TW202229407A - Thermosetting resin composition and its use - Google Patents

Abstract

Provided are: a thermosetting resin composition which has a low resin fluidity during a hot pressing step, and which, after curing, can form a cured product having excellent laser processability, heat resistance, cold/hot cycle resistance, and impact absorption properties; and use thereof. the present invention relates to a thermosetting resin composition comprising: polyimide resin which is a reactant product of a monomer group comprising a dimer diamine and a tetracarboxylic acid anhydride; a hardening agent which is at least one selected from a group consisting of an epoxy compound, a maleimide compound, an isocyanate group-containing compound, a metal chelating compound and a carbodiimide group-containing compound; and a filler, in the thermosetting resin composition, a cured product obtained by heating the thermosetting resin composition at 180 DEG C for 60 minutes shows a specific storage elastic coefficient at a predetermined temperature.

Description

Thermosetting resin composition and its application

The present invention relates to a thermosetting resin composition comprising a polyimide resin and a cured product thereof. The thermosetting adhesive sheet and the thermosetting cover sheet with the release film formed from the thermosetting resin composition of the present invention are suitable for the manufacture of copper-clad laminates and the protection of circuit surfaces of printed wiring boards.

In recent years, with the progress of high density and high functionality of electronic devices, further dimensional stability and excellent high frequency characteristics are also required for materials used in printed wiring boards to be used. For example, Patent Document 1 discloses a multilayer circuit substrate including an adhesive layer, wherein the adhesive layer in the metal-clad laminate has a storage elastic modulus of 1800 MPa at 50°C, and is stored in a temperature range of 180°C to 260°C The maximum value of the elastic coefficient is 800 MPa or less, and the glass transition temperature (Tg) is 180° C. or less, whereby the conductor has excellent dimensional stability and can reduce transmission loss even in transmission of high-frequency signals. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2020-72198

[Problems to be Solved by Invention] However, with the miniaturization of electronic equipment, communication equipment, etc., in addition to dimensional stability and reduction in transmission loss, high processability such as through-hole formation is also required for materials used in printed wiring boards to be used. , A variety of high-level reliability.

In printed wiring boards, openings such as blind holes and through holes are sometimes provided by laser processing or drilling to ensure continuity between inner-layer circuits and outer-layer circuits, and workability for forming the openings becomes important. Along with new ideas for space saving and circuit design, a material that can be processed even with a smaller hole diameter is sought. Furthermore, resistance to a treatment liquid for removing residues called smears generated by processing is also required.

In addition, in recent years, from the viewpoint of environmental protection, there has been an increasing demand for the use of lead-free solder instead of the conventional lead-containing solder. Since the melting point of lead-free solder is higher than that of conventional lead-containing solder, the step of mounting electronic equipment on a printed wiring board (for example, a reflow step, etc.) increases in temperature. Therefore, materials used for printed wiring boards and the like are also required to have heat resistance at a high temperature of 260° C. or higher.

On the other hand, with the worldwide spread of electronic devices such as smartphones and tablet terminals in recent years, reliability in a wide temperature range from low temperature to high temperature is required. When a conventional printed wiring board is exposed to extreme temperature changes, the problem of peeling between the interlayer adhesive layer and the adjacent layers occurs, and the interlayer adhesive layer constituting the printed wiring board is required to have a high degree of resistance to cooling and heating cycles.

Furthermore, in recent years, electronic devices such as smartphones and tablet terminals are required to withstand physical shocks such as dropping.

In addition, when producing a multilayer printed wiring board using a thermosetting adhesive sheet, or using a thermosetting cover sheet with a release film to protect the circuit surface of the printed wiring board, a step of pressing under heating is passed. Therefore, in order to achieve high density of electronic devices, a material with low resin fluidity during the hot pressing step is required.

The present invention was made in view of the above-mentioned problems, and an object of the present invention is to provide a thermosetting resin composition with low resin fluidity during the hot pressing step, which can be cured with laser processability and heat resistance. Hardened product with excellent properties, cooling and heating cycle resistance and shock absorption.

[Technical Means for Solving the Problem] As a result of diligent research, the present inventors found that the problems of the present invention are solved in the following embodiments, and completed the present invention. That is, the thermosetting resin composition of the present invention includes the polyimide resin (A), which is a monomer group containing the dimer diamine (a-1) and the tetracarboxylic anhydride (a-2). Reactant product; hardener (B), selected from epoxy compound (B-1), maleimide compound (B-2), isocyanate group-containing compound (B-3), metal chelate compound (B-4) and at least one of the group consisting of a carbodiimide group-containing compound (B-5); and a filler (C) in which the thermosetting resin composition is The cured product obtained by heating the curable resin composition at 180° C. for 60 minutes satisfies the following (1) to (3). (1) The storage elastic modulus at 30° C. is 1.0×10 ⁶ Pa to 1.0×10 ¹¹ Pa. (2) The storage elastic modulus at 150°C is 1.0×10 ⁴ Pa to 1.0×10 ⁹ Pa. (3) The storage elastic coefficient at 280°C is 1.0×10 ³ Pa to 1.0×10 ⁹ Pa.

[Effect of invention] According to the present invention, the resin has a low fluidity during hot pressing, and can form a cured product excellent in laser processability, heat resistance, cooling-heat cycle resistance, and shock absorption after curing.

Hereinafter, an example of an embodiment to which the present invention is applied will be described. In addition, the dimension and ratio of each member in the following drawings are for convenience of description, and are not limited to these. In addition, in this specification, the description of "arbitrary number A - arbitrary number B" includes the number A as the lower limit value and the number B as the upper limit value within the above-mentioned range. In addition, the "sheet" in this specification is meant to include not only the "sheet" defined in Japanese Industrial Standards (JIS), but also the "film". In addition, the numerical value determined in this specification is the value calculated|required by the method disclosed by embodiment or an Example.

<Thermosetting resin composition> The thermosetting resin composition of the present invention includes a polyimide resin (A) containing dimer diamine (a-1) and tetracarboxylic anhydride (a-2) The reactant product of the monomer group; hardener (B), is selected from epoxy compound (B-1), maleimide compound (B-2), isocyanate group-containing compound (B-3 ), a metal chelate compound (B-4) and any one of the group consisting of a carbodiimide group-containing compound (B-5); and a filler (C), the thermosetting resin composition Among them, the cured product obtained by heating the thermosetting resin composition at 180° C. for 60 minutes satisfies the following (1) to (3). (1) The storage elastic modulus at 30° C. is 1.0×10 ⁶ Pa to 1.0×10 ¹¹ Pa. (2) The storage elastic modulus at 150°C is 1.0×10 ⁴ Pa to 1.0×10 ⁹ Pa. (3) The storage elastic coefficient at 280°C is 1.0×10 ³ Pa to 1.0×10 ⁹ Pa.

<Polyimide resin (A)> The polyimide resin (A) of the present invention is a thermosetting resin obtained by reacting a monomer group containing a dimer diamine (a-1) and a tetracarboxylic anhydride (a-2). The polyimide resin (A) functions as a binder resin in the thermosetting resin composition of the present invention. The binder resin is a matrix of the thermosetting resin composition, and serves functions such as holding the filler (C) described later.

<Dimer diamine (a-1)> The dimer diamine (a-1) of the present invention includes a cyclic structure having 5 to 10 carbons obtained by reacting a monounsaturated fatty acid having one or more double bonds or triple bonds having 10 to 24 carbon atoms. A polyamine compound obtained by converting the carboxyl group of the polyacid compound into an amine group. For example, compounds using natural fatty acids such as soybean oil fatty acid, tall oil fatty acid, and rapeseed oil fatty acid, and oleic acid, linoleic acid, linolenic acid, and erucic acid obtained by refining them as raw materials can be exemplified. It is obtained by converting the carboxyl group of a polybasic acid compound containing a dimer fatty acid (dimer acid) obtained by carrying out a Diels-Alder reaction into an amine group. The ring structure may be one or two, and in the case of two, the two rings may be independent or continuous. Moreover, it may not have a cyclic structure, and may be a mixture of a cyclic structure and a compound not having a cyclic structure. By using a polyamine compound derived from a dimer acid, a dimer skeleton can be easily introduced into the polyimide resin.

As said cyclic structure, a saturated alicyclic structure, an unsaturated alicyclic structure, and an aromatic ring are mentioned. An amino group (an amino group converted from a carboxyl group) may be directly bonded to a cyclic structure, but from the viewpoint of improving solubility and flexibility, it is preferable that the amino group is bonded to the cyclic structure via an aliphatic chain Knot. The number of carbon atoms between the amine group and the cyclic structure is preferably 2 to 25. In addition, from the viewpoint of improving solubility and flexibility, the dimer diamine (a-1) in the present invention is preferably a chain alkyl group having a degree of freedom and high hydrophobicity other than the cyclic structure. part. It is preferable to have two or more alkyl groups with respect to one cyclic structure. The number of carbon atoms in the alkyl group is preferably 2 to 25.

The dimer diamine (a-1) is preferably a monomer containing as a residue a dimer skeleton derived from a dimer acid (dimerized fatty acid) as a main component (70% by mass or more), and in addition , which is obtained by converting the carboxyl group of the fatty acid or the composition of the fatty acid more than trimerized as a raw material into an amine group. In addition, from the viewpoints of oxidation resistance (particularly coloration in a high temperature region) and suppression of gelation during synthesis, hydrogenation (hydrogenation reaction) of the dimer skeleton to reduce the degree of unsaturation is particularly suitable. substance.

Commercially available products of dimer diamine (a-1) include, for example, Priamine 1071, Priamine 1073, Priamine 1074, and Priamine 1075 ( Above, Japan Croda (Croda Japan) company manufacture); Wei Shamin (Versamine) 551 (Japan BASF (BASF) company manufacture) and so on. The dimer diamine may be used alone or in combination of two or more.

As the polyamine compound used for the polymerization of the polyimide resin (A), the above-mentioned dimer diamine (a-1) may be used exclusively, but other polyamines may be used without departing from the gist of the present invention. Amine compounds. In the total amount of the polyamine compound used for the polyimide resin (A), the other polyamine compound is preferably 50 mol % or less, and more preferably 25 mol % or less.

<Other polyamine compounds> As other polyamine compounds, for example, 1,4-diaminobenzene, 1,3-diaminobenzene, 1,2-diaminobenzene, 1,5-diaminonaphthalene, 1,8-diaminobenzene, Diaminonaphthalene, 2,3-diaminonaphthalene, 2,6-diaminotoluene, 2,4-diaminotoluene, 3,4-diaminotoluene, 4,4'-diaminodiaminobenzene Phenylmethane, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 4,4'-diamino-1,2-diphenylethane, 3 ,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminobenzophenone, 4,4'-diaminodiphenyl benzene , 3,3'-diaminobenzophenone, 3,3'-diaminodiphenyl benzene and other aromatic diamines; ethylenediamine, 1,3-propanediamine, 1,4-butanediamine Amine, 1,6-hexanediamine, 1,7-heptanediamine, 1,9-nonanediamine, 1,12-dodecamethylene diamine (1,12-dodecamethylene diamine), iso-xylylene Aliphatic diamines such as amines; isophorone diamine, norbornane diamine, 1,2-cyclohexanediamine, 1,3-cyclohexanediamine, 1,4-cyclohexanediamine, 4,4'-Diaminodicyclohexylmethane, alicyclic diamines such as piperazine, etc. In addition, other polyamine compounds are of course not limited to the above structures.

