TW202212832A - Probe station - Google Patents
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- TW202212832A TW202212832A TW110134041A TW110134041A TW202212832A TW 202212832 A TW202212832 A TW 202212832A TW 110134041 A TW110134041 A TW 110134041A TW 110134041 A TW110134041 A TW 110134041A TW 202212832 A TW202212832 A TW 202212832A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/56—Accessories
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
- H01F7/0273—Magnetic circuits with PM for magnetic field generation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/695—Control of camera direction for changing a field of view, e.g. pan, tilt or based on tracking of objects
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本發明是關於一種探針台。更具體地,本發明是關於一種用於使用探針卡對形成在基板上的半導體裝置進行電測試的探針台。The present invention relates to a probe station. More particularly, the present invention relates to a probe station for electrically testing a semiconductor device formed on a substrate using a probe card.
可以藉由重複執行一系列製造程序在基板,諸如矽晶圓上形成半導體裝置。例如,為了製造半導體裝置,可以在晶圓上執行各種製造程序,諸如用於在晶圓上形成薄層的沉積程序,用於使薄層圖案化以形成電路的蝕刻程序,用於使薄層平坦化的平坦化程序等。Semiconductor devices can be formed on substrates, such as silicon wafers, by repeatedly performing a series of fabrication processes. For example, to fabricate semiconductor devices, various fabrication procedures may be performed on a wafer, such as deposition procedures for forming thin layers on wafers, etching procedures for patterning thin layers to form circuits, Flattening procedures for flattening, etc.
在形成半導體裝置之後,可以執行用於檢查半導體裝置的電特性的電測試程序。測試程序可以由探針台執行,該探針台包括具有多個探針的探針卡,以及向半導體裝置提供電訊號並且分析源於半導體裝置的輸出訊號以檢查半導體裝置的電特性的測試頭可以與探針卡連接。After the semiconductor device is formed, an electrical test procedure for examining the electrical characteristics of the semiconductor device may be performed. The test procedure may be performed by a probe station including a probe card with a plurality of probes, and a test head that provides electrical signals to the semiconductor device and analyzes output signals from the semiconductor device to check the electrical characteristics of the semiconductor device Can be connected with a probe card.
探針台可以包括用於支承基板的卡盤,並且探針卡可以設置在卡盤的上方。卡盤可以被構造成可在水平方向上移動以實現在基板和探針卡之間的對齊,並且可以被構造成可在豎直方向上移動以實現在基板和探針卡之間的電連接。The probe station may include a chuck for supporting the substrate, and the probe card may be disposed above the chuck. The chuck can be configured to be movable in a horizontal direction to achieve alignment between the substrate and the probe card, and can be configured to be movable in a vertical direction to achieve electrical connection between the substrate and the probe card .
用於對探針卡的探針進行成像的下相機單元可以設置在卡盤的一側上,並且用於對基板進行成像的上相機單元可以設置在卡盤的上方。相機單元可以用於基板和探針卡之間的對齊。上相機單元可以由驅動單元水平移動,該驅動單元是以橋形構造的。例如,上相機單元可以移動到預定位置以對基板進行成像,並且卡盤可以由卡盤驅動單元移動,使得由上相機單元對基板的多個點進行成像。A lower camera unit for imaging probes of the probe card may be provided on one side of the chuck, and an upper camera unit for imaging the substrate may be provided above the chuck. The camera unit can be used for alignment between the substrate and the probe card. The upper camera unit can be moved horizontally by the drive unit, which is constructed in a bridge shape. For example, the upper camera unit may be moved to a predetermined position to image the substrate, and the chuck may be moved by the chuck drive unit so that a plurality of points of the substrate are imaged by the upper camera unit.
驅動單元可以包括止動構件,使得上相機單元停止在預定位置處。然而,當上相機單元的移動被止動構件停止時,可能會發生由於碰撞而導致的震動和振動,並且由於去除振動需要相當長的時間,可能會大大延遲針對基板的測試程序。此外,探針台的內部結構可能會因碰撞和振動而發生微小的變形,並且因此可能降低在基板和探針卡之間的接觸精度。The driving unit may include a stopper member such that the upper camera unit is stopped at a predetermined position. However, when the movement of the upper camera unit is stopped by the stopper member, shock and vibration due to collision may occur, and since it takes a considerable time to remove the vibration, the test procedure for the substrate may be greatly delayed. In addition, the internal structure of the probe station may be slightly deformed by collision and vibration, and thus the contact accuracy between the substrate and the probe card may be reduced.
本發明的實施例提供了一種探針台,其能夠減少當用於對基板進行成像的相機單元停止時生成的震動和振動。Embodiments of the present invention provide a probe station capable of reducing shock and vibration generated when a camera unit for imaging a substrate is stopped.
根據本發明的一個方面,一種探針台可以包括卡盤,其被構造成支承基板;探針卡,其設置在卡盤的上方並且被構造成對形成在基板上的半導體裝置進行電測試;相機單元,其設置在卡盤的上方並且被構造成對基板進行成像;以及相機驅動部件,其被構造成在水平方向上移動相機單元。特別地,相機驅動部件可以包括制動單元,其用於使用渦流制動力使相機單元停止在預定位置處。According to one aspect of the present invention, a probe station may include a chuck configured to support a substrate; a probe card disposed over the chuck and configured to electrically test semiconductor devices formed on the substrate; a camera unit that is disposed above the chuck and is configured to image the substrate; and a camera driving part that is configured to move the camera unit in a horizontal direction. In particular, the camera driving part may include a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.
