TW202226360A - Grinding apparatus and method of driving grinding apparatus - Google Patents

Abstract

After a workpiece unit has been delivered from a cassette and before the workpiece unit is delivered to a chuck table, a value of the thickness of the workpiece unit is recognized on the basis of a result of a measurement performed by a measuring unit. The value of the thickness of the workpiece unit is represented by the sum of values of respective thicknesses of a workpiece and a tape affixed thereto. On the basis of the result of the measurement performed by the measuring unit, it is possible to decide whether or not the tape affixed to the workpiece has a desired thickness, i.e., whether the tape is of a desired type or not. As a result, a workpiece with an inadequate tape affixed thereto is prevented from being ground.

Description

Grinding device and driving method of grinding device

The present invention relates to a grinding device and a driving method of the grinding device.

Chips for components such as IC (Integrated Circuit) and LSI (Large Scale Integration) are indispensable components in various electronic devices such as mobile phones and personal computers. Such a chip is manufactured by, for example, thinning a wafer on which a plurality of elements are formed on the front surface, and then dividing the regions including the elements individually.

As a method of thinning the wafer, for example, grinding by a grinding device having a grinding wheel and a chuck table, the grinding wheel including a plurality of grinding stones arranged in a ring-shaped manner, and the chuck table attracting and holding processed objects. In the case of thinning a wafer with such a grinding apparatus, an adhesive film (protective film) is often attached to the front surface of the wafer before grinding (for example, refer to Patent Document 1).

Then, in a state in which the chuck table has attracted and held the front side of the wafer to which the adhesive film is attached, a plurality of grinding stones grind the back side of the wafer, thereby thinning the wafer. By sticking the adhesive film on the front surface of the wafer on which the element is formed, the impact applied to the element when the wafer is ground can be alleviated and the element can be prevented from being damaged. [Previously known technical literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2007-288031.

[Problems to be solved by the invention] The thickness and adhesive strength of the above-mentioned adhesive film vary depending on the type. Therefore, adhesive films attached to workpieces such as wafers are used separately according to grinding conditions and the like. Then, in the grinding device, the workpiece unit is transported from the cassette containing the workpiece (the workpiece unit) to which the desired film is attached and ground to a chuck table.

Here, the sticking of the adhesive film to the workpiece is performed using a dedicated device, but the exchange or replenishment of the adhesive film, which is a consumable, is performed manually by an operator. Therefore, there is a possibility that the adhesive film is attached to the workpiece in a state where the device is equipped with an inappropriate adhesive film.

In addition, the operation of accommodating the workpiece unit in the cassette and/or carrying the cassette accommodating the workpiece unit into the grinding device may be performed manually by an operator. Therefore, there is a possibility that the cassette for accommodating the workpiece to which the inappropriate film is attached is carried into the grinding device.

Furthermore, even the different types of adhesive films are mostly similar in color and touch. Therefore, before the grinding device grinds the workpiece, it is difficult for the operator to confirm the type of the film attached to the workpiece by viewing or touching it.

In view of these problems, an object of the present invention is to provide a grinding device which can prevent grinding of a workpiece to which an inappropriate adhesive film is adhered.

[Technical means to solve the problem] According to an aspect of the present invention, there is provided a grinding device including: a cassette mounting table for mounting a cassette for accommodating a workpiece unit, the workpiece unit being glued to one surface of the workpiece film; a chuck table for holding the workpiece unit; a conveying mechanism for transferring the workpiece unit between the cassette and the chuck table; a first measurement unit for The measurement is used to calculate the thickness value of the workpiece unit held by the conveying mechanism or the value of the thickness value of the workpiece unit; the grinding unit is used for grinding the workpiece unit held on the chuck table; and a control unit for controlling each of the constituent elements, and the control unit includes a judgment unit for judging whether the workpiece unit is a grinding object based on the thickness value of the workpiece unit, and the workpiece unit is The thickness value is obtained from the measurement of the workpiece unit after being carried out from the cassette and before being carried into the chuck table by the first measuring unit.

Furthermore, in one aspect of the present invention, it is preferable that the control unit is provided with: a memory part for storing the respective thickness values of the workpiece and the adhesive film, and the judgment part compares and stores in the memory The value of the sum of the respective thickness values of the workpiece and the adhesive film of the part, and the thickness value of the workpiece unit obtained from the measurement performed by the first measuring unit, is determined as the workpiece. Whether the required film is pasted.

Furthermore, in one aspect of the present invention, it is preferable that the first measuring unit includes: a first non-contact distance measuring device provided on one side of the workpiece unit held by the conveying mechanism, and measuring to The distance to one side of the workpiece unit; and a second non-contact distance measuring device, which is provided on the back side of one side of the workpiece unit held by the conveying mechanism, that is, the other side, and measures to the workpiece The distance to the other side of the workpiece unit.

In addition, in one aspect of the present invention, it is preferable to further include: a second measuring unit for measuring the thickness value of the workpiece unit held on the chuck table or the thickness of the workpiece unit for calculating the thickness value of the workpiece unit. the value of the thickness value, and the judgment part compares the thickness value of the workpiece unit obtained from the measurement by the second measurement unit with the thickness value obtained from the measurement by the first measurement unit The thickness value of the workpiece unit is used to determine whether or not the second measurement unit is operating normally.

