TW202326310A - Grinding apparatus, program, non-transient recording medium, and grinding apparatus control method capable of preventing an operator from forgetting to perform self-grinding - Google Patents

Abstract

Provided is a grinding apparatus capable of preventing an operator from forgetting to execute self-grinding. The grinding apparatus comprises: a control unit having a processing device and a memory device and following the program stored in the memory device to control a chuck table, a grinding unit, and a moving mechanism; and an input device for inputting an instruction to the control unit. The program enables the control unit to execute: a step of stopping the operation of the grinding apparatus after inputting the instruction to stop the operation of the grinding device from the input device to the control unit; and a step of grinding a holding surface through the grinding wheel after inputting the instruction to stop the operation of the grinding device from the input device to the control unit and before finishing the step of stopping the operation of the grinding apparatus.

Description

Grinding device, program, non-transitory recording medium, and control method of grinding device

The present invention relates to a grinding device used when grinding a workpiece such as a wafer, a program used to control the grinding device, a non-transitory recording medium with the program memorized, and a control method of the grinding device.

In order to realize small and lightweight element wafers, opportunities for thinning wafers with elements such as integrated circuits on the front side are increasing. For example, the front side of the wafer is held on the holding surface of the chuck table, the grinding wheel on which the grinding stone containing abrasive grains is fixed is rotated with the chuck table, and the grinding wheel is ground while supplying liquid (grinding fluid) such as pure water. The grindstone is pressed against the back side of the wafer, whereby the wafer is ground and thinned.

However, when a workpiece such as a wafer is ground by the method described above, a process called self-polishing is performed to grind the holding surface of the chuck table (for example, refer to Patent Document 1). In this autogenous grinding, the holding surface is ground with a grinding wheel (grinding stone) in the same manner as the workpiece. Therefore, if the workpiece is held by the holding surface after self-grinding, the distance between the grinding wheel and the holding surface becomes substantially constant in the entire region where the workpiece contacts the grinding wheel, and the workpiece is ground as a whole. The thickness becomes approximately constant. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Unexamined Patent Publication No. 2008-87104

[Problems to be Solved by the Invention] However, in a chuck table used for grinding workpieces, generally speaking, the suction force caused by the negative pressure generated by the suction source acts on the workpiece through the fine holes in the holding surface, thereby holding the workpiece. Processed objects. On the other hand, when the workpiece is ground, the pores of the holding surface may be clogged with chips generated from the workpiece, and the force for holding the workpiece may decrease. Then, before the pores of the holding surface are clogged with chips, the above-mentioned self-polishing is performed at an arbitrary point of time to remove the chips adhering to the holding surface.

However, this autogenous grinding is performed based on an operator's instruction, and may not always be performed at an appropriate point of time. For example, if the operator forgets to perform self-grinding and the holes on the holding surface are clogged with chips, the holding of the workpiece by the chuck table becomes unstable, which adversely affects the grinding of the workpiece.

Therefore, an object of the present invention is to provide a grinding device and the like which can prevent an operator from forgetting to perform self-grinding.

[Technical means to solve the problem] According to one aspect of the present invention, there is provided a grinding device including: a chuck table having a holding surface for holding a workpiece and being rotatable around a rotation axis intersecting with the holding surface; a grinding unit having It has a main shaft that can rotate around the axis when the grinding wheel is installed on the front end; a moving mechanism that makes the chuck table and the grinding unit relatively move in a direction that crosses the holding surface; a control unit , which has a processing device and a memory device, and controls the chuck table, the grinding unit and the moving mechanism according to the program stored in the memory device; and an input device, which inputs instructions into the control unit, and the program causing the control unit to execute: a program for stopping the operation of the grinding device after an instruction to stop the operation of the grinding device is input from the input device into the control unit; After the instruction of operation is input to the control unit and before the program of stopping the operation of the grinding device is completed, the grinding unit and the chuck are moved by the moving mechanism while the chuck table and the main shaft are rotating. The table moves relatively, and the process of grinding the retaining surface by the grinding wheel.

According to another aspect of the present invention, there is provided a program for controlling a grinding device. The grinding device is provided with: a chuck table having a holding surface for holding a workpiece and being able to rotate around the holding surface relative to the holding surface. The intersecting rotating shaft rotates; the grinding unit has a main shaft that can rotate around the axis when the grinding wheel is installed on the front end; the moving mechanism makes the chuck table and the grinding unit relatively to the holding surface Relatively moving in a crossing direction; a control unit, which has a processing device and a memory device, and controls the chuck table, the grinding unit and the moving mechanism according to the program stored in the memory device; and an input device, which will command input to the control unit, and the program causes the control unit to execute: a program for stopping the operation of the grinding device after an instruction to stop the operation of the grinding device is input from the input device to the control unit; and After the command to stop the operation of the grinding device is input into the control unit from the input device and before the process of stopping the operation of the grinding device is completed, in the state where the chuck table and the spindle are rotating, by the movement The grinding unit and the chuck table are relatively moved by a mechanism, and the grinding wheel is used to grind the holding surface.