根據本發明的一些實施例,相機驅動部件還可以包括用於在水平方向上移動相機單元的驅動單元;以及可移動構件,其被構造成可由驅動單元在水平方向上移動,並且相機單元安裝在可移動構件上。According to some embodiments of the present invention, the camera driving part may further include a driving unit for moving the camera unit in the horizontal direction; and a movable member configured to be movable in the horizontal direction by the driving unit, and the camera unit is mounted on the on the movable member.
根據本發明的一些實施例,探針台還可以包括柱,驅動單元的兩個側部安裝在柱上。According to some embodiments of the present invention, the probe station may further comprise a column on which the two sides of the drive unit are mounted.
根據本發明的一些實施例,制動單元可以包括制動板,其安裝在可移動構件上並且由導電材料製成;以及磁場生成單元,其安裝在柱中的一個上並且被構造成生成磁場。在這種情況下,制動板和磁場生成單元可以被佈置成使得當可移動構件移動到靠近柱中的一個的位置時,由磁場生成渦流制動力。According to some embodiments of the present invention, the braking unit may include a braking plate mounted on the movable member and made of conductive material; and a magnetic field generating unit mounted on one of the columns and configured to generate a magnetic field. In this case, the braking plate and the magnetic field generating unit may be arranged such that when the movable member is moved to a position close to one of the columns, an eddy current braking force is generated by the magnetic field.
根據本發明的一些實施例,磁場生成單元可以包括安裝在柱中的一個的側表面上的多個永久磁體。According to some embodiments of the present invention, the magnetic field generating unit may include a plurality of permanent magnets mounted on a side surface of one of the columns.
根據本發明的另一個方面,一種探針台可以包括卡盤,其被構造成支承基板;探針卡,其設置在卡盤的上方並且被構造成對形成在基板上的半導體裝置進行電測試;頂板,探針卡安裝在頂板上;多個支承柱,其被構造成支承頂板;相機單元,其設置在卡盤和頂板之間並且被構造成對基板進行成像;相機驅動部件,其被構造成在水平方向上移動相機單元;以及中間柱,其設置在支承柱之間。特別地,相機驅動部件可以安裝在支承柱中的一個和中間柱上並且可以包括制動單元,制動單元用於使用渦流制動力使相機單元停止在預定位置處。According to another aspect of the present invention, a probe station may include a chuck configured to support a substrate; a probe card disposed over the chuck and configured to electrically test semiconductor devices formed on the substrate a top plate, on which the probe card is mounted; a plurality of support columns, which are configured to support the top plate; a camera unit, which is arranged between the chuck and the top plate and is configured to image the substrate; a camera driving part, which is configured to move the camera unit in a horizontal direction; and an intermediate post disposed between the support posts. In particular, the camera driving part may be mounted on one of the support columns and the intermediate column and may include a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.
根據本發明的一些實施例,相機驅動部件還可以包括用於在水平方向上移動相機單元的驅動單元;以及可移動構件,其被構造成可由驅動單元在水平方向上移動,並且相機單元安裝在可移動構件上。在這種情況下,驅動單元的兩個側部可以分別安裝在支承柱中的一個和中間柱上。According to some embodiments of the present invention, the camera driving part may further include a driving unit for moving the camera unit in the horizontal direction; and a movable member configured to be movable in the horizontal direction by the driving unit, and the camera unit is mounted on the on the movable member. In this case, the two sides of the drive unit may be mounted on one of the support columns and the middle column, respectively.
根據本發明的一些實施例,制動單元可以包括制動板,其安裝在可移動構件上並且由導電材料製成;以及磁場生成單元,其安裝在中間柱上並且被構造成生成磁場。在這種情況下,制動板和磁場生成單元可以被佈置成使得當可移動構件移動到靠近中間柱的位置時,由磁場生成渦流制動力。According to some embodiments of the present invention, the braking unit may include a braking plate mounted on the movable member and made of conductive material; and a magnetic field generating unit mounted on the intermediate post and configured to generate a magnetic field. In this case, the braking plate and the magnetic field generating unit may be arranged such that an eddy current braking force is generated by the magnetic field when the movable member is moved to a position close to the intermediate column.
根據本發明的一些實施例,磁場生成單元可以包括安裝在中間柱的側表面上的多個永久磁體。According to some embodiments of the present invention, the magnetic field generating unit may include a plurality of permanent magnets mounted on a side surface of the intermediate column.
根據本發明的一些實施例,永久磁體可以被佈置成使得極性在水平方向上交替。According to some embodiments of the invention, the permanent magnets may be arranged such that the polarities alternate in the horizontal direction.
