TW202229394A - 成形用樹脂組成物及高頻元件 - Google Patents

成形用樹脂組成物及高頻元件 Download PDF

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Publication number
TW202229394A
TW202229394A TW110146611A TW110146611A TW202229394A TW 202229394 A TW202229394 A TW 202229394A TW 110146611 A TW110146611 A TW 110146611A TW 110146611 A TW110146611 A TW 110146611A TW 202229394 A TW202229394 A TW 202229394A
Authority
TW
Taiwan
Prior art keywords
inorganic filler
resin composition
molding
resin
compound
Prior art date
Application number
TW110146611A
Other languages
English (en)
Chinese (zh)
Inventor
山浦格
荒田道俊
齋藤貴大
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202229394A publication Critical patent/TW202229394A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW110146611A 2020-12-11 2021-12-13 成形用樹脂組成物及高頻元件 TW202229394A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-206092 2020-12-11
JP2020206092 2020-12-11

Publications (1)

Publication Number Publication Date
TW202229394A true TW202229394A (zh) 2022-08-01

Family

ID=81974573

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110146611A TW202229394A (zh) 2020-12-11 2021-12-13 成形用樹脂組成物及高頻元件

Country Status (3)

Country Link
JP (1) JPWO2022124405A1 (https=)
TW (1) TW202229394A (https=)
WO (1) WO2022124405A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870292B (zh) * 2024-04-25 2025-01-11 南亞塑膠工業股份有限公司 樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3876679B2 (ja) * 2001-10-15 2007-02-07 日立化成工業株式会社 樹脂組成物とその利用
JP2010195997A (ja) * 2009-02-27 2010-09-09 Panasonic Electric Works Co Ltd 高誘電性エポキシ樹脂組成物及び高周波デバイス
CN103351578B (zh) * 2013-07-19 2015-08-19 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
JP6679849B2 (ja) * 2015-07-01 2020-04-15 味の素株式会社 樹脂組成物
WO2020066856A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7115568B2 (ja) * 2019-01-23 2022-08-09 株式会社村田製作所 アンテナモジュール及び通信装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870292B (zh) * 2024-04-25 2025-01-11 南亞塑膠工業股份有限公司 樹脂組成物

Also Published As

Publication number Publication date
WO2022124405A1 (ja) 2022-06-16
JPWO2022124405A1 (https=) 2022-06-16

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