Preferably, the program causes the control unit to adjust the grinding device after a command to stop the operation of the grinding device is input to the control unit from the input device and before the process of grinding the holding surface by the grinding wheel starts. The program of the angle formed by the rotation axis of the chuck table and the axis of the spindle. Furthermore, it is preferable that the program does not cause the control unit to execute the program of replacing the grinding wheel mounted on the main shaft after an instruction to stop the operation of the grinding device is input into the control unit from the input device, And make the control unit execute the program of grinding the retaining surface by the grinding wheel. Furthermore, it is preferable that the program causes the control unit to execute the operation of the grinding device in such a manner that the program of grinding the holding surface with the grinding wheel ends before the program of stopping the operation of the grinding device ends. The procedure of stopping and the procedure of grinding the retaining surface by the grinding wheel.

According to yet another aspect of the present invention, a non-transitory memory medium is provided, which stores the program.

According to still another aspect of the present invention, there is provided a method for controlling a grinding device, which is used for controlling the grinding device. The grinding device is provided with: a chuck table having a holding surface for holding a workpiece and being able to rotate around the The holding surface rotates on a crossing axis of rotation; the grinding unit has a main shaft that can rotate around the axis when the grinding wheel is installed on the front end; the moving mechanism makes the chuck table and the grinding unit relatively The holding surface relatively moves in a crossing direction; a control unit, which has a processing device and a memory device, and controls the chuck table, the grinding unit and the moving mechanism according to the program stored in the memory device; and an input device, It inputs instructions into the control unit, and the control method of the grinding device includes: the input device inputs an instruction to stop the operation of the grinding device into the control unit; after the input device stops the grinding device After inputting the command of the operation of the grinding device into the control unit, the step of stopping the operation of the grinding device; after inputting the command of stopping the operation of the grinding device from the input device into the control unit and making the operation of the grinding device Before the stop step ends, in the state where the chuck table and the spindle rotate, the grinding unit and the chuck table are relatively moved by the moving mechanism, and the holding surface is ground by the grinding wheel step.

Preferably, it further includes adjusting the chuck table after the input device inputs a command to stop the operation of the grinding device into the control unit and before the step of grinding the holding surface with the grinding wheel starts. The step of the angle formed by the axis of rotation and the axis of the main shaft. And, it is preferable that after the command to stop the operation of the grinding device is input into the control unit from the input device, the step of replacing the grinding wheel mounted on the main shaft is not performed, and the grinding is performed by the grinding device. The step of grinding the retaining surface by the wheel. Furthermore, preferably, the step of grinding the holding surface with the grinding wheel is completed before the step of stopping the operation of the grinding device is completed.

[Efficacy of the invention] In the grinding device, the program, and the control method of the grinding device in various aspects of the present invention, it is executed by the control unit: after the command to stop the operation of the grinding device is input into the control unit from the input device, the grinding device A program for stopping the operation of the grinding device; and a program for grinding the holding surface by the grinding wheel after the command to stop the operation of the grinding device is input into the control unit from the input device and before the program of stopping the operation of the grinding device ends.

That is, when the grinding device is shut down to stop the operation, self-grinding of the grinding holding surface must be performed by the grinding wheel. Therefore, according to the grinding device, the program, and the control method of the grinding device according to various aspects of the present invention, the operator is prevented from forgetting to perform self-grinding.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a grinding device 2 according to this embodiment. In addition, in FIG. 1 , elements constituting a part of the grinding apparatus 2 are represented by functional blocks. In addition, the X-axis direction (front-rear direction), the Y-axis direction (left-right direction), and the Z-axis direction (vertical direction) used in the following description are perpendicular to each other.

As shown in FIG. 1 , the grinding device 2 includes a base 4 that supports various elements constituting the grinding device 2 . On the front end side of the upper surface of the base 4, a concave accommodation portion 4a whose upper end is opened on the upper surface of the base 4 is provided, and the first conveyance portion 4a for conveying a plate-shaped workpiece 11 is accommodated in the accommodation portion 4a. Institution 6. The first conveyance mechanism 6 is typically a robot arm having a plurality of joints, and not only conveys the workpiece 11 but also reverses the workpiece 11 up and down.

The workpiece 11 is, for example, a disk-shaped wafer made of semiconductor materials such as silicon. That is, this workpiece 11 has a circular front surface 11a and a circular rear surface 11b opposite to the front surface 11a. The front side 11a side of the workpiece 11 is divided into a plurality of small areas by a plurality of dicing lines (planned dividing lines) intersecting each other, and components such as integrated circuits (IC, Integrated Circuit) are formed in each small area .