根據本發明的一些實施例,磁場生成單元可以包括安裝在中間柱的側表面上的多個第一永久磁體,以及設置成面對第一永久磁體的多個第二永久磁體。在這種情況下,制動板可以安裝在可移動構件上,以便可藉由驅動單元在第一永久磁體和第二永久磁體之間移動。According to some embodiments of the present invention, the magnetic field generating unit may include a plurality of first permanent magnets installed on a side surface of the intermediate column, and a plurality of second permanent magnets disposed to face the first permanent magnets. In this case, the brake plate may be mounted on the movable member so as to be movable between the first permanent magnet and the second permanent magnet by the drive unit.
根據本發明的一些實施例,磁場生成單元還可以包括第一安裝支架,其安裝在中間柱的側表面上,在水平方向上延伸並且具有帶有打開的下部的通道形狀,並且第一永久磁體和第二永久磁體可以被安裝成在第一安裝支架的內側表面上彼此面對。According to some embodiments of the present invention, the magnetic field generating unit may further include a first mounting bracket mounted on a side surface of the intermediate column, extending in a horizontal direction and having a channel shape with an opened lower portion, and the first permanent magnet and the second permanent magnet may be mounted to face each other on the inner side surface of the first mounting bracket.
根據本發明的一些實施例,第一永久磁體可以被佈置成使得極性在水平方向上交替,並且第二永久磁體的極性可以被佈置成與第一永久磁體的極性相反。According to some embodiments of the present invention, the first permanent magnets may be arranged such that the polarities alternate in the horizontal direction, and the polarity of the second permanent magnets may be arranged to be opposite to the polarity of the first permanent magnets.
根據本發明的一些實施例,驅動單元可以包括氣動缸,其安裝在支承柱中的一個和中間柱上並且被構造成移動可移動構件;以及引導機構,其安裝在支承柱中的一個和中間柱上並且被構造成在水平方向上引導可移動構件。According to some embodiments of the present invention, the drive unit may include a pneumatic cylinder mounted on one of the support columns and the middle column and configured to move the movable member; and a guide mechanism mounted on one of the support columns and the middle column on the post and configured to guide the movable member in a horizontal direction.
根據本發明的一些實施例,相機驅動部件還可以包括止動構件,其用於使相機單元停止在預定位置處。According to some embodiments of the present invention, the camera driving part may further include a stop member for stopping the camera unit at a predetermined position.
根據本發明的一些實施例,相機驅動部件還可以包括減震器,其用於吸收由止動構件引起的震動。According to some embodiments of the present invention, the camera driving part may further include a shock absorber for absorbing shock caused by the stop member.
根據本發明的又一個方面,一種探針台可以包括卡盤,其被構造成支承基板;探針卡,其設置在卡盤的上方並且被構造成對形成在基板上的半導體裝置進行電測試;頂板,探針卡安裝在頂板上;第一和第二支承柱,第一和第二支承柱在第一水平方向上彼此間隔開並且被構造成支承頂板;第三和第四支承柱,第三和第四支承柱在垂直於第一水平方向的第二水平方向上與第一和第二支承柱間隔開並且被構造成支承頂板;相機單元,其設置在卡盤和頂板之間並且被構造成對基板進行成像;相機驅動部件,其被構造成在第二水平方向上移動相機單元;以及中間柱,其設置在第一和第三支承柱之間。特別地,相機驅動部件可以包括安裝在第三支承柱和中間柱上並且用於在第二水平方向上移動相機單元的驅動單元,以及安裝在中間柱上並且用於使用渦流制動力使相機單元停止在預定位置處的制動單元。According to yet another aspect of the present invention, a probe station may include a chuck configured to support a substrate; a probe card disposed over the chuck and configured to electrically test a semiconductor device formed on the substrate a top plate on which the probe cards are mounted; first and second support columns, the first and second support columns are spaced apart from each other in a first horizontal direction and are configured to support the top plate; third and fourth support columns, The third and fourth support columns are spaced apart from the first and second support columns in a second horizontal direction perpendicular to the first horizontal direction and are configured to support the top plate; a camera unit disposed between the chuck and the top plate and a camera driving part configured to image the substrate; a camera drive part configured to move the camera unit in a second horizontal direction; and an intermediate column disposed between the first and third support columns. In particular, the camera driving part may include a driving unit mounted on the third support column and the intermediate column and used to move the camera unit in the second horizontal direction, and a driving unit mounted on the intermediate column and used to drive the camera unit using an eddy current braking force Stop the braking unit at a predetermined position.
根據本發明的一些實施例,探針台還可以包括卡更換單元,其設置在中間柱的一側上以更換探針卡。在這種情況下,中間柱可以具有比第三支承柱更低的高度,並且卡更換單元可以在中間柱的上部空間中在第一水平方向上傳遞探針卡。According to some embodiments of the present invention, the probe station may further include a card replacement unit provided on one side of the middle column to replace the probe card. In this case, the middle column may have a lower height than the third support column, and the card exchange unit may transfer the probe card in the first horizontal direction in the upper space of the middle column.