In the polymerization of the polyimide resin (A), other polyamine compounds may be used within the scope of not departing from the gist of the present invention. In the total amount of the polyamine compound used for the polyimide resin (A), the other polyamine compound is preferably 50 mol % or less, and more preferably 25 mol % or less.

As another polyamine compound, it is particularly preferable to use a monomer containing a trimer, which is a triamine obtained by converting a tricarboxylic acid derived from a monounsaturated fatty acid having 10 to 24 carbon atoms as a residue. By using a trifunctional or more functional substance as the polyamine compound, a branched structure can be introduced into the polyimide resin, the molecular weight can be increased, and the heat resistance of the obtained polyimide resin can be increased.

<Tetracarboxylic anhydride (a-2)> A known monomer can be used for the tetracarboxylic anhydride (a-2) of the present invention. Specifically, pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride, 3,3',4,4'-diphenyl tetracarboxylic dianhydride, 3,3',4,4'-diphenylene tetracarboxylic dianhydride Benzophenone tetracarboxylic dianhydride, 2,2',3,3'-benzophenone tetracarboxylic dianhydride, 4,4'-[propane-2,2-diylbis(1,4-extendane) Phenyloxy)]diphthalic dianhydride, 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, 5-(2,5-dioxotetrahydro-3-furan base)-3-methyl-cyclohexene-1,2-dicarboxylic acid anhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,3',4,4'-diphenyltetramine Carboxylic acid dianhydride, methylene-4,4'-diphthalic acid dianhydride, 1,1-ethylidene-4,4'-diphthalic acid dianhydride, 2,2-propylidene dianhydride -4,4'-Diphthalic dianhydride, 1,2-Ethylene-4,4'-diphthalic dianhydride, 1,3-Trimethylene-4,4'-di Phthalic acid dianhydride, 1,4-tetraphenylene-4,4'-diphthalic acid dianhydride, 1,5-pentadenomethyl-4,4'-diphthalic acid dianhydride , 4,4'-oxydiphthalic dianhydride, p-phenylene bis(trimellitic anhydride), thio-4,4'-diphthalic dianhydride, sulfonyl-4, 4'-Diphthalic dianhydride, 1,3-bis(3,4-dicarboxyphenyl)phthalic anhydride, 1,3-bis(3,4-dicarboxyphenoxy)phthalic anhydride, 1,4-bis(3,4-dicarboxyphenoxy)phthalic anhydride, 1,3-bis[2-(3,4-dicarboxyphenyl)-2-propyl]phthalic anhydride, 1, 4-bis[2-(3,4-dicarboxyphenyl)-2-propyl]phthalic anhydride, bis[3-(3,4-dicarboxyphenoxy)phenyl]methane dianhydride, bis[ 4-(3,4-Dicarboxyphenoxy)phenyl]methane dianhydride, 2,2-bis[3-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, bis(3,4-dicarboxyphenoxy)dimethylsilane dianhydride, 1,3-bis(3,4 -Dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetra Carboxylic dianhydride, 1,2,5,6-naphthalene tetracarboxylic dianhydride, 3,4,9,10-perylene tetracarboxylic dianhydride, 2,3,6,7-anthracene tetracarboxylic dianhydride, Cyclobutanetetracarboxylic dianhydride (for example, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-tetramethyl-1,2,3,4-cyclobutane alkanetetracarboxylic dianhydride, etc.), cyclohexanetetracarboxylic dianhydride (for example, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, etc.), 9,9-bis[4-(3, 1-, 3,2-, 3,3- or 3,4-dicarboxyphenoxy)phenyl]fluorene dianhydride, norbornane-2-spiro-α-cyclopentanone-α'-spiro -2''-norbornane -5,5'',6,6''-tetracarboxylic dianhydride, and 1,2,7,8-phenanthrenetetracarboxylic dianhydride, 1,2,4,5-naphthalenetetracarboxylic dianhydride, 1,4,5,8-Decahydronaphthalenetetracarboxylic dianhydride, 4,8-dimethyl-1,2,5,6-hexahydronaphthalenetetracarboxylic dianhydride, 2,6-dichloro-1 ,4,5,8-Naphthalenetetracarboxylic dianhydride, 2,7-Dichloro-1,4,5,8-Naphthalenetetracarboxylic dianhydride, 2,3,6,7-Tetrachloro-1,4 ,5,8-Naphthalenetetracarboxylic dianhydride, 1,8,9,10-Phenanthrenetetracarboxylic dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 1,1- Bis(3,4-dicarboxyphenyl)ethanedianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethanedianhydride, bis(2,3-dicarboxyphenyl)methanedianhydride , bis(3,4-dicarboxyphenyl) methane dianhydride, bis(3,4-dicarboxyphenyl) stilbene dianhydride, benzene-1,2,4,5-tetracarboxylic dianhydride, 3,4 ,3',4'-benzophenone tetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5(tetrahydro-2,5-dioxo-3-furyl) Naphtho(1,2-C)furan-1,3-dione, etc. Among these, from the viewpoint of heat resistance and shock absorption, tetracarboxylic anhydrides having two or less aromatic rings in one molecule are more preferred. Among these, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'- Diphenyl ether tetracarboxylic dianhydride, 4,4'-[propane-2,2-diylbis(1,4-phenyleneoxy)]diphthalic dianhydride, 1,3,3a, 4,5,9b-hexahydro-5(tetrahydro-2,5-dioxo-3-furyl)naphtho(1,2-C)furan-1,3-dione. A tetracarboxylic anhydride can be used individually by 1 type or in combination of 2 or more types.

The polyimide resin (A) has a reactive functional group that reacts with the curing agent (B) described later. The reactive functional group of the polyimide resin (A) is not limited, but is preferably at least one of an amine group and an acid anhydride group. There are reactive functional groups on the side chain or terminal of the polyimide resin. The polyimide resin having an amine or acid anhydride group at the molecular terminal can be easily obtained by adjusting the loading ratio of the polyamine compound and the tetracarboxylic dianhydride. More preferably, a polyimide resin in which tetracarboxylic dianhydride is excessively formulated (50 mol % or more) so as to have an acid anhydride group at the terminal is exemplified. In addition, an acid anhydride group may be introduced into the terminal by reacting with maleic anhydride after preparing a polyamine compound in excess (50 mol% or more) to obtain a polyimide resin having a polyamine compound at the terminal.

＜Hardener (B)＞ The hardener (B) has a functional group capable of reacting with the reactive functional group possessed by the polyimide resin (A), and preferably has a plurality of reactive functional groups. Hardener (B) is selected from epoxy compound (B-1), maleimide compound (B-2), isocyanate group-containing compound (B-3), metal chelate compound (B-4) and At least one of the group consisting of a carbodiimide group-containing compound (B-5). By using these compounds as the curing agent (B), it is possible to prevent a decrease in the storage elastic modulus at high temperature, and to suppress side etching during laser processing. The hardener may be used alone or in combination of two or more.

<Epoxy group-containing compound (B-1)> The epoxy group-containing compound (B-1) is not particularly limited as long as it has an epoxy group in the molecule, but an average of two or more epoxy groups in one molecule can be preferably used. compound of. As the epoxy group-containing compound, epoxy resin such as glycidyl ether type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, or cycloaliphatic (alicyclic) epoxy resin can be used, for example. resin.

Examples of glycidyl ether type epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AD type epoxy resins, and cresol novolac type epoxy resins. Epoxy resin, phenol novolac epoxy resin, α-naphthol novolak epoxy resin, bisphenol A novolak epoxy resin, dicyclopentadiene epoxy resin, tetrabromobisphenol A type Epoxy resin, brominated phenol novolak type epoxy resin, tris(glycidoxyphenyl)methane or tetrakis(glycidoxyphenyl)ethane, etc.

Examples of glycidylamine-type epoxy resins include tetraglycidyldiaminodiphenylmethane, triglycidylparaaminophenol, triglycidylmetaaminophenol, or tetraglycidylisoxylylene Amines etc.

As a glycidyl ester type epoxy resin, diglycidyl phthalate, diglycidyl hexahydrophthalate, diglycidyl tetrahydrophthalate, etc. are mentioned, for example.

As a cycloaliphatic (alicyclic) epoxy resin, epoxycyclohexylmethyl-epoxycyclohexanecarboxylate, bis(epoxycyclohexyl) adipate, etc. are mentioned, for example.

An epoxy group-containing compound may be used individually by 1 type, or may be used in combination of 2 or more types. As the epoxy group-containing compound, from the viewpoint of high adhesiveness, bisphenol A epoxy resin, cresol novolak epoxy resin, phenol novolak epoxy resin, tris(glycidyloxy) epoxy resin are preferably used phenyl)methane, tetrakis(glycidyloxyphenyl)ethane, or tetraglycidyl m-xylylenediamine, from the viewpoint of high heat resistance, more preferably those containing a trifunctional or higher epoxy group compound.

<Maleimide group-containing compound (B-2)> The maleimide group-containing compound (B-2) is not particularly limited as long as it has a maleimide group in the molecule, but it is preferable to use a compound having an average of two maleimide groups in one molecule. Compounds with more than one maleimide group.