The grinding device 2 of the present embodiment is used, for example, when grinding the back surface 11 b side of the workpiece 11 . In addition, when grinding the back surface 11b side of the workpiece 11, it is desirable to attach a protective member made of a material such as resin to the front surface 11a side of the workpiece 11. By attaching the protection member to the front surface 11a side of the workpiece 11, the shock applied to the front surface 11a side when the rear surface 11b side is ground is alleviated, thereby protecting components of the workpiece 11 and the like.

In addition, in this embodiment, although a disk-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, the material, shape, structure, size, etc. of the workpiece 11 are not limited thereto. appearance. For example, a substrate or the like made of other materials such as semiconductors, ceramics, resins, and metals can be used as the workpiece 11 . Likewise, the type, number, shape, structure, size, arrangement, etc. of elements are not limited to the above-mentioned aspects. The workpiece 11 may not have elements formed therein.

As shown in FIG. 1 , cassette tables 10 a , 10 b on which cassettes 8 a , 8 b capable of accommodating a plurality of workpieces 11 are placed are provided in front of the housing portion 4 a. A position adjustment mechanism 12 for adjusting the position of the workpiece 11 is provided obliquely behind the housing portion 4a. The position adjustment mechanism 12 includes a disk-shaped position adjustment table and a plurality of pins arranged around the position adjustment table.

By moving a plurality of pins in the radial direction of the position adjustment table, for example, the workpiece 11 carried out from the cassette 8a by the first transport mechanism 6 and placed on the position adjustment table The center is aligned with a predetermined position in the X-axis direction and the Y-axis direction. In addition, the workpiece 11 is placed on the table for position adjustment so that the surface to be ground (in this embodiment, the back surface 11 b ) is exposed upward.

On the side of the position adjustment mechanism 12 is provided a second conveyance mechanism 14 that holds the workpiece 11 and conveys the workpiece 11 to the rear. The second conveying mechanism 14 includes, for example: an arm; Then, the holding pad is rotated, whereby the workpiece 11 whose position has been adjusted by the position adjustment mechanism 12 is conveyed to the rear.

A turntable 16 is provided behind the second transport mechanism 14 . The turntable 16 is connected to a motor (not shown), and is powered by the motor or the like to rotate around a rotation axis substantially parallel to the Z-axis direction. On the upper surface of the turntable 16 , three sets of columnar (disk-shaped) table bases 18 are provided at substantially equal angular intervals along the circumferential direction of the turntable 16 . However, the number of table bases 18 is not limited to this aspect.

Each table base 18 is connected to a motor (not shown) or the like, and is powered by the motor or the like to rotate around a rotation axis approximately parallel to the Z-axis direction or a rotation axis slightly inclined to the Z-axis direction. . In addition, each table base 18 is supported by the rotary table 16 through an angle adjustment mechanism (not shown), and the angle of the rotation axis of each table base 18 is adjusted by the angle adjustment mechanism.

A disc-shaped chuck table 20 for holding the workpiece 11 is fixed to the upper end of each table base 18 with bolts or the like. Each chuck table 20 includes, for example, a disk-shaped frame body 20a (see FIG. 4 ) made of ceramics or the like. On the upper part of the frame body 20a, a concave portion whose upper end opens in a circular shape on the upper surface of the frame body 20a is provided. A porous disk-shaped holding plate 20b is fixed to this concave portion (see FIG. 4 ) made of a material such as ceramics.

The upper surface of the holding plate 20 b is configured in a shape corresponding to, for example, a side surface of a cone, and functions as a holding surface for holding the workpiece 11 . In addition, the height difference (height difference) between the center of the upper surface of the holding plate 20 b corresponding to the vertex of the cone and the outer peripheral edge of the upper surface of the holding plate 20 b is about 10 μm to 30 μm.

The lower surface side of the holding plate 20b is connected to a suction source (not shown) such as an injector through a flow path provided inside the frame 20a, a valve (not shown) arranged outside the frame 20a, and the like. Therefore, when the valve is opened while the workpiece 11 and the like are in contact with the upper surface of the holding plate 20 b and the negative pressure of the suction source acts, the workpiece 11 is sucked by the chuck table 20 . That is, the workpiece 11 is held by the holding surface of the chuck table 20 .

In a state where the chuck table 20 is fixed to the table base 18, the rotary table 16 rotates, for example, in the direction of the arrow in FIG. 1 and in the direction opposite to the arrow. Then, with the rotation of the turntable 16 , the table base 18 and the chuck table 20 move along the circumferential direction of the turntable 16 .

The rotary table 16 moves the table base 18 and the chuck table 20, for example, to the loading and unloading area adjacent to the second conveying mechanism 14, the rough grinding area behind the loading and unloading area, and the finishing area on the side of the rough grinding area. Grinding area and loading and unloading area. The second transport mechanism 14 transports the workpiece 11 held by the holding pad from the position adjustment table of the position adjustment mechanism 12 to the chuck table 20 arranged in the loading and unloading area.