根據本發明的一些實施例,探針台還可以包括第二中間柱,其設置在第二和第四支承柱之間;以及第二相機驅動部件,其被構造成在第二水平方向上移動相機單元。在這種情況下,第二相機驅動部件可以包括安裝在第四支承柱和第二中間柱上並且用於在第二水平方向上移動相機單元的第二驅動單元,以及安裝在第二中間柱上並且用於使用渦流制動力使相機單元停止在預定位置處的第二制動單元。According to some embodiments of the present invention, the probe station may further include a second intermediate column disposed between the second and fourth support columns; and a second camera driving member configured to move in a second horizontal direction camera unit. In this case, the second camera driving part may include a second driving unit mounted on the fourth support column and the second intermediate column and for moving the camera unit in the second horizontal direction, and a second intermediate column mounted on the second intermediate column and a second braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.
根據本發明的一些實施例,探針台還可以包括基板傳遞機器人,其設置在第二中間柱的一側上以將基板裝載到卡盤上。在這種情況下,第二中間柱可以具有比第四支承柱更低的高度,並且基板傳遞機器人可以在第二中間柱的上部空間中在第一水平方向上傳遞基板。According to some embodiments of the present invention, the probe station may further include a substrate transfer robot disposed on one side of the second intermediate column to load the substrate onto the chuck. In this case, the second middle column may have a lower height than the fourth support column, and the substrate transfer robot may transfer the substrate in the first horizontal direction in the upper space of the second middle column.
根據如上所述的本發明的實施例,當其上安裝有相機單元的可移動構件移動到在卡盤上方的預定位置時,可以藉由渦流制動力降低可移動構件的移動速度。此外,可移動構件的移動速度可以由減震器進行二次減速,並且隨後可移動構件可以由止動構件停止在預定位置處。因此,與現有技術相比,可以大大減少當可移動構件停止時生成的震動和振動,並且因此可以大大減少測試延遲時間。此外,探針台的穩定性可以藉由減少震動和振動而大大提高,並且因此可以顯著提高在基板和探針卡之間的接觸精度。According to the embodiments of the present invention as described above, when the movable member on which the camera unit is mounted is moved to a predetermined position above the chuck, the moving speed of the movable member can be reduced by the eddy current braking force. Further, the moving speed of the movable member may be decelerated twice by the shock absorber, and then the movable member may be stopped at a predetermined position by the stopper member. Therefore, compared with the related art, the shock and vibration generated when the movable member is stopped can be greatly reduced, and thus the test delay time can be greatly reduced. In addition, the stability of the probe station can be greatly improved by reducing vibration and vibration, and thus the contact accuracy between the substrate and the probe card can be significantly improved.
上面對本發明的概述並非旨在描述本發明的每個所闡明的實施例或每個實施方案。下面的具體實施方式和申請專利範圍更特別地例示了這些實施例。The above summary of the present invention is not intended to describe each illustrated embodiment or every implementation of the present invention. The following detailed description and claims more particularly illustrate these embodiments.
在下文中,參考圖式更詳細地描述本發明的實施例。然而,本發明不限於下面描述的實施例且以各種其他形式來進行實施。下面的實施例並非用於完全完成本發明的,而是用於將本發明的範圍完全傳達給本領域的技術人員。Hereinafter, embodiments of the present invention are described in more detail with reference to the drawings. However, the present invention is not limited to the embodiments described below and can be implemented in various other forms. The following embodiments are not intended to completely complete the present invention, but are intended to fully convey the scope of the present invention to those skilled in the art.
在說明書中,當一個元件被稱為「在......上」或「被連接至另一個元件或層」時,其能夠直接位於另一個元件或層上,被直接連接至其,或還可以存在中間元件或層。與此不同的是,將理解的是當一個元件被稱為直接在另一個元件或層上或被直接連接至其時,其表示不存在中間元件。此外,儘管像第一、第二和第三的術語用於在本發明的各種實施例中描述各種區域和層,但區域和層並不限於這些術語。In the specification, when an element is referred to as being "on" or "connected to another element or layer", it can be directly on, directly connected to, another element or layer, Or intermediate elements or layers may also be present. In contrast, it will be understood that when an element is referred to as being directly on or directly connected to another element or layer, it will mean that there are no intervening elements present. Furthermore, although terms like first, second, and third are used to describe various regions and layers in various embodiments of the present invention, regions and layers are not limited to these terms.
以下使用的術語僅用於描述具體實施例,而不用於限制本發明。另外地,除非在此另有限定外,包括技術或科學術語的所有術語可以具有與本領域的技術人員通常所理解的相同的意義。The terms used below are only used to describe specific embodiments, and not to limit the present invention. Additionally, unless otherwise defined herein, all terms including technical or scientific terms may have the same meaning as commonly understood by one of ordinary skill in the art.
參考理想實施例的示意圖來描述本發明的實施例。相應地,可以根據圖式的形式來預期製造方法中的變化及/或容許誤差。相應地,本發明的實施例不被描述為限於圖式中的具體形式或區域且包括形式的偏差。該區域可以完全是示意性的,且其形式可以不描述或描繪在任何給定區域中的準確形式或結構,且不旨在限制本發明的範圍。Embodiments of the invention are described with reference to schematic illustrations of idealized embodiments. Accordingly, variations and/or tolerances in manufacturing methods may be expected from the form of the drawings. Accordingly, embodiments of the invention are not described as limited to the specific forms or regions in the drawings and to include deviations in form. This region may be entirely schematic and its form may not describe or depict the precise form or structure in any given region and is not intended to limit the scope of the invention.