According to another aspect of the present invention, there is provided a driving method of a grinding device including a cassette mounting table for mounting a cassette for accommodating a workpiece unit, the workpiece unit being fastened to One side of the object to be processed is formed by pasting the adhesive film; a chuck table, which is used to hold the workpiece unit; a conveying mechanism, which is used to transport the workpiece unit between the cassette and the chuck table; the first a measuring unit for measuring the value used for calculating the thickness value of the workpiece unit held by the conveying mechanism or the thickness value of the workpiece unit; a grinding unit for grinding the workpiece held on the chuck table the workpiece unit; and a control unit for controlling each component, and the driving method of the grinding device includes: a first carrying out step in which the carrying mechanism removes the card from the cassette mounted on the cassette mounting table. The cassette unloads the workpiece unit; the first measurement step, the first measurement unit is used to calculate the thickness value of the workpiece unit or the thickness value of the workpiece unit carried out from the cassette in the unloading step. value; a first judging step, the control unit judges whether the workpiece unit is a grinding object according to the thickness value of the workpiece unit obtained by the measurement in the first measuring step; and a loading step, which is in In the case where the first judging step judges that the workpiece unit is the grinding object, the conveying mechanism carries the workpiece unit into the chuck table, and the first judging step judges that the workpiece unit is not the grinding object In this case, the transport mechanism transports the workpiece unit into the cassette again.

Furthermore, in another aspect of the present invention, preferably, the grinding device further includes: a second measuring unit for measuring a thickness value or The value of the thickness value of the workpiece unit, and the driving method of the grinding device includes: a grinding step in which the grinding unit grinds the workpiece unit carried into the chuck table in the carrying-in step; and a second measuring step, The second measuring unit measures the value used to calculate the thickness value of the workpiece unit ground in the grinding step or the thickness value of the workpiece unit; in the second unloading step, the transfer mechanism unloads the workpiece from the chuck table. The workpiece unit whose thickness value is measured in the second measurement step; in the third measurement step, the first measurement unit is used to calculate the thickness of the workpiece unit unloaded from the chuck table during the second unloading step value or the value of the thickness value of the workpiece unit; and a second judging step, the control unit compares the thickness value of the workpiece unit obtained according to the measurement performed by the second measuring step with the value according to the workpiece unit obtained by the second measuring step The thickness value of the workpiece unit obtained by the measurement performed in the third measurement step is used to determine whether the second measurement unit operates normally.

Or, in another aspect of the present invention, preferably, the grinding device further includes: a second measuring unit for measuring the thickness value of the workpiece unit held on the chuck table or the The value of the thickness value of the workpiece unit, and the driving method of the grinding device includes: a fourth measurement step of grinding the workpiece unit that has been carried into the chuck table in the carrying step. The second measuring unit measures a value used to calculate the thickness value of the workpiece unit or the thickness value of the workpiece unit; and a third judging step, the control unit compares according to the measurement performed by the fourth measuring step. The obtained thickness value of the workpiece unit and the thickness value of the workpiece unit obtained by the measurement performed in the first measurement step are used to determine whether the second measurement unit operates normally.

[Inventive effect] In this invention, the thickness value of the to-be-processed object unit after carrying out from a cassette and before carrying it into a chuck table can be grasped based on the measurement performed by the 1st measurement means. Here, the thickness value of the workpiece unit is a value obtained by adding up the respective thickness values of the workpiece and the adhesive film attached thereto.

Therefore, according to this measurement, it can be judged whether the adhesive film attached to the workpiece has the required thickness, that is, whether it is of the required type. In other words, it is possible to determine whether or not the workpiece unit is a grinding target before being loaded into the chuck table. As a result, the workpiece to which an inappropriate film is adhered is prevented from being ground.

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing an example of the grinding apparatus of the present invention. In addition, the X-axis direction (front-rear direction) and the Y-axis direction (left-right direction) shown in FIG. 1 are directions orthogonal to each other on the horizontal plane, and the Z-axis direction (up-down direction) is the X-axis direction and the Y-axis direction. Orthogonal direction (vertical direction).

The grinding apparatus 2 shown in FIG. 1 is provided with the base 4 which supports various components. An opening 4a is formed on the front end side of the upper surface of the base 4, and the conveyance mechanism 6 is installed in the opening 4a. The transport mechanism 6 is, for example, a robot arm having a plurality of joints. FIG. 2 is a perspective view schematically showing an example of a workpiece unit conveyed by the conveying mechanism 6 .

The workpiece unit 11 shown in FIG. 2 has a disk-shaped workpiece 13 . The workpiece 13 is, for example, a wafer made of a semiconductor material such as silicon (Si). The front surface 13a side of the workpiece 13 is divided into a plurality of regions by a plurality of planned dividing lines 15 intersecting with each other, and elements 17 such as ICs and LSIs are formed in each region.

In addition, the material, shape, structure, size, etc. of the workpiece 13 are not limited. For example, the workpiece 13 may also be a substrate made of materials such as other semiconductor materials, ceramics, resins, and metals. Likewise, the type, number, shape, structure, size and arrangement of the elements 17 are also not limited.

In addition, a film-like adhesive film 19 having a diameter substantially equal to the diameter of the workpiece 13 is adhered to the front surface 13 a of the workpiece 13 . The adhesive film 19 is made of resin, for example, and protects the element 17 by softening the impact applied to the front surface 13a side when grinding the back surface 13b side of the workpiece 13 .

Then, in the present embodiment, in a state where the surface 11a of the workpiece unit 11 (the surface 19a on the side of the adhesive film 19 that is not adhered to the workpiece 13) is held, the back surface of the surface 11a, that is, the other surface, is ground. 11b (back surface 13b of workpiece 13) side.

The front of the opening 4a shown in FIG. 1 is provided with the cassette mounting bases 10a, 10b, and the cassette mounting bases 10a, 10b are used for mounting the cassettes 8a, 8b which accommodate the to-be-processed object unit 11. In addition, the conveying mechanism 6 can not only hold and convey the workpiece unit 11 but also can reverse the workpiece unit 11 up and down.

Further, behind the opening 4 a is provided a measuring unit (first measuring unit) 12 for calculating the thickness value of the workpiece unit 11 held by the conveying mechanism 6 . FIG. 3 is a side view schematically showing the measurement unit 12 .

