)

a plating bath for containing the plating solution;
an anode disposed in the plating bath;
a substrate holder for holding the substrate with the surface to be plated facing downward;
a rotation mechanism for rotating the substrate holder;
a shielding mechanism that moves a shielding member between the anode and the substrate according to the rotation angle of the substrate holder;
including
The shielding mechanism is
a cam member; a rotary drive mechanism configured to rotate the cam member; and a rotation drive mechanism configured to push the shielding member to a shielding position between the anode and the substrate as the cam member rotates. a driven member;
including,
Plating equipment. The cam member has a cam body configured to be rotated by the rotation drive mechanism and a rotor attached to the cam body,
The driven member is a driven slider having a cam groove in which the rotor is fitted, and the shielding member is moved between the shielding position, the anode and the substrate by pressure from the rotor accompanying rotation of the cam body. and a driven slider configured to translate between a retracted position remote from the
The plating apparatus according to claim 1. the shielding mechanism further includes a belt wrapped around the first pulley and the second pulley;
the cam member includes an eccentric cam member coupled to the second pulley;
The rotary drive mechanism is configured to rotate the eccentric cam member by rotating the first pulley,
The driven member includes a driven cam member configured to push the shielding member to the shielding position in response to being pressed by a projection of the eccentric cam member,
The plating apparatus according to claim 1. a plating bath for containing the plating solution;
an anode disposed in the plating bath;
a substrate holder for holding the substrate with the surface to be plated facing downward;
a rotating mechanism for rotating the substrate holder;
a shielding mechanism that moves a shielding member between the anode and the substrate according to the rotation angle of the substrate holder;
including
The shielding mechanism is
a linear drive mechanism configured to linearly move the shielding member between a shielding position between the anode and the substrate and a retracted position away from between the anode and the substrate; ,
Plating equipment. The shielding member has a mask member having an arc shape corresponding to a part of the peripheral edge of the disk-shaped substrate,
The plating apparatus according to any one of claims 1 to 4. a plating bath for containing the plating solution;
an anode disposed in the plating bath;
a substrate holder for holding the substrate with the surface to be plated facing downward;
a rotating mechanism for rotating the substrate holder;
a film thickness sensor configured to measure the plating film thickness of the substrate during the plating process;
a shielding mechanism configured to move a shielding member to a shielding position between the anode and the substrate based on the plating film thickness of the substrate measured by the film thickness sensor;
plating equipment, including a lowering step of lowering the substrate holder holding the substrate with the surface to be plated facing downward into the plating tank;
a rotating step of rotating the substrate holder;
a measuring step of measuring the plating film thickness of the substrate during the plating process;
a shielding step of moving a shielding member between the anode arranged in the plating tank and the substrate based on the plating film thickness of the substrate obtained in the measuring step;
a plating step of plating the surface to be plated by applying a voltage between the anode and the substrate held by the substrate holder;
plating methods, including

Images