圖1為示出根據本發明實施例的探針台的示意性主視圖。圖2為示出如圖1所示的相機驅動部件的示意性側視圖,並且圖3為示出如圖1所示的相機驅動部件的示意性俯視圖。FIG. 1 is a schematic front view showing a probe station according to an embodiment of the present invention. FIG. 2 is a schematic side view showing the camera driving part shown in FIG. 1 , and FIG. 3 is a schematic top view showing the camera driving part shown in FIG. 1 .
參考圖1至圖3,可以使用根據本發明實施例的探針台100來對形成在基板10,諸如半導體晶圓上的半導體裝置進行電測試。探針台100可以包括卡盤110,其被構造成支承基板10;探針卡120,其設置在卡盤110的上方並且被構造成對形成在基板10上的半導體裝置進行電測試;相機單元130,其設置在卡盤110的上方並且被構造成對基板10進行成像;以及相機驅動部件140,其被構造成在水平方向上移動相機單元130。Referring to FIGS. 1 to 3 , a
雖然未在圖中示出,但是卡盤110可以具有用於真空吸附基板10的多個真空孔,以及用於將基板10加熱至預定測試溫度的加熱器,並且用於冷卻基板10的冷卻單元可以設置在卡盤110的下方。探針台100可以包括卡盤驅動部件112,其用於對齊及連接基板10和探針卡120。具體地,卡盤驅動單元可以水平移動和旋轉卡盤110以實現在基板10和探針卡120之間的對齊,並且可以豎直移動卡盤110以將基板10連接到探針卡120。此外,儘管未在圖中示出,但是用於對探針卡120的探針進行成像的下相機單元(未示出)可以安裝在卡盤110的側部上。Although not shown in the drawings, the
探針台100可以包括提供空間的測試室102,在該空間中對基板10進行電測試程序,並且卡盤110和探針卡120可以設置在測試室102中。此外,用於將基板10裝載到卡盤110上並且從卡盤110卸載基板10的裝載器180可以在第一水平方向,例如,在X軸方向上設置在測試室102的一側上,並且用於藉由探針卡120對基板10進行電測試的測試器20可以設置在測試室102上。The
測試室102可以包括其上安裝有探針卡120的頂板104,以及用於支承頂板104的支承柱106A、106B、106C和106D。裝載器180可以包括用於傳遞基板10的基板傳遞機器人182以及其中設置有基板傳遞機器人182的基板傳遞室184。此外,儘管未示出,但是裝載器180可以包括裝載埠(未示出),用於容納多個基板的容器放置在該裝載埠上。The
相機驅動部件140可以包括驅動單元142,其用於在第二水平方向上,例如,在Y軸方向上,在卡盤110的上方,即在卡盤110和探針卡120之間,移動相機單元130;以及可移動構件144,其被構造成可由驅動單元142在第二水平方向上移動,相機單元130安裝在該可移動構件144上。例如,氣動缸可以用作驅動單元142。特別地,為了克服空間,可以使用無桿氣缸作為驅動單元142,並且可以藉由平行於無桿氣缸設置的引導機構150,例如,藉由線性運動引導件在第二水平方向上引導可移動構件144。The
根據本發明的一個實施例,頂板104可以由在第一水平方向上彼此間隔開的第一和第二支承柱106A和106B以及在第二水平方向上與第一和第二支承柱106A和106B間隔開並且在第一水平方向上彼此間隔開的第三和第四支承柱106C和106D支承,如圖3所示。此外,第一中間柱108A可以設置在第一和第三支承柱106A和106C之間,並且第二中間柱108B可以設置在第二和第四支承柱106B和106D之間。According to one embodiment of the present invention, the
驅動單元142和引導機構150可以安裝在第一中間柱108A和第三支承柱106C上。具體地,無桿氣缸的兩個側部可以分別安裝在第一中間柱108A和第三支承柱106C上,並且線性運動引導件的兩個側部可以分別安裝在第一中間柱108A和第三支承柱106C上。The
根據本發明的實施例,探針台100還可以包括第二相機驅動部件190,其被構造成在第二水平方向上移動相機單元130。第二相機驅動部件190可以具有與相機驅動部件140相同的構造。例如,第二相機驅動部件190可以包括安裝在第二中間柱108B和第四支承柱106D上的第二驅動單元,以及安裝在第二中間柱108B和第四支承柱106D上的第二引導機構。According to an embodiment of the present invention, the
可移動構件144可以具有橋形,並且可以包括聯接到第一相機驅動部件140的第一可移動柱146A、聯接到第二相機驅動部件190的第二可移動柱146B,和設置在第一和第二可移動柱146A和146B上的可移動板148。在這種情況下,相機單元130可以安裝在可移動板148上。The
根據本發明的實施例,相機驅動部件140可以包括制動單元160,其用於使用渦流制動力使相機單元130停止在預定位置處。制動單元160可以包括安裝在可移動構件144上,特別地,在第一可移動柱146A上並且由導電材料製成的制動板162,以及安裝在第一中間柱108A的側表面上並且被構造成生成磁場的磁場生成單元164。制動板162和磁場生成單元164可以被佈置成使得當可移動構件144移動到靠近第一中間柱108A的位置時,由磁場生成渦流制動力。具體地,當制動板162移動靠近磁場生成單元164時,可以在制動板162中由磁場誘導出渦流,並且因此可以在與制動板162,即可移動構件144的移動方向相反的方向上生成渦流制動力。According to an embodiment of the present invention, the
圖4為示出如圖2所示的制動單元的示例的示意性放大主視圖,並且圖5為示出如圖4所示的制動單元的示意性放大俯視圖。FIG. 4 is a schematic enlarged front view showing an example of the braking unit shown in FIG. 2 , and FIG. 5 is a schematic enlarged top view showing the braking unit shown in FIG. 4 .