The measurement unit 12 includes: a quadrangular-pillar-shaped support portion 14 extending in the Z-axis direction; side (the conveying mechanism 6 side) and extends in the X-axis direction. The upper surface side measuring device 16 and the lower surface side measuring device 18 are separated in the Z-axis direction, and are non-contact distance measuring devices that measure the distance to the measurement object using a laser beam.

Specifically, the upper surface side measuring device 16 has a light projecting portion 16a that projects a laser beam downward, and a light receiving portion 16b that receives the upper surface of the object to be measured (for example, the other surface 11b of the workpiece unit 11 ). ) reflected laser beam. Then, the upper surface side measuring device 16 measures the distance to the upper surface of the measurement object based on the phase difference between the projected laser beam and the received laser beam, and the like.

Similarly, the lower surface side measuring device 18 has a light projecting portion 18a that projects a laser beam upward, and a light receiving portion 18b that receives reflections from the lower surface of the object to be measured (for example, the surface 11a of the workpiece unit 11 ). laser beam. Then, the lower surface side measuring device 18 measures the distance to the lower surface of the measurement object based on the phase difference between the projected laser beam and the received laser beam, and the like.

In addition, the light projecting portion 16a includes, for example, a light source that projects light of a wavelength that is reflected on the upper surface of the measurement object (for example, the back surface 13b of the workpiece 13 ), and a lens and/or mirror that emits light from the light source of light is directed towards the measurement object. Likewise, the light-projecting portion 18a includes, for example, a light source that projects light of a wavelength that will be reflected on the lower surface of the measurement object (eg, the surface 19a of the adhesive film 19 ); and a lens and/or mirror that will come from this light source of light is directed towards the measurement object.

Therefore, the wavelength of the light projected from the light projection part 16a and the wavelength of the light projected from the light projection part 18a may be different. In addition, the light-receiving parts 16b and 18b include, for example, a lens and/or a mirror that guides the light reflected by the object to be measured to the light-receiving element, and a CMOS (Complementary Metal-Oxide Semiconductor) image that detects the light reflected by the object to be measured. Sensors and other light-receiving elements.

A position adjustment mechanism 20 for adjusting the position of the workpiece unit 11 is provided at an oblique rear (one side of the measurement unit 12 ) of the opening 4 a shown in FIG. 1 . The position adjustment mechanism 20 includes, for example, a disk-shaped table and a plurality of pins arranged around the table.

By moving the plurality of pins in the radial direction of the table, for example, the center of the workpiece unit 11 is positioned at a predetermined position in the X-axis direction and the Y-axis direction by the conveying mechanism. 6 is carried out from the cassette 8 a and placed on the table of the position adjustment mechanism 20 . In addition, in this embodiment, the to-be-processed object unit 11 is mounted on the table of the position adjustment mechanism 20 so that the back surface 11b may face upward.

Furthermore, in the present embodiment, the workpiece unit 11 carried out from the cassette 8 a by the conveying mechanism 6 has its outer peripheral portion positioned between the upper surface side measuring device 16 and the lower surface side measuring device 18 of the measuring unit 12 . , and is carried into the position adjustment mechanism 20 after calculating its thickness value.

A conveyance mechanism 22 is provided behind the measurement unit 12 , and the conveyance mechanism 22 holds the workpiece unit 11 and conveys the workpiece unit 11 to the rear. The conveyance mechanism 22 is provided with the holding pad which attracts and holds the upper surface (rear surface 11b in this embodiment) side of the to-be-processed object unit 11, and the arm part which connects this holding pad. And the conveyance mechanism 22 rotates a holding pad by an arm part, and conveys the to-be-processed object unit 11 whose position is adjusted by the position adjustment mechanism 20 to the rear.

A disk-shaped turntable 24 is provided behind the conveyance mechanism 22 . The turntable 24 is connected to a rotational drive source (not shown) such as a motor, and rotates around a rotational axis substantially parallel to the Z-axis direction. The upper surface of the rotary table 24 is provided with three chuck tables 26 capable of holding the workpiece unit 11 .

The three chuck tables 26 are provided at substantially equal intervals along the circumferential direction of the turntable 24 . In addition, the number and the like of the chuck tables 26 provided on the turntable 24 are not limited.

FIG. 4 is a plan view schematically showing the structure of the turntable 24 and its surroundings. In addition, in FIG. 4, some elements are shown by a dotted line for convenience of description. The transport mechanism 22 transports the workpiece unit 11 held by the holding pads into the chuck table 26 arranged in the loading and unloading area A adjacent to the transport mechanism 22 (see FIG. 4 ).

The turntable 24 rotates, for example, in the directions shown by the arrows in FIGS. 1 and 4 , and moves the chuck tables 26 to the carry-in and carry-out area A, the rough grinding area B, and the fine grinding area C in this order. Each chuck table 26 is connected to a rotational drive source (not shown) such as a motor, and rotates around a rotation axis that is substantially parallel to the Z-axis direction.

Each chuck table 26 has a disk-shaped frame body made of a metal material such as stainless steel, for example. A concave portion having a circular opening at the upper end is formed on the upper surface side of the frame body, and a disc-shaped porous plate made of ceramics or the like is fixed to the concave portion.

The upper surface of the chuck table 26 is formed in a shape corresponding to a conical side surface whose center is slightly convex from the outer edge, and serves as a holding surface for holding the lower surface (in this embodiment, the front surface 11 a ) side of the workpiece unit 11 . 26a function. That is, each chuck table 26 is provided with the holding surface 26a which holds the workpiece unit 11 in the upper part.

The holding surface 26 a is connected to a suction source (not shown) such as a vacuum pump through a suction path (not shown) or the like formed inside the chuck table 26 . The workpiece unit 11 that has been loaded into the chuck table 26 is sucked by the negative pressure of the suction source acting on the holding surface 26a on the lower surface side.