Specific examples of the maleimide group-containing compound in the present invention include o-phenylene bismaleimide, m-phenylene bismaleimide, and p-phenylene bismaleimide. Imine, 4-methyl-1,3-phenylene bismaleimide, N,N'-(toluene-2,6-diyl)bismaleimide), 4,4'- Diphenylmethane bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenyl bismaleimide Lymethyleneimidephenoxy)benzene, 1,3-bis(4-maleimidephenoxy)benzene, polyphenylmethanemaleimide (Chinese Academy of Sciences, CAS) number (NO): 67784-74-1, the reaction product of a polymer containing formaldehyde and aniline and maleic anhydride), N,N'-ethylidenebismaleimide, N,N'-trienemethylidene Bismaleimide, N,N'-propylidene bismaleimide, N,N'-tetradenemethylbismaleimide, N,N'-pentadenemethylbismaleimide Imide, N,N'-(1,3-pentanediyl)bis(maleimide), N,N'-hexadecenylbismaleimide, N,N'-( 1,7-Pentanediyl)bismaleimide, N,N'-(1,8-octanediyl)bismaleimide, N,N'-(1,9-nonane Diyl) bismaleimide, N,N'-(1,10-decanediyl)bismaleimide, N,N'-(1,11-undecanediyl)bismaleimide Leylimide, N,N'-(1,12-dodecanediyl)bismaleimide, N,N'-[(1,4-phenylene)diphenylene]bismaleimide Leylimide, N,N'-[(1,2-phenylene) dimeryl]bismaleimide, N,N'-[(1,3-phenylene) dimeridine base] bismaleimide, 1,6'-bismaleimide-(2,2,4-trimethyl)hexane, N,N'-[(methylimino)bis( 4,1-phenylene)]bismaleimide, N,N'-(2-hydroxypropane-1,3-diylbisiminobiscarbonylbisethylidene)bismaleimide , N,N'-(dithiobis-ethylidene) bismaleimide, N,N'-[hexa-methylbis(iminocarbonylethylidene)]bismaleimide, N,N'-Carbonylbis(1,4-phenylene)bismaleimide, N,N',N''-[nitrotris(ethylidene)]trimaleimide, N ,N',N''-[nitrotris(4,1-phenylene)]trimaleimide, N,N'-[p-phenylene bis(oxy-p-phenylene)] Bismaleimide, N,N'-[methylbis(oxy)bis(2-methyl-1,4-phenylene)]bismaleimide, N,N'-[ Methylidene bis(oxy-p-phenylene)]bis(maleimide), N,N'-[dimethylsilylenebis[(4 ,1-phenylene)(1,3,4,-oxadiazole-5,2-diyl)(4,1-phenylene)]]bismaleimide, N,N'-[ (1,3-phenylene)bisoxybis(3,1-phenylene)]bismaleimide, 1,1'-[3'-oxospiro[9H-xanthene-9 ,1'(3'H)-Isobenzofuran]-3,6-diyl]bis(1H-pyrrole-2,5-dione), N,N'-(3,3'-dichlorobi Benzene-4,4'-diyl)bismaleimide, N,N'-(3,3'-dimethylbiphenyl-4,4'-diyl)bismaleimide, N ,N'-(3,3'-dimethoxybiphenyl-4,4'-diyl)bismaleimide, N,N'-[methyl bis(2-ethyl-4, 1-phenylene)]bismaleimide, N,N'-[methylbis(2,6-diethyl-4,1-phenylene)]bismaleimide, N ,N'-[methyl bis(2-bromo-6-ethyl-4,1-phenylene)] bismaleimide, N,N'-[methyl bis(2-methyl) -4,1-phenylene)]bismaleimide, N,N'-[ethylidenebis(oxyethylidene)]bismaleimide, N,N'-[sulfonylidene Bis(4,1-phenylene)bis(oxy)bis(4,1-phenylene)]bismaleimide, N,N'-[naphthalene-2,7-diylbis(oxygen) base)bis(4,1-phenylene)]bismaleimide, N,N'-[p-phenylenebis(oxy-p-phenylene)]bismaleimide, N, N'-[(1,3-phenylene)bisoxybis(3,1-phenylene)]bismaleimide, N,N'-(3,6,9-trioxadeca Monoalkane-1,11-diyl)bismaleimide, N,N'-[isopropylidenebis[p-phenoxycarbonyl(m-phenylene)]]bismaleimide, N,N'-[Isopropylidenebis[phenoxycarbonyl(p-phenylene)]]bismaleimide, N,N'-[isopropylidenebis[(2,6- Dichlorobenzene-4,1-diyl)oxycarbonyl(p-phenylene)]]bismaleimide, N,N'-[(phenylimino)bis(4,1-phenylene) base)] bismaleimide, N,N'-[azobis(4,1-phenylene)]bismaleimide, N,N'-[1,3,4-oxadi Azole-2,5-diylbis(4,1-phenylene)]bismaleimide, 2,6-bis[4-(maleimide-N-yl)phenoxy]benzyl Nitrile, N,N'-[1,3,4-oxadiazole-2,5-diylbis(3,1-phenylene)]bismaleimide, N,N'-[bis[ 9-oxo-9H-9-phospha(V)-10-oxaphenanthren-9-yl]methylbis(p-phenylene)]bismaleimide, N,N'-[hexamethyleneimide Fluoroisopropylbis[p-phenoxycarbonyl(m-phenylene)]]bismaleimide, N,N'-[carbonylbis[(4,1-phenylene)thio(4 ,1-phenylene)]] bismaleimide, N,N'-carbonylbis(p-phenoxy-p-phenylene)bismaleimide Leylimide, N,N'-[5-tert-butyl-1,3-phenylene bis[(1,3,4-oxadiazole-5,2-diyl)(4,1-phenylene) phenyl)]] bismaleimide, N,N'-[cyclohexylenebis(4,1-phenylene)]bismaleimide, N,N'-[methylenebis( Oxy)bis(2-methyl-1,4-phenylene)]bismaleimide, N,N'-[5-[2-[5-(dimethylamino)-1- Naphthylsulfonylamino]ethylaminocarbamoyl]-1,3-phenylene]bismaleimide, N,N'-(oxydiethylidene)bismaleimide , N,N'-[dithiobis(m-phenylene)]bismaleimide, N,N'-(3,6,9-trioxaundecan-1,11-diyl ) bismaleimide, N,N'-(ethylidene bis-p-phenylene) bismaleimide, BMI-689, BMI-1500, BMI- 1700, BMI-3000, BMI-5000, BMI-9000, ODA-BMI, BAF-BMI and other polyfunctional maleimides manufactured by JFE CHEMICAL.

Moreover, the polyfunctional maleimide obtained by making a polyfunctional amine and maleic anhydride react is mentioned. Examples of polyfunctional amines include isophoronediamine, dicyclohexylmethane-4,4'-diamine, and giffamine having a terminal aminated polypropylene glycol skeleton manufactured by Huntsman Corporation. (Jeffamine) D-230, HK-511, D-400, XTJ-582, D-2000, XTJ-578, XTJ-509, XTJ-510, T-403, T-5000 with terminal aminated ethylene glycol XTJ-500, XTJ-501, XTJ-502, XTJ-504, XTJ-511, XTJ-512, XTJ-590 with alcohol backbone, XTJ-542, XTJ with terminal aminated polytetramethylene glycol backbone -533, XTJ-536, XTJ-548, XTJ-559, etc.

<Isocyanate group-containing compound (B-3)> The isocyanate group-containing compound (B-3) is not particularly limited as long as it is a compound having an isocyanate group in the molecule. Specific examples of the isocyanate group-containing compound having one isocyanate group in one molecule include n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, benzyl isocyanate, and (meth)acryloyloxyethyl isocyanate. , 1,1-bis[(meth)acryloyloxymethyl]ethyl isocyanate, vinyl isocyanate, allyl isocyanate, (meth)acryloyl isocyanate, isopropenyl-α,α-dimethyl isocyanate benzyl isocyanate, etc. In addition, 1,6-diisocyanatohexane (1,6-diisocyanatohexane), isophorone diisocyanate, 4,4'-diphenylmethane diisocyanate, polymerized diphenylmethane diisocyanate, xylylene Diisocyanate, 2,4-Tolylene Diisocyanate, Toluene Diisocyanate, 2,4-Toluene Diisocyanate, Hexadenomethyl Diisocyanate, 4-Methyl Diisocyanate - m-phenylene diisocyanate, naphthalene diisocyanate, p-phenylene diisocyanate, tetramethyl xylylene diisocyanate, cyclohexylmethane diisocyanate, hydrogenated xylylene diisocyanate, cyclohexyl diisocyanate, tolidine diisocyanate Isocyanate, 2,2,4-trimethylhexanylene diisocyanate, 2,4,4-trimethylhexanene methyl diisocyanate, m-tetramethyl xylylene diisocyanate, p-tetramethyl xylylene diisocyanate Compounds obtained by equimolar reaction of diisocyanate compounds such as base diisocyanate and dimer acid diisocyanate with vinyl monomers containing hydroxyl, carboxyl, and amide groups can also be used as isocyanate compounds.

Specific examples of the isocyanate group-containing compound having two isocyanate groups in one molecule include 1,3-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, and 1,4-phenylene diisocyanate. diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-toluene triisocyanate Aromatic diisocyanates such as isocyanates, 1,3,5-benzenetriisocyanate, dianisidine diisocyanate, 4,4'-diphenylether diisocyanate, 4,4',4''-triphenylmethane triisocyanate, etc. ; Trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentaethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1, Aliphatic diisocyanates such as 3-butylene diisocyanate, dodecene methyl diisocyanate, 2,4,4-trimethylhexaene methyl diisocyanate; ω,ω'-diisocyanate-1,3-dimethylbenzene, ω,ω'-diisocyanate-1,4-dimethylbenzene, ω,ω'-diisocyanate-1,4-diethylbenzene , 1,4-tetramethyl xylylene diisocyanate, 1,3-tetramethyl xylylene diisocyanate and other aromatic aliphatic diisocyanates; 3-Isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate [alias: isophorone diisocyanate], 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexanediisocyanate, methyl-2,4-cyclohexanediisocyanate, methyl-2,6-cyclohexanediisocyanate, 4,4'-methylidenebis(cyclohexylisocyanate) , 1,3-bis(isocyanatomethyl)cyclohexane, 1,4-bis(isocyanatomethyl)cyclohexane and other alicyclic diisocyanates.

In addition, specific examples of the isocyanate group-containing compound having three isocyanate groups in one molecule include aromatic polyisocyanates, aliphatic polyisocyanates such as lysine triisocyanate, arylaliphatic polyisocyanates, and alicyclic polyisocyanates. Isocyanates and the like include trimethylolpropane adducts of diisocyanates described above, biuret bodies reacted with water, and trimers having an isocyanurate ring.

As the isocyanate group-containing compound, a block in which the isocyanate group in the exemplified various isocyanate group-containing compounds is protected by ε-caprolactam, methyl ethyl ketone (MEK) oxime, etc. can also be used. Compounds containing isocyanate groups. Specifically, the isocyanate group of the isocyanate group-containing compound may be subjected to ε-caprolactam, methyl ethyl ketone (hereinafter referred to as MEK) oxime, cyclohexanone oxime, pyrazole, phenol or the like Blocked substances, etc. In particular, in the present invention, in the case of using a hexadecene-methyl diisocyanate trimer having an isocyanurate ring and having been blocked by MEK oxime or pyrazole, the adhesion of polyimide or copper to Since it is excellent in strength or heat resistance, it is very preferable. In addition, from the viewpoint of heat resistance, it is preferable to have a trifunctional or more isocyanate group.