參考圖4和圖5,磁場生成單元164可以包括安裝在第一中間柱108A的側表面上的多個永久磁體166。永久磁體166可以被佈置成使得極性沿著可移動構件144的移動方向交替。特別地,當制動板162移動時,可以由永久磁體166生成的磁場在與可移動構件144的移動方向相反的方向上生成渦流制動力。Referring to FIGS. 4 and 5 , the magnetic
此外,第二相機驅動部件190可以包括第二制動單元200,其用於使用渦流制動力使相機單元130停止在預定位置處,如圖1和圖3所示。第二制動單元200可以具有與制動單元160相同的構造。例如,第二制動單元200可以包括安裝在第二中間柱108B上的多個永久磁體和安裝在第二可移動柱146B上的制動板。In addition, the second
再次參考圖2,相機驅動部件140可以包括止動構件152,其用於使相機單元130停止在卡盤110上方的預定位置處。可移動構件144可以藉由與止動構件152緊密接觸而被停止。此外,相機驅動部件140還可以包括用於吸收由止動構件152引起的震動的減震器154。例如,可以使用圓柱形減震器154,並且減震器154和止動構件152可以設置成使得減震器154的桿部從止動構件152朝向可移動構件144突出。Referring again to FIG. 2 , the
特別地,當驅動單元142包括如上所述的無桿氣缸時,恆定的氣壓可以被施加至無桿氣缸中,直到可移動構件144停止為止,並且因此恆定的力可以從無桿氣缸施加到可移動構件144,直到可移動構件144停止為止。此外,制動單元160可以初次使用渦流制動力來降低可移動構件144的移動速度,並且當可移動構件144接近止動構件152時,可移動構件144的移動速度可以由減震器154進行二次降低。結果,藉由制動單元160的初次減速和減震器154的二次減速,可移動構件144可以在無震動和振動的情況下與止動構件152緊密接觸。In particular, when the driving
同時,止動構件152和減震器154可以安裝在第一中間柱108A上,並且儘管未示出,但是第二止動構件和第二減震器可以安裝在第二中間柱108B上。此外,儘管未示出,但是第三止動構件和第三減震器可以安裝在第三支承柱106C上,並且第四止動構件和第四減震器可以安裝在第四支承柱106D上。Meanwhile, the
圖6為示出如圖2所示的制動單元的另一個示例的示意性放大仰視圖,並且圖7為示出如圖6所示的制動單元的示意性放大側視圖。FIG. 6 is a schematic enlarged bottom view showing another example of the braking unit shown in FIG. 2 , and FIG. 7 is a schematic enlarged side view showing the braking unit shown in FIG. 6 .
參考圖6和圖7,磁場生成單元164可以包括安裝在第一中間柱108A的側表面上的第一永久磁體168,設置為面對第一永久磁體168的第二永久磁體170,以及安裝在可移動構件144,特別是第一可移動柱146A上並且由導電材料製成的制動板162。在這種情況下,制動板162可以安裝在第一可移動柱146A上,以便可由驅動單元142在第一永久磁體168和第二永久磁體170之間移動。Referring to FIGS. 6 and 7 , the magnetic
例如,磁場生成單元164可以包括第一安裝支架172,該第一安裝支架172安裝在第一中間柱108A的側表面上,在第二水平方向上延伸並且具有帶有打開的下部的通道形狀,並且第一永久磁體168和第二永久磁體170可以被安裝成在第一安裝支架172的內側表面上彼此面對。此外,制動單元160可以包括用於將制動板162安裝到第一可移動柱146A的第二安裝支架174。For example, the magnetic
特別地,第一永久磁體168可以被佈置為使得極性沿著第二水平方向,即可移動構件144的移動方向交替,並且第二永久磁體170的極性可以被佈置為與第一永久磁體168的極性相反,如圖6所示。In particular, the first
制動板162可以由驅動單元142在第一和第二永久磁體168和170之間移動。即,當制動板162進入第一和第二永久磁體168和170之間時,渦流制動力可以藉由由第一和第二永久磁體168和170形成的磁場施加到制動板162,並且因此,可移動構件144可以在短時間內充分減速。The
參考圖1至圖3,用於更換探針卡120的卡更換單元210可以設置在第一中間柱108A的一側上。卡更換單元210可以包括在第一水平方向上移動探針卡120以更換探針卡120的卡傳遞機器人212。特別地,第一中間柱108A可以具有比第一和第三支承柱106A和106C更低的高度,並且卡傳遞機器人212可以在第一中間柱108A的上部空間中在第一水平方向上傳遞探針卡120以更換探針卡120。Referring to FIGS. 1 to 3 , a
此外,基板傳遞機器人182可以設置在第二中間柱108B的一側上。第二中間柱108B可以具有比第二和第四支承柱106B和106D更低的高度,並且基板傳遞機器人182可以在第一水平方向上在第二中間柱108B的上部空間中傳遞基板10,以裝載和卸載基板10。Also, the
儘管已參考具體實施例描述了本發明的示例實施例,但其不限於此。因此,本領域的技術人員將容易理解的是,在不脫離所附申請專利範圍的精神和範圍的情況下,能夠對其進行各種修改和變化。Although example embodiments of the present invention have been described with reference to specific embodiments, they are not limited thereto. Accordingly, those skilled in the art will readily understand that various modifications and changes can be made thereto without departing from the spirit and scope of the appended claims.