As shown in FIG. 1 , a columnar support structure 28 is provided behind each of the rough grinding area B and the fine grinding area C (the back side of the turntable 24 ). The Z-axis moving mechanism 30 is provided on the front surface side of each support structure 28 . Each Z-axis moving mechanism 30 includes a pair of guide rails 32 that are substantially parallel to each other in the Z-axis direction, and the moving plate 34 is slidably attached to the guide rails 32 .

A nut (not shown) constituting a ball screw is fixed to the rear surface (back surface) side of each moving plate 34 , and a screw shaft 36 substantially parallel to the guide rail 32 is rotatably connected to the nut. A motor 38 is connected to one end of the screw shaft 36 . The screw shaft 36 is rotated by the motor 38 , whereby the moving plate 34 moves in the Z-axis direction along the guide rail 32 .

A fixture 40 is provided on the front surface (front surface) side of each moving plate 34 . Each fixture 40 supports a grinding unit 42 for grinding the workpiece unit 11 . Each grinding unit 42 includes a spindle housing 44 fixed to the fixture 40 .

The main shaft 46 which becomes a rotation axis which is substantially parallel to the Z-axis direction is accommodated in each main shaft housing 44 in a rotatable state. The lower end portion of each spindle 46 is exposed from the lower end surface of the spindle housing 44 . A disk-shaped mount 48 is fixed to the lower end of the spindle 46 .

A first grinding wheel 50a for rough grinding is attached to the lower surface of the mounting member 48 of the grinding unit 42 on the rough grinding area B side. The first grinding wheel 50a for rough grinding includes a first wheel base formed of a metal such as stainless steel or aluminum so as to be substantially the same diameter as the mount 48 .

A plurality of first grinding stones are annularly arranged on the lower surface of the first wheel base, and the first grinding stones are made of abrasive grains such as diamond suitable for rough grinding, vitrified, thermosetting resin, etc. The binding agent is fixed. Furthermore, the spindle housing 44 of the grinding unit 42 on the side of the rough grinding area B accommodates a first rotational drive source (not shown) such as a motor connected to the upper end side of the spindle 46 .

The first grinding wheel 50a is rotated together with the main shaft 46 by the power of the first rotational drive source. The vicinity of the first grinding wheel 50 a is provided with a liquid supply nozzle (not shown) that can supply a liquid (grinding liquid) such as pure water to the point where the workpiece unit 11 comes into contact with the first grinding stone. part (processing point). However, instead of this liquid supply nozzle, or together with the liquid supply nozzle, a liquid supply port for supplying liquid may be provided in the first grinding wheel 50a.

Similarly, the second grinding wheel 50b for fine grinding is attached to the lower surface of the mount 48 of the grinding unit 42 on the fine grinding area C side. The second grinding wheel 50b for finish grinding includes a second wheel base formed of a metal such as stainless steel or aluminum so as to be substantially the same diameter as the mount 48 .

A plurality of second grinding stones are annularly arranged on the lower surface of the second wheel base, and the second grinding stones are formed by fixing abrasive grains such as diamond suitable for fine grinding with a bonding agent such as ceramics or resin. In addition, the spindle housing 44 of the grinding unit 42 on the side of the fine grinding area C accommodates a second rotational drive source (not shown) such as a motor connected to the upper end side of the spindle 46 .

The second grinding wheel 50b is rotated together with the main shaft 46 by the power of the second rotational drive source. The vicinity of the second grinding wheel 50 b is provided with a liquid supply nozzle (not shown) that can supply a liquid (grinding liquid) such as pure water to the point where the workpiece unit 11 comes into contact with the second grinding stone. part (processing point). However, instead of this liquid supply nozzle, or together with the liquid supply nozzle, a liquid supply port for supplying liquid may be provided in the second grinding wheel 50b.

The workpiece unit 11 held by each chuck table 26 is sequentially ground by the above-mentioned two sets of grinding units 42 . Specifically, the workpiece unit 11 held by the chuck table 26 in the rough grinding area B is ground by the grinding unit 42 on the side of the rough grinding area B, and the chuck in the fine grinding area C is ground by the grinding unit 42 on the side of the fine grinding area C. The workpiece unit 11 held by the disk table 26 .

As shown in FIG. 1 , a measuring unit (second measuring unit) 52 is provided in front of the grinding unit 42 on the finishing grinding area C side, and the measuring unit (second measuring unit) 52 is used to calculate the finished workpiece after finishing grinding. Thickness value of element 11.

The measurement unit 52 has: a first measurement part whose front end can contact the upper surface of the measurement object (in this embodiment, the back surface 11 b of the workpiece unit 11 ); and a second measurement part whose front end can contact the upper surface of the chuck table 26 . Hold face 26a. Furthermore, the first measurement unit and the second measurement unit measure the position (height) of the front end in the vertical direction, respectively. That is, the second measurement unit 52 includes 2 contact position (height) measurers.

In front of the carry-in and carry-out area A and on the side of the conveyance mechanism 22, there is provided a conveyance mechanism 54 that holds the ground workpiece unit 11 and conveys the ground workpiece unit 11 to the front. The conveyance mechanism 54 includes a holding pad that sucks and holds the upper surface (the back surface 11 b in the present embodiment) side of the workpiece unit 11 , and an arm portion that is connected to the holding pad. Then, the conveyance mechanism 54 rotates the holding pad by the arm portion, thereby conveying the ground workpiece unit 11 from the chuck table 26 to the front.

A cleaning unit 56 is provided in front of the conveying mechanism 54 , and the cleaning unit 56 cleans the workpiece unit 11 carried out by the conveying mechanism 54 . The cleaning unit 56 includes, for example, a rotary table that rotates while holding the lower surface (in this embodiment, the front surface 11 a ) side of the workpiece unit 11 , and a nozzle that sprays cleaning fluid to the rotating object. The upper surface (rear surface 11b in this embodiment) side of the workpiece unit 11 held by the table.