As shown in FIG. 1 , columnar support structures 30 are respectively provided behind the rough grinding area and the finish grinding area (that is, behind the turntable 16 ). A Z-axis moving mechanism 32 is provided on the front side of each support structure 30 . Each Z-axis moving mechanism 32 includes a pair of guide rails 34 substantially parallel to the Z-axis direction, and a moving plate 36 is slidably attached to the guide rails 34 .

A nut part (not shown) constituting a ball screw is provided on the rear surface side (back side) of each moving plate 36, and the screw shaft 38 substantially parallel to the guide rail 34 is rotatably connected to the nut part. link. A motor 40 and the like are connected to one end of the screw shaft 38 . The screw shaft 38 is rotated by the motor 40 or the like, whereby the moving plate 36 moves along the guide rail 34 (Z-axis direction).

A fixture 42 is provided on the front surface (front surface) of each movable plate 36 . The grinding unit 44 capable of grinding the workpiece 11 is supported by each fixture 42 . Each grinding unit 44 includes a spindle housing 46 fixed to the fixture 42 . The main shaft 48 is housed in each main shaft housing 46 so as to be rotatable about its axis, and the main shaft 48 is a rotation shaft parallel to the Z-axis direction or a rotation shaft slightly inclined to the Z-axis direction.

The lower end of each spindle 48 is exposed from the lower end surface of the spindle housing 46 , and a disc-shaped attachment 50 is fixed to the lower end. For example, a plurality of holes (not shown) penetrating through the attachment 50 in the thickness direction are provided on the outer edge of each attachment 50 , and bolts 52 and the like are inserted into the holes.

A grinding wheel 54 for rough grinding is attached to the lower surface of the attachment 50 of the grinding unit 44 on the side of the rough grinding area with bolts 52 . That is, a grinding wheel 54 for rough grinding is mounted on the main shaft 48 on the side of the rough grinding area. In addition, a motor (not shown) and the like connected to the upper end side of the main shaft 48 are housed in the main shaft case 46 of the grinding unit 44 on the side of the rough grinding area. The grinding wheel 54 for rough grinding is rotated together with the main shaft 48 by the power of the motor or the like.

On the other hand, a grinding wheel 54 for finishing grinding is attached by bolts 52 to the lower surface of the attachment 50 of the grinding unit 44 on the finishing grinding area side. That is, the grinding wheel 54 for finishing grinding is mounted on the main shaft 48 on the side of the finishing grinding area. In addition, a motor (not shown) and the like connected to the upper end side of the main shaft 48 are accommodated in the main shaft housing 46 of the grinding unit 44 on the finish grinding area side. The grinding wheel 54 for finishing grinding is rotated together with the main shaft 48 by the power of the motor or the like.

Each grinding wheel 54 includes an annular wheel base 54 a (see FIG. 4 ) formed using metal such as stainless steel or aluminum. On the lower surface of the wheel base 54a, a plurality of grinding stones 54b (see FIG. 4 ) are fixed along the circumferential direction of the wheel base 54a. The grinding stones 54b are abrasive grains such as diamond dispersed in ceramics (vitrified). Or resin (resinoid) and other binders.

In addition, the average particle diameter of the abrasive grains contained in the grinding stone 54b included in the grinding wheel 54 for finishing grinding is smaller than the average particle diameter of the abrasive grains contained in the grinding stone 54b included in the grinding wheel 54 for rough grinding. Thereby, the grinding wheel 54 suitable for rough grinding and the grinding wheel 54 suitable for finish grinding are realized. The specific size of the abrasive grains is appropriately set in accordance with the quality required of the workpiece 11 after grinding, and the like.

Next to the grinding wheel 54 is arranged a nozzle 56 capable of supplying a liquid (grinding fluid) 21 (see FIG. 4 ) such as pure water to a portion of the workpiece 11 in contact with the grinding stone 54 b. In addition, instead of the nozzle 56, or together with the nozzle 56, a liquid supply port for supplying the liquid may be provided in the grinding wheel 54 or the like.

The upper surface side of the workpiece 11 of the chuck table 20 held in the rough grinding area is ground by the above-mentioned grinding unit 44 on the side of the rough grinding area. Then, the upper surface side of the workpiece 11 of the chuck table 20 held in the finishing grinding area is ground by the above-mentioned grinding unit 44 on the finishing grinding area side.

That is, by sequentially moving the chuck table 20 holding the workpiece 11 to the loading and unloading area, the rough grinding area, and the finishing grinding area, the rough grinding and finishing of the workpiece 11 are continuously performed. grind. When the finish grinding of the workpiece 11 is completed, the chuck table 20 in the finish grinding area is positioned again in the loading and unloading area.

In front of the loading and unloading area and on the side of the second transporting mechanism 14 is provided a third transporting mechanism 58 that holds the ground workpiece 11 and transports the ground workpiece 11 to the front. The third transport mechanism 58 includes: a holding pad that attracts and holds the upper surface side of the workpiece 11; By turning, the ground workpiece 11 is transported forward from the chuck table 20 in the loading and unloading area.