10:基板
20:測試器
100:探針台
102:測試室
104:頂板
106A、106B、106C、106D:支承柱
108A:第一中間柱
108B:第二中間柱
110:卡盤
112:卡盤驅動部件
120:探針卡
130:相機單元
140:相機驅動部件
142:驅動單元
144:可移動構件
146A:第一可移動柱
146B:第二可移動柱
148:可移動板
150:引導機構
152:止動構件
154:減震器
160:制動單元
162:制動板
164:磁場生成單元
166:永久磁體
168:第一永久磁體
170:第二永久磁體
172:第一安裝支架
174:第二安裝支架
180:裝載器
182:基板傳遞機器人
184:基板傳遞室
190:第二相機驅動部件
200:第二制動單元
210:卡更換單元
212:卡傳遞機器人
10: Substrate
20: Tester
100: Probe Station
102: Test Room
104:
根據以下結合圖式的描述,能夠更加詳細地理解本發明的實施例,其中:Embodiments of the present invention can be understood in more detail from the following description in conjunction with the drawings, wherein:
圖1為示出根據本發明的實施例的探針台的示意性主視圖;1 is a schematic front view showing a probe station according to an embodiment of the present invention;
圖2為示出如圖1所示的相機驅動部件的示意性側視圖;Fig. 2 is a schematic side view showing the camera driving part shown in Fig. 1;
圖3為示出如圖1所示的相機驅動部件的示意性俯視圖;FIG. 3 is a schematic top view showing the camera driving part shown in FIG. 1;
圖4為示出如圖2所示的制動單元的示例的示意性放大主視圖;Fig. 4 is a schematic enlarged front view showing an example of the braking unit shown in Fig. 2;
圖5為示出如圖4所示的制動單元的示意性放大俯視圖;Fig. 5 is a schematic enlarged plan view showing the braking unit shown in Fig. 4;
圖6為示出如圖2所示的制動單元的另一個示例的示意性放大仰視圖;以及FIG. 6 is a schematic enlarged bottom view showing another example of the braking unit shown in FIG. 2; and
圖7為示出如圖6所示的制動單元的示意性放大側視圖。FIG. 7 is a schematic enlarged side view showing the braking unit shown in FIG. 6 .
雖然各種實施例適合於各種修改和替代形式,但其具體細節已藉由示例的方式在圖式中示出且將更詳細地進行描述。然而,應理解的是其意圖並非將所要求保護的本發明限制於所述的特定實施例。相反地,其意圖是涵蓋落在如藉由申請專利範圍所限定的主題的精神和範圍內的所有修改、等同物和替代物。While various embodiments are amenable to various modifications and alternative forms, specific details thereof have been shown in the drawings by way of example and will be described in greater detail. It should be understood, however, that the intention is not to limit the invention as claimed to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter as defined by the scope of the claims.