The workpiece unit 11 cleaned by the cleaning unit 56 is transferred by the transfer mechanism 6 . For example, the outer peripheral portion of the workpiece unit 11 is positioned between the upper surface side measuring device 16 and the lower surface side measuring device 18 of the measuring unit 12, and is carried into the cassette 8b after calculating the thickness value. Alternatively, the workpiece unit 11 may be directly carried into the cassette 8b from the cleaning unit 56 .

In addition, the grinding apparatus 2 may include components other than the above-mentioned components. For example, the grinding device 2 may include a touch panel composed of a touch sensor that inputs an instruction from an operator to the grinding device 2 and a display that outputs various information to the operator.

The operation of each component of the grinding apparatus 2 is controlled by the control unit built in the grinding apparatus 2 . FIG. 5 is a block diagram schematically showing an example of a control unit built in the grinding apparatus. The control unit 58 shown in FIG. 5 includes, for example, a processing unit 60 that generates signals for controlling the components of the grinding apparatus 2 , and a memory unit 62 that stores various information (data, programs, etc.) used in the processing unit 60 . ).

In addition, the memory unit 62 stores in advance, for example, the following values: the respective thickness values of the workpiece 13 and the film 19 constituting the workpiece unit 11 to be ground in the grinding device 2 ; and the upper surface of the measuring unit 12 The value of the interval between the side measuring device 16 and the lower surface side measuring device 18 .

The function of the processing unit 60 is realized by a CPU (Central Processing Unit, central processing unit) or the like, and the CPU or the like reads and executes a program stored in the memory unit 62 . In addition, the function of the memory portion 62 can be implemented by semiconductor memories such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and NAND-type flash memory. It is realized by at least one of magnetic storage devices such as HDD (Hard Disk Drive, hard disk drive).

The processing unit 60 includes a conveying unit 64 , a measuring unit 66 , a grinding unit 68 , and a determining unit 70 . In the processing section 60, these functional sections are not simultaneously or independently processed at the same time. Furthermore, the processing unit 60 may have functional units other than the conveying unit 64 , the measuring unit 66 , the grinding unit 68 , and the determining unit 70 . For example, the processing unit 60 may include a display unit that controls the display of the display, which is a component element of the touch panel.

The conveyance unit 64 controls the operations of the conveyance mechanism 6 , the conveyance mechanism 22 , and the conveyance mechanism 54 . For example, the conveyance unit 64 controls the operation of the conveyance mechanism 6 such that the outer peripheral portion of the workpiece unit 11 is positioned at a position between the upper surface side measuring device 16 and the lower surface side measuring device 18 of the measuring unit 12 (measurement position ).

The measurement unit 66 controls the operations of the measurement unit 12 and the measurement unit 52 . For example, the measurement unit 66 controls the operation of the measurement unit 12 by measuring the distance (first distance) between the upper surface of the workpiece unit 11 whose outer peripheral portion is positioned at the above-mentioned measurement position and the upper surface side measuring device 16 , and the The distance (second distance) between the lower surface of the workpiece unit 11 and the lower surface side measuring device 18 .

The grinding unit 68 controls the operations of the rotary table 24 , the chuck table 26 , the grinding unit 42 , and the related components. For example, the grinding unit 68 controls these operations so as to grind the workpiece unit 11 held on the chuck table 26 .

The determination unit 70 calculates the thickness value of the workpiece unit 11 based on the measurement performed by the measurement unit 12 . For example, the determination unit 70 calculates the distance of the workpiece unit 11 by subtracting the first distance and the second distance from the interval value between the upper surface side measuring device 16 and the lower surface side measuring device 18 of the measuring unit 12 stored in the memory unit 62 . Thickness value.

Furthermore, the determination unit 70 determines whether the workpiece unit 11 is a grinding object according to the thickness value of the workpiece unit 11 obtained by the measurement performed by the measurement unit 12 . For example, the determination unit 70 compares the value obtained by summing the respective thickness values of the workpiece 13 and the film 19 stored in the memory unit 62 with the calculated thickness value of the workpiece unit 11, and determines whether the workpiece 13 is in the workpiece 13. Whether the required adhesive film 19 is pasted.

Then, the judging section 70 judges that the workpiece unit 11 is the grinding object when judging that the required film 19 is attached to the workpiece 13 , and judges that the workpiece 13 is not affixed with the required film 19 In this case, it is determined that the workpiece unit 11 is not the grinding object.

FIG. 6 is a flowchart schematically showing an example of a driving method of the grinding device 2 . In this driving method, first, the conveying mechanism 6 carries out the workpiece unit 11 from the cassette 8a placed on the cassette mounting table 10a (carrying out step: S1 ). Then, the conveyance mechanism 6 positions the workpiece unit 11 at the above-mentioned measurement position.

Next, the measurement unit 12 measures the value for calculating the thickness of the workpiece unit 11 , that is, measures the above-mentioned first distance and second distance (measurement step: S2 ). Then, as described above, the determination unit 70 of the control unit 58 calculates the thickness value of the workpiece unit 11 .

Next, the determination part 70 determines whether the workpiece unit 11 is a grinding object according to the thickness value of the workpiece unit 11 (determination step: S3 ). Specifically, as described above, the determination unit 70 determines whether the workpiece unit 11 is the grinding target according to whether or not the required adhesive film 19 is attached to the workpiece 13 .

Then, when it is determined that the workpiece unit 11 is the grinding target ( S3 : YES), the workpiece unit 11 is carried into the chuck table 26 (carrying-in step: S4 ). Specifically, the transfer mechanism 6 carries the workpiece unit 11 into the position adjustment mechanism 20 , and the transfer mechanism 22 carries the workpiece unit 11 whose position has been adjusted by the position adjustment mechanism 20 out of the position adjustment mechanism 20 and into the chuck table 26 .

