TW202225355A - 接著劑套組以及接著體及其製造方法 - Google Patents

接著劑套組以及接著體及其製造方法 Download PDF

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Publication number
TW202225355A
TW202225355A TW110142518A TW110142518A TW202225355A TW 202225355 A TW202225355 A TW 202225355A TW 110142518 A TW110142518 A TW 110142518A TW 110142518 A TW110142518 A TW 110142518A TW 202225355 A TW202225355 A TW 202225355A
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Taiwan
Prior art keywords
meth
adhesive
agent
mass
acrylate
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TW110142518A
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English (en)
Chinese (zh)
Inventor
田中徹
川守崇司
松永昌大
藤安陽介
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日商昭和電工材料股份有限公司
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Publication of TW202225355A publication Critical patent/TW202225355A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW110142518A 2020-11-17 2021-11-16 接著劑套組以及接著體及其製造方法 TW202225355A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2020/042820 2020-11-17
PCT/JP2020/042820 WO2022107211A1 (ja) 2020-11-17 2020-11-17 接着剤セット、並びに接着体及びその製造方法

Publications (1)

Publication Number Publication Date
TW202225355A true TW202225355A (zh) 2022-07-01

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TW110142518A TW202225355A (zh) 2020-11-17 2021-11-16 接著劑套組以及接著體及其製造方法

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US (1) US12595401B2 (https=)
EP (1) EP4141080A4 (https=)
JP (1) JP7816165B2 (https=)
KR (1) KR20230107476A (https=)
CN (1) CN115698208A (https=)
TW (1) TW202225355A (https=)
WO (2) WO2022107211A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022107210A1 (ja) * 2020-11-17 2022-05-27 昭和電工マテリアルズ株式会社 接着剤セット、並びに接着体及びその製造方法
WO2022107211A1 (ja) 2020-11-17 2022-05-27 昭和電工マテリアルズ株式会社 接着剤セット、並びに接着体及びその製造方法
JP2023168084A (ja) * 2022-05-13 2023-11-24 株式会社レゾナック 接着剤セット、並びに接着体及びその製造方法
JP2023168082A (ja) * 2022-05-13 2023-11-24 株式会社レゾナック 接着剤セット、並びに接着体及びその製造方法
JP2023168083A (ja) * 2022-05-13 2023-11-24 株式会社レゾナック 接着剤セット、並びに接着体及びその製造方法
CN121194876A (zh) * 2023-07-07 2025-12-23 株式会社力森诺科 黏合体及其制造方法
CN121195033A (zh) * 2023-07-07 2025-12-23 株式会社力森诺科 黏合剂组合物

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US5106928A (en) * 1991-04-29 1992-04-21 National Starch And Chemical Investment Holding Corporation Acrylic adhesive composition and organoboron initiator system
CA2183873A1 (en) 1994-02-22 1995-08-24 Jury Vladimirovich Zharov Polymerizable compositions made with polymerization initiator systems based on organoborane amine complexes
US5616796A (en) * 1995-04-14 1997-04-01 Minnesota Mining And Manufacturing Company Organoborane polyamine complexes and adhesive composition made therewith
US6734268B2 (en) 2001-12-31 2004-05-11 3M Innovative Properties Company Metal salt modifiers for bonding compositions
US7534843B2 (en) * 2003-12-22 2009-05-19 Dow Global Technoloigies, Inc. Accelerated organoborane amine complex initiated polymerizable compositions
KR20080034792A (ko) 2006-10-17 2008-04-22 제이에스알 가부시끼가이샤 스페이서 형성용 감방사선성 수지 조성물, 스페이서 및그의 형성 방법
US8742050B2 (en) * 2008-03-28 2014-06-03 Henkel US IP LLC Two part hybrid adhesive
KR20120047861A (ko) 2009-06-16 2012-05-14 덴끼 가가꾸 고교 가부시키가이샤 폴리클로로프렌 및 그 제조방법 및 접착제
KR102152473B1 (ko) * 2011-12-16 2020-09-04 히타치가세이가부시끼가이샤 접착제 조성물, 필름상 접착제, 접착 시트, 접속 구조체 및 접속 구조체의 제조 방법
FR2986235B1 (fr) 2012-01-31 2015-02-06 Rhodia Operations Stabilisants reactifs poly(n-vinyl lactame) vivants pour polymerisation en phase dispersee
BR112014018750A8 (pt) 2012-02-03 2017-07-11 Dsm Ip Assets Bv Polímero, processo e composição
EP2834314A1 (en) * 2012-04-06 2015-02-11 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
JP6297857B2 (ja) * 2014-02-21 2018-03-20 スリーエム イノベイティブ プロパティズ カンパニー ２液型接着剤及びそれを含む構造体
JP6404645B2 (ja) * 2014-08-28 2018-10-10 スリーエム イノベイティブ プロパティズ カンパニー ２液型接着剤及びそれを含む構造体
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WO2022107211A1 (ja) 2020-11-17 2022-05-27 昭和電工マテリアルズ株式会社 接着剤セット、並びに接着体及びその製造方法

Also Published As

Publication number Publication date
JP7816165B2 (ja) 2026-02-18
EP4141080A4 (en) 2023-12-06
KR20230107476A (ko) 2023-07-17
JPWO2022107729A1 (https=) 2022-05-27
EP4141080A1 (en) 2023-03-01
WO2022107211A1 (ja) 2022-05-27
US20230212439A1 (en) 2023-07-06
CN115698208A (zh) 2023-02-03
WO2022107729A1 (ja) 2022-05-27
US12595401B2 (en) 2026-04-07

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