20:測試器 20: Tester
104:頂板 104: Top Plate
106A、106C:支承柱 106A, 106C: support column
108A:第一中間柱 108A: First middle column
120:探針卡 120: Probe card
130:相機單元 130: Camera unit
140:相機驅動部件 140: Camera driver components
142:驅動單元 142: Drive unit
144:可移動構件 144: Movable components
146A:第一可移動柱 146A: First movable column
148:可移動板 148: Removable board
150:引導機構 150: Guiding Mechanism
152:止動構件 152: Stop member
154:減震器 154: Shock Absorber
160:制動單元 160: Brake unit
162:制動板 162: Brake plate
164:磁場生成單元 164: Magnetic Field Generation Unit
Claims (20)
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KR1020200122497A KR20220039420A (en) | 2020-09-22 | 2020-09-22 | Probe station |
KR10-2020-0122497 | 2020-09-22 |
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TW202212832A true TW202212832A (en) | 2022-04-01 |
TWI799987B TWI799987B (en) | 2023-04-21 |
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TW110134041A TWI799987B (en) | 2020-09-22 | 2021-09-13 | Probe station |
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CN (1) | CN114252664B (en) |
TW (1) | TWI799987B (en) |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08334497A (en) * | 1995-06-09 | 1996-12-17 | Ishikawajima Harima Heavy Ind Co Ltd | Eddy current test equipment |
JPH09318784A (en) * | 1996-05-31 | 1997-12-12 | Mitsubishi Heavy Ind Ltd | Fuel rod gap measuring device for nuclear fuel assembly |
US20040055836A1 (en) * | 1999-11-22 | 2004-03-25 | Pribonic Edward M. | Eddy current braking apparatus with adjustable braking force |
JP2003110122A (en) * | 2001-09-28 | 2003-04-11 | Sanyo Electric Co Ltd | Method for detecting fault of integrated photovoltaic device and method for repairing the same |
JP2005072143A (en) * | 2003-08-21 | 2005-03-17 | Tokyo Seimitsu Co Ltd | Probe unit |
KR100676679B1 (en) * | 2005-06-29 | 2007-02-01 | 주식회사 하이소닉 | Image photographing device |
US7491319B1 (en) * | 2008-03-17 | 2009-02-17 | Te Hung En Enterprise Co., Ltd. | Inspecting apparatus with eddy current inspection |
JP2009276215A (en) * | 2008-05-15 | 2009-11-26 | Tokyo Electron Ltd | Probe apparatus and method for correcting contact position |
KR20090121747A (en) * | 2008-05-23 | 2009-11-26 | 한전케이피에스 주식회사 | Probe for eddy current testing and transporter thereof |
KR101005100B1 (en) * | 2008-12-11 | 2010-12-30 | 주식회사 쎄믹스 | Probe card exchanger |
KR20110035304A (en) * | 2009-09-30 | 2011-04-06 | 한국수력원자력 주식회사 | Eddy current test probe for tube of heat exchanger |
KR101078496B1 (en) * | 2010-07-06 | 2011-10-31 | 엄두진 | Probe card cooling system |
DE102011051423A1 (en) * | 2011-06-29 | 2013-01-03 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Crash simulation system and crash simulation method |
KR101336652B1 (en) * | 2012-12-28 | 2013-12-04 | 주식회사 서울금속 | Apparatus for inspecting inner circumferential surface of nut |
DE102013102564A1 (en) * | 2013-03-13 | 2014-09-18 | Dtg International Gmbh | Truss unit for a tester for printed circuit boards, as well as tester with it |
JP6446783B2 (en) * | 2014-01-20 | 2019-01-09 | リコーイメージング株式会社 | DRIVE DEVICE, DRIVE METHOD, AND IMAGING DEVICE |
KR101746292B1 (en) | 2015-10-29 | 2017-06-12 | 세메스 주식회사 | Method of aligning probe card |
CN105486995B (en) * | 2015-12-07 | 2018-08-17 | 杭州长川科技股份有限公司 | Full-automatic probe station image positioning device and visual aligning method |
JP6501726B2 (en) * | 2016-04-19 | 2019-04-17 | 三菱電機株式会社 | Probe position inspection apparatus, semiconductor evaluation apparatus and probe position inspection method |
KR101645366B1 (en) * | 2016-05-09 | 2016-08-05 | 나우 주식회사 | Eddy current nondestructive testing device using a non-contact slip ring |
JP6674103B2 (en) * | 2016-08-31 | 2020-04-01 | 株式会社東京精密 | Prober |
KR20190016695A (en) | 2017-08-09 | 2019-02-19 | 세메스 주식회사 | Wafer alignment method and wafer inspection method using the same |
KR101980849B1 (en) * | 2017-10-30 | 2019-05-21 | 세메스 주식회사 | Apparatus for inspecting display cells |
CN110007204B (en) * | 2017-12-29 | 2021-04-30 | 中电海康集团有限公司 | Wafer test probe station device and wafer test method |
US10458937B2 (en) * | 2018-03-08 | 2019-10-29 | Shijiazhuang Tiedao University | Electromagnetic detector for detection of interface cracks in a piezoelectric-piezomagnetic laminated structure |
HUP1800106A2 (en) * | 2018-03-28 | 2019-10-28 | Adam Magyar | Camera stabilizer |
US10895554B2 (en) * | 2018-08-14 | 2021-01-19 | Southwest Research Institute | Flexible eddy current test probe using a shape-memory alloy for surface conformance |
KR102222263B1 (en) * | 2018-09-06 | 2021-03-04 | 세메스 주식회사 | Substrate processing apparatus |
KR102095386B1 (en) * | 2018-11-20 | 2020-03-31 | 주식회사 쎄믹스 | Alignment apparatus for an wafer prober |
DE102018009606B3 (en) * | 2018-12-06 | 2019-12-24 | Mark Fellinger | Device for holding a camera system on moving objects |
CN109900708A (en) * | 2019-03-22 | 2019-06-18 | 上汽通用五菱汽车股份有限公司 | A kind of detection device for engine cylinder body top surface and cylinder holes defect |
-
2020
- 2020-09-22 KR KR1020200122497A patent/KR20220039420A/en active IP Right Grant
-
2021
- 2021-09-13 TW TW110134041A patent/TWI799987B/en active
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CN114252664A (en) | 2022-03-29 |
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