When the workpiece unit 11 is carried into the chuck table 26, the workpiece unit 11 is ground (grinding step: S5). On the other hand, when it is judged that the workpiece unit 11 is not the grinding target ( S3 : NO), the workpiece unit 11 is carried into the cassette 8 a again (carrying-in step: S6 ).

As described above, in the grinding device 2 and the driving method thereof, the thickness value of the workpiece unit 11 after being unloaded from the cassette 8 a and before being loaded into the chuck table 26 can be grasped based on the measurement by the measuring unit 12 . Here, the thickness value of the workpiece unit 11 is a value obtained by adding up the respective thickness values of the workpiece 13 and the adhesive film 19 attached thereto.

Therefore, according to the measurement, it can be determined whether the adhesive film 19 attached to the workpiece 13 has the required thickness, that is, whether it is of the required type. In other words, it is possible to determine whether or not the workpiece unit 11 is a grinding target before being loaded into the chuck table 26 . As a result, the workpiece 13 to which the inappropriate adhesive film 19 is adhered is prevented from being ground.

In addition, in the grinding apparatus 2, it is also possible to confirm whether the measurement unit (second measurement unit) 52 is operating normally. FIG. 7 is a flow chart schematically showing an example of a method of driving the grinding device 2 for such confirmation. In this driving method, first, the workpiece unit 11 held by the chuck table 26 is ground (grinding step: S11 ).

Next, the measuring unit 52 measures the value for calculating the thickness value of the workpiece unit 11 held on the chuck table 26 , that is, the position (height) of the upper surface of the workpiece unit 11 in the vertical direction and the chuck table 26 The position (height) of the holding surface 26a (measurement step: S12).

Then, the determination unit 70 calculates the thickness value of the workpiece unit 11 according to the measurement performed by the measurement unit 52 . Specifically, the determination unit 70 calculates the difference between the position (height) of the upper surface of the workpiece unit 11 and the position (height) of the holding surface 26 a of the chuck table 26 as the thickness value of the workpiece unit 11 .

In addition, the measurement by the measurement unit 52 may be continuously performed during the period from before grinding to after grinding of the workpiece unit 11 . In this case, it is possible to control the display, which is a component of the touch panel described above, to immediately notify an operator or the like of the thickness of the workpiece unit 11 being ground.

Next, the workpiece unit 11 is carried out from the chuck table 26 (carrying out step: S13 ). Specifically, the transport mechanism 54 transports the workpiece unit 11 into the cleaning unit 56 , and the transport mechanism 6 transports the workpiece unit 11 cleaned by the cleaning unit 56 out of the cleaning unit 56 and positions it at the aforementioned measurement position.

Next, the measuring unit (first measuring unit) 12 measures the value for calculating the thickness value of the workpiece unit 11 , that is, measures the above-mentioned first distance and second distance (measurement step: S14 ). Then, as described above, the determination unit 70 of the control unit 58 calculates the thickness value of the workpiece unit 11 .

Next, the determination unit 70 compares the thickness value of the workpiece unit 11 obtained from the measurement by the measurement unit 52 with the thickness value of the workpiece unit 11 obtained from the measurement by the measurement unit 12, and It is judged whether or not the measurement unit 52 is operating normally (judgment step: S15 ).

For example, if the two values are equal, the determination unit 70 determines that the measurement unit 52 is operating normally, and if the two values are different, the determination unit 70 determines that the measurement unit 52 is not operating normally. Alternatively, the determination unit 70 may determine that the measurement unit 52 is operating normally when the difference between the two values is equal to or less than a predetermined threshold value, and may determine that the measurement unit 52 is not operating normally when the difference between the two values exceeds the predetermined threshold value. . In this case, the memory unit 62 may also store the threshold in advance.

Then, in the case where it is judged that the measurement unit 52 is not operating normally ( S15 : NO), the operator is notified of the situation (notification step: S16 ). For example, an error message (a message indicating that the measurement unit 52 does not operate normally) is displayed on the display, which is a component of the touch panel. Then, the conveyance mechanism 6 carries in the to-be-processed object unit 11 into the cassette 8b mounted on the cassette mounting table 10b (carry-in step: S17).

On the other hand, when it is determined that the measurement unit 52 is operating normally ( S15 : YES), the conveying mechanism 6 carries the workpiece unit 11 into the cassette 8 b placed on the cassette placing table 10 b without performing special processing. (Moving in step: S17).

In addition, before grinding the workpiece unit 11 , it may be confirmed whether or not the measurement unit (second measurement unit) 52 is operating normally. FIG. 8 is a flowchart schematically showing an example of a method of driving the grinding device 2 for such confirmation. In this driving method, first, the conveyance mechanism 6 carries out the workpiece unit 11 from the cassette 8a placed on the cassette stage 10a (carrying out step: S21 ).

Next, the measurement unit (first measurement unit) 12 measures the value for calculating the thickness value of the workpiece unit 11 , that is, the above-mentioned first distance and second distance (measurement step: S22 ). Then, as described above, the determination unit 70 of the control unit 58 calculates the thickness value of the workpiece unit 11 .

Next, the workpiece unit 11 is carried into the chuck table 26 (carrying-in step: S23 ). Specifically, the transfer mechanism 6 carries the workpiece unit 11 into the position adjustment mechanism 20 , and the transfer mechanism 22 carries the workpiece unit 11 whose position has been adjusted by the position adjustment mechanism 20 out of the position adjustment mechanism 20 and into the chuck table 26 .