A cleaning unit 60 is provided on the side of the third conveying mechanism 58 , and the cleaning unit 60 cleans the workpiece 11 carried out by the third conveying mechanism 58 . The cleaning unit 60 includes, for example: a rotary table that rotates while holding the lower surface side of the workpiece 11; and a cleaning nozzle that sprays a cleaning fluid onto the workpiece 11 held by the rotary table. surface side.

The cleaning fluid used in the cleaning unit 60 is typically a mixed fluid (two-fluid) in which water and air are mixed. Of course, water or the like that does not mix with air may also be used as the fluid for cleaning. The workpiece 11 cleaned by the cleaning unit 60 is conveyed by the first conveyance mechanism 6 and accommodated, for example, in the cassette 8b.

A control unit 62 is connected to each element of the grinding device 2 . This control unit 62 is constituted by, for example, a computer including a processing device 62a and a memory device 62b, and controls the above-mentioned components including the chuck table 20, the Z-axis moving mechanism 32, and the grinding unit 44 in such a manner as to properly grind the workpiece 11. The operation of each element of the grinding device 2, etc.

The processing device 62 a is typically a CPU (Central Processing Unit, Central Processing Unit), and performs various processes necessary for controlling the above-mentioned elements. The memory device 62 b includes, for example, a main memory device such as DRAM (Dynamic Random Access Memory, random access memory), and an auxiliary memory device such as a hard disk drive and a flash memory. The functions of the control unit 62 are implemented by following software such as programs stored in the memory device 62b and operated by the processing device 62a.

An input device 64 is connected to the control unit 62 . The input device 64 is, for example, a touch panel, and inputs instructions from an operator into the control unit 62 . This touch panel also serves as a display device for displaying information output from the control unit 62 . In addition, a keyboard, mouse, etc. can also be used as the input device 64 .

In the grinding device 2 thus constituted, self-grinding for grinding the holding surface of the chuck table 20 with the grinding wheel 54 is performed when the operation is stopped. For example, a program for causing the control unit 62 to execute a necessary program is recorded in a part of the memory device 62b, which is also a non-transitory recording medium that can be read by a computer or the like, and the control unit 62 Shutdown control follows this program.

FIG. 2 is a functional block diagram schematically showing the functional structure of the control unit 62 implemented by programs in this embodiment. In addition, in FIG. 2, the input device 64 connected to the control unit 62 is collectively shown for convenience of description. As shown in FIG. 2 , the control unit 62 includes an input judging unit 66 that judges an input from an input device 64 .

For example, when an operator inputs a shutdown command (command to stop the operation of the grinding device 2 ) from the input device 64 , the input determination unit 66 notifies the shutdown control unit 68 of a program to start the shutdown. The shutdown control unit 68 executes a shutdown program in accordance with the notification from the input determination unit 66 .

For example, when the operation mode at the time of shutdown is set to "self-polishing at the end" for self-polishing, the shutdown control unit 68 notifies the self-polishing control unit 70 of starting the self-polishing control unit 70 when starting the shutdown procedure. body grinding procedure. The self-polishing control unit 70 follows the notification from the shutdown control unit 68 to execute the self-polishing procedure.

The control unit 62 further includes an operation mode setting part 72 which sets the operation mode at the time of shutdown. For example, if the operation mode selected by the operator is input to the input determination part 66 from the input device 64, the input determination part 66 notifies the operation mode setting part 72 of the operation mode input from the input device 64, and the operation mode setting part 72 The operation mode notified from the input determination unit 66 is set as the operation mode at the time of shutdown. In the operation mode at the time of shutdown, in addition to the above-mentioned "self-polishing at the end", there is also "normal end" in which self-polishing is not performed at the time of shutdown.

The shutdown control unit 68 includes, for example, an electric power control unit 68a that controls supply of electric power, and a memory control unit 68b that controls storage of information. When the shutdown control unit 68 is notified of a program to start the shutdown from the input determination unit 66, the memory control unit 68b executes a program for causing the memory device 62b to memorize information to be stored at the time of shutdown. For example, when a program for storing required information in the memory device 62b and other programs required for shutdown are completed, the power control unit 68a executes a program for shutting off power supply to each element.

The self-grinding control unit 70 includes, for example, a wheel replacement control unit 70a that controls the replacement of the grinding wheel 54, and an angle adjustment unit 70b that adjusts the angle of the rotation axis of the chuck table 20 (the rotation axis of the table base 18). . When starting the self-grinding procedure, the wheel replacement control unit 70a executes a procedure of changing from the grinding wheel 54 suitable for grinding the workpiece 11 to the grinding wheel 54 suitable for self-grinding (replacing the grinding wheel 54) as needed. program of). Specifically, for example, the wheel replacement control unit 70a displays necessary information on the display device in order to notify the operator that the grinding wheel 54 needs to be replaced.