＜Metal chelate compound (B-4)＞ The metal chelate compound (B-4) is an organometallic compound containing a metal and an organic substance, and reacts with the reactive functional group of the binder resin to form a crosslink. The type of the organometallic compound is not particularly limited, and examples thereof include organoaluminum compounds, organotitanium compounds, organozirconium compounds, and the like. In addition, the bond between a metal and an organic substance may be a metal-oxygen bond, and is not limited to a metal-carbon bond. In addition, the bonding method between the metal and the organic substance may be any of chemical bonding, coordinate bonding, and ionic bonding. From the viewpoint of heat resistance, trifunctional or higher is more preferable.

The organoaluminum compound is preferably an aluminum metal chelate compound. Examples of the aluminum metal chelate compound include aluminum diisopropyl ethylacetate, aluminum tris(ethylacetate), aluminum diisopropyl alkylacetate, and bis(ethyl monoacetylacetonate) Aluminium acetoacetate, aluminum tris(acetate), aluminum monoacetate bis(ethylacetate), aluminum di-n-butanolmonomethylacetate, diisobutanolmonomethylacetate Aluminum, aluminum di-sec-butoxide monomethyl acetoacetate, aluminum isopropoxide, aluminum diisopropyl mono-sec-butoxide, aluminum sec-butoxide, aluminum ethoxide, etc.

The organic titanium compound is preferably a titanium metal chelate compound. Examples of the titanium metal chelate compound include titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethylacetate, titanium octylate, titanium ethylacetate, and 1,3-propanedioxybis (Ethyl acetyl acetate) titanium, titanium polyacetyl acetonate, tetraisopropyl titanate, tetra-n-butyl titanate, butyl titanate dimer, tetraoctyl titanate, tert-Amyl titanate, tetra-tert-butyl titanate, tetrastearyl titanate, titanium isostearate, tri-n-butoxytitanium monostearate, di-isopropoxytitanium di- Stearate, titanium stearate, di-isopropoxytitanium diisostearate, (2-n-butoxycarbonylbenzyloxy)tributoxytitanium, etc. The organozirconium compound is preferably a zirconium metal chelate compound. The zirconium metal chelate compound includes, for example, zirconium tetraacetylacetonate, zirconium tributoxyacetylacetonate, zirconium monobutoxyacetylacetonate, bis(ethylacetoxyacetate), and zirconium dibutoxybis(ethylacetate). Acetylacetate) zirconium, tetraacetylacetonate zirconium, n-propyl zirconate, n-butyl zirconate, zirconium stearate, zirconium octoate, etc. Among these, an organic titanium compound and an organic zirconium compound are preferable from the point of thermosetting reactivity.

<Carbodiimide group-containing compound (B-5)> The carbodiimide group-containing compound (B-5) is not particularly limited as long as it is a compound having a carbodiimide group in the molecule. Examples of the carbodiimide group-containing compound include: Carbodilite V-01, Carbodilite V-03, Carbodilite V-05, Carbodilite V-05 ) V-07, Carbodilite (Carbodilite) V-09 (Nisshinbo Chemical Co., Ltd.), cyclic carbodiimide (Teijin Co., Ltd.), etc. From the viewpoint of heat resistance, those having an average of three or more carbodiimide groups in one molecule are preferred.

The curing agent (B) used in the present invention preferably contains an aromatic ring structure in the curing agent. By including a bulky aromatic ring, the molecular motion of the thermosetting resin composition of the present invention can be suppressed, thereby exhibiting an effect of alleviating stress caused during cooling and heating cycles.

The curing agent (B) used in the present invention is preferably an epoxy group, a maleimide group, an isocyanate group-containing group, a metal chelate group with respect to 100 parts by mass of the polyimide resin (A) The total of the compound and the carbodiimide group-containing compound is contained within a range of 1 to 20 parts by mass, more preferably 1 to 15 parts, and still more preferably 3 to 10 parts. By setting the addition amount of the curing agent (B) to 1 part to 20 parts, the storage elastic modulus of the cured product can be suppressed, and the effect of suppressing the occurrence of cracks, etc. .

<Packing (C)> Next, the filler (C) used by this invention is demonstrated in detail. The thermosetting resin composition of the present invention contains a filler for the purpose of controlling the storage elastic modulus of the cured product.

It does not specifically limit as a filler (C), As a shape, a spherical shape, a powder shape, a fibrous shape, a needle shape, a scale shape, etc. are mentioned. Examples of fillers (C) include: Fluorine fillers: polytetrafluoroethylene powder or modified products thereof, tetrafluoroethylene-perfluoroalkyl vinyl ether powder, tetrafluoroethylene-ethylene powder, tetrafluoroethylene-hexafluoroethylene Propylene powder, tetrafluoroethylene-vinylidene fluoride powder, tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether powder, polychlorotrifluoroethylene powder, chlorotrifluoroethylene-ethylene powder, chlorotrifluoroethylene- Vinylidene fluoride powder, polyvinylidene fluoride powder, polyvinylidene fluoride powder, etc. Other fillers include polyethylene powder, polyacrylate powder, epoxy resin powder, polyimide powder, polyimide powder, polyurethane powder, liquid crystal polymer beads, polymer Silicone powder, etc., and polymer fillers such as multi-layer core-shell using silicone, acrylic, styrene butadiene rubber, butadiene rubber, etc.; melamine phosphate, melamine polyphosphate, guanidine phosphate, polyphosphoric acid (Poly) phosphate compounds such as guanidine, ammonium phosphate, ammonium polyphosphate, ammonium ammonium phosphate, ammonium polyphosphate, urethane phosphate, urethane polyphosphate, organic phosphate compounds, phosphorus Nitrile (phospazene) compounds, phosphonic acid compounds, aluminum diethylphosphinate, aluminum methylethylphosphinate, aluminum diphenylphosphinate, aluminum ethylbutylphosphinate, aluminum methylbutylphosphinate Phosphine-based fillers such as phosphinic acid compounds such as aluminum oxide, aluminum polyethylene phosphinate, phosphine oxide compounds, phosphorane compounds, and phosphine compounds; Benzoguanamine, melamine, melam, melem, melon, melamine cyanurate, cyanuric acid compounds, isocyanuric acid compounds, triazole compounds, Nitrogen-based fillers such as tetrazolium compounds, diazo compounds, and urea; Silica or hollow silica or porous silica, mica, talc, kaolin, clay, hydrotalcite, wollastonite, wollastonite, silicon nitride, boron nitride, aluminum nitride, Calcium hydrogen phosphate, calcium phosphate, glass flakes, hydrated glass, calcium titanate, sepiolite, magnesium sulfate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, barium hydroxide, calcium hydroxide, titanium oxide, tin oxide , Inorganic fillers of alumina, magnesia, zirconia, zinc oxide, molybdenum oxide, antimony oxide, nickel oxide, zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, zinc borate, aluminum borate, etc.

In addition, from the viewpoint of shock absorption, fluorine fillers, boron nitride, liquid crystal polymers, and silica are preferably used. In the present invention, these fillers (C) may be used alone or in combination.

The average particle diameter _D50 of the filler (C) is preferably 0.1 μm to 25 μm. When the average particle diameter _D50 of the filler (C) is 0.1 μm to 25 μm, the mechanical properties of the cured product can be improved, and the impact absorption can be improved. The average particle diameter _D50 of the filler (C) is more preferably in the range of 2 μm to 10 μm.

The content of the filler is preferably 5 to 60 parts by mass relative to 100 parts by mass of the binder resin component. By setting the amount of the filler (C) to be 60 parts by mass or less, the storage elastic modulus of the cured film can be controlled to a certain value or less, and the occurrence of cracks, peeling, etc. can be suppressed with respect to stress caused by rapid temperature changes during cooling and heating cycles. Effect. In addition, when the content of the filler (C) is 5 parts by mass or more, the storage elastic coefficient near normal temperature can be kept high, and it is not easy to expand in the desmear step after laser processing. The interface of the thermosetting resin composition of the present invention is less likely to peel or float. The content of the filler is more preferably 5 parts by mass to 40 parts by mass, more preferably 5 parts by mass to 30 parts by mass, and most preferably 5 parts by mass to 20 parts by mass.

Regarding the filler (C), when the thermosetting resin composition of the present invention is used as a thermosetting adhesive sheet to be described later, the difference between the average particle diameter D ₅₀ of the filler (C) and the film thickness of the thermosetting adhesive sheet The relationship is preferably a value calculated from (Formula 1) of 0.8 or less, more preferably 0.1 or less, and still more preferably 0.05 or less. By setting it as 0.8 or less, the binder resin component can sufficiently coat the surface of the filler, and a favorable adhesive force and the like can be exhibited to a to-be-adhered body, and peeling and floating are not easily caused during cooling and heating cycles. (Formula 1) Average particle diameter D ₅₀ (μm) of filler (C) / film thickness of thermosetting adhesive sheet (μm)

The method for adding the filler (C) is not particularly limited, and any conventionally known method can be used. Specifically, the method of adding the filler (C) to the polymerization reaction liquid before or during the polymerization of the binder resin can be mentioned, and a three-roll mill is used. etc. A method of kneading a filler in a binder resin; a method of preparing a dispersion liquid containing the filler and mixing it into the binder resin, etc. In addition, in order to disperse the filler well and stabilize the dispersion state, a dispersant, a tackifier, or the like may be used within a range that does not affect the physical properties of the thermosetting resin composition.

＜Other additives＞ Further, in the thermosetting resin composition of the present invention, energy ray absorbers, dyes, pigments, antioxidants, polymerization inhibitors, antifoaming agents, leveling agents, ions can be further added within a range that does not impair the purpose. Collecting agents, humectants, viscosity modifiers, preservatives, antibacterial agents, antistatic agents, anti-blocking agents, infrared absorbers, electromagnetic wave shielding agents, etc. as optional components, are relatively high in terms of improving laser processability. It is best to prepare energy ray absorbers.

<Storage elastic modulus of thermosetting resin composition> A method of obtaining the storage elastic coefficient will be described. The storage elasticity coefficient can be measured using a DVA (dynamic viscoelasticity analysis) method (dynamic viscoelasticity analysis method) measuring apparatus or the like. The storage elastic coefficient at each temperature can be obtained from the viscoelasticity curve of the cured product obtained by the apparatus.

The cured product obtained by heating the thermosetting resin composition of the present invention at 180° C. for 60 minutes satisfies (1) to (3). (1) The storage elastic modulus at 30° C. is 1.0×10 ⁶ Pa to 1.0×10 ¹¹ Pa. (2) The storage elastic modulus at 150°C is 1.0×10 ⁴ Pa to 1.0×10 ⁹ Pa. (3) The storage elastic coefficient at 280°C is 1.0×10 ³ Pa to 1.0×10 ⁹ Pa.

[Storage modulus of elasticity at 30°C] The cured product obtained by heating the thermosetting resin composition of the present invention at 180°C for 60 minutes has a storage modulus of elasticity at 30°C of 1.0×10 ⁶ Pa to 1.0×10 ¹¹ Pa is preferably 1.0×10 ⁷ Pa to 1.0×10 ¹⁰ Pa, and more preferably 1.0×10 ⁸ Pa to 1.0×10 ⁹ Pa.