Next, the measurement unit (second measurement unit) 52 measures the value for calculating the thickness value of the workpiece unit 11 held on the chuck table 26 , that is, measures the position of the upper surface of the workpiece unit 11 in the vertical direction ( height) and the position (height) of the holding surface 26a of the chuck table 26 (measurement step: S24).

Then, the determination unit 70 calculates the thickness value of the workpiece unit 11 based on the measurement by the measurement unit 52 . Specifically, the determination unit 70 calculates the difference between the position (height) of the upper surface of the workpiece unit 11 and the position (height) of the holding surface 26 a of the chuck table 26 as the thickness value of the workpiece unit 11 .

Next, the determination unit 70 compares the thickness value of the workpiece unit 11 obtained from the measurement by the measurement unit 52 with the thickness value of the workpiece unit 11 obtained from the measurement by the measurement unit 12, and It is judged whether or not the measurement unit 52 is operating normally (judgment step: S25 ).

For example, if the two values are equal, the determination unit 70 determines that the measurement unit 52 is operating normally, and if the two values are different, the determination unit 70 determines that the measurement unit 52 is not operating normally. Alternatively, the determination unit 70 may determine that the measurement unit 52 is operating normally when the difference between the two values is equal to or less than a predetermined threshold value, and may determine that the measurement unit 52 is not operating normally when the difference between the two values exceeds the predetermined threshold value. action. In this case, the memory unit 62 may also store the threshold in advance.

Then, when it is judged that the measurement unit 52 is not operating normally ( S25 : NO), the operator is notified of the situation (notification step: S26 ). For example, an error message (a message indicating that the measurement unit 52 does not operate normally) is displayed on the display, which is a component of the touch panel.

In the driving method of the grinding device 2 shown in each of FIGS. 7 and 8 , the thickness value of the workpiece unit 11 obtained by the measurement by the measurement unit (second measurement unit) 52 is compared with the thickness value obtained by the measurement by the The thickness value of the workpiece unit 11 obtained by the measurement performed by the unit (first measurement unit) 12 is used to confirm whether the measurement unit 52 operates normally.

Therefore, failure or malfunction of the measurement unit 52 can be found at an early stage. Thereby, the following problems can be found at an early stage: the occurrence of machining failures due to excessive or insufficient grinding of the workpiece unit 11 .

Furthermore, in the grinding apparatus 2 , the measurement unit (first measurement unit) 12 is used to check whether the workpiece unit 11 is a grinding target and whether or not the measurement unit (second measurement unit) 52 is operating normally. Therefore, it is preferable that the structure of the grinding apparatus 2 is simplified compared with the grinding apparatus provided with the component which performs both confirmation individually.

In addition, the grinding device 2 is only an example of the grinding device of the present invention, and the grinding device of the present invention is not limited to the grinding device 2 . For example, the measurement unit 12 and the measurement unit 52 can also be replaced by measurement units that directly measure the thickness of the workpiece unit 11 . Similarly, the measurement unit 12 can also be replaced by a measurement unit that performs measurement in a state of being in contact with the measurement object, and the measurement unit 52 can also be replaced by a measurement unit that is not in contact with the measurement object (non-contact). measurement unit.

In addition, the driving method of the grinding device 2 shown in FIGS. 6 to 8 is only an example of the driving method of the grinding device of the present invention, and the driving method of the grinding device of the present invention is not limited to any one of FIGS. 6 to 8 . The driving method of the grinding device 2 shown here. For example, the driving method of the grinding apparatus in which the respective steps included in FIGS. 6 to 8 are arbitrarily combined is also an example of the driving method of the grinding apparatus of the present invention.

In addition, the structure, method, etc. of the above-mentioned embodiment and the modification example can be suitably changed and implemented in the range which does not deviate from the objective of this invention.

11: Processed object unit 11a: Front 11b: Back 13: Processed objects 13a: Front 13b: Back 15: Divide the scheduled line 17: Components 19: Adhesive film 19a: Surface not attached to the side of the workpiece 2: Grinding device 4: Abutment 4a: Opening 6: Conveying mechanism 8a, 8b: Cassette 10a, 10b: Cassette mounts 12: Measuring unit 14: Support part 16: Upper surface side measuring device 16a: Projection part 16b: Light receiving part 18: Lower surface side measuring device 18a: Light Projector 18b: Light receiving part 20: Position adjustment mechanism 22: Conveying mechanism 24: Rotary table 26: Chuck table 26a: Keep Faces 28: Support structure 30: Z-axis moving mechanism 32: Rails 34: Mobile Board 36: Screw shaft 38: Motor 40: Fixtures 42: Grinding unit 44: Spindle housing 46: Spindle 48: Mounting pieces 50a: First grinding wheel 50b: Second grinding wheel 52: Measuring unit 54: Conveying mechanism 56: Cleaning unit 58: Control unit 60: Processing Department 62: Memory Department 64: Conveying Department 66: Measurement Department 68: Grinding Department 70: Judgment Department

FIG. 1 is a perspective view schematically showing an example of a grinding apparatus. FIG. 2 is a perspective view schematically showing an example of a workpiece unit. FIG. 3 is a side view schematically showing an example of a measurement unit. FIG. 4 is a plan view schematically showing an example of the structure of the turntable and its periphery. FIG. 5 is a block diagram schematically showing an example of a control unit. FIG. 6 is a flowchart schematically showing an example of a driving method of the grinding device. FIG. 7 is a flowchart schematically showing another example of the driving method of the grinding device. FIG. 8 is a flowchart schematically showing another example of the driving method of the grinding device.