The angle adjustment unit 70b executes a process of adjusting the angle of the rotation axis of the chuck table 20 to a predetermined angle suitable for the self-polishing when the self-polishing process is started. Specifically, for example, the angle adjustment part 70b adjusts the angle of the rotation axis of the table base 18 by the above-mentioned angle adjustment mechanism. In addition, the angle adjustment unit 70 b may also execute a program of adjusting the angle of the axis of the spindle 48 instead of the angle of the rotation axis of the chuck table 20 or together with the angle of the rotation axis of the chuck table 20 .

FIG. 3 is a flowchart showing the flow of processing when the grinding device 2 is stopped. First, when the input device 64 inputs a shutdown command to the control unit 62 (step ST11 ), the input determination unit 66 of the control unit 62 notifies the shutdown control unit 68 of the shutdown start.

The shutdown control unit 68 that has received the notification of starting the shutdown program from the input judging unit 66 starts the shutdown program (step ST12 ). Specifically, for example, the memory control unit 68b starts a program for causing the memory device 62b to memorize information that needs to be saved at the time of shutdown. In addition, at this stage, the power control unit 68a does not start the process of shutting off the power supply to each element.

And, the stop control unit 68 which receives the notification of the start-stop program from the input judging unit 66 will determine whether the operation mode set by the operation mode setting unit 72 is “self body grinding at the end” when the machine is stopped. Grinding" (step ST13). In addition, in FIG. 3 , although the flow of determining the operation mode is shown after starting the shutdown process, the shutdown process may be started simultaneously with the determination of the operation mode or after the determination of the operation mode.

When "self-polishing at the end" is set in the operation mode (YES in step ST13 ), the shutdown control unit 68 notifies the self-polishing control unit 70 of the procedure to start the self-polishing. The self-grinding control unit 70 , having received the notification to start the self-grinding process from the shutdown control unit 68 , starts the self-polishing process of grinding the holding surface of the chuck table 20 with the grinding wheel 54 for finishing grinding, for example.

Specifically, for example, the angle adjustment unit 70 b starts a process of adjusting the angle of the rotation axis of each chuck table 20 to a predetermined angle suitable for self-polishing (step ST14 ). That is, when the angle adjustment unit 70b has positioned each chuck table 20 in the finish grinding area, the rotation axis of the chuck table 20 and the axis center of the main shaft 48 on which the grinding wheel 54 for finish grinding has been installed are aligned. The formed angle is adjusted to a predetermined angle suitable for self-grinding.

This adjustment is required because generally, the magnitude of the load applied when the chuck table 20 and the grinding wheel 54 are rotated is different between the case of grinding the workpiece 11 and the case of grinding the holding surface of the chuck table 20. . In addition, in the case where there is no substantial difference in the magnitude of the load at the time of rotation, etc., adjustment of this angle may be omitted.

When the adjustment of the angle formed by the rotation axis of each chuck table 20 and the axis center of the spindle 48 is completed, the self-grinding control unit 70 starts the process of grinding the holding surface of the chuck table 20 with the grinding wheel 54 (step ST15 ). FIG. 4 is a cross-sectional view schematically showing the state of the holding surface of the grinding chuck table 20 . Specifically, first, the self-grinding control unit 70 rotates each chuck table 20 around a rotation axis intersecting with its holding surface, and rotates the main shaft 48 on which the grinding wheel 54 for finishing grinding is mounted. Axis rotation.

Next, the autogenous grinding control unit 70 lowers the grinding wheel 54 for finish grinding by the Z-axis moving mechanism 32 while supplying the liquid 21 from the nozzle 56 while the chuck table 20 and the spindle 48 are rotating. That is, the self-polishing control unit 70 uses the Z-axis moving mechanism 32 to move the chuck table 20 in the finishing area and the grinding unit 44 for finishing grinding along the Z-axis that intersects with the holding surface of the chuck table 20 The direction moves relative to each other.

Thereby, the grinding stone 54b of the grinding wheel 54 for finish grinding contacts the holding surface of the chuck table 20 in the finishing grinding area, and grinds the holding surface of the chuck table 20 . The amount of grinding (grinding thickness) of the holding surface is set arbitrarily, for example, within a range of 10 μm to 50 μm. However, the grinding amount of the retaining surface is not limited to this range.

When the grinding of the holding surface of the chuck table 20 in the finish grinding area is completed, the self-polishing control unit 70 rotates the rotary table 16 to move the other chuck table 20 to the finish grinding area, and grinds the other chuck in the same manner. The holding surface of the stage 20. When the rotating table 16 is alternately rotated and the holding surfaces of the chuck tables 20 are ground, and all the holding surfaces of the chuck tables 20 are ground, the self-polishing process ends.

In addition, it is desirable that the wheel replacement control unit 70a does not execute the routine of exchanging the grinding wheel 54 in the self-grinding routine performed at the time of this shutdown. By not performing the procedure of exchanging the grinding wheel 54 which requires work by the operator, it is possible to more surely prevent the operator from forgetting to perform self-grinding. However, in this case, the grinding wheel 54 needs to be configured to be able to grind both the workpiece 11 and the chuck table 20 .