By setting the storage elastic modulus at 30° C. to be 1.0×10 ¹¹ Pa or less, the effect of suppressing the occurrence of cracks and the like against the stress caused by the rapid temperature change during the cooling and heating cycle is exhibited. In addition, by setting it to 1.0×10 ⁶ Pa or more, the intrusion of the desmear liquid in the desmear step can be suppressed, and the occurrence of peeling or floating at the interface between the copper clad laminate and the thermosetting resin composition of the present invention can be suppressed. , can improve the resistance to slag removal. The storage elastic modulus at 30°C can be controlled by adjusting the type and amount of filler (C).

[Storage Elasticity Coefficient at 150°C] Next, the storage elastic coefficient at 150°C of the cured product obtained by heating the thermosetting resin composition of the present invention at 180°C for 60 minutes was 1.0×10 ⁴ Pa to 1.0× 10 ⁹ Pa, preferably 1.0×10 ⁵ Pa to 1.0×10 ⁸ Pa, more preferably 1.0×10 ⁶ Pa to 1.0×10 ⁷ Pa.

By setting the storage elastic modulus at 150°C to 1.0×10 ⁹ Pa or less, similarly to the case of 30°C, there is an effect of suppressing the occurrence of cracks and the like with respect to stress caused by rapid temperature changes during cooling and heating cycles. In addition, by setting it to 1.0×10 ⁴ Pa or more, the cohesive force of the cured film of the thermosetting resin composition can be improved, and the flow of the resin can be suppressed when the thermosetting resin composition is bonded between layers used as a multilayer printed wiring board, This ensures dimensional stability. The storage elastic modulus at 150°C can also be controlled by adjusting the type and addition amount of the filler (C).

Since cooling and heating cycles are repeated in the range of about -30°C to about 150°C, the resistance to cooling and heating cycles is related to the storage elastic modulus of both the room temperature region and the high temperature region. Therefore, with regard to the resistance to cooling and heating cycles, since the storage elastic modulus at 30°C is 1.0×10 ¹¹ Pa or less, and the storage elastic modulus at 150°C is 1.0×10 ⁹ Pa or less, it is difficult for rapid temperature changes during cooling and heating cycles. The induced stress has the effect of suppressing the occurrence of cracks and the like. In particular, when the storage elastic modulus at 30° C. is 1.0×10 ⁹ Pa or less and the storage elastic modulus at 150° C. is 1.0×10 ⁷ Pa or less, particularly excellent thermal cycle resistance can be exhibited.

[Storage Elasticity Coefficient at 280°C] The storage elastic coefficient at 280°C of the cured product obtained by heating the thermosetting resin composition of the present invention at 180°C for 60 minutes is 1.0×10 ³ Pa to 1.0×10 ⁹ Pa is preferably 1.0×10 ⁴ Pa to 1.0×10 ⁸ Pa, more preferably 1.0×10 ⁵ Pa to 1.0×10 ⁷ Pa.

By setting the storage elastic modulus at 280° C. to 1.0×10 ⁹ Pa or less, the stress when high temperature heat is applied in the solder mounting step can be relieved, the occurrence of cracks can be suppressed, and the heat resistance can be improved. In addition, by setting it to 1.0×10 ³ Pa or more, in the laser processing step for forming blind holes or through holes, even if high temperature heat caused by laser is applied, thermal slump is not generated, and side sags can be suppressed. Etching to improve laser machinability. The storage elastic modulus at 280°C can be adjusted according to the type of hardener (B).

<Loss tangent (tanδ) peak> A method of obtaining the peak value of the loss tangent (tanδ) will be described. The storage elastic coefficient can be measured using a DVA method (dynamic viscoelasticity analysis) measuring apparatus or the like. From the viscoelasticity curve of the cured product obtained by the device, the loss tangent (tanδ) was calculated at each temperature from the storage elastic coefficient and the loss elastic coefficient at each temperature, and the tanδ curve was plotted based on (Equation 2). The extremely large point is used as the peak value of the wave. In addition, when there are a plurality of maximum points, the value at which the temperature is closest to room temperature (23° C.) is taken as the tanδ peak of the cured product. (Formula 2) (loss tangent: tanδ) = (loss elastic coefficient) / (storage elastic coefficient)

The loss tangent (tanδ) peak value of the cured product obtained by heating the thermosetting resin composition of the present invention at 180° C. for 60 minutes at 0° C. to 280° C. is preferably 0.3 or more, and more preferably 0.5 or more, More preferably, it is 0.7 or more. When the loss tangent (tanδ) peak value reaches 0.3 or more, the shock diffusivity is increased, and the shock from the outside can be released. Regarding the loss tangent (tanδ), the polyimide resin can be increased by making the number of aromatic rings contained in the structural unit derived from the tetracarboxylic anhydride (a-2) in the polyimide resin (A) to be two or less. (A) The degree of freedom of molecular motion, which can improve shock diffusivity by flexibly inducing molecular motion to external shocks.

The thermosetting resin composition of the present invention can be applied to embodiments such as a thermosetting adhesive sheet, a thermosetting cover sheet with a release film, a copper-clad laminate, etc. to be described later, and these embodiments are processed and assembled into a printed wiring board , the thermosetting resin composition functions as a thermosetting composition for interlayer adhesion of a printed wiring board.

<Thermosetting adhesive sheet> The thermosetting adhesive sheet is obtained by forming the thermosetting resin composition of the present invention into a sheet shape. The thermosetting adhesive sheet is used as a member for bonding of printed wiring boards and electronic equipment, and has a function of bonding and holding other members. The thermosetting adhesive sheet is sandwiched between members to be bonded, temporarily bonded, and then hardened by passing through a heating or hot pressing step, thereby bonding the adherends to each other.

<Manufacturing method of thermosetting adhesive sheet> The manufacturing method of a thermosetting adhesive sheet can obtain a thermosetting adhesive sheet with a release film on both sides, for example, by containing a polyimide resin (A), a curing agent (B), a filler (C), and The coating solution of other optional components and solvent is applied to one side of the release film, and then the liquid medium such as the organic solvent contained in it is usually removed at 40°C to 150°C and dried to form a thermosetting adhesive sheet. Another release film is laminated on the surface of the thermosetting adhesive sheet. Surface contamination of the thermosetting adhesive sheet can be prevented by laminating on both sides with a release film. By peeling off the release film, the thermosetting adhesive sheet can be separated. The two release films may be of the same kind or different kinds. The peeling force can be made stronger or weaker by using the peeling films with different peeling properties, so that it is easy to peel off sequentially.

As the coating method, for example, notch coating, blade coating, die coating, lip coating, roll coating, curtain coating, bar coating, gravure printing, flexographic printing, screen printing, dip coating, spray coating, spin coating can be selected. and other known methods.

The thickness of the thermosetting adhesive sheet after drying is preferably from 5 μm to 500 μm, more preferably from 10 μm to 100 μm, in order to exhibit sufficient adhesiveness and to facilitate handling.

<Thermosetting cover sheet with release film> The thermosetting cover sheet with a release film is formed by sandwiching a thermosetting adhesive sheet between the release film and the cover resin layer. In other words, the thermosetting cover sheet is obtained by replacing the peelable film on one side of the thermosetting adhesive sheet with a release film on both sides with a cover resin layer, and the manufacturing method is also the same.

The cover resin layer is an insulating film, and as the insulating film, for example, one selected from the group consisting of polyimide, liquid crystal polymer, polyphenylene sulfide, syndiotactic polystyrene, polyethylene terephthalate, and polyethylene naphthalene can be used. One or more resins selected from the group consisting of ethylene formate, polycarbonate, polybutylene terephthalate, polyether ether ketone, and fluorine-based resins.

The fluorine-based resin used as the insulating film is not particularly limited, and examples thereof include polytetrafluoroethylene, polytetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, difluoroethylene One or more of the group consisting of ethylene-trifluoroethylene copolymer, tetrafluoroethylene-ethylene copolymer, polychlorotrifluoroethylene and polyvinylidene fluoride.

<Utilization of Thermosetting Adhesive Sheet, Thermosetting Adhesive Sheet with Release Film, and Thermosetting Cover Sheet with Release Film> Using the thermosetting adhesive sheet with a release film of the present invention, etc., a copper-clad laminate and a printed wiring board can be obtained. The copper-clad laminate is obtained by laminating a copper foil and an insulating film via an adhesive layer which is a cured product of the thermosetting adhesive sheet obtained from the thermosetting resin composition of the present invention. Such a copper-clad laminate is obtained, for example, by sequentially peeling off the peelable film from the thermosetting adhesive sheet with a peeling film of the present invention, and stacking copper foil and insulating film on each surface of the thermosetting adhesive sheet, respectively. (This step may be referred to as temporary bonding), the thermosetting adhesive sheet between the copper foil and the insulating film is thermally cured through a heating or hot pressing step. Alternatively, a copper-clad laminate can be obtained by applying a coating solution for forming a thermosetting adhesive sheet on an insulating film, drying it, and stacking a copper foil on the formed thermosetting adhesive sheet, and heating Or a hot pressing step, whereby the thermosetting adhesive sheet between the copper foil and the insulating film is thermally cured. The copper-clad laminate may have copper foil as the outermost layers on both surfaces, such as copper foil/adhesive layer/insulating film/adhesive layer/copper foil, or may be further provided with an inner layer of copper foil. When a copper foil or an insulating film is laminated using a plurality of thermosetting adhesive sheets, the thermosetting of the plurality of thermosetting adhesive sheets may be performed at one time after temporary bonding a plurality of times.

＜Printed wiring board＞ A printed wiring board can be obtained by processing the copper foil in the copper-clad laminate by etching or the like to form a signal circuit or a ground circuit. By peeling off the release film from the thermosetting cover sheet with the release film, laminating the thermosetting adhesive sheet to the circuit surface, and heating and curing, it is also possible to form a cured product including a cover resin layer/adhesive sheet. Covering layers, protecting signal circuits, or utilized as a substrate for further multilayering. As a method of providing a signal circuit or a ground circuit, for example, a photosensitive etching resist layer can be formed on the copper foil of a copper clad laminate, exposed through a mask film having a circuit pattern, only the exposed portion can be cured, and then The copper foil of the unexposed portion is removed by etching, and the remaining resist layer is then peeled off to form a conductive circuit from the copper foil.

Moreover, the printed wiring board of this invention can also be obtained without using a copper clad laminate. For example, a conductive pattern may be formed on a flexible and insulating plastic film such as polyester, polyimide, liquid crystal polymer, or PTFE film by a printing technique, and then the conductive pattern may be covered with the conductive pattern of the present invention. The thermosetting adhesive sheet is laminated with the protective layer and heated and pressurized to harden the thermosetting adhesive sheet, thereby obtaining a flexible printed wiring board provided with the protective layer. Alternatively, only necessary circuits may be provided on a flexible and insulating plastic film by means such as sputtering or electroplating, and a protective layer provided with a protective layer via a cured product of the thermosetting adhesive sheet of the present invention may be obtained in the same manner as follows. Flexible Printed Wiring Board.