2: Grinding device

4: Abutment

4a: Opening

6: Conveying mechanism

8a, 8b: Cassette

10a, 10b: Cassette mounts

12: Measuring unit

20: Position adjustment mechanism

22: Conveying mechanism

24: Rotary table

26: Chuck table

26a: Keep Faces

28: Support structure

30: Z-axis moving mechanism

32: Rails

34: Mobile Board

36: Screw shaft

38: Motor

40: Fixtures

42: Grinding unit

44: Spindle housing

46: Spindle

48: Mounting pieces

50a: First grinding wheel

50b: Second grinding wheel

52: Measuring unit

54: Conveying mechanism

56: Cleaning unit

Claims (8)

A grinding device comprising: a cassette placing table, which is used for placing a cassette for accommodating a unit to be processed, and the unit to be processed is formed by sticking a film on one side of the processed object; a chuck table for holding the workpiece unit; a conveying mechanism for conveying the workpiece unit between the cassette and the chuck table; a first measuring unit for measuring a value for calculating a thickness value of the workpiece unit held by the conveying mechanism or a thickness value of the workpiece unit; a grinding unit for grinding the workpiece unit held on the chuck table; and a control unit for controlling each constituent element, The control unit includes: a judgment unit for judging whether the workpiece unit is a grinding object based on a thickness value of the workpiece unit to be machined, the thickness value of the workpiece unit being determined according to the measurement performed by the first measurement unit. Obtained from the measurement of the workpiece unit after being carried out from the cassette and before being carried into the chuck table. The grinding device of claim 1, wherein, The control unit is provided with: a memory part for storing the respective thickness values of the workpiece and the film, The judging unit compares the value obtained by summing the respective thickness values of the workpiece and the film stored in the memory unit with the thickness of the workpiece unit obtained from the measurement performed by the first measuring unit value, and determine whether the workpiece is pasted with the required film. The grinding device of claim 1, wherein, The first measurement unit has: A first non-contact distance measuring device, which is provided on one side of the workpiece unit held by the conveying mechanism, and measures the distance to one side of the workpiece unit; and A second non-contact distance measuring device is provided on the back surface of the one surface of the workpiece unit held by the conveying mechanism, that is, the other surface side, and measures the distance to the other surface of the workpiece unit. The grinding device of claim 2, wherein, The first measurement unit has: A first non-contact distance measuring device, which is provided on one side of the workpiece unit held by the conveying mechanism, and measures the distance to one side of the workpiece unit; and A second non-contact distance measuring device is provided on the back surface of the one surface of the workpiece unit held by the conveying mechanism, that is, the other surface side, and measures the distance to the other surface of the workpiece unit. The grinding device of any one of claims 1 to 4, further comprising: a second measuring unit for measuring a value for calculating the thickness value of the workpiece unit held on the chuck table or the thickness value of the workpiece unit, The judging section compares the thickness value of the workpiece unit obtained from the measurement performed by the second measurement unit with the thickness value of the workpiece unit obtained from the measurement performed by the first measurement unit , and determine whether the second measurement unit is operating normally. A driving method of a grinding device, the grinding device is provided with: a cassette mounting table, which is used to mount a cassette for accommodating a workpiece unit, the workpiece unit is formed by sticking an adhesive film on one side of the workpiece; a tray table for holding the workpiece unit; a conveying mechanism for transferring the workpiece unit between the cassette and the chuck table; a first measurement unit for measuring and holding for calculation The thickness value of the workpiece unit or the value of the thickness value of the workpiece unit in the conveying mechanism; a grinding unit for grinding the workpiece unit held on the chuck table; and a control unit for used to control each component, The driving method of the grinding device includes: a first unloading step, wherein the conveying mechanism unloads the workpiece unit from the cassette placed on the cassette mounting table; a first measuring step, the first measuring unit measures a value used to calculate the thickness value of the workpiece unit or the thickness value of the workpiece unit unloaded from the cassette in the unloading step; a first determination step, the control unit determines whether the workpiece unit is a grinding object according to the thickness value of the workpiece unit obtained by the measurement in the first measurement step; and A loading step, in which the conveying mechanism carries the workpiece unit into the chuck table when it is determined in the first determination step that the workpiece unit is a grinding object, and determines the workpiece unit in the first determination step When it is not a grinding object, the conveying mechanism conveys the workpiece unit into the cassette again. The driving method of a grinding device as claimed in claim 6, wherein, The grinding device further includes: a second measuring unit for measuring a value for calculating the thickness value of the workpiece unit held on the chuck table or the thickness value of the workpiece unit, The driving method of the grinding device includes: a grinding step, wherein the grinding unit grinds the workpiece unit carried into the chuck table in the carrying-in step; a second measuring step, the second measuring unit measures a value used to calculate the thickness value of the workpiece unit ground or the thickness value of the workpiece unit ground in the grinding step; a second unloading step, wherein the conveying mechanism unloads the workpiece unit whose thickness has been measured in the second measuring step from the chuck table; a third measuring step, wherein the first measuring unit measures a value for calculating the thickness value of the workpiece unit or the thickness value of the workpiece unit unloaded from the chuck table in the second unloading step; and In the second determination step, the control unit compares the thickness value of the workpiece unit obtained according to the measurement performed in the second measurement step with the workpiece obtained according to the measurement performed in the third measurement step The thickness value of the object unit is used to determine whether the second measurement unit is operating normally. The driving method of a grinding device as claimed in claim 6, wherein, The grinding device further includes: a second measuring unit for measuring a value for calculating the thickness value of the workpiece unit held on the chuck table or the thickness value of the workpiece unit, The driving method of the grinding device includes: A fourth measurement step, in which the second measurement unit measures the thickness value of the workpiece unit or the workpiece for calculating the thickness value of the workpiece unit before grinding the workpiece unit that has been loaded into the chuck table in the loading step the value of the element's thickness value; and In a third determination step, the control unit compares the thickness value of the workpiece unit obtained according to the measurement performed in the fourth measurement step with the workpiece obtained according to the measurement performed in the first measurement step The thickness value of the object unit is used to determine whether the second measurement unit is operating normally.

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