Of course, the wheel replacement control unit 70a may also execute the routine of exchanging the grinding wheel 54 in the self-grinding routine performed at the time of shutdown. In addition, the wheel replacement control unit 70 a may execute a routine of exchanging the grinding wheel 54 in a general self-grinding routine other than the self-grinding performed at the time of shutdown.

When all the programs necessary for the shutdown including the self-polishing program are completed, the power control unit 68 a of the shutdown control unit 68 starts a program of shutting off power supply to each element to end the shutdown program (step ST16 ). When the power supply to each element is turned off, all the procedures for stopping the operation of the grinding device 2 are completed, and the grinding device 2 is in a stopped state.

As above, according to the grinding device 2, the program, and the control method of the grinding device according to the present embodiment, if a predetermined operation mode is set, the control unit 62 executes an instruction to stop the operation of the grinding device 2 from the input device 64. After the control unit 62 is input, the program of stopping the operation of the grinding device 2; and after the command to stop the operation of the grinding device 2 is input from the input device 64 to the control unit 62 and before the program of stopping the operation of the grinding device 2 is completed , the procedure of grinding the retaining surface by the grinding wheel 54 .

That is, when the grinding device 2 is shut down to stop the operation, self-grinding of grinding the holding surface by the grinding wheel 54 must be performed. Therefore, according to the grinding device 2, the program, and the control method of the grinding device according to the present embodiment, it is prevented that the operator forgets to perform self-grinding. And, according to the grinding device 2, the program, and the control method of the grinding device of the present embodiment, self-grinding is performed when the stoppage of the workpiece 11 is not conducive to grinding, so there will be no self-grinding caused by self-grinding. and lowered productivity.

In addition, this invention is not limited to description of said embodiment, Various changes can be added and implemented. For example, in the above-mentioned embodiment, although the self-grinding procedure of grinding the holding surface of the chuck table 20 with the grinding wheel 54 for finishing grinding is performed, it is also possible to perform grinding of the chuck table with the grinding wheel 54 for rough grinding. 20. The self-grinding procedure of the retaining surface.

In addition, in the above-mentioned embodiment, although the program for executing the control method of the grinding device is recorded in the memory device 62b in the control unit 62, the program may be recorded in any program that can be read by a computer or the like, for example. non-transitory recording media. For example, this program is sometimes recorded on an optical disc such as a CD (Compact Disc) that can be distributed at low cost.

In addition, the structures, methods, and the like of the above-described embodiments and modified examples can be appropriately changed and implemented within a range that does not deviate from the purpose of the present invention.

2: Grinding device 4: Abutment 4a:Accommodating part 6: The first transfer mechanism 8a: Cassette 8b: Cassette 10a: Cassette table 10b: Cassette table 12: Position adjustment mechanism 14: The second conveying mechanism 16:Rotary table 18:Workbench base 20: chuck table 20a: frame 20b: Holding plate 30: Support structure 32: Z-axis moving mechanism 34: guide rail 36: Mobile board 38: screw shaft 40: motor 42:fixture 44: Grinding unit 46:Spindle housing 48:Spindle 50: Mounting parts 52: Bolt 54: Grinding wheel 54a: wheel abutment 54b: grinding stone 56: Nozzle 58: The third transfer mechanism 60: cleaning unit 62: Control unit 62a: Processing device 62b: memory device 64: Input device 66: input judging part 68: Shutdown control department 68a: Power Control Department 68b: Memory Control Department 70: Autogenous Grinding Control Department 70a: wheel replacement control unit 70b: Angle adjustment part 72: Operation Mode Setting Department 11: Processed object 11a: front 11b: back 21: liquid (grinding fluid)

Fig. 1 is a perspective view schematically showing a grinding device. FIG. 2 is a functional block diagram schematically showing the functional structure of the control unit. FIG. 3 is a flowchart showing the flow of processing when the grinding device is stopped. Fig. 4 is a cross-sectional view schematically showing the state of the holding surface of the grinding chuck table.

62: Control unit

64: Input device

66: input judging part

68: Shutdown control department

68a: Power Control Department

68b: Memory Control Department

70: Autogenous Grinding Control Department

70a: wheel replacement control unit

70b angle adjustment part

72: Operation Mode Setting Department

Claims (13)