Furthermore, a thermosetting adhesive sheet obtained by peeling a release film from the thermosetting adhesive sheet with a release film of the present invention may be sandwiched between a plurality of flexible printed wirings, and heated and pressurized to make the thermosetting adhesive sheet. The curable adhesive sheet is cured to obtain a multilayer flexible printed wiring board.

The printed wiring board of the present invention may be provided with blind vias or through-holes in order to conduct conduction between a cured layer obtained by curing a thermosetting resin composition or a plurality of copper foils arranged to sandwich a protective layer. Through hole opening. The through-hole opening is generally formed by laser processing using a laser or drilling processing using a drill, but from the viewpoint of improving the shape accuracy of the through-hole opening, laser processing is preferred.

By setting the storage elastic modulus at 280° C. of the cured product layer obtained by curing the thermosetting resin composition to 1.0×10 ³ Pa to 1.0×10 ⁹ Pa, it can be maintained even when heat is applied by laser processing Stores elastic modulus and can inhibit side etching.

In general, there is a desmear step of removing residual resin (smear) after forming through-hole openings by laser processing or drilling. The desmear step includes a dry process using plasma or a wet process using an etching solution such as potassium permanganate. Although the dry process is suitable for desmearing small-diameter through-holes, there are many problems due to the need for special gas or the time required for vacuuming. Therefore, most of the desmears using the wet process are currently used.

By setting the storage elastic coefficient at 30° C. to be 1.0×10 ⁶ Pa to 1.0×10 ¹¹ Pa, the intrusion of the desmear liquid in the desmear step can be suppressed, and the thermal curing of the copper clad laminate and the present invention can be suppressed. Peeling or floating occurs at the interface of the resin composition.

Various electronic devices, such as a smartphone, a tablet terminal, a camera, etc., can be manufactured using the printed wiring board of this invention.

[Example] Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples. In addition, "part" in an Example means "mass part", and "%" means "mass %".

In addition, the measurement of the acid value, amine value, and weight average molecular weight (Mw) of resin was performed by the following method. "Acid Value Determination" The acid value was measured according to Japanese Industrial Standards (JIS) K0070. Precisely weigh about 1 g of the sample in a co-plugged Erlenmeyer flask, add 100 ml of a mixture of tetrahydrofuran/ethanol (volume ratio: tetrahydrofuran/ethanol=2/1), and dissolve it. A phenolphthalein test solution was added to this as an indicator, and titration was performed with a 0.1 N alcoholic potassium hydroxide solution, and the end point was the time when the indicator remained light red for 30 seconds. The acid value was determined by the following formula (unit: mgKOH/g). Formula (3) Acid value (mgKOH/g)=(5.611×a×F)/S S: The amount of sample taken (g) a: Consumption of 0.1 N alcoholic potassium hydroxide solution (mL) F: titer of 0.1 N alcoholic potassium hydroxide solution "Amine Value Determination" Precisely weigh about 1 g of the sample in a co-plugged Erlenmeyer flask, add 100 mL of cyclohexanone solvent, and dissolve it. 2 or 3 drops of a solution obtained by dissolving 0.20 g of Methyl Orange in 50 mL of distilled water, and 0.28 g of Xylene Cyanol FF in 50 mL of methanol were additionally added. The indicator prepared by mixing the obtained liquid was kept for 30 seconds. Then, it was titrated with 0.1 N alcoholic hydrochloric acid solution until the solution became blue-gray. The amine value was determined by the following formula (unit: mgKOH/g). Amine value (mgKOH/g)=(5.611×a×F)/S in, S: The amount of sample taken (g) a: Consumption of 0.1 N alcoholic hydrochloric acid solution (mL) F: titer of 0.1 N alcoholic hydrochloric acid solution "Determination of Weight Average Molecular Weight (Mw)" For the measurement of Mw, a gel permeation chromatograph (GPC) "GPC-101" manufactured by Showa Denko Co., Ltd. was used. The solvent was tetrahydrofuran (THF), and as the column, a column obtained by connecting two "KF-805L" (manufactured by Showa Denko: GPC column: 8 mm ID x 300 mm size) in series was used . The sample concentration was 1 mass %, the flow rate was 1.0 mL/min, the pressure was 3.8 MPa, and the column temperature was 40°C. The Mw was determined in terms of polystyrene. For data analysis, a calibration curve, molecular weight, and peak area were calculated using the manufacturer's built-in software, and Mw was obtained with the retention time in the range of 17.9 minutes to 30.0 minutes as the object of analysis.

[Synthesis Example 1] <Synthesis of Polyimide Resin (P1)> In a four-necked flask including a stirrer, a reflux cooling tube, a nitrogen introduction tube, an introduction tube, and a thermometer, 378.7 g of a C36 dimer diamine (Priamine 1075) as a polyamine compound was charged, Bisphenol A-type acid dianhydride (4,4'-[propane-2,2-diylbis(1,4-phenyleneoxy)]diphthalic dianhydride) as tetracarboxylic anhydride (ratio Sta (BISDA)-1000) 380.0 g, and cyclohexanone 1100 g as a solvent, and it stirred until it became uniform. After becoming uniform, the temperature was raised to 110°C, and after 30 minutes, the temperature was raised to 140°C. After the temperature reached 140°C, the reaction was continued at the temperature for 10 hours to continue the dehydration reaction to obtain a weight-average molecular weight of 54,000 and an acid value of 6.4 mgKOH/ g. Polyimide resin (A1) with an amine value of 0.3 mgKOH/g.

[Synthesis Example 2 to Synthesis Example 6] Except having changed the kinds and amounts of dimer diamine (a-1), tetracarboxylic anhydrides (a-2), etc. as shown in Table 1, it carried out in the same manner as in Synthesis Example 1, and obtained in the same manner, respectively. Polyimide resin (A2) to polyimide resin (A6).

[Table 1] Table 1 Polyimide (A) Synthesis Example 1 Synthesis Example 2 Synthesis Example 3 Synthesis Example 4 Synthesis Example 5 Synthesis Example 6 (A1) (A2) (A3) (A4) (A5) (A6) Polyamine compound [mass part] Dimer diamine (a-1) Priamine 1075 100 100 100 100 100 0 Other polyamines 1,4-Diaminobenzene 0 0 0 0 0 100 Tetracarboxylic anhydride [mass parts] (a-2) 4,4'-[Propane-2,2-diylbis(1,4-phenyleneoxy)]diphthalic dianhydride 104.3 0 0 0 0 529.4 1,3,3a,4,5,9b-hexahydro-5(tetrahydro-2,5-dioxo-3-furyl)naphtho(1,2-C)furan-1,3-dione 0 60.2 0 0 0 0 3,3',4,4'-biphenyltetracarboxylic dianhydride 0 0 58.9 0 0 0 9,9-bis(3,4-dicarboxyphenoxy)phenyl]fluorene dianhydride 0 0 0 91.9 0 0 1,2,4,5-benzenetetracarboxylic dianhydride 0 0 0 0 43.7 0 Tetracarboxylic anhydride/polyamine compound [mol ratio] 1.1 1.1 1.1 1.1 1.1 1.1 molecular weight 54,000 48,000 50,000 45,000 47,000 45,000 Acid value [mgKOH/g] 6.4 7.8 8 6 6.6 9 Amine value [mgKOH/g] 0.3 0.3 0.5 0.2 0.6 0.3

[Example 1] 《Manufacture of thermosetting resin composition (coating liquid)》 In a container, 100 parts of polyimide resin (A1), 5 parts of epoxy group-containing compound (B-1-1) to be described later, and 20 parts of boron nitride were placed in a container, and A mixed solvent (toluene:MEK=9:1 (weight ratio)) was added so that the nonvolatile content concentration might be 40%, and the mixture was stirred with a disperser for 10 minutes to obtain a thermosetting resin composition (coating liquid). The storage elastic coefficient and loss elastic coefficient of the cured product were obtained by the methods described later, and the flowability of the resin as a thermosetting adhesive sheet, the laser workability before and after dipping in the desmear solution, heat resistance, thermal cycle resistance, and impact Absorbency was evaluated, and the results are shown in Tables 2 to 4.

[Example 2 to Example 22, Comparative Example 1 to Comparative Example 5] Except having changed the kinds and amounts of binder resin, hardener, and filler as shown in Tables 2 to 4, it was the same as that of Example 1 to obtain a thermosetting resin composition (coating liquid), and the same procedure was carried out. Evaluate.

"Raw Material: Binder Resin" Polyimide resin (A): (A1) to (A6) described in Synthesis Example 1 to Synthesis Example 6 (A7): Vylon 637, an acid value of 5 mgKOH/g, a weight-average molecular weight of 30,000, and a polyester resin of 21°C Tg (manufactured by Toyobo Co., Ltd.)

"Raw Materials: Hardener (B)" Epoxy group-containing compound (B-1-1): "ELM-434" (glycidylamine type epoxy resin, epoxy equivalent 100 g/eq, tetrafunctional) Sumitomo Chemical Co., Ltd. Epoxy group-containing compound (B-1-2): "YX-8800" (glycidyl ether type epoxy resin, epoxy equivalent 180 g/eq, bifunctional) manufactured by Mitsubishi Chemical Corporation Maleimide group-containing compound (B-2): "MIR-3000" (biphenyl aralkyl type maleimide resin, multifunctional) manufactured by Nippon Kayaku Co., Ltd. Isocyanate group-containing compound (B-3): "TKA-100" (isocyanurate-type isocyanate compound, isocyanate equivalent: 180 g/eq, trifunctional) manufactured by Asahi Kasei Corporation Metal chelate compound (B-4): "Orgatix ZC-150" (organic zirconia compound, tetrafunctional) Matsumoto Fine Chemical Co., Ltd. Carbodiimide group-containing compound (B-5): "Carbodilite V-05" (carbodiimide equivalent: 262 g/eq, polyfunctional) Nisshinbo Chemical Co., Ltd. Compounds containing polyamine groups: "BAPP" (bifunctional) Seika (SEIKA) Co., Ltd.

"Raw Material: Filler (C)" Boron Nitride: "SP-2" (average particle size _D50 : 4.0 μm) Silica made by Denka Corporation: "SC2050-MB" (average particle size _D50 : 0.5 μm) Alumina manufactured by Admatechs: "HT grade" (average particle size D ₅₀ = 1.2 μm, average circularity = 0.90) PTFE manufactured by Tokuyama Corporation: "KT-300" (average particle size D ₅₀ : 10.0 μm) Liquid crystal polymer manufactured by Kitamura Co., Ltd.: “E101-S” (average particle size D ₅₀ ; 17.5 μm) manufactured by Sumitomo Chemical Co., Ltd.

《Determination of storage elastic modulus and loss tangent of hardened products》 <Preparation of hardened product for measurement> The coating liquid obtained in each example and each comparative example was uniformly coated on a heavy release film (polyterephthalic acid coated with a heavy release agent) with a thickness of 50 μm using a doctor blade so that the thickness after drying was 200 μm. On the polyethylene terephthalate (PET) film), after drying at 100° C. for 2 minutes, it was cooled to room temperature to form a thermosetting adhesive sheet with a release film on one side. Then, the thermosetting adhesive sheet surface of the obtained thermosetting adhesive sheet with a release film on one side was combined with a light release film (polyethylene terephthalate (PET) coated with a light release agent with a thickness of 50 μm. ) film) was superimposed to obtain a thermosetting adhesive sheet with a release film on both sides comprising a heavy release film/thermosetting adhesive sheet/light release film. The obtained thermosetting adhesive sheet was thermosetted at 180° C., 1 hour, and 2 MPa, and the heavy release film and the light release film were peeled off to obtain a cured product of a 200 μm thermosetting resin composition.

<Measuring method of storage elastic coefficient and loss tangent> A test piece for measurement with a size of 5 mm × 30 mm was cut out from the obtained cured product, and a dynamic viscoelasticity measuring device "DVA200" (manufactured by IT Measurement Control Co., Ltd.) was used. ), cooled to 0 °C, heated to 300 °C at a heating rate of 10 °C/min, and measured viscoelasticity at a vibration frequency of 10 Hz. The storage elastic coefficients at 30°C, 150°C, and 280°C were obtained from the obtained viscoelasticity curves, and the loss tangent (tan δ) was calculated at each temperature from the loss elastic coefficient, and plotted, and the point at which the tan δ curve became the maximum was calculated. In addition, when there are a plurality of maximum points, the value at which the temperature is closest to room temperature (23° C.) is used as the tanδ peak of the cured product. In Tables 2 to 4, for example, the value of the storage elastic modulus such as "1.0×10 ⁶ " is described as "1.0E+06".

(resin fluidity) [Preparation of Sample A for Evaluation] 《Manufacture of thermosetting adhesive sheet with release film on both sides》 In the same manner as in the preparation of samples for measurement of storage elastic coefficient and loss elastic coefficient, the coating liquid obtained in each Example and each Comparative Example was used to dry the thermosetting adhesive sheet with a thickness of 25 μm. Both sides were covered with a heavy release film with a thickness of 50 μm and a light release film with a thickness of 50 μm, respectively, to obtain a thermosetting adhesive sheet with a release film on both sides. The light release film was peeled off from the thermosetting adhesive sheet with the release film on both sides, and the exposed thermosetting adhesive sheet side was temporarily attached to Kapton 100H of DuPont. Thereafter, a circular hole having a diameter of 7 mm was formed by a punching machine. Next, the heavy release film was peeled off, and on the exposed thermosetting adhesive sheet surface, a 12 μm copper foil was laminated on both sides of a 50 μm polyimide film by a vacuum laminator. One side of the copper foil was temporarily bonded, and then thermally hardened by a hot press at 180° C., 1 hour, and 2 MPa, and a sample A for evaluation was produced.

[Evaluation method] In the sample A for evaluation prepared above, a hole with a diameter of 7 mm was observed at a magnification of about 20 to 300 times from the Kapton 100H side with an optical microscope (VHX-7000 manufactured by Keyence Corporation). , the length of the resin oozing out from the end of the circle was measured and evaluated according to the following criteria. ⊚: The resin fluidity is 100 μm or less. for extremely good results. ○: Resin fluidity exceeds 100 μm to 150 μm or less. for good results. Δ: Resin fluidity exceeds 150 μm to 200 μm or less. within the practical range. ×: The resin fluidity exceeds 200 μm. Not practical.

(Laser processability (before desmear liquid treatment)) [Preparation of Sample B for Evaluation] In the same manner as in the preparation of samples for measurement of storage elastic coefficient and loss elastic coefficient, the coating liquid obtained in each Example and each Comparative Example was used to dry the thermosetting adhesive sheet with a thickness of 25 μm. Both sides were covered with a heavy release film with a thickness of 50 μm and a light release film with a thickness of 50 μm, respectively, to obtain a thermosetting adhesive sheet with a release film on both sides. The light release film was peeled off from the thermosetting adhesive sheet with the release film on both sides, and the exposed thermosetting adhesive sheet surface was temporarily followed by a vacuum laminator, and then a 12 μm copper foil was laminated on a 50 μm polyamide On the copper foil on one side of the double-sided copper-clad laminate composed of both sides of the amine film. Next, the heavy release film was peeled off, and on the exposed thermosetting adhesive sheet surface, a single-sided copper-clad laminate consisting of a 50 μm polyimide film and a 12 μm copper foil was similarly laminated using a vacuum laminator. After the polyimide film side of the plate was temporarily attached, it was thermally cured at 180° C., 1 hour, and 2 MPa using a hot press to obtain copper foil 1/polyimide film 2/copper foil 1/thermosetting property The sample B for evaluation of the laminated structure of the hardened|cured material 3/polyimide film 2/copper foil 1 of the next sheet.

[Evaluation method] The sample B for evaluation was irradiated with a UV-YAG laser (Model 5330, manufactured by ESI) from the upper surface of FIG. 1 , and a blind hole with a diameter of 150 μm was processed until thermosetting adhesion. up to the boundary between the hardened product of the sheet and the copper-clad laminate on both sides. Next, the cross section of the blind hole portion was observed at a magnification of about 20 to 500 times with a laser microscope (VK-X100 manufactured by Keyence), and the lateral direction generated in the cured product of the thermosetting adhesive sheet was measured. The maximum length of etching (cutting in the horizontal direction beyond the designed opening diameter) was evaluated according to the following criteria. ◎: 5 μm or less. for extremely good results. ○: More than 5 μm and 7 μm or less. for good results. Δ: More than 7 μm and 10 μm or less. within the practical range. ×: More than 10 μm. Not practical.

(Laser processability (after de-smear treatment)) A sample obtained by processing a blind hole with a diameter of 150 μm up to the boundary between the hardened material of the thermosetting adhesive sheet and the copper-clad laminate on both sides was made in a “Marco Yize (MacDermid) Co., Ltd., Japan. MACUDIZER 9221-S" at 60°C for 7 minutes, "MACUDIZER 9275" at 75°C for 7 minutes, and "MACUDIZER 9276" at 45°C After dipping for 5 minutes, it was washed with water at 23°C for 5 minutes, and dried in an oven at 40°C for 10 minutes. Next, the cross section of the blind hole portion was observed with a laser microscope (VK-X100 manufactured by Keyence Corporation) at a magnification of about 20 times to 500 times, and the boundary between the copper foil and the cured product of the thermosetting adhesive sheet was observed. The peeling and the peeling state of the boundary between the polyimide film and the cured product of the thermosetting adhesive sheet were evaluated. ⊚: Among 30 holes, the number of holes where peeling occurred was 3 or less. for extremely good results. ○: Out of 30 holes, the number of holes where peeling occurred was 4 or more to 6 or less. for good results. Δ: Among 30 holes, the number of holes where peeling occurred was 7 or more to 10 or less. within the practical range. ×: Among 30 holes, one or more holes were peeled off. Not practical.

(heat resistance) [Evaluation method] The sample B for evaluation was prepared, it was stored for 24 hours or more in the environment of 23 degreeC of relative humidity 50%, and the solder float test of floating on the molten solder of 288 degreeC after that for 3 minutes was performed. Then, the cross section was observed at a magnification of about 20 to 500 times with a laser microscope (VK-X100, manufactured by Keyence Corporation), and the peeling and polyamide of the boundary between the copper foil and the cured product of the thermosetting adhesive sheet were observed. The peeling state of the boundary between the imine film and the cured product of the thermosetting adhesive sheet was evaluated. The number of samples for evaluation was 30. ⊚: The number of occurrences of peeling is 10% or less. for extremely good results. ○: The number of occurrences of peeling exceeds 10% to 20% or less. for good results. △: The number of pores where peeling occurred exceeds 20% to 30% or less. within the practical range. ×: The number of pores where peeling occurred exceeds 30%. Not practical.

(Cold and heat cycle resistance) The sample B for evaluation was prepared, and the evaluation of the cooling-heat cycle characteristic was performed. The treatment conditions were 15 minutes at -30°C and 15 minutes at 150°C as one cycle, and after 2000 cycles, the laser microscope (VK-X100 manufactured by Keyence) was used at a magnification of 20 to 500 times. Observe left and right. There were 30 samples for evaluation. ⊚: The number of occurrences of peeling is less than 10%. for extremely good results. ○: The number of occurrences of peeling is 10% to less than 20%. for good results. △: The number of pores where peeling occurred was 20% to less than 30%. within the practical range. ×: The number of pores where peeling occurred was 30% or more. Not practical.

(Shock Absorption Test) [Preparation of Sample C for Evaluation] In the same manner as in the preparation of samples for measurement of storage elastic coefficient and loss elastic coefficient, the coating liquid obtained in each Example and each Comparative Example was used to dry the thermosetting adhesive sheet with a thickness of 25 μm. Both sides were covered with a heavy release film with a thickness of 50 μm and a light release film with a thickness of 50 μm, respectively, to obtain a thermosetting adhesive sheet with a release film on both sides. The light release film was peeled off from the thermosetting adhesive sheet with the release film on both sides, and the exposed thermosetting adhesive sheet was temporarily adhered to a thickness of 3 mm manufactured by TestPiece using a vacuum laminator. on float glass. Next, the heavy release film was peeled off, and on the exposed thermosetting adhesive sheet surface, a single-sided copper-clad laminate consisting of a 50 μm polyimide film and a 12 μm copper foil was similarly laminated using a vacuum laminator. After the polyimide film side of the plate was temporarily attached, it was thermally cured at 180° C., 1 hour, and 2 MPa with a hot press to obtain a laminate of float glass/cured product/polyimide film/copper foil. Sample C for structural evaluation. [Evaluation method] Next, on the test surface of the test piece (the side of the single-sided copper clad laminate), a 300-g round weight was freely dropped downward from a height of 20 cm from the vertex. The float glass side of the test piece was visually observed to confirm the presence or absence of cracks or traces of a hammer, and then evaluated according to the following criteria. There are 10 test samples. ⊚: There are no cracks or traces. for extremely good results. ○: The total number of cracks and traces is 1 to 2. for good results. △: The total number of cracks and traces is 3 to 4. within the practical range. ×: The total number of cracks and marks is 5 or more. Not practical.