A grinding device comprising: a chuck table, which has a holding surface for holding the workpiece, and is rotatable around a rotation axis intersecting with the holding surface; A grinding unit having a main shaft rotatable around an axis with the grinding wheel mounted on the front end; a moving mechanism that relatively moves the chuck table and the grinding unit in a direction that crosses the holding surface; a control unit, which has a processing device and a memory device, and controls the chuck table, the grinding unit and the moving mechanism according to the program stored in the memory device; and an input device, which inputs instructions into the control unit, This program causes the control unit to execute: A program for stopping the operation of the grinding device after an instruction to stop the operation of the grinding device is input into the control unit from the input device; and After the command to stop the operation of the grinding device is input to the control unit from the input device and before the process of stopping the operation of the grinding device is completed, in the state where the chuck table and the main shaft are rotating, by the The procedure of moving the mechanism so that the grinding unit and the chuck table are relatively moved, and the holding surface is ground by the grinding wheel. The grinding device according to claim 1, wherein the program causes the control unit to grind the holding surface with the grinding wheel after an instruction to stop the operation of the grinding device is input into the control unit from the input device Before the program starts, the program of adjusting the angle formed by the rotation axis of the chuck table and the axis center of the main shaft. The grinding device according to claim 1 or 2, wherein the program does not cause the control unit to perform replacement of the main shaft installed after an instruction to stop the operation of the grinding device is input to the control unit from the input device. The program of the grinding wheel, so that the control unit executes the program of grinding the retaining surface by the grinding wheel. The grinding device according to claim 1 or 2, wherein the program is such that the program of grinding the retaining surface with the grinding wheel ends before the program of stopping the operation of the grinding device ends, so that the control unit A program for stopping the operation of the grinding device and a program for grinding the retaining surface by the grinding wheel are executed. A program for controlling a grinding device having: a chuck table, which has a holding surface for holding the workpiece, and is rotatable around a rotation axis intersecting with the holding surface; A grinding unit having a main shaft rotatable around an axis with the grinding wheel mounted on the front end; a moving mechanism that relatively moves the chuck table and the grinding unit in a direction that crosses the holding surface; a control unit, which has a processing device and a memory device, and controls the chuck table, the grinding unit and the moving mechanism according to the program stored in the memory device; and an input device, which inputs instructions into the control unit, This program causes the control unit to execute: A program for stopping the operation of the grinding device after an instruction to stop the operation of the grinding device is input into the control unit from the input device; and After the command to stop the operation of the grinding device is input to the control unit from the input device and before the process of stopping the operation of the grinding device is completed, in the state where the chuck table and the main shaft are rotating, by the The procedure of moving the mechanism so that the grinding unit and the chuck table are relatively moved, and the holding surface is ground by the grinding wheel. The program according to claim 5, wherein the control unit is executed after an instruction to stop the operation of the grinding device is input to the control unit from the input device and before the program of grinding the holding surface by the grinding wheel starts , the procedure for adjusting the angle formed by the rotation axis of the chuck table and the axis center of the spindle. The program according to claim 5 or 6, wherein, after an instruction to stop the operation of the grinding device is input to the control unit from the input device, the control unit is not caused to perform replacement of the grinding wheel mounted on the main shaft program, so that the control unit executes the program of grinding the retaining surface by the grinding wheel. The program according to claim 5 or 6, wherein the control unit executes the grinding process in such a way that the process of grinding the holding surface with the grinding wheel ends before the process of stopping the operation of the grinding device ends. The procedure of stopping the operation of the device and the procedure of grinding the retaining surface by the grinding wheel. A non-transitory recording medium, which has memorized the program as claimed in claim 5 or 6. A control method of a grinding device, which is used to control the grinding device, the grinding device has: a chuck table, which has a holding surface for holding the workpiece, and is rotatable around a rotation axis intersecting with the holding surface; A grinding unit having a main shaft rotatable around an axis with the grinding wheel mounted on the front end; a moving mechanism that relatively moves the chuck table and the grinding unit in a direction that crosses the holding surface; a control unit, which has a processing device and a memory device, and controls the chuck table, the grinding unit and the moving mechanism according to the program stored in the memory device; and an input device, which inputs instructions into the control unit, The control method of the grinding device includes: a step of the input device inputting an instruction to stop the operation of the grinding device into the control unit; a step of stopping the operation of the grinding device after an instruction to stop the operation of the grinding device is input into the control unit from the input device; After the command to stop the operation of the grinding device is input into the control unit from the input device and before the step of stopping the operation of the grinding device is completed, in the state where the chuck table and the spindle rotate, by the The step of moving the grinding unit relative to the chuck table by moving the mechanism, and grinding the holding surface by the grinding wheel. The method for controlling a grinding device according to claim 10, further comprising starting the step of grinding the holding surface with the grinding wheel after the input device inputs an instruction to stop the operation of the grinding device into the control unit Before, the step of adjusting the angle formed by the rotation axis of the chuck table and the axis center of the main shaft. The method for controlling a grinding device according to claim 10 or 11, wherein the grinding wheel mounted on the main shaft is not replaced after an instruction to stop the operation of the grinding device is input into the control unit from the input device The step of grinding the retaining surface by the grinding wheel is carried out. The method for controlling a grinding device according to claim 10 or 11, wherein the step of grinding the holding surface with the grinding wheel is completed before the step of stopping the operation of the grinding device is completed.