[Table 2] Table 2 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 adhesive resin Polyimide resin (A) (A1) 100 - - - - - - - - (A2) - 100 - - - - - - - (A3) - - 100 - - 100 100 100 100 (A4) - - - 100 - - - - - (A5) - - - - 100 - - - - (A6) - - - - - - - - - polyester resin (A7) - - - - - - - - - Hardener (B) Epoxy compound (B-1) ELM-434 5 5 5 5 5 5 5 5 5 YX-8800 - - - - - - - - - Maleimide compound (B-2) MIR-3000 - - - - - - - - - Isocyanate group-containing compound (B-3) TKA100 - - - - - - - - - Metal chelate compound (B-4) ZC-150 - - - - - - - - - Compounds containing carbodiimide groups (B-5) V-05 - - - - - - - - - Amine-containing compounds BAPP - - - - - - - - - Filler (C) Boron Nitride SP-2 20 20 20 20 20 5 30 40 63 silica SC2050-MB - - - - - - - - - Alumina HT grade - - - - - - - - - PTFE KT-300 - - - - - - - - - liquid crystal polymer E101-S - - - - - - - - - Storage elastic coefficient [Pa] 30℃ 4.4E+07 4.4E+08 4.5E+08 5.0E+08 4.8E+08 7.1E+07 5.5E+09 1.2E+09 2.5E+10 150℃ 3.4E+06 3.2E+06 3.7E+06 4.2E+07 4.5E+07 6.2E+05 5.1E+07 4.5E+07 1.3E+08 280℃ 2.0E+06 1.5E+06 1.3E+06 1.5E+06 1.0E+06 4.5E+05 1.2E+06 3.3E+07 3.5E+07 tanδ peak 0.29 0.80 0.90 0.24 0.55 0.82 0.72 0.77 0.90 Average particle size D ₅₀ (μm) of filler (C) / film thickness of thermosetting adhesive sheet (μm) 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.16 Evaluation Resin fluidity ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ Laser processability Before processing ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ After processing 〇 ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ heat resistance ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 〇 Heat and cold cycle resistance ◎ ◎ ◎ 〇 〇 ◎ 〇 〇 △ shock absorption △ ◎ ◎ △ ◎ ◎ ◎ ◎ ◎

[table 3] table 3 Example 10 Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 adhesive resin Polyimide resin (A) (A1) - - - - - - - - - (A2) - - - - - - - - - (A3) 100 100 100 100 100 100 100 100 100 (A4) - - - - - - - - - (A5) - - - - - - - - - (A6) - - - - - - - - - polyester resin (A7) - - - - - - - - - Hardener (B) Epoxy compound (B-1) ELM-434 1 10 twenty two - - - - - 5 YX-8800 - - - 5 - - - - - Maleimide compound (B-2) MIR-3000 - - - - 5 - - - - Isocyanate group-containing compound (B-3) TKA100 - - - - - 5 - - - Metal chelate compound (B-4) ZC-150 - - - - - - 5 - - Compounds containing carbodiimide groups (B-5) V-05 - - - - - - - 5 - Amine-containing compounds BAPP - - - - - - - - - Filler (C) Boron Nitride SP-2 20 20 20 20 20 20 20 20 - silica SC2050-MB - - - - - - - - 20 Alumina HT grade - - - - - - - - - PTFE KT-300 - - - - - - - - - liquid crystal polymer E101-S - - - - - - - - - Storage elastic coefficient [Pa] 30℃ 4.3E+08 7.2E+08 1.2E+09 4.6E+08 4.3E+08 4.2E+08 4.1E+08 4.2E+08 8.0E+07 150℃ 8.9E+04 1.2E+07 1.1E+08 3.2E+06 3.2E+06 3.1E+06 3.4E+06 3.9E+06 6.2E+05 280℃ 7.7E+04 1.4E+06 1.4E+06 1.5E+06 1.5E+05 9.5E+03 1.5E+06 1.3E+04 4.5E+05 tanδ peak 0.88 0.90 0.76 0.80 0.90 0.72 0.90 0.84 0.39 Average particle size D ₅₀ (μm) of filler (C) / film thickness of thermosetting adhesive sheet (μm) 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.02 Evaluation Resin fluidity △ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 Laser processability Before processing 〇 ◎ ◎ ◎ ◎ △ ◎ 〇 ◎ After processing ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 heat resistance ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ Heat and cold cycle resistance ◎ 〇 △ ◎ ◎ ◎ ◎ ◎ ◎ shock absorption ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇

[Table 4] Table 4 Example 19 Example 20 Example 21 Example 22 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 adhesive resin Polyimide resin (A) (A1) - - - - - - - - - (A2) - - - - - - - - - (A3) 100 100 100 100 - 100 100 - 100 (A4) - - - - - - - - - (A5) - - - - - - - - - (A6) - - - - 100 - - - - polyester resin (A7) - - - - - - - 100 - Hardener (B) Epoxy compound (B-1) ELM-434 5 5 5 - 5 5 - 5 50 YX-8800 - - - 5 - - - - - Maleimide compound (B-2) MIR-3000 - - - - - - - - - Isocyanate group-containing compound (B-3) TKA100 - - - - - - - - - Metal chelate compound (B-4) ZC-150 - - - - - - - - - Compounds containing carbodiimide groups (B-5) V-05 - - - - - - - - - Amine-containing compounds BAPP - - - - - - 5 - - Filler (C) Boron Nitride SP-2 - - - 20 20 0 20 20 70 silica SC2050-MB - - - - - - - - - Alumina HT grade 20 - - - - - - - - PTFE KT-300 - 20 - - - - - - - liquid crystal polymer E101-S - - 20 - - - - - - Storage elastic coefficient [Pa] 30℃ 1.2E+08 4.4E+08 4.5E+08 4.3E+08 4.3E+09 6.5E+05 3.2E+08 4.2E+07 1.2E+11 150℃ 6.2E+05 3.5E+06 3.8E+06 3.5E+06 4.2E+09 8.8E+04 3.1E+06 3.5E+04 3.5E+10 280℃ 4.5E+04 3.0E+06 3.2E+06 1.4E+03 1.1E+08 3.4E+03 8.8E+02 2.9E+02 2.9E+10 tanδ peak 0.26 0.65 0.66 0.85 0.55 0.80 0.81 0.25 0.2 Average particle size D ₅₀ (μm) of filler (C) / film thickness of thermosetting adhesive sheet (μm) 0.05 0.40 0.70 0.16 0.16 0.16 0.16 0.16 0.16 Evaluation Resin fluidity 〇 ◎ ◎ ◎ ◎ △ ◎ △ ◎ Laser processability Before processing 〇 ◎ ◎ △ ◎ △ × × ◎ After processing ◎ ◎ ◎ ◎ ◎ × ◎ 〇 ◎ Solder crack resistance ◎ ◎ ◎ ◎ △ ◎ ◎ ◎ × Heat and cold cycle resistance ◎ ◎ ◎ ◎ × ◎ ◎ ◎ × shock absorption △ ◎ ◎ ◎ ◎ ◎ ◎ △ △

[Industrial Availability] According to the present invention, a cured product excellent in laser processability, heat resistance, thermal cycle resistance, and shock absorption can be provided, and a thermosetting resin composition with low resin fluidity can be provided. These are suitable for manufacture of various printed wiring boards, electronic equipment, etc. which require high workability and reliability.

1: copper foil 2: Polyimide film 3: Cured product of thermosetting adhesive sheet 4: Side etching

FIG. 1 is a schematic diagram showing a cross section of a printed wiring board near a blind hole by laser processing.

1: copper foil

2: Polyimide film

3: Cured product of thermosetting adhesive sheet

4: Side etching

Claims (13)

A thermosetting resin composition, comprising: a polyimide resin (A), which is a reactant product of a monomer group comprising a dimer diamine (a-1) and a tetracarboxylic anhydride (a-2) ; Hardener (B), selected from epoxy compound (B-1), maleimide compound (B-2), isocyanate group-containing compound (B-3), metal chelate compound (B-4) ) and at least one of the group consisting of a carbodiimide group-containing compound (B-5); and a filler (C), wherein the thermosetting resin composition is characterized in that the thermosetting resin composition is The cured product obtained by heating the resin composition at 180°C for 60 minutes satisfies (1) to (3), (1) the storage elastic modulus at 30°C is 1.0×10 ⁶ Pa to 1.0×10 ¹¹ Pa, (2) The storage elastic coefficient at 150°C is 1.0×10 ⁴ Pa to 1.0×10 ⁹ Pa, and (3) the storage elastic coefficient at 280° C. is 1.0×10 ³ Pa to 1.0×10 ⁹ Pa. The thermosetting resin composition according to claim 1, wherein a loss tangent (tan δ) peak value of the cured product at 0° C. to 280° C. is 0.3 or more. The thermosetting resin composition according to claim 1 or claim 2, wherein the curing agent (B) contains three or more compounds capable of reacting with the polyimide resin (A) in one molecule. Reactive functional groups. The thermosetting resin composition according to any one of Claims 1 to 3, comprising 0.1 to 20 parts by mass relative to 100 parts by mass of the polyimide resin (A) parts of the hardener (B). The thermosetting resin composition according to any one of Claims 1 to 4, comprising 5 to 60 parts by mass relative to 100 parts by mass of the polyimide resin (A) parts of the filler (C). The thermosetting resin composition according to any one of Claims 1 to 5, wherein the filler (C) is selected from the group consisting of fluorine fillers, boron nitride, liquid crystal polymers and silicon dioxide at least one of the groups. The thermosetting resin composition according to any one of Claims 1 to 6, which is used as a member for interlayer adhesion of a printed wiring board. A thermosetting adhesive sheet formed of the thermosetting resin composition according to any one of Claims 1 to 7. A thermosetting cover sheet with a release film, comprising the thermosetting adhesive sheet according to claim 8 and a release film. A copper-clad laminate obtained by laminating a copper foil and an insulating film via an adhesive layer that is a cured product of the thermosetting resin composition according to any one of Claims 1 to 7. A printed wiring board using the thermosetting adhesive sheet according to claim 8. An electronic device comprising the printed wiring board as claimed in claim 11. A cured product is a cured product of a thermosetting resin composition comprising: a polyimide resin (A) comprising a dimer diamine (a-1) and a tetracarboxylic anhydride The reactant product of the monomer group of (a-2); The hardener (B) is selected from epoxy compound (B-1), maleimide compound (B-2), isocyanate group-containing at least one selected from the group consisting of a compound (B-3), a metal chelate compound (B-4), and a carbodiimide group-containing compound (B-5); and a filler (C), the hardened The characteristics of the material are that (1) to (3) are satisfied, (1) the storage elastic coefficient at 30°C is 1.0×10 ⁶ Pa to 1.0×10 ¹¹ Pa, and (2) the storage elastic coefficient at 150°C is 1.0× 10 ⁴ Pa～1.0×10 ⁹ Pa, (3) The storage elastic coefficient at 280°C is 1.0×10 ³ Pa～1.0×10 ⁹ Pa.

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